Vibration device

Abstract

A vibration device (1) comprises an internal vibrator (7) that amplifies vibration, a piezoelectric element (9) that is connected to one end in a first direction of the internal vibrator and generates vibration, a translucent body (5) that is connected to the other end in the first direction of the internal vibrator and has an optical axis extending along the first direction, and an external vibrator (3) that includes a first connecting part (31) connected to the translucent body and an antenna part (33) that extends to the outside of the translucent body along a second direction from the first connecting part and attenuates vibration. The antenna part (33) is axially asymmetrical about the optical axis, the impedance minimum value (= resonance resistance value) thereof and the loss due to resistance thereof are small, and the antenna part forms a region of large-amplitude vibration and a region of small-amplitude vibration in the surface of the translucent body (5) during vibration without increasing the resonance resistance value of the internal vibrator 7, to remove foreign matter adhered to the translucent body (5).

Description

Technical Field

[0001] The present invention relates to a vibration device.

Background Art

[0002] Patent Document 1 discloses a vibration device including unbalance means for removing a part of the mass or adding mass to at least one of a light-transmitting body, a first cylindrical body, a second cylindrical body, a spring portion, and a vibrating body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The vibration device of Patent Document 1 has room for improvement in removing foreign matter attached to the light-transmitting body.

[0005] The present invention aims to provide a vibration capable of removing foreign matter attached to a light-transmitting body Device

Means for Solving the Problems

Means for Solving the Problems

[0006] A vibration device according to an aspect of the present invention includes an internal vibrating body that amplifies vibration, a piezoelectric element connected to one end of the internal vibrating body in a first direction and generating vibration, a light-transmitting body connected to the other end of the internal vibrating body in the first direction and having an optical axis extending along the first direction, an external vibrating body including a first connection portion connected to the light-transmitting body and an attenuator portion extending outward from the light-transmitting body along a second direction intersecting the first direction from the first connection portion and attenuating vibration and is provided with The attenuator section has non-axial symmetry with respect to the optical axis. [Effects of the Invention]

[0007] According to the present invention, a vibration capable of removing foreign matter adhering to a transparent material is available. Device We can provide this. [Brief explanation of the drawing]

[0008] [Figure 1] A perspective view showing a vibration device according to one embodiment of the present invention. [Figure 2] A cross-sectional view along line II-II in Figure 1. [Figure 3] A perspective view showing the vibrating device of Figure 1, viewed from a different direction than Figure 1. [Figure 4] A graph showing the relationship between impedance and frequency. [Figure 5] A cross-sectional view showing a first modified example of the vibration device in Figure 1. [Figure 6] A perspective view showing a second modified example of the vibration device in Figure 1. [Figure 7] A cross-sectional view showing a third modified example of the vibration device in Figure 1. [Figure 8] A cross-sectional view showing a fourth modified example of the vibration device in Figure 1. [Figure 9] A perspective view showing a fifth modified example of the vibration device in Figure 1. [Figure 10] Figure 9 shows a bottom view of the vibration device. [Figure 11] A cross-sectional view showing a sixth modified example of the vibration device in Figure 1. [Figure 12] A cross-sectional view showing a seventh modified example of the vibration device in Figure 1. [Figure 13] Figure 12 is a perspective view showing an example of the wiring of a vibration device. [Figure 14] A perspective view showing the first example of the wiring in Figure 13. [Figure 15] A perspective view showing a second example of the wiring in Figure 13. [Modes for carrying out the invention]

[0009] Various aspects of the present invention will be described.

[0010] The vibration device according to the first aspect of the present invention includes an internal vibrating body that amplifies vibration, a piezoelectric element connected to one end of the internal vibrating body in the first direction and generating vibration, a translucent body connected to the other end of the internal vibrating body in the first direction and having an optical axis extending along the first direction, an external vibrating body including a first connection portion connected to the translucent body and an attenuator portion that extends outward from the first connection portion along a second direction intersecting the first direction and attenuates vibration, and is provided with [[ID=1�]] the attenuator portion having non-axisymmetry with respect to the optical axis.

[0011] In the vibration device of the first aspect, since the attenuator portion has non-axisymmetry, it is possible to impart an inclination to the vibration amplitude of the translucent body and reduce the deviation of the stress applied to the internal vibrating body during vibration. the law of nature and can be reduced.

[0012] The vibration device according to the second aspect of the present invention is the vibration device of the first aspect, where the attenuator portion has a first attenuator portion and a second attenuator portion that are symmetrically positioned with respect to the optical axis in a cross-sectional view along the optical axis, and the dimension of the first attenuator portion in the first direction is different from the dimension of the second attenuator portion in the first direction.

[0013] In the vibration device of the second aspect, the appearance of the vibration device can be made symmetric.

