Curable resin composition, insulating cured film obtained by curing the composition, insulating cured film for touch panel, and touch panel

Abstract

Provided is a curable resin composition comprising a thermosetting alkali-soluble resin (A1) having an acid value of 55 to 100 mgKOH, a photocurable alkali-soluble resin (A2) having an acid value of 20 to 100 mgKOH / g, a (meth)acrylic monomer (B1) having two polymerizable functional groups and a ring structure contained between the two polymerizable functional groups, and a silane compound (C) represented by formula (1) or (2). (In the formulae, R1 to R3 may be the same as or different from one another, in which all or at least one of these residues represents an alkoxy groups having 1 to 5 carbon atoms and the other represents an alkyl group having 1 to 5 carbon atoms; R4 to R6 may be the same as or different from one another, and each independently represent an alkoxy group having 1 to 5 carbon atoms or an alkyl group having 1 to 5 carbon atoms; A represents a substituted or unsubstituted linear or branched alkylene group having 2 to 18 carbon atoms, and may contain a bivalent or trivalent linking group; B represents a substituted or unsubstituted linear or branched alkylene group having 2 to 15 carbon atoms, and may contain a bivalent linking group; X represents O, NH, NH-CO-NH or S; p represents an integer of 0 or 1; q represents an integer of 1 to 3; r represents an integer of 1 to 3; s represents an integer of 1 to 3; and t represents an integer of 1 to 3.)

Description

[Technical Field]

[0001] The present invention relates to a curable resin composition and an insulating cured film obtained by curing the composition, and more particularly to a curable resin composition useful for insulating cured film applications (e.g., insulating film applications, protective film applications, flat film applications, etc.) used in touch panels, an insulating cured film for touch panels obtained by curing the composition, and a touch panel equipped with the cured film. [Background technology]

[0002] In recent years, as electronic devices have become more sophisticated, diverse, and smaller and lighter, there has been an increase in devices that have a transparent touch panel attached to the front of the display element, such as an LCD. Through this transparent touch panel, users can view and select characters, symbols, and images displayed on the display element, and switch between the various functions of the device by operating the transparent touch panel.

[0003] Touch panel detection methods include resistive, capacitive, ultrasonic, and optical methods, with resistive and capacitive methods being the most common in recent years. For example, the resistive method consists of a two-layer structure with an upper electrode film and a lower electrode glass. Applying pressure to the upper electrode film with a pen tip or similar object activates a switch and triggers a response. The capacitive method consists of a surface protective glass and a sensor glass. When a finger touches the surface glass, electrostatic coupling occurs, creating a difference in capacitance between the surface and the underlying glass. This difference is used to determine the location of the touch.

[0004] Capacitive touch panels, for example, use glass with an ITO film as a substrate and incorporate insulating films or protective films within the laminated structure to prevent misrecognition of the contact location. Such protective films include those made of highly hard inorganic materials such as SiO2 and SiNx, or transparent resins, as well as organic protective films. Furthermore, when touch panels are combined with liquid crystal displays, they can be classified into out-cell, on-cell, and in-cell structures depending on their installation location. In recent years, on-cell and in-cell structures, which offer superior visibility, are becoming mainstream. In these on-cell and in-cell structures, the touch panel is integrated into the liquid crystal panel. In addition, two types of touch panel structures are known: a two-sided type in which the X electrode is arranged on one side of the insulating film and the Y electrode on the other side, and a one-sided type in which the X and Y electrodes are formed on the same plane.

[0005] As a technology applicable to such touch panels, for example, a technology has been proposed for a cured film that has excellent chemical resistance, developability, and wrinkle resistance, using a specific alkali-soluble resin and a photoreactive monomer (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] International Publication No. WO2020 / 251004 [Overview of the project] [Problems that the invention aims to solve]

[0007] As mentioned above, curable resin compositions are widely used to form insulating films used in touch panels, liquid crystal displays, and the like. These insulating films may have patterns such as through-holes and grooves formed on them for purposes such as electrical conductivity between electrodes.

[0008] Positive-type curable resin compositions are considered advantageous for preparing curable resin compositions with patterning accuracy capable of forming relatively small through-holes and narrow grooves. However, using positive-type curable resin compositions presents problems such as discoloration of the cured product.

[0009] On the other hand, it is conceivable to use a negative-type curable resin composition to avoid discoloration of the cured product. However, it is not always easy to achieve high patterning accuracy with conventional negative-type curable compositions, and there is generally a trade-off between patterning accuracy and (electro)migration resistance. Therefore, there has been a strong demand for the development of technology related to negative-type curable resin compositions that possess a predetermined level of patterning accuracy and migration resistance.

[0010] The present invention aims to solve the above-mentioned problems by providing a curable resin composition with excellent patterning accuracy and migration resistance, an insulating cured film obtained by curing the composition, an insulating cured film for touch panels, and a touch panel equipped with the cured film. [Means for solving the problem]

[0011] The inventors diligently studied to solve the aforementioned problems. As a result, they found that the above problems could be solved by using a composition that includes a thermosetting alkali-soluble resin having a specific acid value, a photocurable alkali-soluble resin having a specific acid value, a monomer having a specific structure, and further includes a silane compound having a specific structure, thus completing the present invention. <1> A thermosetting alkali-soluble resin (A1) with an acid value of 55-100 mgKOH / g, A photocurable alkali-soluble resin (A2) with an acid value of 20-100 mgKOH / g, A (meth)acrylic monomer (B1) having two polymerizable functional groups and a ring structure contained between the two polymerizable functional groups, A silane compound (C) represented by the following formula (1) or (2), A curable resin composition containing [the specified ingredient]. [ka] (In the formula, R 1 ~R 3 These may be the same or different, and all or at least one of them are alkoxy groups having 1 to 5 carbon atoms, while the others are alkyl groups having 1 to 5 carbon atoms. 4 ~R 6 A and B are alkoxy groups or alkyl groups having 1 to 5 carbon atoms, and may be the same or different. A is a substituted or unsubstituted linear or branched alkylene group having 2 to 18 carbon atoms, and may contain divalent or trivalent linking groups. B is a substituted or unsubstituted linear or branched alkylene group having 2 to 15 carbon atoms, and may contain divalent linking groups. X is O, NH, NH-CO-NH, or S. p is an integer from 0 to 1. q is an integer from 1 to 3. r is an integer from 1 to 3. s is an integer from 1 to 3. t is an integer from 1 to 3. <2> The thermosetting alkali-soluble resin (A1) has an acid group and a cyclic ether group, <1> The curable resin composition described above. <3> The thermosetting alkali-soluble resin (A1) comprises at least the following units (a1-1) and (a1-2), <1> or the above <2> The curable resin composition described above. [ka] (In formula (a1-1), R 1 X represents a hydrogen atom or a methyl group; 1 R represents a linear or cyclic aliphatic hydrocarbon group having 1 to 15 carbon atoms, which may contain a single bond or an oxygen atom. In formula (a1-2), R 1 R represents a hydrogen atom or a methyl group; 3 This represents a linear or branched aliphatic hydrocarbon group having 3 to 15 carbon atoms, which has a cyclic ether structure and may contain an oxygen atom. <4> The curable resin composition according to <3>, wherein the thermosetting alkali-soluble resin (A1) further contains the following unit (a1-3).

Chemical formula

Chemical formula

[0012] According to the present invention, it is possible to provide a curable resin composition with excellent patterning accuracy and migration resistance, an insulating cured film obtained by curing the composition, an insulating cured film for touch panels, and a touch panel equipped with the cured film. [Brief explanation of the drawing]

[0013] [Figure 1] This is a plan view showing the configuration of one embodiment of the touch panel of this embodiment. [Figure 2] This is a cross-sectional view of AA in Figure 1. [Figure 3] This is a schematic diagram showing the cross-sectional shape of a through-hole. [Modes for carrying out the invention]

[0014] The following describes in detail an embodiment for carrying out the present invention (hereinafter referred to as "this embodiment"). However, the present invention is not limited thereto, and various modifications are possible without departing from its essence.

[0015] 《Curable resin composition》 The curable resin composition of this embodiment comprises a thermosetting alkali-soluble resin (A1) with an acid value of 55 to 100 mgKOH / g, a photocurable alkali-soluble resin (A2) with an acid value of 20 to 100 mgKOH / g, a (meth)acrylic monomer (B1) having two polymerizable functional groups and a ring structure contained between the two polymerizable functional groups, and a silane compound (C) represented by the following formula (1) or (2). [ka] (In the formula, R 1 ~R 3 These may be the same or different, and all or at least one of them are alkoxy groups having 1 to 5 carbon atoms, while the others are alkyl groups having 1 to 5 carbon atoms. 4 ~R 6A and B are alkoxy groups or alkyl groups having 1 to 5 carbon atoms, and may be the same or different. A is a substituted or unsubstituted linear or branched alkylene group having 2 to 18 carbon atoms, and may contain divalent or trivalent linking groups. B is a substituted or unsubstituted linear or branched alkylene group having 2 to 15 carbon atoms, and may contain divalent linking groups. X is O, NH, NH-CO-NH, or S. p is an integer from 0 to 1. q is an integer from 1 to 3. r is an integer from 1 to 3. s is an integer from 1 to 3. t is an integer from 1 to 3.

[0016] The curable resin composition of this embodiment, while being a negative type, exhibits excellent patterning accuracy and migration resistance. In other words, the present invention enables high patterning accuracy because the exposed areas (cured areas) have excellent water and developer resistance during development, while the unexposed areas (uncured areas) are easily dissolved in the developer. The reason why the curable resin composition of this embodiment has excellent patterning accuracy and migration resistance is not entirely clear, but it is presumed that the silane compound (C) contained in the curable resin composition plays a role in achieving both patterning accuracy and migration resistance. Although not bound by theory, it is thought that the NH portion of the silane compound (C) traps metal ions eluting from the wiring, preventing metal ions from forming conductive paths in the cured area, thus resulting in excellent migration resistance. Furthermore, it is thought that the curable resin composition of this embodiment, by including each component, exhibits excellent developability in the non-latent image areas (unexposed areas) and high resistance to the developer in the latent image areas (exposed areas), thus achieving high patterning accuracy. In this description of the embodiment, migration means electromigration.

