Multilayer electronic components

Abstract

To provide: a multilayer electronic component preventing external moisture penetration and the like to have improved reliability; a multilayer electronic component alleviating external impacts to have high impact resistance; and a multilayer electronic component in which a mounting space can be minimized.SOLUTION: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; an external electrode disposed outside the body; and an insulating layer disposed on the external electrode. The external electrode is disposed to cover an exposed surface of an outermost layer of the internal electrode, and is formed to have a thickness, equal to or less than a thickness of the body, and the insulating layer is disposed to cover an end of the external electrode, to improve moisture resistance reliability.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] Multi-Layered Ceramic Capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors mounted on printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones, playing a role in charging or discharging electricity. As the range of applications for capacitors continues to expand, the demand for miniaturization, higher capacitance, and higher reliability is also increasing.

[0003] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to mount. As various electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing. In order to make multilayer ceramic capacitors smaller and higher-capacitance, it is necessary to mount as many components as possible within a limited substrate area, and for this purpose, it is necessary to minimize the mounting space.

[0004] To minimize the mounting space, research is underway on structures that increase the effective volume by deforming the structure of the external electrodes to reduce the specific gravity of parts that do not contribute to capacitance. In this context, multilayer ceramic electronic components having L-shaped electrodes or bottom electrode structures, such as those described in Korean Published Patent Publication No. 10-2017-0143275, have been developed.

[0005] However, in the case of L-shaped electrodes, external impacts can easily cause the bond between the external electrode and the ceramic body to separate. Through this gap, the plating solution or external moisture can penetrate, potentially weakening the reliability of the product. Therefore, there is a need for a method to protect multilayer electronic components from the penetration of the plating solution or external moisture. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Korean Published Patent Gazette No. 10-2017-0143275 [Overview of the project] [Problems that the invention aims to solve]

[0007] One of the problems that this invention aims to solve is to provide a stacked electronic component with improved reliability by preventing external moisture penetration and other issues.

[0008] One of the problems that this invention aims to solve is to provide a stacked electronic component that is resistant to external shocks.

[0009] One of the problems that this invention aims to solve is to provide a stacked electronic component that can minimize the mounting space.

[0010] However, the problems that the present invention aims to solve are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0011] A multilayer electronic component according to an embodiment of the present invention includes a plurality of dielectric layers and first and second internal electrodes alternately arranged in a first direction with the dielectric layers interposed therebetween, and first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. A main body, a first connection portion disposed on the third surface and connected to the first internal electrode, and a first external electrode including a first band portion extending from the first connection portion to a part of the first surface, a second connection portion disposed on the fourth surface and connected to the second internal electrode, and a second external electrode including a second band portion extending from the second connection portion to a part of the first surface, a first insulating layer disposed on the first connection portion, and a second insulating layer disposed on the second connection portion. The first and second connection portions are disposed so as to cover the exposed surfaces of the first and second internal electrodes, respectively, and the first and second insulating layers are disposed so as to cover the first and second connection portions, respectively. When the average size of the main body in the first direction is T, the average size in the first direction from the first surface to the internal electrode closest to the second surface among the first and second internal electrodes is Ti, the average size in the first direction from the first surface to the first direction ends of the first and second connection portions is Tc, and the average size in the first direction from the first surface to one end in the first direction of the first and second insulating layers is Ts, Ti < Tc < Ts ≦ T can be satisfied.

[0012] A multilayer electronic component according to another embodiment of the present invention includes a plurality of dielectric layers and first and second internal electrodes alternately arranged in a first direction with the dielectric layers interposed therebetween, and first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. A main body, a first connection portion disposed on the third surface and connected to the first internal electrode, a first external electrode including a first band portion extending from the first connection portion to a part of the first surface, a second connection portion disposed on the fourth surface and connected to the second internal electrode, a second external electrode including a second band portion extending from the second connection portion to a part of the first surface, a first insulating layer disposed on the first connection portion, and a second insulating layer disposed on the second connection portion. The first and second connection portions are respectively disposed so as to cover the exposed surfaces of the first and second internal electrodes, and the first and second insulating layers are respectively disposed so as to cover the first and second connection portions. When the average size of the main body in the first direction is T, the average size of the main body in the second direction is W, the average size in the first direction from the first surface to the internal electrode closest to the second surface among the first and second internal electrodes is Ti, the average size in the second direction of the first and second internal electrodes is Wi, the average size in the first direction from the first surface to the first direction end portions of the first and second connection portions is Tc, the average size in the second direction of the first and second connection portions is Wc, the average size in the first direction from the first surface to one end portion in the first direction of the first and second insulating layers is Ts, and the average size in the second direction of the first and second insulating layers is Ws, Ti < Tc < Ts ≦ T and Wi < Wc < Ws ≦ W can be satisfied.

Effect of the Invention

[0013] One of the effects of the present invention is to adjust the height or thickness of the external electrode, minimize external moisture penetration, and improve the reliability while improving the capacitance per unit volume of the multilayer electronic component.

[0014] One of the effects of the present invention is that by disposing an insulating layer on the external electrode, external moisture penetration is further minimized, external shocks are absorbed, and the reliability of the laminated electronic component is improved.

[0015] However, the various and significant advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0016] [Figure 1] It is a perspective view schematically showing a laminated electronic component according to an embodiment of the present invention. [Figure 2] It is a perspective view schematically showing the main body of the laminated electronic component of FIG. 1. [Figure 3] It is an exploded perspective view schematically showing the main body of FIG. 2 disassembled. [Figure 4] It is a cross-sectional view taken along the line I-I' of FIG. 1. [Figure 5] It is an enlarged cross-sectional view of P1 in FIG. 4. [Figure 6] It is a cross-sectional view of a laminated electronic component according to another embodiment of the present invention, in which the K1' region corresponding to the K1 region of FIG. 5 is enlarged. [Figure 7] It is a cross-sectional view of a laminated electronic component according to another embodiment of the present invention, in which the P2' region corresponding to the P2 region of FIG. 4 is enlarged. [Figure 8] It is a cross-sectional view taken along the line II-II' of FIG. 1. [Figure 9] It is a perspective view schematically showing a mounting substrate on which a laminated electronic component according to an embodiment of the present invention is mounted. [Figure 10] It is a cross-sectional view taken along the line III-III' of FIG. 8.

