A method for manufacturing an implantation and an electrical connection between the implantation's electronic module and electronic components.

Abstract

The present invention relates to an implant having an electronic module and an electronic component, wherein the electrical connection between the electronic module and the electronic component is created by a direct plug-in connection. The present invention also relates to a method for making the electrical connection between the electronic module and the electronic component of the implant.

Description

Technical Field

[0001] The present disclosure relates to an implant and a method of manufacturing an electrical connection between an electronic device module of the implant and an electronic component.

Background Art

[0002] Implants such as pacemakers or defibrillators include, among other things, an electronic device module with chips, a battery for power supply, and feed-throughs to a header to which one or more electrodes can be connected. The currently known means of establishing contact between the electronic device module, the battery, and the feed-throughs are usually realized using contact-establishing strips soldered-on or welded-on. In an alternative embodiment, bent battery pins are connected in plug-in contact-establishing means.

[0003] FIG. 1 shows an implant known from the prior art. The implant has a housing 50 in which a battery 51 and an electronic device module 52 are arranged. An electrode connection device (header) 53 is arranged on the housing 50. A first electrical contact 54 is formed between the electronic device module 52 and the battery 51. A second electrical contact 56 is formed between the electronic device module 52 and the feed-through 55. The feed-through 55 leads out from the housing 50 and provides an electrical connection between the electronic device module 52 and the electrode connection device 53. The elements of the implant (electrode connection device 53, feed-through 55, battery 51, and electronic device module 52) are arranged flat next to each other. This results in each electrical connection between elements passing at a 90° angle (specifically, the first electrical contact 54 and the second electrical contact 56), and thus requires a complex and costly construction process. The manufacture of the implant shown in FIG. 1 requires complex manufacturing techniques and is difficult to automate.

[0004] U.S. Patent No. 9,737,721(B2) discloses an implant for stimulating the spinal cord. The implant has a housing in which a battery and an electronics module are housed. A support frame, positioned on the battery, houses the electronics module and a communication coil. The electronics module is positioned therein perpendicular to the battery.

[0005] U.S. Patent No. 7,647,110(B2) describes a modular implantation. Various connector modules, electronic modules, and battery modules can be combined to achieve a variety of functions.

[0006] The document EP2,493,557(B1) discloses a modular header for plantings. The header is constructed from several modules connected to one another. The length of the header can be adjusted by the number of modules.

[0007] The document in U.S. Patent Application Publication No. 2018 / 0054034(A1) discloses a modular connector whose length can be adjusted depending on the number of modules used.

[0008] U.S. Patent No. 9,713,717(B2) discloses an implant having an electronic module formed on a substrate. Several components of the electronic module, such as filter capacitors or blocking capacitors, are embedded in the substrate. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] U.S. Patent No. 9,737,721(B2) [Patent Document 2] U.S. Patent No. 7,647,110 (B2) [Patent Document 3] EP2,493,557(B1) [Patent Document 4] U.S. Patent Application Publication No. 2018 / 0054034(A1) [Patent Document 5] U.S. Patent No. 9,713,717(B2) [Overview of the Initiative] [Problems that the invention aims to solve]

[0010] The objective is to identify improved technologies for implants. Specifically, this involves simplifying the manufacturing of active medical implants. [Means for solving the problem]

[0011] A plant is disclosed in claim 1, and a method according to claim 14. Further embodiments are the subject of the independent claims.

[0012] According to one embodiment, an implant having a housing is provided. An energy storage unit and an electronics module are arranged within the housing. A feedthrough to an electrode connection device is formed on the housing. A first contact forms an electrical connection between the energy storage unit and the electronics module. A second contact forms an electrical connection between the electronics module and the feedthrough. The first and second contacts are oriented in the same direction of contact.

[0013] The implant may be an active medical implant, such as an implantable pacemaker or an implantable cardiac defibrillator (ICD).

[0014] Electrode connection devices may also be called connection heads or headers. Electrode connection devices may be designed to accept one or more electrode connections.

[0015] The electronic module may have embedded components, such as a processor and memory, that ensure proper operation.

[0016] The energy storage unit may have a primary cell, a secondary cell, a capacitor, or any combination of the aforementioned elements. The energy storage unit may be designed to supply electrical energy to components of an electronic device module. Furthermore, the energy storage unit may be designed to provide electrical energy for defibrillation (shock). The energy storage unit may be electrically insulated from the housing, for example, by a cover made of an electrical insulating material (e.g., a thermoplastic such as PEEK (polyether ether ketone)), by a tightly adhering plastic coating made of an electrical insulating material, by a one- or multi-component insulating film, by a coating made of an electrical insulating material (e.g., plastic), or by adhesively attaching an insulating film to the energy storage unit.

[0017] A feedthrough can provide an electrical connection between an electrode connection device and an electronic device module. The feedthrough may be multi-pole, for example, tri-pole, quadruple, or pentuple.

[0018] The housing may have a biocompatible material, or may be made of a biocompatible material (e.g., titanium).

[0019] Equal contact directions are given when the preferred direction of the first contact coincides with the preferred direction of the second contact, i.e., when the contacts point in the same direction. The preferred direction of a contact can be derived from the geometric shape of the contact. In the case of a pin contact, the preferred direction is the extension of the longitudinal direction of the pin. In the case of a planar contact, the preferred direction is the normal to the surface.

[0020] The energy storage unit, electronic module, and feedthrough may be arranged vertically in the stacking direction, with the stacking direction corresponding to the contact direction. The energy storage unit, electronic module, and feedthrough are assembled in a single assembly direction. Stacking the elements in an overlapping manner simplifies the assembly of the implant and facilitates the automation of the manufacturing process. Furthermore, electrode connection devices may be positioned on the housing in the stacking direction.

[0021] The first contact can be formed between a first planar contact element disposed on the energy storage unit and a second planar contact element disposed on the electronic device module, and the contact direction is the normal of the contact area between the first planar contact element and the second planar contact element. The first planar contact element and the second planar contact element may be of the same size. The first planar contact element and the second planar contact element may have the same shape, for example, square, rectangular, round, or oval. The first planar contact element and the second planar contact element may be symmetric.

[0022] The second contact can be formed between a third planar contact element disposed on the electronic device module and a fourth planar contact element disposed on the feed-through, and the contact direction is the normal of the contact area between the third planar contact element and the fourth planar contact element. The third planar contact element and the fourth planar contact element may be of the same size. The first planar contact element and the second planar contact element may have the same shape, for example, square, rectangular, round, or oval. The third planar contact element and the fourth planar contact element may be symmetric.

