Head component, liquid dispensing head, liquid dispensing unit, device for dispensing liquid, and method for manufacturing the head component.

Abstract

To provide a head component capable of securing bondability to other members, while securing liquid resistance.SOLUTION: In a head component for a liquid discharge head formed of an alloy containing a noble metal, when defining the outermost surface of an area in contact with liquid as a first area, and the outermost surface of an area where an adhesive is given as a second area, the ratio of the noble metal in the second area is lower than the ratio of the noble metal in the first area.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a head constituent member, a liquid ejection head, a liquid ejection unit, an apparatus for ejecting a liquid, and a method for manufacturing a head constituent member.

Background Art

[0002] In a liquid ejection head, in order to produce a complex three-dimensional structure, a plurality of components are bonded together for production. The manufacturing process of the components is diverse, and for example, an electroforming method is used to reproducibly produce a fine pattern. It is known to produce a nozzle plate, a flow path plate, a diaphragm member, etc. by electroforming.

[0003] The components (members) used in the liquid ejection head have portions that come into contact with a liquid (for example, ink), and thus it is required to enhance the ink resistance. It is also required to enhance the ink resistance so as to be compatible with various types of inks. In the prior art, it has been proposed to use a noble metal or an alloy containing a noble metal in order to enhance the ink resistance.

[0004] Patent Document 1 discloses a nozzle plate made of an electroformed alloy containing palladium and nickel, provided with holes penetrating in the thickness direction, and the ratio of palladium to nickel in the electroformed alloy being 45:55 to 95:5. The object of Patent Document 1 is to optimize the ratio of palladium to nickel in a nozzle plate manufactured by electroforming using an alloy containing palladium and nickel, while ensuring corrosion resistance against nickel elution and further improving mechanical properties such as tensile strength.

[0005] Patent Document 2 discloses a metal member that is an alloy containing at least a platinum group metal, and the ratio of the platinum group metal on the outermost surface is higher than the ratio of the platinum group metal inside. According to Patent Document 2, it is said that the adhesion to a surface treatment film (adhesive film) and the corrosion resistance can be improved.

Summary of the Invention

[0006] However, while Patent Document 1 specifies the palladium ratio for the nozzle plate, there was a problem in that segregation of the precious metal occurred on the alloy surface during plating, resulting in poor adhesion with the adhesive. When adhesion with the adhesive is poor, the bond state may be destroyed at these interfaces during head assembly, causing leakage. Also, if the ratio of precious metal is reduced to improve adhesion with the adhesive, the desired mechanical properties may not be obtained. Patent Document 2 can improve adhesion with the surface treatment film and corrosion resistance, but when an adhesive is applied to join with other components, the adhesion with the adhesive may be impaired.

[0007] Therefore, the present invention aims to provide a head component that ensures liquid resistance while also ensuring bonding with other components. [Means for solving the problem]

[0008] To solve the above problems, the head component of the present invention is a head component for a liquid dispensing head formed of an alloy containing a precious metal, wherein when the outermost surface of the area that comes into contact with the liquid is defined as a first region and the outermost surface of the area to which adhesive is applied is defined as a second region, the ratio of the precious metal in the second region is lower than the ratio of the precious metal in the first region. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a head component that ensures liquid resistance while also ensuring bonding with other components. [Brief explanation of the drawing]

[0010] [Figure 1] These are schematic cross-sectional views (A) and (B) of a main part showing an example of a head component according to the present invention. [Figure 2] This figure shows an example of plating current. [Figure 3]This is a schematic diagram showing an example of a resist. [Figure 4] This is a schematic plan view showing an example of the second region. [Figure 5] This is a schematic plan showing another example of the second region. [Figure 6] These are schematic cross-sectional views (A) and (B) of the main parts showing other examples of the head components according to the present invention. [Figure 7] These are schematic cross-sectional views (A) to (D) of the main parts showing other examples of the head components according to the present invention. [Figure 8] This is a cross-sectional explanatory diagram of a liquid discharge head according to one embodiment of the present invention, in a direction perpendicular to the nozzle arrangement direction (longitudinal direction of the liquid chamber). [Figure 9] This is a cross-sectional diagram illustrating the nozzle arrangement direction (short side of the liquid chamber) of the head. [Figure 10] This is a plan view illustrating the main parts of an example of a liquid dispensing device according to the present invention. [Figure 11] This is a side view illustrating the main components of the device. [Figure 12] This is a plan view illustrating the main parts of another example of the liquid dispensing unit according to the present invention. [Figure 13] This is a front view illustrating yet another example of the liquid dispensing unit according to the present invention. [Modes for carrying out the invention]

[0011] The head components, liquid discharge head, liquid discharge unit, liquid discharge device, and method for manufacturing the head components according to the present invention will be described below with reference to the drawings. It should be noted that the present invention is not limited to the embodiments shown below, and other embodiments, additions, modifications, and deletions can be made within the scope of what a person skilled in the art can conceive. Any embodiment that achieves the function and effect of the present invention is included within the scope of the present invention.

[0012] One embodiment of the head component of the present invention is a head component for a liquid ejection head formed of an alloy containing a noble metal. When the outermost surface of the region in contact with the liquid is defined as the first region and the outermost surface of the region to which the adhesive is applied is defined as the second region, the ratio of the noble metal in the second region is lower than the ratio of the noble metal in the first region.

[0013] According to the present invention, while ensuring liquid resistance such as ink resistance and water resistance, the bonding property with other members can be ensured. In the present invention, since the adhesion with the adhesive can be ensured, it is possible to suppress the destruction of the bonding state at these interfaces during head assembly and suppress the occurrence of leaks. In addition, it is possible to prevent the ratio of the noble metal from being excessively lowered in order to ensure the adhesion with the adhesive, and suppress the deterioration of the mechanical properties.

