Thermosetting adhesive composition, laminated film, connector, and method for manufacturing the same

Abstract

To provide thermosetting adhesive compositions with excellent adhesion between circuit components such as semiconductor chips, printed circuit boards and flexible printed circuit boards.SOLUTION: A thermosetting adhesive compositions of the present disclosure are used for bonding circuit components, and the thermosetting adhesive compositions have a storage modulus at 35°C of 700 MPa or less after heating at 130°C for 1 hour. The thermosetting adhesive composition may have a storage modulus of 4 MPa or more at 130°C after heating at 130°C for 1 hour.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a thermosetting adhesive composition, a laminated film, a connector, and a method for manufacturing the same.

Background Art

[0002] Conventionally, semiconductor devices have been manufactured through the following steps. First, a dicing process is performed with a semiconductor wafer attached to a dicing adhesive sheet, thereby separating the semiconductor wafer into individual semiconductor chips. Thereafter, a pick-up process, a die bonding process, a wire bonding process, a molding process, and the like are performed. Patent Document 1 discloses an adhesive sheet (die bond dicing sheet) having both a function of fixing a semiconductor wafer in the dicing process and a function of bonding a semiconductor chip to a substrate in the die bonding process.

Prior Art Documents

Patent Documents

[0003] [[ID=2)2]]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in recent years, with the evolution of semiconductor modules for small devices typified by smartphones, the manufacturing process of semiconductor modules has changed significantly from the conventional one. For example, the practical application of a process that does not perform a dicing process and a die bonding process has been promoted. Along with this, an adhesive composition used in the manufacturing process of semiconductor modules is also required to have different performance from the conventional one. In addition to such a situation, the present inventors have advanced the development of an adhesive composition that can achieve sufficient adhesiveness while having a small adhesive area in order to cope with the high functionality and thinning of small devices on which semiconductor chips are mounted.

[0005] One aspect of this disclosure provides a thermosetting adhesive composition that exhibits excellent adhesion between circuit components such as semiconductor chips, printed circuit boards, and flexible printed circuit boards. Another aspect of this disclosure provides an adhesive film, a connector, and a method for manufacturing the same, comprising an adhesive layer composed of this thermosetting adhesive composition. [Means for solving the problem]

[0006] A thermosetting adhesive composition relating to one aspect of this disclosure is used for bonding circuit components together, and after being heated at 130°C for 1 hour (hereinafter, sometimes simply referred to as "after heating"), the storage modulus at 35°C is 700 MPa or less.

[0007] A storage modulus of 700 MPa or less at 35°C after heating of a thermosetting adhesive composition means that the thermosetting adhesive composition is relatively soft at 35°C after heating. Because the adhesive layer composed of the thermosetting adhesive composition is relatively soft after heating, excellent adhesion can be achieved even when the object to be bonded is the leading edge of a flexible printed circuit board (hereinafter referred to as "FPC substrate"). This is presumed to be because, even if a force is applied to the leading edge of the FPC substrate after bonding in a direction that would cause the adhesive layer to peel away, the adhesive layer can deform to some extent, and the energy of the peeling is consumed by the deformation of the adhesive layer.

[0008] The above thermosetting adhesive composition may have a storage modulus of 4 MPa or more at 130°C after being heated at 130°C for 1 hour. A storage modulus of 4 MPa or more at 130°C after heating means that the thermosetting adhesive composition is relatively hard at 130°C. Because the thermosetting adhesive composition is relatively hard at 130°C after heating, wire bonding can be suitably performed on a structure including, for example, the leading edge of an FPC substrate, a circuit component to be bonded (semiconductor chip or printed circuit board), and an adhesive layer placed between them. [Effects of the Invention]

[0009] According to one aspect of this disclosure, a thermosetting adhesive composition is provided that exhibits excellent adhesion between circuit components such as semiconductor chips, printed circuit boards, and flexible printed circuit boards. According to one aspect of this disclosure, an adhesive film, a connector, and a method for manufacturing the same are provided, each comprising an adhesive layer composed of this thermosetting adhesive composition. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a schematic cross-sectional view showing one embodiment of the laminated film according to this disclosure. [Figure 2] Figure 2 is a schematic cross-sectional view showing the state of the semiconductor module manufacturing process. [Figure 3] Figure 3 is a schematic cross-sectional view showing the state of the semiconductor module manufacturing process. [Figure 4] Figure 4 is a schematic perspective view showing an example of a punched product according to this disclosure. [Figure 5] Figure 5 is a cross-sectional view along the VV line shown in Figure 4. [Figure 6] Figure 6 is a schematic cross-sectional view showing how the adhesive piece and the cover film covering it are picked up from the base film. [Figure 7] Figure 7 is a schematic cross-sectional view showing the state of the semiconductor module manufacturing process. [Modes for carrying out the invention]

[0011] Embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components (including steps, etc.) are not essential unless otherwise specified. In the following description, the same or corresponding parts are denoted by the same reference numerals, and redundant descriptions are omitted. Also, unless otherwise specified, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings. The sizes of components in each figure are conceptual, and the dimensional ratios in the drawings are not limited to the ratios shown.

[0012] The numerical values ​​and their ranges described herein do not limit this disclosure. Numerical ranges indicated using "~" herein indicate a range that includes the numerical values ​​before and after "~" as the minimum and maximum values, respectively. In numerical ranges described in steps herein, the upper or lower limit described in one numerical range may be replaced by the upper or lower limit of another numerical range described in steps herein. In this specification, "(meth)acrylic" means "acrylic" and the corresponding "methacrylic".

[0013] <Laminated film> Figure 1 is a schematic cross-sectional view of a laminated film according to this embodiment. The laminated film 10 shown in this figure comprises a base film 1, an adhesive layer 3, and a cover film 5 in this order. The laminated film 10 has, for example, a width of 300 mm to 500 mm and a total length of 10 m to 400 m, and is manufactured, for example, by being wound into a roll. The configuration of the laminated film 10 will be described below.

