Multilayer substrate

Abstract

In the present invention, the reference conductor layer overlapping an eleventh interlayer connection conductor among a first reference conductor layer and a second reference conductor layer is provided with a first opening overlapping a signal conductor layer when viewed in the Z-axis direction. When viewed in the Z-axis direction, the first opening is located to the negative X-axis side of the vicinity of a first reference straight line connecting a second interlayer connection conductor and a fifth interlayer connection conductor. When viewed in the Z-axis direction, the first opening is located to the positive X-axis side of the eleventh interlayer connection conductor.

Description

Technical Field

[0001] The present invention relates to a multilayer substrate provided with a signal conductor layer.

Background Art

[0002] As an invention related to a conventional multilayer substrate, for example, a transmission line described in Patent Document 1 is known. This transmission line includes a signal line, two ground conductors, and a plurality of GND vias. The signal line is located between the two ground conductors in the vertical direction. The signal line extends in the front-rear direction. The plurality of GND vias electrically connect the two ground conductors. The plurality of GND vias are located on both the left and right sides of the signal line. The plurality of GND vias are arranged along the signal line.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the transmission line described in Patent Document 1, the intervals of the plurality of GND vias are non-uniform. Therefore, the characteristic impedance generated in the signal line is also non-uniform. In this case, a propagation mode other than a desired propagation mode (for example, TEM mode) (hereinafter, an unnecessary propagation mode) occurs. As a result, the unnecessary propagation mode flows through the two ground conductors. Such an unnecessary propagation mode is radiated as noise outside the transmission line from between two GND vias having a large interval among the plurality of GND vias. As a result, noise occurs in the transmission line.

[0005] Therefore, an object of the present invention is to provide a multilayer substrate capable of suppressing the generation of noise.

Means for Solving the Problems

[0006] A multilayer substrate according to one embodiment of the present invention is A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction, A signal conductor layer provided in the laminate and having a linear shape extending in the X-axis direction perpendicular to the Z-axis direction, A first reference conductor layer is provided on the laminate, is located in the positive Z-axis direction relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction, A second reference conductor layer is provided on the laminate, is located in the negative direction of the Z-axis relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction, The first reference conductor layer and the second reference conductor layer are electrically connected, and the first interlayer connecting conductor, the second interlayer connecting conductor, and the third interlayer connecting conductor are located in the positive direction of the Y axis, perpendicular to the X-axis and Z-axis directions from the signal conductor layer, and are arranged in this order along the signal conductor layer toward the positive direction of the X axis, The first reference conductor layer and the second reference conductor layer are electrically connected, and the fourth, fifth, and sixth interlayer connecting conductors are located in the negative direction of the Y-axis relative to the signal conductor layer and are arranged in this order along the signal conductor layer toward the positive direction of the X-axis, An 11th interlayer connecting conductor is connected to the signal conductor layer, is located in the positive direction of the Z-axis relative to the signal conductor layer, and penetrates one or more of the plurality of insulating layers along the Z-axis; It is equipped with, The distance in the X-axis direction between the second interlayer connecting conductor and the third interlayer connecting conductor is longer than the distance in the X-axis direction between the first interlayer connecting conductor and the second interlayer connecting conductor. The distance in the X-axis direction between the fifth interlayer connecting conductor and the sixth interlayer connecting conductor is longer than the distance in the X-axis direction between the fourth interlayer connecting conductor and the fifth interlayer connecting conductor. The reference conductor layer in the first and second reference conductor layers that overlaps with the inter-layer connecting conductor of the 11th layer is provided with a first opening that overlaps with the signal conductor layer when viewed in the Z-axis direction. Viewed in the Z-axis direction, the first opening is located in the negative direction of the X-axis from the vicinity of the first reference line connecting the second interlayer connecting conductor and the fifth interlayer connecting conductor. Viewed in the Z-axis direction, the first opening is located in the positive X-axis direction relative to the 11th interlayer connecting conductor. [Effects of the Invention]

[0007] According to the multilayer substrate of the present invention, the generation of noise can be suppressed. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is an exploded perspective view of the multilayer substrate 10. [Figure 2] Figure 2 is a top view of the insulating layer 16c. [Figure 3] Figure 3 is a cross-sectional view of the multilayer substrate 10. [Figure 4] Figure 4 is a front view of the multilayer substrate 10 in use. [Figure 5] Figure 5 is a top view of the insulating layer 16c. [Figure 6] Figure 6 is an exploded perspective view of the multilayer substrate 10b. [Figure 7] Figure 7 is a cross-sectional view of the multilayer substrate 10b. [Figure 8] Figure 8 is a top view of the insulating layer 16c. [Figure 9] Figure 9 is a cross-sectional view of the multilayer substrate 10d. [Figure 10] Figure 10 is a cross-sectional view of the multilayer substrate 10e. [Figure 11] Figure 11 is a top view of the insulating layer 16c. [Figure 12] Figure 12 is a cross-sectional view of a 10g multilayer substrate. [Figure 13] Figure 13 is a top view of the insulating layer 16c. [Modes for carrying out the invention]

[0009] (Embodiment) [Structure of Multilayer Substrate] The structure of the multilayer substrate 10 according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of the multilayer substrate 10. FIG. 2 is a top view of the insulator layer 16c. In FIG. 2, the signal conductor layers 20 are shown superimposed. FIG. 3 is a cross-sectional view of the multilayer substrate 10. FIG. 4 is a front view of the multilayer substrate 10 during use.

[0010] In this specification, the directions are defined as follows. The stacking direction of the stacked body 12 of the multilayer substrate 10 is defined as the vertical direction. Also, the vertical direction coincides with the Z-axis direction. The upward direction is the positive direction of the Z-axis. The downward direction is the negative direction of the Z-axis. Also, the direction in which the signal conductor layer 20 of the multilayer substrate 10 extends is defined as the left-right direction. The left-right direction coincides with the X-axis direction. The right direction is the positive direction of the X-axis. The left direction is the negative direction of the X-axis. Also, when viewed in the vertical direction, the line width direction of the signal conductor layer 20 is defined as the front-back direction. The front-back direction coincides with the Y-axis direction. The front direction is the positive direction of the Y-axis. The rear direction is the negative direction of the Y-axis. The vertical direction, the front-back direction, and the left-right direction are orthogonal to each other. Note that the upward and downward directions in the vertical direction may be interchanged, the left and right directions in the left-right direction may be interchanged, or the front and rear directions in the front-back direction may be interchanged.

[0011] Hereinafter, X is a component or member of the multilayer substrate 10. In this specification, unless otherwise specified, each part of X is defined as follows. The front part of X means the first half of X. The rear part of X means the second half of X. The left part of X means the left half of X. The right part of X means the right half of X. The upper part of X means the upper half of X. The lower part of X means the lower half of X. The front end of X means the end in the forward direction of X. The rear end of X means the end in the rearward direction of X. The left end of X means the end in the leftward direction of X. The right end of X means the end in the rightward direction of X. The upper end of X means the end in the upward direction of X. The lower end of X means the end in the downward direction of X. The front end portion of X means the front end of X and its vicinity. The rear end portion of X means the rear end of X and its vicinity. The left end portion of X means the left end of X and its vicinity. The right end portion of X means the right end of X and its vicinity. The upper end portion of X means the upper end of X and its vicinity. The lower end portion of X means the lower end of X and its vicinity.

