Holding device

Abstract

To provide a retainer in which a temperature can be easily adjusted, and a design freedom level of a measurement resistance body is high.SOLUTION: A retainer comprises: a plate-like member 10 that includes a first front surface S1 that is orthogonal to a first direction, and holds an objective material and a second front surface S2 that is positioned to the side opposite to the first front surface S1; a measurement resistance body 60 that is formed in an internal part of the plate-like member 10; and a heater 50 that is formed in an internal part of the plate-like member 10, and is arranged to the second front surface S2 side from the measurement resistance body 60. In the plate-like member 10, a first gas flow channel 14 that is extended to a second direction that is parallel to the first front surface S1 and a plurality of gas jet holes 15 that is communicated with the is first gas flow channel 14 and is extended to the first direction from the first gas flow channel 14 to the first front surface S1 are formed. The first gas flow channel 14 is arranged to the first front surface S1 side from the measurement resistance body 60.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a holding device.

Background Art

[0002] As a holding device that holds an object such as a wafer on a holding surface and heats it, the heating device described in Japanese Unexamined Patent Application Publication No. 2020-77652 (hereinafter referred to as Patent Document 1) is used. This heating device includes a holding body made of ceramics, a heater electrode provided inside the holding body, and an RTD (Resistance Temperature Detector) electrode. Here, the RTD electrode is a temperature measuring resistor that can measure the temperature around the RTD electrode by changing the resistance value. Inside the holding body, a gas flow path extending in a direction parallel to the holding surface is further formed. The gas flow path is arranged on the holding surface side (upper side) of the heater electrode and on the opposite side (lower side) of the holding surface from the RTD electrode. The holding body is provided with a plurality of flow paths that extend in the vertical direction and communicate the gas flow path with a plurality of gas discharge holes provided on the holding surface.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above configuration, since the gas flow path is provided between the heater electrode and the RTD electrode, the heater electrode and the RTD electrode are arranged apart from each other. Therefore, it is difficult to coordinate the heating by the heater electrode and the temperature measurement by the RTD electrode, and there is a possibility that precise temperature adjustment becomes difficult. Further, since the RTD electrode is arranged on the holding surface side of the gas flow path, the RTD electrode has to be formed in a form that avoids the plurality of flow paths, and the design of the RTD electrode may be restricted.

[0005] This disclosure was completed based on the circumstances described above, and aims to provide a holding device that allows for easy temperature adjustment and offers a high degree of design freedom for the resistance thermometer. [Means for solving the problem]

[0006] The holding device of this disclosure comprises a plate-shaped member having a first surface perpendicular to a first direction on which an object is held and a second surface located opposite to the first surface, a resistance thermometer formed inside the plate-shaped member, and a heater formed inside the plate-shaped member and positioned on the second surface side of the resistance thermometer, wherein the plate-shaped member has a first gas flow path extending in a second direction parallel to the first surface, and a plurality of gas ejection holes communicating with the first gas flow path and extending in the first direction from the first gas flow path to the first surface, and the first gas flow path is positioned on the first surface side of the resistance thermometer. [Effects of the Invention]

[0007] According to this disclosure, it is possible to provide a holding device that allows for easy temperature control and offers a high degree of design freedom for the resistance thermometer. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic perspective view showing the external configuration of an electrostatic chuck according to an embodiment. [Figure 2] Figure 2 is a schematic plan view of an electrostatic chuck. [Figure 3] Figure 3 is a schematic cross-sectional view of an electrostatic chuck. [Figure 4] Figure 4 is a schematic diagram showing the configuration of a resistance thermometer in the XY plane. [Modes for carrying out the invention]

[0009] [Description of Embodiments in this Disclosure] First, embodiments of this disclosure will be listed and described. (1) The holding device of the present disclosure comprises a plate-shaped member having a first surface perpendicular to a first direction on which an object is held and a second surface located on the opposite side of the first surface, a resistance thermometer formed inside the plate-shaped member, and a heater formed inside the plate-shaped member and positioned on the second surface side of the resistance thermometer, wherein the plate-shaped member has a first gas passage extending in a second direction parallel to the first surface and a plurality of gas ejection holes communicating with the first gas passage and extending in the first direction from the first gas passage to the first surface, and the first gas passage is positioned on the first surface side of the resistance thermometer.

