Circuit boards with components and elements, components, and methods for manufacturing the same.

Abstract

To provide a wiring circuit board with a component and an element and a component that are capable of controlling a posture of an electronic element with certainty, and to provide a method of manufacturing them.SOLUTION: A wiring circuit board 10 with a component and an element comprises a wiring circuit board 1, an electronic component 2, and an electronic element 3. The wiring circuit board 1 comprises a conductor layer 23 and a cover insulating layer 24. The conductor layer 23 comprises a signal terminal part 231 and a ground terminal part 232. The signal terminal part 231 has an upper surface 231S exposed from the cover insulating layer 24. The ground terminal part 232 has a lower surface 2321S exposed from a base insulating layer 22. The wiring circuit board 1 comprises a first pedestal part 31 and a second pedestal part 32 in contact with the electronic component 2. The ground terminal part 232 is arranged adjacently to the second pedestal part 32, at an opposite side to the first pedestal part 31. The cover insulating layer 24 that covers the ground terminal part 232 is thinner than the cover insulating layer 24 in the second pedestal part 32.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a wiring circuit board with components and elements, components, and a method for manufacturing the same.

Background Art

[0002] A wiring circuit board with components and elements including a wiring circuit board, electronic components, and electronic elements is known (see, for example, Patent Document 1 below). In the wiring circuit board with components and elements described in Patent Document 1, the wiring circuit board includes a base insulating layer, a conductor layer, and a cover insulating layer. The conductor layer includes a first terminal portion and a second terminal portion. The first terminal portion has an upper surface exposed from the cover insulating layer. The first terminal portion is electrically connected to an electronic component. The second terminal portion has a lower surface exposed from the base insulating layer. The second terminal portion is independent of the first terminal portion. The second terminal portion is electrically connected to an electronic element.

[0003] Further, the wiring circuit board further includes a first pedestal portion and a second pedestal portion. Each of the first pedestal portion and the second pedestal portion includes a base insulating layer, a conductor layer, and a cover insulating layer. The second pedestal portion is adjacent to the second terminal portion. The first pedestal portion, the second pedestal portion, and the second terminal portion are arranged in a direction orthogonal to the thickness direction.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Electronic components are relatively large from the standpoint of ensuring their functionality. Therefore, the second terminal portion connected to such electronic components has a relatively large surface area. Consequently, for manufacturing reasons, the cover insulating layer covering this second terminal portion is thicker than the second base portion. As a result, the electronic component comes into contact with the cover insulating layer covering the second terminal portion. This causes the portion of the electronic component opposite to the first base portion relative to the second base portion to move upward. This leads to a problem where the orientation of the electronic component cannot be reliably controlled.

[0006] The present invention provides a component that can reliably control the orientation of an electronic element, a wiring circuit board with an element, and a component, as well as a method for manufacturing the same. [Means for solving the problem]

[0007] The present invention [1] comprises a wiring circuit board having a base insulating layer, a conductor layer disposed on the upper surface of the base insulating layer, and a cover insulating layer disposed on the upper surface of the base insulating layer so as to cover the conductor layer, and electronic components and electronic elements electrically connected to the conductor layer, wherein the conductor layer has an upper surface exposed from the cover insulating layer and a first terminal portion electrically connected to the electronic component, and a lower surface exposed from the base insulating layer and a second terminal portion electrically connected to the electronic element and independent of the first terminal portion, and the wiring circuit board comprises the base insulating layer, the conductor layer The circuit board includes a component and element-equipped wiring board, further comprising: a first base portion that includes the cover insulating layer and contacts the lower surface of the electronic component; and a second base portion that includes the base insulating layer, the conductor layer and the cover insulating layer and contacts the lower surface of the electronic component, the second base portion being spaced apart from the first base portion in a first direction perpendicular to the thickness direction, wherein the second terminal portion is positioned adjacent to the second base portion on the opposite side of the first base portion in the first direction, and the cover insulating layer covering the second terminal portion is thinner than the cover insulating layer on the second base portion.

[0008] In this component and component-equipped wiring circuit board, the cover insulating layer covering the second terminal is thinner than the cover insulating layer on the second base. Therefore, contact between the electronic component and the cover insulating layer covering the second terminal can be suppressed. As a result, the orientation of the electronic component can be reliably controlled by the first and second bases.

[0009] The present invention [2] includes a wiring circuit board with components and elements as described in [1], wherein the second terminal portion has a terminal body portion having a lower surface exposed from the base insulating layer, and a terminal peripheral portion that is continuous with the peripheral edge of the terminal body portion and is disposed on the upper surface of the base insulating layer, and the cover insulating layer covering the terminal peripheral portion is thinner than the cover insulating layer in the second base portion.

[0010] The present invention [3] includes a wiring circuit board with components and elements as described in [2], wherein the cover insulating layer covering the periphery of the terminal is a recess that is recessed toward the downward side, and in the first direction, the recess is located between the terminal body and the second base.

[0011] With this component and wiring circuit board with elements, it is easy to confirm by visually inspecting the recess that the cover insulating layer covering the second base portion is thinner than the cover insulating layer on the second base portion.

[0012] The present invention [4] includes a wiring circuit board with components and elements according to any one of the items [1] to [3], wherein the electronic element has a shape extending in the first direction.

[0013] The present invention [5] includes a wiring circuit board with components and elements according to any one of [1] to [4], wherein the second terminal portion is a ground terminal portion, the base insulating layer in the second base portion has an opening, and the conductor layer in the second base portion fills the opening and is electrically connected to the ground terminal portion.

