Air shroud with integrated heat exchanger

Abstract

A heating module for a substrate processing chamber includes heat lamps coupled to a reflector plate and a heat exchanger. The heat exchanger cools gas within the heating module. A fan within the heating module circulates gas through openings in the reflector plate to cool the heating lamps. The gas is cooled and recirculated by the heat exchanger. One or more shrouds direct the gas as it is circulated.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to heat exchangers for use with substrate processing chambers such as epitaxial deposition chambers.

Background Art

[0002] Semiconductor substrates are processed for a wide variety of applications, including the manufacture of integrated devices and microdevices. During processing, the substrate is placed on a support within a processing chamber. The interior of the processing chamber is placed under vacuum while the substrate is being processed by exposure to heat and process gases. Some processing chambers, such as some epitaxial deposition chambers, use lamps to heat the substrate. Temperature control can be facilitated by cooling the lamps and portions of the processing chamber. In some examples, the lamps and portions of the processing chamber are cooled by a flow of air provided by piping. The piping takes up space, and the resulting air flow can create a non-uniform temperature distribution across the processing chamber, which can negatively affect the quality of the process being performed on the substrate.

[0003] There is a need for improved systems and processes that facilitate cooling the heating lamps and portions of the processing chamber.

Summary of the Invention

[0004] The present disclosure generally relates to heat exchangers for use with substrate processing chambers such as epitaxial deposition chambers.

[0005] In one embodiment, a heating module for a process chamber suitable for use in semiconductor manufacturing includes an outer housing, a lid on the outer housing, a reflector plate disposed within the outer housing, and a plurality of heating lamps associated with the reflector plate. A first heat exchange module is disposed between the reflector plate and the lid, and the first heat exchange module includes a plurality of first heat exchange tubes disposed between a first inner shroud and a first outer shroud.

[0006] In another embodiment, a processing chamber suitable for use in semiconductor manufacturing includes a chamber body including an upper window disposed above a lower window, the upper and lower windows forming a boundary of the processing volume. The processing chamber further includes an upper heating module coupled to the chamber body above the upper window. The upper heating module includes a first outer housing, a first lid on the first outer housing, a first reflector plate disposed within the first outer housing, and a plurality of first heating lamps associated with the first reflector plate. The upper heating module further includes a first heat exchange module disposed between the first reflector plate and the first lid, the first heat exchange module including a plurality of first heat exchange tubes disposed between a first inner shroud and a first outer shroud.

[0007] In another embodiment, a heat exchange module suitable for use in semiconductor manufacturing includes an enclosure. The enclosure includes an inner shroud extending between a first end plate and a second end plate, and an outer shroud extending between the first end plate and the second end plate. The heat exchange module further includes a plurality of heat exchange tubes disposed within the enclosure, and a plurality of inner plates disposed within the enclosure and coupled to each heat exchange tube. The inner shroud, the outer shroud, and each heat exchange tube are curved in the horizontal plane.

[0008] To allow the above-described features of this disclosure to be understood in detail, a more detailed description of this disclosure, which has been briefly summarized above, may be made by reference to embodiments some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings are merely illustrative embodiments and should not be considered limiting in scope, as this disclosure may allow for other equally valid embodiments. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram of the processing chamber. [Figure 2A] Figure 1 is a schematic partial cross-sectional side view of the upper heating module of the processing chamber. [Figure 2B] This is a detailed view of a portion of Figure 2A. [Figure 2C] This is a schematic partial cross-sectional plan view of the upper heating module of Figure 2A. [Figure 2D] This is a schematic isometric view of the heat exchange module. [Figure 2E] Figure 2A is a schematic diagram of the cooling gas flow within the upper heating module. [Figure 3A] Figure 1 is a schematic partial cross-sectional side view of the lower heating module of the processing chamber. [Figure 3B] This is a detailed view of a portion of Figure 3A. [Figure 3C] This is a side view of the lower heating module in Figure 3A. [Figure 3D] Figure 3A is a schematic diagram of the cooling gas flow within the lower heating module. [Modes for carrying out the invention]

[0010] For ease of understanding, the same reference numerals are used to designate identical elements common to the figures where possible. It is intended that elements and features of one embodiment may be usefully incorporated into other embodiments without further description.

[0011] This disclosure relates to a heat exchanger for use with a substrate processing chamber, such as an epitaxial deposition chamber. The heat exchanger is contained within one or more heating modules configured to heat a processing volume together with the processing chamber. The heat exchanger cools a cooling gas, such as air, within one or more heating modules. One or more fans are operated to direct the cooling gas toward heating lamps within one or more heating modules, and toward upper and / or lower windows defining the processing volume. The cooling gas cools the heating lamps, upper and / or lower windows.