[0014] The vibration device according to the third aspect of the present invention is the vibration device of the first aspect, where the attenuator portion has a first attenuator portion and a second attenuator portion that are symmetrically positioned with respect to the optical axis in a cross-sectional view along the optical axis, and the dimension of the first attenuator portion in the second direction is different from the dimension of the second attenuator portion in the second direction.

[0015] In the third embodiment of the vibration device, the thickness, which is the dimension of the attenuator section in the first direction, can be kept constant, making it easier to process the external vibrator by cutting, pressing, etc.

[0016] A fourth aspect of the present invention is a vibration device that, in the first aspect, The attenuator section comprises a first attenuator section and a second attenuator section, which are symmetrically positioned with respect to the optical axis in a cross-sectional view along the optical axis. The material constituting the first attenuator section and the material constituting the second attenuator section are different.

[0017] In the fourth embodiment of the vibration device, the external appearance of the vibration device can be made symmetrical.

[0018] A fifth aspect of the present invention is a vibration device in any of the second to fourth aspects, If the amplitude of vibration generated by the piezoelectric element is greater in the second attenuator than in the first attenuator, the first attenuator is positioned vertically above the second attenuator.

[0019] The vibration device of the fifth embodiment can remove foreign matter more reliably.

[0020] The sixth aspect of the present invention is a vibration device in any of the first to fifth aspects, The internal vibrator is positioned symmetrically with respect to the optical axis.

[0021] In the vibration device of the sixth embodiment, the stress distribution on the internal vibrating body during vibration the law of nature This allows for a more reliable reduction of unwanted vibrations caused by non-axisymmetric design.

[0022] The seventh aspect of the present invention is a vibration device in any of the first to sixth aspects, The piezoelectric element is positioned symmetrically with respect to the optical axis.

[0023] In the seventh embodiment of the vibration device, the stress distribution on the internal vibrating body during vibration is the law of nature This allows for a more reliable reduction of unwanted vibrations caused by non-axisymmetric design.

[0024] The eighth aspect of the present invention is a vibration device in any of the second to fourth aspects, If the amplitude of vibration generated by the piezoelectric element is greater in the second attenuator section than in the first attenuator section, the wiring is connected to the piezoelectric element from a position closer to the first attenuator section than to the second attenuator section.

[0025] The vibration device of the eighth embodiment can suppress both wire breakage and noise caused by wire vibration.

[0026] The ninth aspect of the present invention is a vibration device in the eighth aspect of the present invention, The aforementioned wiring includes a shielding section capable of suppressing electromagnetic noise.

[0027] In the vibration device of the ninth embodiment, the electromagnetic shielding effect on the image sensor can be enhanced at low cost without adding any other shielding members.

[0028] A vibration device according to a tenth aspect of the present invention is a vibration device according to a ninth aspect, wherein the wiring includes at least two electrically independent conductive parts.

[0029] In the vibration device of the tenth embodiment, a drive signal can be supplied to the piezoelectric element.

[0030] The vibration device of the 11th aspect of the present invention is a vibration device of the 10th aspect, The at least two conductive parts include a first conductive part connected to the piezoelectric element so as to be able to transmit a signal, and a second conductive part whose potential is fixed at a constant value. The second conductive portion has the same potential as the shield portion.

[0031] In the vibration device of the 11th embodiment, an electric potential can be supplied to the piezoelectric element.

[0032] A vibration device according to the 12th aspect of the present invention is a vibration device according to the 11th aspect, The system comprises an image sensor located on the optical axis inside the internal vibrator, The aforementioned wiring includes multiple layers, The shield portion constitutes one of the plurality of layers and is located closer to the image sensor than the first conductive portion and the second conductive portion.

[0033] In the vibration device of the 12th embodiment, the intrusion of noise into the image sensor circuit can be suppressed more reliably.

[0034] A vibration device according to the 13th aspect of the present invention is a vibration device according to the 11th or 12th aspect, The first conductive portion and the second conductive portion are connected by twisted wiring.

[0035] The vibration device of the 13th embodiment can more reliably suppress electromagnetic noise.

[0036] The vibration device of the 14th aspect of the present invention is a vibration device of any of the 1st to 13th aspects, The aforementioned attenuator section, A second connecting portion extending outward from the first connecting portion along the second direction toward the light-transmitting body, In the first direction, it is located closer to the light-transmitting body than the second connecting portion, is connected to the second connecting portion, and is not relative to the optical axis. shaft A non-axisymmetric part having symmetry and Includes.

[0037] In the vibration device of the 14th embodiment, non-axisymmetrical properties of the attenuator section can be easily obtained.

