Electronic components

Abstract

To provide an electronic component that suppresses the occurrence of migration in a case where an external electrode includes a conductive resin layer.SOLUTION: In a multilayer capacitor, an external electrode 5 includes a first electrode layer E1, and a second electrode layer E2 directly covering an edge of the first electrode layer E1. A plurality of internal electrodes 7, 9 are disposed in an element assembly 3 so as to be arrayed in a second direction. An insulating film 21 is disposed on the element assembly 3. Each external electrode 5 includes a pair of electrode parts 5c that are disposed on a pair of side surfaces 3c and include the second electrode layer E2. In each electrode part 5c, the second electrode layer E2 covering the edge of the first electrode layer E1 directly covers the side surface 3c. The insulating film 21 extends along an edge E2ce of the second electrode layer E2 included in each electrode part 5c and includes a film part 21a disposed on the side surface 3c and the second electrode layer E2 so as to continuously cover the edge E2ce and a region exposed from the external electrode 5 at the side surface 3c.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] This invention relates to electronic components. [Background technology]

[0002] A known electronic component comprises a rectangular parallelepiped body, a plurality of external electrodes, and a plurality of internal electrodes (see, for example, Patent Document 1). The body has a pair of end faces facing each other in a first direction, a pair of first sides facing each other in a second direction, and a pair of second sides facing each other in a third direction. The plurality of external electrodes are arranged on both ends of the body in the first direction. The plurality of internal electrodes are arranged inside the body in a second direction and are electrically connected to the corresponding external electrodes among the plurality of external electrodes. The external electrodes are arranged on the second side and have an electrode portion that includes a conductive resin layer. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2018-006501 [Overview of the project] [Problems that the invention aims to solve]

[0004] Conductive resin layers generally contain multiple metal particles and resin. In this case, migration may occur in the external electrodes. Migration is thought to occur, for example, due to the following events: The electric field generated between the internal electrode and the conductive resin layer to which the internal electrode is not electrically connected acts on the metal particles, causing the atoms of the metal particles to ionize. The generated metal ions are attracted by the electric field generated between the external electrodes and move away from the conductive resin layer. The metal ions that move away from the conductive resin layer react, for example, with electrons supplied from the substrate and deposit as metal on the surface of the substrate.

[0005] Each aspect of the present invention aims to provide an electronic component that suppresses migration even when the external electrode includes a conductive resin layer. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention comprises a rectangular parallelepiped body, a plurality of external electrodes, a plurality of internal electrodes, and an insulating film disposed on the body. The body has a pair of end faces facing each other in a first direction, a pair of first sides facing each other in a second direction, and a pair of second sides facing each other in a third direction. The plurality of external electrodes are disposed on both ends of the body in the first direction. The plurality of internal electrodes are arranged within the body in a second direction and are electrically connected to the corresponding external electrodes among the plurality of external electrodes. Each external electrode has a pair of first electrode portions disposed on a pair of second sides and containing a conductive resin layer. The insulating film has film portions disposed on the second sides along the edges of the conductive resin layer contained in each first electrode portion, and covering the edges and the regions exposed from the external electrodes on the second sides.

[0007] In one of the above embodiments, the edge of the conductive resin layer contained in the first electrode portion is covered by a film portion of the insulating film. Therefore, even if metal ions are generated in the conductive resin layer of the first electrode portion due to the electric field generated between the internal electrode and the conductive resin layer of the first electrode portion, which is not electrically connected to the internal electrode, the metal ions have difficulty moving out of the conductive resin layer of the first electrode portion. In other words, the film portion of the insulating film restricts the movement of metal ions. As a result, one of the above embodiments suppresses the occurrence of migration.

[0008] In the above-described one aspect, each external electrode may have a pair of second electrode portions that are respectively disposed on a pair of first side surfaces and include a conductive resin layer. The insulating film may have film portions respectively disposed on the first side surfaces so as to cover along the edge of the conductive resin layer included in each second electrode portion and cover the edge and the region exposed from the external electrode on the first side surface. In the configuration in which the insulating film has the film portions disposed on the first side surfaces, the edge of the conductive resin layer included in the second electrode portion is covered by the film portions disposed on the first side surfaces of the insulating film. Therefore, even when metal ions are generated in the conductive resin layer of the second electrode portion due to an electric field generated between the outermost internal electrode located most outward in the second direction among the plurality of internal electrodes and the conductive resin layer of the second electrode portion to which the outermost internal electrode is not electrically connected, the metal ions are unlikely to move from the conductive resin layer of the second electrode portion. That is, the film portions disposed on the first side surfaces restrict the movement of metal ions. As a result, the above configuration further suppresses the occurrence of migration.

[0009] In the above-described one aspect, the conductive resin layer may contain a plurality of silver particles.

[0010] An electronic component according to another aspect of the present invention comprises a rectangular parallelepiped body, a plurality of external electrodes, and a plurality of internal electrodes. The body has a pair of end faces facing each other in a first direction, a pair of first sides facing each other in a second direction, and a pair of second sides facing each other in a third direction. The plurality of external electrodes are arranged on both ends of the body in the first direction. The plurality of internal electrodes are arranged inside the body so as to be aligned in a second direction and are electrically connected to the corresponding external electrodes among the plurality of external electrodes. Each external electrode has a pair of first electrode portions arranged on a pair of second sides and containing a conductive resin layer. In two conductive resin layers located on the same second side, one conductive resin layer has an edge facing the other conductive resin layer. The conductive resin layer includes a first region containing a resin and a plurality of metal particles having a first content, and a second region containing a resin and a plurality of metal particles having a second content smaller than the first content. The second region is located closer to the edge of the conductive resin layer than the first region and includes the edge of the conductive resin layer.

[0011] In the other embodiment described above, the second region constitutes the edge of the conductive resin layer contained in the first electrode portion. The content of multiple metal particles in the second region (second content) is smaller than the content of multiple metal particles in the first region (first content). Even when metal ions are generated in the conductive resin layer of the first electrode portion due to the electric field generated between the internal electrode and the conductive resin layer of the first electrode portion to which the internal electrode is not electrically connected, the amount of metal ions generated in the second region is less than that in the first region. Therefore, the configuration in which the conductive resin layer of the first electrode portion has a second region results in less metal ions moving from the conductive resin layer of the first electrode portion compared to the configuration in which the conductive resin layer of the first electrode portion consists of a first region. As a result, the other embodiment described above suppresses the occurrence of migration.

[0012] In another aspect described above, each external electrode may have a pair of second electrode portions that are respectively disposed on a pair of first side surfaces and include a conductive resin layer. In the two conductive resin layers located on the same first side surface, one conductive resin layer may have an edge facing the other conductive resin layer. The conductive resin layer included in the second electrode portion disposed on the first side surface may include a third region including a plurality of metal particles having a third content and resin, and a fourth region including a plurality of metal particles having a fourth content smaller than the third content and resin. The fourth region may be located closer to the edge of the conductive resin layer than the third region and may include the edge of the conductive resin layer. In a configuration in which the conductive resin layer included in the second electrode portion has a fourth region, the fourth region constitutes the edge of the conductive resin layer included in the second electrode portion. The content (fourth content) of the plurality of metal particles in the fourth region is smaller than the content (third content) of the plurality of metal particles in the third region. Even when metal ions are generated in the conductive resin layer of the second electrode portion due to an electric field generated between the outermost internal electrode located most outward in the second direction among the plurality of internal electrodes and the conductive resin layer of the second electrode portion to which the outermost internal electrode is not electrically connected, in the fourth region, the amount of metal ions generated is smaller than that in the third region. Therefore, the configuration in which the conductive resin layer of the second electrode portion has a fourth region has a smaller amount of metal ions moving from the conductive resin layer of the second electrode portion than the configuration in which the conductive resin layer of the second electrode portion consists of the third region. As a result, the above another aspect further suppresses the occurrence of migration. [[ID=;4]]

[0013] The metal particles may include silver particles.

[0014] In each of the above embodiments, each external electrode may have a pair of second electrode portions, each arranged on a pair of first side surfaces and containing a conductive resin layer. In two conductive resin layers located on the same first side surface, one conductive resin layer may have an edge facing the other conductive resin layer. Among a plurality of internal electrodes, the outermost internal electrode located furthest outward in the second direction may be adjacent in the second direction to the second electrode portion to which the outermost internal electrode is electrically connected. With the surface including the end face on which the outermost internal electrode is exposed as a reference plane, the first length of the outermost internal electrode in the first direction from the reference plane may be greater than the second length in the first direction from the reference plane to the edge of the conductive resin layer to which the outermost internal electrode is electrically connected and which is contained in the second electrode portion, and less than the third length from the reference plane to the edge of the conductive resin layer to which the outermost internal electrode is not electrically connected and which is contained in the second electrode portion. In a configuration where the first length is greater than the second length, the conductive resin layer contained in the outermost internal electrode and the internal electrode adjacent to it in the second direction, and the second electrode portion adjacent to the same outermost internal electrode in the second direction, are not electrically connected to each other, but they are unlikely to face each other in the second direction. An electric field is unlikely to be generated between the conductive resin layer and the internal electrode, as they are not electrically connected to each other. In a configuration where the first length is smaller than the third length, the outermost inner electrode is unlikely to face the conductive resin layer contained in the second electrode portion, which is not electrically connected to the outermost inner electrode, in the second direction. An electric field is unlikely to be generated between the conductive resin layer and the outermost inner electrode, as they are not electrically connected to each other. As a result, a configuration in which the first length is greater than the second length and less than the third length further suppresses the occurrence of migration.

