Component mounting machine and component mounting method
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- FUJI CORP
- Filing Date
- 2022-11-02
- Publication Date
- 2026-07-30
Smart Images
Figure 0007897774000001 
Figure 0007897774000002 
Figure 0007897774000003
Abstract
Description
Technical Field
[0002] ,
[0003]
[0001] The technology disclosed in this specification relates to a component mounter and a component mounting method for mounting electronic components on a substrate.
Background Art
[0002] In a component mounter for mounting electronic components on a substrate, solder or an adhesive may be applied on the substrate, and an electronic component may be mounted thereon. In such a case, the solder or adhesive applied on the substrate may adhere to the nozzle. When solder or adhesive adheres to the nozzle, it may become impossible to properly suck an electronic component with the nozzle, or the electronic component sucked by the nozzle may not separate from the nozzle, making it impossible to properly mount the electronic component on the substrate. For this reason, technologies for performing a process of removing the solder or adhesive adhering to the nozzle have been developed. For example, Patent Document 1 discloses a component mounter provided with a cleaning device for cleaning the tip of the nozzle. The cleaning device is installed at a predetermined position within the component mounter.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] The component mounting machine described in Patent Document 1 is equipped with a cleaning device, which allows for the cleaning of solder and adhesive adhering to the nozzle tip. However, since the cleaning device is fixed in a predetermined position within the component mounting machine, space is required within the machine to accommodate the cleaning device. There are various types of work involved in mounting electronic components onto a circuit board, and while some may result in solder or adhesive adhering to the nozzle tip, others have a low probability of this occurring. The component mounting machine described in Patent Document 1 has the problem that, because the cleaning device is fixed in place, it is installed unnecessarily even when there is no need to clean the nozzle tip.
[0005] This specification discloses techniques for properly cleaning and washing nozzles as needed. [Means for solving the problem]
[0006] A first component mounting machine disclosed herein mounts electronic components onto a substrate. The component mounting machine includes a head to which a nozzle for picking up electronic components or a coating tool for applying adhesive to a substrate can be attached; a feeder holding unit that detachably holds a plurality of component feeders for supplying electronic components to the nozzle; a first device detachably held in the feeder holding unit and equipped with a sheet on which the adhesive in the coating tool can be test-applied; and a moving device for moving the head, which, when the first device is held in the feeder holding unit and a coating tool is attached to the head, moves the head to perform a test-apply operation in which the adhesive in the coating tool is test-applied using the sheet, while when a nozzle is attached to the head, moves the head to perform a cleaning operation in which dirt adhering to the nozzle is cleaned using the sheet.
[0007] Furthermore, the second component mounting machine disclosed herein mounts electronic components onto a substrate. The component mounting machine includes a head to which a nozzle for adsorbing electronic components can be attached, a feeder holding section that detachably holds a plurality of component feeders for supplying electronic components to the nozzle, a second device detachably held in the feeder holding section and having a storage section capable of storing a viscous substance to be attached to the electronic components, and a moving device for moving the head, which, when the second device is held in the feeder holding section and a viscous substance is stored in the storage section, moves the head to perform a viscous substance attachment operation in which the viscous substance is attached to the electronic components adsorbed by the nozzle attached to the head, while when a cleaning solution is stored in the storage section, moves the head to perform a cleaning operation in which dirt attached to the nozzle attached to the head is cleaned.
[0008] In the first and second component mounting machines described above, the first and second devices can be detachably installed in the feeder holding section. Therefore, there is no need to provide a dedicated space for installing the first and second devices. The first and second devices can be used for cleaning and washing the nozzles. Therefore, when it is necessary to clean and wash the nozzles, the first or second device can be installed in the component mounting machine (specifically, in the feeder holding section).
[0009] Furthermore, the component mounting method disclosed herein also provides the same effects and advantages as the first and second component mounting machines described above. [Brief explanation of the drawing]
[0010] [Figure 1] A diagram showing the schematic configuration of a component mounting machine according to the embodiment. [Figure 2] This is a cross-sectional view along line II-II in Figure 1, showing the state in which the adhesive supply device and the coating status confirmation device are installed in the feeder holding section. [Figure 3] A block diagram showing the control system of a component mounting machine according to an embodiment. [Figure 4] A diagram showing the schematic configuration of a parts feeder. [Figure 5] A diagram showing the schematic configuration of an adhesive supply device. [Figure 6] A diagram showing the schematic configuration of a coating condition confirmation device. [Figure 7] A flowchart illustrating an example of processing using a coating condition confirmation device. [Figure 8] A top view showing the viscous material supply device installed in the feeder holding section. [Figure 9] A diagram showing the schematic configuration of a viscous material supply device. [Figure 10] A flowchart illustrating an example of processing using a viscous material supply device. [Modes for carrying out the invention]
[0011] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing.
[0012] In the first and second component mounting machines disclosed herein, the first and second devices can be detachably installed in the feeder holding section. The first device can be used as a test application device for adhesives and also as a nozzle cleaning device, while the second device can be used as a viscous material supply device and also as a nozzle cleaning device. Therefore, the appropriate device can be installed as needed, and the need to permanently install unnecessary devices can be avoided. Furthermore, by using the first and second devices in conjunction with devices used for other purposes, rather than as dedicated devices for nozzle cleaning, it becomes unnecessary to provide a separate dedicated device for nozzle cleaning, making it possible to perform nozzle cleaning at a low cost.