[0012] First, referring to FIG. 1, the structure of the multilayer substrate 10 will be described. The multilayer substrate 10 transmits high-frequency signals. The multilayer substrate 10 is used to electrically connect two circuits in an electronic device such as a smartphone. As shown in FIG. 1, the multilayer substrate 10 includes a laminate 12, signal conductor layers 20, a first reference conductor layer 22, a second reference conductor layer 24, signal terminals 26a, 26b, interlayer connection conductors v1 to v8, v11, v12, a plurality of interlayer connection conductors v9, and a plurality of interlayer connection conductors v10.

[0013] The laminate 12 has a plate shape. Therefore, the laminate 12 has an upper main surface and a lower main surface. The upper main surface and the lower main surface of the laminate 12 have a rectangular shape having long sides extending in the left-right direction. Therefore, the length of the laminate 12 in the left-right direction is longer than the length of the laminate 12 in the front-rear direction. The laminate 12 has flexibility.

[0014] As shown in Figure 1, the laminate 12 has a structure in which insulating layers 16a to 16c and protective layers 18a and 18b are stacked in the Z-axis direction. The protective layer 18a, insulating layers 16a to 16c, and protective layer 18b are arranged in this order from top to bottom. The insulating layers 16a to 16c have an upper main surface and a lower main surface that are aligned in the vertical direction. The material of the insulating layers 16a to 16c is a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The insulating layers 16a to 16c are fused together with adjacent layers in the vertical direction. The protective layers 18a and 18b will be described later.

[0015] High-frequency signals are transmitted through the signal conductor layer 20. The signal conductor layer 20 is provided in the laminate 12. In this embodiment, the signal conductor layer 20 is located on the upper main surface of the insulator layer 16b. The signal conductor layer 20 has a linear shape extending in the left-right direction (X-axis direction).

[0016] The first reference conductor layer 22 is provided on the laminate 12, as shown in Figure 1. The first reference conductor layer 22 is located above the signal conductor layer 20 (in the positive Z-axis direction) and overlaps with the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction). In this embodiment, the first reference conductor layer 22 is located on the upper main surface of the insulator layer 16a. The first reference conductor layer 22 covers substantially the entire upper main surface of the insulator layer 16a. A reference potential is connected to the first reference conductor layer 22. The reference potential is, for example, the ground potential.

[0017] The second reference conductor layer 24 is provided on the laminate 12, as shown in Figure 1. The second reference conductor layer 24 is located below the signal conductor layer 20 (in the negative Z-axis direction) and overlaps with the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction). In this embodiment, the second reference conductor layer 24 is located on the lower main surface of the insulator layer 16c. The second reference conductor layer 24 covers substantially the entire lower main surface of the insulator layer 16c. A reference potential is connected to the second reference conductor layer 24. The reference potential is, for example, the ground potential. The signal conductor layer 20, the first reference conductor layer 22, and the second reference conductor layer 24 have a stripline structure.

[0018] In the first reference conductor layer 22 and the second reference conductor layer 24, the reference conductor layer overlapping with the interlayer connecting conductor v11 (11th interlayer connecting conductor) is provided with a first opening Op1 that overlaps with the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction). In this embodiment, the interlayer connecting conductor v11 overlaps with the second reference conductor layer 24 and does not overlap with the first reference conductor layer 22. Therefore, the second reference conductor layer 24 is provided with a first opening Op1 that overlaps with the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction). The structure of the first opening Op1 will be described later.

[0019] The signal terminal 26a is located at the left end of the laminate 12. More specifically, the signal terminal 26a is located on the upper main surface (the main surface located in the positive direction of the Z axis) of the laminate 12. When viewed in the vertical direction, the signal terminal 26a overlaps with the left end of the signal conductor layer 20. When viewed in the vertical direction, the signal terminal 26a has a circular shape. The signal terminal 26a is an external terminal into which high-frequency signals are input and output. The signal terminal 26a does not contact the first reference conductor layer 22.

[0020] The interlayer connecting conductor v11 (11th interlayer connecting conductor) electrically connects the signal terminal 26a to the left end of the signal conductor layer 20. The interlayer connecting conductor v11 penetrates the insulator layer 16a in the vertical direction. The structure of the signal terminal 26b and the interlayer connecting conductor v12 is symmetrical to the structure of the signal terminal 26a and the interlayer connecting conductor v11, so their explanation is omitted.

[0021] As shown in Figure 1, the interlayer connecting conductor v1 (first interlayer connecting conductor), interlayer connecting conductor v2 (second interlayer connecting conductor), interlayer connecting conductor v3 (third interlayer connecting conductor), interlayer connecting conductor v7 (seventh interlayer connecting conductor), and multiple interlayer connecting conductors v9 electrically connect the first reference conductor layer 22 and the second reference conductor layer 24. As shown in Figure 2, the interlayer connecting conductor v1 (first interlayer connecting conductor), interlayer connecting conductor v2 (second interlayer connecting conductor), interlayer connecting conductor v3 (third interlayer connecting conductor), interlayer connecting conductor v7 (seventh interlayer connecting conductor), and multiple interlayer connecting conductors v9 are located in front of the signal conductor layer 20 (in the positive direction of the Y axis). The interlayer connecting conductors v7, v1 (first interlayer connecting conductor), v2 (second interlayer connecting conductor), v3 (third interlayer connecting conductor), and multiple interlayer connecting conductors v9 are arranged in this order along the signal conductor layer 20 in the rightward direction (positive direction of the X-axis).

[0022] The distance D2 in the left-right direction (X-axis direction) between interlayer connecting conductor v2 (second interlayer connecting conductor) and interlayer connecting conductor v3 (third interlayer connecting conductor) is longer than the distance D1 in the left-right direction (X-axis direction) between interlayer connecting conductor v1 (first interlayer connecting conductor) and interlayer connecting conductor v2 (second interlayer connecting conductor). The distance D4 in the left-right direction between interlayer connecting conductor v7 and interlayer connecting conductor v1 is shorter than the distance D2 in the left-right direction between interlayer connecting conductor v2 and interlayer connecting conductor v3. The distance D5 in the left-right direction between the leftmost interlayer connecting conductor v9 (v9) and interlayer connecting conductor v3 is shorter than the distance D2 in the left-right direction between interlayer connecting conductor v2 and interlayer connecting conductor v3. Also, the left-right spacing D6 between the multiple interlayer connecting conductors v9 is shorter than the left-right distance D2 between interlayer connecting conductor v2 and interlayer connecting conductor v3. In this embodiment, distances D1, D4, D5, and D6 are equal to each other.

[0023] As shown in Figure 1, the interlayer connecting conductors v4 (fourth interlayer connecting conductor), v5 (fifth interlayer connecting conductor), v6 (sixth interlayer connecting conductor), v8 (eighth interlayer connecting conductor), and multiple interlayer connecting conductors v10 electrically connect the first reference conductor layer 22 and the second reference conductor layer 24. As shown in Figure 2, the interlayer connecting conductors v4 (fourth interlayer connecting conductor), v5 (fifth interlayer connecting conductor), v6 (sixth interlayer connecting conductor), v8 (eighth interlayer connecting conductor), and multiple interlayer connecting conductors v10 are located behind the signal conductor layer 20 (negative direction of the Y axis). The interlayer connecting conductors v8, v4 (fourth interlayer connecting conductor), v5 (fifth interlayer connecting conductor), v6 (sixth interlayer connecting conductor), and multiple interlayer connecting conductors v10 are arranged in this order along the signal conductor layer 20 in the rightward direction (positive direction of the X-axis).