[0017] <Alkali-soluble resin (A)> The curable resin composition of this embodiment comprises a thermosetting alkali-soluble resin (A1) and a photocurable alkali-soluble resin (A2). The thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) are different compounds. The "alkali-soluble resin" has an uncured portion that is soluble in the developer, and a cured portion that is insoluble or sparingly soluble in the developer. Furthermore, from the viewpoint of resistance of the cured product to water penetration (hereinafter simply referred to as water resistance), it is preferable that at least one of the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) has a cyclic group. Hereinafter, the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) may be referred to as "alkali-soluble resin (A1)" or "alkali-soluble resin (A2)," respectively. Furthermore, alkali-soluble resins (A1) and (A2) may be collectively referred to as "alkali-soluble resin (A)." The curable resin composition of this embodiment may contain multiple alkali-soluble resins (A1) and (A2).

[0018] (Thermosetting alkali-soluble resin (A1)) The alkali-soluble resin (A1) is a thermosetting alkali-soluble resin with an acid value of 55 to 100 mg KOH / g. The alkali-soluble resin (A1) has a heat-reactive group and is a resin that hardens at temperatures above 70°C. The heat-reactive group is not particularly limited, but in terms of low-temperature curing properties, examples include acid groups (e.g., carboxyl groups, acid anhydride groups, sulfone groups, phosphoric acid groups), cyclic ether groups, hydroxyl groups, amino groups, thiol groups, isoanate groups, and silanol groups. It is preferable that the alkali-soluble resin (A1) has acid groups and cyclic ether groups (e.g., epoxy groups, oxetanyl groups, etc.) as heat-reactive groups. The temperature at which the thermosetting alkali-soluble resin (A1) cures varies depending on the type and number of heat-reactive groups, but from the viewpoint of low-temperature curing properties and developability of unexposed areas (solubility of unexposed areas in the developer), it is preferably 70°C or higher, more preferably 80°C to 230°C, and particularly preferably 90°C to 150°C.

[0019] The acid value of the alkali-soluble resin (A1) is 55 to 100 mg KOH / g, preferably 60 to 95 mg KOH / g, and more preferably 70 to 90 mg KOH / g. When the acid value of the alkali-soluble resin (A1) is within the range of 55 to 100 mg KOH / g, the occurrence of development defects can be suppressed, and resistance to the developer (e.g., tetramethylammonium hydroxide) can be high, and overdevelopment can be suppressed. If it is less than 55 mg KOH / g, there is a risk of reduced developability. The theoretical solid content acid value can be used as the acid value of the alkali-soluble resin, and can be calculated as follows. Theoretical solid content acid value (mgKOH / g) = [56.1 (molecular weight of potassium hydroxide) × (total amount of acid group units in alkali-soluble resin (A1) [g]) × 1000] / [(total amount of solids in alkali-soluble resin (A1) [g]) × (molecular weight of acid group units)]

[0020] As the thermosetting alkali-soluble resin (A1), a resin containing at least the following units (a1-1) and (a1-2) can be used. The thermosetting alkali-soluble resin (A1) may also contain two or more of the following identical constituent units (for example, two units (a1-2)).

[0021] [ka] (Unit (a1-1), R 1 X represents a hydrogen atom or a methyl group; 1 This represents a single bond or a linear or cyclic aliphatic hydrocarbon group having 1 to 15 carbon atoms, which may contain an oxygen atom. In the unit (a1-2), R 1 R represents a hydrogen atom or a methyl group; 3 This represents a linear or branched aliphatic hydrocarbon group having 3 to 15 carbon atoms, which has a cyclic ether structure and may contain an oxygen atom.

[0022] -Unit(a1-1)- The unit (a1-1) is derived from an unsaturated carboxylic acid. In the unit (a1-1), R1 This represents either a hydrogen atom or a methyl group, and a methyl group is preferred from the viewpoint of the water resistance of the resulting cured product. Also, X 1 This represents a linear or cyclic aliphatic hydrocarbon group (divalent bonding group) having 1 to 15 carbon atoms, which may contain a single bond or an oxygen atom. From the viewpoint of water resistance, the carbon number of the aliphatic hydrocarbon group which may contain an oxygen atom is preferably 1 to 9. These aliphatic hydrocarbon groups may have an -O- structure (a structure containing an oxygen atom: for example, an ether group (-O-), an ester group (-CO-O-), or an acid anhydride group (-CO-O-CO-)) in their structure. Examples of linear aliphatic hydrocarbon groups include alkylene groups having 1 to 15 carbon atoms, and aliphatic hydrocarbon groups having 3 to 15 carbon atoms which may contain multiple ester groups or acid anhydride groups (-CO-O-CO-). Examples of cyclic aliphatic hydrocarbon groups include cycloalkylene groups having 3 to 15 carbon atoms, and cycloalkylene groups having 3 to 15 carbon atoms which may contain multiple ester groups or acid anhydride groups. Also, X 1 X may be an aliphatic hydrocarbon group containing both a linear and a cyclic portion. 1 Examples include -CO-O-CH2-CH2-O-CO-CH2-CH2- and -CO-O-CH2-CH2-O-CO-cyclohexyl-.

[0023] Examples of unit (a1-1) include methacrylic acid (hereinafter sometimes referred to as "MAA"), acrylic acid, crotonic acid (trans), maleic acid (cis), fumaric acid (trans), citraconic acid (cis), mesaconic acid (trans), itaconic acid, maleic anhydride, citraconic anhydride, itaconic anhydride, and hexahydrophthalate-2-methacryloyloxyethyl. Preferred structures for unit (a1-1) include units derived from the following compounds.

[0024] [ka]

[0025] -Units (a1-2)- The units (a1-2) are derived from unsaturated carboxylic acids having a cyclic ether structure. In the following units (a1-2), R 1 R represents a hydrogen atom or a methyl group; 3 This represents a linear or branched aliphatic hydrocarbon group having 3 to 15 carbon atoms, which has a cyclic ether structure and may contain an oxygen atom.

[0026] [ka]

[0027] In the units (a1-2), R 1 This represents either a hydrogen atom or a methyl group, and a methyl group is preferred from the viewpoint of water resistance. Also, R 3 This represents a linear or branched aliphatic hydrocarbon group having 3 to 15 carbon atoms, which has a cyclic ether structure and may contain an oxygen atom. Here, the number of carbon atoms in the linear or branched aliphatic hydrocarbon group having a cyclic ether structure is preferably 3 to 7 from the viewpoint of developability. These aliphatic hydrocarbon groups may have an -O- structure (a structure containing an oxygen atom: for example, an ether group (-O-), an ester group (-CO-O-), or an acid anhydride group (-CO-O-CO-)) in their structure. Examples of linear or branched aliphatic hydrocarbon groups having a cyclic ether structure include groups in which a cyclic ether structure is bonded to the end of an alkylene group (for example, a methylene group). Examples of preferred structures of unit (a1-2) include units derived from the following compounds.

[0028] [ka]

[0029] -Units (a1-3)- As a thermosetting alkali-soluble resin (A1), in terms of resistance to developing solutions, a resin containing the following unit (a1-3) in addition to the above-mentioned units (a1-1) and (a1-2) can be used. Unit (a1-3) is a unit derived from an unsaturated compound.

[0030] [ka] (In the formula, R 1 R represents a hydrogen atom or a methyl group; 4 This refers to at least one selected from a linear, branched, or cyclic aliphatic hydrocarbon group, aromatic group, or combination thereof, which may contain an oxygen atom, and having 1 to 20 carbon atoms.

[0031] In the units (a1-3), R 1 This represents either a hydrogen atom or a methyl group, and a methyl group is preferred from the viewpoint of water resistance. Also, R 4 This is a linear, branched, or cyclic aliphatic hydrocarbon group having 1 to 20 carbon atoms, an aromatic group, or a combination of the aliphatic hydrocarbon and the aromatic group. Here, the number of carbon atoms in the aliphatic hydrocarbon group is preferably 1 to 10 from the viewpoint of resistance to developing solutions and developability. These aliphatic hydrocarbon groups may have an -O- structure (a structure containing an oxygen atom: for example, an ether group (-O-), an ester group (-CO-O-), or an acid anhydride group (-CO-O-CO-)) in their structure. Examples of the linear, branched, or cyclic aliphatic hydrocarbon group include linear, branched, or cyclic alkyl groups having 1 to 20 carbon atoms, and from the viewpoint of resistance to developing solutions, methyl, n-propyl, n-butyl, n-hexyl, cyclopentyl, cyclohexyl, isobornyl, tricyclodecanyl, and adamantyl groups are preferred. Furthermore, examples of the aromatic group include phenyl, biphenyl, naphthyl, and anthracenyl groups, with phenyl groups being preferred from the viewpoint of the transparency of the cured product. Examples of combinations of aliphatic hydrocarbon groups having 1 to 20 carbon atoms and aromatic groups include alkoxyphenyl, alkylphenyl, alkoxynaphthyl, alkylnaphthyl, alkoxyanthracenyl, and alkylanthracenyl groups, with alkoxyphenyl and alkylphenyl groups being preferred from the viewpoint of the transparency of the cured product. Examples of preferred structures for units (a1-3) include units derived from the following compounds.

[0032] [ka]

[0033] -Composition ratio- In alkali-soluble resin (A), the content (mol%) of units (a1-1), (a1-2), and (a1-3) is preferably (a1-1) / (a1-2) / (a1-3) = 10~50 / 10~70 / 0~70, more preferably 15~40 / 15~60 / 15~65, and particularly preferably 15~30 / 20~50 / 30~60, from the viewpoint of resistance to developing solution and developability.

