Position adjustment method and manufacturing method for processed substrate

Abstract

To provide a position adjustment method or the like, capable of automatically adjusting a relative position between a band and a holding surface.SOLUTION: In a substrate processing device having a rotational stage having a holding surface, and a mounting machine that grips a substrate with a band and transmits the substrate to the holding surface, a position adjustment method is a position adjustment method of adjusting a relative position between the band and the holding surface. The mounting machine contains a revolution mechanism that moves in revolution the band between a mounting position and a saving position, and contains: a first acquisition step of acquiring an inclination output value of an inclination sensor in a state where a circular dummy substrate to which an inclination sensor is fixed is gripped to the band positioned at the movement position; a first calculation step of calculating a first control value in order to control the revolution mechanism so that the dummy substrate is parallel to the holding surface on the basis of the inclination output value; and a first adjustment step of driving the revolution mechanism on the basis of the first control value, and performing the revolution movement of the band.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a position adjustment method and a method for manufacturing a processing substrate.

Background Art

[0002] Patent Document 1 discloses a substrate processing apparatus (bevel polishing system) including a rotary stage (substrate adsorption and holding unit), a transfer machine, and a processing machine (polishing unit). The transfer machine grips a substrate by hand and delivers it to a holding surface on the rotary stage. The processing machine abuts against a peripheral edge portion (bevel portion) of the substrate that rotates together with the rotary stage and polishes the peripheral edge portion.

[0003] In the substrate processing apparatus as described above, from the viewpoint of the reliability of substrate processing, it is desirable to improve the transfer accuracy when delivering the substrate to the rotary stage. Therefore, conventionally, a so-called teaching operation has been performed on the transfer machine. The teaching operation is an operation of storing, in the transfer machine, ideal position coordinates where the hand should be located when the transfer machine delivers the substrate to the rotary stage. This teaching operation has generally been performed by an operator manually adjusting the transfer machine.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the above-described teaching operation by handwork required labor of the operator. In addition, when the proficiency of the operator was low, the adjustment accuracy might be insufficient.

[0006] This invention has been made in consideration of these circumstances and aims to provide a position adjustment method that can automatically adjust the relative position between the hand and the holding surface, and a method for manufacturing a processing substrate. [Means for solving the problem]

[0007] To solve the above problems, a position adjustment method according to embodiment 1 of the present invention is a substrate processing apparatus comprising: a rotating stage having a holding surface for rotatably holding a circular substrate; and a transfer machine that grasps the substrate with a hand and transfers it to the holding surface, wherein the position adjustment method is for adjusting the relative position between the hand and the holding surface, the transfer machine having a pivot mechanism that pivots the hand between a transfer position where the substrate can be transferred to the holding surface and a retracted position where the hand is retracted from the transfer position, and the method includes: a first acquisition step of acquiring a tilt output value of the tilt sensor while a circular dummy substrate to which a tilt sensor is fixed is grasped by the hand at the transfer position; a first calculation step of calculating a first control value for controlling the pivot mechanism so that the dummy substrate is parallel to the holding surface based on the tilt output value obtained in the first acquisition step; and a first adjustment step of driving the pivot mechanism based on the first control value and pivoting the hand.

[0008] Furthermore, aspect 2 of the present invention, in the position adjustment method of aspect 1, the substrate processing apparatus is equipped with a lifting mechanism capable of changing the first relative position between the hand and the holding surface in a direction perpendicular to the holding surface in order to transfer the substrate from the hand to the holding surface, a distance sensor for measuring the distance to the holding surface is fixed to the dummy substrate, and after the first adjustment step, a second acquisition step is performed in which the distance output value of the distance sensor is acquired while the dummy substrate is being held by the hand at the transfer position, a second calculation step is performed in which a second control value is calculated based on the distance output value obtained in the second acquisition step to control the lifting mechanism so that the first relative position is within a predetermined range, and a second adjustment step is performed in which the lifting mechanism is driven based on the second control value to adjust the first relative position.

[0009] Furthermore, aspect 3 of the present invention is a position adjustment method of aspect 1 or aspect 2, wherein the substrate processing apparatus includes a drive mechanism capable of changing the second relative position between the hand and the holding surface in a direction parallel to the holding surface in order to transfer the substrate from the hand to the holding surface, the holding surface is provided with a mark for finding the rotation axis of the rotating stage, a camera for photographing the holding surface is fixed to the dummy substrate, and after the first adjustment step, with the dummy substrate being held by the hand at the transfer position, a third acquisition step is performed to acquire the amount of displacement between the rotation axis and the center of the dummy substrate based on the position of the mark included in the image taken by the camera, the dummy substrate being held by the hand at the transfer position, a third calculation step is performed to calculate a third control value for controlling the drive mechanism so that the rotation axis and the center of the dummy substrate coincide based on the amount of displacement obtained in the third acquisition step, and a third adjustment step is performed to drive the drive mechanism based on the third control value and adjust the second relative position.

[0010] Furthermore, in the fourth aspect of the present invention, in the position adjustment method of the third aspect, in the third acquisition step, the camera takes a photograph while the rotating stage is rotating, and the position of the rotation axis is estimated based on the trajectory in which the mark moves.

