Processing equipment

Abstract

To efficiently supply cooling liquid having a predetermined temperature to a predetermined constitutive element.SOLUTION: A processing device is provided with a holding table on which a work-piece is held, a processing unit that applies processing to the work-piece held on the holding table, and a control part. The processing unit comprises a spindle unit which includes a spindle which a processing tool is attached to and a housing for supporting the spindle rotatably, which is connected to a spindle temperature adjusting unit that adjusts a temperature of the spindle to a predetermined temperature, by cooling the spindle unit. The spindle temperature adjusting unit comprises a circulation path through which cooling liquid introduced into the housing circulates, a heat exchanger arranged on the circulation path, and a temperature sensor that measures a temperature of the cooling liquid flowing to the housing. The heat exchanger is supplied with processing liquid supplied from a processing liquid supply source, and in the heat exchanger, a temperature of the cooling liquid flowing through the circulation path is lowered by the processing liquid and at the same time the temperature of the processing liquid is increased by the cooling liquid.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a processing apparatus including a holding table for holding a workpiece and a processing unit for processing the workpiece, in which a coolant circulates and specific components are maintained at a predetermined temperature.

Background Art

[0002] As processing apparatuses for processing workpieces such as semiconductor wafers, various processing apparatuses such as cutting apparatuses, grinding apparatuses, and polishing apparatuses are known. In order to repeatedly process workpieces with little variation in these processing apparatuses, it is important to control the temperature of the processing unit and the temperature of the workpiece with high precision. If the temperature of the processing unit or the like is not constant when processing two or more workpieces respectively, a constant processing result may not be obtained. If the temperature of the processing unit or the like changes during the processing of one workpiece, a predetermined processing result may not be obtained.

[0003] For example, the processing unit includes a cutting tool that rotates and contacts the workpiece to process the workpiece, a spindle that serves as a rotation axis when rotating the cutting tool, and a rotational drive source such as a motor that rotates the spindle. When the processing unit is operated, heat is generated due to the rotation of the spindle, and the spindle expands thermally, so the processing result may change.

[0004] Therefore, in order to keep the temperature of the processing unit constant and suppress the thermal expansion of the spindle, a coolant (cooling water) adjusted to a predetermined temperature is supplied to the processing unit. The processing apparatus is provided with a circulation path through which the coolant circulates, and the circulation path is provided with a cooling unit for cooling the coolant. The coolant that has been used for cooling the spindle and whose temperature has risen is cooled by the cooling unit and supplied to the spindle again.

[0005] Furthermore, in these processing devices, a processing fluid (processing water) such as pure water is continuously sprayed onto the workpiece and the processing tools of the processing unit for purposes such as quickly removing processing debris and frictional heat generated on the workpiece. Because the processing fluid comes into contact with the workpiece one after another, the temperature of the workpiece is affected by the temperature of the processing fluid. If unwanted thermal expansion or contraction occurs in the workpiece, the desired processing result cannot be obtained, so the temperature of the processing fluid is also controlled. In processing devices, the temperature of the cooling fluid and processing fluid is controlled, supplied to the designated points of action, and used according to the purpose (see Patent Document 1). [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2018-36406 [Overview of the project] [Problems that the invention aims to solve]

[0007] A processing fluid supply source is connected to the processing equipment to supply processing fluid such as pure water. However, depending on the region in which the processing equipment is used, the temperature of the processing fluid supplied from the processing fluid supply source may be extremely low. Supplying extremely low-temperature processing fluid to the processing tool or workpiece can cause problems such as thermal shrinkage of the tool. Therefore, a heater was installed in the processing equipment to heat the processing fluid supplied from the processing fluid supply source and adjust it to the desired temperature.

[0008] However, installing and operating heaters incurs considerable costs. Furthermore, while cooling units are used in processing equipment to reuse used coolant, preheating the processing fluid supplied from the processing fluid source with a heater is inefficient.

[0009] This invention has been made in view of the above problems, and its objective is to provide a processing apparatus that can efficiently supply a coolant at a predetermined temperature to a predetermined component. [Means for solving the problem]

[0010] According to one aspect of the present invention, a processing apparatus comprises a holding table for holding a workpiece, a processing unit for processing the workpiece held on the holding table, and a control unit, wherein the processing unit includes a spindle unit comprising a spindle on which a processing tool is mounted, a housing that rotatably supports the spindle, and a motor that rotates the spindle, and is connected to a spindle temperature control unit that cools the spindle unit and adjusts it to a predetermined temperature, the spindle temperature control unit being introduced into the housing of the spindle unit and the housing A processing apparatus is provided, comprising: a circulation path through which a coolant discharged from a jigging circulates; a pump disposed in the circulation path for circulating the coolant in the circulation path; a first heat exchanger disposed in the circulation path; and a first temperature sensor disposed upstream of the housing in the circulation path for measuring the temperature of the coolant as it moves towards the housing, wherein the first heat exchanger is supplied with processing fluid from a processing fluid supply source, and in the first heat exchanger, the temperature of the coolant as it moves through the circulation path decreases due to the processing fluid and increases due to the cooling fluid.

[0011] Preferably, a cooling unit for cooling the coolant is provided in the circulation path, and the control unit adjusts the output of the cooling unit by referring to the temperature of the coolant measured by the first temperature sensor.

[0012] Preferably, the spindle temperature control unit further comprises a bypass path arranged in parallel with the first heat exchanger in the circulation path, and a valve arranged in the bypass path for adjusting the amount of coolant flowing through the bypass path, wherein the control unit adjusts the opening of the valve by referring to the temperature of the coolant measured by the first temperature sensor.

[0013] More preferably, the system includes a supply path through which the processing fluid travels from the first heat exchanger, and the processing fluid, which has been supplied from the processing fluid source to the first heat exchanger and whose temperature has risen, is supplied through the supply path to the workpiece held on the holding table or to the processing tool.

[0014] More preferably, the supply path is provided with a heating unit for heating the processing fluid flowing through the supply path, and a second temperature sensor downstream of the heating unit for measuring the temperature of the processing fluid flowing through the supply path.