[0014] FIG. 1 is a schematic cross-sectional view for explaining an example of the head component of the present embodiment. FIG. 1(A) is a schematic cross-sectional view of a main part showing a state in which the head component 1 of this example and another member (for example, the flow path plate 102) are joined by an adhesive 160. In the opening 109, a liquid (for example, ink) flows or is stored.

[0015] As the use of the head component 1, for example, it can be used as a flow path forming member, a liquid chamber forming member, a diaphragm member, or the like.

[0016] FIG. 1(B) is a schematic cross-sectional view of a main part showing the head component 1 of this example, and shows a state in which it is not joined to other members. The broken line portion shown in FIG. 1(B) schematically shows the location where the adhesive 160 is applied.

[0017] In the head component 1 of this example, as shown in FIG. 1(B), the outermost surface of the region in contact with the liquid is defined as the first region 161, and the outermost surface of the region to which the adhesive is applied is defined as the second region 162. The outermost surface is, for example, a region from the surface to a depth of 10 nm. In addition, reference numeral 170 indicates the inside of the head component 1. The inside 170 may be referred to as a bulk or the like.

[0018] As a result of the inventors' study, in the region with a depth of about several tens of nm from the surface, the higher the ratio of the noble metal (which may be referred to as the noble metal ratio, etc.), the better the chemical resistance, but the higher the noble metal ratio, the worse the adhesion tends to be. Therefore, in the present embodiment, in the portion related to the joining with other members, the ratio of the noble metal on the outermost surface is selectively lowered, thereby improving the joining property with other members.

[0019] In the present embodiment, the ratio of the noble metal in the second region 162 is lower than the ratio of the noble metal in the first region 161. Thereby, while ensuring the chemical resistance, the adhesion to the adhesive can be ensured. By ensuring the adhesion to the adhesive, the joining property with other members can be improved.

[0020] In the present embodiment, the ratio of the noble metal in the second region 162 is selectively lowered so as not to affect the noble metal ratio inside and the noble metal ratio in the portion related to the liquid contact. Thereby, the chemical resistance can be ensured and the joining property can be ensured. A detailed example of the manufacturing method will be described later.

[0021] The ratio of the noble metal in the first region 161 is preferably 80 atom% or more. In this case, the chemical resistance can be improved. The ratio of the noble metal in the second region 162 is preferably less than 80 atom%. In this case, the adhesion to the adhesive can be improved.

[0022] More preferably, the ratio of the noble metal in the first region 161 is 80 atom% or more and the ratio of the noble metal in the second region 162 is less than 80 atom%. In this case, the chemical resistance and the adhesion to the adhesive can be achieved at a high level.

[0023] The ratio of precious metals in the first region 161 and the second region 162 can be measured using XPS (X-ray photoelectron spectroscopy). For example, the K-Alpha® manufactured by Thermo Fisher Scientific can be used as the XPS.

[0024] It is preferable that the ratio of precious metals in the first region 161 is different from the ratio of precious metals in the interior 170, and that the ratio of precious metals in the second region 162 is different from the ratio of precious metals in the interior 170. In this embodiment, there is an advantage in that the ratios of precious metals in the first region 161, the second region 162, and the interior 170 can be simultaneously controlled to target values. The ratio of precious metals in the first region 161 affects liquid resistance, and a higher ratio is preferable. The ratio of precious metals in the second region 162 affects adhesion to the adhesive, and a lower ratio is preferable. Furthermore, the ratio of precious metals in the interior 170 affects mechanical properties such as hardness, rigidity, and Young's modulus, and it is preferable to set it to a target value in the design of the liquid discharge head. For example, in the case of a diaphragm member, it affects discharge performance and frequency characteristics.

[0025] In this embodiment, it is preferable that the ratio of precious metals in the first region 161 is higher than the ratio of precious metals in the interior 170. One way to achieve this is to adjust the applied plating current. On the other hand, it is preferable that the ratio of precious metals in the second region 162 is lower than the ratio of precious metals in the interior 170. One way to achieve this is to apply a current in the reverse direction during the process of applying the plating current, as will be described later.

[0026] In this example, the head component 1 is formed from an alloy containing a precious metal. Examples of precious metals include gold, silver, and platinum group elements. Examples of platinum group elements include ruthenium, rhodium, palladium, osmium, iridium, and platinum. There may be multiple elements among them. Among these, palladium is preferred.

[0027] As for the alloy containing precious metals, a nickel-palladium alloy is preferable from the viewpoint of ease of manufacture. In this case, the head components can be easily manufactured by electroforming.

[0028] Next, an example of a manufacturing method for the head components of this embodiment will be described. The manufacturing method of the head component of this embodiment includes a plating current application step of applying a plating current to form an alloy containing a precious metal by electroforming, wherein the plating current application step is a step of applying a current with the opposite sign before the end of the current application, and when the head component for a liquid discharge head is made into a head component, the outermost surface of the area that comes into contact with the liquid is designated as the first region, and the outermost surface of the area to which adhesive is applied is designated as the second region, the ratio of the precious metal in the second region is lower than the ratio of the precious metal in the first region.

[0029] Conventional techniques have attempted to improve liquid resistance by using nickel-precious metal alloys as materials for head components. However, with conventional techniques, even if plating is performed so that the precious metal ratio in the bulk portion is around 50 atom%, segregation causes the precious metal ratio to rise to around 80-100 atom% in the region of several tens of nanometers from the surface. While a higher precious metal ratio improves liquid resistance, it also worsens adhesion to adhesives and surface treatment films.

