Detergent composition, undiluted solution for detergent composition, cleaning method, and method for manufacturing a circuit board

Abstract

To provide a novel cleaning agent composition that exhibits excellent cleaning properties for flux residues, particularly water-soluble flux residues, as well as excellent cleaning properties for metal salts that are poorly soluble in water, and suppresses corrosion of solder metal. [Solution] A detergent composition comprising an amine (A) having an octanol / water partition coefficient (logP) of less than 1, at least one organophosphorus compound (B) selected from the group consisting of acidic phosphate esters (B1), organic phosphonic acids (B2), and salts thereof, and water (C), wherein the content of the amine (A) is 0.1% by mass or more and less than 10% by mass based on 100% by mass of the detergent composition, and the content of the water (C) is 90% by mass or more and less than 99.9% by mass based on 100% by mass of the detergent composition.

Description

[Technical Field]

[0001] The present invention relates to a cleaning agent composition, a stock solution for the cleaning agent composition, a cleaning method, and a method for manufacturing a circuit board. [Background technology]

[0002] When surface-mounting electronic components onto printed circuit boards, soldering is generally used. Typically, flux is used during soldering to remove oxide films from the solder and base material surfaces, or to prevent re-oxidation of the solder and base material surfaces, thereby ensuring sufficient solderability. However, flux is corrosive, and flux residue degrades the quality of the printed circuit board. Therefore, flux residue is sometimes removed by washing.

[0003] Conventionally, rosin-based fluxes (rosin fluxes) have been widely used for soldering surface-mount components, and cleaning agents containing polyoxyalkylene alkyl ether-based non-halogenated organic solvents have been proposed as cleaning agents for rosin flux residue, as they have excellent dissolving power for rosin flux residue (Patent Document 1).

[0004] However, as one measure to address environmental issues, washing flux residue with water is also being considered, and water-soluble fluxes, such as polyether resins to which surfactants and solvents have been added, have been proposed as fluxes that can be washed with water. Since the residue of water-soluble flux is hygroscopic, washing is essential, and it is usually washed with water, but the cleaning effect may not be sufficient. In such cases, it is conceivable to use cleaning agents such as those described in Patent Document 1 as cleaning agents for water-soluble flux residue, or to use cleaning agents proposed for water-soluble flux (Patent Document 2). [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] International Publication No. 2009 / 020199 [Patent Document 2] Japanese Patent Publication No. 2017-119782 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] However, even when using the rosin flux cleaning agent described in Patent Document 1, it can be difficult to thoroughly clean water-soluble flux residue. Furthermore, the water-soluble flux cleaning agent described in Patent Document 2 contains strongly alkaline components such as sodium hydroxide and potassium hydroxide, which can cause corrosion of the solder metal. In addition, soldering with water-soluble flux can generate metal salts that are poorly soluble in water, and it can be difficult to remove such metal salts with water or conventional water-soluble flux cleaning agents.

[0007] The present invention aims to provide a novel cleaning agent composition that exhibits excellent cleaning properties for flux residues, particularly water-soluble flux residues, as well as excellent cleaning properties for metal salts that are poorly soluble in water, and that suppresses corrosion of solder metal. [Means for solving the problem]

[0008] As a result of diligent research to achieve the above objectives, the inventors have found that the above objectives can be solved by a detergent composition containing a predetermined amount of an amine that satisfies specific parameters, a predetermined organophosphorus compound, and water.

[0009] This disclosure provides the following items:

[0010] (Item 1) Amine (A) whose octanol / water partition coefficient (logP) is less than 1, At least one organophosphorus compound (B) selected from the group consisting of acidic phosphate esters (B1), organic phosphonic acids (B2), and salts thereof, and A detergent composition containing water (C), The content of the amine (A) is 0.1% by mass or more and less than 10% by mass based on 100% by mass of the detergent composition, The content of the water (C) is 90% by mass or more and less than 99.9% by mass based on 100% by mass of the detergent composition, Detergent composition.

[0011] (Item 2) Furthermore, the detergent composition according to Item 1 above, which contains a glycol ether (D).

[0012] (Item 3) The detergent composition according to Item 1 or 2 above, wherein the content of the glycol ether (D) is less than 10% by mass based on 100% by mass of the detergent composition.

[0013] (Item 4) Furthermore, the detergent composition according to any one of Items 1 to 3 above, which contains a surfactant.

[0014] (Item 5) The detergent composition according to any one of Items 1 to 4 above, wherein the pH (25 °C) of the detergent composition is 8.5 to 10.5.

[0015] (Item 6) The detergent composition according to any one of Items 1 to 5 above, which is used for removing water-soluble flux residues.

[0016] (Item 7) It is a stock solution for a detergent composition for producing the detergent composition according to any one of Items 1 to 6 above by diluting with water, <00​​​​​​​​The water (C) content is 10 to 95% by mass, based on 100% by mass of the detergent composition. Concentrated solution for detergent compositions.

[0017] (Item 8) A cleaning method comprising the step of bringing an object to be cleaned, to which the object to be cleaned is attached, into contact with a cleaning agent composition described in any one of items 1 to 6 above, thereby removing the object to be cleaned.

[0018] (Item 9) The cleaning method according to item 8 above, wherein the object to be cleaned is a water-soluble flux residue.

[0019] (Item 10) The process of connecting electronic components to a circuit board by soldering, and At least one step selected from the steps of forming solder bumps on a circuit board for connecting the aforementioned electronic components, and The process includes cleaning at least one selected from the circuit board to which the electronic components are connected and the circuit board on which the solder bumps are formed, using the cleaning method described in item 8 or 9 above. A method for manufacturing circuit boards.

[0020] In this disclosure, one or more of the features described above may be provided in combinations other than those explicitly stated. [Effects of the Invention]

[0021] The cleaning agent composition provided in this disclosure exhibits excellent cleaning properties against flux residues, and is particularly excellent against water-soluble flux residues. Furthermore, the cleaning agent composition provided in this disclosure suppresses corrosion to solder metals, making it suitable for cleaning soldered articles. In addition, the cleaning agent composition provided in this disclosure exhibits excellent cleaning properties against water-insoluble metal salts formed during soldering. [Modes for carrying out the invention]

[0022] Throughout this specification, the ranges of numerical values ​​such as physical properties and content may be set as appropriate (for example, by selecting from the values ​​listed in each item below). Specifically, if the examples of numerical value α are A3, A2, and A1 (A3 > A2 > A1), the range of numerical value α may include, for example, A3 or less, A2 or less, less than A3, less than A2, A1 or more, A2 or more, greater than A1, greater than A2, A1 to A2 (A1 or more and A2 or less), A1 to A3, A2 to A3, A1 or more and less than A3, A1 or more and less than A2, A2 or more and less than A3, greater than A1 and less than A3, greater than A1 and less than A2, greater than A2 and less than A3, greater than A1 and A3 or less, greater than A1 and A2 or less, greater than A2 and A3 or less. In this specification, "~" is used to mean that the numerical values ​​listed before and after it are included as the lower limit and upper limit. The components and manufacturing methods of the present invention will be described in detail below.

[0023] As long as the problems of the present invention are solved, the components, conditions, numerical values, etc., are not particularly limited.

[0024] "αβ amount (A / B)" means the amount of β (α) of A relative to 100α of B. α can be expressed as mass%, mole%, or parts by mass, for example. β amount can be expressed as content, amount used, for example. "Mass% content (A / B)" means the content (mass%) of A relative to 100% mass of B.

[0025] "γ ratio (A / B)" refers to the γ ratio calculated using the formula "A ÷ B". Examples of γ ratios include mass ratios and molar ratios.

[0026] [Detergent composition] This disclosure relates to a detergent composition comprising an amine (A) (hereinafter referred to as component (A)) having an octanol / water partition coefficient (logP) of less than 1, an organophosphorus compound (B) (hereinafter referred to as component (B)), and water (C) (hereinafter referred to as component (C)).

[0027] <Amine (A)> (A) Any known amine having an octanol / water partition coefficient (logP) of less than 1 can be used without particular restriction. (A) may be used alone or in combination of two or more.

[0028] The octanol / water partition coefficient (logP) (hereinafter referred to as logP) is "the ratio of the concentration of a substance in octanol to the concentration of a substance in water when the substance is dissolved in a mixture of octanol and water," and is an indicator of the hydrophilicity (or hydrophobicity) of a substance. A smaller value indicates a tendency towards higher hydrophilicity.

[0029] LogP values ​​(or logPow, logKow) for many compounds have been reported, and many values ​​are listed and can be referenced in databases such as the Pomona 92 ​​database available from Daylight Chemical Information Systems, Inc., the GHS-compliant model label and model SDS information published on the Ministry of Health, Labour and Welfare's "Workplace Safety Site" website, the International Chemical Safety Cards (ICSC) published on the National Institute of Health Sciences website, and Chemical Book (https: / / www.chemicalbook.com / ProductIndex_JP.aspx). In addition, the logP value of organic compounds can also be obtained by measurement in accordance with JIS Z7260-107 (2000) or JIS Z7260-117 (2006).

[0030] The cleaning agent composition of this disclosure, by containing component (A), exhibits excellent cleaning properties against flux residues, particularly water-soluble flux residues. Although the details are unclear, it is presumed that component (A) has a low logP value and high hydrophilicity, resulting in a high affinity for water-soluble flux residues and thus enhancing the cleaning performance of the cleaning agent composition against water-soluble flux residues.

