Substrate adsorption member, elastic seal assembly, top ring, and substrate processing apparatus

Abstract

To surely suck a substrate regardless of flatness of a sucked surface of a substrate.SOLUTION: A substrate suction member 330 includes: a porous member 334 having a substrate suction surface 334a for sucking a substrate WF and a decompression part 334b communicating with decompression means; a shielding member 332 having a first shielding member 332-1 for shielding a surface 334c opposite to the substrate suction surface 334a of the porous member 334, and a frame-like second shielding member 332-2 for shielding at least a part of a side face 334d of the porous member 334; and a frame-like elastic seal member 336 mounted on the second shielding member 332-2 so as to surround the porous member 334, and having a contact surface 336a brought into contact with the substrate WF.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] This application relates to a substrate adsorption member, an elastic seal assembly, a top ring, and a substrate processing apparatus.

Background Art

[0002] In the manufacture of semiconductor devices, a chemical mechanical polishing (CMP) apparatus is used to planarize the surface of a substrate. Substrates used in the manufacture of semiconductor devices are often disc-shaped. In addition to semiconductor devices, the requirement for flatness when planarizing the surface of square substrates such as CCL substrates (Copper Clad Laminate substrates), PCB (Printed Circuit Board) substrates, photomask substrates, and display panels is also increasing. Also, the requirement for planarizing the surface of a package substrate on which an electronic device such as a PCB substrate is arranged is also increasing.

[0003] A substrate processing apparatus such as a chemical mechanical polishing apparatus includes a top ring for holding a substrate. For example, as described in Patent Document 1, the top ring includes a rotation axis, a flange connected to the rotation axis, a porous suction plate fitted into an opening formed at the center of the lower surface of the flange, and a shielding plate attached to the upper surface of the suction plate. This top ring is configured to adsorb the substrate through the micropores of the suction plate by vacuum suction and press the substrate against the polishing pad by applying pressure to the shielding plate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Conventional top rings, such as those described in Patent Document 1, have room for improvement in terms of reliably adsorbing substrates regardless of the flatness of the substrate surface to be adsorbed.

[0006] In other words, conventional top rings can adsorb a substrate onto the suction plate by vacuum suction if the substrate's surface to be adsorbed is flat. However, if the surface to be adsorbed is not flat, for example, if a part of the outer periphery of the substrate's surface is recessed, air leaks occur from the gaps created by the recesses, weakening the suction force, and as a result, the substrate may not be able to be adsorbed onto the suction plate.

[0007] Therefore, one of the objectives of this invention is to reliably adsorb a substrate regardless of the flatness of the surface on which the substrate is to be adsorbed. [Means for solving the problem]

[0008] According to one embodiment, a substrate adsorption member is disclosed, which includes a porous member having a substrate adsorption surface for adsorbing a plate and a pressure reduction portion communicating with a pressure reduction means; a shielding member having a first shielding member that shields the surface of the porous member opposite to the substrate adsorption surface and a frame-shaped second shielding member that shields at least a part of the side surface of the porous member; and a frame-shaped elastic sealing member attached to the second shielding member so as to surround the porous member and having a contact surface that contacts the substrate. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view showing the overall configuration of a substrate processing apparatus according to one embodiment. [Figure 2] This is a perspective view illustrating the configuration of a polishing unit according to one embodiment. [Figure 3A] This is a schematic cross-sectional view showing a top ring of one embodiment. [Figure 3B] This is a schematic plan view showing a top ring of one embodiment. [Figure 4] This is a schematic cross-sectional view showing the top ring and substrate of one embodiment. [Figure 5] This is a schematic cross-sectional view showing a top ring of one embodiment. [Figure 6] This is a schematic cross-sectional view showing a magnified portion of the top ring of one embodiment. [Figure 7] This is a schematic cross-sectional view showing a magnified portion of the top ring of one embodiment. [Figure 8] This is a schematic perspective view showing the configuration of an elastic seal assembly according to one embodiment. [Figure 9] This is a schematic perspective view showing the configuration of a substrate adsorption member including an elastic seal assembly according to one embodiment. [Figure 10] This is a schematic cross-sectional view showing a top ring of one embodiment. [Figure 11] This is a schematic cross-sectional view showing a top ring of one embodiment. [Figure 12] This is a cross-sectional view showing an enlarged portion of the top ring of one embodiment. [Figure 13] This is a perspective view showing a magnified portion of the elastic sealing member of one embodiment. [Figure 14] This is a cross-sectional view showing an enlarged portion of the top ring of one embodiment. [Figure 15] This is a cross-sectional view showing an enlarged portion of the top ring of one embodiment. [Figure 16] This is a perspective view showing an enlarged portion of the substrate adsorption member of one embodiment. [Modes for carrying out the invention]

[0010] Embodiments of the substrate adsorption member, elastic seal assembly, top ring, and substrate processing apparatus according to the present invention will be described below with reference to the accompanying drawings. In the accompanying drawings, identical or similar elements are denoted by identical or similar reference numerals, and redundant descriptions of identical or similar elements may be omitted in the description of each embodiment. Furthermore, the features shown in each embodiment are applicable to other embodiments as long as they do not contradict each other.

[0011] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus 1000 according to an embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes a load unit 100, a transfer unit 200, a polishing unit 300, a drying unit 500, and an unload unit 600. In the illustrated embodiment, the transfer unit 200 includes two transfer units 200A and 200B, and the polishing unit 300 includes two polishing units 300A and 300B. In one embodiment, each of these units can be formed independently. By forming these units independently, it is possible to easily form a substrate processing apparatus 1000 having different configurations by arbitrarily combining the number of each unit. Further, the substrate processing apparatus 1000 includes a control device 900, and each component of the substrate processing apparatus 1000 is controlled by the control device 900. In one embodiment, the control device 900 can be configured from a general computer including an input / output device, an arithmetic device, a storage device, and the like.

[0012] <Load unit> The load unit 100 is a unit for introducing a substrate WF before processing such as polishing and cleaning into the substrate processing apparatus 1000. In one embodiment, the load unit 100 is configured to comply with the mechanical device interface standard (IPC - SMEMA - 9851) of the Surface Mount Equipment Manufacturers Association (SMEMA).

[0013] In the illustrated embodiment, the transfer mechanism of the load unit 100 includes a plurality of transfer rollers 202 and a plurality of roller shafts 204 to which the transfer rollers 202 are attached. In the embodiment shown in FIG. 1, three transfer rollers 202 are attached to each roller shaft 204. The substrate WF is placed on the transfer rollers 202, and the substrate WF is transferred by the rotation of the transfer rollers 202. The attachment position of the transfer rollers 202 on the roller shaft 204 can be arbitrary as long as the substrate WF can be stably transferred. This is possible. However, since the transport roller 202 contacts the substrate WF, it should be arranged such that the transport roller 202 contacts an area where there is no problem even if it contacts the substrate WF which is the object to be processed. In one embodiment, the transport roller 202 of the load unit 100 can be made of a conductive polymer. In one embodiment, the transport roller 202 is electrically grounded via a roller shaft 204 or the like. This is to prevent the substrate WF from being charged and damaged. Also, in one embodiment, an ionizer (not shown) may be provided in the load unit 100 to prevent the charging of the substrate WF.