[0014] In this component and element-equipped wiring circuit board, the conductor layer in the second base electrically connects the ground terminal and the metal support layer. Therefore, the conductor layer in the second base constitutes the second base while simultaneously providing a ground connection to the metal support layer. In other words, the conductor layer in the second base combines the functions of a base and ground connection.

[0015] The present invention [6] is a method for manufacturing a wiring circuit board with components and elements as described in any one of [1] to [5], comprising the step of forming a cover insulating layer on the upper surface of a conductor layer, wherein the step comprises forming a photosensitive resin layer on the upper surface of the conductor layer and gradation exposure of the photosensitive resin layer.

[0016] With this manufacturing method, the photosensitive resin layer is exposed to gradation, making it easier to make the cover insulating layer covering the second terminal thinner than the cover insulating layer on the second base. [Effects of the Invention]

[0017] According to the component and element-equipped wiring circuit board and component of the present invention, and the manufacturing method thereof, the orientation of the electronic element in the vertical direction can be reliably controlled. [Brief explanation of the drawing]

[0018] [Figure 1] This is a schematic plan view of the component and element-equipped wiring circuit board of the present invention. [Figure 2] Figure 1 is a plan view of the mounting area of ​​a wiring circuit board with components and elements shown. [Figure 3] Figure 2 is an enlarged plan view of the mounting section. [Figure 4] This is a cross-sectional view along line AA of the mounting section shown in Figure 3. [Figure 5] Figure 3 is an enlarged plan view of the ground terminal section and the second base section. [Figure 6]It is a manufacturing process diagram of a wiring circuit board with components and elements shown in FIG. 4. FIG. 6A shows the process of forming a base insulating layer. FIG. 6B shows the process of forming a conductor layer. FIG. 6C shows the process of subjecting a photosensitive resin layer to gradation exposure. FIG. 6D shows the process of developing the photosensitive resin layer to form a cover insulating layer. FIG. 6E shows the process of machining the outer shape of a metal support layer and a base insulating layer. [Figure 7] It is a cross-sectional view of a mounting portion in a wiring circuit board with components and elements of a modified example.

Embodiments for Carrying Out the Invention

[0019] 1. An Embodiment of a Wiring Circuit Board with Components and Elements Referring to FIGS. 1 to 5, an embodiment of a wiring circuit board with components and elements will be described.

[0020] In FIGS. 1 and 2, in order to clearly understand the arrangement and shape of a conductor layer 23 (described later), a cover insulating layer 24 (described later) is omitted.

[0021] In FIG. 3, in order to clearly understand the arrangement and shape of a conductor layer 23 (described later), an electronic component 2 (described later), an electronic element 3 (described later), and a cover insulating layer 24 (described later) are omitted.

[0022] In FIG. 5, in order to clearly understand the arrangement and shape of a pedestal cover portion 241 (described later) and a thin cover portion 242 (described later), the pedestal cover portion 241 (described later) and the thin cover portion 242 (described later) are drawn in gray.

[0023] 1.1 Overall Configuration of a Wiring Circuit Board 10 with Components and Elements As shown in FIG. 1, a wiring circuit board 10 with components and elements has a sheet shape. The wiring circuit board 10 with components and elements extends in a first direction. The first direction is orthogonal to the thickness direction. The wiring circuit board 10 with components and elements includes a wiring circuit board 1, an electronic component 2, and an electronic element 3.

[0024] The wiring circuit board 1 has a sheet shape. The wiring circuit board 1 extends in a first direction. The wiring circuit board 1 includes a mounting section 1A, an external connection section 1B, and a wiring section 1C. The wiring circuit board 1 also includes a metal support layer 21 and a conductor layer 23 disposed on the metal support layer 21. The conductor layer 23 includes a plurality of one-side terminal units 23A, a plurality of other-side terminal units 23B, and a plurality of wiring units 23C.

[0025] The mounting section 1A is located at one end of the wiring circuit board 1 in a first direction. The mounting section 1A includes a metal support layer 21 and a plurality of one-sided terminal units 23A. Electronic components 2 and electronic elements 3 are mounted on the mounting section 1A.

[0026] The external connection section 1B is located at the other end of the wiring circuit board 1 in the first direction. The external connection section 1B includes a metal support layer 21 and a plurality of other-side terminal units 23B. An external board (not shown) and a power supply unit (not shown) are connected to the external connection section 1B.

[0027] The wiring section 1C is located in the middle of the wiring circuit board 1 in the first direction. In the first direction, the wiring section 1C connects the mounting section 1A and the external connection section 1B. The wiring section 1C includes a metal support layer 21 and a plurality of wiring units 23C.

[0028] The electronic component 2 is placed in the mounting section 1A. The electronic component 2 is electrically connected to a part of the terminal unit 23A on one side (the signal terminal section 231, described later, see Figure 2). The electronic component 2 includes, for example, a slider. As shown in Figure 4, the electronic component 2 has thickness in the vertical direction. The electronic component 2 has a substantially flat plate shape. The electronic component 2 has a plurality of electrodes (not shown) arranged at one end in the first direction.

