Connector with contact support structure

Abstract

Aspects of a connector having a contact support structure are described herein. The exemplary connector includes a housing, a wafer assembly including a terminal row and a wafer mold insert, and a wafer assembly support bar. The terminal row includes a plurality of terminal conductors. The wafer assembly support bar includes a terminal seating surface, a reference surface, and a molded interlock. One of the plurality of terminal conductors is electrically coupled to the terminal seating surface, and the wafer mold insert is molded and extends into the molded interlock to secure the terminal row relative to the reference surface. In this manner, the terminal row is secured by the support bar and the wafer mold insert. Compared to other designs, the support bar provides additional strength, a higher modulus of elasticity, and thermal stability.

Description

Technical Field

[0001] (Cross - reference to Related Applications) This application claims the benefit of U.S. Provisional Patent Application No. 63 / 406,264, filed on September 14, 2022, the entire content of which is incorporated herein by reference.

Background Art

[0002] A series of input / output (I / O) connectors are designed for power, data, and power and data interconnect systems, including board - to - board, wire - to - wire, and wire - to - board systems. Depending on the requirements of the power and data communication environments in which the connectors are used, there are various designs for each system type. As an example, a wire - to - board system includes a free - end connector attached to a wire and a fixed - end connector attached to a substrate.

[0003] As an example, in high - data - rate applications where physical space is constrained, it can be difficult to design interconnect system connectors due to several competing concerns. High - data - rate interconnect systems often rely on differential - coupled signal pairs in which two conductors are arranged in pairs to transmit differential signals. The signal being transmitted is embodied by the electrical difference measured between the conductor pairs. Differential signal transmission can be useful for avoiding spurious signals and crosstalk and for avoiding inadvertent signal - transmission modes between adjacent signal pairs. In a connector interface, ground terminals can serve as a return path to electrical ground, provide shielding between differential pairs, and serve as an anchor for other purposes.

[0004] Connectors used in high data-rate applications are typically designed to meet a wide range of mechanical and electrical requirements. High data-rate connectors are often used, for example, in backplane applications requiring very high conductor density and data rates. To achieve the desired mechanical and electrical requirements, connectors used in such applications often incorporate one or more wafer assemblies. Wafer assemblies may include insulating webs supporting terminal conductors within the wafer assembly. The use of wafer assemblies can be useful in manufacturing connectors capable of achieving high data rates using several different assembly processes. In any case, designing wafers with the conductor density and small footprint required for high data-rate applications in new systems while maintaining the electrical properties desirable for data transmission with integrity remains challenging. [Overview of the Initiative]

[0005] Embodiments of connectors having a contact support structure are described below. An exemplary connector includes a housing, a wafer assembly including a terminal row and a wafer molded insert, and a wafer assembly support bar. The terminal row includes a plurality of terminal conductors. The wafer assembly support bar includes a terminal seating surface, a reference surface, and a molded interlock. One of the plurality of terminal conductors is electrically coupled to the terminal seating surface, the wafer molded insert is molded and extends into the molded interlock, and fixes the terminal row to the reference surface. In this way, the terminal row is fixed by the support bar and the wafer molded insert. Compared to other designs, the support bar provides additional strength, a higher modulus of elasticity, and thermal stability. In other embodiments of the embodiment, the wafer assembly support bar is embodied or formed from metal, and the wafer molded insert is embodied or formed from plastic. The wafer assembly support bar includes a first arm, a second arm, and an extension bar extending between the first arm and the second arm. The first arm and the second arm define the sides of the front port opening of the connector. The extension bar of the wafer assembly support bar is equipped with a molded interlock, and at least one of the first arm and the second arm is equipped with a reference plane.

[0006] In another embodiment, the plurality of terminal conductors include a plurality of ground conductors and a plurality of signal conductors, the wafer assembly support bar includes a plurality of terminal seating surfaces, and the individual conductors of the plurality of ground conductors are electrically coupled to the respective conductors of the plurality of terminal seating surfaces. The wafer assembly support bar further includes terminal recesses positioned between a pair of the plurality of terminal seating surfaces. A pair of the plurality of signal conductors extends through the terminal recesses of the wafer assembly support bar surrounded by the wafer molding insert.

[0007] In other embodiments, the connector includes a grounding path assembly. The grounding path assembly includes a grounding channel block, which includes a plurality of channels. A pair of signal conductors among the plurality of terminal conductors extends along one of the plurality of channels. In one example, the grounding channel block includes a metal plating on a plastic body. In other embodiments, the grounding channel block includes a plurality of grounding ribs for surface mounting to the terminal feet of the connector. The channels extend between a pair of the plurality of grounding ribs on the terminal feet of the connector. In another embodiment, the grounding channel block includes a grounding bar that extends between the plurality of grounding ribs of the grounding channel block and is electrically coupled to the plurality of grounding ribs of the grounding channel block. The plurality of grounding ribs are, in one example, formed integrally with the grounding channel block.

[0008] In another example, the grounding channel block includes a metal plating on a plastic body, and the multiple grounding ribs are separate from the grounding channel block and formed from metal. In yet another embodiment, the grounding path assembly further includes a grounding platform frame, the main surface of which extends in a plane parallel to the main surfaces of the multiple grounding ribs at the terminal feet of the connector.

[0009] Another exemplary connector includes a wafer assembly comprising a terminal row and a wafer-molded insert, and a wafer assembly support bar. The wafer assembly support bar includes a molded interlock, and the wafer-molded insert is molded and extends within the molded interlock of the wafer assembly support bar. In one example, the wafer assembly support bar includes a terminal seating surface, and the ground conductor of the terminal row is electrically coupled to the terminal seating surface of the wafer assembly support bar. In one example, the wafer assembly support bar includes a first arm, a second arm, and an extension bar extending between the first and second arms, the first and second arms defining the sides of the front port opening of the connector. [Brief explanation of the drawing]

[0010] Many aspects of this disclosure can be better understood by referring to the following drawings. The components in the drawings are not necessarily to scale, and instead the focus is on clearly illustrating the principles of this disclosure. Furthermore, in the drawings, similar reference numbers indicate corresponding parts through several figures.

[0011] [Figure 1] This is a perspective view of an exemplary connector in various embodiments of the present disclosure. [Figure 2] This is a front perspective view of the connector shown in Figure 1, with the housing omitted, in various embodiments of the present disclosure. [Figure 3] This is a rear perspective view of the connector shown in Figure 1, with the housing omitted, in various embodiments of the present disclosure. [Figure 4] This figure shows the support bar for the connector shown in Figure 1 in various embodiments of the present disclosure. [Figure 5] Figure 4 is a cross-sectional view AA of the support bar. [Figure 6] This is a detailed view of the support bar and terminal row on one side of the connector shown in Figure 1, in various embodiments of the present disclosure. [Figure 7] Figure 1 shows a detailed view of the terminal array and wafer molding insert of the connector shown in various embodiments of this disclosure. [Figure 8] Figure 7 is another detailed view of the terminal array shown, with the wafer molding insert omitted. [Figure 9] Figure 1 shows a top perspective view of the terminal row and wafer molding insert in the connector shown in various embodiments of the present disclosure. [Figure 10] Figure 1 shows a bottom perspective view of the terminal row and wafer molding insert within the connector shown in various embodiments of the present disclosure. [Figure 11] Figure 1 shows a top perspective view of the terminal row and wafer molding insert in the connector shown in various embodiments of the present disclosure. [Figure 12]A bottom perspective view of a terminal row and a wafer molding insert in the connector shown in FIG. 1 in various embodiments of the present disclosure. [Figure 13] A front perspective view of a ground channel block in the connector shown in FIG. 1 in various embodiments of the present disclosure. [Figure 14] A rear perspective view of a ground channel block in the connector shown in FIG. 1 in various embodiments of the present disclosure. [Figure 15] A front perspective view of a ground frame in the connector shown in FIG. 1 in various embodiments of the present disclosure. [Figure 16] A rear perspective view of a ground frame in the connector shown in FIG. 1 in various embodiments of the present disclosure. [Figure 17] A rear perspective view of a ground frame in the connector shown in FIG. 1 in various embodiments of the present disclosure. [Figure 18] A perspective view of a terminal pin of the connector shown in FIG. 1 in various embodiments of the present disclosure. [Figure 19] A side view of a ground rib of the connector shown in FIG. 1 in various embodiments of the present disclosure. [Figure 20] A side view of another ground rib in various embodiments of the present disclosure. [Figure 21] A view showing a connector provided with a ground rib and a ground platform frame in various embodiments of the present disclosure. [Figure 22] A side view of a metal rib insert in various embodiments of the present disclosure. [Figure 23] A top view of a ground platform frame in various embodiments of the present disclosure.

