Integrated optical multilayer structure and related manufacturing method

Abstract

An integrated functional multi-layer structure (100, 200, 300, 350, 500, 600, 700, 800, 900, 1000) comprising a flexible, preferably 3D formable and thermoplastic substrate film (102) and a circuit (104, 105, 106) provided on the substrate film, the circuit (104, 105, 106) comprising a first light source (104) comprising at least one light emitting unit (optionally an LED), the circuit (104, 105, 106), and a monolithic light guide layer (108) molded on the substrate film to cover and optically couple to the first light source (104), the light guide layer (108) comprising an optically attenuating semi-transparent material, the light guide layer (108) including a first surface (108A) and an opposite second surface (108B), the second surface (108B) facing the first light source (104), and the first surface (108A) a portion of the first light source (104) including a predefined out-coupling region (112) for light emitted by the first light source (104) and transmitted through the light guiding layer (108) within a first distance (H) from the first light source (104), the light guiding layer (108) further including a no-leak region (114) that does not overlap the out-coupling region (112) and is separated from the first light source (104) by at least a second, preferably larger, distance (D). a functional multilayer structure, wherein the attenuation of the emitted light occurring on a direct optical path between the first light source (104) and the out-coupling region (112) is less than the attenuation occurring on a shortest, optionally also direct, optical path between the first light source (104) and the light-restriction region (114), and further wherein the optical transmittance of the semitransparent material of the light guide layer is from about 25% to about 80% at the selected wavelength for an approximately 2 mm thick sample of the semitransparent material, while the associated half-power angle is from about 5 to about 70 degrees. Related manufacturing methods are presented.

Description

Technical Field

[0001] The present invention generally relates to an integrated structure incorporating various functional features such as electronic, mechanical, or optical elements. In particular, but not exclusively, the present invention relates to the provision of a structure including several light sources adapted to emit light also outside the structure.

Background Art

[0002] In the context of various functional assemblies, for example, in the field of electronic devices and electronic products, there are various different stacked assemblies and multilayer structures. For example, the motivations behind integrating functionality including electronic devices, mechanical features, or optical features can be as diverse as the associated usage scenarios. In relatively many cases, when the resulting solution ultimately exhibits multilayer nature, component size reduction, weight reduction, cost reduction, or just efficient integration is required. And the associated usage scenarios can relate to product packages or casings, the visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, labels, vehicle electronics, etc.

[0003] Electronic devices, such as electronic components, ICs (integrated circuits), and conductors, etc., may generally be provided on a substrate element by means of several different technologies. For example, off-the-shelf electronic devices, such as various surface mount devices (SMDs), may be mounted on the substrate surface that ultimately forms an interface layer inside or outside a multilayer structure. Further, technologies corresponding to the term "printed electronics" may be applied to actually manufacture electronic devices directly and additionally on the associated substrate. The term "printed" in this context refers to various printing technologies (such as, without limitation, screen printing, flexographic printing, and inkjet printing) by which electronic devices / electrical elements can be manufactured from a print through a substantially additional printing process. The substrate used can be a flexible and organic printed material, but not necessarily so.

[0004] Furthermore, the concept of injection-molded structural electronics (IMSE) involves constructing functional devices and components for them in the form of multilayer structures that encapsulate electronic functions as seamlessly as possible. Another characteristic of IMSE is that electronics are generally manufactured in actual or more actual 3D (non-planar) shapes according to a 3D model of the target product, component, or overall design. To realize the desired 3D layout of electronics on a 3D substrate and in the associated final product, the electronics may also be initially mounted on a planar substrate (e.g., a film) using a two-dimensional (2D) method of electronic assembly, on which the substrate already housing the electronics may be formed into the desired three-dimensional (i.e., 3D) shape and then subjected to overmolding. This may be done, for example, with a suitable plastic material that covers and embeds the underlying elements (e.g., electronics), and thus protects and potentially hides the elements from the environment. Naturally, further layers and elements may be added to the configuration.

[0005] In relation to an integrated structure containing various optical functional features (e.g., a light source), various problems easily arise and can be advantageously addressed.

[0006] For example, undesirable light leakage from a structure and between its different internal volumes and regions can easily lead to both functional and aesthetic problems, as is readily understood by those skilled in the art, particularly in the fields of lighting and sensing. Therefore, conventional approaches have addressed this problem by incorporating various additional light-blocking components, material layers, light guide arrangements, cavity structures, machining, and so on. However, these conventional solutions typically increase cost, weight, thickness, general size, complexity, and consequently, manufacturing time for the structure, often even resulting in lower yields, while simultaneously requiring the preparation and use of various additional tools. However, the final result may not be perfect from the perspective of considering the optical purpose originally set for that structure.

[0007] Furthermore, achieving high-resolution control of internal and output-coupled light, for example in terms of the shape, size, and location of the illuminated surface area, can be difficult, at least sometimes, in highly integrated structures. To achieve the desired final result, it may be necessary to position the light source suboptimally near the desired light emission surface or "output-coupled" surface, while being constrained to a fairly limited number of orientations or types in which the light source is typically available, for example, with a standard top or side-shooting LED.

[0008] In various applications, controlling or particularly improving uniformity on the output coupling surface of light has proven to be a burden. This can be a significant issue when an icon or symbol is included on a surface that needs to be uniformly illuminated, for example, to indicate to an observer outside the structure that a device function or status associated with the icon or symbol is active. Simply using multiple light sources to more effectively illuminate a common target area or feature (e.g., an icon) can still result in illumination hotspots and leaks, and at the same time require more (often valuable) power and space. Adding light guides or processing elements within the structure has its own drawbacks, as already mentioned.

[0009] In some cases, a light source included in a structural unit to illuminate the environment of a particular internal feature or structure must remain hidden from external perception. Placing additional masking elements or layers (e.g., printed layers) along the light path of a light source to better conceal it from the environment may work in limited ways, but it is usually detrimental to the optical efficiency of the structure and can result in poor yields because it can be difficult to reliably control the masking effect during manufacturing. In any case, the structure becomes bulkier, heavier, and more complex, while also imposing further limitations on the usability of additional optical features along the light path, for example.

[0010] However, in the field of these optically integrated structures (e.g., LED matrices or segment displays), optical segmentation grids are sometimes embedded within the structure. This is usually combined with some overlay material in the form of a sheet of material, but various problems arise. For example, the overall thickness of the structure increases significantly, a considerable amount of assembly work is required, especially when preparing actual 3D structures (e.g., curved or double-curved structures), there are limitations related to color, and design constraints regarding appearance and overall structure.

[0011] Nevertheless, reworking the included features (such as optical functions) was extremely difficult, if not entirely impossible, in today's highly integrated structures. Replacing or updating parts typically required the extensive dismantling and destruction of the existing structure. [Overview of the Initiative]

[0012] The object of the present invention is to mitigate at least one of the drawbacks associated with known solutions in the context of integrated optical structures, associated receiving devices, and associated manufacturing methods.

[0013] This objective is achieved by various embodiments of integrated functional multilayer structures and related methods for providing multilayer structures.

[0014] According to one embodiment, the integrated functional multilayer structure includes a flexible, preferably 3D-formable, thermoplastic substrate film, a circuit provided on the substrate film, the circuit including a first light source including at least one light-emitting unit (optionally an LED), and a monolithic optical guide layer molded on the substrate film to cover and optically couple with the first light source, the optical guide layer including an optically attenuating translucent material, the optical guide layer including a first surface and a second surface opposite to the first surface, the second surface facing the first light source, and a portion of the first surface within a first distance (H) from the first light source, with respect to light emitted by the first light source and transmitted through the optical guide layer. The optical guide layer includes a defined output coupling region, and further includes an optical leakage prevention region which does not overlap with the output coupling region and is separated from the first light source by at least a second, preferably larger distance (D), wherein the attenuation of emitted light occurring in the direct optical path between the first light source and the output coupling region is smaller than the attenuation occurring in the shortest, optionally direct optical path between the first light source and the optical leakage prevention region, and preferably further, the light transmittance of the translucent material of the optical guide layer is about 25% to about 80% at a selected wavelength (e.g., visible light, infrared light, and / or other target wavelength) of a sample of the translucent material about 2 mm thick, and / or the associated half-power angle is about 5 to about 70 degrees.

[0015] In some embodiments, the optical guide material may include, for example, subvolumes or sections with different properties (e.g., it may include substantially one or more transparent portions or sections having transmittances of about 90%, 95%, or more and / or half-power angles of about a few degrees or substantially 0%), and the suitable optical properties may be considered in particular as subvolumes or sections. In some embodiments, the preferred half-power angle for the aforementioned sample may be greater than 70 degrees at least at selected wavelengths. However, the angle may depend on the wavelength of light. In some embodiments, the angle may vary, for example, from about 10 to 50 degrees within the range of the target wavelength. In some embodiments, the half-power angle must be at least about 10 or 20 degrees within selected wavelengths. In these or other embodiments, the half-power angle should preferably not exceed about 50 or 60 degrees, respectively.

[0016] The translucent material used may exhibit a desired color (e.g., red, blue, green, yellow), meaning the material may, for example, better reflect or transmit certain wavelengths and filter out other wavelengths by absorption. In some preferred embodiments, the translucent material may exhibit a substantially white or whitish appearance. The material may emit 400–700 nm, which are substantially all or most visible wavelengths corresponding to those wavelengths. Alternatively, the material may appear very opaque (e.g., dark, if not substantially black), meaning that most wavelengths are significantly absorbed or otherwise attenuated by the material. The material properties (e.g., the exhibited color / filtered wavelengths) may be due to a coloring pigment or masterbatch originally applied in the transparent resin, as will be described in more detail below. In some preferred embodiments, the desired transmittance may be about 50%–60% (for a 2 cm thick sample). The preferred half-angle may be about 40–50 degrees for a sample of similar thickness.

