Surface protective film

Abstract

To provide a surface protective film having good inspectability, hardly causing adhesive deposits at processing and excellent in anti-static properties.SOLUTION: The surface protective film includes a substrate layer, an anti-static layer and an adhesive layer in this order. The anti-static layer and the adhesive layer are directly laminated. An adhesive agent composing the adhesive layer is formed of an adhesive composition. The adhesive composition contains a silicone adhesive and an ionic compound.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This invention relates to a surface protective film. [Background technology]

[0002] In the manufacturing process of optical and electronic components, a surface protection film is generally applied to the optical or electronic component to prevent damage to its surface during processing, assembly, inspection, and transportation. Such a surface protection film is removed from the optical or electronic component when surface protection is no longer necessary (Patent Document 1).

[0003] As mentioned above, surface protective films must have good inspectability, especially when used in the manufacturing process of optical or electronic components.

[0004] On the other hand, surface protective films, optical components, and electronic components typically have high electrical insulation properties and generate static electricity through friction and peeling. Therefore, static electricity is easily generated when peeling surface protective films from optical components or electronic components. In such cases, if a voltage is applied to a liquid crystal while static electricity remains, there is a concern that the orientation of liquid crystal molecules may be lost or defects may occur in the liquid crystal panel. Furthermore, the presence of static electricity can also attract dust and reduce work efficiency.

[0005] To prevent static electricity, surface protective films are often treated with antistatic agents. For example, it has been reported that antistatic functionality can be provided by forming an antistatic layer or applying an antistatic coating to the surface layer (top coat layer, back layer) of a surface protective film (Patent Documents 2 and 3).

[0006] Furthermore, in order to impart antistatic properties to the adhesive layer constituting the surface protective film, a method has been employed in which an ionic compound, such as an alkali metal salt or ionic liquid that functions as an antistatic agent, is incorporated into the adhesive layer and transferred to the adherend (Patent Documents 4 and 5).

[0007] However, the surface protection films described in the above-mentioned Patent Documents 2 to 4 have the problem of generating adhesive residue during processing.

[0008] Furthermore, in Patent Documents 5-7, the surface resistance value of the adhesive layer is 10 11 The impedance is in the latter half of the Ω order, which means it doesn't exhibit sufficient antistatic properties. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Japanese Patent Publication No. 2016-17109 [Patent Document 2] Japanese Patent Publication No. 2004-223923 [Patent Document 3] Japanese Patent Publication No. 2008-255332 [Patent Document 4] Japanese Patent Application Publication No. 9-165460 [Patent Document 5] Japanese Patent Publication No. 2018-172610 [Patent Document 6] Japanese Patent Publication No. 2018-172611 [Patent Document 7] Japanese Patent Publication No. 2020-002203 [Overview of the Initiative] [Problems that the invention aims to solve]

[0010] The objective of this invention is to provide a surface protective film that has good inspectability, generates little adhesive residue during processing, and has excellent antistatic properties. [Means for solving the problem]

[0011] The surface protective film according to an embodiment of the present invention is A surface protective film comprising a base layer, an antistatic layer, and an adhesive layer in this order, The antistatic layer and the adhesive layer are directly laminated together. The adhesive that constitutes the adhesive layer is formed from an adhesive composition. The adhesive composition contains a silicone adhesive and an ionic compound.

[0012] In one embodiment, the silicone adhesive is an addition reaction curable silicone adhesive.

[0013] In one embodiment, the content ratio of the ionic compound in the adhesive composition is 0.005 wt% to 10.0 wt%.

[0014] In one embodiment, the ionic compound contains an ammonium cation.

[0015] In one embodiment, the ionic compound has a reactive carbon-carbon double bond.

[0016] The optical member according to an embodiment of the present invention is one to which the surface protection film is attached.

[0017] The electronic member according to an embodiment of the present invention is one to which the surface protection film is attached.

Advantages of the Invention

[0018] According to the present invention, it is possible to provide a surface protection film that has good inspectability, is less likely to generate adhesive residue during processing, and has excellent antistatic properties.

Brief Description of the Drawings

[0019] [Figure 1] It is a schematic cross-sectional view of a surface protection film according to one embodiment of the present invention.

Modes for Carrying Out the Invention

[0020] In this specification, the expression "(meth)acrylic" means "acrylic and / or methacrylic," the expression "(meth)acrylate" means "acrylate and / or methacrylate," the expression "(meth)allyl" means "allyl and / or methallyl," and the expression "(meth)acrolein" means "acrolein and / or methcrolein." In this specification, the expression "acid (salt)" means "acid and / or its salt." Examples of salts include alkali metal salts and alkaline earth metal salts, specifically, sodium salts and potassium salts.

[0021] A. Surface protective film A surface protection film according to an embodiment of the present invention includes a base layer, an antistatic layer, and an adhesive layer in this order. A surface protection film according to an embodiment of the present invention is formed by directly laminating the antistatic layer and the adhesive layer. Therefore, a surface protection film according to an embodiment of the present invention includes a laminated structure of an antistatic layer and an adhesive layer, and the base layer is included on the side of the laminated structure opposite to the side of the antistatic layer where the adhesive layer is located.

[0022] The surface protective film according to the embodiment of the present invention may include any other suitable layer, as long as it includes a base layer, an antistatic layer, and an adhesive layer, and does not impair the effects of the present invention. Such other layers may be one layer or two or more layers.

[0023] Figure 1 is a schematic cross-sectional view of a surface protection film according to one embodiment of the present invention. In Figure 1, the surface protection film 100 comprises a base layer 10, an antistatic layer 20, and an adhesive layer 30. In the embodiment shown in Figure 1, the base layer 10 and the antistatic layer 20 are directly laminated, and the antistatic layer 20 and the adhesive layer 30 are directly laminated.

[0024] In Figure 1, the surface of the adhesive layer 30 opposite to the side where the antistatic layer 20 is located may be provided with an appropriate release liner (sometimes called a release sheet or separator) for protection until use (not shown). Examples of release liners include release liners in which the surface of a substrate (liner substrate) such as paper or plastic film is treated with silicone, and release liners in which the surface of a substrate (liner substrate) such as paper or plastic film is laminated with a polyolefin resin.

[0025] Examples of plastic films used as liner substrates include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, and ethylene-vinyl acetate copolymer film.

[0026] The thickness of the release liner is preferably 1 μm to 500 μm, more preferably 3 μm to 450 μm, even more preferably 5 μm to 400 μm, and particularly preferably 10 μm to 300 μm.

[0027] The thickness of the surface protective film according to the embodiments of the present invention can be any appropriate thickness as long as it does not impair the effects of the present invention. In terms of being able to better express the effects of the present invention, the thickness of the surface protective film according to the embodiments of the present invention is preferably 5 μm to 500 μm, more preferably 10 μm to 450 μm, even more preferably 15 μm to 400 μm, and particularly preferably 20 μm to 300 μm.

[0028] The surface protection film according to an embodiment of the present invention has an adhesive layer that is bonded to a glass plate, left at a temperature of 23°C for 30 minutes, and then peeled off at a temperature of 23°C at a peeling angle of 180 degrees and a peeling speed of 300 mm / min. The peeling force is preferably 0.005 N / 25 mm to 0.1 N / 25 mm, more preferably 0.007 N / 25 mm to 0.08 N / 25 mm, even more preferably 0.01 N / 25 mm to 0.05 N / 25 mm, particularly preferably 0.01 N / 25 mm to 0.03 N / 25 mm, and most preferably 0.01 N / 25 mm to 0.025 N / 25 mm. If the peeling force is within the above range, the surface protective film according to the embodiment of the present invention is difficult to peel off from the adherend, and typically, during the manufacturing process of optical components and electronic components, it is difficult for the film to peel off after being applied to the exposed surface of the optical component or electronic component, and if peeling becomes necessary, it can be easily removed.

[0029] The surface protection film according to the embodiment of the present invention preferably has a surface resistance value of 5.0 × 10 on the surface of the adhesive layer. 11 It is less than or equal to Ω, and more preferably 3.0 × 10⁻⁶. 11 It is less than or equal to Ω, and more preferably 1.0 × 10⁻⁶. 11 It is less than or equal to Ω, and particularly preferably 8.0 × 10⁻⁶. 10 It is less than or equal to Ω, and most preferably 6.0 × 10⁻⁶. 10 It is less than or equal to Ω. If the above surface resistance value is within the above range, the surface protective film according to the embodiment of the present invention can be sufficiently excellent in antistatic properties. From the viewpoint of antistatic properties, the lower the lower limit of the above surface resistance value, the better, but in reality, it is preferably 1.0 × 10 8 It is greater than or equal to Ω.

[0030] The surface protection film according to the embodiment of the present invention has a haze of preferably 30% or less, more preferably 20% or less, even more preferably 10% or less, particularly preferably 7% or less, and most preferably 5% or less. If the haze is within the above range, the surface protection film according to the embodiment of the present invention may have good inspectability.

