Wiring circuit board and method for manufacturing the same

Abstract

To provide a wiring circuit board with high adhesion between an insulating layer and a metal support layer, excellent rigidity and heat dissipation, and a method for manufacturing the same.SOLUTION: A wiring circuit board 1 has a metal support layer 5, an adhesive layer 6, a base insulating layer 7, and a conductor pattern 8 in order in the direction of thickness. The tensile strength of the metal support layer 5 at 23°C is 100 MPa or more. The thermal conductivity of the metal support layer 5 is 30 W / m K or more. A method for manufacturing the wiring circuit board 1 has a first process and a second process. In the first process, the conductor plate 85 is formed into a conductor pattern 8 by a subtractive method. In the second process, the metal plate 55, whose tensile strength at 23°C is 100 MPa or more and whose thermal conductivity is 30 W / m K or more, and the insulating plate 75 in the laminate 91 with the insulating plate 75 and the conductor pattern 8 are bonded via the adhesive sheet 65.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a wiring circuit board and a method for manufacturing the same. [Background technology]

[0002] A wiring circuit board is known that has a metal support layer, an insulating layer, and a conductor pattern arranged in order in the thickness direction (see, for example, Patent Document 1 below). In the wiring circuit board of Patent Document 1, the insulating layer is in contact with one side of the metal support layer in the thickness direction. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2019-212656 [Overview of the project] [Problems that the invention aims to solve]

[0004] In the wiring circuit board described in Patent Document 1, the adhesion between the metal support layer and the insulating layer is low.

[0005] It is proposed to place an adhesive layer between the metal support layer and the insulating layer to increase the adhesion strength described above.

[0006] Adhesive layers typically have a high coefficient of thermal expansion, which can lead to a decrease in the rigidity of the wiring circuit board when heated.

[0007] On the other hand, since the adhesive layer is placed between the conductor pattern and the metal support layer, there is a problem in that it cannot efficiently dissipate heat from the conductor pattern to the metal support layer.

[0008] The present invention provides a wiring circuit board and a method for manufacturing the same, which have high adhesion between the metal support layer and the insulating layer, and excellent rigidity and heat dissipation. [Means for solving the problem]

[0009] The present invention (1) includes a wiring circuit board comprising, in order in the thickness direction, a metal support layer, an adhesive layer, an insulating layer, and a conductor pattern, wherein the tensile strength of the metal support layer at 23°C is 100 MPa or more, and the thermal conductivity of the metal support layer is 30 W / m·K or more.

[0010] In this wiring circuit board, an adhesive layer is interposed between the metal support layer and the insulating layer. Therefore, the adhesion between the metal support layer and the insulating layer is high.

[0011] Furthermore, since the tensile strength of the metal support layer at 23°C is 100 MPa or more, the wiring circuit board exhibits excellent rigidity.

[0012] Furthermore, since the thermal conductivity of the metal support layer is 30 W / m·K or higher, the wiring circuit board has excellent heat dissipation properties.

[0013] Therefore, the wiring circuit board has high adhesion between the metal support layer and the insulating layer, resulting in excellent rigidity and heat dissipation.

[0014] The present invention (2) includes the wiring circuit board described in (1), wherein the insulating layer has insulating through holes, and the adhesive layer has adhesive through holes that overlap the insulating through holes when projected in the thickness direction.

[0015] The present invention (3) includes the wiring circuit board described in (2), further comprising conductive members disposed within the insulating through-holes and the adhesive through-holes.

[0016] The present invention (4) includes the wiring circuit board described in (2), further comprising a conductive member and a second conductor pattern disposed within the adhesive through-hole, and a connecting member disposed within the insulating through-hole and electrically connecting the conductor pattern and the second conductor pattern.

[0017] The present invention (5) includes a plurality of wiring bodies arranged in parallel at intervals from each other. Each of the plurality of wiring bodies includes an insulating portion included in the insulating layer, an adhesive portion included in the adhesive layer, which is arranged on one surface in the thickness direction of the insulating portion, a wiring portion included in the conductor pattern, which is arranged on one surface in the thickness direction of the adhesive portion, and a metal support portion included in the metal support layer, which is arranged on the other surface in the thickness direction of the insulating portion. The ratio (T / W) of the thickness direction length T to the length W in the parallel direction of the plurality of wiring bodies is 2 or more. The present invention includes the wiring circuit board according to any one of (1) to (4).

[0018] Since the ratio (T / W) is as high as 2 or more, the contact area between the metal support portion and air can be increased. Therefore, the heat dissipation efficiency based on convection is excellent.

[0019] Furthermore, since the aspect ratio (T / W) of the metal support portion is as high as 2 or more, the heat conducted from the wiring portion to the wiring body insulating portion can be efficiently released toward the metal support portion through the adhesive portion.

[0020] Therefore, the wiring circuit board is excellent in heat dissipation in the wiring body.

[0021] The present invention (6) includes the wiring circuit board according to (5), in which one of the metal support portions has an inner surface facing another metal support portion adjacent to the one metal support portion in the parallel direction, and the area of the inner surface is not less than the projected area when the inner surface is projected in the parallel direction. <l

[0022] The present invention (7) includes the wiring circuit board according to (5) or (6), which includes a connecting body that connects the orthogonal direction ends of the plurality of wiring bodies in the orthogonal direction perpendicular to the parallel direction and the thickness direction. The connecting body includes a terminal portion included in the conductor pattern, which is continuous with the orthogonal direction end of the wiring portion, and a connecting metal portion included in the metal support layer, which is continuous with the orthogonal direction end of the metal support portion. The connecting metal portion is continuous in the parallel direction so as to include the plurality of terminal portions when projected in the thickness direction.

[0023] In the wiring circuit board, when projected in the thickness direction, the connecting metal part is continuous in the short side direction so as to include a plurality of terminal parts, so that the plurality of terminal parts can be reliably supported.

[0024] The present invention (8) includes a step of preparing a multilayer base material including an insulating board and a conductor board disposed on at least one surface of the insulating board in the thickness direction, a step of forming a conductor pattern on the conductor board by a subtractive method, a metal plate having a tensile strength of 100 MPa or more and a thermal conductivity of 30 W / m·K or more at 23°C or a metal support layer formed from the metal plate, and the insulating board, and bonding them via an adhesive sheet or an adhesive layer formed from the adhesive sheet, a step of patterning the metal plate to form the metal support layer, a step of patterning the adhesive sheet to form the adhesive layer, and a step of patterning the insulating board to form an insulating layer.

Effect of the Invention

[0025] The wiring circuit board obtained by the manufacturing method of the present invention has high adhesion between the metal support layer and the insulating layer, and is excellent in rigidity and heat dissipation.

