Method for cleaning semiconductor chips

Abstract

To provide a semiconductor chip oriented cleaning method.SOLUTION: The present invention provides a semiconductor chip oriented cleaning method, and can improve the cleaning effect and efficiency by thoroughly cleaning till the depth of each gap between chips and at the same time shorten the cleaning time. This method includes the following steps: (step 1) at least two nozzles are set and each aims to the gap between chips in a clean area; (step 2) the nozzles are moved synchronously along a chip arrangement direction and clean the gap; (step 3) after the gap between the chips is cleaned, the cleaning is terminated if the adjacent clean area does not exist, and if the adjacent clean area exists, the nozzles are moved synchronously to aim the gap between the chips in the clean area; and (step 4) step 2 and step 3 are repeated and the cleaning of the gaps between all the chips is finished. A nozzle used at the cleaning in each step is a fluid nozzle.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductors, and particularly to a semiconductor chip-oriented cleaning method that is applied to conveying equipment and performs cleaning operations when transferring chips from one process to another.

Background Art

[0002] In the microelectronics manufacturing process, the cleaning of semiconductor chips is an extremely important step. As semiconductor technology progresses, especially as the line width of integrated circuits (ICs) continues to shrink, the cleanliness requirements for the chip surface are increasing. Even slight contamination can cause a decrease in chip performance or product failure, so developing an effective, reliable, and economical cleaning technology is an important research topic in the semiconductor manufacturing industry.

[0003] As a conventional cleaning method, wet cleaning uses various chemical solvents and water to clean the chips. Although it can remove various impurities, it is harmful to the environment because it uses a large amount of chemical solvents, and in the cleaning of ultra-fine structures, the accuracy is insufficient, and it cannot completely remove microparticles and contaminants, which may cause chip damage or performance degradation.

[0004] Dry cleaning (such as plasma cleaning) removes surface contaminants with active species generated by plasma. Although the environmental impact is small, there is a risk of damaging the chip surface, and when contaminants are firmly attached, the removal effect is limited.

[0005] Rotary cleaning removes the chemical solution on the chip by centrifugal force, but the cleaning effect is non-uniform depending on the position of the chip. In particular, the centrifugal force weakens near the center, resulting in insufficient cleaning. Furthermore, high-speed rotation is required for effective cleaning, which increases the scattering of the chemical solution, lengthens the cleaning time, and raises the cost of consumables.

Summary of the Invention

Problems to be Solved by the Invention

[0006] Based on the above, the present invention aims to provide a semiconductor chip-oriented cleaning method that penetrates deeply into each gap between chips to thoroughly clean them, improving cleaning effectiveness and efficiency while shortening cleaning time and reducing environmental impact. It also aims to improve upon the limitations of conventional high-precision chip cleaning and provide a highly efficient and comprehensive cleaning solution to the semiconductor manufacturing industry. [Means for solving the problem]

[0007] To solve the above problems and achieve the objectives of the present invention, the technical means of the present invention are as follows: A semiconductor chip-oriented cleaning method used to clean an object to be cleaned that is transported on a conveyor belt by a jig. The jig has at least one clean area, and the object to be cleaned includes at least one substrate and at least one chip, and the object to be cleaned is placed in the clean area, and a gap is formed between the chip and the substrate. The method includes the following steps: Step 1, set up at least two nozzles and each target the chip gap in the clean area. Step 2, move the nozzles synchronously along the direction of the chip arrangement to clean the gap. Step 3, after cleaning the chip gap is complete, if there is no adjacent clean area, the cleaning is terminated, and if there is an adjacent clean area, move the nozzles synchronously to target the chip gap in that area. Step 4, repeat Step 2 and Step 3 to clean all chip gaps. The nozzles used in each of the above steps are fluid nozzles.

[0008] In the above-described technical means, the number of washes in step two is either a single unidirectional wash or multiple reciprocating washes.

[0009] In the above-described technical means, the nozzle pressure is 5-125 kgf / cm². 2 Let's assume that.

[0010] In the above-described technical means, the nozzle is made adjustable in the direction of the gap, and the angle is set to 20 to 90 degrees.

[0011] In the above-described technical means, the nozzle is detachable to facilitate replacement or adjustment.

[0012] In the above-described technical means, the chip is positioned on the substrate by flux. [Effects of the Invention]

[0013] When the technical means of the present invention are employed, the following effects are obtained compared to the prior art: Firstly, the present invention cleans chips when they are transferred between processes during the semiconductor manufacturing process, accurately and efficiently cleaning the narrow gaps between chips after cutting, improving the efficiency of the production line and the quality of chip processing, shortening cleaning time, and reducing the use of chemical cleaning solutions, thereby reducing the environmental impact.

[0014] Secondly, in step two, the nozzle penetrates deeply into each narrow gap in the tip, allowing the cleaning solution to reach every corner of the tip, thoroughly cleaning the gaps, reducing contaminant residue, and improving product yield.