[0017] The so-called light depletion distance (DD) from the first light source, which indicates a selected major or significant, for example 90% or a considerable amount, of the intensity loss of the emitted light at a selected wavelength, preferably at least at the visible wavelength, while the light emitted by the first light source propagates through the translucent material, is advantageously between the first distance (H) and the second distance (D), or substantially corresponds to the first distance (H) or the second distance (D).

[0018] The relevant depletion characteristics or indicators may first be determined by measuring, for example, on the surface of a material, a surface area and / or specifically an area of ​​an icon (printing, coating, mask aperture base, etc.) provided thereon, with respect to their optical emission characteristics (e.g., luminance due to light emitted by a first light source). For example, the ratio of the maximum luminance (L_max_leaked) of the area outside the output coupling region to the average luminance (L_average_illuminated) of the intentionally illuminated area (e.g., the output coupling region or its sub-regions, preferably larger than the area outside the output coupling region) may be determined (i.e., L_max_leaked / L_average_illuminated).

[0019] The diameter or size of the region outside the output coupling area used as the numerator in the comparison may be selected as appropriate, for example, half the line width of the icon, or a selected proportion of the diameter or size of the intentionally illuminated region used in turn as the reference type of divider in the ratio. A desired threshold, for example 10% (corresponding to a ratio of 0.1), or preferably less, for example about 1%, about 0.1%, or less, may be selected for the ratio. The distance from the first light source to the region outside the particular output coupling area on the light guide layer that provides the selected threshold may then be considered the light depletion distance. In many practical applications, the depletion distance may be on the order of, for example, about a few millimeters, a few centimeters, or more, as can be understood by those skilled in the art based on the teachings and considerations provided herein. In some alternative embodiments, the luminance measured to determine the ratio may be either the maximum luminance or the average luminance. In addition to or instead of that, the regions considered in the ratio may have the same diameter or size.

[0020] Correspondingly, the light leakage prevention area may define a portion or more of the first surface of the optical guide layer, and the intensity of light from the first light source output-coupled through the light leakage prevention area via the portion of the first surface of the optical guide layer is then preferably less than about 5%, more preferably less than about 2% or 1%, and most preferably less than about 0.1%, of the light emitted by the first light source at a selected wavelength, preferably at least at a visible wavelength, that is output-coupled through the output-coupled area. Clearly, the intensity of the light output-coupled through the portion or any such portion should preferably be less than or equal to, at most, that provided at the depletion distance. In general, luminance determinations (typically measured as Cd / m^2) and ratios (and, for example, area) similar to those described above may again be considered for the light intensity measurement and the subsequent ratio determination, respectively.

[0021] Furthermore, a selected surface area(s), e.g., an output coupling area, a portion thereof (e.g., an illuminated icon on it, or a portion of an icon), or a surface area included in, defined by, or comprising a light leakage prevention area on the first surface of the light guide layer, may preferably exhibit a desired luminance uniformity, e.g., at least about 50%, or more preferably at least about 70%, in response to light from a first light source that has been output coupled through it. The desired method for measuring uniformity can be flexibly selected or determined by those skilled in the art, but one applicable specification is the minimum / maximum luminance ratio (e.g., a ratio of 0.7, and thus naturally corresponding to 70% uniformity). In the case of an icon, the diameter of the measurement area may correspond, for example, to the line width of the icon. In general, a larger target surface area under scrutiny may be divided into several preferably equal-sized, typically non-overlapping measurement (sub) areas (e.g., 4, 6, 8, or 10 areas, or more), from which the areas providing maximum and minimum luminances are first identified, and then the ratios are determined. For this measurement, and for other measurements focusing on light or light intensity-related properties, or specifically, for example, luminance, appropriate equipment, such as a luminance meter, may be applied.

[0022] The considerations presented above and below in relation to the first light source are, of course, generally applicable to other light sources and their respective output coupling regions, light leakage prevention regions, and relevant distances, with the necessary modifications.

[0023] The structure may optionally include a second light source provided on a substrate film and covered by an optical guide layer, wherein the second light source is configured to emit light into the optical guide layer through at least a portion of the light leakage prevention area of ​​the first light source and output coupled therefrom, and the distance between the second light source and the light leakage prevention area is less than the second distance (D). Therefore, the light leakage prevention area of ​​the first light source may include at least a portion of the optical output coupling area of ​​the second light source.

[0024] The second light source may be positioned and optionally aligned such that the intensity of light emitted by the second light source and reaching the output coupling region of the first light source is less than the intensity of light reaching the light leakage prevention region of the first light source. Therefore, the light leakage prevention region of the second light source may include at least a portion of the output coupling region of the first light source.

[0025] Further light sources may be included within the multilayer structure. Each light source may optionally be configured in general accordance with the aforementioned principles such that it reaches its own output coupling region on the first surface with a desired intensity and / or other characteristics, while substantially preventing the output coupling light from reaching the light-blocking regions of other light sources. In addition to or instead of this, some of the included light sources may have output coupling regions and / or light-blocking regions that are at least partially joined to each other.

[0026] In accordance with the principles generally defined herein, preferably, at least the first light source is oriented at least with respect to its light emission direction(s) to provide or direct more light toward the associated output coupling region than the light leakage prevention region, and / or to make the resulting output coupling region larger and further away, or vice versa.

[0027] In a further embodiment, a method for manufacturing an integrated functional multilayer structure is: Preferably, obtain a flexible substrate film containing a moldable, optionally thermoformable material, Preferably, a circuit is provided on a substrate film t using printed electronics technology and / or selected mounting technology, wherein the circuit includes a first light source including at least one light-emitting unit (optionally an LED). The method includes optionally fabricating a monolithic optical guide layer, which is optically attenuating, semi-transparent, and preferably made of a thermoplastic material, onto a substrate film by molding or casting to cover, optically bond, and preferably at least partially embed a first light source. The optical waveguide layer and the first light source are such that the optical waveguide layer includes a second surface opposite to the first surface, the second surface faces the first light source, a part of the first surface includes a predefined output coupling region within a first distance (H) from the first light source for light emitted by the first light source and transmitted through the optical waveguide layer, and the optical waveguide layer further includes a light leakage prevention region that does not overlap with the output coupling region and is separated from the first light source by at least a second, preferably larger distance (D), and are configured such that the attenuation of the emitted light occurring on the direct optical path between the first light source and the output coupling region is smaller than the shortest, optionally also occurring on the direct optical path attenuation between the first light source and the light leakage prevention region, and further, The light transmittance of the translucent material of the optical waveguide layer is about 25% to about 80% at a selected wavelength of a sample of about 2 mm thickness of the translucent material, while the associated half-value angle is about 5 to about 70 degrees.

[0028] According to the present invention, various advantages are provided for a variety of previously implemented solutions, depending of course on each particular embodiment thereof.

[0029] In various embodiments, a translucent, potentially colored, or more strongly colored material (e.g., typically a thermoplastic resin) that optically attenuates (scatters and / or absorbs), which can generally be very flexibly selected or configured, can be used as the optical waveguide material in the structure to skillfully control light propagation, limit it to desired regions and distances, while avoiding substantial leakage into an undesired region called the light leakage prevention region. Thus, different surfaces, icons, symbols, shapes, other features, and structures can be illuminated effectively and controllably, while non-target regions, even if they are nearby or adjacent regions, are not exposed to similar illumination. This makes it easy to provide a more highly integrated and smaller-sized structure, and different features can be arranged close to each other without causing mutual problems due to their relatively short distances.

[0030] The light source used may be equipped with a carrier element that allows the light source to be oriented as desired, thereby providing the possibility of flexibly adjusting, for example, the emission direction and the resulting output coupling region in terms of its position and size. For example, a top-shooting light source may be tilted so that its beam is shifted laterally from directly above the light source toward the side(s). Various embodiments of the present invention can be manufactured or carried out substantially independently of molds and can therefore easily accommodate different print layouts, for example. However, the present invention offers a low-cost and relatively simple approach to carrying out solutions for many purposes. A great many feasible optical guide materials have somewhat lower injection molding temperatures, which may further increase the reliability and associated yield when using, for example, IMSE technology. This is in contrast to materials that require high molding temperatures, which can easily adversely affect the function and condition of features already present on the substrate film(s) or other elements exposed to such temperatures.

[0031] The aforementioned light-guiding material is advantageously either scattering or diffusive (large-scale scattering or multiple scattering can be considered diffusive). This is so that the illumination effect obtained by a light source embedded on a selected target surface (e.g., the outer surface) of a structure (which may include, for example, an icon or other graphical element to be illuminated) is uniform, without obvious hotspots or dark areas, while still avoiding significant or at least excessive light leakage into adjacent areas that may be optionally associated with different light sources and target features (e.g., icons) to be illuminated separately.

[0032] The color, translucency, or diffusion properties of the material(s) used (e.g., the light guide material) may be determined, for example, by mixing in additives (e.g., selected masterbatch or pigment-based color additives). However, the materials of the light guide layer or other layer(s) may differ locally, even within an integrated layer or portion that is identical in terms of its properties (e.g., attenuation or especially diffusion), obtained by altering the material properties (e.g., mixing ratio) during manufacturing or application.

[0033] Various embodiments of the present invention further enable the provision of a so-called "hide until illuminated" effect, for example in IMSE structures, through the clever combination of materials, light sources, and their relative positioning, orientation, and dimensions. For example, elements such as structures or various components, and graphical symbols provided within conductive traces, can be hidden from external visual perception until a light source intended to illuminate them is activated. In these types of embodiments of the present invention, decorative surface printing can be applied to the output coupling area, for example, the associated film (not just the openings), and the associated optical aspects become much easier to control than when using very shallow layers, by embedding the feature parts to be masked from simple external visual perception, for example, to a depth of several millimeters within the light guide material. The proposed solution also reduces process time and cost.