[0012] Figure 1 schematically shows the processing chamber 100. The processing chamber 100 includes an upper heating module 200 above the chamber body 170 and a lower heating module 300 below the chamber body 170. The upper heating module 200 is shown in more detail in Figures 2A to 2C. The lower heating module 300 is shown in more detail in Figures 3A to 3C.

[0013] The processing chamber 100 may be a processing chamber for carrying out any thermal process, such as an epitaxial process. While a processing chamber for an epitaxial process is shown and described, the concepts of the present disclosure are intended to be applicable to other processing chambers capable of providing a controlled thermal cycle for heating a substrate for processes such as thermal annealing, thermal cleaning, thermochemical vapor deposition, thermal oxidation, and thermal nitriding. The processing chamber 100 is intended to be used for processing a substrate, which includes depositing material on the surface of the substrate.

[0014] Referring to Figure 1, the chamber body 170 includes an upper window 120 and a lower window 130, along with a processing volume 140 between them. The processing volume 140 is substantially cylindrical. The upper window 120 includes a base 125 fixed in the chamber body 300, and the lower window 130 includes a base 135 fixed in the chamber body 300. A neck 132 coupled to the lower window 130 is arranged around the shaft 154 of the susceptor support 152. The susceptor support 152 carries a susceptor 150, on which a substrate 110 may be placed within the processing volume 140.

[0015] The susceptor 150 is intended to be made from SiC-coated graphite. A motor (not shown) rotates the shaft 154 of the susceptor support 152 about the longitudinal axis of the shaft 154, and thus rotates the susceptor 150 and the substrate 110. The substrate 110 is brought into the chamber body 300 through the loading port 160 and placed on the susceptor 150.

[0016] One or more coolant inlets 182 and coolant outlets 184 are associated with an upper heating module 200 and a lower heating module 300. The upper heating module 200 and the lower heating module 300 heat the processing volume 140, for example, by providing infrared radiant heat through an upper window 120 and a lower window 130, respectively. The upper window 120 and the lower window 130 are intended to be constructed from a material such as quartz that is substantially optically transparent. The material of the upper window 120 and the lower window 130 is further intended to be substantially transparent to infrared radiation so that at least 95% of the incident infrared radiation can be transmitted through them.

[0017] Figures 2A to 2C show schematic views of the upper heating module 200. Figure 2A is a schematic partial cross-sectional side view of the upper heating module 200, Figure 2B is a detailed view of a part of Figure 2A, and Figure 2C is a schematic partial cross-sectional plan view of the upper heating module 200. The upper heating module 200 includes an outer housing 202. The outer housing 202 is generally an annular body having a lower flange 204, and one or more fasteners 206 extend through the lower flange 204 for connection to the chamber body 300.

[0018] The outer housing 202 is coupled to a lamp mounting ring 210 disposed therein. The lamp mounting ring 210 is coupled to a reflector mounting ring 230 of the heating lamp assembly 220 by a plurality of fasteners 216 such as screws, bolts, rods, etc.

[0019] The heating lamp assembly 220 includes a plurality of linear heating lamps 222 extending across the central opening of the lamp mounting ring 210. An annular heat shield 280 is coupled to the reflector mounting ring 230 and extends below the reflector mounting ring 230. The annular heat shield 280 reflects heat from the linear heating lamps 222 towards the upper window 120. In some embodiments, it is contemplated that the annular heat shield 280 can be made of a reflective material and / or coated with a reflective material. For example, the annular heat shield 280 can be gold-plated.

[0020] The central opening of the lamp mounting ring 210 is substantially circular, and the annular heat shield 280 is substantially cylindrical. When the upper heating module 200 is assembled to the processing chamber 100, each linear heating lamp 222 extends substantially horizontally above the upper window 120. The linear heating lamps 222 are oriented substantially parallel to each other, such as within 5 degrees.

[0021] The reflector mounting ring 230 is disposed around the upper surface 226 of the upper reflector plate 224 and is coupled to the upper surface 226. When the processing chamber 100 is assembled, the upper reflector plate 224 is disposed above the upper window 120. The upper reflector plate 224 is associated with the linear heating lamp 222. The lower surface 248 of the upper reflector plate 224 includes a plurality of linear channels 246 that extend substantially parallel to each other across the lower surface 248. In some embodiments, it is contemplated that the lower surface 248 of the upper reflector plate 224 includes two or more linear channels 246. For example, the lower surface 248 of the upper reflector plate 224 may include three, four, five, six, seven, eight, nine, ten, or more linear channels 246. The plurality of linear heating lamps 222 extend into the plurality of linear channels 246, and in addition to the heat from the linear heating lamps 222 being radiated directly toward the upper window 120, it is reflected from the sidewalls of the linear channels 246 toward the upper window 120. As shown in FIGS. 2A and 2B, each linear heating lamp 222 is positioned within a corresponding one of the plurality of linear channels 246. In some embodiments, it is contemplated that two or more linear heating lamps 222 may be positioned within a corresponding one of the plurality of linear channels 246.