[0024] The distance D12 in the left-right direction (X-axis direction) between interlayer connecting conductor v5 (5th interlayer connecting conductor) and interlayer connecting conductor v6 (6th interlayer connecting conductor) is longer than the distance D11 in the left-right direction (X-axis direction) between interlayer connecting conductor v4 (4th interlayer connecting conductor) and interlayer connecting conductor v5 (5th interlayer connecting conductor). The distance D14 in the left-right direction between interlayer connecting conductor v8 and interlayer connecting conductor v4 is shorter than the distance D12 in the left-right direction between interlayer connecting conductor v5 and interlayer connecting conductor v6. The distance D15 in the left-right direction between the leftmost interlayer connecting conductor v10 among the multiple interlayer connecting conductors v10 and interlayer connecting conductor v6 is shorter than the distance D12 in the left-right direction between interlayer connecting conductor v5 and interlayer connecting conductor v6. Also, the left-right spacing D16 between the multiple interlayer connecting conductors v10 is shorter than the left-right distance D12 between interlayer connecting conductor v5 and interlayer connecting conductor v6. In this embodiment, distances D11, D14, D15, and D16 are equal to each other.

[0025] In this embodiment, interlayer connecting conductor v1 overlaps with interlayer connecting conductor v4 when viewed in the front-to-back direction. Interlayer connecting conductor v2 overlaps with interlayer connecting conductor v5 when viewed in the front-to-back direction. Interlayer connecting conductor v3 overlaps with interlayer connecting conductor v6 when viewed in the front-to-back direction. Interlayer connecting conductor v7 overlaps with interlayer connecting conductor v8 when viewed in the front-to-back direction. Each of the multiple interlayer connecting conductors v9 overlaps with multiple interlayer connecting conductors v10.

[0026] However, interlayer connecting conductor v1 does not have to overlap with interlayer connecting conductor v4 when viewed in the front-to-back direction. Interlayer connecting conductor v2 does not have to overlap with interlayer connecting conductor v5 when viewed in the front-to-back direction. Interlayer connecting conductor v3 does not have to overlap with interlayer connecting conductor v6 when viewed in the front-to-back direction. Interlayer connecting conductor v7 does not have to overlap with interlayer connecting conductor v8 when viewed in the front-to-back direction. Each of the multiple interlayer connecting conductors v9 does not have to overlap with the multiple interlayer connecting conductors v10.

[0027] Furthermore, as shown in Figure 2, the interlayer conductor v11 (11th interlayer conductor) is located in the section enclosed by interlayer conductors v1 (1st interlayer conductor), v2 (2nd interlayer conductor), v4 (4th interlayer conductor), v5 (5th interlayer conductor), v7 (7th interlayer conductor), and v8 (8th interlayer conductor). The lateral distance D50 between the interlayer conductor v11 and the first reference line X1 (described later) is shorter than half a wavelength of the high-frequency signal transmitted through the signal conductor layer 20. Also, as shown in Figure 3, the interlayer conductor v11 does not overlap with the first aperture Op1 (described later) when viewed in the vertical direction.

[0028] The first reference conductor layer 22, the second reference conductor layer 24, and the signal terminals 26a and 26b described above are formed, for example, by etching a metal foil provided on the upper or lower main surface of the insulator layers 16a to 16c. The metal foil is, for example, copper foil.

[0029] Furthermore, the interlayer connecting conductors v1~v8, v11, v12 and the multiple interlayer connecting conductors v9, v10 are, for example, via-hole conductors. Via-hole conductors are manufactured by forming through-holes in the insulating layers 16a~16c, filling the through-holes with conductive paste, and sintering the conductive paste. The material of the interlayer connecting conductors v1~v8, v11, v12 and the multiple interlayer connecting conductors v9, v10 is a mixture of resin and metal.

[0030] Here, the first reference line X1 is the line connecting the interlayer connecting conductor v2 (second interlayer connecting conductor) and the interlayer connecting conductor v5 (fifth interlayer connecting conductor). Then, looking in the vertical direction (Z-axis direction), the intersection point of the first reference line X1 and the center line CL of the signal conductor layer 20 is defined as the first intersection point P1.

[0031] Furthermore, the second reference line X2 is a line that passes through the interlayer connecting conductor v3 (third interlayer connecting conductor) and the interlayer connecting conductor v6 (sixth interlayer connecting conductor). The intersection point of the second reference line X2 and the center line CL of the signal conductor layer 20, viewed in the vertical direction (Z-axis direction), is defined as the second intersection point P2.

[0032] Furthermore, the interval between the first intersection point P1 and the second intersection point P2 is divided into four equal parts by the first point p1, the second point p2, and the third point p3, which are aligned to the right (positive direction of the X-axis). In addition, the fourth point p4 is defined as a point located to the left of the first intersection point P1 (negative direction of the X-axis) by the distance between the first point p1 and the second point p2.

[0033] The structure of the first opening Op1 is described below. The first opening Op1 has a slit shape that extends in the front-to-back direction. Therefore, the width of the first opening Op1 in the front-to-back direction (Y-axis direction) is greater than the width of the first opening Op1 in the left-to-right direction (X-axis direction). Furthermore, the width of the first opening Op1 in the front-to-back direction (Y-axis direction) is greater than the width of the interlayer connecting conductor v2 (second interlayer connecting conductor). rear end (The negative end of the Y-axis) and the interlayer connecting conductor v5 (the fifth interlayer connecting conductor) front end It is more than half of the distance D60 in the front-to-back direction (Y-axis direction) from the positive end of the Y-axis.

[0034] Furthermore, the first opening Op1 is located near the interlayer connecting conductors v2 and v5. More specifically, viewed in the vertical direction (Z-axis direction), the first opening Op1 is located near the first reference line X1 connecting the second interlayer connecting conductor v2 and the fifth interlayer connecting conductor v5. And to the right (positive direction of the X-axis) It is located in the vicinity of the first reference line X1. Note that being located near the first reference line X1 means being to the left of the first line L1 and to the right of the second line L2.

[0035] The first line L1 is a line that passes through the first point p1 and is perpendicular to the signal conductor layer 20. The second line L2 is a line that passes through the fourth point p4 and is perpendicular to the signal conductor layer 20. When viewed in the vertical direction (Z-axis direction), the center C1 of the first opening Op1 in the front-to-back direction and the left-to-right direction (X-axis direction) is located between the first line L1 and the second line L2. In this embodiment, when viewed in the vertical direction (Z-axis direction), the first opening Op1 is located between the first line L1 and the second line L2.

[0036] Furthermore, when viewed in the vertical direction (Z-axis direction), the first opening Op1 is located to the right (positive X-axis direction) of the interlayer connecting conductor v11 (11th interlayer connecting conductor). Moreover, when viewed in the vertical direction (Z-axis direction), the left end of the first opening Op1 (negative X-axis direction end) is located to the right (positive X-axis direction) of the straight line X3 connecting the interlayer connecting conductor v1 (1st interlayer connecting conductor) and the interlayer connecting conductor v4 (4th interlayer connecting conductor). In this embodiment, when viewed in the vertical direction (Z-axis direction), the left end of the first opening Op1 (negative X-axis direction end) is located to the right (positive X-axis direction) of the interlayer connecting conductor v1 (1st interlayer connecting conductor) and the right end (positive X-axis direction end) of the interlayer connecting conductor v4 (4th interlayer connecting conductor).

