Substrate support method and substrate processing apparatus

Abstract

To provide a substrate support method and substrate processing equipment that support a substrate in a desired shape when supporting a flexible substrate with a lift pin.SOLUTION: A substrate support method is a method for supporting a flexible rectangular substrate placed on the mounting surface of a mounting table by releasing the substrate from the mounting surface, the mounting table has a plurality of lift pins that can protrude and retract from the mounting surface, and the method has the process of molding the shape of the substrate by raising the lift pins to the molding position so that the lift pins with the largest drive to the molding position are first stopped at the molding position, and then raising the lift pins to the target position.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] This disclosure relates to a substrate support method and a substrate processing apparatus. [Background technology]

[0002] Patent Document 1 discloses a substrate mounting mechanism comprising: a mounting table on which a flexible substrate to be processed is placed; a plurality of lifting pins provided so as to be able to protrude from and retract relative to the mounting surface of the mounting table, which support the substrate to be processed and move up and down between a transfer position for transferring the substrate above the mounting table and a mounting position on the mounting table; and a drive mechanism for driving the lifting pins, wherein the plurality of lifting pins include a first lifting pin that supports the peripheral edge of the substrate to be processed and a second lifting pin that supports the central part of the substrate to be processed, and the drive mechanism is characterized in that, when raising and lowering the substrate to be processed, the first lifting pin protrudes higher than the second lifting pin so that the substrate to be processed is stably supported in a downwardly convex shape. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2008-60285 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] Incidentally, bending or warping can occur when a circuit board is placed on the mounting table. In this case, the lift pins are raised to lift the circuit board, it is molded into the desired shape and supported, and then the lift pins are lowered to reposition the circuit board on the mounting table.

[0005] In one aspect, this disclosure provides a substrate support method and a substrate processing apparatus for supporting a flexible substrate in a desired shape when the substrate is supported by lift pins. [Means for solving the problem]

[0006] To solve the above problem, according to one embodiment, a substrate support method for detaching and supporting a flexible rectangular substrate placed on the mounting surface of a mounting table, wherein the mounting table is provided with a plurality of lift pins that can protrude from and retract from the mounting surface, and the method comprises the steps of raising the lift pins to the molding position to form the shape of the substrate, such that the lift pins with the largest drive amount to the molding position stop at the molding position first, and raising the lift pins to a target position, wherein the drive amount to the molding position is the difference in relative height of each lift pin with respect to the lift pin positioned at the lowest position at the target position. The lift pins include a first lift pin provided at the corner of a rectangular mounting area on the mounting surface on which the substrate is placed, a second lift pin provided at the center of the short side of the mounting area, a third lift pin provided at the center of the long side of the mounting area, and a fourth lift pin provided at the center of the surface of the mounting area. The process of forming the substrate includes: starting the drive of the first lift pin and raising it to the forming position; stopping the first lift pin at the forming position; starting the drive of the second lift pin and raising it to the forming position; stopping the second lift pin at the forming position after the first lift pin has stopped; starting the drive of the third lift pin and raising it to the forming position; and stopping the third lift pin at the forming position after the second lift pin has stopped. A substrate support method is provided. [Effects of the Invention]

[0007] In one aspect, when supporting a flexible substrate with lift pins, a substrate support method and a substrate processing apparatus can be provided that support the substrate in a desired shape. [Brief explanation of the drawing]

[0008] [Figure 1] An example of a schematic cross-sectional view of a substrate processing device. [Figure 2] An example of a schematic cross-sectional view in the planar direction of a substrate processing device. [Figure 3] An example of a block diagram showing the configuration of the drive mechanism that drives the lift pin. [Figure 4] This flowchart illustrates an example of the substrate reinstallation operation of the substrate processing apparatus according to this embodiment. [Figure 5] A time chart showing an example of the operation of the lift pins during the repositioning operation of the substrate in the substrate processing apparatus according to this embodiment. [Figure 6] An example of a schematic cross-sectional diagram illustrating the arrangement of lift pins and the shape of the substrate in each state of the substrate reinstallation operation of the substrate processing apparatus according to this embodiment. [Figure 7] A time chart showing an example of the operation of the lift pins during the repositioning operation of a substrate in a substrate processing device related to a reference example. [Figure 8] An example of a schematic cross-sectional view showing the state of a substrate lifted by a lift pin.