[0029] As shown in Figure 2, multiple electronic elements 3 are arranged in the mounting section 1A. The multiple electronic elements 3 are spaced apart in a second direction. The second direction is perpendicular to the first direction and the thickness direction. Each of the multiple electronic elements 3 is electrically connected to a part of the terminal unit 23A on one side (a ground terminal section 232 and a power terminal section 233, described later, see Figure 2). In this embodiment, the electronic elements 3 include, for example, piezoelectric elements. Each of the multiple electronic elements 3 has a shape that extends in the first direction. A piezoelectric element is an actuator that can expand and contract in the first direction. Specifically, a piezoelectric element expands and contracts when electricity is supplied and its voltage is controlled. Each of the multiple electronic elements 3 has electrodes (not shown) located at both ends in the first direction.

[0030] 1.2 Layer configuration of wiring circuit board 1 As shown in Figure 4, the wiring circuit board 1 is provided with the metal support layer 21, the base insulating layer 22, the conductor layer 23, and the cover insulating layer 24 in order toward one side in the thickness direction.

[0031] 1.2.1 Metal support layer 21 The metal support layer 21 is included in the mounting section 1A, the external connection section 1B (see Figure 1), and the wiring section 1C (see Figure 1). The material of the metal support layer 21 is a metal material. For example, stainless steel is an example of a metal material. The thickness of the metal support layer 21 is, for example, 10 μm or more and 35 μm or less.

[0032] 1.2.2 Base insulating layer 22 The base insulating layer 22 is included in the mounting section 1A, the external connection section 1B (see Figure 1), and the wiring section 1C (see Figure 1). The base insulating layer 22 is positioned on the upper surface of the metal support layer 21. In the mounting section 1A, a portion of the lower surface of the base insulating layer 22 is exposed from the metal support layer 21. The material of the base insulating layer 22 is a flexible resin. For example, polyimide is an example of such a resin. The thickness of the base insulating layer 22 is, for example, 1 μm or more and 20 μm or less.

[0033] 1.2.3 Conductor layer 23 The conductor layer 23 is included in the plurality of one-side terminal units 23A, the plurality of other-side terminal units 23B (see Figure 1), and the plurality of wiring units 23C (see Figure 1). The conductor layer 23 is placed on the upper surface of the base insulating layer 22. The material of the conductor layer 23 is, for example, a conductor. The conductor is, for example, copper. The thickness of the conductor layer 23 is, for example, 1 μm or more and 20 μm or less.

[0034] 1.2.4 Cover insulation layer 24 The cover insulating layer 24 is included in the mounting section 1A, the external connection section 1B (see Figure 1), and the wiring section 1C (see Figure 1). The cover insulating layer 24 is positioned on the upper surface of the base insulating layer 22. The cover insulating layer 24 covers the wiring unit 23C and a portion of one terminal unit 23A (the ground terminal section 232 and power terminal section 233, described later, see Figure 3). The cover insulating layer 24 exposes the remaining part of one terminal unit 23A (the signal terminal section 231, described later) and the other terminal unit 23B (see Figure 1). The material of the cover insulating layer 24 is a flexible resin. For example, polyimide is an example of such a resin. The thickness of the cover insulating layer 24 is, for example, 1 μm or more and 20 μm or less.

[0035] 1.3 Details of Implementation Unit 1A The details of the mounting section 1A will now be explained. As shown in Figure 2, the mounting section 1A includes an outrigger section 11, a mounting section 12, a connecting section 13, and an auxiliary connecting section 14.

[0036] The outrigger portions 11 are positioned at both ends of the mounting portion 1A in the second direction. Each of the two outrigger portions 11 extends in the first direction. The two outrigger portions 11 extend in the first direction from the wiring portion 1C (see Figure 1). In this embodiment, the outrigger portions 11 include, for example, a metal support layer 21.

[0037] The mounting section 12 is positioned between the two outrigger sections 11 in the second direction. Electronic components 2 and electronic elements 3 are mounted on the mounting section 12. The mounting section 12 comprises a base section 121, a stage 122, a first projection 123, a second projection 124, and a bridging section 125.

[0038] The base portion 121 is positioned at the other end of the mounting portion 12 in the first direction. The base portion 121 extends in the second direction. The base portion 121 includes the metal support layer 21, base insulating layer 22, conductor layer 23, and cover insulating layer 24 (see Figure 4) described above.

[0039] The stage 122 is positioned at one end of the mounting portion 12 in the first direction. The stage 122 is spaced apart from the base portion 121 in the first direction. The stage 122 extends in the first direction. In plan view, the stage 122 has a substantially rectangular shape. The stage 122 includes the metal support layer 21, base insulating layer 22, conductor layer 23, and cover insulating layer 24 (see Figure 4).

[0040] The first projection 123 extends from the other end edge of the stage 122 in the first direction toward the other side. Specifically, two first projections 123 are provided, corresponding to both ends of the stage 122 in the second direction. Each of the two first projections 123 also extends in the second direction. In this embodiment, each of the two first projections 123 has, for example, a substantially rectangular shape in plan view. As shown in Figure 4, each of the two first projections 123 includes the base insulating layer 22, conductor layer 23, and cover insulating layer 24 described above. Each of the two first projections 123 does not include the metal support layer 21 described above.

[0041] As shown in Figure 2, the second projection 124 extends from one end edge of the base 121 in the first direction toward one side. Specifically, two second projections 124 are provided, corresponding to both ends of the base 121 in the second direction. Each of the two second projections 124 also extends in the second direction. In this embodiment, each of the two second projections 124 has, for example, a substantially rectangular shape in plan view. The second projections 124 are positioned opposite the first projection 123 in the first direction, spaced apart on the other side. Each of the two second projections 124 includes the base insulating layer 22, the conductor layer 23, and the cover insulating layer 24 (see Figure 4). Each of the two second projections 124 does not include the metal support layer 21.