Brief Description of the Drawings

[0026] [Figure 1] FIG. 1 is a plan view of a first embodiment of the wiring circuit board of the present invention. [Figure 2] FIGS. 2A and 2B are cross-sectional views of the wiring circuit board shown in FIG. 1. FIG. 2A is a cross-sectional view taken along line A-A of FIG. 1. FIG. 2B is a cross-sectional view taken along line B-B of FIG. 1. [Figure 3] FIGS. 3A to 3H are process diagrams of the manufacturing method of the wiring circuit board shown in FIG. 2B. FIGS. 3A to 3E are the first step. FIG. 3A is a step of preparing a two-layer base material. FIG. 3B is a step of forming an etching resist. FIG. 3C is a step of etching the conductor board. FIG. 3D is a step of removing the etching resist. FIG. 3E is a step of forming a cover insulating layer. FIG. 3F is the second step. FIG. 3G is the third step. FIG. 3H is the fourth step. [Figure 4] Figures 4A to 4D are process diagrams for the manufacturing method of the wiring circuit board according to the second embodiment. Figure 4A shows the process of preparing the metal support layer. Figure 4B shows the process of placing the adhesive sheet on the metal support layer. Figure 4C is the second step. Figure 4D is the fourth step. [Figure 5] Figures 5A to 5D are process diagrams for the manufacturing method of the wiring circuit board according to the third embodiment. Figure 5A shows the process of preparing the adhesive layer. Figure 5B shows the process of placing the adhesive layer on the metal support layer. Figure 5C is the second step. Figure 5D is the fourth step. [Figure 6] Figures 6A and 6B show a wiring circuit board of the fourth embodiment. Figure 6A is a cross-sectional view of the first connecting body. Figure 6B is a cross-sectional view of the wiring body. [Figure 7] Figure 7 is a process diagram of the manufacturing method for the wiring circuit board shown in Figure 6B. Figures 7A to 7E represent the first step. Figure 7A is the step of preparing the three-layer substrate. Figure 7B is the step of forming the etching resist and the second etching resist. Figure 7C is the step of etching the conductor plate and the second conductor plate. Figure 7D is the step of removing the etching resist and the second etching resist. Figure 7E is the step of forming the cover insulating layer. Figure 7F is the second step. Figure 7G is the third step. Figure 7H is the fourth step. [Figure 8] Figure 8 is a cross-sectional view of a modified example of the fourth embodiment. [Modes for carrying out the invention]

[0027] <First Embodiment of Wiring Circuit Board> A first embodiment of the wiring circuit board of the present invention will be described with reference to Figures 1 to 2B.

[0028] <Overall configuration of wiring circuit board 1> As shown in Figures 2A and 2B, the wiring circuit board 1 has one side and the other side in the thickness direction. The wiring circuit board 1 has a substantially plate shape. As shown in Figure 1, the wiring circuit board 1 extends in the longitudinal direction. The longitudinal direction is perpendicular to the thickness direction. The wiring circuit board 1 integrally comprises a first connector 2A as an example of a connector, a second connector 2B as an example of a connector, and a wiring body 3. Preferably, the wiring circuit board 1 comprises only the first connector 2A, the second connector 2B, and the wiring body 3.

[0029] The first connecting body 2A forms one end of the wiring circuit board 1 in the longitudinal direction. The first connecting body 2A has a substantially rectangular flat plate shape in plan view. The dimensions of the first connecting body 2A in plan view are not particularly limited.

[0030] The second connector 2B forms the other end of the wiring circuit board 1 in the longitudinal direction. The second connector 2B is positioned opposite the first connector 2A on the other side in the longitudinal direction, separated by the wiring 3. The second connecting body 2B has a substantially rectangular flat plate shape in plan view. The dimensions of the second connecting body 2B in plan view are not particularly limited.

[0031] The wiring body 3 forms the longitudinal middle portion of the wiring circuit board 1. In a plan view, the wiring body 3 is positioned between the first connector 2A and the second connector 2B. The wiring body 3 has a shape that extends in the longitudinal direction. The wiring body 3 bridges the first connector 2A and the second connector 2B in the longitudinal direction. In addition, multiple wiring bodies 3 are arranged in parallel at intervals from each other in the short direction of the wiring circuit board 1. The short direction is perpendicular to the longitudinal direction and the thickness direction. The short direction is also an example of the parallel direction of the wiring bodies 3. An opening 4 is formed between adjacent wiring bodies 3.

[0032] The opening 4 separates, for example, adjacent wiring bodies 3 in the short-side direction of the wiring circuit board 1. The opening 4 has a slit shape that extends in the longitudinal direction. The opening 4 penetrates the wiring circuit board 1 in the thickness direction.

[0033] The longitudinal ends of multiple wiring units 3 are connected in the short direction by a single first connector 2A. Thus, the longitudinal ends of multiple wiring units 3 are bundled together by the single first connector 2A.

[0034] The other ends of the multiple wiring bodies 3 in the longitudinal direction are connected in the short direction by a single second connector 2B. Thus, the other ends of the multiple wiring bodies 3 in the longitudinal direction are bundled together by a single second connector 2B.

[0035] The longitudinal length of the wiring assembly 3 is set appropriately according to the application and purpose.

[0036] The short-side length of each of the multiple wiring bodies 3 is, for example, 500 μm or less, preferably 300 μm or less, more preferably 100 μm or less, and also, for example, 10 μm or more. The short-side length of the opening 4 is, for example, 10 μm or more, preferably 50 μm or more, more preferably 100 μm or more, and also, for example, 1000 μm or less. The ratio of the short-side length of the wiring bodies 3 to the short-side length of the opening 4 is, for example, 40 or less, preferably 10 or less, and also, for example, 0.1 or more, preferably 0.5 or more. The thickness of the wiring body 3 is, for example, 10 μm or more, preferably 100 μm or more, and also, for example, 10 mm or less, preferably 1 mm or less. The thickness of the wiring circuit board 1 is the same as the thickness of the wiring body 3 described above.

[0037] <Layer structure of wiring circuit board 1> As shown in Figures 2A and 2B, the wiring circuit board 1 comprises a metal support layer 5, an adhesive layer 6, a base insulating layer 7 as an example of an insulating layer, and a conductor pattern 8. The wiring circuit board 1 further comprises a cover insulating layer 9 (see Figure 2B) and a conductive member 10 (see Figure 2A). The wiring circuit board 1 preferably comprises only a metal support layer 5, an adhesive layer 6, a base insulating layer 7, a conductor pattern 8, a cover insulating layer 9, and a conductive member 10.

[0038] <Metal support layer 5> The metal support layer 5 forms the other surface in the thickness direction of the wiring circuit board 1. As shown in Figures 1 to 2B, the metal support layer 5 is included in the first connector 2A, the second connector 2B, and the wiring 3. In the metal support layer 5, the portion that forms the first connector 2A is the first connecting metal part 51A (see Figure 2A), which is an example of a connecting metal part. In the metal support layer 5, the portion that forms the second connector 2B is the second connecting metal part 51B (see Figure 1), which is an example of a connecting metal part. In the metal support layer 5, the portion that forms the wiring body 3 is the wiring body metal portion 52 (see Figure 2B), which is an example of a support portion.

[0039] The first connecting metal portion 51A has a substantially flat shape that is continuous in the shorter direction, as seen in plan view, and includes the first terminal portion 81A, which will be described later.

[0040] The second connecting metal portion 51B has a substantially flat shape that is continuous in the shorter direction, as seen in plan view, and includes the second terminal portion 81B, which will be described later.

[0041] As shown in Figure 2B, the wiring body metal portion 52 has a roughly rectangular shape that is longer in the thickness direction when viewed as a cross-section (synonymous with a cross-sectional view) when cut along the thickness direction and the short side direction.

[0042] The wiring body metal portion 52 is provided with a metal inner surface 53. The metal inner surface 53 faces the opening 4. The metal inner surface 53 of one wiring body metal portion 52 faces another wiring body metal portion 52 adjacent to that wiring body metal portion 52 in the short direction. Two metal inner surfaces 53 that face each other across the opening 4 are parallel. In this embodiment, the metal inner surface 53 is a flat surface. The area S0 of the metal inner surface 53 is the same as the projected area S1 when the metal inner surface 53 is projected in the short direction, since the wiring body metal portion 52 has a roughly rectangular cross-section. The area S0 of the metal inner surface 53 is the value obtained by multiplying the thickness T of the metal support layer 5, which will be described next, by its length in the longitudinal direction.