[0015] Each of the above embodiments may include a dummy conductor located in the same layer as the outermost inner electrode and spaced apart from it. The dummy conductor may be electrically connected to an outer electrode that is not electrically connected to the outermost inner electrode located in the same layer as the dummy conductor. In a configuration where the dummy conductor is located in the same layer as the outermost inner electrode, structural defects are less likely to occur in the base material.

[0016] Each of the above embodiments may comprise a pair of dummy conductors adjacent in a second direction to a corresponding first side of a pair of first sides. Each external electrode may have a pair of second electrode portions, each positioned on a pair of first sides and containing a conductive resin layer. Each dummy conductor may not be electrically connected to an internal electrode adjacent in a second direction and may face in a second direction the conductive resin layer contained in the second electrode portion. In a configuration with a dummy conductor, the dummy conductor is positioned between the conductive resin layer contained in the second electrode and the internal electrode that is not electrically connected to the conductive resin layer of the second electrode. The dummy conductor separates the conductive resin layer of the second electrode from the internal electrode that is not electrically connected to the conductive resin layer of the second electrode. Therefore, an electric field is unlikely to be generated between the conductive resin layer of the second electrode and the internal electrode that is not electrically connected to the conductive resin layer of the second electrode. Even if an electric field is generated between the conductive resin layer of the second electrode and the internal electrode that is not electrically connected to the conductive resin layer of the second electrode, the strength of the electric field is small. As a result, the configuration with a dummy conductor further suppresses the occurrence of migration.

[0017] In each of the above embodiments, each external electrode may have an electrode portion that is positioned on an end face and includes a conductive resin layer. A configuration in which an external electrode is positioned on the end face and the electrode portion includes a conductive resin layer reduces the stress acting on the solder fillet formed in the electrode portion and suppresses the occurrence of solder cracks. [Effects of the Invention]

[0018] Each aspect of the present invention provides an electronic component that suppresses migration even when the external electrode includes a conductive resin layer. [Brief explanation of the drawing]

[0019] [Figure 1] Figure 1 is a perspective view of a multilayer capacitor according to the first embodiment. [Figure 2] Figure 2 shows the cross-sectional configuration of a multilayer capacitor according to the first embodiment. [Figure 3] Figure 3 shows the cross-sectional configuration of a multilayer capacitor according to the first embodiment. [Figure 4] Figure 4 shows the second electrode layer and the insulating film. [Figure 5] Figure 5 shows the second electrode layer and the insulating film. [Figure 6] Figure 6 shows the mounting structure of a multilayer capacitor according to the first embodiment. [Figure 7] Figure 7 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 8] Figure 8 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 9] Figure 9 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 10] Figure 10 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 11] Figure 11 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 12] Figure 12 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 13] Figure 13 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 14] Figure 14 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 15] Figure 15 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 16] Figure 16 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 17] Figure 17 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 18]Figure 18 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 19] Figure 19 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the first embodiment. [Figure 20] Figure 20 is a perspective view of a multilayer capacitor according to the second embodiment. [Figure 21] Figure 21 is a diagram showing the cross-sectional configuration of a multilayer capacitor according to the second embodiment. [Figure 22] Figure 22 shows the cross-sectional configuration of a multilayer capacitor according to the second embodiment. [Figure 23] Figure 23 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 24] Figure 24 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 25] Figure 25 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 26] Figure 26 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 27] Figure 27 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 28] Figure 28 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 29] Figure 29 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 30] Figure 30 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 31] Figure 31 is a diagram showing the cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 32] Figure 32 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Figure 33] Figure 33 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of the second embodiment. [Modes for carrying out the invention]

[0020] Embodiments of the present invention will be described in detail below with reference to the attached drawings. In this description, the same reference numerals will be used for the same element or element having the same function, and redundant explanations will be omitted.

[0021] (First Embodiment) The configuration of the multilayer capacitor C1 according to the first embodiment will be described with reference to Figures 1 to 3. Figure 1 is a perspective view of the multilayer capacitor according to the first embodiment. Figures 2 and 3 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to the first embodiment. In this embodiment, the electronic component is, for example, the multilayer capacitor C1.

[0022] As shown in Figure 1, the multilayer capacitor C1 comprises a rectangular parallelepiped base body 3 and a plurality of external electrodes 5. In this embodiment, the multilayer capacitor C1 comprises a pair of external electrodes 5. The pair of external electrodes 5 are arranged on the outer surface of the base body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges.

[0023] The element 3 has a pair of opposing sides 3a, a pair of opposing sides 3c, and a pair of opposing end faces 3e. The pair of sides 3a, the pair of sides 3c, and the pair of end faces 3e are rectangular in shape. The direction in which the pair of sides 3a face each other is the second direction D2. The direction in which the pair of sides 3c face each other is the third direction D3. The direction in which the pair of end faces 3e face each other is the first direction D1. The multilayer capacitor C1 is solder-mounted to electronic equipment. Electronic equipment includes, for example, a circuit board or electronic components. In the multilayer capacitor C1, one side 3a faces the electronic equipment. One side 3a is positioned to form a mounting surface. One side 3a is the mounting surface. Of the pair of sides 3c, one side 3c may be positioned to form a mounting surface. For example, if side 3a forms the first side, then side 3c forms the second side.

[0024] The second direction D2 is perpendicular to each side surface 3a and perpendicular to the third direction D3. The first direction D1 is parallel to each side surface 3a and each side surface 3c and perpendicular to the second direction D2 and the third direction D3. The third direction D3 is perpendicular to each side surface 3c, and the first direction D1 is perpendicular to each end surface 3e. In this embodiment, the length of the base body 3 in the first direction D1 is greater than the length of the base body 3 in the second direction D2 and greater than the length of the base body 3 in the third direction D3. The first direction D1 is the longitudinal direction of the base body 3. The length of the base body 3 in the second direction D2 and the length of the base body 3 in the third direction D3 may be equal to each other. The length of the base body 3 in the second direction D2 and the length of the base body 3 in the third direction D3 may be different to each other.

[0025] The length of the base body 3 in the second direction D2 is the height of the base body 3. The length of the base body 3 in the third direction D3 is the width of the base body 3. The length of the base body 3 in the first direction D1 is the length of the base body 3. In this embodiment, the height of the base body 3 is 0.1 to 2.5 mm, the width of the base body 3 is 0.1 to 5.0 mm, and the length of the base body 3 is 0.2 to 5.7 mm. For example, the height of the base body 3 is 2.5 mm, the width of the base body 3 is 2.5 mm, and the length of the base body 3 is 3.2 mm.

[0026] A pair of side faces 3c extend in a second direction D2 to connect a pair of side faces 3a. A pair of side faces 3c also extend in a first direction D1. A pair of end faces 3e extend in a second direction D2 to connect a pair of side faces 3a. A pair of end faces 3e also extend in a third direction D3.

[0027] The base body 3 has four ridge sections 3g, four ridge sections 3i, and four ridge sections 3j. The ridge section 3g is located between the end face 3e and the side surface 3a. The ridge section 3i is located between the end face 3e and the side surface 3c. The ridge section 3j is located between the side surface 3a and the side surface 3c. In this embodiment, each ridge section 3g, 3i, and 3j is rounded to be curved. The base body 3 is subjected to so-called R-chamfering. The end face 3e and the side surface 3a are indirectly adjacent via the ridge section 3g. The end face 3e and the side surface 3c are indirectly adjacent via the ridge section 3i. The side surface 3a and the side surface 3c are indirectly adjacent via the ridge section 3j.

[0028] The base body 3 is constructed by stacking multiple dielectric layers in the second direction D2. The base body 3 has multiple stacked dielectric layers. In the base body 3, the stacking direction of the multiple dielectric layers coincides with the second direction D2. Each dielectric layer is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, dielectric ceramics such as BaTiO3, Ba(Ti,Zr)O3, or (Ba,Ca)TiO3. In the actual base body 3, each dielectric layer is integrated to such an extent that the boundaries between each dielectric layer are not visible.

[0029] As shown in Figures 2 and 3, the multilayer capacitor C1 comprises a plurality of internal electrodes 7 and a plurality of internal electrodes 9. Each internal electrode 7, 9 is an internal conductor located within the element 3. Each internal electrode 7, 9 is made of a conductive material commonly used as an internal conductor in multilayer electronic components. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrodes 7, 9 are constructed as sintered bodies of a conductive paste containing the above conductive material. In this embodiment, the internal electrodes 7, 9 are made of Ni.

[0030] Internal electrodes 7 and 9 are located in different positions (layers) in the second direction D2. Internal electrodes 7 and 9 are arranged alternately within the substrate 3, facing each other with a gap in the second direction D2. Internal electrodes 7 and 9 have different polarities. One end of internal electrodes 7 and 9 is exposed to the corresponding end face 3e. Internal electrodes 7 and 9 each have one end exposed to the corresponding end face 3e. Multiple internal electrodes 7 and multiple internal electrodes 9 are arranged alternately in the second direction D2. Multiple internal electrodes 7 and 9 are arranged within the base body 3 so as to be aligned in the second direction D2. Each internal electrode 7 and 9 is located in a plane approximately parallel to the side surface 3a. Internal electrodes 7 and 9 face each other in the second direction D2. The direction in which internal electrodes 7 and 9 face each other (second direction D2) is perpendicular to the direction parallel to the side surface 3a (third direction D3 and first direction D1).