[0031] The surface protective film according to the embodiment of the present invention can be manufactured by any suitable method. Such a manufacturing method is, for example, (1) A method of applying a solution or hot melt of the adhesive layer forming material onto the antistatic layer. (2) A method of transferring the adhesive layer formed by applying a solution or hot melt of the adhesive layer forming material onto a separator onto the antistatic layer. (3) A method of forming and coating an adhesive layer by extruding the adhesive layer forming material onto an antistatic layer. This can be done in accordance with any suitable manufacturing method, such as those mentioned above.

[0032] As for the coating method, various conventionally known methods can be appropriately employed, such as the roll coating method, gravure coating method, reverse coating method, kiss coating method, dip roll coating method, bar coating method, roll brush method, spray coating method, knife coating method, air knife coating method, spray coating method, comma coating method, direct coating method, and coating method using a die coater.

[0033] ≪A-1. Adhesive Layer≫ The adhesive layer is composed of an adhesive. The adhesive is formed from an adhesive composition. That is, the adhesive formed from the adhesive composition forms a layered structure, thus creating the adhesive layer.

[0034] Adhesives can be defined as those formed from an adhesive composition. This is because adhesives become adhesives when an adhesive composition undergoes a crosslinking reaction due to heating or ultraviolet irradiation, and therefore it is impossible and impractical to directly identify an adhesive by its structure. Thus, the definition "formed from an adhesive composition" appropriately identifies the adhesive as a "thing."

[0035] The adhesive layer can be formed by any suitable method. Such methods include, for example, a direct method in which the adhesive composition is directly applied to any suitable base film (e.g., a laminate of a base layer and an antistatic layer in a surface protection film according to an embodiment of the present invention) and dried or cured, and a transfer method in which the adhesive layer formed on the surface by applying the adhesive composition to the surface (release surface) of the release liner and drying or curing it is bonded to the base film (e.g., a laminate of a base layer and an antistatic layer in a surface protection film according to an embodiment of the present invention) to transfer the adhesive layer. From the viewpoint of anchoring properties of the adhesive layer, the direct method is generally preferred. As for methods of applying (typically coating) such an adhesive layer, various conventionally known methods can be appropriately adopted, such as the roll coating method, gravure coating method, reverse coating method, kiss coating method, dip roll coating method, bar coating method, roll brushing method, spray coating method, knife coating method, air knife coating method, spray coating method, comma coating method, direct coating method, and coating method using a die coater. The adhesive composition can be dried under heating as needed (for example, by heating to about 60°C to 150°C). Ultraviolet light, laser rays, alpha rays, beta rays, gamma rays, X-rays, electron beams, etc., can be used as appropriate means to cure the adhesive composition.

[0036] The thickness of the adhesive layer is preferably 0.5 μm to 200 μm, more preferably 1 μm to 150 μm, even more preferably 2 μm to 100 μm, particularly preferably 3 μm to 90 μm, especially preferably 5 μm to 80 μm, and most preferably 10 μm to 80 μm, in order to better exhibit the effects of the present invention.

[0037] The adhesive composition contains a silicone adhesive and an ionic compound.

[0038] The surface protection film according to the embodiment of the present invention can exhibit the effects of the present invention by having an adhesive composition containing both a silicone adhesive and an ionic compound. In particular, the effects of the present invention can be significantly exhibited by including (using in combination) both the silicone adhesive according to the preferred embodiment described later and the ionic compound according to the preferred embodiment described later. This is presumed to be because the coexistence of the silicone adhesive and the ionic compound in the adhesive composition allows for some kind of mutual adoption between the two, resulting in the surface protection film according to the embodiment of the present invention exhibiting excellent inspectability, excellent antistatic properties, and reduced adhesive residue during processing.

[0039] The content of silicone adhesive in the adhesive composition is preferably 60% to 99.9% by weight, more preferably 65% ​​to 99.9% by weight, even more preferably 70% to 99.9% by weight, particularly preferably 75% to 99.9% by weight, and most preferably 80% to 99.9% by weight, based on solid content. The effects of the present invention can be more fully expressed when the content of silicone adhesive in the adhesive composition is within the above range based on solid content.

[0040] The content ratio of the ionic compound to 100 parts by weight of silicone adhesive in the adhesive composition is preferably 0.005 parts by weight to 10.0 parts by weight, more preferably 0.005 parts by weight to 5.0 parts by weight, even more preferably 0.005 parts by weight to 3.0% by weight, particularly preferably 0.01 parts by weight to 2.0 parts by weight, and most preferably 0.01 parts by weight to 1.0 part by weight. The effects of the present invention can be better realized if the content ratio of the ionic compound to 100 parts by weight of silicone adhesive in the adhesive composition is within the above range. If the content ratio of the ionic compound to 100 parts by weight of silicone adhesive in the adhesive composition is too large and outside the above range, the inspectability of the surface protective film according to the embodiment of the present invention may decrease. If the content ratio of the ionic compound to 100 parts by weight of silicone adhesive in the adhesive composition is too small and outside the above range, the antistatic properties may decrease.

[0041] The content ratio of the ionic compound in the entire adhesive composition is preferably 0.005% by weight to 10.0% by weight, more preferably 0.005% by weight to 5.0% by weight, still more preferably 0.005% by weight to 3.0% by weight, particularly preferably 0.009% by weight to 2.0% by weight, and most preferably 0.009% by weight to 1.0% by weight. If the content ratio of the ionic compound in the entire adhesive composition is within the above range, the effects of the present invention can be more manifested. If the content ratio of the ionic compound in the entire adhesive composition is too large outside the above range, the inspection property of the surface protection film according to the embodiment of the present invention may decrease. If the content ratio of the ionic compound in the entire adhesive composition is too small outside the above range, the antistatic property may decrease.

[0042] <A-1-1. Silicone Adhesive> As the silicone adhesive, any appropriate silicone adhesive can be adopted as long as the effects of the present invention are not impaired. The silicone adhesive may be only one kind or two or more kinds.

[0043] The silicone adhesive contains a silicone-based resin as a main component. The content ratio of the silicone-based resin in the silicone adhesive is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, still more preferably 90% by weight to 100% by weight, particularly preferably 95% by weight to 100% by weight, and most preferably substantially 100% by weight. Here, "substantially" means not including intentionally added components, and means excluding accidentally mixed or by-produced impurities, etc.

[0044] The weight average molecular weight of the silicone-based resin can adopt any appropriate weight average molecular weight as long as the effects of the present invention are not impaired.

[0045] Examples of the silicone resin include silicone resins having a polysiloxane skeleton. Examples of the silicone resin include addition reaction-curable silicone resins, condensation reaction-curable silicone resins, peroxide-crosslinkable silicone resins, ultraviolet curable silicone resins, electron beam curable silicone resins, and the like. In terms of more effectively expressing the effects of the present invention, the addition reaction-curable silicone resin is preferred as the silicone resin.

[0046] Examples of the addition reaction-curable silicone resin include organopolysiloxanes having two or more alkenyl groups having 2 to 10 carbon atoms such as vinyl group, allyl group, propenyl group, and hexenyl group at the terminal and / or side chain of the molecule.

[0047] As the addition reaction-curable silicone resin, any suitable addition reaction-curable silicone resin can be adopted as long as the effects of the present invention are not impaired. In terms of more effectively expressing the effects of the present invention, preferably, the addition reaction-curable silicone resin includes phenyl group-containing organopolysiloxane. Examples of the phenyl group-containing organopolysiloxane include polyalkylphenylsiloxanes such as polymethylphenylsiloxane and polyethylphenylsiloxane.

[0048] Commercially available products can be adopted as the silicone adhesive. Examples of such an addition reaction-curable silicone adhesive containing an addition reaction-curable silicone resin include products with trade names "KR-3704(X-40-3229)" (manufactured by Shin-Etsu Chemical Co., Ltd.), "X-40-3323)" (manufactured by Shin-Etsu Chemical Co., Ltd.), "X-40-3270-1)" (manufactured by Shin-Etsu Chemical Co., Ltd.), and "X-40-3306)" (manufactured by Shin-Etsu Chemical Co., Ltd.).

[0049] <A-1-2. Crosslinking Agent> The adhesive composition may contain a crosslinking agent. When the adhesive composition employs an addition reaction-curable silicone adhesive as the silicone adhesive, it is preferable to contain a crosslinking agent in terms of promoting the curing reaction. The crosslinking agent may be only one kind or two or more kinds.

[0050] As the crosslinking agent, any suitable crosslinking agent can be employed as long as the effects of the present invention are not impaired. In terms of more effectively expressing the effects of the present invention, for example, an organohydrogenpolysiloxane containing two or more hydrosilanes (SiH) in one molecule can be employed as the crosslinking agent.