[0031] Furthermore, the cleaning agent composition of this disclosure contains component (A), which has lower metal corrosiveness compared to the strongly alkaline components contained in conventionally known water-soluble flux cleaning agents, thereby suppressing corrosion to solder metal while providing high cleaning performance for flux residue.

[0032] (A) Examples of component (A) include alkanolamines with logP less than 1, polyamines with logP less than 1, and diaminoalkyl ethers with logP less than 1.

[0033] The above alkanolamines include, for example, ethanolamine (logP=-1.91), N-methylethanolamine (logP=-0.91), N-ethylethanolamine (logP=-0.66), Nn-butylethanolamine (logP=0.64), propanolamine (logP=-1.1), isopropanolamine (logP=-0.93), 2-amino-2-methyl-1-propanol (logP=-0.63), N,N-dimethylethanolamine (logP=-0.55), N,N-diethylethanolamine (logP=0.21), and N,N-dimethylpropanol. Examples include ruamine (logP=-2.59), N,N-dimethylisopropanolamine (logP=-0.12), diethanolamine (logP=-2.46), N-methyldiethanolamine (logP=-1.16), Nn-butyldiethanolamine (logP=0.58), Nt-butyldiethanolamine (logP=0.1), triethanolamine (logP=-2.3), diisopropanolamine (logP=-0.79), triisopropanolamine (logP=-0.015), and N-(β-aminoethyl)ethanolamine (logP=-1.46).

[0034] Examples of the polyamines mentioned above include 1,2-diaminopropane (logP=-1.2), N,N,N',N'-tetramethylethylenediamine (logP=-0.13), N,N-dimethyl-1,3-propanediamine (logP=-0.352), N,N,N',N'-tetramethyl-1,3-diaminopropane (logP=0.36), N,N,N',N'-tetramethyl-4-azaheptan-1,7-diamine (logP=0.214), N,N'-bis(3-aminopropyl)tetramethylenediamine (logP=-0.543), and N,N,N',N'',N''-pentamethyldiethylenetriamine (logP=-2.1).

[0035] Examples of the above-mentioned diaminoalkyl ethers include bis(2-dimethylaminoethyl) ether (logP=-0.34).

[0036] In one embodiment, component (A) is preferably an alkanolamine having a logP of less than 1, from the viewpoint of superior cleaning properties against flux residue, and more preferably, from the same viewpoint, at least one selected from the group consisting of Nn-butyldiethanolamine, 2-amino-2-methyl-1-propanol, Nn-butylethanolamine, and N-methyldiethanolamine.

[0037] The content of component (A) in the above-mentioned detergent composition is not particularly limited. Examples of the content of component (A) in the above-mentioned detergent composition include 10% by mass, 9% by mass, 8% by mass, 7% by mass, 6% by mass, 5% by mass, 4% by mass, 3% by mass, 2% by mass, 1% by mass, 0.95% by mass, 0.9% by mass, 0.85% by mass, 0.8% by mass, 0.75% by mass, 0.7% by mass, 0.65% by mass, 0.6% by mass, 0.55% by mass, 0.5% by mass, 0.45% by mass, 0.4% by mass, 0.35% by mass, 0.3% by mass, 0.25% by mass, 0.2% by mass, 0.15% by mass, and 0.1% by mass, based on 100% by mass of the detergent composition.

[0038] In one embodiment, the content of component (A) in the above-mentioned cleaning agent composition is preferably 0.1% by mass or more, based on 100% by mass of the cleaning agent composition, from the viewpoint of superior cleaning performance against flux residue. In one embodiment, the content of component (A) in the above-mentioned cleaning agent composition is preferably less than 10% by mass, based on 100% by mass of the cleaning agent composition, from the viewpoint of further suppressing corrosion to solder metal.

[0039] In one embodiment, the content of component (A) in the above-mentioned cleaning agent composition is preferably 0.1% by mass or more and less than 10% by mass, based on 100% by mass of the cleaning agent composition, in order to have better cleaning performance against flux residue and to further suppress corrosion against solder metal.

[0040] <Organophosphorus compounds (B)> Component (B) is not particularly limited as long as it is at least one selected from the group consisting of acidic phosphate esters (B1) (hereinafter referred to as component (B1)), organic phosphonic acids (B2) (hereinafter referred to as component (B2)), and salts thereof, and various known components can be used. Component (B) may be used alone or in combination of two or more.

[0041] The cleaning agent composition of this disclosure, by containing component (B), suppresses corrosion of the solder metal. Although the details are unclear, it is presumed that the phosphate structure or phosphonic acid structure in component (B) coordinates (or bonds) to the solder metal, and the organic structures such as ester groups and hydrocarbon groups in component (B) cover the surface of the solder metal, thereby suppressing corrosion of the solder metal.

[0042] Furthermore, the cleaning agent composition of this disclosure, by including component (B), exhibits excellent cleaning properties against water-soluble flux residues. Moreover, the cleaning agent composition of this disclosure, by including component (B), can also remove water-insoluble metal salts formed during soldering, thus exhibiting excellent cleaning properties.

[0043] The cleaning agent compositions of this disclosure tend to have poor cleaning properties when an acidic inorganic phosphorus compound (e.g., orthophosphoric acid) or an organic polycarboxylic acid (e.g., citric acid) is used instead of component (B).

[0044] Furthermore, even if component (B) is a salt, the corrosion inhibitory properties of the cleaning agent composition on solder metal and the cleaning properties on flux residue are just as excellent as those of component (B) if it is not a salt.

[0045] (Acidic phosphate ester (B1)) Component (B1) is not particularly limited as long as it is an acidic phosphate ester, and various known components can be used. Component (B1) may be used alone or in combination of two or more. Note that an acidic phosphate ester means a phosphate ester having at least one hydroxyl group (-OH) bonded to the phosphorus atom in the phosphate group.

[0046] (B1) Component may include, for example, a compound represented by the following general formula (1).

[0047] [ka]

[0048] (In formula (1), R 1 represents a linear or branched alkyl group having 1 to 24 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms, and n represents an integer from 0 to 20. X is a hydroxyl group or general formula (2):R 2 O-(CH2CH2O) m -(In formula (2), R 2 (where m represents a group that is a linear or branched alkyl group having 1 to 24 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms, and m is an integer from 0 to 20.)

[0049] In one embodiment, R in the above general formulas (1) and (2) 1 and R2 In terms of more effectively suppressing corrosion against the solder metal, the number of carbon atoms of [it] is preferably 4 or more, more preferably 6 or more, still more preferably 8 or more, and even more preferably 10 or more. In one embodiment, R in the general formulas (1) and (2) 1 and R 2 In terms of more excellent cleaning property against the flux residue, the number of carbon atoms of [it] is preferably 21 or less, more preferably 18 or less, still more preferably 16 or less, even more preferably 14 or less, and even more preferably 12 or less. In one embodiment, R in the general formulas (1) and (2) 1 and R 2 In terms of more excellent cleaning property against the flux residue and more effectively suppressing corrosion against the solder metal, the number of carbon atoms of [it] is preferably 4 to 21, more preferably 4 to 18, still more preferably 4 to 16, even more preferably 4 to 14, and even more preferably 4 to 12.

[0050] In one embodiment, R in the general formulas (1) and (2) 1 and R 2 In terms of more excellent cleaning property against the flux residue and more effectively suppressing corrosion against the solder metal, preferably, [they] are linear or branched alkyl groups having 4 to 21 carbon atoms, more preferably linear or branched alkyl groups having 4 to 18 carbon atoms, still more preferably linear or branched alkyl groups having 4 to 16 carbon atoms, even more preferably linear or branched alkyl groups having 4 to 14 carbon atoms, and even more preferably linear or branched alkyl groups having 4 to 12 carbon atoms.

[0051] In one embodiment, n and m in the above general formulas (1) and (2) are preferably 0 or more, more preferably 3 or more, and even more preferably 4 or more, from the viewpoint of superior cleaning performance against flux residue. In one embodiment, n and m in the above general formulas (1) and (2) are preferably 16 or less, more preferably 14 or less, even more preferably 12 or less, and even more preferably 10 or less, from the viewpoint of superior cleaning performance against flux residue. In one embodiment, n and m in the above general formulas (1) and (2) are preferably 0 to 16, more preferably 0 to 14, even more preferably 3 to 14, even more preferably 4 to 12, and even more preferably 4 to 10, from the viewpoint of superior cleaning performance against flux residue.

[0052] The salt of component (B1) is not particularly limited, and various known salts can be used. Examples of salts of component (B1) include metal salts of component (B1), such as sodium salts and potassium salts of component (B1), ammonium salts of component (B1), and alkanolamine salts of component (B1).

[0053] (Organophosphonic acid (B2)) (B2) The component is not particularly limited as long as it is an organic phosphonic acid, and various known components can be used. (B2) Component may be used alone or in combination of two or more components.

[0054] (B2) Examples of components include compounds represented by the following general formula (3), alkylenediphosphonic acid, alkylaminophosphonic acid, hydroxyalkylphosphonic acid, 3-phosphonopropionic acid, LO-phosphoserine, 2-phosphonobutane-1,2,4-tricarboxylic acid, etc.

[0055] [ka]

[0056] (In formula (3), R 3(This refers to a linear or branched alkyl group having 1 to 24 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms.)