[0031] In this embodiment, the plurality of internal electrodes 7 include one internal electrode 7A located furthest out in the second direction D2. Internal electrode 7A is the outermost internal electrode. In this embodiment, the plurality of internal electrodes 9 include one internal electrode 9A that is located furthest out in the second direction D2. Internal electrode 9A is the outermost internal electrode. In Figure 3, for illustrative purposes, the internal electrodes 7 and 9 (internal electrodes 7A and 9A) are intentionally shown offset from each other in the third direction D3.

[0032] As shown in Figure 1, the external electrodes 5 are positioned at both ends of the base body 3 in the first direction D1. Each external electrode 5 is positioned on the corresponding end face 3e side of the base body 3. In this embodiment, each external electrode 5 is positioned on a pair of side surfaces 3a, a pair of side surfaces 3c, and one end face 3e. As shown in Figures 2 and 3, the external electrode 5 has multiple electrode portions 5a, 5c, and 5e. Electrode portion 5a is positioned on the side surface 3a and on the ridge portion 3g. Each electrode portion 5c is positioned on the side surface 3c and on the ridge portion 3i. Electrode portion 5e is positioned on the end face 3e. The external electrode 5 also has an electrode portion positioned on the ridge portion 3j.

[0033] The external electrode 5 is formed on five surfaces: a pair of side surfaces 3a, one end surface 3e, and a pair of side surfaces 3c, as well as on ridges 3g, 3i, and 3j. Adjacent electrode portions 5a, 5c, and 5e are connected and electrically connected. Electrode portion 5e completely covers one end of the corresponding internal electrodes 7 and 9. Electrode portion 5e is directly connected to the corresponding internal electrodes 7 and 9. The external electrode 5 is electrically connected to the corresponding internal electrodes 7 and 9. As shown in Figures 2 and 3, the external electrode 5 has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. Each electrode portion 5a and 5c has the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. Each electrode portion 5e has the first electrode layer E1 and the third electrode layer E3.

[0034] The first electrode layer E1 of the electrode portion 5a is arranged on the side surface 3a and the ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is formed to cover a part of the side surface 3a and the entire ridge portion 3g. The first electrode layer E1 of the electrode portion 5a is in contact with the aforementioned part of the side surface 3a and the entire ridge portion 3g. That is, in the electrode portion 5a, the first electrode layer E1 is in direct contact with the base body 3. The side surface 3a is covered by the first electrode layer E1 in the aforementioned part and exposed from the first electrode layer E1 in the remaining part. The aforementioned part of the side surface 3a is a region of the side surface 3a near the end face 3e. The first electrode layer E1 of the electrode portion 5a is located on the side surface 3a. The first electrode layer E1 does not have to be formed on the side surface 3a. That is, the first electrode layer E1 does not have to be arranged on the side surface 3a. The second electrode layer E2 of the electrode section 5a is positioned on the first electrode layer E1 and on the side surface 3a. In the electrode section 5a, the second electrode layer E2 is formed to cover the first electrode layer E1 and a portion of the side surface 3a. In the electrode section 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the side surface 3a. The second electrode layer E2 of the electrode section 5a is formed to cover the first electrode layer E1 of the electrode section 5a. In the electrode section 5a, the second electrode layer E2 indirectly covers the side surface 3a such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3a. The second electrode layer E2 of the electrode section 5a is located on the side surface 3a. The third electrode layer E3 of electrode section 5a is positioned on the second electrode layer E2. In electrode section 5a, the third electrode layer E3 covers the second electrode layer E2. In electrode section 5a, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in electrode section 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. In electrode section 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of electrode section 5a is located on the side surface 3a.

[0035] The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c and the edge portion 3i. The first electrode layer E1 of the electrode portion 5c is formed to cover a part of the side surface 3c and the entire edge portion 3i. The first electrode layer E1 of the electrode portion 5c is in contact with the aforementioned part of the side surface 3c and the entire edge portion 3i. That is, in the electrode portion 5c, the first electrode layer E1 is in direct contact with the base body 3. The side surface 3c is covered by the first electrode layer E1 in the aforementioned part and exposed from the first electrode layer E1 in the remaining part. The aforementioned part of the side surface 3c is a region of the side surface 3c near the end face 3e. The first electrode layer E1 of the electrode portion 5c is located on the side surface 3c. The first electrode layer E1 does not have to be formed on the side surface 3c. That is, the first electrode layer E1 does not have to be located on the side surface 3c. The second electrode layer E2 of the electrode section 5c is positioned on the first electrode layer E1 and on the side surface 3c. In the electrode section 5c, the second electrode layer E2 is formed to cover the first electrode layer E1 and a portion of the side surface 3c. In the electrode section 5c, the second electrode layer E2 is in direct contact with the first electrode layer E1 and the side surface 3c. The second electrode layer E2 of the electrode section 5c is formed to cover the first electrode layer E1 of the electrode section 5c. In the electrode section 5c, the second electrode layer E2 indirectly covers the side surface 3c such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3c. The second electrode layer E2 of the electrode section 5c is located on the side surface 3c. The third electrode layer E3 of the electrode section 5c is positioned on the second electrode layer E2. In the electrode section 5c, the third electrode layer E3 covers the second electrode layer E2. In the electrode section 5c, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in the electrode section 5c, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode section 5c, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode section 5c is located on the side surface 3c.

[0036] The first electrode layer E1 of the electrode portion 5e is positioned on the end face 3e. The first electrode layer E1 of the electrode portion 5e is formed to cover the entire end face 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end face 3e. In other words, in the electrode portion 5e, the first electrode layer E1 is in direct contact with the end face 3e. The third electrode layer E3 of the electrode portion 5e is positioned on the first electrode layer E1. In the electrode portion 5e, the third electrode layer E3 covers the entire first electrode layer E1. In the electrode portion 5e, the third electrode layer E3 is in contact with the entire first electrode layer E1. That is, in the electrode portion 5e, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of the electrode portion 5e is located on the end face 3e.

[0037] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the base body 3. The first electrode layer E1 is formed to cover a portion of side surface 3a, a portion of side surface 3c, one end face 3e, and ridge portions 3g, 3i, and 3j. The first electrode layer E1 is formed by sintering the metal components (metal particles) contained in the conductive paste. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the base body 3. In this embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. The first electrode layer E1 contains a base metal. The conductive paste contains, for example, particles made of Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layers E1 of each electrode portion 5a, 5c, and 5e are formed integrally.

[0038] The second electrode layer E2 is formed by curing a conductive resin applied to the first electrode layer E1. The second electrode layer E2 is formed across the first electrode layer E1 and the base body 3. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer covering the first electrode layer E1. The conductive resin includes, for example, a resin, a conductive material, and an organic solvent. The resin is, for example, a thermosetting resin. The conductive material is, for example, metal particles. The metal particles are, for example, silver particles or copper particles. In this embodiment, the second electrode layer E2 includes a plurality of silver particles. That is, the second electrode layer E2 includes a plurality of metal particles. The thermosetting resin is, for example, a phenolic resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a part of the ridge portion 3j. The second electrode layer E2 of each electrode portion 5a, 5c is formed integrally.

[0039] The third electrode layer E3 is formed on the second electrode layer E2 and on the first electrode layer E1 (the portion exposed from the second electrode layer E2) by a plating method. The third electrode layer E3 may have a multi-layer structure. In this case, the third electrode layer E3 may have, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2 and on the first electrode layer E1. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder corrosion resistance than the metal contained in the second electrode layer E2. The third electrode layer E3 may have a Sn plating layer, a Cu plating layer, or an Au plating layer instead of a Ni plating layer. The solder plating layer may include, for example, a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The third electrode layer E3 of each electrode portion 5a, 5c, and 5e is formed integrally.

[0040] For example, if electrode portion 5c constitutes the first electrode portion, electrode portion 5a constitutes the second electrode portion. In this embodiment, electrode portion 5e does not include the second electrode layer E2.

[0041] The multilayer capacitor C1 includes an insulating film 21, as shown in Figures 2 and 3. The insulating film 21 is disposed on the substrate 3. The insulating film 21 has a film portion 21a disposed on each side surface 3c and a film portion 21b disposed on each side surface 3a. In this embodiment, the film portion 21a and the film portion 21b are integrally formed. The insulating film 21 is made of, for example, an electrically insulating resin. The resin constituting the insulating film 21 is, for example, an acrylic resin, a polyurethane resin, an epoxy resin, or a polyolefin resin. The insulating film 21 does not contain an electrically conductive filler.

[0042] As shown in Figure 4, the film portion 21a is the edge E2c of the second electrode layer E2 included in the electrode portion 5c. e It is positioned on the side surface 3c so as to follow the curve. Figure 4 shows the second electrode layer and the insulating film. The membrane portion 21a has an edge E2c e The film portion 21a is positioned on the side surface 3c so as to continuously cover the area exposed from the external electrode 5 on the side surface 3c. In this embodiment, the film portion 21a is in direct contact with the second electrode layer E2 and the side surface 3c. That is, the film portion 21a is in direct contact with the edge E2c e It is positioned to directly cover the side surface 3c. On the side surface 3c, the membrane portion 21a is positioned over the edge E2c e It extends along the edge E2c of the second electrode layer E2. e A portion of the electrode is covered by the film portion 21a. The third electrode layer E3 of the electrode portion 5c is formed in the region exposed from the film portion 21a of the second electrode layer E2. The width W1 of the membrane portion 21a is 5% or more of the width W2 of the external electrode 5, as shown in Figure 3. The width W1 is the length of the membrane portion 21a in the first direction D1. The width W2 of the external electrode 5 is the length of the external electrode 5 in the first direction D1.