[0014] <Transport unit> The substrate processing apparatus 1000 shown in FIG. 1 includes two transport units 200A and 200B. Since the two transport units 200A and 200B can have the same configuration, hereinafter, they will be collectively described as the transport unit 200.

[0015] The illustrated transport unit 200 includes a plurality of transport rollers 202 for transporting the substrate WF. By rotating the transport roller 202, the substrate WF on the transport roller 202 can be transported in a predetermined direction. The transport roller 202 of the transport unit 200 may be formed of a conductive polymer or a non-conductive polymer. The transport roller 202 is driven by a motor not shown. The substrate WF is transported to the substrate transfer position by the transport roller 202.

[0016] In one embodiment, the transport unit 200 has a cleaning nozzle 284. The cleaning nozzle 284 is connected to a cleaning liquid supply source not shown. The cleaning nozzle 284 is configured to supply the cleaning liquid to the substrate WF transported by the transport roller 202.

[0017] <Polishing unit> Figure 2 is a schematic perspective view showing the configuration of a polishing unit 300 according to one embodiment. The substrate processing apparatus 1000 shown in Figure 1 includes two polishing units 300A and 300B. Since the two polishing units 300A and 300B can have the same configuration, they will be described collectively as the polishing unit 300 below.

[0018] As shown in Figure 2, the polishing unit 300 comprises a polishing table 350 and a top ring 302 which constitutes a polishing head that holds the substrate to be polished and presses it against the polishing surface on the polishing table 350. The polishing table 350 is connected via a table shaft 351 to a polishing table rotation motor (not shown) located below it, and is rotatable around the table shaft 351. A polishing pad 352 is attached to the upper surface of the polishing table 350, and the surface 352a of the polishing pad 352 constitutes the polishing surface for polishing the substrate. In one embodiment, the polishing pad 352 may be attached via a layer to facilitate removal from the polishing table 350. Such a layer may be, for example, a silicone layer or a fluororesin layer, and may be used as described in, for example, Japanese Patent Application Publication No. 2014-176950.

[0019] A polishing fluid supply nozzle 354 is installed above the polishing table 350, and this nozzle supplies polishing fluid to the polishing pad 352 on the polishing table 350. As shown in Figure 2, the polishing table 350 and the table shaft 351 are provided with a passage 353 for supplying polishing fluid. The passage 353 communicates with an opening 355 on the surface of the polishing table 350. A through-hole 357 is formed in the polishing pad 352 at a position corresponding to the opening 355 of the polishing table 350, and the polishing fluid passing through the passage 353 is supplied to the surface of the polishing pad 352 through the opening 355 of the polishing table 350 and the through-hole 357 of the polishing pad 352. Note that the opening 355 of the polishing table 350 and the through-hole 357 of the polishing pad 352 may be one or multiple. Furthermore, the positions of the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 are arbitrary, but in one embodiment they are positioned near the center of the polishing table 350.

[0020] Although not shown in Figure 2, in one embodiment, the polishing unit 300 includes an atomizer 358 for spraying a liquid, or a mixed fluid of liquid and gas, toward the polishing pad 352 (see Figure 1). The liquid sprayed from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen gas.

[0021] The top ring 302 is connected to the top ring shaft 18, which moves up and down relative to the oscillating arm 360 by a vertical movement mechanism 319. This vertical movement of the top ring shaft 18 causes the entire top ring 302 to move up and down relative to the oscillating arm 360, thereby positioning it. The top ring shaft 18 is rotated by a top ring rotation motor (not shown). The rotation of the top ring shaft 18 causes the top ring 302 to rotate around the top ring shaft 18.

[0022] The top ring 302 is designed to hold a rectangular substrate on its underside. The oscillating arm 360 is configured to pivot around a pivot shaft 362. By pivoting the oscillating arm 360, the top ring 302 can move between the substrate transfer position of the transport unit 200 and above the polishing table 350. By lowering the top ring shaft 18, the top ring 302 can be lowered to press the substrate against the surface (polishing surface) 352a of the polishing pad 352. At this time, the top ring 302 and the polishing table 350 are rotated, and polishing fluid is supplied onto the polishing pad 352 from a polishing fluid supply nozzle 354 located above the polishing table 350 and / or from an opening 355 located in the polishing table 350. In this way, the substrate WF can be pressed against the polishing surface 352a of the polishing pad 352 to polish the surface of the substrate. During polishing of the substrate WF, the arm 360 may be fixed or swung so that the top ring 302 passes through the center of the polishing pad 352 (covering the through hole 357 of the polishing pad 352).

[0023] The vertical movement mechanism 319 for moving the top ring shaft 18 and top ring 302 up and down comprises a bridge 28 that rotatably supports the top ring shaft 18 via a bearing 321, a ball screw 32 attached to the bridge 28, a support base 29 supported by a support column 130, and an AC servo motor 38 mounted on the support base 29. The support base 29 that supports the servo motor 38 is fixed to the swing arm 360 via the support column 130.

[0024] The ball screw 32 comprises a screw shaft 32a connected to the servo motor 38 and a nut 32b into which the screw shaft 32a is screwed. The top ring shaft 18 moves up and down together with the bridge 28. Therefore, when the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, which in turn causes the top ring shaft 18 and the top ring 302 to move up and down.

[0025] A polishing unit 300 according to one embodiment includes a dressing unit 356 for dressing the polishing surface 352a of a polishing pad 352. The dressing unit 356 includes a dresser 50 that slides against the polishing surface 352a, a dresser shaft 51 to which the dresser 50 is connected, an air cylinder 53 provided at the upper end of the dresser shaft 51, and a swing arm 55 that rotatably supports the dresser shaft 51. The lower part of the dresser 50 is composed of a dressing member 50a, and needle-shaped diamond particles are attached to the lower surface of this dressing member 50a. The air cylinder 53 is positioned on a support base 57 supported by support columns 56, and these support columns 56 are fixed to the swing arm 55.

[0026] The oscillating arm 55 is driven by a motor (not shown) and is configured to pivot around a pivot shaft 58. The dresser shaft 51 rotates due to the drive of a motor (not shown), and the rotation of this dresser shaft 51 causes the dresser 50 to rotate around the dresser shaft 51. The air cylinder 53 moves the dresser 50 up and down via the dresser shaft 51 and presses the dresser 50 against the polishing surface 352a of the polishing pad 352 with a predetermined pressing force.

[0027] The polishing surface 352a of the polishing pad 352 is dressed as follows. The dresser 50 is pressed against the polishing surface 352a by an air cylinder 53, and at the same time, pure water is supplied to the polishing surface 352a from a pure water supply nozzle (not shown). In this state, the dresser 50 rotates around the dresser shaft 51, causing the lower surface (diamond particles) of the dressing member 50a to slide against the polishing surface 352a. In this way, the polishing pad 352 is scraped off by the dresser 50, and the polishing surface 352a is dressed.