[0014] [Base film] The base film 1 is not particularly limited as long as it can withstand the tension applied during the manufacturing process of the adhesive layer 3 and the manufacturing process of the semiconductor module. From the viewpoint of visibility of the adhesive layer 3 placed on it, the base film 1 is preferably transparent. As the base film 1, you can use polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, polyolefin films such as poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and other homopolymers or copolymers or mixtures thereof, as well as plastic films such as polyvinyl chloride film and polyimide film. The base film 1 may have a single-layer structure or a multi-layer structure.

[0015] The thickness of the base material film 1 may be appropriately selected within a range that does not impair workability. For example, it is 10 to 200 μm, and it may also be 20 to 100 μm or 25 to 80 μm. These thickness ranges are practically problem-free and economically effective ranges.

[0016] In order to increase the adhesion strength of the adhesive layer 3 to the base material film 1, the surface of the base material film 1 may be subjected to chemical or physical surface treatments such as corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage shock exposure, ionization radiation treatment, etc. As the base material film 1, a film with a low surface energy made of a fluororesin can also be used. Examples of such films include A-63 (release treatment agent: modified silicone type) manufactured by Toyobo Film Solutions Co., Ltd., and A-31 (release treatment agent: Pt-based silicone type) manufactured by Toyobo Film Solutions Co., Ltd.

[0017] In order to prevent the adhesion strength of the adhesive layer 3 to the base material film 1 from becoming excessively high, a release layer composed of a release agent such as a silicone-based release agent, a fluorine-based release agent, or a long-chain alkyl acrylate-based release agent may be formed on the surface of the base material film 1.

[0018] The adhesion strength between the base material film 1 and the adhesive layer 3 is, for example, 0.5 N / m or more. When this adhesion strength is 0.5 N / m or more, it is easy to prevent the adhesive layer 3 from inadvertently peeling off from the base material film 1 during the process of manufacturing the laminated film 10. Note that the adhesion strength of the adhesive layer 3 to the base material film 1 means the 90° peel strength. Specifically, it means the peel strength measured when a 20-mm-wide sample with the adhesive layer 3 formed on the base material film 1 is peeled off from the base material film at an angle of 90° and a peeling speed of 50 mm / min.

[0019] [Adhesive layer] The adhesive layer 3 is used for bonding circuit components together, and is particularly suitable for bonding a printed circuit board to the leading edge of an FPC substrate, or for bonding a semiconductor chip to the leading edge of an FPC substrate. The module 50A (connector) shown in Figure 2 includes a semiconductor chip C, a printed circuit board 12 (first circuit component), an adhesive piece 3c, and an FPC substrate 15 (second circuit component). The adhesive piece 3c bonds the leading edge 15a of the printed circuit board 12 and the FPC substrate 15. The adhesive piece 3c is made of a cured product of the adhesive piece 3p (see Figure 4). The adhesive piece 3p is made by die-cutting the adhesive layer 3 shown in Figure 1 into a predetermined shape. The adhesive layer 16 bonds the printed circuit board 12 and the semiconductor chip C. The adhesive layer 16 may have the same composition as the adhesive piece 3c, or it may have a different composition.

[0020] Module 50B shown in Figure 3 is obtained by performing wire bonding on module 50A shown in Figure 2. Wire W1 electrically connects the semiconductor chip C to the printed circuit board 12, and wire W2 electrically connects the printed circuit board 12 to the FPC substrate 15. The semiconductor chip C is, for example, a sensor chip. The printed circuit board 12 is for processing signals from the semiconductor chip C. Signals from the printed circuit board 12 are transmitted to the leading edge 15a of the FPC substrate 15.

[0021] The adhesive piece 3p (adhesive layer) is composed of a thermosetting adhesive composition that satisfies the following condition 1. ·Condition 1 After being heated at 130°C for 1 hour, the storage modulus at 35°C must be 700 MPa or less.

[0022] By using a thermosetting adhesive composition that satisfies condition 1, the leading edge 15a of the FPC substrate 15 can be bonded to the circuit member to be bonded (in this embodiment, the printed circuit board 12) with high strength. The storage modulus related to condition 1 is 700 MPa or less, and may be 30 to 700 MPa, 30 to 500 MPa, or 30 to 200 MPa.

[0023] A thermosetting adhesive composition that satisfies condition 1 is relatively soft at 35°C after heating at 130°C for 1 hour. Therefore, in a state where the tip portion 15a of the FPC substrate 15 is bonded to the adhesive piece 3p (adhesive piece 3c) that has undergone a similar thermal history (see Figure 2), even if a force is applied to the tip portion 15a in a direction that would cause it to peel away from the adhesive piece 3c, the adhesive piece 3c can deform to some extent. The energy of the peeling is consumed by the deformation of the adhesive piece 3p, thereby suppressing the peeling of the tip portion 15a from the adhesive piece 3c.

[0024] To obtain a thermosetting adhesive composition that satisfies condition 1, the following methods can be considered, for example. Method 1: Increase the amount of thermoplastic resin (e.g., acrylic rubber) contained in the thermosetting adhesive composition. Method 2: Use a thermoplastic resin with a relatively low glass transition temperature (Tg). Method 3: Use a thermosetting resin with a flexible skeleton. According to the inventors' studies, methods 1 and 2 are more effective than method 3. With respect to method 1, when the thermosetting adhesive composition contains a thermoplastic resin, a thermosetting resin, and a filler, the content of the thermoplastic resin is, for example, 20 to 40 parts by mass when the total mass of the thermosetting adhesive composition is 100 parts by mass. With respect to method 2, the Tg of the thermoplastic resin is, for example, -50°C to 20°C.

[0025] The thermosetting adhesive composition constituting the adhesive piece 3p may further satisfy the following condition 2. ·Condition 2 After being heated at 130°C for 1 hour, the storage modulus at 130°C must be 4 MPa or higher.

[0026] By using a thermosetting adhesive composition that satisfies condition 2, the vibration of the adhesive piece 3c during the wire bonding process can be reduced, making wire bonding easier. The storage modulus related to condition 2 is 4 MPa or higher, as described above, and may be 10 MPa or higher or 20 MPa or higher. The upper limit of the storage modulus related to condition 2 is, for example, 10,000 MPa. The higher the storage modulus related to condition 2, the easier it tends to make wire bonding.