[0043] As shown in Figure 5, the film portion 21b is the edge E2a of the second electrode layer E2 included in the electrode portion 5a. e It is positioned on the side surface 3a so as to follow the curve. Figure 5 shows the second electrode layer and the insulating film. The film portion 21b is disposed on the side surface 3a so as to continuously cover the edge E2a e and the region exposed from the external electrode 5 on the side surface 3a. In the present embodiment, the film portion 21b is in direct contact with the second electrode layer E2 and the side surface 3a. That is, the film portion 21b is disposed so as to directly cover the edge E2a e and the side surface 3a. On the side surface 3a, the film portion 21b extends along the edge E2a e . In the electrode portion 5a, a part including the edge E2a of the second electrode layer E2 is covered with the film portion 21b. The third electrode layer E3 of the electrode portion 5a is formed in the region exposed from the film portion 21b in the second electrode layer E2. As shown in FIG. 2, the width W3 of the film portion 21b is 5% or more of the width W2. The width W3 is the length of the film portion 21b in the first direction D1. The width W3 may be equal to the width W1 or different from the width W1.

[0044] When the multilayer capacitor C1 is solder-mounted on an electronic device, an external force acting on the multilayer capacitor C1 from the electronic device may act on the element body 3 through the electrode portion 5c. The external force is transmitted from the solder fillet formed during the solder mounting to the electrode portion 5c. The electronic device includes, for example, a circuit board or an electronic component. In the multilayer capacitor C1, the electrode portion 5c has the second electrode layer E2. Therefore, it is difficult for an external force to act on the element body 3 from the electrode portion 5c. As a result, the multilayer capacitor C1 suppresses the occurrence of cracks in the element body 3.

[0045] There is also a possibility that an external force acting on the multilayer capacitor C1 from the electronic device acts on the element body 3 through the electrode portion 5a. In the multilayer capacitor C1, the electrode portion 5a has the second electrode layer E2. Therefore, it is difficult for an external force to act on the element body 3 from the electrode portion 5a. As a result, the multilayer capacitor C1 further suppresses the occurrence of cracks in the element body 3.

[0046] In the multilayer capacitor C1, the edge E2c of the second electrode layer E2 included in the electrode portion 5c​​e However, it is covered by the film portion 21a. Therefore, even if metal ions are generated in the second electrode layer E2 of the electrode portion 5c due to the electric field generated between the internal electrodes 7,9 and the second electrode layer E2 of the electrode portion 5c, which is not electrically connected to the internal electrodes 7,9, the metal ions have difficulty moving out of the second electrode layer E2 of the electrode portion 5c. In other words, the film portion 21a restricts the movement of metal ions. As a result, the multilayer capacitor C1 suppresses the occurrence of migration.

[0047] In the multilayer capacitor C1, the edge E2a of the second electrode layer E2 is included in the electrode portion 5a. e However, it is covered by the film portion 21b. Therefore, even if metal ions are generated in the second electrode layer E2 of electrode portion 5a due to the electric field generated between the internal electrodes 7A and 9A and the second electrode layer E2 of electrode portion 5a, which is not electrically connected to the internal electrodes 7A and 9A, the metal ions have difficulty moving from the second electrode layer E2 of electrode portion 5a. In other words, the film portion 21b restricts the movement of metal ions. As a result, the multilayer capacitor C1 further suppresses the occurrence of migration.

[0048] The second electrode layer E2 contains multiple silver particles. Silver particles are more prone to migration than, for example, copper particles. The multilayer capacitor C1 reliably suppresses migration even when the second electrode layer E2 contains multiple silver particles.

[0049] Next, the mounting structure of the multilayer capacitor C1 will be described with reference to Figure 6. Figure 6 is a diagram showing the mounting structure of the multilayer capacitor according to this embodiment.

[0050] As shown in Figure 6, the electronic component device comprises a multilayer capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or an electronic component. The multilayer capacitor C1 is solder-mounted on the electronic device ED. The electronic device ED has a main surface EDa and two pad electrodes PE. Each pad electrode PE is positioned on the main surface EDa. The two pad electrodes PE are spaced apart from each other. The multilayer capacitor C1 is positioned on the electronic device ED such that the side surface 3a, which constitutes the mounting surface, faces the main surface EDa. Each internal electrode 7,9 is located in a plane substantially parallel to the main surface EDa. When the side surface 3c constitutes the mounting surface, each internal electrode 7,9 is located in a plane substantially perpendicular to the main surface EDa.

[0051] When a multilayer capacitor C1 is soldered, the molten solder wets the external electrode 5 (third electrode layer E3). As the wetted solder solidifies, a solder fillet SF is formed on the external electrode 5. The corresponding external electrodes 5 and pad electrodes PE are connected via the solder fillet SF.

[0052] Next, with reference to Figure 7, the configuration of the multilayer capacitor C11 according to a modified example of the first embodiment will be described. Figure 7 is a diagram showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C11 according to this modified example is generally similar to or the same as the multilayer capacitor C1 described above, but this modified example differs from the first embodiment described above in terms of the configuration of the electrode portion 5e. The differences between the first embodiment described above and this modified example will be mainly described below.

[0053] Each electrode portion 5e has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The second electrode layer E2 of the electrode section 5e is positioned on the first electrode layer E1. In the electrode section 5e, the second electrode layer E2 is formed to cover the entire first electrode layer E1. In the electrode section 5e, the second electrode layer E2 is in direct contact with the first electrode layer E1. In the electrode section 5e, the second electrode layer E2 indirectly covers the end face 3e such that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The second electrode layer E2 of the electrode section 5e is located on the end face 3e. The third electrode layer E3 of electrode section 5e is positioned on the second electrode layer E2. In electrode section 5e, the third electrode layer E3 covers the entire second electrode layer E2. In electrode section 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in electrode section 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In electrode section 5e, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The second electrode layers E2 of each electrode section 5a, 5c, and 5e are formed integrally.

[0054] The configuration in which the electrode portion 5e has a second electrode layer E2 relieves the stress acting on the solder fillet formed on the electrode portion 5e. Therefore, the multilayer capacitor C11 suppresses the occurrence of solder cracks.

[0055] Next, with reference to Figure 8, the configuration of the multilayer capacitor C12 according to a modified example of the first embodiment will be described. Figure 8 is a diagram showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C12 according to this modified example is generally similar to or the same as the multilayer capacitor C1 described above, but this modified example differs from the first embodiment described above in terms of the configuration of the electrode portion 5a and the insulating film 21. The differences between the first embodiment described above and this modified example will be mainly described below.

[0056] As shown in Figure 8, the electrode portion 5a does not necessarily have to have a second electrode layer E2. The third electrode layer E3 of electrode section 5a is positioned on the first electrode layer E1. In electrode section 5a, the third electrode layer E3 covers the entire first electrode layer E1. In electrode section 5a, the third electrode layer E3 is in contact with the entire first electrode layer E1. That is, in electrode section 5a, the third electrode layer E3 is in direct contact with the first electrode layer E1. The third electrode layer E3 of electrode section 5a is located on the side surface 3a.

[0057] In a configuration where the electrode portion 5a does not have a second electrode layer E2, the second electrode layer E2 and the internal electrodes 7 and 9, which are not electrically connected to each other, do not face each other in the second direction D2. Therefore, the insulating film 21 does not need to have a film portion 21b. Even in this case, the multilayer capacitor C12 further suppresses the occurrence of migration. In a configuration where the electrode portion 5a does not have a second electrode layer E2, the insulating film 21 does not need to have a film portion 21b, as shown in Figure 8. Even in a configuration where the insulating film 21 does not have a film portion 21b, the insulating film 21 has a film portion 21a, similar to the multilayer capacitor C1 shown in Figure 3.

[0058] Next, the configuration of the multilayer capacitor C13 according to a modified example of the first embodiment will be described with reference to Figures 9 to 11. Figures 9, 10, and 11 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C13 according to this modified example is generally similar to or the same as the multilayer capacitor C1 described above, but this modified example differs from the first embodiment described above in terms of the configuration of the internal electrodes 7A, 9A and the insulating film 21. The differences between the first embodiment described above and this modified example will be mainly explained below.

[0059] The internal electrode 7A has a pair of ends 7Ae1 and 7Ae2 that face each other in a first direction D1, as shown in Figures 9 and 10. End 7Ae1 is exposed to the end face 3e. End 7Ae2 is located inside the body 3. The internal electrode 9A has a pair of ends 9Ae1 and 9Ae2 that face each other in a first direction D1, as shown in Figures 9 and 11. End 9Ae1 is exposed to the end face 3e. End 9Ae2 is located inside the body 3. For example, if each end 7Ae1 and 9Ae1 constitutes the first end, then each end 7Ae2 and 9Ae2 constitute the second end.

[0060] The second electrode layer E2 of the electrode portion 5a is located on the side surface 3a. Each second electrode layer E2 located on the same side surface 3a has an edge E2a e It has the edge E2a of one of the second electrode layers E2 on the same side surface 3a. e This is the edge E2a of the other second electrode layer E2. e It is in opposition to that.