[0030] For example, when using a nickel-palladium alloy, it is preferable that the palladium ratio be 80 atom% or higher from the viewpoint of liquid resistance. On the other hand, the adhesion between the plating film and the adhesive or surface treatment film is affected by a region of several tens of nanometers from the surface, and the lower the precious metal ratio in this region, the higher the adhesion. If the precious metal ratio in this region is 80 atom% or higher, the adhesion with the adhesive or surface treatment film deteriorates, and for example, during assembly, poor delamination between the plating film and the adhesive or surface treatment film is more likely to occur. In this embodiment, the term "plated film" refers to a portion (which may also be called a film, layer, or region) formed by applying a plating current using the electroforming method.

[0031] Conventional technology has made it difficult to selectively change the ratio of precious metals on the surface to manufacture head components, and head components that improve both liquid resistance and bonding properties have not been obtained. In this embodiment, the proportion of precious metals is selectively reduced only in the area to which the adhesive is applied. In this case, the proportion of precious metals in the interior and on the surface that comes into contact with the liquid is not affected, and liquid resistance and bonding properties can be ensured.

[0032] An example of the manufacturing method of this embodiment will be described below. The manufacturing method for the head component of this embodiment involves manufacturing the head component by electroforming, and includes a plating current application step in which a plating current is applied to form an alloy containing a precious metal, and other steps as necessary.

[0033] In the plating current application process in this embodiment, a resist for a pattern is formed on a Si substrate, for example, and then plating is performed to create a three-dimensional shape. In this embodiment, the ratio of precious metal in the second region 162 is made lower than the ratio of precious metal in the first region 161. One method for selectively adjusting the ratio of precious metal on the outermost surface is to apply a plating current while covering areas other than the selected area with a resist.

[0034] In the plating current application step of this embodiment, for example, with the plated film covered with a resist, a current in the opposite direction to the plating film is applied in the plating solution. In this case, due to the difference in dissolution potential, only the noble metal on the outermost surface can be dissolved, and the proportion of noble metal can be selectively reduced. In alloy plating, due to the difference in the dissolution potential of each metal, by applying a minute current, only a predetermined metal can be dissolved.

[0035] Let's explain the reverse current. In this embodiment, the plating current application process involves applying a current with the opposite sign before the current application is completed. Figure 2 shows an example of plating current. In the illustrated example, a positive current is applied during plating, and a negative current is applied just before the plating is complete. This allows only the precious metal in a region of about several tens of nanometers on the surface to be dissolved. Therefore, the ratio of precious metal on the surface can be adjusted.

[0036] In the plating current application process of this embodiment, only one plating bath is required, thus preventing an increase in manufacturing costs. Furthermore, the plating current application process of this embodiment requires fewer manufacturing steps, and the manufacturing steps do not increase excessively, thus enabling inexpensive production.

[0037] The manufacturing method of this embodiment involves applying a plating current to an alloy containing a precious metal, and the alloy used can be selected as appropriate. The precious metal ratio of the alloy used as a material affects not only the material cost but also the mechanical properties. Furthermore, the precious metal ratio on the surface after the plating current application process of the alloy used as a material affects the liquid resistance and bonding properties. Therefore, in this embodiment, it is preferable to consider the precious metal ratio of the alloy used as a material and the manufacturing process, taking into account the balance of material cost, mechanical properties, liquid resistance, and bonding properties.

[0038] Furthermore, to reduce the proportion of precious metal on the outermost surface in a specific area, a resist can be used, for example. An example is shown in Figure 3. Figure 3 shows an example where the first region 161 is covered with resist 180 in order to manufacture the head component shown in Figure 1(B). By applying a reverse current while covered with resist 180, the proportion of precious metal in the areas not covered by resist 180 can be reduced. This makes it possible to reduce the proportion of precious metal in the second region 162 to which adhesive is applied, for example.

[0039] The resist can be formed at any time. For example, the resist may be formed after the plating film is created. For example, in the example shown in Figure 2, after creating a plating film by applying a positive current, the alloy is removed from the plating bath to create the resist, and then it is put back into the plating bath and a current in the reverse direction is applied. In this way, the proportion of precious metals in a predetermined area can be reduced. The plating film formed by applying the current becomes the first region 161.

[0040] As a supplement, let me explain an example. In the example shown in Figure 2, a plating film is created by applying a positive current from t0 to t1. This plating film has a higher proportion of noble metals on its surface, forming, for example, the first region 161. Next, at t1, the alloy is removed from the plating bath to create a resist, for example, as shown in Figure 3. Then, the alloy is placed back into the plating bath and a current in the reverse direction is applied from t1 to t2. This reduces the proportion of noble metals in areas where the resist has not been formed, creating, for example, the second region 162. After that, the head component can be obtained by removing the resist.

[0041] In this embodiment, the ratio of precious metals in the first region 161, the second region 162, and the interior 170 can be controlled, making it possible to manufacture a head component having desired liquid resistance, bonding properties, and mechanical properties.

[0042] Furthermore, the manufacturing method of this embodiment eliminates the need for surface treatments such as etching, as performed in the conventional technology, for example, Patent Document 1, thus offering the advantage of reduced manufacturing costs. In the conventional technology, if the proportion of precious metals on the surface is high and adhesion to the film cannot be ensured, a step is required to remove the precious metals (e.g., Pd) on the outermost surface using a gas with a high etching rate before the film formation process. In this embodiment, such a step can be omitted, thereby reducing manufacturing costs.

[0043] The head component of this embodiment may be used, for example, as a component that forms a liquid chamber, or as a component that forms a liquid flow path. It may also be used as a diaphragm component. According to this embodiment, a diaphragm component having the head component of this embodiment can be provided, and for example, the diaphragm component 103 described later can be obtained. The diaphragm component of this embodiment can obtain good mechanical properties and good discharge characteristics.