[0034] -Other constituent units- The alkali-soluble resin (A1) may also contain other constituent units that do not fall under any of the above units (a1-1) to (a1-3). Examples of other constituent units include benzyl methacrylate, 1,3-bis(methacryloyloxy)-2-propanol, 2-methacryloyloxyethyl isocyanate, 2-hydroxyethyl methacrylate, and N-cyclohexylsuccinimide. In the alkali-soluble resin (A1), the content (mol%) of other constituent units is preferably 0 to 35 mol%, and more preferably 0 to 20 mol%, from the viewpoint of achieving both resistance to developing solutions and developability.

[0035] (molecular weight) The weight-average molecular weight of the alkali-soluble resin (A1) is preferably 3,000 to 30,000, more preferably 4,000 to 25,000, and particularly preferably 5,500 to 13,000, from the viewpoint of developability. The molecular weight of the alkali-soluble resin (A) can be measured by gel permeation chromatography (manufactured by Tosoh Corporation, part number: HLC-8120, column: two linked G-5000HXL and G-3000HXL columns, detector: RI, mobile phase: tetrahydrofuran).

[0036] (Glass transition temperature) The glass transition temperature of the alkali-soluble resin (A1) is preferably 0 to 300°C, more preferably 30 to 250°C, and particularly preferably 50 to 200°C, from the viewpoint of heat resistance, developability, and low-temperature curing properties. This glass transition temperature can be measured using a differential scanning calorimeter (DSC).

[0037] (Epoxy equivalent) The epoxy equivalent of the alkali-soluble resin (A1) is preferably 200 to 1,000, more preferably 250 to 800, and particularly preferably 300 to 600, from the viewpoint of balancing resistance to developing solutions and developability. This epoxy equivalent can be determined, for example, according to JIS K7236 (2001).

[0038] (double bond equivalent) From the viewpoint of reactivity, the double bond equivalent of the alkali-soluble resin (A1) is preferably 150 to 2000, more preferably 150 to 1500, and particularly preferably 200 to 1000. This double bond equivalent can be determined, for example, by "(mass of polymer per mole) / (number of ethylenically unsaturated groups per mole)".

[0039] (Specific example) Specific examples of alkali-soluble resins (A1) include the following polymers.

[0040] [ka]

[0041] (Photocurable alkali-soluble resin (A2)) Alkali-soluble resin (A2) is a resin that cures with radicals from a photopolymerization initiator. It is preferable that alkali-soluble resin (A2) has an ethylenically unsaturated double bond as a functional group that reacts with the radical. While there are no particular limitations on the ethylenically unsaturated double bond, examples of (meth)acrylic groups, vinyl groups, and allyl groups are preferred in terms of the chemical resistance of the resulting cured product, with (meth)acrylic groups being particularly preferred.

[0042] As the photocurable alkali-soluble resin (A2), a resin containing at least the following units (a2-1) and (a2-2) can be used. The photocurable alkali-soluble resin (A2) may contain two or more of the following identical constituent units (for example, two types of units (a2-2)).

[0043] [ka] (Unit (a2-1), R 1 Each of these independently represents either a hydrogen atom or a methyl group; R 5 This represents a chain, branched, or cyclic aliphatic hydrocarbon group having 2 to 15 carbon atoms, which may contain heteroatoms. In the unit (a2-2), R 1 X represents a hydrogen atom or a methyl group; 1 (This represents a single bond, or a linear or cyclic aliphatic hydrocarbon group having 1 to 15 carbon atoms, which may contain an oxygen atom.)

[0044] -Unit(a2-1)- The unit (a2-1) is derived from an unsaturated compound having a (meth)acryloyl group. In the unit (a2-1), R 1 Each of these independently represents either a hydrogen atom or a methyl group, and a methyl group is preferred from the viewpoint of water resistance. Also, R 5This represents a linear, branched, or cyclic aliphatic hydrocarbon group having 2 to 15 carbon atoms (a divalent bonding group), which may contain heteroatoms. From the viewpoint of the reactivity of the composition, the carbon number of the aliphatic hydrocarbon group, which may contain heteroatoms, is preferably 3 to 10. These aliphatic hydrocarbon groups may have -O- structures (structures containing oxygen atoms: for example, -OH (hydroxyl group), ether group (-O-), ester group (-CO-O-), acid anhydride group (-CO-O-CO-)), sulfur-containing structures such as -S- structures, or nitrogen-containing structures such as -NH- structures. Examples of linear or branched aliphatic hydrocarbon groups include alkylene groups having 2 to 15 carbon atoms, and aliphatic hydrocarbon groups having 2 to 15 carbon atoms that may contain multiple ester groups or acid anhydride groups (-CO-O-CO-). Furthermore, examples of cyclic aliphatic hydrocarbon groups include cycloalkylene groups having 3 to 15 carbon atoms, and cycloalkylene groups having 3 to 15 carbon atoms that may contain multiple ester groups or acid anhydride groups. 5 R may be an aliphatic hydrocarbon group containing both a linear and a cyclic portion. 5 Examples include -CH2-CH(OH)-CH2-, -CH2-CH2-O-CO-´-CH2-CH2-O-, -CO-O-CH2-CH(OH)-CH2-O-, -CO-O-CH2-CH2-O-CO-´-CH2-CH2-O-, and -CO-O-CH2-CH2-CH2-CH2-O-CO-´-CH2-CH2-O-.

[0045] The following compounds are examples of preferred structures for unit (a2-1).

[0046] [ka]

[0047] -Units (a2-2)- The unit (a2-2) is derived from an unsaturated carboxylic acid and has the same structure as the unit (a1-1) described above. In the unit (a2-2), R 1 , X 1This is synonymous with the one in unit (a1-1), and the preferred example is also the same.

[0048] -Units (a2-3)- As for the photocurable alkali-soluble resin (A2), in terms of resistance to developing solutions, a resin containing the following unit (a2-3) in addition to the above-mentioned units (a2-1) and (a2-2) can be used.

[0049] [ka] (In the formula, R 1 R represents a hydrogen atom or a methyl group; 4 This refers to at least one selected from a linear, branched, or cyclic aliphatic hydrocarbon group, aromatic group, or combination thereof, which may contain an oxygen atom, and having 1 to 20 carbon atoms.

[0050] The units (a2-3) are derived from unsaturated compounds and have the same structure as the units (a1-3) described above. In the units (a2-3), R 1 , R 4 This is synonymous with the one in unit (a1-1), and the preferred example is also the same.

[0051] -Composition ratio- In alkali-soluble resin (A), the content (mol%) of units (a2-1), (a2-2), and (a2-3) is preferably (a2-1) / (a2-2) / (a2-3) = 10~70 / 1~50 / 0~70, more preferably 15~60 / 5~40 / 0~60, and particularly preferably 20~50 / 10~30 / 0~50, from the viewpoint of balancing resistance to developing solution and developability.

[0052] -Other constituent units- The alkali-soluble resin (A2) may contain other constituent units that do not fall under any of the above units (a2-1) to (a2-3). Examples of other constituent units include benzyl methacrylate, 2-methacryloyloxyethyl isocyanate, 2-hydroxyethyl methacrylate, and N-cyclohexyl succinimide. In the alkali-soluble resin (A2), the content (mol%) of other constituent units is preferably 0 to 30 mol%, and more preferably 0 to 15 mol%, from the viewpoint of achieving both resistance to developing solutions and developability.

[0053] (molecular weight) The weight-average molecular weight of at least one of the alkali-soluble resins (A1) and (A2) is preferably 30,000 or less, preferably 500 to 30,000, more preferably 1,000 to 20,000, even more preferably 2,000 to 15,000, and particularly preferably 3,000 to 10,000 from the viewpoint of developability. The molecular weight of the alkali-soluble resin (A) can be measured by gel permeation chromatography (manufactured by Tosoh Corporation, part number: HLC-8120, column: G-5000HXL and G-3000HXL linked together, detector: RI, mobile phase: tetrahydrofuran).

[0054] (Acid value) The acid value of the alkali-soluble resin (A2) is 20 to 100 mg KOH / g or less, more preferably 25 to 90 mg KOH / g or less, even more preferably 30 to 80 mg KOH / g, and particularly preferably 30 to 70 mg KOH / g or less, from the viewpoint of balancing resistance to developing solutions and developability. The theoretical acid value can be used as the acid value of the alkali-soluble resin.

[0055] (Glass transition temperature) The glass transition temperature of the alkali-soluble resin (A2) is preferably 0 to 300°C, and particularly preferably 30 to 250°C, from the viewpoint of heat resistance and developability. This glass transition temperature can be measured using a differential scanning calorimeter (DSC).

[0056] (double bond equivalent) The double bond equivalent of alkali-soluble resin (A2) is preferably 150 to 2000, more preferably 150 to 1500, and particularly preferably 200 to 1000, from the viewpoint of reactivity and developability. This double bond equivalent can be determined in the same manner as for alkali-soluble resin (A1).

[0057] (Specific example) Specific examples of alkali-soluble resins (A2) include the following polymers.

[0058] [ka]

[0059] (Content) The content of alkali-soluble resin (A) in the curable resin composition of this embodiment (total amount of alkali-soluble resin (A1) and alkali-soluble resin (A2)) is not particularly limited, but for example, from the viewpoint of developability, 30 to 80% by mass is preferred, 40 to 70% by mass is more preferred, and 45 to 65% by mass is particularly preferred, based on the total solids content in the composition. Throughout this specification, "total solids content" means all components in the resin composition other than the solvent.