Modes for Carrying Out the Invention

[0017] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0018] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are shown arbitrarily for the convenience of explanation; therefore, the present invention is not necessarily limited by the illustrations. Also, components that have the same function within the scope of the same idea are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, unless otherwise stated to the contrary, it does not mean that other components are excluded, but rather that other components may be further included.

[0019] In drawings, the first direction can be defined as the lamination direction or thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0020] Figure 1 is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention; Figure 2 is a schematic perspective view of the main body of the stacked electronic component of Figure 1; Figure 3 is an exploded perspective view of the main body of Figure 2, disassembled; Figure 4 is a cross-sectional view along the line I-I' in Figure 1; Figure 5 is an enlarged cross-sectional view of P1 in Figure 4; Figure 6 is an enlarged cross-sectional view of a stacked electronic component according to another embodiment of the present invention, showing the K1' region corresponding to the K1 region in Figure 5; Figure 7 is an enlarged cross-sectional view of a stacked electronic component according to another embodiment of the present invention, showing the P2' region corresponding to the P2 region in Figure 4; Figure 8 is a cross-sectional view along the line II-II' in Figure 1; Figure 9 is a schematic perspective view of a mounting substrate on which a stacked electronic component according to one embodiment of the present invention is mounted; and Figure 10 is a cross-sectional view along the line III-III' in Figure 8.

[0021] The following describes a stacked electronic component 100 according to one embodiment of the present invention, with reference to Figures 1 to 10.

[0022] Multilayer electronic components A stacked electronic component 100 according to an embodiment of the present invention includes a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122 alternately arranged in the first direction with the dielectric layers 111, first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and 4 and facing each other in the third direction. A main body 110, a first external electrode 131 disposed on the third surface 3 and connected to the first internal electrode 121, the first external electrode 131 including a first connection portion 131a and a first band portion 131b extending from the first connection portion 131a to a part of the first surface 1, a second external electrode 132 disposed on the fourth surface 4 and connected to the second internal electrode 122, the second external electrode 132 including a second connection portion 132a and a second band portion 132b extending from the second connection portion 132a to a part of the first surface 1, a first insulating layer 141 disposed on the first connection portion 131a, and a second insulating layer 142 disposed on the second connection portion 132a, wherein the first and second connection portions 131a and 132a are respectively arranged to cover the exposed surfaces of the first and second internal electrodes 121 and 122, the first and second insulating layers 141 and 142 are respectively arranged to cover the first and second connection portions 131a and 132a, when the average size of the main body 110 in the first direction is T, the average size in the first direction from the first surface 1 to the internal electrode closest to the second surface 2 among the first and second internal electrodes 121 and 122 is Ti, the average size in the first direction from the first surface 1 to the first direction ends of the first and second connection portions 131a and 132a is Tc, and the average size in the first direction from the first surface 1 to one end in the first direction of the first and second insulating layers 141 and 142 is Ts, Ti < Tc < Ts ≦ T can be satisfied.

[0023] The main body 110 can have the dielectric layers 111 and the internal electrodes 121 and 122 alternately laminated.

[0024] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be hexahedral or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body during the firing process, the main body 110 may not be a perfectly straight hexahedron, but it may be substantially hexahedral.

[0025] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3 and 4 and facing each other in a third direction.

[0026] The main body 110 includes a first-to-third corner connecting the first surface 1 and the third surface 3, a first-to-fourth corner connecting the first surface 1 and the fourth surface 4, a second-to-third corner connecting the second surface 2 and the third surface 3, and a second-to-fourth corner connecting the second surface 2 and the fourth surface 4. The first-to-third corner and the second-to-third corner have a form that contracts towards the center of the main body in the first direction as they approach the third surface 3, and the first-to-fourth corner and the second-to-fourth corner can have a form that contracts towards the center of the main body in the first direction as they approach the fourth surface 4.

[0027] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface 1 and the third to fifth surfaces 3, 4, and 5, and / or the corners connecting the second surface 2 and the third to fifth surfaces 3, 4, and 5, may have a form that is contracted toward the center in the first direction of the main body 110 with respect to the first surface 1 or the second surface 2. Alternatively, due to the contraction behavior during the sintering process of the main body 110, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6, and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, and 6, may have a form that is contracted toward the center in the first direction of the main body 110 with respect to the first surface 1 or the second surface 2. Alternatively, in order to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face 1 and the third to sixth faces 3, 4, 5, and 6, and / or the corners connecting the second face 2 and the third to sixth faces 3, 4, 5, and 6, have a rounded shape.

[0028] The above-mentioned corners may include the 1st-3rd corner connecting the 1st surface 1 and the 3rd surface 3, the 1st-4th corner connecting the 1st surface 1 and the 4th surface 4, the 2nd-3rd corner connecting the 2nd surface 2 and the 3rd surface 3, and the 2nd-4th corner connecting the 2nd surface 2 and the 4th surface 4. Furthermore, the corners may include the 1st-5th corner connecting the 1st surface 1 and the 5th surface 5, the 1st-6th corner connecting the 1st surface 1 and the 6th surface 6, the 2nd-5th corner connecting the 2nd surface 2 and the 5th surface 5, and the 2nd-6th corner connecting the 2nd surface 2 and the 6th surface 6. The 1st to 6th surfaces 1, 2, 3, 4, 5, and 6 of the main body 110 can be generally flat surfaces, and non-flat areas can be considered corners. Hereinafter, the extension of each surface may mean a line extended from the flat portion of each surface.