[0043] The thickness T of the metal support layer 5 is, for example, 30 μm or more, preferably 50 μm or more, preferably 75 μm or more, and more preferably 100 μm or more. Alternatively, the thickness T of the metal support layer 5 is, for example, 1000 μm or less, preferably 500 μm or less.

[0044] The length W in the short direction of the metal part 52 of the wiring body is appropriately selected from the range exemplified by the length in the short direction of the wiring body 3 described above. Specifically, the length W in the short direction of the wiring body 3 is, for example, 500 μm or less, preferably 300 μm or less, more preferably 100 μm or less, and also, for example, 10 μm or more.

[0045] Furthermore, the ratio (T / W) of the thickness T of the wiring body metal part 52 to the length W in the short direction of the wiring body metal part 52 is, for example, 1.5 or more, preferably 2 or more, more preferably 2.5 or more, even more preferably 3 or more, and particularly preferably 3.5 or more, and also, for example, 1000 or less, and even more preferably 100 or less. Note that the ratio (T / W) corresponds to the aspect ratio of the cross-section obtained by cutting the wiring body metal part 52 along the thickness direction and the short direction.

[0046] If the aspect ratio (T / W) is above the lower limit mentioned above, the heat generated in the main wiring section 83 (described later) of the wiring body 3 can be efficiently released using the air at the opening 4.

[0047] The thicknesses of the first connecting body 2A and the second connecting body 2B are, for example, the same as the thickness T of the wiring body metal part 52.

[0048] The material of the metal support layer 5 is a metal. Examples of metals include metallic elements classified into groups 1 to 16 of the periodic table (IUPAC, 2018), and alloys containing two or more of these metallic elements. The metal may be either a transition metal or a typical metal. More specifically, examples of metals include group 2, group 4, group 5, group 6, group 7, group 8, group 9, group 10, group 11, group 12, group 13, and group 14 metallic elements. An example of a group 2 metallic element is calcium. Examples of group 4 metallic elements are titanium and zirconium. An example of a group 5 metallic element is vanadium. Examples of group 6 metallic elements are chromium, molybdenum, and tungsten. An example of a group 7 metallic element is manganese. An example of a group 8 metallic element is iron. Examples of Group 9 metallic elements include cobalt. Examples of Group 10 metallic elements include nickel and platinum. Examples of Group 11 metallic elements include copper, silver, and gold. Examples of Group 12 metallic elements include zinc. Examples of Group 13 metallic elements include aluminum and gallium. Examples of Group 14 metallic elements include germanium and tin. These can be used individually or in combination. From the viewpoint of obtaining the high thermal conductivity described below, preferred metals are Group 11 metallic elements, and more preferably copper and copper alloys.

[0049] The thermal conductivity of the metal support layer 5 is 30 W / m·K or higher. In the wiring circuit board 1, since the thermal conductivity of the metal support layer 5 is 30 W / m·K or higher, even if the adhesive layer 6 is interposed between the metal support layer 5 and the conductor pattern 8, the metal support layer 5 can efficiently dissipate the heat generated by the conductor pattern 8.

[0050] The thermal conductivity of the metal support layer 5 is preferably 35 W / m·K or higher, more preferably 40 W / m·K or higher, even more preferably 45 W / m·K or higher, and particularly preferably 50 W / m·K or higher. If the thermal conductivity of the metal support layer 5 is above the lower limit mentioned above, the metal support layer 5 can efficiently dissipate the heat mentioned above.

[0051] The upper limit of the thermal conductivity of the metal support layer 5 is not limited. For example, the upper limit of the thermal conductivity of the metal support layer 5 is 350 W / m·K, or for example, 100 W / m·K.

[0052] The thermal conductivity of the metal support layer 5 is determined according to JIS H 7903:2008 (Method for measuring effective thermal conductivity).

[0053] The tensile strength of the metal support layer 5 at 23°C is 100 MPa or more. Since the tensile strength of the metal support layer 5 at 23°C is 100 MPa or more, the wiring circuit board 1 has excellent rigidity.

[0054] The tensile strength of the metal support layer 5 at 23°C is preferably 150 MPa or more, more preferably 200 MPa or more, even more preferably 500 MPa or more, and particularly preferably 1,000 MPa or more. If the tensile strength of the metal support layer 5 at 23°C is above the lower limit described above, the wiring circuit board 1 will have excellent rigidity.

[0055] The lower limit of the tensile strength of the metal support layer 5 at 23°C is not limited. For example, the lower limit of the tensile strength of the metal support layer 5 at 23°C is 1 MPa, or even 10 MPa.

[0056] The tensile strength of the metal support layer 5 at 23°C is determined according to JIS Z2241:2011.

[0057] <Adhesive layer 6> The adhesive layer 6 is positioned on one side of the metal support layer 5 in the thickness direction. The adhesive layer 6 is in contact with one side of the metal support layer 5 in the thickness direction. The adhesive layer 6 has a sheet shape. The adhesive layer 6 has an external shape corresponding to the first connector 2A, the second connector 2B, and the wiring body 3. In the adhesive layer 6, the portion included in the first connector 2A is the first connecting adhesive portion 61A (see Figure 2A). In the adhesive layer 6, the portion included in the second connector 2B is the second connecting adhesive portion 61B (see Figure 1). In the adhesive layer 6, the portion included in the wiring body 3 is the wiring body adhesive portion 62 (see Figure 2B), which is an example of an adhesive portion.

[0058] The first connecting adhesive portion 61A is positioned on one side of the first connecting metal portion 51A in the thickness direction. The first connecting adhesive portion 61A contacts one side of the first connecting metal portion 51A in the thickness direction. The first connecting adhesive portion 61A is larger than the first connecting metal portion 51A when projected, for example, in the thickness direction. Specifically, both widthwise portions of the first connecting adhesive portion 61A protrude toward both sides in the width direction relative to the first connecting metal portion 51A. The first connecting adhesive portion 61A has an adhesive through-hole 63. The shape of the adhesive through-hole 63 in plan view is not limited. The adhesive through-hole 63 penetrates the first connecting adhesive portion 61A in the thickness direction.

[0059] The second connecting adhesive portion 61B is positioned on one side of the second connecting metal portion 51B in the thickness direction. The second connecting adhesive portion 61B contacts one side of the second connecting metal portion 51B in the thickness direction. When projected in the thickness direction, the second connecting adhesive portion 61B is larger than the second connecting metal portion 51B. Specifically, both sides of the second connecting adhesive portion 61B in the width direction protrude toward both sides of the second connecting metal portion 51B.

[0060] The wiring adhesive portion 62 is located on one side of the wiring metal portion 52 in the thickness direction. The wiring adhesive portion 62 is larger than the wiring metal portion 52 when projected in the thickness direction, for example.

[0061] Examples of materials for the adhesive layer 6 include adhesive compositions. Examples of adhesive compositions include curable adhesive compositions and thermoplastic adhesive compositions. The type of adhesive composition is not limited. If the adhesive composition is a curable adhesive composition, the adhesive layer 6 consists of a cured body of the curable adhesive composition. Examples of adhesive compositions include epoxy adhesive compositions, silicone adhesive compositions, urethane adhesive compositions, and acrylic adhesive compositions.