[0027] Furthermore, if only condition 1 is considered, and the amount of thermoplastic resin in the thermosetting adhesive composition is increased relatively so that the storage modulus related to condition 1 is 700 MPa or less, the storage modulus related to condition 2 also tends to decrease, and condition 2 tends not to be met. In order to obtain a thermosetting adhesive composition that satisfies both condition 1 and condition 2, it is conceivable to use a thermosetting resin with a relatively large number of crosslinking points in the thermosetting adhesive composition that satisfies condition 1, thereby increasing the crosslinking density after heating.

[0028] It is preferable that the thermosetting adhesive composition undergoes a certain degree of curing reaction by heating at 130°C for 1 hour. The degree to which the reaction has progressed can be quantified by differential scanning calorimetry. Specifically, the reaction rate calculated from the heat generation amounts C1 and C2 obtained from the DSC curves obtained by differential scanning calorimetry at a heating rate of 10°C / min using the following formula is, for example, 40% or more, and may be 50% or more or 60% or more. Response rate (%) = (C1 - C2) / C1 × 100 The heat generation C1 is the heat generation of the thermosetting adhesive composition (first measurement target). The heat generation C2 is the heat generation of the resin composition (second measurement target) after heating the thermosetting adhesive composition at 130°C for 1 hour. The temperature range for differential scanning calorimetry is, for example, 30°C to 300°C. The temperature range for determining the heat generation C1 and C2 from the DSC curve obtained by the measurement is 100°C to 270°C. A reaction rate of 40% or more suppresses deterioration over time after the manufacturing process, resulting in excellent reliability.

[0029] The melt viscosity of the thermosetting adhesive composition at 120°C is, for example, 3500 to 12000 Pa·s, and may be 3500 to 10000 Pa·s or 3500 to 8000 Pa·s. Having a melt viscosity within this range at 120°C allows the thermosetting adhesive composition to be placed without gaps between the tip portion 15a of the FPC substrate 15 and the component to be bonded (printed circuit board 12), even if the tip portion 15a of the FPC substrate 15 has irregularities. This enables high-strength bonding between the tip portion 15a and the printed circuit board 12.

[0030] In addition to conditions 1 and 2, the thermosetting adhesive composition also possesses properties such as not being excessively elongated. Specifically, the thermosetting adhesive composition comprises a thermoplastic resin, a thermosetting resin, a curing accelerator, and an inorganic filler, and may optionally include a photoreactive monomer and a photopolymerization initiator. The composition of the thermosetting adhesive composition will be described later.

[0031] The laminated film 10 can be manufactured, for example, as follows. First, a coating solution is prepared by dissolving the raw material resin composition of the adhesive layer 3 in a solvent such as an organic solvent to create a varnish. After applying this coating solution onto the base film 1, the solvent is removed to form the adhesive layer 3. Coating methods include knife coating, roll coating, spray coating, gravure coating, bar coating, and curtain coating. Next, a cover film 5 is bonded to the surface of the adhesive layer 3 under conditions of room temperature to 60°C. This allows the laminated film 10 to be obtained. Alternatively, the adhesive layer 3 may be formed on a wide base film, and then a cover film 5 may be bonded over it to create a laminated film, which can then be cut (slit) to a predetermined width to obtain the laminated film 10.

[0032] <Die-cut products> Figure 4 is a schematic perspective view showing a die-cut product manufactured from a laminated film 10. Figure 5 is a cross-sectional view along the VV line shown in Figure 4. The die-cut product 20 shown in these figures comprises a strip-shaped base film 1 with a width of 100 mm or less, a plurality of adhesive pieces 3p arranged on the base film 1 in the longitudinal direction (direction of arrow X shown in Figure 4), and a cover film 5p that covers the upper surface 3f of the adhesive pieces 3p and has the same shape as the adhesive pieces 3p.

[0033] The adhesive piece 3p is suitably applied to bonding a circuit component (semiconductor chip or printed circuit board) to the leading edge of an FPC substrate. The area of ​​the adhesive piece 3p in plan view is, for example, 1 to 100 mm². 2 And, 3-50mm 2 Or 5-40mm 2 This may also be the case. With the die-cut product 20, multiple adhesive pieces 3p arranged in a line on the base film 1 can be picked up sequentially (see Figure 6), and then each adhesive piece 3p can be placed in a predetermined area of ​​the circuit member, thereby enabling efficient bonding between the circuit member and the FPC member.

[0034] The punched product 20 can be obtained, for example, through the following process. (A) A step of preparing the laminated film 10. (B) A step of obtaining a plurality of adhesive pieces 3p arranged on the base film 1 so as to be aligned in the longitudinal direction of the base film 1 by die-cutting the adhesive layer 3 and cover film 5 in the laminated film 10.

[0035] <Thermosetting resin composition> The thermosetting adhesive composition constituting the adhesive layer 3 and adhesive piece 3p will now be described. The thermosetting adhesive composition includes, for example, a thermoplastic resin, a thermosetting resin, a curing accelerator, and an inorganic filler.

[0036] (thermoplastic resin) As the thermoplastic resin, a resin having thermoplastic properties, or a resin that has thermoplastic properties at least in its uncured state and forms a cross-linked structure after heating, can be used. As the thermoplastic resin, a (meth)acrylic copolymer having reactive groups (hereinafter sometimes referred to as "reactive group-containing (meth)acrylic copolymer") is preferred from the viewpoint of excellent shrinkage, heat resistance, and peelability.

[0037] When the thermoplastic resin includes a reactive group-containing (meth)acrylic copolymer, the thermosetting adhesive composition may also be in a form that does not include the thermosetting resin. That is, it may be in a form that includes a reactive group-containing (meth)acrylic copolymer, a curing accelerator, and a filler. The thermoplastic resin can be used alone or in combination of two or more types.

