Bonding apparatus, method, and program

Abstract

To improve mounting quality by suppressing a displacement of a mounting position with a change of a mounting height.SOLUTION: A bonding device comprises: a bonding tool to which an imaging reference is attached; a first imaging section for imaging the imaging reference attached to the bonding tool; a support member which supports the bonding tool in a vertically drivable manner and supports the first imaging section; a measurement section which measures a first position of the imaging reference at a first height and a second position of the imaging reference at a second height different from the first height on the basis of image data picked up by the first imaging section; and a detection section for detecting a first relative position of the first position and the second position.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a bonding apparatus, method, and program.

Background Art

[0002] A bonding apparatus is a device that bonds (mounts) a semiconductor chip onto a substrate or another semiconductor chip. Examples of bonding apparatuses include a die bonding apparatus that fixes the surface of a semiconductor chip opposite to the electrode surface to a substrate with an adhesive or the like, and a flip chip bonding apparatus that picks up a semiconductor chip from a wafer, inverts it, and directly joins the electrode surface of the semiconductor chip to a substrate or the like. For example, since a flip chip bonding apparatus directly joins the electrodes of a semiconductor chip and the electrodes of a substrate, it is necessary to accurately align the positions of the electrodes of the semiconductor chip and the electrodes of the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The technique described in Patent Document 1 includes an up-and-down two-field camera that simultaneously captures upper and lower images, in which a measurement error occurs due to an increase in temperature. In this technique, when the up-and-down two-field camera exceeds a predetermined temperature, a correction sequence for detecting a correction amount of an offset amount is executed. Thereby, in the technique described in Patent Document 1, since the measurement error occurring in the up-and-down two-field camera can be appropriately corrected, it is possible to suppress the positional deviation of the mounting apparatus over time and improve the mounting quality.

[0005] However, generally speaking, when bonding equipment moves in the vertical direction, measurement errors (deviations) may occur due to the movement in that direction, which can lead to problems in mounting semiconductor chips in the correct mounting position.

[0006] Therefore, the present invention was made to solve these problems, and aims to improve mounting quality by suppressing shifts in mounting position due to changes in mounting height. [Means for solving the problem]

[0007] A bonding apparatus according to one aspect of the present invention includes a bonding tool to which an imaging reference is attached, a first imaging unit for imaging the imaging reference attached to the bonding tool, a support member that supports the bonding tool so as to be drivable in the vertical direction and also supports the first imaging unit, a measuring unit that measures a first position of the imaging reference at a first height and a second position of the imaging reference at a second height different from the first height, based on image data captured by the first imaging unit, and a detection unit that detects a first relative position between the first position and the second position.

[0008] A method in one aspect of the present invention is a method for controlling a bonding apparatus comprising: a bonding tool to which an imaging reference is attached; a first imaging unit for imaging the imaging reference attached to the bonding tool; and a support member that supports the bonding tool so as to be drivable in the vertical direction and also supports the first imaging unit, the method comprising: imaging a first position of the imaging reference at a first height using the first imaging unit; imaging a second position of the imaging reference at a second height different from the first height using the first imaging unit; measuring a first position of the imaging reference at a first height and a second position of the imaging reference at a second height based on image data captured by the first imaging unit; and detecting the relative position between the first position and the second position.

[0009] A program in one aspect of the present invention causes the computer of the bonding control unit in a bonding apparatus comprising: a bonding tool to which an imaging reference is attached; a first imaging unit for imaging the imaging reference attached to the bonding tool; a support member that supports the bonding tool so as to be drivable in the vertical direction and supports the first imaging unit; and a bonding control unit, to perform the following actions: imaging a first position of the imaging reference at a first height using the first imaging unit; imaging a second position of the imaging reference at a second height different from the first height using the first imaging unit; measuring a first position of the imaging reference at a first height and a second position of the imaging reference at a second height based on the image data captured by the first imaging unit; and detecting the relative position between the first position and the second position. [Effects of the Invention]

[0010] This invention makes it possible to suppress misalignment of the mounting position due to changes in mounting height and improve mounting quality. [Brief explanation of the drawing]