Mode for Carrying Out the Invention

[0009] Hereinafter, embodiments for implementing the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are assigned to the same components, and redundant descriptions may be omitted.

[0010] <Substrate processing apparatus> The substrate processing apparatus 1 according to this embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is an example of a schematic cross-sectional view of the substrate processing apparatus 1. The substrate processing apparatus 1 is an apparatus that places a substrate G on a mounting table and performs a desired process (for example, an etching process, etc.) on the substrate G. Further, the mounting table is configured to be able to adjust (for example, cool) the temperature of the mounted substrate G. Hereinafter, a horizontal one direction will be described as the X direction, a horizontal direction orthogonal to the X direction will be described as the Y direction, and the height direction will be described as the Z direction.

[0011] Further, the substrate G on which the process is performed in the substrate processing apparatus 1, in other words, the substrate G placed on the mounting table, is rectangular in plan view and is a flexible substrate. The substrate G may be, for example, a rectangular glass substrate having flexibility. Further, the substrate G may be, for example, a thin film glass substrate having a thickness of about 0.2 mm to several mm. Further, the substrate G may be, for example, one including at least dimensions ranging from about 1500 mm × 1800 mm of the sixth generation to about 3000 mm × 3400 mm of the tenth generation in planar dimensions. Further, the substrate G may be, for example, a glass substrate used in the manufacture of flat panel displays.

[0012] The substrate processing apparatus 1 includes a chamber 2 as a processing container for accommodating the substrate G. The chamber 2 is made of, for example, aluminum whose surface is anodized (anodic oxidation treatment), and is formed in a rectangular tube shape corresponding to the shape of the substrate G.

[0013] On the bottom wall inside the chamber 2, a susceptor 4 is provided as a mounting table for mounting the substrate G. The susceptor 4 is formed in a square plate shape or a columnar shape corresponding to the shape of the substrate G. The susceptor 4 has a base material 4a made of a conductive material such as metal, and an insulating member 4b provided between the bottom of the base material 4a and the bottom surface of the chamber 2. A power supply line 23 for supplying high-frequency power is connected to the base material 4a. The power supply line 23 is connected to a high-frequency power source 25 via a matcher 24. The high-frequency power source 25 applies high-frequency power of, for example, 13.56 MHz to the susceptor 4. The matcher 24 matches the output impedance of the high-frequency power source 25 and the input impedance of the load side. Thereby, the susceptor 4 is configured to function as a lower electrode.

[0014] Further, the susceptor 4 is provided with an electrostatic chuck 40 for adsorbing the mounted substrate G by electrostatic adsorption. The electrostatic chuck 40 is provided on the upper part of the base material 4a. The electrostatic chuck 40 has a dielectric 41 and an internal electrode 42 provided inside the dielectric 41. A power supply line 43 for applying a voltage is connected to the internal electrode 42. The power supply line 43 is connected to a power source 45 via a switch 44. The power source 45 applies a voltage to the internal electrode 42. The switch 44 turns on and off the application of the voltage.

[0015] Further, the upper surface of the susceptor 4 (electrostatic chuck 40) becomes a substrate mounting surface 4c for mounting the substrate G. The substrate mounting surface 4c has an outer edge portion (not shown) that contacts the outer peripheral portion of the back surface of the substrate G, and a recessed portion (not shown) formed inside the outer edge portion. Further, the recessed portion is configured to be able to supply a heat transfer gas such as He gas. When the electrostatic chuck 40 electrostatically adsorbs the substrate G, the outer peripheral portion of the back surface of the substrate G and the outer edge portion of the substrate mounting surface 4c are hermetically adsorbed. Further, by supplying He gas to the space formed as a gap between the back surface of the substrate G and the recessed portion of the substrate mounting surface 4c, the substrate G placed on the susceptor 4 can be cooled (temperature adjusted). Further, a plurality of minute convex portions may be provided in the recessed portion, and the substrate G may be supported by the outer edge portion and the convex portions.