[0057] In one embodiment, R in the above general formula (3) 3 The number of carbon atoms is preferably 5 or more, more preferably 6 or more, and even more preferably 8 or more, from the viewpoint of further suppressing corrosion of the solder metal. In one embodiment, R in the above general formula (3) 3 The number of carbon atoms is preferably 21 or less, more preferably 18 or less, even more preferably 16 or less, and even more preferably 14 or less, from the viewpoint of superior cleaning performance against flux residue. In one embodiment, R in the above general formula (3) 3 The number of carbon atoms is preferably 5 to 21, more preferably 6 to 18, and even more preferably 8 to 14, from the standpoint of having better cleaning properties for flux residue and better suppression of corrosion to solder metal.

[0058] In one embodiment, R in the above general formula (3) 3 Preferably, linear or branched alkyl groups and phenyl groups having 5 to 21 carbon atoms are used, more preferably linear or branched alkyl groups and phenyl groups having 6 to 18 carbon atoms are used, and even more preferably linear or branched alkyl groups and phenyl groups having 8 to 14 carbon atoms are used.

[0059] Examples of the alkylenediphosphonic acids mentioned above include methylenediphosphonic acid, 1,2-ethylenediphosphonic acid, 1,3-propylenediphosphonic acid, 1,4-butylenediphosphonic acid, 1,5-pentylenediphosphonic acid, or 1,6-hexylenediphosphonic acid.

[0060] Examples of the alkylaminophosphonic acids mentioned above include N,N,N',N'-tetrakis(phosphonomethyl)ethylenediamine, aminotrimethylenephosphonic acid, diethylenetriaminepentamethylenephosphonic acid, and alendronic acid.

[0061] Examples of the hydroxyalkylphosphonic acid mentioned above include hydroxyethanediphosphonic acid.

[0062] In one embodiment, component (B2) is preferably a compound represented by the above general formula (3) because it has better cleaning properties for flux residue and better suppression of corrosion to solder metal, and more preferably, for the same reason, at least one selected from the group consisting of hexylphosphonic acid, octylphosphonic acid, and decylphosphonic acid.

[0063] The salt of component (B2) is not particularly limited, and various known salts can be used. Examples of salts of component (B2) include metal salts of component (B2), such as sodium salts and potassium salts of component (B2), ammonium salts of component (B2), and alkanolamine salts of component (B2).

[0064] The content of component (B) in the above-mentioned detergent composition is not particularly limited. Examples of the content of component (B) in the above-mentioned detergent composition include 10% by mass, 9% by mass, 8% by mass, 7% by mass, 6% by mass, 5% by mass, 4% by mass, 3% by mass, 2% by mass, 1% by mass, 0.9% by mass, 0.8% by mass, 0.7% by mass, 0.6% by mass, 0.5% by mass, 0.4% by mass, 0.3% by mass, 0.2% by mass, 0.1% by mass, 0.09% by mass, 0.08% by mass, 0.07% by mass, 0.06% by mass, 0.05% by mass, etc., based on 100% by mass of the detergent composition.

[0065] In one embodiment, the content of component (B) in the above cleaning agent composition is preferably 0.05% by mass or more per 100% by mass of the cleaning agent composition, more preferably 0.1% by mass or more, and even more preferably 0.2% by mass or more, from the same viewpoint as providing superior cleaning performance against flux residue and further suppression of corrosion to solder metal. In one embodiment, the content of component (B) in the above cleaning agent composition is preferably 10% by mass or less per 100% by mass of the cleaning agent composition, more preferably 5% by mass or less, from the same viewpoint as providing further suppression of corrosion to solder metal.

[0066] In one embodiment, the content of component (B) in the above-mentioned cleaning agent composition is preferably 0.05% to 10% by mass, based on 100% by mass of the cleaning agent composition, from the viewpoint of having better cleaning performance against flux residue and better suppression of corrosion against solder metal, more preferably 0.1% to 5% by mass, and even more preferably about 0.2% to 5% by mass, from the viewpoint of having better cleaning performance against flux residue and better suppression of corrosion against solder metal.

[0067] <Water(C)> (C) Component is not particularly limited as long as it is water, and various known types can be used. (C) Component may be used alone or in combination of two or more types.

[0068] The cleaning agent composition of this disclosure, by including component (C), exhibits excellent cleaning properties against water-soluble flux residues.

[0069] (C) Component may include, for example, ultrapure water, pure water, ion-exchanged water, purified water, etc.

[0070] The content of component (C) in the above-mentioned detergent composition is not particularly limited. Examples of the content of component (C) in the above-mentioned detergent composition include 99.9% by mass, 99.5% by mass, 99% by mass, 98.5% by mass, 98% by mass, 97.5% by mass, 97% by mass, 96.5% by mass, 96% by mass, 95.5% by mass, 95% by mass, 94.5% by mass, 94% by mass, 93.5% by mass, 93% by mass, 92.5% by mass, 92% by mass, 91.5% by mass, 91% by mass, 90.5% by mass, 90% by mass, etc., based on 100% by mass of the detergent composition.

[0071] In one embodiment, the content of component (C) in the above-mentioned detergent composition is preferably 90% by mass or more, based on 100% by mass of the detergent composition, from the viewpoint of superior cleaning performance against water-soluble flux residue. In one embodiment, the content of component (C) in the above-mentioned detergent composition is preferably less than 99.9% by mass, based on 100% by mass of the detergent composition, from the viewpoint of superior cleaning performance against water-soluble flux residue.

[0072] In one embodiment, the content of component (C) in the above-mentioned detergent composition is preferably 90% by mass or more and less than 99.9% by mass, based on 100% by mass of the detergent composition, from the viewpoint of having superior cleaning performance against water-soluble flux residue.

[0073] When the content of component (C) in the above-mentioned detergent composition is less than 90% by mass relative to 100% by mass of the detergent composition, the cleaning performance against water-soluble flux residue tends to be insufficient.

[0074] (Glycol ether (D)) In one embodiment, the detergent composition may optionally contain a glycol ether (D) (hereinafter referred to as component (D)), provided that it does not impair the effects of the present disclosure.

[0075] It is presumed that the cleaning agent composition of this disclosure, by including component (D), has better dispersibility of components (A) and (B) in component (C), and thus has better cleaning performance against flux residue.

[0076] Component (D) is not particularly limited as long as it is a glycol ether, and various known types can be used. Component (D) may be used alone or in combination of two or more types.

[0077] Component (D) may include, for example, aliphatic glycol ethers, aromatic glycol ethers, etc. The aliphatic glycol ethers and aromatic glycol ethers are not particularly limited, and various known types can be used.

[0078] Component (D) is preferably a compound represented by the following general formula (4) because it exhibits superior dispersibility of components (A) and (B) in component (C).

[0079] [ka]

[0080] (In formula (4), R 4 R 5 X is a methyl group or hydrogen atom. 1 (where 'a' represents an alkyl group or hydrogen atom with 1 to 4 carbon atoms, and 'a' represents an integer from 1 to 4.)

[0081] Examples of compounds represented by the above general formula (4) include ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, triethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, dipropylene glycol monoalkyl ether, tripropylene glycol monoalkyl ether, ethylene glycol dialkyl ether, diethylene glycol dialkyl ether, triethylene glycol dialkyl ether, propylene glycol dialkyl ether, dipropylene glycol dialkyl ether, tripropylene glycol dialkyl ether, ethylene glycol monophenyl ether, propylene glycol monophenyl ether, ethylene glycol diphenyl ether, diethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, ethylene glycol dibenzyl ether, and diethylene glycol monobenzyl ether.

[0082] Examples of the ethylene glycol monoalkyl ethers mentioned above include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol monoisopropyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol monoisobutyl ether, ethylene glycol mono-t-butyl ether, ethylene glycol mono-n-pentyl ether, and ethylene glycol mono-n-hexyl ether.

[0083] Examples of the above-mentioned diethylene glycol monoalkyl ethers include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol monoisopropyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol monoisobutyl ether, diethylene glycol mono-t-butyl ether, diethylene glycol mono-n-pentyl ether, and diethylene glycol mono-n-hexyl ether.

[0084] Examples of the above-mentioned triethylene glycol monoalkyl ethers include triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol mono-n-propyl ether, triethylene glycol monoisopropyl ether, triethylene glycol mono-n-butyl ether, triethylene glycol monoisobutyl ether, triethylene glycol mono-t-butyl ether, triethylene glycol mono-n-pentyl ether, and triethylene glycol mono-n-hexyl ether.

[0085] Examples of the propylene glycol monoalkyl ethers mentioned above include propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol monoisopropyl ether, propylene glycol mono-n-butyl ether, propylene glycol monoisobutyl ether, propylene glycol mono-t-butyl ether, propylene glycol mono-n-pentyl ether, and propylene glycol mono-n-hexyl ether.

[0086] Examples of the above-mentioned dipropylene glycol monoalkyl ethers include dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol monoisopropyl ether, dipropylene glycol mono-n-butyl ether, dipropylene glycol monoisobutyl ether, dipropylene glycol mono-t-butyl ether, dipropylene glycol mono-n-pentyl ether, and dipropylene glycol mono-n-hexyl ether.

[0087] Examples of the above-mentioned tripropylene glycol monoalkyl ethers include tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, tripropylene glycol mono-n-propyl ether, tripropylene glycol monoisopropyl ether, tripropylene glycol mono-n-butyl ether, tripropylene glycol monoisobutyl ether, tripropylene glycol mono-t-butyl ether, tripropylene glycol mono-n-pentyl ether, and tripropylene glycol mono-n-hexyl ether.