[0028] <Drying Unit> The drying unit 500 is a device for drying the substrate WF. In the substrate processing apparatus 1000 shown in Figure 1, the drying unit 500 dries the substrate WF that has been polished in the polishing unit 300 and then washed in the cleaning section of the transport unit 200. As shown in Figure 1, the drying unit 500 is located downstream of the transport unit 200. The drying unit 500 has nozzles 530 for injecting gas toward the substrate WF being transported on the transport rollers 202. The gas can be, for example, compressed air or nitrogen. The substrate WF can be dried by blowing away water droplets on the transported substrate WF with the drying unit 500.

[0029] <Unloading Unit> The unloading unit 600 is a unit for transporting the substrate WF (waterwall) out of the substrate processing apparatus 1000 after processing such as polishing and cleaning. In the substrate processing apparatus 1000 shown in Figure 1, the unloading unit 600 receives the substrate after it has been dried in the drying unit 500. As shown in Figure 1, the unloading unit 600 is located downstream of the drying unit 500. In one embodiment, the unloading unit 600 is configured to comply with the SMEMA (Surface Mount Equipment Manufacturers Association) machine interface standard (IPC-SMEMA-9851).

[0030] <Top Ring> Next, the top ring 302 in the polishing unit 300 according to one embodiment will be described. Figure 3A is a schematic cross-sectional view showing the top ring of one embodiment. Figure 3B is a schematic plan view showing the top ring of one embodiment. As shown in Figures 3A and 3B, the top ring 302 includes a top ring shaft (rotating shaft) 18 and a base member 301 connected to the top ring shaft 18. Specifically, the base member 301 includes a flange 303 connected to the top ring shaft 18, a plate-shaped spacer 305 provided in a rectangular recess formed in the center of the lower surface of the flange 303, and a plate-shaped carrier 306 provided below the flange 303 and the spacer 305.

[0031] Furthermore, the top ring 302 includes a substrate adsorption member 330 for adsorbing the back surface of the substrate WF with the polishing surface facing downwards. The substrate adsorption member 330 is attached to the lower surface of the carrier 306. The substrate adsorption member 330 includes a porous member 334. The porous member 334 can be any material that can vacuum adsorb the substrate WF by vacuuming using a depressurization means (vacuum source) 31, and can be, for example, a resin such as PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride) with numerous fine particles. It can be made of a resin porous material in which holes are formed. In this embodiment, the porous member 334 is formed in a plate shape and has a substrate adsorption surface 334a for adsorbing the substrate WF and a pressure reduction section 334b ​​that communicates with a pressure reduction means (vacuum source) 31.

[0032] Furthermore, the substrate adsorption member 330 includes a shielding member 332. The shielding member 332 can be any airtight member that can shield the flow of gas, and can be formed from a resin plate such as a relatively soft PE (polyethylene), PP (polypropylene), PTFE (polytetrafluoroethylene), or PVC (polyvinyl chloride). In this embodiment, the shielding member 332 has a plate-shaped first shielding member 332-1 that shields the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a, and a second shielding member 332-2 provided on the peripheral edge of the lower surface of the first shielding member 332-1. In this embodiment, the second shielding member 332-2 is a frame-shaped member that shields a part of the side surface 334d of the porous member 334, but is not limited to this, and may be a frame-shaped member that shields the entire side surface 334d of the porous member 334. The first shielding member 332-1 and the second shielding member 332-2 are formed as a single integrated member. The first shielding member 332-1 has suction holes 335 formed to communicate with the porous member 334. The depressurization section 334b ​​is provided at a position corresponding to the suction holes 335 on the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a.

[0033] In the top ring 302 that adsorbs and holds the substrate WF on the porous member 334 as in this embodiment, it is required that the substrate WF be reliably adsorbed regardless of the flatness of the surface of the substrate WF to be adsorbed. That is, if the surface of the substrate WF to be adsorbed is flat, it is possible to easily adsorb the substrate WF onto the porous member 334 by vacuum suction. However, if the surface to be adsorbed is not flat, for example, if a part of the outer periphery of the surface of the substrate WF to be adsorbed is recessed, air leaks may occur from the gap created by the recess, weakening the adsorption force, and as a result, the substrate WF may not be adsorbed onto the porous member 334.

[0034] Therefore, as shown in Figures 3A and 3B, the substrate adsorption member 330 of this embodiment includes a frame-shaped elastic sealing member 336 attached to the lower surface of the second shielding member 332-2 so as to surround the porous member 334. The elastic sealing member 336 can be attached to the lower surface of the second shielding member 332-2 using any means, such as double-sided tape. The elastic sealing member 336 can be any material that is elastic and can block the flow of gas. For example, the elastic sealing member 336 can be a soft material that is chemical resistant, has good elasticity, and has a skin surface. That is, general soft materials have countless pores on their surface and allow gas to pass through, making them insufficient as sealing members. For this reason, as an example, the elastic sealing member 336 can be an extruded foam material. This makes the surface of the elastic sealing member 336 a skin surface, which can block the flow of gas and has good elasticity. Furthermore, the elastic sealing member 336 has a contact surface 336a that comes into contact with the substrate WF when adsorbing the substrate WF. As shown in Figure 3A, the contact surface 336a protrudes from the substrate adsorption surface 334a of the porous member 334 when the substrate WF is not in contact. Silicone sponge is the most preferred material for the elastic sealing member 336, and silicone rubber is also preferred. It is also possible to use Norseal made of soft polyvinyl chloride.

[0035] Figure 4 is a schematic cross-sectional view showing a top ring and substrate in one embodiment. Figure 4 shows the state in which the top ring, holding the substrate by a transfer means (not shown) at the aforementioned substrate transfer position (not shown), is at the polishing position of the polishing pad 352 on the polishing table 350. As shown in Figure 4, when the substrate adsorption member 330 adsorbs the substrate WF, the substrate WF comes into contact with the contact surface 336a of the elastic sealing member 336. Here, since the elastic sealing member 336 has good elasticity, when it adsorbs the substrate WF, it is pressed by the substrate WF and contracts, sealing the space between the atmosphere around the top ring 302 and the porous member 334. The elastic sealing member 336 returns to its original shape when the adsorption of the substrate WF is released and the substrate WF is separated. It is designed to revert to its original state.

[0036] According to this embodiment, even if a portion of the outer periphery of the surface of the substrate WF to be adsorbed is recessed, forming a step WFa, as shown in Figure 4, the elastic sealing member 336 is provided, which prevents air leakage from occurring through the gap created by the step WFa. Therefore, according to this embodiment, the substrate WF can be reliably adsorbed onto the substrate adsorption member 330 regardless of the flatness of the surface of the substrate WF to be adsorbed.

[0037] Furthermore, according to this embodiment, when the porous member 334 is vacuumed by the depressurization means (vacuum source) 31, air leaks from gaps created by the step WFa can be prevented, so that negative pressure can be efficiently formed on the substrate adsorption surface 334a. As a result, the substrate WF can be reliably adsorbed onto the substrate adsorption member 330, so that the substrate WF does not fly out (slip out) during polishing without providing a retainer member around the substrate WF. In particular, with the recent trend towards thinner substrate WFs, there is a risk that the substrate WF may slip out during polishing even if a retainer member is provided. Also, if the shape of the substrate WF is rectangular, there is a risk that the corners of the substrate WF may come into contact with the retainer member during polishing, causing damage to the substrate WF or top ring. In contrast, according to this embodiment, the substrate WF can be pressed against the polishing pad 352 while being vacuum-adsorbed by the substrate adsorption member 330, so that the substrate WF does not slip out during polishing, and damage to the substrate WF or top ring can be prevented during polishing.