[0011] Furthermore, in order to solve the above problems, a method for manufacturing a processed substrate according to aspect 4 of the present invention is a method for manufacturing a processed substrate using a substrate processing apparatus comprising: a rotating stage having a holding surface for rotatably holding a circular substrate; a transfer machine that grasps the substrate with a hand and transfers it to the holding surface; and a processing machine that processes the substrate transferred to the holding surface, wherein the transfer machine has a pivoting mechanism that pivots the hand between a transfer position to which the substrate can be transferred to the holding surface and a retracted position retracted from the transfer position, and the method comprises: a first acquisition step of acquiring a tilt output value of the tilt sensor while a circular dummy substrate to which a tilt sensor is fixed is grasped by the hand at the transfer position; a first calculation step of calculating a first control value for controlling the pivoting mechanism so that the dummy substrate is parallel to the holding surface based on the tilt output value obtained in the first acquisition step; and a moving step of driving the pivoting mechanism based on the first control value and pivoting the hand to the transfer position when processing the substrate with the processing machine. [Effects of the Invention]

[0012] According to the above aspects of the present invention, a position adjustment method that can automatically adjust the relative position between a hand and a holding surface, and a method for manufacturing a processing substrate can be provided. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic diagram showing a substrate processing apparatus according to an embodiment of the present invention. [Figure 2] A perspective view showing a rotating stage and a transfer machine according to an embodiment of the present invention. [Figure 3] This is an enlarged view showing a part of a hand according to an embodiment of the present invention. [Figure 4] This figure shows the hand in the retracted position according to an embodiment of the present invention. [Figure 5] This is a perspective view showing a dummy substrate according to an embodiment of the present invention. [Figure 6] This is a diagram showing a substrate processing apparatus and a dummy substrate according to an embodiment of the present invention. [Figure 7] It is a flowchart showing a position adjustment method according to an embodiment of the present invention. [Figure 8] It is a diagram for explaining a method of estimating the position of the rotation axis of the rotation stage. [Figure 9] It is a diagram for explaining a method of estimating the position of the rotation axis of the rotation stage. [Figure 10] It is a flowchart showing a method of manufacturing a processing substrate according to an embodiment of the present invention.

Mode for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0015] <Substrate processing apparatus> FIG. 1 is a schematic diagram showing a substrate processing apparatus 1 according to the present embodiment. As shown in FIG. 1, the substrate processing apparatus 1 according to the present embodiment includes a plurality (two in the present embodiment) of processing units ********, a control unit 40, a plurality of load ports 51, an EFEM 52, a cleaning unit 53, a dryer 54, a plurality (three in the present embodiment) of temporary tables 55A to 55C, a plurality (four in the present embodiment) of transfer machines 56A to 56D, and a power supply unit 60. The control unit 40 comprehensively controls the operation of the substrate processing apparatus 1. The power supply unit 60 supplies power to each device included in the substrate processing apparatus 1. The number of the processing units ********, the number of the temporary tables 55A to 55C, and the number of the transfer machines 56A to 56D can be appropriately changed.

[0016] In the configuration of the substrate processing apparatus 1 as shown in FIG. 1, a circular substrate W made of a wafer or the like is processed according to the following procedure. That is, the substrate W is placed on the temporary stage 55A from the load port 51 via the transfer machine 56A in the EFEM 52. Next, the substrate W on the temporary stage 55A is transferred by the transfer machine 56B to either the first processing unit 100A or the second processing unit 100B. Then, the substrate W is processed by either the first processing unit 100A or the second processing unit 100B. Next, the processed substrate W (processed substrate) is transferred by the transfer machine 56B to the temporary stage 55B. Thereafter, the substrate W on the temporary stage 55B is transferred by the transfer machine 56C to the cleaning unit 53. And the substrate W is cleaned by the cleaning unit 53. Next, the cleaned substrate W is transferred by the transfer machine 56D to the dryer 54 and dried in the dryer 54. Thereafter, the substrate W is carried out to the load port 51 by the transfer machine 56A.

[0017] As shown in FIG. 1, each of the processing units 100A and 100B according to the present embodiment includes a transfer machine 10, a holding unit 20, a plurality (four in the present embodiment) of processing machines 30, and a housing H. The housing H houses the holding unit 20 and the plurality of processing machines 30. The processing units 100A and 100B according to the present embodiment are devices for polishing the peripheral edge (bevel portion) of the substrate W. Note that the number of the processing machines 30 can be changed as appropriate.

[0018] FIG. 2 is a diagram showing the transfer machine 10 and the holding unit 20 according to the present embodiment. As shown in FIG. 2, the transfer machine 10 according to the present embodiment has a pair of hands 11. The holding unit 20 according to the present embodiment has a rotary stage 21. The rotary stage 21 has a holding surface 21a for holding the substrate W rotatably. The holding surface 21a is, for example, circular.

[0019] The transfer machine 10 grasps the substrate W that has been transported into the housing H with the hand 11 and transfers it to the holding surface 21a. The processing machine 30 performs processing on the substrate W that has been transferred to the holding surface 21a. Specifically, the processing machine 30 contacts the substrate W, which is held on the holding surface 21a and rotates with the rotating stage 21, and polishes the peripheral edge of the substrate W. The processing machine 30 has, for example, a tape containing diamond particles.