[0037] Viewed in the vertical direction (Z-axis direction), the right end of the first aperture Op1 (the positive end in the X-axis direction) passes through the second point p2 and is located to the left (negative direction in the X-axis direction) of the third line L3 which is perpendicular to the signal conductor layer 20. In this embodiment, viewed in the vertical direction (Z-axis direction), the entirety of the first aperture Op1 is located between the first line L1 and the second line L2. More precisely, the first aperture Op1 is located between the first reference line X1 and the first line L1.

[0038] Furthermore, the front end (positive Y-axis end) of the first opening Op1 is located behind (negative Y-axis direction) the front end (positive Y-axis end) of the interlayer connecting conductor v2 (second interlayer connecting conductor). The rear end (negative Y-axis end) of the first opening Op1 is located in front of (positive Y-axis direction) the rear end (negative Y-axis end) of the interlayer connecting conductor v5 (fifth interlayer connecting conductor).

[0039] Furthermore, when viewed in the vertical direction (Z-axis direction), there are no openings other than the first opening Op1 on the third straight line L3. In other words, no openings are provided on the third straight line L3. . Change Furthermore, no openings are provided to the right of the first opening Op1 and to the left of the second reference line X2.

[0040] As described above, the first reference conductor layer 22, which is located at the same vertical position as the signal terminal 26a, does not have an opening. The second reference conductor layer 24, which is located at a different vertical position from the signal terminal 26a, has a first opening Op1.

[0041] Furthermore, in the multilayer substrate 10, no openings are provided in the section between the first straight line L1 and the second reference straight line X2. The fourth straight line L4 is a line that passes through the third point p3 and is perpendicular to the signal conductor layer 20.

[0042] The protective layer 18a is an insulating layer that covers the upper main surface of the insulating layer 16a. Thus, the protective layer 18a protects the first reference conductor layer 22. However, the protective layer 18a is provided with openings h1 to h6. Opening h1 overlaps with the signal terminal 26a when viewed in the vertical direction. As a result, the signal terminal 26a is exposed to the outside from the multilayer substrate 10. Opening h2 is located behind opening h1. A portion of the first reference conductor layer 22 is exposed to the outside from the multilayer substrate 10 through opening h2. Opening h3 is located in front of opening h1. A portion of the first reference conductor layer 22 is exposed to the outside from the multilayer substrate 10 through opening h3. As a result, a portion of the first reference conductor layer 22 functions as a ground terminal. Note that the structure of openings h4 to h6 is symmetrical to the structure of openings h1 to h3, so their explanation is omitted.

[0043] The protective layer 18b is a protective layer that covers the lower main surface of the insulator layer 16c. In this way, the protective layer 18b protects the second reference conductor layer 24.

[0044] The multilayer substrate 10 described above is flexible. Therefore, as shown in Figure 4, the multilayer substrate 10 can be bent. Specifically, the multilayer substrate 10 has a first section A1, a second section A2, and a third section A3. When the multilayer substrate 10 is not bent, the first section A1, the second section A2, and the third section A3 are arranged in this order from left to right. The first section A1 is the section to the left of the first reference line X1 connecting the interlayer connecting conductor v2 and the interlayer connecting conductor v5, as shown in Figure 2. The second section A2 is the section between the first reference line X1 connecting the interlayer connecting conductor v2 and the interlayer connecting conductor v5 and the second reference line X2 connecting the interlayer connecting conductor v3 and the interlayer connecting conductor v6. The third section A3 is the section to the right of the second reference line X2 connecting the interlayer connecting conductor v3 and the interlayer connecting conductor v6.

[0045] Furthermore, a portion a2 of the second section A2 is bent downward relative to the first section A1. That is, the multilayer substrate 10 is bent in a portion a2 of the second section A2 between the first reference line X1 connecting the interlayer connecting conductor v2 (second interlayer connecting conductor) and the interlayer connecting conductor v5 (fifth interlayer connecting conductor) and the second reference line X2 connecting the interlayer connecting conductor v3 (third interlayer connecting conductor) and the interlayer connecting conductor v6 (sixth interlayer connecting conductor). The negative X-axis end of portion a2 is located in the positive X-axis direction relative to the negative X-axis end of the second section A2. The positive X-axis end of portion a2 is located in the negative X-axis direction relative to the positive X-axis end of the second section A2. On the other hand, the first section A1 and the third section A3 are not bent. However, the first section A1 and the third section A3 may be slightly bent. In this case, the radius of curvature of the first section A1 and the radius of curvature of the third section A3 are greater than the radius of curvature of a2, which is a portion of the second section A2.

[0046] [effect] (a) The multilayer substrate 10 can suppress the generation of noise. More specifically, in the multilayer substrate 10, the distance D2 in the left-right direction between interlayer connecting conductor v2 and interlayer connecting conductor v3 is longer than the distance D1 in the left-right direction between interlayer connecting conductor v1 and interlayer connecting conductor v2. The distance D12 in the left-right direction between interlayer connecting conductor v5 and interlayer connecting conductor v6 is longer than the distance D11 in the left-right direction between interlayer connecting conductor v4 and interlayer connecting conductor v5. Therefore, the signal conductor layer 20 Transmission lines including The characteristic impedance tends to become non-uniform. In this case, propagation modes other than the desired propagation mode (TEM mode) (hereinafter referred to as unwanted propagation modes) occur. As a result, these unwanted propagation modes may be radiated as noise from the region between the first reference line X1 and the second reference line X2.

[0047] Therefore, in the multilayer substrate 10, when viewed in the vertical direction, the first aperture Op1 is located to the left of the vicinity of the first reference line X1 connecting the second interlayer connecting conductor v2 and the fifth interlayer connecting conductor v5. Also, when viewed in the vertical direction, the first aperture Op1 is located to the right of the eleventh interlayer connecting conductor v11. As a result, the first aperture Op1 is located in the vicinity of the interlayer connecting conductors v2 and v5. The center C1 of the first aperture Op1 is located in the vicinity of the first reference line X1 in the horizontal direction, and is not located in the vicinity of the interlayer connecting conductors v2 and v5. Therefore, unwanted propagation modes Resonance and electromagnetic waves The second reference conductor layer 24 moves to the right Even if it propagates , unwanted propagation mode Propagation of electromagnetic waves This is blocked by the first aperture Op1. Therefore, unwanted propagation modes are suppressed from being radiated as noise from the region between the first reference line X1 and the second reference line X2. Furthermore, unwanted propagation modes of Resonance is suppressed.

[0048] (b) In the multilayer substrate 10, the width of the first aperture Op1 in the front-to-back direction is more than half of the front-to-back distance D60 between the rear end of the interlayer connecting conductor v2 and the front end of the interlayer connecting conductor v5. As a result, the flow of unwanted propagation modes propagating through the second reference conductor layer 24 is efficiently obstructed by the first aperture Op1. Therefore, the radiation of unwanted propagation modes as noise from between the interlayer connecting conductors v2 and v3 and between the interlayer connecting conductors v5 and v6 is suppressed. Furthermore, no apertures are provided to the right of the first aperture Op1 and to the left of the second reference line X2, thus maintaining the strength of the multilayer substrate 10.

[0049] (c) The multilayer substrate 10 has a first reference line X1 connecting interlayer connecting conductor v2 and interlayer connecting conductor v5, and a line connecting interlayer connecting conductor v3 and interlayer connecting conductor v6. Second standardThe second section A2 is bent in a portion a2 between it and the straight line X2. There are no interlayer connecting conductors in this portion a2 of the second section A2. Therefore, even if a portion a2 of the second section A2 is bent, the distance between the signal conductor layer 20 and the interlayer connecting conductor in this portion a2 of the second section A2 does not change easily. As a result, the characteristic impedance generated in the signal conductor layer 20 in this portion a2 of the second section A2 does not change easily. Thus, with the multilayer substrate 10, the characteristic impedance generated in the signal conductor layer 20 is suppressed from deviating from the desired characteristic impedance (e.g., 50Ω).

