Device for transporting semiconductor circuits

Abstract

To provide a device for transferring a semiconductor circuit or a chip from a first position to a second position.SOLUTION: A device for transferring a chip 100 comprises: a rotatable transfer assembly 110 including at least two transfer heads 120a and 120b, each transfer head being structured for picking-up a semiconductor circuit or a chip 1 at a first position, and for positioning the chip in a second position through a rotation of the transfer assembly about an axis of rotation 110z; a transfer assembly actuator 130 that is for driving the transfer assembly together with the transfer heads about the axis of rotation; and transfer actuators 140a and 140b that are structured for actuating each transfer head in a radial direction relative to the axis of rotation. Each transfer head actuator is attached to the transfer assembly actuator and includes an actuator element coupled to each transfer head. The actuator element is actuated in a direction of the axis of rotation relative to the transfer assembly actuator.SELECTED DRAWING: Figure 2

Description

Technical Field

[0004] , , ,

[0001] The present invention relates to an apparatus for transporting semiconductor circuits.

Background Art

[0002] Semiconductor circuits are manufactured in a matrix having a plurality of rows and columns of such circuits on and within a circular planar substrate, also called a wafer. Although not a strict requirement, such circuits are typically all identical and all have the same dimensions. After manufacture of the wafer, the surface of the wafer is adhered to a flexible carrier film. Thereafter, each circuit is physically separated by cutting from one surface of the wafer to the opposite surface without cutting the carrier film. Thus, a plurality of individual semiconductor circuits (hereinafter also referred to as "chips" or "dies") disposed on the carrier film are obtained. <​​​​​Using at least two conventional rotary motors, operated independently of each other, to rotate a rotary-driven transport assembly and a rotary-driven transport head separately has several significant structural and operational drawbacks. One drawback is that because the rotary-driven transport head is connected to the same rotary transport head motor, its semiconductor circuitry must be operated sequentially rather than in parallel, resulting in a reduction in machine speed.

[0005] Another drawback is quality issues. Due to hardware dimensional tolerances, semiconductor circuits may not be positioned correctly as intended (for example, out of focus for the inspection camera). Also, due to the large impact mass, connecting multiple transport heads to the same rotary transport head motor can cause chip damage, leading to quality issues. Furthermore, friction from the rotary bearings of the rotary motors used can interfere with the positional control of the transport heads, also resulting in quality issues. As a solution, one could consider connecting each transport head to its own rotary transport head motor to control the operation of each individual transport head, but this is not possible due to volume constraints in the overall structure of the device.

[0006] Another drawback is that adapting a chip transport system from one configuration to another can result in significant conversion time, leading to a loss of machine uptime. Chip transport systems have many configurations (e.g., different numbers of transport heads, different positions for collecting, inspecting, and positioning semiconductor circuits at several different locations). Furthermore, their structure consumes volume to support the rotary motor, making maintenance of such chip transport systems burdensome.

[0007] The transport module leads to inaccuracies and quality problems in chip pick-and-place placement. These mechanical inaccuracies arise because each degree of freedom (inward rotation and radial translation, or vice versa) has its own bearing (in the current design, rotation is reduced to 1 / 3), and because there are fewer actuators than transport heads, it becomes impossible to perform independent corrections for each transport head via servo motors. [Overview of the project] [Problems that the invention aims to solve]

[0008] Therefore, the object of this disclosure is to provide an improved chip transport device with reduced structural dimensions by incorporating simpler operation and drive mechanisms, enabling faster operation of semiconductor circuits, reduced impact mass, and improved operational quality through reduced friction. [Means for solving the problem]

[0009] According to a first example of the present disclosure, a device is proposed for transporting a chip from a first position to at least a second position, the device comprising: at least one rotatable transport assembly having at least two transport heads, each transport head being structured to pick up a chip at a first position and to position the chip at at least a second position through rotation of at least one rotatable transport assembly about a rotation axis; a transport assembly actuator for driving the rotatable transport assembly together with at least two transport heads about a rotation axis; and at least a first transport head actuator structured to actuate at least one transport head radially with respect to the rotation axis, the at least first transport head actuator comprising an actuator element attached to the rotatable transport assembly actuator and coupled to at least one transport head, the actuator element being structured to actuate relative to the rotatable transport assembly actuator in the direction of the rotation axis.

