Semiconductor chip tilt cleaning method

Abstract

To provide a semiconductor chip inclination cleaning method which improves a cleaning effect, reduces a risk of contaminant residue, realizes waste reduction and cost reduction, and has high adaptability.SOLUTION: A method comprises: a step 1 of inclining a jig downwards to one side in a conveyor belt conveying direction; a step 2 of setting at least two nozzles and aiming chip gaps in a clean area; a step 3 of cleaning the gap of the nozzles along the array direction of the chips; a step 4 of, after cleaning is completed, ending cleaning if there is no adjacent clean area and synchronously moving the nozzles if there is an adjacent clean area and aiming the chip gaps in the area; a step 5 of repeating the steps 2 and 3 and continuing until all chip gaps are cleaned; and a step 6 of returning the jig to a horizontal state, then inclining the jig downward in a direction opposite to the conveyor belt conveying direction, and repeating the steps 2 to 5 to clean all chip gaps again. The nozzle used is a fluid nozzle.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductors, and particularly to a semiconductor chip inclined cleaning method that is applied to a transfer device and performs cleaning when transferring a chip from one process to another process.

Background Art

[0002] In the microelectronics manufacturing process, the cleaning of semiconductor chips is an extremely important process. As semiconductor technology progresses, especially as the line width of integrated circuits (ICs) continues to shrink, the cleanliness requirements for the chip surface are increasing. Even minute contaminants can cause a decrease in chip performance and product defects. Therefore, the development of cleaning technology that combines effectiveness, reliability, and economy is an important research topic in the semiconductor manufacturing industry.

[0003] Wet cleaning, a conventional cleaning method, uses various chemical solvents and water to clean chips and can remove various impurities. However, due to the use of a large amount of chemical solvents, it has a large environmental impact. In addition, when cleaning extremely fine structures, the accuracy is insufficient, and fine particles and contaminants cannot be completely removed, resulting in chip damage or performance degradation.

[0004] Plasma cleaning, a type of dry cleaning, removes surface contaminants with active species generated by plasma. Although it has a smaller environmental impact than wet cleaning, there is a risk of damaging the chip surface, and the removal effect is limited especially when contaminants are strongly attached.

[0005] Rotary cleaning removes the chemical solution on the chip by centrifugal force, but the cleaning effect is non-uniform at each part of the chip. Especially near the center of the chip, the centrifugal force is weak and the cleaning is insufficient. In addition, high-speed rotation is required for effective cleaning, resulting in an increase in the scattering of the chemical solution, a prolonged cleaning time, and an increase in the cost of consumables.

Summary of the Invention

Problems to be Solved by the Invention

[0006] Based on the above, the present invention provides a semiconductor chip tilting cleaning method that tilts the jig and substrate during the cleaning process to effectively clean the gap between the chip and the substrate, thereby improving cleaning efficiency and effectiveness. The aim is to improve upon the limitations of conventional high-precision chip cleaning and provide a more efficient and comprehensive cleaning solution for the semiconductor manufacturing industry. [Means for solving the problem]

[0007] To solve the above problems and achieve the objectives of the present invention, the following technical means are provided. The semiconductor chip tilt cleaning method is for cleaning an object to be cleaned that is transported on a conveyor belt by a jig. The jig has at least one clean area, and the object to be cleaned includes at least one substrate and at least one chip, and the object to be cleaned is placed within the clean area, with a gap formed between the chip and the substrate. The method includes the following steps: Step 1: The jig is tilted downward to one side in the conveyor belt transport direction. Step 2: At least two nozzles are set and each is aimed at a chip gap in the clean area. Step 3: The nozzles are moved synchronously along the chip arrangement direction to clean the gap. Step 4: After cleaning the chip gap, if there is no adjacent clean area, cleaning is terminated, and if there is an adjacent area, the nozzles are moved synchronously to aim at the chip gap in that area. Step 5: Steps 2 and 3 are repeated to clean all chip gaps. Step 6: After step 5 is completed, the jig is returned to a horizontal position, the jig is tilted downward to the opposite side of the conveyor belt transport direction, and steps 2 to 5 are repeated to clean all chip gaps again. The nozzle used in each step is a fluid nozzle.