[0034] For example, in various embodiments of the present invention, common problems related to light leakage and uniformity are reduced or overcome for implementing (LED) matrix or segment displays, and furthermore, 3D shape displays (e.g., curved displays or 3D dome displays) can be realized, thus offering clear advantages. Also, fewer traces are required.

[0035] Furthermore, in order to improve light uniformity in the target region and further reduce the number of light sources required, the multilayer structures described herein may include a light guide material and one or more diffusers, which may even be monolithic.

[0036] In various embodiments, several elements of the multilayer structure (e.g., at least one light source) may be contained within a module whose interior remains accessible after the construction of the structure via a removable cover. Thus, the contained elements may be conveniently accessed for purposes such as inspection, repair, rework, reprogramming, or replacement. The module may include one or more elements and, optionally, a wall structure and an internal hollow section housing a joint carrier (e.g., a circuit board for such a carrier).

[0037] In some embodiments, reflectors may be provided around one or more light sources to, for example, reduce light leakage and improve the intensity and uniformity of light on the target output coupling surface. The reflectors can be conveniently mounted, for example, in conjunction with the module and circuit board configurations described above.

[0038] Various other advantages provided by different embodiments of the present invention will become apparent to those skilled in the art based on the following detailed description.

[0039] The expression “several” may, in this specification, refer to any positive integers starting from one (1) and up to, for example, one (1), two (2), or three (3).

[0040] The expression "multiple" may refer to any two positive integers starting with (2).

[0041] The terms "First" and "Second" are used herein to distinguish one element from another, unless otherwise specified, and are not used to assign any particular priority or order to them.

[0042] The typical embodiments of the invention presented herein should not be construed as limiting the applicability of the appended claims. The verb “including” is used herein as an open limitation that does not exclude the existence of features not enumerated. Features enumerated in various embodiments (e.g., dependent claims) can be freely combined with each other unless otherwise specified.

[0043] Novel features that are considered to be characteristics of the present invention are described in particular in the appended claims. However, the present invention itself, with respect to both its structure and its operation, as well as its further objectives and advantages, is best understood when the following description of specific embodiments is read in conjunction with the accompanying drawings.

[0044] Some embodiments of the present invention are shown in the accompanying drawings, as examples, without limitation. [Brief explanation of the drawing]

[0045] [Figure 1] This figure shows various embodiments of the present invention through embodiments of the multilayer structure according to the present invention. [Figure 2] For example, this figure shows another embodiment in which different feature parts, including 3D shaping of the substrate film portion that receives the light source, can be used, at least selectively, in addition to or instead of those in other embodiments intended herein for carrying out the present invention. [Figure 3A] This figure illustrates another embodiment in which the use of different features, such as one or more side-shooting (side-emitting) light sources, optical masking, or light control features, can be used at least selectively in addition to or instead of any of the other embodiments intended herein for carrying out the present invention. [Figure 3B]This figure illustrates another embodiment, in which different features, such as the use of multiple light-emitting units in a light source, can be used, at least selectively, in addition to or instead of any of the other embodiments intended herein for carrying out the present invention. [Figure 4] This is a flowchart of an embodiment of the method according to the present invention. [Figure 5] This figure shows another embodiment of the multilayer structure, the provision of a different feature thereof, for example, an inclined carrier element for a light source, which can be used at least selectively in addition to or instead of any of the other embodiments intended herein for carrying out the present invention. [Figure 6] This figure shows another embodiment of the multilayer structure, in which different features, such as diffusers, can be used, at least selectively, in addition to or instead of any of the other embodiments intended herein for carrying out the present invention. [Figure 7] This figure shows an embodiment of a module that is at least partially replaceable and / or accessible after installation, including one or more light sources and / or other circuits that can be used in connection with various embodiments of the present invention. [Figure 8] This figure shows another embodiment of a multilayer structure, in which different features, such as a reflector or preferably a rigid circuit board for a circuit including at least one light source, can be used, at least selectively, in addition to or instead of any of the other embodiments intended herein for carrying out the present invention. [Figure 9] This figure shows another embodiment of the multilayer structure, in which its different features, such as voids, can be used, in addition to or instead of, any of the other embodiments intended herein for carrying out the present invention, at least selectively. [Figure 10]This figure illustrates another embodiment of a multilayer structure in which different features, such as a 3D-shaped film or other 3D-shaped (i.e., not merely substantially planar) material layer having optical properties, can be used, at least selectively, in addition to or instead of any of the other embodiments intended herein for carrying out the present invention. [Modes for carrying out the invention]

[0046] Figure 1 shows an embodiment of the multilayer structure according to the present invention, indicated by 100.

[0047] The multilayer structure includes at least one substrate film 102, which is preferably made of a flexible, 3D-formable (shape-forming) material, such as a thermoformable (plastic) material. As will be readily apparent to those skilled in the art, instead of a single, optionally monolithic film 102, the substrate film 102 can be a multilayer and / or multi-sectioned configuration having, for example, different layers at least in some places.

[0048] Item 108 preferably refers to at least one optical guide layer provided on the substrate film 102, optionally formed between the substrate film 102 and the element 120. This may be, for example, another (substrate) film, either different from or similar to film 102.

[0049] The optical guide layer 108 includes a first side and an associated first surface 108A. The first surface 108A favorably targets the operating environment of the structure, for example, the user of the structure or a device containing the structure inside. Furthermore, the substrate film 102 includes a second side and an associated second surface 108B on the opposite side. The second surface 108B substantially faces, for example, the interior of the structure or a receiving device.

[0050] As previously mentioned, item 120 may refer to at least one further film, coating, or other functional element. In many embodiments, multiple such elements may be laminated at least locally on the surface 108A.

[0051] The substrate film 102 and / or further films 120 or material layers in general, which are included in the multilayer structure, may contain at least one material selected from the group consisting of polymers, thermoplastics, electrical insulating materials, PMMA (polymethyl methacrylate), polycarbonate (PC), flame retardant PC film, copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural fiber or fabric materials, naturally grown materials, cotton, wool, linen, silk, and any combination thereof.

[0052] The thickness of film 102 and optionally any further films or layers 120 may vary depending on the embodiment. It may be, for example, simply tens or hundreds of millimeters, or it may be considerably thicker and one or several millimeters in size.

[0053] The thickness of the optical guide layer 108 may be selected as needed, but a thickness of several millimeters (for example, about 2 to 5 millimeters) may be applied. The thickness may also be considerably thicker, for example, at least about 1 cm in some places. The thickness may actually vary locally. In addition to accommodating various elements (for example, electronic or optical elements), the optical guide layer 108 may optionally include recesses or internal cavities for purposes such as optical guiding, processing, and / or thermal management.

[0054] Item 104 refers to a circuit provided on the substrate film 102, particularly a circuit including a light source type circuit or component. If the structure includes a further film 120, the film 120 may also be provided with a circuit including, for example, a light source(s), and the film 120 may optionally be electrically or electromagnetically connected to the circuit on the film 102, for example, via intermediate wiring or wirelessly (e.g., capacitively or inductively).

[0055] In the illustration, the (first) light source 104 emits light as indicated by a dotted line extending from the light source 104 to the target output coupling region 112 on the optical guide layer 108. The 104 may be, for example, a top-shooting LED. The output coupling region 112 is located within a first distance H from the light source 104. Thus, the shortest distance between the first light source 104 and the output coupling region 112 is less than or equal to the first distance H.

[0056] Preferably, but not necessarily, in various embodiments, the shortest distance is less than about 20 millimeters, more preferably less than about 10 millimeters, even more preferably less than about 8 millimeters, and most preferably less than about 5 millimeters, for example, about 2 to 5 millimeters. Similarly, the order of the first distance H defining the outer limit for the distance between the first light source 104 and the associated output coupling region 112 may be approximately the same or greater, as will be understood by those skilled in the art.

[0057] Item 105 refers to a possible further, or second, light source, which may be similar to or different from the first light source 104 in terms of radiant characteristics (e.g., emission technique, wavelength, power, beam type, and direction), configuration, or dimensions. The second light source 105 is located at a distance from the first light source 104. The distance may be selected as appropriate. For completeness, it should be noted that in various embodiments of the present invention, there may, of course, be more light sources 104, 105 embedded. These may be collectively or independently controlled by included, or at least functionally connected, control circuits.

[0058] In supplementary or alternative embodiments, the light sources 104, 105 may be, for example, top-emitting, side-emitting, double-sided, and bottom-emitting LEDs, or other types of light sources. Generally, for example, packaged semiconductor type or chip-on-board semiconductor type light sources (preferably LEDs) may be used. Furthermore, with respect to packaging, the light sources 104, 105 may optionally be of the flip-chip type. In some embodiments, the light source 104 may include multiple (two, three, four, or more) light-emitting units (e.g., LEDs) that are packaged or at least grouped together. For example, a polycolor or specifically RGB (red-green-blue) LED consisting of multiple LED emitters may be provided in a single package.

[0059] Item 114 preferably refers to a light-blocking region that receives little light from the first light source 104 and / or transmits little light from the first light source 104. The optional second light source 105 described above may still be located, for example, within the light-blocking region 104, or at least closer to the light-blocking region than the first light source 104. In this embodiment, the first light source 104 has a direct line of sight (LOS) to both the output coupling region 112 and the light-blocking region 114 with substantially no light-blocking elements.

[0060] In some embodiments, the light-blocking region 114 may substantially consist of a surface region or area of ​​the optical guide layer 108 on the first surface 108A. In some other embodiments, in addition to or instead of the above, it may include or consist of at least a volume or area of ​​the optical guide layer 108 below the surface 108A (for example, at least a plane that crosses the substrate film 102 at a distance D), which is shown in Figure 1 by a dotted line fill pattern surrounding the second light source 105.