[0013] In the component mounting machine disclosed herein, the cleaning operation may be an operation in which the tip of the nozzle is pressed against the sheet. With such a configuration, the cleaning operation can be suitably performed.
[0014] In the component mounting machine disclosed in this specification, the first device may store identification information for identifying the first device. The component mounting machine may further include an acquisition unit that can communicate with the first device held by the feeder holding unit and acquire the identification information from the first device, and a storage unit that stores a work program for mounting electronic components on a substrate. When the acquisition unit acquires the identification information and the work program includes an operation of applying an adhesive to the substrate by an application tool, the moving device moves the head to perform a trial application operation. On the other hand, when the work program does not include an operation of applying an adhesive to the substrate by an application tool, the moving device may move the head to perform a cleaning operation. According to such a configuration, by installing the first device in the feeder holding unit, the installed first device can be identified. Also, based on the identification information acquired from the first device and the work program, it is possible to appropriately determine whether to use the first device as a device for performing a trial application operation or a cleaning operation.
[0015] Also, the component mounting method disclosed in this specification is a method for mounting electronic components on a substrate. The component mounting method includes a program acquisition step of acquiring a work program for mounting electronic components on a substrate, an identification information acquisition step of acquiring identification information for identifying a first device having a sheet capable of trial-applying an adhesive in an application tool and held by a feeder holding unit that detachably holds a feeder for supplying electronic components, and an operation execution step of executing an operation using the first device. When the identification information is acquired in the identification information acquisition step and the work program acquired in the program acquisition step includes an operation of applying an adhesive to the substrate by an application tool, a trial application operation of trial-applying the adhesive in the application tool using the sheet is executed. On the other hand, when the work program acquired in the program acquisition step does not include an operation of applying an adhesive to the substrate by an application tool, a cleaning operation of cleaning the dirt adhering to the nozzle using the sheet is executed.
Example
[0016] (Example 1) Referring to the drawings, the component mounter 10 according to the embodiment will be described. The component mounter 10 is a device for mounting electronic components 4 on a circuit board 2. The component mounter 10 is also referred to as an electronic component mounting device or a chip mounter. Usually, the component mounter 10 is installed together with other board working machines such as a solder printer and a board inspection machine to constitute a series of mounting lines.
[0017] As shown in FIGS. 1 to 3, the component mounter 10 includes a feeder holding part 14, a head 16, an imaging device 20, a moving device 18 for moving the head 16 and the imaging device 20, a board conveyor 22, an operation panel 24, a communication part 28, and a control device 26.
[0018] The feeder holding part 14 has a plurality of slots, and a component feeder 30 (described later) can be detachably installed in each of the plurality of slots. The feeder holding part 14 may be fixed to the component mounter 10 or may be detachable from the component mounter 10. As shown in FIG. 2, the feeder holding part 14 has a connector 15. In FIG. 2, it shows a state where the component feeder 30 (and the adhesive supply device 60, coating state confirmation device 80, and viscous body supply device 50 described later) is not installed in the slot on the +X direction side. The connector 15 is provided at a position where it connects to the connector 40 (described later) of the component feeder 30 when the component feeder 30 is installed on the feeder holding part 14. Also, an adhesive supply device 60, a coating state confirmation device 80, and a viscous body supply device 50 can be detachably installed on the feeder holding part 14. The component feeder 30, the adhesive supply device 60, the coating state confirmation device 80, and the viscous body supply device 50 will be described in detail later.
[0019] The head 16 is detachably attached to the mobile base 18a (described later) of the mobile device 18. The head 16 has one or more nozzles 6 for picking up electronic components 4. The nozzles 6 are detachably attached to the head 16. The head 16 is movable with the nozzles 6 in the Z direction (here, the vertical direction), and moves the nozzles 6 closer to and further away from the component feeder 30 and circuit board 2 installed in the feeder holding unit 14. The head 16 can pick up electronic components 4 supplied from the component feeder 30 with the nozzles 6 and mount the electronic components 4 picked up by the nozzles 6 onto the circuit board 2. Different types of heads 16 can be attached to the mobile base 18a depending on the type of electronic component 4. In addition, a head 16 to which an adhesive tool 66 (described later) can be attached can also be attached to the mobile base 18a.
[0020] The imaging device 20 is fixed to the mobile base 18a (described later) and moves integrally with the mobile base 18a. The imaging device 20 is equipped with a camera and a light source. The camera is positioned so that its imaging direction faces downward and images the upper surface of the circuit board 2 and the upper surface of the sheet 84 (described later) provided by the coating state confirmation device 80. For example, a CCD camera is used as the camera. The light source is composed of LEDs and illuminates the upper surface of the circuit board 2 and the upper surface of the sheet 84. Image data of the images captured by the imaging device 20 is stored in the memory (not shown) of the control device 26.