[0062] In this embodiment, the adhesive layer 6 is insulating. In other words, the adhesive layer is non-conductive. That is, the adhesive layer 6 consists only of insulating regions. Specifically, the volume resistivity of the adhesive layer 6 (insulating region) is, for example, 1 × 10⁻⁶. 5 Ωcm or more, preferably 1 × 10⁻⁶ 6 Ωcm or more, more preferably 1 × 10⁻⁶ 7 It is greater than or equal to Ωcm, and also, for example, 1 × 10 18 It is less than or equal to Ωcm. The volume resistivity is determined according to JIS C 2139-3-1.

[0063] The thermal conductivity of the adhesive layer 6 is relatively low, for example, lower than that of the metal support layer 5. Specifically, the thermal conductivity of the adhesive layer 6 is, for example, 1 W / m·K or less, preferably 0.5 W / m·K or less, and also, for example, 0.01 W / m·K or more, preferably 0.001 W / m·K or more. The thermal conductivity of the adhesive layer 6 is determined according to JIS A 1412 (Method for measuring the thermal conductivity of thermal insulating materials).

[0064] The coefficient of thermal expansion of the adhesive layer 6 is relatively high. For example, the coefficient of thermal expansion of the adhesive layer 6 is 10 ppm / °C or higher, more specifically 20 ppm / °C or higher, more specifically 30 ppm / °C or higher, and also, for example, 100 ppm / °C or lower. The coefficient of thermal expansion of the adhesive layer 6 is determined according to JIS K7197:2012.

[0065] The thickness of the adhesive layer 6 is, for example, 1 μm or more, preferably 10 μm or more, and also, for example, 10,000 μm or less, preferably 1,000 μm or less.

[0066] The opening area of ​​the adhesive through-hole 63 is, for example, 10 μm. 2 Preferably, 100 μm 2 That's all, and also, for example, 1,000 mm 2 Preferably, 100 mm 2 The following applies:

[0067] <Base insulating layer 7> The base insulating layer 7 is positioned on one side of the adhesive layer 6 in the thickness direction. Specifically, the base insulating layer 7 is in contact with the entire surface of one side of the adhesive layer 6 in the thickness direction. The base insulating layer 7 has an external shape corresponding to the first connector 2A, the second connector 2B, and the wiring body 3. The base insulating layer 7 has the same external shape as the adhesive layer 6. In the base insulating layer 7, the portion included in the first connector 2A is the first connecting base portion 71A (see Figure 2A). In the base insulating layer 7, the portion included in the second connector 2B is the second connecting base portion 71B (see Figure 1). In the base insulating layer 7, the portion included in the wiring body 3 is the wiring body base portion 72 (see Figure 2B), which is an example of an insulating portion.

[0068] The first connecting base portion 71A is positioned on one side of the first connecting adhesive portion 61A in the thickness direction. The first connecting base portion 71A is in contact with one side of the first connecting adhesive portion 61A in the thickness direction. Specifically, the first connecting base portion 71A is bonded to one side of the first connecting adhesive portion 61A in the thickness direction. When projected in the thickness direction, the first connecting base portion 71A has the same external shape as the first connecting adhesive portion 61A. The first connecting base portion 71A has an insulating through-hole 73 as an insulating through-hole.

[0069] The shape of the insulating through-hole 73 in plan view is not limited. The insulating through-hole 73 penetrates the first connecting base portion 71A in the thickness direction. When projected in the thickness direction, the insulating through-hole 73 overlaps with the adhesive through-hole 63. In plan view, the insulating through-hole 73 has the same shape as the adhesive through-hole 63. The inner circumferential surface separating the insulating through-hole 73 and the inner circumferential surface separating the adhesive through-hole 63 are flush in the thickness direction.

[0070] The second connecting base portion 71B is positioned on one side of the second connecting adhesive portion 61B in the thickness direction. The second connecting base portion 71B is in contact with one side of the second connecting adhesive portion 61B in the thickness direction. Specifically, the second connecting base portion 71B is bonded to one side of the second connecting adhesive portion 61B in the thickness direction.

[0071] The wiring base portion 72 is positioned on one side of the wiring adhesive portion 62 in the thickness direction. The wiring base portion 72 is in contact with one side of the wiring adhesive portion 62 in the thickness direction. The wiring base portion 72 is bonded to one side of the wiring adhesive portion 62 in the thickness direction.

[0072] The thickness of the base insulating layer 7 is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less.

[0073] Examples of materials for the base insulating layer 7 include insulating resins. Examples of insulating resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0074] Furthermore, the thermal conductivity of the base insulating layer 7 is lower than that of the metal support layer 5. The thermal conductivity of the base insulating layer 7 is, for example, 1 W / m·K or less, more preferably 0.5 W / m·K or less, and also, for example, 0.01 W / m·K or more, preferably 0.1 W / m·K or more. The thermal conductivity of the base insulating layer 7 is determined according to JIS A 1412 (Method for measuring the thermal conductivity of thermal insulating materials).

[0075] <Conductor Pattern 8> The conductor pattern 8 is arranged on one side of the base insulating layer 7 in the thickness direction. Specifically, the conductor pattern 8 is arranged on one side in the thickness direction of the first connecting base portion 71A, the second connecting base portion 71B, and the wiring body base portion 72.

[0076] In the conductor pattern 8, the portion included in the first connector 2A is the first terminal portion 81A (see Figure 2A) and the first auxiliary wiring portion 82A (see Figure 1). In the conductor pattern 8, the portion included in the second connector 2B is the second terminal portion 81B and the second auxiliary wiring portion 82B (see Figure 1). In the conductor pattern 8, the portion included in the wiring body 3 is the main wiring portion 83, which is an example of a wiring portion.

[0077] The first terminal portion 81A is located on one side of the first connecting base portion 71A in the thickness direction. The first terminal portion 81A is located on one side of the first connecting base portion 71A in the longitudinal direction. Multiple first terminal portions 81A are arranged within the first connecting body 2A, corresponding to multiple wiring bodies 3, and spaced apart in the short direction of the wiring circuit board 1. When projected in the thickness direction, the first terminal portion 81A is included in the first connecting metal portion 51A. The first terminal portion 81A has, for example, a substantially rectangular shape (corner land shape) in plan view.

[0078] One of the multiple first terminal portions 81A includes an adhesive through-hole 63 and an insulating through-hole 73 when projected in the thickness direction. A portion of the other surface of one of the multiple first terminal portions 81A in the thickness direction contacts the conductive member 10.

[0079] The first auxiliary wiring section 82A is arranged on one side in the thickness direction of the first connecting base section 71A. Multiple first auxiliary wiring sections 82A are arranged corresponding to each of the multiple wiring bodies 3 and the multiple first terminal sections 81A corresponding to them. The first auxiliary wiring section 82A is continuous with the first terminal section 81A. The first auxiliary wiring section 82A extends from the other end edge in the longitudinal direction of the first terminal section 81A toward the other side in the longitudinal direction. The first auxiliary wiring section 82A has a substantially straight shape in plan view.

[0080] The second terminal portion 81B is located on one side of the second connecting base portion 71B in the thickness direction. The second terminal portion 81B is located on the other side of the second connecting base portion 71B in the longitudinal direction. Multiple second terminal portions 81B are arranged within the second connecting body 2B, corresponding to multiple wiring bodies 3, and spaced apart in the short direction of the wiring circuit board 1. When projected in the thickness direction, the second terminal portion 81B is included in the second connecting metal portion 51B. In plan view, the second terminal portion 81B has a substantially rectangular shape (corner land shape).