[0023] In one embodiment, the first contact is formed between a first pin element and a first pin socket, and the longitudinal extension of the first pin element may be provided to determine the contact direction. The first pin element may be disposed on the energy storage unit. In this case, the first pin socket is disposed on the electronic device module. In another variant, the first pin element may be disposed on the electronic device module, and the first pin socket is disposed on the energy storage unit. The first pin element may have a plurality of pins oriented parallel to each other. The first pin element may be provided to be formed as, for example, a pair of pins disposed on the energy storage unit (for example, as the anode and cathode of the energy storage unit). In this case, the first pin socket is formed as, for example, a pair of pin sockets that can be disposed on the electronic device module.

[0024] Furthermore, a second contact may be formed between the second pin element and the second pin socket, and the longitudinal extension of the second pin element may determine the direction of contact. The second pin element may be located on a feedthrough, and the second pin socket may be located on an electronics module. Alternatively, the second pin element may be located on an electronics module, and the second pin socket may be located on a feedthrough. The second pin element may have multiple pins oriented parallel to each other. For example, the multiple pins may be located on a feedthrough (multi-pole feedthrough). In this case, the second pin socket may have multiple pin sockets located, for example, on an electronics module.

[0025] The first pin element and the second pin element may be arranged parallel to each other.

[0026] The first contact and / or the second contact may be designed as a plug-in contact, a clamp contact, or a welded contact.

[0027] The electronic module may be positioned in front of the energy storage unit. The front side is the side of the energy storage unit facing the electrode connection device. Therefore, the electronic module is positioned between the electrode connection device and the energy storage unit.

[0028] The electronic module can be positioned parallel or perpendicular to the front of the energy storage unit. The electronic module may have a planar substrate on which its components are arranged. In the case of a planar substrate, the height of the substrate is much smaller than the width and length of the substrate. The substrate may be in the form of a printed circuit board. The planar substrate may be positioned parallel or perpendicular to the front of the energy storage unit. Specifically, the parallel arrangement of the electronic module / substrate allows for a space-saving assembly. In this case, the electronic module is located on the front side of the energy storage unit.

[0029] The electronic module may be provided to be housed within a support frame. The support frame may be housed in a housing such that the energy storage unit is secured by the support frame. The support frame may be press-fitted onto the energy storage unit such that the energy storage unit is pressed against the housing by the support frame and thus secured. Alternatively, or further, the support frame may be housed in a housing such that the support frame is designed to reduce or prevent relative movement between the energy storage unit and the electronic module. Specifically, relative movement that would result in loss of electrical connection between the electronic module and the energy storage unit would be prevented. The support frame may have a plastic material or may be entirely made of a plastic material. Suitable plastic materials include, for example, polybutylene terephthalate (PBT), polycarbonate (PC), or similar plastic materials.

[0030] The housing may be formed in two parts and have a first housing shell and a second housing shell. An energy storage unit may be provided to be fixed between the first housing shell and the second housing shell. The first housing shell and the second housing shell may be symmetrical (e.g., specularly symmetrical) or identical. The two-part housing may have integrated weld protection (e.g., beading).

[0031] In one embodiment, the housing may be formed as a single part. The single-part housing may be manufactured by direct molding from a base material, for example, by deep drawing.

[0032] The housing may have an opening through which the energy storage unit and electronic module can be introduced into the housing. The opening may be formed on the front side of the housing (the side facing the electrode connection device). If the housing is made of two parts, the first housing shell and the second housing shell may be connected to each other (e.g., welded) such that the opening is formed on the front side. The opening may open in the contact direction. In this case, all elements of the implant (energy storage unit, electronic module, feedthrough, electrode connection device, and housing) may be assembled in only one stacking direction.

[0033] The energy storage unit may be fixed to the enclosure. For example, a self-adhesive pad may be attached to the first housing shell and / or the second housing shell, and the energy storage unit will adhere to this pad when the housing shells are connected to form the housing. The energy storage unit may be bonded to the first housing shell and / or the second housing shell by an adhesive. Fixation can also be achieved by a clamping action between the first housing shell and the second housing shell. The housing may also be welded to the energy storage unit.

[0034] The clamping portion may be located on the housing and is designed to secure the energy storage unit to the housing. The clamping portion may be located on the underside of the housing, opposite the front side of the housing. The clamping portion may be designed to press the energy storage unit against a support frame for securing. The clamping portion may be designed as a spring, a weld protection band, or a plastic material component that fills a solid space.

[0035] Feedthroughs may be mounted on an electronics module as SMD (surface-mounted device) components. SMD components are soldered directly to a printed circuit board (e.g., the board of the electronics module) by one or more solderable connection areas. In other words, feedthroughs are assembled on an electronics module using SMT (surface-mounting technology).

[0036] The feedthrough may have a second substrate. The second substrate of the feedthrough, the electronic module (or the substrate of the electronic module), and the front of the energy storage unit may be arranged parallel to each other.

[0037] In a further embodiment, a method for assembling a planted structure is disclosed. This method comprises the steps of preparing an energy storage unit, preparing an electronic module, preparing a feedthrough, arranging the electronic module on the energy storage unit, and arranging the feedthrough on the electronic module. Here, the feedthrough, the electronic module, and the energy storage unit are arranged overlapping along a common assembly direction. Specifically, the electronic module may be arranged in front of the energy storage unit.

[0038] The order of placement is not important. The electronic module may first be placed on the energy storage unit, and then the feedthrough may be placed on the electronic module. However, the feedthrough may first be placed on the electronic module, and then the electronic module with the feedthrough may be placed on the energy storage unit.

[0039] When an electronics module is placed on an energy storage unit, the electrical connection between the energy storage unit and the electronics module is formed with a first contact. When a feedthrough is placed on an electronics module, the electrical connection between the electronics module and the feedthrough may be formed with a second contact. The first and second contacts may be oriented in the same direction of contact.

[0040] The above method may further include the steps of placing the energy storage unit together with the electronic equipment module and feedthrough into the housing, and closing the housing.

[0041] The above method may further include the steps of placing an electrode connection device on a housing and connecting the electrode connection device to a feedthrough.

[0042] In a further embodiment, an implantation is provided having an electronic module and an energy storage unit, wherein the volume of the electronic module is less than 25% of the volume of the energy storage unit. Preferably, the volume of the electronic module is less than 20% of the volume of the energy storage unit. More preferably, the volume of the electronic module is less than 16% of the volume of the energy storage unit. In one embodiment, the volume of the energy storage unit is 3.06 cm³. 3 The volume of the electronic module is 0.46 cm³. 3 That is the case.