[0060] (Combination of alkali-soluble resin (A1) and alkali-soluble resin (A2)) The mass ratio of alkali-soluble resin (A1) to alkali-soluble resin (A2) in the curable resin composition of this embodiment is not particularly limited, but for example, from the viewpoint of curability, a mass ratio (A1):(A2) of 100:5 to 100 is preferred, 100:5 to 60% is more preferred, and 100:10 to 50 is particularly preferred.

[0061] <Other polymers> The curable resin composition of this embodiment may contain polymers other than the alkali-soluble resin (A). The content of other polymers in the curable resin composition of this embodiment is not particularly limited, but from the viewpoint of obtaining the effects of including other polymers without significantly impairing the chemical resistance of the cured film, for example, 5 to 30 parts by mass, and more preferably 10 to 20 parts by mass, per 100 parts by mass of alkali-soluble resin (A).

[0062] <Polyfunctional (meth)acrylic monomer (B)> The polyfunctional (meth)acrylic monomer B is a compound having two or more polymerizable functional groups and having at least one (meth)acrylic group. The polyfunctional (meth)acrylic monomer B of this embodiment includes the (meth)acrylic monomer (B1) and the (meth)acrylic monomer (B2) described later. The curable resin composition of this embodiment also contains the (meth)acrylic monomer (B1) and optionally further contains the (meth)acrylic monomer (B2).

[0063] In this embodiment, the content of the polyfunctional (meth)acrylic monomer (B) in the curable resin composition is set such that the mass ratio [A:B] of the total amount [A] of the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) to the total amount [B] of the polyfunctional (meth)acrylic monomer (B) is 100:40 to 80, from the viewpoint of developability during pattern formation. If the total amount [B] of the polyfunctional (meth)acrylic monomer (B) is less than 40 parts by mass of 100 parts by mass of the total amount [A] of the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2), the developability during pattern formation may decrease. If the total amount [B] is greater than 80 parts by mass of 100 parts by mass of the total amount [A], the migration resistance of the curable resin composition may deteriorate. From the viewpoint of pattern processability and migration resistance, the mass ratio [A:B] is preferably 100:40 to 75, more preferably 100:45 to 70, and particularly preferably 100:45 to 60.

[0064] Furthermore, although there are no particular limitations, the combination of alkali-soluble resin (A1) and alkali-soluble resin (A2) with polyfunctional (meth)acrylic monomer (B) is not particularly limited. However, from the viewpoint of balancing resistance to developing solutions and developability, for example, A1:A2:B = 100:5 to 40:35 to 110 can be used.

[0065] Furthermore, although not particularly limited, the mass ratio [B1:B2] of the meth)acrylic monomer (B1) and (meth)acrylic monomer (B2) in the polyfunctional (meth)acrylic monomer B is set to be between 100:0 and 100.

[0066] <(meth)acrylic monomer (B1)> The (meth)acrylic monomer (B1) is a compound having two polymerizable functional groups and a ring structure contained between the two polymerizable functional groups, and having at least one (meth)acrylic group. The curable resin composition of this embodiment can improve the processability of patterns by using the (meth)acrylic monomer (B1).

[0067] Here, "ring structure" refers to a structure having at least one cyclic skeleton, and includes both structures composed solely of a cyclic skeleton and structures composed of a cyclic skeleton and linear structures bonded to the cyclic skeleton. Furthermore, "ring structure contained between two polymerizable functional groups" means that the two polymerizable functional groups are bonded via a ring structure, and the polymerizable functional groups may be directly bonded to the cyclic skeleton or indirectly bonded to the cyclic skeleton. From the viewpoint of resistance to developing solutions, the ring structure of the (meth)acrylic monomer (B1) can be selected from the group including aliphatic hydrocarbon groups having 6 to 26 carbon atoms that may contain an oxygen atom, aromatic hydrocarbons having 6 to 26 carbon atoms that may contain an oxygen atom, and combinations thereof (for example, combinations of aliphatic hydrocarbons and aromatic hydrocarbons, combinations of different aliphatic hydrocarbons, different aromatic hydrocarbon compounds, etc.). Specific examples of cyclic skeletons include, for example, the fluorene skeleton, cyclohexane skeleton, bisphenol A skeleton, dicyclopentane skeleton, and combinations thereof.

[0068] A "polymerizable functional group" is a (meth)acrylic group itself, a group containing one (meth)acrylic group, or a functional group containing one polymerizable group other than a (meth)acrylic group. Examples of polymerizable functional groups other than a (meth)acrylic group include vinyl groups, allyl groups, and (meth)acrylamide groups. Hereinafter, when referred to as a "group containing a (meth)acrylic group," it means either a (meth)acrylic group itself or a group containing one (meth)acrylic group. In (meth)acrylic monomer (B1), there are two polymerizable functional groups. If the number of polymerizable functional groups exceeds two, the processability of the pattern may decrease. Also, the two polymerizable functional groups may be the same or different from each other.

[0069] As the (meth)acrylic monomer (B1), the compound represented by the following formula (b1) can be used.

[0070] [ka] (In the formula, R 11 and R 12 Each of these independently represents either a hydrogen atom or a methyl group; Y 1 and Y 2 Each of these independently represents a single bond or a linear or branched aliphatic hydrocarbon group having 1 to 26 carbon atoms, which may contain an oxygen atom; X 11 (wherein W1 represents an aliphatic hydrocarbon group or aromatic group having 6 to 26 carbon atoms and a cyclic skeleton; W1 and W2 each independently represent O, N, or S.)

[0071] In formula (b1), R 11 and R 12 Each of these independently represents either a hydrogen atom or a methyl group, and from the viewpoint of the composition exhibiting good curability during exposure (hereinafter simply referred to as "curability"), a hydrogen atom is preferred. Y 1 and Y 2Each independently represents a linear or branched aliphatic hydrocarbon group (divalent bonding group) having 1 to 26 carbon atoms, which may contain a single bond or an oxygen atom. From the viewpoint of curability, the number of carbon atoms in the aliphatic hydrocarbon group is preferably 1 to 20, and more preferably 1 to 12. Examples of linear or branched aliphatic hydrocarbon groups include alkylene groups having 1 to 26 carbon atoms, such as methylene group, ethylene group, 1-methylethylene group, 1-methylprolene group, 2-methylprolene group, and 1,1-dimethylethylene group. Also, Y containing an oxygen atom 1 and Y 2 For example, -O(C2H4O )m Examples include the group indicated by - (m is 1 to 13). 1 and Y 2 For example, a methylene group is preferred.

[0072] X 11 This represents an aliphatic hydrocarbon group or aromatic group (divalent bond group) having 6 to 26 carbon atoms and a cyclic skeleton. From the viewpoint of resistance to developing solution, X 11 The carbon number is preferably 6 to 26. Examples of aliphatic hydrocarbons having 6 to 26 carbon atoms and a cyclic skeleton include divalent bonding groups consisting of a cyclohexane ring, cyclodecane ring, tricyclodecane ring, adamantane ring, norbornane ring, or decalin ring, while examples of aromatic groups include divalent bonding groups consisting of a benzene ring, a naphthalene ring, etc. 11 Preferably, the bond group is a divalent bond containing at least one selected from the fluorene skeleton, cyclohexane skeleton, bisphenol A skeleton, dicyclopentane skeleton, and combinations thereof.

[0073] The (meth)acrylic monomer (B1) is not particularly limited, but the following compounds can be listed.

[0074] [ka]

[0075] In this embodiment, the content of (meth)acrylic monomer (B) in the curable resin composition is set such that the mass ratio [A:B] of the total amount [A] of the thermosetting alkali-soluble resin (A1) and photocurable alkali-soluble resin (A2) to the total amount [B] of (meth)acrylic monomer (B) is 100:35 to 80, from the viewpoint of developability during through-hole formation. If the total amount [B] of (meth)acrylic monomer (B) is less than 35 parts by mass of 100 parts by mass of the total amount [A] of the thermosetting alkali-soluble resin (A1) and photocurable alkali-soluble resin (A2), the developability during through-hole formation may decrease. From the viewpoint of through-hole processability, the mass ratio [A:B] is preferably 100:40 to 75, and more preferably 100:45 to 70. Furthermore, although there are no particular limitations, the combination of alkali-soluble resin (A1) and alkali-soluble resin (A2) with (meth)acrylic monomer (B) can be, for example, A1:A2:B = 100:5 to 40:35 to 110, or 100:10 to 30:50 to 100, from the viewpoint of balancing resistance to developing solutions and developability.

[0076] Furthermore, the curable resin composition of this embodiment may also contain photoreactive monomers other than the (meth)acrylic monomer (B). There are no particular limitations on the other photoreactive monomers, but examples include compounds having three or more ethylenically unsaturated groups in the molecule. Examples of such compounds include trimethylolpropane triacrylate, pentaerythritol triacrylate, and dipentaerythritol hexaacrylate.

[0077] (double bond equivalent) The double bond equivalent of (meth)acrylic monomer (B1) is preferably 120 to 1000, more preferably 120 to 800, and particularly preferably 120 to 600, from the viewpoint of reactivity and developability. This double bond equivalent can be determined according to the molecular weight of (meth)acrylic monomer (B) / (number of ethylenically unsaturated groups in (meth)acrylic monomer (B)).

[0078] (LogP) The LogP of the (meth)acrylic monomer (B) is preferably 1 to 8, more preferably 1.5 to 7, even more preferably 2 to 6, particularly preferably 2.5 to 6, and most preferably 3 to 5, from the viewpoint of resistance to developer and developability. The LogP can be determined by measuring it using HPLC (High Performance Liquid Chromatography) with a reversed-phase column (C18) according to OECD GUIDELINES FOR THE TESTING CHEMICALS Partition Coefficient (n-octanol / water), High Performance Liquid Chromatography (HPLC) Method 117 (Adopted 13 April 2004). Benzyl alcohol, anisole, toluene, and butylbenzene are used as standard substances with known LogPs.