[0012] Connectors are typically designed to meet a wide range of mechanical and electrical requirements. High data-rate connectors are often used, for example, in backplane applications requiring very high conductor density and data rates. To achieve the desired mechanical and electrical requirements, connectors used in such applications often incorporate one or more wafer assemblies. Wafer assemblies may include insulating webs that support terminal conductors within the wafer assembly. The use of wafer assemblies can be useful in manufacturing high data-rate capable connectors using a variety of different assembly processes. In any case, designing wafers and connectors with the conductor density and small footprint required for high data-rate applications in new systems while maintaining the electrical properties desirable for data transmission with integrity remains challenging.

[0013] In the context outlined above, various aspects and embodiments of connectors having contact support structures and other mechanisms are described herein. An exemplary connector includes a housing, a wafer assembly including a terminal row and a wafer molding insert, and a wafer assembly support bar. The terminal row includes a plurality of terminal conductors. The wafer assembly support bar includes a terminal seating surface, a reference surface, and a molding interlock. One of the plurality of terminal conductors is electrically coupled to the terminal seating surface, the wafer molding insert is molded and extends into the molding interlock, and fixes the terminal row to the reference surface. In this way, the terminal row is fixed by the support bar and the wafer molding insert. Compared to other designs, the support bar provides additional strength, a higher modulus of elasticity, and thermal stability.

[0014] Referring to the drawings, FIG. 1 shows a perspective view of an exemplary connector 10 according to various embodiments of the present disclosure. The connector 10 is shown as a representative example and is not drawn to any particular scale or size. The shape, size, ratio, and other characteristics of the connector 10 may vary compared to those shown. For example, the connector 10 can accommodate a larger or smaller number of terminal rows (e.g., wider or narrower), and other variations are within the scope of the examples described herein. For higher data rate interconnections, several connectors similar to the connector 10 can be stacked or arranged side by side. Additionally, as shown in the drawings and described herein, one or more of the parts or components of the connector 10 can optionally be omitted. The connector 10 can also include other parts or components not shown.

[0015] The connector 10 includes a front port opening 12 and terminal legs 13. The connector 10 is designed to establish and maintain electrical connection with contacts on the free end interface of a cable assembly. For example, an Octal Small Form Factor Pluggable (OSFP), Quad Small Form Factor Pluggable (QSFP), or similar printed circuit board (PCB)-type interface of a cable assembly can be inserted into the front port opening 12 of the connector 10.

[0016] Connector 10 includes a row of terminal conductors extending from the front port opening 12 to the terminal legs 13 for the communication of data signals on the conductors. Because the terminal conductors extend from the front port opening 12 to the terminal legs 13, Connector 10 is designed to provide shielding and maintain the signal integrity of differential signals on the terminal conductors. Connector 10 can be designed for use with OSFP, QSFP, or related interconnect systems, but the concepts described herein are not limited to use with any particular type or style of interconnect system. Furthermore, the terminal legs 13 of Connector 10 can be designed as Surface-Mount Technology (SMT) legs for bonding to the surface of a larger substrate or assembly, although Connector 10 may also be designed to have through-hole leads or other lead styles on the terminal legs 13, depending on the circumstances.

[0017] As shown in Figure 1, the connector includes a housing 100, support bars 220 and 320, and terminal rows 210 and 310 positioned within the opening 12. The housing 100 may, in one example, be formed from plastic or other insulating material, but the housing may, in some cases, be formed from metal or a combination of insulating and conductive material. The housing includes a front port 110, a bottom mounting surface 120, and mounting posts 122 and 124. The connector 10 is, in one example, adapted to receive a PCB-type tip of an OSFP, QSFP, or related type of cable system. The PCB-type tip of the cable system can be mated into the opening 12 of the connector. When inserted, the terminal rows 210 and 310 within the housing 100, including terminal conductors 211 and 311, seat and electrically contact contacts on the top and bottom surfaces of the PCB-type tip.

[0018] The alignment and positioning of the terminal conductors within the connector 10 are of particular importance. The mechanical compliance and robustness of each terminal conductor in terminal rows 210 and 310 within the housing 100 must be consistent across terminal rows 210 and 310. Designing a connector with terminal rows that do not exhibit variations in mechanical robustness, bend or curve at the center (or other locations), or exhibit other mechanical or electrical variations can be difficult, especially when the terminal rows are relatively wide. Furthermore, when the connector 10 is mounted on the surface of a larger substrate or assembly, it is often thermally dependent, and the application of heat can cause the internal wafer molding support within the connector 10 to loosen, altering the mechanical or electrical performance of the terminal conductors.

[0019] In the context outlined above, the connector 10 includes support bars 220 and 320. The support bars 220 and 320 are formed from a material that is relatively rigid and has a high modulus of elasticity even when heated. Among other examples described herein, the support bars 220 and 320 can be formed from a metal such as aluminum, copper, or another rigid and thermally stable metal or metal alloy. The wafer assembly within the connector 10 can be molded into the molded interlocks of the support bars 220 and 320, and the terminal conductors can be mechanically and electrically fixed (i.e., soldered or welded) to the terminal seating surfaces on the support bars 220 and 320. Thus, the wafer assembly can be mechanically and electrically integrated with the support bars 220 and 320 to provide further strength and dimensional accuracy to the terminal rows within the wafer assembly. Thus, the support bars 220 and 320 provide a common electrical path between the ground terminals in the terminal rows.

[0020] Furthermore, as shown in Figure 1, the ends of the support bars 220 and 320 define the sides of the connector opening 12. In this configuration, the surfaces of the ends of the support bars 220 and 320 provide reference planes, allowing for more precise manufacturing of the position of the terminal conductors relative to the reference planes. These positions can be maintained even under mechanical stress and thermal cycling. The PCB-type end of the cable system can be fitted into the opening 12 of the connector 10, and the alignment of the conductors with the terminal rows in the housing 100 can be found based on the contact of the support bars 220 and 320 with the reference planes. These and other mechanisms of the housing 100 will be described in more detail below.

[0021] Figure 2 shows a front perspective view of the connector 10 shown in Figure 1, with the housing 100 omitted from the figure, and Figure 3 shows a rear perspective view of the connector 10. Inside the housing 100, the connector 10 includes a first or upper wafer assembly 200, a second or lower wafer assembly 300, support bars 220 and 320, and a grounding path assembly. First, the assembly of the connector 10 will be described with reference to Figures 2 and 3, and then detailed diagrams of the assembly will be described with reference to Figures 4 to 19.

[0022] The wafer assembly 200 includes, among other possible components, a terminal row 210, flexible shields 230 and 231, and wafer molding inserts 240 and 250. Together with the support bar 220, the wafer assembly 200 supports, spaced, and aligned the terminal conductors in the terminal row 210. The connector 10 also includes a grounding path assembly for the wafer assembly 200. The grounding path assembly for the wafer assembly 200 includes upper grounding channel blocks 400A and 400B and lower grounding channel blocks 450A and 450B. Blocks 400A, 400B, 450A and 450B are also shown separately in Figures 13 and 14. The grounding path assembly also includes grounding frames 410A and 410B for the upper grounding channel blocks 400A and 400B, and grounding frames 460A and 460B for the lower grounding channel blocks 450A and 450B, respectively. Grounding frames 410A, 410B, 460A, and 460B are also shown separately in Figures 15 to 17.

[0023] The terminal row 210 includes signal conductors, power conductors, and ground conductors. Each signal conductor and power conductor in the terminal row 210 includes a lead contact at one distal end (i.e., located at the front port opening 12 of the connector 10, as shown in Figure 1), a tail contact at the other distal end (i.e., located at the terminal leg 13), and a conductor bend between the lead contact and the tail contact. The signal conductor and power conductor of the terminal row 210 are electrically insulated from each other within the connector 10. The signal conductor and power conductor begin at the lead contact at the front port opening 12 and extend to the tail contact at the terminal leg 13 of the connector 10. The tail contacts of the signal conductor and power conductor can be formed as SMT tail contacts, as in the illustrated example, or as through-holes or other types of contacts.