[0061] In fact, in some embodiments, the light leakage prevention region 114 may define a selected, optionally substantially cubic, cubic, or cylindrical subvolume of the optical guide layer 108, for example, optionally extending through the optical guide layer 108 across the first surface 108A and the second surface 108B.

[0062] However, depending on the embodiment, the light-blocking region 114 may include a plurality of surface regions, for example, at least one region on the surfaces 108A and 108B of the light guide layer 108.

[0063] Preferably, the structure 100 is constructed, for example, in terms of dimensions, features, such as the position and arrangement of components, elements, or material layers, and the materials used, such that the light from the first light source 104 reaching the light-forbidden area 114 is below a threshold (the threshold is considered to be the depletion distance DD). This threshold may be determined as appropriate in terms of a selected criterion, such as luminous intensity, illuminance, or brightness, as will be described in more detail elsewhere in this specification.

[0064] Therefore, the depletion of light on its way from the light source 104 to the restricted area 114 can generally be controlled, for example, by the selection and / or preparation of the translucent material of the light guide layer 108, through its attenuation characteristics, which include substantially scattering (diffusion) and absorption. However, depletion can also be controlled, for example, by the position of the light source 114 and its distance D (preferably greater than distance H) to the area 114.

[0065] In a preferred embodiment, the light transmittance of the translucent material selected for the optical guide layer 108 may be about 25% to about 80% at selected wavelengths (e.g., at least a portion of the visible wavelengths), for example, considering a translucent material sample about 2 mm or 3 mm thick. The associated half-width angle can be about 5 to about 70 degrees, or 75 degrees (on an intensity basis). In different usage scenarios, the desired transmittance and scattering may, of course, vary further. As mentioned above, in some embodiments, the optical guide layer 108 may include, at least in certain locations, a material that is substantially transparent (e.g., transmittance of 95% or more, and a half-width angle that is substantially low, if not zero).

[0066] Appropriate translucency and attenuation of the optical guide layer 108 can be achieved, for example, by using scattering elements in the optical guide material. As the amount of scattering elements increases, scattering / diffusion and angle at full power also increase as one possible measurable indicator, but the light transmittance through the layer decreases overall. Correspondingly, as the layer thickness increases, scattering / diffusion properties (e.g., angle at full power) increase overall, and transmittance decreases.

[0067] For example, considering the scattering (diffusion) properties as described above, the optical guide layer 108 may generally contain at least one material selected from the group consisting of, for example, polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermosetting materials, elastomer resins, PC, PMMA, ABS, PET, copolyester, copolyester resin, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanized rubber), and MS resin.

[0068] An example of an applicable polycarbonate-based material is Makrolon®, available in a variety of colors / hues (e.g., white / whitish and black / dark, or dark), transparency, and scattering properties. For example, color code 021182 ("Cool White") is a possible choice.

[0069] As mentioned above, colored or more heavily colored resins can provide a feasible option for the optical guide layer 108 to conceal the interior (e.g., light sources 104, 105, or other circuits) from external perception by limiting undesirable light leakage inside and outside the structure 100 to nearby elements. Originally, a colored masterbatch may be doped into a transparent base material, such as a plastic resin (e.g., polycarbonate). In many use scenarios, the structure 100 may only be a few millimeters or centimeters thick in total, and the optical guide layer 108 on top of that, and very satisfactory results can be obtained by using a 2-4 mm (e.g., 3 mm) plastic resin with a selected masterbatch (e.g., white or a resin of a desired selected wavelength) as the optical guide layer 108 at a desired concentration (e.g., a letdown ratio of about 1%). In general, in many embodiments in the context of the present invention, feasible letdown (doping) ratios are actually about 5%, 4%, 3%, 2%, 1%, or less. For example, a masterbatch suitable for your purpose is provided by Lifocolor®.

[0070] Furthermore, provided that the light sources 104 and 105, which are provided on the film 102 to illuminate dedicated, different target output coupling regions 112, are separated from each other by an appropriate distance (for example, about 4 millimeters), good illumination uniformity can be obtained on the output coupling regions 112 without significant light leakage to adjacent regions, including the prohibited regions 114.

[0071] In the case of a 12mA LED-type light source, the light intensity measured on the surface of the light guide layer 108 is only a small fraction of the original intensity, for example, about 5%, 1%, or 0.1% or less, at a lateral distance of only about 15 millimeters from the actual LED's position below it. This has been found to exceed the attenuation possible for many real-world use scenarios in terms of undesirable light leakage.

[0072] If the light guide layer 108 is substantially white or whitish in color, the colors perceptible in the environment can be cleverly adjusted by the light source and its emission wavelength, as those skilled in the art will understand. Such adjustment can be flexibly achieved by a multicolor light source, such as an RGB-LED (red-green-blue LED), or by a group of light sources emitting different wavelengths.

[0073] The aforementioned "invisible until illuminated" effect can be achieved, for example, by adding a translucent (e.g., exhibiting a selected color) masterbatch to the injection-molded base resin constituting the light guide layer 108. However, the substrate film 102 used may be substantially opaque, black, and / or otherwise exhibit a dark color. Thus, "icons invisible until illuminated" can be provided on the surface 108A, for example, by referring to a printed element 122, a transparent or translucent film 120 with a printed icon, and / or an opaque / dark / colored film arranged with one or more openings among other options. Using, for example, a translucent black masterbatch of about 3% may be sufficient to visually conceal the underlying components, such as circuits or light sources 104, and traces 106, for example, from external perception. The embedded underlying elements (e.g., components and traces) may be further prepared from a material that provides a dark color (preferably highly attenuating or absorbing optically). Alternatively, transparent materials can be utilized. Different lighting effects can be achieved by using different colors. The translucent material of the light guide layer 108 may be adapted generally or selectively to the color(s) used on the surface 108A, for example, the color(s) indicated by the ink or film present thereon.

[0074] As mentioned above, by using a resin exhibiting white color as the light guide layer 108 and employing an appropriate configuration in which a multicolor light source (e.g., RGB-LED) is embedded, it is possible to illuminate virtually any color on the (white) surface 108A as needed, according to the configuration.

[0075] To measure and characterize the scattering (diffusion) properties of the material under consideration or selected, a portion of the material (e.g., one corresponding to the dimensions of the optical guide layer 108, or a representative sample of another size) may be covered with a mask containing a small orifice and illuminated from the back. A goniometer may be used to measure the intensity of light passing through the orifice at different angles to determine, for example, the half-angle of maximum power (FWHM).

[0076] Scattering or diffusion (multiple scattering occurring in a material can be considered diffusion) may be characterized and determined based on the level of so-called haze in a translucent material. Haze can be defined as the ratio of diffuse transmittance to the total transmittance of a test specimen or sample of the material. Haze may be measured or determined based on a selected standard (e.g., ASTM D1003). In the context of various embodiments of the present invention, haze may be (the ratio of diffuse transmittance from the incident beam to the total transmitted light that is more than 2.5 degrees), for example, about or at least about 20%, 30%, 40%, 50%, 60%, or more. A haze meter or photometer may be used for measurement, for example, according to a selected test method or standard (e.g., those mentioned above). Thus, from the viewpoint of the present invention, there are different methods and approaches that can be selectively used by those skilled in the art to select, verify, and compare several different materials and their configurations (dimensions, doping / mixing with additives, etc.).

[0077] The aforementioned second light source 105 may, if included, be configured in some embodiments to emit light into the optical guide layer 108 and output couple from there through at least a portion of the light leakage prevention region 114 of the first light source 104. The second light source 105 may be positioned and optionally aligned such that the intensity of the light emitted by the second light source 105 and reaching the output coupling region 112 of the first light source 104 is less than the intensity of the light reaching the light leakage prevention region 114. Therefore, the distance between the second light source 105 and the light leakage prevention region 114 may be less than the second distance D.

[0078] Accordingly, in some embodiments, the first light source 104 and the second light source 105 may have functional configurations within the structure 100 that are at least partially mirror-like, and optionally also dimensional or positional configurations, and each of them 104, 105 may have its own output coupling region that also defines at least a portion of the light-forbidden region of the other light source. The light sources 104, 105 may be optionally controlled dynamically (e.g., alternately, or generally from time to time, and / or independently) to illuminate their own output coupling regions and / or elements thereon, while not causing any significant problems (e.g., light leakage) and therefore not causing undesirable illumination of the other light output coupling region.

[0079] Item 121 refers to an optional encapsulant, glove top, or other conformal coating (e.g., Illumabond® or Triggerbond®) for photoforming or other processing, protection, and / or fixation purposes. The material used may be distributed over a selected circuit (e.g., a first light source 104). For example, it may be substantially transparent. Alternatively, it may be colored and / or translucent. In some embodiments, specific optical functions or features (e.g., lenses) may be provided by the encapsulant. The lenses may be, for example, diffusive, Fresnel, or collimating. In addition to or instead of this, off-the-shelf lenses or optical components in general may also be included in the structure.

[0080] As briefly stated above, item 122 may refer to at least one functional element that is mounted and / or additionally manufactured in situ, for example by printing (e.g., screen printing, inkjet, or 3D printing) on ​​the first surface 108A of the optical guide layer 108, which is optionally located adjacent to and / or on the output coupling region 112 or the light leakage prevention region 114. If there is also, for example, a film 120 on the surface 108A, the functional element 122 can be provided on either side, i.e., the side facing the optical guide layer 108 or the opposite side, and therefore facing the environment. On the side facing the optical guide layer 108, the element 122 will be better protected from the environment.

[0081] Functional elements 122 may be selected from the following group: light-shielding (masking) elements, graphical elements (e.g., icons, symbols, patterns, alphanumeric elements, images, etc., which may have a display property, such as a status indicator for a receiving device or connected device), light diffusers, reflectors, dispersion elements, and collimators. Optically, functional elements 122, as well as films 102, 120, may be transparent, translucent, or opaque, such as color printing or layers. However, item 122 may refer to conductive traces, electrodes, electrical insulators, electronic components, circuit elements, or connectors, for example.