[0021] The moving device 18 moves the head 16 and the imaging device 20 between the parts feeder 30 and the circuit board 2. In this embodiment, the moving device 18 is an XY robot that moves the moving base 18a in the X and Y directions. The moving device 18 consists of guide rails that guide the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rails, and a motor that drives the moving mechanism. The moving device 18 is positioned above the parts feeder 30 and the circuit board 2. The head 16 and the imaging device 20 are attached to the moving base 18a. The head 16 and the imaging device 20 move above the parts feeder 30, adhesive supply device 60, coating state confirmation device 80, or viscous substance supply device 50 installed in the feeder holding section 14, and above the circuit board 2, by the moving device 18.
[0022] The substrate conveyor 22 transports the circuit board 2 in the X direction. In this embodiment, the substrate conveyor 22 consists of a pair of belt conveyors, a support device attached to the belt conveyors and supporting the circuit board 2 from below, and a drive device that drives the belt conveyors. The substrate conveyor 22 receives the circuit board 2 from an adjacent substrate work machine on one side and carries it into the component mounting machine 10, where it positions the circuit board 2 at the component mounting position. Once the mounting of electronic components 4 on the circuit board 2 is complete, the substrate conveyor 22 unloads the circuit board 2 from the component mounting machine 10 and hands it over to an adjacent substrate work machine on the other side.
[0023] The control device 26 is configured using a computer equipped with a CPU and a memory device. The control device 26 controls the operation of each part of the component mounting machine 10 based on the production program transmitted from the management device 8. As shown in Figure 3, the control device 26 is connected to the head 16, the moving device 18, the imaging device 20, the substrate conveyor 22, the operation panel 24, and the communication unit 28, and controls each part of the head 16, the moving device 18, the imaging device 20, the substrate conveyor 22, the operation panel 24, and the communication unit 28. In addition, the control device 26 acquires identification information (described later) to identify devices such as the component feeder 30, adhesive supply device 60, coating state confirmation device 80, and viscous material supply device 50 installed in the feeder holding unit 14 via the connector 15.
[0024] The control panel 24 is a display device that provides the operator with various information about the component mounting machine 10, and also an input device that receives instructions and information from the operator. The communication unit 28 sends and receives information with the management device 8. Specifically, the communication unit 28 receives information about the production program from the management device 8.
[0025] The component feeder 30 is detachably installed in the feeder holding section 14 and supplies electronic components 4 to the component mounting machine 10 (specifically, the nozzle 6). As shown in Figure 4, the component feeder 30 comprises a main body 32, a reel 34 detachably attached to the main body 32, a tape delivery mechanism 38, a connector 40, and a control device 42.
[0026] A long tape 36 containing multiple electronic components 4 at regular intervals is wound around the reel 34. The tape feeding mechanism 38 feeds out a fixed amount of the tape 36 containing the electronic components 4 from the reel 34. The amount of tape 36 fed out by the tape feeding mechanism 38 is set according to the spacing of the electronic components 4 contained in the tape 36. The electronic components 4 on the fed-out tape 36 are picked up by the head 16 at the component pick-up position 44. The reel 34 is replaceable with the main body 32 of the component feeder 30.
[0027] The connector 40 is located on the +Y side of the parts feeder 30 (i.e., the side facing the substrate conveyor 22 when the parts feeder 30 is installed in the feeder holding unit 14). When the parts feeder 30 is installed in the feeder holding unit 14, the connector 40 is connected to the connector 15 of the feeder holding unit 14. The control device 42 controls various parts of the parts feeder 30. The memory of the control device 42 (not shown) stores identification information to identify the parts feeder 30.
[0028] In this embodiment, the component feeder 30 is a tape-type component feeder, but the configuration is not limited to this. For example, the component feeder may be a tray-type component feeder that stores multiple electronic components 4 on a tray, or a bulk-type component feeder that stores multiple electronic components 4 randomly in a container.
[0029] The adhesive supply device 60 is detachably installed on the feeder holding unit 14 and supplies adhesive to the component mounting machine 10. As shown in Figure 5, the adhesive supply device 60 comprises a main body 62, a pocket 64 provided in the main body 62, an adhesive tool 66, a heater 68, a connector 70, and a control device 72.
[0030] The main body 62 has a shape that allows it to be installed in the feeder holding section 14. That is, the main body 62 has a shape that conforms to the slots of the feeder holding section 14. The X-direction dimension of the main body 62 is larger than the X-direction dimension of the parts feeder 30. For this reason, the adhesive supply device 60 is installed across multiple slots (two slots in this embodiment) of the feeder holding section 14.
[0031] Pocket 64 is provided on the upper surface of the main body 62 on the +Y direction side. Pocket 64 has a shape that can accommodate an adhesive tool 66. The adhesive tool 66 is housed in pocket 64. The adhesive tool 66 contains adhesive (e.g., glue). The adhesive tool 66 is mounted on a head 16 of a type that can accommodate the adhesive tool 66, and is moved between the adhesive supply device 60 and the circuit board 2 by a moving device 18 while mounted on the head 16. The adhesive tool 66 is used to apply adhesive to the circuit board 2. When the adhesive tool 66 is mounted on the head 16, pressure is applied to the adhesive inside the adhesive tool 66 by a pressure applying device (not shown), causing the adhesive inside the adhesive tool 66 to be discharged from the tip.