[0024] Each grounding conductor in the terminal row 210 includes a lead contact at one distal end and a tail contact at the other distal end. The grounding conductors extend from the lead contact in the front port opening 12 to the contact on the grounding path assembly of the wafer assembly 200, as described later. The grounding path assembly includes several grounding ribs or fins for surface mounting to the substrate at the terminal feet 13. Further diagrams of the terminal row 210 are provided in Figures 9 and 10.

[0025] The terminal row 210 can be formed from a flat metal sheet (e.g., by punching, shearing, or other methods). In some cases, the metal sheet can be plated with one or more plating metals. The wafer molding inserts 240 and 250 can be formed from plastic such as liquid crystal polymer (LCP) or other insulating material and are molded around the terminal conductors in the terminal row 210. The wafer molding inserts 240 and 250 are separated from each other along the length of the terminal conductors in the terminal row 210, and a bend is formed in the terminal row 210 between the wafer molding inserts 240 and 250.

[0026] The flexible shields 230 and 231 are formed from flat metal sheets (e.g., punched, sheared, or otherwise formed) and may be plated. The flexible shields 230 and 231 are fixed to the upper surface of the ground conductor in the terminal row 210 within an opening through which the ground conductor passes, using mechanical interference. The flexible shields 230 and 231 straddle (but do not touch) the signal conductors in the terminal row 210, providing shielding for the signal conductors. The flexible shields 230 and 231 provide additional support to the ground conductor in the terminal row 210, shielding the signal conductors in the terminal row 210 to maintain electrical ground coupling and maintain the integrity of data signals. Although not shown in Figure 2, the terminal row 310 also includes flexible shielding.

[0027] The upper ground channel blocks 400A and 400B and the lower ground channel blocks 450A and 450B can, in one example, be formed as insulating blocks or bodies covered with one or more plated metals. For example, blocks 400A, 400B, 450A, and 450B can be formed from LCP, polyethylene (PE), polytetrafluoroethylene (PTFE), conductive PE or PTFE, fluoropolymer, or other plastics or insulating materials. Blocks 400A, 400B, 450A, and 450B can be plated with tin, gold, or one or more other plated metals. In other cases, ground channel blocks 400A and 400B can be formed from metal or other conductive materials, with or without plating. The signal conductors of terminal row 210 extend into channels formed within blocks 400A, 400B, 450A, and 450B, helping to prevent signal crosstalk and interference between them. The lower grounding channel blocks 450A and 450B include, in particular, grounding ribs, including grounding ribs 451A and 452A of block 450A and grounding ribs 451B and 451B of block 450B, as shown in Figure 3.

[0028] Referring to Figure 3, the ground channel block 450A includes a ground bar 456A, and the ground channel block 450B includes a ground bar 456B. The ground bars 456A and 456B can be formed from metals such as aluminum, copper, zinc, stainless steel, or other metals or metal alloys, and may be plated with one or more plating metals. The ground bar 456A extends between the ground ribs of the ground channel block 450A and is electrically coupled to the ground ribs to share the ground and maintain a common potential between the ground ribs. Similarly, the ground bar 456B extends between the ground ribs of the ground channel block 450B and is electrically coupled to the ground ribs to share the ground and maintain a common potential between the ground ribs. Further embodiments of the ground path assembly for the wafer assembly 300 are described below.

[0029] The wafer molding inserts 240 and 250 are formed around the terminal row 210 or otherwise. Before the wafer molding inserts 240 and 250 are formed, one or more of the ground conductors in the terminal row 210 can be mechanically and electrically fixed to the terminal seating surface of the support bar 220 (e.g., soldered, welded, glued, etc.). The terminal row 210 and the support bar 220 can then be inserted into the mold fixture, and LCP or another insulating material can be injected into the mold. The insulating material forms the wafer molding inserts 240 and 250 around the terminal row 210, and the insulating material also flows into the molding interlock of the support bar 220. Thus, the wafer molding insert 240 is anchored and fixed to the support bar 220.

[0030] For example, Figures 2 and 3 show how the material of the wafer molding insert 240 extends into the interlock aperture 222A of the support bar 220 to form an interlock plug 241. The support bar 220 includes several interlock apertures, and the wafer molding insert 240 extends through each of the interlock apertures to form several interlock plugs. In this way, the terminal row 210 is fixed to the support bar 220 and the wafer molding insert 240. Compared to other designs, the support bar 220 provides additional strength, a higher modulus of elasticity, and better thermal stability. The support bar 220 also provides additional advantages described herein. Other embodiments of the arrangement of the terminal row 210, the support bar 220, and the wafer molding insert 240 are described below.

[0031] The wafer assembly 300 includes, among other possible components, a terminal row 310, a flexible shield (not shown in Figures 2 and 3), and wafer molding inserts 340 and 350. Together with the support bar 320, the wafer assembly 300 supports, spaced, and aligned the terminal conductors in the terminal row 310. The connector 10 also includes a grounding path assembly for the wafer assembly 300. The grounding path assembly for the wafer assembly 300 includes upper grounding channel blocks 500A and 500B and lower grounding channel blocks 550A and 550B. Blocks 500A, 500B, 550A and 550B are also shown separately in Figures 13 and 14. The grounding path assembly also includes grounding frames 510A and 510B for the upper grounding channel blocks 500A and 500B, and grounding frames 560A and 560B for the lower grounding channel blocks 550A and 550B, respectively. Grounding frames 510A, 510B, 560A, and 560B are also shown separately in Figures 15 to 17.

[0032] The terminal row 310 includes signal conductors, power conductors, and ground conductors. Each signal conductor and power conductor in the terminal row 310 includes a lead contact at one distal end (i.e., located at the front port opening 12 of the connector 10, as shown in Figure 1), a tail contact at the other distal end (i.e., located at the terminal leg 13), and a conductor bend between the lead contact and the tail contact. The signal conductor and power conductor of the terminal row 310 are electrically insulated from each other within the connector 10. The signal conductor and power conductor extend from the lead contact at the front port opening 12 to the tail contact at the terminal leg 13 of the connector 10. As an example, the signal conductor 312 extends from the lead contact 312L end at the front port opening 12 to the tail contact 312T end at the terminal leg 13. The tail contacts of the signal conductor and power conductor can be formed as SMT tail contacts, as in the illustrated example, or as through-holes or other types of contacts.

[0033] Each grounding conductor in the terminal row 310 includes a lead contact at one distal end and a tail contact at the other distal end. The grounding conductors extend from the lead contact in the front port opening 12 to the contact on the grounding path assembly of the wafer assembly 300, as described later. The grounding path assembly includes several grounding ribs or fins for surface mounting to the substrate at the terminal feet 13. Further diagrams of the terminal row 210 are provided in Figures 9 and 10.

[0034] The terminal row 310 can be formed from a flat metal sheet (e.g., by punching, shearing, or other methods). In some cases, the metal sheet can be plated with one or more plating metals. The wafer forming inserts 340 and 350 can be formed from plastic such as LCP or other insulating material and are formed around the terminal conductors in the terminal row 310. The wafer forming inserts 340 and 350 are separated from each other along the length of the terminal conductors in the terminal row 310, and a bend is formed in the terminal row 310 between the wafer forming inserts 340 and 350.

[0035] The upper ground channel blocks 500A and 500B and the lower ground channel blocks 550A and 550B can, in one example, be formed as plastic blocks covered with one or more plated metals, although the blocks can also be formed from metal or other conductive materials. For example, blocks 500A, 500B, 550A, and 550B can be formed from LCP, PE, PTFE, conductive PE or PTFE, fluoropolymer, or other plastic or insulating materials. The signal conductors of terminal row 310 extend into channels formed within blocks 500A, 500B, 550A, and 550B, which help prevent signal crosstalk and interference between them. The ground channel blocks 550A and 550B include ground ribs. For example, as shown in Figure 2, the ground channel block 550A includes, among other things, ground ribs 551A and 552A, and the ground channel block 550B includes, among other things, ground ribs 551B and 552B.

[0036] Referring to Figure 2, the ground channel block 550A includes a ground bar 556A, and the ground channel block 550B includes a ground bar 556B. The ground bars 556A and 556B can be formed from metals such as aluminum, copper, zinc, stainless steel, or other metals or metal alloys, and may be plated with one or more plating metals. The ground bar 556A extends between the ground ribs of the ground channel block 550A and is electrically coupled to the ground ribs to share the ground and maintain a common potential between the ground ribs. Similarly, the ground bar 556B extends between the ground ribs of the ground channel block 550B and is electrically coupled to the ground ribs to share the ground and maintain a common potential between the ground ribs. Further embodiments of the ground path assembly for the wafer assembly 300 are described below.