[0015] Preferably, a second heat exchanger is provided in the supply path, and the workpiece held on the holding table or the used processing fluid supplied to the processing tool is introduced into the second heat exchanger through the supply path, and in the second heat exchanger, the temperature of the processing fluid traveling through the supply path is raised by the used processing fluid. [Effects of the Invention]

[0018] In a processing apparatus according to one aspect of the present invention, a first heat exchanger is provided in the circulation path through which a coolant, whose temperature has risen due to its use in cooling the spindle unit, travels. The first heat exchanger is supplied with processing fluid from a processing fluid supply source. In the first heat exchanger, the temperature of the coolant traveling through the circulation path is lowered by the processing fluid, and the temperature of the processing fluid is raised by the coolant. In other words, heat exchange takes place between the coolant and the processing fluid in the first heat exchanger.

[0019] When the temperature of the coolant, which has risen, decreases in the first heat exchanger, it becomes easier to reuse the coolant. On the other hand, when the temperature of the processing fluid supplied from the processing fluid source rises, it becomes easier to supply this processing fluid to the processing tools, etc. At the very least, compared to when the first heat exchanger is not used, it becomes easier to adjust the temperature of the coolant, which has risen, to a temperature suitable for reuse, and it also becomes easier to adjust the temperature of the processing fluid, which is too cold, to a temperature suitable for use. Therefore, the cost required for adjusting the temperature of the coolant and processing fluid can be reduced.

[0020] Therefore, according to one aspect of the present invention, a processing apparatus is provided that can efficiently supply a coolant at a predetermined temperature to a predetermined component.

Brief Description of the Drawings

[0021] [Figure 1] It is a perspective view schematically showing a processing apparatus. [Figure 2] It is a perspective view schematically showing a workpiece to be processed which is supplied with a processing fluid and processed by a cutting tool. [Figure 3] It is a cross-sectional view schematically showing a processing chamber in which a processing fluid is used, recovered, and discharged. [Figure 4] It is a connection relationship diagram schematically showing a circulation path of a coolant and a supply path of a processing fluid. [Figure 5] It is a connection relationship diagram schematically showing a circulation path of a coolant and a supply path of a processing fluid.

Embodiments for Carrying Out the Invention

[0022] Referring to the accompanying drawings, embodiments according to one aspect of the present invention will be described. The processing apparatus according to the present embodiment is installed in a semiconductor device chip manufacturing factory and processes a workpiece such as a semiconductor wafer. The processing apparatus according to the present embodiment is, for example, a cutting apparatus, a grinding apparatus, a polishing apparatus, or the like. The processing apparatus includes a processing unit having a cutting tool, a spindle to which the cutting tool is attached, and a motor for rotating the spindle, and a holding table (chuck table) for holding the workpiece to be processed.

[0023] FIG. 2 is a perspective view schematically showing a workpiece 1 being processed by the processing unit of the processing apparatus. First, the workpiece 1 will be described. The workpiece 1 is, for example, a wafer formed of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors. Or it is a wafer formed of a complex oxide such as LT (lithium tantalate) or LN (lithium niobate).

[0024] Alternatively, the workpiece 1 is a substantially disk-shaped substrate or the like made of a material such as sapphire, glass, or quartz. The glass is, for example, alkali glass, non-alkali glass, soda lime glass, lead glass, borosilicate glass, fused silica glass, or the like. Alternatively, the workpiece 1 may be a package substrate formed by arranging a plurality of device chips vertically and horizontally and sealing them with resin. Hereinafter, the case where the workpiece 1 is a semiconductor wafer will be described as an example, but the workpiece 1 is not limited thereto.

[0025] The surface 1a of the workpiece 1 is partitioned by a plurality of division planned lines 3 that intersect each other. And in each region partitioned by the division planned lines 3 on the surface 1a of the workpiece 1, devices 5 such as ICs and LSIs are formed respectively. Note that there are no restrictions on the type, quantity, arrangement, etc. of the devices 5.

[0026] When the workpiece 1 is processed along the division planned line 3 to form processing marks 13 such as division grooves and the workpiece 1 is divided, individual device chips each including a device 5 can be formed. Before the workpiece 1 is divided, the workpiece 1 is ground from the back surface 1b side to be thinned, and the back surface 1b side is further polished to be flattened. Then, when the workpiece 1 is divided, thin device chips can be manufactured. Thus, the workpiece 1 provided with a plurality of devices 5 on the surface 1a side is processed by various processing apparatuses.

[0027] When the workpiece 1 is carried into the processing apparatus, an adhesive tape 7 that is attached in advance so as to close the opening of a ring frame 9 formed of metal or the like is attached to the back surface 1b side of the workpiece 1. Then, the workpiece 1 is carried into the processing apparatus and processed in a state of a frame unit 11 in which the workpiece 1, the adhesive tape 7, and the ring frame 9 are integrated. The individual device chips formed by dividing the workpiece 1 are supported by the adhesive tape 7 and then picked up from the adhesive tape 7.

[0028] Hereinafter, a processing apparatus for cutting a workpiece 1 will be described as a processing apparatus according to this embodiment. That is, the processing apparatus will be described below using the case where the processing apparatus is a cutting apparatus as an example. However, the processing apparatus according to this embodiment is not limited to a cutting apparatus. Figure 1 is a schematic perspective view showing a cutting apparatus, which is an example of a processing apparatus 2 according to this embodiment.

[0029] The processing apparatus 2 comprises a base 4 that supports each component and a housing 6 that covers each component supported by the base 4. A cassette support base 8 is provided on one corner of the base 4 that is not covered by the housing 6. A cassette for containing multiple workpieces 1 is mounted on the upper surface of the cassette support base 8.

[0030] A touch panel display 10 is provided on the outer surface of the processing device 2. The touch panel display 10 displays various information and operation screens. The operator can input various commands to the processing device 2 by touching a predetermined position on the touch panel display 10 that displays the screen. In other words, the touch panel display 10 functions as an input unit (input interface) used for inputting various commands, and also functions as a display unit that displays various information.

[0031] The processing device 2 is equipped with a notification unit that emits an alarm or other notification to the operator when any abnormality occurs or when an event that should be reported to the operator occurs. The touch panel display 10 can also function as a notification unit by displaying an alarm screen. In addition, the processing device 2 is equipped with an alarm lamp 46 with multiple lamps as a notification unit. The alarm lamp 46 notifies the operator of various information by illuminating lamps of specific colors.