[0029] On the one hand, in order to suppress the step between the internal electrodes 121 and 122, after cutting the internal electrodes 121 and 122 after lamination so as to be exposed on the fifth and sixth surfaces 5 and 6 of the main body 110, when a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) which is both side surfaces of the active part Ac to form the margin parts 114 and 115, the parts connecting the first surface 1 with the fifth and sixth surfaces 5 and 6 and the parts connecting the second surface 2 with the fifth and sixth surfaces 5 and 6 may not have a contracted form.

[0030] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated so that they are difficult to confirm without using a scanning electron microscope (SEM).

[0031] The raw material for forming the dielectric layer is not limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can contain BaTiO3-based ceramic powder. As an example of the ceramic powder, BaTiO3, (Ba y Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0032] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the powder such as barium titanate (BaTiO3) as the raw material for forming the dielectric layer according to the object of the present invention.

[0033] On the other hand, the average thickness td of the dielectric layer 111 is not particularly limited. Generally, when the dielectric layer is formed thinly with an average thickness of 0.6 μm or less, reliability may decrease, especially when the average thickness of the dielectric layer 111 is 0.4 μm or less. However, by placing insulating layers 141 and 142 containing resin according to one embodiment of the present invention on the connection parts 131a and 132a of the external electrodes, it is possible to prevent the penetration of external moisture or plating solution, thereby improving reliability. Thus, excellent reliability can be ensured even when the average thickness td of the dielectric layer 111 is 0.4 μm or less.

[0034] The average thickness td of the dielectric layer 111 can refer to the average thickness of the dielectric layer 111 that is placed between the first and second internal electrodes 121 and 122.

[0035] The average thickness td of the dielectric layer 111 can be measured by scanning images of the cross-section of the main body 110 in the first and second directions (length and thickness directions, LT direction) using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one dielectric layer can be measured at 30 equally spaced points in the second direction (length direction) in the scanned image, and the average value can be measured. These 30 equally spaced points can be specified by the active area Ac. Furthermore, by extending this average value measurement to 10 dielectric layers and measuring the average values, the average thickness td of the dielectric layer 111 can be further generalized. Here, the average thickness td of the dielectric layer 111 can represent the average size in the first direction.

[0036] The main body 110 may include an active portion Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged facing each other with a dielectric layer 111 in between to form a capacitance, and upper and lower cover portions 112 and 113 which are formed on both end faces of the active portion Ac in the first direction, and margin portions 114 and 115 which may be arranged on both sides of the active portion Ac in the third direction.

[0037] The active portion Ac, which contributes to the capacitance formation of the multilayer electronic component, can be formed by repeatedly stacking multiple first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0038] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the active portion Ac in the first direction and a lower cover portion 113 positioned below the active portion Ac in the first direction.

[0039] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the first direction (thickness direction) on the upper and lower surfaces of the active portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0040] The upper cover portion 112 and the lower cover portion 113 do not include the internal electrodes 121 and 122 and may contain the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 may contain ceramic material, for example, barium titanate (BaTiO3) based ceramic material.

[0041] The average thickness tc of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average thickness tc of the cover portions 112 and 113 can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less for ultra-small products. On the other hand, the effect of improving reliability by arranging the insulating layers 141 and 142 on the connection portions 131a and 132a of the external electrodes is the same as described above, and excellent reliability can be ensured even when the average thickness tc of the cover portions 112 and 113 is 30 μm or less, and excellent reliability can also be maintained even when the average thickness tc of the cover portions 112 and 113 is 20 μm or less.

[0042] The average thickness tc of the cover portions 112 and 113 can be the average of the dimensions (thickness) in the first direction measured at five equally spaced points on the upper or lower cover portions 112 and 113 of the active portion Ac. Here, the average thickness tc of the cover portions 112 and 113 can represent the average dimensions in the first direction.

[0043] On the other hand, the margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both sides of the main body 110 in the third direction (width direction).

[0044] As shown in Figure 2, the margin portions 114 and 115 can refer to the regions between the interface between the first and second internal electrodes 121 and 122 in the third direction and the body 110, with respect to the cross-sections of the body 110 in the first and third directions (thickness and width direction, WT direction).

[0045] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The margin portions 114 and 115 can be formed by applying conductive paste to the ceramic green sheet, except where the margin portions 114 and 115 are formed, to form the internal electrodes 121 and 122. As described above, in order to suppress the step caused by the internal electrodes 121 and 122, the laminated internal electrodes 121 and 122 can be cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both sides of the active portion Ac to form the margin portions 114 and 115.

[0047] The average width of the first and second margin portions 114 and 115 is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the average width of the first and second margin portions 114 and 115 can be 80 μm or less, preferably 30 μm or less, and more preferably 20 μm or less for ultra-small products. On the other hand, the effect of improving reliability by arranging the insulating layers 141 and 142 on the connection portions 131a and 132a of the external electrodes is the same as described above, and excellent reliability can be ensured even when the average width of the first and second margin portions 114 and 115 is 30 μm or less, and excellent reliability can also be maintained even when the average width of the margin portions 114 and 115 is 20 μm or less.

[0048] The average width of margin portions 114 and 115 can be the average of the widths of margin portions 114 and 115 measured at five equally spaced points in the first direction on the side surface of the active portion Ac. Here, the average width of margin portions 114 and 115 can represent the average size of margin portions 114 and 115 in the third direction.

[0049] The internal electrodes 121 and 122 can be stacked alternately with the dielectric layer 111. The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122, and the first and second internal electrodes 121 and 122 are arranged alternately facing each other with the dielectric layer 111 constituting the main body 110 in between, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0050] Referring to Figure 4, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 can be placed on the third surface 3 of the main body 110 and connected to the first internal electrode 121, and the second external electrode 131 can be placed on the fourth surface 4 of the main body 110 and connected to the second internal electrode 122.

[0051] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but can be connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but can be connected to the second external electrode 132. In this case, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed in between.

[0052] On the other hand, the main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0053] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following onto a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The printing method for the conductive paste for internal electrodes can be screen printing or gravure printing, but the present invention is not limited thereto.