[0043] The elements of a plant are three-dimensional objects having length, width, and height. The dimensions of an object are always determined in the same direction. The length of an electronic module is determined in the same direction as the length of the electrode connection device and the battery. The width of an electronic module is determined in the same direction as the width of the electrode connection device and the battery. The height of an electronic module is determined in the same direction as the height of the electrode connection device and the battery. A coordinate system is drawn in the lower left corner of Figure 2 for illustrative purposes. The x-direction corresponds to length, the y-direction to width, and the z-direction to height.

[0044] The volume of the energy storage unit is the actual volume of the element.

[0045] The volume of an electronic module is considered to be the volume of the enclosure surrounding the electronic module, where the base of the enclosure is equal to the area of ​​the electronic module, and the height of the enclosure is equal to the height of the tallest component on the electronic module. If the electronic module has a rectangular base, then the volume is given by a cube, where the base of the cube is equal to the base of the electronic module (product of length and width). The height of the cube corresponds to the height of the tallest component on the electronic module. If the electronic module is materialized as a planar substrate, the components may be arranged on one side of the substrate. In this case, the above definition of volume applies. It may also be given that the components are arranged on both sides of the substrate. In this case, the height of the electronic module corresponds to the sum of the heights of the tallest components on each side of the substrate.

[0046] The ratio of the length to the width of the electronic equipment module may be 4:1 or greater, preferably 5:1 or greater, and more preferably 6:1 or greater. In this embodiment, the electronic equipment module has a narrow design that facilitates placement of the electronic equipment module in front of the energy storage unit. In one embodiment, the electronic equipment module has a length of more than 30 mm and a width of less than 5.2 mm.

[0047] The width of the electronic equipment module may be given to be less than or equal to the width of the energy storage unit.

[0048] The length of the electronic device module may be less than or equal to the length of the energy storage unit.

[0049] As already mentioned above, the implant may have an electrode connection device, the length of the electronic module is less than or equal to the length of the electrode connection device, and / or the width of the electronic module is less than or equal to the width of the electrode connection device. The length of the energy storage unit may also be less than or equal to the length of the electrode connection device, and / or the width of the energy storage unit may also be less than or equal to the width of the electrode connection device.

[0050] The electronic device module may have a substrate on which multiple components are arranged, and the area of ​​the substrate is less than or equal to the area in front of the energy storage unit.

[0051] It may be given that some of the components have a minimum structural size of F ≤ 90 nm. Alternatively, or further, it may be given that some (or others) of the components have a minimum structural size of F ≤ 65 nm, preferably F ≤ 55 nm. It may be given that all components of the electronic equipment module are manufactured with a uniform structural size, e.g., F ≤ 90 nm, F ≤ 65 nm, or F ≤ 55 nm. It may also be given that the components of the electronic equipment module are manufactured with the various structural sizes described herein.

[0052] At least one of the multiple components may be located on the first side of the substrate, and at least one other of the multiple components may be located on the second side of the substrate. Thus, the substrate may be occupied on one side or on two sides.

[0053] In one embodiment, it may be given that at least one component on the first side of the substrate, and / or at least one other component on the second side of the substrate, are sealed with a potting agent.

[0054] It may also be given that some of the components are arranged on the substrate as SMD elements. For example, components may be arranged in one or more ball grid arrays (BGAs) and / or within a multi-chip module (MCM) housing and / or as bare integrated circuits (chips). When the substrate is shown on one side, the following arrangements of components are possible: - All components are placed in a ball grid array package. - All components are placed in an MCM package. - All components are placed as chips. - All components are placed as SMD elements. - One or more or zero components are placed in one or more BGA housings, one or more or zero other components are placed in one or more MCM housings, one or more or zero other components are placed as chips, and one or more or zero other components are placed as SMD elements.

[0055] If the substrate occupies two sides, the above arrangement can be realized on both sides of the substrate.

[0056] Multiple components may be arranged side-by-side or overlapping on one side of the substrate, with each chip / component bonded to the substrate and the components sealed with a potting agent. The connection of the chip / component to the substrate may be in the form of wire bonds, flip-chip bumps, or flip-chip solder ball connections. The potting agent may partially cover the substrate. In one embodiment, the potting agent may extend along the edge of the substrate. Preferably, the potting agent completely covers the side of the substrate where the components are located.

[0057] On a panel acting as a substrate, components may be arranged in a grid such that each grid cell has all the units / chips required for an electronic module. Each chip / component is bonded to the substrate for electrical connections. The panel is then encapsulated (overmolded) with a potting agent. After the panel is covered with the potting agent, the individual electronic modules are cut from the panel. Advantageously, the length of the potting area on the panel is an integer multiple of the length of the electronic module, and / or the width of the potting area on the panel is an integer multiple of the width of the electronic module. This ensures optimal use of the panel's potting area. On the other side of the panel / substrate, further components may be arranged, for example, as SMD elements in chips and / or ball grid array packages.

[0058] Holes for connection contacts for the energy storage section, and / or holes for further connection contacts for feedthroughs, may be formed in the potting material.

[0059] Electronic device modules may be formed as multi-chip modules. A multi-chip module (MCM) consists of multiple individual microchips that appear from the outside like a single chip, function as such, and are used like a single chip, and are housed in a common package either planar (side by side) or overlapping.

[0060] Feedthrough to electrode connection devices is - Integrated components of electronic equipment modules, - SMD components on electronic equipment modules, or - Plug-in connections on electronic equipment modules It may be formed as follows.

[0061] In another embodiment, an implant is provided having an electronic module and electronic components, wherein the electrical connection between the electronic module and the electronic components is formed by a straight plug-in connection.

[0062] The implantation may have further electronic components, and the electrical connection between the electronic module and the further electronic components is formed by further straight plug-in connections, with the straight plug-in connection and the further straight plug-in connection oriented in the same direction. The features disclosed herein for a straight plug-in connection apply analogously to further straight plug-in connections. Similarly, the description of electronic components applies analogously to further electronic components.

[0063] Electrical connections may be designed entirely or partially as plug-in contacts, allowing one (or more) contact pins of an electronic component to be plugged directly into or through a male connector socket of an electronic device module. Straight plug-in connections do not require adapters (e.g., wiring strips) and, furthermore, do not require bending of pins.

[0064] Electronic components or further electronic components may be feedthroughs or energy storage units. Multiple electronic components may be provided, and electrical connections to the electronic module are formed by straight plug-in connections for each electronic component. The electronic module and electronic components may be housed in a package.

[0065] In one embodiment, further electronic modules may be placed on top of an electronic module. Further electronic modules may be connected to the electronic module by straight plug-in connections. Multiple electronic modules may be stacked, and the multiple electronic modules are connected to each other by straight plug-in connections.