[0016] A showerhead 11, which supplies processing gas into the chamber 2 and functions as an upper electrode, is provided on the upper part or upper wall of the chamber 2, facing the susceptor 4. The showerhead 11 has a gas diffusion space 12 formed inside for diffusing the processing gas, and a plurality of discharge holes 13 for discharging the processing gas are formed on its lower surface or the surface facing the susceptor 4. This showerhead 11 is grounded and together with the susceptor 4 constitutes a pair of parallel plate electrodes. In this embodiment, the present disclosure is described as being applied to a substrate processing apparatus that generates plasma using parallel plate electrodes, but of course, the present disclosure may also be applied to a substrate processing apparatus that generates plasma by inductive coupling, or to a substrate processing apparatus that generates plasma by other methods.

[0017] A gas inlet 14 is provided on the upper surface of the shower head 11, and a processing gas supply pipe 15 is connected to this gas inlet 14. A processing gas supply source 18 is connected to this processing gas supply pipe 15 via a valve 16 and a mass flow controller 17. A processing gas for etching, for example, is supplied from the processing gas supply source 18. As the processing gas, gases commonly used in this field, such as halogen gases, O2 gas, and Ar gas, can be used.

[0018] An exhaust pipe 19 is connected to the bottom wall of chamber 2, and an exhaust device 20 is connected to this exhaust pipe 19. The exhaust device 20 is equipped with a vacuum pump such as a turbomolecular pump, and is configured to evacuate the inside of chamber 2 to a predetermined reduced pressure atmosphere. An inlet / outlet 21 for loading and unloading substrates G is formed on the side wall of chamber 2, and a gate valve 22 is provided to open and close this inlet / outlet 21. When the inlet / outlet 21 is open, the substrate G is supported from below by a transport arm 50 (see Figure 2, described later) as a transport member, and is transported between the inlet / outlet 21 and an adjacent transport chamber (not shown) via the gate valve 22.

[0019] Through holes 7 are formed in the bottom wall of the chamber 2 and the susceptor 4, penetrating them at the outer periphery and central position (inward from the outer periphery position or closer to the center) of the susceptor 4, respectively. Lift pins 8 are inserted into each through hole 7 so as to be able to protrude and retract relative to the substrate mounting surface 4c of the susceptor 4, supporting and raising / lowering the substrate G from below. The lift pins 8 are positioned to contact the outer periphery and central part of the substrate G when protruding, and are positioned radially or in the width direction by positioning bushings (not shown) and inserted into the through holes 7.

[0020] The lower part of the lift pin 8 protrudes outside the chamber 2. A flange 26 is formed on the lower part of the lift pin 8, and one end (lower end) of an expandable bellows 27, which is provided to surround the lift pin 8, is connected to the flange 26, while the other end (upper end) of the bellows 27 is connected to the bottom wall of the chamber 2. Alternatively, the other end (upper end) of the bellows 27 may be connected to the bottom wall of the susceptor 4. As a result, the bellows 27 expands and contracts in accordance with the raising and lowering of the lift pin 8, and seals the gap between the insertion hole 7 and the lift pin 8.

[0021] Here, the arrangement of the insertion hole 7 and the lift pin 8 will be further explained using Figure 2. Figure 2 is an example of a schematic cross-sectional view of the substrate processing apparatus 1 in the planar direction. In Figure 2, the positions of the transport arm 50 and the substrate G when the substrate G held by the transport arm 50 is placed above the mounting area 4d are indicated by the dashed line.

[0022] As shown in Figure 2, the substrate G and the substrate mounting surface 4c of the susceptor 4 on which the substrate G is placed have a rectangular shape with a short side (Y direction) and a long side (X direction) when viewed from above. The substrate mounting surface 4c also has a mounting area 4d (shown as a dashed line in Figure 2) corresponding to the substrate G. When the substrate G is placed on the susceptor 4, the substrate G is placed in the mounting area 4d. In Figure 2, the center line 4e (a line connecting the midpoint of one long side to the midpoint of the other long side) and the center line 4f (a line connecting the midpoint of one short side to the midpoint of the other short side) of the mounting area 4d are shown as dashed lines. Also, in Figure 2, for convenience, the dashed line showing the mounting area 4d is drawn inside the dashed line showing the substrate G, but this does not mean that the mounting area 4d is defined inside the outer circumference of the substrate G; it is desirable that the mounting area 4d has the same shape and area as the substrate G. Furthermore, the mounting area 4d may be an area having a shape and area that encloses the substrate G.