[0054] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited. Generally, when the internal electrodes 121 and 122 are formed thinly with an average thickness of 0.6 μm or less, reliability may decrease, especially when the average thickness of the internal electrodes 121 and 122 is 0.4 μm or less. However, when insulating layers 141 and 142 containing resin are placed on the connection parts 131a and 132a of the external electrodes according to one embodiment of the present invention, reliability can be improved by preventing the penetration of external moisture or plating solution, and thus excellent reliability can be ensured even when the average thickness te of the internal electrodes 121 and 122 is 0.4 μm or less.

[0055] The average thickness te of the internal electrodes 121 and 122 can be measured by scanning images of the cross-sections of the main body 110 in the first and second directions (length and thickness directions, LT direction) with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, in the scanned image, the size (thickness) in the first direction can be measured at 30 equally spaced points in the second direction (length direction) for one internal electrode, and the average value can be calculated. The 30 equally spaced points can be specified by the active area Ac. Furthermore, by extending this average value measurement to 10 internal electrodes and calculating the average, the average thickness te of the internal electrodes can be further generalized. Here, the average thickness te of the internal electrodes can represent the average size in the first direction.

[0056] One embodiment of the present invention describes a structure in which a stacked electronic component 100 has two external electrodes 131 and 132, but the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0057] External electrodes 131 and 132 can be arranged on the third and fourth surfaces 3 and 4 of the main body 110. More specifically, the external electrodes 131 and 132 can include first and second connecting portions 131a and 132a, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to the first and second internal electrodes 121 and 122, respectively.

[0058] Of the external electrodes 131 and 132, the areas located on the 1st to 3rd corners and the 1st to 4th corners of the main body 110 can be designated as corner portions (not shown), the areas located on the 3rd and 4th surfaces 3 and 4 of the main body 110 can be designated as connecting portions 131a and 132a, and the areas located on the 1st surface 1 of the main body can be designated as band portions 131b and 132b.

[0059] In this specification, since the band portions 131b and 132b extend from the connecting portions 131a and 132a to a part of the first surface 1, the band portions 131b and 132b are described as including corner portions (not shown). However, if necessary, the band portions 131b and 132b and the corner portions (not shown) can be described separately.

[0060] The external electrodes 131 and 132 may include a first external electrode 131 positioned on the third surface 3 and including a first connecting portion 131a connected to the first internal electrode 121 and a first band portion 131b extending from the first connecting portion 131a to a part of the first surface 1, and a second external electrode 132 positioned on the fourth surface 4 and including a second connecting portion 132a connected to the second internal electrode 122 and a second band portion 132b extending from the second connecting portion 132a to a part of the first surface 1. That is, the first connecting portion 131a can be connected to the first internal electrode 121 on the third surface 3, and the second connecting portion 132a can be connected to the second internal electrode 122 on the fourth surface 4.

[0061] On the other hand, the external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0062] The external electrodes 131 and 132 can be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0063] Furthermore, the external electrodes 131 and 132 can be formed by sequentially forming a fired electrode and a resin-based electrode on the main body 110. Additionally, the external electrodes 131 and 132 can be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0064] While materials with excellent electrical conductivity can be used as the conductive metal in the external electrodes 131 and 132, the invention is not limited thereto. For example, the conductive metal can be one or more of copper (Cu), nickel (Ni), palladium (Pd), silver (Ag), tin (Sn), chromium (Cr), and their alloys. On the other hand, if the external electrodes 131 and 132 contain one or more of Ni and Ni alloys, the connectivity with the internal electrodes 121 and 122 containing Ni can be further improved.

[0065] In this specification, the connection portions 131a, 132a and the band portions 131b, 132b of the external electrodes are described separately. This distinction is made for the convenience of structural explanation, and the main conductive metal components of the connection portions 131a, 132a and the main conductive metal components of the band portions 131b, 132b can be the same. However, this is not a limitation, and if it is necessary to have different components for the band portions 131b, 132b, the main components of the connection portions 131a, 132a and the band portions 131b, 132b can be different. That is, the main components of the first connection portion 131a and the first band portion 131b can be different from each other, and the main components of the second connection portion 132a and the second band portion 132b can be different from each other.

[0066] The insulating layers 141 and 142 can be placed on the connection portions 131a and 132a. More specifically, the first insulating layer 141 can be placed on the first connection portion 131a, and the second insulating layer 142 can be placed on the second connection portion 132a.

[0067] Since the first and second connecting portions 131a and 132a are connected to the first and second internal electrodes 121 and 122, they can serve as pathways for the penetration of plating solution during the plating process or for the penetration of external moisture during actual use. In one embodiment of the present invention, insulating layers 141 and 142 are further arranged on the connecting portions 131a and 132a, which can more effectively prevent the penetration of plating solution or external moisture.

[0068] On the other hand, the insulating layers 141 and 142 may contain resin.

[0069] Conventionally, glass-based materials were generally used for the insulating layer. However, due to the characteristics of the glass series, excessive unevenness occurred during sintering, making it difficult to form a uniform layer. Furthermore, the heat required during the sintering process could generate stress within the main body, potentially causing cracks or delamination. In addition, when using an insulating layer containing glass-based materials, a method is used in which the insulating layer containing the glass-based material is fired after the external electrodes. However, during the firing process of the insulating layer, there was a risk of radial cracking due to the diffusion of metallic material from the external electrodes into the internal electrodes. Moreover, because glass-based materials generally have high hardness, there was a risk of breakage even from small impacts.

[0070] Here, by incorporating resin instead of glass series into the insulating layer, the problems associated with glass series insulating layers can be solved. Resin has superior impact resistance compared to glass series and can be cured at low temperatures, thus suppressing cracks due to thermal shrinkage and radial cracks due to metal diffusion. Furthermore, resin has the advantage of being readily available in terms of cost and supply compared to glass series.

[0071] The type of resin is not particularly limited and may include, for example, one or more selected from epoxy resins, acrylic resins, ethyl cellulose, and polymer resins.

[0072] In one embodiment of the present invention, the insulating layers 141 and 142 may contain one or more additives selected from SiO2, TiO2, BaTiO3, BaO, Al2O3, and ZnO, in addition to the resin. However, they are not particularly limited thereto, and may also contain oxides or inorganic powders with high insulating properties.