[0015] Thirdly, using a fluid nozzle allows for uniform distribution of the cleaning solution, improving the uniformity, penetration, and quality of cleaning, especially in narrow gaps, and reducing the risk of contaminant residue.

[0016] Fourth, the semiconductor chip-oriented cleaning method of the present invention reduces the amount of cleaning solution and other consumables used, thereby reducing waste and lowering costs.

[0017] Fifth, the semiconductor chip-oriented cleaning method of the present invention can be applied to chips of different sizes and types, has high adaptability, and can be widely applied to various semiconductor manufacturing processes. [Brief explanation of the drawing]

[0018] [Figure 1] This figure shows a local plane of the present invention. [Figure 2] This diagram shows the flow chart of the present invention. [Figure 3] This figure shows a single row of chips in a clean area according to the present invention. [Figure 4] This figure shows the operation of single-row tip cleaning within the clean zone according to the present invention. [Figure 5] This is a diagram showing the operation of single-row chip cleaning within the clean area in the present invention. [Figure 6] This is a diagram showing the operation of multi-row chip cleaning within the clean area in the present invention. [Figure 7] This is a diagram showing the operation of nozzle angle adjustment in the present invention.

Embodiments for Carrying out the Invention

[0019] Hereinafter, the present invention will be described in more detail in combination with specific embodiments and accompanying drawings.

[0020] As shown in FIGS. 1 to 5, the semiconductor chip-oriented cleaning method of the present invention is used to clean the object to be cleaned (30) conveyed by the jig (20) arranged on the conveyor belt (10). The jig (20) is provided with at least one clean area (60). The object to be cleaned (30) includes at least one substrate (301) and at least one chip (302). The object to be cleaned (30) is arranged within the clean area (60), and a gap (303) is formed between the chip (302) and the substrate (301). This method includes the following steps.

[0021] Step One (1), set at least two nozzles (40), and aim at the gaps (303) between the chips (302) within the clean area (60) respectively.

[0022] Step Two (2), synchronously move the nozzles (40) along the arrangement direction of the chips (302) to clean the gaps (303). Step Three (3), after finishing cleaning the gaps (303) between the chips (302), if there is no adjacent clean area (60), end the cleaning. If there is an adjacent clean area (60), synchronously move the nozzles (40) to aim at the gaps (303) between the chips (302) within the clean area (60).

[0023] Step Four (4), repeat Step Two (2) and Step Three (3) until all the gaps (303) between the chips (302) are cleaned.

[0024] The nozzle (40) used in each of the above steps is a fluid nozzle.

[0025] Here, by performing step two (2), the nozzle (40) penetrates deeply into all the narrow gaps (303) of the tip (302), and the cleaning solution reaches every corner of the tip (302), allowing for effective cleaning of the gaps (303). This improves the cleaning effect and allows for thorough cleaning of the gaps (303), reducing the residue of contaminants and contributing to improved product yield.

[0026] Next, cleaning with the fluid nozzle (40) allows for more uniform distribution of the cleaning solution, improving the uniformity, penetration, and quality of cleaning, especially in the narrow gaps (303) of the tip (302), and reducing the risk of contaminant residue.

[0027] Furthermore, by implementing steps 1 through 4, the entire cleaning process can be completed in a short time, saving time and improving production efficiency. In addition, the high efficiency and precision of the cleaning process reduce the amount of cleaning fluid and other consumables used, resulting in reduced waste and costs.

[0028] In addition, the semiconductor chip-oriented cleaning method of the present invention can be applied to chips (302) of different sizes and types, has high adaptability, and can be widely applied to various semiconductor manufacturing processes.

[0029] Specifically, the cleaning flow of the present invention is as follows: First, two nozzles (40) are set up and precisely targeted to the gaps (303) between the tips (302) in the clean area (60) to ensure that all gaps (303) are cleaned. Next, the nozzles (40) are moved synchronously along the direction of the arrangement of the tips (302) to uniformly and thoroughly clean the gaps (303) and remove accumulated dust and contaminants. After cleaning the gaps (303) between the tips (302) in the clean area (60) is complete, the presence or absence of an adjacent clean area (60) is checked. If there is no adjacent clean area (60), cleaning is terminated. If there is an adjacent clean area (60), the nozzles (40) are moved synchronously and targeted to that gap (303). Finally, steps two (2) and three (3) are repeated until all the gaps (303) between the tips (302) in the clean areas (60) are completely cleaned.

[0030] As mentioned above, the pressure of the nozzle (40) is 5-125 kgf / cm². 2 Within this pressure range, the nozzle (40) generates sufficient force, exhibiting a high cleaning effect even in minute gaps and hard-to-reach areas.

[0031] Next, the nozzle pressure (40) can be adjusted according to the degree and type of contamination of the tip (302). Low pressure can be used for light contamination, and high pressure for stubborn contamination, allowing for various levels of contamination to be addressed.