[0061] As shown in Figure 9, the length L11 of the internal electrode 7A in the first direction D1 from the reference plane PL1 is equal to the length from the reference plane PL1 to the edge E2a of the second electrode layer E2 which is electrically connected to the internal electrode 7A. e The length L21 in the first direction D1 up to is greater than this. Therefore, when the internal electrode 7A and the second electrode layer E2 to which the internal electrode 7A is electrically connected are viewed from the second direction D2, the end 7A e2 The internal electrode 7A is exposed from the second electrode layer E2 to which it is electrically connected. Length L11 is measured from the reference plane PL1 to the edge E2a of the second electrode layer E2, where the internal electrode 7A is not electrically connected. e It is smaller than the length L31 in the first direction D1 up to that point. Therefore, when the internal electrode 7A and the second electrode layer E2, to which the internal electrode 7A is not electrically connected, are viewed from the second direction D2, the internal electrode 7A and the second electrode layer E2, to which the internal electrode 7A is not electrically connected, do not overlap each other. The reference plane PL1 includes the end face 3e on which the end 7Ae1 of the internal electrode 7A is exposed. For example, if length L11 constitutes the first length, length L21 constitutes the second length, and length L31 constitutes the third length.

[0062] The length L12 of the internal electrode 9A in the first direction D1 from the reference plane PL2 is equal to the length from the reference plane PL2 to the edge E2a of the second electrode layer E2, which is electrically connected to the internal electrode 9A. e The length L22 in the first direction D1 up to is greater than this. Therefore, when the internal electrode 9A and the second electrode layer E2 to which the internal electrode 9A is electrically connected are viewed from the second direction D2, the end 9A e2 The internal electrode 9A is exposed from the second electrode layer E2 to which it is electrically connected. Length L12 is measured from the reference plane PL2 to the edge E2a of the second electrode layer E2, where the internal electrode 9A is not electrically connected. e It is smaller than the length L32 in the first direction D1 up to that point. Therefore, when the internal electrode 9A and the second electrode layer E2, to which the internal electrode 9A is not electrically connected, are viewed from the second direction D2, the internal electrode 9A and the second electrode layer E2, to which the internal electrode 9A is not electrically connected, do not overlap each other. The reference plane PL2 includes the end face 3e on which the end 9Ae1 of the internal electrode 9A is exposed. For example, if length L12 constitutes the first length, then length L22 constitutes the second length, and length L32 constitutes the third length.

[0063] The length L41 in the first direction D1 from the reference plane PL1 to the other end of the internal electrode 9 is smaller than the length L21. Therefore, when the internal electrode 9, which is not electrically connected to the internal electrode 7A, and the second electrode layer E2, to which the internal electrode 7A is electrically connected, are viewed from the second direction D2, the internal electrode 9 and the second electrode layer E2, to which the internal electrode 7A is electrically connected, overlap each other. The length L42 in the first direction D1 from the reference plane PL2 to the other end of the internal electrode 7 is smaller than the length L22. Therefore, when the internal electrode 7, which is not electrically connected to the internal electrode 9A, and the second electrode layer E2, to which the internal electrode 9A is electrically connected, are viewed from the second direction D2, the internal electrode 7 and the second electrode layer E2, to which the internal electrode 9A is electrically connected, overlap each other.

[0064] Lengths L11 and L12 may be the same or different. Lengths L21 and L22 may be the same or different. Lengths L31 and L32 may be the same or different. Lengths L41 and L42 may be the same or different.

[0065] The multilayer capacitor C13 comprises multiple conductors 11 and 13. The multilayer capacitor C13 comprises two conductors 11 and 13. In Figures 10 and 11, for illustrative purposes, each internal electrode 7 and 9 (internal electrodes 7A and 9A) and each conductor 11 and 13 are intentionally shown offset from each other in a third direction D3. The conductor 11 is located in the same layer as the internal electrode 7A and is spaced apart from the internal electrode 7A. The conductor 11 has one end exposed to the corresponding end face 3e. One end of the conductor 11 is exposed to the end face 3e to which one end of the internal electrode 9 is exposed. One end of the conductor 11 is completely covered by the corresponding electrode portion 5e. The conductor 11 is directly connected to the corresponding electrode portion 5e. The conductor 11 is electrically connected to the corresponding external electrode 5. In the multilayer capacitor C13, the conductor 11 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9 is electrically connected. That is, the conductor 11 is electrically connected to the external electrode 5 to which the internal electrode 7 is not electrically connected. The conductor 13 is located in the same layer as the internal electrode 9A and is spaced apart from the internal electrode 9A. The conductor 13 has one end exposed to the corresponding end face 3e. One end of the conductor 13 is exposed to the end face 3e to which one end of the internal electrode 7 is exposed. One end of the conductor 13 is completely covered by the corresponding electrode portion 5e. The conductor 13 is directly connected to the corresponding electrode portion 5e. The conductor 13 is electrically connected to the corresponding external electrode 5. In the multilayer capacitor C13, the conductor 13 is electrically connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7 is electrically connected. That is, the conductor 13 is electrically connected to the external electrode 5 to which the internal electrode 9 is not electrically connected. Conductors 11 and 13 constitute dummy conductors that do not contribute to the formation of capacitance.

[0066] In the multilayer capacitor C13, lengths L11 and L12 are greater than lengths L21 and L22. Therefore, although the internal electrodes 7A and 9A and the internal electrodes 7 and 9 adjacent in the second direction D2, and the second electrode layer E2 containing the electrode portion 5a adjacent to the internal electrodes 7A and 9A in the second direction D2, are not electrically connected to each other, they are unlikely to face each other in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7 and 9, which are not electrically connected to each other. Lengths L11 and L12 are smaller than lengths L31 and L32. Therefore, the internal electrodes 7A and 9A are unlikely to face the second electrode layer E2, which is included in the electrode portion 5a to which the internal electrodes 7A and 9A are not electrically connected, in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2, which is not electrically connected to the internal electrodes 7A and 9A. As a result, the multilayer capacitor C13 further suppresses the occurrence of migration. Therefore, the insulating film 21 does not need to have a film portion 21b.

[0067] In the multilayer capacitor C13, conductor 11 is electrically connected to the external electrode 5, which is not electrically connected to the internal electrode 7A. Conductor 13 is electrically connected to the external electrode 5, which is not electrically connected to the internal electrode 9A. In a configuration where conductors 11 and 13 are located in the same layer as internal electrodes 7A and 9A, structural defects are less likely to occur in the substrate 3.

[0068] Next, the configuration of the multilayer capacitor C14 according to a modified example of the first embodiment will be described with reference to Figures 12 to 14. Figures 12, 13, and 14 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C14 according to this modified example is generally similar to or the same as the multilayer capacitor C13 shown in Figures 9 to 11, however, this modified example differs from the multilayer capacitor C13 in terms of the configuration of each conductor 11, 13. The differences between the multilayer capacitor C13 and this modified example will be mainly described below.

[0069] The multilayer capacitor C14 comprises a pair of conductors 11 and 13. In Figures 13 and 14, for illustrative purposes, the internal electrodes 7A and 9A and the conductors 11 and 13 are intentionally shown offset from each other in the third direction D3. In the multilayer capacitor C14, the conductors 11 and 13 constitute dummy conductors that do not contribute much to the formation of capacitance.

[0070] The conductor 11 is adjacent to one side surface 3a in the second direction D2. The conductor 11 is adjacent to the internal electrode 9A in the second direction D2. The conductor 11 is located between one side surface 3a and the internal electrode 9A. The conductor 11 includes part 11a and part 11b. Part 11a faces in a second direction D2 the second electrode layer E2, which is located on one side surface 3a and to which the internal electrode 9A is not electrically connected. Therefore, the conductor 11 faces in a second direction D2 the second electrode layer E2, to which the internal electrode 9A is not electrically connected. Part 11b faces in the second direction D2 towards the second electrode layer E2, which is electrically connected to the internal electrode 9A and is located on one side surface 3a. For example, if part 11a constitutes the first part, then part 11b constitutes the second part.

[0071] Part 11a is spaced apart from part 11b in the first direction D1 and is not electrically connected to either of the second electrode layers E2. Part 11a has no edges that are exposed on the surface of the substrate 3. Part 11b is electrically connected to the second electrode layer E2 which is facing part 11b in the second direction D2. Part 11b has an end that is exposed to the end face 3e on which the internal electrode 9A is exposed. At the end exposed to the end face 3e, part 11b is directly connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 9A is electrically connected. Part 11b is electrically connected to the external electrode 5 to which the internal electrode 9A is electrically connected.

[0072] The conductor 13 is adjacent to the other side surface 3a in the second direction D2. The conductor 13 is adjacent to the internal electrode 7A in the second direction D2. The conductor 13 is located between the other side surface 3a and the internal electrode 7A. The conductor 13 includes part 13a and part 13b. Part 13a faces in a second direction D2 the second electrode layer E2 located on the other side surface 3a, to which the internal electrode 7A is not electrically connected. Therefore, the conductor 13 faces in a second direction D2 the second electrode layer E2 to which the internal electrode 7A is not electrically connected. Part 13b faces in the second direction D2 the second electrode layer E2, which is located on the other side surface 3a and to which the internal electrode 7A is electrically connected.

