Fluid supply system, substrate processing apparatus, and substrate processing method

Abstract

A fluid supply system according to one aspect of the present disclosure supplies a fluid into a processing container in which a substrate is to be processed, said fluid supply system comprising: a processing fluid supply unit that supplies a processing fluid; a fluid supply path that is connected to the processing fluid supply unit and the processing container and that causes the processing fluid the temperature of which has been adjusted to flow into the processing container; a first heating mechanism that is provided to the fluid supply path and that heats the processing fluid to a first temperature; and a second heating mechanism that is provided to the fluid supply path and that heats the processing fluid to a second temperature which is lower than the first temperature, wherein the processing fluid supply unit has a flow rate adjustment mechanism that adjusts the flow rate of the processing fluid, and the fluid supply path has a first branch flow path that causes the processing fluid to pass through the first heating mechanism and flow into the processing container, and a second branch flow path that causes the processing fluid to pass through the second heating mechanism and flow into the processing container.

Description

Technical Field

[0001] The present disclosure relates to a fluid supply system, a substrate processing apparatus, and a substrate processing method.

Background Art

[0002] Techniques for drying a substrate using a supercritical fluid are known. Patent Document 1 discloses a configuration for switching the temperature of the supercritical fluid supplied to a substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of supplying a processing fluid with a controlled flow rate and temperature.

Means for Solving the Problems

[0005] A fluid supply system according to an aspect of the present disclosure is a fluid supply system that supplies a fluid into a processing container in which a substrate is processed inside, and includes a processing fluid supply unit that supplies a processing fluid, a fluid supply path that is connected to the processing fluid supply unit and the processing container and allows a processing fluid with an adjusted temperature to flow into the processing container, a first heating mechanism provided in the fluid supply path that heats the processing fluid to a first temperature, and a second heating mechanism provided in the fluid supply path that heats the processing fluid to a second temperature lower than the first temperature. The processing fluid supply unit has a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid, and the fluid supply path has a first branch flow path that allows the processing fluid to flow into the processing container through the first heating mechanism, and a second branch flow path that allows the processing fluid to flow into the processing container through the second heating mechanism. death 、 The first heating mechanism is provided in the first branch channel, the second heating mechanism is provided in the second branch channel, the first branch channel has a first on-off valve downstream of the first heating mechanism, the second branch channel has a second on-off valve downstream of the second heating mechanism, and the fluid supply passage has a bypass channel downstream of the first on-off valve and the second on-off valve that connects the first branch channel and the second branch channel. 。 [Effects of the Invention]

[0006] According to this disclosure, it is possible to supply a processing fluid with controlled flow rate and temperature. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 shows a substrate processing apparatus according to the first embodiment. [Figure 2] Figure 2 is a timing chart showing the substrate processing method according to the first embodiment. [Figure 3] Figure 3 is a diagram (1) showing a substrate processing method according to the first embodiment. [Figure 4] Figure 4 is a diagram (2) showing a substrate processing method according to the first embodiment. [Figure 5] Figure 5 is a diagram (3) showing a substrate processing method according to the first embodiment. [Figure 6] Figure 6 is a diagram (4) showing the substrate processing method according to the first embodiment. [Figure 7] Figure 7 is a diagram (5) showing the substrate processing method according to the first embodiment. [Figure 8] Figure 8 is a diagram (6) showing a substrate processing method according to the first embodiment. [Figure 9] Figure 9 is a diagram (7) showing the substrate processing method according to the first embodiment. [Figure 10] Figure 10 shows a substrate processing apparatus according to the second embodiment. [Figure 11] Figure 11 is a timing chart showing the substrate processing method according to the second embodiment. [Figure 12] Figure 12 is a diagram (1) showing a substrate processing method according to the second embodiment. [Figure 13] Figure 13 is a diagram (2) showing a substrate processing method according to the second embodiment. [Figure 14] Figure 14 is a diagram (3) showing a substrate processing method according to the second embodiment. [Figure 15]FIG. 15 is a diagram (4) showing a substrate processing method according to the second embodiment. [Figure 16] FIG. 16 is a diagram (5) showing a substrate processing method according to the second embodiment. [Figure 17] FIG. 17 is a diagram (6) showing a substrate processing method according to the second embodiment. [Figure 18] FIG. 18 is a diagram (7) showing a substrate processing method according to the second embodiment. [Figure 19] FIG. 19 is a diagram showing a substrate processing apparatus according to the first modification of the second embodiment. [Figure 20] FIG. 20 is a diagram showing a substrate processing apparatus according to the second modification of the second embodiment. [Figure 21] FIG. 21 is a diagram showing a substrate processing apparatus according to the third embodiment. [Figure 22] FIG. 22 is a diagram showing a substrate processing apparatus according to the fourth embodiment. [Figure 23] FIG. 23 is a diagram showing a substrate processing apparatus according to the fifth embodiment. [Figure 24] FIG. 24 is a diagram showing a substrate processing apparatus according to the sixth embodiment.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.At all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] 〔First Embodiment〕 (Substrate Processing Apparatus) Referring to FIG. 1, a substrate processing apparatus 10 according to the first embodiment will be described. FIG. 1 is a diagram showing the substrate processing apparatus 10 according to the first embodiment.

[0010] The substrate processing apparatus 10 includes a processing unit 11, a fluid supply system 12, a discharge unit 13, and a control unit 14.

[0011] The processing unit 11 includes a processing container 111 and a holding plate 112. The processing container 111 is a container with a processing space formed inside that can accommodate, for example, a substrate W with a diameter of 300 mm. The substrate W may be, for example, a semiconductor wafer. The holding plate 112 is provided inside the processing container 111. The holding plate 112 holds the substrate W horizontally. The processing unit 11 may also include a pressure sensor for detecting the pressure inside the processing container 111 and a temperature sensor for detecting the temperature inside the processing container 111.

[0012] The fluid supply system 12 includes a processing fluid supply unit 121 and a temperature control unit 122.

[0013] The processing fluid supply unit 121 includes a processing fluid supply source S11, a first supply channel L11, an on-off valve V11, an orifice OR11, a second supply channel L12, an on-off valve V12, an orifice OR12, an inert gas supply source S12, a third supply channel L13, and an on-off valve V13.

[0014] The processing fluid supply source S11 is a source of processing fluid. The processing fluid may be, for example, liquid carbon dioxide (CO2).

[0015] The first supply channel L11 is connected upstream to the processing fluid supply source S11 and downstream to the temperature control unit 122. The first supply channel L11 is provided with an on / off valve V11 and an orifice OR11 in order from upstream.

[0016] The on-off valve V11 is a valve that switches the flow of the processing fluid on and off. When the on-off valve V11 is open, it allows the processing fluid to flow to the downstream temperature control section 122, and when it is closed, it does not allow the processing fluid to flow to the downstream temperature control section 122.

[0017] Orifice OR11 has the function of reducing the flow velocity of the liquid processing fluid and adjusting the pressure. Orifice OR11 allows the pressure-adjusted processing fluid to flow through the downstream temperature adjustment section 122.

[0018] The second supply channel L12 is provided in parallel with the first supply channel L11. The second supply channel L12 branches off from the first supply channel L11 upstream of the on-off valve V11 and merges with the first supply channel L11 downstream of the orifice OR11. The on-off valve V12 and the orifice OR12 are provided in the second supply channel L12 in that order from upstream.

[0019] The on-off valve V12 is a valve that switches the flow of the processing fluid on and off. When the on-off valve V12 is open, it allows the processing fluid to flow to the downstream temperature control unit 122, and when it is closed, it does not allow the processing fluid to flow to the downstream temperature control unit 122.

[0020] Orifice OR12 has the function of reducing the flow velocity of the liquid processing fluid and adjusting the pressure. Orifice OR12 allows the pressure-adjusted processing fluid to flow through the downstream temperature adjustment section 122.

[0021] The inert gas supply source S12 is a source of inert gas. The inert gas may be, for example, nitrogen (N2) gas.

[0022] The third supply channel L13 is connected upstream to the inert gas supply source S12 and merges downstream with the first supply channel L11 downstream of the orifice OR11. The third supply channel L13 is provided with an on / off valve V13. The third supply channel L13 may also be provided with a check valve, a filter, etc.

[0023] The on-off valve V13 is a valve that switches the flow of inert gas on and off. When the on-off valve V13 is open, it allows inert gas to flow to the downstream temperature control unit 122, and when it is closed, it does not allow inert gas to flow to the downstream temperature control unit 122.

[0024] The temperature control unit 122 is connected to the processing fluid supply unit 121 and the processing container 111. The temperature control unit 122 causes the temperature-controlled fluid to flow into the processing container 111. The fluid contains the processing fluid and an inert gas. The temperature control unit 122 has a first branch channel L14, a second branch channel L15, a bypass channel L16, and a first discharge channel L17.

[0025] In the first branch channel L14, a heating mechanism HE11, an on-off valve V15, a filter F11, and a temperature sensor T11 are provided in that order from upstream. Downstream of the heating mechanism HE11 in the first branch channel L14, a line heater LH11 is provided. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the first branch channel L14.

[0026] In the second branch channel L15, a heating mechanism HE12, an on-off valve V16, and a filter F12 are provided in that order from upstream. Downstream of the heating mechanism HE12 in the second branch channel L15, a line heater LH12 is provided. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the second branch channel L15.

[0027] The first branch channel L14 branches off from the second branch channel L15 between the heating mechanism HE12 and the on / off valve V16. The second branch channel L15 merges with the first branch channel L14 just before the processing container 111.

[0028] The heating mechanism HE11 is installed in series with the heating mechanism HE12. The heating mechanism HE11 heats the fluid supplied from the processing fluid supply unit 121 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or more and 120°C or less.

[0029] The on-off valve V15 is a valve that switches the fluid flow on and off. When the on-off valve V15 is open, it allows fluid to flow to the downstream processing container 111, and when it is closed, it does not allow fluid to flow to the downstream processing container 111.

[0030] Filter F11 filters the fluid flowing through the first branch channel L14, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during substrate processing using the fluid.

[0031] The temperature sensor T11 is installed downstream of the confluence of the first branch channel L14 with the second branch channel L15. The temperature sensor T11 is installed, for example, immediately before the processing container 111. The temperature sensor T11 detects the temperature of the fluid flowing in the first branch channel L14.

[0032] The line heater LH11 heats the first branch channel L14 downstream of the heating mechanism HE11. The line heater LH11 suppresses the temperature drop of the fluid, which has been heated to a first temperature by the heating mechanism HE11, as it flows through the first branch channel L14.

[0033] The heating mechanism HE12 heats the fluid supplied from the processing fluid supply unit 121 to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0034] The on-off valve V16 is a valve that switches the fluid flow on and off. When the on-off valve V16 is open, it allows fluid to flow to the downstream processing container 111, and when it is closed, it does not allow fluid to flow to the downstream processing container 111.

[0035] Filter F12 filters the fluid flowing through the second branch channel L15, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during substrate processing using the fluid.

[0036] The line heater LH12 heats the second branch channel L15 downstream of the heating mechanism HE12. The line heater LH12 suppresses the temperature drop of the fluid, which has been heated to a second temperature by the heating mechanism HE12, as it flows through the second branch channel L15.

[0037] In the temperature control unit 122, when the on-off valve V15 is closed and the on-off valve V16 is opened, the fluid heated to the second temperature by the heating mechanism HE12 is supplied to the processing container 111 through the second branch passage L15. Conversely, when the on-off valve V16 is closed and the on-off valve V15 is opened, the fluid heated to the second temperature by the heating mechanism HE12 and then heated to the first temperature by the heating mechanism HE11 is supplied to the processing container 111 through the first branch passage L14. In this way, the temperature of the fluid flowing into the processing container 111 can be changed by exclusively opening and closing the on-off valves V15 and V16. Furthermore, when both on-off valves V15 and V16 are opened, the fluid heated to the first temperature by the heating mechanism HE11 and the fluid heated to the second temperature by the heating mechanism HE12 are mixed and supplied to the processing container 111. In this case, a fluid at an intermediate temperature between the first and second temperatures can be supplied to the processing container 111. In this way, by controlling the opening and closing of the on-off valves V15 and V16, the temperature of the fluid flowing through the processing container 111 can be changed in three stages.

[0038] The bypass channel L16 connects the position between the on-off valve V15 and filter F11 in the first branch channel L14 with the position between the on-off valve V16 and filter F12 in the second branch channel L15. An orifice OR13 is provided in the bypass channel L16. A line heater LH13 is provided in the bypass channel L16. The bypass channel L16, orifice OR13, and line heater LH13 are optional.

[0039] The orifice OR13 has the function of reducing the flow velocity of the fluid flowing through the bypass channel L16 and thereby regulating the pressure.

[0040] Line heater LH13 heats the bypass channel L16.

[0041] The first discharge channel L17 discharges the fluid in the first branch channel L14. The first discharge channel L17 branches off from the first branch channel L14 between the heating mechanism HE11 and the on-off valve V15. The on-off valve V14 is provided in the first discharge channel L17. The line heater LH14 is provided in the first discharge channel L17. An orifice may also be provided in the first discharge channel L17.