[0044] The diaphragm member of this embodiment can be manufactured, for example, as follows. A resist for the diaphragm pattern is formed on a Si substrate or the like, and then plated. This process is repeated, for example, two or three times to create a three-dimensional shape. Next, the substrate is removed from the plating bath, a resist for the second region 162 is formed, and a reverse current is applied. The material then peeled off from the Si substrate becomes the diaphragm component.

[0045] Next, other embodiments of the present invention will be described. Matters similar to those described in the above embodiments will be omitted from the description. In this embodiment, the second region 162 to which the adhesive is applied has regions with different precious metal ratios. In this embodiment, the second region 162 has a high region and a low region with different precious metal ratios, the precious metal ratio in the high region is higher than the precious metal ratio in the low region, and the low region is surrounded by the high region in a plan view.

[0046] The terms "high region" and "low region" are merely for convenience; they could also be referred to as, for example, region A and region B.

[0047] Figure 4 shows a plan view illustrating an example of this embodiment. In the illustrated example, the second region 162 has a high region (reference numeral 162a) and a low region (reference numeral 162b) with different ratios of precious metals. The ratio of precious metals in the high region is higher than that in the low region, and the low region is surrounded by the high region in a plan view. In this example, the low region is made to be circular, but it is not limited to this.

[0048] Figure 5 shows a plan view illustrating another example of this embodiment. In the illustrated example, both the high and low regions are linear. Even in this case, as in the example above, the low region can be said to be surrounded by the high region.

[0049] In this way, by arranging the high and low regions, even if liquid enters the second region 162, the influence of the liquid on the low region can be prevented, thus preventing a decrease in bonding strength. Therefore, in this embodiment, it is easier to ensure bonding strength.

[0050] In this embodiment, to form high and low regions as in the example above, one method is to pattern with a resist. The resist formation method can be selected as appropriate. Alternatively, for example, a method may be used in which a current is applied to form the high region, and then a current is applied with a different resist to form the low region.

[0051] In this embodiment, an adhesion film (also referred to as a surface treatment film) may be formed in the area to which the adhesive is applied, and the adhesive may be applied on the adhesion film. By forming an adhesion film, the adhesion with the adhesive can be improved. In this embodiment, good adhesion to the adhesion film can also be obtained, ensuring bonding with other members.

[0052] Figure 6 shows a schematic diagram of the case when an adhesive film is formed. Figure 6(A) is a schematic cross-sectional view of the main part showing the state in which the head component 1 and other members (e.g., the flow channel plate 102) of this example are joined with adhesive 160. As shown in the figure, an adhesive film 171 is formed between the head component 1 and the adhesive 160. Figure 6(B) is a schematic cross-sectional view of the main part showing the head component 1 of this example, showing the state in which it is not joined to other members. The dashed lines shown in Figure 6(B) schematically indicate the areas where adhesive 160 is applied and where the adhesive film 171 is formed.

[0053] The adhesion film can be formed, for example, by known surface treatment methods. The adhesion film can be formed, for example, by applying a plating current followed by etching of the noble metal.

[0054] Next, other embodiments of the present invention will be described. Matters similar to those described in the above embodiments will be omitted from the description.

[0055] The head component of this embodiment is a head component for a liquid discharge head formed of an alloy containing a precious metal, wherein the outermost surface of the area that comes into contact with the liquid is defined as the liquid contact region, and the area that is joined with other components and on which a surface treatment film is formed is defined as the surface region, the ratio of the precious metal in the liquid contact region is the same as the ratio of the precious metal inside the head component, and the ratio of the precious metal in the surface region is lower than the ratio of the precious metal inside the head component.

[0056] In this embodiment, the ratio of precious metals in the surface region is lower than that of the interior (also referred to as the bulk or bulk portion), which improves the coverage of the surface treatment film. If the ratio of precious metals in the surface region is higher than that of the interior, areas with poor coverage of the surface treatment film will occur, and these areas will be exposed to the ink. For example, in the side portions of a three-dimensional structure, it may not be possible to adequately cover them with the surface treatment film, resulting in poor coverage of the surface treatment film.

[0057] The surface treatment film, also known as an adhesion film, is provided to ensure adhesion with other components. The surface region is the area that is joined with other components, and by providing a surface treatment film in this region, the bonding with other components can be improved. The composition of the surface treatment film can be selected as appropriate. Depending on the shape of the head components, there may be areas where the surface treatment film comes into contact with ink, so a surface treatment film with good wettability, such as a Zr-based alloy formed by sputtering, can be used.

[0058] Furthermore, in this embodiment, the ratio of precious metals in the liquid contact area is the same as the ratio of precious metals inside the head component. Therefore, the area that comes into contact with the liquid (e.g., ink) can have a high ratio of precious metals, similar to the bulk portion, and liquid contact can be ensured. In this way, in this embodiment as well, a head component can be obtained that ensures liquid resistance while also ensuring bonding with other components. Furthermore, in this embodiment as well, the advantage of reducing manufacturing costs can be obtained, similar to the above embodiment.

[0059] The proportion of precious metals within the head components (bulk portion) is preferably 80 atom% or more. In other words, the proportion of precious metals in the liquid contact area is preferably 80 atom% or more. In this case, the proportion of precious metals in the liquid contact area can be increased, improving the wetted surface properties.

[0060] Figure 7 shows a diagram illustrating this embodiment. Figure 7(A) shows the state after plating the Si substrate 181 and forming the resist 180. Figure 7(B) shows the state after applying a current in the reverse direction. The ratio of noble metals decreases in the areas where the resist 180 is not formed, and a surface region 164 is formed. Figure 7(C) shows the state after removing the resist 180 and peeling it off the Si substrate 181. Figure 7(D) shows the state after forming the surface treatment film 172.