[0010] With this configuration, the first gas flow path is positioned on the first surface side of the resistance thermometer, allowing the resistance thermometer to be placed closer to the heater in the first direction. Therefore, it becomes easier to perform more precise temperature control using the heater and resistance thermometer.

[0011] Furthermore, since it is not necessary to form multiple gas outlets that penetrate the resistance thermometer, the design flexibility of the resistance thermometer can be improved. In addition, the length of the multiple gas outlets in the first direction can be shortened, making it easier to form multiple gas outlets.

[0012] (2) The holding device described in (1) further comprises a first driver and a second driver formed inside the plate-shaped member extending in the second direction, the resistance thermometer comprises a plurality of resistors arranged in the first direction and connected in series, each of the plurality of resistors has a pad portion at its end, the plurality of resistors includes a first resistor positioned furthest to the first surface in the first direction and a second resistor positioned furthest to the second surface in the first direction, the first driver is electrically connected to the pad portion of the first resistor and the second driver is electrically connected to the pad portion of the second resistor, and the resistance thermometer is preferably positioned between the first driver and the second driver in the first direction.

[0013] With this configuration, since the resistance thermometer is positioned between the first and second drivers, the design flexibility of each resistor in the resistance thermometer can be increased.

[0014] (3) In the holding device described in (1) or (2), the plate-shaped member comprises a main body and a flange extending outward from the main body, wherein the first surface is provided on the main body, the third surface of the flange positioned on the first surface side is positioned on the second surface side of the first surface and is parallel to the first surface, and the first gas flow path provided on the main body is positioned on the first surface side of the third surface in the first direction.

[0015] This configuration makes it easier to reduce the dimensions of the flange in the first direction. Furthermore, it improves the design flexibility of the flange.

[0016] [Details of the embodiments of this disclosure] Specific examples of embodiments of this disclosure will be described with reference to Figures 1 to 4. This disclosure is not limited to these examples, but is intended to include all modifications within the meaning and scope of the claims, as indicated by the claims. In the following description, for multiple identical components, only some components may be reference-labeled, while others may be omitted. In this specification, the configuration of the holding device is described with the positive Z-axis direction as upward, the negative Z-axis direction as downward, and the XY plane direction as horizontal; however, the actual usage of the holding device may involve different configurations. Furthermore, in this specification, "orthogonal" includes configurations that are perceived as substantially orthogonal, and "parallel" includes configurations that are perceived as substantially parallel.

[0017] <Electrostatic Chuck> The holding device of the present disclosure is an electrostatic chuck 1 that can adsorb and hold an object such as a semiconductor wafer or a glass substrate (hereinafter referred to as "wafer W"). The electrostatic chuck 1 is, for example, attached to a processing chamber of a semiconductor manufacturing apparatus not shown and is used to perform various processes (film formation, etching, etc.) on the wafer W using plasma.

[0018] As shown in FIG. 1, the electrostatic chuck 1 includes a plate-like member 10 and a base member 20. The plate-like member 10 and the base member 20 are joined by a joining portion 30. The joining portion 30 is constituted by an adhesive such as a silicone-based resin, an acrylic-based resin, or an epoxy-based resin, for example. The electrostatic chuck 1 is configured to be able to adsorb and hold the wafer W by electrostatic attraction.

[0019] The base member 20 is a disk-shaped member and can be formed into a shape having a diameter of about 340 mm and a thickness of about 35 mm, for example. The base member 20 is mainly composed of a conductive material such as aluminum or an aluminum alloy. Here, the main component means the component having the highest content ratio (weight ratio) (the same applies hereinafter). As shown in FIG. 3, the base member 20 has a fourth surface S4 disposed on the side of the plate-like member 10 and a fifth surface S5 disposed on the side opposite to the fourth surface S4. The fourth surface S4 is disposed on the upper side of the base member 20, and the fifth surface S5 is disposed on the lower side of the base member 20. The fourth surface S4 of the base member 20 is joined to the second surface S2 of the plate-like member 10, which will be described later, by the joining portion 30.

