Electrostatic chuck device, and method for manufacturing an electrostatic chuck device

Abstract

To provide an electrostatic chuck device in which a gap is hardly generated between a base and an adhesive layer while making the thickness of the adhesive layer uniform.SOLUTION: An electrostatic chuck device includes a base provided with a support surface and a hole opening in the support surface, an insertion component inserted into the hole, an electrostatic chuck member that is stacked on the support surface from one side in the stacking direction, and an adhesive layer located between the electrostatic chuck member and the base in the stacking direction, and the adhesive layer includes an adhesive sheet that bonds the electrostatic chuck member and the base, and a filling portion that fills the gap between the end face of the insertion component on one side in the stacking direction and the electrostatic chuck member.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electrostatic chuck device and a method for manufacturing the electrostatic chuck device.

Background Art

[0002] In semiconductor manufacturing equipment, an electrostatic chuck device for fixing a plate-like sample such as a wafer to a chuck surface is used. Patent Document 1 discloses a member for a semiconductor manufacturing device having an electrostatic chuck and a cooling plate made of aluminum. In this device, the electrostatic chuck and the cooling plate are joined via a thermosetting sheet. [[ID=一三]]

Prior Art Documents

Patent Documents

[0003] [[ID=二三]]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By using an adhesive sheet as an adhesive layer for bonding an electrostatic chuck member and a base made of aluminum, the thickness of the adhesive layer can be made uniform. As a result, the heat conduction between the electrostatic chuck member and the base can be made closer to uniform at the bonding surface. However, the sheet-like adhesive layer is difficult to follow the unevenness on the base side. Therefore, there is a problem that a gap is generated between the adhesive layer due to a step when assembling other parts to the base. When a gap is generated between the adhesive layer and the base, there is a risk of discharge starting from the gap.

[0005] One object of the present invention is to provide an electrostatic chuck device in which the thickness of the adhesive layer is made uniform and it is difficult for a gap to occur between the base and the adhesive layer.

Means for Solving the Problems

[0006] To solve the above problems, one aspect of the present invention includes the following aspects. Two or more of the following inventions may be combined with each other.

[0007] [1] An electrostatic chuck device comprising: a support surface and a base having a hole opening to the support surface; an insertion part inserted into the hole; an electrostatic chuck member stacked on the support surface from one side in the stacking direction; and an adhesive layer located between the electrostatic chuck member and the base in the stacking direction, wherein the adhesive layer comprises an adhesive sheet that adheres the electrostatic chuck member and the base, and a filling portion that fills the gap between the end face of the insertion part on one side in the stacking direction and the electrostatic chuck member.

[0008] [2] The electrostatic chuck device according to [1], wherein the adhesive sheet is provided with through holes that enclose the openings of the holes when viewed from the stacking direction, and the filling portion is arranged inside the through holes.

[0009] [3] The electrostatic chuck device according to [1], wherein the end face of the insert component is located on the other side of the stacking direction from the support surface, the filling portion is located on one side of the end face in the stacking direction and inside the hole, and the adhesive sheet covers the filling portion from one side in the stacking direction.

[0010] [4] The electrostatic chuck device according to any one of [1] to [3], wherein the filling portion is a fluid adhesive.

[0011] [5] The electrostatic chuck device according to [4], wherein the adhesive sheet and the filling portion are polymer compounds having main chains composed of different elements from each other.

[0012] [6] An electrostatic chuck device according to any one of [1] to [5], comprising a protective resin portion that covers the outer peripheral surface of the adhesive sheet, wherein the protective resin portion is made of a material different from the constituent material of the adhesive sheet.

[0013] [7] The electrostatic chuck device according to any one of [1] to [6], wherein the insert component is a cylindrical insulator extending in the stacking direction.

[0014] [8] A method for manufacturing an electrostatic chuck device having an electrostatic chuck member and a base, comprising: an insertion step of inserting an insertion component into a hole opening in the support surface of the base; an bonding step of laminating an adhesive sheet and the electrostatic chuck member on the support surface and fixing the electrostatic chuck member and the base to each other with the adhesive sheet, wherein the bonding step includes an opening step of forming a through hole in the adhesive sheet that encompasses the opening of the hole when viewed from the lamination direction; a filling step of filling the inside of the through hole with an uncured resin; and a curing step of curing the uncured resin to form a filled portion.

[0015] [9] The method for manufacturing an electrostatic chuck device according to [8], wherein the bonding step is a step of performing the opening step after laminating the adhesive sheet onto the support surface.

[0016]

[10] The method for manufacturing an electrostatic chuck device according to [8], wherein the bonding step is a step of laminating the adhesive sheet onto the support surface after the opening step has been performed.

[0017]

[11] A method for manufacturing an electrostatic chuck device having an electrostatic chuck member and a base, comprising: an bonding step of laminating an adhesive sheet and the electrostatic chuck member on the support surface of the base and fixing the electrostatic chuck member and the base to each other with the adhesive sheet; an insertion step of inserting an insertion component into a hole opening in the support surface; and a curing step, wherein the bonding step includes an opening step of forming a through hole in the adhesive sheet that encompasses the opening of the hole when viewed from the lamination direction, and a filling step of filling the inside of the through hole with uncured resin, the insertion step is performed after the filling step, and the curing step is performed after the insertion step, to cure the uncured resin and form a filled portion.

[0018]

[12] A method for manufacturing an electrostatic chuck device having an electrostatic chuck member and a base, the method including an insertion step of inserting an insertion component into a hole opening in a support surface of the base, and an adhesion step of laminating the adhesive sheet and the electrostatic chuck member on the support surface and fixing the electrostatic chuck member and the base to each other by the adhesive sheet. In the insertion step, a recess formed by an inner peripheral surface of the hole and an end surface of the insertion component is formed. The adhesion step includes a filling step of filling an uncured resin into the recess, a lamination step of covering the resin with the adhesive sheet, and a curing step of curing the uncured resin to form a filling portion.