[0042] The bridging portion 125 is positioned in the middle of the mounting portion 12 in the first direction. In the second direction, the bridging portion 125 is positioned between the two first protrusions 123. In the second direction, the bridging portion 125 is positioned between the two second protrusions 124. The bridging portion 125 extends in the first direction. In the first direction, the bridging portion 125 bridges the base portion 121 and the stage 122. The bridging portion 125 includes the metal support layer 21, base insulation layer 22, conductor layer 23 and cover insulation layer 24 (see Figure 4).

[0043] The connecting portion 13 connects the two outrigger portions 11 and the mounting portion 12 in the second direction. More specifically, the connecting portion 13 connects each of the ends of the outrigger portions 11 in the two first directions and each of the ends of the base portion 121 in the second direction. The connecting portion 13 includes, for example, a metal support layer 21.

[0044] The auxiliary connecting section 14 connects the two outrigger sections 11 and the stage 122. More specifically, the auxiliary connecting section 14 connects one end of the outrigger sections 11 in two first directions to one end of the stage 122 in a second direction. The auxiliary connecting section 14 includes, for example, a base insulating layer 22 and / or a cover insulating layer 24.

[0045] 1.4 Details of Conductor Layer 23 The details of the conductor layer 23 will now be described. As shown in Figure 1, the conductor layer 23 includes the above-described plurality of one-side terminal units 23A, the above-described plurality of other-side terminal units 23B, and the above-described plurality of wiring units 23C.

[0046] 1.4.1 Terminal unit 23A on one side As shown in Figure 2, one terminal unit 23A comprises a signal terminal section 231 as an example of a first terminal section, a ground terminal section 232 as an example of a second terminal section, and a power terminal section 233. In other words, the conductor layer 23 comprises a signal terminal section 231 and a ground terminal section 232.

[0047] The signal terminal portion 231 is located at one end of the stage 122 in the first direction. Multiple signal terminal portions 231 are arranged at intervals from each other in the second direction. As shown in Figure 4, the signal terminal portion 231 is in contact with the upper surface of the base insulating layer 22. The signal terminal portion 231 has an upper surface 231S that is exposed from the cover insulating layer 24. The length of the signal terminal portion 231 in the first direction and the length of the signal terminal portion 231 in the second direction are, for example, 10 μm or more and 500 μm or less, respectively.

[0048] As shown in Figure 3, the ground terminal portion 232 is located within the first protruding portion 123 described above. Multiple ground terminal portions 232 are provided corresponding to multiple electronic elements 3. In this embodiment, each of the multiple ground terminal portions 232 has, for example, a substantially rectangular shape in plan view. As shown in Figure 4, each of the multiple ground terminal portions 232 has a terminal body portion 2321 and a terminal peripheral portion 2322.

[0049] The base insulating layer 22 corresponding to the ground terminal portion 232 has a first opening 221. The first opening 221 penetrates the base insulating layer 22 in the thickness direction. In this embodiment, the first opening 221 has, for example, a substantially rectangular shape in plan view. The above-described terminal body portion 2321 is filled into the first opening 221. The terminal body portion 2321 drops down from the terminal peripheral portion 2322. The terminal body portion 2321 has a lower surface 2321S that is exposed from the base insulating layer 22 around the first opening 221. The lower surface 2321S is flush with the lower surface of the base insulating layer 22 around the first opening 221. The upper surface of the terminal body portion 2321 is covered by the cover insulating layer 24.

[0050] The terminal periphery portion 2322 is continuous with the peripheral edge of the terminal body portion 2321. In this embodiment, the terminal periphery portion 2322 has a substantially rectangular frame shape in plan view. The terminal periphery portion 2322 is positioned on the upper surface of the base insulating layer 22 around the first opening 221. The upper surface and peripheral side surface of the terminal periphery portion 2322 are in contact with the cover insulating layer 24. The terminal periphery portion 2322 is sandwiched between the base insulating layer 22 and the cover insulating layer 24 in the vertical direction. As a result, the terminal periphery portion 2322 performs an anchoring effect. The ground terminal portion 232 is firmly supported by the base insulating layer 22 and the cover insulating layer 24 by the anchoring effect.

[0051] The length of the terminal body portion 2321 in the first direction and the length of the terminal body portion 2321 in the second direction are, for example, 10 μm or more, preferably 20 μm or more, more preferably 30 μm or more, and also, for example, 300 μm or less. The length of the terminal body portion 2321 in the first direction and the length of the terminal body portion 2321 in the second direction are set in accordance with the size of the electrodes of the electronic element 3. In this embodiment, the length of the terminal body portion 2321 in the first direction and the length of the terminal body portion 2321 in the second direction are synonymous with the length of the lower surface 2321S of the terminal body portion 2321 in the first direction and the length of the lower surface 2321S of the terminal body portion 2321 in the second direction. If the length of the terminal body portion 2321 in the first direction and the length of the terminal body portion 2321 in the second direction are both greater than or equal to the lower limit described above, the area of ​​the lower surface 2321S can be increased, thereby improving the reliability of the connection with the electronic element 3.

[0052] The outer length of the terminal perimeter 2322 in the first direction and the outer length of the terminal perimeter 2322 in the second direction are, for example, 20 μm or more, preferably 50 μm or more, more preferably 100 μm or more, and also, for example, 400 μm or less. In this embodiment, the outer length of the terminal perimeter 2322 in the first direction and the outer length of the terminal perimeter 2322 in the second direction are synonymous with the length of the ground terminal portion 232 in the first direction and the length of the ground terminal portion 232 in the second direction.