[0020] A refrigerant flow path 21 is provided inside the base member 20. The refrigerant flow path 21 is connected to a refrigerant circulation device not shown. The refrigerant circulation device is configured to be able to circulate a refrigerant such as a fluorine-based inert liquid or water through the refrigerant flow path 21. When the refrigerant is flowed through the refrigerant flow path 21, the base member 20 is cooled, and the plate-like member 10 is cooled by heat transfer (heat extraction) between the base member 20 and the plate-like member 10 through the joining portion 30, and the wafer W held on the first surface S1 of the plate-like member 10, which will be described later, is cooled. Thereby, the temperature of the wafer W can be controlled.

[0021] <Plate-like member> The plate-like member 10 has a disk shape as a whole and can be formed into a shape having a diameter of about 300 mm and a thickness of about 5 mm, for example. The plate-like member 10 is an insulating substrate and is formed of, for example, ceramics mainly composed of aluminum nitride (AlN) or alumina (Al2O3).

[0022] As shown in FIG. 1, the plate-like member 10 includes a main body portion 10A and a flange portion 10B that expands in diameter from the main body portion 10A to the outer peripheral side of the main body portion 10A. The upper surface of the main body portion 10A is a first surface S1 orthogonal to the Z-axis direction (an example of the first direction). The upper surface of the flange portion 10B is a third surface S3 orthogonal to the Z-axis direction. The first surface S1 is arranged above the third surface S3, and a step is provided between the first surface S1 and the third surface S3. The first surface S1 is a circular plane when viewed in the Z-axis direction and functions as a suction surface for holding the wafer W. On the third surface S3, for example, a jig (not shown) for fixing a focus ring or an electrostatic chuck 1 is engaged.

[0023] As shown in FIG. 3, in the plate-like member 10, the surface (that is, the lower surface) arranged on the opposite side to the first surface S1 and the third surface S3 is a second surface S2. The second surface S2 is joined to the base member 20 via a joining portion 30.

[0024] Inside the main body portion 10A of the plate-like member 10, a chuck electrode 40 formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is arranged. The chuck electrode 40 is arranged at a position close to the first surface S1. The shape of the chuck electrode 40 when viewed in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attraction force is generated, and the wafer W is attracted and fixed to the first surface S1 of the plate-like member 10 by this electrostatic attraction force.

[0025] Inside the plate-shaped member 10, an RF (Radio Frequency) electrode 41 made of a conductive material (e.g., tungsten, molybdenum, platinum, etc.) is arranged. The RF electrode 41 is provided inside the main body portion 10A and the flange portion 10B. The RF electrode 41 is positioned below the chuck electrode 40. Plasma can be generated by applying a voltage to the RF electrode 41 from a high-frequency power supply (not shown).

[0026] Inside the plate-shaped member 10 are a heater 50, a resistance thermometer 60, a driver 70 for the resistance thermometer, and various vias, each made of a conductive material (e.g., tungsten, molybdenum, platinum, etc.). In this embodiment, the resistance thermometer 60 is positioned below the RF electrode 41, and the heater 50 is positioned below the resistance thermometer 60.

[0027] <First gas flow path> The plate-shaped member 10 has a first gas passage 14, a plurality of gas ejection holes 15 that communicate with the first gas passage 14 and open to the first surface S1, and a second gas passage 16 that communicates with the first gas passage 14 and opens to the second surface S2. The first gas passage 14 is a space that extends in a horizontal direction (an example of a second direction) parallel to the first surface S1. The first gas passage 14 may, for example, extend in the radial direction of the plate-shaped member 10, or it may extend in a concentric shape when viewed in the Z-axis direction. The first gas passage 14 is located above the resistance thermometer 60. The first gas passage 14 is provided inside the main body portion 10A of the plate-shaped member 10 and is located above the third surface S3. In detail, the end (lower end) of the first gas passage 14 on the second surface S2 side in the Z-axis direction is located at or above the height of the third surface S3.

[0028] The first gas channel 14 is positioned between the RF electrode 41 and the resistance thermometer driver 70 in the Z-axis direction. In other words, the first gas channel 14 is positioned to separate the RF electrode 41 from the electrical system, such as the resistance thermometer 60 and heater 50. This makes it possible to suppress plasma noise caused by the proximity of the electrical system, such as the resistance thermometer 60 and heater 50, to the RF electrode 41.