[0088] Examples of the above-mentioned ethylene glycol dialkyl ethers include ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol di-n-butyl ether, ethylene glycol diisobutyl ether, ethylene glycol di-t-butyl ether, ethylene glycol ethyl methyl ether, ethylene glycol methyl propyl ether, ethylene glycol methyl n-propyl ether, ethylene glycol methyl isopropyl ether, ethylene glycol methyl butyl ether, ethylene glycol methyl isobutyl ether, ethylene glycol methyl t-butyl ether, ethylene glycol methyl n-pentyl ether, ethylene glycol methyl n-hexyl ether, ethylene glycol ethyl propyl ether, ethylene glycol ethyl n-propyl ether, and ethylene glycol ethyl isopropyl ether.

[0089] Examples of the above-mentioned diethylene glycol dialkyl ethers include diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol di-n-butyl ether, diethylene glycol diisobutyl ether, diethylene glycol di-t-butyl ether, diethylene glycol ethyl methyl ether, diethylene glycol methyl propyl ether, diethylene glycol methyl n-propyl ether, diethylene glycol methyl isopropyl ether, diethylene glycol methyl butyl ether, diethylene glycol methyl isobutyl ether, diethylene glycol methyl t-butyl ether, diethylene glycol ethyl propyl ether, diethylene glycol ethyl n-propyl ether, and diethylene glycol ethyl isopropyl ether.

[0090] Examples of the above-mentioned triethylene glycol dialkyl ethers include triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol di-n-butyl ether, triethylene glycol diisobutyl ether, triethylene glycol di-t-butyl ether, triethylene glycol ethyl methyl ether, triethylene glycol methyl propyl ether, triethylene glycol methyl n-propyl ether, triethylene glycol methyl isopropyl ether, triethylene glycol methyl butyl ether, triethylene glycol methyl isobutyl ether, triethylene glycol methyl t-butyl ether, triethylene glycol methyl n-pentyl ether, triethylene glycol ethyl propyl ether, triethylene glycol ethyl n-propyl ether, triethylene glycol ethyl isopropyl ether, triethylene glycol ethyl butyl ether, triethylene glycol ethyl isobutyl ether, triethylene glycol ethyl t-butyl ether, and triethylene glycol ethyl n-pentyl ether.

[0091] Examples of the propylene glycol dialkyl ethers mentioned above include propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol di-n-propyl ether, propylene glycol diisopropyl ether, propylene glycol di-n-butyl ether, propylene glycol diisobutyl ether, propylene glycol di-t-butyl ether, propylene glycol ethyl methyl ether, propylene glycol methyl propyl ether, propylene glycol methyl n-propyl ether, propylene glycol methyl isopropyl ether, propylene glycol methyl butyl ether, propylene glycol methyl isobutyl ether, propylene glycol methyl t-butyl ether, propylene glycol ethyl propyl ether, propylene glycol ethyl n-propyl ether, propylene glycol ethyl isopropyl ether, propylene glycol ethyl butyl ether, propylene glycol ethyl isobutyl ether, and propylene glycol ethyl t-butyl ether.

[0092] Examples of the above-mentioned dipropylene glycol dialkyl ethers include dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol di-n-propyl ether, dipropylene glycol diisopropyl ether, dipropylene glycol di-n-butyl ether, dipropylene glycol diisobutyl ether, dipropylene glycol di-t-butyl ether, dipropylene glycol ethyl methyl ether, dipropylene glycol methyl propyl ether, dipropylene glycol methyl n-propyl ether, dipropylene glycol methyl isopropyl ether, dipropylene glycol methyl butyl ether, dipropylene glycol methyl isobutyl ether, dipropylene glycol methyl t-butyl ether, dipropylene glycol ethyl propyl ether, dipropylene glycol ethyl n-propyl ether, dipropylene glycol ethyl isopropyl ether, dipropylene glycol ethyl butyl ether, dipropylene glycol ethyl isobutyl ether, and dipropylene glycol ethyl t-butyl ether.

[0093] Examples of the above-mentioned tripropylene glycol dialkyl ethers include tripropylene glycol dimethyl ether, tripropylene glycol diethyl ether, tripropylene glycol di-n-propyl ether, tripropylene glycol diisopropyl ether, tripropylene glycol di-n-butyl ether, tripropylene glycol diisobutyl ether, tripropylene glycol di-t-butyl ether, tripropylene glycol ethyl methyl ether, tripropylene glycol methyl propyl ether, tripropylene glycol methyl n-propyl ether, tripropylene glycol methyl isopropyl ether, tripropylene glycol methyl butyl ether, tripropylene glycol methyl isobutyl ether, tripropylene glycol methyl t-butyl ether, tripropylene glycol ethyl propyl ether, tripropylene glycol ethyl n-propyl ether, tripropylene glycol ethyl isopropyl ether, tripropylene glycol ethyl butyl ether, tripropylene glycol ethyl isobutyl ether, and tripropylene glycol ethyl t-butyl ether.

[0094] In one embodiment, component (D) is preferably a glycol ether having a solubility in water of more than 10% by mass at 20°C, given that it exhibits superior dispersibility of components (A) and (B) in component (C).

[0095] In one embodiment, component (D) is selected from the group consisting of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monoisopropyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol monoisobutyl ether, ethylene glycol mono-t-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, dipropylene glycol monomethyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol mono-n-propyl ether, triethylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, dipropylene glycol dimethyl ether, triethylene glycol ethyl methyl ether, triethylene glycol diethyl ether, and tripropylene glycol dimethyl ether, in order to provide better dispersibility of components (A) and (B) in component (C).

[0096] The content of component (D) in the above-mentioned detergent composition is not particularly limited. Examples of the content of component (D) in the above-mentioned detergent composition include 10% by mass, 9% by mass, 8% by mass, 7% by mass, 6% by mass, 5% by mass, 4% by mass, 3% by mass, 2% by mass, 1% by mass, 0.9% by mass, 0.8% by mass, 0.7% by mass, 0.6% by mass, 0.5% by mass, 0.4% by mass, 0.3% by mass, 0.2% by mass, 0.1% by mass, 0.09% by mass, 0.08% by mass, 0.07% by mass, 0.06% by mass, 0.05% by mass, 0.04% by mass, 0.03% by mass, 0.02% by mass, 0.01% by mass, 0% by mass, etc., based on 100% by mass of the detergent composition.

[0097] In one embodiment, the content of component (D) in the above-mentioned detergent composition is preferably less than 10% by mass, and more preferably less than 5% by mass, based on 100% by mass of the detergent composition, from the viewpoint of better dispersibility of components (A) and (B) in component (C). In one embodiment, the content of component (D) in the above-mentioned detergent composition is preferably 0.01% by mass or more, based on 100% by mass of the detergent composition, from the viewpoint of better dispersibility of components (A) and (B) in component (C).

[0098] In one embodiment, the content of component (D) in the above-mentioned detergent composition is preferably less than 10% by mass relative to 100% by mass of the detergent composition, from the viewpoint of better dispersibility of components (A) and (B) in component (C), more preferably 0.01% by mass or more and less than 10% by mass, and even more preferably 0.01% by mass or more and less than 5% by mass.

[0099] When the content of component (D) in the above-mentioned detergent composition is 10% by mass or more relative to 100% by mass of the detergent composition, the cleaning performance against water-soluble flux residue tends to be insufficient.

[0100] (Other ingredients) In one embodiment, the above-mentioned cleaning agent composition may optionally contain components other than components (A) to (D) (hereinafter referred to as "other components"), provided that the effects of the present disclosure are not impaired. Examples of other components include organic solvents other than component (D), additives, etc.

[0101] (Organic solvents) Organic solvents are preferred because they have low toxicity to humans and are environmentally friendly; therefore, non-halogen solvents are preferred. Examples of such non-halogen solvents include hydrocarbon solvents, alcohol solvents, ketone solvents, ether solvents, ester solvents, and nitrogen-containing compound solvents. Organic solvents may be used individually or in combination of two or more types.

[0102] (Hydroxide-based solvents) Examples of the hydrocarbon solvents mentioned above include n-pentane, n-hexane, n-heptane, n-octane, n-nonane, n-decane, cyclopentane, methylcyclopentane, dodecylbenzene, diisopropylbenzene, tetraamylbenzene, dodecane, hexadecane, tetradecane, tetradecene, decalin, dimethyldecalin, diisopropylcyclohexane, butylcyclohexane, dodecylcyclohexane, dicyclohexylmethane, paramentane, pinan, myrcene, menthane, 1-decene, limonene, isononane, isodecane, isoundecane, isododecane, 2,2,4,6,6-pentamethylheptane, terpinene, and the like.

[0103] (Alcohol-based solvent) Examples of the above-mentioned alcohol-based solvents include methanol, ethanol, propanol, isopropanol, n-butanol, n-pentanol, n-hexanol, n-heptanol, 2-octanol, 2-methyl-1-butanol, 3-methyl-2-butanol, 4-methyl-2-pentanol, cyclohexanol, 2-ethylbutanol, 3,5-dimethyl-1-hexyn-3-ol, 3-heptanol, 2-heptanol, 2-ethylhexanol, tetrahydrofurfuryl alcohol, furfuryl alcohol, and benzyl alcohol.