[0020] (direction definition) In this embodiment, the positional relationships of each component are explained by setting up an XYZ Cartesian coordinate system. The Z-axis direction is perpendicular to the holding surface 21a. The Y-axis direction is parallel to the holding surface 21a and is the direction in which the transfer machine 10 and the holding part 20 are aligned. The X-axis direction is parallel to the holding surface 21a and is perpendicular to both the Z-axis direction and the Y-axis direction. In this specification, the X-axis direction may be referred to as the left-right direction X, the Y-axis direction as the front-back direction Y, and the Z-axis direction as the up-down direction Z. One direction along the left-right direction X is represented by the direction +X. The direction opposite to the direction +X is represented by the direction -X. Along the front-back direction Y, the direction from the transfer machine 10 toward the holding part 20 is represented by the direction +Y and is referred to as the front. The direction opposite to the direction +Y is represented by the direction -Y and is referred to as the rear. In the vertical Z direction, the direction in which the holding surface 21a of the rotating stage 21 faces is represented by the +Z direction and is called upward. The direction opposite to the +Z direction is represented by the -Z direction and is called downward. Viewing from the vertical Z direction is called a plan view.

[0021] As shown in Figure 2, the holding unit 20 according to this embodiment includes a rotating stage 21, a rotating shaft portion 22, and a rotating mechanism 23. One end of the rotating shaft portion 22 is connected to the rotating stage 21, and the other end of the rotating shaft portion 22 is connected to the rotating mechanism 23. The rotating mechanism 23 rotates the rotating stage 21 around the rotation axis O via the rotating shaft portion 22. A mark M2 is provided at the center of the holding surface 21a of the rotating stage 21 (see Figure 8). The mark M2 is, for example, a dot-shaped mark.

[0022] As shown in Figure 2, the holding unit 20 according to this embodiment is provided with a lifting mechanism 24. The lifting mechanism 24 is a mechanism that can change the relative position between the hand 11 and the holding surface 21a in a direction perpendicular to the holding surface 21a (i.e., the vertical direction Z) in order to transfer the substrate W from the hand 11 to the holding surface 21a. Hereinafter, the "relative position between the hand 11 and the holding surface 21a in a direction perpendicular to the holding surface 21a" may be referred to as the "first relative position". The lifting mechanism 24 according to this embodiment is a mechanism that moves the holding surface 21a in the vertical direction Z via a rotating shaft unit 22 and a rotating stage 21, etc. The lifting mechanism 24 moves the holding surface 21a in the vertical direction Z based on a control value output from, for example, the control unit 40.

[0023] As shown in Figure 2, the transfer machine 10 according to this embodiment includes a pair of hands 11, a swivel mechanism 12, and an opening / closing mechanism 13. In this embodiment, the pair of hands 11 are spaced apart in the left-right direction X and have a symmetrical shape in the left-right direction X. However, the two hands 11 may have different shapes from each other.

[0024] Each hand 11 has a connecting portion 11a, an extension portion 11b, and a gripping portion 11c. The connecting portion 11a is the part that connects to the pivot shaft portion 12a (described later) of the pivot mechanism 12. The extension portion 11b is the part that extends linearly from the connecting portion 11a. The gripping portion 11c is the part that extends from the tip of the extension portion 11b. In this embodiment, each gripping portion 11c has an arc shape that is convex outward in the left-right direction X.

[0025] Each gripping portion 11c is provided with two gripping protrusions 11d. Of the two gripping protrusions 11d, one is located at the tip of the gripping portion 11c, and the other gripping protrusion 11d is located at the base of the gripping portion 11c. The two hands 11 together have a total of four gripping protrusions 11d, and the hands 11 grip the substrate W by contacting these four gripping protrusions 11d with the substrate W.

[0026] Specifically, as shown in Figure 3, the gripping projection 11d according to this embodiment includes a main portion 11d1 and a projection 11d2. The projection 11d2 is located below (towards the back of the paper) the main portion 11d1. In plan view, the projection 11d2 protrudes further toward the center of the substrate W than the main portion 11d1. The main portion 11d1 has a first contact surface 11s1 that faces toward the center of the substrate W in a direction perpendicular to the vertical direction Z. The projection 11d2 has a second contact surface 11s2 that faces upward (towards the front of the paper).

[0027] Then, the substrate W is gripped by the two hands 11 as its side surface contacts the first contact surface 11s1 and its bottom surface contacts the second contact surface 11s2. More specifically, the side surface of the substrate W contacts the four first contact surfaces 11s1 of the four gripping protrusions 11d, thereby suppressing relative movement of the substrate W in the left-right direction X or the front-back direction Y relative to the hands 11. In addition, the bottom surface of the substrate W contacts the four second contact surfaces 11s2, thereby suppressing relative movement of the substrate W in the up-down direction Z relative to the hands 11, and preventing the substrate W from tilting relative to the hands 11.