[0073] Part 13a is spaced apart from part 13b in the first direction D1 and is not electrically connected to either of the second electrode layers E2. Part 13a has no edges exposed on the surface of the substrate 3. Part 13b is electrically connected to the second electrode layer E2 which is facing part 13b in the second direction D2. Part 13b has an end that is exposed to the end face 3e on which the internal electrode 7A is exposed. At the end exposed to the end face 3e, part 13b is directly connected to the external electrode 5 (electrode portion 5e) to which the internal electrode 7A is electrically connected. Part 13b is electrically connected to the external electrode 5 to which the internal electrode 7A is electrically connected. For example, if part 13a constitutes the first part, then part 13b constitutes the second part.

[0074] The end 7Ae2 overlaps with the conductor 13 (part 13a) when viewed from the second direction D2. In the positional relationship between the internal electrode 9A, the second electrode layer E2 which is not electrically connected to the internal electrode 9A and is located on one side surface 3a, and the conductor 13 (part 13a), the conductor 13 (part 13a) is located between the internal electrode 9A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 9A and the second electrode layer E2 which is not electrically connected to the internal electrode 9A and is located on one side surface 3a do not face each other in the second direction D2.

[0075] The end 9Ae2 overlaps with the conductor 11 (part 11a) when viewed from the second direction D2. In the positional relationship between the internal electrode 7A, the second electrode layer E2 which is not electrically connected to the internal electrode 7A and is located on the other side surface 3a, and the conductor 11 (part 11a), the conductor 11 (part 11a) is located between the internal electrode 7A and the second electrode layer E2. Therefore, in the above positional relationship, the internal electrode 7A and the second electrode layer E2 which is not electrically connected to the internal electrode 7A and is located on the other side surface 3a do not face each other in the second direction D2.

[0076] In the multilayer capacitor C14, the conductor 11 is located between the second electrode layer E2 and the internal electrode 7A, which is not electrically connected to the second electrode layer E2. The conductor 11 separates the second electrode layer E2 and the internal electrode 7A, which is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 7A, which is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 7A, the strength of the electric field is small. The conductor 13 is positioned between the second electrode layer E2 and the internal electrode 9A, which is not electrically connected to the second electrode layer E2. The conductor 13 separates the second electrode layer E2 and the internal electrode 9A, which is not electrically connected to the second electrode layer E2. Therefore, an electric field is unlikely to be generated between the second electrode layer E2 and the internal electrode 9A, which is not electrically connected to the second electrode layer E2. Even if an electric field is generated between the second electrode layer E2 and the internal electrode 9A, the strength of the electric field is small. As a result, the multilayer capacitor C14 further suppresses the occurrence of migration. Therefore, the insulating film 21 does not need to have a film portion 21b.

[0077] In the multilayer capacitor C14, conductor 11 includes portion 11a and portion 11b, and conductor 13 includes portion 13a and portion 13b. Part 11a faces a second electrode layer E2 in the second direction D2 where the internal electrode 9A adjacent to the conductor 11 in the second direction D2 is not electrically connected. Part 11b faces a second electrode layer E2 in the second direction D2 where the internal electrode 9A is electrically connected. Part 13a faces a second electrode layer E2 in the second direction D2, where the internal electrode 7A adjacent to the conductor 13 in the second direction D2 is not electrically connected. Part 13b faces a second electrode layer E2 in the second direction D2, where the internal electrode 7A is electrically connected. In the multilayer capacitor C14, the configuration on one end face 3e side from the center in the first direction D1 is unlikely to differ from the configuration on the other end face 3e side from the center in the first direction D1. Therefore, structural defects are unlikely to occur in the element 3.

[0078] In the multilayer capacitor C14, terminal 7Ae2 overlaps with conductor 13 (part 13a) when viewed from the second direction D2. Therefore, an electric field is less likely to be generated between the second electrode layer E2 and the internal electrode 7A which is not electrically connected to the second electrode layer E2. Terminal 9Ae2 overlaps with conductor 11 (part 11a) when viewed from the second direction D2. Therefore, an electric field is less likely to be generated between the second electrode layer E2 and the internal electrode 9A which is not electrically connected to the second electrode layer E2. As a result, the multilayer capacitor C14 further suppresses the occurrence of migration.

[0079] Next, the configuration of the multilayer capacitor C15 according to a modified example of the first embodiment will be described with reference to Figures 15 to 17. Figures 15, 16, and 17 show the cross-sectional configuration of the multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C15 according to this modified example is generally similar to or the same as the multilayer capacitor C14 shown in Figures 12 to 14, but this modified example differs from the multilayer capacitor C14 in terms of the configuration of each conductor 11, 13. The differences between the multilayer capacitor C14 and this modified example will be mainly described below.

[0080] In the multilayer capacitor C15, parts 11a and 11b are a single unit. The conductor 11 has no ends exposed on the surface of the element 3. The conductor 11 is not connected to any of the external electrodes 5. That is, the conductor 11 is not electrically connected to the second electrode layer E2. Parts 13a and 13b are a single unit. Conductor 13 has no ends exposed on the surface of the element 3. Conductor 13 is not connected to any of the external electrodes 5. In other words, conductor 13 is not electrically connected to the second electrode layer E2.

[0081] The end 7Ae2 is not electrically connected to the internal electrode 7A and faces the second electrode layer E2 located on the other side surface 3a in the second direction D2. That is, the end 7Ae2 is exposed from the conductor 13 (part 13a) when viewed from the second direction D2. The end 9Ae2 is not electrically connected to the internal electrode 9A and faces the second electrode layer E2 located on one side surface 3a in the second direction D2. That is, the end 9Ae2 is exposed from the conductor 11 (part 11a) when viewed from the second direction D2. In the multilayer capacitor C15, the lengths of the internal electrodes 7 and 9 in the second direction D2 are increased, which allows for an increase in the capacitance of the multilayer capacitor.

[0082] Next, the configuration of the multilayer capacitor C16 according to a modified example of the first embodiment will be described with reference to Figures 18 and 19. Figures 18 and 19 show the cross-sectional configuration of the multilayer capacitor according to a modified example of the first embodiment. The multilayer capacitor C16 according to this modified example is generally similar to or the same as the multilayer capacitor C1 described above, but this modified example differs from the first embodiment described above in terms of the configuration of the electrode portions 5a, 5c and the insulating film 21. The differences between the first embodiment described above and this modified example will be mainly described below.

[0083] In the multilayer capacitor C16, the film portion 21a is in direct contact with the third electrode layer E3 and the side surface 3c. That is, the film portion 21a is in direct contact with the edge E2c e It is positioned to indirectly cover the surface and directly cover the side surface 3c. In the electrode portion 5c, the edge E2c of the second electrode layer E2 e A portion of this is indirectly covered by the membrane portion 21a. The membrane portion 21b is in direct contact with the third electrode layer E3 and the side surface 3a. That is, the membrane portion 21b is in direct contact with the edge E2a e It is positioned to indirectly cover the side 3a and to directly cover the edge E2a of the second electrode layer E2. e A portion of this is indirectly covered by the membrane portion 21b. In the multilayer capacitor C16, the second electrode layer E2 of electrode portion 5a is formed to cover the entire first electrode layer E1 of electrode portion 5a. The second electrode layer E2 of electrode portion 5c is formed to cover the entire first electrode layer E1 of electrode portion 5c.

[0084] Even in the multilayer capacitor C16, when metal ions are generated within the second electrode layer E2 of electrode section 5c due to the electric field between the internal electrodes 7 and 9 and the second electrode layer E2 of electrode section 5c, which is not electrically connected to the internal electrodes 7 and 9, the metal ions are less likely to move from the second electrode layer E2 of electrode section 5c. In other words, the film portion 21a restricts the movement of metal ions. As a result, the multilayer capacitor C16 suppresses the occurrence of migration. Even when metal ions are generated within the second electrode layer E2 of electrode section 5a due to the electric field between the internal electrodes 7A and 9A and the second electrode layer E2 of electrode section 5a, which is not electrically connected to the internal electrodes 7A and 9A, the metal ions are less likely to move from the second electrode layer E2 of electrode section 5a. In other words, the film portion 21b restricts the movement of metal ions. As a result, the multilayer capacitor C16 further suppresses the occurrence of migration.

[0085] (Second embodiment) The configuration of the multilayer capacitor C2 according to the second embodiment will be described with reference to Figures 20 to 22. Figure 20 is a perspective view of the multilayer capacitor according to the second embodiment. Figures 21 and 22 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to the second embodiment. The multilayer capacitor C2 is generally similar to or the same as the multilayer capacitor C1, but the multilayer capacitor C2 differs from the multilayer capacitor C1 in terms of the configuration of the second electrode layer E2. The multilayer capacitor C2 differs from the multilayer capacitor C1 in that it does not have an insulating film 21. The differences between the multilayer capacitor C1 and the multilayer capacitor C2 will be mainly described below. In this embodiment as well, the electronic component is, for example, the multilayer capacitor C2.

[0086] As shown in Figures 20 to 22, the multilayer capacitor C2 comprises a base body 3, a plurality of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. The multilayer capacitor C2 does not have the insulating film 21 that the multilayer capacitor C1 had. In this embodiment, the multilayer capacitor C2 has a pair of external electrodes 5. The external electrode 5 has multiple electrode sections 5a, 5c, and 5e. Each electrode section 5a and 5c has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. Each electrode section 5e has a first electrode layer E1 and a third electrode layer E3.