[0019]

[13] The insertion component is a cylindrical insulator. An object is disposed inside the insertion component before the filling step, and the object is removed after the curing step. The method for manufacturing an electrostatic chuck device according to any one of [8] to

[12] . [Effect of the Invention]

[0020] According to one aspect of the present invention, an electrostatic chuck device is provided in which the thickness of the adhesive layer is made uniform and a gap is hardly generated between the electrostatic chuck device and the base. [Brief Description of the Drawings]

[0021] [Figure 1] FIG. 1 is a schematic cross-sectional view showing an electrostatic chuck device according to the first embodiment. [Figure 2] FIG. 2 is a schematic partial cross-sectional view of the electrostatic chuck device according to the first embodiment, showing a structure in which an upper end surface of an insulator is located below a support surface. [Figure 3] FIG. 3 is a schematic partial cross-sectional view of the electrostatic chuck device according to the first embodiment, showing a structure in which an upper end surface of an insulator is located above a support surface. [Figure 4] FIG. 4 is a photographed image of a cross-section of an electrostatic chuck device of a comparative example. [Figure 5] FIG. 5 is a photographed image of a cross-section of an electrostatic chuck device of an example. [Figure 6]FIG. 6 is a flowchart of a method for manufacturing an electrostatic chuck device according to the first embodiment. [Figure 7] FIG. 7 is a schematic diagram showing the first lamination step of the first embodiment. [Figure 8] FIG. 8 is a schematic diagram showing the opening step of the first embodiment. [Figure 9] FIG. 9 is a schematic diagram showing the filling step of the first embodiment. [Figure 10] FIG. 10 is a flowchart showing the bonding step of Modification 1 that can be adopted in the first embodiment. [Figure 11] FIG. 11 is a flowchart showing a manufacturing method of Modification 2 that can be adopted in the first embodiment. [Figure 12] FIG. 12 is a schematic diagram showing the first lamination step of Modification 2 that can be adopted in the first embodiment. [Figure 13] FIG. 13 is a schematic diagram showing the opening step of Modification 2 that can be adopted in the first embodiment. [Figure 14] FIG. 14 is a schematic diagram showing the second lamination step of Modification 2 that can be adopted in the first embodiment. [Figure 15] FIG. 15 is a schematic diagram showing the filling step and the insertion step of Modification 2 that can be adopted in the first embodiment. [Figure 16] FIG. 16 is a partial cross-sectional schematic diagram of an electrostatic chuck device according to the second embodiment. [Figure 17] FIG. 17 is a flowchart of the bonding step of the electrostatic chuck device according to the second embodiment. [Figure 18] FIG. 18 is a schematic diagram showing the filling step of the second embodiment. [Figure 19] FIG. 19 is a schematic diagram showing the first lamination step of the second embodiment.

DETAILED DESCRIPTION OF THE INVENTION

[0022] [[ID=IS=46]] Hereinafter, each embodiment of the electrostatic chuck device of the present invention will be described with reference to the drawings. In all the following drawings, for the sake of clarity of the drawings, the dimensions, ratios, etc. of each component may be appropriately different and shown.

[0023] <First Embodiment> (Electrostatic chuck device) Figure 1 is a schematic cross-sectional view showing the electrostatic chuck device 1 of the first embodiment. The electrostatic chuck device 1 comprises an electrostatic chuck member 2, a base 3, an adhesive layer 55, a protective resin part 60, an insulator (insertion part) 23, and a power supply terminal 16. The electrostatic chuck member 2 and the base 3 are laminated together via the adhesive layer 55.

[0024] In this specification, the direction in which the electrostatic chuck member 2 and the base 3 are stacked is referred to as the stacking direction. Furthermore, the side on which the electrostatic chuck member 2 is positioned relative to the base 3 is referred to as one side of the stacking direction, and the opposite side is referred to as the opposite side. In the following description, the vertical direction is used as the stacking direction to describe each part of the electrostatic chuck device 1. However, the vertical direction here is used solely for the purpose of simplifying the explanation and does not limit the orientation of the electrostatic chuck device 1 when it is in use. The upper side corresponds to one side of the stacking direction, and the lower side corresponds to the other side of the stacking direction.

[0025] The electrostatic chuck member 2 includes a dielectric substrate 11 and an adsorption electrode 13 located inside the dielectric substrate 11. A mounting surface 2a for adsorbing the wafer W is provided on the upper surface of the electrostatic chuck member 2. A focus ring surrounding the wafer W may be arranged outside the mounting surface 2a of the electrostatic chuck member 2.

[0026] The dielectric substrate 11 is made of a composite sintered body that has sufficient mechanical strength and durability against corrosive gases and their plasmas. As the dielectric material constituting the dielectric substrate 11, ceramics that have mechanical strength and durability against corrosive gases and their plasmas are preferably used. Suitable ceramic materials for the dielectric substrate 11 include, for example, aluminum oxide (Al2O3) sintered bodies, aluminum nitride (AlN) sintered bodies, and aluminum oxide (Al2O3)-silicon carbide (SiC) composite sintered bodies. In particular, from the viewpoint of dielectric properties at high temperatures, high corrosion resistance, plasma resistance, and heat resistance, aluminum oxide (Al2O3)-silicon carbide (SiC) composite sintered bodies are preferred as the material constituting the dielectric substrate 11.

[0027] The dielectric substrate 11 is a circular plate in plan view. The dielectric substrate 11 has a mounting surface 2a on which the wafer W is placed, and a back surface 2b facing the opposite side of the mounting surface 2a. The mounting surface 2a may have, for example, a plurality of protrusions (not shown) formed at predetermined intervals. In this case, the mounting surface 2a supports the wafer W with the tips of the plurality of protrusions.

[0028] The adsorption electrode 13 is positioned inside the dielectric substrate 11. The adsorption electrode 13 extends in a plate shape along the mounting surface 2a of the dielectric substrate 11. When a voltage is applied to the adsorption electrode 13, it generates an electrostatic adsorption force to hold the wafer W to the mounting surface 2a of the dielectric substrate 11. A power supply terminal 16 for applying a DC voltage to the adsorption electrode 13 is connected to the adsorption electrode 13.

[0029] The adsorption electrode 13 is composed of a composite of an insulating material and a conductive material. The insulating material included in the adsorption electrode 13 is not particularly limited, but is preferably at least one selected from the group consisting of aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), yttrium(III) oxide (Y2O3), yttrium aluminum garnet (YAG), and SmAlO3. The conductive material included in the adsorption electrode 13 is preferably at least one selected from the group consisting of molybdenum carbide (Mo2C), molybdenum (Mo), tungsten carbide (WC), tungsten (W), tantalum carbide (TaC), tantalum (Ta), silicon carbide (SiC), carbon black, carbon nanotubes, and carbon nanofibers.

[0030] The base 3 supports the electrostatic chuck member 2 from below. The base 3 is provided with an upward-facing support surface 3a and a downward-facing bottom surface 3b. The support surface 3a faces the back surface 2b of the dielectric substrate 11 in the vertical direction via an adhesive layer 55. The base 3 supports the electrostatic chuck member 2 on the support surface 3a.

[0031] A flow path 3f for circulating refrigerant is provided inside the base 3. The refrigerant flowing through the flow path 3f may be water, He gas, N2 gas, etc. The flow path 3f extends along the support surface 3a. The refrigerant in the flow path 3f cools the entire base 3 and also cools the electrostatic chuck member 2 via the support surface 3a.