[0008] In the above technical means, the jig inclination angle in steps one and six is ​​20 to 70 degrees.

[0009] In the above technical means, the number of washes in step three is either a single unidirectional wash or multiple reciprocating washes.

[0010] In the above technical means, the nozzle pressure is 5-125 kgf / cm². 2 That is the case.

[0011] In the above technical means, the nozzle is adjustable in inclination in the direction of the gap, and the angle is between 20 and 90 degrees.

[0012] In the above technical means, the nozzle is detachable and easily replaceable or adjustable.

[0013] In the above technical means, the chip is positioned on the substrate by flux. [Effects of the Invention]

[0014] By adopting the present invention's technical solution, the following effects can be obtained.

[0015] Firstly, by tilting the jig in steps one and six, the cleaning solution is effectively guided into the narrow gap between the chip and the substrate, allowing for uniform and thorough cleaning of the entire cleaning area, thereby improving the cleaning effect.

[0016] Secondly, by using a fluid nozzle, the cleaning solution can be distributed uniformly, improving the uniformity, penetration, and quality of cleaning, especially in narrow gaps, and reducing the risk of contaminant residue.

[0017] Thirdly, by tilting the jig, the amount of cleaning fluid and consumables used is reduced, resulting in reduced waste and lower costs.

[0018] Fourth, this method is applicable to chips of various sizes and types, possesses high adaptability, and can be widely applied to various semiconductor manufacturing processes. [Brief explanation of the drawing]

[0019] [Figure 1] This is a local plan view of the present invention. [Figure 2] This is a flowchart of the present invention. [Figure 3] This figure shows a single row of chips in the clean area according to the present invention. [Figure 4] This figure shows the operation of the jig during single-row chip cleaning with an inclined jig according to the present invention. [Figure 5] The figure shows the operation when the jig is tilted and single-row chips are being cleaned in the present invention. [Figure 6] The figure shows the operation when the jig is tilted and multi-row chips are being cleaned in the present invention. [Figure 7] The figure shows the operation when the jig is tilted and multi-row chips are being cleaned in the present invention. [Figure 8] The figure shows multi-row chips within the cleaning area in the present invention. [Figure 9] The figure shows the operation of adjusting the nozzle angle in the present invention.

Embodiments for Carrying Out the Invention

[0020] Hereinafter, the present invention will be described in more detail by combining specific embodiments and the accompanying drawings.

[0021] As shown in Figures 1 to 7, the semiconductor chip tilt cleaning method according to the present invention is for cleaning an object to be cleaned (30) that is transported on a conveyor belt (10) by a jig (20). The jig (20) has at least one clean area (60), and the object to be cleaned (30) includes at least one substrate (301) and at least one chip (302). The object to be cleaned (30) is placed within the clean area (60), and a gap (303) is formed between the chip (302) and the substrate (301). The method includes the following steps: Step 1 (1) The jig (20) is tilted downward toward the transport direction side of the conveyor belt (10). Step 2 (2) At least two nozzles (40) are set and each is aimed at the gap (303) between the chip (302) in the clean area (60). Step 3 (3): The nozzle (40) is moved synchronously along the arrangement direction of the chips (302) to clean the gaps (302). Step 4 (4): After cleaning the gaps (303) between the chips (302), if there are no adjacent clean areas (60), the cleaning is terminated. If there are adjacent clean areas (60), the nozzle (40) is moved synchronously to target the gaps (303) between the chips (302) within each clean area (60). Step 5 (5): Steps 2 (2) and 3 (3) are repeated to clean all the gaps (303) between the chips (302). Step 6 (6): After step 5 (5) is completed, the jig (20) is returned to a horizontal position, the jig (20) is tilted downwards in the opposite direction to the conveying direction of the conveyor belt (10), and steps 2 (2) through 5 (5) are repeated to clean all the gaps (303) between the chips (302).