[0087] The second electrode layer E2 of the electrode portion 5c is located on the side surface 3c. Each second electrode layer E2 located on the same side surface 3c has an edge E2c e It has the edge E2c of one of the second electrode layers E2 on the same side surface 3c. e This is the edge E2c of the other second electrode layer E2. e It is in opposition to that. In the electrode portion 5c, each second electrode layer E2 includes region E2c1 and region E2c2. Region E2c2 has a more pronounced edge than region E2c1. e It is located close to the edge, and also on edge E2c e It contains. The content of metal particles in region E2c2 is less than the content of metal particles in region E2c1. For example, the content of metal particles in region E2c2 is less than 30 vol%. For example, the content of metal particles in region E2c1 is 30 vol% or more. In this embodiment, the content of metal particles in region E2c2 is about 25 vol%, and the content of metal particles in region E2c1 is about 50 vol%.

[0088] The second electrode layer E2 of the electrode portion 5a is located on the side surface 3a. Each second electrode layer E2 located on the same side surface 3a has an edge E2a e It has the edge E2a of one of the second electrode layers E2 on the same side surface 3a. e This is the edge E2a of the other second electrode layer E2. e It is in opposition to that. In electrode portion 5a, each second electrode layer E2 includes region E2a1 and region E2a2. Region E2a2 has a more pronounced edge than region E2a1. e It is located close to the edge, and also on edge E2a eIt contains. The content of metal particles in region E2a2 is less than the content of metal particles in region E2a1. For example, the content of metal particles in region E2a2 is less than 30 vol%. For example, the content of metal particles in region E2a1 is 30 vol% or more. In this embodiment, the content of metal particles in region E2a2 is about 25 vol%, and the content of metal particles in region E2a1 is about 50 vol%.

[0089] For example, if region E2c1 constitutes the first region, then region E2c2 constitutes the second region, region E2a1 constitutes the third region, and region E2a2 constitutes the fourth region. For example, if the content of metal particles in region E2c1 constitutes the first content, then the content of metal particles in region E2c2 constitutes the second content, the content of metal particles in region E2a1 constitutes the third content, and the content of metal particles in region E2a2 constitutes the fourth content.

[0090] The width W4 of region E2c2 is 5% or more of the width W2, as shown in Figure 21. The width W4 is the length of region E2c2 in the first direction D1. The width W5 of region E2a2 is 5% or more of the width W2, as shown in Figure 22. Width W5 is the length of region E2a2 in the first direction D1. Width W5 may be equal to or different from width W4.

[0091] In the multilayer capacitor C2, the electrode portion 5c has a second electrode layer E2. Therefore, like the multilayer capacitor C1, the multilayer capacitor C2 suppresses the occurrence of cracks in the substrate 3. In the multilayer capacitor C2, the electrode portion 5a has a second electrode layer E2. Therefore, like the multilayer capacitor C1, the multilayer capacitor C2 further suppresses the occurrence of cracks in the substrate 3.

[0092] In the multilayer capacitor C2, region E2c2 is the edge E2c of the second electrode layer E2 included in the electrode portion 5c. eThe metal particle content in region E2c2 is smaller than that in region E2c1. Even when metal ions are generated in the second electrode layer E2 of electrode section 5c due to the electric field generated between the internal electrodes 7,9 and the second electrode layer E2 of electrode section 5c, which is not electrically connected to the internal electrodes 7,9, the amount of metal ions generated in region E2c2 is less than in region E2c1. Therefore, the amount of metal ions moving from the second electrode layer E2 of electrode section 5c is less in the multilayer capacitor C2 compared to a configuration where the second electrode layer E2 of electrode section 5c is composed of region E2c1. As a result, the multilayer capacitor C2 suppresses migration.

[0093] In the multilayer capacitor C2, region E2a2 is the edge E2a of the second electrode layer E2 included in the electrode portion 5a. e The metal particle content in region E2a2 is smaller than the metal particle content in region E2a1. Even when metal ions are generated in the second electrode layer E2 of electrode section 5a due to the electric field generated between the internal electrodes 7A and 9A and the second electrode layer E2 of electrode section 5a, which is not electrically connected to the internal electrodes 7A and 9A, the amount of metal ions generated in region E2a2 is less than in region E2a1. Therefore, the amount of metal ions moving from the second electrode layer E2 of electrode section 5a is less in the multilayer capacitor C2 compared to a configuration where the second electrode layer E2 of electrode section 5a is composed of region E2a1. As a result, the multilayer capacitor C2 further suppresses the occurrence of migration.

[0094] The second electrode layer E2 contains multiple silver particles. Silver particles are more prone to migration than, for example, copper particles. The multilayer capacitor C2 reliably suppresses migration even when the second electrode layer E2 contains multiple silver particles.

[0095] Next, with reference to Figure 23, the configuration of the multilayer capacitor C21 according to a modified example of the second embodiment will be described. Figure 23 is a diagram showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor C21 according to this modified example is generally similar to or the same as the multilayer capacitor C2 described above, but this modified example differs from the second embodiment described above in terms of the configuration of the electrode portion 5e. The differences between the second embodiment described above and this modified example will be mainly described below. In terms of the configuration of the electrode portion 5e, this modified example is similar to the multilayer capacitor C11 shown in Figure 7.

[0096] Each electrode portion 5e, like the multilayer capacitor C11, has a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The configuration in which the electrode portion 5e has a second electrode layer E2 relieves the stress acting on the solder fillet formed on the electrode portion 5e. Therefore, the multilayer capacitor C21 suppresses the occurrence of solder cracks.

[0097] Next, with reference to Figure 24, the configuration of the multilayer capacitor C22 according to a modified example of the second embodiment will be described. Figure 24 is a diagram showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor C22 according to this modified example is generally similar to or the same as the multilayer capacitor C2 described above, but this modified example differs from the second embodiment described above in terms of the configuration of the electrode portion 5a. The differences between the second embodiment described above and this modified example will be mainly described below. In terms of the configuration of the electrode portion 5a, this modified example is similar to the multilayer capacitor C12 shown in Figure 8.

[0098] The electrode portion 5a, like the electrode portion 5a of the multilayer capacitor C12, does not necessarily have a second electrode layer E2. In a configuration where the electrode portion 5a does not have a second electrode layer E2, the second electrode layer E2 and the internal electrodes 7 and 9, which are not electrically connected to each other, do not face each other in the second direction D2. Therefore, migration is further suppressed even in the multilayer capacitor C22.

[0099] Next, the configuration of the multilayer capacitor C23 according to a modified example of the second embodiment will be described with reference to Figures 25 to 27. Figures 25, 26, and 27 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor C23 according to this modified example is generally similar to or the same as the multilayer capacitor C2 described above, but this modified example differs from the second embodiment described above in terms of the configuration of the internal electrodes 7A and 9A. The differences between the second embodiment described above and this modified example will be mainly described below. This modified example is similar to the multilayer capacitor C13 shown in Figures 9 to 11 in terms of the configuration of the internal electrodes 7A and 9A.

[0100] In the multilayer capacitor C23, similar to the multilayer capacitor C13, lengths L11 and L12 are greater than lengths L21 and L22. In the multilayer capacitor C23, length L21 is from the reference plane PL1 to the edge E2a of the second electrode layer E2 which is electrically connected to the internal electrode 7A. e The length in the first direction D1 is from the reference plane PL2 to the edge E2a of the second electrode layer E2 which is electrically connected to the internal electrode 9A. e This is the length in the first direction D1 up to [the specified point]. Therefore, although the internal electrodes 7A and 9A and the internal electrodes 7 and 9 adjacent in the second direction D2, and the second electrode layer E2 included in the electrode portion 5a adjacent to the internal electrodes 7A and 9A in the second direction D2, are not electrically connected to each other, they are unlikely to face each other in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7 and 9, which are not electrically connected to each other. Lengths L11 and L12 are smaller than lengths L31 and L32. In the multilayer capacitor C23, length L31 is from the reference plane PL1 to the edge E2a of the second electrode layer E2, to which the internal electrode 7A is not electrically connected. e The length in the first direction D1 is up to the reference plane PL2, and the length L32 is from the edge E2a of the second electrode layer E2, where the internal electrode 9A is not electrically connected. eThis is the length in the first direction D1 up to [the specified point]. Therefore, the internal electrodes 7A and 9A are unlikely to face the second electrode layer E2, which is included in the electrode portion 5a to which the internal electrodes 7A and 9A are not electrically connected, in the second direction D2. An electric field is unlikely to be generated between the second electrode layer E2 and the internal electrodes 7A and 9A, which are not electrically connected to each other. As a result, the multilayer capacitor C23 further suppresses the occurrence of migration. Therefore, the second electrode layer E2 included in the electrode portion 5a does not need to have region E2a2. Although not shown in the figure, the second electrode layer E2 included in the electrode portion 5a may have region E2a2.

[0101] Next, the configuration of the multilayer capacitor C24 according to a modified example of the second embodiment will be described with reference to Figures 28 to 30. Figures 28, 29, and 30 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor C24 according to this modified example is generally similar to or the same as the multilayer capacitor C23 shown in Figures 25 to 27, however, this modified example differs from the multilayer capacitor C23 with respect to the configuration of each conductor 11, 13. The differences between the multilayer capacitor C23 and this modified example will be mainly described below. This modified example is similar to the multilayer capacitor C14 shown in Figures 12 to 14 with respect to the configuration of each conductor 11, 13.