[0028] The swivel mechanism 12 swivels the hand 11 between the transfer position and the retracted position. Here, the "transfer position" is the position where the substrate W can be transferred to the holding surface 21a, as shown in Figure 2. More specifically, it is the position where the substrate W and the holding surface 21a overlap in a plan view when the hand 11 grips the substrate W. The "retracted position" is the position retracted from the transfer position, as shown in Figure 4. In the example shown in Figure 4, the hand 11 in the retracted position extends in the vertical direction Z. In other words, in the illustrated example, the swivel mechanism 12 swivels the hand 11 by 90°. By swiveling the hand 11 to the retracted position using the swivel mechanism 12, it is possible to reduce the possibility of flying debris generated during processing of the substrate W by the processing machine 30 adhering to the hand 11.

[0029] As shown in Figures 2 and 4, the swivel mechanism 12 according to this embodiment includes a swivel shaft 12a, a belt 12b, and a servo motor 12c. The swivel shaft 12a extends in the left-right direction X and is connected to the connection part 11a of the hand 11. The servo motor 12c rotates a rotating shaft (not shown) based on a control value output from, for example, the control unit 40. The belt 12b connects the rotating shaft of the servo motor 12c to the swivel shaft 12a, and links the rotation of the rotating shaft with the rotation of the swivel shaft 12a. With such a swivel mechanism 12, the swivel shaft 12a can be rotated by driving the servo motor 12c, thereby swiveling the hand 11.

[0030] The opening / closing mechanism 13 opens and closes the two hands 11 in the left-right direction X. In other words, the opening / closing mechanism 13 widens or narrows the distance between the two hands 11 in the left-right direction X. As shown in Figure 2, the opening / closing mechanism 13 according to this embodiment has two movable parts 13a, a guide 13b, and a power mechanism (not shown). The guide 13b extends in the left-right direction X. Each movable part 13a moves along the guide 13b in the left-right direction X by the action of the power mechanism (not shown). The power mechanism (not shown) may include, for example, a servo motor or an actuator. In this embodiment, the movement of the two movable parts 13a is synchronized, and the travel distance of the two movable parts 13a in the left-right direction X is equal.

[0031] As shown in Figure 1, the transfer machine 10 according to this embodiment is provided with a drive mechanism 14. The drive mechanism 14 is a mechanism that can change the relative position between the hand 11 and the holding surface 21a in a direction parallel to the holding surface 21a (for example, the left-right direction X and the front-back direction Y) in order to transfer the substrate W from the hand 11 to the holding surface 21a. Hereinafter, the "relative position between the hand 11 and the holding surface 21a in a direction parallel to the holding surface 21a" may be referred to as the "second relative position". The drive mechanism 14 according to this embodiment moves the hand 11 in two directions, the left-right direction X and the front-back direction Y, by moving the entire transfer machine 10. The drive mechanism 14 moves the transfer machine 10 in two directions, the left-right direction X and the front-back direction Y, based on control values ​​output from, for example, the control unit 40.

[0032] In a substrate processing apparatus 1 that polishes the peripheral edge of a substrate W, as in this embodiment, it is desirable to improve the accuracy (transfer accuracy) when transferring the substrate W to the holding surface 21a. This is because if misalignment occurs when transferring the substrate W to the holding surface 21a, the accuracy of polishing the substrate W by the processing machine 30 will decrease.

[0033] Therefore, in the substrate processing apparatus 1 according to this embodiment, a step is performed to adjust the relative position between the hand 11 and the holding surface 21a before processing the substrate W by the processing machine 30. In this step, for example, a circular dummy substrate D as shown in Figure 5 is used. The diameter of the dummy substrate D is the same as the diameter of the substrate W to be processed by the substrate processing apparatus 1. The dummy substrate D is used while being held by the hand 11 at the transfer position. The dummy substrate D is formed of, for example, a light-transmitting material. A mark M1 is provided at the center of the dummy substrate D. The mark M1 is, for example, a dot-shaped mark.

[0034] As shown in Figure 5, a tilt sensor 71, a distance sensor 72, and a camera 73 are fixed to the dummy substrate D. The tilt sensor 71 acquires the tilt of the dummy substrate D as a tilt output value. The distance sensor 72 acquires the distance in the vertical direction Z from the distance sensor 72 to the holding surface 21a as a distance output value. The camera 73 is configured to capture images of the holding surface 21a via the dummy substrate D (see Figure 8). In this embodiment, the camera 73 is fixed to the center of the dummy substrate D such that the mark M1 on the dummy substrate D is located within the shooting range (angle of view).

[0035] The tilt sensor 71 outputs the acquired tilt output value to the control unit 40 (see Figure 6). The distance sensor 72 outputs the acquired distance output value to the control unit 40. The camera 73 outputs the acquired image to the control unit 40. The camera 73 may also output multiple images taken at predetermined intervals to the control unit 40.

[0036] When the control unit 40 obtains a tilt output value from the tilt sensor 71, it calculates a first control value based on that tilt output value. The "first control value" refers to the control value used to control the swivel mechanism 12 so that the dummy substrate D is parallel to the holding surface 21a. The control unit 40 then drives the swivel mechanism 12 based on the calculated first control value.

[0037] Furthermore, when the control unit 40 obtains a distance output value from the distance sensor 72, it calculates a second control value based on that distance output value. The "second control value" refers to a control value for controlling the lifting mechanism 24 so that the first relative position (the relative position between the hand 11 and the holding surface 21a in a direction perpendicular to the holding surface 21a) is within a predetermined range. The control unit 40 then drives the lifting mechanism 24 based on the calculated second control value.