[0023] The susceptor 4 has through holes 7a to 7d as insertion holes 7. Through holes 7a to 7c are provided on the outer periphery of the mounting area 4d. Through hole 7d is provided in the center of the surface of the mounting area 4d, surrounded by the outer periphery of the mounting area 4d. Lift pins 8a to 8d are arranged in the through holes 7a to 7d as lift pins 8.

[0024] Through holes 7a are provided at the corners of the rectangular mounting area 4d. In the example shown in Figure 2, four through holes 7a are provided within the mounting area 4d, with the centerlines 4e and 4f as symmetric axes. A lift pin 8a is placed in each through hole 7a. Hereinafter, the four lift pins 8a will also be referred to as the first group, Gr.1.

[0025] Through holes 7b are provided in the center of the short side of the rectangular mounting area 4d (between the two corners on the left and right (Y direction) with the center line 4f as the axis of symmetry). In the example shown in Figure 2, two through holes 7b are provided in the center of one short side with the center line 4f as the axis of symmetry. Similarly, two through holes 7b are provided in the center of the other short side with the center line 4f as the axis of symmetry. There are four through holes 7b within the mounting area 4d. A lift pin 8b is placed in each of the through holes 7b. Hereinafter, the four lift pins 8b will also be referred to as the second group Gr.2.

[0026] An insertion hole 7c is provided in the center of the long side of the rectangular mounting area 4d (between the two corners on the front and rear (X direction) with the center line 4e as the axis of symmetry). In the example shown in Figure 2, an insertion hole 7c is provided on the center line 4e in the center of one long side. Similarly, an insertion hole 7c is provided on the center line 4e in the center of the other long side. Two insertion holes 7c are provided within the mounting area 4d. A lift pin 8c is placed in each insertion hole 7c. Hereinafter, the two lift pins 8c will also be referred to as the third group Gr.3.

[0027] An insertion hole 7d is provided in the center of the surface near the center of the rectangular mounting area 4d. In the example shown in Figure 2, the insertion hole 7d is located on the center line 4e, and there are two insertion holes 7d with the center line 4f as the axis of symmetry. A lift pin 8d is placed in each insertion hole 7d. Hereinafter, the two lift pins 8d will also be referred to as the fourth group, Gr.4.

[0028] Figure 3 is an example of a block diagram showing the configuration of the drive mechanism that drives the lift pins 8a to 8d.

[0029] The lift pins 8a to 8d are each connected to drive units 9a to 9d. The lift pins 8a to 8d are configured to protrude from and retract from the substrate mounting surface 4c of the susceptor 4 by moving up and down when driven by these drive units 9a to 9d. Each of the drive units 9a to 9d is configured, for example, using a stepping motor. As shown in Figure 3, the lift pins 8a to 8d have been described as being configured to be driven individually, but this is not the only configuration, and they may be configured to be driven in groups (Group 1 Gr.1 to Group 4 Gr.4). This configuration allows for a reduction in the number of drive units (stepping motors).

[0030] The drive of the drive units 9a to 9d is controlled separately by a controller 31 equipped with a microprocessor (computer), thereby enabling the lift pins 8a to 8d to move up and down independently of each other. The controller 31 is connected to a user interface 32, which includes a keyboard for the process manager to input commands to manage the drive of the drive units 9a to 9d, and a display that visualizes and displays the drive status of the drive units 9a to 9d. A storage unit 33 stores a recipe containing control programs and drive condition data for realizing the drive of the drive units 9a to 9d under the control of the controller 31. When necessary, the controller 31 can execute a recipe retrieved from the storage unit 33 via instructions from the user interface 32, thereby driving and stopping the drive units 9a to 9d under the control of the controller 31. The recipe can be stored on a computer-readable storage medium such as a CD-ROM, hard disk, or flash memory, or it can be transmitted from another device as needed, for example, via a dedicated line.

[0031] The controller 31, user interface 32, and memory unit 33 constitute a control unit that controls the raising and lowering of the lift pins 8a to 8d by the drive units 9a to 9d, and the susceptor 4, lift pins 8a to 8d, drive units 9a to 9d, and control unit constitute a substrate mounting mechanism.