[0032] The inside of the housing 6 of the processing device 2 is a processing chamber 12. The processing device 2 processes (cuts) the workpiece 1 in the processing chamber 12. The processing chamber 12 houses a holding table (chuck table) 14 that can hold the workpiece 1 by suction.

[0033] Figure 3 is a schematic side view showing the interior of the processing chamber 12. The processing chamber 12 is formed in a roughly rectangular parallelepiped shape so as to enclose the holding table 14 and the processing unit 16, and the space inside the processing chamber 12 becomes the processing space 36 where the workpiece 1 is processed. In other words, the holding table 14 and the processing unit 16 are housed in the processing space 36 inside the processing chamber 12.

[0034] The processing chamber 12 comprises a roughly rectangular upper wall 12a in plan view and a side wall 12b connected to the upper wall 12a and positioned along the Z-axis. The upper wall 12a has an opening 12c that is large enough to insert the support structure of the processing unit 16.

[0035] The holding table 14 is supported by the X-axis moving table 14b, which is covered by a table cover 14c. The X-axis moving table 14b moves in the machining feed direction (X-axis direction) by a machining feed unit (X-axis moving mechanism) (not shown). As the X-axis moving table 14b moves, the holding table 14 is machine-feeded along the X-axis direction.

[0036] A retractable, bellows-shaped dustproof and splashproof cover 14d is connected to the front and rear of the table cover 14c in the X-axis direction. Machining debris and scattered machining fluid generated in the machining chamber 12 are caught by the dustproof and splashproof cover 14d. In other words, the dustproof and splashproof cover 14d protects the machining feed unit.

[0037] The upper surface 14a of the holding table 14 is a holding surface that holds the workpiece 1 by suction. The upper surface 14a of the holding table 14 is formed to be approximately parallel to the X-axis and Y-axis directions and is connected to a suction source (not shown) such as an ejector via a suction passage (not shown) provided inside the holding table 14. The holding table 14 is connected to a rotational drive source (not shown) such as a motor and rotates around a rotation axis that is approximately parallel to the Z-axis direction (vertical direction).

[0038] Inside the machining chamber 12 are one or more machining units (cutting units) 16 that machine (cut) the workpiece 1 held by the holding table 14. The machining units 16 are supported by a lifting unit (Z-axis movement mechanism) and an indexing feed unit (Y-axis movement mechanism), which are not shown, and are movable in the vertical direction (Z-axis direction) and the indexing feed direction (Y-axis direction).

[0039] Figure 2 includes a schematic perspective view of the processing unit (cutting unit) 16. The processing unit 16 is equipped with an annular cutting blade 18 as a processing tool, and processes (cuts) the workpiece 1 with the cutting blade 18. The processing unit 16 includes a spindle unit 19 which includes a spindle (not shown) on which the cutting blade (processing tool) 18 is mounted, a housing 20 that rotatably supports the spindle, and a rotational drive source such as a motor (not shown) that rotates the spindle.

[0040] The housing 20 rotatably houses the base end of a spindle, which forms a rotation axis parallel to the Y-axis direction. A rotational drive source for rotating the spindle is housed inside the housing 20, and when this rotational drive source is activated, the spindle rotates. An annular cutting blade (working tool) 18 is attached to the tip of the spindle. Rotating the spindle allows the cutting blade 18 to rotate as well. The cutting blade 18 comprises a grinding wheel portion containing a binder formed in an annular shape from a metal or resin material, and abrasive grains formed from diamond or the like and dispersed and fixed within the binder.

[0041] The spindle is rotated to lower the rotating cutting blade 18 to a predetermined height, and the machining feed unit (X-axis movement mechanism) is activated to move the holding table 14, bringing the grinding wheel portion of the rotating cutting blade 18 into contact with the workpiece 1, at which point the workpiece 1 is cut. As the workpiece 1 is cut along the division line 3, machining marks (division grooves) 13 are formed on the workpiece 1. Once machining marks 13 have been formed along all of the division line 3 on the workpiece 1, the workpiece 1 is divided into individual device chips.

[0042] In the machining unit 16, heat is generated as the spindle, to which the cutting blade 18 is connected at the tip, rotates. As a result, the spindle may expand due to heat, preventing the desired machining results from being obtained. Therefore, in order to maintain a constant spindle temperature and suppress thermal expansion, a spindle temperature control unit is connected to the spindle unit 19 to cool the spindle unit 19 and adjust it to a predetermined temperature. The spindle temperature control unit supplies a coolant (cooling water) adjusted to a predetermined temperature to the spindle unit 19.

[0043] The spindle temperature control unit is equipped with a circulation path (described later) through which the coolant circulates, and a cooling unit is provided in the circulation path to cool the coolant. Coolant is supplied to the housing 20 of the spindle unit 19 from the forward pipe 21a of the circulation path, and used coolant is returned to the circulation path from the return pipe 21b. The coolant used to cool the spindle and whose temperature has risen is cooled by the cooling unit provided in the circulation path of the spindle temperature control unit and supplied back to the housing 20.

[0044] Furthermore, when the cutting blade 18 cuts the workpiece 1, cutting debris and heat are generated from the grinding wheel and the workpiece 1. Therefore, while the cutting blade 18 is cutting the workpiece 1, a cutting fluid, such as pure water, is supplied to the cutting blade 18 and the workpiece 1. The cutting fluid removes the cutting debris and heat. The cutting fluid also maintains the temperature of the workpiece 1 and the cutting blade (working tool) 18 at a predetermined temperature.

[0045] The processing unit 16 further comprises a blade cover 22 that covers the cutting blade 18, and a processing fluid supply nozzle 24 connected to the blade cover 22. Inside the blade cover 22, a processing fluid injection nozzle 26 (see Figure 3) is provided for spraying processing fluid onto the cutting blade 18. The processing fluid is supplied to the cutting blade 18 from the processing fluid supply nozzle 24 and the processing fluid injection nozzle 26.