[0038] Examples of (meth)acrylic copolymers include acrylic glass and (meth)acrylic acid ester copolymers such as acrylic rubber, with acrylic rubber being preferred. The acrylic rubber is preferably formed by copolymerizing an acrylic acid ester as the main component with a monomer selected from (meth)acrylic acid ester and acrylonitrile.

[0039] Examples of (meth)acrylic acid esters include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, and lauryl methacrylate. As (meth)acrylic acid ester copolymers, copolymers containing butyl acrylate and acrylonitrile as copolymer components, and copolymers containing ethyl acrylate and acrylonitrile as copolymer components are preferred.

[0040] The reactive group-containing (meth)acrylic copolymer is preferably a reactive group-containing (meth)acrylic copolymer that contains a reactive group-containing (meth)acrylic monomer as a copolymer component. Such a reactive group-containing (meth)acrylic copolymer can be obtained by copolymerizing a monomer composition containing a reactive group-containing (meth)acrylic monomer and the above monomer.

[0041] From the viewpoint of improving heat resistance, epoxy groups, carboxyl groups, acryloyl groups, methacryloyl groups, hydroxyl groups, and episulfide groups are preferred as reactive groups, and among these, epoxy groups and carboxyl groups are more preferred from the viewpoint of crosslinking.

[0042] In this embodiment, the reactive group-containing (meth)acrylic copolymer is preferably an epoxy group-containing (meth)acrylic copolymer that contains an epoxy group-containing (meth)acrylic monomer as a copolymer component. In this case, examples of epoxy group-containing (meth)acrylic monomers include glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, 3,4-epoxycyclohexyl methyl acrylate, glycidyl methacrylate, 4-hydroxybutyl methacrylate glycidyl ether, and 3,4-epoxycyclohexyl methyl methacrylate. From the viewpoint of heat resistance, glycidyl acrylate and glycidyl methacrylate are preferred as the reactive group-containing (meth)acrylic monomer.

[0043] The Tg of the thermoplastic resin is, for example, -50°C to 20°C, and may also be -40°C to 10°C or -40°C to 0°C. If the Tg of the thermoplastic resin is -50°C or higher, it is easier to suppress the adhesive layer 3 from becoming excessively soft, and excellent handling and adhesion can be achieved. On the other hand, if the Tg of the thermoplastic resin is 0°C or lower, it is easier to ensure the flexibility of the adhesive layer 3, and excellent adhesive strength can be achieved. In addition, even if there are irregularities on the adherend surface, the adhesive layer 3 can easily follow the irregularities, and excellent adhesion can be achieved.

[0044] The Tg of a thermoplastic resin is the midpoint glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of a thermoplastic resin is the midpoint glass transition temperature calculated by measuring the change in heat quantity under the conditions of a heating rate of 10°C / min and a measurement temperature of -80 to 80°C, using a method compliant with JIS K7121:1987. If the thermoplastic resin is a commercially available product, the value listed in the catalog may be used.

[0045] The weight-average molecular weight of the thermoplastic resin is preferably between 100,000 and 2,000,000. A weight-average molecular weight of 100,000 or more makes it easier to ensure heat resistance. On the other hand, a weight-average molecular weight of 2,000,000 or less makes it easier to suppress the decrease in flow and adhesion. The weight-average molecular weight of the thermoplastic resin may also be between 400,000 and 2,000,000 or between 500,000 and 2,000,000. Note that the weight-average molecular weight is a polystyrene equivalent value using a calibration curve with standard polystyrene by gel permeation chromatography (GPC).

[0046] When a (meth)acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymer component, it is preferable that the thermoplastic resin content is 20 to 40 parts by mass when the total mass of the adhesive film is 100 parts by mass. When the content is within the above range, it is easier to achieve a higher level of flexibility and adhesion of the adhesive layer 3. As the (meth)acrylic copolymer having a reactive group as described above, one obtained by polymerization methods such as pearl polymerization or solution polymerization may be used. Alternatively, a commercially available product such as SG-P3 (trade name, manufactured by Nagase ChemteX Corporation) may be used.

[0047] (thermosetting resin) Any thermosetting resin that hardens with heat can be used without particular limitations. Examples of thermosetting resins include epoxy resins, acrylic resins, silicone resins, phenolic resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins. These can be used individually or in combination of two or more.

[0048] The epoxy resin is not particularly limited as long as it hardens and has heat-resistant properties. Examples of epoxy resins that can be used include difunctional epoxy resins such as bisphenol A type epoxy, novolac type epoxy resins such as phenol novolac type epoxy resins and cresol novolac type epoxy resins. Furthermore, conventionally known epoxy resins such as polyfunctional epoxy resins, glycidylamine type epoxy resins, heterocyclic epoxy resins, and alicyclic epoxy resins can also be used.

[0049] Examples of bisphenol A type epoxy resins include Epicote 807, Epicote 815, Epicote 825, Epicote 827, Epicote 828, Epicote 834, Epicote 1001, Epicote 1004, Epicote 1007, Epicote 1009 (all manufactured by Mitsubishi Chemical Corporation), DER-330, DER-301, DER-361 (all manufactured by Dow Chemical Company), YD8125, YDF8170 (all manufactured by Toto Kasei Co., Ltd.), and others. Examples of phenol novolac type epoxy resins include Epicote 152, Epicote 154 (both manufactured by Mitsubishi Chemical Corporation), EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.), and DEN-438 (manufactured by Dow Chemical Company). Examples of o-cresol novolac type epoxy resins include YDCN-700-10 (manufactured by Nippon Steel Chemical & Material Co., Ltd.), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027 (all manufactured by Nippon Kayaku Co., Ltd.), YDCN701, YDCN702, YDCN703, YDCN704 (all manufactured by Toto Kasei Co., Ltd.), and N-500P-10 (manufactured by DIC Corporation). Examples of polyfunctional epoxy resins include Epon 1031S, 1032H60 (both manufactured by Mitsubishi Chemical Corporation), Araldite 0163 (manufactured by BASF Japan), and Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-421, EX-411, and EX-321 (all manufactured by Nagase ChemteX Corporation). Examples of amine-type epoxy resins include Epicote 604 (manufactured by Mitsubishi Chemical Corporation), YH-434 (manufactured by Toto Kasei Co., Ltd.), TETRAD-X, TETRAD-C (both manufactured by Mitsubishi Gas Chemical Company, Inc.), and ELM-120 (manufactured by Sumitomo Chemical Co., Ltd.). Examples of heterocyclic epoxy resins include Araldite PT810 (manufactured by BASF Japan), ERL4234, ERL4299, ERL4221, and ERL4206 (all manufactured by Union Carbide). These epoxy resins can be used individually or in combination of two or more.