[0051] In an organohydrogenpolysiloxane containing two or more hydrosilanes (SiH) in one molecule, various organic groups other than hydrogen atoms may be bonded to the silicon atoms to which the hydrogen atoms are bonded. Examples of such organic groups include alkyl groups such as methyl group and ethyl group; aryl groups such as phenyl group; halogenated alkyl groups; and the like. Among these, from the viewpoints of synthesis and handling, an alkyl group is preferable, and a methyl group is more preferable. The skeletal structure of the organohydrogenpolysiloxane containing two or more hydrosilanes (SiH) in one molecule may be linear, branched or cyclic, but a linear structure is preferable.

[0052] Specific examples of the organohydrogenpolysiloxane containing two or more hydrosilanes (SiH) in one molecule include, for example, dimethylhydrogen siloxy group-terminated dimethylsiloxane-methylhydrogen siloxane copolymer, trimethylsiloxy group-terminated dimethylsiloxane-methylhydrogen siloxane copolymer, trimethylsiloxy group-terminated methylhydrogen polysiloxane, poly(hydrogensilsesquioxane), and the like.

[0053] [[ID=,16]]<A-1-3. Catalyst> The adhesive composition may contain a catalyst. When the adhesive composition employs an addition reaction-curable silicone resin as the silicone-based resin, it is preferable to contain a catalyst in terms of promoting the curing reaction. The crosslinking agent may be only one kind or two or more kinds.

[0054] As the catalyst, any suitable catalyst can be employed as long as it does not impair the effects of the present invention. In terms of further expressing the effects of the present invention, examples of the catalyst include particulate platinum, particulate platinum adsorbed on a carbon powder carrier, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin complexes of chloroplatinic acid, and white metal-based compounds such as palladium and rhodium.

[0055] <A-1-4. Ionic Compound> As the ionic compound, any suitable ionic compound can be employed as long as it does not impair the effects of the present invention. The ionic compound may be only one kind or two or more kinds.

[0056] As the ionic compound, in terms of further expressing the effects of the present invention, preferably, an ionic compound containing at least one selected from onium cations and metal cations and a fluoro organic anion, or an ionic group-containing silicone oligomer. More preferably, it is an ionic compound containing at least one selected from onium cations and metal cations and a fluoro organic anion in terms of making the appearance of the adhesive layer more excellent.

[0057] [[ID=1,8]]Preferably, the ionic compound has a reactive carbon-carbon double bond. Examples of the reactive carbon-carbon double bond include a vinyl group (CH2=CH-group) and an allyl group (CH2=CH-CH2-group).

[0058] The ionic compound may be an ionic liquid. The ionic liquid means a molten salt (ionic compound) that is liquid at 25°C. [[ID=!23]]

[0059] As the ionic group-containing silicone oligomer, any suitable ionic group-containing silicone oligomer can be used, as long as it does not impair the effects of the present invention. An example of an ionic group-containing silicone oligomer is "X-40-2450," a product manufactured by Shin-Etsu Chemical Co., Ltd.

[0060] As the onium cation, any suitable onium cation can be used as long as it does not impair the effects of the present invention. In terms of being able to better express the effects of the present invention, such an onium cation is preferably at least one selected from ammonium cation (nitrogen-containing onium cation), sulfonium cation (sulfur-containing onium cation), and phosphorus-containing onium cation (phosphonium cation), and more preferably an ammonium cation.

[0061] Any suitable metal cation can be used as the metal cation, as long as it does not impair the effects of the present invention. Preferably, such metal cations are alkali metal cations such as Li cations, Na cations, and K cations, as they can better express the effects of the present invention.

[0062] As the fluoroorganic anion, any suitable fluoroorganic anion can be used, as long as it does not impair the effects of the present invention. The fluoroorganic anion may be fully fluorinated (perfluorinated) or partially fluorinated.

[0063] Examples of such fluoroorganic anions include fluorinated aryl sulfonates, perfluoroalkanesulfonates, bis(fluorosulfonyl)imides, bis(perfluoroalkanesulfonyl)imides, cyanoperfluoroalkanesulfonylamides, bis(cyano)perfluoroalkanesulfonylmethides, cyano-bis-(perfluoroalkanesulfonyl)methides, tris(perfluoroalkanesulfonyl)methides, trifluoroacetates, perfluoroalkylates, tris(perfluoroalkanesulfonyl)methides, and (perfluoroalkanesulfonyl)trifluoroacetamide.

[0064] Among these fluoroorganic anions, perfluoroalkyl sulfonates, bis(fluorosulfonyl)imides, and bis(perfluoroalkanesulfonyl)imides are preferred in terms of being able to better express the effects of the present invention, and more specifically, for example, trifluoromethanesulfonate, pentafluoroethanesulfonate, heptafluoropropanesulfonate, nonafluorobutanesulfonate, bis(fluorosulfonyl)imides, and bis(trifluoromethanesulfonyl)imides, and preferably bis(fluorosulfonyl)imides and bis(trifluoromethanesulfonyl)imides.

[0065] The ionic compound is more preferably an ionic compound composed of an onium cation and a fluoroorganic anion, as this allows for a more pronounced effect of the present invention.

[0066] The onium cation preferably has at least one structure selected from those represented by general formulas (1) to (4). [ka]

[0067] In general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbon atoms, which may contain heteroatoms, and Rb and Rc, identical or different, represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, which may also contain heteroatoms. However, if the nitrogen atom contains a double bond, Rc is absent.

[0068] In general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms and may contain heteroatoms, and Re, Rf, and Rg, identical or different, represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms and may contain heteroatoms.

[0069] In general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbon atoms and may contain heteroatoms, and Ri, Rj, and Rk, identical or different, represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms and may contain heteroatoms.

[0070] In general formula (4), Z represents a nitrogen atom, a sulfur atom, or a phosphorus atom, and Rl, Rm, Rn, and Ro represent the same or different hydrocarbon groups having 1 to 20 carbon atoms, and may include heteroatoms. However, if Z is a sulfur atom, Ro is absent.

[0071] Examples of cation structures represented by general formula (1) include pyridinium cation structures, pyrrolidinium cation structures, piperidinium cation structures, cation structures having a pyrroline skeleton, and cation structures having a pyrrole skeleton.

[0072] Specific examples of cations represented by general formula (1) include pyridinium cations such as 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-butyl-3,4-dimethylpyridinium cation, and 1,1-dimethylpyrrolidinium cation; 1-E 1-methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation Pyrrolidinium cations such as dinium cation, 1,1-dipropylpyrrolidinium cation, 1-propyl-1-butylpyrrolidinium cation, 1,1-dibutylpyrrolidinium cation; 1-propylpiperidinium cation, 1-pentylpiperidinium cation, 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1- Piperidinium cations such as heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, 1-propyl-1-butylpiperidinium cation, 1,1-dimethylpiperidinium cation, 1,1-dipropylpiperidinium cation, 1,1-dibutylpiperidinium cation, etc.; 2-methyl-1-pyrroline cation;Examples include 1-ethyl-2-phenylindole cation; 1,2-dimethylindole cation; 1-ethylcarbazole cation; and cations having at least one of these cations selected from vinyl groups (CH2=CH- groups) and allyl groups (CH2=CH-CH2- groups).

[0073] Among these, pyridinium cations such as 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, etc., which can further express the effects of the present invention; 1-ethyl-1-methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethylpyrrolidinium cation, 1-ethylpyrrolidinium cation, 1-ethylpyrrolidinium cation Pyrrolidinium cations such as 1-1-hexylpyrrolidinium cation and 1-ethyl-1-heptylpyrrolidinium cation; piperidinium cations such as 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, and 1-propyl-1-butylpiperidinium cation; cations having at least one of these cations selected from vinyl groups (CH2=CH- groups) and allyl groups (CH2=CH-CH2- groups);Examples include, and more preferably, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-propylpiperidinium cation, and cations having at least one of these cations selected from vinyl groups (CH2=CH- groups) and allyl groups (CH2=CH-CH2- groups).

[0074] Examples of cation structures represented by general formula (2) include the imidazolium cation structure, the tetrahydropyrimidinium cation structure, and the dihydropyrimidinium cation structure.