[0037] The wafer molding inserts 340 and 350 are molded around the terminal row 310 or formed by other means. Before the wafer molding inserts 340 and 350 are formed, one or more of the ground conductors in the terminal row 310 may be electrically and mechanically fixed to the terminal seating surface of the support bar 320 (e.g., by soldering, welding, or bonding). When the wafer molding insert 340 is molded, the insulating material of the wafer molding insert 340 flows into the molding interlock of the support bar 320, anchoring and fixing the wafer molding insert 340 to the support bar 320. This is similar to how the wafer molding insert 240 is anchored to the support bar 220. In this way, the terminal row 310 is fixed to the support bar 320 and the wafer molding insert 340. Compared to other designs, the support bar 320 provides additional strength, a higher modulus of elasticity, and thermal stability. The support bar 320 also provides additional advantages described herein. Other configurations of the arrangement of the terminal row 310, support bar 320, and wafer molding insert 340 are described below.

[0038] Figure 4 shows the support bars 220 and 320 separated from each other, with all other components of the connector 10 omitted from the figure. Figure 4 shows the support bars 220 and 320 as representative examples. The size, shape, and style of the support bars 220 and 320 may vary from those shown. For example, the number and location of the interlocking mechanisms, terminal seating surfaces, and other mechanisms of the support bars 220 and 320 may differ from those shown. The support bars 220 and 320 can be formed from metals such as aluminum, copper, zinc, stainless steel, or other metals or metal alloys that are relatively rigid and have a high modulus of elasticity even when heated. Preferably, the support bars 220 and 320 are formed from materials having higher rigidity and modulus of elasticity than the wafer molding inserts 240, 250, 340, and 350. The support bars 220 and 320 can be formed by molding, milling, or other suitable manufacturing techniques. In some cases, the support bars 220 and 320 can also be plated with one or more metals.

[0039] In the example shown in Figure 4, support bars 220 and 320 are formed to have the same shape and size, and support bar 320 is rotated 180 degrees along axis "B" compared to support bar 220. Thus, support bars 220 and 320 are duplicates of each other and can be sourced as multiple identical parts or components to reduce cost, complexity, and tooling requirements. However, in other cases, support bars 220 and 320 can differ from each other in size, shape, or both size and shape, and in other embodiments. Support bar 220 includes a first or right-end arm 220A, a second or left-end arm 220B, and an extension bar 220C. The extension bar 220C extends between arms 220A and 220B. The right-end arm 220A and the left-end arm 220B each include interlocking mechanisms 221A and 221B, respectively, whose shapes are complementary. In the illustrated configuration, the interlock mechanism of support bar 220 engages with the interlock mechanism of support bar 320, so that support bars 220 and 320 are seated within the connector 10 and aligned with each other. The arm 220A of support bar 220 and the arm 220B of support bar 320 define the side surface of the front port opening 12 of the connector 10.

[0040] The support bar 220 includes, among other things, several molded interlocks, such as interlock apertures 222A to 222F. The support bar 220 also includes, among other things, several terminal seating surfaces, such as terminal seating surfaces 223A to 223C. The support bar 220 also includes terminal recesses between the terminal seating surfaces. Terminal recesses 224A and 224B are shown, among other things, between terminal seating surfaces 223A to 223C in Figure 4. The support bar 320 also includes interlock apertures, terminal seating surfaces, and terminal recesses, as shown in Figure 4.

[0041] The ground conductors within the terminal row 210 can be mechanically and electrically fixed to the terminal seating surfaces 223A-223C (e.g., soldering, welding, bonding, etc.). In this way, the terminal row 210 can be fixed to the support bar 220 before the wafer molding inserts 240 and 250 are formed. The terminal row 210 and support bar 220 can then be inserted into the mold fixture, and LCP or another insulating material can be injected into the mold. As the wafer molding inserts 240 and 250 are molded around the terminal row 210, the insulating material of the wafer molding insert 240 also flows into the interlock apertures 222A-222F of the support bar 220, anchoring and fixing the wafer molding insert 240 to the support bar 220. Compared to other designs where only plastic molding is used to support the rows of terminal conductors, the support bar 220 provides additional strength, a higher modulus of elasticity, and thermal stability.

[0042] Similarly, the ground conductor of the terminal row 310 can be mechanically and electrically fixed to the terminal seating surface of the support bar 320. The terminal row 310 can be fixed to the support bar 320 in this way before the wafer molding inserts 340 and 350 are formed. Once formed, the insulating material of the wafer molding insert 340 flows into the interlock aperture of the support bar 320, such as the interlock aperture 322D, anchoring and fixing the wafer molding insert 340 to the support bar 220.

[0043] Support bars 220 and 320 also include several reference planes from which the position and surface of the terminal conductors in terminal rows 210 and 310 are precisely set according to the aspects of the embodiment. For example, support bar 220 includes a reference plane 226, and support bar 320 includes reference planes 326 and 327. Reference planes 226, 326, and 327 provide a surface interface (or mechanical interface or interference) that allows the contacts on the PCB-type connector to be aligned with the terminal conductors in terminal rows 210 and 310, as will be described later with reference to Figure 6.

[0044] Figure 5 shows a cross-sectional view AA of the support bar 320 shown in Figure 4, passing through the interlock aperture 322D. The interlock aperture 322D can be formed in other shapes, but is cylindrical and tapered, extending from the inner surface 329A to the outer surface 329B of the support bar 320. The interlock aperture 322D includes a first narrower tapered aperture 328A extending from the inner surface 329A to a position within the support bar 320, and a second wider tapered aperture 328B extending from within the support bar 320 to the outer surface 329B. Thus, the interlock aperture 322D includes a step or ledge between the narrower aperture 328A and the wider aperture 328B. Each of the other interlock apertures within the support bars 220 and 320 has a similar shape in one example, but the support bars 220 and 320 may include different types and styles of molded interlocks.

[0045] As the wafer forming insert 340 is formed around the terminal row 310, the insulating material of the wafer forming insert 340 flows, among other things, into the interlock aperture 322D within the support bar 320. The wafer forming insert 340 forms a larger cap or interlock plug within the wider aperture 328B, which has mechanical interference between the plug and the step or ledge within the interlock aperture 322D. Thus, the wafer forming insert 340 is fixed to the support bar 320 after the wafer forming insert 340 has been formed. The wafer forming insert 240 is also fixed to the support bar 220 in a similar manner, based on the flow of material from the wafer forming insert 240 extending into the apertures 222A-222F of the support bar 220.

[0046] Figure 6 shows a detailed view of the support bars 220 and 320 and terminal rows 210 and 310 on one side of the connector 10. The housing 100 and flexible shields 230 and 231 are omitted from the view in Figure 6. The support bars 220 and 320 include reference planes from which the position and surface of the terminal conductors in the terminal rows 210 and 310 are set or determined with better accuracy compared to other designs. For example, support bar 220 includes a reference plane 226, and support bar 320 includes reference planes 326 and 327. When the PCB-type end of the cable system is inserted into the front port opening 12 of the connector 10, the top surface of the PCB can be guided by the reference plane 226, the bottom surface of the PCB can be guided by the reference plane 326, and the side surface of the PCB can be guided by the reference plane 327. Therefore, the reference planes 226, 326, and 327 provide a surface interface (or mechanical interference) that allows the PCB and contacts on the PCB to be aligned with the terminal conductors in the terminal rows 210 and 310. The support bars 220 and 320 include reference planes on both the right and left sides of the opening 12 in the front port 110 of the housing 100. Furthermore, since the support bars 220 and 320 are electrically coupled to the ground conductors in the terminal rows 210 and 310, they provide a kind of ground shield around the terminal rows 210 and 310 within the front port 110 of the housing 100.

[0047] Terminal conductors 211-214 of terminal row 210 are shown in Figure 6. Terminal conductors 211 and 214 are ground conductors (also referred to as "ground conductors 211 and 214"), and terminal conductors 212 and 213 are a pair of signal conductors for differential signals (also referred to as "signal conductors 212 and 213"). Signal conductors 212 and 213 are positioned between ground conductors 211 and 214 in terminal row 210, and the other pair of signal conductors are also positioned between ground conductors in terminal row 210.