[0042] The on-off valve V14 is a valve that switches the fluid flow on and off. When the on-off valve V14 is open, it allows fluid to flow into the downstream first discharge channel L17, and when it is closed, it does not allow fluid to flow into the downstream first discharge channel L17.

[0043] Line heater LH14 heats the first discharge channel L17.

[0044] The discharge section 13 has a discharge channel L18. The discharge channel L18 is connected to the processing container 111. A pressure sensor P11, a back pressure valve BV11, and an on-off valve V17 are provided in the discharge channel L18 in order from upstream. A line heater LH15 is provided in the discharge channel L18. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the discharge channel L18.

[0045] The pressure sensor P11 detects the pressure of the fluid flowing through the discharge channel L18 immediately after the processing container 111. This allows the pressure inside the processing container 111 to be detected.

[0046] The back pressure valve BV11 maintains the primary pressure at the set pressure by adjusting the valve opening to allow fluid to flow to the secondary side when the primary pressure in the discharge passage L18 exceeds the set pressure. For example, the set pressure of the back pressure valve BV11 is adjusted by the control unit 14.

[0047] The on-off valve V17 is a valve that switches the fluid flow on and off. When the on-off valve V17 is open, it allows fluid to flow into the downstream discharge channel L18, and when it is closed, it does not allow fluid to flow into the downstream discharge channel L18.

[0048] Line heater LH15 heats the discharge channel L18.

[0049] The control unit 14 receives measurement signals from various sensors (temperature sensor T11, pressure sensor P11, etc.) and transmits control signals to various functional elements. The control signals include, for example, the opening / closing signals of valve V17 from valve V11, the set pressure signal of back pressure valve BV11, and the temperature signal of line heater LH15 from line heater LH11. For example, the control unit 14 is configured to change the flow rate of the fluid flowing through the processing container 111 by controlling the opening and closing of valves V11 and V12 according to the processing state of the substrate W in the processing container 111. For example, the control unit 14 is configured to change the temperature of the fluid flowing through the processing container 111 by controlling the opening and closing of valves V15 and V16 according to the processing state of the substrate W in the processing container 111.

[0050] The control unit 14 is, for example, a computer and comprises an arithmetic unit 141 and a storage unit 142. The storage unit 142 stores programs that control various processes performed in the substrate processing device 10. The arithmetic unit 141 controls the operation of the substrate processing device 10 by reading and executing the programs stored in the storage unit 142. The programs may be those that were recorded on a storage medium readable by a computer and installed from that storage medium to the storage unit 142 of the control unit 14. Examples of storage mediums readable by a computer include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnetic optical disks (MOs), and memory cards.

[0051] (Substrate processing method) Referring to Figures 2 to 9, a substrate processing method performed using the substrate processing apparatus 10 will be described. The substrate processing method shown below is automatically executed under the control of the control unit 14 based on the processing recipe and control program stored in the storage unit 142.

[0052] Figure 2 is a timing chart showing the substrate processing method according to the first embodiment. In Figure 2, the lower figure shows the opening and closing timings of the on / off valves V11, V12, V13, V14, V15, V16, and V17, and the upper figure shows the change in the detected value (pressure) of the pressure sensor P11 corresponding to the opening and closing timings.

[0053] Figures 3 to 9 show a substrate processing method according to the first embodiment. In Figures 3 to 9, an open valve is shown in black, and a closed valve is shown in white. In Figures 3 to 9, a fluid passage is shown with a thick solid line.

[0054] <Standby process> During the standby phase, an inert gas is supplied to the processing unit 11, the fluid supply system 12, and the discharge unit 13. The inert gas may be, for example, N2 gas. Specifically, as shown in Figure 3, the on-off valves V13, V15, V16, and V17 are set to the open state, and the on-off valves V11, V12, and V14 are set to the closed state. As a result, the inert gas guided from the inert gas supply source S12 to the first branch channel L14 is heated to a first temperature by the heating mechanism HE11 and supplied into the processing container 111. In addition, the inert gas guided from the inert gas supply source S12 to the second branch channel L15 is heated to a second temperature by the heating mechanism HE12 and supplied into the processing container 111. Therefore, since the first branch channel L14 and the second branch channel L15 are purged and heated by the inert gas, the processing temperature of the first substrate W processed after the standby phase becomes approximately the same as the processing temperature of the second and subsequent substrates W. As a result, variations in processing temperature between substrates W are suppressed. During the waiting process, inert gas is discharged from the processing container 111 through the discharge channel L18.

[0055] In the waiting process, the substrate W is brought into the processing container 111. Specifically, as shown in Figure 4, the on-off valve V16 is opened, and the on-off valves V11, V12, V13, V14, V15, and V17 are closed before the substrate W is brought into the processing container 111. That is, the substrate W is brought into the processing container 111 when no inert gas is supplied to it. However, the substrate W may also be brought into the processing container 111 when an inert gas is supplied to it. The substrate W is cleaned, and the recesses in the surface pattern are filled with isopropyl alcohol (IPA) before being placed on the holding plate 112.

[0056] <First step in boosting pressure> The first pressurization step is performed after the standby step. In the first pressurization step, the pressure inside the processing container 111 is first increased by supplying a processing fluid at a first flow rate and a second temperature, and then the pressure inside the processing container 111 is increased by supplying a processing fluid at a second flow rate and a second temperature. In other words, the first pressurization step involves two stages of pressurization. The second flow rate may be greater than the first flow rate.

[0057] During the first flow rate boost, as shown in Figure 5, valves V11 and V16 are open, and valves V12, V13, V14, V15, and V17 are closed. As a result, the processing fluid from the processing fluid supply source S11 flows into the temperature control unit 122 via the first supply channel L11 and is supplied into the processing container 111 via the second branch channel L15. Therefore, processing fluid at the first flow rate and second temperature is supplied into the processing container 111. As a result, the temperature of the substrate W changes to the second temperature. During the first flow rate boost, valve V17 is closed, so no processing fluid flows out of the processing container 111. Therefore, the pressure inside the processing container 111 gradually increases.

[0058] During the first flow rate boost, the treated fluid, whose flow velocity has been reduced by the orifice OR13, flows from the second branch channel L15 through the bypass channel L16 into the first branch channel L14. This prevents backflow of the treated fluid from the confluence of the first branch channel L14 and the second branch channel L15 immediately before the treatment container 111 toward the upstream of the first branch channel L14. Therefore, contamination downstream of the filter F11 by IPA residue and the like can be suppressed.

[0059] During the pressurization at the first flow rate, the pressure inside the processing container 111 is detected by the pressure sensor P11, and the pressurization at the first flow rate continues until the pressure inside the processing container 111 reaches the first pressure Y1. When the pressure inside the processing container 111 reaches the first pressure Y1, the pressurization at the first flow rate ends, and the process transitions to pressurization at the second flow rate.

[0060] During the pressurization at the second flow rate, the on-off valve V12 is opened, as shown in Figure 6. The state of the other on-off valves is the same as shown in Figure 5. As a result, the processing fluid from the processing fluid supply source S11 flows into the temperature control unit 122 via the second supply channel L12 in addition to the first supply channel L11, and is supplied into the processing container 111 via the second branch channel L15. Therefore, the flow rate of the processing fluid supplied into the processing container 111 increases to the second flow rate. During the pressurization at the second flow rate, the on-off valve V17 is closed, so no processing fluid flows out of the processing container 111. Therefore, the pressure inside the processing container 111 gradually increases.

[0061] During the second flow rate increase, the pressure of the processing fluid supplied into the processing container 111 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing container 111 in a gaseous state. Subsequently, as the processing fluid fills the processing container 111, the pressure inside the processing container 111 increases, and when the pressure inside the processing container 111 exceeds the critical pressure, the processing fluid present in the processing container 111 enters a supercritical state.

[0062] During the pressurization at the second flow rate, the treated fluid, whose flow velocity has been reduced by the orifice OR13, flows from the second branch channel L15 through the bypass channel L16 into the first branch channel L14. This prevents backflow of the treated fluid from the confluence of the first branch channel L14 and the second branch channel L15 immediately before the treatment container 111 toward the upstream of the first branch channel L14. Therefore, contamination downstream of the filter F11 by IPA residue and the like can be suppressed.

[0063] During the pressurization process at the second flow rate, the pressure inside the processing container 111 is detected by the pressure sensor P11, and the pressurization process at the second flow rate continues until the pressure inside the processing container 111 reaches the second pressure Y2. When the pressure inside the processing container 111 reaches the second pressure Y2, the first pressurization process ends, and the process moves to the second pressurization process.

[0064] <Second Boost Process> The second pressurization step is performed after the first pressurization step. In the second pressurization step, the pressure inside the processing container 111 is increased by supplying a processing fluid at a second flow rate and a first temperature. Specifically, as shown in Figure 7, the on-off valves V11, V12, and V15 are opened, and the on-off valves V13, V14, V16, and V17 are closed. As a result, the processing fluid from the processing fluid supply source S11 flows into the temperature adjustment unit 122 via the first supply channel L11 and the second supply channel L12, and is supplied into the processing container 111 via the first branch channel L14. Therefore, a processing fluid at a second flow rate and a first temperature is supplied into the processing container 111. As a result, the temperature of the substrate W changes rapidly to the first temperature.

[0065] In the second pressurization step, the processed fluid, whose flow velocity has been reduced by the orifice OR13, flows from the first branch channel L14 through the bypass channel L16 into the second branch channel L15. This prevents backflow of the processed fluid from the confluence of the first branch channel L14 and the second branch channel L15 immediately before the processing container 111 toward the upstream of the second branch channel L15. Therefore, contamination downstream of the filter F12 by IPA residue and the like can be suppressed.

[0066] During the second pressurization process, the pressure inside the processing container 111 is detected by the pressure sensor P11, and the second pressurization process continues until the pressure inside the processing container 111 reaches the third pressure Y3. When the pressure inside the processing container 111 reaches the third pressure Y3, the second pressurization process ends, and the process moves to the flow process.

[0067] <Distribution process> The flow process is performed after the second pressurization process. In the flow process, a processing fluid at a second flow rate and first temperature is supplied from the processing fluid supply source S11 into the processing container 111, and the IPA is replaced with the processing fluid in the recesses of the pattern on the substrate W inside the processing container 111. Specifically, as shown in Figure 8, the on-off valves V11, V12, V15, and V17 are set to the open state, and the on-off valves V13, V14, and V16 are set to the closed state. As a result, the processing fluid from the processing fluid supply source S11 flows into the temperature control unit 122 via the first supply channel L11 and the second supply channel L12, and is supplied into the processing container 111 via the first branch channel L14. The processing fluid supplied into the processing container 111 is discharged from inside the processing container 111 via the discharge channel L18. By performing the flow process, the replacement of IPA with the processing fluid in the recesses of the pattern on the substrate W is promoted.

[0068] In the flow process, the treated fluid, whose flow velocity has been reduced by the orifice OR13, flows from the first branch channel L14 through the bypass channel L16 into the second branch channel L15. This prevents backflow of the treated fluid from the confluence of the first branch channel L14 and the second branch channel L15 immediately before the treatment container 111 toward the upstream of the second branch channel L15. Therefore, contamination downstream of the filter F12 by IPA residue and the like can be suppressed.

[0069] Once the replacement of IPA with the processing fluid is complete within the recesses of the pattern, the flow process ends and the process moves to the depressurization process.

[0070] <Depressurization process> The depressurization process is performed after the flow process. In the depressurization process, the processing fluid is discharged from the processing container 111. Specifically, as shown in Figure 9, the on-off valves V14 and V17 are opened, and the on-off valves V11, V12, V13, V15, and V16 are closed. When the pressure inside the processing container 111 falls below the critical pressure of the processing fluid due to the depressurization process, the supercritical processing fluid vaporizes and separates from the recesses of the pattern. This completes the drying process for one substrate W.

[0071] After the depressurization process, the process moves to a standby phase. The processed substrate W is removed from the processing container 111, for example, after the standby phase. Specifically, after the depressurization process, the supply of inert gas to the processing container 111 is started via the first branch channel L14 and the second branch channel L15. Then, while the inert gas is being supplied to the processing container 111, the substrate W is removed from the processing container 111. The supply of inert gas to the processing container 111 continues even after the substrate W has been removed from the processing container 111. In this way, when the substrate W is removed from the processing container 111 while the inert gas is being supplied to the processing container 111, the inside of the processing container 111 becomes positive pressure, so when the processing container 111 is opened, a gas flow is formed from the inside to the outside of the processing container 111. Therefore, any residue inside the processing container 111 can be discharged and removed from the outside of the processing container 111. However, the supply of inert gas to the processing container 111 may be stopped when the substrate W is removed from the processing container 111.

[0072] According to the first embodiment described above, the fluid supply system 12 includes a processing fluid supply unit 121 and a temperature control unit 122. The processing fluid supply unit 121 has a flow rate adjustment mechanism (on-off valves V11, V12, orifices OR11, OR12) for adjusting the flow rate of the processing fluid. The temperature control unit 122 has a first branch channel L14 for passing a processing fluid at a first temperature into the processing container 111 and a second branch channel L15 for passing a processing fluid at a second temperature into the processing container 111. This allows for individual control of the flow rate and temperature of the processing fluid supplied into the processing container 111, and enables the supply of processing fluid with controlled flow rate and temperature into the processing container 111. As a result, the process margin in the substrate processing method performed using the substrate processing apparatus 10 can be expanded.

