Resin molding apparatus and method for manufacturing resin molded products

Abstract

To provide a resin-molding device that uses a liquid resin to produce a resin molded article, while reducing the time required for producing each resin molded article, and a method for producing a resin molded article.SOLUTION: A resin-molding device comprises: a first module; a second module; a third module; and a transport mechanism. The first module supplies a release film. The second module mounts a liquid resin on the release film. The third module performs resin molding by clamping a molding die in a state where the release film having the liquid resin mounted thereon is disposed in the molding die. The second module includes a first stage and a second stage. The transport mechanism starts transporting the release film from the first module to the second stage while the liquid resin is being supplied to the release film that has been at least temporarily disposed on the first stage.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

Background Art

[0002] Japanese Unexamined Patent Application Publication No. 2022-61238 (Patent Document 1) discloses a resin encapsulation apparatus. In this resin encapsulation apparatus, resin is supplied to a film, and the film on which the resin is placed is conveyed to a mold. By using the mold in which the film on which the resin is placed is set, one surface of the work is resin-encapsulated (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Generally, the step of placing liquid resin on a release film by supplying the liquid resin to the release film requires a long time. Therefore, when resin molding is performed using liquid resin, the time required for manufacturing each resin molded product tends to be long. In Patent Document 1 described above, no means for solving such a problem is disclosed.

[0005] The present invention has been made to solve such problems, and an object thereof is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can manufacture a resin molded product using liquid resin and suppress the time required for manufacturing each resin molded product.

Means for Solving the Problems

[0007] A method for manufacturing a resin molded article according to another aspect of the present invention is a method for manufacturing a resin molded article using the resin molding apparatus described above. This method for manufacturing a resin molded article includes the steps of supplying a release film, supplying liquid resin to the release film to place liquid resin on the release film, clamping the mold with the release film on which the liquid resin is placed in the mold, and starting the transport of the release film from the first module to the second stage while liquid resin is being supplied to the release film which has been placed in the first stage at least once. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin molding apparatus that can manufacture resin molded products using liquid resin and suppress the time required to manufacture each resin molded product, as well as a method for manufacturing resin molded products. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic plan view showing a resin molding apparatus according to Embodiment 1. [Figure 2] This is a schematic partial cross-sectional view showing a part of the first transport mechanism from the side. [Figure 3]This diagram schematically shows the front view of the release film placement area. [Figure 4] This diagram schematically shows the planar surface of the release film placement area. [Figure 5] This diagram schematically shows the dispenser and the holding mechanism. [Figure 6] This diagram schematically shows a cross-section of the resin molding section before mold clamping. [Figure 7] This diagram schematically shows a cross-section of the resin molding section during mold clamping. [Figure 8A] This flowchart shows the first part of the procedure for transporting release film in a resin molding machine. [Figure 8B] This flowchart shows the latter part of the procedure for transporting release film in a resin molding apparatus. [Figure 9] This flowchart shows the procedure for supplying liquid resin to the release film in the second module. [Figure 10] This diagram illustrates the placement of a release film on a stage where one has not yet been placed. [Figure 11] This diagram illustrates how a release film on which liquid resin is placed is held in place. [Figure 12] This is a diagram to explain how to rearrange the positions of the stages. [Figure 13] This diagram schematically shows the state of each stage when liquid resin is dispensed onto a release film. [Figure 14] This diagram schematically shows a stage in a raised position, on which a release film containing liquid resin is placed. [Figure 15] This diagram illustrates how the cycle time in the manufacturing of resin molded products changes depending on the timing of the release film transport. [Figure 16] This is a schematic plan view showing a resin molding apparatus according to Embodiment 2. [Figure 17] This is a schematic partial cross-sectional view showing a part of the first transport mechanism in Embodiment 2 from the side. [Figure 18]It is a diagram schematically showing a cross section of a resin molding part before mold clamping in Embodiment 2. [Figure 19] It is a diagram schematically showing a cross section of a resin molding part during mold clamping in Embodiment 2. [Figure 20] It is a diagram schematically showing the positional relationship of each part when a release film held by one holding part is arranged on the stage of one release film arranging part. [Figure 21] It is a diagram schematically showing the positional relationship of each part when a release film held by the other holding part is arranged on the stage of the other release film arranging part. [Embodiments for Carrying Out the Invention]

[0010] Hereinafter, an embodiment according to one aspect of the present invention (hereinafter, also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their descriptions are not repeated. Also, for ease of understanding, each drawing is schematically drawn with appropriate omissions or exaggerations of the subject. Further, in the following description, two directions orthogonal to each other on the horizontal plane are defined as the front-rear direction and the left-right direction, and the vertical direction is defined as the up-down direction. Also, in this specification, the term "liquid" in the liquid resin means that it is liquid at room temperature and has fluidity.

[0011] [1. Embodiment 1] [1-1. Configuration of Resin Molding Apparatus] FIG. 1 is a plan view schematically showing a resin molding apparatus 1 according to Embodiment 1 of the present invention. The resin molding apparatus 1 is configured to perform resin sealing on a substrate on which electronic components such as semiconductor chips are mounted to manufacture a resin molded product. In the resin molding apparatus 1, the component mounting surface of the substrate on which the electronic components are mounted is resin-sealed.

[0012] Examples of substrates include semiconductor substrates such as silicon wafers, lead frames, printed circuit boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate may also be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate may or may not have wiring already installed.

[0013] As shown in Figure 1, the resin molding apparatus 1 includes a first module 10, a second module 20, a third module 30, a fourth module 40, and a control unit 70. The control unit 70 includes, for example, a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). The control unit 70 is configured to control each of the first module 10, the second module 20, the third module 30, and the fourth module 40 according to a control program.

[0014] Each of the first module 10, second module 20, third module 30, and fourth module 40 is detachable and interchangeable with the other modules. Furthermore, in the resin molding apparatus 1, each of the first module 10, second module 20, third module 30, and fourth module 40 can be increased or decreased in number.

[0015] The first module 10 includes a release film supply unit 100 and a first transport mechanism 50. The first module 10 is configured to supply the release film. The release film material is a resin material having properties such as heat resistance, release properties, flexibility, and extensibility. Examples of such materials include PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, and polyvinylidene chloride.

[0016] The release film supply unit 100 includes, for example, a roll of release film, a film mounting table, a film gripper, and a cutter (none of which are shown). The film gripper pulls out a long piece of release film from the roll of release film, and the pulled-out release film is placed on the film mounting table. The release film placed on the film mounting table is cut into a desired shape (for example, a rectangle or a circle) by the cutter, thereby preparing a release film F1 (Figure 2, etc.) to be used in resin molding. A tray cover TC1 (described later) is placed on the prepared release film F1. The release film F1 and tray cover TC1 prepared in the release film supply unit 100 are transported to the second module 20 by the first transport mechanism 50.

[0017] Figure 2 is a schematic partial cross-sectional view showing a part of the first transport mechanism 50 from the side. As shown in Figure 2, the first transport mechanism 50 includes a movable part 500, a support part 510, and a holding part 511. The movable part 500 has, for example, a column shape extending in the vertical direction. The movable part 500 is configured to move along rails laid across the first module 10, the second module 20, and the third module 30. The movable part 500 is also configured to move in the front-rear direction in the second module 20. The movement of the movable part 500 is achieved, for example, by a servo motor (not shown).