[0050] It is preferable to use an epoxy resin that has a low functional group equivalent and is polyfunctional. By using an epoxy resin, the storage modulus at 130°C after heat treatment of the adhesive film is improved, and the wire bonding performance is excellent. Specifically, HP-4710 (manufactured by DIC Corporation), Epon 1031S, and 1032H60 (all manufactured by Mitsubishi Chemical Corporation) are examples.

[0051] As the epoxy resin curing agent, which is part of the thermosetting resin component, commonly used known resins can be used. Specifically, examples include amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenols having two or more phenolic hydroxyl groups in one molecule such as bisphenol A, bisphenol F, and bisphenol S, and phenol resins such as phenol novolac resin, bisphenol A novolac resin, and cresol novolac resin. As the epoxy resin curing agent, phenol resins such as phenol novolac resin, bisphenol A novolac resin, and cresol novolac resin are particularly preferred from the viewpoint of having excellent resistance to electrolytic corrosion when hydrated. The epoxy curing agent may be used in combination with the epoxy resin or on its own.

[0052] Among the phenolic resin curing agents listed above, it is preferable to use Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH4170 (all manufactured by DIC Corporation, product names), H-1 (manufactured by Meiwa Kasei Co., Ltd., product name), Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65, Milex XL, Milex XLC, Milex XLC-LL, Milex RN, Milex RS, and Milex VR (all manufactured by Mitsubishi Chemical Corporation, product names).

[0053] The content of the thermosetting resin in the thermosetting adhesive composition is, for example, 20 to 60 parts by mass, or 20 to 50 parts by mass, per 100 parts by mass of the thermosetting adhesive composition. When the content of the thermosetting resin is within the above range, shrinkage associated with the thermosetting of the adhesive layer 3 can be suppressed, and excellent adhesion after thermosetting can be easily achieved.

[0054] (Curing accelerator) Examples of curing accelerators include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazides, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, and 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylborate. These can be used individually or in combination of two or more.

[0055] When a thermosetting adhesive composition contains a (meth)acrylic copolymer having epoxy groups, it is preferable to contain a curing accelerator that promotes the curing of the epoxy groups contained in the (meth)acrylic copolymer. Examples of curing accelerators that promote the curing of epoxy groups include phenolic curing agents, acid anhydride curing agents, amine curing agents, imidazole curing agents, imidazoline curing agents, triazine curing agents, and phosphine curing agents. Among these, imidazole curing agents are preferred because they can be expected to shorten the process time and improve workability from the viewpoint of rapid curing, heat resistance, and release properties. These compounds can be used individually or in combination of two or more.

[0056] The content of the curing accelerator in the thermosetting adhesive composition is, for example, 0.01 to 1.0 parts by mass per 100 parts by mass of the thermosetting adhesive composition, and may also be 0.02 to 0.8 parts by mass or 0.03 to 0.5 parts by mass. When the content of the curing accelerator is within the above range, it tends to be possible to sufficiently suppress the decrease in storage stability while improving the curability of the adhesive layer 3.

[0057] (Inorganic filler) The thermosetting adhesive composition may contain an inorganic filler. Examples of inorganic fillers include metallic fillers such as silver powder, gold powder, and copper powder, and non-metallic inorganic fillers such as silica, alumina, boron nitride, titania, glass, iron oxide, and ceramics. The inorganic filler can be selected according to the desired function.

[0058] The inorganic filler described above may have organic groups on its surface. Modification of the inorganic filler's surface with organic groups improves its dispersibility in organic solvents when preparing the varnish for forming the adhesive layer 3. In addition, it suppresses shrinkage associated with the thermal curing of the adhesive layer 3, while also facilitating the achievement of both a high elastic modulus and excellent release properties for the adhesive layer 3. An inorganic filler having organic groups on its surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) with the inorganic filler and stirring at a temperature of 30°C or higher. The modification of the inorganic filler's surface with organic groups can be confirmed by UV measurement, IR measurement, XPS measurement, etc.

[0059] [ka] In formula (B-1), X represents an organic group selected from the group consisting of a phenyl group, a glycidoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, a vinyl group, an isocyanate group, and a methacryloxy group; s represents 0 or an integer from 1 to 10; and R11, R12, and R13 each independently represent an alkyl group having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, isopropyl, and isobutyl groups. From the viewpoint of readily available materials, methyl, ethyl, and pentyl alkyl groups are preferred for the C1-C10 alkyl group. From the viewpoint of heat resistance, amino, glycidoxy, mercapto, and isocyanate groups are preferred for X, and glycidoxy and mercapto groups are more preferred. In formula (B-1), s is preferably 0-5, and more preferably 0-4, from the viewpoint of suppressing film fluidity at high temperatures and improving heat resistance.

[0060] Examples of silane coupling agents include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxy Examples include propylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-(1,3-dimethylbutylidene)-3-(triethoxysilyl)-1-propanamine, N,N'-bis(3-(trimethoxysilyl)propyl)ethylenediamine, polyoxyethylenepropyltrialkoxysilane, and polyethoxydimethylsiloxane. Among these, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatetopropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane are preferred, and trimethoxyphenylsilane, 3-glycidoxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane are more preferred. The silane coupling agent can be used alone or in combination of two or more.

[0061] The amount of the coupling agent described above is, for example, 0 to 10 parts by mass per 100 parts by mass of the thermosetting adhesive composition, from the viewpoint of balancing heat resistance and storage stability, and may also be 0.1 to 5 parts by mass. From the viewpoint of storage stability, the upper limit may be 3 parts by mass.