[0053] As shown in Figure 2, the power terminal portion 233 is located within the second protrusion portion 124 described above. Multiple power terminal portions 233 are provided, corresponding to multiple electronic elements 3. Although not shown, each of the multiple power terminal portions 233 has a lower surface exposed from the base insulating layer 22.

[0054] 1.4.2 Terminal unit 23B on the other side As shown in Figure 1, the other terminal unit 23B includes a plurality of external signal terminals 234 and a plurality of external power terminals 235.

[0055] Multiple external signal terminals 234 are arranged at intervals from one another. The external signal terminals 234 are located on the upper surface of the base insulating layer 22. The upper surface of the external signal terminals 234 is exposed from the cover insulating layer 24 (see Figure 4).

[0056] Multiple external power terminals 235 are arranged at intervals from one another. The external power terminals 235 are located on the upper surface of the base insulating layer 22. The upper surface of the external power terminals 235 is exposed from the cover insulating layer 24 (see Figure 4). In this embodiment, the multiple external signal terminals 234 and the multiple external power terminals 235 are arranged, for example, in a first direction.

[0057] 1.4.3 Multiple Wiring Units 23C Multiple wiring units 23C comprise multiple signal wires 238 and multiple power supply wires 239.

[0058] As shown in Figure 2, the signal wiring 238 electrically connects the signal terminal 231 to the external signal terminal 234 (see Figure 1). The signal wiring 238 is positioned on the upper surface of the base insulating layer 22. The signal wiring 238 is covered by the cover insulating layer 24.

[0059] The power wiring 239 electrically connects the power terminal section 233 and the external power terminal section 235. The power wiring 239 is positioned on the upper surface of the base insulating layer 22. The power wiring 239 is covered by the cover insulating layer 24.

[0060] 1.5 First base portion 31, second base portion 32, and connecting portion 4 As shown in Figure 3, the wiring circuit board 1 further comprises a first base portion 31, a second base portion 32, and a connection portion 4.

[0061] 1.5.1 First base section 31 The first base portion 31 is positioned in the middle of the stage 122 in the first direction. In the first direction, the first base portion 31 is spaced apart from the signal terminal portion 231 and on the other side. In the first direction, the first base portion 31 is positioned between the signal terminal portion 231 and the ground terminal portion 232. As shown in Figure 2, the first base portion 31 is positioned at both ends of the stage 122 in the second direction. As shown in Figure 4, each of the multiple first base portions 31 includes a base insulating layer 22, a conductor layer 23, and a cover insulating layer 24.

[0062] The conductor layer 23 in the first base portion 31 is located on the upper surface of the base insulating layer 22 in the first base portion 31. As shown in Figure 3, in this embodiment, the conductor layer 23 in the first base portion 31 has, for example, a substantially circular shape in plan view. As shown in Figure 4, in this embodiment, the cover insulating layer 24 in the first base portion 31 is larger than the conductor layer 23 in the first base portion 31. In plan view, the cover insulating layer 24 in the first base portion 31 encompasses the conductor layer 23 in the first base portion 31. The cover insulating layer 24 in the first base portion 31 contacts the upper surface and circumferential surface of the conductor layer 23 in the first base portion 31. In this embodiment, the cover insulating layer 24 in the first base portion 31 has, for example, a substantially circular shape in plan view.

[0063] 1.5.2 Second base section 32 As shown in Figure 3, the second base portion 32 is positioned at the other end of the stage 122 in the first direction. The second base portion 32 is spaced apart from the first base portion 31 in the first direction. In the first direction, the second base portion 32 is positioned on the opposite side of the signal terminal portion 231 from the first base portion 31. In the first direction, the second base portion 32 is positioned between the first base portion 31 and the ground terminal portion 232. The second base portion 32 is adjacent to the ground terminal portion 232. Thus, the ground terminal portion 232 is positioned adjacent to the second base portion 32 in the first direction, on the opposite side of the first base portion 31 from the second base portion 32. As shown in Figure 2, the second base portion 32 is positioned at both ends of the stage 122 in the second direction. Each of the multiple second base portions 32 corresponds to each of the multiple first base portions 31. As shown in Figure 4, each of the multiple second base portions 32 includes a base insulating layer 22, a conductor layer 23, and a cover insulating layer 24.

[0064] The base insulating layer 22 in the second base portion 32 has a second opening 222. The second opening 222 penetrates the base insulating layer 22 in the thickness direction. As shown in Figure 5, in this embodiment, the second opening 222 has, for example, a substantially circular shape in plan view.

[0065] In this embodiment, the conductor layer 23 in the second base portion 32 has, for example, a substantially circular shape in plan view. The conductor layer 23 in the second base portion 32 comprises a conductor base body portion 236 and a conductor base peripheral portion 237.

[0066] As shown in Figure 4, the conductor base body 236 is filled into the second opening 222. The conductor base body 236 is in contact with the upper surface of the metal support layer 21. The conductor base body 236 drops down from the conductor base periphery 237.

[0067] The conductor base peripheral portion 237 is continuous with the peripheral edge of the conductor base main body portion 236. The conductor base peripheral portion 237 is positioned on the upper surface of the base insulating layer 22 around the second opening 222. The conductor base peripheral portion 237 is sandwiched between the base insulating layer 22 and the cover insulating layer 24 in the vertical direction. This allows the conductor base peripheral portion 237 to perform an anchoring effect. The second base portion 32 is firmly supported by the base insulating layer 22 and the cover insulating layer 24 by this anchoring effect. As shown in Figure 5, in this embodiment, the conductor base peripheral portion 237 has a substantially annular shape in plan view.