[0022] Each linear channel 246 has a cross-sectional profile configured to reflect heat in a predetermined distribution pattern. For example, the predetermined distribution pattern may create a substantially uniform distribution of heat. Alternatively, the predetermined distribution pattern may concentrate peak irradiation in one or more specific regions on the substrate 110 being processed to enable control of the temperature in those regions. Each linear channel 246 is contemplated to have at least one of a cross-section having geometrically straight sides, such as a U-shaped cross-section, a V-shaped cross-section, a rectangular cross-section, a pentagonal cross-section, a hexagonal cross-section, or a cross-section having more than six sides, or a curved cross-section, such as a portion of a circle, an ellipse, or a parabola, or a combination thereof.

[0023] As an example, an elliptical cross-sectional shape may facilitate the concentration of infrared radiation from the linear heating lamp 222. As another example, a parabolic cross-sectional shape may facilitate the collimation of infrared radiation from the linear heating lamp 222. As yet another example, an angular cross-sectional shape may facilitate the diffusion of infrared radiation from the linear heating lamp 222. In some embodiments, it is intended that one or more linear channels 246 may have the same cross-section as another or more linear channels 246. In some embodiments, it is intended that one or more linear channels 246 may have a cross-section different from another or more linear channels 246. In some embodiments, it is intended that one or more linear channels 246 may have a cross-section that changes from a first shape to a second shape along the length of the linear channel 246.

[0024] The lower surface 248 of the upper reflector plate 224 may be designed to provide irradiance peaks at many locations across the substrate 110 being processed in order to facilitate the desired thermal profile. In some embodiments, the upper reflector plate 224 is configured to produce up to the same number of irradiance peaks as the number of lamps in the plurality of linear heating lamps 222. In some embodiments, the upper reflector plate 224 is configured to produce more irradiance peaks than the number of lamps in the plurality of linear heating lamps 222. In some embodiments, the upper reflector plate 224 is intended to be made from and / or coated with a reflective material. For example, the upper reflector plate 224 may be gold-plated. In some embodiments, the upper reflector plate 224 includes a plurality of parts joined together to form a disc-shaped plate.

[0025] As shown in Figures 2A and 2B, the upper surface 226 of the upper reflector plate 224 includes a plurality of coolant channels 234. In some embodiments, the plurality of coolant channels 234 extend parallel to a plurality of linear heating lamps 222. Cooling tubes 236 are provided in each coolant channel 234 to transport a coolant, such as water or a refrigerant such as R-22, R-32, or R-410A. In some embodiments, a single cooling tube 236 may be routed through one coolant channel 234, then exit the coolant channel 234, and routed across to another coolant channel 234. In some embodiments, the number of coolant channels 234 corresponds to the number of a plurality of linear channels 246. In some embodiments, the coolant channels 234 and cooling tubes 236 are intended to be omitted.

[0026] The upper reflector plate 224 includes openings, such as cooling slots 240 extending from the upper surface 226 to the lower surface 248. The cooling slots 240 are configured to route a cooling gas, such as air, through the upper reflector plate 224. In some embodiments, the cooling slots 240 may include a plurality of first slots 242 configured to cool a plurality of linear heating lamps 222 to maintain a target lamp temperature. An exemplary target lamp temperature is less than 800 degrees Celsius. As shown in Figure 2A, the first slots 242 are configured to direct the cooling gas generally toward each linear heating lamp 222. In some embodiments, the cooling slots 240 may include a plurality of second slots 244 for directing the cooling gas toward the upper window 120. An exemplary target temperature of the upper window 120 is approximately 200 degrees Celsius to approximately 600 degrees Celsius.

[0027] The number, size, and / or flow area of ​​the first slots 242 relative to the second slots 244 are intended to be configured according to a desired ratio of the cooling gas to flow through each of the first and second slots 244. For example, the desired total flow rate of the cooling gas through the first slots 242 is intended to be greater than, equal to, or less than, the desired total flow rate of the cooling gas through the second slots 244. Similarly, the actual total flow rate of the cooling gas through the first slots 242 is intended to be greater than, equal to, or less than, the actual total flow rate of the cooling gas through the second slots 244. Thus, the number of first slots 242 is intended to be greater than, equal to, or less than, the number of second slots 244. In addition, the size of the first slots 242 is intended to be greater than, equal to, or less than, the size of the second slots 244. Furthermore, it is intended that the circulation area of ​​the first slot 242 may be larger than, equal to, or smaller than the circulation area of ​​the second slot 244.

[0028] In some embodiments, the cooling slots 240 are intended to be configured to provide sufficient back pressure to offer a desired flow pattern through the cooling slots 240. For example, the number, size, and / or flow area of ​​the cooling slots 240 may be configured such that the flow rate of cooling gas through one first slot 242 is greater than, equal to, or less than, the flow rate of cooling gas through another first slot 242. Similarly, the number, size, and / or flow area of ​​the cooling slots 240 may be configured such that the flow rate of cooling gas through one second slot 244 is greater than, equal to, or less than, the flow rate of cooling gas through another second slot 244.