[0010] Actuator elements structured to act in the direction of the axis of rotation for rotatable transport assembly actuators solve the mechanical inaccuracies in known applications. The complete structure can rotate around an axis of rotation requiring only one rotary motor or actuator, resulting in a simpler structure with a reduced number of moving parts such as bearings. Overall, this results in improved accuracy in the operation of individual semiconductor circuits in a small-volume device, and reduces machine uptime and maintenance time. With this simplified mechanical structure, each transport head can be actuated by its own transport head actuator, and this configuration allows for accuracy compensation for each transport head / semiconductor circuit, improving operational flexibility and accuracy per transport head. Alternatively, two (or more) transport heads can be actuated by a single transport head actuator, enabling parallel operation of semiconductor chips.

[0011] In a preferred example, the actuator element is coupled to at least one transport head by a bar-linkage or cable linkage mechanism.

[0012] Preferably, at least the first transport head actuator comprises an actuator component attached to a rotatable transport assembly actuator, and an actuator element structured to act in the direction of the axis of rotation relative to the actuator component. Here, the complete transport head actuator rotates together with a transport assembly actuator having a separate component structured to actuate one or more transport heads for semiconductor circuit manipulation.

[0013] In a preferred example, at least the first conveyor head actuator includes a magnetic coil drive unit for acting the actuator element in the direction of the rotation axis relative to the rotatable conveyor assembly actuator. Such a non-contact operating principle ensures appropriate mechanical precision and instantaneous response time, further improving the overall machine speed.

[0014] In particular, to further improve instantaneous response time and mechanical speed, the magnetic coil drive unit comprises a plurality of magnetic elements attached to the actuator element so as to surround a coil element attached to the actuator component. In another embodiment, the plurality of magnetic elements are attached to the actuator component, while the coil element is attached to the actuator element.

[0015] In one example, at least the first conveying head actuator includes guide elements that interconnect the actuator elements and actuator components, the guide elements being selected from, but not limited to, membrane elements, spring elements, ball bearings, air bearings, and the like. Here again, such a structure improves mechanical precision and instantaneous response time, further increasing the overall machine speed.

[0016] In further embodiments of the present disclosure, at least a first transport head actuator further includes at least one sensing device for sensing displacement of an actuator element in the direction of the axis of rotation relative to a rotatable transport assembly actuator. Such sensing allows for precise operation of the transport head radially with respect to the axis of rotation, thereby improving the accuracy of semiconductor circuit operation. The sensing device is mounted on the transport head actuator, which is then mounted on the rotatable transport assembly actuator, so that displacement changes are sensed in the direction of the axis of rotation regardless of the rotation (direction and velocity) of the entire structure.

[0017] As an example, the sensing device can be embodied as a linear encoder that senses an encoded scale placed on an actuator element, which encodes a position along the axis of rotation. The linear encoder is structured to scan the encoded scale to convert the encoded position into an analog or digital signal. To ensure mechanical speed and efficient readout, the sensing device is mounted on the actuator component, the encoded scale is mounted on the actuator component, and the actuator element is displaced relative to the actuator component in a direction along the axis of rotation.

[0018] Because the structure of the apparatus according to this disclosure is simpler and has a smaller volume, the number of conveying heads can be increased to, for example, 4, 6, 8, 16, or even more. Therefore, the structure of the apparatus can be extended only in the direction of the rotation axis by attaching additional conveying head actuators to at least the first conveying head actuator as viewed in the direction of the rotation axis.