[0081] The second auxiliary wiring section 82B is arranged on one side in the thickness direction of the second connecting base section 71B. Multiple second auxiliary wiring sections 82B are arranged corresponding to each of the multiple wiring bodies 3 and the multiple second terminal sections 81B corresponding to them. The second auxiliary wiring section 82B is continuous with the second terminal section 81B. The second auxiliary wiring section 82B extends from one end edge in the longitudinal direction of the second terminal section 81B toward one side in the longitudinal direction. The second auxiliary wiring section 82B has a substantially straight shape in plan view.

[0082] The main wiring section 83 is located on one side of the wiring body base section 72 in the thickness direction. Specifically, each of the multiple main wiring sections 83 is located approximately in the center of the shorter side of each of the multiple wiring body base sections 72. When projected in the thickness direction, the main wiring section 83 is contained within the wiring body base section 72.

[0083] The main wiring section 83 is provided in a one-to-one correspondence with the wiring body base section 72 (or the wiring body metal section 52, or the wiring body adhesive section 62). When projected in the thickness direction, the main wiring section 83 is positioned inward from both ends of the wiring body base section 72 in the width direction.

[0084] Furthermore, one longitudinal edge of the main wiring section 83 is continuous with the other longitudinal edge of the first auxiliary wiring section 82A. The other longitudinal edge of the main wiring section 83 is continuous with one longitudinal edge of the second auxiliary wiring section 82B. As a result, the main wiring section 83, together with the first auxiliary wiring section 82A and the second auxiliary wiring section 82B, forms a substantially straight shape in plan view that extends in the longitudinal direction, connecting the first terminal section 81A and the second terminal section 81B in the longitudinal direction.

[0085] The length of the main wiring section 83 in the short direction is, for example, the same as the length of the first auxiliary wiring section 82A and the second auxiliary wiring section 82B in the short direction.

[0086] Examples of materials for the conductor pattern 8 include conductors. Examples of conductors include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. Preferably, copper is used from the viewpoint of obtaining good electrical properties.

[0087] The thickness of the conductor pattern 8 is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 50 μm or less, preferably 30 μm or less.

[0088] Furthermore, the length of the main wiring section 83 in the shorter direction is, for example, 200 μm or less, preferably 100 μm or less, and also, for example, 1 μm or more, preferably 5 μm or more.

[0089] <Cover insulating layer 9> As shown in Figure 2B, the cover insulating layer 9 is positioned on one side in the thickness direction of the base insulating layer 7. The cover insulating layer 9 covers the main wiring section 83, the first auxiliary wiring section 82A, and the second auxiliary wiring section 82B. Specifically, the cover insulating layer 9 covers one side in the thickness direction and the outer peripheral surface of each of the main wiring section 83, the first auxiliary wiring section 82A, and the second auxiliary wiring section 82B. The cover insulating layer 9 exposes the first terminal section 81A and the second terminal section 81B.

[0090] The thickness of the cover insulating layer 9 is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less.

[0091] Examples of materials for the cover insulating layer 9 include insulating resins. Examples of insulating resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The insulating resin also contains solder resist.

[0092] The metal support layer 5, adhesive layer 6, base insulating layer 7, and cover insulating layer 9 described above all share an opening 4.

[0093] <Conductive member 10> As shown in Figure 2A, the conductive member 10 is positioned within the adhesive through-hole 63 and the insulating through-hole 73. The conductive member 10 extends in the thickness direction. The other end of the conductive member 10 in the thickness direction contacts the first connecting metal portion 51A. One end of the conductive member 10 in the thickness direction contacts the first terminal portion 81A. As a result, the conductive member 10 electrically connects the first connecting metal portion 51A and the first terminal portion 81A.

[0094] Examples of materials for the conductive member 10 include solder, anisotropic conductive paste (ACP), and anisotropic conductive film (ACF). The conductors mentioned above are also examples of materials for the conductive member 10.

[0095] In this embodiment, the conductive member 10 does not have adhesive properties. In other words, the material of the conductive member 10 does not contain the adhesive composition described above.

[0096] <Manufacturing method for wiring circuit board 1> Next, the manufacturing method of the wiring circuit board 1 will be explained with reference to Figures 3A to 3H.

[0097] The method for manufacturing the wiring circuit board 1 comprises a first step, a second step, a third step, and a fourth step. In this method, the first step, the second step, the third step, and the fourth step are carried out in order.

[0098] <1st process> As shown in Figures 3A to 3E, the first step is to prepare the laminate 91. As shown in Figure 3E, the laminate 91 is provided with an insulating board 75, a conductor pattern 8, and a cover insulating layer 9 in order toward one side in the thickness direction.

[0099] To prepare the laminated board 91, first, a two-layer substrate 92 is prepared as shown in Figure 3A. The two-layer substrate 92, as an example of a multilayer substrate, is provided with an insulating plate 75 and a conductor plate 85 in order toward one side in the thickness direction. The insulating plate 75 is an insulating material for forming the base insulating layer 7. In the laminated board 91, the insulating board 75 does not yet have the opening 4 described above. The conductor board 85 is arranged on one side in the thickness direction of the insulating board 75. The conductor board 85 is in contact with the entire surface of one side in the thickness direction of the insulating board 75. The conductor board 85 is a conductor material for forming the conductor pattern 8. The conductor board 85 does not yet have the pattern described above.

[0100] Next, as shown in Figures 3B to 3E, the conductive plate 85 is formed into a conductive pattern 8 by the subtractive method.

[0101] Specifically, as shown in Figure 3B, first, an etching resist 90 is formed on one side of the thickness direction of the conductive plate 85 by photolithography. The etching resist 90 has the same pattern as the conductive pattern 8.

[0102] Next, as shown in Figure 3C, the conductive plate 85 exposed from the etching resist 90 is removed by etching. This forms the conductive pattern 8 from the conductive plate 85.

[0103] Next, as shown in Figure 3D, the etching resist 90 is removed.

[0104] Subsequently, as shown in Figure 3E, the cover insulating layer 9 is formed on one side of the insulating plate 75 in the thickness direction, covering a portion of the conductor pattern 8. For example, a varnish containing an insulating resin is applied to the insulating plate 75 and the conductor pattern 8, and then exposed and developed to form a cover insulating layer 9 having a predetermined pattern.

[0105] Subsequently, insulating through-holes 73 (see Figure 2A) are formed in the insulating plate 75.

[0106] This prepares the laminated board 91.

[0107] <Second process> As shown in Figure 3F, in the second step, the metal plate 55 and the insulating plate 75 in the laminate 91 are bonded together via the adhesive sheet 65.

[0108] The metal plate 55 is a metal material for forming the metal support layer 5 described above. The metal plate 55 does not yet have an opening 4. The metal plate 55 has the same thermal conductivity and tensile strength as the metal support layer 5 described above.

[0109] The adhesive sheet 65 is a sheet for forming the adhesive layer 6 described above. The adhesive sheet 65 does not yet have an opening 4.

[0110] In the second step, for example, first, the adhesive sheet 65 is placed on one side of the metal plate 55 in the thickness direction, or on the other side of the insulating plate 75, and then the metal plate 55 and the insulating plate 75 are bonded together via the adhesive sheet 65. Preferably, first, the adhesive sheet 65 is placed on one side of the metal plate 55 in the thickness direction, and then one side of the adhesive sheet 65 in the thickness direction is brought into contact with the other side of the insulating plate 75 in the thickness direction.