[0032] The base 3 is a disc-shaped metal member in plan view. The material constituting the base 3 is not particularly limited as long as it is a metal or composite material containing these metals that has excellent thermal conductivity, electrical conductivity, and workability. Suitable materials for the base 3 include alloys of aluminum (Al), copper (Cu), stainless steel (SUS), and titanium (Ti). From the viewpoint of thermal conductivity, electrical conductivity, and workability, an aluminum alloy is preferred for the material constituting the base 3. At least the surface of the base 3 exposed to the plasma is preferably anodized or coated with a polyimide resin. It is even more preferable that the entire surface of the base 3 is anodized or coated with a resin. By applying anodized or resin coating to the base 3, the plasma resistance of the base 3 is improved and abnormal discharge is prevented. Therefore, the plasma resistance stability of the base 3 is improved, and surface scratches on the base 3 can also be prevented. The body of the base 3 also functions as an internal electrode for plasma generation. The frame of base 3 is connected to an external high-frequency power supply 22 via a matching circuit (not shown).

[0033] A hole 17 is provided in the base 3. The hole 17 extends along the vertical direction. The hole 17 penetrates the base 3 in the vertical direction and opens into the support surface 3a and the lower surface 3b of the base 3, respectively. The hole 17 is, for example, circular in plan view. An insulator 23 is inserted into the hole 17. In this embodiment, the hole 17 penetrates the base 3 in the vertical direction, but the hole 17 does not necessarily have to penetrate the base 3, as long as it opens into at least the support surface 3a and an insulator 23 is inserted inside.

[0034] The insulator 23 is inserted into the hole 17 and assembled to the base 3. In other words, the insulator 23 functions as an insertable component that is inserted into the hole 17. The insulator 23 is cylindrical and extends in the vertical direction (stacking direction). The power supply terminal 16 is located inside the insulator 23. The outer surface of the insulator 23 is joined to the inner surface of the hole 17 using bonding means such as adhesive. The insulator 23 insulates the metal base 3 from the power supply terminal 16.

[0035] The insulator 23 is formed from, for example, ceramic material. That is, the insulator 23 is composed of an insulating material. This allows the insulator 23 to suppress the gas inlet hole from becoming the starting point of abnormal discharge. The insulator 23 has resistance to plasma. As the ceramic material constituting the insulator 23, one or more ceramics selected from aluminum nitride (AlN), aluminum oxide (Al2O3), silicon nitride (Si3N4), zirconium oxide (ZrO2), sialon, boron nitride (BN), and silicon carbide (SiC) can be used.

[0036] The upper end face (hereinafter referred to as the upper end face 23a) of the insulator 23 (one side in the stacking direction) is positioned on approximately the same plane as the support surface 3a of the base 3. However, the upper end face 23a may be misaligned vertically with respect to the support surface 3a due to dimensional errors of the insulator 23 and the base 3, as well as assembly errors. The upper end face 23a may be located above the support surface 3a (one side in the stacking direction) or below the support surface 3a (the other side in the stacking direction).

[0037] The power supply terminal 16 extends downward from the adsorption electrode 13. The power supply terminal 16 is connected to an external power supply 21. The power supply 21 supplies voltage to the adsorption electrode 13. The number and shape of the power supply terminal 16 are determined by the type of adsorption electrode 13, i.e., whether it is a unipolar or bipolar type.

[0038] The power supply terminal 16 passes through a first hole 17a in the dielectric substrate 11 and a second hole 17b in the adhesive layer 55. The first hole 17a is located in the portion of the dielectric substrate 11 below the adsorption electrode 13. The first hole 17a is circular when viewed from the stacking direction. The second hole 17b is connected to the first hole 17a. The second hole 17b is circular when viewed from the stacking direction. The inner circumferential surfaces of the first hole 17a and the second hole 17b are connected to the inner circumferential surface of the insulator 23 when viewed from the stacking direction. The inner diameters of the first hole 17a and the second hole 17b are approximately equal to the inner diameter of the insulator 23 and slightly larger than the outer diameter of the power supply terminal 16.

[0039] The adhesive layer 55 is located between the electrostatic chuck member 2 and the base 3 in the stacking direction (vertical direction). The thickness of the adhesive layer 55 is, for example, 20 μm to 300 μm, more preferably 30 μm to 200 μm. The adhesive layer 55 adheres to the back surface 2b of the electrostatic chuck member 2 and the support surface 3a of the base 3. In this way, the adhesive layer 55 fixes the electrostatic chuck member 2 and the base 3 to each other. A heater for heating the electrostatic chuck member 2 may be placed between the adhesive layer 55 and the electrostatic chuck member 2, or between the adhesive layer 55 and the base 3.

[0040] Figure 2 is a schematic partial cross-sectional view of the electrostatic chuck device 1 of this embodiment. The adhesive layer 55 comprises an adhesive sheet 51 and a filler portion 52. The adhesive sheet 51 and the filler portion 52 are heat-resistant and insulating. The adhesive sheet 51 is made of an adhesive resin in the form of a sheet or film of uniform thickness. On the other hand, the filler portion 52 is made of an adhesive resin that is fluid in its uncured state. After curing, the filler portion 52 has elasticity equivalent to that of the adhesive sheet 51.

[0041] The adhesive sheet 51 preferably has heat resistance in a temperature range of -20°C to 150°C. The adhesive sheet 51 in this embodiment is a polymer alloy material obtained by mixing a plastic resin and an epoxy-based thermosetting resin. The adhesive sheet 51 in this embodiment is hardened by applying heat after being sandwiched between the electrostatic chuck member 2 and the base 3. The storage modulus of the adhesive sheet 51 after hardening is preferably 3000 MPa or more at -70°C and 0.1 MPa or more at 150°C.

[0042] The adhesive sheet 51 is provided with a through hole 51h. The through hole 51h penetrates the adhesive sheet 51 in the stacking direction. When viewed from the stacking direction, the through hole 51h encloses the opening of the hole portion 17 of the base 3. That is, when viewed from the stacking direction, the entire upper opening of the hole portion 17 is located inside the through hole 51h. In this embodiment, the inner diameter of the through hole 51h is equal to the inner diameter of the hole portion 17, and the inner circumferential surface of the through hole 51h is continuous with the inner circumferential surface of the hole portion 17. However, the inner diameter of the through hole 51h may be larger than the inner diameter of the hole portion 17.