[0032] The heater 68 is positioned around the pocket 64. The heater 68 adjusts the temperature of the adhesive tool 66 housed in the pocket 64. In order to apply the adhesive to the circuit board 2 in a stable state, the adhesive needs to be adjusted to a predetermined temperature higher than room temperature. By positioning the heater 68 near the pocket 64, the temperature of the adhesive housed in the adhesive tool 66 can be suitably adjusted while the adhesive tool 66 is housed in the pocket 64.
[0033] The connector 70 is located on the side of the adhesive supply device 60 in the +Y direction (i.e., the side facing the substrate conveyor 22 when the adhesive supply device 60 is installed in the feeder holding unit 14). When the adhesive supply device 60 is installed in the feeder holding unit 14, the connector 70 is connected to the connector 15 of the feeder holding unit 14. The control device 72 controls each part of the adhesive supply device 60. The memory of the control device 72 (not shown) stores identification information to identify the adhesive supply device 60.
[0034] The coating state confirmation device 80 is used to confirm whether the adhesive is properly applied from the adhesive tool 66 housed in the adhesive supply device 60 (i.e., the adhesive application state). In this embodiment, the coating state confirmation device 80 is also used to clean any dirt adhering to the nozzle 6. The coating state confirmation device 80 is detachably installed in the feeder holding unit 14. As shown in Figure 6, the coating state confirmation device 80 comprises a main body 82, a sheet 84, a supply unit 86 for supplying the sheet 84, a winding unit 88 for winding the sheet 84, a motor 89, a connector 90, and a control device 92.
[0035] The main body 82, like the main body 62 of the adhesive supply device 60, has a shape that allows it to be installed in the feeder holding section 14. The X-direction dimension of the main body 82 is larger than the X-direction dimension of the parts feeder 30. For this reason, the coating state confirmation device 80 is installed across multiple slots (two slots in this embodiment) of the feeder holding section 14.
[0036] The sheet 84 is used to test-apply the adhesive using the adhesive tool 66 housed in the adhesive supply device 60 (i.e., to test-apply the adhesive). In this embodiment, the sheet 84 is also used to remove dirt adhering to the nozzle 6. The sheet 84 is supplied from the supply unit 86, exposed to the outside from the main body 82 at the test application position 85, and wound onto the winding unit 88. The supply unit 86 and the winding unit 88 are rotatably supported by the main body 82. A motor 89 is connected to the winding unit 88, and the motor 89 rotates the winding unit 88 in the direction that winds up the sheet 84 (clockwise in Figure 7). As the winding unit 88 rotates and winds up the sheet 84, the sheet 84 is pulled, causing the supply unit 86 to rotate as well.
[0037] The connector 90 is located on the side of the coating status confirmation device 80 in the +Y direction (i.e., the side facing the substrate conveyor 22 when the coating status confirmation device 80 is installed in the feeder holding unit 14). When the coating status confirmation device 80 is installed in the feeder holding unit 14, the connector 90 is connected to the connector 15 of the feeder holding unit 14. The control device 92 controls each part of the coating status confirmation device 80. The memory of the control device 92 (not shown) stores identification information to identify the coating status confirmation device 80.
[0038] Next, we will describe the operation using the coating status confirmation device 80 installed in the component mounting machine 10. In this embodiment, once the coating status confirmation device 80 is installed in the component mounting machine 10, two types of operations using the coating status confirmation device 80 become possible. One is the operation of test-applying adhesive to the sheet 84 using the adhesive tool 66 housed in the adhesive supply device 60 (hereinafter also referred to as the test-applying operation), and the other is the operation of transferring the dirt attached to the nozzle 6 to the sheet 84 and cleaning the nozzle 6 (hereinafter also referred to as the cleaning operation). Below, we will describe an example in which either the test-applying operation or the cleaning operation is performed using the coating status confirmation device 80.
[0039] As shown in Figure 7, first, the control device 26 determines whether or not it has acquired the work program transmitted from the management device 8 via the communication unit 28 (S12). Based on the work program transmitted from the management device 8, the component mounting machine 10 executes the process of mounting electronic components 4 onto the circuit board 2 (hereinafter also referred to as the mounting process). If the work program has not been acquired (NO in step S12), it waits until it acquires the work program transmitted from the management device 8.
[0040] When the work program is acquired (YES in step S12), the control device 26 determines whether or not a device such as a parts feeder 30 has been installed in each slot of the feeder holding unit 14 (S14). The work of installing the devices such as parts feeders 30 in each slot may be performed by an operator, or a moving device (not shown) that moves the devices such as parts feeders 30 from a predetermined storage unit to the feeder holding unit 14 may perform this automatically according to instructions transmitted from the management device 8. In this embodiment, the feeder holding unit 14 is equipped with a parts feeder 30 and a coating status confirmation device 80. Additionally, an adhesive supply device 60 is also installed in the feeder holding unit 14 as needed. For example, when a parts feeder 30 is installed in a slot of the feeder holding unit 14, the connector 15 provided in the slot and the connector 40 of the parts feeder 30 are connected, and identification information of the parts feeder 30 is output to the control device 26 via connectors 40 and 15. In this embodiment, in addition to the parts feeder 30, an adhesive supply device 60 or a coating status confirmation device 80 can also be installed in the slot. Identification information of the adhesive supply device 60 or coating status confirmation device 80 installed in the slot is output from the connector 70 of the adhesive supply device 60 or the connector 90 of the coating status confirmation device 80 via the connector 15 provided in the slot. Not all slots of the feeder holding unit 14 may have devices installed, and which of the multiple slots will have devices installed can be determined from the work program acquired in step S12. Identification information is output from each slot via the connector 15 (specifically, the connector 15 and one of the connectors 40, 70, or 90 of each device), making it possible to determine whether or not a device has been installed in each slot, and to identify what type of device has been installed in each slot. If there are slots without a device installed (NO in step S14), the system waits until a device is installed in each slot.