[0011] [Figure 1] This is a side view showing the schematic configuration of the bonding apparatus according to this embodiment. [Figure 2] This diagram shows the position of the imaging reference at the reference height. [Figure 3] This figure shows the amount of deviation of the imaging reference at bonding positions higher than the reference height. [Figure 4] This figure shows an example of a database of deviation amounts. [Figure 5] This is a flowchart showing the implementation process flow, including the correction sequence. [Figure 6] This figure shows an example of the schematic configuration and operation of a bonding apparatus related to a modified example. [Figure 7] This figure shows the deviation at the reference height of the bonding apparatus in the modified example. [Modes for carrying out the invention]

[0012] <<Structure>> Referring to Figure 1, the configuration of the bonding apparatus 100 according to this embodiment will be described. Figure 1 is a side view showing the schematic configuration of the bonding apparatus 100 according to this embodiment.

[0013] As shown in Figure 1, the bonding apparatus 100 comprises a wafer holding unit 10, a handling unit 20, a bonding head unit 30, a bonding stage unit 40, and a bonding control unit 50. In the following description, the directions parallel to the bonding target surface are referred to as the X and Y directions, and the direction perpendicular to the bonding target surface is referred to as the Z direction.

[0014] The bonding apparatus 100 is an example of a mounting apparatus for mounting a semiconductor chip 61 (also called a "die") from a wafer 60 onto a substrate 70. An integrated circuit pattern is formed on the surface of the semiconductor chip 61. The bonding apparatus 100, for example, aligns the semiconductor chip 61 with the substrate 70 and bonds the semiconductor chip 61 to the substrate 70 so that the back surface of the semiconductor chip 61 faces the substrate 70. The bonding apparatus 100 is, for example, a flip-chip bonder or a die bonding apparatus.

[0015] The wafer holder 10 is a component that holds the wafer 60. The wafer 60 includes a plurality of semiconductor chips 61 that are diced in a grid pattern. The wafer holder 10 holds the plurality of semiconductor chips 61, for example, by vacuum suction. The wafer holder 10 may also hold the plurality of semiconductor chips 61 by, for example, attaching the wafer 60 to a film.

[0016] The handling unit 20 includes, for example, a stepping motor 21, a rotating shaft 22, an arm 23, a base 24, and a pickup tool 25. The stepping motor 21 rotates the rotating shaft 22 to reverse the base 24 and the pickup tool 25. One end of the arm 23 is attached to the rotating shaft 22 and extends obliquely downward in the Z direction from the rotating shaft 22, and the other end is attached to the upper surface 24a in the Z direction of the base 24. The base 24 is fixed to the tip of the arm 23 with bolts or the like. A pickup tool 25 is attached to the lower surface 24b in the Z direction of the base 24. The pickup tool 25 is configured to be movable in the Z direction.

[0017] With the pickup tool 25 facing downward, the handling unit 20 is moved above the wafer holding unit 10. Also, the handling unit 20 adsorbs the semiconductor chip 61 from above with the pickup tool 25. On the other hand, the stepping motor 21 rotates the rotating shaft 22 and reverses the base 24 and the pickup tool 25, so that the lower surface 24b of the base 24 faces upward in the Z direction and the pickup tool 25 faces upward. Thereby, the handling unit 20 reverses the picked-up semiconductor chip 61.

[0018] The bonding head unit 30 adsorbs the semiconductor chip 61 picked up from the wafer holding unit 10, transports it to the position of the substrate 70, and bonds the semiconductor chip 61 to the substrate 70.

[0019] A bonding tool 32 is attached to the bonding head unit 30 via a Z-axis drive mechanism 31. Also, a first imaging unit 33 is attached to the bonding head unit 30 via a Z-axis drive mechanism (not shown). The bonding head unit 30 is configured to be movable in the X and Y directions by an XY table 34. The bonding tool 32 and the first imaging unit 33 are configured to be movable in the X and Y directions together with the bonding head unit 30.

[0020] The bonding tool 32 is configured, for example, in the shape of a rectangular parallelepiped or a frustoconical shape, and holds the surface of the semiconductor chip 61 on which the integrated circuit pattern is formed. The bonding tool 32 has, for example, a central axis Ca parallel to the Z direction, and is fixed to the bonding head 30 so as to be movable in the Z, X, and Y directions by a Z-axis drive mechanism 31 and an XY table 34.