[0038] Furthermore, although Figure 4 illustrates the case where a portion of the outer periphery of the surface to be adsorbed on the substrate WF is recessed, the embodiment is not limited to this case. In the same way, even when the surface to be adsorbed on the substrate WF is flat, the substrate WF can be reliably adsorbed onto the substrate adsorption member 330. That is, in this embodiment, the second shielding member 332-2 is configured such that the substrate adsorption surface 334a of the porous member 334 protrudes more than the mounting surface 332-2a of the elastic sealing member 336 of the second shielding member 332-2. In other words, the mounting surface 332-2a of the elastic sealing member 336 of the second shielding member 332-2 is recessed more than the substrate adsorption surface 334a of the porous member 334. The elastic sealing member 336 is positioned to surround the side surface of the porous member 334 that protrudes more than the mounting surface 332-2a of the second shielding member 332-2. Therefore, when a substrate WF with a flat surface is adsorbed, the contact surface 336a of the elastic sealing member 336, which is pressed and contracted by the substrate WF, becomes coplanar with the substrate adsorption surface 334a of the porous member 334, so that the substrate WF can be reliably adsorbed onto the substrate adsorption member 330.

[0039] Furthermore, when an elastic sealing member 336 that contacts the substrate WF is used as in this embodiment, there is a risk that the substrate WF may not peel off the elastic sealing member 336 even after the suction of the substrate WF is released. In this regard, since the surface of the elastic sealing member 336 is a skin surface, it is easier to release the substrate WF when the suction of the substrate WF is released. In addition, the contact surface 336a of the elastic sealing member 336 may be coated with a fluororesin coating, such as a Teflon® coating made of polytetrafluoroethylene, so that it does not naturally adhere to the substrate WF (blooming does not occur). Alternatively, the contact surface 336a of the elastic sealing member 336 may be coated by impregnation.

[0040] Furthermore, according to this embodiment, by providing the elastic sealing member 336, the space between the atmosphere surrounding the top ring 302 and the porous member 334 can be sealed. Therefore, it is possible to prevent polishing liquid from flowing into the substrate adsorption surface 334a of the porous member 334. As a result, it is possible to prevent abrasive particles contained in the polishing liquid from clogging the pores of the porous member 334, thereby reducing the adsorption performance of the substrate adsorption member 330 and preventing adverse effects on the lifespan of the substrate adsorption member 330.

[0041] Furthermore, the top ring 302 of this embodiment is equipped with means to deal with the case when abrasive grains enter the pores of the porous member 334. Figure 5 is a schematic cross-sectional view showing a top ring of one embodiment. As shown in Figure 5, the top ring 302 is equipped with an abrasive grain cleaning member 33. The abrasive grain cleaning member 33 is configured to supply a fluid such as air or pure water to the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a via a flow path 333 formed in the base member 301 and the shielding member 332. By supplying a fluid to the surface 334c of the porous member 334 opposite to the substrate adsorption surface 334a, abrasive grains SL that clog the pores of the porous member 334 can be washed away. This cleaning process for the porous member 334 may be performed after the polishing process, simultaneously with the process of releasing the adsorption of the substrate WF at the substrate transfer position (not shown) and releasing the substrate WF from the top ring 302 by a transfer means (not shown).

[0042] Next, a modified example of the top ring 302 will be described. Figure 6 is a schematic cross-sectional view showing an enlarged portion of the top ring of one embodiment. The configuration other than the substrate adsorption member 330 is the same as in the embodiments of Figures 3 to 5, so its description will be omitted. As shown in Figure 6, the elastic sealing member 336 can be configured to include a first elastic sealing member 336-1 that surrounds the side surface of the porous member 334 that protrudes beyond the mounting surface 332-2a of the second shielding member 332-2, and a second elastic sealing member 336-2 that is spaced apart and located outside the first elastic sealing member 336-1.

[0043] The first elastic sealing member 336-1 can be any member capable of blocking the flow of gas and has a contact surface 336-1a that contacts the substrate WF. The second elastic sealing member 336-2 can be any member capable of blocking the flow of polishing liquid and has a contact surface 336-2a that contacts the substrate WF. According to this embodiment, the inflow of polishing liquid and gas into the porous member 334 can be sealed more reliably. As a result, air leaks into the porous member 334 can be prevented, and the pores of the porous member 334 can be prevented from being blocked by abrasive particles, so that the substrate WF can be reliably adsorbed onto the substrate adsorption member 330.

[0044] Next, other modifications of the top ring 302 will be described. Figure 7 is a schematic cross-sectional view showing an enlarged portion of the top ring in one embodiment. As shown in Figure 7, the shielding member 332 further includes a frame-shaped third shielding member 332-3 provided on the lower outer circumference of the second shielding member 332-2. The third shielding member 332-3 is spaced outside the elastic sealing member 336. The third shielding member 332-3 is configured such that a gap 338 is formed between the lower surface of the third shielding member 332-3 and the substrate WF. The first shielding member 332-1 and the second shielding member 332-2 also have a fluid passage 332a for discharging fluid into the space 337 between the elastic sealing member 336 and the third shielding member 332-3. The top ring 302 includes a fluid supply member 34 configured to supply fluid (e.g., air) to the space 337 via the fluid passage 332a.

[0045] The fluid supplied from the fluid supply member 34 to the space 337 via the fluid passage 332a is ejected outward from the gap 338 between the lower surface of the third shielding member 332-3 and the substrate WF. This prevents air and polishing liquid from flowing into the porous member 334 from outside the top ring 302. As a result, air leaks to the porous member 334 are prevented, and the pores of the porous member 334 are prevented from being clogged with abrasive particles, so that the substrate WF can be reliably adsorbed by the substrate adsorption member 330.

[0046] Next, the elastic seal assembly of this embodiment will be described. In the above embodiment, an example was shown in which the elastic seal member 336 is attached to the second shielding member 332-2 using means such as double-sided tape, but it is not limited to this, and the elastic seal assembly can be attached to the second shielding member 332-2. It can also be attached. Figure 8 is a schematic perspective view showing the configuration of an elastic seal assembly according to one embodiment. Figure 9 is a schematic perspective view showing the configuration of a substrate adsorption member including an elastic seal assembly according to one embodiment.

[0047] Figures 8 and 9 are perspective views of the elastic seal assembly and substrate adsorption member viewed from the back. As shown in Figures 8 and 9, the elastic seal assembly 331 includes a frame-shaped fixing frame 339. The fixing frame 339 is a rigid member formed to be attached to the second shielding member 332-2 so as to surround the porous member 334. Specifically, the fixing frame 339 is composed of a rectangular frame 339a configured to surround the side surface 334d of the porous member 334, and a plurality of (12 in this embodiment) protrusions 339b projecting outward from the frame 339a. Bolt holes 339c are formed in the protrusions 339b for attaching the elastic seal assembly 331 to the second shielding member 332-2 with bolts B. The elastic seal assembly 331 also includes an elastic seal member 336 attached to the fixing frame 339. The elastic seal member 336 has the same configuration as described in the above embodiment, so a detailed description is omitted. The elastic sealing member 336 is attached to the side 339d of the fixed frame 339 opposite to the fixed surface to which it is attached to the second shielding member 332-2, by any means such as adhesive or double-sided tape. In the embodiment shown in Figure 9, a groove 332-2b corresponding to the shape of the elastic sealing assembly 331 (fixed frame 339) is provided on the bottom surface of the second shielding member 332-2, and a mounting surface 332-2a is formed on the bottom surface of the groove 332-2b. The elastic sealing assembly 331 is fitted into the groove 332-2b and fixed to the second shielding member 332-2 by bolts B.