[0073] The additives added to the insulating layers 141 and 142 have excellent bonding strength with the dielectric material contained in the main body 110 and the glass contained in the external electrodes 131 and 132, thereby improving the bonding strength with the main body 110 and the external electrodes 131 and 132.

[0074] The method for forming the insulating layers 141 and 142 is not particularly limited. For example, after forming the external electrodes 131 and 132 on the main body 110, the insulating layers 141 and 142 can be formed by printing resin, transferring resin made from a sheet, or dipping the main body 110 into a paste containing resin. Alternatively, one or more of the above methods can be applied to form them.

[0075] In one embodiment of the present invention, the insulating layers 141 and 142 can be arranged in direct contact with the first and second external electrodes 131 and 132, and the region on the outer surface of the first and second external electrodes 131 and 132 on which the insulating layers 141 and 142 are arranged can suppress erosion of the external electrodes by the plating solution.

[0076] On the other hand, as various electronic devices become smaller and more powerful, the demand for miniaturization and higher capacity in multilayer electronic components is increasing. To achieve this, it is necessary to mount as many components as possible within a limited substrate area, which requires minimizing the mounting space. Here, attempts have been made to increase the effective volume of multilayer electronic components by changing the shape of external electrodes, such as L-shaped electrodes, to reduce the specific gravity of parts that do not contribute to capacitance. However, in the case of L-shaped electrodes, they are vulnerable to external impacts, and the bond between the external electrode and the ceramic body may separate. Moisture and other external substances can then penetrate through the separated gap, which can reduce the reliability of the multilayer electronic component.

[0077] According to one embodiment of the present invention, the shape of the external electrode or insulating layer can be controlled to prevent external moisture penetration, and the external electrode and ceramic body can be prevented from separating in the event of impact, thereby improving reliability.

[0078] Referring to FIG. 4, when explaining the stacked electronic component 100 according to an embodiment of the present invention, the first connection portion 131a is arranged so that the exposed surface of the first internal electrode 121 is not exposed to the outside, and the second connection portion 132a can be arranged so that the exposed surface of the second internal electrode 122 is not exposed to the outside. That is, the first and second connection portions 131a and 132a can be arranged to be connected including the exposed surface of the internal electrode arranged closest to the second surface 2 among the first and second internal electrodes 121 and 122 from the first surface 1.

[0079] More specifically, when defining the average size in the first direction from the first surface 1 to the internal electrode arranged closest to the second surface 2 among the first and second internal electrodes as Ti, the average size in the first direction from the first surface 1 to the end portions in the first direction of the first and second connection portions 131a and 132a as Tc, and the average size in the first direction from the first surface 1 to one end portion in the first direction of the first and second insulating layers 141 and 142 as Ts, Ti < Tc < Ts ≤ T can be satisfied.

[0080] More specifically explained, the first insulating layer 141 can be arranged to cover the end portion in the first direction of the first connection portion 131a, and the second insulating layer 142 can be arranged to cover the end portion in the first direction of the second connection portion 132a. When defining the average size in the first direction from the first surface 1 to the first internal electrode 121 arranged closest to the second surface 2 as Ti1, the average size in the first direction from the first surface 1 to the second internal electrode 122 arranged closest to the second surface 2 as Ti2, the average size in the first direction from the first surface 1 to the end portion in the first direction of the first connection portion 131a as Tc1, the average size in the first direction from the first surface 1 to the end portion in the first direction of the second connection portion 132a as Tc2, the average size in the first direction from the first surface 1 to one end portion in the first direction of the first insulating layer 141 as Ts1, and the average size in the first direction from the first surface 1 to the end portion in the first direction of the second insulating layer 142 as Ts2, Ti1 < Tc1 < Ts1 ≤ T and Ti2 < Tc2 < Ts2 ≤ T can be satisfied.

[0081] On the other hand, the average size of the first and second connection portions 131a and 132a in the first direction can be different. Referring to Figures 5 and 7, it is sufficient for the average size Tc2 of the second connection portion 132a in the first direction to exceed the average size Ti2 of the second internal electrode 122 in the first direction, and even if it does not exceed the average size Ti1 of the first internal electrode 121 in the first direction, it is possible to prevent moisture from penetrating to the interface between the second connection portion 132a and the fourth surface 4 of the main body, thereby improving the reliability of the laminated electronic component 100.

[0082] Here, the dimensions of the main body 110, connection parts 131a, 132a, and insulating layers 141, 142 in the first direction can be measured via SEM in the cross-sections of the first and second directions (length and thickness directions, LT direction), and the average dimensions in the first direction can be calculated by measuring the dimensions in the first direction at 30 equally spaced points in the third direction (width direction) and averaging the results. Here, the dimensions in the first direction can mean height or thickness.

[0083] In other words, the connecting portions 131a and 132a are positioned to exceed the height of the outermost layer of the internal electrodes 121 and 122 that are closest to the second surface 2 from the first surface 1, and can be positioned below the extension line E2 of the second surface of the main body 110. Here, the outermost layer of the internal electrodes 121 and 122 can be one of the first and second internal electrodes 121 and 122 that are closest to the second surface 2, and "height or thickness" can mean the size from a reference point, more specifically, the size in the first direction from the first surface 1 of the main body 110. By forming the connecting portions 131a and 132a to be larger in the first direction than the height or thickness of the outermost layer of the internal electrodes 121 and 122, the connectivity between the connecting portions 131a and 132a and the internal electrodes 121 and 122 is not reduced, and the penetration of external moisture and the like between the interface between the connecting portions 131a and 132a and the main body 110 can be prevented.

[0084] Furthermore, by positioning the ends of the connection portions 131a and 132a in the first direction below the extension line E2 of the second surface of the main body 110, the thickness of the stacked electronic component 100 can be kept from increasing, thereby minimizing the volume and thus the mounting space.