[0038] Furthermore, when the control unit 40 acquires an image from the camera 73, it acquires the amount of misalignment between the rotation axis O of the rotating stage 21 and the center of the dummy substrate D based on the positions of marks M1 and M2 included in the image. The control unit 40 also calculates a third control value based on the acquired misalignment amount. The "third control value" refers to a control value used to control the drive mechanism 14 so that the rotation axis O and the center of the dummy substrate D coincide. More specifically in this embodiment, the "third control value" refers to a control value used to control the drive mechanism 14 so that the rotation axis O and the mark M1 on the dummy substrate D coincide. The control unit 40 then drives the drive mechanism 14 based on the calculated third control value.

[0039] <Position adjustment method> The following describes a position adjustment method for adjusting the relative position between the hand 11 and the holding surface 21a using a dummy substrate D in the substrate processing apparatus 1 according to this embodiment. Figure 6 is a flowchart of the position adjustment method according to this embodiment.

[0040] (Step S101) First, for example, the conveyor 56B sets the dummy circuit board D onto the hand 11. In other words, the hand 11 grips the dummy circuit board D. At this time, the swivel mechanism 12 is driven as needed to ensure that the hand 11 is in the transfer position.

[0041] (Step S102: First acquisition process) Next, the first acquisition step is performed. In the first acquisition step, the tilt sensor 71 acquires the tilt of the dummy substrate D as a tilt output value. More specifically, the tilt sensor 71 acquires the tilt of the dummy substrate D with respect to the holding surface 21a as a tilt output value. The tilt sensor 71 outputs the acquired tilt output value to the control unit 40. The control unit 40 acquires the tilt output value output by the tilt sensor 71.

[0042] (Step S103: First calculation process) Next, the first calculation step is performed. In the first calculation step, the control unit 40 calculates a first control value based on the acquired inclination output value.

[0043] (Step S104: First adjustment step) Next, the first adjustment step is performed. In the first adjustment step, the control unit 40 drives the pivot mechanism 12 based on the calculated first control value. This makes the dummy substrate D and the holding surface 21a parallel.

[0044] (Step S105: Second acquisition process) Next, the second acquisition process is performed. In the second acquisition process, the distance sensor 72 acquires the distance to the holding surface 21a as a distance output value. More specifically, the distance sensor 72 acquires the distance in the vertical Z direction from the distance sensor 72 to the holding surface 21a as a distance output value. The distance sensor 72 outputs the acquired distance output value to the control unit 40. The control unit 40 acquires the distance output value output by the distance sensor 72.

[0045] (Step S106: Second calculation process) Next, a second calculation step is performed. In the second calculation step, the control unit 40 calculates a second control value based on the acquired distance output value.

[0046] (Step S107: Second adjustment process) Next, a second adjustment step is performed. In the second adjustment step, the control unit 40 drives the lifting mechanism 24 based on the calculated second control value. This adjusts the first relative position (the relative position between the dummy substrate D and the holding surface 21a in the vertical direction Z) so that the first relative position is within a predetermined range.

[0047] (Step S108: Third acquisition process) Next, the third acquisition process is performed. In the third acquisition process, first, the camera 73 photographs the holding surface 21a and outputs one or more of the captured images to the control unit 40. The control unit 40 acquires the output images. Then, based on the positions of marks M1 and M2 included in the images captured by the camera 73, the control unit 40 acquires the amount of displacement between the rotation axis O of the rotating stage 21 and the center (mark M1) of the dummy substrate D.

[0048] In order to obtain the amount of deviation between the rotation axis O of the rotating stage 21 and the center of the dummy substrate D, the control unit 40 estimates the position of the rotation axis O from the image captured by the camera 73. Here, the mark M2 provided on the holding surface 21a is for the control unit 40 to find the rotation axis O. However, the mark M2 is not necessarily located on the rotation axis O (see Figure 8). This is because, due to errors during marking, etc., the mark M2 may be placed at a position offset from the center of the holding surface 21a. Furthermore, even if the mark M2 could be placed at the center of the holding surface 21a, the mark M2 and the rotation axis O may not coincide. This is because, due to factors such as machining errors and assembly errors of each component of the holding part 20, the actual position of the rotation axis O and the position of the center of the holding surface 21a may be misaligned.

[0049] In light of these problems, in the third acquisition step according to this embodiment, the position of the rotation axis O is estimated as follows. That is, in the third acquisition step according to this embodiment, while the rotating stage 21 is rotated around the rotation axis O, the camera 73 takes multiple images of the holding surface 21a at sufficiently short time intervals. Then, the control unit 40 obtains the trajectory of the mark M2 as it moves in conjunction with the rotation of the rotating stage 21 from the multiple acquired images.

[0050] In an ideal situation where there is no misalignment between mark M2 and the axis of rotation O, mark M2 traces a point-like trajectory T1 (point T1), as shown in Figure 9. In this case, the control unit 40 can estimate the center of point T1 to be the axis of rotation O. On the other hand, if there is a misalignment between mark M2 and the axis of rotation O, as shown in Figure 8, mark M2 traces annular trajectories T2 and T3 (rings T2 and T3), as shown in Figure 9. In this case, the control unit 40 can estimate the centers of rings T2 and T3 to be the axis of rotation O. Using this method, even if there is a misalignment between the position of the axis of rotation O and the position of mark M2, the position of the axis of rotation O can be accurately estimated based on the image captured by the camera 73.