[0082] In some embodiments, the functional element can be monolithic with the optical guide layer 108, as will be described in more detail below with reference to Figure 9.

[0083] Therefore, the functional element(s) 122 may have, among other options, a display function, an optical function, a connectivity function, or an electrical (conductive, insulating, sensing, or other) property.

[0084] As previously mentioned, the element(s) 122 may be positioned, for example, adjacent to the output coupling region 112, or partially or completely overlapping it. The first light source 104 may be configured to illuminate the element(s) 122 (e.g., graphical elements) in a way that makes them visually prominent to the user in the environment 100 of the structure. Further light sources potentially included within the structure 100 (e.g., a second light source 105) may have similar functions with respect to their associated output coupling regions / functional elements (which may be different from or the same as those of the first light source 104), as already mentioned above.

[0085] Item 122a provides a graphical example of element 122, in this example particularly of icon type, where a snowflake and a seat belt are positioned apart from each other. These can then be selectively illuminated by a light source(s) below them contained within the structure 100. For example, at least one of the elements 122 can be positioned within a first distance H (and therefore also within a second distance D) from a first light source 104 on an output coupling region 112 so that it is illuminated by the light source 104 when it is on (emitting light). The remaining elements 122 can then be positioned on the output coupling region of a second light source 105, which may be contained within the light-depletion region 114 of the first light source 104, and can be correspondingly illuminated by the second light source 105 or any further light source. A surface region indicating the aforementioned light-depletion distance for the light of the first light source 104 can exist between the two elements 122. In any case, preferably, the light sources 104, 105 are independently controllable in order to make the elements 122 perceptible independently of the environment 100 of the structure.

[0086] The circuitry 106 contained within the structure 100 may include, in addition to several light sources 104, 105, electrically conductive traces or contact pads optionally printed on the film 102 and / or other material layers of the structure 100 using, for example, printed electronics technology. Such traces may be configured for the transfer of power and / or data (e.g., signaling data or other data) between elements (e.g., light sources and associated controllers and / or power supplies).

[0087] Furthermore, the circuit 106 may generally include one or more electrodes, electrical connectors, electronic components, and integrated circuits (ICs) (e.g., control circuits or data transfer circuits). The circuit 106 may be manufactured in or directly for the structure 100 by a selected method(s), for example, printed electronics technology, optionally screen printing, or other additive printing, or generally coating technology.

[0088] In addition to or instead of the above, the circuit 106 may include several mounted components (e.g., surface mount devices (SMDs)). Therefore, non-conductive and / or conductive adhesives may be used to secure the mounted components to the carrier. In some embodiments, mechanical fastening is implemented or at least reinforced by an electrically non-conductive adhesive material, while solder or other electrically highly conductive (but less conductive, adhesive-type) materials are used to obtain electrical connectivity.

[0089] For example, if capacitive sensing of gestures (e.g., touch or touchless gestures) on a structure 100 is to be implemented, the configuration (dimensions, positioning, etc.) of the sensing electrodes of the circuit 106 may be such that the sensing area or volume, defined by the relevant electric field, is positioned as needed, thereby covering, for example, a selected side wall and / or top area of ​​the structure, and / or other areas that should be highly sensitive to touch and / or touchless gestures. This type of configuration may be achieved or implemented, for example, by utilizing appropriate simulation or measurement.

[0090] Furthermore, the circuit 106 may include at least one component selected from the group consisting of the following, and / or the remaining multilayer structure may include: electronic components, electromechanical components, electro-optical components, radiation emission components, light-emitting components, LEDs (light-emitting diodes), OLEDs (organic LEDs), side-shooting LEDs or other light sources, top-shooting LEDs or other light sources, bottom-shooting LEDs or other light sources, radiation detection components, photodetection or photosensitive components, photodiodes, phototransistors, photovoltaics, sensors, micromechanical components, switches, touch switches, touch panels, proximity switches, touch sensors, air sensors, temperature sensors, pressure sensors, moisture sensors, gas sensors, proximity sensors, capacitive switches, capacitives Sensors, projected capacitive sensors or switches, single-electrode capacitive switches or sensors, capacitive buttons, multi-electrode capacitive switches or sensors, self-capacitive sensors, mutual capacitive sensors, inductive sensors, sensor electrodes, micromechanical components, UI elements, user input elements, vibration elements, sound generation elements, communication elements, transmitters, receivers, transceivers, antennas, infrared (IR) receivers or transmitters, wireless communication elements, wireless tags, radio tags, tag readers, data processing elements, microprocessors, microcontrollers, digital signal processors, signal processors, programmable logic chips, ASICs (application-specific integrated circuits), data storage elements, and electronic subassemblies.

[0091] Structure 100 may be an external system or device (e.g., a receiving device or receiving arrangement for the structure) and may be connected to them in many usage scenarios. This may be carried out by connectors, such as electrical connectors or connector cables, which may be attached to Structure 100 and its elements (e.g., circuit 106) in a selected manner (e.g., with respect to communication and / or power). The attachment points may be, for example, on the sides or bottom of the structure. Through holes may be provided within the film 102 for connectivity purposes.

[0092] In various embodiments, at least the first light source 104 may be oriented in general, at least with respect to its light emission direction(s), to provide more light towards its target output coupling region 112 than, for example, the light leakage prevention region (114), and / or to adjust the resulting output coupling region 112 to be larger and further away, or vice versa (smaller and closer).

[0093] Regarding the available options for positioning and oriented the light source(s) of the structure 100 as needed, for example, with respect to their illumination characteristics, Figure 2 shows the following embodiment in 200. That is, the first light source 104 is tilted with respect to a reference (e.g., the top surface of the arrangement 200 or the original plane of the substrate film 102) by 3D shaping (preferably thermoforming) the receiving substrate film 102 to establish at least a local 3D shape (e.g., a protrusion or recess at the location of the first light source 104), thus tilting the light source 104. Thus, the radiation direction(s) of the light source 104 are adjusted in a desired manner. For example, a top-shooting light source may be adjusted to hit or fire further away on the surface 108A (e.g., to conveniently illuminate an icon or other graphical / functional element 122 from the side, while the volume directly below the illuminated feature can optionally be used for other purposes (e.g., sensing and sensing electronic equipment)). A side-shooting light source may be adjusted to illuminate the area 112 (shown in the figure) above it, in addition to or instead of the side-shooting light source. Thus, depending on the embodiment, the inclination may facilitate illuminating a larger or smaller area than would otherwise be possible, and / or achieving better uniformity for surface illumination.

[0094] Figure 3A shows a particular embodiment of 300 that has already been briefly described. In one embodiment, the light source (for example, the first light source 104) may be configured to illuminate multiple output coupling regions 112 rather than a single unified region. However, the light source 104 may also be configured to illuminate output coupling regions 112 that are shifted laterally from directly above the light source 104.

[0095] Multiple regions 112 and lateral shifts may be achieved, for example, by the radiation characteristics of the light source 104 itself and / or by using a functional element 122 (e.g., a light-shielding or masking feature on the relevant optical path). The light source 104 may emit light in multiple (e.g., two) directions or substantially through two beams, for example, considering a suitable side-emitting LED. In addition to or instead of this, a masking feature (e.g., an opaque print) may be used to divide the illumination pattern into multiple cut sections when visually inspected from the outside. However, carrier elements, which will be described in more detail with reference to Figure 5, or 3D shaping of the substrate film 102 (returning to Figure 2) may be utilized.

[0096] Similarly, Figure 3B shows that in 350, multiple light-emitting units 104a are used in at least a single light source 104. The units 104a may have similar and / or different characteristics (e.g., emission direction, emission wavelength / color, beam width, intensity). Together, these 104a can extend to a larger output coupling region 112 than would otherwise be possible. Nevertheless, the optical uniformity on the region 112 can still be conveniently adjusted or "fine-tuned," for example, by changing the proportional intensity of the units. Various lighting effects (e.g., fades, temporally and spatially complex lighting patterns, animations, etc.) may be obtained on the region 112 and elements 122 (e.g., icons or other graphical elements therein).

[0097] As already mentioned, more complex feature areas (e.g., matrix or segment displays) may be implemented by applying multiple light sources 104, 105, or at least multiple light-emitting units 104a within a single light source 104, 105. As in other applications and embodiments, a diffusive translucent resin may be used as a light guide layer 108 to adequately block the light. Light emitted from each light source or emitting unit can penetrate to the surface and associated output coupling areas, but the range within the translucent material is limited so that the light does not mix noticeably with adjacent output coupling areas of other light sources or units(s), at least substantially. Furthermore, surface features (e.g., embossing, film, or printing 120, 122) may be configured to provide desired visual effects (e.g., pixel map appearance or 3D effect) if required by the application.

[0098] In 360, we demonstrate how different dynamically illuminated elements visible from the outside (e.g., symbol or matrix / segment display) can be cleverly constructed by combinations of embedded light sources 104, 105, an intermediate translucent light guide layer 108, and, for example, an uppermost film 120 and / or other functional elements 122. For example, the lighting effect can be restricted to a desired output coupling region 112 by surrounding a printed or laminated film-type (preferably substantially opaque) light block or mask 120, 122. A more translucent (e.g., translucent) print or film that optionally exhibits color can then be used on the actual output coupling region 112. Segment dividing lines can be implemented, for example, by localized substantially opaque print or film.

[0099] Figure 4 shows a flowchart of an embodiment of the method according to the present invention at 400.