[0046] Figure 3 is a schematic side view showing the inside of the processing chamber 12 in which the workpiece 1 is processed by the processing unit 16. The blade cover 22 incorporates a fluid supply passage 28 whose end is connected to a processing fluid supply nozzle 24 or a processing fluid injection nozzle 26, and has a connection part 30 at the starting point of the fluid supply passage 28. A pipe 32 of the processing fluid supply route, which will be described in detail later, is connected to the connection part 30, and the processing fluid is supplied through the supply route.

[0047] A protective cover 34 is provided near the opening 12c of the processing chamber 12, at a position that overlaps with the opening 12c. The protective cover 34 prevents the processing fluid used in processing by the processing unit 16 from splashing out of the processing chamber 12 through the opening 12c.

[0048] Furthermore, a partition member 38 is provided on the front side (right side in Figure 3) of the processing unit 16, dividing the processing space 36 into a processing area 36a and a transport area 36b. Processing of the workpiece 1 is performed in the processing area 36a, while the transport of the workpiece 1 onto the holding table 14 and the removal of the workpiece 1 from the holding table 14 are performed in the transport area 36b. In addition, the partition member 38 prevents the processing fluid used in processing by the processing unit 16 from splashing into the transport area 36b.

[0049] An opening 38a is provided at the lower end of the partition member 38. The holding table 14 moves along the X-axis direction between the processing area 36a and the transport area 36b through this opening 38a.

[0050] When the workpiece 1 is processed by the processing unit 16 within the processing area 36a, the processing fluid 40 supplied from the supply path and used for processing is scattered to the rear (left side in Figure 3) by the rotation of the cutting blade 18. This scattered processing fluid 40 is discharged by a drain 42 provided on the rear side of the dustproof and waterproof cover 14d.

[0051] The drain 42 is a discharge mechanism that discharges the used processing fluid 40 from the processing chamber 12 to the outside of the processing chamber 12. The drain 42 comprises a storage section 42a that temporarily stores the processing fluid 40 in the processing space 36, and a pipe 42b, one end of which is connected to the bottom of the storage section 42a and the other end of which is connected to a discharge path (described later). The processing fluid 40 that has been scattered in the processing space 36 is temporarily stored in the storage section 42a and then proceeds through the discharge path via the pipe 42b.

[0052] The processing apparatus 2 may include a cleaning unit (not shown) for cleaning the processed workpiece. The cleaning unit includes a spinner table for rotatably holding the workpiece, and a spray unit for spraying cleaning water onto the workpiece held on the spinner table. The processed workpiece is cleaned in the cleaning unit and then discharged from the processing apparatus 2.

[0053] The processing apparatus 2 includes a control unit 44 that controls each component, such as the holding table (chuck table) 14, the processing unit (cutting unit) 16, and the cleaning unit. The control unit 44 also controls the cassette support base 8, the X-axis movement mechanism, and the transport unit. The control unit 44 may also control components provided in the supply path (described later) that supplies processing fluid to the processing unit 16 and the workpiece 1, and in the circulation path that circulates and supplies cooling fluid to the processing unit 16.

[0054] The control unit 44 is connected to each component. The control unit 44 is composed of a computer that includes, for example, a processing unit such as a CPU (Central Processing Unit), a main memory such as DRAM (Dynamic Random Access Memory), and an auxiliary storage device such as flash memory. The functions of the control unit 44 are realized by operating the processing unit and other components according to the software stored in the auxiliary storage device.

[0055] Here, the processing device 2 is connected to a processing fluid supply source that supplies processing fluid 40 to the processing unit 16. However, depending on the area in which the processing device 2 is used and the equipment and environment of the factory where the processing device 2 is installed, the temperature of the processing fluid 40 supplied from the processing fluid supply source may be extremely low. Supplying extremely low-temperature processing fluid 40 to the cutting blade (processing tool) 18 or the workpiece 1 can cause problems such as thermal shrinkage of the processing tool, etc.

[0056] Therefore, conventionally, a heating unit such as a heater was installed in the processing water supply path of the processing apparatus 2, and the processing liquid 40 supplied from the processing liquid supply source was heated by the heating unit to adjust it to the desired temperature. However, the installation and operation of the heating unit incurs considerable costs. Furthermore, in the processing apparatus 2, while a cooling unit is used for reuse of the used coolant circulating in the circulation path, preheating the processing liquid 40 supplied from the processing liquid supply source with a heating unit is inefficient.

[0057] Therefore, in the processing apparatus according to this embodiment, a coolant at a predetermined temperature is efficiently supplied to predetermined components such as the processing unit 16. The following description of the processing apparatus 2 according to this embodiment will focus on the circulation path that efficiently supplies a coolant at a predetermined temperature to the processing unit 16 to cool the processing unit 16, and the supply path that efficiently supplies processing fluid 40 at a predetermined temperature to the processing unit 16.

[0058] Figure 4 is a schematic connection diagram showing the configuration of a spindle temperature control unit 48 that supplies coolant to the spindle unit 19 of the processing unit 16 to adjust the spindle temperature. In the connection diagram shown in Figure 4, each component is represented by a block or symbol, and the piping connecting each component is shown by lines. The piping is made up of, for example, resin tubes or pipes.

[0059] The spindle temperature control unit 48 includes a circulation path 50 through which the coolant introduced into and discharged from the housing 20 of the spindle unit 19 circulates. Furthermore, the spindle temperature control unit 48 includes a pump 52 disposed in the circulation path 50 for circulating the coolant in the circulation path 50, and a first heat exchanger 54 disposed in the circulation path 50.

[0060] Furthermore, the spindle temperature control unit 48 is located upstream of the housing 20 of the spindle unit 19 in the circulation path 50 and is equipped with a first temperature sensor 60 that measures the temperature of the coolant flowing into the housing 20. In addition, a cooling unit 62 for cooling the coolant is located in the circulation path 50. Although the connection diagram in Figure 4 shows the cooling unit 62 located downstream of the first temperature sensor 60 in the circulation path 50, the cooling unit 62 may also be located upstream of the first temperature sensor 60.

[0061] There are no particular restrictions on the pump 52 used in the circulation path 50. Any pump can be used as the pump 52, such as non-positive displacement pumps like centrifugal pumps and propeller pumps, or positive displacement pumps like reciprocating pumps and rotary pumps. There are also no particular restrictions on the first temperature sensor 60. Any contact temperature sensor equipped with a resistance thermometer, thermocouple, or IC temperature sensor can be used as the first temperature sensor 60.