[0104] (Ketone-based solvents) Examples of the ketone-based solvents mentioned above include acetone, methyl ethyl ketone, methyl isobutyl ketone, diethyl ketone, di-n-propyl ketone, diisopropyl ketone, diisobutyl ketone, ethyl-n-butyl ketone, methylhexyl ketone, methyl-n-amyl ketone, cyclohexanone, methylcyclohexanone, and methyl-n-hexyl ketone.

[0105] (Ether-based solvents) The above-mentioned ether-based solvents are ether-based solvents other than component (D) described above, and examples include diethyl ether, diisopropyl ether, ethyl-t-butyl ether, dibutyl ether, ethyl isoamyl ether, diisoamyl ether, vinyl methyl ether, vinyl ethyl ether, amylxylyl ether, hexyl ether, tetrahydrofuran, and the like.

[0106] (Ester-based solvents) Examples of the ester-based solvents mentioned above include ethyl acetate, methyl acetate, coconut oil fatty acid methyl ester, isopropyl myristate, 2-ethylhexyl stearate, methyl laurate, methyl oleate, isobutyl oleate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methoxy-3-methylbutyl acetate, propylene glycol diacetate, ethylene glycol monobutyl ether acetate, butyl lactate, methyl acetoacetate, ethyl acetoacetate, diethyl oxalate, octanoic acid ester, and the like.

[0107] (Nitrogen-containing compound solvent) Examples of the nitrogen-containing compound solvents mentioned above include 1,3-dimethyl-2-imidazolidinone, 1,3-diethyl-2-imidazolidinone, 1,3-dipropyl-2-imidazolidinone, N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylformamide.

[0108] (Additives) Specific examples of the above additives include rust inhibitors, surfactants, defoamers, antioxidants, chelating agents other than component (B), organic acids, amine compounds other than component (A), organophosphorus compounds other than component (B), etc. The above additives may be used individually or in combination of two or more types.

[0109] The surfactants mentioned above are not particularly limited, and various known surfactants can be used. Examples of the surfactants include nonionic surfactants other than component (D), anionic surfactants, cationic surfactants, amphoteric surfactants, etc. The surfactants may be used individually or in combination of two or more.

[0110] The above nonionic surfactant is, for example, one of the general formulas (5):R 6 -O-(CH2-CH2-O)eH (wherein R 6 Examples include compounds represented by (where e represents an alkyl group with 8 to 20 carbon atoms, and e represents an integer from 0 to 20), ethylene oxide adducts of fatty acid amides, sorbitan fatty acid esters, sucrose fatty acid esters, fatty acid alkanolamides, and their corresponding polyoxypropylene-based surfactants and polyoxyalkyleneamine-based surfactants.

[0111] Examples of the above-mentioned anionic surfactants include sulfate ester-based anionic surfactants (sulfate salts of higher alcohols, alkyl sulfate salts, polyoxyethylene alkyl sulfate salts, etc.) and sulfonate-based anionic surfactants (alkyl sulfonates, alkylbenzene sulfonates, etc.).

[0112] Examples of the cationic surfactants mentioned above include alkylated ammonium salts and quaternary ammonium salts.

[0113] Examples of the above-mentioned amphoteric surfactants include amino acid-type and betaine-type amphoteric surfactants.

[0114] The amount of the surfactant is not particularly limited, but it is preferably 0 to 15% by mass, and more preferably 0.1 to 10% by mass, based on 100% by mass of the detergent composition, in order for the detergent composition to exhibit excellent cleaning properties and to sufficiently remove copper oxide films.

[0115] The chelating agent is not particularly limited as long as it is a metal chelating agent that has the ability to coordinate to metal ions other than component (B), and various known ones can be used. Examples of the chelating agent include carboxylic acid chelating agents, amino acid chelating agents, phosphate chelating agents, aminocarboxylic acid chelating agents, and hydroxycarboxylic acid chelating agents. These chelating agents may be salts of sodium salts, potassium salts, ammonium salts, etc., or hydrolyzable ester derivatives. The chelating agents may be used individually or in combination of two or more.

[0116] Examples of the carboxylic acid-based chelating agents mentioned above include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, itaconic acid, acetylsalicylic acid, phthalic acid, trimellitic acid, and cyclopentanetetracarboxylic acid.

[0117] Examples of the above-mentioned amino acid-based chelating agents include glycine, alanine, lysine, arginine, asparagine, and tyrosine.

[0118] Examples of the phosphate-based chelating agents mentioned above include orthophosphate, pyrophosphate, triphosphate, and polyphosphate.

[0119] Examples of the above-mentioned aminocarboxylic acid-based chelating agents include ethylenediaminetetraacetic acid (EDTA), cyclohexanediaminetetraacetic acid (CDTA), nitrilotriacetic acid (NTA), diethylenetriaminepentaacetic acid (DTPA), iminodiacetic acid (IDA), N-(2-hydroxyethyl)iminodiacetic acid (HIMDA), and hydroxyethylethylenediaminetriacetic acid (HEDTA).

[0120] Examples of the hydroxycarboxylic acid chelating agents mentioned above include malic acid, citric acid, isocitric acid, glycolic acid, gluconic acid, salicylic acid, tartaric acid, and lactic acid.

[0121] The above amine compounds are not particularly limited as long as they are not component (A), and various known compounds can be used. Examples of the above amine compounds include aliphatic amines, alkanolamines, and tertiary diamines. These amine compounds may also be salts. The above amine compounds may be used individually or in combination of two or more.

[0122] Examples of the above-mentioned aliphatic amines include primary aliphatic amines such as octylamine, decylamine, dodecylamine, tetradecylamine, hexadecylamine, and 2-ethylhexylamine, and tertiary diamines such as N,N,N',N'-tetramethylhexamethylenediamine, N,N,N',N'-tetraethylhexamethylenediamine, N,N,N',N'-tetraisopropylhexamethylenediamine, and N,N,N',N'-tetra-n-propylhexamethylenediamine.

[0123] Examples of the above-mentioned alkanolamines include N,N-di-n-butylethanolamine, N-cyclohexyldiethanolamine, and 3-amino-4-octanol.

[0124] The organophosphorus compounds mentioned above are not particularly limited as long as they are not component (B), and various known compounds can be used. Examples of the organophosphorus compounds include phosphate esters and phosphite esters other than component (B). These organophosphorus compounds may also be salts. The organophosphorus compounds may be used individually or in combination of two or more.

[0125] Examples of the above-mentioned phosphate esters include trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, trihexyl phosphate, trioctyl phosphate, tridecyl phosphate, triundecyl phosphate, tridodecyl phosphate, tritridecyl phosphate, tristearyl phosphate, trioleyl phosphate, and triphenyl phosphate.

[0126] Examples of the above-mentioned phosphite esters include monomethyl phosphite, dimethyl phosphite, trimethyl phosphite, monoethyl phosphite, diethyl phosphite, triethyl phosphite, monopropyl phosphite, dipropyl phosphite, tripropyl phosphite, monobutyl phosphite, dibutyl phosphite, tributyl phosphite, monohexyl phosphite, dihexyl phosphite, trihexyl phosphite, monooctyl phosphite, dioctyl phosphite, trioctyl phosphite, monodecyl phosphite, didecyl phosphite, tridecyl phosphite, monoundecyl phosphite, diundecyl phosphite, triundecyl phosphite, monododecyl phosphite, didodecyl phosphite, tododecyl phosphite, monotridecyl phosphite, ditridecyl phosphite, tridecyl phosphite, monostearyl phosphite, distearyl phosphite, tristearyl phosphite, monooleyl phosphite, dioleyl phosphite, trioleyl phosphite, monophenyl phosphite, diphenyl phosphite, and triphenyl phosphite.

[0127] Furthermore, in the above-mentioned cleaning agent composition, the addition of an oxidizing agent is undesirable because it promotes metal corrosion. Examples of such oxidizing agents include hydrogen peroxide; other peracid compounds such as salts and acids containing anions of peroxomonosulfuric acid, perboric acid, perchloric acid, periodic acid, persulfuric acid, permanganic acid, and peracetic acid; and amine-N-oxides.

[0128] Further examples of oxidizing agents include FeCl3, FeF3, Fe(NO3)3, Sr(NO3)2, CoF3, MnF3, and ozone (2KHSO4). 5. KHSO 4.K7SO4), iodic acid, vanadium(V) oxide, vanadium(IV,V) oxide, ammonium vanadate, polyatomic salts of ammonium (e.g., ammonium peroxomonosulfate, ammonium chlorite (NH4ClO2), ammonium chlorate (NH4ClO3), ammonium iodate (NH4IO3), ammonium nitrate (NH4NO3), ammonium perborate (NH4BO3), ammonium perchlorate (NH4ClO4), ammonium periodate (NH4IO4), ammonium persulfate ((NH4)2S2O8), ammonium hypochlorite (NH4ClO)), ammonium tungstate ((NH4) 10H2(W2O7)), polyatotonic salts of sodium (e.g., sodium persulfate (Na2S2O8), sodium hypochlorite (NaClO), sodium perborate), polyatomic salts of potassium (e.g., potassium iodate (KIO3), potassium permanganate (KMnO4), potassium persulfate, nitric acid (HNO3), potassium persulfate (K2S2O8), potassium hypochlorite (KClO)), polyatomic salts of tetramethylammonium (e.g., tetramethylammonium chlorite ((N(CH3)4)ClO2), tetramethylammonium chlorate) ((N(CH3)4)ClO3), tetramethylammonium iodate ((N(CH3)4)IO3), tetramethylammonium perborate ((N(CH3)4)BO3), tetramethylammonium perchlorate ((N(CH3)4)ClO4), tetramethylammonium periodate ((N(CH3)4)IO4), tetramethylammonium persulfate ((N(CH3)4)S2O8)), polyatomic salts of tetrabutylammonium (e.g., tetrabutylammonium peroxomonosulfate), peroxotononosulfuric acid Examples of oxidizing agents include perbromic acid, ferric nitrate (Fe(NO3)3), hydrogen peroxide urea ((CO(NH2)2)H2O2), peracetic acid (CH3(CO)OOH), 1,4-benzoquinone, tolquinone, dimethyl-1,4-benzoquinone, chloranil, alloxane, N-methylmorpholine N-oxide, trimethylamine N-oxide, and combinations thereof. Other examples of oxidizing agents include perbromic acid, telluric acid trifluoroperacetic acid, m-chloroperbenzoic acid, t-butyl hydroperoxide, dibenzoyl peroxide, potassium peroxysulfate (e.g., Oxone® DuPont), methyl ethyl ketone peroxide, acetone peroxide, ethyl hydroperoxide, and cumene hydroperoxide.