[0019] It should be noted that the improved structure of the apparatus according to this disclosure (smaller volume dimensions, less mechanical inaccuracy, and less friction between its moving parts) allows each transport head to be actuated by its own transport head actuator. On the other hand, each transport head actuator can be structured to actuate two or more transport heads, depending on the implementation of the chip transport device.

[0020] In one example, the apparatus further includes a wafer placement device structured to position a wafer having a chip surface extending in a first plane at a first position, and a lead frame placement device for positioning a lead frame, or antenna foil or packaging tape, etc., having a bond surface extending in a second plane at a second position.

[0021] In additional implementations, the apparatus according to this disclosure may include a chip surface inspection device extending in a third plane at a third position. For example, the third position may be an intermediate position between the first and second positions when viewed in the rotational direction of the rotatable transport assembly, allowing semiconductor circuits picked up by the transport head at the first position to be visually inspected at the intermediate third position, and then the inspected semiconductor circuits to be placed at the second position by the transport head.

[0022] Furthermore, the apparatus according to this disclosure may include, for example, a chip transport device extending in a fourth plane at a fourth position to transport semiconductor circuits to a further processing line. [Brief explanation of the drawing]

[0023] Herein, the present disclosure will be explained with reference to the drawings.

[0024] [Figure 1] This is a schematic description of a device for transporting semiconductor circuits using prior art. [Figure 2] This is a schematic description of the apparatus for transporting semiconductor circuits as disclosed herein. [Figure 3]A further example of an apparatus for transporting a semiconductor circuit according to the present disclosure. [Figure 4] A further example of an apparatus for transporting a semiconductor circuit according to the present disclosure. [Figure 5] A further example of an apparatus for transporting a semiconductor circuit according to the present disclosure. [Figure 6] A detailed diagram of an example of a transport head actuator according to the present disclosure for implementation in an apparatus according to the present disclosure. [Figure 7] A detailed diagram of an example of a transport head actuator according to the present disclosure for implementation in an apparatus according to the present disclosure. <​​​​​​​​​​​​​​​​​​​​Prior art devices for transporting chips are indicated by reference numeral 10. Throughout this specification, individual semiconductor circuits or chips are indicated by reference numeral 1.

[0029] The device 10 consists of a transport assembly 11 that is rotationally driven by a rotary motor or a transport assembly actuator 13. The transport assembly actuator 13 is provided with one or more transport assembly actuator bearings 13' and can rotate the transport assembly 10 around a rotation axis, which is indicated by reference numeral 11z in Figure 1.

[0030] The transport assembly 11 is preferably fitted with at least two transport heads 12 (indicated as 12a-12b). The apparatus 10 can operate with one transport head 12 fitted to the rotatable transport assembly 11, but (considering the machine speed) it is preferable to have at least two transport heads 12a-12b fitted to the transport assembly 11. Each transport head 12;12a-12b is structured to pick up a semiconductor circuit or chip 1 in a first position and position the chip 1 in at least a second position through rotation of the rotatable transport assembly 11 by the transport assembly actuator 13 around the rotation axis 11z.

[0031] Furthermore, as shown in Figure 1, each transport head 12a-12b is similarly driven by a corresponding rotary transport head motor 14(14a-14b) to properly operate the semiconductor circuit (chip) 1 at each first and second position, for example, to pick up the chip 1 from a wafer placed at the first position and to place the chip 1 on a carrier film at the second position. Each rotary transport head motor 14a, 14b is provided with transport head actuator bearings 14a'-14b' that allow rotation around their respective rotation axes 14a-z, 14b-z. The rotation axes 11z, 14a-z, 14b-z are not perfectly concentric with each other, resulting in mechanical precision of the transport heads 12a-12b. Furthermore, each rotary transport head motor 14a, 14b is provided with coupling mechanisms 15a, 15b that operate the transport heads 12a-12b to pick up the semiconductor circuit or chip 1 at the first position and to position or place the chip 1 at the second position.