[0029] <Multiple gas vents> Multiple gas ejection holes 15 extend upward from the first gas flow path 14. The multiple gas ejection holes 15 are provided in a manner that penetrates the chuck electrode 40 and the RF electrode 41. For example, the multiple gas ejection holes 15 are located inside the through holes provided in the chuck electrode 40 and the RF electrode 41. A thermally conductive gas (e.g., helium gas) supplied from the communication holes 23, which will be described later, is ejected from the multiple gas ejection holes 15. This allows for smooth temperature control of the wafer W adsorbed on the first surface S1.

[0030] Unlike this embodiment, when the first gas flow path is located below the resistance thermometer, the multiple gas outlets must penetrate the resistance thermometer. Furthermore, the gas outlets must be made longer in the Z-axis direction by the length of the resistance thermometer layer. However, in this embodiment, the first gas flow path 14 is located above the resistance thermometer 60. Therefore, the multiple gas outlets 15 do not need to penetrate the resistance thermometer 60, thus improving the design flexibility of the resistance thermometer 60. In addition, the length of the multiple gas outlets 15 in the Z-axis direction can be shortened, making it easier to form the multiple gas outlets 15.

[0031] The second gas passage 16 is a space that extends mainly in the vertical direction. The second gas passage 16 communicates with a communication hole 23 that is formed by penetrating the base member 20 and the joint 30 in the vertical direction. The communication hole 23 is formed extending from the fifth surface S5 to the fourth surface S4 of the base member 20, and further to the joint 30. Although not shown, gas cylinders, vacuum pumps, etc., for supplying thermally conductive gas are connected to the communication hole 23 via piping.

[0032] In this embodiment, the resistance thermometer 60, heater 50, driver 70 for the resistance thermometer, various drivers (not shown), various vias, etc. are arranged in a height region (a predetermined region in the Z-axis direction) where the second gas passage 16 is provided, so as to avoid the second gas passage 16. Typically, the number of second gas passages 16 is less than the number of gas outlets 15. Therefore, unlike in this embodiment, it is often easier to arrange the resistance thermometer 60 in a height region where the second gas passage 16 is provided, so as to avoid the second gas passage 16, rather than arranging the resistance thermometer in a height region where multiple gas outlets are provided, so as to avoid multiple gas outlets. In other words, according to this embodiment, the design freedom of the resistance thermometer 60 can be improved.

[0033] The plate-shaped member 10 with the above configuration can be manufactured, for example, by creating multiple ceramic green sheets, processing a predetermined ceramic green sheet by forming via holes, filling it with metallizing paste, printing, etc., heat-pressing these ceramic green sheets together, cutting or other processing, and then firing them.

[0034] Figure 2 is a schematic plan view of the electrostatic chuck 1 according to this embodiment, showing the virtual divisions (first zone 11 and second zone 12) of the plate-shaped member 10 in the XY plane. For simplicity, the gas ejection holes 15, the first gas flow path 14, the second gas flow path 16, etc., are omitted from Figure 2. The second gas flow path 16 may be located between adjacent first zones 11 in the XY plane, or it may be located inside the first zone 11.

[0035] In this embodiment, as shown in Figure 2, the main body portion 10A of the plate-shaped member 10 is virtually divided into a plurality of first zones 11 arranged horizontally. More specifically, in a view along the Z-axis, the main body portion 10A of the plate-shaped member 10 is divided into a plurality of virtual annular regions (however, only the region including the center point P1 is a circular region) by a plurality of concentric first boundary lines BL1 centered on the center point P1 of the first surface S1, and each annular region is further divided into first zones 11 arranged circumferentially on the first surface S1 by a plurality of second boundary lines BL2 extending radially on the first surface S1. The plurality of first zones 11 are formed to demarcate the portion of the plate-shaped member 10 on which the wafer W is placed.