[0073] Furthermore, according to the first embodiment, a temperature adjustment section 122 (heating mechanisms HE11, HE12) is provided downstream of the confluence of the first supply channel L11, the second supply channel L12, and the third supply channel L13. In this case, the inert gas from the inert gas supply source S12 is heated to a first temperature by the heating mechanism HE11 and flows through the first branch channel L14. As a result, temperature uniformity along the direction of fluid flow is improved in the first branch channel L14 downstream of the heating mechanism HE11. In contrast, when room temperature inert gas flows through the first branch channel L14, even if the first branch channel L14 is heated by the line heater LH11, a temperature distribution along the direction of fluid flow is likely to occur in the first branch channel L14.

[0074] Furthermore, the inert gas from the inert gas supply source S12 is heated to a second temperature by the heating mechanism HE12 and flows through the second branch channel L15. As a result, temperature uniformity along the direction of fluid flow is improved in the second branch channel L15 downstream of the heating mechanism HE12. In contrast, when room temperature inert gas flows through the second branch channel L15, even if the second branch channel L15 is heated by the line heater LH12, a temperature distribution along the direction of fluid flow is likely to occur in the second branch channel L15.

[0075] Furthermore, according to the first embodiment, a large flow rate of heated inert gas is supplied into the processing container 111 via the first branch channel L14 and the second branch channel L15, thereby promoting the drying of the IPA remaining in the first branch channel L14, the second branch channel L15, and the processing container 111.

[0076] Furthermore, according to the first embodiment, in a waiting step before the processing fluid from the processing fluid supply source S11 is supplied into the processing container 111 via the first branch channel L14 and the second branch channel L15, heated inert gas flows through the first branch channel L14 and the second branch channel L15. In this case, since the first branch channel L14 and the second branch channel L15 are heated by the inert gas, the processing temperature of the first substrate W, which is processed after the waiting step, becomes approximately the same as the processing temperature of the second and subsequent substrates W. As a result, variations in processing temperature between substrates W are suppressed.

[0077] [Second Embodiment] (Substrate processing equipment) Referring to Figure 10, the substrate processing apparatus 20 according to the second embodiment will be described. Figure 10 is a diagram showing the substrate processing apparatus 20 according to the second embodiment.

[0078] The substrate processing apparatus 20 includes a processing unit 21, a fluid supply system 22, a discharge unit 23, and a control unit 24.

[0079] The processing unit 21 may be the same as the processing unit 11. The processing unit 21 includes a processing container 211 and a holding plate 212.

[0080] The fluid supply system 22 includes a processing fluid supply unit 221 and a temperature control unit 222.

[0081] The processing fluid supply unit 221 may be the same as the processing fluid supply unit 121. The processing fluid supply unit 221 includes a processing fluid supply source S21, a first supply channel L21, an on-off valve V21, an orifice OR21, a second supply channel L22, an on-off valve V22, an orifice OR22, an inert gas supply source S22, a third supply channel L23, and an on-off valve V23.

[0082] The temperature control unit 222 is connected to the processing fluid supply unit 221 and the processing container 211. The temperature control unit 222 causes the temperature-controlled fluid to flow into the processing container 211. The fluid includes the processing fluid and an inert gas. The temperature control unit 222 has a first branch channel L24, a second branch channel L25, a bypass channel L26, a first discharge channel L27, and a second discharge channel L28.

[0083] In the first branch channel L24, a heating mechanism HE21, an on-off valve V25, a filter F21, and a temperature sensor T21 are provided in that order from upstream. Downstream of the heating mechanism HE21 in the first branch channel L24, a line heater LH21 is provided. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the first branch channel L24.

[0084] In the second branch channel L25, an on-off valve V24, a heating mechanism HE22, an on-off valve V26, and a filter F22 are provided in that order from upstream. A line heater LH22 is provided downstream of the heating mechanism HE22 in the second branch channel L25. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the second branch channel L25.

[0085] The second branch channel L25 branches off from the first branch channel L24 between the processing fluid supply unit 221 and the heating mechanism HE21. The second branch channel L25 merges with the first branch channel L24 just before the processing container 211.

[0086] The heating mechanism HE21 is installed in parallel with the heating mechanism HE22. The heating mechanism HE21 heats the fluid supplied from the processing fluid supply unit 221 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or more and 120°C or less.

[0087] The on-off valve V25 is a valve that switches the fluid flow on and off. When the on-off valve V25 is open, it allows fluid to flow to the downstream processing container 211, and when it is closed, it does not allow fluid to flow to the downstream processing container 211.

[0088] The filter F21 filters the fluid flowing through the first branch channel L24, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0089] The temperature sensor T21 is installed downstream of the confluence of the first branch channel L24 with the second branch channel L25. The temperature sensor T21 is installed, for example, immediately before the processing container 211. The temperature sensor T21 detects the temperature of the fluid flowing in the first branch channel L24.

[0090] The line heater LH21 heats the first branch channel L24 downstream of the heating mechanism HE21. The line heater LH21 suppresses the temperature drop of the fluid, which has been heated to a first temperature by the heating mechanism HE21, as it flows through the first branch channel L24.

[0091] The on-off valve V24 is a valve that switches the fluid flow on and off. When the on-off valve V24 is open, it allows fluid to flow to the downstream heating mechanism HE22, and when it is closed, it does not allow fluid to flow to the downstream heating mechanism HE22.

[0092] The heating mechanism HE22 heats the fluid supplied from the processing fluid supply unit 221 to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0093] The on-off valve V26 is a valve that switches the fluid flow on and off. When the on-off valve V26 is open, it allows fluid to flow to the downstream processing container 211, and when it is closed, it does not allow fluid to flow to the downstream processing container 211.

[0094] The filter F22 filters the fluid flowing through the second branch channel L25, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0095] The line heater LH22 heats the second branch channel L25 downstream of the heating mechanism HE22. The line heater LH22 suppresses the temperature drop of the fluid, which has been heated to a second temperature by the heating mechanism HE22, as it flows through the second branch channel L25.

[0096] In the temperature control unit 222, when the on-off valve V25 is closed and the on-off valve V26 is opened, the fluid heated to a second temperature by the heating mechanism HE22 is supplied to the processing container 211 through the second branch passage L25. Conversely, when the on-off valve V26 is closed and the on-off valve V25 is opened, the fluid heated to a first temperature by the heating mechanism HE21 is supplied to the processing container 211 through the first branch passage L24. In this way, the temperature of the fluid flowing into the processing container 211 can be changed by exclusively opening and closing the on-off valves V25 and V26. Furthermore, when both on-off valves V25 and V26 are opened, the fluid heated to a first temperature by the heating mechanism HE21 and the fluid heated to a second temperature by the heating mechanism HE22 are mixed and supplied to the processing container 211. In this case, a fluid at an intermediate temperature between the first and second temperatures can be supplied to the processing container 211. In this way, by controlling the opening and closing of the on-off valves V25 and V26, the temperature of the fluid flowing through the processing container 211 can be changed in three stages.

[0097] The bypass channel L26 connects the position between the on-off valve V25 and filter F21 in the first branch channel L24 with the position between the on-off valve V26 and filter F22 in the second branch channel L25. An orifice OR23 is provided in the bypass channel L26. A line heater LH23 is provided in the bypass channel L26. The bypass channel L26, orifice OR23, and line heater LH23 are optional.

[0098] The orifice OR23 has the function of reducing the flow velocity of the fluid flowing through the bypass channel L26 and thereby regulating the pressure.

[0099] Line heater LH23 heats the bypass channel L26.

[0100] The first discharge channel L27 discharges the fluid in the first branch channel L24. The first discharge channel L27 branches off from the first branch channel L24 between the heating mechanism HE21 and the on-off valve V25. The on-off valve V27 is provided in the first discharge channel L27. The line heater LH24 is provided in the first discharge channel L27. An orifice may be provided in the first discharge channel L27.

[0101] The on-off valve V27 is a valve that switches the fluid flow on and off. When the on-off valve V27 is open, it allows fluid to flow into the downstream first discharge channel L27, and when it is closed, it does not allow fluid to flow into the downstream first discharge channel L27.

[0102] Line heater LH24 heats the first discharge channel L27.

[0103] The second discharge channel L28 discharges the fluid in the second branch channel L25. The second discharge channel L28 branches off from the second branch channel L25 between the heating mechanism HE22 and the on-off valve V26. The on-off valve V28 is provided in the second discharge channel L28. The line heater LH25 is provided in the second discharge channel L28. An orifice may be provided in the second discharge channel L28.

[0104] The on-off valve V28 is a valve that switches the fluid flow on and off. When the on-off valve V28 is open, it allows fluid to flow into the downstream second discharge channel L28, and when it is closed, it does not allow fluid to flow into the downstream second discharge channel L28.

[0105] Line heater LH25 heats the second discharge channel L28.

[0106] The discharge section 23 has a discharge channel L29. The discharge channel L29 is connected to the processing container 211. A pressure sensor P21, a back pressure valve BV21, and an on-off valve V29 are provided in the discharge channel L29 in order from upstream. A line heater LH26 is provided in the discharge channel L29. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the discharge channel L29.

[0107] The pressure sensor P21 detects the pressure of the fluid flowing through the discharge channel L29 immediately after the processing container 211. This allows the pressure inside the processing container 211 to be detected.

[0108] The back pressure valve BV21 maintains the primary pressure at the set pressure by adjusting the valve opening to allow fluid to flow to the secondary side when the primary pressure in the discharge passage L29 exceeds the set pressure. For example, the set pressure of the back pressure valve BV21 is adjusted by the control unit 24.

[0109] The on-off valve V29 is a valve that switches the fluid flow on and off. When the on-off valve V29 is open, it allows fluid to flow into the downstream discharge channel L29, and when it is closed, it does not allow fluid to flow into the downstream discharge channel L29.

[0110] Line heater LH26 heats the discharge channel L29.

[0111] The control unit 24 receives measurement signals from various sensors (temperature sensor T21, pressure sensor P21, etc.) and transmits control signals to various functional elements. The control signals include, for example, the opening / closing signals of valve V29 from valve V21, the set pressure signal of back pressure valve BV21, and the temperature signal of line heater LH26 from line heater LH21. For example, the control unit 24 is configured to change the flow rate of fluid flowing into the processing container 211 by controlling the opening and closing of valves V21 and V22 according to the processing state of the substrate W in the processing container 211. For example, the control unit 24 is configured to change the temperature of fluid flowing into the processing container 211 by controlling the opening and closing of valves V25 and V26 according to the processing state of the substrate W in the processing container 211.

[0112] The control unit 24 is, for example, a computer and comprises an arithmetic unit 241 and a storage unit 242. The storage unit 242 stores programs that control various processes performed in the substrate processing device 20. The arithmetic unit 241 controls the operation of the substrate processing device 20 by reading and executing the programs stored in the storage unit 242. The programs may be those that were recorded on a storage medium readable by the computer and installed from that storage medium to the storage unit 242 of the control unit 24. Examples of storage mediums readable by the computer include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnetic optical disks (MOs), and memory cards.

[0113] (Substrate processing method) Referring to Figures 11 to 18, a substrate processing method performed using the substrate processing apparatus 20 will be described. The substrate processing method shown below is automatically executed under the control of the control unit 24 based on the processing recipe and control program stored in the storage unit 242.

[0114] Figure 11 is a timing chart showing the substrate processing method according to the second embodiment. In Figure 11, the lower figure shows the opening and closing timings of the on / off valves V21, V22, V23, V24, V25, V26, V27, V28, and V29, and the upper figure shows the change in the detected value (pressure) of the pressure sensor P21 corresponding to the opening and closing timings.

[0115] Figures 12 to 18 show a substrate processing method according to the second embodiment. In Figures 12 to 18, an open valve is shown in black, and a closed valve is shown in white. In Figures 12 to 18, a fluid passage is shown with a thick solid line.

[0116] <Standby process> During the standby phase, an inert gas is supplied to the processing unit 21, the fluid supply system 22, and the discharge unit 23. The inert gas may be, for example, N2 gas. Specifically, as shown in Figure 12, the on-off valves V23, V24, V25, V26, and V29 are set to the open state, and the on-off valves V21, V22, V27, and V28 are set to the closed state. As a result, the inert gas guided from the inert gas supply source S22 to the first branch channel L24 is heated to a first temperature by the heating mechanism HE21 and supplied into the processing container 211. In addition, the inert gas guided from the inert gas supply source S22 to the second branch channel L25 is heated to a second temperature by the heating mechanism HE22 and supplied into the processing container 211. Therefore, since the first branch channel L24 and the second branch channel L25 are purged and heated by the inert gas, the processing temperature of the first substrate W after the standby phase is approximately the same as the processing temperature of the second and subsequent substrates W. As a result, variations in processing temperature between substrates W are suppressed. During the waiting process, an inert gas is discharged from the processing container 211 through the discharge channel L29.