[0032] Next, the repositioning operation of the substrate G in the substrate processing apparatus 1 will be explained using Figures 4 to 6.

[0033] Figure 4 is a flowchart illustrating an example of the repositioning operation of the substrate G of the substrate processing apparatus 1 according to this embodiment. Figure 5 is a time chart showing an example of the operation of the lift pins 8 during the repositioning operation of the substrate G of the substrate processing apparatus 1 according to this embodiment. Figure 6 is an example of a schematic cross-sectional diagram illustrating the arrangement of the lift pins 8 and the shape of the substrate G in each state of the repositioning operation of the substrate G of the substrate processing apparatus 1 according to this embodiment. Note that in Figure 6, the deflection of the substrate G is exaggerated in the illustration.

[0034] Here, the repositioning operation of the substrate G involves raising the lift pins 8a to 8d to lift the substrate G, supporting the substrate G in the desired shape, and then lowering the lift pins 8a to 8d to reposition the substrate G on the susceptor 4. The heights (target positions) of the lift pins 8a to 8d when supporting the substrate G in the desired shape are offset as shown in the lift pin heights in step S110 of Figure 5, so that "height of lift pin 8a of group 1 Gr.1 > height of lift pin 8b of group 2 Gr.2 > height of lift pin 8c of group 3 Gr.3 > height of lift pin 8d of group 4 Gr.4". In this way, when supporting the substrate G in the desired shape, the lift pin 8a of group 1 Gr.1 is positioned at the highest position; in other words, the offset amount of the lift pin 8a of group 1 Gr.1 is L offset_1 Let's explain by setting it to 0. Also, when supporting the substrate G in the desired shape, the offset amount of the lift pins 8a of the second group Gr.2 relative to the lift pins 8a of the first group Gr.1 is L offset_2 The offset amount of the lift pin 8c of the third group Gr.3 relative to the lift pin 8a of the first group Gr.1 is L offset_3 The offset amount of the lift pin 8d of the fourth group Gr.4 relative to the lift pin 8a of the first group Gr.1 is L offset_4 This will be explained as follows.

[0035] In step S101, the controller 31 determines whether or not bending has occurred in the substrate G placed on the susceptor 4. The determination of whether or not bending has occurred in the substrate G may be based, for example, on the flow rate of the heat transfer gas supplied between the substrate G and the susceptor 4. Furthermore, the determination of whether or not bending has occurred in the substrate G is not limited to this. If the substrate G is not bending (S101-NO), the process of reinstalling the substrate G is terminated. If the substrate G is bending (S101-YES), the controller 31 proceeds to step S102.

[0036] In step S102, the controller 31 releases the electrostatic chuck 40.

[0037] In step S103, the controller 31 starts driving the lift pins 8a of the first group Gr.1 to a predetermined molding position. Here, the predetermined molding position of the lift pins 8a of the first group Gr.1 is the relative height of the lift pins 8a of the first group Gr.1 with respect to the pin that is positioned at the lowest position in the target position (lift pin 8d of the fourth group Gr.4), i.e., L offset_4 This is the result.

[0038] In step S104, the controller 31 stops the lift pins 8a of the first group Gr.1 at a predetermined molding position. Figure 6(a) shows schematic cross-sectional shapes 201 and 202 illustrating the shape of the substrate G in cross-section AA (see Figure 2) and cross-sectional shapes 202 illustrating the shape of the substrate G in cross-section BB (see Figure 2) at the end of step S104. Figure 6(b) shows schematic cross-sectional shapes 203 and 204 illustrating the shape of the substrate G in cross-section CC (see Figure 2) and cross-sectional shapes 204 illustrating the shape of the substrate G in cross-section DD (see Figure 2) at the end of step S104.

[0039] In step S105, the controller 31 starts driving the lift pins 8b of the second group Gr.2 to a predetermined molding position. Here, the predetermined molding position of the lift pins 8b of the second group Gr.2 is the relative height of the lift pins 8b of the second group Gr.2 with respect to the pin (lift pin 8d of the fourth group Gr.4) arranged at the lowest position at the target position, that is, "L offset_4 -L offset_2 ".