[0061] When a reverse current is applied, the resist 180 is formed, so the ratio of precious metals in the liquid contact region 163 and the interior 170 becomes the same. In other words, the liquid contact region 163 is unaffected because it is covered with the resist, and it maintains a high ratio of precious metals, similar to the interior 170 (bulk portion).

[0062] In Figure 7(D), areas where the surface treatment film 172 has poor coverage are indicated by the symbol a. These areas are exposed to the ink and will dissolve. However, since the liquid contact area 163 has a high proportion of precious metals, similar to the interior 170 (bulk portion), wettability can be ensured. Even if defects such as pinholes occur in the surface treatment film 172, wettability is ensured by the liquid contact area 163. In addition, in Figure 7(D), other components are indicated by the symbol 102, and good bonding can be obtained by providing the surface treatment film 172 in the area (surface area 164) that joins with other components.

[0063] In Figure 7(A), it appears that the liquid contact region 163 is formed by performing an arbitrary operation on the interior 170 (bulk portion). However, in this embodiment, the liquid contact region 163 is not limited to the case where the composition of the interior 170 is changed by performing an arbitrary operation on the interior 170 (bulk portion). The liquid contact region 163 and the interior 170 may be the same. To make them the same, for example, a resist 180 as shown in Figures 7(A) and 7(b) can be formed on the region that comes into contact with the liquid, thereby preventing it from being affected by the plating current. In this case, it can be said that the interior 170 is the same as the region that comes into contact with the liquid.

[0064] Next, a liquid discharge head according to one embodiment of the present invention will be described with reference to Figures 8 and 9. Figure 8 is a cross-sectional explanatory view of the head in a direction perpendicular to the nozzle arrangement direction (liquid chamber longitudinal direction), and Figure 9 is a cross-sectional explanatory view of the head in the nozzle arrangement direction (liquid chamber short direction).

[0065] This liquid discharge head is constructed by laminating and bonding a nozzle plate 101, a flow path plate 102, and a diaphragm member 103 made of a thin film member as a wall member. It also includes a piezoelectric actuator 111 for displacing the diaphragm member 103 and a frame member 120 as a common liquid chamber member.

[0066] The nozzle plate 101, the flow path plate 102, and the vibrating plate member 103 constitute individual liquid chambers 106 through which multiple nozzles 104 for discharging liquid pass, a fluid resistance section 107 for supplying liquid to the individual liquid chambers 106, and a liquid introduction section 108 leading to the fluid resistance section 107.

[0067] Then, liquid is supplied from the common liquid chamber 110, which serves as a common flow path for the frame member 120, through the opening 109 formed in the diaphragm member 103, via the liquid introduction section 108 and the fluid resistance section 107 to the individual liquid chambers 106.

[0068] The diaphragm member 103 is a wall member that forms the wall surface of the individual liquid chambers 106 of the flow channel plate 102. This diaphragm member 103 has a three-layer structure, and the one layer on the flow channel plate 102 side forms a deformable vibrating region (diaphragm) 130 in the part corresponding to the individual liquid chambers 106.

[0069] On the opposite side of the individual liquid chambers 106 of the diaphragm member 103, a piezoelectric actuator 111 is arranged, which includes an electromechanical conversion element as an actuator means for deforming the vibration region 130 of the diaphragm member 103 and as a pressure generating means.

[0070] This piezoelectric actuator 111 has a plurality of laminated piezoelectric members 112 bonded to a base member 113 with adhesive, and grooves are machined into the piezoelectric members 112 by half-cut dicing to form a required number of columnar piezoelectric elements (piezoelectric columns) 112A, 112B at predetermined intervals in a comb-like pattern on each piezoelectric member 112.

[0071] The piezoelectric elements 112A and 112B of the piezoelectric member 112 are the same, but piezoelectric element 112A is driven by applying a drive waveform, while piezoelectric element 112B is used simply as a support without applying a drive waveform.

[0072] The piezoelectric element 112A is bonded to a protrusion 130a, which is an island-shaped thickened portion formed in the vibration region 130 of the diaphragm member 103. The piezoelectric element 112B is bonded to a protrusion 130b, which is a thickened portion of the diaphragm member 103.

[0073] This piezoelectric member 112 is constructed by alternately stacking piezoelectric layers and internal electrodes. Each internal electrode is brought out to its end face to provide an external electrode, and an FPC 115, which serves as a flexible wiring member for supplying a drive signal to the external electrode of the piezoelectric element 112A, is connected to it.

[0074] The frame member 120 is formed by injection molding of, for example, an epoxy resin or a thermoplastic resin such as polyphenylene sulfite, and has a common liquid chamber 110 into which liquid is supplied from the head tank and liquid cartridge.

[0075] In this liquid discharge head, for example, by lowering the voltage applied to the piezoelectric element 112A from the reference potential, the piezoelectric element 112A contracts, the vibration region 130 of the diaphragm member 103 is pulled, and the volume of the individual liquid chamber 106 expands, causing liquid to flow into the individual liquid chamber 106.

[0076] Subsequently, the voltage applied to the piezoelectric element 112A is increased to stretch the piezoelectric element 112A in the stacking direction, deforming the vibration region 130 of the diaphragm member 103 toward the nozzle 104 and contracting the volume of the individual liquid chamber 106. As a result, the liquid in the individual liquid chamber 106 is pressurized, and the liquid is discharged (injected) from the nozzle 104.