[0050] (d) In the multilayer substrate 10, the width of the first aperture Op1 in the front-to-back direction is greater than the width of the first aperture Op1 in the left-to-right direction. That is, the first aperture Op1 has a longitudinal direction in the front-to-back direction. Therefore, the first aperture Op1 obstructs the flow of unwanted propagation modes to the right. Furthermore, because the width of the first aperture Op1 in the left-to-right direction is small, the area of ​​the first aperture Op1 does not become too large. As a result, the emission of noise from the first aperture Op1 is suppressed. In addition, the strength of the multilayer substrate 10 can be maintained.

[0051] (e) In the multilayer substrate 10, the front end of the first opening Op1 is located behind the front end of the interlayer connecting conductor v2. The rear end of the first opening Op1 is located in front of the rear end of the interlayer connecting conductor v5. This prevents the length of the first opening Op1 in the front-to-back direction from becoming too long. As a result, the strength of the second reference conductor layer 24 is less likely to decrease, and damage to the second reference conductor layer 24 is suppressed. In addition, the strength of the multilayer substrate 10 can be maintained.

[0052] (f) The multilayer substrate 10 can suppress the generation of noise. More specifically, the characteristic impedance generated in the interlayer connecting conductor v11 and the sections before and after it is prone to deviating from the desired characteristic impedance. Therefore, unwanted propagation modes are likely to occur in the interlayer connecting conductor v11. As a result, the unwanted propagation modes flow to the right in the second reference conductor layer 24 near the first reference straight line X1.

[0053] Therefore, the interlayer connecting conductor v11 is located in the section where interlayer connecting conductors v1, v2, v4, v5, v7, and v8 are provided. This suppresses the radiation of unwanted propagation modes as noise outside the multilayer substrate 10 by interlayer connecting conductors v1, v2, v4, v5, v7, and v8.

[0054] (First variation) The multilayer substrate 10a according to the first modified example will be described below with reference to the drawings. Figure 5 is a top view of the insulating layer 16c.

[0055] The multilayer substrate 10a differs from the multilayer substrate 10 in that the second openings Op2 to Op5, the third opening Op6, and the fourth openings Op7 to Op10 are provided on the second reference conductor layer 24. The second opening Op2 is located to the left front of the first opening Op1. The second opening Op3 is located to the left rear of the first opening Op1. The second opening Op4 is located to the right front of the first opening Op1. The second opening Op5 is located to the right rear of the first opening Op1. Also, viewed in the left-right direction, the front end of the first opening Op1 overlaps with the rear end of the second opening Op2 and the rear end of the second opening Op4. Also, viewed in the left-right direction, the rear end of the first opening Op1 overlaps with the front end of the second opening Op3 and the front end of the second opening Op5. The width of each of the second openings Op2 to Op5 in the front-back direction is greater than the width of the second openings Op2 to Op5 in the left-right direction.

[0056] However, the second openings Op2 to Op5 are located between the first straight line L1 and the second straight line L2. In this embodiment, the centers C2 to C5 of the second openings Op2 to Op5 in the left-right direction (X-axis direction) are located between the first straight line L1 and the second straight line L2. Furthermore, when viewed in the left-right direction (X-axis direction), the width W1 in the front-back direction (Y-axis direction) of the region where the first opening Op1 and the second openings Op2 to Op5 exist is the interlayer connecting conductor v2 (the 2 The distance D60 in the front-to-back direction (Y-axis direction) between the rear end (negative Y-axis end) of the interlayer connecting conductor) and the front end (positive Y-axis end) of the interlayer connecting conductor v5 (fifth interlayer connecting conductor) is more than half of this distance.

[0057] The third opening Op6 and the fourth openings Op7-Op10 are located near the interlayer connecting conductor v12. The third opening Op6 has a structure symmetrical to the first opening Op1. The fourth openings Op7-Op10 are symmetrical to the second openings Op2-Op5. symmetric It has a structure. Therefore, the structure of the third aperture Op6 and the fourth apertures Op7 to Op10 will not be explained. This suppresses the radiation of noise generated by the interlayer connecting conductor v12. Also, since there is no aperture between the first straight line L1 and the straight line L4, noise leakage is suppressed and the strength of the multilayer substrate 10a can be maintained. The other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10, so the explanation will be omitted. The multilayer substrate 10a can achieve the effects of (a), (c), (d), (e), and (f).

[0058] (g) In the case of the multilayer substrate 10a, when viewed in the left-right direction, the width W1 in the front-to-back direction of the region where the first aperture Op1 and the second apertures Op2 to Op5 exist is equal to the width of the interlayer connecting conductor v 2 The distance D60 between the rear end and the front end of the interlayer connecting conductor v5 is more than half. As a result, the flow of unwanted propagation modes propagating through the second reference conductor layer 24 is efficiently obstructed by the first aperture Op1 and the second apertures Op2 to Op5. Therefore, the radiation of unwanted propagation modes as noise from between interlayer connecting conductors v2 and v3 and between interlayer connecting conductors v5 and v6 is suppressed.

[0059] (h) In the multilayer substrate 10a, the third aperture Op6 has a structure that is symmetric with respect to the first aperture Op1 and the third line L3. Also, the fourth apertures Op7 to Op10 have a structure that is symmetric with respect to the second apertures Op2 to Op5 and the third line L3. As a result, even if unwanted propagation modes flow to the left in the vicinity of the second reference line X2 through the second reference conductor layer 24, the flow of unwanted propagation modes is obstructed by the third aperture Op6 and the fourth apertures Op7 to Op10. Therefore, the radiation of unwanted propagation modes as noise from between interlayer connecting conductors v2 and v3 and between interlayer connecting conductors v5 and v6 is suppressed.

[0060] (Second variation) The following describes the multilayer substrate 10b according to the second modified example, with reference to the drawings. Figure 6 is an exploded perspective view of the multilayer substrate 10b. Figure 7 is a cross-sectional view of the multilayer substrate 10b.

[0061] The multilayer substrate 10b differs from the multilayer substrate 10 in that an opening Op30 is provided in the first reference conductor layer 22. The opening Op30 does not overlap with the first opening Op1 when viewed in the vertical direction. This makes it less likely for the characteristic impedance generated in the signal conductor layer 20 to fluctuate. Furthermore, 1 By positioning aperture Op1 closer to the interlayer conductor v11 than aperture Op30, the effects of noise are suppressed. The other structures of multilayer substrate 10b are the same as those of multilayer substrate 10, so their description is omitted. Multilayer substrate 10b can achieve the effects (a) to (f). Furthermore, with multilayer substrate 10b, the variation of the characteristic impedance generated in the signal conductor layer 20 from the desired characteristic impedance is suppressed.

[0062] (Third variation) The following describes the multilayer substrate 10c according to the third modified example, with reference to the drawings. Figure 8 is a top view of the insulating layer 16c.

[0063] The multilayer substrate 10c differs from the multilayer substrate 10 in that, when viewed in the vertical direction, the line width w1 of the portion of the signal conductor layer 20 that overlaps with the first aperture Op1 is thicker than the line width w2 of the portion of the signal conductor layer 20 that does not overlap with the first aperture Op1 when viewed in the vertical direction. The other structural features of the multilayer substrate 10c are the same as those of the multilayer substrate 10, so their description is omitted. Multilayer substrate 10 c This can produce the effects (a) to (f).