[0066] Electronic components can have straight pin elements, and electronic equipment modules have pin sockets, where the pin elements are placed inside the pin sockets to form electrical connections.

[0067] Alternatively, the electronic module may have straight pin elements, and the electronic component may have a pin socket, with the pin elements being placed inside the pin socket to form an electrical connection.

[0068] As mentioned above, a straight pin element can have multiple pins. These multiple pins can be arranged parallel to each other. In this case, multiple pin sockets are provided, and each of the multiple pins is associated with a separate pin socket.

[0069] The pin socket may be ring-shaped. The pin socket may be embodied as a disk. The pin socket may be soldered to an electronic device module or to an electronic component. The pin elements may be welded to the pin socket.

[0070] A pin socket can be attached to an electronic module using one of the following fastening methods: soldering, bonding, embedding, clamping, and crimping. Crimping is understood to mean a joining process in which two components are joined together by plastic deformation, for example, by flanging, drawing, rippling, or folding. In embedding, a portion of the pin socket is surrounded by the material of the electronic module.

[0071] Pin sockets can be attached to electronic components using one of the following fastening methods: soldering, bonding, embedding, clamping, and crimping.

[0072] The pin element may be given to have a spring element.

[0073] The electronic component may be an energy storage unit, a feedthrough, or a capacitor. Furthermore, the electronic component may be embodied as a high-voltage capacitor or a capacitor stack. In one embodiment, the electronic component is an energy storage unit, and further electronic components are feedthroughs.

[0074] A plug-in connection may be formed as a removable connection, for example, as a plug-in connection.

[0075] The plug-in connection may be formed as a non-removable connection, for example, as a welded connection or a soldered connection.

[0076] Electrical connections can be formed by connections selected from the following types: spring contacts, insulated displacement contacts, solder contacts, welded contacts, press-fit, and adhesive. Conductive adhesive may be used for adhesive connections.

[0077] Plug-in connections can be designed to compensate for relative movement between electronic components and electronic equipment modules without interfering with electrical connections. For example, pin elements may be long and flexible enough to compensate for the relative movement of electronic components relative to the electronic equipment module. Alternatively, or further, male connector sockets may be sufficiently flexible and / or mounted in a sufficiently flexible manner to compensate for the relative movement of electronic components relative to the electronic equipment module. For example, pin elements may have a length greater than the height of the pin socket. In this case, the pin elements protrude beyond the pin socket when inserted, thereby allowing for some degree of compensation for movement along the direction of the pin elements.

[0078] In yet another embodiment, a method is provided for manufacturing an electrical connection between an electronic module and an electronic component of a plant, wherein the electronic component and the electronic module are moved toward each other by relative motion, and the electrical connection is formed by a straight plug-in connection between the electronic component and the electronic module. The relative motion may be linear relative motion. This facilitates the implementation of an automated process for assembling the plant.

[0079] Plug-in connections can be designed as redundant connections to increase reliability.

[0080] In yet another embodiment, an implant is disclosed having an electrode connection device and a housing, the electrode connection device having a cover that closes the housing formed on the electrode connection device.

[0081] The cover may be welded to the housing. A flange may be formed on the cover. The flange may extend partially or completely along the perimeter of the cover.

[0082] The welding protection device may be formed on the cover, for example, in the form of partial or complete circumferential beading.

[0083] Alternatively, the cover may be secured to the housing by plug-in connections, spring connections, or clamp connections.

[0084] The cover may be formed from a biocompatible material, such as titanium.

[0085] The cover and housing may be formed from the same material (e.g., titanium).

[0086] A feedthrough may be formed in the cover, which forms an electrical connection between an electrode connection device located in the housing and an electronic module.

[0087] The feedthrough can be electrically connected to the electronics module by a plug-in connection or by spring contacts.

[0088] The electrode connection device may have a pre-assembled assembly. The assembly may have the following components: a continuous receiving means for a male connector; a first connecting element located in front of the receiving means, having at least two flat sides; and a second connecting element located in the rear region of the receiving means, having at least two flat sides.

[0089] In a further embodiment, an assembly for an implant electrode connection device is provided. The assembly has a continuous receiving means for a male connector. A first connecting element is further provided, located in the front region of the receiving means, and the first connecting element has at least two flat sides. Finally, a second connecting element is provided, located in the rear region of the receiving means, and the second connecting element has at least two flat sides.

[0090] Further provided are electrode connection devices for implants having the assemblies disclosed herein.

[0091] The disclosure further includes an implant having an electrode connection device and an assembly.

[0092] The flat sides allow for at least partially angular shapes, making it possible to easily grip the assembly (manually or automatically). This can enable the automation of the manufacturing process.

[0093] The assembly may be enclosed in plastic material in at least some sections. For example, the assembly may be overmolded in plastic material in some sections. The plastic material may be a thermoplastic, such as polysulfone. Biocompatible casting resins can also be used. The plastic material can provide further stability to the assembly. This makes it possible to manufacture the assembly as a prefabricated component, which is then processed into an electrode connection device for an implant.

[0094] The connection area of ​​the first connecting element may be free of plastic material. Alternatively, or further, the connection area of ​​the second connecting element may be free of plastic material.

[0095] A first guide for a first conductor for connecting to the connection region of a first connecting element may be formed in a plastic material, and / or a second guide for a second conductor for connecting to the connection region of a second connecting element may be formed in a plastic material.

[0096] The first guide may be formed adjacent to the connection area of ​​the first connecting element, and / or the second guide may be formed adjacent to the connection area of ​​the second connecting element.

[0097] The first conductor (second conductor) may be connected to the connection area of ​​the first connecting element (second connecting element) to enable connection of a male connector inserted into a receiving means for a plant. The connection area of ​​the first connecting element and / or the connection area of ​​the second connecting element may be embodied as a planar element. The connection area of ​​the first connecting element and / or the connection area of ​​the second connecting element may be circular and have, for example, a diameter of 1 to 5 mm. This provides a large welding area for fixing the first conductor or the second conductor. In one embodiment, both the first guide and the second guide are formed adjacent to their respective connection areas. The guides allow the conductors to be connected to their respective connection areas without causing a short circuit.

[0098] The first and second connecting elements may be given to be offset from each other. In other words, the first and second connecting elements are on two different levels. The different arrangement makes it easier to connect conductors to the connecting elements without the conductors touching each other.

[0099] In one embodiment, the assembly may have an antenna, which has a U-shaped configuration within an intermediate region formed between a first and a second connecting element. The intermediate region may be narrower than the adjacent connecting elements. In this way, a gripping recess for an automatic gripper is formed together with the U-shaped configuration of the antenna.