[0021] The bonding tool 32 is attached to the bonding head 30 via a θ-axis drive mechanism and a tilt drive mechanism (not shown). The bonding tool 32 is configured to move in the rotational direction and the tilt direction (inclination direction) around the Z axis by these drive mechanisms.

[0022] The first imaging unit 33 is configured to include, for example, an optical system such as a lens and an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The first imaging unit 33 has, for example, an optical axis Oa1 along the Z direction, and when positioned above the bonding stage unit 40 (on the +Z direction side), it captures the upper surface (the surface on the +Z direction side) of the bonding stage unit 40. The first imaging unit 33 is installed on the bonding head unit 30 so as to be movable in the Z, X, and Y directions, respectively, by means of, for example, a Z-axis drive mechanism (not shown) and an XY table 34. The first imaging unit 33 is also installed on the bonding head unit 30 so as to be parallel to the optical axis Oa1 and the central axis Ca of the bonding tool 32. The first imaging unit 33 also transmits image data, which is an image of the imaging reference 81 described later, to the bonding control unit 50.

[0023] The bonding stage section 40 is a stage for bonding a semiconductor chip 61 to a substrate 70. The bonding stage section 40 has a moving mechanism (not shown) for moving the substrate 70 in the X and Y directions, and a heating mechanism (not shown) for heating the substrate 70.

[0024] The bonding control unit 50 is implemented, for example, by a hardware processor such as a CPU (Central Processing Unit) executing a program (software). Furthermore, some or all of these components may be implemented by hardware (including circuitry) such as LSI (Large Scale Integration), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), or GPU (Graphics Processing Unit), or by the collaboration of software and hardware. The program may be pre-stored in a storage device such as the HDD or flash memory of the bonding control unit 50, or it may be pre-stored on a removable storage medium such as a DVD or CD-ROM and installed on the HDD or flash memory of the bonding control unit 50 when the storage medium is inserted into a drive device.

[0025] The bonding control unit 50 includes, for example, a measuring unit 51, a detection unit 52, a storage unit 53, and a mounting unit 54.

[0026] During bonding with the bonding tool 32, the relative positions of the semiconductor chip 61 in the X, Y, and rotational directions shift depending on the bonding height of the semiconductor chip 61 to the substrate 70. This is because, as the temperature of the bonding head 30 of the bonding apparatus 100 rises, the position of the bonding tool 32 may shift from a predetermined reference when the height of the bonding tool 32 is changed due to the effect of the temperature rise. This positional shift causes the bonding position (mounting position) of the semiconductor chip 61 to deviate from the predetermined reference, resulting in the problem of not being able to accurately bond the electrodes of the semiconductor chip 61 and the electrodes of the substrate 70. Therefore, the bonding control unit 50 measures the amount of positional shift according to the height and corrects this amount of shift when bonding the semiconductor chip 61 to the substrate 70 to achieve accurate bonding.

[0027] Referring to Figures 2 and 3, the processing (functional parts) of the bonding control unit 50 for measuring and storing the amount of displacement for each height will be described. The bonding apparatus 100 uses a bonding tool 32 to adsorb a measuring chip (hereinafter referred to as "measuring chip 80") with an imaging reference 81 attached, and performs image analysis on the image data of the imaging reference 81 in order to measure and store the amount of displacement. The measuring chip 80 is, for example, a transparent glass chip with approximately the same thickness as the semiconductor chip 61. The imaging reference 81 is, for example, a mark that can be imaged by a first imaging unit 33 provided on one side of the measuring chip. The imaging reference 81 has a center point Cp. The processing of each functional part of the bonding control unit 50 will be described in detail below.

[0028] The measurement unit 51 performs image analysis on the image data of the imaging reference 81 captured by the first imaging unit 33 to measure the position of the imaging reference 81 at a predetermined height. The position of the imaging reference 81 is, for example, the relative position of the center point Cp of the imaging reference 81 with respect to the optical axis Oa1 of the first imaging unit 33. In the following description, the position of the imaging reference 81 at reference height Z0 will be described as rotation angle θ0, X position X0, Y position Y0, and the position of the imaging reference 81 at a height Z1 higher than the reference height Z0 will be described as rotation angle θ1, X position X1, Y position Y1. The reference height Z0 is, for example, the height of the surface of the substrate 70. Height Z1 is, for example, the height obtained by adding the thickness of one semiconductor chip 61 to the reference height Z0. That is, a predetermined height higher than the reference height Z0 is, for example, a height corresponding to the number of stacked semiconductor chips 61 with the reference height Z0 as the reference.