[0018] The support portion 510 has, for example, a plate shape. The support portion 510 is attached to the movable portion 500 and extends forward from the movable portion 500. The support portion 510 is configured to move, for example, in the vertical direction relative to the movable portion 500. The vertical movement of the support portion 510 is achieved, for example, by an air cylinder or servo motor (not shown).

[0019] The holding portion 511 is fixed below the front end of the support portion 510 and is configured to hold the tray cover TC1 and the release film F1 at their lower ends. The holding portion 511 mechanically holds the tray cover TC1 by a tray cover chuck (not shown). The holding portion 511 also holds the release film F1 by using a vacuum pump (not shown) to adsorb the release film F1 through the tray cover TC1 and by mechanically pressing the release film F1 from below upward with the release film chuck (not shown). For example, as the movable portion 500 moves in the front-rear direction in the second module 20, the holding portion 511 also moves in the front-rear direction. The tray cover TC1 is a frame-shaped member, and the size of the release film F1 is larger than the size of the space enclosed by the frame of the tray cover TC1. The shape of this space in plan view is, for example, rectangular.

[0020] Referring again to Figure 1, the second module 20 includes a release film placement section 200, a dispenser 250, and a holding mechanism 260. The second module 20 is configured to place liquid resin on the release film F1 by supplying liquid resin to the release film F1.

[0021] Figure 3 is a schematic diagram showing the front view of the release film placement section 200. Figure 4 is a schematic diagram showing the top view of the release film placement section 200. As shown in Figures 3 and 4, the release film placement section 200 includes a weighing device 230, replacement mechanisms 210 and 220, stages 212 and 222, plates 213 and 223, and rails 215 and 225. The weighing device 230 is configured to weigh the liquid resin placed on the release film F1.

[0022] The replacement mechanism 210 includes a movable part 214 and a support part 211. The movable part 214 is, for example, a rectangular block-shaped member in plan view. The movable part 214 is arranged on a rail 215 that extends in the front-rear direction and is movable on the rail 215. The movement of the movable part 214 is achieved, for example, by an air cylinder. The support part 211 is a plate-shaped member that extends upward from the movable part 214. The support part 211 moves together with the movable part 214 as the movable part 214 moves.

[0023] The stage 212 is a rectangular plate-shaped member in plan view. The stage 212 is attached to the support 211 and extends to the right from the support 211. The stage 212 is movable vertically relative to the support 211. The movement of the stage 212 is achieved, for example, by a servo motor. The stage 212 has a through hole H1 that penetrates vertically. The shape of the through hole H1 in plan view is, for example, rectangular. The through hole H1 is covered by a rectangular plate 213 in plan view. That is, the length of each side of the plate 213 is longer than the length of each side of the through hole H1. The release film F1 and the tray cover TC1 are placed on the plate 213. The plate 213 is simply resting on the stage 212 and is not fixed to the stage 212.

[0024] As the stage 212 moves above the weighing device 230 and then descends, the weighing device 230 passes through the through-hole H1. This causes the plate 213 to be supported by the weighing device 230 and to lift the plate 213 away from the stage 212. With the plate 213 supported by the weighing device 230, liquid resin is supplied to the release film F1 on the plate 213 by the dispenser 250. The weight of the liquid resin placed on the release film F1 is measured by the weighing device 230, and an appropriate amount of liquid resin is supplied to the release film F1.

[0025] The replacement mechanism 220 includes a movable part 224 and a support part 221. The movable part 224 is, for example, a rectangular block-shaped member in plan view. The movable part 224 is positioned on a rail 225 that extends in the front-rear direction and is movable on the rail 225. The movement of the movable part 224 is achieved, for example, by an air cylinder. The support part 221 is a plate-shaped member that extends upward from the movable part 224. The support part 221 moves together with the movable part 224 as the movable part 224 moves.

[0026] The stage 222 is a rectangular plate-shaped member in plan view. The stage 222 is attached to the support 221 and extends to the left from the support 221. The stage 222 is movable vertically relative to the support 221. The movement of the stage 222 is achieved, for example, by a servo motor. The stage 222 has a through hole H2 that penetrates vertically. The shape of the through hole H2 in plan view is, for example, rectangular. The through hole H2 is covered by a rectangular plate 223 in plan view. That is, the length of each side of the plate 223 is longer than the length of each side of the through hole H2. The release film F1 and the tray cover TC1 are placed on the plate 223. Note that the plate 223 is simply resting on the stage 222 and is not fixed to the stage 222.

[0027] As the stage 222 moves above the weighing scale 230 and then descends, the weighing scale 230 passes through the through-hole H2. This causes the plate 223 to be supported by the weighing scale 230 and to lift the plate 223 away from the stage 222. With the plate 223 supported by the weighing scale 230, the liquid resin is supplied to the release film F1 on the plate 223 by the dispenser 250. The weight of the liquid resin placed on the release film F1 is measured by the weighing scale 230, and an appropriate amount of liquid resin is supplied to the release film F1.

[0028] Thus, in the release film placement section 200, the plates (plate 213 or plate 223) placed on the measuring instrument 230 are changed by controlling the replacement mechanisms 210 and 220. This allows liquid resin to be supplied sequentially to the release film F1 placed on plate 213 and the release film F1 placed on plate 223.

[0029] Figure 5 is a schematic diagram of the dispenser 250 and the holding mechanism 260. As shown in Figure 5, the dispenser 250 includes a dispenser body 251 and a cartridge C1. The cartridge C1 stores liquid resin. The dispenser body 251 includes a plunger (not shown). The liquid resin stored in the cartridge C1 is pushed from above by the plunger, causing the liquid resin to be discharged from the nozzle N1 of the cartridge C1. In the dispenser 250, the cartridge C1 is replaceably mounted on the dispenser body 251 such that the longitudinal direction of the cartridge C1 is aligned with the vertical direction.

[0030] The holding mechanism 260 is configured to hold both a used cartridge C1 and an unused cartridge C1. In this example, the unused cartridge C1 is held in the through-hole H3. For example, a used cartridge C1 contained in the dispenser 250 is inserted into the through-hole H4 and held by the holding mechanism 260. The used cartridge C1 is then automatically removed from the dispenser body 251. Subsequently, for example, the unused cartridge C1 held in the through-hole H3 is automatically connected to the dispenser body 251. This allows for automatic replacement of the cartridge C1. According to the second module 20, since the holding mechanism 260 holds both the used cartridge C1 and the unused cartridge C1, the replacement of the cartridge C1 in the dispenser 250 can be easily performed.

[0031] Referring again to Figure 1, the fourth module 40 includes a substrate supply unit 410, a substrate storage unit 420, a substrate mounting unit 430, and a second transport mechanism 60. The substrate supply unit 410 is configured to supply substrates before resin encapsulation to the substrate mounting unit 430. The substrate storage unit 420 is configured to store resin-encapsulated substrates (resin molded products). The substrate mounting unit 430 is configured to move in the front-rear direction between a position corresponding to the substrate supply unit 410 and a position corresponding to the substrate storage unit 420. The second transport mechanism 60 is configured to move in the left-right direction and the front-rear direction in the fourth module 40 and the third module 30. For example, the second transport mechanism 60 holds a substrate before resin encapsulation placed in the substrate mounting unit 430 and transports it to the third module 30, and transports a resin-encapsulated substrate from the third module 30 to the fourth module 40.