[0100] In the initiation of a method for manufacturing a multilayer structure, a startup step 402 may be performed. During startup, necessary tasks (e.g., selection, acquisition, calibration, and other configuration tasks of materials, components, and tools) may be performed. Special care must be taken to ensure that the individual elements and material selections work together to withstand the selected manufacturing and installation processes. This is, of course, preferably by checking in advance based on the specifications of the manufacturing process and component data sheets, or by examining and testing a manufactured prototype in detail. Accordingly, the equipment to be used (in particular equipment that provides measurements such as molding, IMD (in-mold decoration), lamination, joining, (thermo)forming, electronic assembly, cutting, drilling, printing, and / or desired optical measurements) may be brought up to operational status at this stage.

[0101] In 404, an optional flexible substrate film is obtained, of which at least one of plastics or other materials for housing, for example, electronic equipment. The substrate film may initially be substantially flat or, for example, curved. The substrate film may be made of at least one or more materials that are substantially electrically insulating. Off-the-shelf elements (e.g., rolls or sheets of plastic film) may be obtained for use as the substrate material. In some embodiments, the substrate film itself may first be manufactured in-house by forming it from the selected starting material(s) using a mold or forming apparatus or other method. Optionally, the substrate film may be further processed at this stage, for example, by giving it holes, notches, recesses, cuts, etc.

[0102] In 406, several electrically conductive elements, such as conductor lines (traces), sensing elements (e.g., electrodes), and / or contact areas (e.g., pads), are provided on one or both sides of the substrate film(s), preferably by one or more additional techniques of printed electronics technology. For example, screen printing, inkjet printing, flexographic printing, gravure printing, or offset lithography printing may be applied by appropriate printing apparatus(s). In some cases, subtractive or semi-additive processes may also be used. For example, further actions to develop the film(s), including printing or generally providing graphics, visual indicators, thermal conductors, optical elements, etc., may be performed here.

[0103] In various embodiments, the electrically conductive element may include at least one material selected from the group consisting of conductive inks, conductive nanoparticle inks, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesives, carbon fibers, alloys, silver alloys, zinc, brass, titanium, solder, and any component thereof. The conductive material used may be optically opaque, translucent, and / or transparent at a desired wavelength (e.g., at least a portion of the visible light) in order to, for example, mask, reflect, absorb, or pass through radiation (e.g., visible light). This embodiment is described elsewhere in this specification.

[0104] In 408, further circuits (e.g., one or more typically off-the-shelf components, including electronic components (e.g., various SMDs)) may be attached to contact areas on the film(s), for example, by solder and / or adhesive. For example, a light source(s) (e.g., LEDs) of selected technology and packaging may be provided here, as well as various elements of control electronics, communication, sensing, connection (e.g., connectors), acceptance (circuit board(s), carrier(s), etc.), and / or power supply (e.g., battery), depending on the embodiment. For example, a suitable pick-and-place or other mounting device may be used for this purpose. Alternatively or additionally, printed electronics technology may be applied to actually manufacture at least a portion of the components (e.g., OLEDs (organic LEDs)) directly on the film(s). Thus, as those skilled in the art will understand, the execution of items 406 and 408 for providing the desired circuits in the multilayer structure may overlap in time. Furthermore, the installed components may include various optical elements (e.g., lenses, reflectors, diffusers, masks, filters, etc.) or carrier elements having optionally inclined surfaces for housing circuits and / or circuit boards for those circuits.

[0105] The selected and provided elements may be subjected to further processing (e.g., encapsulation).

[0106] For completeness and with regard to the provision of circuits and components to the structure, item 409 refers to the possible mounting of one or more modules or other subsystems or “subassemblies” that can incorporate electronic equipment, such as light sources, ICs, and / or various components as intended elsewhere herein, initially on a separate secondary substrate, such as a circuit board. At least some of the electronic equipment and / or other elements of a multilayer structure may be provided to the substrate film(s) via such modules or subassemblies. Optionally, the modules or subassemblies may be at least partially overmolded with a protective plastic layer before mounting to the main substrate. For example, adhesives, pressure, and / or heat may be used for the mechanical bonding of the module subassembly to the primary (receiving) substrate. Solder, wiring, and conductive inks are examples of applicable options for providing electrical connections between elements of the module or subassembly and with the remaining electrical elements on the main substrate. Item 409 can also be performed, for example, in the context of item 408. Its illustrated location is primarily typical.

[0107] In some embodiments, before or during the molding step 412, a substrate film(s), which preferably already includes, for example, at least a portion of a circuit design, e.g., (printed) conductive elements, and further elements, e.g., electronic components, optical elements, and / or modules, or subassemblies, may be (3D) shaped or "formed" 410, for example, using thermoforming or cold forming, to exhibit a desired shape, e.g., at least locally three-dimensional (substantially non-planar) shape. A suitable forming apparatus (e.g., a thermoforming machine) may, of course, be used for this purpose. The bidirectional curved arrows in the diagram are to highlight the fact that molding 410 can be performed alternatively or additionally, for example, at item 408, between item 406 and item 408, or even at or before item 406. In addition or instead, if an already established multilayer laminate is designed to withstand such processing, at least some of the forming can be performed after molding.

[0108] Advantageously, the circuits are provided, if not entirely, at least partially on film 102 and optionally on film 120 before the aforementioned 3D shaping of the film(s), or when the film(s)(s) are still substantially planar or at least more planar, thereby avoiding subsequent redundant and less reliable 3D assembly of electronics on an already 3D-shaped carrier.

[0109] In 412, for example, at least one plastic layer, preferably a thermoplastic or thermosetting layer, which functions as an optical guide, is manufactured on the substrate(s) and preferably molded (e.g., by injection molding) to preferably at least partially embed the circuitry of the multilayer structure, and further components, elements, or even modules / subassemblies. Desired portions may be left transparent, or later made transparent by mechanical or chemical treatment, as described elsewhere herein, for example, with regard to cover portions of modules for receiving interchangeable elements. The molded material(s) may be provided using multiple molding steps or shots, or through a single step. The molded material may optionally even flow, for example, through a film, from one side thereto to the opposite side, through holes provided therein, or by penetrating the substrate material itself (e.g., through thinned / slightly thinner portions). The molded material(s) may, for example, be substantially electrically insulating. As intended herein, the material is also advantageously translucent to preferably function as a lossy or attenuating optical guide.

[0110] In practice, at least one substrate film already having several further features (e.g., at least a portion of a circuit and potentially several different optical elements or modules) may be used as an insert in an injection molding process to which at least one molding machine is applied. If two films are used, both may be inserted into their own mold halves so that a plastic layer is injected at least between them. Alternatively, the second film can be later attached to the already established assembly of the first film and the plastic layer by a suitable lamination technique, for example, using an adhesive between them.

[0111] Regarding the overall thickness resulting from the obtained laminated multilayer structure, it depends on the materials used and the associated minimum material thickness, for example, to provide the necessary strength considering manufacturing and subsequent use. These embodiments must be considered on a case-by-case basis. For example, the overall thickness of the structure can be on the order of a few millimeters, as described elsewhere in this specification, but considerably thicker or thinner embodiments are also achievable.

[0112] Item 414 refers to possible further tasks (e.g., post-processing and installation work). Further layers or general feature parts may be added to the multilayer structure by molding, lamination, or appropriate coating (e.g., deposition) procedures, with respect to other possible positioning or fixing techniques. Layers may have protective, display, and / or aesthetic value (e.g., graphics, colors, figures, text, numerical data) and may include, for example, textiles, leather, or rubber materials instead of or in addition to (further) plastics. Further elements (e.g., electronics, modules, module interiors or components, and / or optical components) may be attached and fixed to, for example, the outer surface(s) of the structure (e.g., the outer surface of the film or molded layer included, depending on the embodiment). Molding / cutting of necessary materials may be performed. For example, diffusers may be manufactured by locally laser-cutting optical guide material, as intended elsewhere in this specification. Where connectors are provided, connectors in the multilayer structure may be connected to desired external connection elements (e.g., external devices, systems, or structures, e.g., external connectors of receiving devices). For example, these two connectors may together form a plug-and-socket type connection and interface. In this specification, the multilayer structure may also be arranged and mounted in general in larger assemblies (e.g., electronic receiving devices, optionally personal communication devices, computers, home appliances, industrial equipment, or, for example, a vehicle in embodiments where the multilayer structure forms part of the exterior or interior of the vehicle (e.g., the dashboard)).

[0113] At 416, the execution of the method ends.

[0114] Figure 5 shows an inclined carrier element 513 for a light source at 500. This can be used, at least selectively, in addition to or instead of any of the feature parts of the embodiments of the preceding figures when carrying out the present invention. In fact, instead of or in addition to 3D shaping the underlying substrate film as done in Figure 2, an optional obliquely cut surface 513A, inclined with respect to the plane of the underlying substrate film and / or surface 108A, for receiving at least a first light source 104, can be provided, for example, by an element 513 placed on the substrate film 102, and the light source 104 and, for example, its emission direction(s) or, in the case of a sensor-type circuit provided on the element 513, can be cleverly oriented as needed and, as described above, the light source 104 and, for example, its emission direction(s) or, in the case of a sensor-type circuit provided on the element 513, its detection direction(s) can be cleverly oriented.

[0115] Element 513 may include a plastic material (e.g., thermoplastics, metals, ceramics, etc.). It 513 may be manufactured, for example, by (injection) molding or 3D printing. However, it 513 may be manufactured for different inclination angles depending on the use case. The material may be thermally conductive at least locally to improve heat dissipation. Electrical conductivity can be provided at least in place to enable electrical connectivity on and / or through it.

[0116] When a light source is accepted, the inclined surface 513A can improve the size and uniformity of the resulting further-remote illumination area, but it may also be used to accept sensors or various actuators, thereby improving the effective area of ​​these sensors or actuators. The illumination area / output coupling area 112 on surface 108A may be shifted horizontally or laterally, for example, from the area directly above the light source 104 associated with a top-emitting light source, or it may be moved closer, for example, in relation to a side-shooting light source. Similar beneficial effects can also be obtained with a 3D-shaped substrate film 102, as described in relation to Figure 2.