[0079] Examples of LogP measurement conditions are as follows: • Equipment: Agilent Technology 1200 Series HPLC • Column: DiKMA Inspire C18 5μm 150×4.6mm (particle size 5μm, inner diameter 4.6mm, length 150mm) Mobile phase: A mixture of acetonitrile and 0.5 wt% phosphoric acid aqueous solution {mixing ratio 55:45 (volume ratio)} Oven temperature: 40℃ ·Flow rate: 1mL / min UV detection wavelength: 210nm

[0080] <(meth)acrylic monomer (B2)> The (meth)acrylic monomer (B2) is a compound having three or more polymerizable functional groups and having at least one (meth)acrylic group. The curable resin composition of this embodiment may contain (meth)acrylic monomer (B2) in addition to (meth)acrylic monomer (B1).

[0081] The (meth)acrylic monomer (B2) is not particularly limited, but can be trimethylolpropane triacrylate, dipentaerythritol hexaacrylate (DPHA), pentaerythritol triacrylate (PET-3A), or tripentaerythritol octaacrylate.

[0082] (Combination of (meth)acrylic monomer (B1) and (meth)acrylic monomer (B2)) The mass ratio of (meth)acrylic monomer (B1) to (meth)acrylic monomer (B2) in the curable resin composition of this embodiment is not particularly limited, but for example, from the viewpoint of reactivity, a mass ratio (B1):(B2) of 100:0 to 50 is preferred, 100:0 to 40% is more preferred, and 100:0 to 30% is particularly preferred. Furthermore, there are no particular limitations on the combination of (meth)acrylic monomer (B1) and (meth)acrylic monomer (B2), but from the viewpoint of water resistance and reactivity, for example, a combination of dimethylol-tricyclodecanediaacrylate and dipentaerythritol hexaacrylate (DPHA) can be used.

[0083] Furthermore, the curable resin composition of this embodiment may also contain photoreactive monomers other than the polyfunctional (meth)acrylic monomer (B) (particularly monofunctional (meth)acrylic monomers).

[0084] <Silane compound (C)> Silane compound (C) is a so-called silane coupling agent. Silane compound (C) is represented by the following formula (1) or (2). [ka] (In the formula, R 1 ~R 3 These may be the same or different, and all or at least one of them are alkoxy groups having 1 to 5 carbon atoms, while the others are alkyl groups having 1 to 5 carbon atoms. 4 ~R 6A and B are alkoxy groups or alkyl groups having 1 to 5 carbon atoms, and may be the same or different. A is a substituted or unsubstituted linear or branched alkylene group having 2 to 18 carbon atoms, and may contain divalent or trivalent linking groups. B is a substituted or unsubstituted linear or branched alkylene group having 2 to 15 carbon atoms, and may contain divalent linking groups. X is O, NH, NH-CO-NH, or S. p is an integer from 0 to 1. q is an integer from 1 to 3. r is an integer from 1 to 3. s is an integer from 1 to 3. t is an integer from 1 to 3.

[0085] The amount of silane compound (C) in the curable resin composition of this embodiment is not limited, but from the viewpoint of achieving both patterning accuracy and migration resistance of the curable resin composition, it is preferably 1 to 40 parts by mass, and more preferably 5 to 30 parts by mass, per 100 parts by mass of the total amount of alkali-soluble resin (A).

[0086] In the above formula (1) or (2), R 1 ~R 3 These may be the same or different, and all or at least one of them are alkoxy groups having 1 to 5 carbon atoms, while the others are alkyl groups having 1 to 5 carbon atoms.

[0087] Examples of alkoxy groups having 1 to 5 carbon atoms include methoxy, ethoxy, 1-propoxy, 2-propoxy, 1-butoxy, 2-methylpropoxy, 2-butoxy, 1,1-dimethylethoxy, 1-pentoxy, 3-methylbutoxy, 2,2-dimethylpropoxy, and 1,1-dimethylpropoxy groups, and preferably methoxy and ethoxy groups.

[0088] Examples of alkyl groups having 1 to 5 carbon atoms include methyl group, ethyl group, 1-propyl group, 2-propyl group, 1-butyl group, 2-methylpropyl group, 2-butyl group, 1,1-dimethylethyl group, 1-pentyl group, 3-methylbutyl group, 2,2-dimethylpropyl group, and 1,1-dimethylpropyl group, with methyl group and ethyl group being preferred.

[0089] A is a substituted or unsubstituted linear or branched alkylene group having 2 to 18 carbon atoms. The number of carbon atoms in the linear or branched alkylene group is preferably 2 to 12, more preferably 2 to 6. Substituents for the linear or branched alkylene group having 2 to 18 carbon atoms include ester groups to which an alkyl group having 1 to 5 carbon atoms is attached. A may contain at least one divalent or trivalent linking group. Examples of divalent or trivalent linking groups are shown in the following formula [A1]. By including a trivalent linking group in the substituted or unsubstituted linear or branched alkylene group having 2 to 18 carbon atoms, compounds are obtained in formula (1) where q and r are integers greater than 1. [ka] [R 7 , R 8 These may be the same or different hydrogen atoms, C1-C5 alkyl groups, C6-C12 aryl groups, -CH=, [ka] (R 9 , R 10 m3 is an alkyl group with 1 to 5 carbon atoms, and m3 is an integer from 1 to 5. [ka] (m4 is an integer from 1 to 5) [ka] (R 11 R is a monovalent or divalent group represented by an alkyl group having 1 to 5 carbon atoms, or a cycloalkane having 3 to 6 carbon atoms, which may have substituents. 7 or R 8 If either of the groups is a divalent group, the other is either a hydrogen atom or a monovalent group. [ka] A substituted or unsubstituted cycloalkane with 3 to 6 carbon atoms possessing at least two bonding sites. [ka]

[0090] In [A1] above, the alkyl group having 1 to 5 carbon atoms is the same as that exemplified in general formula (1) above. Examples of aryl groups having 6 to 12 carbon atoms include phenyl, benzyl, and tolyl groups. Examples of cycloalkanes having 3 to 6 carbon atoms include cyclopropane, cyclobutane, cyclopentane, and cyclohexane.

[0091] An isocyanate group or silicon atom is bonded to A. If A contains one or more trivalent linking groups [A1], it can become a compound having multiple isocyanate groups or multiple silicon atoms in its molecule. Furthermore, even if a trivalent linking group is present, a non-reaction-participating group such as a methyl group or cyano group may be bonded to the end of one of the linking groups, resulting in a divalent linking group.

[0092] q is an integer between 1 and 3, preferably 1. r is an integer between 1 and 3, preferably 1.

[0093] R 4 ~R 6 These may be the same or different, and are alkoxy groups having 1 to 5 carbon atoms or alkyl groups having 1 to 5 carbon atoms. The alkoxy groups having 1 to 5 carbon atoms or alkyl groups having 1 to 5 carbon atoms are as described above for R 1 ~R 3 Examples similar to those shown earlier can be provided.

[0094] B is a substituted or unsubstituted linear or branched alkylene group having 2 to 15 carbon atoms. The number of carbon atoms in the linear or branched alkylene group is preferably 2 to 10, more preferably 2 to 6. B may contain at least one divalent linking group. Examples of divalent linking groups include ether bonds (-O-), carbonyl groups (-C(=O)-), and those shown in the following formula [B1].

[0095] [ka]

[0096] X consists of O, NH, NH-CO-NH, and S.

[0097] The X group or silicon atom is either bonded to B, or the X group and silicon atom are directly bonded. If the molecule contains multiple X groups, the second and subsequent X groups are bonded to [B1], or the substituent [B1] itself is an NH-CO-NH group. Also, if the molecule contains multiple silicon atoms, the second and subsequent silicon atoms are either bonded to [B1], or are substituents on a linear or branched alkylene group.

[0098] p is an integer of 0 or 1. s is an integer between 1 and 3, preferably 1. t is an integer between 1 and 3, preferably 1.

[0099] The silane compound (C) contained in the curable resin composition of this embodiment is preferably a silane compound represented by any of the following formulas (3) to (6) from the viewpoint of further improving the adhesion of the cured film to the substrate. [ka] (In the formula, R 1 ~R 3 These may be the same or different, and all or at least one of them are alkoxy groups having 1 to 5 carbon atoms, while the others are alkyl groups having 1 to 5 carbon atoms. 4 ~R 6may be the same or different and are alkyl groups having 1 to 5 carbon atoms. m is an integer of 2 to 18.) [Chemical formula] (In the formula, R 1 ~R 3 may be the same or different, and all or at least one of them is an alkoxy group having 1 to 5 carbon atoms, and the others are alkyl groups having 1 to 5 carbon atoms. R 4 ~R 6 may be the same or different and are alkoxy groups having 1 to 5 carbon atoms or alkyl groups having 1 to 5 carbon atoms. m is an integer of 2 to 18, and n is an integer of 2 to 15.) [Chemical formula] (In the formula, R 1 ~R 3 may be the same or different, and all or at least one of them is an alkoxy group having 1 to 5 carbon atoms, and the others are alkyl groups having 1 to 5 carbon atoms. R 4 ~R 6 may be the same or different and are alkoxy groups having 1 to 5 carbon atoms or alkyl groups having 1 to 5 carbon atoms. m is an integer of 2 to 18, and n is an integer of 2 to 15.) [Chemical formula] (In the formula, R 1 ~R 3 may be the same or different, and all or at least one of them is an alkoxy group having 1 to 5 carbon atoms, and the others are alkyl groups having 1 to 5 carbon atoms. R 4 ~R 6 may be the same or different and are alkoxy groups having 1 to 5 carbon atoms or alkyl groups having 1 to 5 carbon atoms. m is an integer of 2 to 18, and n is an integer of 2 to 15.)