[0032] The third module 30 includes a resin molding section 300. In the resin molding section 300, resin sealing (resin molding) of the component mounting surface of the substrate is performed by using a release film F1 on which liquid resin is placed.

[0033] Figure 6 is a schematic diagram showing a cross-section of the resin molding section 300 before mold clamping. Figure 7 is a schematic diagram showing a cross-section of the resin molding section 300 during mold clamping. As shown in Figures 6 and 7, the resin molding section 300 includes an outer frame member 301, a fixed platen 310, a movable platen 330, and a molding die 305. An example of the molding die 305 is a metal mold.

[0034] The outer frame member 301 is composed of tie bars (columns) or hold frames (plate members). When the outer frame member 301 is composed of tie bars, it is made up of four tie bars positioned at the four corners. Each of the four tie bars extends in the vertical direction. When the outer frame member 301 is made up of hold frames, it is made up of two hold frames positioned on the left and right sides. The wide surface of one of the two hold frames faces the wide surface of the other of the two hold frames in the left-right direction.

[0035] The fixed platen 310 is a rectangular plate-shaped member in plan view. The fixed platen 310 is fixed to the upper part of the outer frame member 301. The movable platen 330 is located inside the outer frame member 301 and below the fixed platen 310. The movable platen 330 is configured to move in the vertical direction. The movement of the movable platen 330 is achieved, for example, by a clamping mechanism (not shown). The clamping mechanism is achieved, for example, by a combination of a servo motor and a ball screw, or a combination of a hydraulic cylinder and a linkage mechanism.

[0036] The molding die 305 includes an upper die 320 and a lower die 340. The molding die 305 is positioned inside the outer frame member 301, between a fixed platen 310 and a movable platen 330. More specifically, the upper die 320 is fixed to the lower surface of the fixed platen 310, and the lower die 340 is fixed to the upper surface of the movable platen 330. As the movable platen 330 moves vertically, the lower die 340 also moves vertically along with the movable platen 330. The molding die 305 is clamped when the movable platen 330 rises.

[0037] The lower mold 340 includes a base plate 344, a bottom member 341, a spring 343, and a side member 342. The base plate 344 is a rectangular plate-shaped member in plan view. The base plate 344 is fixed to the upper surface of the movable platen 330. The bottom member 341 is a rectangular block-shaped member in plan view. The bottom member 341 is fixed to the upper surface of the base plate 344 and is located approximately in the center of the base plate 344. The side member 342 is a frame-shaped member that surrounds the bottom member 341. The side member 342 is fixed to the bottom member 341 via a plurality of springs 343.

[0038] The upper surface of the side member 342 is located above the upper surface of the bottom member 341, and a recess (cavity) is formed on the upper surface of the lower mold 340. A release film F1 on which liquid resin R1 is placed is positioned in this recess. A substrate P1 is positioned on the lower surface of the upper mold 320. With the release film F1 on which liquid resin R1 is placed in the recess of the lower mold 340 and the substrate P1 positioned on the lower surface of the upper mold 320, the mold clamping of the molding die 305 is performed, thereby resin-sealing the component mounting surface of the substrate.

[0039] <1-2. Transport operation of release film and supply operation of liquid resin> Figure 8A is a flowchart showing the first half of the procedure for transporting the release film F1 in the resin molding apparatus 1. Figure 8B is a flowchart showing the second half of the procedure for transporting the release film F1 in the resin molding apparatus 1. The processes shown in the flowcharts of Figures 8A and 8B are repeatedly executed by the control unit 70 while the resin molding apparatus 1 is operating. One cycle of the processes shown in these flowcharts corresponds to the molding cycle of the resin molded product. In both Figures 8A and 8B, "MD" stands for module.

[0040] Referring to Figure 8A, the control unit 70 determines whether the release film F1 has been prepared in the first module 10 (step S100). That is, the control unit 70 determines whether the release film F1 has been prepared by cutting a portion of the roll of release film and whether the tray cover TC1 has been placed on the release film F1. If it is determined that the release film F1 has not been prepared (NO in step S100), the control unit 70 waits until the release film F1 is prepared.

[0041] On the other hand, when it is determined that the release film F1 is ready (YES in step S100), the control unit 70 controls the first transport mechanism 50 to hold the release film F1 and tray cover TC1 prepared in the first module 10 (step S110). The control unit 70 controls the first transport mechanism 50 to start transporting the release film F1 and tray cover TC1 from the first module 10 to the second module 20 (step S120). That is, the movement of the holding part 511 included in the first transport mechanism 50 begins.

[0042] As will be described in detail later, in this embodiment 1, for example, the transport of the release film F1 from the first module 10 to the second module 20 in the molding cycle of the second and subsequent resin molded products is started while the liquid resin R1 is being supplied to the release film F1 in the molding cycle of the previous resin molded product. This makes it possible to shorten the time required to manufacture one resin molded product compared to the case in which the transport of a new release film F1 from the first module 10 to the second module 20 is started after the supply of liquid resin R1 to the release film in the molding cycle of the previous resin molded product is completed.

[0043] Subsequently, the control unit 70 determines whether the movement of the holding unit 511 to the stage 212, 222 on which the release film F1 is not placed has been completed, and if the release film F1 is placed on the other stage, whether the supply of liquid resin R1 to the release film F1 has been completed (step S130). If it is determined that the conditions in step S130 are not met, the control unit 70 waits until the conditions in step S130 are met.

[0044] On the other hand, if it is determined that the conditions in step S130 are met, the control unit 70 places the release film F1 on the stage (stage 212 or stage 222) located below the first transport mechanism 50 (holding unit 511) (step S140). More specifically, the holding unit 511 of the first transport mechanism 50 descends, and with the release film F1 in contact with the plate on the stage (stage 212 or plate 213), the suction and mechanical holding of the release film F1 are released, thereby placing the release film F1 on the plate. The tray cover TC1 is also placed on the release film F1.

[0045] Referring to Figure 8B, when the release film F1 is placed on the stage, the control unit 70 determines whether the current molding cycle is for the second or subsequent resin molded product (step S150). If it is determined to be the molding cycle for the first resin molded product (NO in step S150), the process in step S100 is executed again.

[0046] On the other hand, if it is determined that it is the second or subsequent molding cycle for a resin molded product (YES in step S150), the control unit 70 controls the first transport mechanism 50 to start moving upward to a stage among the stages 212 and 222 that is different from the stage on which the release film F1 was placed in step S140 (step S155). In other words, the movement of the holding unit 511 included in the first transport mechanism 50 begins.

[0047] The control unit 70 determines whether the movement of the holding unit 511 to a stage other than the stage on which the release film F1 was placed in step S140 has been completed among the stages 212 and 222 (step S160). If it is determined that the movement of the holding unit 511 has not been completed (NO in step S160), the control unit 70 waits until the movement of the holding unit 511 is completed.

[0048] On the other hand, when it is determined that the movement of the holding part 511 is complete (YES in step S160), the control unit 70 determines whether or not the resin molding part 300 of the third module 30 is in the process of resin molding (step S170). If it is determined that the resin molding part 300 is in the process of resin molding (YES in step S170), the control unit 70 waits until the resin molding in the resin molding part 300 is completed.