[0085] In other words, the first external electrode 131 and the second external electrode 132 do not have to be placed on the second surface 2, and by not placing the first connection portion 131a of the first external electrode and the second connection portion 132a of the second external electrode on the second surface 2, the first connection portion 131a and the second connection portion 132a can be placed below the extension line E2 of the second surface of the main body 110.

[0086] Referring to Figure 6, the first end of the first connection portion 131a in the first direction can be located at the second-third corner of the main body and positioned below the extension line E2 of the second surface, and in the second direction, it can be positioned to the right of the extension line E3 of the third surface 3 and in contact with the main body 110. Also, one end of the first insulating layer 141 covering the first connection portion 131a in the first direction can be positioned to contact the second-third corner of the main body 110, positioned below the extension line E2 of the second surface in the first direction, and in the second direction, it can be positioned to the right of the extension line E3 of the third surface 3 and in contact with the main body 110. By the first connection portion 131a and the first insulating layer 141 contacting the second-third corner of the main body 110, external moisture penetration can be effectively prevented. This can also be achieved in a structure where the second connection portion 132a and the second insulating layer 142 contact the second-fourth corner of the main body 110, as described above, by effectively preventing external moisture penetration.

[0087] Referring to Figures 9 and 10, a stacked electronic component 100 according to one embodiment of the present invention can be described. The insulating layers 141 and 142 can be positioned between the extension line Eb1 of the outer surface of the band portions 131b and 132b and the extension line E2 of the second surface 2. Here, the outer surface of the band portions 131b and 132b can mean the surface that is exposed to the outside, rather than the interface that is in contact with the main body 110, among the surfaces parallel to the first surface 1 of the main body.

[0088] More specifically, the first insulating layer 141 can be positioned between the extension line Eb1 of the outer surface of the first band and the extension line E2 of the second surface, and the second insulating layer 142 can be positioned between the extension line Eb1 of the outer surface of the second band and the extension line E2 of the second surface. In this case, the extension line Eb1 of the outer surface of the first band and the extension line Eb1 of the outer surface of the second band can be the same, but are not limited to this, and the extension lines of the outer surfaces of the first and second bands can not coincide.

[0089] In other words, with respect to the first direction, one end of the first and second insulating layers 141 and 142 may be located between the outermost layer of the internal electrodes 121 and 122 and the extension line E2 of the second surface of the main body, and the other end may be located between the extension line E1 of the first surface of the main body and the extension line Eb1 of the outer surface of the band portion. However, it is not limited to this, and the shape of solder 191, 192, etc. may change as needed when mounting to the substrate 180, and may cover part or all of the outer surface of the band portions 131b and 132b. In other words, the insulating layers 141 and 142 may be arranged to cover part of the band portion on the connection portion 131a and 132a and the corner portion (first to third corner or first to fourth corner). This prevents excessive formation of solder 191 and 192 and minimizes the mounting space.

[0090] In one embodiment of the present invention, the stacked electronic component 100 can have an average size (average thickness) of the insulating layers 141 and 142 in the second direction of 500 nm or more and 50 μm or less.

[0091] If the average thickness of the insulating layers 141 and 142 is less than 500 nm, it may not be able to effectively block moisture penetration or adequately protect the main body 110, potentially causing damage to the main body 110 or the internal electrodes 121 and 122. If the average thickness of the insulating layers 141 and 142 exceeds 50 μm, the specific gravity occupied by the insulating layers 141 and 142 may be excessive, making it difficult to minimize the capacitance per unit volume of the multilayer electronic component 100.

[0092] On the other hand, the average size of the insulating layers 141 and 142 in the second direction can be a value obtained by measuring the sizes in the second direction at 30 points equally spaced in the first direction in the cross sections in the first and second directions (length and thickness directions, L-T direction) and averaging them.

[0093] In the stacked electronic component 100 according to another embodiment of the present invention, the first and second connection portions 131a and 132a are respectively arranged so as to cover the exposed surfaces of the first and second internal electrodes 121 and 122, and the first and second insulating layers 141 and 142 are respectively arranged so as to cover the first and second connection portions 131a and 132a. When the average size of the main body 110 in the second direction is defined as W, the average size of the first and second internal electrodes 121 and 122 in the second direction is defined as Wi, the average size of the first and second connection portions 131a and 132a in the second direction is defined as Wc, and the average size of the first and second insulating layers 141 and 142 in the second direction is defined as Ws, Wi < Wc < Ws ≦ W can be satisfied.

[0094] Referring to FIG. 8 to describe the stacked electronic component 100, the first and second connection portions 131a and 132a are respectively arranged so as to cover the first and second internal electrodes 121 and 122. When the average size of the first and second internal electrodes 121 and 122 in the third direction is defined as Wi, the average size of the first and second connection portions 131a and 132a in the third direction is defined as Wc, and the average size of the main body 110 in the third direction is defined as W, Wi < Wc ≦ W can be satisfied.

[0095] Also, the first and second insulating layers 141 and 142 are respectively arranged so as to cover the first and second connection portions 131a and 132a. When the average size of the first and second insulating layers in the third direction is defined as Ws, Wi < Wc < Ws ≦ W can be satisfied.

[0096] More specifically, if the average size Wc of the connection parts 131a and 132a in the third direction exceeds the average size Wi of the internal electrodes 121 and 122 in the third direction, and is less than or equal to the average size W of the main body 110 in the third direction, then external moisture penetration can be effectively prevented. Furthermore, if the average size Ws of the insulating layers 141 and 142 in the third direction exceeds the average size Wc of the connection parts 131a and 132a in the third direction, and is less than or equal to the average size W of the main body 110 in the third direction, then the main body 110 can be protected from external impacts, and external moisture penetration can be prevented even more effectively, thereby improving the reliability of the laminated electronic component 100.

[0097] In this case, the first connection portion 131a can be arranged to cover the third direction so that the first internal electrode 121 is not exposed to the outside, and the second connection portion 132a can be arranged to cover the third direction so that the second internal electrode 122 is not exposed to the outside.