[0040] In step S106, the controller 31 stops the lift pins 8b of the second group Gr.2 at the predetermined molding position. FIG. 6(c) shows a cross-sectional schematic shape 201 schematically showing the shape of the substrate G in the A-A cross section (see FIG. 2) and a cross-sectional schematic shape 202 schematically showing the shape of the substrate G in the B-B cross section (see FIG. 2) when step S106 ends. FIG. 6(d) shows a cross-sectional schematic shape 203 schematically showing the shape of the substrate G in the C-C cross section (see FIG. 2) and a cross-sectional schematic shape 204 schematically showing the shape of the substrate G in the D-D cross section (see FIG. 2) when step S106 ends.

[0041] In step S107, the controller 31 starts driving the lift pins 8c of the third group Gr.3 to a predetermined molding position. Here, the predetermined molding position of the lift pins 8c of the third group Gr.3 is the relative height of the lift pins 8c of the third group Gr.3 with respect to the pin (lift pin 8d of the fourth group Gr.4) arranged at the lowest position at the target position, that is, "L offset_4 -L offset_3 ".

[0042] In step S108, the controller 31 stops the lift pins 8c of the third group Gr.3 at a predetermined molding position. Figure 6(e) shows schematic cross-sectional shapes 201 and 202 of the AA cross-section (see Figure 2) of the substrate G at the end of step S108. Figure 6(f) shows schematic cross-sectional shapes 203 and 204 of the CC cross-section (see Figure 2) of the substrate G at the end of step S108.

[0043] Furthermore, in steps S103 to S108, the lift pins 8d of the fourth group Gr.4 do not protrude from the substrate mounting surface 4c of the susceptor 4.

[0044] Through the molding process shown in steps S103 to S108 above, the lift pins 8a to 8d are offset by an amount (L offset_2 , L offset_3 , L offset_4 The shape is formed by applying the following. Furthermore, in the molding process shown in steps S103 to S108, the lift pins 8 with the largest drive amount to the molding position are driven first, and the lift pins 8 with the largest drive amount to the molding position are driven first, and then driven second, and so on. Through this molding process, the substrate G supported by the lift pins 8a to 8d is molded into the desired shape. The molded substrate G is in contact with the substrate mounting surface 4c of the susceptor 4 near the center of its surface.

[0045] In step S109, the controller 31 starts driving all the lift pins 8 from the first group Gr.1 lift pin 8a to the fourth group Gr.4 lift pin 8d to a predetermined target position. As all the lift pins 8 rise simultaneously, the substrate G is raised by the lift pins 8 while maintaining the shape formed in the molding process.

[0046] In step S110, the controller 31 stops all lift pins 8 from the lift pin 8a of the first group Gr.1 to the lift pin 8d of the fourth group Gr.4 at predetermined target positions. Figure 6(g) shows schematic cross-sectional shapes 201 and 202 of the AA cross-section (see Figure 2) and the BB cross-section (see Figure 2) respectively, illustrating the shape of the substrate G at the end of step S110. Figure 6(h) shows schematic cross-sectional shapes 203 and 204 of the CC cross-section (see Figure 2) and the DD cross-section (see Figure 2) respectively, illustrating the shape of the substrate G at the end of step S110.

[0047] The lifting process described in steps S109 to S110 above lifts the substrate G, which was molded in the molding process described in steps S103 to S108, to the target position while maintaining its shape.

[0048] In step S111, the controller 31 lowers the lift pin 8 and places the substrate G on the susceptor 4.

[0049] In step S112, the controller 31 controls the electrostatic chuck 40 to electrostatically attract the substrate G to the susceptor 4.

[0050] In step S113, the controller 31 determines whether the bending of the substrate G placed on the susceptor 4 has been resolved. If the bending has not been resolved (S113 No), the controller 31 returns to step S102 and repeats the reinstallation operation (S102-S112). If the bending has been resolved (S113 Yes), the reinstallation operation of the substrate G is terminated.

[0051] Although the explanation described the process as starting the upward movement of the lift pin 8b of the second group Gr.2 (see S105) after stopping the lift pin 8a of the first group Gr.1 at the molding position (see S104), and then starting the upward movement of the lift pin 8c of the third group Gr.3 (see S105) after stopping the lift pin 8b of the second group Gr.2 at the molding position (see S106), the process is not limited to this.