[0048] Figure 6 shows how the upper surfaces of the ground conductors 211 and 214 contact the terminal seating surfaces 223A and 223B of the support bar 220. The ground conductors 211 and 214 can be soldered, welded, or otherwise bonded to the terminal seating surfaces 223A and 223B before the wafer molding insert 240 is formed. Meanwhile, the signal conductors 212 and 213 pass under the terminal recesses 224A of the support bar 220 without contacting the support bar 220. Other signal conductors in the terminal row 210 also pass under the terminal recesses in the support bar 220.

[0049] When the wafer molding insert 240 is formed, the material flows into the terminal recess 224B of the support bar 220, surrounding the signal conductors 212 and 213 along their length. The material also flows into the interlock aperture 222A, forming the interlock plug 241. Thus, the wafer molding insert 240 electrically insulates the signal conductors 212 and 213 from the support bar 220 and fixes the signal conductors 212 and 213 to the support bar 220. Based on the structural design and assembly method of the connector 10, high precision can be achieved between the reference planes 226, 326 and 327 of the support bar 220 and the terminal conductors in the terminal row 210. The wafer assemblies 200 and 300 are fixed to the support bars 220 and 320, respectively, in a similar manner, and the support bars 220 and 320 provide several advantages, including additional strength and dimensional accuracy for the terminal rows 210 and 310 and the wafer assemblies 200 and 300.

[0050] Figure 7 shows a detailed view of the terminal row 210 and wafer-formed insert 240 of the connector 10 shown in Figure 1. In Figure 7, the housing 100, support bar 220, and upper ground channel block 400A are omitted from the figure. Figure 8 shows another detailed view of the terminal row 210 shown in Figure 7, with the wafer-formed insert 240 also omitted from the figure. Figure 7 shows how pairs of signal conductors, such as signal conductors 212 and 213, pass through the wafer-formed insert 240 (i.e., the wafer-formed insert 240 is formed around signal conductors 212 and 213). However, the upper surfaces of ground conductors, such as ground conductors 211 and 214, are not enclosed or surrounded by the wafer-formed insert 240. Instead, the upper surfaces of ground conductors 211 and 214 can be soldered, welded, or otherwise bonded to the terminal seating surfaces 223A and 223B of the support bar 220 (see Figure 6). In this way, the grounding conductors 211 and 214 are electrically coupled to the support bar 220.

[0051] Referring to Figure 8, the grounding frame 410A includes, among other things, grounding contact platforms 411A-413A. The grounding contact platforms 411A-413A are bent or otherwise formed to extend upward from the main surface of the grounding frame 410A. The upper surfaces of the grounding contact platforms 411A-413A contact the bottom surfaces of the grounding conductors in the terminal row 210 when the connector 10 is assembled. For example, the upper surfaces of the grounding contact platforms 411A and 412A contact the bottom surfaces of the grounding conductors 211 and 214. In this way, the grounding conductors 211 and 214 are electrically coupled to the grounding frame 410A, which is assembled or integrated with the upper grounding channel block 400A, both of which are components of the grounding path assembly of the wafer assembly 200. The grounding frame 410A, the upper grounding channel block 400A, and other grounding frames and grounding channel blocks within the connector will be described in more detail below with reference to Figures 13 to 16.

[0052] The grounding frame 410A also includes interface apertures on the sides of the grounding contact platform. For example, the grounding frame 410A includes interface apertures 416 and 417 on the sides of the grounding contact platform 411A. When the connector 10 is assembled, the interface plug on the wafer molding insert 240 may be positioned within the interface aperture of the grounding frame 410A. The grounding frames 410B, 510A, and 510B also include interface apertures, and the wafer molding insert 340 of the wafer assembly 300 also includes interface plugs. An example of an interface plug on the wafer molding insert 240 is described below with reference to Figure 10. An example of an interface plug on the wafer molding insert 340 is described below with reference to Figure 11.

[0053] Figure 9 shows a top perspective view of the terminal row 210 and wafer molding inserts 240 and 250, and Figure 10 shows a bottom perspective view thereof. The wafer molding insert 240 extends across the width "W" of the terminal row 210, as shown in Figure 9. Similarly, the wafer molding insert 250 extends across the width "W" of the terminal row 210, as shown in Figure 10. The terminal row 210 and wafer molding inserts 240 and 250 are parts or components of the first or upper wafer assembly 200 within the connector 10.

[0054] Terminal row 210 includes a first or right group 216 of terminal conductors, a central group 217 of terminal conductors, and a second or left group 218 of terminal conductors. Groups 216 and 217 include ground conductors and signal conductors. In particular, group 216 includes a ground conductor 211, signal conductors 212 and 213 that form a differential pair of signal conductors, and a ground conductor 214. Collectively, group 216 includes eight signal conductors and five ground conductors, with each pair of signal conductors positioned between two ground conductors. The central group of terminal conductors 217 includes power conductors and may optionally include ground conductors or signal conductors. Group 218 is similar to group 216 but positioned on the other side of group 217. Terminal row 310, shown in Figure 11, is similar to terminal row 210. The pitch between the lead contacts of the terminal conductors is, in one example, the same in both terminal rows 210 and 310. However, the terminal conductors of terminal row 210 may be offset from the terminal conductors of terminal row 310 so that the lead contacts are staggered between the rows. In other cases, the terminal conductors in terminal rows 210 and 310 may have the same pitch and be aligned with respect to each other (i.e., not staggered). In yet other cases, the terminal conductors in terminal rows 210 and 310 may have different lead contact pitches relative to each other.

[0055] Figure 10 shows how the signal and power conductors of the terminal row 210 extend from the lead contacts in the opening 12 (see Figure 1) to the tail contacts on the terminal feet 13 of the connector 10. As an example, the signal conductor 212 extends from the lead contact 212L end to the tail contact 212T end of the connector 10. The signal conductor 212, like the other signal and power conductors in the terminal row 210, includes a bend 212B between the wafer molding insert 240 and the wafer molding insert 250. The tail contacts of the signal and power conductors in the terminal row 210 can be formed as SMT tail contacts as shown in Figure 10, or as through-holes or other types of contacts. The ground conductor in the terminal row 210 does not extend directly to the terminal feet 13. Instead, the ground conductor extends from the lead contact in the opening 12 to the contact on the ground path assembly of the wafer assembly 200. The ground path assembly includes ground ribs for surface mounting to the substrate, as described below.

[0056] Figure 10 also shows, in particular, wafer interface plugs 243 and 244 of the wafer molding insert 240. The interface plugs on the wafer molding insert 240 can be positioned within the interface aperture of the grounding frame 410A when the connector 10 is assembled. For example, the wafer interface plugs 243 and 244 shown in Figure 10 can be positioned within the interface apertures 416 and 417 of the grounding frame 410A shown in Figure 8 as parts of the connector 10 assembly. The interface plugs of the wafer molding insert 240 can be used to secure the wafer assembly 200 to the grounding path assembly for the wafer assembly 200. In a similar manner, as will be described below, the interface plugs of the wafer molding insert 350 can be used to secure the wafer assembly 300 to the grounding path assembly for the wafer assembly 300.

[0057] Figure 11 shows a top perspective view of the terminal row 310 and wafer molding inserts 340 and 350, and Figure 12 shows a bottom perspective view thereof. The wafer molding insert 340 extends across the width "W" of the terminal row 310, as shown in Figure 11. Similarly, the wafer molding insert 350 extends across the width "W" of the terminal row 310, as shown in Figure 10. The terminal row 310 and the wafer molding inserts 340 and 350 are parts or components of the second or lower wafer assembly 300 within the connector 10.

[0058] The terminal array 310 includes a first or right group 316 of terminal conductors, a central group 317 of terminal conductors, and a second or left group 318 of terminal conductors. Groups 316 and 317 include ground conductors and signal conductors. For example, group 316 includes a ground conductor 311, signal conductors 312 and 313 forming a differential pair of signal conductors, and a ground conductor 314. Collectively, group 316 includes eight signal conductors and five ground conductors, with each pair of signal conductors positioned between two ground conductors. The central group of terminal conductors 317 includes power conductors and may optionally include ground conductors or signal conductors. Group 318 is similar to group 316 but positioned on the other side of group 317.