[0029] Referring to Figure 2, the rotation angle, X position, and Y position will be explained. Figure 2 shows the position of the imaging reference 81 at a reference height Z0. The rotation angle is the inclination angle of the center line LC of the first imaging unit 33 with respect to the reference line LB of the imaging reference 81. The reference line LB is, for example, a virtual line set midway between two edges in the XY plane that are parallel to the direction in which the rectangular measuring chip 80 extends from the bonding head unit 30 toward the first imaging unit 33. The center line LC is, for example, a virtual line perpendicular to the optical axis Oa1 of the first imaging unit 33. Hereinafter, as an example, as shown in Figure 2(b), the explanation will be given assuming that the center line LC coincides with the reference line LB at a reference height Z0. That is, in Figure 2, the rotation angle θ0 is "0". The X position and Y position are, for example, the relative positions of the center point Cp of the imaging reference with respect to the optical axis Oa1.

[0030] The detection unit 52 detects the rotation angle, X position, and Y position deviations (first relative positions) at each height. The deviation is, for example, the difference between the relative position of the center point Cp with respect to the optical axis Oa1 at the first height and the relative position of the center Cp with respect to the optical axis Oa1 at the second height, which is higher than the first height. The detection unit 52 detects, for example, the rotational deviation, X direction deviation, and Y direction deviation at the position of the imaging reference 81 at height Z1 with respect to the position of the imaging reference 81 at reference height Z0. For convenience, below, the rotational deviation, X direction deviation, and Y direction deviation at the position of the imaging reference 81 at height Z1 with respect to the rotation angle θ0, X position X0, and Y position Y0 at reference height Z0 will be described as rotational deviation Δθ1, X deviation ΔX1, and Y deviation ΔY1, respectively.

[0031] Referring to Figure 3, the rotational displacement Δθ1, X displacement ΔX1, and Y displacement ΔY1 will be explained. Figure 3 shows the displacement of the imaging reference 81 at a bonding position higher than the reference height Z0. As shown in Figure 3(b), the rotational displacement Δθ1 is the angular difference (θ1-θ0) between the rotation angle θ1 and the rotation angle θ0. As shown in Figure 3(c), the X displacement ΔX1 and Y displacement ΔY1 are, for example, the changed distances between the X position X0 and Y position Y0 and the X position X1 and Y position Y1 after correcting for the rotational displacement Δθ1. Specifically, the X displacement ΔX1 is the difference between the X position X0, which shows the relative position of the center point Cp of the imaging reference with respect to the optical axis Oa1 at reference height Z0, and the X position X1, which shows the relative position of the center point Cp of the imaging reference with respect to the optical axis Oa1 at height Z1. In Figure 3(c), as shown in Figure 2, the optical axis Oa1 at the reference height Z0 coincides with the center point Cp of the imaging reference, so the X position X0 becomes "0", and the X position X1 becomes the X displacement amount ΔX1. The Y displacement amount ΔY1 is calculated similarly, so its explanation is omitted.

[0032] The storage unit 53 stores the amount of displacement for each height detected by the detection unit 52. The storage unit 62 includes a displacement amount database D62. The displacement amount database D62 will be described with reference to Figure 4. Figure 4 is a diagram showing an example of the displacement amount database D62. As shown in Figure 4, the displacement amount database D62 uses, for example, height Zn as the primary key and rotational displacement amount Δθ n , X displacement amount ΔX n , Y displacement amount ΔY n The data is stored in association with each other. Furthermore, the displacement database D62 may store the temperature indicated by a temperature sensor that measures the temperature of the bonding head 30 at height Z, and the number of bonding cycles in association with each other.

[0033] The mounting unit 63 mounts the semiconductor chip 61 onto the substrate 70. Based on the misalignment database D62, the mounting unit 63 corrects the misalignment amount according to the height and mounts the semiconductor chip 61 onto the substrate 70. Specifically, for example, the mounting unit 63 rotates the bonding tool 32 by Δθ1 to correct the rotational misalignment amount Δθ1. After that, the mounting unit 63 moves the XY table 34 by X misalignment amount ΔX1 and Y misalignment amount ΔY1.