[0075] Specific examples of cations represented by general formula (2) include, for example, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, and 1-dodecyl-3-methylimidazolium cation. Imidazolium cations such as cations, 1-tetradecyl-3-methylimidazolium cation, 1,2-dimethyl-3-propylimidazolium cation, 1-ethyl-2,3-dimethylimidazolium cation, 1-butyl-2,3-dimethylimidazolium cation, 1-hexyl-2,3-dimethylimidazolium cation, etc.; 1,3-dimethyl-1,4,5,6-tetrahydropyrimidinium cation, 1,2,3-trimethyl-1,4,5,6 Examples include tetrahydropyrimidinium cations such as -tetrahydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation, and 1,2,3,5-tetramethyl-1,4,5,6-tetrahydropyrimidinium cation; dihydropyrimidinium cations such as 1,3-dimethyl-1,4-dihydropyrimidinium cation, 1,3-dimethyl-1,6-dihydropyrimidinium cation, 1,2,3-trimethyl-1,4-dihydropyrimidinium cation, 1,2,3-trimethyl-1,6-dihydropyrimidinium cation, 1,2,3,4-tetramethyl-1,4-dihydropyrimidinium cation, and 1,2,3,4-tetramethyl-1,6-dihydropyrimidinium cation; and cations having at least one of the vinyl group (CH2=CH- group) and allyl group (CH2=CH-CH2- group).

[0076] Among these, the following are preferred in that the effects of the present invention can be expressed even more strongly: 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation, 1-tetradecyl-3-methylimidazolium cation, and these cations further contain vinyl groups (CH2=CH- groups) and ali groups. The imidazolium cation is an imidazolium cation having at least one selected from a vinyl group (CH2=CH-CH2- group), more preferably a 1-ethyl-3-methylimidazolium cation, a 1-hexyl-3-methylimidazolium cation, and these cations further have at least one selected from a vinyl group (CH2=CH- group) and an allyl group (CH2=CH-CH2- group), even more preferably a 1-allyl-3-methylimidazolium cation, a 1-ethyl-3-vinylimidazolium cation, and particularly preferably a 1-allyl-3-methylimidazolium cation.

[0077] Examples of cation structures represented by general formula (3) include pyrazolium cation structures and pyrazolinium cation structures.

[0078] Specific examples of cations represented by general formula (3) include, for example, pyrazolium cations such as 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methylpyrazolinium cation, 1-ethyl-2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, and 1-butyl-2,3,5-trimethylpyrazolium cation; pyrazolinium cations such as 1-ethyl-2,3,5-trimethylpyrazolinium cation, 1-propyl-2,3,5-trimethylpyrazolinium cation, and 1-butyl-2,3,5-trimethylpyrazolinium cation; and cations in which these cations further have at least one selected from vinyl groups (CH2=CH- groups) and allyl groups (CH2=CH-CH2- groups).

[0079] Examples of cation structures represented by general formula (4) include tetraalkylammonium cation structures, trialkylsulfonium cation structures, tetraalkylphosphonium cation structures, and structures in which some of the alkyl groups are substituted with alkenyl groups, alkoxyl groups, or epoxy groups.

[0080] Specific examples of cations represented by general formula (4) include, for example, tetramethylammonium cation, tetraethylammonium cation, tetrabutylammonium cation, tetrapentylammonium cation, tetrahexylammonium cation, tetraheptylammonium cation, triethylmethylammonium cation, tributylethylammonium cation, trimethylpropylammonium cation, trimethyldecylammonium cation, N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, glycidyltrimethylammonium cation, diallyldimethylammonium cation, N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-N-butylammonium cation, N,N-dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl-N-ethyl-N-heptylammonium cation, N,N-dimethyl- N,N-dipropylammonium cation, N,N-diethyl-N-propyl-N-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, N,N-dimethyl-N-propyl-N-hexylammonium cation, N,N-dimethyl-N-propyl-N-heptylammonium cation, N,N-dimethyl-N-butyl-N-hexylammonium cation, N,N-diethyl-N-butyl-N-heptylammonium cation, N,N-dimethyl-N-pentyl-N-hexylammonium cation Thione, N,N-dimethyl-N,N-dihexylammonium cation, trimethylheptylammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N-methyl-N-pentylammonium cation, N,N-diethyl-N-methyl-N-heptylammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation, triethylpentylammonium cation, triethylheptylammonium cation, N,Tetraalkylammonium cations such as N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methyl-N-pentylammonium cation, N,N-dipropyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N-dibutyl-N-methyl-N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N-ethyl-N-propyl-N-pentylammonium cation; trimethylsulfonium cation, triethylsulfonium cation, tributylsulfonium cation, trihexylsulfonium cation, etc.; trimethylsulfonium cation, triethylsulfonium cation, tributylsulfonium cation, trihexylsulfonium cation, etc. Examples include trialkylsulfonium cations such as phonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, and dimethyldecylsulfonium cation; tetraalkylphosphonium cations such as tetramethylphosphonium cation, tetraethylphosphonium cation, tetrabutylphosphonium cation, tetrahexylphosphonium cation, tetraoctylphosphonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation, and trimethyldecylphosphonium cation; and cations having at least one of these cations selected from vinyl groups (CH2=CH- groups) and allyl groups (CH2=CH-CH2- groups).

[0081] The ionic compound is preferably an ionic compound containing at least one selected from the above-mentioned onium cation and metal cation and the above-mentioned fluoroorganic anion, or an ionic group-containing silicone oligomer, more preferably an ionic compound containing at least one selected from the above-mentioned onium cation and metal cation and the above-mentioned fluoroorganic anion, and even more preferably an ionic compound containing the above-mentioned onium cation and the above-mentioned fluoroorganic anion. Furthermore, those having a reactive carbon-carbon double bond (e.g., a vinyl group (CH2=CH- group), an allyl group (CH2=CH-CH2- group), etc.) are particularly preferred. Moreover, the ionic compound most preferably has an allyl group (CH2=CH-CH2- group). When the ionic compound has an allyl group, the surface resistance value of the adhesive layer can be reduced compared to when the ionic compound has a vinyl group.

[0082] In order to better express the effects of the present invention, the ionic compounds are preferably, specifically, 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, and 1-butyl-3-methylpyridinium trifluoromethanesulfonate. Lupyridinium bis(trifluoromethanesulfonyl)imide, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpiperidinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylimidazolium trifluoromethanesulfone 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-hexyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-allyl-3-methylimidazolium trifluoromethanesulfonate, 1-allyl-3-methylimidazolium heptafluoropropanesulfonate, 1-allyl-3-methylimidazolium bis(trifluoro These are romethanesulfonyl)imide, 1-allyl-3-methylimidazolium bis(fluorosulfonyl)imide, methyltrioctylammonium bis(trifluoromethanesulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium bis(fluorosulfonyl)imide, 1-ethyl-3-vinylimidazolium bis(trifluoromethanesulfonyl)imide, and 1-ethyl-3-vinylimidazolium bis(fluorosulfonyl)imide.More preferably, they are 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-allyl-3-methyl-imidazolium bis(trifluoromethanesulfonyl)imide, methyltrioctylammonium bis(trifluoromethanesulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-vinylimidazolium bis(trifluoromethanesulfonyl)imide, and particularly preferably, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-allyl-3-methyl-imidazolium bis(trifluoromethanesulfonyl)imide, methyltrioctylammonium bis(trifluoromethanesulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-vinylimidazolium bis(trifluoromethanesulfonyl)imide, and most preferably, 1-allyl-3-methyl-imidazolium bis(trifluoromethanesulfonyl)imide.,

[0083] Commercially available ionic compounds may be used, or those synthesized by any suitable method may be used. For example, ionic liquids may be synthesized by a halide method, a hydroxide method, an acid ester method, a complex formation method, a neutralization method, etc., as described in "Ionic Liquids - The Cutting Edge and Future of Development -" (published by CMC Publishing).

[0084] <A-1-5. Other Components> The adhesive composition may contain any other suitable components as long as they do not impair the effects of the present invention. Examples of such other components include other resin components, crosslinking accelerators, silane coupling agents, silicone-based additives such as modified silicone oils, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foils, ultraviolet absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, conductive agents, stabilizers, surface lubricants, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, and the like.

[0085] ≪A-2. Base material layer≫ The base layer may be a single layer or two or more layers. The base layer may also be stretched.

[0086] The thickness of the substrate layer is preferably 4 μm to 450 μm, more preferably 8 μm to 400 μm, even more preferably 12 μm to 350 μm, and particularly preferably 16 μm to 250 μm.

[0087] For surfaces of the base layer that do not have an adhesive layer, a release treatment can be performed by adding fatty acid amides, polyethyleneimines, long-chain alkyl additives, etc. to the base layer for purposes such as forming a winding body that is easy to unwind, or a coating layer made of any suitable release agent such as silicone-based, long-chain alkyl-based, or fluorine-based agents can be provided.

[0088] Any suitable material can be used for the base layer depending on the application. Examples include plastics, paper, metal films, and nonwoven fabrics. Preferably, it is plastic. That is, the base layer is preferably a plastic film. The base layer may be composed of one type of material or two or more types of materials. For example, it may be composed of two or more types of plastics.