[0111] In addition, in the second step, the conductive member 10 is placed inside the adhesive through-hole 63 and the insulating through-hole 73. Specifically, the adhesive through-hole 63 is formed in the adhesive sheet 65, and the conductive member 10 is placed in the adhesive sheet 65 or insulating plate 75 such that a portion of it fills inside the adhesive through-hole 63 or the insulating through-hole 73 (see Figure 2A), and then the adhesive sheet 65 and the insulating plate 75 are bonded together.

[0112] <3rd process> In the third step, as shown in Figure 3G, the metal plate 55 is shaped (patterned) to form the metal support layer 5. Examples of shaping methods include etching, punching (die processing), water cutting, and laser processing. From the viewpoint of formation accuracy, etching is preferred as the shaping method. This forms the metal support layer 5 having openings 4.

[0113] <4th process> In the fourth step, as shown in Figure 3H, the adhesive sheet 65 and the insulating board 75 are shaped to form the adhesive layer 6 and the base insulating layer 7, respectively. The shaping is not limited. Examples of shaping methods include etching, punching (mold processing), water cutting, and laser processing. This forms the adhesive layer 6 and the base insulating layer 7, each having an opening 4.

[0114] This allows the wiring circuit board 1 to be manufactured.

[0115] The applications of the wiring circuit board 1 are not particularly limited. The wiring circuit board 1 can be used in various fields. For example, the wiring circuit board 1 can be used as a wiring circuit board for electronic equipment (wiring circuit board for electronic components) and as a wiring circuit board for electrical equipment (wiring circuit board for electrical components). Note that wiring circuit boards for electronic equipment and wiring circuit boards for electrical equipment are not strictly distinguished. Examples of wiring circuit boards for electronic equipment and wiring circuit boards for electrical equipment include wiring circuit boards for sensors, wiring circuit boards for transport vehicles, wiring circuit boards for video equipment, wiring circuit boards for communication relay equipment, wiring circuit boards for information processing terminals, wiring circuit boards for mobile equipment, wiring circuit boards for medical equipment, wiring circuit boards for electrical equipment, and wiring circuit boards for recording electronic equipment. Examples of sensors in a sensor wiring circuit board include location information sensors, obstacle detection sensors, and temperature sensors. Examples of transport vehicles in a wiring circuit board for transport vehicles include automobiles, trains, aircraft, and work vehicles. Examples of video equipment on a wiring circuit board for video equipment include flat panel displays, flexible displays, and projection-type video equipment. Examples of communication relay equipment on a wiring circuit board for communication relay equipment include network equipment and large-scale communication equipment. Examples of information processing terminals on a wiring circuit board for information processing terminals include computers, tablets, smartphones, and home game consoles. Examples of mobile equipment on a wiring circuit board for mobile equipment include drones and robots. Examples of medical equipment on a wiring circuit board for medical equipment include wearable medical devices and medical diagnostic devices. Examples of electrical equipment on a wiring circuit board for electrical equipment include refrigerators, washing machines, vacuum cleaners, and air conditioning equipment. Examples of recording electronic equipment on a wiring circuit board for recording electronic equipment include digital cameras and DVD recording devices.

[0116] <Effects of the First Embodiment> In this wiring circuit board 1, an adhesive layer 6 is interposed between the metal support layer 5 and the base insulating layer 7. Therefore, the adhesion between the metal support layer 5 and the base insulating layer 7 is high.

[0117] Furthermore, since the tensile strength of the metal support layer 5 at 23°C is 100 MPa or more, the wiring circuit board 1 has excellent rigidity.

[0118] Furthermore, since the thermal conductivity of the metal support layer 5 is 30 W / m·K or higher, the wiring circuit board 1 has excellent heat dissipation properties.

[0119] Therefore, the wiring circuit board 1 has high adhesion between the metal support layer 5 and the base insulating layer 7, and excellent rigidity and heat dissipation.

[0120] Furthermore, the wiring circuit board 1 is further equipped with conductive members 10 placed within the insulating through-holes 73 and adhesive through-holes 63, thereby enabling the formation of conductive paths and heat dissipation paths between the conductor pattern 8 and the metal support layer 5. As a result, the wiring circuit board 1 offers a high degree of freedom in designing conductive paths while also providing excellent heat dissipation.

[0121] Furthermore, in the wiring circuit board 1, the heat generated in the wiring 3 can be circulated through the air between the multiple wiring 3 (openings 4), and in particular, convection can be promoted in the thickness direction to achieve efficient heat dissipation.

[0122] Furthermore, when the aspect ratio (T / W) of the wiring body metal part 52 is high, such as 2 or more, the contact area with the air can be increased. As a result, the heat dissipation efficiency based on convection is excellent.

[0123] Furthermore, when the aspect ratio (T / W) is high, such as 2 or more, the metal part 52 of the wiring body can efficiently dissipate the heat conducted from the main wiring part 83 to the base part 72 of the wiring body via the wiring body adhesive part 62 towards the metal part 52 of the wiring body.

[0124] Therefore, the wiring circuit board 1 has excellent heat dissipation properties in the wiring body 3.

[0125] Furthermore, in the wiring circuit board 1, the first connecting metal portion 51A is continuous in the short-side direction so as to include a plurality of first terminal portions 81A when projected in the thickness direction, so that the first connecting metal portion 51A can reliably support a plurality of first terminal portions 81A.

[0126] The second connecting metal portion 51B is continuous in the short direction so as to include a plurality of second terminal portions 81B when projected in the thickness direction, so that the second connecting metal portion 51B can reliably support a plurality of second terminal portions 81B.

[0127] Therefore, the wiring circuit board 1 offers excellent heat dissipation in the wiring body 3, while also providing excellent mechanical strength in the first terminal portion 81A of the first connecting body 2A and the second terminal portion 81B of the second connecting body 2B.

[0128] <Modified form of the first embodiment> In the following modified examples, the same reference numerals are used for components and processes as in the first embodiment described above, and their detailed descriptions are omitted. Furthermore, each modified example can achieve the same effects and advantages as the first embodiment, unless otherwise noted. In addition, the first embodiment and its modified examples can be combined as appropriate.

[0129] In the modified example, the inner metal surface 53 includes a curved surface. In a cross-sectional view, the curved surface has a concave shape that is recessed inward in the short-side direction from both ends in the thickness direction towards the center in the thickness direction. The short-side length of the wiring body metal portion 52 becomes shorter from both ends in the thickness direction towards the center in the thickness direction.

[0130] In the modified example, the inner surface 53 of the metal includes a convex surface in addition to a concave surface.

[0131] In the modified example, the area S0 of the inner metal surface 53 is larger than the projected area S1 obtained when the inner metal surface 53 is projected in the shorter direction. Therefore, the present invention includes embodiments in which the area S0 of the inner metal surface 53 is greater than or equal to the projected area S1 obtained when the inner metal surface 53 is projected in the shorter direction, specifically including both the first embodiment in which the area S0 of the inner metal surface 53 is the same as the projected area S1 of the inner metal surface 53, and a modified example in which the area S0 of the inner metal surface 53 is greater than the projected area S1 of the inner metal surface 53.

[0132] In a modified example, the area ratio (S0 / S1) of the area S0 to the projected area S1 of the inner metal surface 53 is, for example, 1.01 or more, preferably 1.1 or more, more preferably 1.2 or more, even more preferably 1.3 or more, and also, for example, 2 or less.