[0029] The upper plate 250 is coupled to the outer housing 202 and acts as a lid for the upper heating module 200. One or more temperature sensors, such as one or more pyrometers 254, are mounted on a base 256 on the upper plate 250. In some embodiments, the base 256 is intended to include a heat exchanger for providing cooling by a suitable fluid, such as water, supplied via a connecting hose (not shown). Each pyrometer 254 may be mounted to measure the surface temperature of an individual portion of the substrate 110 being processed. In some embodiments, each pyrometer 254 may measure the surface temperature of an individual portion of the upper window 120. Such measurements are facilitated via a corresponding pyrometer tube 258.

[0030] The upper heating module 200 includes one or more heat exchange modules 400 mounted above the heating lamp assembly 220. Figure 2D is a schematic isometric view of the heat exchange module 400. Although the upper heating module 200 is shown as including two heat exchange modules 400, in some embodiments the upper heating module 200 may include fewer or more heat exchange modules 400, such as one, three, four, five, or more.

[0031] Referring to Figures 2A to 2D, each heat exchange module 400 includes one or more heat exchange tubes 404 mounted in an enclosure 410. Each enclosure 410 includes an inner shroud 412 and an outer shroud 414 extending between end plates 416. As shown in the figures, the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 are curved in the horizontal plane. However, in some embodiments, the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 are not curved in the horizontal plane. In one example, each of the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 may be aligned in a straight line in the horizontal plane. In a further example, each of the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 may be aligned on a line in the horizontal plane that includes one or more obtuse angles. In such an example, the inner shroud 412, the outer shroud 414, and the heat exchange tube 404 may each be arranged on lines similar to two or more sides of a polygon.

[0032] As shown in Figures 2B and 2C, each heat exchange tube 404 is connected to a coolant inlet 182 and a coolant outlet 184. Each heat exchange tube 404 is configured to transport coolant from the coolant inlet 182 to the coolant outlet 184. As shown, each heat exchange tube 404 is connected in parallel to the coolant inlet 182 and the coolant outlet 184. Each heat exchange tube 404 is arranged in multiple paths along the enclosure 410 between end plates 416. The multiple paths are facilitated by one or more U-bends 406 in each heat exchange tube 404. As shown, each heat exchange tube 404 is arranged in four paths. However, in some embodiments, each heat exchange tube 404 may be arranged in any preferred number of paths, such as one, two, three, four, five, six, or more. Each end plate 416 of the enclosure 410 provides support for each heat exchange tube 404. As shown in the figures, in some embodiments, each heat exchange tube 404 passes through each end plate 416, and at least a portion of each U-shaped bend 406 is outside the enclosure 410.

[0033] The heat exchange module 400 includes one or more inner plates 418 within the enclosure 410. Each inner plate 418 is coupled to each heat exchange tube 404. In some embodiments, each inner plate 418 is coupled to at least one of an inner shroud 412 or an outer shroud 414. In some embodiments, each inner plate 418 provides support for each heat exchange tube 404. Each inner plate 418 provides thermal connection to each heat exchange tube 404 and includes a surface that is in contact with the cooling gas in the upper heating module 200, which facilitates heat transfer between the cooling gas and the coolant in the heat exchange tube 404.

[0034] In some embodiments, the heat exchange module 400 includes a baffle 422 extending upward from the enclosure 410. As shown, the baffle 422 is an extension of the outer shroud 414 and is configured to contact the upper plate 250 of the upper heating module 200. In some embodiments, the baffle 422 is configured to extend to a location close to the upper plate 250 of the upper heating module 200. In embodiments where the baffle 422 contacts or is close to the upper plate 250, the baffle 422's proximity to the upper plate 250 helps to prevent the cooling gas from bypassing the enclosure 410 and directs the cooling gas into the enclosure 410. In some embodiments, the baffle 422 is not configured to terminate in contact with or close to the upper plate 250. In some embodiments, the baffle 422 may be omitted.

[0035] In some embodiments, the heat exchange module 400 includes a skirt 424 extending downward from the enclosure 410. As shown, the skirt 424 is an extension of the inner shroud 412 and is configured to contact the reflector mounting ring 230 of the upper heating module 200. In some embodiments, the skirt 424 is configured to extend to a location close to the reflector mounting ring 230 of the upper heating module 200. In embodiments where the skirt 424 contacts or is close to the reflector mounting ring 230, the skirt 424's proximity to the reflector mounting ring 230 helps to prevent the cooling gas from bypassing the enclosure 410 and directs the cooling gas into the enclosure 410. In some embodiments, the skirt 424 is not configured to terminate in contact with or close to the reflector mounting ring 230. In some embodiments, the skirt 424 may be omitted.