[0089] Examples of the above-mentioned plastics include polyester resins, polyamide resins, and polyolefin resins. Examples of polyester resins include polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Examples of polyolefin resins include homopolymers of olefin monomers and copolymers of olefin monomers. Specifically, examples of polyolefin resins include homopolypropylene; propylene copolymers such as block, random, and graft types with ethylene as the copolymer component; reactor TPO; ethylene polymers such as low-density, high-density, linear low-density, and ultra-low-density polymers; ethylene copolymers such as ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-methacrylic acid copolymer, and ethylene-methyl methacrylate copolymer.

[0090] The base layer may contain any suitable additives as needed. Examples of additives that can be contained in the base layer include antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, fillers, and pigments. The type, number, and amount of additives that can be contained in the base layer can be appropriately set according to the purpose. In particular, when the material of the base layer is plastic, it is preferable to contain some of the above additives for the purpose of preventing deterioration, etc. From the viewpoint of improving weather resistance, antioxidants, ultraviolet absorbers, light stabilizers, and fillers are particularly preferred as additives.

[0091] Any suitable antioxidant can be used. Examples of such antioxidants include phenolic antioxidants, phosphorus-based heat stabilizers, lactone-based heat stabilizers, sulfur-based heat stabilizers, and phenol-phosphorus antioxidants. The antioxidant content is preferably 1% by weight or less, more preferably 0.5% by weight or less, and even more preferably 0.01% to 0.2% by weight, relative to the base resin of the substrate layer (if the substrate layer is a blend, the blend is the base resin).

[0092] Any suitable UV absorber can be used as the UV absorber. Examples of such UV absorbers include benzotriazole-based UV absorbers, triazine-based UV absorbers, and benzophenone-based UV absorbers. The content of the UV absorber is preferably 2% by weight or less, more preferably 1% by weight or less, and even more preferably 0.01% to 0.5% by weight, relative to the base resin forming the substrate layer (if the substrate layer is a blend, the blend is the base resin).

[0093] Any suitable light stabilizer can be used. Examples of such light stabilizers include hindered amine-based light stabilizers and benzoate-based light stabilizers. The content of the light stabilizer is preferably 2% by weight or less, more preferably 1% by weight or less, and even more preferably 0.01% to 0.5% by weight, relative to the base resin forming the substrate layer (if the substrate layer is a blend, the blend is the base resin).

[0094] Any suitable filler can be used as the filler. Examples of such fillers include inorganic fillers. Specifically, examples of inorganic fillers include carbon black, titanium dioxide, and zinc oxide. The content of the filler is preferably 20% by weight or less, more preferably 10% by weight or less, and even more preferably 0.01% to 10% by weight, relative to the base resin forming the substrate layer (if the substrate layer is a blend, the blend is the base resin).

[0095] Furthermore, as additives, inorganic, low-molecular-weight, and high-molecular-weight antistatic agents such as surfactants, inorganic salts, polyhydric alcohols, metal compounds, and carbon are also preferred for the purpose of imparting antistatic properties. In particular, high-molecular-weight antistatic agents and carbon are preferred from the viewpoint of preventing contamination and maintaining tackiness.

[0096] ≪A-3. Antistatic layer≫ The surface protection film according to an embodiment of the present invention includes a base material layer, an antistatic layer, and an adhesive layer in this order, and the antistatic layer and the adhesive layer are directly laminated. By including the antistatic layer in a mode where it is directly laminated with the adhesive layer, the effects of the present invention can be more effectively manifested.

[0097] As the thickness of the antistatic layer, any appropriate thickness can be adopted as long as the effects of the present invention are not impaired. In terms of more effectively manifesting the effects of the present invention, the thickness of the antistatic layer is preferably 3 nm to 500 nm, more preferably 3 nm to 100 nm, still more preferably 3 nm to 60 nm, and particularly preferably 8 nm to 55 nm. If the thickness of the antistatic layer is too small, it becomes difficult to form the antistatic layer uniformly (for example, the thickness variation depending on the location becomes large in the thickness of the antistatic layer), and thus, unevenness may easily occur in the appearance of the surface protection film. On the other hand, if the thickness of the antistatic layer is too large, it may affect the characteristics (for example, optical characteristics, dimensional stability, etc.) of the surface protection film according to the embodiment of the present invention. <A-3-1. Conductive Polymer>

[0098] As the antistatic layer, any appropriate antistatic layer can be adopted as long as the effects of the present invention are not impaired. In terms of more effectively manifesting the effects of the present invention, the antistatic layer preferably contains a conductive polymer, and more preferably contains a conductive polymer, a binder, and a crosslinking agent.

[0099] The conductive polymer may be only one kind or two or more kinds.

[0100] The ratio of conductive polymer to 100 parts by weight of binder in the antistatic layer is preferably 10 to 200 parts by weight, more preferably 25 to 150 parts by weight, and even more preferably 40 to 120 parts by weight, in order to better exhibit the effects of the present invention. If the ratio of conductive polymer to 100 parts by weight of binder in the antistatic layer is too small and outside the above range, the antistatic properties of the surface protective film according to the embodiment of the present invention may decrease. If the ratio of conductive polymer to 100 parts by weight of binder in the antistatic layer is too large and outside the above range, the adhesion of the antistatic layer to adjacent layers may decrease, or the transparency may decrease.

[0101] As a method for forming the antistatic layer, any suitable method can be adopted as long as it does not impair the effects of the present invention. Typical such methods include applying a coating material for forming the antistatic layer (antistatic agent composition) to the first surface of a substrate (support) and drying or curing it.

[0102] As the conductive polymer, any suitable antistatic layer can be used, as long as it does not impair the effects of the present invention. Examples of such conductive polymers include water-soluble conductive polymers and water-dispersible conductive polymers.

[0103] Examples of water-soluble conductive polymers include polyaniline sulfonic acid, poly(isothianaphthenediyl sulfonate) compounds, and quaternary ammonium salt-containing (meth)acrylic acid ester polymers, with polyaniline sulfonic acid being preferred.

[0104] Examples of water-dispersible conductive polymers include polythiophenes and polyanilines doped with polyanions, with polythiophenes doped with polyanions being preferred.

[0105] Examples of polythiophenes that can be used as water-dispersible conductive polymers include polythiophene, poly(3-methylthiophene), poly(3-ethylthiophene), poly(3-propylthiophene), poly(3-butylthiophene), poly(3-hexylthiophene), poly(3-heptylthiophene), poly(3-octylthiophene), poly(3-decylthiophene), poly(3-dodecylthiophene), poly(3-octadecylthiophene), poly(3-bromothiophene), and poly(3-chlorothiophene). Poly(3-iodothiophene), poly(3-cyanothiophene), poly(3-phenylthiophene), poly(3,4-dimethylthiophene), poly(3,4-dibutylthiophene), poly(3-hydroxythiophene), poly(3-methoxythiophene), poly(3-ethoxythiophene), poly(3-butoxythiophene), poly(3-hexyloxythiophene), poly(3-heptyloxythiophene), poly(3-octyloxythiophene), poly(3-decyloxythiophene), Poly(3-dodecyloxythiophene), poly(3-octadecyloxythiophene), poly(3,4-dihydroxythiophene), poly(3,4-dimethoxythiophene), poly(3,4-diethoxythiophene), poly(3,4-dipropoxythiophene), poly(3,4-dibutoxythiophene), poly(3,4-dihexyloxythiophene), poly(3,4-diheptyloxythiophene), poly(3,4-dioctyloxythiophene), poly(3,4-didecyloxythiophene), poly( Examples include poly(3,4-didodecyloxythiophene), poly(3,4-ethylenedioxythiophene), poly(3,4-propylenedioxythiophene), poly(3,4-butenedioxythiophene), poly(3-methyl-4-methoxythiophene), poly(3-methyl-4-ethoxythiophene), poly(3-carboxythiophene), poly(3-methyl-4-carboxythiophene), poly(3-methyl-4-carboxyethylthiophene), and poly(3-methyl-4-carboxybutylthiophene). The degree of polymerization of the polythiophenes is preferably 2 to 1000, and more preferably 5 to 100, in order to better exhibit the effects of the present invention.

[0106] As the water-dispersible conductive polymer, poly(3,4-ethylenedioxythiophene) (PEDOT) is preferred in that it can better exhibit the effects of the present invention.

[0107] Polyanions are polymers of constituent units having anionic groups and act as dopants for polythiophenes. Examples of polyanions include polystyrene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacryl sulfonic acid, polymethacrylate, poly(2-acrylamido-2-methylpropanesulfonic acid), polyisoprene sulfonic acid, polysulfoethyl methacrylate, poly(4-sulfobutyl methacrylate), polymetharyloxybenzene sulfonic acid, polyvinyl carboxylic acid, polystyrene carboxylic acid, polyallyl carboxylic acid, polyacryl carboxylic acid, polymethacrylate, poly(2-acrylamido-2-methylpropanecarboxylic acid), polyisoprene carboxylic acid, polyacrylic acid, and polysulfonated phenylacetylene. Polyanions may be homopolymers of these or copolymers of two or more of them. The weight-average molecular weight (Mw) of the polyanions is preferably 1000 to 1,000,000, and more preferably 2000 to 500,000, in terms of excellent doping and dispersibility with polythiophenes.