[0062] Furthermore, there are no particular restrictions on the cooling unit 62. The cooling unit 62 may use an air-cooled or liquid-cooled heat exchanger. In the cooling unit 62, heat exchange occurs, for example, between a cooling medium supplied from a factory where the processing device 2 is installed and a cooling liquid traveling through the circulation path 50. Alternatively, the cooling unit 62 may be composed of cooling elements such as a Peltier element. There are also no particular restrictions on the first heat exchanger 54. For example, the first heat exchanger 54 can be a tube-type heat exchanger or a plate-type heat exchanger.

[0063] Here, a supply path 64 for the processing fluid 40 supplied to the processing unit 16 is connected to the first heat exchanger 54 located in the circulation path 50 of the spindle temperature control unit 48. A processing fluid supply source 66 is connected to the starting point of the processing fluid 40 supply path 64. For example, the processing fluid supply source 66 is equipment such as a factory where the processing apparatus 2 is installed, and is a tank that supplies the processing fluid 40 such as pure water. Additives such as surfactants may be mixed into the processing fluid 40 in advance.

[0064] The coolant passing through the return pipe 21b of the circulation path 50 has risen in temperature because it was used to cool the spindle. Therefore, this coolant cannot be reused to cool the spindle as is. On the other hand, the machining fluid 40 supplied from the machining fluid supply source 66 is at a low temperature and cannot be supplied to the machining unit 16 as is.

[0065] The first heat exchanger 54 has a circulation path 50 for the spindle temperature control unit 48 and a supply path 64 for the processing fluid 40. In the first heat exchanger 54, heat exchange takes place between the coolant used to cool the spindle in the spindle unit 19 and flowing through the return pipe 21b of the circulation path 50, and the processing fluid 40 supplied from the processing fluid supply source 66 and flowing through the supply path 64.

[0066] In other words, in the first heat exchanger 54, the temperature of the coolant used to cool the spindle in the spindle unit 19 and traveling through the circulation path 50 decreases due to the processing fluid 40, while the temperature of the processing fluid 40 increases due to the coolant. As a result, the coolant approaches a temperature suitable for reuse, while the processing fluid 40 approaches a temperature suitable for supplying to the processing unit 16.

[0067] Let's explain from a different perspective. The first heat exchanger 54 is located in the middle of the coolant circulation path 50, and is supplied with the coolant used to cool the spindle unit 19. The coolant that has been heat-exchanged and discharged in the first heat exchanger 54 then proceeds through the circulation path 50 again. At the same time, the first heat exchanger 54 is located in the middle of the processing fluid supply path 64, and is supplied with the processing fluid 40 supplied from the processing fluid supply source 66. The processing fluid 40 that has been heat-exchanged and discharged in the first heat exchanger 54 then proceeds through the supply path 64 again.

[0068] If the first heat exchanger 54 is not present in the circulation path 50, the cooling liquid temperature must be lowered primarily by the cooling unit 62, resulting in high operating costs for the cooling unit 62. However, since the first heat exchanger 54 also lowers the cooling liquid temperature, the operating intensity of the cooling unit 62 required to regulate the cooling liquid temperature can be reduced. Furthermore, if the cooling liquid temperature is sufficiently lowered by the first heat exchanger 54, the operation of the cooling unit 62 can be omitted.

[0069] The temperature of the coolant, whose temperature has been reduced by the first heat exchanger 54, is monitored by the first temperature sensor 60. Then, the temperature of the coolant discharged from the first heat exchanger 54 is measured by the first temperature sensor 60 so that the spindle unit 19 is supplied with coolant at the optimal temperature, and the operating intensity of the cooling unit 62 is determined according to the measured temperature of the coolant.

[0070] In particular, it is preferable that the first temperature sensor 60 and the cooling unit 62 are connected to the control unit 44, and that the control unit 44 determines the output of the cooling unit 62 by referring to the temperature of the coolant measured by the first temperature sensor 60 and controls the cooling unit 62.

[0071] Furthermore, when the temperature of the coolant discharged from the first heat exchanger 54 and flowing again through the circulation path 50 is measured by the first temperature sensor 60, it is possible that the coolant temperature may be lower than the optimal temperature. In other words, it is possible that the coolant is excessively cooled in the first heat exchanger 54 and is not suitable for supply to the spindle unit 19 in that state.

[0072] Therefore, the spindle temperature control unit 48 may be provided with a bypass path 56 arranged in parallel with the first heat exchanger 54 in the circulation path 50. The bypass path 56 may be provided with a valve 58 for adjusting the amount of coolant flowing through the bypass path 56. Any valve with adjustable flow rate can be used as the valve 58, and it is preferable to use an electronically controllable valve such as a globe valve, gate valve, ball valve, or butterfly valve.

[0073] If a bypass path 56 is formed in the spindle temperature control unit 48, the entire amount of coolant used to cool the spindle unit 19 and traveling through the circulation path 50 does not proceed to the first heat exchanger 54, and a portion of the coolant flows through the bypass path 56. The coolant that has not decreased in temperature after passing through the bypass path 56 merges with the coolant whose temperature has decreased in the first heat exchanger 54 and proceeds through the circulation path 50 again.

[0074] In this case, the temperature of the coolant measured by the temperature sensor 60 will be higher compared to the case where the entire amount of coolant proceeds to the first heat exchanger 54. By controlling the valve 58 to adjust the flow rate of the coolant proceeding through the bypass path 56, the amount of temperature drop of the coolant from immediately after it is used to cool the spindle unit 19 until it flows into the temperature sensor 60 can be adjusted. In other words, if the spindle temperature control unit 48 is equipped with a bypass path 56 and a valve 58, it is possible to prevent the coolant from becoming too cold.

[0075] The opening degree of valve 58 may be adjusted by the control unit 44. In other words, the control unit 44 may adjust the opening degree of valve 58 by referring to the temperature of the coolant measured by the first temperature sensor 60. The control unit 44 may also operate the bypass path 56 and the cooling unit 62 simultaneously, or set valve 58 to a non-zero opening degree and operate the cooling unit 62 with a non-zero output.