[0052] For example, the lift pin 8b of the second group Gr.2 may be started to rise before the lift pin 8a of the first group Gr.1 stops at the molding position, and the lift pin 8b of the second group Gr.2 may be controlled to stop at the molding position after the lift pin 8a of the first group Gr.1 stops at the molding position. Alternatively, the lift pin 8c of the third group Gr.3 may be started to rise before the lift pin 8b of the second group Gr.2 stops at the molding position, and the lift pin 8c of the third group Gr.3 may be controlled to stop at the molding position after the lift pin 8b of the second group Gr.2 stops at the molding position.

[0053] Next, the operation of the lift pins during the substrate reinstallation operation of the substrate processing apparatus according to the reference example will be explained using Figure 7. Figure 7 is a time chart showing an example of the operation of the lift pins during the substrate reinstallation operation of the substrate processing apparatus according to the reference example.

[0054] In the substrate processing apparatus according to the reference example, the controller 31 starts driving all the lift pins 8 from the lift pin 8a of the first group Gr.1 to the lift pin 8d of the fourth group Gr.4 to a predetermined molding position.

[0055] Specifically, the lift pins 8a of the first group Gr.1 are driven first, followed by the lift pins 8c of the third group Gr.3. When the lift pins 8c of the third group Gr.3 reach the molding position, the lift pins 8a of the first group Gr.1 and 8b of the second group Gr.2 continue to be driven, while the lift pins 8c of the third group Gr.3 stop being driven. When the lift pins 8b of the second group Gr.2 reach the molding position, the lift pins 8a of the first group Gr.1 continue to be driven, while the lift pins 8b of the second group Gr.2 stop being driven. In other words, the lift pins are stopped sequentially, starting with the lift pins with the smallest drive distance to the molding position. When the lift pins 8a of the first group Gr.1 reach the molding position, the process moves to the lifting process. In the lifting process, all lift pins from the lift pins 8a of the first group Gr.1 to the lift pins 8d of the fourth group Gr.4 are driven to a predetermined target position.

[0056] Figure 8 is an example of a schematic cross-sectional view showing the state of the substrate G lifted by the lift pins 8 in the reference example and this embodiment. Note that Figure 8 schematically shows the relationship between the lift pins 8 and the shape of the substrate G, and does not correspond to the actual arrangement of the lift pins 8.

[0057] Figures 8(a) to 8(c) show the lifting operation of the substrate G in a substrate processing apparatus according to a reference example. In the reference example, the drive is stopped sequentially starting with the lift pins 8, which have a small amount of drive to the molding position. Figure 8(a) shows an example of the state in which the lift pin 8c of the third group Gr.3 is stopped at the molding position. Figure 8(b) shows an example of the state in which the lift pin 8b of the second group Gr.2 is stopped at the molding position. Figure 8(c) shows an example of the state in which the lift pin 8a of the first group Gr.1 is stopped at the molding position.

[0058] In the lifting operation shown in the reference example, from a state where the lift pins 8b of the second group Gr.2, 8c of the third group Gr.3, and 8d of the fourth group Gr.4 are stopped (see Figure 8(b)), the lift pin 8a of the first group Gr.1, which has a large drive amount to the molding position, rises further, causing the substrate G to be lifted as shown in Figure 8(c), and the substrate G to separate from the lift pins 8b, 8c, and 8d, which are stopped. As a result, the actual shape of the substrate G may not be the analyzed shape (shown by the dashed line in Figure 8(c)). In addition, because the shape of the substrate G supported by the lift pins 8 is not the intended shape, bending of the substrate G may occur again when the substrate G is reinstalled on the susceptor 4.

[0059] Figures 8(d) to 8(f) show the lifting operation of the substrate G in the substrate processing apparatus 1 according to this embodiment. In this embodiment, the drive is stopped sequentially from the lift pins 8 that have a large drive amount to the molding position. Figure 8(d) shows an example of the state in which the lift pin 8a of the first group Gr.1 is rising to the molding position. Figure 8(e) shows an example of the state in which the lift pin 8b of the second group Gr.2 is rising to the molding position. Figure 8(f) shows an example of the state in which the lift pin 8c of the third group Gr.3 has stopped at the molding position.