[0049] On the other hand, if it is determined that resin molding is not being performed in the resin molding section 300 (NO in step S170), the control unit 70 controls the first transport mechanism 50 to hold the release film F1 which is located on a different stage from the stage on which the release film F1 was placed in step S140 among the stages 212 and 222 (step S180). In step S180, the release film F1 held by the first transport mechanism 50 has liquid resin R1 on it.

[0050] The control unit 70 controls the first transport mechanism 50 to transport the release film F1 from the second module 20 to the third module 30 (step S190). The release film F1 transported from the second module 20 to the third module 30 is placed in the lower mold 340 of the resin molding section 300.

[0051] Figure 9 is a flowchart showing the procedure for supplying liquid resin R1 to the release film F1 in the second module 20. The process shown in this flowchart is repeatedly executed by the control unit 70 during the operation of the resin molding apparatus 1.

[0052] Referring to Figure 9, the control unit 70 determines whether the release film F1 has been placed on one of the stages 212, 222 that does not currently have a release film F1, and whether the release film F1 has been held by the first transport mechanism 50 on the other stage if it is already placed on that stage (step S200). If it is determined that the conditions in step S200 are not met, the control unit 70 waits until the conditions in step S200 are met.

[0053] Figure 10 illustrates the placement of the release film F1 on a stage where the release film F1 is not already placed. In this example, the release film F1 is not placed on stage 222, but it is placed on stage 212. The length of the support portion 510 in the front-rear direction is longer than the length from the rear end of stage 222 to the front end of stage 212. As the moving portion 500 (Figure 2) moves in the front-rear direction, the holding portion 511 moves between above stage 222 and above stage 212.

[0054] Referring to Figure 10, the holding portion 511 of the first transport mechanism 50, which holds the release film F1 without the liquid resin R1 on it, moves above the stage 222. In this state, the holding portion 511 descends, and the release film F1 and tray cover TC1 are placed on the stage 222 via the plate 223. As a result, it is determined that in step S200 of Figure 9, the placement of the release film F1 to the stage where it was not placed has been completed.

[0055] Figure 11 is a diagram illustrating the holding of the release film F1 on which the liquid resin R1 is placed. Referring to Figure 11, after the release film F1 and tray cover TC1 are placed on the stage 222, the holding unit 511 of the first transport mechanism 50 moves above the stage 212. In this state, the holding unit 511 descends and holds the release film F1 and tray cover TC1 placed on the stage 212. After that, the holding unit 511 rises. As a result, it is determined that the holding of the release film F1 by the first transport mechanism 50 is completed in step S200 of Figure 9. The release film F1 held by the holding unit 511 is then transported from the second module 20 to the third module 30.

[0056] In the second module 20, the placement of a release film F1 without liquid resin R1 on one stage and the transfer of a release film F1 with liquid resin R1 on the other stage to the third module 30 are performed in a series of operations. This makes it possible to shorten the time required to manufacture one resin molded product.

[0057] Referring again to Figure 9, when it is determined that the conditions in step S200 are met, the control unit 70 controls the swapping mechanisms 210 and 220 respectively to swap the positions of stage 222 and stage 212 (step S210).

[0058] Figure 12 is a diagram illustrating the swapping of stage positions. Referring to Figure 12, in this example, the release film F1 that was placed on stage 212 has already been transported to the third module 30. Immediately after transport, stage 212 is located above the weighing scale 230. When the stage positions are swapped by the swapping mechanisms 210 and 220, stage 222 is located above the weighing scale 230. That is, stage 222, on which the release film F1 without the liquid resin R1 is placed, is located above the weighing scale 230. In the second module 20, since the positions of each stage are swapped by the swapping mechanisms, the liquid resin R1 can be supplied to the release film F1 even if the movable range of the dispenser 250 is not large.

[0059] Referring again to Figure 9, the control unit 70 controls the replacement mechanism 210 or replacement mechanism 220 so that the stage located above the weighing device 230, on which the release film F1 without the liquid resin R1 is placed, is lowered (step S220). As a result, the plate (plate 223 or plate 213) placed on the lowered stage is supported by the weighing device 230. With the plate supported by the weighing device 230, the control unit 70 controls the dispenser 250 so that it moves above the release film F1 placed on the plate supported by the weighing device 230, and also controls the dispenser 250 to dispense the liquid resin R1 onto the release film F1 (step S230).

[0060] Figure 13 schematically shows the state of each stage when liquid resin R1 is dispensed onto the release film F1. As shown in Figure 13, when liquid resin R1 is dispensed onto the release film F1 placed on the stage 212, the stage 212 descends, the weighing device 230 passes through the through-hole H1 of the stage 212, and the plate 213 that was placed on the stage 212 is supported by the weighing device 230. In this state, the liquid resin R1 is supplied to the release film F1 by the dispenser 250. Since the liquid resin R1 is supplied to the release film F1 placed on the plate supported by the weighing device 230, and the weight measured by the weighing device 230 is not affected by the operation of the stage 212, the weight of the liquid resin R1 supplied to the release film F1 can be measured relatively accurately.

[0061] Referring again to Figure 9, once the supply of liquid resin R1 to the release film F1 is complete, the control unit 70 controls the replacement mechanism 210 or replacement mechanism 220 so that the stage on which the release film F1 with the liquid resin R1 is placed is raised (step S240).

[0062] Figure 14 schematically shows the state in which the stage on which the release film F1 containing the liquid resin R1 is placed has been raised. As shown in Figure 14, the stage 212 on which the release film F1 containing the liquid resin R1 is placed has been raised, and the plate 213 has been placed back on the stage 212.

[0063] Thus, in the resin molding apparatus 1 according to this embodiment 1, the second module 20 includes stages 212 and 222. If the second module 20 had only one stage, it would be impossible to start transporting a new release film F1 from the first module 10 to the second module 20 while liquid resin R1 is being supplied to the release film F1 placed on the stage. This is because the first transport mechanism 50, which holds the new release film F1, would not be able to hold the release film F1 placed on the stage, nor would it be able to place the new release film F1 on the stage.

[0064] In the resin molding apparatus 1 according to this embodiment 1, since the second module 20 includes stages 212 and 222, for example, it is possible to start transporting a new release film F1 from the first module 10 to the second module 20 while liquid resin R1 is being supplied to a release film F1 placed on one of the stages 212 and 222. As a result, the resin molding apparatus 1 can shorten the time required to manufacture one resin molded product compared to the case where the transport of the release film F1 from the first module 10 to the second module 20 is started after the supply of liquid resin to the release film placed on the stage is completed.

[0065] <1-3. Cycle time in the manufacturing of resin molded products> Figure 15 illustrates how the cycle time of resin molded product manufacturing changes depending on the timing of the release film F1 transport. Cycle time refers to the approximate time required to manufacture one product. Referring to Figure 15, the horizontal axis represents time. Each of (1)-(7) in the figure represents the time required for the following process. (1) Preparation of release film F1 by cutting the roll of release film (2) Placement of tray cover TC1 on release film F1 (3) Conveying of the release film F1 from the first module 10 to the second module 20 (4) Discharge of liquid resin R1 onto release film F1 in the second module 20 (5) Setting the release film F1 on which the liquid resin R1 is placed onto the lower mold 340. (6) Resin molding (mold) (7) Removal of the resin-molded substrate from the mold 305 and setting of the substrate before resin molding onto the upper mold 320

[0066] In this example, the time required for (4) is longer than the time required for (6). Also, the sum of the time required for each of (5), (6), and (7) is longer than the time required for (4). Furthermore, the sum of the time required for each of (5), (6), and (7) is shorter than the sum of the time required for each of (3), (4), and (5).