[0032] Furthermore, the pressure was increased to 125 kgf / cm². 2 By controlling the following, the risk of excessively damaging the tip (302) during the cleaning process can be avoided. Appropriate pressure ensures that the cleaning solution is uniformly distributed to all gaps (303) in the tip (302), improving cleaning uniformity and penetration even in narrow or irregular spaces.

[0033] As described above, the nozzle (40) is detachable, making it easy to replace and adjust. This simplifies cleaning and maintenance of the nozzle (40) and ensures highly efficient operation. In addition, in the event of a malfunction, only the nozzle (40) can be replaced, reducing maintenance costs and downtime. Furthermore, different types and sizes of nozzles (40) can be quickly replaced, flexibly accommodating diverse cleaning needs and the size, shape, and material of the tip (302), ensuring that cleaning is always performed under optimal conditions.

[0034] As described above, the chip (302) is positioned on the substrate (301) by the flux (50). The use of flux (50) improves the bonding strength between the chip (302) and the substrate (301), ensuring the precise positioning of the chip (302) during the manufacturing process and increasing assembly accuracy. Furthermore, flux (50) has excellent thermal conductivity, uniformly distributing heat to each soldering area during heating, preventing solder defects due to uneven heat distribution. In addition, the chemical components of flux (50) react with and dissolve oxides on the surface of the chip (302), reducing residue and decreasing the need for post-processing cleaning, saving time and resources and improving production speed and efficiency.

[0035] As shown in Figures 4 and 5, the number of washes in step two (2) is either a single unidirectional wash (see Figure 4) or multiple reciprocating washes (see Figure 5). This allows for the selection of the optimal number of washes according to the type of contaminant and the specific needs of the tip (302), thereby reducing the risk of tip (302) damage.

[0036] As shown in Figure 6, the present invention enables synchronous cleaning of multi-row chips (302) within a clean area (60). By moving two or more nozzles (40) along the arrangement direction of the multi-row chips (302), multiple chips are cleaned simultaneously, improving cleaning efficiency.

[0037] As shown in Figure 7, the nozzle (40) can be tilted in the direction of the gap (303), with an angle (a) of 20 to 90 degrees. By adjusting the tilt angle of the nozzle (40), the coverage area of ​​the cleaning solution can be expanded, allowing for direct targeting of the contaminated area, thus improving cleaning efficiency, shortening cleaning time, and saving resources and costs.

[0038] The above examples illustrate the present invention and do not limit its scope. All equivalent changes or modifications made based on the structure, features and principles described in the claims of the present invention are included within the scope of the claims of the present invention. [Explanation of Symbols]

[0039] Step 1 Step 2 3 Steps 4 Step 4 10 Conveyor Belts 20 jigs 30 Items to be washed 301 circuit board 302 chips 303 Gap 40 nozzles 50 flux 60 Clean Areas a angle

Claims

1. A method for cleaning an object to be cleaned (30) that is transported on a conveyor belt (10) by a jig (20), The jig (20) has at least one clean area (60), The object to be cleaned (30) includes at least one substrate (301) and at least one chip (302), The object to be washed (30) is located within the clean area (60), A gap (303) is formed between the chip (302) and the substrate (301). Step 1 (1) involves setting up at least two nozzles (40) and aiming each of them at the gap (303) between the tips (302) within the clean area (60), Step two (2) involves moving the nozzle (40) synchronously along the arrangement direction of the tips (302) to clean the gap (303), Step three (3) is performed after the cleaning of the gaps (303) between the tips (302) is completed, if there are no adjacent clean areas (60), the cleaning is terminated, and if there are adjacent clean areas (60), the nozzle (40) is moved synchronously and targeted to the gaps (303) of the tips (302) within the clean areas (60), Step two (2) and step three (3) are repeated until all gaps (303) between the tips (302) are cleaned, and step four (4) is also included. A semiconductor chip-directed cleaning method characterized in that the nozzle (40) used in each of the above steps is a fluid nozzle.

2. The semiconductor chip-directed cleaning method according to claim 1, wherein the number of cleaning cycles in step two (2) is either a primary unidirectional cleaning or multiple reciprocating cleaning cycles.

3. The pressure of the nozzle (40) is 5-125 kgf / cm². ２ The semiconductor chip-directed cleaning method according to claim 1.

4. The nozzle (40) is adjustable in inclination angle toward the gap (303); The semiconductor chip-directed cleaning method according to claim 3, wherein the angle (a) of the nozzle (40) is 20 to 90 degrees.

5. The semiconductor chip-directed cleaning method according to claim 4, wherein the nozzle (40) is detachable and easily replaceable or adjustable.

6. The semiconductor chip-directed cleaning method according to claim 1, wherein the chip (302) is positioned on the substrate (301) by flux (50).

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