[0129] In the above-described detergent composition, the method of blending components (A) to (D) and other components is not particularly limited, and a general liquid mixing method can be used. A specific blending method is the stirring method.

[0130] The physical properties of the above-mentioned cleaning agent composition are not particularly limited. In one embodiment, the pH of the cleaning agent composition at 25°C is preferably around 8.5 to 10.5, in that it more effectively suppresses corrosion of solder metal.

[0131] [Items to be washed] The target of cleaning in the above-mentioned cleaning agent composition is not particularly limited. Examples of targets of cleaning in the above-mentioned cleaning agent composition include soldering flux, solder paste, water-soluble flux residue, rosin flux residue, industrial oil, and metal shavings. In one embodiment, the target of cleaning in the above-mentioned cleaning agent composition is preferably either water-soluble flux residue or rosin flux residue, and more preferably water-soluble flux residue, from the viewpoint of excellent cleaning performance.

[0132] In this specification, "soldering flux" refers to a composition used to remove oxide films from the surfaces of solder and base materials (such as metal electrodes) and to facilitate the joining of the two. Generally, it contains a base resin, an activator, and an organic solvent, and may optionally contain thixotropic agents, antioxidants, and other additives. Soldering fluxes are further classified according to their composition and application into rosin flux, non-rosin flux, water-soluble flux, flux for solder paste, and non-solder paste fluxes such as flux for solder wire, post-flux, and pre-flux.

[0133] Examples of the base resin of the above rosin flux include rosin-based resins. Examples of rosin-based resins include natural rosin, rosin derivatives, and their purified products. Examples of natural rosin include gum rosin, tall oil rosin, and wood rosin. Examples of rosin derivatives include hydrides and disproportions of natural rosin; polymerized rosin, unsaturated acid-modified rosin, rosin esters, and hydrogenated unsaturated acid-modified rosin. The above polymerized rosin, the above unsaturated acid-modified rosin, and the above rosin esters can be produced using the above natural rosin, or the above hydrides or disproportions of natural rosin. Examples of polyhydric alcohols constituting the above rosin esters include glycerin and pentaerythritol. Examples of unsaturated acids constituting the above unsaturated acid-modified rosin include acrylic acid, fumaric acid, and maleic acid.

[0134] Examples of the base resins for the above-mentioned non-rosin flux include non-rosin-based resins. Examples of non-rosin-based resins include epoxy resins, acrylic resins, polyimide resins, nylon resins, polyacrylonitrile resins, vinyl chloride resins, vinyl acetate resins, polyolefin resins, fluororesins, ABS resins, isoprene rubber, styrene-butadiene rubber (SBR), butadiene rubber (BR), chloroprene rubber, nylon rubber, nylon elastomers, polyester elastomers, and the like.

[0135] Examples of the base resins of the above-mentioned water-soluble fluxes include polyethylene glycol, polypropylene glycol, copolymers thereof, derivatives thereof, polyglycerin ester compounds, triazine compounds, vinyl group-containing compounds, carboxyl group-containing compounds, epoxy group-containing compounds, and the like.

[0136] Examples of the above-mentioned activators include succinic acid, adipic acid, azelaic acid, glutaric acid, sebacic acid, dodecane diacitate, dimer acid, fumaric acid, maleic acid, itaconic acid, trans-2,3-dibromo-1,4-butendiol, cis-2,3-dibromo-1,4-butendiol, 3-bromopropionic acid, 2-bromovaleric acid, 5-bromo-n-valeric acid, 2-bromoisovaleric acid, amine compounds (monoalkanolamines, dialkanolamines, trialkanolamines), ethylamine bromate, diethylamine bromate, diethylamine hydrochloride, methylamine bromate, amino acids, amide compounds, and the like.

[0137] Examples of the above-mentioned organic solvents include ethanol, n-propanol, isopropanol, isobutanol, butylcarbitol, hexylcarbitol, isopropyl acetate, ethyl propionate, butyl benzoate, diethyl adipate, n-hexane, dodecane, tetradecene, and the like.

[0138] Examples of the thixotropic agents mentioned above include castor oil, hydrogenated castor oil, beeswax, carnauba wax, stearamide, and 12-hydroxystearate ethylenebisamide.

[0139] Examples of the above antioxidants include pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxyhydrocinnamamide), 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, 2,6-di-t-butyl-p-cresol, triphenyl phosphite, triethyl phosphite, trilauryl trithiophosphite, tris(tridecyl) phosphite, and the like.

[0140] Other additives mentioned above include, for example, antifungal agents, matting agents, anti-thickening agents, and surfactants.

[0141] In this specification, "solder paste" is a mixture of soldering flux and solder powder. Examples of solder powder include lead-free solder powders of the Sn-Ag, Sn-Cu, Sn-Sb, and Sn-Zn systems, as well as lead-containing solder powders in which lead is a component. These solder metals may also be doped with one or more elements from Ag, Al, Au, Bi, Co, Cu, Fe, Ga, Ge, In, Ni, P, Pt, Sb, and Zn. The solder paste is supplied onto the electrodes via a metal mask by screen printing, and after the electronic components are placed on it, soldering is performed under heating.

[0142] Examples of articles to which the above-mentioned soldering flux or solder paste is attached include metal masks for screen printing, squeegees, nozzles and syringes for dispensing systems, and jigs for fixing substrates.

[0143] The flux residue mentioned above is the residue that remains after joining electronic components to electrodes using solder paste, solder wire, soldering flux, pre-flux, post-flux, etc. Flux residue can corrode the solder metal and base material, and reduce the insulation resistance of the substrate, so it needs to be removed by cleaning.

[0144] Examples of items to which the above-mentioned flux residue adheres include glass processed products such as photomasks, optical lenses, vacuum discharge tubes, touch panels, and display device glass; metal processed products such as metal masks, pallets, printed circuit boards, flexible wiring boards, ceramic wiring boards, semiconductor elements, semiconductor packages, magnetic media, power modules, camera modules, lead frames, magnetic disks, and heat sinks; resin processed products such as glass epoxy substrates, polyimide substrates, paper phenolic substrates, and plastic molded parts; wafers made of silicon (Si), sapphire (Al2O3), silicon carbide (SiC), diamond (C), gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide (GaAs), and indium phosphide (InP); and processed products made from these wafers that have been cut (sliced, diced, etc.), ground (backgrinded, blasted, etc.), chamfered (beveled, barreled, etc.), and polished (lapping, polished, buffed, etc.); as well as jigs, carriers, magazines, etc., used when processing, mounting, welding, cleaning, and transporting these items. Furthermore, the corresponding components may have electronic components such as ICs, capacitors, resistors, diodes, transistors, coils, and CSPs soldered to them, or BGAs, PGAs, and LGAs formed, or may have undergone pre-treatment such as solder leveling.

[0145] Other items to be cleaned include, for example, printed circuit boards, ceramic wiring boards, semiconductor element mounting boards, cover glass, and chips generated during the dicing process of wafers, etc.

[0146] The above-mentioned cleaning agent compositions can be classified according to the object being cleaned, for example, as follows: cleaning agents for removing water-soluble flux residue, cleaning agents for removing rosin flux residue, cleaning agents for removing soldering flux, cleaning agents for removing solder paste, etc.

[0147] [Concentrated solution for detergent composition] This disclosure relates to a stock solution for a detergent composition for manufacturing the detergent composition, comprising component (A), component (B), and component (C).

[0148] The stock solution for the detergent composition of this disclosure can be used to produce the detergent composition by diluting it with water. Since the stock solution for the detergent composition is concentrated with components (A) to (C), which are the active ingredients of the detergent composition, and optionally component (D), efficient transportation and storage are possible.

[0149] The content of component (A) in the above-mentioned undiluted detergent composition is not particularly limited. Examples of the content of component (A) in the above-mentioned undiluted detergent composition include 50% by mass, 45% by mass, 40% by mass, 35% by mass, 30% by mass, 25% by mass, 20% by mass, 19% by mass, 18% by mass, 17% by mass, 16% by mass, 15% by mass, 14% by mass, 13% by mass, 12% by mass, 11% by mass, 10% by mass, 9% by mass, 8% by mass, 7% by mass, 6% by mass, 5% by mass, 4% by mass, 3% by mass, 2% by mass, 1% by mass, 0.95% by mass, 0.9% by mass, 0.85% by mass, 0.8% by mass, 0.75% by mass, 0.7% by mass, 0.65% by mass, 0.6% by mass, 0.55% by mass, and 0.5% by mass, based on 100% by mass of the undiluted detergent composition.