[0100] Positioning means may be formed at the rear end of the receiving means. Positioning means can be formed as an angular structure, for example, perpendicular to the receiving device. Positioning means may be formed from a plastic material, for example, on a single component having a plastic material coating on the assembly. Positioning means may be positioned in the housing of the plant when placing the assembly into the socket to assist in orienting the assembly. Positioning means may have a tapered end.

[0101] The assembly may have further receiving means for further male connectors, with a third connecting element positioned in the front region of the further receiving means and a fourth connecting element positioned in the rear region of the further receiving means. For further receiving means, the description disclosed herein applies analogously to receiving means. Furthermore, the description for the first and second connecting elements applies analogously to the third and fourth connecting elements.

[0102] In a further embodiment, a method for forming an electrode connection device on an implant is disclosed. This method is - A step of preparing the assembly, - Continuous receiving means for male connectors, - A first connecting element positioned within the front region of the receiving means and having at least two flat sides, - A second connecting element located within the rear region of the receiving means and having at least two flat sides. The steps include: preparing an assembly having, - The steps of placing and fixing the spring element in the receiving means, - A step of closing the opening of the receiving means using a potting aid, - The step of fixing the first conductor to the first connecting element, - The step of fixing the second conductor to the second connecting element, - A step of placing the assembly on the housing of the planting, - The steps of connecting the first conductor to a feedthrough formed on the housing, - The step of connecting the second conductor to the feedthrough, - The step of placing an assembly having a housing inside a mold, - A step of filling the mold with synthetic resin, - The process includes the step of removing the potting aid after the resin has hardened.

[0103] The method can also be used to form electrode connection devices on the cover of an implant.

[0104] The method involves the following further steps, namely, - The steps of positioning and securing the antenna to the assembly, - This may include the step of connecting the antenna to the feedthrough. These further steps are performed before the assembly is placed on the housing.

[0105] Furthermore, it may be provided that any protruding resin after hardening is removed, for example, by grinding and / or polishing.

[0106] The mold may be made of silicone.

[0107] The feedthrough may have one or more plug-in contacts (e.g., pins) for connecting conductors and / or antennas.

[0108] The synthetic resin may be an epoxy resin. An epoxy resin is a synthetic resin that retains epoxy groups. An epoxy resin is a curable resin (reactive resin) that can be reacted with a curing accelerator and, if necessary, other additives to form a thermosetting plastic material. An epoxy resin is a polyether having two terminal epoxy groups. The curing agent is the reaction partner, and together with the resin, they form a polymeric plastic material.

[0109] Since the synthetic resin can adhere directly to the housing or cover of the plant, no further adhesive is required. In other words, the contact area between the curing resin and the housing / cover of the plant does not need to be adhesive.

[0110] An electrode connection device may be a header for an implantable cardiac pacemaker or implantable cardiac defibrillator (ICD). In this case, the electrode connection device is used to electrically connect one or more electrode leads to the implant.

[0111] Antennas, charging coils, X-ray markers, communication coils, and / or color markers may be arranged in the electrode connection device.

[0112] Another embodiment relates to a method for manufacturing an implant, comprising the steps of: preparing a housing; preparing an electrode connection device on which a cover is formed to close the housing; placing the cover on the housing; and connecting the cover to the housing. The connection between the cover and the housing may be formed as a material connection, for example, by welding.

[0113] The embodiments disclosed herein relating to implants and assemblies for electrode connection devices, and embodiments relating to methods, may be combined in any way to realize different embodiments of implants or methods. Furthermore, the descriptions relating to implants and assemblies apply analogously to methods, and vice versa.

[0114] An exemplary embodiment is described in more detail below with reference to the drawings. [Brief explanation of the drawing]

[0115] [Figure 1] This is a schematic diagram of a planting structure based on prior art. [Figure 2] This is an exploded assembly diagram of one embodiment of a planting according to the present invention. [Figure 3] Figure 2 is a perspective view of a portion of the planted area. [Figure 4] This is a side view of the planted area. [Figure 5] This is a detailed diagram of an electronics module. [Figure 6]This diagram shows further details of the electronics module. [Figure 7] This is a block diagram of the planting according to the present invention. [Figure 8] These are a side view of the electronic equipment module (upper image in Figure 8), a view of the electronic equipment module from below (center image in Figure 8), and a view of the electronic equipment module from above (lower image in Figure 8). [Figure 9] These are perspective views of the top surface of the electronic equipment module (upper image in Figure 9) and the bottom surface of the electronic equipment module (lower image in Figure 9). [Figure 10A] This is a diagram showing the manufacturing process for electronic equipment modules. [Figure 10B] This is a diagram showing the manufacturing process for electronic equipment modules. [Figure 10C] This is a diagram showing the manufacturing process for electronic equipment modules. [Figure 10D] This is a diagram showing the manufacturing process for electronic equipment modules. [Figure 10E] This is a diagram showing the manufacturing process for electronic equipment modules. [Figure 11] This is a perspective view of one embodiment of an assembly for an electrode connection device. [Figure 12] Figure 11 shows the front view (upper image in Figure 12) and rear view (lower image in Figure 12) of the assembled structure. [Figure 13] This figure shows the assembly according to Figures 11 and 12, equipped with a potting aid. [Figure 14] This figure shows the assembly shown in Figures 11 to 13, which includes an antenna and a conductor. [Figure 15] This diagram shows the assemblies shown in Figures 11 to 14, which are arranged on the housing. [Figure 16] These figures show the assemblies as shown in Figures 11 to 15, which have been completely potted (using a potting aid). [Figure 17] These figures show the assemblies shown in Figures 11 to 15 after potting (without potting aid). [Figure 18] This figure shows another embodiment of the planting according to the present invention. [Modes for carrying out the invention]

[0116] Figure 2 shows an embodiment of an implantation according to the present invention. The implantation has a two-part housing 60 comprising a first housing shell 60a and a second housing shell 60b. An electronics module 61 and an energy storage unit 62 (e.g., a battery) are arranged in the housing 60. The energy storage unit 62 is electrically insulated from the housing 60 by an insulating cover 64. The electronics module 61 is located on the front side 68 of the energy storage unit 62. A first pin element is located on the front side 68 of the energy storage unit 62 and has two pins 66a, 66b oriented parallel to each other. A first pin socket located on the electronics module 61, having two ring-shaped pin sockets 67a, 67b, is associated with the first pin element. The first pin elements 66a, 66b and the first pin sockets 67a, 67b form an electrical connection between the energy storage unit 62 and the electronics module 61. The electronics module 61 is connected to a feedthrough 65. The connection details are described in more detail below. The electrode connection device 63 is located on the housing 60 and connected to the electronics module 61 by a feedthrough 65.