[0100] Examples of the silane compound (C) include, but are not limited to, the following compounds. [Chemical formula]

[0101] (Photopolymerization initiator) The curable resin composition of this embodiment is a negative-type curable resin composition containing a photopolymerization initiator. The photopolymerization initiator is a compound that is activated by various types of active light, such as ultraviolet light, and initiates polymerization. Examples of photopolymerization initiators include radical photopolymerization initiators, cationic photopolymerization initiators, and anionic photopolymerization initiators. The photopolymerization initiator is not particularly limited, but for example, a photopolymerization initiator that generates radicals that polymerize ethylenically unsaturated groups by ultraviolet light to visible light can be suitably used.

[0102] The photopolymerization initiator is not particularly limited, but examples include acetophenones such as acetophenone, 2,2'-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, and p-tert-butylacetophenone, as well as 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one and 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin- Alpha-aminoketone photopolymerization initiators such as 4-ylphenyl)-butan-1-one, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, and 1-[4-(phenylthio)phenyl]octane-1,2-dione=2-(O-benzoyl oxime), ethanone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(O-acetyl oxime), 1-[9-ethyl-6-benzoyl-9.H.-carbazole-3-yl]- Octane-1-onoxime-O-acetate, 1-[9-ethyl-6-(2-methylbenzoyl)-9.H-carbazol-3-yl]-ethane-1-onoxime-O-benzoate, 1-[9-n-butyl-6-(2-ethylbenzoyl)-9.H-carbazol-3-yl]-ethane-1-onoxime-O-benzoate, Ethanone-1-[9-ethyl-6-(2-methyl-4-tetrahydrofuranylbenzoyl)-9.H-carbazol-3-yl]-1-(O-acetate Ethanone-1-[9-ethyl-6-(2-methyl-4-tetrahydropyranylbenzoyl)-9.H-carbazol-3-yl]-1-(O-acetyloxime), Ethanone-1-[9-ethyl-6-(2-methyl-5-tetrahydrofuranylbenzoyl)-9.H-carbazol-3-yl]-1-(O-acetyloxime), Ethanone-1-[9-ethyl-6-{2-methyl-4-(2,2-dimethyl-1,3-dioxolanyl)methoxybenzoyl}-9.H.Oxime ester-based photopolymerization initiators such as -carbazole-3-yl]-1-(O-acetyloxime), benzophenones such as benzophenone, 2-chlorobenzophenone, and p,p'-bisdimethylaminobenzophenone; benzoin ethers such as benzyl, benzoin, benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; sulfur compounds such as benzyldimethylketal, thioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2-methylthioxanthone, and 2-isopropylthioxanthone; 2-ethylanthraquinone, octamethylanthraquinone, and 1,2-benz Examples of photopolymerization initiators include anthraquinones such as anthraquinone and 2,3-diphenylanthraquinone; triazines such as 2,4-trichloromethyl-(4'-methoxyphenyl)-6-triazine, 2,4-trichloromethyl-(4'-methoxynaphthyl)-6-triazine, 2,4-trichloromethyl-(piperonyl)-6-triazine, and 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; organic peroxides such as azobisisobutyronitrile, benzoyl peroxide, and cumene peroxide; and thiol compounds such as 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, and 2-mercaptobenzothiazole. From the viewpoint of reactivity, oxime ester-based photopolymerization initiators are preferred as photopolymerization initiators. These photopolymerization initiators may be used individually or in combination of two or more.

[0103] The content of the photopolymerization initiator in the curable resin composition of this embodiment is not particularly limited, but for example, from the viewpoint of photoreactivity and storage stability, when the total of the polyfunctional (meth)acrylic monomer (B), the photoreactive monomer, and the photocurable alkali-soluble resin (A) is 100 parts by mass, 0.1 to 30 parts by mass is preferred, 1 to 20 parts by mass is more preferred, and 2 to 15 parts by mass is particularly preferred.

[0104] <Method for producing curable resin compositions> The curable resin composition of this embodiment is a negative-type curable resin containing an alkali-soluble resin (A), a (meth)acrylic monomer (B), and a silane compound (C). It can also be prepared by adding a solvent, polymerization inhibitor, photopolymerization initiator, etc., and stirring and mixing.

[0105] (solvent) In this embodiment, the solvent can be appropriately selected and used from known solvents depending on the desired purpose. Examples of the aforementioned solvents include cyclohexanone (anone), cyclopentanone, diethylene glycol ethyl methyl ether, acetylacetone, methanol, ethanol, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve, methyl cellosolve acetate, diglyme, cyclohexanone, ethylbenzene, xylene, isoamyl acetate, n-amyl acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (PGMAC), propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, diethylene glycol, diethylene glycol monomethyl ether, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol Examples include ethyl methyl ether (EDM), diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, triethylene glycol, triethylene glycol monomethyl ether, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether, triethylene glycol monoethyl ether acetate, liquid polyethylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monoethyl ether acetate, lactic acid esters, methyl methoxypropionate, and ethyl ethoxypropionate.

[0106] The aforementioned solvent may be used alone or in combination of two or more types. Furthermore, while there are no particular limitations on the solvent content in the curable resin composition of this embodiment, it is preferable to use a solvent such that, for example, from the viewpoint of storage stability and coating properties, the total solids content (total mass of components other than the solvent in the composition) concentration is preferably 1 to 40% by mass, more preferably 5 to 40% by mass, and particularly preferably 10 to 30% by mass. By keeping the solids content within the above range, the viscosity of the curable resin composition can be made appropriate, and the coating properties when applying it to a substrate or the like to form a film are particularly improved.

[0107] (Polymerization inhibitor) The curable resin composition of this embodiment may contain a polymerization inhibitor from the viewpoint of suppressing polymerization of the photocurable alkali-soluble resin (A2), (meth)acrylic monomer (B), etc. Furthermore, a known ultraviolet absorber may be used as the polymerization inhibitor.

[0108] Examples of polymerization inhibitors include 4-methoxyphenol, 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-N,N-dimethylamino-p-cresol, 2,4-dimethyl-6-tert-butylphenol, 4-tert-butylcatechol, and 4,4'-thio-bis(3-methyl-6-tert-butylphenol). Phenolic compounds such as 4,4'-butylidene-bis(3-methyl-6-tert-butylphenol), 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl, 4-acetamino-2,2,6,6-tetramethylpiperidine-N-oxyl, 4-benzoyloxy-2,2,6,6-tetramethylpiperidine-N-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine-N-oxyl Examples include N-oxy radical compounds such as syl and 2,2,6,6-tetramethylpiperidine-N-oxyl; quinone compounds such as methoquinone (MEHQ), hydroquinone, 2,5-di-tert-butylhydroquinone, 2,6-di-tert-butylhydroquinone, and benzoquinone; cuprous chloride; copper dialkyldithiocarbamates such as copper dimethyldithiocarbamate; amino compounds such as phenothiazine, N,N'-diphenyl-p-phenylenediamine, phenyl-β-naphthylamine, N,N'-di-β-naphthyl-p-phenylenediamine, and N-phenyl-N'-isopropyl-p-phenylenediamine; and hydroxyamine compounds such as 1,4-dihydroxy-2,2,6,6-tetramethylpiperidine, 1-hydroxy-2,2,6,6-tetramethylpiperidine, and 4-hydroxy-2,2,6,6-tetramethylpiperidine. For example, methoquinone can be suitably used as a polymerization inhibitor. These polymerization inhibitors may be used individually or in combination of two or more types.

[0109] The amount of polymerization inhibitor in the curable resin composition of this embodiment is not particularly limited, but from the viewpoint of processability of patterns such as through holes and grooves, it is preferably 0.1 to 0.6% by mass, and more preferably 0.1 to 0.4% by mass, based on the total solids content (total mass of components other than the solvent in the composition).

[0110] The curable resin composition of this embodiment may also use various additives as needed, such as inorganic fine particles, adhesion-promoting additives, surfactants, storage stabilizers, leveling agents, light stabilizers, and antioxidants. Examples of these additives include those described in Japanese Patent Application Publication No. 2012-215833.

[0111] <<Insulating cured film>> The applications of the curable resin composition of this embodiment are not particularly limited, but it can be used for insulating film formation, for example, as an insulating cured film, particularly an insulating cured film for touch panels. An insulating cured film for touch panels can be formed by applying the curable resin composition to a substrate such as a glass substrate, ITO, a metal film, or an organic film using various application methods such as spin coating, die coating, roll coating, or roll transfer, and then curing the coating.

[0112] Specifically, the curable resin composition can be applied to a substrate such as a glass substrate and cured by irradiating it with light to form the cured film of this embodiment. Furthermore, the cured film of this embodiment can be patterned by irradiating it with light through a mask, developing it, and then heat-treating it as needed.

[0113] The insulating cured film can be used for any application, such as insulating film, protective film, or flat film. The insulating cured film using the curable resin composition of this embodiment is particularly suitable for use as a protective film for touch panels or as an insulating film for touch panels.

[0114] Furthermore, the insulating cured film of this embodiment may be used not only as a so-called permanent film maintained within devices such as touch panels, but also as a resist film used when patterning an ITO film on a glass substrate.

[0115] (pattern) Cured films used in insulating cured films for touch panels and the like can be provided with patterns such as through-holes and grooves of a desired size for purposes such as conducting electricity between electrodes. As described above, the curable resin composition of this embodiment is a negative-type composition, yet it has excellent pattern processability, and can form patterns where the holes are sufficiently open to the sides and grooves to the bottom, and the cross-sectional shape of the holes and grooves is an inverted trapezoidal shape from the exposure direction. For this reason, it can be suitably used as a cured film forming composition with patterns such as through-holes or grooves (hereinafter also referred to as "patterned cured film forming composition").