[0048] According to this embodiment, when the elastic seal member 336 reaches the end of its lifespan due to wear or other reasons, for example, the elastic seal member 336, which is a consumable part, can be easily replaced. That is, when the elastic seal member 336 is directly attached to the second shielding member 332-2 using double-sided tape or the like, as in the above embodiment, the elastic seal member 336 is elastic and flexes, making positioning difficult and installation difficult. In particular, at the site where the substrate processing apparatus 1000 is installed, there are often no mounting jigs or other equipment available, and there are often no workers with the necessary installation skills, making it difficult to replace the elastic seal member 336. In contrast, according to this embodiment, for example, the elastic seal assembly 331 is manufactured at a manufacturing plant for the elastic seal assembly 331 using a dedicated jig or by workers with the necessary installation skills, and then delivered to the site where the substrate processing apparatus 1000 is installed. Since the elastic seal assembly 331 already has the elastic seal member 336 attached to the rigid fixed frame 339, at the installation site of the substrate processing apparatus 1000, a typical worker can easily attach the elastic seal assembly 331 to the second shielding member 332-2 using bolts.

[0049] In this embodiment, an example is shown in which the elastic seal assembly 331 is fixed to the second shielding member 332-2 using bolts, but the fixing method is arbitrary. For example, magnets can be embedded in both the frame 339a and the second shielding member 332-2, and the frame 339a and the second shielding member 332-2 can be fixed together by magnetic force. In this case, the protrusion 339b does not need to be provided.

[0050] Next, other embodiments of the top ring will be described. Figure 10 is a schematic cross-sectional view of a top ring according to one embodiment. As shown in Figure 10, the top ring 1302 includes a base member 1301 connected to a top ring shaft (rotating shaft) 1018. Specifically, the base member 1301 includes a flange 1303 connected to the top ring shaft 1018, an upper guide member 1305 provided at the bottom of the flange 1303, and a lower guide member 1306 provided at the bottom of the upper guide member 1305. The upper guide member 1305 has a planar size smaller than the planar size of the flange 1303 and protrudes downward from the lower surface of the flange 1303. The lower guide member 1306 is connected to the upper guide member 1 It is provided in a frame shape on the peripheral edge of the lower surface of 305. The planar size of the upper guide member 1305 or flange 1303 refers to the size of the upper guide member 1305 or flange 1303 when viewed from above (viewed from a direction along the top ring shaft 1018).

[0051] Furthermore, the top ring 1302 includes a substrate adsorption member 1330 for adsorbing the back surface of the substrate WF with the polishing surface facing downward. The substrate adsorption member 1330 is positioned below the base member 1301. The substrate adsorption member 1330 includes a porous member 1334. The porous member 1334 is made of the same material as the porous member 334 in the above embodiment. The porous member 1334 has a substrate adsorption surface 1334a for adsorbing the substrate WF and a pressure reduction section 1334b that communicates with a pressure reduction means (vacuum source) 1031.

[0052] Furthermore, the substrate adsorption member 1330 includes a shielding member 1332. The shielding member 1332 is made of the same material as the shielding member 332 in the above embodiment. The shielding member 1332 has a plate-shaped first shielding member 1332-1 that shields the surface 1334c of the porous member 1334 opposite to the substrate adsorption surface 1334a, and a second shielding member 1332-2 provided on the peripheral edge of the lower surface of the first shielding member 1332-1. The shielding member 1332 is formed to shield the surface 1334c and a part of the side surface 1334d of the porous member 1334 opposite to the substrate adsorption surface 1334a. The shielding member 1332 includes a suction hole 1337 formed to communicate with the porous member 1334. The depressurization section 1334b is provided at the position where the suction hole 1337 is formed. In this embodiment, the suction hole 1337 is formed in the shielding member 1332 so as to communicate with the side surface 1334d of the porous member 1334, and the depressurization section 1334b is provided on the side surface 1·BR>R34d. One end of the suction hole 1337 is connected to the side surface 1334d of the porous member 1334, and the other end is connected to the depressurization means 1031 via the suction passage 1312.

[0053] In this embodiment, since a pressure reduction section 1334b is provided on the side surface 1334d of the porous member 1334, the polishing profile of the substrate WF can be made uniform. That is, the area where the pressure reduction section 1334b is provided is evacuated by the pressure reduction means 1031, resulting in a locally negative pressure. If the pressure reduction section 1334b were provided on the side surface 1334c of the porous member 1334 opposite to the substrate adsorption surface 1334a, that area would become locally negative, making it more difficult for pressure to act on the substrate WF compared to other areas, and as a result, the polishing profile may become uneven. In contrast, in this embodiment, since the pressure reduction section 1334b is provided on the side surface 1334d of the porous member 1334, localized negative pressure is less likely to occur on the side surface 1334c of the porous member 1334 opposite to the substrate adsorption surface 1334a, so the polishing profile of the substrate WF can be made uniform.

[0054] As shown in Figure 10, the substrate adsorption member 1330 includes a frame member 1344 provided on the shielding member 1332 so as to surround at least a part of the base member 1301 (specifically, the upper guide member 1305 and the lower guide member 1306). The frame member 1344 includes a lower frame member 1343 provided in a frame shape on the periphery of the upper surface of the shielding member 1332, and a frame-shaped upper frame member 1342 provided on the lower frame member 1343. The lower frame member 1343 and the shielding member 1332 are connected via a sealing material 1341. In this embodiment, the sealing material 1341 is formed in a film shape that covers the upper surface of the substrate adsorption member 1330, but it is not limited to this, and may be a frame shape having only a periphery portion for sealing the lower frame member 1343 and the shielding member 1332.

[0055] The upper frame member 1342 includes a frame member projection 1342a that protrudes in the direction of the base member 1301 (specifically, the upper guide member 1305). The upper guide member 1305 also includes a guide member projection 1305a that protrudes in the direction of the upper frame member 1342 at a different height position than the frame member projection 1342a. The frame member projection 1342a and the guide member projection 1305a are connected to the top... When the pullers 1302 are viewed from above, they overlap each other in a predetermined area. Therefore, the height movement of the substrate adsorption member 1330 can be restricted by the contact between the frame member projection 1342a and the guide member projection 1305a.

[0056] The substrate adsorption member 1330 includes an elastic member 1340 that connects at least a portion of the base member 1301 surrounded by the frame member 1344 to the frame member 1344. Specifically, the elastic member 1340 is a frame-shaped plate member having an inner end 1340a sandwiched between the upper guide member 1305 and the lower guide member 1306, and an outer end 1340b sandwiched between the lower frame member 1343 and the upper frame member 1342. The elastic member 1340 can be formed from rubber materials such as silicone rubber, EPDM (ethylene propylene diene rubber), or FKM (fluororubber), but is not limited to these.