[0036] In this embodiment, the flange portion 10B is virtually divided into a plurality of second zones 12 arranged horizontally. More specifically, in a view along the Z-axis, the flange portion 10B is annular, and this annular region is divided into a plurality of second zones 12 arranged circumferentially around the plate-like member 10 by a plurality of third boundary lines BL3 extending radially around the plate-like member 10.

[0037] Each of the multiple first zones 11 and multiple second zones 12 (hereinafter referred to as each zone 11 and 12) is equipped with a heater 50 and a resistance thermometer 60 (see Figure 4). With this configuration, it is possible to control the temperature of the wafer W placed on the main body 10A and the components (e.g., a focus ring) placed on the flange 10B.

[0038] <Resistance thermometer> One resistance thermometer 60 is provided in each zone 11 and 12. As shown in Figure 3, the resistance thermometer 60 comprises a plurality (two in this embodiment) of resistors 61 arranged in series along the Z-axis. As shown in Figure 4, each resistor 61 comprises a thin wire-shaped resistance portion 61A and pad portions 61B located at both ends of the resistance portion 61A, and extends horizontally. The pad portions 61B are approximately circular in shape when viewed in the Z-axis direction, and their width is larger than that of the resistance portion 61A. In this embodiment, the configuration (shape, dimensions, position in the XY plane, etc.) of each resistor 61 is the same. Therefore, each resistor 61 is arranged superimposed when viewed in the Z-axis direction.

[0039] As shown in Figure 3, among the multiple resistors 61, the resistor 61 positioned closest to the first surface S1 in the Z-axis direction is designated as the first resistor 62. Among the multiple resistors 61, the resistor 61 positioned closest to the second surface S2 in the Z-axis direction is designated as the second resistor 63.

[0040] <First driver, second driver> The resistance thermometer driver 70 is part of the configuration for connecting the resistance thermometer 60 to the power supply terminal 13. The resistance thermometer driver 70 comprises a first driver 71 and a second driver 72 extending horizontally. The first driver 71 is electrically connected to the pad portion 61B of the first resistor 62. The second driver 72 is electrically connected to the pad portion 61B of the second resistor 63. In detail, the first driver 71 and the second driver 72 and each pad portion 61B are connected via vias or the like. In this embodiment, the resistance thermometer 60 is positioned between the first driver 71 and the second driver 72 in the Z-axis direction.

[0041] With the above configuration, for example, by routing the first driver 71 and the second driver 72 in the Z-axis direction outside each zone 11, 12 where the resistance thermometer 60 is provided, the design flexibility of the resistance thermometer 60 within each zone 11, 12 can be increased.

[0042] The ends of the temperature sensor drivers 70 (first driver 71 and second driver 72) opposite to the temperature sensor 60 are designated as power supply ends. In this embodiment, the power supply ends are located on the flange portion 10B of the plate-shaped member 10. The power supply ends are electrically connected to the power supply terminals 13 via vias or electrode pads. The power supply terminals 13 are housed in terminal holes 22 provided in the electrostatic chuck 1. The terminal holes 22 extend in the Z-axis direction from the fifth surface S5 of the base member 20 to the interior of the plate-shaped member 10. The power supply terminals 13 are connected to a power source (not shown).

[0043] <Heater> Similar to the resistance thermometer 60 shown in Figure 4, one heater 50 is provided in each zone 11 and 12. Although a detailed explanation is omitted, the heater 50, like each resistor 61 of the resistance thermometer 60, comprises a resistance wire portion and pad portions provided at both ends of the resistance wire portion. The resistance wire portion of the heater 50 is shaped to pass through each position within each zone 11 and 12 as evenly as possible when viewed in the Z-axis direction.

[0044] The electrostatic chuck 1 is equipped with a configuration for supplying power to each heater 50. Specifically, the electrostatic chuck 1 has heater terminal holes (not shown), and each heater terminal hole houses a heater power supply terminal (not shown). The heater power supply terminals are connected to the pad portion of the heater 50 via heater vias or electrode pads (not shown), etc.

[0045] When voltage is applied to the heater 50 from a power source (not shown), the heater 50 generates heat. This heats each zone 11, 12 where the heater 50 is located. By individually controlling the voltage applied to the heaters 50 located in each zone 11, 12 of the plate-shaped member 10, the temperature of each zone 11, 12 can be controlled individually.