[0068] As shown in Figure 4, the cover insulating layer 24 in the second base portion 32 is positioned on the upper surface of the base insulating layer 22 in the second base portion 32. The cover insulating layer 24 in the second base portion 32 covers the upper surface of the conductor base body portion 236 and the upper surface and peripheral side surface of the conductor base peripheral portion 237. As shown in Figure 5, the cover insulating layer 24 in the second base portion 32 has, for example, a substantially circular shape in plan view.

[0069] The dimensions of the second base portion 32 are smaller than the dimensions of the ground terminal portion 232 described above.

[0070] The outer length of the conductor base periphery 237 in the first direction and the outer length of the conductor base periphery 237 in the second direction are, for example, 30 μm or more, preferably 60 μm or more, and also, for example, 500 μm or less, preferably 300 μm or less. The outer length of the conductor base periphery 237 in the first direction and the outer length of the conductor base periphery 237 in the second direction are synonymous with the outer length of the conductor layer 23 of the second base portion 32 in the first direction and the outer length of the conductor layer 23 of the second base portion 32 in the second direction.

[0071] The length of the conductor base body 236 in the first direction and the length of the conductor base body 236 in the second direction are, for example, 20 μm or more, preferably 50 μm or more, and also, for example, 490 μm or less, preferably 290 μm or less.

[0072] The ratio of the length of the ground terminal portion 232 in the first direction to the outer length of the conductor layer 23 of the second base portion 32 in the first direction is, for example, 0.5 or more, preferably 1 or more, more preferably 1.5 or more, and also, for example, 5 or less. The ratio of the length of the ground terminal portion 232 in the second direction to the outer length of the conductor layer 23 of the second base portion 32 in the second direction is, for example, 0.5 or more, preferably 1 or more, more preferably 1.5 or more, and also, for example, 5 or less.

[0073] 1.5.3 Connection part 4 The connection portion 4 connects the second base portion 32 and the ground terminal portion 232 in the first direction. As shown in Figure 4, the connection portion 4 has a base insulating layer 22, a conductor layer 23, and a cover insulating layer 24. The base insulating layer 22, conductor layer 23, and cover insulating layer 24 in the connection portion 4 have the same configuration as the base insulating layer 22, conductor layer 23, and cover insulating layer 24 in the second base portion 32. However, the base insulating layer 22 in the second base portion 32 does not have a second opening 222. Also, the thickness of the cover insulating layer 24 in the connection portion 4 is the same as, or thinner than, the thickness of the cover insulating layer 24 in the second base portion 32.

[0074] As shown in Figure 5, in this embodiment, the conductor layer 23 in the connection portion 4 has a triangular shape that extends from the conductor layer 23 in the second base portion 32 toward the ground terminal portion 232. As shown in Figure 4, the conductor layer 23 in the connection portion 4 electrically connects the ground terminal portion 232 with the conductor layer 23 in the second base portion 32. In other words, the conductor layer 23 in the second base portion 32 is electrically connected to the ground terminal portion 232 via the conductor layer 23 in the connection portion 4. The ground terminal portion 232 is grounded to the metal support layer 21 via the conductor layer 23 in the connection portion 4 and the conductor layer 23 in the second base portion 32. The ground terminal portion 232 is independent of the signal terminal portion 231.

[0075] 1.6 Thickness of the cover insulating layer 24 covering the ground terminal portion 232 Furthermore, the cover insulating layer 24 covering the ground terminal portion 232 is thinner than the cover insulating layer 24 on the second base portion 32. Specifically, the cover insulating layer 24 covering the terminal peripheral portion 2322 is thinner than the cover insulating layer 24 on the second base portion 32. Also, the cover insulating layer 24 covering the terminal body portion 2321 is thinner than the cover insulating layer 24 on the second base portion 32.

[0076] The cover insulating layer 24 in the second base portion 32 is the base cover portion 241. The cover insulating layer 24 covering the ground terminal portion 232 (terminal peripheral portion 2322) is the thin-walled cover portion 242. The upper surface of the thin-walled cover portion 242 is positioned lower than the upper surface of the base cover portion 241.

[0077] The ratio of the thickness of the thin-walled cover portion 242 to the thickness of the base cover portion 241 is, for example, 0.95 or less, preferably 0.9 or less, more preferably 0.8 or less, and also, for example, 0.1 or more, preferably 0.3 or more. If the above ratio is below the above upper limit, contact between the upper surface of the thin-walled cover portion 242 and the electronic component 2 can be effectively suppressed.

[0078] The value obtained by subtracting the thickness of the thin-walled cover portion 242 from the thickness of the base cover portion 241 is, for example, 0.2 μm or more, preferably 0.4 μm or more, more preferably 0.8 μm or more, and also, for example, 19.8 μm or less, preferably 17.0 μm or less. If the above value is above the above lower limit, contact between the upper surface of the thin-walled cover portion 242 and the electronic component 2 can be effectively suppressed.

[0079] The thickness of the base cover portion 241 is, for example, 1.0 μm or more, preferably 2.0 μm or more, and also, for example, 20.0 μm or less, preferably 12.0 μm or less.

[0080] The thickness of the thin-walled cover portion 242 is, for example, 19.8 μm or less, preferably 11.8 μm or less, and also, for example, 0.2 μm or more, preferably 1.0 μm or more.