[0077] Then, by returning the voltage applied to the piezoelectric element 112A to the reference potential, the vibration region 130 of the diaphragm member 103 is restored to its initial position, causing the individual liquid chambers 106 to expand and generate negative pressure. At this time, liquid is filled from the common liquid chamber 110 into the individual liquid chambers 106. After the vibration of the meniscus surface of the nozzle 104 has dampened and stabilized, the operation proceeds to the next droplet discharge.

[0078] Furthermore, the method of driving this head is not limited to the example above (pull-push-shot); it is also possible to perform pull-shot, push-shot, etc., depending on the way the drive waveform is applied.

[0079] Next, an example of a liquid dispensing apparatus according to the present invention will be described with reference to Figures 10 and 11. Figure 10 is a plan view illustrating the main part of the apparatus, and Figure 11 is a side view illustrating the main part of the apparatus.

[0080] This liquid dispensing device is a serial type device, and the carriage 403 reciprocates in the main scanning direction by the main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is stretched across the left and right side plates 491A and 491B and holds the carriage 403 in a movable position. The carriage 403 is then reciprocated in the main scanning direction by the main scanning motor 405 via the timing belt 408 stretched between the drive pulley 406 and the driven pulley 407.

[0081] The carriage 403 is equipped with a liquid discharge unit 440 that integrates a liquid discharge head 404 and a head tank 441 according to the present invention. The liquid discharge head 404 of the liquid discharge unit 440 discharges liquids of various colors, such as yellow (Y), cyan (C), magenta (M), and black (K). The liquid discharge head 404 is also mounted with a nozzle row consisting of multiple nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and with the discharge direction facing downwards.

[0082] A supply mechanism 494 for supplying liquid stored outside the liquid discharge head 404 to the liquid discharge head 404 supplies the head tank 441 with liquid stored in the liquid cartridge 450.

[0083] The supply mechanism 494 consists of a cartridge holder 451, which is a filling section for mounting the liquid cartridge 450, a tube 456, a liquid delivery unit 452 including a liquid delivery pump, and the like. The liquid cartridge 450 is detachably mounted in the cartridge holder 451. Liquid is delivered from the liquid cartridge 450 to the head tank 441 via the tube 456 by the liquid delivery unit 452.

[0084] This device includes a transport mechanism 495 for transporting paper 410. The transport mechanism 495 includes a transport belt 412, which is a transport means, and a sub-scanning motor 416 for driving the transport belt 412.

[0085] The conveyor belt 412 attracts the paper 410 and transports it to a position opposite the liquid discharge head 404. This conveyor belt 412 is an endless belt and is stretched between the conveyor roller 413 and the tension roller 414. Attraction can be performed by electrostatic attraction or air suction.

[0086] Then, the conveyor belt 412 moves in a circular motion in the sub-scanning direction as the conveyor rollers 413 are rotationally driven by the sub-scanning motor 416 via the timing belt 417 and timing pulley 418.

[0087] Furthermore, a maintenance and recovery mechanism 420 is positioned on one side of the carriage 403 in the main scanning direction, to the side of the conveyor belt 412, for maintaining and recovering the liquid discharge head 404.

[0088] The maintenance and recovery mechanism 420 consists of, for example, a cap member 421 that caps the nozzle surface (the surface on which the nozzle is formed) of the liquid discharge head 404, and a wiper member 422 that wipes the nozzle surface.

[0089] The main scanning movement mechanism 493, the supply mechanism 494, the maintenance and recovery mechanism 420, and the transport mechanism 495 are mounted on a housing that includes side plates 491A, 491B, and a back plate 491C.

[0090] In this configured device, the paper 410 is fed onto the transport belt 412 and picked up, and the paper 410 is transported in the sub-scanning direction by the circumferential movement of the transport belt 412.

[0091] Therefore, by moving the carriage 403 in the main scanning direction and driving the liquid ejection head 404 in accordance with the image signal, liquid is ejected onto the stationary paper 410 to form an image.

[0092] Thus, since this device is equipped with a liquid discharge head according to the present invention, it can stably form high-resolution images.

[0093] Next, another example of the liquid dispensing unit according to the present invention will be described with reference to Figure 12. Figure 12 is a plan view illustrating the main parts of the unit.

[0094] This liquid discharge unit consists of a housing portion comprising side plates 491A, 491B and a back plate 491C, a main scanning movement mechanism 493, a carriage 403, and a liquid discharge head 404, which are components of the device that discharges the liquid.

[0095] Furthermore, a liquid dispensing unit can also be configured by further attaching, for example, the side plate 491B of this liquid dispensing unit to at least one of the aforementioned maintenance and recovery mechanism 420 and supply mechanism 494.

[0096] Next, yet another example of the liquid dispensing unit according to the present invention will be described with reference to Figure 13. Figure 13 is a front view of the unit.

[0097] This liquid discharge unit consists of a liquid discharge head 404 to which a flow path component 444 is attached, and a tube 456 connected to the flow path component 444.

[0098] The flow path component 444 is located inside the cover 442. A head tank 441 can be included instead of the flow path component 444. Furthermore, a connector 443 for electrical connection to the liquid discharge head 404 is provided on the upper part of the flow path component 444.

[0099] In this application, the discharged liquid is not particularly limited as long as it has a viscosity and surface tension that can be discharged from the head, but it is preferable that its viscosity becomes 30 mPa·s or less at room temperature and atmospheric pressure, or when heated or cooled. More specifically, it is a solution, suspension, emulsion, etc. containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a polymerizable compound, a resin, a functional material such as a surfactant, a biocompatible material such as DNA, amino acids or proteins, calcium, or an edible material such as a natural pigment. These can be used, for example, as inkjet inks, surface treatment liquids, liquids for forming components of electronic elements and light-emitting elements or electronic circuit resist patterns, and material liquids for 3D molding.