[0117] In the waiting process, the substrate W is brought into the processing container 211. Specifically, as shown in Figure 13, the on-off valves V24 and V26 are opened, and the on-off valves V21, V22, V23, V25, V27, V28, and V29 are closed, after which the substrate W is brought into the processing container 211. That is, the substrate W is brought into the processing container 211 while no inert gas is supplied to it. However, the substrate W may also be brought into the processing container 211 while an inert gas is supplied to it. The substrate W is cleaned, and the recesses in the surface pattern are filled with IPA, and then placed on the holding plate 212.

[0118] <First step in boosting pressure> The first pressurization step is performed after the standby step. In the first pressurization step, the pressure inside the processing container 211 is first increased by supplying a processing fluid at a first flow rate and a second temperature, and then the pressure inside the processing container 211 is increased by supplying a processing fluid at a second flow rate and a second temperature. In other words, the first pressurization step involves two stages of pressurization. The second flow rate may be greater than the first flow rate.

[0119] During the first flow rate boost, as shown in Figure 14, valves V21, V24, and V26 are open, and valves V22, V23, V25, V27, V28, and V29 are closed. As a result, the processing fluid from the processing fluid supply source S21 flows into the temperature control unit 222 via the first supply channel L21 and is supplied into the processing container 211 via the second branch channel L25. Therefore, processing fluid at the first flow rate and second temperature is supplied into the processing container 211. As a result, the temperature of the substrate W changes to the second temperature. During the first flow rate boost, valve V29 is closed, so no processing fluid flows out of the processing container 211. Therefore, the pressure inside the processing container 211 gradually increases.

[0120] During the pressurization at the first flow rate, the treated fluid, whose flow velocity has been reduced by the orifice OR23, flows from the second branch channel L25 through the bypass channel L26 into the first branch channel L24. This prevents backflow of the treated fluid from the confluence of the first branch channel L24 and the second branch channel L25 immediately before the treatment container 211 toward the upstream of the first branch channel L24. Therefore, contamination downstream of the filter F21 by IPA residue and the like can be suppressed.

[0121] During the pressurization at the first flow rate, the pressure inside the processing container 211 is detected by the pressure sensor P21, and the pressurization at the first flow rate continues until the pressure inside the processing container 211 reaches the first pressure Y1. When the pressure inside the processing container 211 reaches the first pressure Y1, the pressurization at the first flow rate ends, and the process transitions to pressurization at the second flow rate.

[0122] During the pressurization at the second flow rate, the on-off valve V22 is opened, as shown in Figure 15. The state of the other on-off valves is the same as shown in Figure 14. As a result, the processing fluid from the processing fluid supply source S21 flows into the temperature control unit 222 via the second supply channel L22 in addition to the first supply channel L21, and is supplied into the processing container 211 via the second branch channel L25. Therefore, the flow rate of the processing fluid supplied into the processing container 211 increases to the second flow rate. During the pressurization at the second flow rate, the on-off valve V29 is closed, so no processing fluid flows out of the processing container 211. Therefore, the pressure inside the processing container 211 gradually increases.

[0123] During the second flow rate increase, the pressure of the processing fluid supplied into the processing container 211 is lower than the critical pressure. Therefore, the processing fluid is supplied into the processing container 211 in a gaseous state. Subsequently, as the processing fluid fills the processing container 211, the pressure inside the processing container 211 increases, and when the pressure inside the processing container 211 exceeds the critical pressure, the processing fluid present in the processing container 211 enters a supercritical state.

[0124] During the pressurization at the second flow rate, the treated fluid, whose flow velocity has been reduced by the orifice OR23, flows from the second branch channel L25 through the bypass channel L26 into the first branch channel L24. This prevents backflow of the treated fluid from the confluence of the first branch channel L24 and the second branch channel L25 immediately before the treatment container 211 toward the upstream of the first branch channel L24. Therefore, contamination downstream of the filter F21 by IPA residue and the like can be suppressed.

[0125] During the pressurization process at the second flow rate, the pressure inside the processing container 211 is detected by the pressure sensor P21, and the pressurization process at the second flow rate continues until the pressure inside the processing container 211 reaches the second pressure Y2. When the pressure inside the processing container 211 reaches the second pressure Y2, the first pressurization process ends, and the process moves to the second pressurization process.

[0126] <Second Boost Process> The second pressure boosting step is performed after the first pressure boosting step. In the second pressure boosting step, the pressure inside the processing container 211 is increased by supplying a processing fluid at a second flow rate and a first temperature. Specifically, as shown in Figure 16, the on-off valves V21, V22, V25, and V28 are opened, and the on-off valves V23, V24, V26, V27, and V29 are closed. As a result, the processing fluid from the processing fluid supply source S21 flows into the temperature adjustment unit 222 via the first supply channel L21 and the second supply channel L22, and is supplied into the processing container 211 via the first branch channel L24. Therefore, a processing fluid at a second flow rate and a first temperature is supplied into the processing container 211. As a result, the temperature of the substrate W changes rapidly to the first temperature.

[0127] In the second pressurization step, the processed fluid, whose flow velocity has been reduced by the orifice OR23, flows from the first branch channel L24 through the bypass channel L26 into the second branch channel L25. This prevents backflow of the processed fluid from the confluence of the first branch channel L24 and the second branch channel L25 immediately before the processing vessel 211 toward the upstream of the second branch channel L25. Therefore, contamination downstream of the filter F22 by IPA residue and the like can be suppressed.

[0128] In the second pressurization step, the processing fluid in the second branch channel L25 is discharged, and the pressure inside the second branch channel L25 is reduced. Since the amount of heat stored in the heating mechanism HE22, which is set to a second temperature lower than the first temperature, is small, when the pressure inside the second branch channel L25 is reduced, the temperature of the heating mechanism HE22 drops significantly due to the pressure drop, and it takes time for the temperature of the heating mechanism HE22 to return to the second temperature. Therefore, in the second pressurization step, while the processing fluid is flowing through the first branch channel L24, the on-off valves V24 and V26 are closed and the on-off valve V28 is opened, thereby reducing the pressure inside the second branch channel L25 and returning the temperature of the heating mechanism HE22 to the second temperature. In this way, since the second discharge channel L28 and the on-off valve V28 are provided, the heating mechanism HE2 can be prepared for the next substrate W in parallel with the processing of the substrate W in the processing container 211.

[0129] During the second pressurization process, the pressure inside the processing container 211 is detected by the pressure sensor P21, and the second pressurization process continues until the pressure inside the processing container 211 reaches the third pressure Y3. When the pressure inside the processing container 211 reaches the third pressure Y3, the second pressurization process ends, and the process transitions to the flow process.

[0130] <Distribution process> The flow process is performed after the second pressurization process. In the flow process, a processing fluid at a second flow rate and first temperature is supplied from the processing fluid supply source S21 into the processing container 211, and the IPA is replaced with the processing fluid in the recesses of the pattern on the substrate W inside the processing container 211. Specifically, as shown in Figure 17, the on-off valves V21, V22, V25, V28, and V29 are set to the open state, and the on-off valves V23, V24, V26, and V27 are set to the closed state. As a result, the processing fluid from the processing fluid supply source S21 flows into the temperature control unit 222 via the first supply channel L21 and the second supply channel L22, and is supplied into the processing container 211 via the first branch channel L24. The processing fluid supplied into the processing container 211 is discharged from inside the processing container 211 via the discharge channel L29. By performing the flow process, the replacement of IPA with the processing fluid in the recesses of the pattern on the substrate W is promoted.

[0131] In the flow process, the processed fluid, whose flow velocity has been reduced by the orifice OR23, flows from the first branch channel L24 through the bypass channel L26 into the second branch channel L25. This prevents backflow of the processed fluid from the confluence of the first branch channel L24 and the second branch channel L25 immediately before the processing container 211 toward the upstream of the second branch channel L25. Therefore, contamination downstream of the filter F22 by IPA residue and the like can be suppressed. The pressure reduction in the second branch channel L25 is also maintained during the flow process.

[0132] Once the replacement of IPA with the processing fluid is complete within the recesses of the pattern, the flow process ends and the process moves to the depressurization process.

[0133] <Depressurization process> The depressurization process is performed after the flow process. In the depressurization process, the processing fluid is discharged from the processing container 211. Specifically, as shown in Figure 18, valves V27, V28, and V29 are opened, and valves V21, V22, V23, V24, V25, and V26 are closed. When the pressure inside the processing container 211 falls below the critical pressure of the processing fluid due to the depressurization process, the supercritical processing fluid vaporizes and separates from the recesses of the pattern. This completes the drying process for one substrate W.

[0134] In the depressurization process, the processed fluid in the first branch channel L24 is discharged via the first discharge channel L27, and the processed fluid in the second branch channel L25 is discharged via the second discharge channel L28. In other words, the processed fluid in the first branch channel L24 and the processed fluid in the second branch channel L25 are discharged from different discharge channels. This prevents mixing of the processed fluid at the first temperature and the processed fluid at the second temperature.

[0135] After the depressurization process, the process moves to a standby phase. The processed substrate W is removed from the processing container 211, for example, after the standby phase. Specifically, after the depressurization process, the supply of inert gas to the processing container 211 is started via the first branch channel L24 and the second branch channel L25. Then, while the inert gas is being supplied to the processing container 211, the substrate W is removed from the processing container 211. Even after the substrate W has been removed from the processing container 211, the supply of inert gas to the processing container 211 continues. In this way, when the substrate W is removed from the processing container 211 while the inert gas is being supplied to the processing container 211, the inside of the processing container 211 becomes positive pressure, so when the processing container 211 is opened, a gas flow is formed from the inside to the outside of the processing container 211. Therefore, any residue inside the processing container 211 can be discharged and removed from the outside of the processing container 211. However, the supply of inert gas to the processing container 211 may be stopped when the substrate W is removed from the processing container 211.

[0136] According to the second embodiment described above, the fluid supply system 22 includes a processing fluid supply unit 221 and a temperature control unit 222. The processing fluid supply unit 221 has a flow rate adjustment mechanism (on-off valves V21, V22, orifices OR21, OR22) for adjusting the flow rate of the processing fluid. The temperature control unit 222 has a first branch channel L24 for passing a processing fluid at a first temperature into the processing container 211 and a second branch channel L25 for passing a processing fluid at a second temperature into the processing container 211. This allows for individual control of the flow rate and temperature of the processing fluid supplied into the processing container 211, and enables the supply of processing fluid with controlled flow rate and temperature into the processing container 211. As a result, the process margin in the substrate processing method performed using the substrate processing apparatus 10 can be expanded.

[0137] Furthermore, according to the second embodiment, a temperature adjustment section 222 (heating mechanisms HE21, HE22) is provided downstream of the confluence of the first supply channel L21, the second supply channel L22, and the third supply channel L23. In this case, the inert gas from the inert gas supply source S22 is heated to a first temperature by the heating mechanism HE21 and flows through the first branch channel L24. As a result, temperature uniformity along the direction of fluid flow is improved in the first branch channel L24 downstream of the heating mechanism HE21. In contrast, when room temperature inert gas flows through the first branch channel L24, even if the first branch channel L24 is heated by the line heater LH21, a temperature distribution along the direction of fluid flow is likely to occur in the first branch channel L24.

[0138] Furthermore, the inert gas from the inert gas supply source S22 is heated to a second temperature by the heating mechanism HE22 and flows through the second branch channel L25. As a result, temperature uniformity along the direction of fluid flow is improved in the second branch channel L25 downstream of the heating mechanism HE22. In contrast, when room temperature inert gas flows through the second branch channel L25, even if the second branch channel L25 is heated by the line heater LH22, a temperature distribution along the direction of fluid flow is likely to occur in the second branch channel L25.

[0139] Furthermore, according to the second embodiment, a large flow rate of heated inert gas is supplied into the processing container 211 via the first branch channel L24 and the second branch channel L25, thereby promoting the drying of the IPA remaining in the first branch channel L24, the second branch channel L25, and the processing container 211.

[0140] Furthermore, according to the second embodiment, in a waiting step before the processing fluid from the processing fluid supply source S21 is supplied into the processing container 211 via the first branch channel L24 and the second branch channel L25, heated inert gas flows through the first branch channel L24 and the second branch channel L25. In this case, since the first branch channel L24 and the second branch channel L25 are heated by the inert gas, the processing temperature of the first substrate W, which is processed after the waiting step, becomes approximately the same as the processing temperature of the second and subsequent substrates W. As a result, variations in processing temperature between substrates W are suppressed.

[0141] [First modified example of the second embodiment] Referring to Figure 19, a substrate processing apparatus 20A according to the first modified example of the second embodiment will be described. Figure 19 is a diagram showing a substrate processing apparatus 20A according to the first modified example of the second embodiment.

[0142] The substrate processing apparatus 20A differs from the substrate processing apparatus 20 in that heating mechanisms HE21 and HE22 are connected to the processing fluid supply unit, and that it lacks a bypass flow path L26. Other configurations of the substrate processing apparatus 20A may be the same as those of the substrate processing apparatus 20. The following description will focus on the differences from the substrate processing apparatus 20.

[0143] The substrate processing apparatus 20A includes a processing unit 21, a fluid supply system 22A, a discharge unit 23, and a control unit 24.

[0144] The fluid supply system 22A includes a processing fluid supply unit 221A, a processing fluid supply unit 221B, and a temperature control unit 222A.