[0041] When a device is installed in each slot (YES in step S14), the control device 26 determines whether or not the coating status confirmation device 80 is included among the devices installed in the feeder holding unit 14 (S16). In this embodiment, the coating status confirmation device 80 is used for either a test coating operation or a cleaning operation. If the coating status confirmation device 80 is not installed in the feeder holding unit 14 (NO in step S16), the control device 26 determines that neither the test coating operation nor the cleaning operation will be performed in the mounting process, and terminates the process of this embodiment.
[0042] On the other hand, if the coating state confirmation device 80 is installed in the feeder holding unit 14 (YES in step S16), the control device 26 determines whether or not the mounting process includes a process of supplying adhesive (S18). For example, the control device 26 can determine whether or not the mounting process includes a process of supplying adhesive based on the work program acquired in step S12. Also, if the process of supplying adhesive is to be performed, the adhesive supply device 60 must be installed in the feeder holding unit 14. For this reason, the control device 26 may determine whether or not the mounting process includes a process of supplying adhesive based on whether or not the adhesive supply device 60 was installed in the feeder holding unit 14 in step S14. Also, if the process of supplying adhesive is to be performed, a head 16 capable of mounting an adhesive tool 66 (described later) is attached to the mobile base 18a. For this reason, the control device 26 may determine whether or not the mounting process includes a process of supplying adhesive based on the type of head 16 attached to the mobile base 18a.
[0043] If the process includes supplying adhesive (YES in step S18), the control device 26 performs a test application operation on the sheet 84 of the application state confirmation device 80 (S20). That is, the control device 26 determines that the application state confirmation device 80 is installed in the feeder holding unit 14 in order to perform the test application operation, which is one of the two operations between the test application operation and the cleaning operation, and performs the test application operation.
[0044] For example, the test application operation is performed as follows: The test application operation is performed with the adhesive supply device 60 and the application status confirmation device 80 installed in the feeder holding unit 14. In addition, the operation to confirm the application status of the adhesive is performed before the adhesive is applied to the circuit board 2.
[0045] First, the control device 26 attaches the adhesive tool 66, housed in the adhesive supply device 60, to the head 16. Next, the control device 26 moves the adhesive tool 66 above the test application position 85 and applies the adhesive from the adhesive tool 66 onto the sheet 84 exposed at the test application position 85. Next, the control device 26 moves the imaging device 20 above the test application position 85 and images the test application position 85 from above. Next, the control device 26 determines from the captured image whether the size and shape of the applied adhesive are within a predetermined range. Finally, the control device 26 transmits information to the application status confirmation device 80 via connectors 15 and 90 indicating that the test application is complete.
[0046] When the control device 92 of the coating status confirmation device 80 receives information from the control device 26 that the test coating is complete, it drives the motor 89 by a predetermined amount and winds up the sheet 84 in the winding unit 88. As a result, the sheet 84 to which the adhesive has been applied during the test coating moves from the test coating position 85 towards the winding unit 88, and the sheet 84 without adhesive is exposed at the test coating position 85.
[0047] On the other hand, if the process of supplying adhesive is not included (NO in step S18), the control device 26 performs a cleaning operation on the sheet 84 of the coating state confirmation device 80 (S22). In other words, the control device 26 determines that the coating state confirmation device 80 has been installed in the feeder holding unit 14 in order to perform the cleaning operation, which is one of the two operations between the trial coating operation and the cleaning operation.
[0048] For example, the cleaning operation is performed as follows: The cleaning operation is performed with the nozzle 6 attached to the head 16. The control device 26 moves the nozzle 6 above the test application position 85 and presses the nozzle 6 onto the sheet 84 exposed at the test application position 85. Solder or adhesive applied to the circuit board 2 may adhere to the nozzle 6. By pressing the nozzle 6 onto the sheet 84, the dirt (solder, adhesive, etc.) attached to the nozzle 6 is transferred to the sheet 84, and the dirt attached to the nozzle 6 can be removed. The cleaning operation is performed according to the work program acquired in step S12. For example, the cleaning operation can be performed after multiple operations of mounting electronic components 4 onto the circuit board 2. The cleaning operation may also be performed at the instruction of the operator. For example, when the operator discovers that dirt has adhered to the nozzle 6, the operator may instruct the operation to be performed from the control panel 24.