[0100] The energy source for discharging liquid includes piezoelectric actuators (multilayer piezoelectric elements and thin-film piezoelectric elements), thermal actuators using electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a diaphragm and a counter electrode.

[0101] A "liquid dispensing unit" is a liquid dispensing head with integrated functional components and mechanisms, and includes an assembly of parts related to liquid dispensing. For example, a "liquid dispensing unit" may include a combination of a liquid dispensing head with at least one of the following components: a head tank, carriage, supply mechanism, maintenance and recovery mechanism, and main scanning and moving mechanism.

[0102] Here, integration includes, for example, cases where the liquid dispensing head and functional components or mechanisms are fixed to each other by fastening, bonding, engaging, etc., or where one is held movably relative to the other. Furthermore, the liquid dispensing head and functional components or mechanisms may be configured to be detachable from each other.

[0103] For example, some liquid dispensing units have a liquid dispensing head and head tank integrated into one unit. Others have a liquid dispensing head and head tank integrated into one unit, connected to each other by tubes or similar means. In these liquid dispensing units, a unit including a filter can also be added between the head tank and the liquid dispensing head.

[0104] Additionally, some liquid dispensing units have an integrated liquid dispensing head and carriage.

[0105] Furthermore, some liquid dispensing units integrate the liquid dispensing head and the scanning mechanism by movably holding the liquid dispensing head in a guide member that constitutes part of the scanning mechanism. Others integrate the liquid dispensing head, carriage, and main scanning mechanism.

[0106] Furthermore, some liquid dispensing units integrate the liquid dispensing head, carriage, and maintenance / recovery mechanism by fixing a cap component, which is part of the maintenance / recovery mechanism, to a carriage to which the liquid dispensing head is attached.

[0107] Furthermore, some liquid discharge units have a head tank or a liquid discharge head to which flow path components are attached, to which a tube is connected, integrating the liquid discharge head and the supply mechanism. Through this tube, the liquid from the liquid storage source is supplied to the liquid discharge head.

[0108] The main scanning movement mechanism shall include the guide member alone. The supply mechanism shall also include the tube alone and the loading section alone.

[0109] "A device for dispensing liquid" includes devices that have a liquid dispensing head or liquid dispensing unit and drive the liquid dispensing head to dispense liquid. A device for dispensing liquid includes not only devices that can dispense liquid onto surfaces to which liquid can adhere, but also devices that dispense liquid into air or into liquid.

[0110] This "liquid dispensing device" may also include means for feeding, transporting, and dispensing paper onto materials to which liquid can adhere, as well as pre-treatment devices, post-treatment devices, etc.

[0111] For example, "devices that dispense liquids" include image forming machines, which dispense ink to form images on paper, and three-dimensional molding machines, which dispense molding liquid into a powder layer formed in layers to create three-dimensional objects.

[0112] Furthermore, "devices that dispense liquid" are not limited to those that visualize meaningful images such as letters or figures through the dispensed liquid. For example, devices that form patterns that do not have meaning in themselves, or devices that create three-dimensional images, are also included.

[0113] The term "materials to which liquid can adhere" above refers to materials to which liquid can adhere, at least temporarily, including materials that adhere and solidify, or materials that adhere and penetrate. Specific examples include recording media such as paper, recording paper, film, and cloth; electronic components such as electronic circuit boards and piezoelectric elements; powder layers; organ models; and inspection cells. Unless otherwise specified, it includes all materials to which liquid can adhere.

[0114] The materials referred to as "materials to which liquid can adhere" above include paper, thread, fibers, fabrics, leather, metal, plastic, glass, wood, ceramics, etc., as long as liquid can adhere to them, even temporarily.

[0115] Furthermore, "liquid dispensing devices" include devices in which the liquid dispensing head and the surface to which the liquid can adhere move relative to each other, but are not limited to these. Specific examples include serial-type devices in which the liquid dispensing head moves, and line-type devices in which the liquid dispensing head does not move.

[0116] Other examples of "devices that dispense liquids" include processing liquid coating devices that dispense processing liquid onto the surface of paper for purposes such as modifying the surface of the paper, and injection granulation devices that granulate fine particles of raw materials by spraying a compositional solution, in which raw materials are dispersed in a solution, through a nozzle.

[0117] In this application, the terms image formation, recording, printing, copying, printing, and shaping are all considered synonymous.