[0117] The feedthrough 65, the electronics module 61, and the energy storage unit 62 are assembled along an axis (in this case, along the z-direction). The direction of the axis is determined by the direction of the electrical connections between the feedthrough 65 and the electronics module 61, and between the electronics module 61 and the energy storage unit 62.

[0118] In the illustrated embodiment, the electronics module 61 is positioned parallel to the front 68 of the energy storage unit 62. This type of arrangement makes very efficient use of space within the housing. The electronics module 61 may be inserted into the front 68 of the energy storage unit 62 and / or attached to the front 68 with adhesive.

[0119] In Figure 3, the elements of the implant are partially assembled. The electronics module 61 is mounted on the energy storage unit 62. Furthermore, the feedthrough 65 is connected to the electronics module 61. The energy storage unit 62 (within the insulating cover 64) with the electronics module 61 is placed inside the second housing shell 60b. In the next step, the first housing shell 60a is placed on the second housing shell 60b, and the housing shells 60a and 60b are joined together, for example, by welding (not shown). Subsequently, the electrode connection device 63 is placed in the housing 60 and connected to the feedthrough 65 (not shown).

[0120] Figure 4 shows a side view of a planting substantially corresponding to the planting in Figure 2. Thus, the same elements are indicated by the same reference numerals. In the embodiment according to Figure 4, the electronic module 61 is housed within a support frame 69. The support frame 69 is positioned in front of the energy storage unit 62. The support frame 69 works to center the energy storage unit 62 within the housing 60 and press it against the base of the housing. This prevents the transmission of vibration as well as compressive and tensile forces. In this way, the support frame 69 protects the components on the electronic module 61 and the electrical connections between the energy storage unit 62 and the electronic module 61 from damage and / or loss of electrical contacts.

[0121] Details of the electronics module 61 are shown in Figure 5 (the lower part of Figure 5 shows a magnified detail of the upper part). The feedthrough 65 is formed as a multi-pole feedthrough with multiple pins 70. In the illustrated embodiment, five pins 70 are formed on the feedthrough 65, but different numbers of pins are also possible. Each pin 70 is inserted into a pin socket 71, and the feedthrough 65 forms an electrical connection between the electronics module 61 and the electrode connection device 63.

[0122] Another detail of the electronics module, along with the details of the energy storage unit 62, is shown in Figure 6. The first pin elements 66a, 66b (e.g., the anode and cathode of the battery) are formed on the energy storage unit. The first pin sockets 67a, 67b are located on the electronics module 61. The electronics module 61 is electrically connected to the energy storage unit 62 by a straight plug-in connection by inserting the first pin elements 66a, 66b into the first pin sockets 67a, 67b. The connection can be embodied as a redundant connection in such a way that the first pin sockets 67a, 67b in each case have two pin sockets (two rings arranged vertically) (not shown) arranged vertically.

[0123] The electrical connection between the electronic equipment module 61 and the energy storage unit 62 can be achieved using the following techniques, namely, - Using laser welding, the cylindrical shape and lumen were formed (see Figure 6). - As a spring contact in a plug-in connection, and - Using resistance welding as an angle on an electronics module It can be achieved.

[0124] The feedthrough pin 70 of 65 and the first pin elements 66a and 66b point in the same direction (contact direction), which determines the assembly direction for the elements.

[0125] The SMD component 72 is located on the rear side of the electronic module (see Figures 8 and 9).

[0126] Figure 7 shows a block diagram of the planting. The functions of the electronics module are enclosed by frame 80 and implemented as units / chips on the electronics module, which are described in more detail below.

[0127] The wireless transceiver 81 is coupled to the antenna 82. The wireless transceiver 81 is used to communicate with an external device, specifically a programming device. Here, for example, plant measurements and / or parameters may be transmitted to the programming device. Modified parameters of the plant may also be received from the programming device.

[0128] The electronic device module further includes a control unit 83 (controller). The control unit 83 includes a processor, such as a digital signal processor (DSP), memory such as RAM (random access memory) and / or ROM (read-only memory), and a timer. Further functions, such as memory access, such as DMA (direct memory access), and / or MAC (media access control), and network functions may be incorporated into the control unit 83.

[0129] A measurement unit 86 (detection unit) is provided as a further component on the electronic equipment module. The measurement unit 86 is configured to take measurement values ​​from the heart 91.

[0130] The pacemaker unit 85 (pacing unit) is configured to generate stimulating pulses for the heart 91.

[0131] The electronic module may optionally include a shock unit 84 (shock unit) and an HV unit 87 (HV - high voltage), especially when the implant is designed as an ICD. The shock unit 84 is configured to control the HV unit 87. The HV unit 87 is configured to deliver a shock (defibrillation) at a voltage of, for example, 700-800V.

[0132] An EMC (Electromagnetic Compatibility) unit 88 is provided and designed to minimize or suppress the effects of electromagnetic fields. These electromagnetic fields may include spurious radiation, shock fields delivered by the HV unit 87, stimulation pulse fields delivered by the pacemaker unit 85, external shock fields, external stimulation fields, and fields from external sources (e.g., high-frequency measurements). The EMC unit 88 is coupled to the implant housing 92.

[0133] The electronics module is coupled to the battery 90. The power supply unit 89 of the electronics module has a switched-mode power supply (SMPS) and is configured for power management.

[0134] The functions / units of an electronic device module are implemented in various integrated circuits, i.e., chips, mounted on the electronic device module. The dimensions of a chip are determined by the complexity of its function. As complexity increases, the planar dimensions of the chip increase. The size of the chip largely determines the size of the electronic device module and also largely determines its orientation (parallel to the energy storage unit). The size of the electronic device module is also determined by the number of non-integrated passive components and the number of electrical connections between the chips to all other connections on the electronic device module.

[0135] Either therapeutic function may be monolithically integrated on a single chip, thereby determining the number of chips required in the manufacturing process or electronic module, depending on the operating voltage range, the complexity of the data and signals, and their characteristics, i.e., whether they exhibit analog, time-continuous behavior, digital, time-discontinuous behavior, or mixed analog-digital signal behavior. In principle, all of the above functions, specifically digital control functions, mixed analog-digital detection functions for amplification and evaluation of ECG (Electrocardiogram) signals (ECG), pacing for generating stimulation pulses, power management for optimal power supply to the implant, and control of shock and defibrillation shocks for voltage generation, may be monolithically integrated. However, currently used manufacturing processes employing the smallest structural sizes F=130nm and F=180nm result in chips with very large dimensions due to vertical placement within the implant housing, and furthermore, their data storage capacity (RAM) is very small, or must be supplemented with a separate memory chip to enable all necessary therapeutic and diagnostic functions. For current implants, therefore, some or all of the functions of electronic modules are carried out on chips manufactured with a minimum structural size F ≤ 90 nm, preferably F ≤ 65 nm or F ≤ 55 nm.