[0051] (Step S109) Next, the third calculation step is performed. In the third calculation step, the control unit 40 calculates a third control value based on the acquired deviation amount.

[0052] (Step S110: Third adjustment step) Next, a third adjustment step is performed. In the third adjustment step, the control unit 40 drives the drive mechanism 14 based on the calculated third control value. This adjusts the second relative position (the relative position between the hand 11 and the holding surface 21a in a direction parallel to the holding surface 21a), so that the center of the dummy substrate D and the rotation axis O of the rotating stage 21 coincide.

[0053] (Step S111) Finally, for example, a transporter 56B retrieves the dummy circuit board D from the hand 11.

[0054] As described above, the second and third acquisition processes are performed after the first adjustment process. This is because, before the first adjustment process, the dummy substrate D may be tilted relative to the holding surface 21a, making it difficult to accurately measure the distance between the distance sensor 72 and the holding surface 21a, and to accurately estimate the position of the rotation axis O. By performing the second and third acquisition processes after the first adjustment process, the distance can be measured and the position of the rotation axis O can be estimated while the dummy substrate D and the holding surface 21a are parallel. This improves the accuracy of measurement and estimation. Note that the third acquisition process may be performed before the second acquisition process. That is, after the first adjustment process, the third acquisition process, third calculation process, third adjustment process, second acquisition process, second calculation process, and second adjustment process may be performed in this order.

[0055] Furthermore, the second acquisition step, second calculation step, second adjustment step, third acquisition step, third calculation step, and third adjustment step do not need to be performed. Even in this case, by performing the first acquisition step, first calculation step, and first adjustment step, at least the effect of the substrate W and the holding surface 21a becoming parallel when the hand 11 grips the substrate W can be obtained.

[0056] <Manufacturing method for processed substrates> Next, a method for manufacturing a processed substrate using the substrate processing apparatus 1 according to this embodiment will be described. Figure 10 is a flowchart showing the method for manufacturing a processed substrate according to this embodiment.

[0057] (Step S201: Position adjustment process) First, a position adjustment process is performed. In the position adjustment process, steps S101 to S111 described above are performed using a dummy substrate D. As mentioned above, steps S108 to S110 may be performed before steps S105 to S107, or steps S105 to S110 may be omitted.

[0058] (Step S202: Transfer process) Next, the moving process is performed. In the moving process, the control unit 40 drives the slewing mechanism 12, the lifting mechanism 24, and the drive mechanism 14, respectively, based on the first control value, second control value, and third control value obtained in the position adjustment process, to move the hand 11 to the transfer position.

[0059] (Step S203) Next, the conveyor 56B sets the substrate W onto the hand 11. In other words, the hand 11 grips the substrate W. At this time, the substrate W is positioned in an optimal location for the hand 11 to transfer the substrate W to the holding surface 21a. Specifically, the substrate W and the holding surface 21a are parallel, the first relative position (the relative position of the substrate W and the holding surface 21a in the vertical direction Z) is within a predetermined range, and the center of the substrate W coincides with the rotation axis O of the rotating stage 21. This is because, in the above-described moving process, the swivel mechanism 12, the opening / closing mechanism 13, and the drive mechanism 14 are driven based on the first control value, the second control value, and the third control value.

[0060] (Step S204) Next, for example, the holding surface 21a is raised by the lifting mechanism 24, and the lower surface of the substrate W comes into contact with the holding surface 21a. As a result, the transfer machine 10 transfers the substrate W to the holding surface 21a.

[0061] (Step S205) Next, the swivel mechanism 12 retracts the hand 11. In other words, the swivel mechanism 12 swivels the hand 11 from the transfer position to the retracted position. This is to reduce the possibility, for example, that flying debris generated in the next processing step may adhere to the hand 11.

[0062] (Step S206: Processing step) Next, a processing step is performed. In the processing step, the processing machine 30 processes the substrate W. More specifically in this embodiment, the processing machine 30 contacts the substrate W, which is held by the holding surface 21a and rotates together with the rotating stage 21, and polishes the peripheral edge of the substrate W.

[0063] (Step S207) Finally, the conveyor 56B retrieves the substrate W from the hand 11. Through these steps, a substrate W that has been processed by the processing machine 30, i.e., a processed substrate, can be obtained. If necessary, the substrate W may be washed by the washing unit 53 or dried by the dryer 54.

[0064] As described above, the position adjustment method according to this embodiment is a position adjustment method for adjusting the relative position between the hand 11 and the holding surface 21a in a substrate processing apparatus 1 comprising a rotating stage 21 having a holding surface 21a that rotatably holds a circular substrate W, and a transfer machine 10 that grasps the substrate W with a hand 11 and transfers it to the holding surface 21a, wherein the transfer machine 10 is rotated between a transfer position in which the substrate W can be transferred to the holding surface 21a and a retracted position which is moved away from the transfer position. The system includes: a first acquisition step of acquiring the tilt output value of the tilt sensor 71 while a circular dummy substrate D, which has a pivoting mechanism 12 and a tilt sensor 71 fixed to it, is being held by a hand 11 at a transfer position; a first calculation step of calculating a first control value for controlling the pivoting mechanism 12 so that the dummy substrate D becomes parallel to the holding surface 21a based on the tilt output value obtained in the first acquisition step; and a first adjustment step of driving the pivoting mechanism 12 based on the first control value to pivot and move the hand 11.