[0043] The adhesive sheet 51 adheres to the electrostatic chuck member 2 and the base 3. The upper surface 51a of the adhesive sheet 51 adheres to the entire back surface 2b of the electrostatic chuck member 2, except for the portion where the through hole 51h is provided when viewed from the stacking direction. Similarly, the lower surface 51b of the adhesive sheet 51 adheres to the entire support surface 3a of the base 3, except for the portion where the through hole 51h is provided when viewed from the stacking direction. In this way, the adhesive sheet 51 fixes the electrostatic chuck member 2 and the base 3 to each other. Furthermore, by adhering to the electrostatic chuck member 2 and the base 3, the adhesive sheet 51 can facilitate the smooth transfer of heat between the electrostatic chuck member 2 and the base 3.

[0044] The filler portion 52 in this embodiment is a fluid adhesive. Preferably, the filler portion 52 has heat resistance in a temperature range of -20°C to 150°C. For example, a silicone-based resin can be suitably used as the filler portion 52. In this embodiment, the filler portion 52 is a thermosetting resin. The filler portion 52 is cured by applying heat after being filled into the target portion. The storage modulus of the cured filler portion 52 is preferably 100 MPa or more at -70°C and 0.1 MPa or more at 150°C. To match the thermal conductivity of the adhesive sheet 51, fillers such as aluminum nitride, aluminum oxide, silicon carbide, boron nitride, and boron carbide can be added as appropriate to adjust the properties.

[0045] The filling portion 52 is located inside the through-hole 51h of the adhesive sheet 51, between the back surface 2b of the electrostatic chuck member 2 and the upper end surface 23a of the insulator 23. In this embodiment, the upper end surface 23a of the insulator 23 is located below the support surface 3a of the base 3. Therefore, by inserting the insulator 23 into the hole 17, a recess is formed by the inner circumferential surface of the hole 17 and the upper end surface 23a of the insulator 23. A portion of the filling portion 52 penetrates into this recess. In other words, a portion of the filling portion 52 in this embodiment is located inside the hole 17.

[0046] Figure 3 is a schematic partial cross-sectional view of the electrostatic chuck device 1A when the upper end surface 23a of the insulator 23 is located above the support surface 3a of the base 3. In this case, the upper end of the insulator 23 is positioned inside the through hole 51h. The filling portion 52 is also positioned inside the through hole 51h of the adhesive sheet 51, between the back surface 2b of the electrostatic chuck member 2 and the upper end surface 23a of the insulator 23.

[0047] In this embodiment, the filling portion 52 is fluid while uncured. Therefore, regardless of the positional relationship in the stacking direction between the upper end surface 23a of the insulator 23 and the support surface 3a, the filling portion 52 fills the space between the back surface 2b of the electrostatic chuck member 2 and the upper end surface 23a of the insulator 23 without any gaps. After curing, the filling portion 52 is provided with a second hole 17b through which the power supply terminal 16 passes.

[0048] In this embodiment, the filling portion 52 adheres closely to the adhesive sheet 51 on its outer circumferential surface, adheres closely to the back surface 2b of the electrostatic chuck member 2 on its upper surface 52a, and adheres closely to the support surface 3a of the base 3 on its lower surface 52b. As a result, the filling portion 52 can smoothly transfer heat between the electrostatic chuck member 2, the base 3, and the insulator 23.

[0049] The filling portion 52 in this embodiment is a fluid adhesive. Therefore, the filling portion 52 adheres to the adhesive sheet 51, the back surface 2b of the electrostatic chuck member 2, and the support surface 3a of the base 3. According to this embodiment, even if each part expands or contracts due to temperature changes, the filling portion 52 can maintain close contact with the electrostatic chuck member 2 and the insulator 23, making it difficult for them to separate, and allowing heat to be transferred between each part. Furthermore, because the filling portion 52 is an adhesive, the insulator 23 can be fixed to the base 3 and the electrostatic chuck member 2. This prevents the insulator 23 from detaching from the base 3.

[0050] The adhesive layer 55 of this embodiment has an adhesive sheet 51. According to this embodiment, the adhesive sheet 51, which is a sheet of uniform thickness, makes it possible to uniformly transfer heat between the electrostatic chuck member 2 and the base 3. With the electrostatic chuck device 1 of this embodiment, it is easy to uniformly control the in-plane temperature distribution of the wafer W mounted on the mounting surface 2a of the electrostatic chuck member 2.

[0051] In this embodiment, an insulator 23 is inserted as an insertable component into the hole 17 of the base 3. The upper end surface 23a of the insulator 23 is likely to be misaligned in the stacking direction with respect to the support surface 3a of the base 3, and a step is likely to occur at the boundary between the insulator 23 and the base 3 on the upper end side of the base 3. For this reason, if the upper end surface 23a of the insulator 23 is covered with an adhesive sheet 51, the adhesive sheet 51 may not follow the step shape, and a gap may be created between the adhesive layer 55 and the base 3, the insulator 23, or the electrostatic chuck member 2. The gap created between the adhesive layer and the base 3, the insulator 23, or the electrostatic chuck member 2 can become a discharge starting point.

[0052] According to this embodiment, the filling portion 52 is filled into the gap between the upper end surface 23a of the insulator 23 and the electrostatic chuck member 2. This prevents gaps from being formed in the adhesive layer 55 that could serve as discharge initiation points, thereby improving the reliability of the electrostatic chuck device 1.

[0053] In this embodiment, the adhesive sheet 51 is provided with through holes 51h. Therefore, even if the insulator 23 protrudes upward from the support surface 3a of the base 3, the adhesive sheet 51 will not ride up onto the insulator. That is, whether the upper end surface 23a of the insulator 23 is located above or below the support surface 3a, the gap for filling the filling portion 52 can be limited to the upper side of the insulator 23. Therefore, the gap can be reliably filled by the filling portion 52, and the reliability of the electrostatic chuck device 1 can be increased.

[0054] Figure 4 is a cross-sectional photograph of a comparative example in which the electrostatic chuck device of this embodiment is not provided with the filling section 52 described above. Figure 5 is a cross-sectional photograph of an embodiment of the electrostatic chuck device of this embodiment.

[0055] In the comparative example electrostatic chuck device shown in Figure 4, the upper end surface 23a of the insulator 23 is positioned below the support surface 3a of the base 3, creating a step at the boundary between the upper end surface 23a and the support surface 3a. The adhesive sheet 51 is curved along this step, and consequently, a gap G is created between the adhesive sheet 51 and the electrostatic chuck member 2 on the upper side of the adhesive sheet 51.