[0049] In this embodiment, the coating state confirmation device 80 can be installed in the feeder holding section 14 where the component feeder 30 is installed. This allows the coating state confirmation device 80 to be installed as needed, avoiding the need to permanently install unnecessary equipment in the component mounting machine 10. Furthermore, the coating state confirmation device 80 can be used as both a device for performing a test coating operation and a device for performing a cleaning operation. By enabling the cleaning operation to be performed using the device for performing the test coating operation, there is no need to separately provide a dedicated device for removing dirt from the nozzle 6, and the nozzle 6 can be cleaned at a low cost.
[0050] In this embodiment, only one of either a test application operation or a cleaning operation was performed using the application status confirmation device 80, but the configuration is not limited to this. Multiple application status confirmation devices 80 may be installed in the feeder holding unit 14, and a test application operation may be performed with a specific application status confirmation device 80 while a cleaning operation is performed with other application status confirmation devices 80. In this case, the work program acquired in step S12 includes information on the location of the slot where the application status confirmation device 80 is installed and whether the application status confirmation device 80 installed at that location is used for a test application operation or a cleaning operation. When the control device 26 performs the work of applying adhesive to the circuit board 2 according to the work program, it performs a test application operation using the application status confirmation device 80 for the test application operation, and when it performs the work of mounting electronic components 4 on the circuit board 2, it performs a cleaning operation using the application status confirmation device 80 for the cleaning operation.
[0051] (Example 2) In the above embodiment, the coating condition confirmation device 80 was used to remove dirt adhering to the nozzle 6, but the configuration is not limited to this. For example, the viscous material supply device 50, which supplies a viscous material to be applied to the lower surface of the electronic component 4, may be repurposed as a device for removing dirt adhering to the nozzle 6.
[0052] As shown in Figure 8, the viscous material supply device 50 is detachably installed in the feeder holding section 14. As shown in Figure 9, the viscous material supply device 50 comprises a main body 52, a storage section 54, a connector 56, and a control device 58. The main body 52 has a shape that allows it to be installed in the feeder holding section 14, similar to the main body 62 of the adhesive supply device 60 and the main body 82 of the coating state confirmation device 80. The X-direction dimension of the main body 52 is larger than the X-direction dimension of the parts feeder 30. For this reason, the viscous material supply device 50 is installed across multiple slots (two slots in this embodiment) of the feeder holding section 14.
[0053] The storage section 54 is a rectangular box shape when viewed from above, and a viscous substance is stored inside. The viscous substance is used by attaching it to the electronic component 4 (for example, the electrodes of the electronic component 4) when mounting the electronic component 4 onto the circuit board 2. In this embodiment, the viscous substance is flux. Furthermore, when the viscous substance supply device 50 is repurposed as a device for removing dirt adhering to the nozzle 6, a cleaning solution for cleaning the nozzle 6 is stored in the storage section 54.
[0054] The connector 56 is located on the side of the viscous material supply device 50 in the +Y direction (i.e., the side facing the substrate conveyor 22 when the viscous material supply device 50 is installed in the feeder holding unit 14). When the viscous material supply device 50 is installed in the feeder holding unit 14, the connector 56 is connected to the connector 15 of the feeder holding unit 14. The control device 58 controls each part of the viscous material supply device 50. The memory of the control device 58 (not shown) stores identification information to identify the viscous material supply device 50.
[0055] Next, we will describe the operation using the viscous substance supply device 50 installed in the component mounting machine 10. In this embodiment as well, once the viscous substance supply device 50 is installed in the component mounting machine 10, two types of operations using the viscous substance supply device 50 become possible. One is the operation of attaching the viscous substance contained inside the storage section 54 of the viscous substance supply device 50 to the lower surface of the electronic component 4 (hereinafter also referred to as the viscous substance attachment operation), and the other is the operation of cleaning the tip of the nozzle 6 with the cleaning liquid contained inside the storage section 54 (hereinafter also referred to as the cleaning operation). Below, we will describe an example in which either the viscous substance attachment operation or the cleaning operation is performed using the viscous substance supply device 50.
[0056] As shown in Figure 10, first, the control device 26 determines whether or not it has acquired the work program transmitted from the management device 8 via the communication unit 28 (S32). If the work program has not been acquired (NO in step S32), it waits until it acquires the work program transmitted from the management device 8. Once the work program has been acquired (YES in step S32), the control device 26 determines whether or not devices such as component feeders 30 have been installed in each slot of the feeder holding unit 14 (S34). If there are slots where no devices have been installed (NO in step S34), it waits until devices have been installed in each slot. Note that the processing in steps S32 and S34 is the same as the processing in steps S12 and S14 of the above embodiment 1, so a detailed explanation is omitted.
[0057] In this embodiment, a parts feeder 30 and a viscous material supply device 50 are installed in the feeder holding section 14. Specifically, when performing a viscous material adhesion operation using the viscous material supply device 50, the viscous material supply device 50 is installed with the viscous material contained in the storage section 54, and when performing a cleaning operation using the viscous material supply device 50, the viscous material supply device 50 is installed with the cleaning liquid contained in the storage section 54. When a parts feeder 30 or a viscous material supply device 50 is installed in each slot, the connector 15 provided in the slot is connected to the connector 40 of the parts feeder 30 or the connector 56 of the viscous material supply device 50, and identification information of the parts feeder 30 or the viscous material supply device 50 is output to the control device 26.