[0038] A vibration device according to a 15th aspect of the present invention is A vibrating body capable of amplifying vibrations, A piezoelectric element connected to one end of the vibrating body in the first direction and capable of generating vibration, A light-transmitting body connected to the other end of the vibrating body in the first direction and having an optical axis extending along the first direction, An attenuator portion is located at the edge of the light-transmitting body in a second direction intersecting the first direction, and is configured to connect the vibrating body and the light-transmitting body and to dampen vibrations. Equipped with, The attenuator section has non-axial symmetry with respect to the optical axis.

[0039] In the vibration device of the 15th embodiment, it is possible to achieve both vibration containment and non-axisymmetric attenuator section.

[0040] One embodiment of the present invention will be described below with reference to the accompanying drawings. The following description is essentially illustrative and is not intended to limit the present invention, its applications, or its uses. The drawings are schematic, and the dimensions and proportions shown in the drawings do not necessarily correspond to those of reality.

[0041] As shown in Figures 1 and 2, the vibration device 1 comprises an internal vibrator 7, a piezoelectric element 9, a lens (an example of a light-transmitting material) 5, and an external vibrator 3. The piezoelectric element 9 is connected to one end of the internal vibrator 7 in a first direction (for example, the Z direction). The lens 5 is connected to the other end of the internal vibrator 7 in the first direction Z. The lens 5 has an optical axis L extending along the first direction Z. The vibration generated by the piezoelectric element 9 is transmitted to the lens 5 via the internal vibrator 7, causing the lens 5 to vibrate. This removes foreign matter such as water droplets or mud adhering to the lens 5.

[0042] The internal vibrator 7 is configured to amplify the vibrations generated by the piezoelectric element 9. The internal vibrator 7 is made of, for example, a metal material or ceramics. Examples of metal materials that make up the internal vibrator 7 include stainless steel, aluminum, iron, titanium, and duralumin. The surface of the internal vibrator 7 may be subjected to surface treatment such as oxidation treatment or anodizing treatment to improve the adhesion of the adhesive. For example, by making the surface of the internal vibrator 7 black through surface treatment, a decrease in optical performance due to diffuse reflection of light can be prevented.

[0043] In this embodiment, the internal vibrator 7 is, for example, a cylindrical body positioned symmetrically with respect to the optical axis L. The internal vibrator 7 includes a first portion 71 that contacts the lens 5, a second portion 72 to which the piezoelectric element 9 is attached, and a third portion 73 that connects the first portion 71 and the second portion 72. The first portion 71 and the second portion 72 have a cylindrical shape extending along a first direction Z. The second portion 72 is configured to vibrate together with the vibration of the piezoelectric element 9 and has a larger plate thickness (i.e., a larger dimension in the first direction Z) than the first portion 71 and the third portion 73. This makes it easier for the vibration of the piezoelectric element 9 to be efficiently transmitted by the lens 5. The third portion 73 has a roughly S-shaped cross-section and is configured to support the first portion 71 and to transmit the vibration of the second portion 72 to the first portion 71.

[0044] The first part 71, the second part 72, and the third part 73 may be formed as a single unit or individually. The maximum external dimension of the third part 73 (i.e., the maximum dimension in the second direction (e.g., the X direction) intersecting the first direction Z) is greater than the maximum external dimension of the first part 71, and the maximum external dimension of the second part 72 is greater than the maximum external dimension of the third part 73. This allows the vibrations of the piezoelectric element 9 to be efficiently transmitted to the lens 5.

[0045] The external vibrator 3 is configured to prevent vibrations from the internal vibrator 7 from escaping to components other than the lens 5, and to efficiently transmit vibrations to the lens 5. For example, the external vibrator 3 is configured to cover the entire internal vibrator 7 and protect it from external elements. The external vibrator 3 is made of a metal material such as stainless steel, aluminum, iron, titanium, or duralumin, or a resin.

[0046] The external vibrator 3, as an example, is roughly rectangular in shape and includes a first connecting portion 31, an attenuator portion 33, and a fixing portion 35.

[0047] As shown in Figure 2, the first connecting portion 31 extends from the end of the attenuator portion 33 closest to the internal vibrator 7 in the second direction X along the first direction Z and away from the piezoelectric element 9. In this embodiment, the first connecting portion 31 includes a plate-shaped portion 311 and a protruding portion 312. The plate-shaped portion 311 extends from the attenuator portion 33 along the first direction Z. The protruding portion 312 is located at the end of the plate-shaped portion 311 furthest from the attenuator portion 33 in the first direction Z. The protruding portion 312 is, Plate-shaped portion 311 It protrudes in the second direction X and in a direction approaching the lens 5. The edge of the lens 5 is sandwiched between the protruding part 312 and the first part 71 of the internal vibrator 7.

[0048] The attenuator section 33 extends outward from the lens 5 along the second direction X from the first connection section 31 and is configured to dampen vibrations generated by the piezoelectric element 9. The attenuator section 33 has a smaller thickness and thinner wall thickness than the fixed section 35, and therefore has spring characteristics.