[0046] In this embodiment, the first gas flow path 14 is located above the resistance thermometer 60, and the heater 50 is located below the resistance thermometer 60 (see Figure 3). Therefore, unlike this embodiment, in this embodiment, the resistance thermometer 60 and the heater 50 can be brought closer together in the Z-axis direction compared to the case where the first gas flow path is arranged between the resistance thermometer and the heater in the Z-axis direction. Consequently, the temperature can be controlled more precisely using the heater 50 and the resistance thermometer 60.

[0047] <Effects of the Embodiment> As described above, the holding device (electrostatic chuck 1) of the embodiment comprises a plate-shaped member 10 having a first surface S1 on which an object (wafer W) is held and which is perpendicular to a first direction (Z-axis direction), and a second surface S2 located on the opposite side of the first surface S1; a resistance thermometer 60 formed inside the plate-shaped member 10; and a heater 50 formed inside the plate-shaped member 10 and positioned on the second surface S2 side of the resistance thermometer 60. The plate-shaped member 10 has a first gas flow path 14 extending in a second direction (horizontal direction) parallel to the first surface S1, and a plurality of gas ejection holes 15 communicating with the first gas flow path 14 and extending in the first direction from the first gas flow path 14 to the first surface S1. The first gas flow path 14 is positioned on the first surface S1 side of the resistance thermometer 60.

[0048] With this configuration, the first gas flow path 14 is positioned closer to the first surface S1 than the resistance thermometer 60, so the resistance thermometer 60 can be placed closer to the heater 50 in the first direction. Therefore, it becomes easier to perform more precise temperature control using the heater 50 and the resistance thermometer 60.

[0049] Furthermore, since it is not necessary to form multiple gas outlets 15 that penetrate the resistance thermometer 60, the design flexibility of the resistance thermometer 60 can be improved. In addition, since the length of the multiple gas outlets 15 in the first direction can be shortened, the formation of the multiple gas outlets 15 becomes easier.

[0050] The holding device of the embodiment further comprises a first driver 71 and a second driver 72 formed inside the plate-shaped member 10 extending in a second direction, the resistance thermometer 60 comprises a plurality of resistors 61 arranged in a first direction and connected in series, each end of the plurality of resistors 61 is provided with a pad portion 61B, the plurality of resistors 61 include a first resistor 62 positioned furthest toward the first surface S1 in the first direction and a second resistor 63 positioned furthest toward the second surface S2 in the first direction, the first driver 71 is electrically connected to the pad portion 61B of the first resistor 62 and the second driver 72 is electrically connected to the pad portion 61B of the second resistor 63, and the resistance thermometer 60 is positioned between the first driver 71 and the second driver 72 in the first direction.

[0051] With this configuration, since the resistance thermometer 60 is positioned between the first driver 71 and the second driver 72, the design flexibility of each resistor 61 of the resistance thermometer 60 can be increased.

[0052] In this embodiment, the plate-shaped member 10 comprises a main body portion 10A and a flange portion 10B that extends outward from the main body portion 10A. The first surface S1 is provided on the main body portion 10A, and the third surface S3, which is located on the side of the flange portion 10B to the first surface S1, is located on the side of the second surface S2 to the first surface S1 and is parallel to the first surface S1. The first gas flow path 14 provided on the main body portion 10A is located on the side of the first surface S1 to the third surface S3 in the first direction.

[0053] This configuration makes it easier to reduce the dimensions of the flange portion 10B in the first direction. Furthermore, it improves the design flexibility of the flange portion 10B.

[0054] <Other Embodiments> (1) In this embodiment, the resistance thermometer 60 had two resistors 61 arranged in the Z-axis direction, but the resistance thermometer may have one resistor or three or more resistors.

[0055] (2) In the embodiment, the flange portion 10B was provided with an RF electrode 41, a resistance thermometer 60, a heater 50, etc., but the various electrodes, resistors, drivers, vias, and other components provided on the flange portion can be selected as appropriate. For example, the flange portion may not be provided with a chuck electrode, RF electrode, resistance thermometer, and heater, but only with various drivers and vias.

[0056] (3) In the embodiment, the plate-shaped member 10 was provided with a flange portion 10B, but the plate-shaped member does not need to be provided with a flange portion.