[0022] The nozzle (40) used in the above step is a fluid nozzle, and the inclination angle of the jig (20) in step one (1) and step six (6) is 20 to 70 degrees.

[0023] Here, by tilting the jig (20) in step 1 (1) and step 6 (6), the cleaning fluid is effectively guided into the narrow gap (303) between the chip (302) and the substrate (301), allowing the entire clean area (60) to be cleaned uniformly and thoroughly, thus improving the cleaning effect. In addition, tilting the jig (20) reduces the amount of cleaning fluid and other consumables used, thereby reducing waste and lowering costs.

[0024] Next, cleaning with the fluid nozzle (40) ensures uniform distribution of the cleaning solution, particularly in the narrow gaps (303) of the tip (302), improving the uniformity, penetration, and quality of the cleaning, and reducing the risk of contaminant residue.

[0025] Furthermore, the semiconductor chip tilt cleaning method of the present invention has high adaptability because it can be applied to chips (302) of different sizes and types, and can be widely applied to various semiconductor manufacturing processes.

[0026] To specifically describe the cleaning flow of the present invention, first, the jig (20) is tilted toward the conveying direction of the conveyor belt (10), then at least two nozzles (40) are set up to accurately target the gaps (303) between the chips (302) in the clean area (60) and to ensure that each gap (303) is thoroughly cleaned. After that, the nozzles (40) are moved synchronously in the direction of the chip arrangement (302) to uniformly and completely clean the gaps (303) to remove dust and contaminants. Once cleaning in the clean area (60) is complete, the presence or absence of an adjacent clean area (60) is checked, and if there is none, cleaning is terminated, and if there is, the nozzles (40) are moved synchronously to target the gaps (303) between the chips (302) in that clean area (60). Steps two (2) and three (3) are repeated to completely clean all the gaps (303) between the chips (302) in all the clean areas (60). Finally, after step five (5) is completed, return the jig (20) to a horizontal position, tilt the jig (20) to the opposite side of the conveying direction of the conveyor belt (10), and repeat steps two (2) through five (5) to perform another thorough cleaning.

[0027] The pressure of the nozzle (40) is 5-125 kgf / cm². 2Within this range, the nozzle (40) exerts sufficient force to efficiently remove dirt from minute gaps and hard-to-reach areas. The pressure can be adjusted according to the degree of contamination and the type of tip (302), with low pressure for light contamination and high pressure for stubborn contamination. The pressure is set to 125 kgf / cm². 2 By controlling the following, the risk of damage to fragile or microstructured tips (302) can be reduced. Appropriate pressure ensures that the cleaning solution is uniformly distributed to all gaps (303) in the tip (302), improving cleaning uniformity and penetration even in narrow or irregular spaces.

[0028] The nozzle (40) is detachable and easy to replace or adjust, simplifying cleaning and maintenance of the nozzle (40) and ensuring highly efficient operation. Even if a nozzle (40) malfunctions, only the nozzle needs to be replaced, rather than the entire system, reducing maintenance costs and downtime. Furthermore, the nozzle (40) can be quickly swapped with different types and sizes, flexibly accommodating various cleaning needs and tip (302) sizes, shapes, and materials, ensuring optimal cleaning conditions at all times.

[0029] The chip (302) is positioned on the substrate (301) by flux (50). The use of flux (50) increases the bonding strength between the chip (302) and the substrate (301), ensuring the precise positioning of the chip (302) during the manufacturing process and improving assembly accuracy. Flux (50) has excellent thermal conductivity, uniformly transferring heat to each weld area during heating, preventing welding defects due to uneven heat distribution. In addition, the chemical components of flux (50) react with and dissolve oxides on the surface of the chip (302), reducing residue generation during the welding process, decreasing the need for subsequent cleaning, saving time and resources, and improving production speed and efficiency.