[0116] The method for producing a patterned cured film using the curable resin composition of this embodiment (hereinafter also referred to as a "patterned cured film") is not particularly limited, and known pattern formation methods and cured film production methods can be appropriately selected. An example of a method for producing a patterned cured film using the curable resin composition of this embodiment is a method that includes the steps of: applying the curable resin composition of this embodiment to a substrate to form a coating film (coating film formation step); exposing the coating film through a pattern formation mask such as through holes or grooves (exposure step); removing the unexposed parts of the coating film after exposure with a developer (development step); and heating the coating film from which the unexposed parts have been removed (for example, 90 to 230°C, 10 to 60 minutes) (post-bake step). Between the coating film formation step and the exposure step, a step of heating the coating film (for example, 80 to 100°C, 60 to 180 seconds) (pre-bake step) may be performed. The curable resin composition of this embodiment exhibits excellent developability in unexposed areas (uncured areas) and high developer resistance in exposed areas (cured areas). Therefore, it is possible to form a desired fine pattern while suppressing overdevelopment. Furthermore, because it contains a thermosetting resin (alkali-soluble resin (A1)) in addition to a photocurable resin (alkali-soluble resin (A2)), the taper angle of the hole or groove cross-sectional shape can be maintained without the pattern walls becoming saggy during the post-bake process. Thus, by using the curable resin composition of this embodiment, even patterns with small pore diameters (for example, pore diameters of 5 μm or less) can be formed with sufficient openings extending to the sides of the pattern, and the cross-sectional shape of the pattern can be formed in an inverted trapezoidal shape from the exposure direction.

[0117] The thickness of the patterned cured film can be set as appropriate depending on the purpose, but for example, from the viewpoint of migration resistance and developability, it can be set to 0.2 μm to 20 μm, and further to 0.5 μm to 10 μm. Furthermore, the pore diameter of the through-holes formed in the patterned cured film can be set appropriately depending on the purpose, but for example, from the viewpoint of reactivity and developability, it can be 30 μm to 200 μm, and further, it can be 40 μm to 100 μm. Note that the "pore diameter" of the through-holes formed in the patterned cured film is the pore diameter corresponding to the height of 10% from the bottom surface of the through-hole (10% Bottom CD in Figure 3; "R" 10 It can be defined as (sometimes referred to as "...").

[0118] The width of the grooves in the patterned cured film can be set as appropriate depending on the purpose, but for example, from the viewpoint of reactivity and developability, it can be 30 μm to 1000 μm, and further, 50 μm to 500 μm.

[0119] <<Touch Panel>> As described above, the curable resin composition of this embodiment and the insulating cured film using the same can be suitably used as an insulating film for touch panels. Hereinafter, the insulating cured film and the insulating film for touch panels of this embodiment may be collectively referred to simply as "the cured film of this embodiment."

[0120] The touch panel of this embodiment may be of any type: resistive, capacitive, ultrasonic, or optical, but a capacitive touch panel is preferred. Capacitive touch panels, for example, use glass with an ITO film as a substrate and have insulating films or protective films in the laminated structure (for example, between electrodes) to prevent misrecognition of the contact position. If the touch panel of this embodiment is a capacitive touch panel, the cured film of this embodiment can be used, for example, as an insulating film, a protective film, or both in the laminated structure.

[0121] Furthermore, touch panels can be divided into two types: a two-sided structure in which the X electrode is arranged on one side of the insulating film and the Y electrode on the other side, and a one-sided structure in which the X electrode and Y electrode are formed on the same plane. The touch panel of this embodiment may have either a two-sided or one-sided structure, but a one-sided structure is particularly preferred. In a single-panel touch panel structure, the X and Y electrodes are electrically isolated. Depending on the electrode pattern, these can be classified into, for example, island-type patterns or through-hole patterns. For instance, in an island-type pattern and a single-panel touch panel structure, the isolated electrodes are electrically connected by a component called a jumper. Transparent electrodes, such as ITO film, are used in the electrode jumpers. If the jumper connects the isolated Y electrodes, an insulating layer is provided below the jumper to maintain insulation from the X electrode. Furthermore, a uniform insulating film (protective film) is typically formed on each electrode arranged in a single panel. Therefore, if the touch panel of this embodiment has a single-panel structure, the cured film of this embodiment can be used, for example, as an insulating film formed on the electrode, an insulating layer formed below the jumper portion, or both.

[0122] Furthermore, when a touch panel is incorporated into a liquid crystal display device, it can be classified into out-cell, on-cell, and in-cell structures depending on its installation location. In on-cell and in-cell structures, the touch panel is incorporated within the liquid crystal panel, while in an out-cell structure, the touch panel is incorporated on the outside of the liquid crystal panel. In an on-cell structure, the touch panel is installed between the polarizing plate on the observation direction side and the liquid crystal laminate (a laminate composed of a pair of substrate glass and a liquid crystal layer interposed therein). In an in-cell structure, the liquid crystal layer of the liquid crystal laminate has the touch panel function. The touch panel of this embodiment is applicable to any of these structures, but for example, it is preferably used in an on-cell structure.

[0123] The following describes one aspect of the touch panel according to this embodiment using the figures. Figure 1 is a plan view showing the configuration of one aspect of the touch panel according to this embodiment. As shown in Figure 1, when the touch panel according to this embodiment is a single-panel type touch panel, ITO (indium tin oxide) electrodes (X1~X3, Y1~Y3) are formed on the glass substrate 10.

[0124] The material of the glass substrate 10 is not particularly limited, but for example, glass plates such as soda-lime glass, low-alkali borosilicate glass, or alkali-free aluminoborosilicate glass can be used. Alternatively, instead of a glass substrate, a plastic plate or plastic film made of polyethylene terephthalate (PET), triacetylcellulose (TAC), polymethyl methacrylate (PMMA), polycarbonate (PC), etc., may be used.

[0125] The ITO electrodes (X1-X3, Y1-Y3) are transparent electrodes. In this embodiment, ITO is used as the material for the transparent electrodes, but it is not particularly limited as long as it can be arranged on the substrate surface. In addition to ITO, inorganic conductive materials such as ZnO (zinc oxide), organic conductive materials such as PEDOT / PSS (polyethylenedioxythiophene / polystyrene sulfonic acid), polyaniline, and polypyrrole can also be used. These materials may be used individually or in combination of two or more. Although not shown in Figures 1 and 2, a thin metal film functioning as a metal wiring may be used in the underlying layer of each electrode and jumper section X12, or instead of the transparent electrode. Metal materials such as Mo (molybdenum), Al (aluminum), Ag (silver), and Pd (palladium) can be used for the thin metal film, and it is preferable to use either Mo or Al or one or more of them.

[0126] As shown in Figure 1, the ITO electrodes X1 to X3 are arranged in the direction of arrow P in Figure 1. Although the ITO electrodes X1 to X3 are separated from adjacent electrodes, they are electrically connected to adjacent electrodes in the P direction via jumper portions X12. The jumper portions X12 can be made of the same material as the transparent electrodes, such as ITO. Furthermore, an insulating film 14, as shown in Figure 2, is interposed between the lower part of the jumper portion X12 in the thickness direction and the connection portion of the ITO electrode Y. In addition, through-holes 20 are provided at both ends of each jumper portion X12 to electrically connect to adjacent electrodes in the P direction. Furthermore, the ITO electrodes Y1 to Y3 are electrodes arranged in the direction of arrow Q in Figure 1. The ITO electrodes Y1 to Y3 are continuously coupled to adjacent electrodes in the Q direction via connection parts formed of ITO film, and are electrically connected in the Q direction. Typically, the ITO electrodes Y1 to Y3 are formed continuously as a single unit with each connection part during electrode molding. Hereinafter, the group of electrodes electrically connected in the P direction will be referred to as "X electrodes," and the group of electrodes electrically connected in the Q direction will be referred to as "Y electrodes." As shown in Figure 1, in a single-sided touch panel, the X electrodes are arranged along the P direction, and the Y electrodes are arranged along the Q direction.

[0127] Next, the cross-sectional structure of the touch panel in this embodiment will be described using Figure 2. Figure 2 is a cross-sectional view of AA in Figure 1. As shown in Figure 2, an insulating film 14 and a connecting portion Y12 for ITO electrodes Y1 and Y2 are interposed between ITO electrodes X2 and X3. The ITO electrodes X2 and X3 are electrically connected by the jumper portion X12 as described above. In addition, a part of the insulating film 14 extends between the jumper portion X12 and the connecting portion Y12 at the lower part in the thickness direction of the jumper portion X12, thereby maintaining insulation between the jumper portion X12 and the connecting portion Y12. Furthermore, an insulating protective layer 16 is provided on the insulating film 14 and on the upper side in the thickness direction of the jumper portion X12.

[0128] In this embodiment, at least one of the insulating film 14 or the insulating protective layer 16 is made of the cured film of this embodiment. However, the other may be formed using a known material that has been conventionally used for insulating films and protective films, but it is preferable that both the insulating film 14 and the insulating protective layer 16 are made of the cured film of this embodiment.

[0129] In the touch panel described above, the method for forming the cured film of this embodiment is not particularly limited, but for example, the coating film can be formed on the lower layer (for example, the glass substrate 10 and ITO electrode for the insulating film 14, or the ITO electrode for the insulating protective layer 16, etc.) by coating methods such as spray coating, spin coating, slit die coating, roll coating, or bar coating. In this case, the dry film thickness of the coating film is not particularly limited, but for example, in the case of the insulating protective layer 16, it is preferably 0.5 to 20 μm, and more preferably 1.0 to 10 μm. Similarly, in the case of the insulating film 14, the dry film thickness is preferably 0.2 to 10 μm, and more preferably 0.5 to 5 μm. Furthermore, if necessary, the coating film can be exposed through a mask having a predetermined pattern provided in contact with or without contact with the coating film. The type of light ray used for exposure is not particularly limited, and examples include visible light, ultraviolet light, far-infrared light, electron beam, X-ray, etc., with ultraviolet light being preferred. The illuminance of the light is not particularly limited, but it is 5-150 mW / cm² at 365 nm.2 Preferably, it is 5-35 mW / cm². 2 It is particularly preferable that this be the case. Subsequently, the uncured areas are removed and the desired pattern is formed by immersing the material in an aqueous alkaline developer such as sodium carbonate, sodium hydroxide, or potassium hydroxide, or in tetramethylammonium hydroxide (TMAH), or by spraying the developer solution, as needed. Furthermore, heating (post-baking) can be applied as needed to promote polymerization of the photosensitive composition and harden the film. The pattern formation method described above can be applied when forming the hardened film.