[0032] In this known configuration, rotary motors 14a-14b are mounted for each conveyor head 12a-12b. However, in a more common configuration, two or four rotary-driven conveyor heads 12 can also be connected to the same rotary conveyor head actuator 14. Such a configuration has several significant structural and operational drawbacks. The main drawback is that, because the rotary-driven conveyor heads are connected to the same rotary conveyor head motor, their semiconductor circuitry must be operated sequentially rather than in parallel, resulting in a decrease in machine speed.

[0033] Another drawback relates to quality issues caused by friction from the rotary bearings 13', 14a', and 14b' from the rotary actuators or motors used, which hinders the positional control of the conveyor head operation. As a solution, it is conceivable to connect each conveyor head 12 to an individual rotary conveyor head actuator (motor) to control the operation of each individual conveyor head, but this is not possible due to volume constraints in the overall structure of the device.

[0034] Figure 2 provides a schematic depiction of a first example of the present disclosure, in which a device for transporting a semiconductor circuit or chip 1 from a first position to at least a second position is indicated by reference numeral 100. The device 100 comprises at least one rotatable transport assembly 110. At least two transport heads 120 (120a-120b) are mounted on the rotatable transport assembly 110. Similarly, each transport head 120 (120a-120b) serves to pick up the chip 1 from the first position and to position the chip 1 at least a second position through radial displacement of the rotatable transport assembly 110 with respect to its axis of rotation 110z. Rotating at least one rotatable transport assembly 110 about its axis of rotation 110z ensures that each transport head 120 (120a-120b) is displaced from the first position to at least a second position through rotation.

[0035] The rotation of the transport assembly 110 around the rotation axis 110z is achieved by the transport assembly actuator 130. According to this disclosure, the transport assembly actuator 130, together with at least two transport heads 120 (120a-120b), drives or rotates the rotatable transport assembly 110 around a single rotation axis 110z. In accordance with this disclosure, the complete structure of the device 100 as depicted in Figure 2 can rotate around a single rotation axis 110z using only one rotary motor or actuator 130, thereby significantly reducing the number of moving parts and obtaining a simplified structure using only one bearing 130'. Furthermore, there is no mechanical inaccuracy due to an eccentric rotation axis as in known devices shown in Figure 1. Overall, this improves the precision of operation of individual semiconductor circuits, reduces machine uptime and repair time, and results in a device 100 with small volume dimensions.

[0036] Furthermore, at least one first transport head actuator 140(140a) is used to actuate at least one corresponding transport head 120(120a) radially with respect to the rotation axis 110z, as shown by the arrow R in Figure 2. In this example, two transport head actuators 140a-140b are used to actuate the corresponding transport heads 120a-120b, with the assistance of a connecting mechanism 150a-150b such as a bar link mechanism or a cable mechanism. As shown in the figure, the transport head actuators 140(140a-140b) are mounted on a rotatable transport assembly actuator 130.

[0037] Therefore, the complete configuration of the apparatus 100 according to this disclosure, consisting of a transport assembly 110, a plurality of transport heads 120, a transport assembly actuator 130, and a transport head actuator 140, is mounted on a single bearing 130' and is fully rotatable around a single pivot axis 110z. The advantages of such a simpler structure are obvious. In addition to a significant reduction in the number of moving parts, the volumetric dimensions of such a configuration are smaller, and in addition to an increase in the speed of the machine, the tip 1 can be operated faster and with greater precision. Also, due to the simple structure, the operating time loss and maintenance time of the machine are reduced.

[0038] Figures 3–5 illustrate in more detail an example of the apparatus according to the present disclosure, indicated by reference numerals 100 (Figure 3), 100' (Figure 4), and 100” (Figure 5). In Figure 3, the chip transport apparatus 100 according to the present disclosure consists of a transport assembly 110, a transport assembly actuator 130, a number (in this case, eight) of transport heads 120a–120h, and one transport head actuator 140a. Note that the number of transport heads 120 is arbitrary and depends on the type of application of the apparatus 100. Thus, one, two, four, eight, or even sixteen transport heads 120 (in which case indicated by reference numerals 120a–120p) can be mounted on the rotatable transport assembly 110.