[0145] The processing fluid supply unit 221A includes a processing fluid supply source S21A, a first supply channel L21A, an on-off valve V21A, an orifice OR21A, an inert gas supply source S22A, a third supply channel L23A, and an on-off valve V23A. The processing fluid supply source S21A, the first supply channel L21A, the on-off valve V21A, the orifice OR21A, the inert gas supply source S22A, the third supply channel L23A, and the on-off valve V23A may be the same as the processing fluid supply source S21, the first supply channel L21, the on-off valve V21, the orifice OR21, the inert gas supply source S22, the third supply channel L23, and the on-off valve V23A, respectively.

[0146] The processing fluid supply unit 221B includes a processing fluid supply source S21B, a first supply channel L21B, an on-off valve V21B, an orifice OR21B, a second supply channel L22B, an on-off valve V22B, an orifice OR22B, an inert gas supply source S22B, a third supply channel L23B, and an on-off valve V23B. The processing fluid supply source S21B, the first supply channel L21B, the on-off valve V21B, the orifice OR21B, the second supply channel L22B, the on-off valve V22B, the orifice OR22B, the inert gas supply source S22B, the third supply channel L23B, and the on-off valve V23B may be the same as the processing fluid supply source S21, the first supply channel L21, the on-off valve V21, the orifice OR21, the second supply channel L22, the on-off valve V22, the orifice OR22, the inert gas supply source S22, the third supply channel L23, and the on-off valve V23, respectively.

[0147] The temperature control unit 222A differs from the temperature control unit 222 in that the heating mechanism HE21 is connected to the processing fluid supply unit 221A, and the heating mechanism HE22 is connected to the processing fluid supply unit 221B.

[0148] In the substrate processing apparatus 20A, the processing fluid supply units 221A and 221B that supply fluid to the temperature control unit 222A are switched by controlling the opening and closing of the on-off valves V21A, V23A, V21B, V22B, and V23B. For example, when on-off valve V21A is opened, processing fluid is supplied from processing fluid supply unit 221A to the first branch channel L24. For example, when on-off valve V23A is opened, inert gas is supplied from processing fluid supply unit 221A to the first branch channel L24. For example, when at least one of on-off valves V21B and V22B is opened, processing fluid is supplied from processing fluid supply unit 221B to the second branch channel L25. For example, when on-off valve V23B is opened, inert gas is supplied from processing fluid supply unit 221B to the second branch channel L25. In the substrate processing apparatus 20A, for example, the processing fluid supply units 221A and 221B that supply fluid to the temperature control unit 222A are switched depending on the process being performed.

[0149] [Second modified example of the second embodiment] Referring to Figure 20, a substrate processing apparatus 20B according to a second modification of the second embodiment will be described. Figure 20 is a diagram showing a substrate processing apparatus 20B according to a second modification of the second embodiment.

[0150] The substrate processing apparatus 20B differs from the substrate processing apparatus 20 in that it is provided with orifices OR24 and OR25.

[0151] Orifice OR24 is installed in the first branch channel L24 downstream of filter F21 and upstream of the confluence point of the first branch channel L24 and the second branch channel L25. Orifice OR24 has a greater pressure loss than orifice OR23. In other words, orifice OR24 has a smaller flow area than orifice OR23.

[0152] Orifice OR25 is installed in the second branch channel L25, downstream of filter F22 and upstream of the confluence point of the first branch channel L24 and the second branch channel L25. Orifice OR25 has a greater pressure loss than orifice OR23. In other words, orifice OR25 has a smaller flow area than orifice OR23.

[0153] In the substrate processing apparatus 20B, when the on-off valve V25 is closed and the on-off valve V26 is opened, the fluid heated to a second temperature by the heating mechanism HE22 is supplied into the processing container 211 through the second branch channel L25. At this time, the fluid, whose flow velocity has been reduced by the orifice OR23, flows from the second branch channel L25 to the first branch channel L24 via the bypass channel L26. This prevents backflow of fluid from the processing container 211 toward the first branch channel L24. Therefore, contamination of the first branch channel L24 by IPA residue and the like can be suppressed. Furthermore, an orifice OR24 with a greater pressure loss than orifice OR23 is provided in the first branch channel L24 downstream of the filter F21. In this case, the pressure in the second branch channel L25 between the on-off valve V26 and the filter F22, the pressure in the first branch channel L24 upstream of orifice OR24, and the pressure in the first branch channel L24 downstream of orifice OR24 decrease in this order. Therefore, backflow of fluid from the processing container 211 toward the first branch channel L24 can be further prevented.

[0154] Furthermore, when the on-off valve V26 is closed and the on-off valve V25 is opened, the fluid heated to the first temperature by the heating mechanism HE21 is supplied into the processing container 211 through the first branch channel L24. At this time, the fluid, whose flow velocity has been reduced by the orifice OR23, flows from the first branch channel L24 to the second branch channel L25 via the bypass channel L26. This prevents backflow of fluid from the processing container 211 toward the second branch channel L25. Therefore, contamination of the second branch channel L25 by IPA residue and the like can be suppressed. In addition, an orifice OR25 with a greater pressure loss than orifice OR23 is provided in the second branch channel L25 downstream of the filter F22. In this case, the pressure in the first branch channel L24 between the on-off valve V25 and the filter F21, the pressure in the second branch channel L25 upstream of orifice OR25, and the pressure in the second branch channel L25 downstream of orifice OR25 decrease in that order. Therefore, backflow of fluid from the processing container 211 toward the second branch channel L25 can be further prevented.

[0155] [Third Embodiment] Referring to Figure 21, the substrate processing apparatus 30 according to the third embodiment will be described. Figure 21 is a diagram showing the substrate processing apparatus 30 according to the third embodiment.

[0156] The substrate processing apparatus 30 includes a processing unit 31, a fluid supply system 32, a discharge unit 33, and a control unit 34.

[0157] The processing unit 31 may be the same as the processing unit 11. The processing unit 31 includes a processing container 311 and a holding plate 312.

[0158] The fluid supply system 32 includes a processing fluid supply unit 321 and a temperature control unit 322.

[0159] The processing fluid supply unit 321 may be the same as the processing fluid supply unit 121. The processing fluid supply unit 321 includes a processing fluid supply source S31, a first supply channel L31, an on-off valve V31, an orifice OR31, a second supply channel L32, an on-off valve V32, an orifice OR32, an inert gas supply source S32, a third supply channel L33, and an on-off valve V33.

[0160] The temperature control unit 322 is connected to the processing fluid supply unit 321 and the processing container 311. The temperature control unit 322 causes the temperature-controlled fluid to flow into the processing container 311. The fluid contains the processing fluid and an inert gas. The temperature control unit 322 has a first flow path L34, a second flow path L35, a bypass flow path L36, and a first discharge flow path L37.

[0161] The first flow path L34 is connected to the side of the processing container 311. The first flow path L34 supplies fluid from the side of the processing container 311 toward the substrate W. A heating mechanism HE31, an orifice OR33, a filter F31, and an on / off valve V34 are provided in the first flow path L34 in order from upstream. A line heater LH31 is provided downstream of the heating mechanism HE31 in the first flow path L34. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the first flow path L34.

[0162] The heating mechanism HE31 heats the fluid supplied from the processing fluid supply unit 321 to a predetermined temperature and supplies the fluid at the predetermined temperature downstream.

[0163] The orifice OR33 has the function of reducing the flow velocity of the fluid flowing through the first channel L34 and regulating the pressure.

[0164] The filter F31 filters the fluid flowing through the first channel L34, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0165] The on-off valve V34 is a valve that switches the fluid flow on and off. When the on-off valve V34 is open, it allows fluid to flow to the downstream processing container 311, and when it is closed, it does not allow fluid to flow to the downstream processing container 311.

[0166] The line heater LH31 heats the first flow path L34 downstream of the heating mechanism HE31. The line heater LH31 suppresses the temperature drop of the fluid, which has been heated to a predetermined temperature by the heating mechanism HE31, as it flows through the first flow path L34.

[0167] The second channel L35 branches off from the first channel L34 between the filter F31 and the on-off valve V34. The second channel L35 is connected to the bottom of the processing container 311. The second channel L35 supplies fluid from below the processing container 311 toward the substrate W. The on-off valve V35 is provided in the second channel L35. The line heater LH32 is provided in the second channel L35. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the second channel L35.

[0168] The on-off valve V35 is a valve that switches the fluid flow on and off. When the on-off valve V35 is open, it allows fluid to flow to the downstream processing container 311, and when it is closed, it does not allow fluid to flow to the downstream processing container 311.

[0169] The line heater LH32 heats the second flow path L35. The line heater LH32 suppresses the temperature drop of the fluid, which has been heated to a predetermined temperature by the heating mechanism HE31, as it flows through the second flow path L35.

[0170] The bypass channel L36 connects the downstream position of the on-off valve V34 in the first channel L34 to the downstream position of the on-off valve V35 in the second channel L35. An orifice OR34 is provided in the bypass channel L36. A line heater LH33 is provided in the bypass channel L36.

[0171] The orifice OR34 has the function of reducing the flow velocity of the fluid flowing through the bypass channel L36 and thereby regulating the pressure.

[0172] Line heater LH33 heats the bypass channel L36.

[0173] In the temperature control unit 322, when the on-off valve V34 is closed and the on-off valve V35 is opened, the fluid heated to a predetermined temperature by the heating mechanism HE31 is supplied into the processing container 311 from below through the second flow path L35. At this time, the fluid, whose flow velocity has been reduced by the orifice OR34, flows from the second flow path L35 to the first flow path L34 via the bypass flow path L36. This prevents backflow of fluid from the processing container 311 toward the first flow path L34. Therefore, contamination of the first flow path L34 by IPA residue and the like can be suppressed.

[0174] Furthermore, when the on-off valve V35 is closed and the on-off valve V34 is opened, the fluid heated to a predetermined temperature by the heating mechanism HE31 is supplied into the processing container 311 from the side of the processing container 311 through the first flow path L34. At this time, the fluid, whose flow velocity has been reduced by the orifice OR34, flows from the first flow path L34 to the second flow path L35 via the bypass flow path L36. This prevents backflow of fluid from the processing container 311 toward the second flow path L35. Therefore, contamination of the second flow path L35 by IPA residue and the like can be suppressed.

[0175] The first discharge channel L37 discharges the fluid in the first channel L34. The first discharge channel L37 branches off from the first channel L34 between the filter F31 and the on-off valve V34. The on-off valve V36 and the orifice OR35 are provided in the first discharge channel L37 in order from upstream. The line heater LH34 is provided in the first discharge channel L37. The orifice OR35 is optional.

[0176] The on-off valve V36 is a valve that switches the fluid flow on and off. When the on-off valve V36 is open, it allows fluid to flow into the downstream first discharge channel L37, and when it is closed, it does not allow fluid to flow into the downstream first discharge channel L37.

[0177] The orifice OR35 has the function of reducing the flow velocity of the fluid flowing through the first discharge channel L37 and adjusting the pressure.

[0178] Line heater LH34 heats the first discharge channel L37.

[0179] The discharge section 33 has a discharge channel L38. The discharge channel L38 is connected to the processing container 311. A back pressure valve BV31 and an on-off valve V37 are provided in the discharge channel L38 in order from upstream. A line heater LH35 is provided in the discharge channel L38. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the discharge channel L38.

[0180] The back pressure valve BV31, the on-off valve V37, and the line heater LH35 may be the same as the back pressure valve BV11, the on-off valve V17, and the line heater LH15, respectively.

[0181] The control unit 34, like the control unit 14, receives measurement signals from various sensors and transmits control signals to various functional elements. The control unit 34 is, for example, a computer and comprises an arithmetic unit 341 and a storage unit 342. The arithmetic unit 341 and the storage unit 342 may be the same as the arithmetic unit 141 and the storage unit 142, respectively.

[0182] [Fourth Embodiment] Referring to Figure 22, the substrate processing apparatus 40 according to the fourth embodiment will be described. Figure 22 is a diagram showing the substrate processing apparatus 40 according to the fourth embodiment.

[0183] The substrate processing apparatus 40 includes a processing unit 41, a fluid supply system 42, a discharge unit 43, and a control unit 44.

[0184] The processing unit 41 may be the same as the processing unit 11. The processing unit 41 includes a processing container 411 and a holding plate 412.

[0185] The fluid supply system 42 includes a processing fluid supply unit 421 and a temperature control unit 422.

[0186] The processing fluid supply unit 421 may be the same as the processing fluid supply unit 121. The processing fluid supply unit 421 includes a processing fluid supply source S41, a first supply channel L41, an on-off valve V41, an orifice OR41, a second supply channel L42, an on-off valve V42, an orifice OR42, an inert gas supply source S42, a third supply channel L43, and an on-off valve V43.

[0187] The temperature control unit 422 is connected to the processing fluid supply unit 421 and the processing container 411. The temperature control unit 422 causes a temperature-controlled fluid to flow into the processing container 411. The fluid includes a processing fluid and an inert gas. The temperature control unit 422 has a first branch channel L44, a second branch channel L45, a first bypass channel L46, a first discharge channel L47, a second discharge channel L48, a third branch channel L421, and a second bypass channel L422.