[0130] Furthermore, for example, when forming a jumper portion X12, first, patterned X and Y electrodes are formed on the glass substrate 10, then a curable resin composition is applied to the glass substrate 10 and the surface of the X electrode, and the curable resin composition is exposed and developed using a mask capable of forming an insulating film 14 and through-holes 20. Next, a material that will become the jumper portion X12 (such as ITO) is deposited on the insulating film 14 and through-holes 20 by PVD or the like to form a conductive layer. After that, a protective layer is provided only on the surface of the conductive layer at the location where the jumper portion X12 is to be formed (for example, the insulating film 14 on the connection portion Y12 in Figure 2), and by performing an etching treatment, the jumper portion X12 can be formed on the insulating film 14 on the connection portion Y12. [Examples]

[0131] The present invention will be described more specifically below using examples and comparative examples. The present invention is not limited in any way by the following examples.

[0132] [Examples and Comparative Examples] A curable resin composition was prepared by mixing each component according to the formulations shown in the table below. The mixing was carried out at room temperature, with ultraviolet light blocked to prevent the polymerization reaction from starting.

[0133] [Table 1] * In the table, "OXE01" refers to Irgacure OXE01 (BASF Japan Ltd.). Furthermore, the numerical values ​​for each component in the table represent mass percentages of the entire composition (excluding the solvent).

[0134] In the table above, the components used were those shown in the table below.

[0135] [Table 2]

[0136] [Table 3]

[0137] [Table 4]

[0138] ≪Rating≫ The curable compositions of the examples and comparative examples obtained above were evaluated. The results are shown in the table below.

[0139] (Formation of through-holes) The obtained curable resin composition was applied to a substrate having an ITO film by spin coating, and the coating film was formed by pre-baking on a 90°C hot plate for 120 seconds. Then, using a rectangular contact hole pattern for negatives (hole pitch 200 μm / size 50 μm × 50 μm), light from a super-high pressure mercury lamp at 150 mJ / cm² was applied. 2 Irradiated (illuminance at 365nm: 20mW / cm²) 2 Next, the substrate was developed using 2.38% tetramethylammonium hydroxide (TMAH) for 30 seconds and heated at 120°C for 30 minutes to produce a cured film with a thickness of 2.0 μm.

[0140] The cross-sections of the resulting cured film-coated substrates were observed using a laser microscope (LASERTEC product name: OPTELICSHYBRID), and each evaluation was performed according to the following criteria.

[0141] [Opening of through-holes] A: The through-hole penetrated all the way through to the underlying material. C: A membrane was observed at the bottom of the hole, indicating it was not open.

[0142] [Migration Evaluation] A hardened film substrate was fabricated using a substrate with copper wiring patterned in a comb shape, in the same manner as the hardened film substrate described above, except that through-holes were not provided. The resistance value of the obtained hardened film substrate was observed after heating for 300 hours at 85°C and 85%RH using an insulation degradation characteristic evaluation tester (product name SIR13, manufactured by Kusumoto Kasei Co., Ltd.), and each evaluation was performed according to the following criteria. A: 1.0E+10(1.0×10 10 )Ω or more B:5.0E+9(5.0×10 9 )Ω or more C:5.0E+9(5.0×10 9 ) Less than Ω

[0143] The results showed that Comparative Example 1, which did not use the thermosetting alkali-soluble resin (A1) in this embodiment, and Comparative Example 3, which did not use the (meth)acrylic monomer (B1) but used the (meth)acrylic monomer (B2), exhibited high migration resistance, but the through-holes were not penetrated. In addition, Comparative Example 2, which did not use the silane compound (C), exhibited penetrated through-holes, but the migration resistance was low. In contrast, the example using the curable composition of this embodiment showed through-holes and high migration resistance. Therefore, it can be seen that the curable composition of the example achieves both high patterning accuracy and high migration resistance. [Explanation of symbols]

[0144] 10: Glass substrate, X12: Jumper section, Y12: Connection section, 14: Insulating film, 16: Insulating protective layer, X1~X3, Y1~Y4: ITO electrodes, X34: Connection section, K1, K5: ITO film / insulating film interface, K2: ITO film / protective film interface, K3, K4: Glass substrate / ITO film interface

[0145] The disclosure of Japanese Patent Application No. 2022-106885, filed on 1 July 2022, is incorporated herein by reference in its entirety. Furthermore, all documents, patent applications, and technical standards described in this specification are incorporated by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually noted to be incorporated by reference.

Claims

1. A thermosetting alkali-soluble resin (A1) with an acid value of 55-100 mgKOH / g, A photocurable alkali-soluble resin (A2) with an acid value of 20-100 mg KOH / g, A (meth)acrylic monomer (B1) having two polymerizable functional groups and a ring structure contained between the two polymerizable functional groups, A silane compound (C) represented by the following formula (1) or (2), The total amount of the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) is 30 to 80% by mass relative to the total solid content in the composition. The mass ratio [A:B] of the total amount [A] of the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) to the total amount [B] of the polyfunctional (meth)acrylic monomer (B) containing the (meth)acrylic monomer (B1) is 100:40 to 80. The amount of silane compound (C) in the composition is 1 to 40 parts by mass per 100 parts by mass of the total amount of the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2). A curable resin composition containing [the specified ingredient]. 【Chemistry 1】 (In the formula, R 1 ~R 3 These may be the same or different, and all or at least one of them are alkoxy groups having 1 to 5 carbon atoms, while the others are alkyl groups having 1 to 5 carbon atoms. 4 ~R 6 A is a C1-C5 alkoxy group or a C1-C5 alkyl group, which may be the same or different. B is a substituted or unsubstituted C2-C18 linear or branched alkylene group, which may contain a divalent or trivalent linking group. X is a substituted or unsubstituted C2-C15 linear or branched alkylene group, which may contain a divalent linking group. X is O, NH, NH-CO-NH, or S. p is an integer from 0 to 1. q is an integer from 1 to 3. r is an integer from 1 to 3. s is an integer from 1 to 3. t is an integer from 1 to 3.

2. The curable resin composition according to claim 1, wherein the thermosetting alkali-soluble resin (A1) has an acid group and a cyclic ether group.

3. The curable resin composition according to claim 1, wherein the thermosetting alkali-soluble resin (A1) comprises at least the following units (a1-1) and (a1-2). 【Chemistry 2】 (In formula (a1-1), R 1 X represents a hydrogen atom or a methyl group; 1 R represents a linear or cyclic aliphatic hydrocarbon group having 1 to 15 carbon atoms, which may contain a single bond or an oxygen atom. In formula (a1-2), R 1 R represents a hydrogen atom or a methyl group; 3 This represents a linear or branched aliphatic hydrocarbon group having 3 to 15 carbon atoms, which has a cyclic ether structure and may contain an oxygen atom.

4. The curable resin composition according to claim 3, wherein the thermosetting alkali-soluble resin (A1) further comprises the following units (a1-3). 【Transformation 3】 (In the formula, R 1 represents a hydrogen atom or a methyl group; R 4 represents at least one selected from a linear, branched or cyclic aliphatic hydrocarbon group having 1 to 20 carbon atoms which may contain an oxygen atom, an aromatic group, and combinations thereof.)

5. The curable resin composition according to claim 1, wherein at least one of the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) has a cyclic group.

6. The curable resin composition according to claim 1, wherein the weight-average molecular weight of at least one of the thermosetting alkali-soluble resin (A1) and the photocurable alkali-soluble resin (A2) is 30,000 or less.

7. The curable resin composition according to claim 1, wherein the photocurable alkali-soluble resin (A2) comprises at least the following units (a2-1) and (a2-2). 【Chemistry 4】 (In unit (a2-1), R1 independently represents either a hydrogen atom or a methyl group; R 5 This represents a chain, branched, or cyclic aliphatic hydrocarbon group having 2 to 15 carbon atoms, which may contain heteroatoms. In the unit (a2-2), R 1 X represents a hydrogen atom or a methyl group; 1 (This represents a single bond, or a linear or cyclic aliphatic hydrocarbon group having 1 to 15 carbon atoms, which may contain an oxygen atom.)

8. The curable resin composition according to claim 7, wherein the photocurable alkali-soluble resin (A2) further comprises the following units (a2-3). 【Transformation 5】 (In the formula, R 1 R represents a hydrogen atom or a methyl group; 4 This refers to at least one selected from a linear, branched, or cyclic aliphatic hydrocarbon group, aromatic group, or combination thereof, having 1 to 20 carbon atoms, which may contain an oxygen atom.

9. The curable resin composition according to claim 1, wherein the ring structure of the (meth)acrylic monomer (B1) comprises one selected from the group comprising an aliphatic hydrocarbon group having 6 to 26 carbon atoms that may contain an oxygen atom, an aromatic hydrocarbon having 6 to 26 carbon atoms that may contain an oxygen atom, and a combination thereof.

10. A curable resin composition according to any one of claims 1 to 9, used for insulating film formation applications.

11. An insulating cured film obtained by curing a curable resin composition according to any one of claims 1 to 9.

12. An insulating cured film for a touch panel obtained by curing a curable resin composition according to any one of claims 1 to 9.

13. A touch panel comprising an insulating cured film for touch panels as described in claim 12.

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