[0065] This configuration enables the first acquisition process, the first calculation process, and the first adjustment process to be performed so that when the hand 11 grips the substrate W, the substrate W and the holding surface 21a are parallel. Furthermore, since these processes are performed automatically by the tilt sensor 71, etc., the labor required by the operator and the adjustment accuracy can be improved compared to manually adjusting the relative position between the hand 11 and the holding surface 21a.

[0066] Furthermore, the substrate processing apparatus 1 according to this embodiment includes a lifting mechanism 24 capable of changing the first relative position between the hand 11 and the holding surface 21a in a direction perpendicular to the holding surface 21a in order to transfer the substrate W from the hand 11 to the holding surface 21a. A distance sensor 72 for measuring the distance to the holding surface 21a is fixed to the dummy substrate D. The position adjustment method according to this embodiment includes, after the first adjustment step, a second acquisition step of acquiring the distance output value of the distance sensor 72 while the dummy substrate D is being held by the hand 11 at the transfer position; a second calculation step of calculating a second control value for controlling the lifting mechanism 24 so that the first relative position is within a predetermined range based on the distance output value obtained in the second acquisition step; and a second adjustment step of driving the lifting mechanism 24 based on the second control value to adjust the first relative position. With this configuration, the first relative position can be automatically adjusted and the first relative position can be set within a predetermined range.

[0067] Furthermore, the substrate processing apparatus 1 according to this embodiment includes a drive mechanism 14 capable of changing the second relative position between the hand 11 and the holding surface 21a in a direction parallel to the holding surface 21a in order to transfer the substrate W from the hand 11 to the holding surface 21a, a mark M2 for finding the rotation axis O of the rotating stage 21 provided on the holding surface 21a, and a camera 73 fixed to the dummy substrate D for photographing the holding surface 21a. The position adjustment method according to this embodiment includes, after the first adjustment step, a third acquisition step of acquiring the amount of displacement between the rotation axis O and the center of the dummy substrate D based on the position of the mark M2 included in the image taken by the camera 73 while the dummy substrate D is gripped by the hand 11 at the transfer position, a third calculation step of calculating a third control value for controlling the drive mechanism 14 so that the rotation axis O and the center of the dummy substrate D coincide based on the amount of displacement obtained in the third acquisition step, and a third adjustment step of driving the drive mechanism 14 based on the third control value to adjust the second relative position. This configuration allows for automatic adjustment of the second relative position, aligning the rotation axis O with the center of the dummy substrate D.

[0068] Furthermore, in the third acquisition process, the camera 73 takes images while the rotating stage 21 is rotated, and the position of the rotation axis O is estimated based on the trajectories T1, T2, and T3 in which the mark M2 moves. With this configuration, even if the position of the mark M2 and the position of the rotation axis O are misaligned, the position of the rotation axis O can be estimated, and the amount of misalignment between the rotation axis O and the center of the dummy substrate D can be obtained.

[0069] Furthermore, the method for manufacturing a processed substrate according to this embodiment is a method for manufacturing a processed substrate using a substrate processing apparatus 1 comprising a rotating stage 21 having a holding surface 21a that rotatably holds a circular substrate W, a transfer machine 10 that grasps the substrate W with a hand 11 and transfers it to the holding surface 21a, and a processing machine 30 that processes the substrate W transferred to the holding surface 21a, wherein the above-described position adjustment method is performed and the processing machine 30 processes the substrate W, the method includes a moving step in which a swivel mechanism 12 is driven based on a first control value to swivel and move the hand 11 to the transfer position.

[0070] This configuration allows the substrate W to be transferred to the holding surface 21a while the substrate W and the holding surface 21a are parallel, thereby improving the accuracy of processing by the processing machine 30.

[0071] The technical scope of the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention.

[0072] For example, the lifting mechanism 24 according to the above embodiment was a mechanism that changes the first relative position by moving the holding surface 21a in the vertical direction Z, but the configuration of the lifting mechanism 24 is not limited to this. The lifting mechanism 24 may be a mechanism that moves the hand 11 in the vertical direction Z, or it may be a mechanism that moves both the hand 11 and the holding surface 21a in the vertical direction Z.

[0073] Furthermore, although the drive mechanism 14 according to the above embodiment was a mechanism that changes the second relative position by moving the hand 11 in the left-right direction X and the front-back direction Y, the configuration of the drive mechanism 14 is not limited to this. The drive mechanism 14 may be a mechanism that moves the holding surface 21a in the left-right direction X and the front-back direction Y, or it may be a mechanism that moves both the hand 11 and the holding surface 21a in the left-right direction X and the front-back direction Y.

[0074] Furthermore, the drive mechanism 14 may be a mechanism that changes the relative position between the hand 11 and the holding surface 21a only in the left-right direction X. Alternatively, the drive mechanism 14 may be a mechanism that changes the relative position between the hand 11 and the holding surface 21a only in the front-back direction Y.