[0188] The first branch channel L44 is connected to the side of the processing container 411. The first branch channel L44 supplies fluid from the side of the processing container 411 toward the substrate W. A heating mechanism HE41, an on-off valve V45, a filter F41, and an on-off valve V50 are provided in the first branch channel L44 in order from upstream. A line heater LH41 is provided downstream of the heating mechanism HE41 in the first branch channel L44. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the first branch channel L44.

[0189] The heating mechanism HE41 is installed in parallel with the heating mechanism HE42. The heating mechanism HE41 heats the fluid supplied from the processing fluid supply unit 421 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or more and 120°C or less.

[0190] The on-off valve V45 is a valve that switches the fluid flow on and off. When the on-off valve V45 is open, it allows fluid to flow to the downstream filter F41, and when it is closed, it does not allow fluid to flow to the downstream filter F41.

[0191] The filter F41 filters the fluid flowing through the first branch channel L44, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0192] The on-off valve V50 is a valve that switches the fluid flow on and off. When the on-off valve V50 is open, it allows fluid to flow to the downstream processing container 411, and when it is closed, it does not allow fluid to flow to the downstream processing container 411.

[0193] The line heater LH41 heats the first branch channel L44 downstream of the heating mechanism HE41. The line heater LH41 suppresses the temperature drop of the fluid, which has been heated to a first temperature by the heating mechanism HE41, as it flows through the first branch channel L44.

[0194] The second branch channel L45 branches off from the first branch channel L44 between the processing fluid supply unit 421 and the heating mechanism HE41. The second branch channel L45 merges with the first branch channel L44 between the filter F41 and the on / off valve V50.

[0195] In the second branch channel L45, an on-off valve V44, a heating mechanism HE42, an on-off valve V46, and a filter F42 are provided in that order from upstream. A line heater LH42 is provided downstream of the heating mechanism HE42 in the second branch channel L45. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the second branch channel L45.

[0196] The on-off valve V44 is a valve that switches the fluid flow on and off. When the on-off valve V44 is open, it allows fluid to flow to the downstream heating mechanism HE42, and when it is closed, it does not allow fluid to flow to the downstream heating mechanism HE42.

[0197] The heating mechanism HE42 heats the fluid supplied from the processing fluid supply unit 421 to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0198] The on-off valve V46 is a valve that switches the fluid flow on and off. When the on-off valve V46 is open, it allows fluid to flow to the downstream filter F42, and when it is closed, it does not allow fluid to flow to the downstream filter F42.

[0199] The filter F42 filters the fluid flowing through the second branch channel L45, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0200] The line heater LH42 heats the second branch channel L45 downstream of the heating mechanism HE42. The line heater LH42 suppresses the temperature drop of the fluid, which has been heated to a second temperature by the heating mechanism HE42, as it flows through the second branch channel L45.

[0201] The first bypass channel L46 connects the position between the on-off valve V45 and filter F41 in the first branch channel L44 with the position between the on-off valve V46 and filter F42 in the second branch channel L45. An orifice OR43 is provided in the first bypass channel L46. A line heater LH43 is provided in the first bypass channel L46. The first bypass channel L46, orifice OR43, and line heater LH43 are optional.

[0202] The orifice OR43 has the function of reducing the flow velocity of the fluid flowing through the first bypass channel L46 and thereby regulating the pressure.

[0203] Line heater LH43 heats the first bypass channel L46.

[0204] In the temperature control unit 422, when the on-off valve V45 is closed and the on-off valve V46 is opened, the fluid heated to the second temperature by the heating mechanism HE42 is supplied to the processing container 411 through the second branch channel L45. At this time, the fluid, whose flow velocity has been reduced by the orifice OR43, flows from the second branch channel L45 to the first branch channel L44 via the first bypass channel L46. This prevents backflow of fluid from the confluence of the first branch channel L44 and the second branch channel L45 toward the upstream of the first branch channel L44. Therefore, contamination of the first branch channel L44, filter F41, etc. can be suppressed.

[0205] Furthermore, when the on-off valve V46 is closed and the on-off valve V45 is opened, the fluid heated to the first temperature by the heating mechanism HE41 is supplied into the processing container 411 through the first branch channel L44. At this time, the fluid, whose flow velocity has been reduced by the orifice OR43, flows from the first branch channel L44 through the first bypass channel L46 into the second branch channel L45. This prevents backflow of fluid from the confluence of the first branch channel L44 and the second branch channel L45 toward the upstream of the second branch channel L45. Therefore, contamination of the second branch channel L45, filter F42, etc. can be suppressed.

[0206] In this way, by exclusively opening and closing valves V45 and V46, the temperature of the fluid flowing through the processing container 411 can be changed. Also, when both valves V45 and V46 are open, the fluid heated to a first temperature by heating mechanism HE41 and the fluid heated to a second temperature by heating mechanism HE42 are mixed and supplied to the processing container 411. In this case, a fluid at an intermediate temperature between the first and second temperatures can be supplied to the processing container 411. In this way, by controlling the opening and closing of valves V45 and V46, the temperature of the fluid flowing through the processing container 411 can be changed in three stages.

[0207] The first discharge channel L47 discharges the fluid in the first branch channel L44. The first discharge channel L47 branches off from the first branch channel L44 between the heating mechanism HE41 and the on-off valve V45. The on-off valve V47 is provided in the first discharge channel L47. The line heater LH44 is provided in the first discharge channel L47. An orifice may be provided in the first discharge channel L47.

[0208] The on-off valve V47 is a valve that switches the fluid flow on and off. When the on-off valve V47 is open, it allows fluid to flow into the downstream first discharge channel L47, and when it is closed, it does not allow fluid to flow into the downstream first discharge channel L47.

[0209] Line heater LH44 heats the first discharge channel L47.

[0210] The second discharge channel L48 discharges the fluid in the second branch channel L45. The second discharge channel L48 branches off from the second branch channel L45 between the heating mechanism HE42 and the on-off valve V46. The on-off valve V48 is provided in the second discharge channel L48. The line heater LH45 is provided in the second discharge channel L48. An orifice may be provided in the second discharge channel L48.

[0211] The on-off valve V48 is a valve that switches the fluid flow on and off. When the on-off valve V48 is open, it allows fluid to flow into the downstream second discharge channel L48, and when it is closed, it does not allow fluid to flow into the downstream second discharge channel L48.

[0212] Line heater LH45 heats the second discharge channel L48.

[0213] The third branch channel L421 branches off from the first branch channel L44 between the filter F41 and the on-off valve V50. The third branch channel L421 is connected to the bottom of the processing container 411. The third branch channel L421 supplies fluid from below the processing container 411 toward the substrate W.

[0214] A shut-off valve V421 is provided in the third branch channel L421. A line heater LH421 is provided in the third branch channel L421. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the third branch channel L421.

[0215] The on-off valve V421 is a valve that switches the fluid flow on and off. When the on-off valve V421 is open, it allows fluid to flow to the downstream processing container 411, and when it is closed, it does not allow fluid to flow to the downstream processing container 411.

[0216] Line heater LH421 heats the third branch channel L421. Line heater LH421 suppresses the temperature drop of the fluid heated to the first temperature by heating mechanism HE41 and the fluid heated to the second temperature by heating mechanism HE42 as they flow through the third branch channel L421.

[0217] The second bypass channel L422 connects the downstream position of the on-off valve V50 in the first branch channel L44 with the downstream position of the on-off valve V421 in the third branch channel L421. An orifice OR422 is provided in the second bypass channel L422. A line heater LH422 is provided in the second bypass channel L422.

[0218] Orifice OR422 has the function of reducing the flow velocity of the fluid flowing through the second bypass channel L422 and regulating the pressure.

[0219] Line heater LH422 heats the second bypass channel L422.

[0220] In the temperature control unit 422, when the on-off valve V50 is closed and the on-off valve V421 is opened, fluid is supplied into the processing container 411 through the third branch channel L421. At this time, the fluid, whose flow velocity has been reduced by the orifice OR422, flows from the third branch channel L421 to the first branch channel L44 via the second bypass channel L422. This prevents backflow of fluid from the processing container 411 upstream of the first branch channel L44. Therefore, contamination of the first branch channel L44 by IPA residue and the like can be suppressed.

[0221] Furthermore, when the on-off valve V421 is closed and the on-off valve V50 is opened, fluid is supplied into the treatment container 411 through the first branch channel L44. At this time, the fluid, whose flow velocity has been reduced by the orifice OR422, flows from the first branch channel L44 to the third branch channel L421 via the second bypass channel L422. This prevents backflow of fluid from the treatment container 411 upstream of the third branch channel L421. Therefore, contamination of the third branch channel L421 by IPA residue and other substances can be suppressed.

[0222] The discharge section 43 has a discharge channel L49. The discharge channel L49 is connected to the processing container 411. Back pressure valve BV41 and on-off valve V49 are provided in the discharge channel L49 in order from upstream. A line heater LH46 is provided in the discharge channel L49. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the discharge channel L49.

[0223] The back pressure valve BV41, the on-off valve V49, and the line heater LH46 may be the same as the back pressure valve BV11, the on-off valve V17, and the line heater LH15, respectively.

[0224] The control unit 44, like the control unit 14, receives measurement signals from various sensors and transmits control signals to various functional elements. The control unit 44 is, for example, a computer and comprises an arithmetic unit 441 and a storage unit 442. The arithmetic unit 441 and the storage unit 442 may be the same as the arithmetic unit 141 and the storage unit 142, respectively.

[0225] [Fifth Embodiment] Referring to Figure 23, the substrate processing apparatus 50 according to the fifth embodiment will be described. Figure 23 is a diagram showing the substrate processing apparatus 50 according to the fifth embodiment.

[0226] The substrate processing apparatus 50 includes a processing unit 51, a fluid supply system 52, a discharge unit 53, and a control unit 54.

[0227] The processing unit 51 may be the same as the processing unit 11. The processing unit 51 includes a processing container 511 and a holding plate 512.

[0228] The fluid supply system 52 includes a processing fluid supply unit 521 and a temperature control unit 522.

[0229] The processing fluid supply unit 521 may be the same as the processing fluid supply unit 121. The processing fluid supply unit 521 includes a processing fluid supply source S51, a first supply channel L51, an on-off valve V51, an orifice OR51, a second supply channel L52, an on-off valve V52, an orifice OR52, an inert gas supply source S52, a third supply channel L53, and an on-off valve V53.

[0230] The temperature control unit 522 is connected to the processing fluid supply unit 521 and the processing container 511. The temperature control unit 522 causes the temperature-controlled fluid to flow into the processing container 511. The fluid includes the processing fluid and an inert gas. The temperature control unit 522 has a first branch channel L54, a second branch channel L55, a first bypass channel L56, a first discharge channel L57, a third branch channel L521, and a second bypass channel L522.

[0231] The first branch channel L54 is connected to the side of the processing container 511. The first branch channel L54 supplies fluid from the side of the processing container 511 toward the substrate W. A heating mechanism HE51, an on-off valve V55, a filter F51, and an on-off valve V60 are provided in the first branch channel L54 in order from upstream. A line heater LH51 is provided downstream of the heating mechanism HE51 in the first branch channel L54. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the first branch channel L54.

[0232] In the second branch channel L55, a heating mechanism HE52, an on-off valve V56, and a filter F52 are provided in that order from upstream. Downstream of the heating mechanism HE52 in the second branch channel L55, a line heater LH52 is provided. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the second branch channel L55.

[0233] The first branch channel L54 branches off from the second branch channel L55 between the heating mechanism HE52 and the on-off valve V56. The second branch channel L55 merges with the first branch channel L54 between the filter F51 and the on-off valve V60.

[0234] The heating mechanism HE51 is installed in series with the heating mechanism HE52. The heating mechanism HE51 heats the fluid supplied from the processing fluid supply unit 521 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or more and 120°C or less.

[0235] The on-off valve V55 is a valve that switches the fluid flow on and off. When the on-off valve V55 is open, it allows fluid to flow to the downstream filter F51, and when it is closed, it does not allow fluid to flow to the downstream filter F51.

[0236] The filter F51 filters the fluid flowing through the first branch channel L54, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0237] The on-off valve V60 is a valve that switches the fluid flow on and off. When the on-off valve V60 is open, it allows fluid to flow to the downstream processing container 511, and when it is closed, it does not allow fluid to flow to the downstream processing container 511.

[0238] The line heater LH51 heats the first branch channel L54 downstream of the heating mechanism HE51. The line heater LH51 suppresses the temperature drop of the fluid, which has been heated to a first temperature by the heating mechanism HE51, as it flows through the first branch channel L54.

[0239] The heating mechanism HE52 heats the fluid supplied from the processing fluid supply unit 521 to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0240] The on-off valve V56 is a valve that switches the fluid flow on and off. When the on-off valve V56 is open, it allows fluid to flow to the downstream filter F52, and when it is closed, it does not allow fluid to flow to the downstream filter F52.

[0241] Filter F52 filters the fluid flowing through the second branch channel L55, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0242] The line heater LH52 heats the second branch channel L55 downstream of the heating mechanism HE52. The line heater LH52 suppresses the temperature drop of the fluid, which has been heated to a second temperature by the heating mechanism HE52, as it flows through the second branch channel L55.