[0133] In the modified wiring circuit board 1, the area S0 of the inner metal surface 53 is larger than the projected area S1 obtained when the inner metal surface 53 is projected in the shorter direction, so the contact area between the inner metal surface 53 and the air can be reliably increased. As a result, the heat dissipation efficiency based on convection from the metal part 52 of the wiring body is further improved.

[0134] In the first embodiment, both the first connecting body 2A and the second connecting body 2B are continuous in the short-side direction in a plan view, including the first terminal portion 81A and the second terminal portion 81B. However, although not shown, for example, one of them may be continuous in the short-side direction and the other may be discontinuous in the short-side direction. In this case, the other may be divided into multiple parts spaced apart in the short-side direction. Furthermore, although not shown, for example, either the first connecting body 2A or the second connecting body 2B may be divided into multiple parts spaced apart in the short-side direction.

[0135] In the first embodiment, one main wiring section 83 is provided on the wiring body base section 72, but for example, although not shown, multiple main wiring sections 83 can be provided on a single wiring body base section 72.

[0136] In the modified version, the wiring circuit board 1 does not include the conductive member 10. The base insulating layer 7 insulates the conductor pattern 8 from the metal support layer 5.

[0137] In a modified example, an adhesive may be interposed between the base insulating layer 7 and the conductor pattern 8.

[0138] <Second Embodiment> In the following second embodiment, the same reference numerals are used for components and processes as in the first embodiment described above, and their detailed descriptions are omitted. Furthermore, the second embodiment can achieve the same effects and advantages as the first embodiment, unless otherwise specified. Moreover, the first and second embodiments can be combined as appropriate.

[0139] A second embodiment will be described with reference to Figures 4A to 4D.

[0140] In the second embodiment, as shown in Figure 4A, the third step is performed before the second step.

[0141] <3rd process> In the third step, as shown in Figure 4B, the metal plate 55, indicated by the dashed line, is processed (patterned) to form the metal support layer 5.

[0142] <Second process> The second step is performed after the third step. As shown in Figure 4C, in the second step, the adhesive sheet 65 is placed on one side of the metal support layer 5 in the thickness direction, or on the other side of the insulating plate 75, and then the metal support layer 5 and the insulating plate 75 are bonded together via the adhesive sheet 65. Preferably, first, as shown by the arrows in Figure 4A and Figure 4B, the adhesive sheet 65 is placed on one side of the metal support layer 5 in the thickness direction, and then, as shown in Figure 4C, one side of the adhesive sheet 65 in the thickness direction is brought into contact with the other side of the insulating plate 75 in the thickness direction.

[0143] <4th process> As shown in Figure 4D, in the fourth step, the adhesive sheet 65 and the insulating board 75 are shaped (patterned) to form the adhesive layer 6 and the base insulating layer 7, respectively, with patterns having openings 4.

[0144] <Third Embodiment> In the following third embodiment, the same reference numerals are used for components and processes as in the first and second embodiments described above, and their detailed descriptions are omitted. Furthermore, the third embodiment can achieve the same effects and advantages as the first and second embodiments, unless otherwise noted. Moreover, the first, second, and third embodiments and their variations can be combined as appropriate.

[0145] A third embodiment will be described with reference to Figures 5A to 5D.

[0146] In the third embodiment, the third step is performed before the second step, and in the third step, the adhesive sheet 65 is shaped to form the adhesive layer 6.

[0147] As shown in Figure 5A, an adhesive layer 6 is formed in advance from the adhesive sheet 65 in a pattern having openings 4.

[0148] As shown in Figure 5C, the adhesive layer 6 is placed on one side of the metal support layer 5 in the thickness direction, or on the other side of the insulating plate 75, and then the metal support layer 5 and the insulating plate 75 are bonded together via the adhesive layer 6. Preferably, first, as shown in Figures 5A and 5B, the adhesive layer 6 is placed on one side of the metal support layer 5 in the thickness direction, and then, as shown in Figure 5C, one side of the adhesive layer 6 in the thickness direction is brought into contact with the other side of the insulating plate 75 in the thickness direction.

[0149] <4th process> As shown in Figure 5D, in the fourth step, the insulating plate 75 is processed (patterned) to form the base insulating layer 7 with a pattern having openings 4.

[0150] <Fourth Embodiment> In the following fourth embodiment, the same reference numerals are used for components and processes as in the first to third embodiments described above, and their detailed descriptions are omitted. Furthermore, the fourth embodiment can achieve the same effects and advantages as the first embodiment, unless otherwise specified. Moreover, the first to fourth embodiments can be combined as appropriate.

[0151] The wiring circuit board 1 of the fourth embodiment will be described with reference to Figures 6A and 6B.

[0152] As shown in Figures 6A and 6B, the wiring circuit board 1 further comprises a second conductor pattern 80 and a conductor connecting member 87.

[0153] The second conductor pattern 80 is positioned on the other side in the thickness direction of the base insulating layer 7. Specifically, the second conductor pattern 80 is positioned on the other side in the thickness direction of the first connecting base portion 71A, the second connecting base portion 71B (see Figure 1), and the wiring body base portion 72. The other side in the thickness direction and the circumferential side of the second conductor pattern 80 are covered with the adhesive layer 6. In addition, the other side in the thickness direction of the second conductor pattern 80 positioned on the first connecting base portion 71A is in contact with the conductive member 10. The physical properties and dimensions of the second conductor pattern 80 are the same as those of the conductor pattern 8 described above. The second conductor pattern 80 in contact with the conductive member 10 is positioned together with the conductive member 10 in the adhesive through-hole 63.

[0154] The conductor connecting member 87 is positioned within the insulating through-hole 73. The insulating through-hole 73 penetrates the base insulating layer 7. The conductor connecting member 87 extends in the thickness direction. One end of the conductor connecting member 87 in the thickness direction contacts the first terminal portion 81A of the conductor pattern 8. The other end of the conductor connecting member 87 in the thickness direction contacts the second conductor pattern 80. In this way, the conductor connecting member 87 electrically connects the conductor pattern 8 and the second conductor pattern 80.

[0155] The manufacturing method of the wiring circuit board 1 of the fourth embodiment will be described with reference to Figures 7A to 7H. This manufacturing method comprises a first step, a second step, a third step, and a fourth step.

[0156] The second step (see Figure 7F), the third step (see Figure 7G), and the fourth step (see Figure 7H) in the manufacturing method of the fourth embodiment will be described in the same way as the second step (see Figure 3F), the third step (see Figure 3G), and the fourth step (see Figure 3H) in the first embodiment.

[0157] The first step in the fourth embodiment will be described with reference to Figures 7A to 7E.

[0158] As shown in Figures 7A to 7E, the first step involves preparing the second laminate 93. The second laminate 93 is provided with the second conductor pattern 80, the insulating board 75, the conductor pattern 8, and the cover insulating layer 9 in order toward one side in the thickness direction.

[0159] To prepare the second laminate 93, first, a three-layer substrate 94 is prepared as an example of a multilayer substrate, as shown in Figure 7A. The three-layer substrate 94 is provided with a second conductor plate 88, an insulating plate 75, and a conductor plate 85 in order toward one side in the thickness direction. The second conductor plate 88 is positioned on the other side in the thickness direction of the insulating plate 75. The second conductor plate 88 is in contact with the entire other side in the thickness direction of the insulating plate 75. The second conductor plate 88 is a conductor material for forming the second conductor pattern 80.