[0049] The attenuator section 33 is non-axisymmetric with respect to the optical axis L. In this embodiment, as shown in Figures 2 and 3, the attenuator section 33 includes a first attenuator section 331 and a second attenuator section 332, which are symmetrically positioned with respect to the optical axis L in a cross-sectional view along the optical axis L. The dimension D1 of the first attenuator section 331 in the first direction Z (i.e., the thickness dimension) and the dimension D2 of the second attenuator section 332 in the first direction Z are different.

[0050] In the vibration device 1 shown in Figures 1 to 3, as an example, the thickness dimension D1 of the first attenuator section 331 is larger than the thickness dimension D2 of the second attenuator section 332. More specifically, the surface of the first attenuator section 331 on the lens 5 side in the first direction Z and the surface of the second attenuator section 332 on the lens 5 side in the first direction Z are located substantially on the same plane. On the other hand, the surface of the first attenuator section 331 on the piezoelectric element 9 side in the first direction Z is located closer to the piezoelectric element 9 than the surface of the second attenuator section 332 on the piezoelectric element 9 side in the first direction Z.

[0051] In this case, the amplitude of vibration generated by the piezoelectric element 9 is smaller in the first attenuator section 331 than in the second attenuator section 332. For example, by arranging the vibration device 1 so that the first attenuator section 331 is located vertically above the second attenuator section 332, the sliding of foreign objects off the lens 5 can be promoted.

[0052] In this embodiment, as shown in Figure 2, the wiring 100 is connected to the piezoelectric element 9 from a position closer to the first attenuator section 331 than to the second attenuator section 332, and a voltage is applied to the piezoelectric element 9 via the wiring 100. By connecting the wiring 100 from the first attenuator section 331 side, where the amplitude is smaller, it is possible to suppress disconnection of the wiring 100 and noise caused by vibration of the wiring 100.

[0053] Figure 4 shows the relationship between impedance and frequency for a non-axisymmetric vibration device 1 and the relationship between impedance and frequency for an axisymmetric vibration device. In Figure 4, the relationship between impedance and frequency for vibration device 1 is shown by a solid line, and the relationship between impedance and frequency for an axisymmetric vibration device is shown by a dotted line. The axisymmetric vibration device has the same configuration as vibration device 1, except that the thickness dimension D1 of the first attenuator section 331 and the thickness dimension D2 of the second attenuator section 332 are the same. As shown in Figure 4, vibration device 1 has a smaller minimum impedance (=resonance resistance value) and smaller losses due to resistance compared to the axisymmetric vibration device. In other words, vibration device 1 can tilt the amplitude of lens 5 during vibration without increasing the resonance resistance value of the internal vibrator 7. "Tilting the amplitude of lens 5" means forming a region on the surface of lens 5 where lens 5 vibrates with a large amplitude and a region where lens 5 vibrates with a small amplitude.

[0054] The fixing part 35 includes a node that suppresses vibrations to less than 1 / 100th of the displacement of the lens 5, and is configured to suppress vibrations transmitted to members connected to the fixing part 35 (for example, the case housing the image sensor and the lens module).

[0055] The vibration of the fixed part 35 can be suppressed as the volume of the fixed part 35 increases, but when miniaturizing the vibration device 1, it is difficult to simply increase the size of the fixed part 35. The fixed part 35 in this embodiment has a roughly rectangular external shape. By configuring it in this way, the volume of the fixed part 35 can be increased without increasing the size of the vibration device 1. For example, the volume of a 25mm x 25mm shape is greater than that of a cylindrical shape with a diameter of 25mm. straight The cube is larger. The external vibrator 3 is made of a material with a lower Young's modulus than the internal vibrator 7. By configuring it in this way, the damping of vibrations by the attenuator section 33 can be greatly increased.

[0056] Lens 5 is made of, for example, glass. The upper surface of lens 5 has a convex shape, and as an example, its surface is coated with a water-repellent coating and an anti-reflective coating (AR coating). The surface of lens 5 on the optical image-forming side is composed of a flat portion 51 and a recessed portion 52. The flat portion 51 is connected to the first portion 71 of the internal vibrator 7, for example, by adhesive.

[0057] The piezoelectric element 9 has a piezoelectric body and electrodes and is configured to generate vibrations. The piezoelectric body is composed of suitable piezoelectric ceramics such as barium titanate (BaTiO3), lead titanate / zirconate (PZT:PbTiO3·PbZrO3), lead titanate (PbTiO3), lead metaniobate (PbNb2O6), bismuth titanate (Bi4Ti3O12), (K,Na)NbO3, or suitable piezoelectric single crystals such as LiTaO3, LiNbO3. The electrodes are composed of, for example, Ni, Ag, and Au.