[0067] In Figure 15, the first row shows the molding cycle of the first resin molded product. The first row is common to both the provisional form (described later) and this embodiment 1.

[0068] The second line shows the second molding cycle of the resin molded product in the provisional configuration. In the provisional configuration, the transport of a new release film F1 from the first module 10 to the second module 20 does not start while the liquid resin R1 is being supplied to the release film F1 located on one of the stages. In the provisional configuration, the transport of a new release film F1 from the first module 10 to the second module 20 starts after the supply of liquid resin R1 to the release film F1 located on one of the stages is completed. Therefore, in the provisional configuration, at time t3, (5) in the first molding cycle is completed, and then (3) in the second molding cycle is performed. In this case, the cycle time for manufacturing the resin molded product is the sum of the time required for each of (3), (4), and (5).

[0069] The third line shows the second molding cycle of the resin molded product in this embodiment 1. As described above, in this embodiment 1, the transport of a new release film F1 from the first module 10 to the second module 20 begins while the liquid resin R1 is being supplied to the release film F1 placed on one of the stages. Therefore, at time t2, (3) of the second molding cycle is performed before (4) of the first molding cycle is completed. Then, at time t2, as (4) of the first molding cycle is completed, (4) of the second molding cycle begins. In this case, the cycle time for manufacturing the resin molded product is the sum of the time required for each of (5), (6), and (7). In this example, the cycle time is the period from the start of (6) (for example, time t3) to the start of (6) of the next cycle (for example, time t5).

[0070] Thus, in the resin molding apparatus 1 according to this embodiment 1, the time required for (4) is longer than the time required for (6), but the supply of liquid resin R1 to the release film F1 in the second module 20 does not become a time bottleneck. Therefore, with the resin molding apparatus 1, even if it takes some time to supply liquid resin R1 to the release film F1, the impact on the time required to manufacture one resin molded product can be suppressed.

[0071] Furthermore, in the resin molding apparatus 1 according to this embodiment 1, since the cycle time for manufacturing the resin molded product depends on the time required for (6), even if it takes some time to supply the liquid resin R1 to the release film F1, the impact on the time required to manufacture one resin molded product can be suppressed.

[0072] <1-4. Features> As described above, in the resin molding apparatus 1 according to this embodiment 1, the transport of the release film F1 from the first module 10 to the other stage is started while the liquid resin R1 is being supplied to the release film F1 which has been placed on at least one stage. Therefore, the resin molding apparatus 1 can shorten the time required to manufacture one resin molded product compared to the case in which the transport of the release film F1 from the first module 10 to the other stage is started after the supply of liquid resin R1 to the release film F1 which has been placed on at least one stage has been completed.

[0073] The release film F1 is an example of a "release film" in the present invention. The first module 10 is an example of a "first module" in the present invention. The liquid resin R1 is an example of a "liquid resin" in the present invention. The second module 20 is an example of a "second module" in the present invention. The mold 305 is an example of a "mold" in the present invention. The third module 30 is an example of a "third module" in the present invention. The stages 212 and 222 are examples of a "first stage" and a "second stage" in the present invention, respectively. The first transport mechanism 50 is an example of a "transport mechanism" in the present invention.

[0074] The configuration realized by the replacement mechanisms 210 and 220 is an example of a "replacement mechanism" in the present invention. Dispenser 250 is an example of a "dispenser" in the present invention. Cartridge C1 is an example of a "cartridge" in the present invention. Holding mechanism 260 is an example of a "holding mechanism" in the present invention. Measuring device 230 is an example of a "measuring device" in the present invention. Through holes H1 and H2 are examples of "through holes" in the present invention. Plates 213 and 223 are examples of "plates" in the present invention.

[0075] [2. Embodiment 2] In the above embodiment 1, in one molding cycle, one release film F1 was supplied to the first module 10, liquid resin R1 was supplied to one release film F1 in the second module 20, and resin molding using one release film F1 was performed in the third module 30. However, the number of release films F1 processed simultaneously in each module in one molding cycle is not limited to this. For example, two or more release films F1 may be processed simultaneously in each module in one molding cycle.

[0076] In the resin molding apparatus 1A according to this second embodiment, two release films F1 are processed simultaneously in each module. Due to this feature, the resin molding apparatus 1 according to the first embodiment and the resin molding apparatus 1A according to this second embodiment have different configurations. However, in parts unrelated to this feature, the resin molding apparatus 1 according to the first embodiment and the resin molding apparatus 1A according to this second embodiment have substantially the same configuration. In the following, we will focus on the parts that differ from the first embodiment, and will not repeat the explanation of parts that are substantially the same as the first embodiment.

[0077] <2-1. Configuration of the resin molding apparatus> Figure 16 is a schematic plan view showing a resin molding apparatus 1A according to this second embodiment. The resin molding apparatus 1A is configured to manufacture a resin molded product by applying resin encapsulation to a substrate on which electronic components such as semiconductor chips are mounted. In the resin molding apparatus 1A, the component mounting surface of the substrate on which the electronic components are mounted is resin-encapsulated.

[0078] As shown in Figure 16, the resin molding apparatus 1A includes a first module 10A, a second module 20A, a third module 30A, a fourth module 40A, and a control unit 70A. The control unit 70A includes, for example, a CPU, RAM, and ROM. The control unit 70A is configured to control each of the first module 10A, the second module 20A, the third module 30A, and the fourth module 40A according to a control program, for example.

[0079] Each of the first module 10A, the second module 20A, the third module 30A, and the fourth module 40A is detachable and interchangeable with the other modules. Furthermore, in the resin molding apparatus 1A, each of the first module 10A, the second module 20A, the third module 30A, and the fourth module 40A can be increased or decreased.

[0080] The first module 10A includes two release film supply units 100A and a first transport mechanism 50A. Each of the two release film supply units 100A has substantially the same configuration as the release film supply unit 100 in the first embodiment described above. The two release film supply units 100A are arranged, for example, side by side in the vertical direction. Two release films F1 are supplied simultaneously by the two release film supply units 100A.

[0081] Figure 17 is a schematic partial cross-sectional view showing a part of the first conveying mechanism 50A from the side. As shown in Figure 17, the first conveying mechanism 50A includes a movable part 500A, support parts 510A and 520A, and holding parts 511A and 521A. The movable part 500A, support part 510A, and holding part 511A have substantially the same configuration as the movable part 500, support part 510, and holding part 511 in the first embodiment described above. The first conveying mechanism 50A differs from the first conveying mechanism 50 in the first embodiment described above in that it includes a support part 520A and a holding part 521A.

[0082] The support portion 520A and the holding portion 521A have substantially the same configuration as the support portion 510 and the holding portion 511 in the first embodiment described above. The support portion 520A is attached to the moving portion 500A and is located below the support portion 510A. Each of the holding portions 511A and 521A holds the release film F1, so that two release films F1 are conveyed simultaneously.

[0083] Referring again to Figure 16, the second module 20 includes release film placement sections 200X, 200Y, two dispensers 250, and two holding mechanisms 260. Each of the release film placement sections 200X, 200Y has substantially the same configuration as the release film placement section 200 in the first embodiment described above. Each of the release film placement sections 200X, 200Y is configured to place liquid resin on the release film F1 by supplying liquid resin to the release film F1.