[0136] One objective is to design electronic modules so that they no longer determine the volume, shape, and size of the plant (as in prior art). To achieve this objective, at least one of the following rules applies:

[0137] 1. The electronics module is positioned parallel to the front of the energy storage unit. 2. The length of the electronic equipment module shall be less than or equal to the length of the electrode connection device. 3. The width of the electronic equipment module shall be less than or equal to the width of the energy storage unit (or housing). 4. The length of the energy storage section is equal to the length of the electrode connection device (utilizing the maximum volume). 5. The area of ​​the electronic equipment module corresponds to the area of ​​the front side of the energy storage unit. 6. The volume requirement for electronic equipment modules is less than 1 / 4 of the volume of the energy storage unit (or less than 1 / 4 of the total volume enclosing the metal of the plant).

[0138] Applying one or more of these rules results in a narrow, strip-like electronic module on which components are mounted such that the maximum edge length, including its connections, does not exceed that of the electronic module. Improved optical imaging and lithography processes in semiconductor manufacturing enable an increasing amount of functionality per silicon area. The minimum structural size of a component sufficient for implantation is F ≤ 90 nm. This allows analog circuits, digital circuits, analog-digital hybrid circuits, and high-voltage circuits to be increasingly integrated monolithically on a single chip. This reduces the number of chips and connections on an electronic module, and therefore compensates for the smaller available area of ​​currently narrow, strip-like modules to accommodate known functional complexity.

[0139] Regarding the manufacturing of integrated circuits on electronic equipment modules, a manufacturing process is selected characterized in that at least one chip is manufactured in a process having a minimum structural size F ≤ 90 nm. Alternatively, at least one chip is manufactured in a process having a minimum structural size F ≤ 65 nm. Alternatively, at least one chip is manufactured in a process having a minimum structural size F ≤ 65 nm, and a voltage of ≥ 10 V may be simultaneously connected to its substrate. Alternatively, at least one chip is manufactured in a process having a minimum structural size F ≤ 65 nm, and a voltage of ≥ 10 V may be simultaneously connected to its substrate, and the chip's SRAM (Static Random Access Memory, Static RAM) memory function has a capacity of ≥ 3 megabits.

[0140] Electronic equipment modules having the form factor described herein are specifically suitable for mounting in the cross-section of a flat plant between an energy storage unit and an electrode connection device. The position of this assembly is - Right-angle connections for wired components on the upper and / or lower sides of the electronics module. - A lumen into which connections of components, such as battery connections and / or header connections, may be inserted from above or through the inside. - Lumen fitted to accommodate cutting sleeves and / or clamping sleeves This results in further features of electronic modules that can be realized individually or in any combination of them.

[0141] The straight, cut edges also enable the optimal manufacturing of electronic modules in a panelized form using standard packaging techniques for Ball Grid Array Packages (μBGA). In μBGA, chips are mounted and bonded onto a Printed Circuit Board (PCB) substrate and covered with a molding compound during the transfer overmolding process. Solder balls are applied to the back of the substrate for SMD assemblies. Packaging is performed in a panelized state. The Printed Circuit Board substrate always has a uniform panel size for all chip sizes, which depends solely on the molding tools of the transfer molding machine. Depending on the chip size, more or fewer chips are mounted on the panel, and then, after potting and fitting the solder balls, they are cut from the panel to their final package size.

[0142] In one embodiment, there are three square potting areas, each with a 56 mm edge length on a 205 mm x 70 mm panel, where the chip is assembled and wire-bonded (see Figures 10A and 10B). Applying this μBGA packaging process to electronic equipment modules brings about further features and expansions of the packaging process shown in Figures 10A to 10E. After transfer molding, holes or fits for the cutting sleeve and / or clamping sleeve are drilled (see Figure 10C). Potting not only serves to cover the chip, but it is also part of the mechanical stability of the electronic equipment module, specifically the resulting plug-in connection. Instead of solder balls, the panel is used to mount the SMD components of the electronic equipment module in a panelized form (see Figure 10D). The edge length of the electronic equipment module satisfies an integer divider ratio of the potting surface edge of the panel, minus cutting losses. The components of an electronic device module may be provided as an ASIC (Application-Specific Integrated Circuit).

[0143] Some of the manufacturing steps are summarized below. - Figure 10A: In the panelized configuration, the ASIC 101 is assembled and joined to the first side (front side) of panel 100. - Figure 10B: Transfer overmolding the assembled ASIC 101 with potting agent 102. - Figure 10C: Drill hole 103 for connecting the energy storage unit. - Figure 10D: The second side (rear side) of panel 100 is mounted using SMD component 104. - Figure 10E: Swing out the completed electronic module.

[0144] Figures 11 to 17 illustrate the individual steps for assembling the electrode connection device (header) on the implant. These steps are described in more detail below.

[0145] Figure 11 shows an assembly 1 (also called a header core) comprising a first receiving means 2 for a male electrode connector and a second receiving means 13 for a further male electrode connector. The first receiving means 2 has a front opening 6 through which a male electrode connector can be inserted. The first receiving means 2 has a first portion 3, a second portion 4, and a third portion 5. The diameter of the first portion 3 is greater than the diameter of the second portion 4. The diameter of the second portion 4 is greater than the diameter of the third portion 5. In other words, the first receiving means 2 tapers gradually from the front opening 6 towards the end.

[0146] The first connecting element is formed between the first part 3 and the second part 4 (i.e., in the front region of the first receiving means 2). The second connecting element 8 is formed between the second part 4 and the third part 5 (in the rear region of the first receiving means 2). Both the first connecting element 7 and the second connecting element 8 have at least two flat sides. This allows for easy gripping of the assembly 1 during assembly and enables automation of the assembly steps. In the illustrated embodiment, the first connecting element 7 and the second connecting element 8 are substantially cubic in shape. The second connecting element 8 has an angled edge 17, which saves material and serves to observe the direction of epoxy resin flow. A recess 12a is formed in the plastic material to be coated on the rear side of the first connecting element 7. A rear opening 12b is formed on the rear side of the second connecting element 8.