[0058] In this embodiment, the piezoelectric element 9 has an annular shape when viewed along the first direction Z and is positioned symmetrically with respect to the optical axis L. The piezoelectric element 9 is connected to the second portion 72 of the internal vibrator 7, for example, by an adhesive.

[0059] The adhesive between the lens 5 and the internal vibrator 7, and the adhesive between the piezoelectric element 9 and the internal vibrator 7, are made of, for example, epoxy resin. By using an adhesive with a high Young's modulus, the transmission loss of vibrations between the two members can be reduced.

[0060] The vibration device 1 can produce the following effects:

[0061] The vibration device 1 comprises an internal vibrator 7 capable of amplifying vibrations, a piezoelectric element 9 connected to one end of the internal vibrator 7 in the first direction Z and capable of generating vibrations, a lens 5 connected to the other end of the internal vibrator 7 in the first direction Z and having an optical axis L extending along the first direction Z, and an external vibrator 3. The external vibrator 3 is a lens 5 The lens 5 includes a first connecting portion 31 connected to the optical axis L, and an attenuator portion 33 extending outward from the first connecting portion 31 along the second direction X to dampen vibrations. The attenuator portion 33 is non-axisymmetric with respect to the optical axis L. This configuration allows for a gradient to be applied to the amplitude of the lens 5 during vibration, and also reduces the uneven distribution of stress on the internal vibrating body 7 during vibration. the law of nature It can be reduced.

[0062] The attenuator section 33 ,light shaft L In a cross-sectional view along the optical axis L, the device has a first attenuator section 331 and a second attenuator section 332, which are symmetrically positioned with respect to the optical axis L. The dimension D1 of the first attenuator section 331 in the first direction Z is different from the dimension D2 of the second attenuator section 332 in the first direction Z. This configuration allows the external appearance of the vibration device 1 to be symmetrical.

[0063] The internal vibrator 7 is positioned symmetrically with respect to the optical axis L. With this configuration, the internal vibrator 7 Stress distribution the law of nature This allows for a more reliable reduction of unwanted vibrations caused by non-axisymmetric design.

[0064] The piezoelectric element 9 is positioned symmetrically with respect to the optical axis L. This configuration allows for the uneven distribution of stress on the internal vibrating body 7 during vibration. the law of natureThis allows for a more reliable reduction of unwanted vibrations caused by non-axisymmetric design.

[0065] The vibration device 1 can be configured as follows:

[0066] The non-axisymmetric nature of the attenuator section 33 is not limited to cases where the thickness dimension D1 of the first attenuator section 331 and the thickness dimension D2 of the second attenuator section 332 are different. For example, the attenuator section 33 may be given non-axisymmetric nature by the configurations shown in Figures 5 to 11.

[0067] In the vibration device 1 shown in Figure 5, the dimension W1 of the first attenuator section 331 in the second direction X is different from the dimension W2 of the second attenuator section 332 in the second direction X. In the vibration device 1 shown in Figure 5, for example, the dimension W2 of the second attenuator section 332 is larger than the dimension W1 of the first attenuator section 331. By configuring it in this way, the thickness, which is the dimension in the first direction of the attenuator section 33, can be kept constant, making it easier to process the external vibrator 3. In this case as well, the amplitude due to the vibration generated by the piezoelectric element 9 is smaller for the first attenuator section 331 than for the second attenuator section 332.

[0068] The vibration device 1 shown in Figure 6 has different materials for the first attenuator section 331 and the second attenuator section 332. In the vibration device 1 shown in Figure 6, for example, the first attenuator section 331 is made of a material with a higher Young's modulus than the second attenuator section 332. This configuration makes the appearance of the vibration device 1 symmetrical. In this case as well, the amplitude due to vibration generated by the piezoelectric element 9 is smaller for the first attenuator section 331 than for the second attenuator section 332. The Young's moduli of the first attenuator section 331 and the second attenuator section 332 are not limited to different materials; for example, their density or mechanical Q value may also be different.

[0069] The vibration device 1 shown in Figures 7 and 8 has an attenuator section 33 which includes a second connecting section 41 and a non-axisymmetric section 42. The second connecting section 41 extends outward from the lens 5 along the second direction X from the first connecting section 31 and is formed integrally with the first connecting section 31 and the fixing section 35. The non-axisymmetric section 42 has non-axissymmetry with respect to the optical axis L and is located closer to the lens 5 than the second connecting section 41 in the first direction Z. The non-axisymmetric section 42 is composed of, for example, a cover member that covers the outer surface of the second connecting section 41 and is connected to the second connecting section via adhesive or the like. 41 The connected non-axisymmetric portion 42 has a first attenuator portion 421 and a second attenuator portion 422, which are symmetrically positioned with respect to the optical axis L in a cross-sectional view along the optical axis L.