[0034] <<Operation>> The operation of the bonding apparatus 100 will be explained with reference to Figures 2, 3, and 5. Below, the implementation process including a sequence for correcting the amount of misalignment for each height in the bonding apparatus 100 (hereinafter referred to as the "correction sequence") will be described. Figure 5 is a flowchart showing the flow of the implementation process including the correction sequence.

[0035] In step S100, the bonding apparatus 100, for example, counts the number of bonding cycles, and if the number of bonding cycles reaches a predetermined threshold (step S100: YES), it executes the correction sequence from step S101 onwards. On the other hand, if the number of bonding cycles is less than or equal to the predetermined threshold (step S100: NO), it may proceed to step S106 and continue bonding. The bonding apparatus 100 may decide whether or not to execute the correction sequence by performing a process to determine whether or not the temperature of the bonding head 30 has reached a predetermined threshold, instead of, or in conjunction with, the process to determine whether or not the number of bonding cycles has reached a predetermined threshold.

[0036] If the number of bonding cycles reaches a predetermined threshold (step S100: YES), in step S101, the bonding apparatus 100 measures the offset amount at the reference height Z0 (for example, rotational displacement Δθ0, X displacement ΔX0, Y displacement ΔY0) using a predetermined method.

[0037] In step S102, the bonding apparatus 100 lowers the bonding head 30 onto the measuring tip 80 to pick up the measuring tip 80, as shown in Figure 2(a).

[0038] In step S103, the bonding apparatus 100 moves the bonding tool 32 to a reference height Z0 and acquires image data of the imaging reference 81 with the first imaging unit 33. At this time, the first imaging unit 33 images the imaging reference 81 while it is moved to height Z0. The bonding apparatus 100 performs image analysis on the image data to measure the rotation angle θ0, X position X0, and Y position Y0 at the reference height Z0. The bonding apparatus 100 then stores the rotational displacement amount Δθ0, X displacement amount ΔX0, and Y displacement amount ΔY0 at the reference height Z0 in the storage unit 62. The rotational displacement amount Δθ0, X displacement amount ΔX0, and Y displacement amount ΔY0 at the reference height Z0 are, for example, reference offset amounts in the bonding apparatus 100.

[0039] In step S104, the bonding apparatus 100 moves the bonding tool 32 to a height Z1 and acquires image data of the imaging reference 81 with the first imaging unit 33. At this time, the first imaging unit 33 images the imaging reference 81 while it is moved to a height Z1. The bonding apparatus 100 performs image analysis on the image data to measure the rotation angle θ1, X position X1, and Y position Y1 at a height Z1. The bonding apparatus 100 then detects the rotational misalignment amount Δθ1, which is the difference between the rotation angle θ1 and the rotation angle θ0, and stores it in the storage unit 62. After correcting the rotational misalignment amount Δθ1, the bonding apparatus 100 detects the X misalignment amount ΔX1, which is the difference between the X position X1 and the X position X0, and stores it in the storage unit 62. Similarly, after correcting the rotational misalignment amount Δθ1, the bonding apparatus 100 detects the Y misalignment amount ΔY1, which is the difference between the Y position Y1 and the Y position Y0, and stores it in the storage unit 62.

[0040] In step S105, the bonding apparatus 100 performs the same process as in step S104 at each height higher than height Z1 up to a height (Zn) predetermined by the user.

[0041] If bonding has been performed up to a height preset by the user (step S105: YES), in step S106, the bonding apparatus 100 resumes bonding.

[0042] In step S107, the bonding apparatus 100 checks whether all bonding has been completed. If production will stop due to the completion of all bonding, it stops operating (step S107: YES). On the other hand, if all bonding has not been completed (step S107: NO), the bonding apparatus 100 repeats the process from step S100.

[0043] The above correction sequence detects the amount of displacement corresponding to the height of the bonding head 30 due to thermal expansion or the like, and effectively suppresses positional deviation during bonding by correcting this displacement. As a result, the bonding apparatus 100 can improve bonding quality (mounting quality).

[0044] <<Variation>> A modified bonding apparatus 100a will be described with reference to Figures 6 and 7. Figure 6 is a diagram showing an example of the schematic configuration and operation of the modified bonding apparatus 100a. Figure 7 is a diagram showing the displacement at the reference height Z0 of the modified bonding apparatus 100a.