[0036] As shown in Figures 2B and 2C, the cover 432 extends from the inner shroud 412 of the enclosure 410 to the inner wall 204 of the upper heating module 200. One or more fans 436, each including a motor 438, are coupled to the cover 432 and configured in the cover 432 to induce a flow of cooling gas through the openings 434. In some embodiments, one or more additional shrouds 428 are positioned within the upper heating module 200 to direct the flow of cooling gas.

[0037] The enclosure 410, cover 432, fan 436, and annular heat shield 280 (and baffles 422, skirt 424, and optional additional shrouds 428, if present) divide the space within the upper heating module 200 into a lower region 262 below the cover 432 and fan 436, and above the upper reflector plate 224, an annular region 264 between the outer housing 202 and the annular heat shield 280, and an upper region 266 between the upper plate 250, cover 432, fan 436, and enclosure 410.

[0038] In some embodiments, the valve 188 selectively prevents or allows the coolant to flow from an external source to the coolant inlet 182 and to flow out and back out of the coolant outlet 184. As shown, in some embodiments, the valve 188 may be operated by a controller 440 configured to control the operation of the fan 436 and / or the flow of the coolant. In some embodiments, the coolant is water. In some embodiments, the coolant is a refrigerant such as R-22, R-32, or R-410A. In some embodiments, the coolant supplied to the heat exchange tube 404 is the same coolant supplied to the (one or more) cooling tubes 236. In some embodiments, the coolant supplied to the heat exchange tube 404 is different from the coolant supplied to the (one or more) cooling tubes 236.

[0039] As shown in Figure 2B, in some embodiments, one or more first sensors 186 and / or one or more second sensors 292 may be located in one or more preferred locations within the upper heating module 200. One or more first sensors 186 may measure one or more parameters related to the coolant, such as pressure, temperature, or flow rate. One or more second sensors 292 may measure one or more parameters related to the cooling gas, such as pressure, temperature, or flow rate. One or more first sensors 186 and / or one or more second sensors 292 and / or each fan motor 438 and / or each pyrometer 254 are intended to be connected to a controller 440.

[0040] In some embodiments, when the upper heating module 200 is connected to the chamber body 170, the upper heating module 200 functions as a sealed container through which a cooling gas can circulate. In some embodiments, the upper heating module 200 includes vents through which at least a portion of the cooling gas can move between the inside and outside of the upper heating module 200.

[0041] Figure 2E is a schematic diagram of the cooling gas flow within the upper heating module 200. The flow is indicated by arrows. During operation of the upper heating module 200, the controller 440 opens valve 188 to allow the coolant to flow from the coolant inlet 182, through the heat exchange tube 404, and out through the coolant outlet 184. The controller 440 operates a fan 436 via motor 438. The fan 436 moves the cooling gas into the lower region 262 through cooling slots 240 in the upper reflector plate 224. The cooling gas cools the upper reflector plate 224, the heating lamp 222, and associated components attached to the upper reflector plate 224 or the heating lamp 222.

[0042] The cooling gas flows through the interior of the annular heat shield 280 and strikes the upper window 120. The cooling gas cools the upper window 120, moves around the bottom of the annular heat shield 280, and flows upward out of the annular heat shield 280. The temperature of the cooling gas increases due to heat transfer from the upper reflector plate 224, heating lamp 222, associated components, annular heat shield 280, and upper window 120 to the cooling gas.

[0043] The cooling gas flows through the annular region 264 and then through the enclosure 410 of the heat exchange module 400. The cooling gas comes into contact with the inner plate 418 and the heat exchange tube 404, and heat from the cooling gas is transferred to the coolant in the heat exchange tube 404. The temperature of the cooling gas is reduced by the heat transfer from the cooling gas to the coolant. The cooling gas exits the enclosure 410 of the heat exchange module 400 and flows into the upper region 266, and the operation of the fan 436 draws the cooling gas back into the lower region 262.

[0044] During operation, the controller 440 monitors operating parameters and adjusts the flow of cooling gas and / or coolant to affect the temperature of the heating lamp 222, the components on the upper reflector plate 224 associated with the heating lamp 222, and / or the upper window 120. The controller monitors the temperature and / or pressure of the cooling gas at various locations in the upper heating module 200 via sensor 292. In some embodiments, the controller may monitor the flow rate of the cooling gas via the current draw of the motor 438 of the fan 436. The controller monitors the temperature and / or pressure and / or flow rate of the coolant via sensor 186. By monitoring the pressure and / or flow rate of the coolant, the controller can determine whether a coolant leak is occurring within each heat exchange module 400.