[0062] The inorganic filler content is, for example, 30 to 50 parts by mass, or 35 to 45 parts by mass, per 100 parts by mass of the thermosetting adhesive composition. The inorganic filler content in the thermosetting adhesive composition is, for example, 450 parts by mass or less, or 400 parts by mass or less, or 350 parts by mass or less, per 100 parts by mass of the thermoplastic resin. There is no particular lower limit to the inorganic filler content, but for example, it is 10 parts by mass or more, or 50 parts by mass or more, per 100 parts by mass of the thermoplastic resin. By setting the inorganic filler content within the above range, shrinkage associated with thermosetting can be suppressed, and it is easier to achieve both high melt viscosity and excellent release properties of the adhesive layer 3.

[0063] (Organic filler) The thermosetting adhesive composition may contain an organic filler. Examples of organic fillers include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, and polyimide fine particles. The content of the organic filler is, for example, 450 parts by mass or less per 100 parts by mass of thermoplastic resin, and may be 400 parts by mass or less or 350 parts by mass or less. There is no particular lower limit to the content of the organic filler, but for example, it is 10 parts by mass or more per 100 parts by mass of thermoplastic resin.

[0064] (Organic solvents) The thermosetting adhesive composition may be diluted with an organic solvent as needed. The organic solvent is not particularly limited, but can be determined by considering its volatility during film formation based on its boiling point. Specifically, solvents with relatively low boiling points such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene are preferred from the viewpoint of preventing the film from hardening too quickly during film formation. Furthermore, for purposes such as improving film formation, it is preferable to use solvents with relatively high boiling points such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone. These solvents can be used individually or in combination of two or more.

[0065] The thickness of the adhesive layer 3 can be appropriately selected within a range that does not impair workability, for example, it may be 1 to 200 μm, 5 to 150 μm, or 10 to 150 μm. A thickness of 1 μm or more in the adhesive layer 3 makes it easier to ensure sufficient adhesion, while a thickness of 200 μm or less makes it easier to prevent the thermosetting adhesive composition constituting the adhesive layer 3 from protruding from the base film 1 or cover film 5.

[0066] [Cover film] The cover film 5 only needs to be easily peelable from the adhesive layer 3. As the cover film 5, you can use polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, or other homopolymers or copolymers or mixtures thereof, as well as plastic films such as polyvinyl chloride film and polyimide film. The cover film 5 may have a single-layer structure or a multi-layer structure. In the case of a multi-layer structure, it may be an adhesive film, and specifically, a dicing adhesive film (manufactured by Maxell Corporation) is preferred. The adhesive film may have an adhesive layer and a base layer. In this case, the adhesive layer may be configured to be in contact with the adhesive layer 3. As the adhesive layer, a photocurable adhesive layer or a pressure-sensitive adhesive layer can be used, and as the base layer, the aforementioned plastic film can be used.

[0067] The adhesion force between the adhesive layer 3 and the cover film 5 is, for example, 70 N / m or less, but may also be 50 N / m or less, or 20 N / m or less. In particular, when the adhesive layer 3 is made of a thermosetting resin composition, it is preferable that the adhesion force of the cover film 5 to the adhesive layer 3 is within the above range after heat treatment at 90°C for 1 second. With this adhesion force of 70 N / m or less, after the adhesive layer 3 covered with the cover film 5 is temporarily pressed onto the adherend (e.g., a substrate) at 90°C for 0.5 seconds, the cover film 5 can be easily peeled off the semi-cured adhesive layer 3 with adhesive tape or the like. Note that the adhesion force of the cover film 5 to the adhesive layer 3 refers to the 90° peel strength, and specifically refers to the peel strength measured when a sample is prepared in which a cover film of the same width is placed on an adhesive layer of the same composition as the adhesive layer 3 with a width of 20 mm, and this cover film is peeled off from the adhesive layer at a 90° angle and a peeling speed of 50 mm / min. The adhesion strength may be the value after light irradiation if the cover film 5 is an adhesive film having a light-curing adhesive layer.

[0068] The thickness of the cover film 5 can be appropriately selected within a range that does not impair workability, for example, 10 to 200 μm, or 10 to 180 μm or 15 to 140 μm. These thickness ranges are practically acceptable and economically effective.

[0069] <Manufacturing method for semiconductor modules> A method for manufacturing the module 50B (connector) shown in Figure 3 using the die-cut product 20 will be described. Figure 6 is a schematic cross-sectional view showing how the adhesive piece 3p and the cover film 5p covering it are picked up from the base film 1. With a certain tension applied to the die-cut product 20, the die-cut product 20 is moved in the direction of the arrow shown in Figure 6 while the surface of the die-cut product 20 on the base film 1 side is in contact with the wedge-shaped member 60. As a result, the front of the adhesive piece 3p and the cover film 5p are lifted away from the base film 1, as shown in the figure. In this state, for example, the adhesive piece 3p and the cover film 5p are picked up by a pickup device 65 having suction force.

[0070] Next, the adhesive piece 3p, covered with the cover film 5p, is placed on the surface 12a of the printed circuit board 12 (see Figure 7). While in this state, the adhesive piece 3p is temporarily pressed against the printed circuit board 12. Temporary pressing can be performed, for example, at a temperature of 60-100°C and a pressing force of 0.1-2 MPa for 0.1-10 seconds. Temporary pressing partially hardens the adhesive piece 3p, improving its adhesion to the surface 12a. Afterwards, the cover film 5p is peeled off the adhesive piece 3p using adhesive tape or the like. This exposes the surface F1 of the adhesive piece 3p.