[0045] The bonding apparatus 100a has a configuration that allows for the measurement of the offset amount at the reference height Z0 using a simpler method compared to the bonding apparatus 100. Below, only the configurations that differ from the bonding apparatus 100 will be described, and the same configurations as the bonding apparatus 100 will not be mentioned.

[0046] As shown in Figure 6, the bonding apparatus 100a further comprises a second imaging unit 35. The second imaging unit 35 is composed of, for example, an optical system such as a lens and an image sensor such as a CCD image sensor or a CMOS image sensor. The second imaging unit 35 has an optical axis Oa2 along the vertical direction.

[0047] The second imaging unit 35 is installed, for example, on the upper surface of the bonding stage unit 40 and images the measuring tip 80 from the opposite side of the bonding tool 32 via the measuring tip 80. That is, the second imaging unit 35 is positioned so that the imaging reference 81 of the measuring tip 80, which is attracted to the bonding tool 32, can be imaged from below (-Z direction side) of the bonding tool 32. The measuring tip 80 is made of a transparent material so that the second imaging unit 35 can image the bonding tool 32.

[0048] The process for detecting the amount of deviation (absolute offset) of the reference height Z0 in the bonding apparatus 100a will be described. As shown in Figure 6(a), the bonding apparatus 100a moves the second imaging unit 35 to the lower side (-Z direction side) of the bonding tool 32 so that the central axis Ca of the bonding tool 32 and the optical axis Oa2 of the second imaging unit 35 overlap. Next, the bonding apparatus 100a moves the bonding head unit 30 by a predetermined offset amount p (predetermined distance) in the +X direction. Then, as shown in Figure 6(b), the imaging reference 81 of the measuring chip 80 moves directly above the second imaging unit 35 so as to face the second imaging unit 35. The second imaging unit 35 then images the imaging reference 81 from below (-Z direction side) to acquire the first image data IM1. At this time, the first imaging unit 33 images the imaging reference 81 from above (+Z direction side) to acquire the second image data IM2.

[0049] The measurement unit 51 analyzes the image data of the imaging reference 81 captured by the second imaging unit 35 to measure the position of the imaging reference 81 at reference height Z0. Specifically, as shown in Figure 7(a), the measurement unit 51 identifies that in the image shown by the first image data IM1, the center point Cp of the imaging reference 81 is shifted by a distance b1 in the +X direction and by a distance b2 in the +Y direction from the optical axis Oa2 of the second imaging unit 35. That is, the measurement unit 51 measures the relative position of the center point Cp with respect to the optical axis Oa2 (hereinafter referred to as the "third relative position"). Furthermore, as shown in Figure 7(b), the measurement unit 51 identifies that in the image shown by the second image data IM2, the center point Cp of the imaging reference 81 is shifted by a distance c1 in the -X direction and by a distance c2 in the -Y direction from the optical axis Oa1 of the first imaging unit 33. In other words, the measuring unit 51 measures the relative position of the center point Cp with respect to the optical axis Oa1 (hereinafter referred to as the "fourth relative position").

[0050] The detection unit 52 detects the amount of displacement of the reference height Z0 (the fifth relative position) based on the third relative position and the fourth relative position. Specifically, the detection unit 52 may, for example, identify the distance (b1 + c1) as the X displacement and the distance (b2 + c2) as the Y displacement. Alternatively, the detection unit 52 may identify the amount of rotational displacement of the second reference position with respect to the first reference position, centered on the central axis Ca of the bonding tool 32. Then, considering the amount of displacement of the reference height Z0, the detection unit 52 detects the rotational displacement Δθ1, X displacement ΔX1, and Y displacement ΔY1 at height Z1 with respect to the rotation angle θ0, X position X0, and Y position Y0, which are the positions of the imaging reference 81 at the reference height Z0.

[0051] As described above, the bonding apparatus 100a can be simplified because the second imaging unit 35 can detect the offset amount of a reference, such as the reference height Z0, which serves as a reference in the bonding apparatus 100a through a simple process.