[0108] As for the polyanions, polystyrene sulfonic acid (PSS) is preferred in that it can better exhibit the effects of the present invention.

[0109] For example, when poly(3,4-ethylenedioxythiophene) (PEDOT) is used as a polythiophene and polystyrene sulfonic acid (PSS) is used as a polyanion that can be doped with polypolythiophenes, PEDOT and PSS interact and are in close proximity to each other. As a result, electrons are removed from PEDOT by PSS, and the antistatic layer exhibits excellent conductivity.

[0110] Examples of commercially available polythiophenes doped with polyanions include, for example, the product name "Bytron P" of H.C. Stark Co., Ltd. for poly(3,4-ethylenedioxythiophene) / polystyrene sulfonic acid (PEDOT / PSS), the product name "Sepulveda" of Shin-Etsu Polymer Co., Ltd., and the product name "Verazol" of Soken Chemical & Engineering Co., Ltd.

[0111] The weight average molecular weight (Mw) in terms of polystyrene of polyaniline sulfonic acid that can be used as a water-soluble conductive polymer component is preferably 1×10 3 ~5×10 5 in terms of more preferably expressing the effects of the present invention, and more preferably 5×10 3 ~3×10 5 in terms of.

[0112] Examples of commercially available polyaniline sulfonic acid include, for example, the product name "aquaPASS" of Mitsubishi Rayon Co., Ltd.

[0113] <A-3-2. Binder> The content ratio of the binder in the entire antistatic layer is preferably 50% by weight to 95% by weight, and more preferably 60% by weight to 90% by weight in terms of more preferably expressing the effects of the present invention.

[0114] As the binder, any suitable resin can be employed as long as the effects of the present invention are not impaired. Examples of such binders include, for example, polyester resins, acrylic resins, polyvinyl resins, urethane resins, melamine resins, and epoxy resins.

[0115] In order to better exhibit the effects of the present invention, the binder preferably contains a polyester resin. The polyester resin mainly contains polyester, and its content is preferably 50% to 100% by weight, more preferably 70% to 100% by weight, even more preferably 90% to 100% by weight, particularly preferably 95% to 100% by weight, and most preferably substantially 100% by weight. Here, "substantially" means that it does not contain any intentionally added components, and that any impurities that are accidentally mixed in or produced as by-products are excluded.

[0116] If a polyester resin is used as a binder, the low surface free energy of the polyester resin makes it possible to suppress repulsion and other issues when applying the antistatic composition to a substrate to form a film, even without adding additives such as lubricants.

[0117] The polyester preferably has a structure in which at least one compound (polycarboxylic acid component) selected from polycarboxylic acids (typically dicarboxylic acids) having two or more carboxyl groups in one molecule and their derivatives (anhydrides, esters, halides, etc. of polycarboxylic acids) is condensed with at least one compound (polyhydric alcohol component) selected from polyhydric alcohols (typically diols) having two or more hydroxyl groups in one molecule.

[0118] Compounds that can be used as polycarboxylic acid components include, for example, oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, meso-tartaric acid, itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, tetramethyladipic acid, methyleneadipic acid, muconic acid, and Aliphatic dicarboxylic acids such as lactaric acid, pimelic acid, suberic acid, perfluorosuberic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, brassic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, and tetradecyldicarboxylic acid; cycloalkyldicarboxylic acids (e.g., 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4-(2-norbornene)dicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid (Hymic acid), and adamantanedicarboxylic acid. , alicyclic dicarboxylic acids such as spiroheptanedicarboxylic acid; phthalic acid, isophthalic acid, dithioisophthalic acid, methylisophthalic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methylterephthalic acid, dimethylterephthalic acid, chloroterephthalic acid, bromoterephthalic acid, naphthalenedicarboxylic acid, oxofluorange carboxylic acid, anthracenedicarboxylic acid, biphenyldicarboxylic acid, biphenylenedicarboxylic acid, dimethylbiphenylenedicarboxylic acid, 4,4"-p-terephenylenedicarboxylic acid, 4, Aromatic dicarboxylic acids such as 4"-p-quarelphenyldicarboxylic acid, bibenzyldicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylenediacetic acid, phenylenedipropionic acid, naphthalenedicarboxylic acid, naphthalenedipropionic acid, biphenyldiacetic acid, biphenyldipropionic acid, 3,3'-[4,4'-(methylenedi-p-biphenylene)]dipropionic acid, 4,4'-bibenzyldiacetic acid, 3,3'(4,4'-bibenzyl)dipropionic acid, oxydi-p-phenylenediacetic acid, and other aromatic dicarboxylic acids; acid anhydrides of any of the above-mentioned polycarboxylic acids;Examples include esters of any of the polycarboxylic acids mentioned above (e.g., alkyl esters, which may be monoesters, diesters, etc.); and acid halides corresponding to any of the polycarboxylic acids mentioned above (e.g., dicarboxylic acid chlorides).

[0119] Compounds that can be used as polycarboxylic acid components are preferably aromatic dicarboxylic acids and their acid anhydrides, such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid; aliphatic dicarboxylic acids and their acid anhydrides, such as adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, hymic acid, and 1,4-cyclohexanedicarboxylic acid; and lower alkyl esters of the dicarboxylic acids (for example, esters with monoalcohols having 1 to 3 carbon atoms).

[0120] Examples of compounds that can be used as polyhydric alcohol components include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A, and diols such as bisphenol A. Other examples include alkylene oxide adducts of these compounds (e.g., ethylene oxide adducts, propylene oxide adducts, etc.).

[0121] The molecular weight of the polyester resin is preferably 5 × 10⁶ as the weight-average molecular weight (Mw) on a standard polystyrene basis, as measured by gel permeation chromatography (GPC), in order to better express the effects of the present invention. 3 ~1.5×10 5 Therefore, 1 × 10 4~6×10 4 is as follows.

[0122] The glass transition temperature (Tg) of the polyester resin is preferably 0°C to 120°C, more preferably 10°C to 80°C, in terms of more effectively expressing the effects of the present invention.

[0123] As the polyester resin, commercially available products such as "Vyloner" manufactured by Toyobo Co., Ltd. can be used.

[0124] As the binder, resins other than polyester resins (for example, acrylic resins, acrylic urethane resins, acrylic styrene resins, acrylic silicone resins, silicone resins, polysilazane resins, polyurethane resins, fluorine resins, polyvinyl alcohol resins, polyolefin resins, etc.) may be further contained.

[0125] <A-3-3. Crosslinking Agent> As the crosslinking agent, a crosslinking agent used for crosslinking general resins can be adopted. Examples of such crosslinking agents include melamine-based crosslinking agents, isocyanate-based crosslinking agents, and epoxy-based crosslinking agents. The crosslinking agent may be only one kind or two or more kinds. The amount of the crosslinking agent used can be appropriately adjusted according to the purpose.

[0126] <A-3-4. Other Components> The antistatic agent composition used for forming the antistatic layer may contain any appropriate other components as long as the effects of the present invention are not impaired. Examples of such other components include solvents, other antistatic components (organic conductive substances other than conductive polymers, inorganic conductive substances, other antistatic agents, etc.), surfactants, leveling agents, lubricants, antioxidants, colorants (pigments, dyes, etc.), fluidity modifiers (thixotropic agents, thickeners, etc.), film-forming aids, defoaming agents, and preservatives.

[0127] <A-3-5. Formation of Antistatic Layer> The antistatic layer can be suitably formed by a method that includes applying a liquid composition (coating material for forming the antistatic layer, antistatic agent composition) in which various components such as conductive polymers are dissolved in a suitable solvent (such as water) to a substrate. For example, a method in which the coating material is applied to one side of the substrate, dried, and then cured as necessary (heat treatment, ultraviolet treatment, etc.) can be preferably employed. The NV (non-volatile content) of the coating material can preferably be 5% by weight or less, and more preferably 1% by weight or less.

[0128] The solvent constituting the coating material is preferably one that can stably dissolve (disperse) the antistatic layer-forming components. Examples of such solvents include organic solvents, water, or mixtures thereof. The solvent may be one type or two or more types.

[0129] Examples of organic solvents include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; aliphatic or alicyclic hydrocarbons such as n-hexane and cyclohexane; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; and glycol ethers such as alkylene glycol monoalkyl ethers (e.g., ethylene glycol monomethyl ether, ethylene glycol monoethyl ether) and dialkylene glycol monoalkyl ether.