[0070] In the vibration device 1 shown in Figure 7, the first attenuator section 421 is in contact with and pressurizing the second connection section 41, but the second attenuator section 422 is not in contact with the second connection section 41, and a gap 43 is formed between the second attenuator section 422 and the second connection section 41. In other words, in the vibration device 1 shown in Figure 7, the amount of pressure applied by the non-axisymmetric section 42 to the second connection section 41 is asymmetric with respect to the optical axis L.

[0071] In the vibration device 1 shown in Figure 8, both the first attenuator section 421 and the second attenuator section 422 are in contact with the second connection section 41, but the thickness dimensions of the first attenuator section 421 and the second attenuator section 422 are different. Specifically, the first attenuator section 421 has a substantially rectangular cross-section, and the second attenuator section 422 has an inclined surface 423 that slopes so as it moves away from the first connection section 31 along the second direction X, it approaches the second connection section 41 in the first direction Z. This configuration prevents liquid from accumulating on the surface of the attenuator section 33.

[0072] The non-axisymmetric nature of the non-axisymmetric portion 42 is not limited to the examples shown in Figures 7 and 8. For example, the non-axisymmetric nature of the non-axisymmetric portion 42 may be provided by making the thicknesses of the first attenuator portion 421 and the second attenuator portion 422 different, while both the first attenuator portion 421 and the second attenuator portion 422 have a substantially rectangular cross-section. The non-axisymmetric nature of the non-axisymmetric portion 42 may also be provided by making the materials of the first attenuator portion 421 and the second attenuator portion 422 different.

[0073] The vibrator 1 shown in Figures 9 and 10 has an external vibrator 3 with a substantially circular inner surface and a substantially circular second attenuator section 332 when viewed along the first direction Z. The center of the inner surface of the external vibrator 3 substantially coincides with the optical axis L. The center point C of the second attenuator section 332 does not coincide with the optical axis L and is located at a different position from the optical axis L. By changing the radius dimension of the second attenuator section 332 and the position of the center point C, the length ratio of the first attenuator section 331 and the second attenuator section 332 can be adjusted. The second attenuator section 332 can be machined, for example, by cutting using a lathe. In other words, an asymmetrical attenuator section 331 can also be formed by general machining means such as a lathe.

[0074] The vibration device 1 shown in Figure 11 comprises a piezoelectric element 9 capable of generating vibrations, a vibrating body 10, a lens 5, and an attenuator section 60 configured to dampen vibrations. The vibrating body 10 is configured to amplify vibrations. The piezoelectric element 9 is connected to one end of the vibrating body 10 in the first direction Z. 5 It is connected to the other end of the vibrating body 10 in the first direction Z. The vibrating body 10 is joined to the piezoelectric element 9 and the lens 5, for example, by an adhesive.

[0075] The vibration device 1 shown in Figure 11 comprises a housing 80 and an imaging unit 82. The housing 80 is cylindrical in shape with an open end 81 and has a substrate 83 located at the open end 81. The imaging unit 82 includes an image sensor and is fixed to the substrate 83. A vibration structure 20, including a lens 5, a vibrator 10, and an inner layer lens 11, is fixed to the open end 81 of the housing 80. The vibration structure 20 has a fixing part 21 and an inner layer lens barrel 22. The fixing part 21 fixes the lens 5 and the vibrator 10 to the inner layer lens barrel 22. The inner layer lens barrel 22 is configured to hold the inner layer lens 11 and is fixed to the open end 81 of the housing 80.

[0076] The attenuator section 60 is located at the edge of the lens 5 in the second direction X and connects the vibrator 10 and the lens 5. The attenuator section 60 is, for example, made of a separate component from the vibrator 10 and is screwed to the vibrator 10. This holds the edge of the lens 5 between the attenuator section 60 and the vibrator 10, preventing the lens 5 from falling off. With this configuration, the vibrator 10, which is closer to the vibration nodes than the lens 5, can be fixed with the fixing section 21, thus achieving both vibration confinement and the non-axisymmetric nature of the attenuator section 60.

[0077] The non-axisymmetric nature of the attenuator section 33 may be provided by combining any multiple of the configurations shown in Figures 1 to 11.

[0078] The first attenuator sections 331, 421 and the second attenuator sections 332, 422 only need to be configured to be asymmetrically positioned with respect to the optical axis L in at least one cross-sectional view along the optical axis L.

[0079] If the amplitude of vibration generated by the piezoelectric element 9 is greater in the second attenuator sections 332 and 422 than in the first attenuator sections 331 and 421, the first attenuator sections 331 and 421 may or may not be positioned vertically above the second attenuator sections 332 and 422.

[0080] The internal vibrator 7 and the piezoelectric element 9 may or may not be positioned symmetrically with respect to the optical axis L.