[0084] The fourth module 40A includes a substrate supply unit 410A, a substrate storage unit 420A, two substrate mounting units 430A, and a second transport mechanism 60A. The substrate supply unit 410A is configured to supply two un-resin-sealed substrates to the substrate mounting unit 430A at one time. The substrate storage unit 420A is configured to store two resin-sealed substrates (resin molded products) at one time. Each substrate mounting unit 430A is configured to move in the front-rear direction between a position corresponding to the substrate supply unit 410A and a position corresponding to the substrate storage unit 420A. The second transport mechanism 60A is configured to move in the left-right and front-rear directions in the fourth module 40A and the third module 30A. For example, the second transport mechanism 60A holds two un-resin-sealed substrates placed in the two substrate mounting units 430A and transports them to the third module 30A, and transports two resin-sealed substrates from the third module 30A to the fourth module 40A.

[0085] The third module 30A includes a resin molding section 300A. In the resin molding section 300A, resin sealing (resin molding) of the component mounting surfaces of the two substrates is performed by using two release films F1 on which liquid resin is placed.

[0086] Figure 18 is a schematic diagram showing a cross-section of the resin molding section 300A before mold clamping. Figure 19 is a schematic diagram showing a cross-section of the resin molding section 300A during mold clamping. As shown in Figures 18 and 19, the resin molding section 300A includes an outer frame member 301A, a fixed platen 310A, a movable platen 330A, and molding dies 305A and 355A. The outer frame member 301A, the fixed platen 310A, and the movable platen 330A have substantially the same configuration as the outer frame member 301, the fixed platen 310, and the movable platen 330 in the above embodiment 1.

[0087] The resin molding section 300A in this second embodiment differs from the resin molding section 300 in the first embodiment in that it includes two molds. The molds 305A and 355A are positioned inside the outer frame member 301A between the fixed platen 310A and the movable platen 330A. Each of the molds 305A and 355A has substantially the same configuration as the mold 305 in the first embodiment.

[0088] More specifically, the molding die 305A includes an upper die 320A and a lower die 340A, and the lower die 340A includes a bottom member 341A, a side member 342A, a spring 343A, and a base plate 344A. The upper die 320A and the lower die 340A have substantially the same configuration as the upper die 320 and lower die 340 in Embodiment 1, respectively. Furthermore, the bottom member 341A, side member 342A, spring 343A, and base plate 344A have substantially the same configuration as the bottom member 341, side member 342, spring 343, and base plate 344 in Embodiment 1, respectively.

[0089] Furthermore, the molding die 355A includes an upper die 360A and a lower die 370A, and the lower die 370A includes a bottom member 371A, a side member 372A, a spring 373A, and a base plate 374A. The upper die 360A and the lower die 370A have substantially the same configuration as the upper die 320 and lower die 340 in Embodiment 1, respectively. Also, the bottom member 371A, side member 372A, spring 373A, and base plate 374A have substantially the same configuration as the bottom member 341, side member 342, spring 343, and base plate 344 in Embodiment 1, respectively.

[0090] An intermediate plate 350A is positioned between mold 305A and mold 355A. The intermediate plate 350A is configured to move vertically. The movement of the intermediate plate 350A is, for example, linked to the movement of the movable platen 330A. The intermediate plate 350A rises in conjunction with the rise of the movable platen 330A. The upward speed of the intermediate plate 350A is, for example, half the upward speed of the movable platen 330A. As the movable platen 330A rises, the intermediate plate 350A also rises, and mold clamping is performed in molds 305A and 355A, respectively.

[0091] <2-2. Operation of placing the release film on the stage> The two release films F1 held by the first transport mechanism 50A are sequentially placed, for example, one on a stage in the release film placement section 200X where no release films F1 are placed, and one on a stage in the release film placement section 200Y where no release films F1 are placed.

[0092] Figure 20 schematically shows the positional relationship of each part when the release film F1 held by the holding part 511A is placed on the stage 222X of one of the release film placement parts 200X. As shown in Figure 20, in this example, the stage 222X is located below the holding part 511A, and the position of the stage 222X corresponds to the position of the holding part 511A.

[0093] Figure 21 schematically shows the positional relationship of each part when the release film F1 held by the holding part 521A is placed on the stage 222Y of the other release film placement part 200Y. As shown in Figure 21, in this example, the stage 222Y is located below the holding part 521A, and the position of the stage 222Y corresponds to the position of the holding part 521A.

[0094] Thus, since the position of the stage in one release film placement section corresponds to the holding section 511A, and the position of the stage in the other release film placement section corresponds to the holding section 521A, the release film F1 can be transferred between each stage and each holding section relatively easily.

[0095] Furthermore, the first transport mechanism 50A sequentially holds the release film F1 from which the liquid resin R1 has been supplied in the release film placement section 200X and the release film F1 from which the liquid resin R1 has been supplied in the release film placement section 200Y, and transports them to the third module 30A. The release film F1 held by the holding section 511A is placed in the lower mold 340A, and the release film F1 held by the holding section 521A is placed in the lower mold 370A.

[0096] <2-3. Features> As described above, with the resin molding apparatus 1A according to this embodiment 2, since two release films F1 are processed in parallel in each module, the manufacturing efficiency of resin molded products can be improved.

[0097] Note that the first module 10A is an example of the "first module" in the present invention. The release film supply unit 100A is an example of the "first unit" in the present invention. The second module 20A is an example of the "second module" in the present invention. Each of the release film placement units 200X and 200Y is an example of the "second unit" in the present invention. The third module 30A is an example of the "third module" in the present invention. The configuration including the mold 305A and the intermediate plate 350A, and the configuration including the mold 355A and the movable platen 330A, are each examples of the "third unit" in the present invention. The first transport mechanism 50A is an example of the "transport mechanism" in the present invention.

[0098] The holding part 511 is an example of the "first holding part" in the present invention. The holding part 521 is an example of the "second holding part" in the present invention. Each of the stages 222X and 222Y is an example of the "first stage" in the present invention.

[0099] [3. Other Embodiments] The concept of the above embodiments is not limited to those described above. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. Below, an example of another embodiment to which the concept of the above embodiments can be applied will be described.

[0100] <3-1> In the above embodiments 1 and 2, the positions of each stage included in the release film placement sections 200, 200X, and 200Y were configured to be interchangeable by a replacement mechanism. However, the positions of each stage do not necessarily need to be interchangeable. For example, the positions of each stage may be fixed. In this case, the dispenser 250 may be configured to move above each stage. In this case, the support sections 510, 510A, and 520A of the first transport mechanisms 50 and 50A may be provided with two holding sections 511, 511A, and 521A, respectively, arranged in the front-to-back direction. This makes it possible, for example, to simultaneously place the release film F1 without the liquid resin R1 on it and hold the release film F1 with the liquid resin R1 on it.

[0101] <3-2> In embodiments 1 and 2 described above, the liquid resin R1 was supplied to the release film F1 while the release film F1 was supported by the measuring device 230. However, the supply of liquid resin R1 to the release film F1 does not necessarily have to be performed while the release film F1 is supported by the measuring device 230. For example, the liquid resin R1 may be supplied to each release film F1 while the release films F1 are placed on each stage. In this case, for example, through holes may not be formed in each stage, and plates may not be placed on each stage.