[0064] Furthermore, the characteristic impedance generated in the signal conductor layer 20 is suppressed from deviating from the desired characteristic impedance. More specifically, in the portion where the signal conductor layer 20 overlaps with the first aperture Op1 when viewed in the vertical direction, capacitance is less likely to form between the signal conductor layer 20 and the second reference conductor layer 24. Therefore, the characteristic impedance generated in the portion where the signal conductor layer 20 overlaps with the first aperture Op1 when viewed in the vertical direction tends to be higher than the desired characteristic impedance.

[0065] Therefore, when viewed in the vertical direction, the line width w1 of the portion of the signal conductor layer 20 that overlaps with the first aperture Op1 is thicker than the line width w2 of the portion of the signal conductor layer 20 that does not overlap with the first aperture Op1 when viewed in the vertical direction. The characteristic impedance generated in the portion of the signal conductor layer 20 that overlaps with the first aperture Op1 when viewed in the vertical direction approaches the desired characteristic impedance.

[0066] (Fourth variation) The following describes the multilayer substrate 10d according to the fourth modified example, with reference to the drawings. Figure 9 is a cross-sectional view of the multilayer substrate 10d.

[0067] The multilayer substrate 10d differs from the multilayer substrate 10 in that it further comprises a conductor 50. The conductor 50 is filled in the first opening Op1. The conductivity of the conductor 50 is lower than that of the second reference conductor layer 24. The other structures of the multilayer substrate 10d are the same as those of the multilayer substrate 10, so their description is omitted. The multilayer substrate 10d can achieve the effects (a) to (f).

[0068] (i) In the multilayer substrate 10d, the conductor 50 fills the first aperture Op1. The conductivity of the conductor 50 is lower than that of the second reference conductor layer 24. Therefore, even if unwanted propagation modes flow to the right through the second reference conductor layer 24, they are attenuated by the conductor 50. As a result, the radiation of unwanted propagation modes as noise from between interlayer connecting conductors v2 and v3 and between interlayer connecting conductors v5 and v6 is suppressed.

[0069] (j) In the multilayer substrate 10d, the conductor 50 fills the first aperture Op1. This allows noise to pass from the first aperture Op1 to the multilayer substrate 10 d Intrusion into the interior is suppressed. Also, noise is suppressed from the first aperture Op1 to the multilayer substrate 10 d The emission of radiation into the environment is suppressed.

[0070] (Fifth variation) The following describes the multilayer substrate 10e according to the fifth modified example, with reference to the drawings. Figure 10 is a cross-sectional view of the multilayer substrate 10e.

[0071] The multilayer substrate 10e differs from the multilayer substrate 10 in that it further comprises an insulator 60 and a conductor 62. The insulator 60 fills the first opening Op1. The material of the insulator 60 may be the same as or different from the material of the insulator layers 16a to 16c. Also, the material of the insulator 60 may be the same as or different from the material of the protective layers 18a and 18b. The conductor 62 covers the insulator 60. The conductivity of the conductor 62 is lower than the conductivity of the second reference conductor layer 24. The other structures of the multilayer substrate 10e are the same as those of the multilayer substrate 10, so their description is omitted. Multilayer substrate 10 e It can produce the effects of (a)~(f), (i), and (j).

[0072] (Sixth variation) The multilayer substrate 10f according to the sixth modified example will be described below with reference to the drawings. Figure 11 is a top view of the insulating layer 16c.

[0073] The multilayer substrate 10f differs from the multilayer substrate 10 in that it has multiple interlayer connecting conductors v7 and multiple interlayer connecting conductors v8. The multiple interlayer connecting conductors v7 (seventh interlayer connecting conductor) are arranged along the signal conductor layer 20 to the left (negative direction of the X axis) of the interlayer connecting conductor v1 (first interlayer connecting conductor). The distance D7 between the multiple interlayer connecting conductors v7 (seventh interlayer connecting conductor) in the left-right direction (X axis direction) is shorter than the distance D2 between the interlayer connecting conductor v2 (second interlayer connecting conductor) and the interlayer connecting conductor v3 (third interlayer connecting conductor). Furthermore, the distance D8 in the left-to-right direction (in the X-axis direction) between the rightmost (positive X-axis direction) interlayer connecting conductor v7 (the 7th interlayer connecting conductor) and interlayer connecting conductor v1 (the 1st interlayer connecting conductor) is shorter than the distance D2 in the left-to-right direction (in the X-axis direction) between interlayer connecting conductor v2 (the 2nd interlayer connecting conductor) and interlayer connecting conductor v3 (the 3rd interlayer connecting conductor). The spacing D7 and distance D8 are equal to distance D1.

[0074] Multiple interlayer conductors v8 (the eighth interlayer conductor) are aligned along the signal conductor layer 20 to the left (negative direction of the X-axis) of interlayer conductor v4 (the fourth interlayer conductor). The left-right spacing D17 of the multiple interlayer conductors v8 (the eighth interlayer conductor) is shorter than the left-right distance D12 between interlayer conductor v5 (the fifth interlayer conductor) and interlayer conductor v6 (the sixth interlayer conductor). Furthermore, the left-right distance D18 between the rightmost interlayer conductor v8 (the eighth interlayer conductor) among the multiple interlayer conductors v8 (the eighth interlayer conductor) and interlayer conductor v4 (the fourth interlayer conductor) is shorter than the left-right distance D12 between interlayer conductor v5 (the fifth interlayer conductor) and interlayer conductor v6 (the sixth interlayer conductor). The interval D17 and distance D18 are equal to the distance D11.

[0075] The interlayer connecting conductor v11 (11th interlayer connecting conductor) is located in the section surrounded by interlayer connecting conductors v1 (1st interlayer connecting conductor), interlayer connecting conductor v2 (2nd interlayer connecting conductor), interlayer connecting conductor v4 (4th interlayer connecting conductor), interlayer connecting conductor v5 (5th interlayer connecting conductor), multiple interlayer connecting conductors v7 (7th interlayer connecting conductor), and multiple interlayer connecting conductors v8 (8th interlayer connecting conductor). The other structure of the multilayer substrate 10f is the same as that of the multilayer substrate 10, so the explanation is omitted. The multilayer substrate 10f can achieve the effects (a) to (f).

[0076] (Seventh variation) The following describes the seventh modified multilayer substrate 10g with reference to the drawings. Figure 12 is a cross-sectional view of the multilayer substrate 10g.

[0077] The multilayer substrate 10g differs from the multilayer substrate 10 in that it further comprises a signal conductor layer 21, a first reference conductor layer 22a, an insulating layer 16d, and interlayer connecting conductors v15 and v16. The insulating layer 16d is laminated on top of the insulating layer 16a. However, the insulating layer 16d is provided only at the left end of the multilayer substrate 10g. The signal conductor layer 21 is located on the upper main surface of the insulating layer 16a. The interlayer connecting conductor v15 penetrates the insulating layer 16a in the vertical direction. The interlayer connecting conductor v15 electrically connects the left end of the signal conductor layer 20 and the right end of the signal conductor layer 21. The interlayer connecting conductor v11 electrically connects the left end of the signal conductor layer 21 and the signal terminal 26a. Furthermore, the interlayer connecting conductors v11 and v15 do not overlap with the first opening Op1 when viewed in the vertical direction. The first reference conductor layer 22a is located on the upper main surface of the insulator layer 16a. The interlayer connecting conductor v16 electrically connects the first reference conductor layer 22a and the first reference conductor layer 22. The other structures of the multilayer substrate 10g are the same as those of the multilayer substrate 10, so their description is omitted. The multilayer substrate 10g can achieve the effects (a) to (f).