[0147] The assembly is partially enclosed in plastic material 11. In the illustrated embodiment, the assembly is partially overmolded with polysulfone. Recesses for the first contact surface 9 and the second contact surface 10 are formed in the plastic material 11. The first and second contact surfaces are formed as circular surfaces. Guides 16 are formed adjacent to each of the first contact surface 9 and the second contact surface 10. The guides 16 function to receive connecting elements (e.g., wiring strips). The guides on the contact surfaces prevent connecting elements from different contact surfaces from touching each other.

[0148] The second receiving means 13 is constructed similarly to the first receiving means 2. For clarity, the components of the second receiving means (the opening, the three stepped tapered sections, and the two connecting elements) are not given reference numerals. The second receiving means also has two contact surfaces (a third contact surface 14 and a fourth contact surface 15) for connection. Guides are again formed adjacent to the contact surfaces.

[0149] The positioning means 18b is formed at one end of the second receiving means and is embodied as a pin having a pointed end. When assembling the assembly 1 on the housing 29 (see Figure 15), the pointed end of the positioning means 18b can be inserted into a socket in the housing to facilitate the precise fitting of the assembly on the housing. However, the assembly can also be embodied without the positioning means 18b.

[0150] The positioning pin 18a is formed on the upper side of the assembly (see Figure 12). When the assembly is placed on the housing of the plant, the positioning pin may be positioned within the associated socket. In the illustrated embodiment, two positioning pins are shown, but other numbers of positioning pins are possible.

[0151] The first receiving means 2 and the second receiving means 13 each have a spring sleeve and a male connector socket, respectively. The first receiving means 2 and the second receiving means 13 can be designed as IS-1 connectors.

[0152] The spring element 20 is placed in the first receiving means 2 and fixed therein (left side of Figure 13). The recess 12a in the plastic material is used to weld the spring element 20 placed in the first receiving means 2 into the first connecting element 7 by resistance welding. Similarly, another spring element is placed in and fixed to the second receiving means 13 (not shown). The opening of the assembly 1 is then closed and sealed with potting aids 21, 22, and 23 (right side of Figure 13).

[0153] Further assembly steps are shown in Figure 14. A wire strip 24 is fixed (e.g., welded) to the third contact surface 14. At its rear end, the wire strip 24 has a wire strip connection 25 (see Figure 4) which can be connected to the pin contacts of the feedthrough 30, and may be inserted, for example, onto the pin contacts. Further wire strips are connected to the other contact surfaces 9, 10, and 15.

[0154] The antenna 26 is attached to the assembly 1. The antenna 26 is partially enclosed by the first portion 3 of the first receiving means 2 and clipped therein. In the region between the first connecting element 7 and the second connecting element 8, the antenna 26 has a U-shaped portion 27. This forms a gripping recess that can be used, for example, with an automatic gripper to hold and transport the assembly. An antenna connection 28 is formed at the rear end of the antenna for connection to the feedthrough 30.

[0155] Next, the assembly with the wire strip and antenna is placed in a mold (e.g., a silicone mold) (not shown). The wire strip connection and antenna connection 28 are placed on the corresponding pins of the feedthrough 30 and connected to the pins (e.g., welded). The mold is closed and filled with synthetic resin 31 (e.g., epoxy resin). This forms the electrode connection device (see Figure 16).

[0156] For example, by grinding and / or polishing, the potting aids 21, 22, and 23 are removed, along with any excess resin on the outer surface. At this point, the implant with the electrode connection device is fully assembled (Figure 17).

[0157] Figure 18 shows another embodiment of the implant. An electrode connection device 53 is mounted on the cover 121. The energy storage unit 62 is received in the housing 120. The housing 120 may be provided as a deep-drawn molded portion. The cover 121 is welded to the housing 120 along a circumferential weld seam 122 to close the housing 120. A support frame 69 is positioned on the energy storage unit. The support frame 69 receives the electronics module. The electrode connection device 53 may be formed, for example, by the embodiments shown in Figures 11 to 17. A feedthrough 65 with pins 70 is welded into the cover 121.

[0158] The examples of plantings and methods disclosed herein may have the following advantages:

[0159] The internal structure of electronic implants is considerably simplified, thus lowering manufacturing costs. Similarly, the number and complexity of required manufacturing processes are reduced, thus aiding in manufacturing scalability (e.g., simplified transmission to other locations, reduced need for employee training, reduced manufacturing environment and associated engineering requirements). Furthermore, when removable connector technology is used, rework becomes possible or simplified.

[0160] Regarding the form factor of electronic modules, implants can be manufactured smaller, or the resulting volume can be used to increase battery capacity and thus extend the lifespan of the implant. Manufacturing electronic modules in μBGA technology enables increased utility for panels and associated product cost reductions. Vertical assemblies of electronic modules (parallel to the front of the energy storage unit) allow for electrical connections without angles, thus enabling simpler and more economical implants optimized for automated manufacturing in one axis.

[0161] The features, claims, and drawings disclosed in this specification may be relevant to the implementation of the embodiments, both individually and in any combination thereof.

Claims

1. An implant comprising an electronic module and an electronic component, wherein the electrical connection between the electronic module and the electronic component is formed by a straight plug-in connection, the electronic component has straight pin elements, the electronic module has a pin socket, the pin elements are arranged within the pin socket to form the electrical connection, and the electronic component is feedthrough. The implantation has further electronic components, the electrical connection between the electronic module and the further electronic components is formed by further straight plug-in connections, the straight plug-in connection and the further straight plug-in connection are oriented in the same direction, the electronic module has another pin socket, the further electronic component is an energy storage unit and has pin elements located in the other pin socket of the electronic module, The electronic device module is arranged on a support frame, the support frame is arranged within a housing such that the energy storage unit is fixed by the support frame, and the support frame is arranged on the energy storage unit such that the energy storage unit is pressed against the housing by the support frame and thereby fixed. The straight plug-in connection and the further straight plug-in connection are formed as removable connections in the plant.

2. The planting according to claim 1, wherein the clamp portion is located at the bottom of the housing on the side opposite to the front of the housing, and the clamp portion is designed to press and secure the energy storage portion to the support frame.

3. The implantation according to claim 1 or 2, wherein the pin socket is ring-shaped.

4. The implantation according to any one of claims 1 to 3, wherein the pin element has a spring element.

5. The plant according to any one of claims 1 to 4, wherein the electrical connection is formed by a connection selected from the following connection types: spring contacts and insulated displacement contacts.

6. The plant according to any one of claims 1 to 5, wherein the plug-in connection is designed to compensate for relative movement between the electronic component and the electronic equipment module without interfering with the electrical connection.

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