[0117] Element 513 may include a flat surface(s) and / or top for convenient assembly (e.g., a pick-and-place surface mount process) and / or for receiving further elements, such as printed or mounted electrodes (e.g., for capacitive sensing or other touch / gesture sensing) or other electronic elements or components. Since the top surface of element 513 is closer to the environment of the structure on surface 108A, it may be useful to utilize the top surface of element 513 for sensing purposes, for example.

[0118] In some embodiments, a circuit board 502 for housing at least a portion of the circuit (e.g., a first light source 114 and, for example, a trace or other circuit 106) can be provided as an integrated, optionally monolithic, or separately from the inclined element 513 defining the surface 513A. In some embodiments, the circuit board 502 may also be employed separately without the element 513 and the associated inclined surface 513A.

[0119] The circuit board 502 may include at least one element selected from the group consisting of: a flexible film or sheet, a rigid sheet, a rectangular sheet or film, a rounded or substantially circular sheet or film, an FR4-based circuit board, a flame-retardant circuit board, a metal core circuit board, a plastic substrate, a molded product such as an injection-molded plastic substrate, a metal substrate such as a sheet metal substrate optionally having at least selectively provided electrical insulating layers, or a ceramic circuit board.

[0120] Circuits 106 and 114 on the circuit board 502 may be configured to be electrically and preferably thermally connected to several locations in the remaining multilayer structure to the side or below the circuit board. The connections may be made using at least one connecting material 516 positioned between them, preferably positioned at least around the circuit board 502 (if present). For example, electrically and / or thermally conductive solder, ink, or adhesive may be used for this purpose.

[0121] Using the circuit board 502 can facilitate thermal management, for example, related to high-power light sources (e.g., high-power LEDs). Among other benefits, it can prevent damage to the substrate film 102 due to excessive heat buildup by electronic equipment. The circuit board 502 can function as a heat sink. However, using the circuit board 502 can facilitate the assembly and provision of electronic equipment onto the surface 513A, for example, by utilizing mechanical mounting features (e.g., compatible fixing features, such as protrusions and / or holes on the surface 513A and the substrate 502, respectively) and / or adhesives.

[0122] Figure 6 shows an embodiment of a diffuser included in any multilayer structure described herein, in 600. Item 122, which describes the functional elements in general, may in particular refer herein to a print to be illuminated (e.g., an icon) that potentially covers all or most of the output coupling area 112, while item 122A may refer, for example, a surrounding or at least adjacent opaque print, coating, or film that blocks light. A further film 120 may be provided on top, in addition to or instead of the above, for protection and / or other purposes (e.g., to perform further optical functions). The film 120 may be transparent / substantially transparent, or it may be colored to have specular or diffuse transmission properties with respect to the transmitted wavelength, for example.

[0123] Therefore, a diffuser 109 with varying thickness is preferably provided and positioned on the optical path extending from the light sources 104, 105 to the environment of the structure via the output coupling region 112 of the light sources 104, 105. The diffuser 109 may optionally be monolithic with the optical guide layer 108 and the translucent material of the optical guide layer 108. Furthermore, it 109 may be fabricated additionally on the optical guide layer and / or subtractively from layers 120, 120b, 122 on the optical guide layer 108, for example. Including a ready-made diffuser 109 component within the structure is a further option and may optionally be provided in association with or integrated with a larger module including, for example, light sources, carrier elements, circuit boards, and / or associated wall structures. Alternatively, these different options may be selectively combined by those skilled in the art to devise a desired diffuser 109. Optionally, the diffuser 109 may include, or be adjacent to, an air cap or cavity filled with some other material (e.g., a diffusion material).

[0124] The diffuser 109 can improve the illumination performance of the structure (for example, illumination uniformity on the output coupling region 112). Therefore, the diffuser 109 can prevent, for example, the occurrence of hot spots or dark spots.

[0125] The diffuser 109 may be manufactured, for example, from a diffusion plastic, by (injection) molding, 3D printing, or other additive methods, or by CNC milling or laser processing. For example, the transparency and translucency of the light guide layer 108 may be locally altered using a laser, and the diffuser 109 may be implemented from there. Alternatively, the diffuser 109 may be constructed from multiple printed laminates. The filtering properties of the diffusion layer(s) of the diffuser 109 may be optionally different from each other and may be used, for example, to block a selected color. A diffuser 109 that is white, whitish, or monochromatic, if not substantially transparent or at least colorless, can be used as a default solution for general applications, while a multicolor option may prove useful, for example, in an area diffuser 109 having various areas associated with a particular color. Light blocking or black areas may be further integrated with and implemented within the diffuser 109. Thus, the diffuser 109 may be used to prevent light from entering an undesirable area (e.g., surface 108A). This may reduce the need for further blocking (opacity) printing.

[0126] Figure 7 shows an embodiment of a module in 700 that includes, for example, one or more of the light sources 104, 105 and / or other circuits that are generally included within the multilayer structure described herein, which is at least partially replaceable or accessible after installation.

[0127] Adjacent to the translucent material of the light guide layer 108, the module is advantageously provided having a wall structure 724, the wall structure 724 substantially surrounds, preferably also in contact with, an optionally spring-loaded (see spring element 722) circuit board 502 having the properties already described in relation to Figure 5, at least laterally, and optionally in contact with, a module is provided that accepts light sources 104, 105 and optionally further circuitry 106 (e.g., traces, control electronics, etc.). However, a replaceable power source (e.g., a rechargeable or disposable battery) can be provided within the module and made easily accessible thereto.

[0128] Advantageously, the substrate 502, the light source(s) 104, 105 on it, and / or any further elements included (e.g., radiation / photodetectors, batteries, processing units, memory, data interface devices, contacts or especially programming pads, pins, traces, etc.) are accessible, and one or both of them are more preferably replaceable externally from the environment of the structure via a movable, optionally hinged or fully removable cover 718 of the module provided on, for example, a first surface 108A and / or a second surface 108B. The surface layers(s) 108A, 108B may actually include openings to provide easy access to the embedded module. Item 702 refers, for example, to the base layer of the module that gives support to the wall structure 724 and / or the substrate 502. In some embodiments, the base 702 may be omitted.

[0129] The cover 718 may include, for example, a mechanical, externally operable fastening feature (such as a wedge-shaped, resilient projection) having a compatible mating part (for example, a recess or hole in the wall 724), or vice versa. Alternatively or additionally, screws may be used, for example, to allow convenient maintenance work whenever necessary, while keeping the module intact and protected by the cover 718 during use.

[0130] In some embodiments, the cover 718 may be configured as an optical element (e.g., a lens, such as a collimating lens, a diffusing lens, or a Fresnel lens or other specific lens) for an element included in the module (e.g., a light source or a light / radiation detector).

[0131] In some embodiments, some elements provided within the module (e.g., any of the previously intended options) may be placed in a socket, for example, to facilitate post-manufacturing assembly or replacement. The socket(s) may be provided on the substrate 502.

[0132] Figure 8 shows selected details of an embodiment in which, in 800, via an exploded assembly view, at least one light source 104, 105 is at least partially surrounded by an optional cylindrical optical reflector structure 802 which preferably extends in the thickness direction of the optical guide layer 108. The interior of the reflector structure 802 may optionally contain a diffusive translucent resin 822 that is different from the translucent material of the optical guide layer 108.

[0133] As is clear from the figure, the circuit (for example, the light source 104) may be provided on a circuit board 502, which has already been described in more detail in relation to Figure 5 and the related text.

[0134] However, in some embodiments, the reflector 802 can be integrated with, connected to, or at least implemented together with the wall structure 724 of the solution in Figure 7. Other features of the module and the overall solution can also be adopted in the context of the reflector from Figure 7.

[0135] Figures 9 and 10 show further features (e.g., voids and / or optical features) at 900 and 1000, respectively. These can be used at least selectively in the constructed multilayer structure, in addition to or instead of any of the other embodiments intended herein for carrying out the present invention.

[0136] In Figure 9, the embodiment of the multilayer structure described above comprises a front material stack or layer 9006, preferably a plastic top film 912, optionally a plastic or glass light guide layer 914, for example substantially made of polycarbonate or TPU resin, and / or optionally an optional display or decorative film / layer 916 having a limited light transmittance (e.g., about 30%, 20%, or 10% or less).

[0137] The shape(s) 918 (graphical and / or 3D shapes, e.g., several icons, symbols, patterns, alphanumeric characters, etc.) of the optical function may be established, for example, within the light guide layer 914 and / or film / layer 916, to form the desired illumination effect from the light(s) 104, 105 (e.g., top-shooting LEDs) emitted beneath the multilayer structure (see the two dashed lines with the light source 104 as the endpoint). Optionally, 3D shaping methods including thermoforming or surface treatment (e.g., embossing, milling, etc.) may be used for this purpose in addition to or instead of shaping. The film 120 is optional but may be used, for example, for optical balancing or other optical functions.

[0138] In Figure 10, the film 120 is configured to retain, for example, a printed (preferably screen-printed, or otherwise additively manufactured) 3D shape 1004 of optical functionality, and / or to directly define a shape 1002 by local 3D shaping / shaping of the film itself 120 (or at least its surface) obtained by thermoforming or other applicable 3D shaping methods. The 3D shape may, in addition to or instead of thereto, be achieved during injection molding of the film 120 or the material provided on it. Item 9006 refers to several front layers or associated material stacks, preferably including at least transparent or translucent layers in places, to allow light emitted by a light source(s) 104, 105 placed below to propagate toward the environment. Item 1008 refers to a light-shielding layer (e.g., a film or printed layer).

[0139] The optical functions considered above in relation to Figures 9 and 10 may vary and be selected depending on the circumstances, and may include, for example, light transmission, masking, filtering, scattering, collimation, etc., depending on the requirements set by the usage scenario.

[0140] The solutions in Figures 9 and 10 may be combined with each other, or selectively with any of the embodiments described herein.