[0081] 1.7 Electronic Components 2 The electronic component 2 is positioned above the mounting portion 12 of the wiring circuit board 1. The electrodes of the electronic component 2 are electrically connected to the signal terminal portion 231 via the first conductive bonding material 6. In other words, the electronic component 2 is electrically connected to the conductor layer 23. The lower surface of the electronic component 2 is in contact with the first base portion 31 and the second base portion 32. In other words, the first base portion 31 and the second base portion 32 are in contact with the lower surface of the electronic component 2. The electronic component 2 is movable in a second direction relative to the first base portion 31 and the second base portion 32. The thin-walled cover portion 242 is not in contact with the lower surface of the electronic component 2.

[0082] 1.8 Electronic Element 3 A portion (the lower end) of the electronic element 3 is positioned below the mounting portion 12 of the wiring circuit board 1. More specifically, the electronic element 3 is positioned below the first protrusion 123 and the second protrusion 124. Each electrode of the electronic element 3 is electrically connected to the ground terminal portion 232 and the power terminal portion 233 (see Figure 2) via the second conductive bonding material 7. In other words, the electronic element 3 is electrically connected to the conductor layer 23. The electronic element 3 is fixed to the first protrusion 123 and the second protrusion 124.

[0083] 1.9 Manufacturing method of wiring circuit board 10 with components and elements The manufacturing method of the wiring circuit board 10 with components and elements will be described with reference to Figures 4 and 6A to 6E.

[0084] As shown in Figure 6A, in this manufacturing method, first, a varnish containing a photosensitive synthetic resin is applied to the metal support layer 21 and dried to prepare the base photosensitive layer. Then, the base photosensitive layer is subjected to gradation exposure, development, and heating. This forms a base insulating layer 22 having a thin base portion 225. In gradation exposure, the base photosensitive layer is exposed through a photomask having a transparent portion, a light-shielding portion, and a semi-transparent portion (not shown). If the base photosensitive layer is negative type, the base photosensitive layer corresponding to the transparent portion forms the base insulating layer 22 excluding the thin base portion 225, the base photosensitive layer corresponding to the light-shielding portion forms at least the second opening 222, and the base photosensitive layer corresponding to the semi-transparent portion forms the thin base portion 225.

[0085] As shown in Figure 6B, in this manufacturing method, the conductive layer 23 is then formed on the upper surface of the base insulating layer 22 and on the upper surface of the metal support layer 21 within the second opening 222. An example of a method for forming the conductive layer 23 is the additive method.

[0086] As shown in Figures 6C and 6D, in this manufacturing method, the cover insulating layer 24 is then formed on the upper surfaces of the base insulating layer 22 and the conductor layer 23. The step of forming the cover insulating layer 24 includes the steps of forming a photosensitive resin layer 245 on the upper surfaces of the base insulating layer 22 and the conductor layer 23 (see Figure 6C), gradation exposure of the photosensitive resin layer 245 (see Figure 6D), and development and heating of the photosensitive resin layer 245 after exposure.

[0087] As shown in Figure 6C, the photosensitive resin layer 245 is formed on the upper surface of the base insulating layer 22 and the conductor layer 23, for example, by coating or attaching.

[0088] In gradation exposure, the photosensitive resin layer 245 is exposed through a photomask 5. The photomask 5 has a transparent portion 51, a light-shielding portion 52, and a semi-transparent portion 53. When the photosensitive resin layer 245 is exposed, the transparent portion 51 allows light to pass through. When the photosensitive resin layer 245 is exposed, the light-shielding portion 52 blocks light. When the photosensitive resin layer 245 is exposed, the semi-transparent portion 53 allows a predetermined amount (predetermined percentage) of light to pass through. The total light transmittance of the semi-transparent portion 53 is, for example, 5% or more, preferably 10% or more, and also, for example, 90% or less, preferably 85% or less.

[0089] Upon development and heating, if the photosensitive resin layer 245 is of the negative type, the photosensitive resin layer 245 corresponding to the transparent portion 51 forms a cover insulating layer 24 (including the base cover portion 241), excluding the thin cover portion 242; the photosensitive resin layer 245 corresponding to the light-shielding portion 52 is removed; and the photosensitive resin layer 245 corresponding to the semi-transparent portion 53 forms a thin cover portion 242.

[0090] As shown in Figure 6E, in this manufacturing method, the metal support layer 21 and the base insulating layer 22 are then processed. Specifically, first, the metal support layer 21 on the other side of the thin-walled base portion 225 is removed by etching. Then, the thin-walled base portion 225 and the lower end of the base insulating layer 22 around the thin-walled base portion 225 are removed by etching. This forms the first opening 221 in the base insulating layer 22. After that, the metal support layer 21 is shaped by etching.

[0091] This allows for the manufacture of the wiring circuit board 1.

[0092] As shown in Figure 4, in this manufacturing method, the electronic components 2 and electronic elements 3 are then mounted on the wiring circuit board 1.

[0093] As shown in Figure 1, an external circuit board (not shown) is electrically connected to the external signal terminal section 234. A power supply unit (not shown) is electrically connected to the external power terminal section 235.

[0094] The signal is input from the external circuit board to the electronic component 2 via the external signal terminal section 234, the signal wiring 238, and the signal terminal section 231 (see Figure 2).

[0095] The power supply current is input from the power supply unit to the other electrode of the electronic element 3 in the first direction via the external power supply terminal section 235, the power supply wiring 239, and the power supply terminal section 233 (see Figure 2).