[0059] Figure 11 also shows, in particular, the wafer interface plugs 343 and 344 of the wafer molding insert 340. The interface plugs on the wafer molding insert 340 can be positioned within the interface aperture of the grounding frame 410A when the connector 10 is assembled. The interface plugs on the wafer molding insert 340 can be used as a anchor to secure the wafer assembly 300 to the grounding path assembly for the wafer assembly 300.

[0060] Figure 12 shows how the signal and power conductors of the terminal row 310 extend from the lead contacts in the opening 12 (see Figure 1) to the tail contacts on the terminal legs 13 of the connector 10. As an example, the signal conductor 312 extends from the lead contact 312L end of the connector 10 to the tail contact 312T end. The signal conductor 312, like the other signal and power conductors in the terminal row 310, includes a bend 312B between the wafer molding insert 340 and the wafer molding insert 350. The tail contacts of the signal and power conductors in the terminal row 310 can be formed as SMT tail contacts, as shown in Figure 12, or as through-holes or other types of contacts. The ground conductor in the terminal row 310 does not extend directly to the mounting interface 330. Instead, the ground conductor extends from the lead contact in the opening 12 (see Figure 1) to the contact on the ground path assembly of the wafer assembly 300.

[0061] Figure 13 shows a front perspective view of the ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B in the connector 10 shown in Figure 1, and Figure 14 shows a rear perspective view of the blocks. The ground channel blocks 400A, 400B, 450A, and 450B form parts or components of the ground path assembly of the wafer assembly 200, and the ground channel blocks 500A, 500B, 550A, and 550B form parts or components of the ground path assembly of the wafer assembly 300. In the example shown, the ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B are separate blocks (i.e., not integrally formed), but in some cases one or more of the blocks can be combined or integrally formed together. For example, blocks 400A and 450A may be formed as a single block, or they may be combined with other blocks. As described above, the ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B may be formed from LCP, PE, PTFE, conductive PE or PTFE, fluoropolymer, or other plastics or insulating materials.

[0062] As shown in Figures 13 and 14, the ground channel block 400A includes channels 401C-404C, and the ground channel block 400B includes channels 401D-404D. When the connector 10 is assembled, the pairs of signal conductors of the terminal row 210 extend into channels 401C-404C and 401D-404D of the ground channel blocks 400A and 400B, as also shown in Figure 3. Channels 401C-404C and 401D-404D help to electrically isolate the pairs of signal conductors in the terminal row 210 from each other, thereby reducing crosstalk and interference between them.

[0063] Similarly, the ground channel blocks 500A and 500B include, among other channels, channels 501C, 502C, 501D, and 502D. The pairs of signal conductors in terminal row 310 extend, in particular, into channels 501C and 502C in ground channel block 500A, and into channels 501D and 502D in ground channel block 500B. The pairs of signal conductors in terminal row 310 also extend, among other channels, into channels 551C and 552C in ground channel block 550A, and into channels 551D and 552D in ground channel block 550B. The channels in blocks 500A, 500B, 550A, and 550B help to electrically isolate the pairs of signal conductors in terminal row 310 from each other, thereby reducing crosstalk and interference between them. The signal conductors within terminal row 310 begin at the lead contacts within opening 12 (see Figure 1), pass through the channels within ground channel blocks 500A and 500B, and through the channels within ground channel blocks 550A and 550B, extending to the tail contacts on terminal legs 13 of connector 10.

[0064] Referring to Figure 14, the ground channel block 450A includes, among other things, channels 451C to 452C, and the ground channel block 450B includes, among other things, channels 451D to 452D. The pairs of signal conductors in the terminal row 210 extend, among other channels, into channels 451C and 452C in the ground channel block 450A, and into channels 451D and 452D in the ground channel block 450B. The channels in blocks 450A and 450B help to electrically isolate the pairs of signal conductors in the terminal row 210 from each other, thereby reducing crosstalk and interference between them. The signal conductors in the terminal row 210 start from the lead contacts in the opening 12 (see Figure 1), pass through the channels in the ground channel blocks 400A and 400B (see Figure 3), and pass through the channels in the ground channel blocks 450A and 450B, extending to the tail contacts on the terminal legs 13 of the connector 10. The channels within the ground channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B may also include shifts, bends, or other mechanisms that conform to shifts or bends in the signal conductors extending within them. As an example, Figures 13 and 14 show shifts 610 and 612, and other modifications in the direction of the channels are within the scope of the embodiment.

[0065] The subset of grounding channel blocks shown in Figures 13 and 14 also includes grounding ribs on the terminal legs 13 of the connector 10. In the examples shown in Figures 13 and 14, the grounding ribs are integrally formed with the grounding channel blocks 450A, 450B, 550A, and 550B. Grounding channel blocks including separate grounding ribs formed from metal may be relied upon in other embodiments, such as those shown in Figures 21 to 23. As shown in Figure 13, in particular, grounding channel block 550A includes grounding ribs 551A and 552A, and grounding channel block 550B includes grounding ribs 551B and 552B. Channel 551C extends between grounding ribs 551A and 552A of grounding channel block 550A, and other channels of grounding channel block 550A extend between pairs of grounding ribs of grounding channel block 550A. Channel 551D extends between grounding ribs 551B and 552B, and other channels of grounding channel block 550B also extend between pairs of grounding ribs of grounding channel block 550B.

[0066] As shown in Figure 14, in particular, the ground channel block 450A includes ground ribs 451A and 452A, and the ground channel block 450B includes ground ribs 451B and 452B. The ground ribs can be plated with tin, gold, or another metal plating suitable for surface mounting, and the ground ribs can be surface mounted to the traces on the PCB together with the SMT tails of the signal and power terminal conductors. The ground ribs also provide shielding between the SMT tails on the mounting surface of the terminal feet 13 of the connector 10. The ground ribs in the ground channel blocks 450A, 450B, 550A, and 550B are described below with reference to Figures 18 and 19.

[0067] Referring to Figure 13, the grounding channel block 550A also includes a grounding bar 556A, and the grounding channel block 550B includes a grounding bar 556B. The grounding bar 556A extends between the grounding ribs of the grounding channel block 550A and is electrically coupled to the grounding ribs to share the ground and maintain a common potential between the grounding ribs. Similarly, the grounding bar 556B extends between the grounding ribs of the grounding channel block 550B and is electrically coupled to the grounding ribs to share the ground and maintain a common potential between the grounding ribs.

[0068] Referring to Figure 14, the grounding channel block 450A also includes a grounding bar 456A, and the grounding channel block 450B includes a grounding bar 456B. The grounding bar 456A extends between the grounding ribs of the grounding channel block 450A and is electrically coupled to the grounding ribs to share the ground and maintain a common potential between the grounding ribs. Similarly, the grounding bar 456B extends between the grounding ribs of the grounding channel block 450B and is electrically coupled to the grounding ribs to share the ground and maintain a common potential between the grounding ribs.

[0069] The grounding bars 456A, 456B, 556A, and 556B can be formed from a metal such as aluminum, copper, zinc, stainless steel, or other metals or metal alloys, and may be plated with one or more plating metals. The grounding channel blocks 450A and 450B can, in one example, be molded around the grounding bars 456A and 456B, or the grounding bars 456A and 456B can be inserted into slots at the ends of the grounding ribs and secured by interference fit, welding, adhesive, or other means. Similarly, the grounding channel blocks 550A and 550B can, in one example, be molded around the grounding bars 556A and 556B, or the grounding bars 556A and 556B can be inserted into slots at the ends of the grounding ribs and secured by interference fit, welding, adhesive, or other means.

[0070] The grounding channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B may also include several corresponding or mating interlocking mechanisms, such as the interlocking mechanism 600 shown in Figure 13 and the interlocking mechanism 601 shown in Figure 14. The interlocking mechanism 600 can be used to position, align, and fix pairs of grounding channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B relative to each other.

[0071] Figure 15 shows a front perspective view of the grounding frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B in the connector 10 shown in Figure 1, and Figure 16 shows a rear perspective view of the grounding frames. The grounding frames 410A, 410B, 460A, and 460B form parts or components of the grounding path assembly of the wafer assembly 200, and the grounding frames 510A, 510B, 560A, and 560B form parts or components of the grounding path assembly of the wafer assembly 300. The grounding frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B are separate (i.e., not integrally formed) in the illustrated example, but in some cases one or more of the grounding frames can be combined and integrated. For example, grounding frames 410A and 460A can be formed as a single grounding frame in some cases, or they can be combined with other grounding frames.