[0039] In this example, each conveyor head 120a-120h consists of a conveyor head body 121a-121h attached to the conveyor assembly 110, and conveyor head arms 122a-122h that are movably connected or hinged to the conveyor head body 121a-121h. Each conveyor head arm 122a-122h carries a pickup element 123a-123h that can interact with the chip 1 in a known manner. For simplicity, only the reference figures 121a-122a-123a of the auxiliary conveyor head 120a are shown in Figure 3, but it is obvious that in the configuration of eight conveyor heads 120, the other seven conveyor heads 120b-120h also have corresponding parts 121x-122x-123x (where x represents the associated suffix bh).

[0040] The transport head arms 122a-122h are connected to the transport head actuator 140a via the corresponding cable mechanism 150a-150h. When the cable mechanism 150a-150h is activated (as will be described in detail later in this specification), the transport head arms 122a-122h are displaced relative to the corresponding transport head body 121a-121h, causing the pickup elements 123a-123h to move radially with respect to the rotation axis 110z, for example, away from or toward the axis 110z, as indicated by the arrow R in Figure 2. As the pickup elements 123a-123h move radially, the chip 1 can be picked up from the wafer positioned at the first position and placed on the carrier film at the second position.

[0041] All transport heads 120a-120h can be linked to one identical transport head actuator 140a, as shown in Figure 3, for example, but additional transport head actuators 140b, 140c, 140d, etc., can be implemented. For example, as shown in Figure 4, since the overall structure of the chip transport device 100' according to this disclosure rotates around a single rotation axis 110z, at least one additional transport head actuator 140b can be attached to the first transport head actuator 140a as viewed in the direction of the rotation axis 110z. This allows the device of this disclosure to be advantageously upscaled along the rotation axis 110z in terms of machine speed by expanding the device with additional transport head actuators 140(ad) to actuate one or more additional transport heads 120a-120h attached to the rotatable transport assembly 110.

[0042] An example of this is shown in Figure 5, which depicts a chip transport device 100” according to the present disclosure, which rotates around a single rotation axis 110z and is provided with four transport head actuators 140a-140b-140c-140d, each of which is mounted on a preceding transport head actuator as viewed in the direction of the rotation axis 110z. The complete arrangement of the multiple transport head actuators is mounted on a rotatable transport assembly 110.

[0043] As clearly shown in Figures 3 to 5, in some embodiments of the apparatus 100-100'-100" according to this disclosure, the volumetric dimensions are small because only the elongated structural dimensions of the apparatus viewed in the direction of the rotation axis change depending on the number of conveying head actuators 140 attached to the rotatable conveying assembly 110. Therefore, this design configuration has less mechanical inaccuracy and less friction between its moving parts because the overall structure rotates around a single rotation axis 110z and requires a single bearing 130' (Figure 2).

[0044] By adding an additional transport head actuator 140 along the rotation axis 110z in this way, each transport head 120 can be operated by its own transport head actuator 140. On the other hand, each transport head actuator 140 can be structured to operate two or more transport heads 120, depending on the embodiment of the chip transport device 100-100'-100''. For example, in Figure 3, the eight transport heads 120a-120h can be operated together and simultaneously by a single transport head actuator 140a, whereas in the device 100' of Figure 4, the eight transport heads 120a-120h are each divided into two separate sets of four transport heads, for example, one set consisting of transport heads 120a, 120c, 120e and 120g, and the other set consisting of transport heads 120b, 120d, Similarly, in the apparatus 100'' of Figure 5, the eight conveyor heads 120a-120h can be grouped into four separate sets of two conveyor heads each, for example, one set consisting of conveyor heads 120a and 120e, a second set consisting of conveyor heads 120b and 120f, a third set consisting of conveyor heads 120c and 120g, and a fourth set consisting of conveyor heads 120d and 120h. Similarly, each set is operated together and simultaneously by one of the four conveyor head actuators 140a-140d, and all operation / control is provided via the respective cable mechanisms 150a-150h.