[0058] When a device is installed in each slot (YES in step S34), the control device 26 determines whether the device installed in the feeder holding unit 14 includes a viscous material supply device 50 (S36). In this embodiment, the viscous material supply device 50 is used for either a viscous material adhesion operation or a cleaning operation. If the viscous material supply device 50 is not installed in the feeder holding unit 14 (NO in step S36), the control device 26 determines that neither the viscous material adhesion operation nor the cleaning operation will be performed in the mounting process, and terminates the process in this embodiment.
[0059] On the other hand, if the viscous substance supply device 50 is installed in the feeder holding unit 14 (YES in step S36), the control device 26 determines whether the work program acquired in step S32 includes the operation of attaching viscous substance to the underside of the electronic component 4 (S38). If the operation of attaching viscous substance to the underside of the electronic component 4 is included (YES in step S38), the control device 26 performs the viscous substance attachment operation on the viscous substance supply device 50 (S40). In other words, the control device 26 determines that the viscous substance supply device 50 was installed in the feeder holding unit 14 in order to perform the viscous substance attachment operation, which is one of the two operations between the viscous substance attachment operation and the cleaning operation. In this case, in step S34, the viscous substance supply device 50 with viscous substance stored in the storage unit 54 is installed in the feeder holding unit 14. The viscous substance attachment operation is performed with the nozzle 6 adsorbing the electronic component 4. The control device 26 moves the nozzle 6 that has adsorbed the electronic component 4 above the storage unit 54, and then lowers the nozzle 6. Then, the lower surface of the electronic component 4 comes into contact with the viscous substance in the reservoir 54, and the viscous substance adheres to the lower surface of the electronic component 4. Once the viscous substance adhesion operation is performed, the control device 26 mounts the electronic component 4 with the viscous substance attached to it onto the circuit board 2.
[0060] On the other hand, if the process does not include the application of a viscous substance to the underside of the electronic component 4 (YES in step S38), the control device 26 performs a cleaning operation on the viscous substance supply device 50 (S42). That is, the control device 26 determines that the viscous substance supply device 50 is installed in the feeder holding unit 14 to perform the cleaning operation, which is one of the two operations between the application of the viscous substance and cleaning. In this case, in step S34, the viscous substance supply device 50, with cleaning liquid stored in the storage unit 54, is installed in the feeder holding unit 14. The cleaning operation is performed to clean the tip of the nozzle 6, and is therefore performed when the electronic component 4 is not adsorbed onto the nozzle 6. The control device 26 moves the nozzle 6, which is not adsorbing the electronic component 4, above the storage unit 54, and then lowers the nozzle 6. As a result, the tip of the nozzle 6 is immersed in the cleaning liquid in the storage unit 54. This cleans the tip of the nozzle 6. The cleaning operation is performed according to the work program acquired in step S22. For example, the cleaning operation can be performed after each subsequent operation of mounting electronic components 4 onto the circuit board 2. Alternatively, the cleaning operation may be performed at the operator's instruction. For example, when an operator discovers that dirt has adhered to the nozzle 6, the operator may instruct the system to perform the cleaning operation from the control panel 24.
[0061] In this embodiment as well, the viscous material supply device 50, which can be installed in the feeder holding section 14, is used as a device for performing the viscous material adhesion operation and also as a device for performing the cleaning operation. Therefore, a device for cleaning the tip of the nozzle 6 can be installed as needed, and it is possible to avoid providing a separate dedicated device for cleaning the tip of the nozzle 6.
[0062] In this embodiment as well, multiple viscous material supply devices 50 may be installed in the feeder holding unit 14, and a viscous material adhesion operation may be performed with a specific viscous material supply device 50, while a cleaning operation may be performed with other viscous material supply devices 50. In this case, the work program acquired in step S32 includes information on the location of the slot in which the viscous material supply device 50 is installed, and whether viscous material or cleaning liquid is stored in the storage unit 54 of the viscous material supply device 50 installed in that slot. The control device 26, according to the work program, performs a viscous material adhesion operation using the viscous material supply device 50 containing viscous material when an electronic component 4 is attracted to the nozzle 6, and performs a cleaning operation using the viscous material supply device 50 containing cleaning liquid when an electronic component 4 is not attracted to the nozzle 6.
[0063] Furthermore, in the above embodiments 1 and 2, only one of the coating state confirmation device 80 and the viscous substance supply device 50 was installed in the feeder holding unit 14, but both the coating state confirmation device 80 and the viscous substance supply device 50 may be installed in the feeder holding unit 14. In this case as well, the coating state confirmation device 80 may be used to perform either a test coating operation or a cleaning operation, or multiple coating state confirmation devices 80 may be installed in the feeder holding unit 14 to perform both a test coating operation and a cleaning operation. Similarly, the viscous substance supply device 50 may be used to perform either a viscous substance adhesion operation or a cleaning operation, or multiple viscous substance supply devices 50 may be installed in the feeder holding unit 14 to perform both a viscous substance adhesion operation and a cleaning operation. In addition, if both the coating state confirmation device 80 and the viscous substance supply device 50 are installed in the feeder holding unit 14, both a cleaning operation using the coating state confirmation device 80 and a cleaning operation using the viscous substance supply device 50 may be performed. This makes it possible to more reliably remove dirt from the tip of the nozzle 6.