[0096] As shown in Figure 4, on the other hand, the electrode of one part of the electronic element 3 in the first direction is grounded to the metal support layer 21 via the ground terminal portion 232, the conductor layer 23 of the connection portion 4, and the conductor layer 23 of the second base portion 32.

[0097] When power supply current is input to the electrodes, for example, one electronic element 3 in the second direction extends in the first direction, and the other electronic element 3 in the second direction contracts in the first direction. As a result, the electronic component 2 swings in the second direction.

[0098] When electronic component 2 swings, the lower surface of electronic component 2 contacts (rubs against) the first base portion 31 and the second base portion 32 (base cover portion 241). When electronic component 2 swings, the lower surface of electronic component 2 does not contact the thin-walled cover portion 242.

[0099] 2. Effects of one embodiment In this component and element-equipped wiring circuit board 10, the thin cover portion 242, which is the cover insulating layer 24 covering the ground terminal portion 232, is thinner than the base cover portion 241, which is the cover insulating layer 24 of the second base portion 32. Therefore, contact between the electronic component 2 and the thin cover portion 242 can be suppressed. As a result, the orientation of the electronic component 2 can be reliably controlled by the first base portion 31 and the second base portion 32.

[0100] In this component and element-equipped wiring circuit board 10, the conductor layer 23 in the second base portion 32 electrically connects the ground terminal portion 232 and the metal support layer 21. Therefore, the conductor layer 23 constitutes the second base portion 32 while simultaneously enabling the ground terminal portion 232 to be grounded to the metal support layer 21. In other words, the conductor layer 23 in the second base portion 32 combines the function of a base with the function of ground connection.

[0101] With the manufacturing method described above, as shown in Figure 6C, the photosensitive resin layer 245 is subjected to gradation exposure, so as shown in Figure 6D, the thin-walled cover portion 242 can be made thinner than the base cover portion 241 more easily.

[0102] 3. Variations In the following modifications, the same reference numerals are used for components and processes as in the above-described embodiment, and their detailed descriptions are omitted. Furthermore, the modifications can achieve the same effects and advantages as the first embodiment, unless otherwise specified. Moreover, the first embodiment and its modifications can be combined as appropriate.

[0103] As shown in Figure 7, the cover insulating layer 24 (thin-walled cover portion 242) covering the terminal periphery 2322 has a recess 246. The recess 246 is recessed downwards. In the first direction, the recess 246 is located between the terminal body portion 2321 and the second base portion 32. The recess 246 extends in the second direction.

[0104] With this component and element-equipped wiring circuit board 10, by visually inspecting the recess 246, it is easy to confirm that the cover insulating layer 24 (thin-walled cover portion 242) covering the terminal periphery 2322 is thinner than the cover insulating layer 24 on the second base portion 32. [Explanation of Symbols]

[0105] 1 Wiring circuit board 2 Electronic components 3 Electronic components 10-element wiring circuit board 22 Base insulating layer 23 Conductor layer 24 Cover insulation layer 31. First base section 32. Second base section 231S top surface (signal terminal section) 231 Signal terminal section (an example of the first terminal section) 232 Ground terminal section (an example of the second terminal section) 245 Photosensitive resin layer 246 recess 2321 Terminal body 2321S Bottom surface (terminal body) 2322 Terminal circumference

Claims

1. A wiring circuit board comprising a base insulating layer, a conductor layer disposed on the upper surface of the base insulating layer, and a cover insulating layer disposed on the upper surface of the base insulating layer so as to cover the conductor layer, The conductor layer comprises electronic components and electronic elements electrically connected to it. The aforementioned conductor layer is A first terminal portion having an upper surface exposed from the cover insulating layer and electrically connected to the electronic component, It has a lower surface exposed from the base insulating layer, is electrically connected to the electronic element, and comprises a second terminal portion independent of the first terminal portion, The aforementioned wiring circuit board is The base insulating layer, the conductor layer, and the cover insulating layer are included, and the first base portion is in contact with the lower surface of the electronic component, The base insulating layer, the conductor layer, and the cover insulating layer are included, and the second base portion in contact with the lower surface of the electronic component is further comprising a second base portion that is spaced apart from the first base portion in a first direction perpendicular to the thickness direction, The second terminal portion is positioned adjacent to the second base portion on the opposite side of the first base portion in the first direction and has a terminal body portion having a lower surface exposed from the base insulating layer, and a terminal peripheral portion that is continuous with the peripheral edge of the terminal body portion and positioned on the upper surface of the base insulating layer. The cover insulating layer covering the terminal periphery of the second terminal portion is thinner than the cover insulating layer on the second base portion. A wiring circuit board with components and elements, wherein the cover insulating layer covering the terminal periphery is a recess that is recessed downward, and in the first direction, the recess is located between the terminal body and the second base.

2. The component and wiring circuit board with component according to claim 1, wherein the electronic element has a shape extending in the first direction.

3. The second terminal section is a ground terminal section, The base insulating layer in the second base portion has an opening, The component and element-equipped wiring circuit board according to claim 1, wherein the conductor layer in the second base portion is filled into the opening and electrically connected to the ground terminal portion.

4. A method for manufacturing a wiring circuit board with components and elements as described in claim 1, The process includes a step of forming a cover insulating layer on the upper surface of the conductor layer. The above process is, A step of forming a photosensitive resin layer on the upper surface of the conductor layer, A method for manufacturing a wiring circuit board with components and elements, comprising the step of gradual exposure of the photosensitive resin layer.

Images