[0045] Each transport head 120 can be operated by its own transport head actuator 140, significantly improving the operational flexibility and precision per transport head. Thus, a one-on-one configuration enables precision correction for each transport head 120 / semiconductor circuit 1. Alternatively, two (or more) transport heads can be operated by a single transport head actuator 20, enabling parallel operation of semiconductor chips.

[0046] Figures 6 to 8 illustrate the function of the transport head actuator 140 in more detail. In Figures 6 to 8, the transport head actuator is indicated by the reference numeral 140a. However, when multiple transport head actuators 140 are used, for example, as depicted in Figures 4 and 5, the subsequent suffix is ​​applied to the first transport head actuator and subsequent transport head actuators 140. Thus, as described above, in one example, each transport head 120x can be actuated by its own transport head actuator 140x (where x represents the relevant suffix up to ah, or even up to ap). The transport head actuator 140(ah) can have a more or less cylindrical configuration, reducing impact mass and balancing inertia during rotation around the rotation axis 110z. Each transport head actuator 140(ah) has an actuator element 142(ah), which is coupled to at least one transport head 120(ah) via a corresponding connection mechanism 150(ah). The actuator element 142(ah) is structured to act in the direction of the rotation axis 110z relative to the rotatable transport assembly actuator 130. The movement of the actuator element 142(ah) acting in the direction of the rotation axis 110z relative to the rotatable transport assembly actuator 130 solves the problem of mechanical inaccuracy in known applications.

[0047] In particular, using a connection mechanism 150(ah), such as a bar link mechanism or cable mechanism, to interconnect the actuator element 142(ah) with at least one transport head 120(ah) results in a robust and reliable operating mechanism with no friction or mechanical play. Therefore, this operating mechanism improves the mechanical precision of the operation of the semiconductor circuit 1.

[0048] As further shown in Figure 6, reference numeral 141(ah) indicates an actuator component as a further part of the associated transport head actuator 140(ah). The actuator component 141(ah) is mounted to be fixed to the rotatable transport assembly actuator 130. In a non-limiting example, the actuator component 141(ah) may be formed as a ring-shaped base element 141-1(ah), to which an extension part 141-2(ah) is provided, uniformly distributed along its circumference and extending in the direction of the rotation axis 110z. The extension part 141-2(ah) is mounted to be fixed to the rotatable transport assembly actuator 130.

[0049] The actuator element 142(ah) is also structured as a ring-shaped element, and the ring-shaped element has several openings 142-1(ah) evenly distributed along its circumference. Each extension part 141-2(ah) is housed in the corresponding opening 142-1(ah), allowing for contactless movement of the actuator element 142(ah) in the direction of the rotation axis 110z relative to the actuator part 141(ah).

[0050] Similarly, looking at Figures 4 and 5, which show multiple transport head actuators 140a-140d mounted side by side along the rotation axis 110z, at least one additional actuator component 141b-141d of transport head actuators 140b-140d is attached to the actuator component 141a-140c of the previous transport head actuators 140a-140c, thus creating a single rigid structure with minimal moving parts, thus reducing friction and further improving mechanical precision.

[0051] In the examples shown in Figures 7 and 8, each transport head actuator 140(ah) is equipped with a magnetic coil drive unit 148(ah) for acting an actuator element 142(ah) in the direction of the rotation axis 110z relative to a rotatable transport assembly actuator 130 (and actuator component 141(ah)). Such a non-contact operating principle ensures appropriate mechanical precision and instantaneous response time, further improving the overall machine speed.

[0052] In particular, to further improve instantaneous response time and machine speed, the magnetic coil drive unit 148(ah) includes a plurality of magnetic elements 144(ah) attached to the inner circumference of a ring-shaped actuator element 142(ah) that surrounds a coil element 145(ah) attached to the actuator component 141(ah). In an alternative embodiment, the plurality of magnetic elements 144(ah) are attached to the actuator component 141(ah), while the coil element 145(ah) is attached to the actuator element 142(ah).