[0057] As shown in Figure 10, the top ring 1302 includes an elastic membrane 1320 configured to form a plurality of pressurizing chambers for pressurizing the substrate WF between the base member 1301 and the substrate adsorption member 1330. Specifically, the elastic membrane 1320 includes a film-like sealing material 1341 and a plurality of elastic membranes 1320-1, 1320-2, and 1320-3 with different areas that are stacked. A pressurizing chamber for pressurizing the entire substrate WF is formed between the base member 1301 and the sealing material 1341. This pressurizing chamber is in communication with the pressure adjustment unit 1030 via a pressurizing passage 1313-4. Furthermore, each of the elastic membranes 1320-1, 1320-2, and 1320-3 includes a central portion that contacts the upper surface of the shielding member 1332 and ends that extend from the central portion and are fixed at different positions on the lower surface of the upper guide member 1305. Multiple elastic membranes 1320-1, 1320-2, and 1320-3 form multiple concentric pressurized chambers between the base member 1301 and the multiple elastic membranes 1320-1, 1320-2, and 1320-3 for pressurizing the substrate WF. Each of the pressurized chambers is in communication with the pressure adjustment unit 1030 via pressurizing passages 1313-1, 1313-2, and 1313-3. The pressure adjustment unit 1030 has a pressure adjustment function that adjusts the pressure of the pressurized fluid supplied to each pressurized chamber. In other words, the pressure adjustment unit 1030 can adjust the pressure of the pressurized chambers for pressurizing the entire substrate WF by adjusting the pressure of the pressurized fluid supplied to pressurizing passage 1313-4, and can also adjust the pressure of the multiple concentric pressurized chambers by adjusting the pressure of the pressurized fluid supplied to pressurizing passages 1313-1, 1313-2, and 1313-3. By forming multiple pressurizing chambers in this manner, the pressing force of the substrate WF against the polishing pad 352 can be controlled area by area via the substrate adsorption member 1330. According to this embodiment, the substrate WF is adsorbed onto the substrate adsorption surface 1334a by creating a negative pressure in the porous member 1334 using the depressurizing means 1031, and the substrate WF can be pressed against the polishing pad 352 via the substrate adsorption member 1330 by pressurizing the pressurizing chamber with the pressure adjustment unit 1030.

[0058] Furthermore, as shown in Figure 10, the top ring 1302 further includes a band 1345 that connects the outer surface of the portion of the base member 1301 not enclosed by the frame member 1344 (specifically, the flange 1303) to the outer surface of the frame member 1344. The band 1345 is attached from the outer surface of the flange 1303 to the outer surface of the upper frame member 1342. The band 1345 allows displacement of the substrate adsorption member 1330 relative to the base member 1301 and prevents polishing liquid or the like from entering the space between the substrate adsorption member 1330 and the base member 1301. Also, as shown in Figure 10, the top ring 1302 includes an elastic seal member 1336 similar to the elastic seal member 336 of the above embodiment. The elastic seal member 1336 may be attached to the second shielding member 1332-2 by double-sided tape or the like, or it may be attached to the second shielding member 1332-2 in the form of the elastic seal assembly 331 described above.

[0059] According to this embodiment, even if tilting occurs in the top ring 1302 or the polishing table 1350 to which the polishing pad 352 is attached due to manufacturing tolerances of each component constituting the substrate processing apparatus 1000, the substrate WF can be uniformly pressed against the polishing pad 352. This is possible. In other words, according to this embodiment, the substrate adsorption member 1330 is not fixed to the base member 1301, but is held by the elastic member 1340. Therefore, even if the top ring 1302 or the polishing table 1350 tilts and the substrate WF makes uneven contact with the polishing pad 352, the elasticity of the elastic member 1340 causes the substrate adsorption member 1330 to conform to the polishing surface of the polishing pad 352, and as a result, the substrate WF can be brought into contact with the polishing pad 352 parallel to the polishing pad. Thus, according to this embodiment, the substrate WF can be pressed uniformly against the polishing pad 352.

[0060] In addition, according to this embodiment, a compact top ring can be realized. That is, when a substrate adsorption member is supported on a base member via an elastic member, for example, an opening can be provided in the center of the lower surface of the base member, the substrate adsorption member can be placed in the opening, and the frame-shaped member at the periphery forming the opening and the substrate adsorption member can be connected by an elastic member. However, in such a configuration, if a suction path for vacuum suction from a porous material is to be routed through the frame-shaped member of the top ring, the planar size of the top ring will increase due to the space constraints of the frame-shaped member, which may hinder the miniaturization of the top ring.

[0061] In contrast, in the top ring 1302 of this embodiment, the substrate adsorption member 1330 includes a frame member 1344 that surrounds at least a part of the base member 1301, and the frame member 1344 and the base member 1301 are connected by an elastic member 1340. Therefore, even when the pressure reduction section 1334b is provided on the side surface 1334d of the porous member 1334, as in this embodiment, and the suction passage 1312 is routed through the outer circumference of the top ring 1302, there is no need to increase the planar size of the frame member 1344, and as a result, the top ring 1302 can be manufactured compactly. Note that the planar size of the top ring 1302 or the frame member 1344 refers to the size of the top ring 1302 or the frame member 1344 when viewed from above (viewed from a direction along the top ring shaft 1018).

[0062] Next, a modified version of the top ring will be described. Figure 11 is a schematic cross-sectional view showing a top ring of one embodiment. Figure 12 is an enlarged cross-sectional view showing a part of the top ring of one embodiment. Figure 13 is an enlarged perspective view showing a part of the elastic sealing member of one embodiment. The top ring 2302 of this embodiment is the same as the top ring 302 of the embodiments shown in Figures 3 to 5, except for the elastic sealing member 2336, so the description of the similar configuration will be omitted.

[0063] As shown in Figure 11, the substrate adsorption member 330 has an elastic sealing member 2336 arranged to surround the porous member 334. In this embodiment, the elastic sealing member 2336 is composed of a sealing lip member having a roughly U-shaped cross-section. Specifically, as shown in Figure 12, the elastic sealing member 2336 has a base portion 2336-1, a lip portion 2336-2, and a connecting portion 2336-3.

[0064] The base portion 2336-1 is a frame-shaped member attached to the mounting surface 332-2a of the second shielding member 332-2 by any means such as adhesive or double-sided tape. The lip portion 2336-2 is a frame-shaped member positioned below the base portion 2336-1, spaced apart from the base portion 2336-1. The connecting portion (connecting wall) 2336-3 is a frame-shaped member that connects the end of the base portion 2336-1 and the end of the lip portion 2336-2. The elastic sealing member 2336 is formed integrally with the base portion 2336-1, the lip portion 2336-2, and the connecting portion 2336-3, and is a rectangular frame-shaped member corresponding to the square substrate WF. Although only a part of the elastic sealing member 2336 is shown in Figure 13, the elastic sealing member 2336 has four straight edges SI and four curved corners CO that connect each edge SI. The elastic sealing member 2336 is formed by the connection of each side SI and each corner CO, creating a rectangular frame. It is formed in a specific shape, and since there are no gaps that could cause air leaks, sealing performance can be ensured.