[0081] If the amplitude of vibration generated by the piezoelectric element 9 is greater in the second attenuator section 332, 422 than in the first attenuator section 331, 421, the wiring 100 may or may not be connected to the piezoelectric element 9 from a position closer to the first attenuator section 331, 421 than to the second attenuator section 332, 422.

[0082] Referring to Figures 12 to 15, an example of wiring 100 connected to the piezoelectric element 9 will be explained.

[0083] In the vibration device 1 shown in Figure 12, the wiring 100 is connected to the piezoelectric element 9 and the drive circuit 110. The drive circuit 110 is connected to the image sensor substrate 120 by an inter-substrate connector 130. An image sensor 121 is mounted on the image sensor substrate 120. The image sensor 121 is located on the optical axis L inside the internal vibrator 7. An inner layer lens 11 is located between the lens 5 and the image sensor 121 in the first direction Z.

[0084] The wiring 100 includes a shielding section 101 and two electrically independent conductive sections. This wiring 100 enhances the electromagnetic shielding effect on the image sensor 121 at low cost without requiring the addition of other shielding materials. Furthermore, the two conductive sections can supply a drive signal to the piezoelectric element 9.

[0085] For example, the wiring 100 is a flexible substrate containing multiple layers, where each of the shield portion 101 and the two conductive portions constitutes one of the multiple layers. As an example, the wiring 100 is laminated in the following order, as shown in Figure 13: shield portion 101, protective layer 104, base film 105, two conductive portions, and protective layer 104. The protective layer 104 and base film 105 are formed from, for example, polyimide (PI) or PET film.

[0086] The shielding portion 101 is configured to suppress electromagnetic noise. By configuring the shielding portion 101 to be located closest to the image sensor 121 among multiple layers, the intrusion of electromagnetic noise into the image sensor 121 circuit can be more reliably suppressed. The shielding portion 101 is formed of, for example, copper foil, permalloy, or iron.

[0087] The two conductive parts (hereinafter referred to as the first conductive part 102 and the second conductive part 103) are electrically independent of each other (in other words, they are not electrically short-circuited). The first conductive part 102 and the second conductive part 103 are formed, for example, from copper foil and are located between the base film 105 and the protective layer 104. The first conductive part 102 is connected to the piezoelectric element 9 so as to be able to transmit signals. The second conductive part 103 has the same potential as the shield part 101. The potential of the second conductive part 103 is fixed to a constant value including ground. This allows potential to be supplied to the piezoelectric element 9.

[0088] Examples of wiring configurations for the first conductive part 102 and the second conductive part 103 are shown in Figures 14 and 15.

[0089] In Figure 14, the wiring 100 has the first conductive part 102 and the second conductive part 103 twisted together in the portion covered by the protective layer 104. By twisting the first conductive part 102 and the second conductive part 103 in this way, the electromotive force due to the magnetic field is canceled out, and electromagnetic noise can be suppressed more reliably. Furthermore, by providing a shielding portion 101 to the wiring 100, the electromagnetic shielding effect on the image sensor 121 can be enhanced at low cost without adding any other shielding materials. In the wiring 100 of Figure 14, through-holes penetrating the shielding portion 101 are provided on both sides of the portion where the first conductive part 102 and the second conductive part 103 of the shielding portion 101 are twisted together. 106A shield is provided. For example, if the second conductive part 103 is connected at one point, no current flows through the shield part 101, so the intrusion of electromagnetic noise into the image sensor 121 circuit can be suppressed more reliably. The portion of the wiring 100 in Figure 14 that is not covered by the protective layer 104 extends along the direction in which the wiring 100 extends, with a predetermined gap in the width direction perpendicular to the direction in which the wiring 100 extends. In Figure 14, components other than the shield part 101, the first conductive part 102, and the second conductive part 103 are omitted.

[0090] In Figure 15, the wiring 100 is not twisted in the portion covered by the protective layer 104, specifically in the first conductive portion 102 and the second conductive portion 103. In other words, even in the portion covered by the protective layer 104, the first conductive portion 102 and the second conductive portion 103 extend along the direction in which the wiring 100 extends, with a predetermined spacing in the width direction. Compared to the wiring 100 in Figure 14, the wiring 100 in Figure 15 has one less electrode layer constituting the first conductive portion 102 and the second conductive portion 103, thus enabling a lower-cost and improved electromagnetic shielding effect for the image sensor 121.

[0091] By appropriately combining any embodiment or modification from the various embodiments or modifications described above, the effects of each can be achieved. Furthermore, combinations of embodiments with each other, combinations of examples with each other, and combinations of embodiments with examples are possible, as well as combinations of features from different embodiments or examples.