[0102] <3-3> In the above embodiments 1 and 2, the two stages included in each of the release film placement sections 200, 200X, and 200Y were arranged so as to be aligned in the front-to-back direction. However, the two stages do not necessarily have to be aligned in the front-to-back direction. For example, the two stages may be aligned in the left-to-right direction.

[0103] <3-4> In the above embodiment 2, the two release film supply units 100A, the holding units 511A and 521A in the first transport mechanism 50A, and the molds 305A and 355A in the resin molding unit 300A were arranged to be aligned vertically. However, they do not necessarily have to be aligned vertically; for example, they may be arranged to be aligned horizontally.

[0104] <3-5> In the above embodiments 1 and 2, each module included in the resin molding apparatus 1 and 1A was controlled by the control units 70 and 70A. The control units 70 and 70A may be implemented by multiple computers, and each module may be controlled by a separate computer.

[0105] <3-6> In the flowchart shown in Figure 8B, the execution order of the process in step S170 and the process in step S180 may be reversed. That is, regardless of whether resin molding is in progress in the resin molding section 300, the release film F1 on which the liquid resin R1 is placed may be held first by the first transport mechanism 50.

[0106] <3-7> With respect to step S130 of the flowchart shown in Figure 8A, if a release film F1 is placed on the other stage, the release film F1 held by the first transport mechanism 50 may be placed on a stage where no release film F1 is placed before the supply of liquid resin R1 to the release film F1 is completed.

[0107] <3-8> In the above embodiment 2, two release films F1 were processed simultaneously in one molding cycle. However, the number of release films F1 processed in one molding cycle may be three or more. In this case, for example, the first module 10A may include three or more release film supply units 100A, and the first transport mechanism 50A may include three or more holding units for holding the release films F1. Also, the second module 20A may include three or more release film placement units 200, and the resin molding unit 300 may include three or more molds. Furthermore, the substrate mounting unit 430A may be configured to hold three or more substrates, and the second transport mechanism 60A may be configured to hold three or more substrates.

[0108] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0109] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. That is, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0110] [4. Addendum] This specification discloses a variety of technical ideas, including at least the following technologies:

[0111] <Technology 1> (composition) A first module that supplies release film, A second module that places the liquid resin onto the release film by supplying the liquid resin to the release film, The system includes a third module which includes a mold and performs resin molding by clamping the mold with the release film on which the liquid resin is placed positioned in the mold, The second module includes the first and second stages, The release film can be placed in each of the first and second stages. A resin molding apparatus further comprising a transport mechanism that initiates the transport of the release film from the first module to the second stage while the liquid resin is being supplied to the release film, which has at least been placed on the first stage. (Effects, etc.) In this resin molding apparatus, the transport of the release film from the first module to the second stage begins while liquid resin is being supplied to the release film, which has at least been placed in the first stage. Therefore, this resin molding apparatus can shorten the time required to manufacture one resin molded product compared to a case where the transport of the release film from the first module to the second stage begins only after the supply of liquid resin to the release film, which has at least been placed in the first stage, has been completed.

[0112] <Technology 2> (composition) The resin molding apparatus according to Technology 1, wherein the transport mechanism places the release film without the liquid resin on it on the second stage, and then transports the release film with the liquid resin on it from the first stage to the third module. (Effects, etc.) With this resin molding apparatus, the placement of the release film without liquid resin onto the second stage and the transport of the release film with liquid resin onto the first stage to the third module are performed in a single operation, thus further reducing the time required to manufacture each resin molded product.

[0113] <Technology 3> (composition) The supply time required for supplying the liquid resin to the release film in the second module is longer than the molding time required for resin molding in the third module. A resin molding apparatus according to Technology 1 or Technology 2, wherein, in the manufacturing of a resin molded product through processes in each of the first module, the second module, and the third module, the supply of the liquid resin to the release film in the second module does not become a time bottleneck. (Effects, etc.) In this resin molding apparatus, although the supply time is longer than the molding time, the supply of liquid resin to the release film in the second module does not become a time bottleneck. Therefore, with this resin molding apparatus, even if it takes some time to supply liquid resin to the release film, the impact on the time required to manufacture one resin molded product can be suppressed.

[0114] <Technology 4> (composition) A resin molding apparatus according to any one of the technologies 1 to 3, wherein the cycle time for manufacturing the resin molded product through the processes in each of the first module, the second module, and the third module depends on the molding time required for resin molding in the third module. (Effects, etc.) With this resin molding apparatus, since the cycle time for manufacturing resin molded products depends on the molding time, even if it takes some time to supply liquid resin to the release film, the impact on the time required to manufacture each resin molded product can be minimized.

[0115] <Technology 5> (composition) The second module further includes a replacement mechanism and a dispenser, The replacement mechanism swaps the positions of the first stage and the second stage after the release film without the liquid resin is placed on the second stage and the transport of the release film with the liquid resin on it from the first stage to the third module has begun. The resin molding apparatus according to any one of the technologies 1 to 4, wherein the dispenser, after replacement by the replacement mechanism, discharges the liquid resin toward the release film which does not have the liquid resin on it. (Effects, etc.) With this resin molding apparatus, the positions of the first stage and the second stage are swapped by a swapping mechanism, so liquid resin can be supplied to the release film even if the range of motion of the dispenser is not large.

[0116] <Technology 6> (composition) The dispenser includes a cartridge for storing the liquid resin, In the dispenser, the cartridge is installed in a replaceable manner such that its longitudinal direction is aligned with the vertical direction. The resin molding apparatus according to Art 5, further comprising a second module, a holding mechanism for holding a used cartridge and an unused cartridge, respectively. (Effects, etc.) With this resin molding apparatus, used and unused cartridges are held together by a retention mechanism, making it easy to replace cartridges in the dispenser.

[0117] <Technology 7> (composition) The second module further includes a measuring instrument, Each of the first and second stages has a through hole formed therein. Each of the first and second stages is covered by a plate. The release film is placed on the plate, With the measuring instrument passing through the through-hole, the measuring instrument supports a plate positioned on the stage of the first and second stages that corresponds to the through-hole through which the measuring instrument passes. A resin molding apparatus according to any one of the technologies 1 to 6, wherein the liquid resin is supplied to the release film placed on a plate supported by the aforementioned measuring instrument. (Effects, etc.) In this resin molding apparatus, a plate placed in the stage corresponding to the through-hole through which the weighing device passes is supported by the weighing device, and liquid resin is supplied to a release film placed on the plate supported by the weighing device. Therefore, with this resin molding apparatus, since liquid resin is supplied to a release film placed on a plate supported by the weighing device, the weight of the liquid resin supplied to the release film can be measured relatively accurately.

[0118] <Technology 8> (composition) The first module includes two first units, each of which supplies the release film. The second module includes two second units, each of which supplies the liquid resin onto the release film, thereby placing the liquid resin onto the release film. Each of the two second units includes the first and second stages, The aforementioned third module includes two third units, Each of the two third units includes the mold, and resin molding is performed by clamping the mold with the release film on which the liquid resin is placed positioned in the mold. The transport mechanism holds two release films, The aforementioned transport mechanism is One of the two release films obtained from the two first units, which does not have the liquid resin on it, is placed on the first stage of one of the two second units, and the other of the two release films obtained from the two first units, which does not have the liquid resin on it, is placed on the first stage of the other of the two second units. A resin molding apparatus according to any one of the technologies 1 to 7, wherein one of the two release films on which the liquid resin obtained from the first stage of the two second units is placed in the mold of one of the two third units, and the other of the two release films on which the liquid resin obtained from the first stage of the two second units is placed in the mold of the other of the two third units. (Effects, etc.) This resin molding apparatus allows the two units contained in each module to process materials in parallel, thereby improving the manufacturing efficiency of resin molded products.