[0065] As shown in Figure 12, the elastic sealing member 2336 is positioned around the porous member 334 such that an opening is formed facing outwards. In other words, the connecting portion (connecting wall) 2336-3 connects the end of the base portion 2336-1 on the porous member 334 side to the end of the lip portion 2336-2 on the porous member 334 side. Therefore, the lip portion 2336-2 extends outwards from the lower end of the connecting portion 2336-3. More specifically, when the substrate WF is not adsorbed to the porous member 334 (left side of Figure 12), the lip portion 2336-2 extends diagonally downwards from the lower end of the connecting portion 2336-3. The elastic sealing member 2336 can be formed from a material that is elastic and can block the flow of gas, such as a silicone sponge or silicone rubber, as in the above embodiment. Alternatively, the elastic sealing member 2336 can be made from a soft material that is chemical resistant, has good elasticity, and has a skin-like surface.

[0066] A contact surface 2336a is formed on the lower surface of the lip portion 2336-2, which comes into contact with the substrate WF. That is, when the substrate WF is adsorbed onto the porous member 334 (right side of Figure 12), the substrate WF comes into contact with the contact surface 2336a of the lip portion 2336-2, pushing up the lip portion 2336-2. The elastic sealing member 2336 is an elastic material, and the adsorption of the substrate WF creates positive pressure on the outside of the elastic sealing member 2336, so the lip portion 2336-2 presses against the substrate WF. This seals the space between the lip portion 2336-2 and the substrate WF. The contact surface 2336a of the elastic sealing member 2336 may be coated with a fluororesin coating, such as Teflon® processing made of polytetrafluoroethylene, to prevent natural adhesion and fixation with the substrate WF (preventing blooming). Alternatively, the contact surface 2336a of the elastic sealing member 2336 may be coated by impregnation.

[0067] According to this embodiment, even if a portion of the outer periphery of the surface of the substrate WF to be adsorbed is recessed, forming a step WFa, as shown on the right side of Figure 12, the elastic sealing member 2336 is provided, which prevents air leakage from occurring through the gap created by the step WFa. Therefore, according to this embodiment, the substrate WF can be reliably adsorbed onto the substrate adsorption member 330 regardless of the flatness of the surface of the substrate WF to be adsorbed.

[0068] In addition, according to this embodiment, it is possible to suppress damage to the substrate WF caused by the reaction force of the elastic sealing member. That is, when adsorbing and holding a brittle substrate (for example, a thin glass substrate), there is a risk that the substrate may be damaged by the reaction force of the contracted elastic sealing member. In contrast, the elastic sealing member 2336 in this embodiment is composed of a sealing lip member with a roughly U-shaped cross-section, so that it is possible to ensure sealing performance while keeping the reaction force on the substrate low. As a result, according to this embodiment, it is possible to suppress damage to the substrate WF caused by the reaction force of the elastic sealing member, and the substrate WF can be reliably adsorbed to the substrate adsorption member 330. Note that the elastic sealing member 2336 can also be used in place of the elastic sealing member 1336 in the top ring 1302 shown in Figure 10.

[0069] Next, another modification of the top ring 2302 will be described. Figure 14 is an enlarged cross-sectional view showing a part of the top ring of one embodiment. Figure 15 is an enlarged cross-sectional view showing a part of the top ring of one embodiment. Figure 16 is an enlarged perspective view showing a part of the substrate adsorption member of one embodiment. The top ring of this embodiment is the same as the top ring 2302 of the embodiments shown in Figures 11 to 13, except that a protrusion is formed on the second shielding member, so a description of the similar configuration will be omitted.

[0070] As shown in Figures 14 to 16, the second shielding member 332-2 is an elastic sealing member 233 It has a frame-shaped projection 332-4 surrounding 6. The projection 332-4 protrudes downward from the lower surface of the second shielding member 332-2. The projection 332-4 has a substrate pressing surface 332-4a that is formed to be flush with the substrate adsorption surface 334a of the porous member 334.

[0071] As in this embodiment, by forming a projection 332-4 having a substrate pressing surface 332-4a on the second shielding member 332-2, it is possible to suppress cracking in the outermost part of the substrate. That is, if the substrate pressing surface 332-4a is not provided, when the top ring that holds the substrate WF by suction presses the substrate WF against the polishing pad 352, the outermost part of the substrate WF (the part outside the part that contacts the elastic sealing member 2336) may warp up and crack due to the reaction force from the polishing pad 352. In contrast, in this embodiment, since the substrate pressing surface 332-4a is formed on the projection 332-4 provided on the outside of the elastic sealing member 2336, it is possible to suppress the warping of the outermost part of the substrate WF. As a result, according to this embodiment, it is possible to suppress cracking in the outermost part of the substrate.

[0072] Furthermore, the protruding portion 332-4 is formed to protrude inward from the lower surface of the second shielding member 332-2 (towards the elastic sealing member 2336). As a result, the second shielding member 332-2 has a groove 332-4b formed by the protruding portion 332-4 and the mounting surface 332-2a. The groove 332-4b is a groove into which the elastic sealing member 2336 is fitted. The outer thick portion of the base portion 2336-1 is fitted into the groove 332-4b, thereby fitting and fixing the elastic sealing member 2336 to the second shielding member 332-2 around its entire circumference.

[0073] According to this embodiment, when the elastic sealing member 2336 reaches the end of its lifespan due to wear or other reasons, for example, the elastic sealing member 2336, which is a consumable part, can be easily replaced. That is, since the second shielding member 332-2 has a groove 332-4b for fitting the elastic sealing member 2336 into, a typical worker can easily attach the elastic sealing member 2336 to the second shielding member 332-2 at the site where the substrate processing apparatus 1000 is installed.

[0074] Although several embodiments of the present invention have been described above, the embodiments described above are for the purpose of facilitating understanding of the present invention and do not limit it. The present invention can be modified and improved without departing from its spirit, and of course, equivalents thereof are included in the present invention. Furthermore, any combination or omission of the components described in the claims and specification is possible to the extent that at least some of the above-mentioned problems can be solved or at least some of the effects can be achieved.

[0075] This application discloses a substrate adsorption member, as one embodiment, comprising: a porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reduction portion communicating with a pressure reduction means; a shielding member having a first shielding member that shields the surface of the porous member opposite to the substrate adsorption surface and a frame-shaped second shielding member that shields at least a portion of the side surface of the porous member; and a frame-shaped elastic sealing member attached to the second shielding member so as to surround the porous member and having a contact surface that contacts the substrate.

[0076] Furthermore, the present application discloses a substrate adsorption member in one embodiment, wherein the second shielding member is configured such that the substrate adsorption surface of the porous member protrudes beyond the mounting surface of the elastic sealing member of the second shielding member, and the elastic sealing member is arranged to surround the side surface of the porous member that protrudes beyond the mounting surface of the second shielding member.

[0077] Furthermore, in one embodiment, the present application provides that the elastic sealing member is located in front of the second shielding member. A substrate adsorption member is disclosed, which includes a first elastic sealing member that surrounds the side surface of the porous member that protrudes beyond the mounting surface, and a second elastic sealing member that is spaced apart and located outside the first elastic sealing member.