[0056] In the electrostatic chuck device of the embodiment shown in Figure 5, a step is provided at the boundary between the upper end surface 23a and the support surface 3a, similar to the comparative example. However, in the electrostatic chuck device of the embodiment, the filling portion 52 is placed between the insulator 23 and the electrostatic chuck member 2, thereby suppressing the formation of gaps in the adhesive layer 55. By comparing the embodiment with the comparative example, it was confirmed that the adhesive layer 55 having the filling portion 52 can suppress the formation of gaps.

[0057] The main component of the adhesive sheet 51 in this embodiment is, for example, an epoxy resin. The main component of the filling portion 52 in this embodiment is a silicone resin. Therefore, the adhesive sheet 51 and the filling portion 52 are polymer compounds having main chains composed of different elements. By using polymer compounds with main chains composed of different elements in the adhesive sheet 51 and the filling portion 52, the dielectric strength of the insulator 23 is improved, and the generation of impurities such as carbon due to erosion by plasma, etc., can be suppressed even during prolonged use. Furthermore, in the cleaning process (S50), the adhesive sheet 51 can be protected from the solvent used for cleaning and the vapors of the solvent.

[0058] As shown in Figure 1, the protective resin portion 60 is provided on the outer circumferential surface of the electrostatic chuck device 1. The protective resin portion 60 is provided around the entire circumference of the outer circumferential surface of the electrostatic chuck member 2. In addition to the outer circumferential surface of the adhesive sheet 51, the protective resin portion 60 covers the lower end of the outer circumferential surface of the electrostatic chuck member 2 and the upper end of the base 3. The protective resin portion 60 is made of a different material from the constituent material of the adhesive sheet 51.

[0059] The protective resin portion 60 preferably has heat resistance in a temperature range of -20°C to 150°C, and for example, a silicone-based resin is preferred. The protective resin portion 60 may be made of the same material as the filling portion 52.

[0060] In the manufacturing method of the electrostatic chuck device 1, a cleaning step is performed as a finishing step to remove particles and other debris generated by machining. The cleaning step is performed using a solvent, but depending on the type of solvent, there is a risk of swelling of the adhesive sheet 51. The electrostatic chuck device 1 of this embodiment is equipped with a protective resin part 60 that covers the outer surface of the adhesive sheet 51. Therefore, by selecting a highly solvent-resistant material made of a different material from the adhesive sheet 51 as the material for the protective resin part 60, the adhesive sheet 51 can be protected from solvents by the protective resin part 60.

[0061] Although not shown in this embodiment, the electrostatic chuck member 2, base 3, and adhesive layer 55 may be provided with multiple gas introduction holes that penetrate them vertically. The gas introduction holes open to the mounting surface 2a. The gas introduction holes are connected to a gas supply device and supply a cooling gas such as helium (He) to the wafer W placed on the electrostatic chuck member 2. A cylindrical insulator is inserted into the portion of the gas introduction hole that penetrates the base 3. The inside of the insulator functions as a gas passage path. The configuration of the through hole 51h in the adhesive sheet 51 above the insulator 23 and the filling portion 52 described above can be similarly applied to the insulator placed in the gas introduction hole.

[0062] Furthermore, although not shown in this embodiment, the electrostatic chuck device 1 may have a pressure pin. The pressure pin extends upward from the mounting surface 2a and is provided to lift the wafer W. When the electrostatic chuck device 1 has a pressure pin, the electrostatic chuck member 2, base 3, and adhesive layer 55 are provided with pin insertion holes into which the pressure pin is inserted. A cylindrical insulator is inserted into the portion of the pin insertion hole that penetrates the base 3. The configuration of the through hole 51h in the adhesive sheet 51 above the insulator 23 and the filling portion 52 described above can be similarly applied to the insulator placed in the pin insertion hole.

[0063] (Manufacturing method for electrostatic chucks) Figure 6 is a flowchart showing the manufacturing method of the electrostatic chuck device 1 according to this embodiment. The manufacturing method of the electrostatic chuck device 1 of this embodiment mainly comprises a preliminary step S10, an insertion step S20, an adhesive step S30, a protective resin part molding step S40, and a cleaning step S50.

[0064] Preliminary step S10 is a process of preparing the electrostatic chuck member 2, the base 3, and the insulator 23. The electrostatic chuck member 2 is manufactured by forming a pair of ceramic plates by sintering, overlapping them with a conductive coating in between, and hot-pressing them. Also in preliminary step S10, a hole 17 is provided in the electrostatic chuck member 2 by machining. In preliminary step S10, a packing material 23s (see Figure 7) is packed inside the insulator 23.

[0065] Insertion step S20 is the step of inserting the insulator 23 into the hole 17 of the base 3. In this embodiment, adhesive is applied to the outer surface of the insulator 23 in advance. This adhesive is then cured after the insulator 23 is inserted into the hole 17.

[0066] The bonding process S30 is a process of laminating an adhesive sheet 51 and an electrostatic chuck member 2 onto the support surface 3a and fixing the electrostatic chuck member 2 and the base 3 to each other with the adhesive sheet 51. The bonding process S30 includes a first lamination process S31, an opening process S32, a filling process S33, a second lamination process S34, a curing process S35, and a post-processing process S36.

[0067] Figure 7 is a schematic diagram showing the first lamination process S31 of this embodiment. As shown in Figure 7, the first lamination step S31 is the step of laminating adhesive sheets 51 onto the support surface 3a of the base 3. The outer shape of the adhesive sheets 51 is pre-cut to match the shape of the support surface 3a of the base 3. In the first lamination step S31, the worker laminates the adhesive sheets 51 while removing air between the adhesive sheets 51 and the support surface 3a so as not to create any gaps between the adhesive sheets 51 and the support surface 3a.

[0068] Figure 8 is a schematic diagram showing the opening process S32 of this embodiment. As shown in Figure 8, the opening process S32 is a process in which a through hole 51h is formed in the adhesive sheet 51 mounted on the support surface 3a, encompassing the opening of the hole portion 17 when viewed from the stacking direction. In the opening process S32, the worker cuts a circular portion of the adhesive sheet 51 using a tool with a cutting blade at its tip, such as a cutter. By applying the cutting blade along the edge of the hole portion 17 of the base 3, the worker can form a through hole 51h in the adhesive sheet 51 that is substantially the same shape as the hole portion 17 when viewed from the stacking direction.

[0069] Figure 9 is a schematic diagram showing the filling process S33 of this embodiment. As shown in Figure 9, the filling step S33 is a step of filling the inside of the through hole 51h with uncured resin 52p. The filling step S33 is performed, for example, by a dispenser capable of dispensing uncured resin 52p. In the filling step S33, the uncured resin 52p is filled from the upper opening of the hole 17. At the time of the filling step S33, a packing material 23s is placed inside the insulator 23. This prevents the uncured resin 52p from flowing into the inside of the insulator 23.