[0045] Figure 3A is a schematic partial cross-sectional side view of the lower heating module 300, Figure 3B is a detailed view of a portion of Figure 3A, and Figure 3C is a side view of the lower heating module 300 taken perpendicular to the view in Figure 3A. The lower heating module 300 includes an outer housing 302. The outer housing 302 is generally an annular body coupled to or integrated with the adapter plate 306. When the processing chamber 100 is assembled, a fastener 308 connects the adapter plate 306 to the chamber body 170.

[0046] The outer housing 302 is coupled to a separation plate 310 disposed therein. The separation plate 310 is coupled to a heating lamp assembly 320. The heating lamp assembly 320 includes a plurality of linear heating lamps 322 extending across the central opening of the separation plate 310. An annular heat shield 380 is coupled to the separation plate 310. The annular heat shield 380 reflects heat from the linear heating lamps 322 toward the lower window 130. In some embodiments, the annular heat shield 380 is intended to be made of and / or coated with a reflective material. For example, the annular heat shield 380 may be gold-plated.

[0047] The central opening of the separation plate 310 is substantially circular, and the annular heat shield 380 is substantially cylindrical. When the lower heating module 300 is assembled into the process chamber 100, each linear heating lamp 322 extends substantially horizontally below the lower window 130. The linear heating lamps 322 are oriented substantially parallel to each other, such as within 5 degrees.

[0048] The lower reflector plate 324 is coupled to and disposed within the annular heat shield 380. When the process chamber 100 is assembled, the lower reflector plate 324 is positioned below the lower window 130. The lower reflector plate 324 is associated with the linear heating lamp 322. The upper surface 348 of the lower reflector plate 324 includes a plurality of linear channels 346 that extend substantially parallel to each other across the upper surface 348. In some embodiments, the upper surface 348 of the lower reflector plate 324 is intended to include two or more linear channels 346. For example, the upper surface 348 of the lower reflector plate 324 may include three, four, five, six, seven, eight, nine, ten, or more linear channels 346. Multiple linear heating lamps 322 extend into multiple linear channels 346, and therefore, in addition to being directly radiated toward the lower window 130, heat from the linear heating lamps 322 is reflected toward the lower window 130 from the side walls of the linear channels 346. As shown in Figures 3A and 3B, each linear heating lamp 322 is located in a corresponding one of the multiple linear channels 346. In some embodiments, it is intended that two or more linear heating lamps 322 may be located in a corresponding one of the multiple linear channels 346.

[0049] Each linear channel 346 has a cross-sectional profile configured to reflect heat in a predetermined distribution pattern. For example, the predetermined distribution pattern may create a substantially uniform distribution of heat. Alternatively, the predetermined distribution pattern may concentrate peak irradiation on one or more specific regions on the underside of the susceptor 150 to enable temperature control in those regions. Each linear channel 346 is intended to have at least one of the following cross-sections: a cross-section with geometric straight sides, such as a U-shaped cross-section, or a V-shaped cross-section, a rectangular cross-section, a pentagonal cross-section, a hexagonal cross-section, or a cross-section with more than six sides; or a curved cross-section, such as a part of a circle, a part of an ellipse, or a part of a parabola; or a combination thereof.

[0050] As an example, an elliptical cross-sectional shape may facilitate the concentration of infrared radiation from the linear heating lamp 322. As another example, a parabolic cross-sectional shape may facilitate the collimation of infrared radiation from the linear heating lamp 322. As yet another example, an angular cross-sectional shape may facilitate the diffusion of infrared radiation from the linear heating lamp 322. In some embodiments, it is intended that one or more linear channels 346 may have the same cross-section as another or more linear channels 346. In some embodiments, it is intended that one or more linear channels 346 may have a cross-section different from another or more linear channels 346. In some embodiments, it is intended that one or more linear channels 346 may have a cross-section that changes from a first shape to a second shape along the length of the linear channel 346.

[0051] The upper surface 348 of the lower reflector plate 324 may be designed to provide irradiance peaks at many locations across the underside of the susceptor 150 in order to facilitate the desired thermal profile. In some embodiments, the lower reflector plate 324 is configured to produce up to the same number of irradiance peaks as the number of lamps in the plurality of linear heating lamps 322. In some embodiments, the lower reflector plate 324 is configured to produce more irradiance peaks than the number of lamps in the plurality of linear heating lamps 322. In some embodiments, the lower reflector plate 324 is intended to be made from and / or coated with a reflective material. For example, the lower reflector plate 324 may be gold-plated.

[0052] The neck shield 382 extends through the lower reflector plate 324. The neck shield 382 is configured to be positioned around the neck 132 of the lower window 130. The neck shield 382 reflects heat away from the neck 132 of the lower window 130. In some embodiments, the neck shield 382 is intended to be made from and / or coated with a reflective material. For example, the neck shield 382 may be gold-plated.