[0141] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will understand that the disclosed embodiments are for illustrative purposes only, and that other arrangements applying many of the above principles can be readily provided to best suit each potential use scenario.

Claims

1. An integrated functional multilayer structure (100, 200, 300, 350, 500, 600, 700, 800, 900, 1000), A flexible substrate film (102) and Circuits (104, 105, 106) provided on the substrate film, wherein each circuit (104, 105, 106) includes a first light source (104) which includes at least one light-emitting unit (optionally an LED), A monolithic optical guide layer (108) is formed on the substrate film to cover and optically couple the first light source (104), wherein the optical guide layer (108) includes an optically attenuating translucent material, and The optical guide layer (108) includes a first surface (108A) and a second surface (108B) opposite to it, the second surface (108B) facing the first light source (104), a portion of the first surface (108A) includes a predetermined output coupling region (112) within a first distance (H) from the first light source (104) for light emitted by the first light source (104) and transmitted through the optical guide layer (108), the optical guide layer (108) further includes an optical leakage prevention region (114) which does not overlap with the output coupling region (112) and is separated from the first light source (104) by at least a second distance (D), The attenuation of emitted light occurring in the direct optical path between the first light source (104) and the output coupling region (112) is smaller than the attenuation occurring in the shortest, arbitrarily selected, and direct optical path between the first light source (104) and the light leakage prevention region (114). Furthermore, the light transmittance of the translucent material in the optical guide layer is approximately 25% to approximately 80% at a selected wavelength for a sample of the translucent material with a thickness of approximately 2 mm, while the associated half-width angle is approximately 5 to approximately 70 degrees, in a multilayer structure.

2. The structure according to claim 1, wherein the first light source (104) has a direct line of sight (LOS) without a light-shielding element to both the output coupling region (112) and the light leakage prevention region (114).

3. The structure according to claim 1 or 2, wherein the light depletion distance (DD) from the first light source, which shows a significant intensity loss of the emitted light at a selected wavelength, at least at the visible wavelength, as the light emitted by the first light source propagates through the translucent material, is between the first distance (H) and the second (D) distance.

4. The structure according to any one of claims 1 to 3, wherein the light leakage prevention region (114) includes or consists of a portion of the first surface (108A) of the light guide layer (108), and the portion is optionally visually perceptible from the outside.

5. The structure according to any one of claims 1 to 4, wherein the light leakage prevention region (114) is a selected, optionally substantially cubic, cubic, or cylindrical subvolume of the optical guide layer (108), which optionally defines a subvolume extending through the optical guide layer (108) in a direction spanning the first surface (108A) and the second surface (108B).

6. The light leakage prevention region (114) defining a portion of the first surface of the light guide layer exhibits at least 50% brightness uniformity in response to the light of the first light source output-coupled through it, and / or The structure according to any one of claims 1 to 5, wherein the output coupling region (112) exhibits at least about 70% brightness uniformity in response to the light from the first light source that is output coupled through there.

7. The structure according to any one of claims 1 to 6, wherein the light leakage prevention region defines a portion of the first surface of the optical guide layer, and the intensity of light from the first light source output-coupled through the light leakage prevention region via the portion of the first surface of the optical guide layer is significantly lower than the intensity of light emitted by the first light source at a selected wavelength, at least at a visible wavelength, and output-coupled through the output-coupled region.

8. The structure according to any one of claims 1 to 7, wherein the second distance (D) is about 1.2 times, 1.5 times, 2, 3 times, 4 times, or 5 times greater than the first distance (H).

9. The above-mentioned at least first light source (104) is Top-emitting, side-emitting, double-sided, or bottom-emitting, and optionally a flip-chip type light-emitting unit. Multiple light-emitting units (104a) that are packaged or at least grouped together, and / or The structure according to any one of claims 1 to 8, comprising multiple LED emitters, each containing a multicolor or specifically RGB LED, provided within a single package.

10. (300) The structure according to any one of claims 1 to 9, wherein at least the first light source is associated with at least one further output coupling region, and the first and further output coupling regions optionally have at least a partially shading element (122) between them.

11. The structure according to any one of claims 1 to 10, wherein the shortest distance between the first light source (104) and the output coupling region (112) is less than or equal to the first distance (H), and is less than about 20 mm, or less than about 10 mm, or less than about 8 mm, or less than about 5 mm.

12. The structure according to any one of claims 1 to 11, wherein the thickness of the translucent optical guide layer (108) is about 10 mm or less, or about 5 mm or less.

13. The translucent material includes a plastic resin and a thermoplastic resin, as per any of claims 1 to 12. The structure described in item 1.

14. The structure according to any one of claims 1 to 13, wherein the translucent material is colored and optionally contains a masterbatch or pigment-based color additive.

15. The structure according to claim 14, wherein the letdown ratio is approximately 5%, 4%, 3%, 2%, 1%, or less.

16. The structure according to any one of claims 1 to 15, comprising an optionally obliquely cut surface (513A) inclined with respect to the plane of a substrate film below, for receiving at least the first light source (104), wherein the inclined surface optionally further receives a circuit board for at least one of the light sources.

17. The structure according to any one of claims 1 to 16, comprising a diffuser (109) of varying thickness on the optical path extending from the first light source through the output coupling region (112) to the environment of the structure, wherein the diffuser is optionally monolithic with the optical guide layer and the translucent material of the optical guide layer, and is manufactured additively on the optical guide layer and / or subtractively from layers (120, 120b, 122) on the optical guide layer.

18. The structure according to any one of claims 1 to 17, comprising a module adjacent to the translucent material of the optical guide layer, optionally substantially enclosing at least laterally a spring-loaded circuit board (502), and having a wall structure (724) for receiving at least the first light source (104), wherein the circuit board and the first light source are accessible and one or both are replaceable from outside the environment of the structure.

19. The structure according to any one of claims 1 to 18, comprising an optionally cylindrical light-reflecting wall structure that laterally surrounds at least the first light source and extends in the thickness direction of the light guide layer that at least partially embeds the light-reflecting wall structure, wherein the interior of the light-reflecting wall structure optionally contains a diffusive resin different from the translucent material of the light guide layer.

20. The structure according to any one of claims 1 to 19, comprising on the optical guide layer an aggregate of one or more layers (9006) further comprising a stack of voids or air cavities (906) and / or optionally further comprising plastic and / or glass, wherein at least the film (120, 916) advantageously comprises an optically functional 3D shape (900, 1000) additively manufactured from an opaque or translucent material, optionally screen printed, or locally shaped from the film, optionally thermoformed.

21. The structure according to any one of claims 1 to 20, comprising at least one attached and / or additionally in-situ manufactured functional element (120, 122) on the first surface (108A) of the optical guide layer (108), which optionally is located adjacent to and / or above the output coupling region (112) or the light leakage prevention region (114), and which is selected from the group consisting of conductive traces, electrodes, electrical insulators, electronic components, circuit elements, connectors, light shielding elements, graphical elements, light diffusers, reflectors, dispersion elements, and collimators.

22. At least one attached and / or additionally manufactured film (120) or coating on the first side of the light guide layer, optionally positioned adjacent to and / or on the output coupling region (112) or light leakage prevention region (114), comprising an opaque or translucent light masking or filtering element, and / or the first The structure according to any one of claims 1 to 21, comprising a film (120) or coating that defines at least a portion of a graphical element to be illuminated by a light source or a further light source included.

23. (200) The structure according to any one of claims 1 to 22, wherein the substrate film (102) includes a 3D-formed, optionally thermoformed portion (111) that receives the first light source (104) thereon in an orientation inclined with respect to the first surface (108A).

24. The structure according to any one of claims 1 to 23, wherein the circuit further comprises at least one element (106) selected from the group consisting of several electrically conductive traces optionally printed using printed electronics technology, which are connected to at least the first light source, electronic components, integrated circuits, electrodes, contact pads, and / or electrical connectors.

25. A method (400) for manufacturing an integrated functional multilayer structure, To obtain a flexible substrate film (404), Providing (406, 408) a circuit on the substrate film using printed electronics technology and / or selected mounting technology, wherein the circuit includes a first light source (104) which includes at least one light-emitting unit (optionally an LED), The method includes optionally manufacturing an optically attenuating, translucent monolithic light guide layer on the substrate film by molding or casting (412) to cover, optically bond, and preferably at least partially embed the first light source, The optical guide layer (108) and the first light source include a first surface (108A) and a second surface (108B) opposite to the first light source (104), the second surface (108B) facing the first light source (104), and a portion of the first surface (108A) includes a predetermined output coupling region (112) within a first distance (H) from the first light source (104) for light emitted by the first light source (104) and transmitted through the optical guide layer (108), the optical guide layer (108) further includes a light leakage prevention region (114) which does not overlap with the output coupling region (112) and is separated from the first light source (104) by at least a second, preferably larger distance (D), and the emitted light occurring on the direct optical path between the first light source (104) and the output coupling region (112) They are configured such that the attenuation is smaller than the attenuation occurring in the shortest, optionally, and direct optical path between the first light source (104) and the light leakage prevention area (114), and further, The light transmittance of the translucent material in the optical guide layer is about 25% to about 80% at a selected wavelength for a sample of the translucent material with a thickness of about 2 mm, while the associated half-width angle is about 5 to about 50 degrees, Method (400).

26. The method according to claim 25, wherein the substrate film is 3D formed and optionally the first light source is placed on it, and the resulting 3D shape is shown at least locally.

27. The method according to claim 25 or 26, wherein the translucent material is produced by blending at least a pigment or masterbatch color additive with a raw resin at a selected letdown ratio.

28. The method according to any one of claims 25 to 27, wherein the optical guide layer is manufactured on the substrate film by injection molding, optionally by low-pressure injection molding, and / or by using a molding temperature lower than about 250, 200, or 150°C.

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