[0160] Next, as shown in Figures 7B to 7E, the conductor plate 85 is formed into the conductor pattern 8 and the second conductor plate 88 is formed into the second conductor pattern 80 by the subtractive method.

[0161] Specifically, as shown in Figure 7B, first, etching resist 90 is formed on one side in the thickness direction of the conductor plate 85 by photolithography, and second etching resist 95 is formed on the other side in the thickness direction of the second conductor plate 88 by photolithography. The second etching resist 95 has the same pattern as the second conductor pattern 80.

[0162] Subsequently, as shown in FIG. 7C, the conductor plate 85 exposed from the etching resist 90 is removed by etching, and the second conductor plate 88 exposed from the second etching resist 95 is removed by etching. Thereby, the conductor pattern 8 is formed from the conductor plate 85, and the second conductor pattern 80 is formed from the second conductor plate 88.

[0163] Subsequently, as shown in FIG. 7D, the etching resist 90 and the second etching resist 95 are removed.

[0164] An insulating through hole 73 (see FIG. 6A) is formed, and the conductor connection member 87 is disposed in the insulating through hole 73. In forming the insulating through hole 73, for example, conductor vias communicating with the insulating through hole 73 are also formed in the conductor pattern 8 and the second conductor pattern 80, and subsequently, plating and a conductive paste are applied to the insulating through hole 73 and the conductor vias.

[0165] Thereafter, as shown in FIG. 7E, a cover insulating layer 9 is formed. Thereby, the second laminated plate 93 is prepared.

[0166] <Modification of the Fourth Embodiment> As shown in FIG. 8, in addition to the above-described insulating region 66, the adhesive layer 6 may further have a conductive region 67. On the other hand, the wiring circuit board 1 of this modification does not include the conductive member 10.

[0167] The conductive region 67 overlaps the second conductor pattern 80 in a plan view. The conductive region 67 is made of a conductive adhesive. The volume resistivity of the conductive region 67 is, for example, less than 1×10 5 Ωcm.

[0168] The insulating region 66 is a region other than the conductive region 67 in a plan view. The insulating region 66 is made of a non-conductive adhesive. Each of the conductive adhesive and the non-conductive adhesive is described in, for example, JP-A-2012-226802 and JP-A-2012-226803.

[0169] <Fifth and Sixth Embodiments> In the following fifth and sixth embodiments, the same reference numerals are used for components and processes as in the first to fourth embodiments described above, and their detailed descriptions are omitted. Furthermore, the fifth and sixth embodiments can achieve the same effects and advantages as the first and fourth embodiments, unless otherwise noted. Moreover, the first to fourth embodiments can be combined as appropriate.

[0170] In the manufacturing method of the fifth embodiment, a second laminated board 93 (see parentheses in Figure 4C) is used instead of the laminated board 91 in the manufacturing method of the second embodiment.

[0171] In the manufacturing method of the sixth embodiment, a second laminated board 93 (see parentheses in Figure 5C) is used instead of the laminated board 91 in the manufacturing method of the third embodiment. [Explanation of Symbols]

[0172] 1 Wiring circuit board 3 Wiring 5 Metal support layer 6 Adhesive layer 7. Base insulating layer (insulating layer) 8 Conductor Patterns 10 Conductive members 51A 1st connecting metal part (connecting metal part) 51B 2nd connecting metal part (connecting metal part) 52 Wiring body metal part (support part) 53 Metal inner surface 55 Metal plate 62 Wiring body adhesive part (adhesive part) 63 Adhesive through hole 65 Adhesive Sheets 72 Wiring base section (insulating section) 73 Insulation through-holes 75 Insulating board 80 Second conductor pattern 81A First terminal section (terminal section) 81B 2nd terminal section (terminal section) 83 Main wiring section (wiring section) 85 Conductor plate 91 Laminate 92 2-layer base material (multi-layer base material) 93. Second Laminate 94 3-layer base material (multilayer base material)

Claims

1. The structure comprises a metal support layer, an adhesive layer, an insulating layer, and a conductor pattern, arranged in order in the thickness direction. The tensile strength of the metal support layer at 23°C is 100 MPa or more. The thermal conductivity of the metal support layer is 30 W / m·K or higher. The conductor pattern includes a plurality of wiring sections, A wiring circuit board having openings positioned between adjacent wiring sections.

2. The insulating layer has insulating through holes, The wiring circuit board according to claim 1, wherein the adhesive layer has adhesive through holes that overlap the insulating through holes when projected in the thickness direction.

3. The wiring circuit board according to claim 2, further comprising conductive members disposed within the insulating through-holes and the adhesive through-holes.

4. A conductive member and a second conductor pattern are disposed within the adhesive through-hole, A connecting member is disposed within the insulating through-hole and electrically connects the conductor pattern and the second conductor pattern. The wiring circuit board according to claim 2, further comprising:

5. It comprises multiple wiring units arranged in parallel with space between them, Each of the aforementioned plurality of wiring units is The insulating portion included in the insulating layer, Displaced on the other side in the thickness direction of the insulating portion, and the adhesive portion included in the adhesive layer, The wiring portion is arranged on one side in the thickness direction of the insulating portion, Displaced on the other side in the thickness direction of the adhesive portion, the ratio of the length T in the thickness direction to the length W in the parallel direction of the plurality of wirings (T / W) is 2 or more, and the metal support portion included in the metal support layer A wiring circuit board according to any one of claims 1 to 4, comprising:

6. One of the metal support portions has an inner surface facing the other metal support portion adjacent to the first metal support portion in the parallel direction, The wiring circuit board according to claim 5, wherein the area of ​​the inner surface is greater than or equal to the projected area when the inner surface is projected in the parallel direction.

7. The system includes a connector that connects the orthogonal ends of the plurality of wiring bodies that are perpendicular to the parallel direction and the thickness direction, The aforementioned connecting body, A terminal portion that is continuous with the orthogonal end of the wiring portion and is included in the conductor pattern, The metal support portion comprises a connecting metal portion that is continuous with the orthogonal end of the metal support portion and is included in the metal support layer, The wiring circuit board according to claim 5, wherein the connecting metal portion is continuous in the parallel direction such that it includes a plurality of terminal portions when projected in the thickness direction.

8. The system includes a connector that connects the orthogonal ends of the plurality of wiring bodies that are perpendicular to the parallel direction and the thickness direction, The aforementioned connecting body, A terminal portion that is continuous with the orthogonal end of the wiring portion and is included in the conductor pattern, The metal support portion comprises a connecting metal portion that is continuous with the orthogonal end of the metal support portion and is included in the metal support layer, The wiring circuit board according to claim 6, wherein the connecting metal portion is continuous in the parallel direction such that it includes a plurality of terminal portions when projected in the thickness direction.

9. A method for manufacturing a wiring circuit board according to Claim 1, A step of preparing a multilayer substrate comprising an insulating plate and a conductive plate disposed on at least one side of the insulating plate in the thickness direction, The process of forming a conductive pattern on the conductive plate using a subtractive method, A step of bonding a metal plate having a tensile strength of 100 MPa or more at 23°C and a thermal conductivity of 30 W / m·K or more, or a metal support layer formed from the metal plate, and the insulating plate via an adhesive sheet or an adhesive layer formed from the adhesive sheet, A step of forming the metal support layer by patterning the metal plate, The process of patterning the adhesive sheet to form the adhesive layer, The process of patterning the insulating plate to form an insulating layer A method for manufacturing a wiring circuit board, comprising:

Images