[0070] In the filling step S33, it is preferable that the amount of uncured resin 52p filled is slightly excessive relative to the volume of the hole 17. In this case, when filling is complete, the uncured resin 52p will slightly overflow from the upper edge of the opening of the hole 17. This reliably prevents voids from remaining in the hole 17 after the next step, the second lamination step S34.

[0071] The second lamination step S34 is a step in which the electrostatic chuck member 2 is laminated onto the adhesive sheet 51. In the second lamination step S34, the worker laminates the electrostatic chuck member 2 in such a way that no gap is created between the adhesive sheet 51 and the electrostatic chuck member 2.

[0072] The curing step S35 is a process for curing the adhesive sheet 51 and the uncured resin 52p. In this embodiment, the adhesive sheet 51 and the resin 52p are thermosetting resins. Therefore, in the curing step S35, the electrostatic chuck device 1 is heated. The uncured resin 52p hardens in the curing step S35, forming the filling portion 52. After going through the curing step S35, the electrostatic chuck member 2 and the base 3 are fixed to each other.

[0073] The post-processing step S36 is a finishing step of the bonding step S30, and mainly involves forming holes for the power supply terminals 16. As shown in Figure 2, in the post-processing step S36, the worker removes the packing material 23s from inside the insulator 23 and further forms a second hole 17b in the filling portion 52 and a first hole 17a in the dielectric substrate 11. The bonding step S30 is completed by performing the post-processing step S36.

[0074] In this embodiment, bonding step S30 is a step in which an adhesive sheet 51 is laminated onto the support surface 3a of the base 3, and then an opening step S32 is performed. In bonding step S30 of this embodiment, through holes 51h can be formed in the adhesive sheet 51 to match the holes 17 of the base 3. Therefore, compared to the case in which an adhesive sheet 51 with pre-formed through holes 51h is laminated onto the support surface 3a, there is no need to align the through holes 51h. Furthermore, according to this embodiment, there is no need to form the through holes 51h larger to account for assembly errors during lamination. Therefore, the size of the through holes 51h can be minimized, and a large contact area can be secured between the adhesive sheet 51 and the electrostatic chuck member 2 and the base 3. As a result, the uniformity of heat transfer between the electrostatic chuck member 2 and the base 3 can be improved.

[0075] In the manufacturing method of the electrostatic chuck device 1 of this embodiment shown in Figure 6, the protective resin part molding step S40 is a step in which the protective resin part 60 (see Figure 1) is formed. When a thermosetting resin is used for the protective resin part 60, in the protective resin part molding step S40, the worker applies the uncured resin along the outer surface of the electrostatic chuck device 1 and then increases the temperature to cure the resin. The curing of the protective resin part 60 may also be performed simultaneously with the curing of the adhesive sheet 51 and the filling part 52.

[0076] The cleaning step S50 is a process of cleaning the electrostatic chuck member 2 using a solvent. By going through the cleaning step S50, particles adhering to the surface of the electrostatic chuck device 1 can be removed. The electrostatic chuck device 1 can be manufactured by going through the above steps.

[0077] In the manufacturing method of the electrostatic chuck member 2 of this embodiment, the packing material 23s is placed inside the insulator 23 before the filling process, and the packing material 23s is removed after the hardening process. This prevents the filling portion 52 from flowing into the inside of the insulator 23 and prevents a portion of the filling portion from remaining inside the insulator 23.

[0078] (Modified Method 1 of Manufacturing an Electrostatic Chuck Device) Figure 10 is a flowchart of the bonding process S30A of Modification 1 that can be adopted in this embodiment. As shown in Figure 10, the bonding process S30A of this modification is a process in which a first lamination process S31A is performed in which an adhesive sheet 51 is laminated on the support surface 3a after the opening process S32A is performed. According to this modification, in the opening process, multiple through holes 51h can be formed simultaneously using a mold. This makes it possible to perform the opening process S32A easily and quickly. Even when the bonding process S30A of this modification is adopted, an electrostatic chuck device 1 with the same structure as the embodiment described above can be manufactured.

[0079] (Modified Method 2 of Manufacturing an Electrostatic Chuck Device) Figure 11 is a flowchart of the manufacturing method of a modified example 2 of the electrostatic chuck device 1 that can be used in this embodiment. The manufacturing method for the electrostatic chuck device 1 of this modified example mainly comprises a preliminary step S10B, an adhesive step S30B, an insertion step S20B, a curing step S21B, a protective resin part molding step S40, and a cleaning step S50. Even when employing the manufacturing method of this modified example, an electrostatic chuck device 1 having the same structure as the embodiment described above can be manufactured. Furthermore, components of the same embodiment as described above are denoted by the same reference numerals, and their descriptions are omitted.

[0080] The preliminary step S10B is the process of preparing the electrostatic chuck member 2, the base 3, and the insulator 23. In the preliminary step S10B of this modified example, the step of filling the inside of the insulator 23 with packing material is not necessarily required.

[0081] The bonding process S30B is a process of laminating the adhesive sheet 51 and the electrostatic chuck member 2 onto the support surface 3a and fixing the electrostatic chuck member 2 and the base 3 to each other with the adhesive sheet 51. In this modified example, the bonding process S30B includes a first lamination process S31B, an opening process S32B, a second lamination process S33B, and a filling process S34B.

[0082] Figure 12 is a schematic diagram showing the first lamination process S31B of this modified example. As shown in Figure 12, the first lamination step S31B is the step of laminating adhesive sheets 51 onto the support surface 3a of the base 3. In the first lamination step S31B, the worker laminates the adhesive sheets 51 while removing air between the adhesive sheets 51 and the support surface 3a so as not to create any gaps between the adhesive sheets 51 and the support surface 3a. In this modified example, the bonding step S30B is performed before inserting the insulators 23 into the holes 17 provided in the base 3. In the first lamination step S31B, the adhesive sheets 51 cover the entire opening of the holes 17 from above.

[0083] Figure 13 is a schematic diagram showing the opening process S32B of this modified example. As shown in Figure 13, the opening step S32B is a step in which a through hole 51h is formed in the adhesive sheet 51 mounted on the support surface 3a, encompassing the opening of the hole portion 17 when viewed from the lamination direction. In this modified example, the opening step S32B may also be performed before the first lamination step S31B.