[0092] Although the present invention has been described in detail in each embodiment, the disclosures in these embodiments are subject to change in the details of their configuration, and changes in the combination and order of elements in each embodiment can be realized without departing from the claimed scope and spirit of the present invention. [Explanation of Symbols]

[0093] 1 Vibration device 3. External vibrators 5 lenses 7 Internal vibrating element 9. Piezoelectric element 10 Vibrating body 11. Inner lens 21 Fixed part 22 Inner lens barrel 31. First connection section 33 Attenuator section 35 Fixed part 41 Second connection section 42 Non-axisymmetric part 43 gaps 51 Plane part 52 recess 60 Attenuator section 71 Part 1 72 Part 2 73 Part 3 80 cabinets 81 Open end 82 Imaging Unit 83 circuit boards 100 Wiring 311 Plate-like part 312 Protrusion 331, 421 First attenuator section 332, 422 Second attenuator section 423 Slope

Claims

1. An internal vibrator capable of amplifying vibrations, A piezoelectric element connected to one end of the internal vibrating body in the first direction and capable of generating vibrations, A light-transmitting body having an optical axis extending along the first direction is connected to the other end of the internal vibrating body in the first direction, An external vibrator covering the internal vibrator includes a first connecting portion connected to the light-transmitting body, and an attenuator portion extending outward from the light-transmitting body along a second direction intersecting the first direction from the first connecting portion and configured to dampen vibrations. Equipped with, A vibrating device in which the attenuator section has non-axial symmetry with respect to the optical axis.

2. The attenuator section comprises a first attenuator section and a second attenuator section, which are symmetrically positioned with respect to the optical axis in a cross-sectional view along the optical axis. The vibration device according to claim 1, wherein the dimensions of the first attenuator portion in the first direction are different from the dimensions of the second attenuator portion in the first direction.

3. The attenuator section comprises a first attenuator section and a second attenuator section, which are symmetrically positioned with respect to the optical axis in a cross-sectional view along the optical axis. The vibration device according to claim 1, wherein the dimensions of the first attenuator portion in the second direction and the dimensions of the second attenuator portion in the second direction are different.

4. The attenuator section comprises a first attenuator section and a second attenuator section, which are symmetrically positioned with respect to the optical axis in a cross-sectional view along the optical axis. The vibration device according to claim 1, wherein the material constituting the first attenuator section and the material constituting the second attenuator section are different.

5. The vibration device according to any one of claims 2 to 4, wherein the attenuator section is configured such that the amplitude due to vibration generated by the piezoelectric element is greater in the second attenuator section than in the first attenuator section, and the first attenuator section is located vertically above the second attenuator section.

6. The vibration device according to any one of claims 1 to 4, wherein the internal vibrator is positioned symmetrically with respect to the optical axis.

7. The vibration device according to any one of claims 1 to 4, wherein the piezoelectric element is positioned symmetrically with respect to the optical axis.

8. The vibration device according to any one of claims 2 to 4, wherein the attenuator section is configured such that the amplitude due to vibration generated by the piezoelectric element is greater in the second attenuator section than in the first attenuator section, and wiring is connected to the piezoelectric element from a position closer to the first attenuator section than to the second attenuator section with respect to the optical axis in the second direction.

9. The vibration device according to claim 8, wherein the wiring includes a shielding portion capable of suppressing electromagnetic noise.

10. The vibration device according to claim 9, wherein the wiring includes at least two electrically independent conductive parts.

11. The at least two conductive parts include a first conductive part connected to the piezoelectric element so as to be able to transmit a signal, and a second conductive part whose potential is fixed at a constant value. The vibration device according to claim 10, wherein the second conductive portion has the same potential as the shield portion.

12. The system comprises an image sensor located on the optical axis inside the internal vibrator, The aforementioned wiring includes multiple layers, The vibration device according to claim 11, wherein the shield portion constitutes one of the plurality of layers and is located closer to the image sensor than the first conductive portion and the second conductive portion.

13. The vibration device according to claim 11, wherein the first conductive part and the second conductive part are twisted together.

14. The aforementioned attenuator section, A second connecting portion extending outward from the first connecting portion along the second direction toward the light-transmitting body, A non-axisymmetric portion located closer to the light-transmitting body than the second connecting portion in the first direction, connected to the second connecting portion, and having non-axisymmetric properties with respect to the optical axis. A vibration device according to any one of claims 1 to 4, including the following:

15. A vibrating body capable of amplifying vibrations, A piezoelectric element connected to one end of the vibrating body in the first direction and capable of generating vibration, A light-transmitting body connected to the other end of the vibrating body in the first direction and having an optical axis extending along the first direction, An attenuator portion is located at the edge of the light-transmitting body in a second direction intersecting the first direction, and is configured to connect the vibrating body and the light-transmitting body and to dampen vibrations. Equipped with, A vibrating device in which the attenuator section has non-axial symmetry with respect to the optical axis.

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