[0071] The bonding of the leading edge 15a of the FPC substrate 15 to the printed circuit board 12 includes the steps of pressing the leading edge 15a against an adhesive piece 3p, and then curing the adhesive piece 3p by heating. That is, first, the leading edge 15a of the FPC substrate 15 is placed on the upper surface 3f of the adhesive piece 3p, and then the leading edge 15a is pressed against the adhesive piece 3p. This results in a laminate containing the printed circuit board 12, the FPC substrate 15, and the adhesive piece 3p. The pressing can be performed, for example, at a temperature of 90 to 150°C and a pressing force of 0.1 to 3 MPa for 0.1 to 10 seconds. Next, the adhesive piece 3p is cured. The curing can be performed, for example, at a temperature of 100 to 175°C for 30 to 240 minutes. This results in the module 50A shown in Figure 2. By satisfying the above condition 1, even if a force is applied to the tip 15a in a direction that would cause the tip 15a to peel off from the adhesive piece 3c after curing, the adhesive piece 3c will deform to some extent, thereby suppressing the peeling of the tip 15a from the adhesive piece 3c. Furthermore, considering the heat resistance of the components constituting module 50A, the temperature conditions for the pressing and curing processes may be set to approximately 120-140°C, and the processing time to approximately 30-90 minutes. From this perspective, the heating conditions in conditions 1 and 2 above are set to 130°C for 1 hour. Lowering the temperature at which module 50A is heated has the advantage of broadening the range of material choices.

[0072] By performing wire bonding on module 50A, module 50B shown in Figure 3 is obtained. The adhesive piece 3p satisfying condition 2 above reduces the movement of the adhesive piece 3c during the wire bonding process, facilitating wire bonding connections. Subsequently, the semiconductor module is completed through processes such as protecting the wires W1 and W2 of module 50B with resin material and heat treatment to promote the curing reaction of the adhesive piece 3c.

[0073] Although embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments. For example, in the above embodiments, an example was given in which adhesive pieces 3p made of an adhesive composition are prepared in advance by die-cutting, but an adhesive layer may also be formed by preparing a coating liquid containing an adhesive composition and coating it onto the surface of the printed circuit board 12. [Examples]

[0074] The present disclosure will be described below based on examples. This disclosure is not limited to the following examples.

[0075] The following materials were prepared to prepare the adhesive varnishes for the examples and comparative examples. <Epoxy resin (thermosetting resin)> • YDF-8170C (Product name, manufactured by Nippon Steel Chemical & Material Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent: 160) EXA-830CRP (product name), manufactured by DIC Corporation, bisphenol F type epoxy resin, epoxy equivalent: 160) • N-500P-10 (Product name, manufactured by DIC Corporation, cresol novolac type epoxy resin, epoxy equivalent 204) • Epiclon HP-4710 (product name, manufactured by DIC Corporation, naphthalene-type tetrafunctional epoxy resin, epoxy equivalent: 170) <Phenolic resin (thermosetting resin)> • PSM-4326 (Product name, manufactured by Gun-ei Chemical Industry Co., Ltd., phenolic resin, functional group equivalent 105) • MEH-7800M (product name, manufactured by Meiwa Chemical Co., Ltd., phenol novolac type phenolic resin, hydroxyl group equivalent: 167-180 g / eq) <Thermoplastic resin> • SG-P3 (product name, manufactured by Nagase ChemteX Corporation, glycidyl group-containing acrylic rubber, molecular weight: 800,000, Tg: 12℃) • SG-708-6 (Product name, manufactured by Nagase ChemteX Corporation, carboxyl group-containing acrylic rubber, molecular weight: 700,000, Tg: 4℃) • SG280 TEA (product name, manufactured by Nagase ChemteX Corporation, carboxyl group-containing acrylic rubber, molecular weight: 900,000, Tg: -29℃) • WS023 (Product name, manufactured by Nagase ChemteX Corporation, hydroxyl group-containing acrylic rubber, molecular weight: 500,000, Tg: -10℃) <Filler> • SC-2050-HLG (Product name, manufactured by Admatex Co., Ltd., surface treatment filler) • R972 (product name, manufactured by Nippon Aerosil Co., Ltd., silica particles) <Coupling agent> • A-189 (Product name, manufactured by Momentive Performance Materials Japan LLC, γ-mercaptopropyltrimethoxysilane, silane coupling agent) • Z-6119 (product name, manufactured by Dow Toray Corporation, 3-ureidopropyltriethoxysilane, silane coupling agent) <Curing accelerator> • Curesol 2PZ-CN (product name, manufactured by Shikoku Chemicals Co., Ltd., 1-cyanoethyl-2-phenylimidazole) (Product name, manufactured by Shikoku Chemicals Co., Ltd., imidazole compound) • Curazol 2PZ (product name, manufactured by Shikoku Chemicals Co., Ltd., 2-phenylimidazole) <Solvent> Cyclohexanone

[0076] (Example 1) An adhesive varnish was obtained by mixing the materials and solvent shown in Example 1 of Table 1 and then vacuum degassing. This adhesive varnish was coated onto a 38 μm thick surface-release treated PET film (base film). After a drying process, a 25 μm thick film-like adhesive (adhesive layer) was formed on one side of the PET film. A laminated film was obtained by attaching a dicing adhesive film (manufactured by Maxell Corporation) to the surface of the film-like adhesive.

[0077] (Examples 2-13 and Comparative Example 1) Laminated films were prepared in the same manner as in Example 1, except that adhesive varnishes with the compositions shown in Examples 2 to 13 and Comparative Example 1 in Tables 1 to 3 were used.

[0078] The following items were evaluated for the film-like adhesives in the examples and comparative examples. (Measurement of storage modulus) (1) Storage modulus after heating at 130°C for 1 hour After heating a film-like adhesive at 130°C for 1 hour, the storage modulus of the film-like adhesive was measured by the following method. Specifically, multiple layers of 25 μm thick film-like adhesive were laminated to a thickness of approximately 300 μm, and this was made into a size of 4 mm wide x 33 mm. A sample for measurement was obtained by curing it at 130°C for 1 hour. The sample was set in a dynamic viscoelastic device (product name: Rheogel E-4000, manufactured by UBM Co., Ltd.) with a chuck distance of 20 mm, and a tensile load was applied. Measurements were taken at a frequency of 10 Hz and a heating rate of 3 °C / min to measure the storage modulus at 35°C and 130°C. The results are shown in Tables 1 to 3. (2) Storage modulus before heating at 130°C for 1 hour The storage modulus of the film-like adhesive before heating at 130°C for 1 hour was also measured in the same manner as described above. The storage modulus at 130°C is shown in Tables 1 to 3.