[0078] Furthermore, in one embodiment, the present application discloses a substrate adsorption member in which the shielding member further includes a frame-shaped third shielding member provided below the second shielding member and spaced apart outside the elastic sealing member, and the first shielding member and the second shielding member have fluid passages for discharging fluid into the space between the elastic sealing member and the third shielding member.

[0079] Furthermore, in one embodiment, the present application discloses a substrate adsorption member in which the elastic sealing member includes a base portion attached to the mounting surface of the second shielding member, a lip portion spaced below the base portion, and a connecting portion connecting the base portion and the lip portion, wherein the contact surface is formed on the lower surface of the lip portion.

[0080] Furthermore, the present application discloses, as one embodiment, a substrate adsorption member in which the second shielding member has a frame-shaped projection surrounding the elastic sealing member, and the projection has a substrate pressing surface formed to be flush with the substrate adsorption surface of the porous member.

[0081] Furthermore, the present application discloses, as one embodiment, a substrate adsorption member in which the second shielding member has a groove formed by the protrusion and the mounting surface for fitting the elastic sealing member, and the elastic sealing member is attached to the second shielding member by the base portion being fitted into the groove.

[0082] Furthermore, the present application discloses, as one embodiment, a substrate adsorption member in which the elastic sealing member is formed in the shape of a rectangular frame having four straight edges.

[0083] Furthermore, the present application discloses an elastic seal assembly to be attached to a substrate adsorption member, as one embodiment, which includes a porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reduction portion communicating with a pressure reduction means, and a shielding member having a first shielding member that shields the surface of the porous member opposite to the substrate adsorption surface and a frame-shaped second shielding member that shields at least a part of the side surface of the porous member, the elastic seal assembly further includes a frame-shaped fixed frame attached to the second shielding member so as to surround the porous member, and a frame-shaped elastic seal member attached to the surface of the fixed frame opposite to the fixed surface attached to the second shielding member, and having a contact surface that contacts the substrate.

[0084] Furthermore, the present application discloses, as one embodiment, a top ring for holding a substrate, comprising a rotating shaft, a base member connected to the rotating shaft, and a substrate adsorption member attached to the base member to which any of the above-described substrate adsorption members or the above-described elastic seal assembly is attached.

[0085] Furthermore, the present application discloses a top ring, in one embodiment, which further includes an abrasive cleaning member configured to supply fluid to the surface of the porous member opposite to the substrate adsorption surface via a channel formed in the base member and the shielding member.

[0086] Furthermore, the present application discloses a substrate processing apparatus, as one embodiment, comprising: a polishing table to which a polishing pad having a polishing surface is attached; a top ring as described above, configured to hold a substrate and press against the polishing surface; and a polishing liquid supply nozzle configured to supply polishing liquid onto the polishing pad. [Explanation of Symbols]

[0087] 18 Top Ring Shaft (Rotating Shaft) 31. Depressurization means (vacuum source) 33 Abrasive cleaning member 34 Fluid supply member 301 Base member 302 Top Ring 303 Flange 305 Spacer 306 Carriers 330 Substrate adsorption material 332 Shielding member 332-1 First shielding member 332-2 Second shielding member 332-2a Mounting surface 332-3 Third shielding member 332-4 Protrusion 332-4a Substrate retaining surface 332-4b Groove 332a Fluid flow path 333 Channels 334 Porous material 334a Board adsorption surface 334b Reduced pressure section 334c Opposite side 334d side 336,1336,2336 Elastic sealing member 336-1 First elastic sealing member 336-2 Second elastic sealing member 336a Contact surface 337 Space 1000 Substrate Processing Equipment 2336-1 Base section 2336-2 Lip section 2336-3 Connection part WF board WFa step

Claims

1. A porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reduction section communicating with a pressure reduction means, A shielding member having a first shielding member that shields the surface of the porous member opposite to the substrate adsorption surface and a frame-shaped second shielding member that shields at least a portion of the side surface of the porous member, A frame-shaped elastic sealing member is attached to the second shielding member so as to surround the porous member and has a contact surface that contacts the substrate, Includes, The second shielding member is configured such that the substrate adsorption surface of the porous member protrudes more than the mounting surface of the elastic sealing member of the second shielding member. The elastic sealing member is positioned to surround the side surface of the porous member that protrudes beyond the mounting surface of the second shielding member. Substrate adsorption component.

2. The elastic sealing member includes a first elastic sealing member that surrounds the side surface of the porous member that protrudes beyond the mounting surface of the second shielding member, and a second elastic sealing member that is spaced apart outside the first elastic sealing member. The substrate adsorption member according to claim 1.

3. The shielding member further includes a frame-shaped third shielding member provided below the second shielding member and spaced apart on the outside of the elastic sealing member, The first shielding member and the second shielding member have fluid passages for discharging fluid into the space between the elastic sealing member and the third shielding member. The substrate adsorption member according to claim 1.

4. The elastic sealing member comprises a base portion attached to the mounting surface of the second shielding member, a lip portion positioned below the base portion at a distance, and the base portion and the lip portion. It includes a connecting portion that connects to the lip portion, and the contact surface is formed on the lower surface of the lip portion. The substrate adsorption member according to claim 1.

5. The second shielding member has a frame-shaped projection surrounding the elastic sealing member, and the projection has a substrate pressing surface formed to be flush with the substrate adsorption surface of the porous member. The substrate adsorption member according to claim 4.

6. The second shielding member has a groove formed by the protrusion and the mounting surface for fitting the elastic sealing member, The elastic sealing member is attached to the second shielding member by fitting the base portion into the groove. The substrate adsorption member according to claim 5.

7. The elastic sealing member is formed in the shape of a rectangular frame having four straight edges. A substrate adsorption member according to any one of claims 1 to 6.

8. An elastic seal assembly to be attached to a substrate adsorption member, comprising: a porous member having a substrate adsorption surface for adsorbing a substrate and a pressure reduction section communicating with a pressure reduction means; and a shielding member having a first shielding member that shields the surface of the porous member opposite to the substrate adsorption surface and a frame-shaped second shielding member that shields at least a portion of the side surface of the porous member, A frame-shaped fixing frame is attached to the second shielding member so as to surround the porous member, A frame-shaped elastic sealing member is attached to the side of the fixed frame opposite to the fixed surface to which the second shielding member is attached, and has a contact surface that contacts the substrate, An elastic seal assembly, including the above.

9. A top ring for holding a substrate, Rotating shaft and A base member connected to the aforementioned rotating shaft, A substrate adsorption member to which a substrate adsorption member according to any one of claims 1 to 6 or an elastic seal assembly according to claim 8 is attached is mounted on the base member, A top ring, including the top ring.

10. The abrasive cleaning member further includes a component configured to supply fluid to the surface of the porous member opposite to the substrate adsorption surface via a channel formed in the base member and the shielding member. The top ring according to claim 9.

11. A polishing table to which a polishing pad having a polishing surface is attached, A top ring according to claim 9, configured to hold the substrate and press against the polishing surface, A polishing liquid supply nozzle configured to supply polishing liquid onto the polishing pad, A substrate processing apparatus, including

Images