[0098] Here, the average size in the third direction of the main body 110, internal electrodes 121, 122, connecting parts 131a, 132a, and insulating layers 141, 142 can be measured via SEM in the second and third direction (length and width direction, LW direction) cross-sections of the main body 110 including the internal electrodes. More specifically, the average size in the third direction can be further generalized by measuring the size in the second and third direction cross-sections and extending such measurements to the 10 layers including the internal electrodes and calculating the average.

[0099] On the other hand, a plating layer (not shown) can be placed on the insulating layers 141 and 142.

[0100] The plating layer plays a role in improving mounting characteristics. The type of plating layer is not particularly limited and can be a plating layer containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and their alloys, and can be formed from multiple layers.

[0101] To give a more specific example of the plating layer, the plating layer can be a Ni plating layer or a Sn plating layer, and can be configured such that a Ni plating layer and a Sn plating layer are formed sequentially on the insulating layers 141 and 142, or a configuration such that a Sn plating layer, a Ni plating layer, and a Sn plating layer are formed sequentially. Furthermore, the plating layer can also include multiple Ni plating layers and / or multiple Sn plating layers.

[0102] Referring to Figures 9 and 10, which show a mounting substrate on which the multilayer electronic component 100 is mounted, the band portions 131b and 132b can be joined to electrode pads 181 and 182 placed on the substrate 180 by solder 191 and 192.

[0103] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 100 can be horizontally mounted on the substrate 180 so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting only; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component 100 can be vertically mounted on the substrate 180 so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0104] There is no particular limit to the size of the stacked electronic component 100.

[0105] However, in order to achieve both miniaturization and high capacitance simultaneously, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, the effects of the present invention on improving reliability and capacitance per unit volume can be more pronounced in a stacked electronic component 100 having a size of 0402 (length × width, 0.4 mm × 0.2 mm) or less.

[0106] The present invention will be described in more detail below with reference to examples, but this is intended to aid in a concrete understanding of the invention, and the scope of the present invention is not limited by these examples.

[0107] (Examples) The capacity and humidity resistance reliability were evaluated according to the height of the outermost layer of the internal electrode, the height of the connection part of the external electrode, and the thickness of the main body, and are shown in Table 1 below. The capacity and humidity resistance reliability were also evaluated according to the width of the internal electrode, the width of the external electrode, and the width of the main body, and are shown in Table 2 below.

[0108] The height of the outermost layer of the internal electrodes refers to the height from the first surface of the main body to the internal electrode closest to the second surface, the height of the connection portion of the external electrodes refers to the height from the extension line of the first surface of the main body to one end of the connection portion in the first direction, and the thickness of the main body refers to the height from the first surface to the second surface of the main body. On the other hand, the insulating layer is formed from the corner portion to cover the end of the connection portion and is formed so as not to exceed the thickness of the main body.

[0109] In this case, the height or thickness was measured by polishing the multilayer electronic component to a depth of 1 / 2 in the third direction (width direction) to expose the cross-sections in the first and second directions (length and thickness directions, LT direction), and the width was measured by polishing the multilayer electronic component to a depth of 1 / 2 in the first direction (thickness direction) to expose the cross-sections in the second and third directions (length and width directions, LW direction).

[0110] A multilayer electronic component was manufactured using a dielectric layer containing barium titanate (BaTiO3), an internal electrode made of nickel (Ni), an external electrode connection made of copper (Cu), and an insulating layer made of epoxy resin.

[0111] Tables 1 and 2 below show data from evaluating the capacitance and humidity resistance reliability of 400 multilayer electronic components mounted on a substrate.

[0112] For capacity evaluation, if the measured capacity value (μF) decreased to less than 10% compared to the reference capacity (μF), it was evaluated as defective and indicated with an X in the table below. If the decrease did not fall below 10%, it was evaluated as not defective and indicated with an O in the table below.

[0113] Humidity resistance reliability was evaluated using the 8585 test, applying a rated voltage of 1Vr for 24 hours under temperature conditions of 85°C and relative humidity conditions of 85%. At this time, the insulation resistance (IR) value of the multilayer electronic component was 10 times the initial insulation resistance (IR).6 If any one of the following fails, it is evaluated as defective and marked as X in the table below. When the insulation resistance (IR) value is 10 times that of the initial insulation resistance (IR0), 6 If there is no laminated electronic component that has fallen below, it is evaluated as non-defective and marked as O in the table below.

[0114]

Table 1

[0115] Test numbers 1 and 2 are evaluated as defective in terms of moisture resistance reliability, and it can be confirmed that the height Tc of the connection part is formed higher than the body thickness T. For test numbers 6 to 8, at least one of them is evaluated as defective in terms of capacitance or moisture resistance reliability, and it can be confirmed that the height Tc of the connection part is formed below the height Ti of the outermost layer of the internal electrode.

[0116] On the other hand, for test numbers 3 to 5, the height Tc of the connection part exceeds the height Ti of the outermost layer of the internal electrode, but is formed below the body thickness T. It can be confirmed that there are no components with a target capacitance variation of less than 10% and no defects in moisture resistance reliability.

[0117] Thus, when Ti < Tc ≤ T is satisfied, it can be confirmed that the reliability of the laminated electronic component is improved. Since the insulating layer covers the end of the connection part, it can be seen that the reliability of the laminated electronic component is also improved when Ti < Tc < Ts ≤ T.

[0118]

Table 2

[0119] Test numbers 9 and 10 are evaluated as defective in terms of moisture resistance reliability, and it can be confirmed that the width Wc of the connection part is formed wider than the width W of the body. Also, for test numbers 15 and 16, at least one of them is evaluated as defective in terms of capacitance or moisture resistance reliability, and it can be confirmed that the width Wc of the connection part is formed below the width Wi of the internal electrode.

[0120] On the other hand, in Test Nos. 11 to 14, the width Wc of the connection part exceeds the width Wi of the internal electrode, but is formed to be not more than the width W of the main body, and it can be confirmed that the target capacitance fluctuation is maintained below 10% and there are no parts with failures in moisture resistance reliability either.