[0078] (Variation 8) The multilayer substrate 10h according to the eighth modified example will be described below with reference to the drawings. Figure 13 is a top view of the insulating layer 16c.

[0079] The multilayer substrate 10h differs from the multilayer substrate 10 in that, when viewed in the vertical direction, the first aperture Op1 is located between the first reference line X1 and line X3. More precisely, the first aperture Op1 is located to the left of the first reference line X1 and to the right of line X3. The other structures of the multilayer substrate 10h are the same as those of the multilayer substrate 10, so their description is omitted. The multilayer substrate 10h can achieve the effects (a) to (f).

[0080] (Other embodiments) The multilayer substrate according to the present invention is not limited to multilayer substrates 10, 10a to 10h, but can be modified within the scope of its gist. Furthermore, the structures of the multilayer substrates 10, 10a to 10h may be arbitrarily combined.

[0081] Furthermore, the number of second apertures in the multilayer substrate 10a is not limited to four. The number of second apertures may be one to three, or five or more.

[0082] The signal conductor layer 20 may be curved when viewed in the vertical direction. In this case, the multilayer substrates 10, 10a to 10g include sections where the X-axis direction coincides with the left-right direction and sections where the X-axis direction does not coincide with the left-right direction.

[0083] Note that the first opening Op1 may be provided in the first reference conductor layer 22, rather than in the second reference conductor layer 24. In this case, there is no conductor layer within the first opening Op1. Therefore, the first opening Op1 is different from, for example, an opening provided in the first reference conductor layer 22 for a signal terminal 26a.

[0084] The signal conductor layer 20 may be curved forward or backward when viewed in the vertical direction.

[0085] Note that in Figure 12, 1The opening Op1 may be provided in the first reference conductor layer 22. The multilayer substrates 10, 10a to 10h are intended to remove noise caused by capacitance formed between the reference conductor overlapping with the interlayer connecting conductor v11 and the interlayer connecting conductor v11. Therefore, in the multilayer substrate 10g, the first opening Op1 only needs to be provided in the first reference conductor layer 22 or in the second reference conductor layer 24, as it is sufficient to provide a reference conductor that overlaps with the interlayer connecting conductor v11. [Explanation of Symbols]

[0086] 10,10a~10h: Multilayer board 12: Laminate 16a~16d: Insulating layer 18a, 18b: Protective layer 20,21: Signal conductor layer 22: First reference conductor layer 24: Second reference conductor layer 26a, 26b: Signal terminal 50,62: Conductor 60: Insulator A1: Section 1 A2: Section 2 A3: Third section C1~C5: Center CL: Center line L1: 1st straight line L2: Second straight line L3: 3rd straight line Op1: 1st opening Op2~Op5: Second opening Op30: Opening Op6: 3rd opening Op7~Op10: 4th opening P1: 1st intersection P2: 2nd intersection p1: 1st point p2: 2nd point p3: 3rd point p4: 4th point v1~v12,v15: Interlayer connecting conductors

Claims

1. A laminate having a structure in which multiple insulating layers are stacked in the Z-axis direction, and a plurality of conductive layers provided on the laminate, The aforementioned conductor layer is A signal conductor layer provided in the laminate and having a linear shape extending in the X-axis direction perpendicular to the Z-axis direction, A first reference conductor layer is provided on the laminate, is located in the positive Z-axis direction relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction, A second reference conductor layer is provided on the laminate, is located in the negative direction of the Z-axis relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction, The first reference conductor layer and the second reference conductor layer are electrically connected, and the first interlayer connecting conductor, the second interlayer connecting conductor, and the third interlayer connecting conductor are located in the positive direction of the Y axis, perpendicular to the X-axis and Z-axis directions from the signal conductor layer, and are arranged in this order along the signal conductor layer toward the positive direction of the X axis, The first reference conductor layer and the second reference conductor layer are electrically connected, and the fourth, fifth, and sixth interlayer connecting conductors are located in the negative direction of the Y-axis relative to the signal conductor layer and are arranged in this order along the signal conductor layer toward the positive direction of the X-axis, An 11th interlayer connecting conductor is connected to the signal conductor layer, is located in the positive direction of the Z-axis relative to the signal conductor layer, and penetrates one or more of the plurality of insulating layers along the Z-axis, Includes, The distance in the X-axis direction between the second interlayer connecting conductor and the third interlayer connecting conductor is longer than the distance in the X-axis direction between the first interlayer connecting conductor and the second interlayer connecting conductor. The distance in the X-axis direction between the fifth interlayer connecting conductor and the sixth interlayer connecting conductor is longer than the distance in the X-axis direction between the fourth interlayer connecting conductor and the fifth interlayer connecting conductor. In the first reference conductor layer and the second reference conductor layer, the reference conductor layer that overlaps with the 11th interlayer connecting conductor is provided with a first opening at a position that overlaps with the signal conductor layer when viewed in the Z-axis direction. Viewed in the Z-axis direction, the first opening is located in the negative direction of the X-axis from the vicinity of the first reference line connecting the second interlayer connecting conductor and the fifth interlayer connecting conductor. Viewed in the Z-axis direction, the first opening is located in the positive X-axis direction relative to the 11th interlayer connecting conductor. When viewed in the Z-axis direction, the conductor layer is not located within the first opening. Multilayer substrate, Viewed in the Z-axis direction, the intersection point between the first reference line and the center line of the signal conductor layer is defined as the first intersection point. Viewed in the Z-axis direction, the intersection point of the second reference line connecting the third interlayer connecting conductor and the sixth interlayer connecting conductor and the center line of the signal conductor layer is defined as the second intersection point. The interval between the first intersection and the second intersection is divided into four equal parts by the first, second, and third points aligned in the positive direction of the X-axis. A fourth point is defined as a point located in the negative direction of the X-axis from the first intersection point by the distance between the first and second points. Viewed in the Z-axis direction, the first opening is located between a first straight line passing through the first point and perpendicular to the signal conductor layer, and a second straight line passing through the fourth point and perpendicular to the signal conductor layer. Multilayer board.