[0064] The following points should be noted regarding the circuit board work machine described in the embodiment. In the embodiment, the component mounting machine 10 is an example of a "circuit board work machine," the electronic component 4 is an example of a "component," the connector 15 is an example of an "acquisition unit," the head 16 is an example of a "head," the control device 26 is an example of a "storage unit," the viscous material supply device 50 is an example of a "second device," the adhesive tool 66 is an example of a "coating tool," and the coating state confirmation device 80 is an example of a "first device."
[0065] The specific examples of the technologies disclosed herein have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technologies described in the claims include various modifications and changes to the specific examples described above. Furthermore, the technical elements described herein or in the drawings exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technologies illustrated herein or in the drawings achieve multiple objectives simultaneously, and achieving even one of these objectives constitutes technical usefulness in itself. [Explanation of Symbols]
[0066] 2: Circuit board 4: Electronic components 6: Nozzle 10: Component mounting machine 14: Feeder holding section 16: Head 18: Mobile device 18a: Mobile base 20: Circuit board conveyor 24: Control Panel 26: Control device for component mounting machine 28: Communications Department 30: Parts feeder 34: Reel 40: Connectors for parts feeders 42: Control device for parts feeder 50: Viscous material supply device 54: Storage section 56: Connector for viscous material supply device 58: Control device for viscous material supply device 60: Adhesive supply device 66: Adhesive Tools 70: Connector for adhesive supply device 72: Control device for adhesive supply device 80: Coating condition confirmation device 84: Sheet 90: Connector for coating status confirmation device 92: Control device for checking the coating status
Claims
1. A component mounting machine for mounting electronic components onto a circuit board, A head to which a nozzle for adsorbing the electronic component or an application tool for applying adhesive to the substrate can be attached, A feeder holding unit that detachably holds a plurality of component feeders that supply the aforementioned electronic components to the nozzle, The first apparatus includes a sheet that is detachably held in the feeder holding section and on which the adhesive in the application tool can be test-applied, A moving device for moving the head, wherein when the first device is held in the feeder holding section and the mounting process for mounting the electronic components onto the substrate includes the process of applying the adhesive to the substrate with the application tool, the moving device moves the head to perform a test application operation in which the adhesive in the application tool is test applied using the sheet, while when the mounting process does not include the process of applying the adhesive to the substrate with the application tool, the moving device moves the head to perform a cleaning operation in which dirt adhering to the nozzle is cleaned using the sheet, A component mounting machine equipped with the following features.
2. The component mounting machine according to claim 1, wherein the cleaning operation is the operation of pressing the tip of the nozzle against the sheet.
3. The first device stores identification information to identify the first device, An acquisition unit which is capable of communicating with the first device held in the feeder holding unit and acquires the identification information from the first device, A storage unit that stores a work program for mounting the aforementioned electronic components onto the substrate, It also has the following features: The component mounting machine according to claim 1 or 2, wherein the moving device moves the head to perform the test application operation when the acquisition unit has acquired the identification information and the work program includes the operation of applying the adhesive to the substrate with the application tool, while moving the head to perform the cleaning operation when the work program does not include the operation of applying the adhesive to the substrate with the application tool.
4. A component mounting machine for mounting electronic components onto a circuit board, A head to which a nozzle for adsorbing the aforementioned electronic component can be attached, A feeder holding unit that detachably holds a plurality of component feeders that supply the aforementioned electronic components to the nozzle, A second device comprising a storage section detachably held in the feeder holding section and capable of storing a viscous substance to be attached to the electronic components, A moving device for moving the head, wherein when the second device is held in the feeder holding section, and the work program for mounting the electronic components onto the substrate includes the work of attaching the viscous substance to the electronic components, the moving device moves the head to perform a viscous substance attachment operation in which the viscous substance is attached to the electronic components that are attracted to the nozzle mounted on the head, while when the work program does not include the work of attaching the viscous substance to the electronic components, the moving device moves the head to perform a cleaning operation in which dirt attached to the nozzle mounted on the head is cleaned. A component mounting machine equipped with the following features.
5. A method for mounting electronic components onto a circuit board, A program acquisition step to acquire a work program for mounting the aforementioned electronic components onto the substrate, An identification information acquisition step is to acquire identification information for the first device from a first device which is equipped with a sheet on which adhesive in a coating tool can be test-applied, and which is held in a feeder holding part that detachably holds a feeder that supplies the electronic components, An operation execution step for performing an operation using the first apparatus, wherein when the identification information is acquired by the identification information acquisition step, and the work program acquired in the program acquisition step includes the operation of applying adhesive to the substrate with an application tool, a trial application operation is performed to test apply the adhesive in the application tool using the sheet; on the other hand, if the work program acquired in the program acquisition step does not include the operation of applying adhesive to the substrate with an application tool, a cleaning operation is performed to clean dirt adhering to the nozzle that adsorbs the electronic component using the sheet; A component mounting method comprising the following features.