[0072] The grounding frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B can be formed from a flat metal sheet by punching, shearing, or other means. In some cases, the metal sheet can be plated with one or more plating metals. The grounding frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B can be positioned and fixed to the wafer molding inserts 240, 250, 340, and 350, as well as the grounding channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B (for example, adjacent to, between, relative to, etc.) when the connector 10 is assembled. Each of the grounding frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B includes two main sides, which are the two largest surfaces of the grounding frame. For example, the main sides of grounding frames 410A and 410B are identified using cross-hatch lines in Figures 15 and 16.

[0073] The grounding frame 410A includes, among other things, grounding contact platforms 411A-413A. The grounding contact platforms 411A-413A are bent or otherwise formed to extend upward from the main surface of the grounding frame 410A. The upper surfaces of the grounding contact platforms 411A-413A contact the bottom surfaces of the grounding conductors in the terminal row 210 when the connector 10 is assembled. For example, the upper surfaces of the grounding contact platforms 411A and 412A contact the bottom surfaces of the grounding conductors 211 and 214, as also shown in Figure 8. In this way, the grounding conductors 211 and 214 are electrically coupled to the grounding frame 410A, which is assembled with or integrated with the upper grounding channel block 400A as a component of the grounding path assembly for the wafer assembly 200.

[0074] Similarly, the grounding frame 410B includes, among other things, grounding contact platforms 411B-413B. The grounding contact platforms 411B-413B are bent or otherwise formed to extend upward from the main surface of the grounding frame 410B. The upper surfaces of the grounding contact platforms 411B-413B contact the bottom surfaces of the grounding conductors in the terminal row 210 when the connector 10 is assembled. In this way, the grounding conductors in the terminal row 210 are coupled to the grounding frame 410B, which is assembled or integrated with the upper grounding channel block 400B as a grounding path assembly for the wafer assembly 200. The grounding frames 510A and 510B also include, among other things, grounding contact platforms 511A, 512A, 511B, and 512B that contact the grounding terminals in the terminal row 310, as shown in Figure 17.

[0075] As shown in Figure 16, the grounding frame 410A includes several bent tabs, including a bent tab 414A, which, among other things, is mechanically and electrically coupled to the coupling tab of the grounding frame 460A when the connector 10 is assembled using a treadlock. The bent tab 414A is mechanically and electrically coupled to the coupling tab 461A of the grounding frame 460A, as shown in Figure 16 as an example. The grounding frame 510A is also mechanically and electrically coupled to the grounding frame 560A, and the grounding frame 510B is also mechanically and electrically coupled to the grounding frame 560B. As shown in Figure 17, the grounding frame 560B includes several eyelets, such as eyelet 561A, and the grounding frame 510B includes several grounding pins, such as grounding pin 514B. The grounding pin 514B is inserted into eyelet 561A, mechanically and electrically coupling the grounding frames 510B and 560B. The grounding frames 510A and 510B are coupled to each other in a similar manner. Figures 15–17 show exemplary grounding frames and methods for connecting them to one another, but frames of other sizes, shapes, and styles can be relied upon. Grounding frames can also be electrically connected to one another in other ways using mechanical interfaces and mating configurations.

[0076] The grounding frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B can be fixed in various ways to the wafer molding inserts 240, 250, 340, and 350, and the grounding channel blocks 400A, 400B, 450A, 450B, 500A, 500B, 550A, and 550B. Referring to Figure 16 as an example, the grounding frame 460B includes a mounting aperture 620 at one end, and the grounding frame 560B includes a mounting aperture 622 at one end. The mounting posts or plugs of the wafer molding inserts 250 and 350 can be molded or inserted through the apertures 620 and 622, for example, to help fix the grounding frames 460B and 560B in place using the wafer molding inserts 250 and 350. Each of the grounding frames 410A, 410B, 460A, 460B, 510A, 510B, 560A, and 560B includes one or more mounting apertures and may rely on other mechanisms to position the grounding frame within the connector 10. In some cases, the mounting apertures may be omitted.

[0077] Figure 18 shows a perspective view of the terminal legs 13 of the connector 10 shown in Figure 1. As shown, the ground channel blocks 450A, 450B, 550A, and 550B include ground ribs. For example, the ground channel blocks 450A and 450B include, among other things, ground ribs 451A and 452A of block 450A and ground ribs 451B and 451B of block 450B. The ground channel block 550A includes, among other things, ground ribs 551A and 552A, and the ground channel block 550B includes, among other things, ground ribs 551B and 552B. The ground ribs of the ground channel blocks 450A, 450B, 550A, and 550B can be plated with tin, gold, or another metallic plating suitable for surface mounting using tin, cadmium, zinc, indium, or other types of solder.

[0078] Due to the relatively large surface area of ​​the grounding ribs, they help to electrically isolate the tail contacts or ends of the terminal conductors in terminal rows 210 and 310 to the PCB or other assembly to which the connector 10 is attached to the terminal feet 13. For example, tail contacts 318T and 319T are located between grounding ribs 551B and 552B, and grounding ribs 551B and 552B help to maintain electrical isolation between signals on tail contacts 318T and 319T. Similarly, tail contacts 218T and 219T are located between grounding ribs 451B and 452B, and grounding ribs 451B and 452B help to maintain electrical isolation between signals on tail contacts 218T and 219T.

[0079] The side contours of the grounding ribs can, in some cases, be formed to follow or coincide with the side contours of the tail contacts in the terminal rows 210 and 310. For example, as shown in Figure 19, the side contours of the grounding ribs 451B and 551B follow the side contours of the tail contacts 219T and 319T along the bottom edge lengths 630 and 631 of the grounding rib 451B, respectively. Thus, when the terminal feet 13 of the connector 10 are placed on the top surface of the PCB or other assembly for surface mounting, both the edge lengths 630 and 631 of the grounding ribs 451B and 551B and the tail contacts 219T and 319T of the terminal rows 210 and 310 come into contact with the PCB.

[0080] The grounding ribs of connector 10 may include other mechanisms to facilitate surface mounting. For example, Figure 20 shows side views of grounding ribs 451F and 551F, illustrating alternative examples of grounding ribs. Grounding rib 451F includes curved recesses 641 and 642, and grounding rib 551F includes curved recesses 643 and 644. The curved recesses 641 and 642 of grounding rib 451F are located at both ends of the bottom edge length 650 of grounding rib 451F, and the curved recesses 643 and 644 of grounding rib 551F are located at both ends of the bottom edge length 651 of grounding rib 551F. The recesses 641-644 provide areas for soldering or other electrical coupling, for example, to flow and secure around the edge lengths 650 and 651 of grounding ribs 451F and 551F.

[0081] Figure 21 shows a partial view of another connector 20. Connector 20 is similar to connector 10, but includes metal grounding ribs and a grounding platform. In connector 20, each grounding channel block includes grounding ribs and a platform frame. In Figure 21, grounding channel block 450E is similar to grounding channel block 450B in connector 10, as described above. However, grounding channel block 450E includes grounding ribs 451F to 455F formed as metal rib inserts. Grounding ribs 451F to 455F can be formed from metal such as aluminum, copper, zinc, stainless steel, or other metals or metal alloys (e.g., formed by punching, shearing, or other methods), and may be plated with one or more plating metals. A side view of grounding rib 455F is shown in Figure 22.

[0082] The grounding ribs 451F-455F are not integrally formed with the grounding channel block 450E, as the grounding ribs 451B and 451B are integrally formed with the grounding channel block 450B. Instead, the grounding ribs 451F-455F are fitted around the wafer forming insert 250E and the grounding channel block 450E. The wafer forming insert 250E includes several seating channels, including, among others, the seating channel 251E. The grounding rib 455F includes rib teeth 670 (see Figure 22), which seat on the lower ledge of the seating channel 251E to form an interlocking fit between the grounding rib 455F and the wafer forming insert 250E. The grounding channel block 450E also includes channels or slots, and the rib tabs 680 of the grounding rib 455F (see Figure 22) slide within the channels or slots of the grounding channel block 450E, assisting in fixing it in place. The other grounding ribs 451F to 454F are fixed to the wafer molding insert 250E and the grounding channel block 450E in a similar manner.