[0057] (4) In this embodiment, the resistance thermometer 60 was positioned between the first driver 71 and the second driver 72 in the Z-axis direction, but the relative positions of the first driver, the second driver, and the resistance thermometer may be changed as appropriate.

[0058] (5) In the embodiment, the lower end of the first gas flow path 14 was located at a height that coincided with or was higher than the height of the third surface S3, but the lower end of the first gas flow path may be located below the third surface. [Explanation of Symbols]

[0059] 1…Electrostatic chuck 10…Plate-shaped member 10A…Main body 10B…Flange 11…First zone 12…Second zone 13…Power supply terminal 14…First gas flow path 15…Gas outlet 16…Second gas flow path S1…First surface S2…Second surface S3…Third surface BL1…First boundary line BL2…Second boundary line BL3…Third boundary line P1…Center point 20...Base member 21...Refrigerant flow path 22...Terminal hole 23...Communication hole S4...Fourth surface S5...Fifth surface 30…Joint part 40... Chuck electrode 41...RF electrode 50... Heater 60...Resistance thermometer 61...Resistor 61A...Resistance wire section 61B...Pad section 62...First resistor 63...Second resistor 70... Driver for resistance thermometer 71... First driver 72... Second driver W...wafer

Claims

1. A plate-shaped member having a first surface perpendicular to a first direction on which an object is held, and a second surface located on the opposite side of the first surface, A temperature-sensing resistance element formed inside the plate-shaped member, The plate-shaped member comprises a heater formed inside the plate-shaped member and positioned on the second surface side of the temperature-measuring resistance element, The plate-like member has a first gas channel extending in a second direction parallel to the first surface, and a plurality of gas ejection holes communicating with the first gas channel and extending in the first direction from the first gas channel to the first surface. The first gas flow path is positioned on the first surface side of the resistance thermometer, The plate-like member comprises a main body portion and a flange portion that extends outward from the outer circumference of the main body portion. The first surface is provided on the main body, The third surface of the flange portion, which is positioned on the first surface side, is positioned on the second surface side of the first surface and is parallel to the first surface. A holding device wherein the first gas flow path provided in the main body is positioned on the first surface side of the third surface in the first direction.

2. A plate-shaped member having a first surface perpendicular to the first direction on which an object is held, and a second surface located on the opposite side of the first surface, A temperature-sensing resistance element formed inside the plate-shaped member, A heater formed inside the plate-shaped member and positioned on the second surface side of the temperature sensor, The plate-shaped member comprises an RF electrode, which is a high-frequency electrode for plasma generation, formed inside the plate-shaped member and positioned on the first surface side of the resistance thermometer, The plate-like member has a first gas channel extending in a second direction parallel to the first surface, and a plurality of gas ejection holes communicating with the first gas channel and extending in the first direction from the first gas channel to the first surface. The first gas flow path is a holding device disposed between the RF electrode and the resistance thermometer in the first direction.

3. A plate-shaped member having a first surface perpendicular to the first direction on which an object is held, and a second surface located on the opposite side of the first surface, A temperature-sensing resistance element formed inside the plate-shaped member, The plate-shaped member comprises a heater formed inside the plate-shaped member and positioned on the second surface side of the temperature-measuring resistance element, The plate-like member has a first gas channel extending in a second direction parallel to the first surface, and a plurality of gas ejection holes communicating with the first gas channel and extending in the first direction from the first gas channel to the first surface. The first gas flow path is positioned on the first surface side of the resistance thermometer, The plate-shaped member further comprises a first driver and a second driver formed extending in the second direction inside the plate-shaped member, The temperature-sensing resistance element comprises a plurality of resistors arranged in the first direction and connected in series, A pad portion is provided at the end of each of the aforementioned plurality of resistors. The plurality of resistors include a first resistor positioned furthest to the first surface in the first direction, and a second resistor positioned furthest to the second surface in the first direction. The first driver is electrically connected to the pad portion of the first resistor, The second driver is electrically connected to the pad portion of the second resistor, The temperature-sensing resistance element is a holding device disposed between the first driver and the second driver in the first direction.

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