[0118] Examples of the present invention are as follows: <1> A head component for a liquid dispensing head, formed from an alloy containing a precious metal, When the outermost surface of the area in contact with the liquid is defined as the first region, and the outermost surface of the area to which the adhesive is applied is defined as the second region, the ratio of the precious metal in the first region is higher than the ratio of the precious metal in the second region. This is a head component characterized by the following features. <2> The proportion of the precious metal in the first region is 80 atom% or more. The proportion of the precious metal in the second region is less than 80 atom%. Characterized by <1> These are the head components described above. <3> A head component for a liquid dispensing head, formed from an alloy containing a precious metal, When the outermost surface of the area that comes into contact with the liquid is defined as the liquid contact area, and the area that is joined to other components and where a surface treatment film is formed is defined as the surface area, The ratio of the noble metal in the liquid contact region is the same as the ratio of the noble metal inside the head component. The proportion of the precious metal in the surface region is lower than the proportion of the precious metal inside the head component. This is a head component characterized by the following features. <4> The proportion of the noble metal within the head component is 80 atom% or more. Characterized by <3> These are the head components described above. <5> The aforementioned outermost surface is a region extending from the surface to a depth of 10 nm. Characterized by <1> from <4> It is a head component as described in any of the above. <6> The ratio of the precious metal in the first region is different from the ratio of the precious metal inside, and the ratio of the precious metal in the second region is different from the ratio of the precious metal inside. Characterized by <1> from <5> It is a head component as described in any of the above. <7> The second region has high and low regions with different ratios of the precious metals. The proportion of the precious metal in the high region is higher than the proportion of the precious metal in the low region. The aforementioned low region is surrounded by the aforementioned high region in a plan view. Characterized by <1> from <6> It is a head component as described in any of the above. <8> The aforementioned precious metal is palladium. The alloy containing the aforementioned precious metal is an alloy containing palladium and nickel. Characterized by <1> from <7> It is a head component as described in any of the above. <9> It is a diaphragm component. Characterized by <1> from <8> It is a head component as described in any of the above. <10> <1> from <8> Head component or <9> Having the diaphragm member described above This is a liquid dispensing head characterized by the following features. <11> <10> This is a liquid dispensing unit characterized by including the liquid dispensing head described above. <12> The liquid discharge head is integrated with at least one of the following: a head tank for storing the liquid supplied to the liquid discharge head, a carriage on which the liquid discharge head is mounted, a supply mechanism for supplying liquid to the liquid discharge head, a maintenance and recovery mechanism for maintaining and restoring the liquid discharge head, and a main scanning movement mechanism for moving the liquid discharge head in the main scanning direction. Characterized by <11> This is the liquid dispensing unit described in [reference]. <13> <10> The liquid dispensing head described above, or <11> or <12> This is a liquid dispensing device characterized by being equipped with the liquid dispensing unit described above. <14> A method for manufacturing a head component for a liquid dispensing head, The electroforming process includes a plating current application step in which a plating current is applied to form an alloy containing precious metals. The plating current application step is a step of applying a current with the opposite sign before the end of the current application, and when the head component for the liquid discharge head is defined as the first region, the outermost surface of the area that comes into contact with the liquid is defined as the second region, and the outermost surface of the area to which the adhesive is applied is defined as the second region, the ratio of the precious metal in the second region is lower than the ratio of the precious metal in the first region. This is a method for manufacturing a head component, characterized by the following features. [Explanation of Symbols]

[0119] 102 Flow channel plate 103 Diaphragm component 109 Aperture 160 Adhesives 161 First Domain 162 Second Domain 162a high area 162b low area 163 Liquid contact area 164 Surface area 170 Internal 172 Surface treatment film 180 Resist 181 Si substrate [Prior art documents] [Patent Documents]

[0120] [Patent Document 1] Japanese Patent Application Publication No. 2011-88388 [Patent Document 2] Japanese Patent Publication No. 2019-116653

Claims

1. A head component for a liquid dispensing head, formed from an alloy containing a precious metal, When the outermost surface of the area in contact with the liquid is defined as the first region, and the outermost surface of the area to which the adhesive is applied is defined as the second region, the ratio of the precious metal in the second region is lower than the ratio of the precious metal in the first region. A head component characterized by the following features.

2. The proportion of the precious metal in the first region is 80 atom% or more. The proportion of the precious metal in the second region is less than 80 atom%. The head component according to feature 1.

3. A head component for a liquid dispensing head, formed from an alloy containing a precious metal, When the outermost surface of the area that comes into contact with the liquid is defined as the liquid contact area, and the area that is joined to other components and where a surface treatment film is formed is defined as the surface area, The ratio of the noble metal in the liquid contact region is the same as the ratio of the noble metal inside the head component. The proportion of the precious metal in the surface region is lower than the proportion of the precious metal inside the head component. A head component characterized by the following features.

4. The proportion of the precious metal within the head component is 80 atom% or more. The head component according to feature 3.

5. The aforementioned outermost surface is a region extending from the surface to a depth of 10 nm. The head component according to claim 1 or 3.

6. The ratio of the precious metal in the first region is different from the ratio of the precious metal inside, and the ratio of the precious metal in the second region is different from the ratio of the precious metal inside. The head component according to feature 1.

7. The second region has high and low regions with different ratios of the precious metals. The proportion of the precious metal in the high region is higher than the proportion of the precious metal in the low region. The aforementioned low region is surrounded by the aforementioned high region in a plan view. The head component according to feature 1.

8. The aforementioned precious metal is palladium. The alloy containing the aforementioned precious metal is an alloy containing palladium and nickel. The head component according to claim 1 or 3.

9. Having the head component according to claim 1 or 3 A liquid dispensing head characterized by the following features.

10. The head component is a diaphragm member. The liquid dispensing head according to feature 9.

11. A liquid dispensing unit characterized by including the liquid dispensing head described in claim 9.

12. The liquid discharge head is integrated with at least one of the following: a head tank for storing the liquid supplied to the liquid discharge head, a carriage on which the liquid discharge head is mounted, a supply mechanism for supplying liquid to the liquid discharge head, a maintenance and recovery mechanism for maintaining and restoring the liquid discharge head, and a main scanning movement mechanism for moving the liquid discharge head in the main scanning direction. The liquid dispensing unit according to claim 11.

13. A liquid dispensing device characterized by comprising the liquid dispensing head described in claim 9.

14. A liquid dispensing device characterized by comprising the liquid dispensing unit described in Claim 11.

15. A liquid dispensing device characterized by comprising the liquid dispensing unit described in Claim 12.

16. A method for manufacturing a head component for a liquid dispensing head, The electroforming process includes a plating current application step in which a plating current is applied to form an alloy containing precious metals. The plating current application step is a step of applying a current with the opposite sign before the end of current application, and when the head component for the liquid discharge head is defined as the first region, and the outermost surface of the region to which the adhesive is applied is defined as the second region, the ratio of the noble metal in the second region is lower than the ratio of the noble metal in the first region. A method for manufacturing a head component, characterized by the above.

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