2. A laminate having a structure in which a plurality of insulating layers are stacked in the Z-axis direction, and a plurality of conductive layers provided on the laminate, The aforementioned conductor layer is A signal conductor layer provided in the laminate and having a linear shape extending in the X-axis direction perpendicular to the Z-axis direction, A first reference conductor layer is provided on the laminate, is located in the positive Z-axis direction relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction, A second reference conductor layer is provided on the laminate, is located in the negative direction of the Z-axis relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction, The first reference conductor layer and the second reference conductor layer are electrically connected, and the first interlayer connecting conductor, the second interlayer connecting conductor, and the third interlayer connecting conductor are located in the positive direction of the Y axis, perpendicular to the X-axis and Z-axis directions from the signal conductor layer, and are arranged in this order along the signal conductor layer toward the positive direction of the X axis, The first reference conductor layer and the second reference conductor layer are electrically connected, and the fourth, fifth, and sixth interlayer connecting conductors are located in the negative direction of the Y-axis relative to the signal conductor layer and are arranged in this order along the signal conductor layer toward the positive direction of the X-axis, An 11th interlayer connecting conductor is connected to the signal conductor layer, is located in the positive direction of the Z-axis relative to the signal conductor layer, and penetrates one or more of the plurality of insulating layers along the Z-axis, Includes, The distance in the X-axis direction between the second interlayer connecting conductor and the third interlayer connecting conductor is longer than the distance in the X-axis direction between the first interlayer connecting conductor and the second interlayer connecting conductor. The distance in the X-axis direction between the fifth interlayer connecting conductor and the sixth interlayer connecting conductor is longer than the distance in the X-axis direction between the fourth interlayer connecting conductor and the fifth interlayer connecting conductor. In the first reference conductor layer and the second reference conductor layer, the reference conductor layer that overlaps with the 11th interlayer connecting conductor is provided with a first opening at a position that overlaps with the signal conductor layer when viewed in the Z-axis direction. Viewed in the Z-axis direction, the first opening is located in the negative direction of the X-axis from the vicinity of the first reference line connecting the second interlayer connecting conductor and the fifth interlayer connecting conductor. Viewed in the Z-axis direction, the first opening is located in the positive X-axis direction relative to the 11th interlayer connecting conductor. When viewed in the Z-axis direction, the conductor layer is not located within the first opening. Multilayer substrate, Viewed in the Z-axis direction, the negative end of the first opening in the X-axis direction is located in the positive X-axis direction more than the positive end of the first interlayer connecting conductor in the X-axis direction and the positive end of the fourth interlayer connecting conductor in the X-axis direction. Multilayer board.

3. A laminate having a structure in which a plurality of insulating layers are stacked in the Z-axis direction, and a plurality of conductive layers provided on the laminate, The aforementioned conductor layer is A signal conductor layer provided in the laminate and having a linear shape extending in the X-axis direction perpendicular to the Z-axis direction, A first reference conductor layer is provided on the laminate, is located in the positive Z-axis direction relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction, A second reference conductor layer is provided on the laminate, is located in the negative direction of the Z-axis relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction, The first reference conductor layer and the second reference conductor layer are electrically connected, and the first interlayer connecting conductor, the second interlayer connecting conductor, and the third interlayer connecting conductor are located in the positive direction of the Y axis, perpendicular to the X-axis and Z-axis directions from the signal conductor layer, and are arranged in this order along the signal conductor layer toward the positive direction of the X axis, The first reference conductor layer and the second reference conductor layer are electrically connected, and the fourth, fifth, and sixth interlayer connecting conductors are located in the negative direction of the Y-axis relative to the signal conductor layer and are arranged in this order along the signal conductor layer toward the positive direction of the X-axis, An 11th interlayer connecting conductor is connected to the signal conductor layer, is located in the positive direction of the Z-axis relative to the signal conductor layer, and penetrates one or more of the plurality of insulating layers along the Z-axis, Includes, The distance in the X-axis direction between the second interlayer connecting conductor and the third interlayer connecting conductor is longer than the distance in the X-axis direction between the first interlayer connecting conductor and the second interlayer connecting conductor. The distance in the X-axis direction between the fifth interlayer connecting conductor and the sixth interlayer connecting conductor is longer than the distance in the X-axis direction between the fourth interlayer connecting conductor and the fifth interlayer connecting conductor. In the first reference conductor layer and the second reference conductor layer, the reference conductor layer that overlaps with the 11th interlayer connecting conductor is provided with a first opening at a position that overlaps with the signal conductor layer when viewed in the Z-axis direction. Viewed in the Z-axis direction, the first opening is located in the negative direction of the X-axis from the vicinity of the first reference line connecting the second interlayer connecting conductor and the fifth interlayer connecting conductor. Viewed in the Z-axis direction, the first opening is located in the positive X-axis direction relative to the 11th interlayer connecting conductor. When viewed in the Z-axis direction, the conductor layer is not located within the first opening. Multilayer substrate, The section between the straight line connecting the second interlayer connecting conductor and the fifth interlayer connecting conductor and the straight line connecting the third interlayer connecting conductor and the sixth interlayer connecting conductor is bent in a portion of the section. Multilayer board.

4. The second reference conductor layer is provided with one or more second openings. The second line is a line that passes through the fourth point and is perpendicular to the signal conductor layer. The one or more second openings are located between the first straight line and the second straight line. Viewed in the X-axis direction, the width in the Y-axis direction of the region where the first opening and the one or more second openings exist is more than half the distance between the negative Y-axis end of the second interlayer connecting conductor and the positive Y-axis end of the fifth interlayer connecting conductor. The multilayer substrate according to claim 1.

5. Multiple interlayer connecting conductors, which electrically connect the first reference conductor layer and the second reference conductor layer and are located in the positive direction of the Y-axis relative to the signal conductor layer, Multiple interlayer connecting conductors, which electrically connect the first reference conductor layer and the second reference conductor layer and are located in the negative direction of the Y-axis relative to the signal conductor layer, A signal terminal located on the main surface of the laminate that is in the positive direction of the Z-axis, It also has the following features: The 11th interlayer connecting conductor electrically connects the signal terminal and the signal conductor layer. The plurality of seventh interlayer connecting conductors are arranged along the signal conductor layer in the negative direction of the X-axis from the first interlayer connecting conductor, The spacing of the plurality of seventh interlayer connecting conductors in the X-axis direction is shorter than the distance between the second interlayer connecting conductor and the third interlayer connecting conductor in the X-axis direction. The distance in the X-axis direction between the seventh interlayer connecting conductor, which is located furthest in the positive direction of the X-axis among the plurality of seventh interlayer connecting conductors, and the first interlayer connecting conductor is shorter than the distance in the X-axis direction between the second interlayer connecting conductor and the third interlayer connecting conductor. The plurality of eighth interlayer connecting conductors are arranged along the signal conductor layer in the negative direction of the X-axis from the fourth interlayer connecting conductor, The spacing of the plurality of eighth interlayer connecting conductors in the X-axis direction is shorter than the distance between the fifth interlayer connecting conductor and the sixth interlayer connecting conductor in the X-axis direction. The distance in the X-axis direction between the eighth interlayer connecting conductor located most in the positive direction of the X-axis among the plurality of eighth interlayer connecting conductors and the fourth interlayer connecting conductor is shorter than the distance in the X-axis direction between the fifth interlayer connecting conductor and the sixth interlayer connecting conductor. The 11th interlayer connecting conductor is located in the section surrounded by the 1st interlayer connecting conductor, the 2nd interlayer connecting conductor, the 4th interlayer connecting conductor, the 5th interlayer connecting conductor, the plurality of 7th interlayer connecting conductors, and the plurality of 8th interlayer connecting conductors. A multilayer substrate according to any one of claims 1 to 3.

6. No opening is provided in the section between the first straight line and the second reference straight line. The multilayer substrate according to claim 1.

7. The positive Y-axis end of the first opening is located in the negative Y-axis direction relative to the positive Y-axis end of the second interlayer connecting conductor. The negative end of the first opening in the Y-axis direction is located in the positive Y-axis direction relative to the negative end of the fifth interlayer connecting conductor in the Y-axis direction. A multilayer substrate according to any one of claims 1 to 3.

8. The width of the first opening in the Y-axis direction is greater than the width of the first opening in the X-axis direction. A multilayer substrate according to any one of claims 1 to 3.

9. The width of the first opening in the Y-axis direction is more than half the distance between the negative Y-axis end of the second interlayer connecting conductor and the positive Y-axis end of the fifth interlayer connecting conductor. A multilayer substrate according to any one of claims 1 to 3.

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