[0060] In the lifting operation shown in this embodiment, by sequentially stopping the drive from the lift pins 8, which have a large drive amount to the molding position, it is possible to prevent the substrate G from separating from the lift pins 8. As a result, the actual shape of the substrate G can be made to match the analyzed shape. Furthermore, when the substrate G is reinstalled on the susceptor 4, bending of the substrate G can be suppressed again. In addition, the number of retries for reinstalling the substrate G can be reduced, and the productivity of the substrate processing apparatus 1 can be improved.

[0061] Although the substrate processing apparatus 1 has been described above, this disclosure is not limited to the embodiments described above, and various modifications and improvements are possible within the scope of the gist of this disclosure as described in the claims. [Explanation of Symbols]

[0062] G board 1. Substrate processing apparatus 2 Chambers 4. Susceptor (mounting platform) 4a Base material 4b Insulating material 4c Substrate mounting surface (mounting surface) 4d placement area 4e,4f center line 7, 7a~7d Through holes 8 Lift Pins 8a Lift pin (first lift pin) 8b Lift pin (2nd lift pin) 8c Lift Pin (3rd Lift Pin) 8d Lift pin (4th lift pin) 9a~9d Drive unit 31 Controller (Control Unit) 40 Electrostatic Chuck

Claims

1. A substrate support method for detaching and supporting a flexible rectangular substrate placed on the mounting surface of a mounting table from the aforementioned mounting surface, The mounting base is equipped with a plurality of lift pins that can protrude from and retract from the mounting surface described above, A step of raising the lift pins to the molding position and molding the shape of the substrate, such that the lift pins with the largest drive amount to the molding position stop at the molding position first, The process includes raising the lift pin to a target position, The amount of drive to the molding position is the difference in relative height between each lift pin and the lowest-positioned lift pin at the target position. The aforementioned lift pin is A first lift pin is provided at the corner of a rectangular mounting area on the mounting surface on which the substrate is placed, A second lift pin is provided in the center of the short side of the aforementioned mounting area, A third lift pin is provided in the center of the long side of the aforementioned mounting area, The mounting area has a fourth lift pin provided in the center of the surface, The process of molding the aforementioned substrate is as follows: A step of starting the drive of the first lift pin and raising it to the molding position, A step of stopping the first lift pin at the molding position, A step of starting the drive of the second lift pin and raising it to the molding position, After the first lift pin has stopped, the second lift pin is stopped at the molding position. A step of starting the drive of the third lift pin and raising it to the molding position, The process includes the step of stopping the third lift pin at the molding position after the second lift pin has stopped. Board support method.

2. The step of raising the second lift pin to the molding position involves starting the drive of the second lift pin after the first lift pin has stopped. The step of raising the third lift pin to the molding position is to start driving the third lift pin after the second lift pin has stopped. The substrate support method according to claim 1.

3. In the process of molding the aforementioned substrate, The fourth lift pin does not protrude from the mounting surface described above. A substrate support method according to claim 1 or claim 2.

4. The substrate is a glass substrate used in the manufacture of flat panel displays. A substrate support method according to any one of claims 1 to 3.

5. A mounting platform on which a flexible rectangular substrate is placed on the mounting surface, Multiple lift pins that can protrude from and retract from the aforementioned mounting surface, The system includes a control unit that controls the raising and lowering of the lift pin, The control unit, The lift pins are raised to the molding position and the shape of the substrate is formed so that the lift pins with the largest drive distance to the molding position stop at the molding position first. The lift pin is configured to raise to the target position. The amount of drive to the molding position is the difference in relative height between each lift pin and the lowest-positioned lift pin at the target position. The aforementioned lift pin is A first lift pin is provided at the corner of a rectangular mounting area on the mounting surface on which the substrate is placed, A second lift pin is provided in the center of the short side of the aforementioned mounting area, A third lift pin is provided in the center of the long side of the aforementioned mounting area, The mounting area has a fourth lift pin provided in the center of the surface, The control unit, when forming the shape of the substrate, The first lift pin is driven to raise it to the molding position, The first lift pin is stopped at the molding position, The second lift pin is driven to raise it to the molding position, After the first lift pin has stopped, the second lift pin is stopped at the molding position. The third lift pin is driven to raise it to the molding position, The configuration is such that the third lift pin stops at the molding position after the second lift pin has stopped. Circuit board processing equipment.

Images