[0079] (Measurement of melt viscosity) The melt viscosity of a film-like adhesive (before heating at 130°C for 1 hour) at 120°C was measured using the following method. Specifically, multiple layers of 25 μm thick film-like adhesive were stacked to a thickness of approximately 300 μm, and this was punched out to a size of 10 mm × 10 mm to obtain a sample for measurement. A circular aluminum plate jig with a diameter of 8 mm was set in a dynamic viscoelasticity instrument ARES (manufactured by TA instruments), and the sample was then placed on it. Subsequently, measurements were taken while the temperature was raised to 150°C at a heating rate of 5°C / min while applying a 5% strain at 35°C. The frequency was kept constant at 1 Hz, the initial load was maintained at 200 g, and the axial force was maintained at 100 g. The melt viscosity values ​​at 120°C are listed in Tables 1 to 3.

[0080] (Measurement of heat generation) The reaction rate of the film-type adhesive was measured using the following method. Specifically, 10 mg of the film-type adhesive was weighed into an aluminum pan (manufactured by Epollead Service Co., Ltd.), an aluminum lid was placed over it, and the evaluation sample was sealed inside the sample pan using a crimper. A differential scanning calorimeter (Thermo plus DSC8235E, manufactured by Rigaku Corporation) was used to measure the DSC under a nitrogen atmosphere at a heating rate of 10°C / min and a measurement temperature range of 30 to 300°C. For the analysis of the heat generation, a partial area analysis method was used. By instructing the analysis within the temperature range of 100°C to 270°C of the DSC curve, the baseline of the analysis temperature range was specified, and the total heat generation (unit: J / g) was calculated by integrating the peak area. This was defined as the initial heat generation C1.

[0081] The film-like adhesives obtained in the examples and comparative examples (initial samples, first measurement targets) were placed in an oven set to 130°C and heat-treated for 1 hour. Using the heat-treated samples (second measurement targets), the heat generation (unit: J / g) from 100°C to 270°C was calculated using the same procedure as before the heat treatment. This was defined as the heat generation C2 after heat treatment.

[0082] The reaction rate was calculated using the following formula based on the two obtained values ​​of heat generation C1 and C2. The results are shown in Tables 1-3. Response rate (%) = (C1 - C2) / C1 × 100

[0083] (Measurement of peel strength) The peel strength of the film-like adhesive was measured using the following method. First, the laminated film was punched out to a size of 3.2 mm x 3.2 mm. After peeling the base film from the laminated film, the film-like adhesive was attached to an organic substrate and pre-pressed with a pressure of 1.0 N for 0.5 seconds on a 90°C stage. Next, the cover film was peeled off the film-like adhesive, and a 5 mm x 100 mm polyimide film (UPIREX 50S (product name), manufactured by Ube Industries, Ltd.) was attached to the film-like adhesive and pre-pressed with a force of 15 N for 1 second on a 150°C stage. After that, the film-like adhesive was cured by heating at 130°C for 1 hour to obtain the measurement sample. The peel strength was measured using a 90-degree peel tester (manufactured by Tester Sangyo Co., Ltd.) at a test speed of 50 mm / min. The results are shown in Tables 1-3.

[0084] [Table 1]

[0085] [Table 2]

[0086] [Table 3] [Explanation of Symbols]

[0087] 1...Base film, 3...Adhesive layer, 3c,3p...Adhesive pieces, 5,5p...Cover film, 10...Laminated film, 12...Printed circuit board, 15...Flexible printed circuit board, 15a...Tip, 20...Die-cut product, 50A,50B...Module (connector), C...Semiconductor chip, W1,W2...Wire.

Claims

1. A thermosetting adhesive composition used for bonding circuit components together, A thermoplastic resin consisting of a (meth)acrylic copolymer having a reactive group, Thermosetting resins containing epoxy resin and phenolic resin, Inorganic fillers, Includes, When the total mass of the thermosetting adhesive composition is 100 parts by mass, the content of the thermoplastic resin is 20 to 40 parts by mass and the content of the inorganic filler is 35 to 45 parts by mass. The thermoplastic resin has a glass transition temperature in the range of -50°C to 20°C. The thermosetting adhesive composition has a melt viscosity of 3500 to 12000 Pa·s at 120°C. The thermosetting adhesive composition is characterized in that, after being heated at 130°C for 1 hour, its storage modulus at 35°C is 700 MPa or less and its storage modulus at 130°C is 4 MPa or more.

2. The heat generation in the range of 100°C to 270°C, determined from the DSC curve obtained by differential scanning calorimetry at a heating rate of 10°C / min, is such that the reaction rate calculated by the following formula from the heat generation C2 of the second measurement target to the heat generation C1 of the first measurement target is 40% or more. Response rate (%) = (C1 - C2) / C1 × 100 The first object to be measured is the thermosetting adhesive composition, The thermosetting adhesive composition according to claim 1, wherein the second object of measurement is the resin composition after heating the thermosetting adhesive composition at 130°C for 1 hour.

3. A base film and An adhesive layer provided on the surface of the base film, Equipped with, A laminated film wherein the adhesive layer is composed of the thermosetting adhesive composition described in claim 1 or 2.

4. A step of preparing a laminate comprising a first circuit member, a second circuit member, and an adhesive layer disposed between the first and second circuit members, A step of heating the laminate at 100 to 175°C for 30 to 240 minutes, A step of wire bonding the first circuit member and the second circuit member, This includes in this order, The first circuit component is one selected from the group consisting of printed circuit boards and semiconductor chips. The second circuit component is a flexible printed circuit board. A method for manufacturing a connector, wherein the adhesive layer is composed of the thermosetting adhesive composition described in claim 1 or 2.

5. The first circuit component, The second circuit component, An adhesive layer disposed between the first and second circuit members, Equipped with, The first circuit component is one selected from the group consisting of printed circuit boards and semiconductor chips. The second circuit component is a flexible printed circuit board. A connecting body wherein the adhesive layer is composed of a cured product of the thermosetting adhesive composition described in claim 1 or 2.

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