[0076] In other words, even when the cooling effect of the first heat exchanger 54 on the coolant is sufficient and the operation of the cooling unit 62 is unnecessary, cooling may still be performed by the functions of both the first heat exchanger 54 and the cooling unit 62. In this case, even if the amount of temperature decrease of the coolant by the first heat exchanger 54 is not stable, the temperature of the coolant can be precisely adjusted to a predetermined temperature by finely controlling the output of the cooling unit 62.

[0077] Next, the supply path 64 of the processing apparatus 2 will be further described. Low-temperature processing fluid 40 supplied from the processing fluid supply source 66 flows through the supply path 64. The processing fluid 40, whose temperature has risen in the first heat exchanger 54, continues to travel through the supply path 64. When the processing fluid 40 supplied from the processing fluid supply source 66 to the first heat exchanger 54 and whose temperature has risen is at a predetermined temperature suitable for use, it is supplied through the supply path 64 to the workpiece 1 held in the holding table 14 or to the cutting blade (processing tool) 18.

[0078] However, if the temperature of the processing fluid 40 supplied from the processing fluid supply source 66 to the first heat exchanger 54 and heated has not reached a predetermined temperature suitable for use, the processing fluid 40 needs to be further heated before being supplied to the workpiece 1, etc. Therefore, it is preferable that the supply path 64 be equipped with a heating unit 68 that heats the processing fluid 40 flowing through the supply path 64, and a second temperature sensor 70 downstream of the heating unit 68 that measures the temperature of the processing fluid 40 flowing through the supply path 64.

[0079] Here, it is preferable that the second temperature sensor 70 is configured in the same manner as the first temperature sensor 60 described above. The heating unit 68 may be configured with a heater such as an electric heating wire, for example. Alternatively, a heat exchanger may be used for the heating unit 68. In the heating unit 68, heat exchange takes place between the heating medium supplied from, for example, a factory where the processing apparatus 2 is installed, and the processing liquid 40. However, the second temperature sensor 70 and the heating unit 68 are not limited to these.

[0080] The control unit 44 may be connected to the second temperature sensor 70 and the heating unit 68. The control unit 44 may adjust the output of the heating unit 68 by referring to the temperature of the processing fluid 40 measured by the second temperature sensor 70 so that the temperature of the processing fluid 40 is at the optimal temperature when supplied to the workpiece 1 or the cutting blade (working tool) 18.

[0081] If the first heat exchanger 54 is not installed in the supply path 64, the processing fluid 40 supplied from the processing fluid supply source 66 must be heated and its temperature adjusted solely by the heating unit 68. In contrast, if the first heat exchanger 54 is installed in the supply path 64 and the temperature of the processing fluid 40 rises in the first heat exchanger 54, the operating intensity of the heating unit 68 can be relatively low. Therefore, the processing apparatus 2 according to this embodiment, which has the first heat exchanger 54, can efficiently adjust the temperature of the processing fluid 40.

[0082] As shown in Figure 4, a second heat exchanger 72 may be provided in the supply path 64 for the processing fluid 40. The second heat exchanger 72 receives the processing fluid 40 supplied from the processing fluid supply source 66, along with the used processing fluid 40 supplied to the workpiece 1 held on the holding table 14 or the cutting blade (working tool) 18 via the supply path 64.

[0083] The processing fluid 40 supplied to the cutting blade (working tool) 18, etc., absorbs processing heat generated by the cutting blade 18, etc., along with the processing chips generated by the processing of the workpiece 1, so its temperature rises. This high-temperature processing fluid 40 is discharged from the processing apparatus 2 through the piping 42b shown in Figure 3, but in the processing apparatus 2 according to this embodiment, the heat contained in the discharged processing fluid 40 is used to heat the processing fluid 40 supplied to the cutting blade 18, etc.

[0084] The second heat exchanger 72 is connected to the discharge path 74 for the used processing fluid 40. The second heat exchanger 72 may be configured in the same way as the first heat exchanger 54 described above. In the second heat exchanger 72, the temperature of the processing fluid 40 traveling through the supply path 64 is raised by the used processing fluid 40.

[0085] When the processing fluid 40 supplied from the processing fluid supply source 66 is heated in the second heat exchanger 72 in addition to the first heat exchanger 54 and its temperature rises, the operating intensity of the heating unit 68 can be reduced. Therefore, the processing apparatus 2 according to this embodiment, which has a second heat exchanger 72 in addition to the first heat exchanger 54, can control the temperature of the processing fluid 40 more efficiently.

[0086] Up to this point, we have described the case where the circulation path 50 and the supply path 64 are each equipped with one temperature sensor 60, 70. However, the processing apparatus 2 according to this embodiment is not limited to this. The processing apparatus 2 according to this embodiment may be further equipped with other temperature sensors in the circulation path 50 and the supply path 64, may have a tank in which the coolant or processing fluid 40 is temporarily stored, and may have a pump for discharging the coolant stored in the tank from the tank.

[0087] Furthermore, the control unit 44 may control each component such as the cooling unit 62 and the heating unit 68 by referring to the temperature of the coolant or processing fluid 40 measured by the other temperature sensors, and may also control the opening degree of the valve 58 and the output of each pump. By measuring the temperature of the coolant and processing fluid 40 at various points in the circulation path 50 with many temperature sensors, the control unit 44 can control each component more precisely, thereby controlling the temperature of the coolant and processing fluid 40 with greater accuracy.

[0088] As described above, in the processing apparatus 2 according to this embodiment, the coolant used to cool the spindle unit 19 by circulating through the circulation path 50 is cooled by the low-temperature processing fluid 40 supplied from the processing fluid supply source 66. Therefore, according to the processing apparatus 2 according to this embodiment, the used coolant can be cooled efficiently once its temperature has risen, and thus a coolant at a predetermined temperature can be efficiently supplied to predetermined components.

[0089] Furthermore, in the processing apparatus 2 according to this embodiment, the processing fluid 40 supplied to the workpiece 1 and the cutting blade (processing tool) 18 through the supply path 64 is heated by the cooling fluid used to cool the spindle unit 19. Therefore, according to the processing apparatus 2 according to this embodiment, the temperature of the processing fluid 40 can be efficiently heated to a predetermined temperature, and thus the processing fluid 40 at a predetermined temperature can be efficiently supplied to a predetermined component.