[0119] <Technology 9> (composition) The transport mechanism includes first and second holding parts, each holding the release film, When the release film, which does not have the liquid resin held by the first holding portion on it, is placed on the first stage of one of the two second units, the position of the first stage of one of the two second units corresponds to the position of the first holding portion. The resin molding apparatus according to Technical Reference 8, wherein when the release film, which does not have the liquid resin held by the second holding portion on it, is placed on the first stage of the other of the two second units, the position of the first stage of the other of the two second units corresponds to the position of the second holding portion. (Effects, etc.) In this resin molding apparatus, the position of the stage of one of the two second units corresponds to the position of the first holding unit, and the position of the stage of the other of the two second units corresponds to the position of the second holding unit, making it relatively easy to transfer the release film between each stage and the holding unit.

[0120] <Technology 10> (composition) A method for manufacturing a resin molded product using a resin molding apparatus described in any one of Technology 1 to Technology 9, The step of supplying the release film, The steps include supplying the liquid resin to the release film to place the liquid resin on the release film, The steps include: clamping the mold with the release film on which the liquid resin is placed in the mold; A method for manufacturing a resin molded product, comprising the step of starting the transport of the release film from the first module to the second stage while the liquid resin is being supplied to the release film, which has at least been placed on the first stage. (Effects, etc.) In this method for manufacturing resin molded products, the transport of the release film from the first module to the second stage begins while liquid resin is being supplied to the release film, which has at least been placed in the first stage. Therefore, this method for manufacturing resin molded products can shorten the time required to manufacture one resin molded product compared to a case where the transport of the release film from the first module to the second stage begins only after the supply of liquid resin to the release film, which has at least been placed in the first stage, has been completed. [Explanation of Symbols]

[0121] 1 Resin molding apparatus, 10 First module, 20 Second module, 30 Third module, 40 Fourth module, 50 First transport mechanism, 60 Second transport mechanism, 70 Control unit, 100 Release film supply unit, 200 Release film placement unit, 210, 220 Replacement mechanism, 211, 221, 510, 520A Support unit, 212, 222 Stage, 213, 223 Plate, 214, 224, 500 Moving unit, 215, 225 Rail, 230 Measuring instrument, 250 Dispenser, 251 Dispenser body, 260 Holding mechanism, 300 Resin molding unit, 301 Outer frame member, 305, 355A Molding die, 310 Fixed platen, 320, 360A Upper die, 330 Movable platen, 340, 370A Lower mold, 341, 371A Bottom member, 342, 372A Side member, 343, 373A Spring, 344, 374A Base plate, 350A Intermediate plate, 410 Substrate supply section, 420 Substrate storage section, 430 Substrate mounting section, 511, 521A Holding section, C1 Cartridge, F1 Release film, H1, H2, H3, H4 Through hole, N1 Nozzle, P1 Substrate, R1 Liquid resin, TC1 Tray cover.

Claims

1. A first module that supplies release film, A second module that places the liquid resin onto the release film by supplying the liquid resin to the release film, The system includes a third module which includes a mold and performs resin molding by clamping the mold with the release film on which the liquid resin is placed positioned in the mold, The second module includes the first and second stages, The release film can be placed in each of the first and second stages. The present invention further comprises a transport mechanism that initiates the transport of the release film from the first module to the second stage while the liquid resin is being supplied to the release film, which has at least been placed on the first stage, The second module further includes a replacement mechanism and a dispenser, The replacement mechanism, after the release film without the liquid resin is placed on the second stage and the transport of the release film with the liquid resin on it from the first stage to the third module has begun, swaps the positions of the first stage and the second stage. The dispenser is a resin molding apparatus that, after replacement by the replacement mechanism, discharges the liquid resin toward the release film which does not have the liquid resin on it.

2. The resin molding apparatus according to claim 1, wherein the transport mechanism places the release film without the liquid resin on it on the second stage, and then transports the release film with the liquid resin on it from the first stage to the third module.

3. The supply time required for supplying the liquid resin to the release film in the second module is longer than the molding time required for resin molding in the third module. The resin molding apparatus according to claim 1, wherein, in the manufacturing of a resin molded product through processes in each of the first module, the second module, and the third module, the supply of the liquid resin to the release film in the second module does not become a time bottleneck.

4. The resin molding apparatus according to claim 1, wherein the cycle time for manufacturing the resin molded product through the processes in each of the first module, the second module, and the third module depends on the molding time required for resin molding in the third module.

5. The dispenser includes a cartridge for storing the liquid resin, In the dispenser, the cartridge is installed in a replaceable manner such that its longitudinal direction is aligned with the vertical direction. The resin molding apparatus according to claim 1, wherein the second module further includes a holding mechanism for holding a used cartridge and an unused cartridge, respectively.

6. The second module further includes a measuring instrument, Each of the first and second stages has a through hole formed therein. Each of the first and second stages is covered by a plate. The release film is placed on the plate, With the measuring instrument passing through the through-hole, the measuring instrument supports a plate positioned on the stage of the first and second stages that corresponds to the through-hole through which the measuring instrument passes. The resin molding apparatus according to claim 1, wherein the liquid resin is supplied to the release film placed on a plate supported by the measuring instrument.

7. The first module includes two first units, each of which supplies the release film. The second module includes two second units, each of which supplies the liquid resin to the release film, thereby placing the liquid resin on the release film. Each of the two second units includes the first and second stages, The aforementioned third module includes two third units, Each of the two third units includes the mold, and resin molding is performed by clamping the mold with the release film on which the liquid resin is placed positioned in the mold. The transport mechanism holds two release films, The aforementioned transport mechanism is One of the two release films obtained from the two first units, which does not have the liquid resin on it, is placed on the first stage of one of the two second units, and the other of the two release films obtained from the two first units, which does not have the liquid resin on it, is placed on the first stage of the other of the two second units. The resin molding apparatus according to claim 1, wherein one of the two release films on which the liquid resin obtained from the first stage of the two second units is placed is placed in the mold of one of the two third units, and the other of the two release films on which the liquid resin obtained from the first stage of the two second units is placed in the mold of the other of the two third units.

8. The transport mechanism includes first and second holding parts, each holding the release film, When the release film, which does not have the liquid resin held by the first holding portion on it, is placed on the first stage of one of the two second units, the position of the first stage of one of the two second units corresponds to the position of the first holding portion. The resin molding apparatus according to claim 7, wherein when the release film, which does not have the liquid resin held by the second holding portion on it, is placed on the first stage of the other of the two second units, the position of the first stage of the other of the two second units corresponds to the position of the second holding portion.

9. A method for manufacturing a resin molded product using a resin molding apparatus according to any one of claims 1 to 8, The step of supplying the release film, The steps include supplying the liquid resin to the release film to place the liquid resin on the release film, The steps include: clamping the mold with the release film on which the liquid resin is placed in the mold; A method for manufacturing a resin molded product, comprising the step of starting the transport of the release film from the first module to the second stage while the liquid resin is being supplied to the release film, which has at least been placed on the first stage.

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