[0053] To ensure mechanical precision and instantaneous response time, when the actuator element 142(ah) is displaced relative to the actuator component 141(ah) in the direction of the rotation axis 110z, each transport head actuator 140(ah) consists of a guide element 143(ah) that interconnects the actuator element 142(ah) and the actuator component 141(ah). The guide element 143(ah) can be selected from, but is not limited to, a group consisting of membrane elements, spring elements, ball bearings, air bearings, etc. In the example shown in Figure 8, the guide element 141(ah) is formed as a disc-shaped spring element having a first mounting point 143-1(ah) for attachment / interconnection to the extension part 141-2(ah) of the actuator component 141(ah) and a second mounting point 143-2(ah) for attachment / interconnection to the actuator element 142(ah). This structure enables frictionless movement of multiple parts without mechanical play, ensuring reliability and precision of operation.

[0054] Therefore, with the actuator component 141(ah) attached to the transport assembly actuator 130, the complete transport head actuator 140(ah) rotates together with the transport assembly actuator 130 (and the rotatable transport assembly 110 having multiple transport heads 120) around the rotation axis 110z, while the separate actuator component 141(ah) can be displaced in the direction of the rotation axis 110z relative to the rotatable transport assembly actuator 130 (and the rotatable transport assembly 110 having several transport heads 120) when the magnetic coil drive unit 148, combined with the guide element 143(ah), is activated to actuate one or more transport heads 120(ah) for semiconductor circuit operation via the associated cable mechanism 150(ah).

[0055] When the magnetic coil drive unit 148(ah) is operated, the actuator element 142(ah) is displaced relative to the actuator component 141 in the direction of the rotation axis 110z by the generated electromagnetic force. The actuator element 142(ah) is connected to fix one end of the corresponding cable mechanism 150(ah), while the other end of the cable mechanism 150(ah) is connected to fix the corresponding transport head 120(ah), and in particular to the corresponding transport head arms 122a-122h. The displacement of the actuator element 142(ah) (forward and backward along the rotation axis) is transmitted to the transport head arms 122(ah) via the cable mechanism 150(ah), and the associated pickup element 123(ah) can be displaced radially relative to the rotation axis 110z, as shown by arrow R in Figure 2, in order to perform the respective pickup and placement of the chip 1.

[0056] In Figures 3 to 5 and 8, reference numeral 146(ad) indicates a sensing device for sensing the displacement of actuator element 142 in the direction of the rotation axis 110z relative to actuator component 141(ah) / rotatable transport assembly actuator 130 / rotatable transport assembly 110 / transport head 120(ah). Such sensing allows for precise operation of the transport head 120, which is radially corresponding to the rotation axis 110z, thereby improving the accuracy of semiconductor circuit operation. The sensing device 146(ah) is attached to the transport head actuator 140(ah), which is then attached to the rotatable transport assembly actuator 130, so that the displacement change is sensed in the direction of the rotation axis 110z, independently of the rotation (direction and / or velocity) of the overall structure 100-100'-100''.

[0057] For the purpose of redundancy and to further improve mechanical precision, each transport head 120(ah) may be equipped with multiple sensing devices 146(ah).

[0058] In one example, the sensing device 146 can be embodied as a linear encoder that senses an encoding scale 147(ah) located on a surface, for example, the outer circumference of a disc-shaped actuator element 142(ah), which encodes a position along the rotation axis 110z. The linear encoder 146 is structured to scan the encoding scale 147 in order to convert the encoded position into an analog or digital signal. [Explanation of Symbols]