[0150] In one embodiment, the content of component (A) in the undiluted solution for the cleaning agent composition is preferably 0.5% by mass or more, based on 100% by mass of the undiluted solution for the cleaning agent composition, from the viewpoint of superior cleaning performance against flux residue. In another embodiment, the content of component (A) in the undiluted solution for the cleaning agent composition is preferably 50% by mass or less, based on 100% by mass of the undiluted solution for the cleaning agent composition, from the viewpoint of further suppressing corrosion of solder metal.

[0151] In one embodiment, the content of component (A) in the undiluted solution for the cleaning agent composition is preferably 0.5% to 50% by mass relative to 100% by mass of the undiluted solution for the cleaning agent composition, in order to have better cleaning performance against flux residue and to further suppress corrosion against solder metal.

[0152] The content of component (B) in the above-mentioned undiluted detergent composition is not particularly limited. Examples of the content of component (B) in the above-mentioned undiluted detergent composition include 40% by mass, 35% by mass, 30% by mass, 25% by mass, 20% by mass, 19% by mass, 18% by mass, 17% by mass, 16% by mass, 15% by mass, 14% by mass, 13% by mass, 12% by mass, 11% by mass, 10% by mass, 9% by mass, 8% by mass, 7% by mass, 6% by mass, 5% by mass, 4% by mass, 3% by mass, 2% by mass, 1% by mass, 0.9% by mass, 0.8% by mass, 0.7% by mass, 0.6% by mass, 0.5% by mass, etc., based on 100% by mass of the undiluted detergent composition.

[0153] In one embodiment, the content of component (B) in the undiluted solution for the cleaning agent composition is preferably 0.5% by mass or more, based on 100% by mass of the undiluted solution for the cleaning agent composition, from the viewpoint of having better cleaning performance against flux residue and better suppression of corrosion to solder metal. In one embodiment, the content of component (B) in the undiluted solution for the cleaning agent composition is preferably 40% by mass or less, based on 100% by mass of the undiluted solution for the cleaning agent composition, from the viewpoint of better suppression of corrosion to solder metal.

[0154] In one embodiment, the content of component (B) in the undiluted solution for the cleaning agent composition is preferably 0.5% to 40% by mass relative to 100% by mass of the undiluted solution for the cleaning agent composition, in order to have better cleaning performance against flux residue and to further suppress corrosion against solder metal.

[0155] The content of component (C) in the above-mentioned undiluted detergent composition is not particularly limited. Examples of component (C) content in the above-mentioned undiluted detergent composition include 95% by mass, 90% by mass, 85% by mass, 80% by mass, 75% by mass, 70% by mass, 65% by mass, 60% by mass, 55% by mass, 50% by mass, 45% by mass, 40% by mass, 35% by mass, 30% by mass, 25% by mass, 20% by mass, 19% by mass, 18% by mass, 17% by mass, 16% by mass, 15% by mass, 14% by mass, 13% by mass, 12% by mass, 11% by mass, and 10% by mass, based on 100% by mass of the undiluted detergent composition.

[0156] In one embodiment, the content of component (C) in the undiluted solution for the detergent composition is preferably 10% by mass or more, based on 100% by mass of the undiluted solution for the detergent composition, from the viewpoint of superior cleaning performance against water-soluble flux residue. In one embodiment, the content of component (C) in the undiluted solution for the detergent composition is preferably 95% by mass or less, based on 100% by mass of the undiluted solution for the detergent composition, from the viewpoint of superior cleaning performance against water-soluble flux residue.

[0157] In one embodiment, the content of component (C) in the undiluted solution for the detergent composition is preferably 10% to 95% by mass relative to 100% by mass of the undiluted solution for the detergent composition, from the viewpoint of having superior cleaning properties against water-soluble flux residues.

[0158] In one embodiment, the stock solution for the detergent composition may optionally contain component (D), the other components described above, as long as they do not impair the effects of the present disclosure.

[0159] The content of component (D) in the above-mentioned undiluted detergent composition is not particularly limited. Examples of the content of component (D) in the above-mentioned undiluted detergent composition include 50% by mass, 45% by mass, 40% by mass, 35% by mass, 30% by mass, 25% by mass, 20% by mass, 19% by mass, 18% by mass, 17% by mass, 16% by mass, 15% by mass, 14% by mass, 13% by mass, 12% by mass, 11% by mass, 10% by mass, 9% by mass, 8% by mass, 7% by mass, 6% by mass, 5% by mass, 4% by mass, 3% by mass, 2% by mass, 1% by mass, 0.9% by mass, 0.8% by mass, 0.7% by mass, 0.6% by mass, 0.5% by mass, 0.4% by mass, 0.3% by mass, 0.2% by mass, 0.1% by mass, and 0% by mass, based on 100% by mass of the undiluted detergent composition.

[0160] In one embodiment, the content of component (D) in the undiluted detergent composition is preferably less than 50% by mass relative to 100% by mass of the undiluted detergent composition, from the viewpoint of superior dispersibility of components (A) and (B) in component (C). In one embodiment, the content of component (D) in the undiluted detergent composition is preferably 0.1% by mass or more relative to 100% by mass of the undiluted detergent composition, from the viewpoint of superior dispersibility of components (A) and (B) in component (C).

[0161] In one embodiment, the content of component (D) in the undiluted solution for the detergent composition is preferably less than 50% by mass relative to 100% by mass of the undiluted solution for the detergent composition, from the viewpoint that the dispersibility of components (A) and (B) in component (C) is superior, and more preferably 0.1% by mass or more and less than 50% by mass.

[0162] In the above-mentioned undiluted solution for the detergent composition, the method of blending components (A) to (D) and other components is not particularly limited, and a general liquid mixing method can be used. A specific blending method is the stirring method.

[0163] The amount of water used when diluting the above-mentioned detergent composition stock solution with water is not particularly limited, as long as the total water content in the detergent after water dilution is within the above-mentioned range of the content of component (C) in the detergent composition.

[0164] The method for diluting the above-mentioned detergent composition stock solution with water is not particularly limited, and general liquid mixing methods can be used. A specific mixing method is the stirring method.

[0165] [Washing method] This disclosure relates to a cleaning method that includes a step of removing the object to be cleaned by bringing the object to be cleaned, to which the object to be cleaned is attached, into contact with the cleaning agent composition (hereinafter also referred to as the cleaning step).

[0166] The above cleaning step is a step of removing the object to be cleaned by bringing the object to be cleaned into contact with the above cleaning agent composition.

[0167] The means by which the cleaning agent composition or rinsing water is brought into contact with the object to be cleaned are not particularly limited, and various known methods can be employed. For example, methods include spraying the cleaning agent composition or rinsing water onto the object to be cleaned using a spray device (see Japanese Patent Publication No. 2007-096127), immersing the object to be cleaned in the cleaning agent composition and performing ultrasonic cleaning, and using a direct-pass cleaning device (registered trademark "Direct Pass", manufactured by Arakawa Chemical Industries, Ltd., Patent No. 2621800, etc.).

[0168] The means by which the cleaning agent composition is brought into contact with the object to be cleaned are not particularly limited, and various known methods can be employed. Examples include immersion stirring, liquid shower, air shower, and ultrasonic cleaning.

[0169] In one embodiment, the cleaning method may further include a rinsing step and a drying step.

[0170] The above-mentioned rinsing step is a step of bringing the object to be cleaned into contact with rinsing water to remove the cleaning agent composition adhering to the object. The above-mentioned drying step is a step of removing the rinsing water adhering to the object.

[0171] In the above-described rinsing step, the means of bringing the rinsing water into contact with the object to be cleaned are not particularly limited, and various known methods can be employed. Examples include the immersion stirring method, the liquid shower method, the air shower method, and the ultrasonic cleaning method.

[0172] The above rinsing step may be repeated multiple times. For example, by performing a pre-rinsing treatment on the object to be cleaned, followed by a final rinsing treatment, the cleaning agent composition adhering to the surface of the object to be cleaned can be effectively removed.

[0173] The pre-rinsing treatment can be carried out using conventional pre-rinsing methods such as those using pure water. The final rinsing treatment can be carried out according to conventionally known methods, such as treating the pre-rinsed material with pure water.

[0174] [Manufacturing method for circuit boards] This disclosure relates to a method for manufacturing a circuit board (hereinafter also referred to as the method for manufacturing a circuit board), which includes at least one step selected from the steps of connecting electronic components to a circuit board by soldering (hereinafter also referred to as the soldering step) and forming solder bumps on the circuit board for connecting the electronic components, and cleaning at least one selected from the circuit board to which the electronic components are connected and the circuit board on which the solder bumps are formed, using the cleaning method described above.

[0175] The electronic components used in the above-described method for manufacturing the circuit board are not particularly limited. Examples of such electronic components include semiconductor chips, chip-type capacitors, and circuit boards. One type of electronic component may be used alone, or two or more types may be used in combination.

[0176] In the soldering process described above, the soldering flux and solder paste used for soldering are not particularly limited. Examples of soldering flux include those described above in relation to the disclosure of the object to be cleaned. Examples of solder paste include those described above in relation to the disclosure of the object to be cleaned.