[0084] Figure 14 is a schematic diagram showing the second lamination process S33B of this modified example. The second lamination step S33B is a step in which the electrostatic chuck member 2 is laminated onto the adhesive sheet 51. In the second lamination step S33B, the worker laminates the electrostatic chuck member 2 so as not to create any gaps between the adhesive sheet 51 and the electrostatic chuck member 2. At this time, pressing may be performed while applying heat in order to increase the holding force between the electrostatic chuck member 2, the adhesive sheet 51 and the base 3. The temperature and pressing pressure should be applied to an extent that the desired holding force can be obtained. For example, a temperature of 70°C to 170°C and a pressure of 0.1 MPa to 2.0 MPa are preferable. However, applying too much temperature and pressure is undesirable as it will cause deterioration of the adhesive sheet 51. In the second lamination step S33B, the electrostatic chuck member 2 covers the through hole 51h of the adhesive sheet 51.

[0085] Figure 15 is a schematic diagram showing the filling process S34B and the insertion process S20B of this modified example. The filling step S34B is the process of filling the inside of the through hole 51h with uncured resin 52p. The insertion step S20B is the process of inserting the insulator 23 into the hole 17 of the base 3. In this modified example, adhesive is applied to the outer surface of the insulator 23 in advance.

[0086] The curing step S21B is performed after the insertion step S20B. The curing step S21B is a step in which the adhesive sheet 51 and the uncured resin 52p, as well as the adhesive provided around the insulator 23, are cured. In the curing step S21B, for example, the adhesive sheet 51, the resin 52p, and the adhesive are cured by heating the electrostatic chuck device 1. The uncured resin 52p is cured by the curing step S21B and the filling portion 52 is formed. After the curing step S, the resin 52p that has flowed into the inside of the insulator 23 may be removed. After the curing step S21B, the protective resin part molding step S40 and the cleaning step S55 are performed, similar to the embodiment described above, and the electrostatic chuck device 1 is completed.

[0087] According to this modified manufacturing method, by performing the insertion step S20B after the bonding step S30B, the insulator 23 can be installed without filling the inside of the insulator 23. However, even when employing this modified manufacturing method, the insulator 23 may still be filled. In this case, while it is not necessary to remove the resin 52p that has flowed into the inside of the insulator 23 after the curing step S21B, it becomes necessary to remove the filling inside the insulator 23 in a later step.

[0088] <Second Embodiment> (Electrostatic chuck device) Figure 16 is a schematic partial cross-sectional view of the electrostatic chuck device 101 of the second embodiment. The electrostatic chuck device 101 of the second embodiment differs from the first embodiment mainly in the configuration of the adhesive layer 155. Components that are the same as those in the above-described embodiment are denoted by the same reference numerals and their descriptions are omitted.

[0089] Similar to the embodiments described above, the adhesive layer 155 has an adhesive sheet 151 and a filling portion 152. The adhesive sheet 151 is made of an adhesive resin in the form of a sheet or film of uniform thickness. On the other hand, the filling portion 152 is made of an adhesive resin that is fluid in an uncured state.

[0090] In this embodiment, the upper end surface 23a of the insulator 23 is located below (on the other side in the stacking direction) the support surface 3a of the base 3. Therefore, by inserting the insulator 23 into the hole 17, a recess is formed by the inner circumferential surface of the hole 17 and the upper end surface 23a of the insulator 23. The filling portion 152 is formed inside this recess. That is, the filling portion 152 is located above (on one side in the stacking direction) the upper end surface 23a of the insulator 23 and inside the hole 17.

[0091] In this embodiment, for example, the vertical dimension of the insulator 23 is made sufficiently smaller than the vertical dimension of the base 3. This allows the upper end surface 23a of the insulator 23 to be lower than the support surface 3a, regardless of assembly errors or dimensional tolerances of each part.

[0092] The adhesive sheet 151 adheres the electrostatic chuck member 2 and the base 3. The adhesive sheet 151 covers the filling portion 152 from above (one side in the lamination direction). After curing, the adhesive sheet 151 is provided with a second hole 17b through which the power supply terminal 16 passes.

[0093] According to this embodiment, the filling portion 152 is filled into the gap between the upper end surface 23a of the insulator 23 and the electrostatic chuck member 2. More specifically, the filling portion 152 is filled into the gap between the upper end surface 23a of the insulator 23 and the lower end surface of the adhesive sheet 151. This ensures that the gap in the adhesive layer 155 is reliably filled, suppressing discharge from the adhesive layer 155 and improving the reliability of the electrostatic chuck device 101.

[0094] According to this embodiment, the gaps in the adhesive layer 155 can be filled by the filling portion 152 without providing through holes in the adhesive sheet 151. Therefore, processing of the adhesive sheet 151 is unnecessary, and the manufacturing process of the electrostatic chuck device 101 can be simplified.

[0095] (Manufacturing method for electrostatic chucks) Figure 17 is a flowchart of the bonding process S130 in the manufacturing method of the electrostatic chuck device 101 of this embodiment. Figure 18 is a schematic diagram showing the filling process S131 of this embodiment, and Figure 19 is a schematic diagram showing the first lamination process S132 of this embodiment. Similar to the first embodiment, a preliminary step and an insertion step are performed before the bonding step S130 in this embodiment. Furthermore, a protective resin molding step and a cleaning step are performed after the bonding step.

[0096] The bonding process S130 is a process of laminating an adhesive sheet 151 and an electrostatic chuck member 2 onto the support surface 3a and fixing the electrostatic chuck member 2 and the base 3 to each other with the adhesive sheet 151. The bonding process S130 includes a filling process S131, a first lamination process (lamination process) S132, a second lamination process S133, a curing process S134, and a post-processing process S135.

[0097] As shown in Figure 18, in the insertion step performed prior to the bonding step S130, a recess 101a is formed by the inner circumferential surface of the hole 17 and the upper end surface 23a of the insulator 23.

[0098] In the filling process S131, the uncured resin 152p is filled through the upper opening of the recess 101a. At the time of the filling process S131, the filler material 23s is placed inside the insulator 23. Therefore, it is possible to suppress the flow of the uncured resin 152p into the interior of the insulator 23.

[0099] In the filling step S131, it is preferable that the amount of uncured resin 152p filled is slightly excessive relative to the volume of the recess 101a. In this case, when filling is complete, the uncured resin 152p will slightly overflow from the upper edge of the opening of the recess 101a. This ensures that voids do not remain in the recess 101a after the next step, the first lamination step S132.

[0100] As shown in Figure 19, the first lamination step S132 is the step of laminating the adhesive sheet 151 onto the support surface 3a of the base 3. In this way, the resin 152p is covered with the adhesive sheet 151 in the first lamination step S132. In the first lamination step S132, the worker laminates the adhesive sheet 151 while removing the air between the adhesive sheet 151 and the support surface 3a so as not to create any gaps between the adhesive sheet 151 and the support surface 3a.