[0130] <<B. Optical and Electronic Components>> The optical component according to the embodiment of the present invention has a surface protective film according to the embodiment of the present invention attached to it. The electronic component according to the embodiment of the present invention has a surface protective film according to the embodiment of the present invention attached to it. [Examples]

[0131] The present invention will be specifically described below with reference to examples, but the present invention is not limited in any way to these examples. The test and evaluation methods in the examples are as follows. When "parts" is written, it means "parts by weight" unless otherwise specified, and when "%" is written, it means "percent by weight" unless otherwise specified.

[0132] <Measurement of peeling force from glass plate (after being left at 23°C for 30 minutes)> The adhesive side of the surface protective film (25mm wide x 140mm long), from which the separator had been removed, was attached to a glass plate (soda-lime glass, manufactured by Matsunami Glass Industry Co., Ltd.) using a 2kg hand roller in one pass-and-go motion, and left for 30 minutes at an ambient temperature of 23°C. The evaluation samples obtained as described above were measured using a tensile testing machine. The tensile testing machine used was the "Autograph AG-Xplus HS 6000mm / min high-speed model (AG-50NX plus)" manufactured by Shimadzu Corporation. The evaluation samples were set in the tensile testing machine and the tensile test was started. Specifically, the load when peeling the surface protective film from the glass plate was measured, and the average load at that time was defined as the peeling force of the surface protective film from the glass plate. The conditions for the tensile test were: test environment temperature: 23℃, peeling angle: 180 degrees, peeling speed (tensile speed): 300mm / min.

[0133] <Haze Measurement> For surface protective film (50mm wide, 50mm long) with the separator removed, haze was measured using Murakami Color Technology Laboratory's HM-150N under the conditions of JIS-K-7136.

[0134] <Measurement of surface resistance> The adhesive layer side of the surface protective film (50mm wide, 50mm long) from which the separator had been removed was measured by pressing the terminals against a Trek Japan "Model 152P-2P" at 10V for 10 seconds.

[0135] <Glue residue evaluation> A 1cm cut was made by inserting a cutter blade at a 30-degree angle into the center of the adhesive layer side of a surface protective film (25mm wide x 140mm long) from which the separator had been removed. A × was used if adhesive residue was visible, and a ○ was used if no adhesive residue was found.

[0136] <Evaluation of the appearance of the adhesive layer> In the surface protective films manufactured in the examples and comparative examples, after laminating a separator to the surface of the formed adhesive layer, it was visually inspected whether air bubbles could be observed between the adhesive layer and the separator after 1 minute.

[0137] [Manufacturing Example 1]: Preparation of coating material As a binder, 100 parts of a 25% aqueous solution of polyester resin (manufactured by Toyobo Co., Ltd., product name "Vaironal MD-1480"), 20 parts of conductive polymer, and 5 parts of melamine-based crosslinking agent (manufactured by Sumitomo Chemical Co., Ltd., product name "Sumimar M-50W") were added to a mixed solvent of water / ethanol (1 / 1 by weight ratio) and stirred for about 20 minutes to mix thoroughly. In this way, a coating material with a solid content of approximately 0.4% was prepared. As the conductive polymer, an aqueous solution (Bytron P, manufactured by HCStark) containing 0.5% poly(3,4-ethylenedioxythiophene) (PEDOT) and 0.8% polystyrene sulfonate (weight-average molecular weight 150,000) (PSS) was used.

[0138] [Manufacturing Example 2]: Creation of a film with a topcoat layer (a laminate of an antistatic layer and a base layer) A transparent polyethylene terephthalate (PET) film with a thickness of 75 μm was prepared. The coating material prepared in Manufacturing Example 1 was applied to one side of this PET film using a bar coater and dried by heating at 130°C for 2 minutes. In this way, a film with a topcoat layer (1) was prepared, having a transparent topcoat layer (antistatic layer) with a thickness of 30 nm on one side of the PET film (base layer).

[0139] [Manufacturing Example 3]: Preparation of a urethane-based adhesive composition solution As polyol (A2) (100 parts by weight in total), 85 parts by weight of Preminol S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000), a polyol having three hydroxyl groups; 13 parts by weight of Sannix GP3000 (manufactured by Sanyo Chemical Industries, Ltd., Mn=3000), a polyol having three hydroxyl groups; 2 parts by weight of Sannix GP1000 (manufactured by Sanyo Chemical Industries, Ltd., Mn=1000), a polyol having three hydroxyl groups; 18 parts by weight of an isocyanate compound (Coronate HX:C / HX, manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent; and 0.50 parts by weight on a solid content basis of an ionic compound (trade name "Elexel AS110", 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.). Diluted with ethyl acetate to obtain a urethane-based adhesive composition solution.

[0140] [Manufacturing Example 4]: Preparation of acrylic adhesive composition solution In a four-necked flask equipped with a stirring blade, thermometer, nitrogen gas inlet tube, and condenser, 96 parts by weight of 2-ethylhexyl acrylate (2EHA), 4 parts by weight of 2-hydroxyethyl acrylate (HEA), 0.2 parts by weight of 2,2'-azobisisobutyronitrile as polymerization initiators, and 150 parts by weight of ethyl acetate were charged. Nitrogen gas was introduced while gently stirring, and the polymerization reaction was carried out for 6 hours while maintaining the liquid temperature in the flask at around 65°C to prepare a 40% by weight solution of acrylic polymer (1). The weight-average molecular weight (Mw) of acrylic polymer (A3) was 540,000. 100 parts by weight of acrylic polymer (A3), 5 parts by weight of isocyanate compound (Coronate HX:C / HX, manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent (based on solid content), 0.50 parts by weight of ionic compound (trade name "Elexel AS110", 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) (based on solid content), and 10 parts by weight of fatty acid ester (trade name "Saracos 816", manufactured by Nisshin Oillio Co., Ltd.) were diluted with ethyl acetate to obtain an acrylic adhesive composition solution.

[0141] [Example 1] 100 parts by weight of silicone adhesive (product name "X-40-3306", manufactured by Shin-Etsu Chemical Co., Ltd.) (A1), 1.3 parts by weight in terms of solid content of platinum-based catalyst (product name "CAT-PL-50T", manufactured by Shin-Etsu Chemical Co., Ltd.), and 0.50 parts by weight in terms of solid content of ionic compound (product name "X-40-2450", ionic group-containing silicone oligomer, manufactured by Shin-Etsu Chemical Co., Ltd.) were diluted with toluene to obtain a silicone adhesive composition solution to a total solid content of 30% by weight. The silicone adhesive composition solution was then applied to the topcoat layer side of the topcoat layer-attached film (1) prepared in Production Example 2 to a dry thickness of 50 μm, and cured and dried at a drying temperature of 130°C for a drying time of 2 minutes to form an adhesive layer. Next, a polyethylene terephthalate (PET) film (without release treatment) was laminated to the surface of the obtained adhesive layer as a separator to obtain a surface protection film (1). The samples were aged at room temperature for 5 days and then evaluated. The results are shown in Table 1.

[0142] [Example 2] As shown in Table 1, the procedure was carried out in the same manner as in Example 1, except that the ionic compound was changed to 0.50 parts by weight on a solid content basis, using the trade name "CIL-312" (1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, manufactured by Nippon Carlit Co., Ltd.), to obtain a surface protective film (2). The results are shown in Table 1.

[0143] [Example 3] As shown in Table 1, the procedure was carried out in the same manner as in Example 1, except that the ionic compound was changed to 1.00 part by weight on a solid content basis, using the trade name "CIL-312" (1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, manufactured by Nippon Carlit Co., Ltd.), to obtain a surface protective film (3). The results are shown in Table 1.

[0144] [Example 4] As shown in Table 1, the procedure was carried out in the same manner as in Example 1, except that the ionic compound was changed to 5.00 parts by weight on a solid content basis, using the trade name "CIL-312" (1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, manufactured by Nippon Carlit Co., Ltd.), to obtain a surface protective film (4). The results are shown in Table 1.

[0145] [Example 5] As shown in Table 1, the procedure was carried out in the same manner as in Example 1, except that the ionic compound was changed to 0.50 parts by weight on a solid content basis, using the trade name "Elexel AS110" (1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), to obtain a surface protective film (5). The results are shown in Table 1.

[0146] [Example 6] As shown in Table 1, the procedure was carried out in the same manner as in Example 1, except that the ionic compound was changed to 1.00 part by weight on a solid content basis, using the trade name "Elexel AS110" (1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), to obtain a surface protective film (6). The results are shown in Table 1.

[0147] [Example 7] As shown in Table 1, a surface protective film (7) was obtained in the same manner as in Example 1, except that the ionic compound was changed to methyltrioctylammonium bis(trifluoromethanesulfonyl)imide (MTOATFSI, manufactured by Mitsubishi Materials Corporation) in terms of solid content, at a rate of 0.50 parts by weight. The results are shown in Table 1.