[0059] 1. Semiconductor circuit or chip prior art 10 Chip transport device 11 Rotatable Transport Assembly Rotation axis of 11z transport assembly 12a-12b Conveyor head 13. Transport Assembly Actuator 13' Conveyor Assembly Actuator Bearing 14a-14b Rotatable transport head actuator 14a'-14b' Conveyor head actuator bearing 14a-z Rotation axis of transport head actuator 14a 14b-z Rotation axis of the transport head actuator 14b 15a-15b Connection mechanism for transport heads 12a-12b This disclosure 100-100'-100" Chip Transport Device (First, Second, and Third Embodiments) 110 Rotatable Transport Assembly Rotation axis of the 110z transport assembly 120 (ah) conveyor head 121(ah) Conveyor head body 122(ah) Transport head arm 123(ah) Pick-up elements 130 Transport Assembly Actuator 130' Conveyor Assembly Actuator Bearing 140(ah) Conveyor head actuator for conveyor heads 120a-120h 141(ah) Actuator Parts 142(ah) Actuator element 143(ah) Guide elements, e.g., spring elements, ball bearings, pneumatic bearings 144(ah) magnetic element 145(ah) coil element 146 (ah) sensing device (linear encoder) 147 (ah) encoding scale 148Ah Magnetic Coil Drive Unit 150(ah) Connection mechanism for transport heads 120a-120h

Claims

1. A device for transporting a chip from a first position to at least a second position, At least one rotatable transport assembly comprising at least two transport heads, each transport head being structured to pick up a chip at a first position and to position the chip at at least a second position through rotation of the at least one rotatable transport assembly about a pivot axis, A transport assembly actuator for driving the rotatable transport assembly together with the at least two transport heads around the rotation axis, At least a first conveyor head actuator structured to actuate at least one conveyor head radially with respect to the rotation axis, wherein the at least first conveyor head actuator includes an actuator element attached to the rotatable conveyor assembly actuator and coupled to the at least one conveyor head, the actuator element being structured to actuate with respect to the rotatable conveyor assembly actuator in the direction of the rotation axis, A device equipped with the following features.

2. The apparatus according to claim 1, wherein the actuator element is coupled to the at least one transport head by a connection mechanism.

3. The apparatus according to claim 1, wherein the at least first conveying head actuator comprises an actuator component attached to the rotatable conveying assembly actuator, the actuator element being structured to actuate relative to the actuator component in the direction of the rotation axis.

4. The apparatus according to claim 3, wherein the at least first transport head actuator comprises a magnetic coil drive unit for moving the actuator element in the direction of the rotation axis relative to the rotatable transport assembly actuator.

5. The apparatus according to claim 4, wherein the magnetic coil drive unit comprises a plurality of magnetic elements attached to the actuator element that surround the coil element attached to the actuator component.

6. The apparatus according to any one of claims 3 to 5, wherein the at least first transport head actuator comprises guide elements that interconnect the actuator elements and the actuator components.

7. The apparatus according to claim 6, wherein the guide element is selected from the group consisting of membrane elements, spring elements, ball bearings, air bearings, etc., but is not limited thereto.

8. The apparatus according to any one of claims 3 to 5, wherein the at least first transport head actuator further comprises at least one sensing device for sensing the displacement of the actuator element in the direction of the rotation axis relative to the rotatable transport assembly actuator.

9. The apparatus according to any one of claims 3 to 5, wherein the number of transport heads is 4, 6, 8, 16, or more.

10. The apparatus according to claim 3, further comprising at least one further conveying head actuator attached to the at least first conveying head actuator in view of the direction of the rotation axis.

11. The apparatus according to claim 10, wherein the actuator component of the at least one further transport head actuator is attached to the actuator component of the previous transport head actuator.

12. The apparatus according to claim 10, wherein the number of transport head actuators is equal to the number of transport heads, or equal to half or one-quarter of the number of transport heads.

13. The apparatus according to claim 11 or 12, wherein the rotatable transport assembly is rotated in one direction.

14. The apparatus according to claim 11, further comprising: a wafer placement device structured to place a wafer having a chip surface extending in a first plane at the first position; and a lead frame placement device for placing a lead frame having a bond surface extending in a second plane at the second position.

15. The apparatus according to claim 14, further comprising a chip surface inspection device extending in a third plane at a third position.

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