[0177] In one embodiment, the flux used for soldering in the above-mentioned method for manufacturing the circuit board is preferably a water-soluble flux, as this allows for thorough cleaning of the flux residue.

[0178] In the soldering process described above, the soldering method is not particularly limited. Examples of soldering methods include reflow soldering and flow soldering. [Examples]

[0179] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. In the examples, "%" and "parts" mean "mass%" and "parts by mass" respectively, unless otherwise specified.

[0180] [Preparation of detergent composition] Example 1 5 parts Nn-butyldiethanolamine, phosphate ester of polyoxyethylene alkyl ether (product name "Prysurf A212C", manufactured by Daiichi Kogyo Seiyaku Co., Ltd., in general formula (1), R 1 Two parts of (where is an alkyl group having 12 carbon atoms) and 93 parts of water were mixed to prepare 100 parts of a detergent composition.

[0181] Examples 2, 4-14, 16, 18-27, 29-36 and Comparative Examples 1-8 In Example 1, the detergent composition was prepared in the same manner as in Example 1, except that each component was changed to those shown in Tables 1 to 4. The values ​​in Tables 1 to 4 indicate the parts by mass of each component per 100 parts by mass of the detergent composition. In Tables 1 to 2, Softanol 90 is a nonionic surfactant (product name "Softanol 90", manufactured by Nippon Shokubai Co., Ltd.), and EA137 is a nonionic surfactant (product name "Neugen EA-137", manufactured by Daiichi Kogyo Seiyaku Co., Ltd.).

[0182] Example 3 45 parts of Nn-butyldiethanolamine, phosphate ester (product name "AP-4", manufactured by Daihachi Chemical Industry Co., Ltd., in general formula (1), R 1 18 parts of (where is an alkyl group having 4 carbon atoms), 27 parts of diethylene glycol monobutyl ether, and 10 parts of water were mixed to prepare 100 parts of a stock solution for the detergent composition. 800 parts of water were added to the 100 parts of the resulting stock solution to dilute it and prepare the detergent composition.

[0183] Example 15 27 parts of N-methyldiethanolamine, phosphate ester of polyoxyethylene alkyl ether (product name "Prysurf A212C", manufactured by Daiichi Kogyo Seiyaku Co., Ltd., general formula (1), R 1 27 parts of (where is an alkyl group with 12 carbon atoms), 36 parts of diethylene glycol monobutyl ether, and 10 parts of water were mixed to prepare 100 parts of a stock solution for the detergent composition. 800 parts of water were added to the 100 parts of the resulting stock solution to dilute it and prepare the detergent composition.

[0184] Example 17 5 parts Nn-butyldiethanolamine, phosphate ester of polyoxyethylene alkyl ether (product name "Prysurf A212C", manufactured by Daiichi Kogyo Seiyaku Co., Ltd., in general formula (1), R 1 Two parts of (where is an alkyl group having 12 carbon atoms), three parts of diethylene glycol monobutyl ether, and ninety parts of water were mixed to prepare 100 parts of a stock solution for the detergent composition. The obtained 100 parts of stock solution for the detergent composition was diluted by mixing with 900 parts of water to prepare the detergent composition.

[0185] Example 28 Nn-butylethanolamine 1 part, polyoxyethylene alkyl ether phosphate ester (product name "Prysurf A212C", manufactured by Daiichi Kogyo Seiyaku Co., Ltd., general formula (1), R 1 Two parts of (where is an alkyl group having 12 carbon atoms), two parts of diethylene glycol monobutyl ether, and 95 parts of water were mixed to prepare 100 parts of a stock solution for the detergent composition. The resulting 100 parts of stock solution for the detergent composition was diluted with 400 parts of water to prepare the detergent composition.

[0186] [Table 1]

[0187] [Table 2]

[0188] [Table 3]

[0189] [Table 4]

[0190] The abbreviations for each component in Tables 1-4 and the octanol / water partition coefficient (logP) for component (A) are shown in Table 5. Note that the logP values ​​in Table 5 were referenced from Chemical Book (https: / / www.chemicalbook.com / ProductIndex_JP.aspx).

[0191] [Table 5]

[0192] R in Table 5 1 This is R in general formula (1). 1 This means R in Table 5 1 In this context, C4 and C12 refer to R 1 This indicates the number of carbon atoms in the alkyl group; for example, C6 means that there are 6 carbon atoms.

[0193] The cleaning properties and corrosiveness of the cleaning agent compositions obtained in Examples 1-36 and Comparative Examples 1-8 were evaluated, and the pH of the cleaning agent compositions was measured. The results are shown in Tables 1-4.

[0194] <Evaluation of cleanability> (Preparation of test pieces for cleaning performance testing) A water-soluble flux (product name "WF-6317", manufactured by Senju Metal Industry Co., Ltd.) was printed onto a copper pad on a glass epoxy substrate (30 x 30 x 1.0 mm thick) using a metal mask, and solder balls (LLS221BGA-400B, manufactured by Taiho Kogyo Co., Ltd., ball diameter 400 μm) were mounted on the flux. This substrate was heated on a hot plate at 240°C for 90 seconds to create a test substrate with flux residue attached.

[0195] (Detergent composition detergency test) Using the above test substrate, a cleaning performance test by the immersion cleaning method was conducted under the following cleaning and rinsing conditions. The test substrate was immersed in the cleaning agent compositions obtained in Examples 1 to 36 and Comparative Examples 1 to 8 for 15 minutes for cleaning. Next, the test substrate was immersed in ion-exchanged water at a liquid temperature of 25°C for pre-rinsing for 5 minutes. Further, the test substrate was immersed in ion-exchanged water at a liquid temperature of 25°C for final rinsing for 5 minutes. Then, the test substrate was air-blown for 1 minute to remove moisture and dried. The surface of the dried test substrate was visually judged based on the following criteria to evaluate the cleaning performance. ○: All flux residues and metal salts are removed. △: A little of the flux residue or metal salt, or both, remains. ×: Little of the flux residue or metal salt, or both, is washed away and remains. <OO00733> <Evaluation of Corrosiveness> Before and after the above cleaning performance test, the corrosiveness of the solder metal in the soldered part was visually judged based on the following criteria to evaluate the corrosiveness. ○: No corrosion of the solder metal. △: The solder metal is slightly corroded (partially corroded). ×: The solder metal is corroded (almost entirely corroded).

[0197] <OO00741><pH Measurement> Using a pH meter (manufactured by Horiba, Ltd., product name "D-54"), the electrode was immersed in the cleaning agent compositions obtained in Examples 1 to 29 and Comparative Examples 1 to 8 at a liquid temperature of 25°C, and after stirring with a magnetic stirrer for 1 minute, the pH of the cleaning agent composition was measured.

Claims

1. Amine (A) having an octanol / water partition coefficient (logP) of less than 1, At least one organophosphorus compound (B) selected from the group consisting of acidic phosphate esters (B1), organic phosphonic acids (B2), and salts thereof, and A detergent composition containing water (C), The content of the amine (A) is 0.1% by mass or more and less than 10% by mass, based on 100% by mass of the detergent composition. The water (C) content is 90% by mass or more and less than 99.9% by mass, based on 100% by mass of the detergent composition. The aforementioned organic phosphonic acid (B2) is a compound represented by the following general formula (3): Detergent composition. 【Chemistry 1】 (In formula (3), R3 represents a linear or branched alkyl group having 1 to 24 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms.)

2. Furthermore, the detergent composition according to claim 1, further comprising glycol ether (D).

3. The detergent composition according to claim 2, wherein the content of the glycol ether (D) is less than 10% by mass based on 100% by mass of the detergent composition.

4. Furthermore, the detergent composition according to claim 1 or 2, comprising a surfactant.

5. The detergent composition according to claim 1 or 2, wherein the pH (at 25°C) of the detergent composition is 8.5 to 10.

5.

6. A cleaning agent composition according to claim 1 or 2, for the removal of water-soluble flux residue.

7. This is a stock solution for a detergent composition, which is diluted with water to produce the detergent composition described in claim 1. Amine (A) having an octanol / water partition coefficient (logP) of less than 1, At least one organophosphorus compound (B) selected from the group consisting of acidic phosphate esters (B1), organic phosphonic acids (B2), and salts thereof, and This is a stock solution for a detergent composition containing water (C), The content of the amine (A) is 0.5 to 50% by mass, based on 100% by mass of the undiluted solution for the detergent composition. The water (C) content is 10 to 95% by mass, based on 100% by mass of the undiluted solution for the detergent composition. The aforementioned organic phosphonic acid (B2) is a compound represented by the following general formula (3): Concentrated solution for detergent compositions. 【Chemistry 1】 (In formula (3), R3 represents a linear or branched alkyl group having 1 to 24 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms.)

8. A cleaning method comprising the step of bringing an object to be cleaned, to which the object to be cleaned is attached, into contact with the cleaning agent composition according to claim 1 or 2 to remove the object to be cleaned.

9. The cleaning method according to claim 8, wherein the object to be cleaned is a water-soluble flux residue.

10. The process of connecting electronic components to a circuit board by soldering, and At least one step selected from the steps of forming solder bumps on a circuit board for connecting the aforementioned electronic components, and The process includes cleaning at least one selected from the circuit board to which the electronic components are connected and the circuit board on which the solder bumps are formed, using the cleaning method described in claim 8. A method for manufacturing circuit boards.

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