[0101] The second lamination step S133 is the step of laminating the electrostatic chuck member 2 onto the adhesive sheet 151. In the second lamination step S133, the worker laminates the electrostatic chuck member 2 in such a way that no gap is created between the adhesive sheet 151 and the electrostatic chuck member 2.

[0102] The curing step S134 is a process for curing the adhesive sheet 151 and the uncured resin 152p. The uncured resin 152p hardens in the curing step S134, forming the filled portion 152. Through the curing step S134, the electrostatic chuck member 2 and the base 3 are fixed to each other.

[0103] The post-processing step S135 is a finishing step of the bonding step S130, and mainly involves forming a hole for passing the power supply terminal 16 through. The bonding step S130 is completed by performing the post-processing step S135. In the post-processing step S135, the worker removes the packing material 23s from inside the insulator 23 and further forms a hole in the filling portion 152 and the adhesive sheet 151 for passing the power supply terminal 16 through.

[0104] Although various embodiments of the present invention have been described above, the configurations and combinations thereof in each embodiment are merely examples, and additions, omissions, substitutions, and other modifications are possible without departing from the spirit of the present invention. Furthermore, the present invention is not limited by these embodiments.

[0105] For example, in the above embodiment, the case in which the resin material constituting the filling portion is an adhesive was described. However, the filling portion does not necessarily have to have adhesive properties. Also, in the above embodiment, the case in which the adhesive sheet is thermosetting was described, but the adhesive sheet may have other configurations. In addition, in the above embodiment, the case in which the insertion component inserted into the hole in the base is an insulator was described, but the configuration of the insertion component is not limited to this embodiment. [Explanation of Symbols]

[0106] 1,1A,101...Electrostatic chuck device, 2...Electrostatic chuck member, 3...Base, 3a...Support surface, 17...Hole, 23...Insulator (insertion part), 23s...Filler, 51,151...Adhesive sheet, 51h...Through hole, 52,152...Filling part, 52p,152p...Resin, 55,155...Adhesive layer, 60...Protective resin part, 101a...Recess, G...Gap, S20...Insertion process, S30,S130,S30A...Adhesion process, S32,S32A...Opening process, S33,S131...Filling process, S35,S134...Curing process, S132...First lamination process (lamination process)

Claims

1. A base having a support surface and a hole opening into the support surface, An insertion component inserted into the aforementioned hole, An electrostatic chuck member is laminated on the support surface from one side in the lamination direction, The system comprises an adhesive layer located between the electrostatic chuck member and the base in the aforementioned stacking direction, The aforementioned adhesive layer is An adhesive sheet for bonding the electrostatic chuck member and the base, The insert component has a filling portion which fills the gap between the end face on one side in the stacking direction and the electrostatic chuck member, The adhesive sheet covers the filling portion from one side in the stacking direction. The end face of the insert component is located on the other side in the stacking direction from the support surface. The filling portion is located on one side of the end face in the stacking direction and inside the hole. The adhesive layer fills the gap without any voids. Electrostatic chuck device.

2. The adhesive sheet is provided with through holes that enclose the openings of the holes when viewed from the stacking direction, The filling portion is located inside the through hole. The electrostatic chuck device according to claim 1.

3. The filling portion is a fluid adhesive. The electrostatic chuck device according to claim 1 or 2.

4. The adhesive sheet and the filling portion are polymer compounds having main chains composed of different elements from each other. The electrostatic chuck device according to claim 1 or 2.

5. The adhesive sheet is provided with a protective resin portion that covers the outer surface, The protective resin portion is made of a material different from the constituent material of the adhesive sheet. The electrostatic chuck device according to claim 1 or 2.

6. The aforementioned insert is a cylindrical insulator extending in the stacking direction. The electrostatic chuck device according to claim 1 or 2.

7. A method for manufacturing an electrostatic chuck device having an electrostatic chuck member and a base, The insertion step involves inserting an insertion component into a hole opening in the support surface of the base, The process includes a bonding step of laminating an adhesive sheet and the electrostatic chuck member onto the support surface and fixing the electrostatic chuck member and the base to each other with the adhesive sheet, In the insertion step, the end face of the insertion component is positioned in a recessed position relative to the support surface. The bonding process described above is: The adhesive sheet is given an opening step of which through holes are formed in the adhesive sheet, which enclose the openings of the holes when viewed from the stacking direction, A filling step of filling the inside of the through hole with uncured resin, A curing step is included in which the uncured resin is cured to form a filled portion. A method for manufacturing an electrostatic chuck device.

8. The bonding step is a step in which the bonding sheet is laminated onto the support surface and then the opening step is performed. A method for manufacturing an electrostatic chuck device according to claim 7.

9. The bonding step is a step of laminating the adhesive sheet onto the support surface after the opening step has been performed. A method for manufacturing an electrostatic chuck device according to claim 7.

10. A method for manufacturing an electrostatic chuck device having an electrostatic chuck member and a base, A bonding step is performed to laminate an adhesive sheet and the electrostatic chuck member onto the support surface of the base, and to fix the electrostatic chuck member and the base to each other using the adhesive sheet. The insertion step involves inserting an insertion component into a hole opening in the support surface, It has a curing process, The bonding process described above is: The adhesive sheet is given an opening step of which through holes are formed in the adhesive sheet, which enclose the openings of the holes when viewed from the stacking direction, The process includes a filling step of filling the inside of the through hole with uncured resin, The insertion step is performed after the filling step has been completed. In the insertion step, the end face of the insertion component is positioned in a recessed position relative to the support surface. The curing step is performed after the insertion step, and the uncured resin is cured to form a filled portion. A method for manufacturing an electrostatic chuck device.

11. A method for manufacturing an electrostatic chuck device having an electrostatic chuck member and a base, The insertion step involves inserting an insertion component into a hole opening in the support surface of the base, The process includes a bonding step of laminating an adhesive sheet and the electrostatic chuck member onto the support surface, and fixing the electrostatic chuck member and the base to each other with the adhesive sheet. In the insertion step, the end face of the insertion component is positioned recessed with respect to the support surface, and a recess is formed by the inner circumferential surface of the hole and the end face of the insertion component. The bonding process described above is: A filling step of filling the interior of the recess with uncured resin, A lamination step of covering the resin with the adhesive sheet, A curing step is included in which the uncured resin is cured to form a filled portion. A method for manufacturing an electrostatic chuck device.

12. The aforementioned insert is a cylindrical insulator. Before the filling process, a filler material is placed inside the insert component. After the hardening process, the filling is removed. A method for manufacturing an electrostatic chuck device according to any one of claims 7 to 11.

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