[0090] It should be noted that the present invention is not limited to the embodiments described above and can be implemented with various modifications. For example, in the above embodiment, as shown in Figure 4, the processing fluid 40 that has traveled from the processing fluid supply source 66 to the supply path 64 first passes through the first heat exchanger 54 and then through the second heat exchanger 72, but one aspect of the present invention is not limited to this.

[0091] In one aspect of the present invention, the processing apparatus 2 may be configured such that the processing fluid 40, which has traveled from the processing fluid supply source 66 to the supply path 64, first passes through the second heat exchanger 72 and then through the first heat exchanger 54. Figure 5 is a schematic diagram showing the connection relationship between the cooling fluid circulation path and the processing fluid supply path in such a case.

[0092] In comparison with the first heat exchanger 54 shown in Figure 4, the processing fluid 40 that has traveled from the processing fluid supply source 66 to the supply path 64 reaches the first heat exchanger 54 shown in Figure 5 at a higher temperature. Therefore, in the configuration shown in Figure 5, the difference between the temperature of the cooling water that travels through the circulation path 50 and reaches the first heat exchanger 54 and the temperature of the processing fluid 40 that travels through the supply path 64 and reaches the first heat exchanger 54 is relatively small. As a result, the amount of heat exchanged between the processing fluid 40 and the cooling fluid in the first heat exchanger 54 is reduced, and the temperature drop of the cooling fluid in the first heat exchanger 54 is reduced.

[0093] For example, if the temperature of the processing fluid 40 supplied from the processing fluid supply source 66 to the supply path 64 is extremely low, when the processing fluid 40 first passes through the first heat exchanger 54, the temperature of the cooling fluid being heat-exchanged may become too low. In this case, the valve 58 will open wide to prevent the cooling fluid from being overcooled, and the amount of cooling fluid passing through the bypass path 56 will increase. At this time, it is conceivable that there will be less room to adjust the flow rate of the cooling fluid in the bypass path 56 by opening and closing the valve 58.

[0094] In contrast, if the temperature difference between the coolant reaching the first heat exchanger 54 and the processing fluid 40 is relatively small, there is no need to open the valve 58 wide from the start. Therefore, there is a greater range of adjustment for the flow rate of the coolant flowing through the bypass path 56 by the valve 58. Consequently, as shown in Figure 5, configuring the system so that the processing fluid 40 supplied from the processing fluid supply source 66 passes through the second heat exchanger 72 first can be advantageous for adjusting the temperature of the coolant.

[0095] Furthermore, although the above embodiment described a case in which the temperature of the processing fluid 40 supplied from the processing fluid supply source 66 rises as it passes through both the first heat exchanger 54 and the second heat exchanger 72, the processing apparatus 2 according to one aspect of the present invention is not limited to this. The processing fluid 40 supplied from the processing fluid supply source 66 does not have to pass through either the first heat exchanger 54 or the second heat exchanger 72. For example, unused processing fluid 40 supplied from the processing fluid supply source 66 may undergo heat exchange and its temperature rise only in the second heat exchanger 72.

[0096] The configuration of the processing apparatus 2 in this case will now be described. The processing apparatus 2 comprises a supply path 64 which is the path through which the processing fluid 40 supplied from the processing fluid supply source 66 and supplied to the workpiece 1 held on the holding table 14, or to the cutting blade (processing tool) 18, travels, and a heat exchanger (second heat exchanger 72) disposed in the supply path 64.

[0097] In the processing apparatus 2, used processing fluid 40 supplied to the workpiece 1 held on the holding table 14, or to the cutting blade (processing tool) 18, is introduced into the heat exchanger via the supply path 64. In the heat exchanger, the temperature of the processing fluid 40 traveling through the supply path 64 is raised by the used processing fluid 40.

[0098] Furthermore, the supply path 64 may be equipped with a heating unit 68 for heating the processing fluid 40 flowing through the supply path 64, and a temperature sensor (second temperature sensor 70) downstream of the heating unit 68 and the heat exchanger for measuring the temperature of the processing fluid 40 flowing through the supply path 64. In this case as well, in the processing apparatus 2, the temperature of the processing fluid 40 before use supplied to the workpiece 1, etc., rises due to the used processing fluid 40. Therefore, the operating intensity of the heating unit 68 can be suppressed compared to the case where a heat exchanger is not provided in the supply path 64.

[0099] Furthermore, although the above embodiment described a case in which the temperature of the processing fluid 40 supplied from the processing fluid supply source 66 is low and unsuitable for use, the present invention is not limited to this. For example, depending on the region in which the processing apparatus 2 is installed, it is conceivable that the temperature of the processing fluid 40 supplied from the processing fluid supply source 66 may be extremely high, making the processing fluid 40 unsuitable for use as is.

[0100] In this case, it is not necessary to pass the high-temperature processing fluid 40 supplied from the processing fluid supply source 66 through the first heat exchanger 54. On the other hand, there is value in passing the high-temperature processing fluid 40 only through the second heat exchanger 72. In this case, the temperature of the processing fluid 40 supplied to and used on the workpiece 1, etc., becomes lower than the temperature of the processing fluid 40 before use, so when heat exchange occurs in the second heat exchanger 72, the temperature of the processing fluid 40 before use decreases.

[0101] In this case, if it is assumed that the temperature of the processing fluid 40 supplied from the processing fluid supply source 66 is high, it is desirable that a cooling unit (not shown) be provided in place of the heating unit 68, or together with the heating unit 68, in the supply path 64. In this case, if the temperature of the processing fluid 40 before use decreases in the second heat exchanger 72, the operating intensity of this cooling unit can be suppressed.

[0102] In summary, whether the temperature of the pre-use processing fluid 40 supplied from the processing fluid supply source 66 and flowing through the supply path 64 is low or high, it is meaningful to pass the pre-use processing fluid 40 through the heat exchanger (second heat exchanger 72) through which the used processing fluid 40 has passed. In either case, the temperature of the pre-use processing fluid 40 is brought closer to the temperature of the used processing fluid 40, thus bringing the temperature of the pre-use processing fluid 40 closer to a temperature suitable for use. Therefore, the operating intensity of the heating unit 68 or cooling unit installed in the supply path 64 can be suppressed.