[0030] As shown in Figures 4 to 7, the number of washes in step three (3) is either a single unidirectional wash (see Figures 4 and 5) or multiple reciprocating washes (see Figures 6 and 7). Depending on the type of contaminant and the requirements of the tip (302), unidirectional or reciprocating washes can be selected to increase the flexibility of the wash. Unidirectional washes are sufficient for light contamination, while reciprocating washes allow for more thorough cleaning of stubborn contamination. By selecting the appropriate number of washes, the risk of tip (302) damage during the wash process is reduced, and the possibility of tip (302) breakage is effectively decreased.

[0031] As shown in Figure 8, the present invention enables synchronous cleaning of multiple rows of chips (302) within a clean area (60). By moving multiple nozzles (40) along the direction of the chip (302) arrangement, a large number of chips (302) within the clean area (60) are cleaned simultaneously, improving cleaning efficiency.

[0032] As shown in Figure 9, the nozzle (40) can be tilted in the direction of the gap (303), and the angle (a) of the nozzle (40) is 20 to 90 degrees. By adjusting the tilt angle of the nozzle (40), the coverage area of ​​the cleaning solution can be expanded, allowing for direct targeting of the contaminated area, thereby increasing cleaning efficiency, shortening cleaning time, saving resources, and reducing costs.

[0033] The above examples illustrate the present invention and do not limit its scope. All equivalent changes or modifications made based on the structures, features and principles described in the claims of the present invention are included within the scope of the claims of the present invention. [Explanation of Symbols]

[0034] Step 1 Step 2 3 Steps 4 Step 4 Step 5 6 Step 6 10 Conveyor Belts 20 jigs 30 Items to be washed 301 circuit board 302 chips 303 Gap 40 nozzles 50 flux 60 Clean Areas a angle

Claims

1. A method for cleaning an object to be cleaned (30) that is transported by a jig (20) placed on a conveyor belt (10), The jig (20) includes at least one clean area (60), The object to be cleaned (30) includes at least one substrate (301) and at least one chip (302), The object to be cleaned (30) is placed within the clean area (60). A gap (303) is formed between the chip (302) and the substrate (301). Step 1 (1) involves tilting the jig (20) downwards to one side in the conveying direction of the conveyor belt (10), Step two (2) involves setting up at least two nozzles (40) and aiming each of them at the gap (303) of the tip (302) within the clean area (60), Step three (3) involves moving the nozzle (40) synchronously along the arrangement direction of the tips (302) to clean the gap (303), Step four (4) is performed after cleaning the gap (303) of the tip (302) is complete, if there is no adjacent clean area (60), the cleaning is terminated, and if there is an adjacent clean area (60), the nozzle (40) is moved synchronously to aim at the gap (303) of the tip (302) within the clean area (60), Step two (2) and step three (3) are repeated, and step five (5) is performed to clean all of the chip (302) gaps (303), Step 6 includes, after the completion of step 5 (5), returning the jig (20) to a horizontal position, tilting the jig (20) downward toward the opposite direction from the conveying direction of the conveyor belt (10), repeating steps 2 (2) to 5 (5), and cleaning all the chip (302) gaps (303) again, A semiconductor chip tilt cleaning method characterized in that the nozzle (40) used in each of the above steps is a fluid nozzle.

2. The semiconductor chip tilt cleaning method according to claim 1, wherein the tilt angle of the jig (20) in step 1 (1) and step 6 (6) is 20 to 70 degrees.

3. The semiconductor chip tilt cleaning method according to claim 1, wherein the number of cleaning cycles in step three (3) is either a primary unidirectional cleaning or multiple reciprocating cleaning cycles.

4. The pressure of the nozzle (40) is 5-125 kgf / cm². ２ The semiconductor chip tilt cleaning method according to claim 1.

5. The nozzle (40) is adjustable in inclination angle in the direction of the gap (303), The semiconductor chip tilt cleaning method according to claim 4, wherein the angle (a) of the nozzle (40) is 20 to 90 degrees.

6. The semiconductor chip tilt cleaning method according to claim 5, wherein the nozzle (40) is detachable and can be easily replaced or adjusted.

7. The semiconductor chip tilt cleaning method according to claim 1, wherein the chip (302) is positioned on the substrate (301) by flux (50).

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