[0052] ===Summary=== <1> The bonding apparatus 100 includes a bonding tool 32 to which an imaging reference 81 is attached, a first imaging unit 33 for imaging the imaging reference 81 attached to the bonding tool 32, a bonding head unit 30 (support member) that supports the bonding tool 32 so as to be drivable in the vertical direction and also supports the first imaging unit 33, a measuring unit 51 that measures a first position of the imaging reference 81 at a first height (e.g., reference height Z0) and a second position of the imaging reference 81 at a second height (e.g., height Z1) different from the first height (reference height Z0) based on image data captured by the first imaging unit 33, and a detection unit 52 that detects the amount of deviation (first relative position) between the first position and the second position. As a result, the bonding apparatus 100 can suppress deviations in the mounting position due to changes in mounting height and improve mounting quality.

[0053] <2> The first imaging unit 33 in the bonding apparatus 100 is equipped with a drive mechanism that can move vertically in accordance with the movement of the bonding tool 32. <1> The bonding apparatus 100 described above. This allows the bonding apparatus 100 to suppress misalignment of the mounting position due to changes in mounting height, thereby improving mounting quality.

[0054] <3> In the bonding apparatus 100, the bonding tool 32 is supported on a bonding head portion 30 (support member) so as to be rotatable in the rotational direction along a plane perpendicular to the vertical direction, and the detection unit 52 detects the amount of rotational displacement (first relative position) between the first position and the second position. <1> or <2> The bonding apparatus 100 described above. This allows the bonding apparatus 100 to more reliably suppress misalignment of the mounting position due to changes in mounting height, thereby improving mounting quality.

[0055] <4> The bonding apparatus 100 further includes a mounting section 54 for mounting a semiconductor chip at a second position corrected based on the amount of misalignment (first relative position). <1> from <3> A bonding apparatus 100 as described in any of the above. This allows the bonding apparatus 100 to suppress misalignment of the mounting position due to changes in mounting height and improve mounting quality.

[0056] <5> The detection unit 52 in the bonding apparatus 100 detects the amount of deviation (second relative position) in a predetermined direction along a plane between the first position and the second position corrected based on the first relative position, and the mounting unit 54 corrects the second position, which was corrected based on the amount of deviation (second relative position), based on the amount of deviation (first relative position). <4> The bonding apparatus 100 described above. This allows the bonding apparatus 100 to more reliably suppress misalignment of the mounting position due to changes in mounting height, thereby improving mounting quality.

[0057] <6> The bonding apparatus 100a further includes a second imaging unit 35 provided on a substrate 70 for bonding a semiconductor chip 61, which images the imaging reference 81 from the opposite side of the bonding tool 32 relative to the imaging reference 81, and the detection unit 52 detects when the bonding tool 32 and the first imaging unit 33 are moved a predetermined distance from a position where the second imaging unit 35 faces the bonding tool 32 to a position where the second imaging unit 35 faces the imaging reference 81, and the first imaging unit 52 detects the imaging reference 81 located directly above the second imaging unit 35 as imaged by the second imaging unit 35. Based on the third relative position between the second imaging unit 35 and the imaging reference 81, which is determined based on the image data IM1, and the fourth relative position between the first imaging unit 33 and the imaging reference 81, which is determined based on the second image data IM2, which is an image taken by the first imaging unit 33 of the imaging reference 81 located directly above the second imaging unit 35, the amount of deviation (fifth relative position) between a predetermined reference and the first position at a first height (e.g., reference height Z0) is detected, and based on this amount of deviation (fifth relative position) and the second position, the amount of deviation (first relative position) at height Z1 is detected. <1> from <5> A bonding apparatus 100 as described in any of the above. This allows the bonding apparatus 100a to detect a reference offset amount in the bonding apparatus 100a through a simple process, thereby simplifying the apparatus configuration.

[0058] <7> The bonding apparatus 100 further includes a storage unit 53 that stores a second height (e.g., height Z1) and a displacement amount (first relative position) in association with each other, and the mounting unit 54 mounts the semiconductor chip 61 at a second position corrected based on the displacement amount (first relative position) of the second height (e.g., height Z1) stored in the storage unit 53. <1> from <6> A bonding apparatus 100, 100a as described in any of the above. This allows the bonding apparatus 100 to suppress misalignment of the mounting position due to changes in mounting height and improve mounting quality.