[0243] The first bypass channel L56 connects the position between the on-off valve V55 and the filter F51 in the first branch channel L54 with the position between the on-off valve V56 and the filter F52 in the second branch channel L55. An orifice OR53 is provided in the first bypass channel L56. A line heater LH53 is provided in the first bypass channel L56.

[0244] The orifice OR53 has the function of reducing the flow velocity of the fluid flowing through the first bypass channel L56 and thereby regulating the pressure.

[0245] Line heater LH53 heats the first bypass channel L56.

[0246] In the temperature control unit 522, when the on-off valve V55 is closed and the on-off valve V56 is opened, the fluid heated to the second temperature by the heating mechanism HE52 is supplied to the processing container 511 through the second branch channel L55. At this time, the fluid, whose flow velocity has been reduced by the orifice OR53, flows from the second branch channel L55 to the first branch channel L54 via the first bypass channel L56. This prevents backflow of fluid from the confluence of the first branch channel L54 and the second branch channel L55 toward the upstream of the first branch channel L54. Therefore, contamination of the first branch channel L54, filter F51, etc. can be suppressed.

[0247] Furthermore, when the on-off valve V56 is closed and the on-off valve V55 is opened, the fluid heated to the first temperature by the heating mechanism HE51 is supplied into the processing container 511 through the first branch channel L54. At this time, the fluid, whose flow velocity has been reduced by the orifice OR53, flows from the first branch channel L54 through the first bypass channel L56 into the second branch channel L55. This prevents backflow of fluid from the confluence of the first branch channel L54 and the second branch channel L55 toward the upstream of the second branch channel L55. Therefore, contamination of the second branch channel L55, filter F52, etc. can be suppressed.

[0248] In this way, by exclusively opening and closing valves V55 and V56, the temperature of the fluid flowing through the processing container 511 can be changed. Also, when both valves V55 and V56 are open, the fluid heated to a first temperature by heating mechanism HE51 and the fluid heated to a second temperature by heating mechanism HE52 are mixed and supplied to the processing container 511. In this case, a fluid at an intermediate temperature between the first and second temperatures can be supplied to the processing container 511. In this way, by controlling the opening and closing of valves V55 and V56, the temperature of the fluid flowing through the processing container 511 can be changed in three stages.

[0249] The first discharge channel L57 discharges the fluid in the first branch channel L54. The first discharge channel L57 branches off from the first branch channel L54 between the heating mechanism HE51 and the on-off valve V55. The on-off valve V54 is provided in the first discharge channel L57. The line heater LH54 is provided in the first discharge channel L57. An orifice may be provided in the first discharge channel L57.

[0250] The on-off valve V54 is a valve that switches the fluid flow on and off. When the on-off valve V54 is open, it allows fluid to flow into the downstream first discharge channel L57, and when it is closed, it does not allow fluid to flow into the downstream first discharge channel L57.

[0251] Line heater LH54 heats the first discharge channel L57.

[0252] The third branch channel L521 branches off from the first branch channel L54 between the filter F51 and the on-off valve V60. The third branch channel L521 is connected to the bottom of the processing container 511. The third branch channel L521 supplies fluid from below the processing container 511 toward the substrate W.

[0253] A shut-off valve V521 is provided in the third branch channel L521. A line heater LH521 is provided in the third branch channel L521. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the third branch channel L521.

[0254] The on-off valve V521 is a valve that switches the fluid flow on and off. When the on-off valve V521 is open, it allows fluid to flow to the downstream processing container 511, and when it is closed, it does not allow fluid to flow to the downstream processing container 511.

[0255] The line heater LH521 heats the third branch channel L521. The line heater LH521 suppresses the temperature drop of the fluid heated to the first temperature by the heating mechanism HE51 and the fluid heated to the second temperature by the heating mechanism HE52 as they flow through the third branch channel L521.

[0256] The second bypass channel L522 connects the downstream position of the on-off valve V60 in the first branch channel L54 with the downstream position of the on-off valve V521 in the third branch channel L521. An orifice OR522 is provided in the second bypass channel L522. A line heater LH522 is provided in the second bypass channel L522.

[0257] The orifice OR522 has the function of reducing the flow velocity of the fluid flowing through the second bypass channel L522 and regulating the pressure.

[0258] Line heater LH522 heats the second bypass channel L522.

[0259] In the temperature control unit 522, when the on-off valve V60 is closed and the on-off valve V521 is opened, fluid is supplied into the processing container 511 through the third branch channel L521. At this time, the fluid, whose flow velocity has been reduced by the orifice OR522, flows from the third branch channel L521 to the first branch channel L54 via the second bypass channel L522. This prevents backflow of fluid from the processing container 511 upstream of the first branch channel L54. Therefore, contamination of the first branch channel L54 by IPA residue and the like can be suppressed.

[0260] Furthermore, when the on-off valve V521 is closed and the on-off valve V60 is opened, fluid is supplied into the treatment container 511 through the first branch channel L54. At this time, the fluid, whose flow velocity has been reduced by the orifice OR522, flows from the first branch channel L54 to the third branch channel L521 via the second bypass channel L522. This prevents backflow of fluid from the treatment container 511 upstream of the third branch channel L521. Therefore, contamination of the third branch channel L521 by IPA residue and other substances can be suppressed.

[0261] The discharge section 53 has a discharge channel L58. The discharge channel L58 is connected to the processing container 511. A back pressure valve BV51 and an on-off valve V57 are provided in the discharge channel L58 in order from upstream. A line heater LH55 is provided in the discharge channel L58. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the discharge channel L58.

[0262] The back pressure valve BV51, the on-off valve V57, and the line heater LH55 may be the same as the back pressure valve BV11, the on-off valve V17, and the line heater LH15, respectively.

[0263] The control unit 54, like the control unit 14, receives measurement signals from various sensors and transmits control signals to various functional elements. The control unit 54 is, for example, a computer and comprises an arithmetic unit 541 and a storage unit 542. The arithmetic unit 541 and the storage unit 542 may be the same as the arithmetic unit 141 and the storage unit 142, respectively.

[0264] [Sixth Embodiment] Referring to Figure 24, the substrate processing apparatus 60 according to the sixth embodiment will be described. Figure 24 is a diagram showing the substrate processing apparatus 60 according to the sixth embodiment.

[0265] The substrate processing apparatus 60 includes a processing unit 61, a fluid supply system 62, a discharge unit 63, and a control unit 64.

[0266] The processing unit 61 may be the same as the processing unit 11. The processing unit 61 includes a processing container 611 and a holding plate 612.

[0267] The fluid supply system 62 includes a processing fluid supply unit 621A, a processing fluid supply unit 621B, and a temperature control unit 622.

[0268] The processing fluid supply unit 621A and the processing fluid supply unit 621B may each be the same as the processing fluid supply unit 221A and the processing fluid supply unit 221B. The processing fluid supply unit 621A includes a processing fluid supply source S61A, a first supply flow path L61A, an on-off valve V61A, an orifice OR61A, an inert gas supply source S62A, a third supply flow path L63A, and an on-off valve V63A. The processing fluid supply unit 621B includes a processing fluid supply source S61B, a first supply flow path L61B, an on-off valve V61B, an orifice OR61B, a second supply flow path L62B, an on-off valve V62B, an orifice OR62B, an inert gas supply source S62B, a third supply flow path L63B, and an on-off valve V63B.

[0269] The temperature adjustment unit 622 is connected to the processing fluid supply units 621A and 621B and the processing container 611. The temperature adjustment unit 622 allows a fluid with adjusted temperature to flow into the interior of the processing container 611. The fluid includes a processing fluid and an inert gas. The temperature adjustment unit 622 includes a first branch flow path L64, a second branch flow path L65, a bypass flow path L66, a first discharge flow path L67, a second discharge flow path L68, and a third branch flow path L621.

[0270] The first branch flow path L64 is connected to the processing fluid supply unit 621A. Fluid is supplied to the first branch flow path L64 from the processing fluid supply unit 621A. The first branch flow path L64 is connected to a side portion of the processing container 611. The first branch flow path L64 supplies fluid from the side of the processing container 611 toward the substrate W. In the first branch flow path L64, a heating mechanism HE61, an on-off valve V65, a filter F61, and an on-off valve V70 are provided in this order from upstream. A line heater LH61 is provided downstream of the heating mechanism HE61 in the first branch flow path L64. Sensors such as temperature sensors and pressure sensors may be provided at various positions of the first branch flow path L64.

[0271] The heating mechanism HE61 is provided in parallel with the heating mechanism HE62. The heating mechanism HE61 heats the fluid supplied from the processing fluid supply unit 621A to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

[0272] The on-off valve V65 is a valve that switches the fluid flow on and off. When the on-off valve V65 is open, it allows fluid to flow to the downstream filter F61, and when it is closed, it does not allow fluid to flow to the downstream filter F61.

[0273] Filter F61 filters the fluid flowing through the first branch channel L64, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0274] The on-off valve V70 is a valve that switches the fluid flow on and off. When the on-off valve V70 is open, it allows fluid to flow to the downstream processing container 611, and when it is closed, it does not allow fluid to flow to the downstream processing container 611.

[0275] The line heater LH61 heats the first branch channel L64 downstream of the heating mechanism HE61. The line heater LH61 suppresses the temperature drop of the fluid, which has been heated to a first temperature by the heating mechanism HE61, as it flows through the first branch channel L64.

[0276] The second branch channel L65 is connected to the processing fluid supply unit 621B. Fluid is supplied to the second branch channel L65 from the processing fluid supply unit 621B. The second branch channel L65 merges with the first branch channel L64 between the filter F61 and the on-off valve V70. The heating mechanism HE62, the on-off valve V66, and the filter F62 are provided in the second branch channel L65 in order from upstream. A line heater LH62 is provided downstream of the heating mechanism HE62 in the second branch channel L65. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the second branch channel L65.

[0277] The heating mechanism HE62 heats the fluid supplied from the processing fluid supply unit 621B to a second temperature and supplies the fluid at the second temperature downstream. The second temperature is lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0278] The on-off valve V66 is a valve that switches the fluid flow on and off. When the on-off valve V66 is open, it allows fluid to flow to the downstream filter F62, and when it is closed, it does not allow fluid to flow to the downstream filter F62.

[0279] Filter F62 filters the fluid flowing through the second branch channel L65, removing foreign matter contained in the fluid. This suppresses the generation of particles on the surface of the substrate W during the drying process of the substrate W using the fluid.

[0280] The line heater LH62 heats the second branch channel L65 downstream of the heating mechanism HE62. The line heater LH62 suppresses the temperature drop of the fluid, which has been heated to a second temperature by the heating mechanism HE62, as it flows through the second branch channel L65.

[0281] The bypass channel L66 connects the position between the on-off valve V65 and filter F61 in the first branch channel L64 with the position between the on-off valve V66 and filter F62 in the second branch channel L65. An orifice OR63 is provided in the bypass channel L66. A line heater LH63 is provided in the bypass channel L66.

[0282] The orifice OR63 has the function of reducing the flow velocity of the fluid flowing through the bypass channel L66 and thereby regulating the pressure.

[0283] Line heater LH63 heats the bypass channel L66.

[0284] In the temperature control unit 622, when the on-off valve V65 is closed and the on-off valve V66 is opened, the fluid heated to the second temperature by the heating mechanism HE62 is supplied to the processing container 611 through the second branch channel L65. At this time, the fluid, whose flow velocity has been reduced by the orifice OR63, flows from the second branch channel L65 to the first branch channel L64 via the bypass channel L66. This prevents backflow of fluid from the confluence of the first branch channel L64 and the second branch channel L65 toward the upstream of the first branch channel L64. Therefore, contamination of the first branch channel L64, filter F61, etc. can be suppressed.

[0285] Furthermore, when valve V66 is closed and valve V65 is opened, the fluid heated to the first temperature by the heating mechanism HE61 is supplied into the processing container 611 through the first branch channel L64. At this time, the fluid, whose flow velocity has been reduced by the orifice OR63, flows from the first branch channel L64 to the second branch channel L65 via the bypass channel L66. This prevents backflow of fluid from the confluence of the first branch channel L64 and the second branch channel L65 toward the upstream of the second branch channel L65. Therefore, contamination of the second branch channel L65, filter F62, etc. can be suppressed.

[0286] In this way, by exclusively opening and closing valves V65 and V66, the temperature of the fluid flowing through the processing container 611 can be changed. Also, when both valves V65 and V66 are open, the fluid heated to a first temperature by heating mechanism HE61 and the fluid heated to a second temperature by heating mechanism HE62 are mixed and supplied to the processing container 611. In this case, a fluid at an intermediate temperature between the first and second temperatures can be supplied to the processing container 611. In this way, by controlling the opening and closing of valves V65 and V66, the temperature of the fluid flowing through the processing container 611 can be changed in three stages.

[0287] The first discharge channel L67 discharges the fluid in the first branch channel L64. The first discharge channel L67 branches off from the first branch channel L64 between the heating mechanism HE61 and the on-off valve V65. The on-off valve V67 is provided in the first discharge channel L67. The line heater LH64 is provided in the first discharge channel L67. An orifice may be provided in the first discharge channel L67.