[0121] Thereby, when Wi < Wc ≤ W is satisfied, it can be confirmed that the reliability of the multilayer electronic component is improved. Also, since the insulating layer covers the end portion of the connection part, it can be understood that the reliability of the multilayer electronic component can be improved even when Wi < Wc < Ws ≤ W.

[0122] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the attached drawings. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field within the scope not departing from the technical idea of the present invention described in the claims, and it can be said that these also belong to the scope of the present invention.

Explanation of Reference Numerals

[0123] 100 Multilayer electronic component 110 Main body 111 Dielectric layer 112, 113 Cover part 114, 115 Margin part 121, 122 Internal electrode 131, 132 External electrode 131a, 132a Connection part 131b, 132b Band part 141, 142 Insulating layer 180 Substrate 181, 182 Electrode pad 191, 192 Solder

Claims

1. A body comprising a plurality of dielectric layers and first and second internal electrodes arranged alternately in a first direction with the dielectric layers in between, the body comprising first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction, The first external electrode includes a first connecting portion arranged on the third surface and connected to the first internal electrode, and a first band portion extending from the first connecting portion to a part of the first surface, The second external electrode includes a second connecting portion arranged on the fourth surface and connected to the second internal electrode, and a second band portion extending from the second connecting portion to a part of the first surface, A first insulating layer disposed on the first connection portion, The second insulating layer is disposed on the second connection portion, The first and second connecting portions are arranged to cover the exposed surfaces of the first and second internal electrodes, respectively, and the first and second insulating layers are arranged to cover the first and second connecting portions, respectively. The average size of the main body in the first direction is T, Ti is the average size in the first direction from the first surface to the internal electrode closest to the second surface among the first and second internal electrodes. The average size in the first direction from the first surface to the ends of the first and second connecting portions in the first direction is Tc. When Ts is defined as the average size in the first direction from the first surface to one end of the first and second insulating layers in the first direction, A multilayer electronic component satisfying Ti < Tc < Ts ≤ T.

2. The laminated electronic component according to claim 1, wherein the first insulating layer is disposed between the extension line of the outer surface of the first band portion and the extension line of the second surface, and the second insulating layer is disposed between the extension line of the outer surface of the second band portion and the extension line of the second surface.

3. The stacked electronic component according to claim 1, wherein the main components of the first connection portion and the first band portion are different from each other, and the main components of the second connection portion and the second band portion are different from each other.

4. The laminated electronic component according to claim 1, wherein the first and second insulating layers include a resin.

5. The laminated electronic component according to claim 4, wherein the resin comprises one or more selected from epoxy resin, acrylic resin, ethyl cellulose, and polymer resin.

6. The first and second insulating layers are made of SiO ２ , TiO ２ , BaTiO ３ BaO, Al ２ O ３ The multilayer electronic component according to claim 1, comprising one or more additives selected from and ZnO.

7. The stacked electronic component according to claim 1, wherein the main body further includes an active portion in which capacitance is formed by including the plurality of dielectric layers and the first and second internal electrodes arranged alternately in a first direction, a cover portion disposed on both end faces of the active portion in the first direction, and a margin portion disposed on both sides of the active portion in the third direction.

8. The stacked electronic component according to claim 7, wherein the average size of the cover portion in the first direction is 100 μm or less, and the average size of the margin portion in the third direction is 80 μm or less.

9. A body comprising a plurality of dielectric layers and first and second internal electrodes arranged alternately in a first direction with the dielectric layers in between, the body comprising first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction, The first external electrode includes a first connecting portion arranged on the third surface and connected to the first internal electrode, and a first band portion extending from the first connecting portion to a part of the first surface, The second external electrode includes a second connecting portion arranged on the fourth surface and connected to the second internal electrode, and a second band portion extending from the second connecting portion to a part of the first surface, A first insulating layer disposed on the first connection portion, The second insulating layer is disposed on the second connection portion, The first and second connecting portions are arranged to cover the exposed surfaces of the first and second internal electrodes, respectively, and the first and second insulating layers are arranged to cover the first and second connecting portions, respectively. The average size of the main body in the first direction is T, and the average size of the main body in the second direction is W. Ti is the average size in the first direction from the first surface to the internal electrode closest to the second surface among the first and second internal electrodes, and Wi is the average size in the second direction of the first and second internal electrodes. The average size in the first direction from the first surface to the ends of the first and second connecting portions in the first direction is Tc, and the average size in the second direction of the first and second connecting portions is Wc. When the average size in the first direction from the first surface to one end of the first and second insulating layers in the first direction is defined as Ts, and the average size in the second direction of the first and second insulating layers is defined as Ws, A stacked electronic component satisfying Ti < Tc < Ts ≤ T and Wi < Wc < Ws ≤ W.

10. The laminated electronic component according to claim 9, wherein the first insulating layer is disposed between the extension line of the outer surface of the first band portion and the extension line of the second surface, and the second insulating layer is disposed between the extension line of the outer surface of the second band portion and the extension line of the second surface.

11. The stacked electronic component according to claim 9, wherein the main components of the first connection portion and the first band portion are different from each other, and the main components of the second connection portion and the second band portion are different from each other.

12. The laminated electronic component according to claim 9, wherein the first and second insulating layers include a resin.

13. The laminated electronic component according to claim 12, wherein the resin comprises one or more selected from epoxy resin, acrylic resin, ethyl cellulose, and polymer resin.

14. The first and second insulating layers are SiO ２ , TiO ２ , BaTiO ３ , BaO, Al ２ O ３ and the laminated electronic component according to claim 9, comprising one or more additives selected from ZnO.

15. The stacked electronic component according to claim 9, wherein the main body further includes an active portion in which capacitance is formed by including the plurality of dielectric layers and the first and second internal electrodes arranged alternately in a first direction, a cover portion disposed on both end faces of the active portion in the first direction, and a margin portion disposed on both sides of the active portion in the third direction.

16. The stacked electronic component according to claim 15, wherein the average size of the cover portion in the first direction is 100 μm or less, and the average size of the margin portion in the third direction is 80 μm or less.

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