[0103] Furthermore, in the above embodiment, a case was described in which the control unit 44 that controls each component of the processing apparatus 2 is connected to the cooling unit 62, the first temperature sensor 60, the valve 58, the heating unit 68, and the second temperature sensor 70. Then, a case was described in which the control unit 44 that controls each component of the processing apparatus 2 adjusts the output of the cooling unit 62 and the heating unit 68 and adjusts the opening degree of the valve 58. However, the processing apparatus 2 according to one aspect of the present invention is not limited thereto.

[0104] In other words, a processing apparatus 2 according to one aspect of the present invention may have a dedicated control unit as a control unit that functions solely for the purpose of controlling the cooling unit 62, the valve 58, and the heating unit 68, etc. This dedicated control unit may be connected to the cooling unit 62, the first temperature sensor 60, the valve 58, the heating unit 68, and the second temperature sensor 70. This control unit does not need to control other components of the processing apparatus 2. In other words, there are no limitations on the configuration and function of the control unit in a processing apparatus 2 according to one aspect of the present invention.

[0105] Furthermore, in a processing apparatus 2 according to one aspect of the present invention, if the temperature of the coolant measured by the first temperature sensor 60, or the temperature of the processing fluid 40 measured by the second temperature sensor 70, deviates significantly from the temperature suitable for their respective uses, a warning may be issued to the user. This is because if the temperature of the coolant, etc., deviates significantly from the predetermined temperature, and it is expected that the temperature cannot be adequately adjusted even with the use of the cooling unit 62, etc., then processing the workpiece 1 in the processing apparatus 2 will not yield the predetermined processing results.

[0106] In this case, the control unit 44 may stop the processing of the workpiece 1 by the processing device 2. Alternatively, the control unit 44 may control the alarm lamp 46 to illuminate a red lamp indicating a warning. Or, the control unit 44 may control the touch panel display 10 to display a warning screen. In this case, improper processing by the processing device 2 is prevented.

[0107] Furthermore, the structures, methods, etc., according to the above embodiments can be modified as appropriate without departing from the scope of the objectives of the present invention. [Explanation of Symbols]

[0108] 1 Workpiece 1a surface 1b back side Planned division into 3 lines 5 devices 7 Adhesive tape 9 Ring Frame 11 Frame Unit 13 Machining marks 2 Processing equipment 4 bases 6 cabinets 8 Cassette Support Stands 10 Touchscreen displays 12 Processing room 12a Upper wall 12b side wall 12c aperture 14 Holding Table 14a Top side 14b X-axis moving table 14cm Table Cover 14d Dustproof and Splashproof Cover 16 Processing Units 18 cutting blades 19 Spindle Unit 20 Housing 21a Outbound pipe 21b Return path tube 22 Blade Cover 24 Processing fluid supply nozzle 26 Processing fluid spray nozzle 28 Liquid supply channel 30 Connection part 32 Piping 34 Protective Cover 36 Processing space 36a Processing area 36b Transport area 38 Partition Member 38a aperture 40 Processing fluid 42 Drain 42a Storage section 42b Piping 44 Control Unit 46. ​​Alarm lamp 48 Spindle Temperature Control Unit 50 Circulation pathways 52 pumps 54. First heat exchanger 56 Bypass Route 58 valves 60 First temperature sensor 62 Cooling Units 64 Supply routes 66 Processing fluid supply source 68 Heating Unit 70 Second temperature sensor 72. Second heat exchanger 74 Emission Routes

Claims

1. A processing apparatus comprising a holding table for holding a workpiece, a processing unit for processing the workpiece held on the holding table, and a control unit, The processing unit comprises a spindle unit including a spindle on which a processing tool is mounted, a housing that rotatably supports the spindle, and a motor that rotates the spindle, and is connected to a spindle temperature control unit that cools the spindle unit and adjusts it to a predetermined temperature. The spindle temperature control unit is A circulation path through which the coolant introduced into and discharged from the housing of the spindle unit circulates, A pump is installed in the circulation path and circulates the coolant through the circulation path, A first heat exchanger is installed in the circulation path, The circulation path includes a first temperature sensor disposed on the upstream side of the housing for measuring the temperature of the coolant as it flows into the housing, A processing apparatus characterized in that a processing fluid supplied from a processing fluid supply source is supplied to the first heat exchanger, and in the first heat exchanger, the temperature of the cooling fluid traveling through the circulation path decreases due to the processing fluid and the temperature of the processing fluid increases due to the cooling fluid.

2. A cooling unit for cooling the coolant is provided in the circulation path. The processing apparatus according to claim 1, characterized in that the control unit adjusts the output of the cooling unit by referring to the temperature of the cooling liquid measured by the first temperature sensor.

3. The spindle temperature control unit is A bypass path is arranged in parallel with the first heat exchanger in the circulation path, The bypass path is further provided with a valve that adjusts the amount of coolant flowing through the bypass path, The processing apparatus according to claim 1, characterized in that the control unit adjusts the opening degree of the valve by referring to the temperature of the coolant measured by the first temperature sensor.

4. The spindle temperature control unit is A bypass path is arranged in parallel with the first heat exchanger in the circulation path, The bypass path is further provided with a valve that adjusts the amount of coolant flowing through the bypass path, The processing apparatus according to claim 2, characterized in that the control unit adjusts the opening degree of the valve by referring to the temperature of the coolant measured by the first temperature sensor.

5. The processing fluid is provided with a supply path that serves as the path through which it travels from the first heat exchanger. The processing apparatus according to any one of claims 1 to 4, characterized in that the processing fluid supplied from the processing fluid supply source to the first heat exchanger, and whose temperature has risen, is supplied through the supply path to the workpiece held on the holding table or to the processing tool.

6. The supply route includes, A heating unit that heats the processing liquid flowing through the supply path, The processing apparatus according to claim 5, further comprising a second temperature sensor located downstream of the heating unit for measuring the temperature of the processing fluid flowing through the supply path.

7. A second heat exchanger is installed in the supply path. The workpiece held on the holding table, or the used processing fluid supplied to the processing tool, is introduced into the second heat exchanger through the supply path. The processing apparatus according to claim 5, characterized in that the temperature of the processing fluid traveling through the supply path is increased by the used processing fluid in the second heat exchanger.

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