[0148] [Example 8] As shown in Table 1, a surface protective film (8) was obtained in the same manner as in Example 1, except that the ionic compound was changed to methyltrioctylammonium bis(trifluoromethanesulfonyl)imide (MTOATFSI, manufactured by Mitsubishi Materials Corporation) at 1.00 parts by weight on a solid content basis. The results are shown in Table 1.

[0149] [Example 9] As shown in Table 1, a surface protective film (9) was obtained in the same manner as in Example 1, except that the ionic compound was changed to methyltrioctylammonium bis(trifluoromethanesulfonyl)imide (MTOATFSI, manufactured by Mitsubishi Materials Corporation) at 5.00 parts by weight on a solid content basis. The results are shown in Table 1.

[0150] [Example 10] As shown in Table 1, a surface protective film (10) was obtained in the same manner as in Example 1, except that the ionic compound was changed to lithium bis(trifluoromethanesulfonyl)imide (LiTFSI, manufactured by Mitsubishi Materials Corporation) in terms of solid content, at 0.50 parts by weight. The results are shown in Table 1.

[0151] [Example 11] As shown in Table 1, a surface protective film (11) was obtained in the same manner as in Example 1, except that the ionic compound was changed to 0.01 parts by weight on a solid content basis of 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide (1Allyl3MeImTFSI, manufactured by Tokyo Chemical Industry Co., Ltd.). The results are shown in Table 1.

[0152] [Example 12] As shown in Table 1, a surface protective film (12) was obtained in the same manner as in Example 1, except that the ionic compound was changed to 0.10 parts by weight on a solid content basis of 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide (1Allyl3MeImTFSI, manufactured by Tokyo Chemical Industry Co., Ltd.). The results are shown in Table 1.

[0153] [Example 13] As shown in Table 1, a surface protective film (13) was obtained in the same manner as in Example 1, except that the ionic compound was changed to 0.50 parts by weight on a solid content basis of 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide (1Allyl3MeImTFSI, manufactured by Tokyo Chemical Industry Co., Ltd.). The results are shown in Table 1.

[0154] [Example 14] As shown in Table 1, a surface protective film (14) was obtained in the same manner as in Example 1, except that the ionic compound was changed to 1.00 part by weight on a solid content basis of 1-allyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide (1Allyl3MeImTFSI, manufactured by Tokyo Chemical Industry Co., Ltd.). The results are shown in Table 1.

[0155] [Example 15] As shown in Table 1, a surface protective film (15) was obtained in the same manner as in Example 1, except that the ionic compound was changed to 0.10 parts by weight on a solid content basis of 1-ethyl-3-vinyl-imidazolium bis(trifluoromethanesulfonyl)imide (1Ethyl3ViImTFSI, manufactured by Tokyo Chemical Industry Co., Ltd.). The results are shown in Table 1.

[0156] [Example 16] As shown in Table 1, a surface protective film (16) was obtained in the same manner as in Example 1, except that the ionic compound was changed to 0.50 parts by weight on a solid content basis of 1-ethyl-3-vinyl-imidazolium bis(trifluoromethanesulfonyl)imide (1Ethyl3ViImTFSI, manufactured by Tokyo Chemical Industry Co., Ltd.). The results are shown in Table 1.

[0157] [Example 17] As shown in Table 1, a surface protective film (17) was obtained in the same manner as in Example 12, except that the silicone-based adhesive composition solution was applied to form an adhesive layer with a drying thickness of 25 μm. The results are shown in Table 1.

[0158] [Example 18] As shown in Table 1, a surface protective film (18) was obtained in the same manner as in Example 12, except that the silicone-based adhesive composition solution was applied to form an adhesive layer with a drying thickness of 75 μm. The results are shown in Table 1.

[0159] [Example 19] As shown in Table 1, a surface protective film (19) was obtained in the same manner as in Example 12, except that the thickness of the top coat layer (antistatic layer) was changed to 20 nm. The results are shown in Table 1.

[0160] [Example 20] As shown in Table 1, a surface protective film (20) was obtained in the same manner as in Example 12, except that the thickness of the top coat layer (antistatic layer) was changed to 50 nm. The results are shown in Table 1.

[0161] [Comparative Example 1] As shown in Table 1, a surface protective film (C1) was obtained in the same manner as in Example 1, except that ionic compounds were not used. The results are shown in Table 1.

[0162] [Comparative Example 2] As shown in Table 1, a surface protective film (C2) was obtained in the same manner as in Example 1, except that the silicone adhesive composition solution was applied to a 75 μm thick transparent polyethylene terephthalate (PET) film (without primer) instead of applying it to the top coat layer side of the top coat layered film (1) prepared in Production Example 2. The results are shown in Table 1.

[0163] [Comparative Example 3] As shown in Table 1, a surface protective film (C3) was obtained in the same manner as in Example 2, except that the silicone adhesive composition solution was applied to a 75 μm thick transparent polyethylene terephthalate (PET) film (without primer) instead of applying it to the top coat layer side of the top coat layered film (1) prepared in Production Example 2. The results are shown in Table 1.

[0164] [Comparative Example 4] As shown in Table 1, a surface protective film (C4) was obtained in the same manner as in Example 5, except that the silicone adhesive composition solution was applied to a 75 μm thick transparent polyethylene terephthalate (PET) film (without primer) instead of applying it to the top coat layer side of the top coat layered film (1) prepared in Production Example 2. The results are shown in Table 1.

[0165] [Comparative Example 5] The urethane-based adhesive composition solution obtained in Production Example 3 was applied to the topcoat layer side of the topcoat layer-attached film (1) prepared in Production Example 2 to a thickness of 50 μm. The film was cured and dried at a drying temperature of 130°C for 2 minutes to create an adhesive layer. Next, the silicone-treated side of a 25 μm thick polyester resin separator (product name "MRF25", thickness 25 μm, manufactured by Mitsubishi Chemical Corporation), with one side silicone-treated, was laminated to the surface of the obtained adhesive layer to obtain a surface protection film (C5). The film was aged at room temperature for 5 days and evaluated. The results are shown in Table 1.

[0166] [Comparative Example 6] The acrylic adhesive composition solution obtained in Production Example 4 was applied to the topcoat layer side of the topcoat layered film (1) prepared in Production Example 2 to a thickness of 50 μm, and cured and dried under the conditions of a drying temperature of 110°C and a drying time of 2 minutes. Next, a polyethylene terephthalate (PET) film (silicone treated) was laminated to the surface of the obtained adhesive layer as a separator to obtain a surface protection film (C6). The surface protection film was aged at room temperature for 5 days and evaluated. The results are shown in Table 1.

[0167] [Comparative Example 7] As shown in Table 1, a surface protective film (C7) was obtained in the same manner as in Example 13, except that the silicone adhesive composition solution was applied to a 75 μm thick transparent polyethylene terephthalate (PET) film (without primer) instead of applying it to the top coat layer side of the top coat layered film (1) prepared in Production Example 2. The results are shown in Table 1.

[0168] [Table 1]

[0169] [Examples 21-40] For each of the surface protective films (1) to (20) obtained in Examples 1 to 20, the separator was peeled off, and the adhesive layer side was attached to a polarizing plate (manufactured by Nitto Denko Corporation, product name "TEG1465DUHC"), which is an optical component, to obtain an optical component with the surface protective film attached.

[0170] [Examples 41-60] For each of the surface protection films (1) to (20) obtained in Examples 1 to 20, the separator was peeled off, and the adhesive layer side was attached to a conductive film (manufactured by Nitto Denko Corporation, product name "Elecrista V270L-TFMP") which is an electronic component, to obtain an electronic component with the surface protection film attached. [Industrial applicability]

[0171] The surface protection film of the present invention can be used in any suitable application. Preferably, the surface protection film of the present invention is used in the fields of optical components and electronic components. [Explanation of Symbols]

[0172] 10 Base material layer 20 Antistatic layer 30 Adhesive layer 100 Surface protective film

Claims

1. A surface protective film comprising a base layer, an antistatic layer, and an adhesive layer in this order, The antistatic layer and the adhesive layer are directly laminated together. The adhesive constituting the adhesive layer is formed from an adhesive composition, The adhesive composition comprises a silicone adhesive and an ionic compound containing a nitrogen-containing onium cation and a fluoroorganic anion. The ionic compound has a reactive carbon-carbon double bond, Surface protective film.

2. The surface protective film according to claim 1, wherein the silicone adhesive is an addition-curing type silicone adhesive.

3. The surface protective film according to claim 1 or 2, wherein the content of the ionic compound in the adhesive composition is 0.005% by weight to 10.0% by weight.

4. An optical member to which a surface protective film according to any one of claims 1 to 3 is attached.

5. An electronic component to which a surface protective film according to any one of claims 1 to 3 is attached.

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