[0102] The multilayer capacitor C24, like the multilayer capacitor C14, has a pair of conductors 11 and 13. In Figures 29 and 30, for illustrative purposes, each internal electrode 7A, 9A and each conductor 11 and 13 are intentionally shown in a third direction D3. In the multilayer capacitor C24 as well, conductors 11 and 13 constitute dummy conductors that do not contribute much to the formation of capacitance. In the multilayer capacitor C24, similar to the multilayer capacitor C14, the conductor 11 is located between the second electrode layer E2 and the internal electrode 7A, which is not electrically connected to the second electrode layer E2. Therefore, even if an electric field is generated between the second electrode layer E2 and the internal electrode 7A, which is not electrically connected to the second electrode layer E2, the strength of the electric field is small. The conductor 13 is located between the second electrode layer E2 and the internal electrode 9A, which is not electrically connected to the second electrode layer E2. Therefore, even if an electric field is generated between the second electrode layer E2 and the internal electrode 9A, which is not electrically connected to the second electrode layer E2, the strength of the electric field is small. As a result, the multilayer capacitor C24 further suppresses the occurrence of migration. Therefore, the second electrode layer E2 included in the electrode portion 5a does not need to have region E2a2. Although not shown in the figure, the second electrode layer E2 included in the electrode portion 5a may have region E2a2.

[0103] Next, the configuration of the multilayer capacitor C25 according to a modified example of the second embodiment will be described with reference to Figures 31 to 33. Figures 31, 32, and 33 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to a modified example of the second embodiment. The multilayer capacitor according to this modified example is generally similar to or the same as the multilayer capacitor C24 shown in Figures 28 to 30, however, this modified example differs from the multilayer capacitor C24 with respect to the configuration of each conductor 11, 13. The differences between the multilayer capacitor C24 and this modified example will be mainly described below. This modified example is similar to the multilayer capacitor C15 with respect to the configuration of each conductor 11, 13.

[0104] In the multilayer capacitor C25, parts 11a and 11b are a single unit. Conductor 11 has no ends exposed on the surface of the element 3. Conductor 11 is not connected to any of the external electrodes 5. That is, conductor 11 is not electrically connected to the second electrode layer E2. Parts 13a and 13b are a single unit. Conductor 13 has no ends exposed on the surface of the element 3. Conductor 13 is not connected to any of the external electrodes 5. In other words, conductor 13 is not electrically connected to the second electrode layer E2. In the multilayer capacitor C25, the second electrode layer E2 included in the electrode portion 5a does not necessarily have a region E2a2. Although not shown in the figure, the second electrode layer E2 included in the electrode portion 5a may have a region E2a2.

[0105] While embodiments of the present invention have been described above, the present invention is not necessarily limited to the embodiments described above, and various modifications are possible without departing from the spirit of the invention.

[0106] In the modified examples shown in Figures 8 to 19 and Figures 24 to 33, the electrode portion 5e may have a second electrode layer E2, similar to the modified examples shown in Figures 7 and 23.

[0107] In this embodiment and its modified examples, multilayer capacitors C1, C11-C16, C2, C21-C25 were used as examples of electronic components, but the applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, or multilayer composite components, or electronic components other than multilayer electronic components. [Explanation of Symbols]

[0108] 3...Element body, 3a,3c...Side surface, 3e...End surface, 5...External electrode, 5a,5c,5e...Electrode part, 7,9,7A,9A...Internal electrode, 11,13...Conductor, 21...Insulating film, 21a,21b...Membrane part, C1, C11~C16 ,C2,C21~C25...Multilayer capacitor, D1...First direction, D2...Second direction, D3...Third direction, E1...First electrode layer, E2...Second electrode layer, E2a1,E2a2,E2c1,E2c2...Second electrode layer area, E2a e ,E2c e ...Edge of the second electrode layer, E3...Third electrode layer, PL1, PL2...Reference planes

Claims

1. A base body having a rectangular parallelepiped shape, with a pair of end faces facing each other in a first direction, a pair of first sides facing each other in a second direction, and a pair of second sides facing each other in a third direction, The material includes a sintered metal layer, a conductive resin layer formed to directly cover the edge of the sintered metal layer, and a plating layer formed to directly cover the conductive resin layer, and a plurality of external electrodes arranged on both ends of the base body in the first direction, A plurality of internal electrodes are arranged within the body so as to be aligned in the second direction, and are electrically connected to a corresponding external electrode among the plurality of external electrodes, The substrate comprises an insulating film disposed on the substrate, Each external electrode has a pair of first electrode portions, each arranged on the pair of second sides and including the conductive resin layer and the plating layer, and a pair of second electrode portions, each arranged on the pair of first sides and not including the conductive resin layer. In each of the pair of first electrode portions, the conductive resin layer, which is formed to directly cover the edge of the sintered metal layer, directly covers the second side surface. The insulating film has film portions arranged on the second surface and the conductive resin layer along the edge of the conductive resin layer contained in each of the first electrode portions, and continuously covering the edge and the region exposed from the external electrode on the second surface, and is not arranged on the pair of first surfaces. An electronic component wherein, in each of the pair of first electrode portions, the plating layer is formed in the region exposed from the film portion of the conductive resin layer.

2. A base body having a rectangular parallelepiped shape, with a pair of end faces facing each other in a first direction, a pair of first sides facing each other in a second direction, and a pair of second sides facing each other in a third direction, The material includes a sintered metal layer, a conductive resin layer formed to directly cover the edge of the sintered metal layer, and a plating layer formed to directly cover the conductive resin layer, and a plurality of external electrodes arranged on both ends of the base body in the first direction, A plurality of internal electrodes are arranged within the body so as to be aligned in the second direction, and are electrically connected to a corresponding external electrode among the plurality of external electrodes, The substrate comprises an insulating film disposed on the substrate, Each external electrode has a pair of first electrode portions, each arranged on the pair of second sides and including the conductive resin layer and the plating layer, and a pair of second electrode portions, each arranged on the pair of first sides and including the conductive resin layer. In each of the pair of first electrode portions, the conductive resin layer, which is formed to directly cover the edge of the sintered metal layer, directly covers the second side surface. The insulating film has film portions arranged on the second surface and the conductive resin layer along the edge of the conductive resin layer contained in each of the first electrode portions, and continuously covering the edge and the region exposed from the external electrode on the second surface, and is not arranged on the pair of first surfaces. In each of the pair of first electrode portions, the plating layer is formed in the region exposed from the film portion of the conductive resin layer. In the two conductive resin layers located on the same first surface, one of the conductive resin layers has an edge facing the other conductive resin layer. Of the plurality of internal electrodes, the outermost internal electrode located furthest outward in the second direction is adjacent in the second direction to the second electrode portion to which the outermost internal electrode is electrically connected. An electronic component wherein, with the surface including the end face on which the outermost inner electrode is exposed as a reference plane, the first length of the outermost inner electrode in the first direction from the reference plane is greater than the second length in the first direction from the reference plane to the edge of the conductive resin layer to which the outermost inner electrode is electrically connected and which is included in the second electrode portion, and is less than the third length from the reference plane to the edge of the conductive resin layer to which the outermost inner electrode is not electrically connected and which is included in the second electrode portion.

3. The system further comprises a dummy conductor located in the same layer as the outermost inner electrode and spaced apart from the outermost inner electrode, The electronic component according to claim 2, wherein the dummy conductor is electrically connected to the outermost inner electrode, which is located in the same layer as the dummy conductor, and is not electrically connected to the outermost inner electrode.

4. A base body having a rectangular parallelepiped shape, with a pair of end faces facing each other in a first direction, a pair of first sides facing each other in a second direction, and a pair of second sides facing each other in a third direction, The material includes a sintered metal layer, a conductive resin layer formed to directly cover the edge of the sintered metal layer, and a plating layer formed to directly cover the conductive resin layer, and a plurality of external electrodes arranged on both ends of the base body in the first direction, A plurality of internal electrodes are arranged within the body so as to be aligned in the second direction, and are electrically connected to a corresponding external electrode among the plurality of external electrodes, An insulating film disposed on the aforementioned substrate, Each comprises a pair of dummy conductors adjacent to the corresponding first side of the pair of first sides in the second direction, Each external electrode has a pair of first electrode portions, each arranged on the pair of second sides and including the conductive resin layer and the plating layer, and a pair of second electrode portions, each arranged on the pair of first sides and including the conductive resin layer. In each of the pair of first electrode portions, the conductive resin layer, which is formed to directly cover the edge of the sintered metal layer, directly covers the second side surface. The insulating film has film portions arranged on the second surface and the conductive resin layer along the edge of the conductive resin layer contained in each of the first electrode portions, and continuously covering the edge and the region exposed from the external electrode on the second surface, and is not arranged on the pair of first surfaces. In each of the pair of first electrode portions, the plating layer is formed in the region exposed from the film portion of the conductive resin layer. Each of the dummy conductors is an electronic component in which the internal electrode adjacent to the dummy conductor in the second direction is not electrically connected to the dummy conductor and the conductive resin layer contained in the second electrode portion is facing the second electrode portion in the second direction.

5. The electronic component according to any one of claims 1 to 4, wherein each of the external electrodes further has an electrode portion that is arranged on the end face and includes a conductive resin layer.

6. The electronic component according to any one of claims 1 to 5, wherein the conductive resin layer contains a plurality of silver particles.

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