[0083] The example shown in Figure 21 also includes a grounding platform frame 640. At least one main surface of the grounding platform frame 640 extends in a plane parallel to the main surfaces of the grounding ribs 451F–455F. For reference, the main surfaces of the grounding platform frame 640 are identified using crosshatch lines in Figure 21, and the main surfaces of the grounding ribs 455F are identified using crosshatch lines in Figure 22. The grounding platform frame 640 includes several openings 690–693 (see Figure 23) and a common bar 649 (see Figure 23) that extends across the grounding ribs 451F–455F and over the tail ends of the signal conductors, as shown in Figure 21. The grounding platform frame 640 can be formed from a metal such as aluminum, copper, zinc, stainless steel, or other metals or metal alloys, and may be plated with one or more plating metals.

[0084] Figure 22 shows a side view of the grounding rib 455F, and Figure 23 shows a top view of the grounding platform frame 640. The grounding rib 455F includes a bottom edge length 660 for surface mounting. The bottom edge length 660 of the grounding rib 455F may have other side contour shapes or styles, including angled lengths, compared to those shown. The bottom edge length 660 includes, for example, a curved recess 661 that provides an area for solder to flow. The bottom edge length 660 of the grounding rib 455F may also, in some cases, have additional recesses, as in the example shown in Figure 20.

[0085] The grounding rib 455F also includes a rib tab 680. The rib tab 680 can be inserted into a channel or slot of the grounding channel block 450E (see Figure 21), and the abutment edge of the rib tab 680 can contact the back surface within the channel or slot. The rib tab 680 also extends into a channel 646 within the grounding platform frame 640, as shown in Figure 23. The rib tabs of other grounding ribs may extend into other channels within the grounding platform frame 640. For example, the rib tab of the grounding rib 454F may extend into a channel 647 of the grounding platform frame 640.

[0086] The grounding rib 455F also includes rib teeth 670, which seat within the lower ledge of the seating channel 251E of the wafer molding insert 250E (see Figure 21), forming an interlock between the grounding rib 455F and the wafer molding insert 250E. In addition, the grounding rib 455F includes a shared channel 672. Referring to Figures 22 and 23, the interlock region 695 of the grounding platform frame 640 is inserted into the shared channel 672 of the grounding rib 455F when the connector is assembled. Similar interlock regions of the grounding platform frame 640 can be inserted into the shared channels of the grounding ribs 451F-454F. The shared teeth 671 of the grounding rib 455F seat against the leading edge 648 of the interlock region 695 to electrically and mechanically secure the grounding rib 455F to the grounding platform frame 640. As shown in Figure 21, once the connector 20 is assembled, the signal conductor can extend downward through the openings 690-693 of the grounding platform frame 640, and the common bar 649 extends over the tail end of the signal conductor, across the grounding ribs 451F-455F.

[0087] Terms such as "top," "bottom," "side," "front," "back," "right," and "left" are not intended to provide an absolute reference system. Rather, these terms are relative and are intended to distinguish specific mechanisms from one another, as the orientation of the structures described herein can change. Terms such as "comprising," "including," and "having" are synonymous and are used in an open-ended manner, not excluding additional elements, mechanisms, actions, or movements. Furthermore, the term "or" is used in an inclusive rather than exclusive sense; therefore, for example, when used to connect elements in a list, "or" means one, some, or all of the elements in the list.

[0088] Combinatorial languages ​​such as "at least one of X, Y, and Z" or "at least one of X, Y, or Z" are generally used to identify one of them, any two combinations, or all three (or more, if a larger group is identified), such as X and only X, Y and only Y, and Z and only Z, combinations of X and Y, combinations of X and Z, combinations of Y and Z, and all of X, Y, and Z. Such combinationatorial languages ​​are not generally intended to identify or include at least one X, at least one Y, and at least one Z, unless otherwise specified. The terms “approximately” and “substantially” take into account at least some manufacturing tolerances between a theoretical design and a manufactured product or assembly, such as geometric dimensions and tolerance standards, as described in American Society of Mechanical Engineers (ASME®) Y14.5 and related International Organization for Standardization (ISO®) standards, unless otherwise defined herein to relate to a specific range, percentage, or related deviation criterion. As those skilled in the art will understand, “approximately,” “substantially,” “orthogonal,” “vertex,” “collinear,” “coplanar,” and other terms, “approximately,” “substantially,” or related terms, even without explicit reference, still assume such manufacturing tolerances.

[0089] The embodiments described above in this disclosure are merely examples of embodiments intended to provide a clear understanding of the principles of this disclosure. Many changes and modifications can be made to the embodiments described above without substantially departing from the spirit and principles of this disclosure. Furthermore, components and mechanisms described in relation to one embodiment can be included in another embodiment. All such changes and modifications are intended to be included herein within the scope of this disclosure.

Claims

1. It is a connector, Housing and A wafer assembly comprising a terminal row and a wafer molding insert, wherein the terminal row comprises a plurality of terminal conductors, A wafer assembly support bar comprising a plurality of terminal seating surfaces, a terminal recess positioned between a pair of terminal seating surfaces, a reference surface, and a plurality of interlock apertures, One of the plurality of terminal conductors is electrically coupled to the terminal seat surface of the wafer assembly support bar. The wafer molding insert is a connector that extends into a plurality of interlock apertures of the wafer assembly support bar to fix the terminal row relative to the reference plane.

2. The wafer assembly support bar includes metal, The connector according to claim 1, wherein the wafer molding insert includes plastic.

3. The wafer assembly support bar comprises a first arm, a second arm, and an extension bar extending between the first arm and the second arm. The connector according to claim 1, wherein the first arm and the second arm define the side surface of the port opening of the connector.

4. The extension bar of the wafer assembly support bar is equipped with a molding interlock, The connector according to claim 3, wherein at least one of the first arm and the second arm is provided with the reference plane.

5. The aforementioned plurality of terminal conductors include a plurality of ground conductors and a plurality of signal conductors, The connector according to claim 1, wherein each of the plurality of grounding conductors is electrically coupled to each of the plurality of terminal seat surfaces.

6. The connector according to claim 5, wherein a pair of the plurality of signal conductors is surrounded by the wafer molding insert and extends through the terminal recess of the wafer assembly support bar.

7. Further comprising a grounding path assembly, The grounding path assembly includes a grounding channel block, The ground channel block includes multiple channels, The connector according to claim 1, wherein a pair of signal conductors among the plurality of terminal conductors extends along one of the plurality of channels.

8. The connector according to claim 7, wherein the ground channel block includes metal plating on a plastic body.

9. The ground channel block comprises a plurality of ground ribs for surface mounting the terminal feet of the connector to the substrate, The connector according to claim 7, wherein the channel extends between a pair of the plurality of grounding ribs in the terminal leg of the connector.

10. The connector according to claim 9, wherein the ground channel block comprises a ground bar that extends between a plurality of ground ribs of the ground channel block and is electrically coupled to the plurality of ground ribs.

11. The connector according to claim 9, wherein the plurality of grounding ribs are formed integrally with the grounding channel block.

12. The ground channel block includes metal plating on a plastic body, The connector according to claim 9, wherein the plurality of grounding ribs are separate from the grounding channel block and are formed of metal.

13. It is a connector, A wafer assembly including a terminal row and a wafer molding insert, A connector comprising a wafer assembly support bar having multiple terminal seating surfaces, multiple interlock apertures, and multiple terminal recesses, wherein each interlock aperture is aligned with one of the multiple terminal recesses, and the wafer molding insert extends within the multiple interlock apertures of the wafer assembly support bar.

14. The connector according to claim 13, wherein the ground conductor of the terminal row is electrically coupled to at least one of the plurality of terminal seating surfaces of the wafer assembly support bar.

15. The wafer assembly support bar includes metal, The wafer molding insert includes plastic, The wafer assembly support bar comprises a first arm, a second arm, and an extension bar extending between the first arm and the second arm. The connector according to claim 13, wherein the first arm and the second arm define the side surface of the front port opening of the connector.

16. Further comprising a grounding path assembly, The grounding path assembly includes a grounding channel block, The ground channel block includes a channel, The connector according to claim 13, wherein the pair of signal conductors of the terminal row extend along the channel.

17. The ground channel block comprises a plurality of ground ribs for surface mounting the terminal feet of the connector to the substrate, The connector according to claim 16, wherein the channel extends between a pair of earthing ribs in the terminal foot of the connector.

18. The connector according to claim 17, wherein the ground channel block comprises a ground bar extending between a plurality of ground ribs of the ground channel block and electrically coupled to the plurality of ground ribs.

Images