[0053] As shown in the figure, the lower surface 326 of the lower reflector plate 324 includes a plurality of coolant channels 334. In some embodiments, the plurality of coolant channels 334 extend parallel to a plurality of linear heating lamps 322. Cooling tubes 336 are provided in each coolant channel 334 to transport a coolant, such as water or a refrigerant such as R-22, R-32, or R-410A. In some embodiments, a single cooling tube 336 may be routed through one coolant channel 334, then exit the coolant channel 334, and routed through another coolant channel 334. In some embodiments, the number of coolant channels 334 corresponds to the number of plurality of linear channels 346. In some embodiments, the coolant channels 334 and cooling tubes 336 are intended to be omitted.

[0054] The lower reflector plate 324 includes openings, such as cooling slots 340, which extend from the lower surface 326 to the upper surface 348. The cooling slots 340 are configured to route a cooling fluid, such as a gas like air, through the lower reflector plate 324. In some embodiments, the cooling slots 340 may include a plurality of first slots 342 configured to cool a plurality of linear heating lamps 322 to maintain a target lamp temperature. An exemplary target lamp temperature is less than 800 degrees Celsius. As shown in Figure 2, the first slots 342 are configured to direct the cooling fluid generally toward each linear heating lamp 322. In some embodiments, the cooling slots 340 may include a plurality of second slots 344 for directing the cooling fluid toward the lower window 130. An exemplary target temperature of the lower window 130 is approximately 400 degrees Celsius to approximately 600 degrees Celsius.

[0055] The number, size, and / or flow area of ​​the first slots 342 relative to the second slots 344 are intended to be configured according to a desired ratio of the cooling fluid to flow through each of the first and second slots 344. For example, the desired total flow rate of the cooling fluid through the first slots 342 is intended to be greater than, equal to, or less than, the desired total flow rate of the cooling fluid through the second slots 344. Similarly, the actual total flow rate of the cooling fluid through the first slots 342 is intended to be greater than, equal to, or less than, the actual total flow rate of the cooling fluid through the second slots 344. Thus, the number of first slots 342 is intended to be greater than, equal to, or less than, the number of second slots 344. In addition, the size of the first slots 342 is intended to be greater than, equal to, or less than, the size of the second slots 344. Furthermore, it is intended that the circulation area of ​​the first slot 342 may be larger than, equal to, or smaller than the circulation area of ​​the second slot 344.

[0056] In some embodiments, the cooling slots 340 are intended to be configured to provide sufficient back pressure to deliver a desired flow pattern through the cooling slots 340. For example, the number, size, and / or flow area of ​​the cooling slots 340 may be configured such that the flow rate of the cooling fluid through one first slot 342 is greater than, equal to, or less than, the flow rate of the cooling fluid through another first slot 342. Similarly, the number, size, and / or flow area of ​​the cooling slots 340 may be configured such that the flow rate of the cooling fluid through one second slot 344 is greater than, equal to, or less than, the flow rate of the cooling fluid through another second slot 344.

[0057] The bottom cover 350 is coupled to the outer housing 302 and acts as a lid for the lower heating module 300. One or more temperature sensors, such as one or more pyrometers 354, are mounted on a base 356 on the bottom cover 350, as shown in Figure 3C. In some embodiments, the base 356 is intended to include a heat exchanger for providing cooling by a preferred fluid, such as water, supplied via a connecting hose (not shown). Each pyrometer 354 is intended to be mounted to measure the surface temperature of an individual portion of the lower surface of the susceptor 150. In some embodiments, each pyrometer 354 may measure the surface temperature of an individual portion of the lower window 130. Such measurements are further intended to be facilitated via a corresponding pyrometer tube (not shown) protruding through a hole in the lower reflector plate 324, although in some embodiments, the corresponding pyrometer tube may be omitted.

[0058] Returning to Figures 3A and 3B, the lower heating module 300 includes one or more heat exchange modules 400 mounted below the heating lamp assembly 320. Although the lower heating module 300 is shown as including two heat exchange modules 400, in some embodiments the lower heating module 300 may include fewer or more heat exchange modules 400, such as one, three, four, five, or more. Each heat exchange module 400 is configured as described above.

[0059] As shown in the illustration, in some embodiments, the heat exchange module 400 includes an outer baffle 452 extending downward from the enclosure 410. As shown in the illustration, the outer baffle 452 is an extension of the outer shroud 414 and is configured to contact the bottom cover 350 of the lower heating module 300. In some embodiments, the outer baffle 452 is configured to extend to a location close to the bottom cover 350 of the lower heating module 300. In embodiments where the outer baffle 452 contacts or is close to the bottom cover 350, the proximity of the outer baffle 452 to the bottom cover 350 works to prevent the cooling gas from bypassing the enclosure 410 and direct the cooling gas into the enclosure 410. In some embodiments, the outer baffle 452 is not configured to terminate in contact with or close to the bottom cover 350. In some embodiments, the outer baffle 452 may be omitted.