[0075] Furthermore, the substrate processing apparatus 1 does not necessarily have to be equipped with a drive mechanism 14. In this case, instead of a drive mechanism 14, the substrate processing apparatus 1 may have a guide mechanism that allows the transfer machine 10 to be manually moved in a direction parallel to the holding surface 21a.

[0076] Furthermore, if the rotation axis O can be estimated, the mark M1 does not need to be provided on the dummy substrate D. Also, if the camera 73 can photograph the holding surface 21a and the distance sensor 72 can measure the distance to the holding surface 21a, the dummy substrate D may be made of a material that does not transmit light. For example, a hole may be formed in the dummy substrate D for the camera 73 to photograph the holding surface 21a.

[0077] Furthermore, in the above embodiment, the swivel mechanism 12, the lifting mechanism 24, and the drive mechanism 14 were all controlled collectively by the control unit 40, but separate control units may be provided for each of the swivel mechanism 12, the lifting mechanism 24, and the drive mechanism 14.

[0078] Furthermore, without departing from the spirit of the present invention, the components in the above-described embodiments may be replaced with well-known components as appropriate, and the above-described embodiments and modifications may be combined as appropriate. [Explanation of symbols]

[0079] 1...Substrate processing device 10...Transfer device 11...Hand 12...Swivel mechanism 14...Drive mechanism 21...Rotating stage 21a...Holding surface 24...Lifting mechanism 30...Processing machine 71...Tilt sensor 72...Distance sensor 73...Camera W...Substrate D...Dummy substrate M2...Mark

Claims

1. A substrate processing apparatus comprising a rotating stage having a holding surface for rotatably holding a circular substrate, and a transfer machine that grasps the substrate with a hand and transfers it to the holding surface, wherein a position adjustment method is used to adjust the relative position between the hand and the holding surface, The transfer machine has a pivoting mechanism that pivots the hand between a transfer position in which the substrate can be transferred to the holding surface and a retracted position which is retracted from the transfer position. A first acquisition step involves acquiring the tilt output value of the tilt sensor while a circular dummy circuit board, to which a tilt sensor is fixed, is held by the hand at the transfer position, and A first calculation step is to calculate a first control value for controlling the rotation mechanism so that the dummy substrate is parallel to the holding surface, based on the tilt output value obtained in the first acquisition step, A position adjustment method comprising: a first adjustment step of driving the swivel mechanism based on the first control value and swiveling the hand.

2. The substrate processing apparatus includes a lifting mechanism capable of changing the first relative position between the hand and the holding surface in a direction perpendicular to the holding surface in order to transfer the substrate from the hand to the holding surface. A distance sensor for measuring the distance to the holding surface is fixed to the dummy substrate. A second acquisition step is performed after the first adjustment step, in which the distance output value of the distance sensor is acquired while the dummy substrate is being held by the hand at the transfer position, A second calculation step involves calculating a second control value for controlling the lifting mechanism so that the first relative position is within a predetermined range, based on the distance output value obtained in the second acquisition step. The position adjustment method according to claim 1, comprising a second adjustment step of driving the lifting mechanism based on the second control value to adjust the first relative position.

3. The substrate processing apparatus includes a drive mechanism capable of changing the second relative position between the hand and the holding surface in a direction parallel to the holding surface in order to transfer the substrate from the hand to the holding surface. The holding surface is provided with a mark for finding the rotation axis of the rotating stage. A camera for photographing the holding surface is fixed to the dummy circuit board. A third acquisition step is performed, after the first adjustment step, in which the dummy substrate is held by the hand at the transfer position, and the amount of displacement between the rotation axis and the center of the dummy substrate is acquired based on the position of the mark included in the image captured by the camera, A third calculation step, which calculates a third control value for controlling the drive mechanism so that the rotation axis and the center of the dummy substrate coincide, based on the amount of displacement obtained in the third acquisition step, A position adjustment method according to claim 1 or 2, comprising a third adjustment step of driving the drive mechanism based on the third control value and adjusting the second relative position.

4. The position adjustment method according to claim 3, wherein in the third acquisition step, the camera takes a photograph while the rotating stage is rotating, and the position of the rotation axis is estimated based on the trajectory in which the mark moves.

5. A method for manufacturing a processed substrate using a substrate processing apparatus comprising: a rotating stage having a holding surface for rotatably holding a circular substrate; a transfer machine that grasps the substrate with a hand and transfers it to the holding surface; and a processing machine that performs processing on the substrate transferred to the holding surface, The transfer machine has a pivoting mechanism that pivots the hand between a transfer position in which the substrate can be transferred to the holding surface and a retracted position which is retracted from the transfer position. A first acquisition step involves acquiring the tilt output value of the tilt sensor while a circular dummy circuit board, to which a tilt sensor is fixed, is held by the hand at the transfer position, and A first calculation step is to calculate a first control value for controlling the rotation mechanism so that the dummy substrate is parallel to the holding surface, based on the tilt output value obtained in the first acquisition step, A method for manufacturing a processed substrate, comprising: a moving step of driving the swivel mechanism based on the first control value to swivel and move the hand to the transfer position when processing the substrate with the processing machine.

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