[0059] The embodiments described above can be combined, modified, or improved as appropriate depending on the application, and the present invention is not limited to the embodiments described above. It is clear from the claims that such combinations or modified or improved forms may also fall within the technical scope of the present invention. [Explanation of Symbols]

[0060] 30...Bonding head unit, 31...Z-axis drive mechanism, 32...Bonding tool, 33...First imaging unit, 34...XY table, 35...Second imaging unit, 40...Bonding stage unit, 50...Bonding control unit, 51...Measurement unit, 52...Detection unit, 53...Storage unit, 54...Mounting unit, 60...Wafer, 61...Semiconductor chip, 70...Substrate, 80...Measurement chip, 81...Imaging reference, 100...Bonding apparatus.

Claims

1. A bonding tool that adsorbs a chip with an imaging reference attached, A first imaging unit for imaging the imaging reference of the chip adsorbed onto the bonding tool, A support member that supports the bonding tool so as to be drivable in the vertical direction and supports the first imaging unit, A measuring unit that measures, based on image data captured by the first imaging unit, a first position at a first height of the imaging reference and a second position of the imaging reference at a second height different from the first height, A detection unit for detecting the first relative position between the first position and the second position, A bonding apparatus equipped with [a specific feature].

2. The first imaging unit is equipped with a drive mechanism that can move vertically in accordance with the movement of the bonding tool. The bonding apparatus according to claim 1.

3. The bonding tool is supported by the support member so as to be rotatable in a rotational direction along a plane that intersects the vertical direction perpendicularly, The detection unit detects the first relative position in the rotational direction between the first position and the second position. The bonding apparatus according to claim 1.

4. The system further includes a mounting section for mounting a semiconductor chip at the second position corrected based on the first relative position. The bonding apparatus according to claim 3.

5. The detection unit detects a second relative position in a predetermined direction along the plane between the first position and the second position corrected based on the first relative position, The mounting unit corrects the second position, which has been corrected based on the first relative position, based on the second relative position. The bonding apparatus according to claim 4.

6. The system further comprises a second imaging unit provided on a substrate for bonding semiconductor chips, which images the imaging reference from the opposite side of the bonding tool relative to the imaging reference, The detection unit is When the bonding tool and the first imaging unit are moved a predetermined distance from a position where the second imaging unit faces the bonding tool to a position where the second imaging unit faces the imaging reference, The imaging reference located directly above the second imaging unit is identified based on the first image data captured by the second imaging unit, and the third relative position between the second imaging unit and the imaging reference is determined. The imaging reference located directly above the second imaging unit is identified based on the second image data captured by the first imaging unit, and the fourth relative position between the first imaging unit and the imaging reference is determined accordingly. Based on this, a fifth relative position between a predetermined reference at the first height and the first position is detected. Based on the fifth relative position and the second position, the first relative position is detected. The bonding apparatus according to claim 1.

7. The system further includes a storage unit that stores the second height and the first relative position in association with each other. The mounting unit mounts the semiconductor chip at the second position corrected based on the first relative position of the second height stored in the storage unit. The bonding apparatus according to claim 4.

8. A bonding tool that adsorbs a chip with an imaging reference attached, A first imaging unit for imaging the imaging reference of the chip adsorbed onto the bonding tool, A support member that supports the bonding tool so as to be drivable in the vertical direction and supports the first imaging unit, A method for controlling a bonding apparatus comprising: The first imaging unit captures the first position at the first height of the imaging reference, The first imaging unit captures the second position of the imaging reference at a second height different from the first height, Based on the image data captured by the first imaging unit, the first position at the first height of the imaging reference and the second position at the second height of the imaging reference are measured. To detect the relative position between the first position and the second position, A method that includes this.

9. A bonding tool that adsorbs a chip with an imaging reference attached, A first imaging unit for imaging the imaging reference of the chip adsorbed onto the bonding tool, A support member that supports the bonding tool so as to be drivable in the vertical direction and supports the first imaging unit, Bonding control unit and In a bonding apparatus equipped with the following, the computer of the bonding control unit: The first imaging unit captures the first position at the first height of the imaging reference, The first imaging unit captures the second position of the imaging reference at a second height different from the first height, Based on the image data captured by the first imaging unit, the first position at the first height of the imaging reference and the second position at the second height of the imaging reference are measured. To detect the relative position between the first position and the second position, A program that executes the command.

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