[0288] The on-off valve V67 is a valve that switches the fluid flow on and off. When the on-off valve V67 is open, it allows fluid to flow into the downstream first discharge channel L67, and when it is closed, it does not allow fluid to flow into the downstream first discharge channel L67.

[0289] Line heater LH64 heats the first discharge channel L67.

[0290] The second discharge flow path L68 discharges the fluid in the second branch flow path L65. The second discharge flow path L68 branches from the second branch flow path L65 between the heating mechanism HE62 and the on-off valve V66. An on-off valve V68 is provided in the second discharge flow path L68. A line heater LH65 is provided in the second discharge flow path L68. An orifice may be provided in the second discharge flow path L68.

[0291] The on-off valve V68 is a valve that switches the on and off of the fluid flow. In the open state, the on-off valve V68 allows the fluid to flow into the downstream second discharge flow path L68, and in the closed state, it does not allow the fluid to flow into the downstream second discharge flow path L68.

[0292] The line heater LH65 heats the second discharge flow path L68.

[0293] The third branch flow path L621 branches from the first branch flow path L64 between the filter F61 and the on-off valve V70. The third branch flow path L621 is connected to the bottom of the processing container 611. The third branch flow path L621 supplies fluid from below the processing container 611 toward the substrate W.

[0294] An on-off valve V621 is provided in the third branch flow path L621. A line heater LH621 is provided in the third branch flow path L621. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the third branch flow path L621.

[0295] [[ID=I9]] The on-off valve V621 is a valve that switches the on and off of the fluid flow. In the open state, the on-off valve V621 allows the fluid to flow into the downstream processing container 611, and in the closed state, it does not allow the fluid to flow into the downstream processing container 611.

[0296] The line heater LH621 heats the third branch flow path L621. The line heater LH621 suppresses the temperature drop when the fluid heated to the first temperature by the heating mechanism HE61 and the fluid heated to the second temperature by the heating mechanism HE62 flow through the third branch flow path L621.

[0297] In the temperature control unit 622, when the on-off valve V70 is closed and the on-off valve V621 is opened, fluid is supplied into the processing container 611 through the third branch passage L621. Also, when the on-off valve V621 is closed and the on-off valve V70 is opened, fluid is supplied into the processing container 611 through the first branch passage L64.

[0298] The discharge section 63 has a discharge channel L69. The discharge channel L69 is connected to the processing container 611. A back pressure valve BV61 and an on-off valve V69 are provided in the discharge channel L69 in order from upstream. A line heater LH66 is provided in the discharge channel L69. Sensors such as temperature sensors and pressure sensors may be provided at various positions in the discharge channel L69.

[0299] The back pressure valve BV61, the on-off valve V69, and the line heater LH66 may be the same as the back pressure valve BV11, the on-off valve V17, and the line heater LH15, respectively.

[0300] The control unit 64, like the control unit 14, receives measurement signals from various sensors and transmits control signals to various functional elements. The control unit 64 is, for example, a computer and comprises an arithmetic unit 641 and a storage unit 642. The arithmetic unit 641 and the storage unit 642 may be the same as the arithmetic unit 141 and the storage unit 142, respectively.

[0301] In the above embodiment, on-off valves V11 and V21 are examples of first supply valves, and on-off valves V12 and V22 are examples of second supply valves. On-off valves V15 and V25 are examples of first on-off valves, on-off valves V16 and V26 are examples of second on-off valves, and on-off valve V24 is an example of a third on-off valve. On-off valve V27 is an example of a first discharge valve, on-off valve V28 is an example of a second discharge valve, and on-off valve V29 is an example of a third discharge valve. Heating mechanisms HE11 and HE21 are examples of first heating mechanisms, and heating mechanisms HE12 and HE22 are examples of second heating mechanisms. Orifices OR13 and OR23 are examples of first throttles. First branch passages L14 and L24 and second branch passages L15 and L25 are examples of fluid supply passages.

[0302] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.

[0303] This international application claims priority based on Japanese Patent Application No. 2022-168324, filed on 20 October 2022, and the entire contents of said application are incorporated herein by reference. [Explanation of Symbols]

[0304] 10, 20 Substrate processing equipment 11, 21 Processing Unit 111, 211 Processing containers 12, 22 Fluid supply systems 121, 221 Processing fluid supply unit 122, 222 Temperature adjustment section HE11, HE21 heating mechanism HE12, HE22 heating mechanism L14, L24 First branch channel L15, L25 Second branch channel V11, V21 Shut-off valves V12, V22 Shut-off valves

Claims

1. A fluid supply system that supplies fluid into a processing container in which substrates are processed internally, A processing fluid supply unit that supplies the processing fluid, A fluid supply passage is connected to the processing fluid supply unit and the processing container, and the temperature-adjusted processing fluid is passed through the processing container. A first heating mechanism is provided in the fluid supply passage for heating the processing fluid to a first temperature, A second heating mechanism is provided in the fluid supply passage and heats the processing fluid to a second temperature lower than the first temperature, It has, The processing fluid supply unit has a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid. The aforementioned fluid supply passage is A first branch channel that allows the processing fluid to flow into the processing container through the first heating mechanism, A second branch channel that allows the processing fluid to flow into the processing container through the second heating mechanism, It has, The first heating mechanism is provided in the first branch channel, and the second heating mechanism is provided in the second branch channel. A first on / off valve is provided downstream of the first heating mechanism in the first branch channel. A second on-off valve is provided downstream of the second heating mechanism in the second branch channel. The fluid supply passage has a bypass passage downstream of the first on-off valve and the second on-off valve that connects the first branch passage and the second branch passage. Fluid supply system.

2. The bypass channel is provided with a first throttle, The fluid supply system according to claim 1.

3. It has a control unit that controls each part of the fluid supply system, The control unit is configured to change the temperature of the processing fluid flowing through the processing container by controlling the opening and closing of the first and second on-off valves. The fluid supply system according to claim 1.

4. The first heating mechanism is provided in series with the second heating mechanism, A first discharge channel is connected to the first branch channel for discharging the processed fluid within the first branch channel. A fluid supply system according to any one of claims 1 to 3.

5. The first heating mechanism is provided in parallel with the second heating mechanism, The first branch channel is connected to a first discharge channel which has a first discharge valve and discharges the processed fluid in the first branch channel. The second branch channel is connected to a second discharge channel which has a second discharge valve and discharges the processed fluid in the second branch channel. In the second branch channel, a third on / off valve is provided upstream of the second heating mechanism. A fluid supply system according to any one of claims 1 to 3.

6. It has a control unit that controls each part of the fluid supply system, The control unit, A step of transporting the substrate into the processing container, After the above-mentioned transport step, the second and third on-off valves are opened and the processing fluid at the second temperature is supplied into the processing container. After the step of supplying the processing fluid at the second temperature, the second and third on-off valves are closed, and the first on-off valve is opened to supply the processing fluid at the first temperature into the processing container. The steps include opening the second discharge valve to reduce the pressure inside the second branch passage, Execute, The step of reducing the pressure in the second branch channel is performed in parallel with the step of supplying the processing fluid at the first temperature into the processing container. The fluid supply system according to claim 5.

7. It has a control unit that controls each part of the fluid supply system, The control unit controls the opening and closing of the first and second on-off valves according to the processing state of the substrate in the processing container, thereby changing the temperature of the processing fluid flowing through the processing container. A fluid supply system according to any one of claims 1 to 3.

8. It has a control unit that controls each part of the fluid supply system, The processing fluid supply unit has a first supply channel and a second supply channel provided in parallel, The flow rate adjustment mechanism includes a first supply valve provided in the first supply channel and a second supply valve provided in the second supply channel. The control unit changes the flow rate of the processing fluid flowing through the processing container by controlling the opening and closing of the first supply valve and the second supply valve according to the processing state of the substrate in the processing container. A fluid supply system according to any one of claims 1 to 3.

9. It has a control unit that controls each part of the fluid supply system, The control unit, A step of transporting the substrate into the processing container, The process of controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, opening the second on / off valve to supply the processing fluid at a second temperature and a first flow rate into the processing container, The process involves supplying the processing fluid at the first flow rate and second temperature into the processing container, then controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at the second flow rate, opening the first on / off valve to supply the processing fluid at the first temperature and second flow rate into the processing container, Execute A fluid supply system according to any one of claims 1 to 3.

10. The fluid supply system according to claim 7, A discharge section having a third discharge valve for discharging the processing fluid from the processing container, It has, The control unit, A step of transporting the substrate into the processing container, A step of controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, opening the second on / off valve and closing the third discharge valve to supply the processing fluid at the second temperature and first flow rate into the processing container, thereby increasing the pressure inside the processing container. After the step of increasing the pressure inside the processing container, the flow rate adjustment mechanism is controlled to supply the processing fluid to the fluid supply passage at a second flow rate, the second on-off valve is closed and the first on-off valve is opened to supply the processing fluid at a first temperature and a second flow rate into the processing container, thereby increasing the pressure inside the processing container. Execute Circuit board processing equipment.

11. A substrate processing method using a fluid supply system that supplies fluid into a processing container in which the substrate is processed, The aforementioned fluid supply system A processing fluid supply unit that supplies the processing fluid, A fluid supply passage is connected to the processing fluid supply unit and the processing container, and the temperature-adjusted processing fluid is passed through the processing container. A first heating mechanism is provided in the fluid supply passage for heating the processing fluid to a first temperature, A second heating mechanism is provided in the fluid supply passage and heats the processing fluid to a second temperature lower than the first temperature, It has, The processing fluid supply unit has a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid. The aforementioned fluid supply passage is A first branch channel that allows the processing fluid to flow into the processing container through the first heating mechanism, A second branch channel that allows the processing fluid to flow into the processing container through the second heating mechanism, It has, The first heating mechanism is provided in the first branch channel, and the second heating mechanism is provided in the second branch channel. A first on / off valve is provided downstream of the first heating mechanism in the first branch channel. A second on-off valve is provided downstream of the second heating mechanism in the second branch channel. The fluid supply passage has a bypass passage downstream of the first on-off valve and the second on-off valve that connects the first branch passage and the second branch passage. A fluid is supplied into a processing container in which the substrate is processed, thereby processing the substrate. Substrate processing method.

12. The bypass channel is provided with a first throttle, The substrate processing method according to claim 11.

13. The temperature of the processing fluid flowing through the processing container is changed by controlling the opening and closing of the first on-off valve and the second on-off valve. The substrate processing method according to claim 11.

14. The first heating mechanism is provided in series with the second heating mechanism, A first discharge channel is connected to the first branch channel for discharging the processed fluid within the first branch channel. A substrate processing method according to any one of claims 11 to 13.

15. The first heating mechanism is provided in parallel with the second heating mechanism, The first branch channel is connected to a first discharge channel which has a first discharge valve and discharges the processed fluid in the first branch channel. The second branch channel is connected to a second discharge channel which has a second discharge valve and discharges the processed fluid in the second branch channel. In the second branch channel, a third on / off valve is provided upstream of the second heating mechanism. A substrate processing method according to any one of claims 11 to 13.

16. A step of transporting the substrate into the processing container, After the above-mentioned transport step, the second and third on-off valves are opened and the processing fluid at the second temperature is supplied into the processing container. After the step of supplying the processing fluid at the second temperature, the second and third on-off valves are closed, and the first on-off valve is opened to supply the processing fluid at the first temperature into the processing container. The steps include opening the second discharge valve to reduce the pressure inside the second branch passage, It has, The step of reducing the pressure in the second branch channel is performed in parallel with the step of supplying the processing fluid at the first temperature into the processing container. The substrate processing method according to claim 15.

17. The process includes a step of changing the temperature of the processing fluid flowing through the processing container by controlling the opening and closing of the first and second on-off valves according to the processing state of the substrate in the processing container. A substrate processing method according to any one of claims 11 to 13.

18. The processing fluid supply unit has a first supply channel and a second supply channel provided in parallel, The flow rate adjustment mechanism includes a first supply valve provided in the first supply channel and a second supply valve provided in the second supply channel. The process includes a step of changing the flow rate of the processing fluid flowing through the processing container by controlling the opening and closing of the first supply valve and the second supply valve according to the processing state of the substrate in the processing container. A substrate processing method according to any one of claims 11 to 13.

19. A step of transporting the substrate into the processing container, The process of controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, opening the second on / off valve to supply the processing fluid at a second temperature and a first flow rate into the processing container, The process involves supplying the processing fluid at the first flow rate and second temperature into the processing container, then controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at the second flow rate, opening the first on / off valve to supply the processing fluid at the first temperature and second flow rate into the processing container, Having, A substrate processing method according to any one of claims 11 to 13.

20. It has a third discharge valve and a discharge section for discharging the processing fluid from the processing container, A step of transporting the substrate into the processing container, A step of controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, opening the second on / off valve and closing the third discharge valve to supply the processing fluid at the second temperature and first flow rate into the processing container, thereby increasing the pressure inside the processing container. After the step of increasing the pressure inside the processing container, the flow rate adjustment mechanism is controlled to supply the processing fluid to the fluid supply passage at a second flow rate, the second on-off valve is closed and the first on-off valve is opened to supply the processing fluid at a first temperature and a second flow rate into the processing container, thereby increasing the pressure inside the processing container. Having, The substrate processing method according to claim 17.

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