[0060] In some embodiments, the heat exchange module 400 includes an inner baffle 454 extending downward from the enclosure 410. As shown, the inner baffle 454 is an extension of the inner shroud 412 and is configured to contact the isolation plate 310 of the lower heating module 300. In some embodiments, the inner baffle 454 is configured to extend to a location close to the isolation plate 310 of the lower heating module 200. In embodiments where the inner baffle 454 contacts or is close to the isolation plate 310, the proximity of the inner baffle 454 to the isolation plate 310 helps to prevent the cooling gas from bypassing the circulation route described below. In some embodiments, the inner baffle 454 is not configured to terminate in contact with or close to the isolation plate 310. In some embodiments, the inner baffle 454 may be omitted.

[0061] As shown in the figure, one or more openings 330 in the separation plate 310 provide a flow path for cooling gas to the enclosure 410 of the heat exchange module 400.

[0062] The cover 462 extends from the inner shroud 412 of the enclosure 410 to the inner wall 304 of the lower heating module 300. One or more fans 466, each including a motor 468, are coupled to the cover 462 and configured in the cover 462 to induce a flow of cooling gas through the opening 464. In some embodiments, one or more additional shrouds 458 are positioned within the lower heating module 300 to direct the flow of cooling gas.

[0063] The enclosure 410, cover 462, and fan 466 (and, if present, the outer baffle 452, inner baffle 454, and any additional shroud 458) divide the space within the lower heating module 300 into a lower region 362 between the bottom cover 350 and cover 462, fan 466, and enclosure 410, and an upper region 366 above the cover 462 and fan 466, and below the lower reflector plate 324. An annular region 364 exists between the outer housing 302 and the annular heat shield 380.

[0064] Referring to Figure 3A, in some embodiments, the valve 188 selectively prevents or allows the coolant to flow from an external source to the coolant inlet 182 and to flow out and back out of the coolant outlet 184. As shown, in some embodiments, the valve 188 may be operated by the controller 440. In some embodiments, the coolant is water. In some embodiments, the coolant is a refrigerant such as R-22, R-32, or R-410A. In some embodiments, the coolant supplied to the heat exchange tube 404 is the same coolant supplied to the (one or more) cooling tubes 336. In some embodiments, the coolant supplied to the heat exchange tube 404 is different from the coolant supplied to the (one or more) cooling tubes 336.

[0065] In some embodiments, one or more first sensors 186 and / or one or more second sensors 292 may be located in one or more preferred locations within the lower heating module 300. One or more first sensors 186 may measure one or more parameters related to the coolant, such as pressure, temperature, or flow rate. One or more second sensors 292 may measure one or more parameters related to the cooling gas, such as pressure, temperature, or flow rate. One or more first sensors 186 and / or one or more second sensors 292 and / or each fan motor 468 and / or each pyrometer 354 are intended to be connected to a controller 440.

[0066] In some embodiments, when the lower heating module 300 is connected to the chamber body 170, the lower heating module 300 functions as a sealed container through which a cooling gas can circulate. In some embodiments, the lower heating module 300 includes vents through which at least a portion of the cooling gas can move between the inside and outside of the lower heating module 300.

[0067] Figure 3D is a schematic diagram of the cooling gas flow within the lower heating module 300. The flow is indicated by arrows. During operation of the lower heating module 300, the controller 440 opens valve 188 to allow the coolant to flow from the coolant inlet 182, through the heat exchange tube 404, and out through the coolant outlet 184. The controller 440 operates a fan 466 via motor 468. The fan 466 moves the cooling gas into the upper region 366 through the cooling slots 340 in the lower reflector plate 324. The cooling gas cools the lower reflector plate 324, the heating lamp 322, and associated components attached to the lower reflector plate 324 or the heating lamp 322.

[0068] The cooling gas flows through the interior of the annular heat shield 380 and strikes the lower window 130. The cooling gas cools the lower window 130, moves around the upper periphery of the annular heat shield 380, and flows downward into the annular region 364. The temperature of the cooling gas increases due to heat transfer from the lower reflector plate 324, heating lamp 322, associated components, annular heat shield 380, and lower window 130 to the cooling gas.

[0069] The cooling gas flows into the enclosure 410 of the heat exchange module 400 through one or more openings 330 in the separation plate 310. The cooling gas comes into contact with the inner plate 418 and the heat exchange tube 404, and heat from the cooling gas is transferred to the coolant in the heat exchange tube 404. The temperature of the cooling gas is reduced by the heat transfer from the cooling gas to the coolant. The cooling gas exits the enclosure 410 of the heat exchange module 400 and flows into the lower region 362, where the operation of the fan 466 draws the cooling gas back into the upper region 366.

[0070] During operation, the controller 440 monitors operating parameters and adjusts the flow of cooling gas and / or coolant to affect the temperature of the heating lamp 322, the components on the lower reflector plate 324 associated with the heating lamp 322, and / or the lower window 130. The controller 440 monitors the temperature and / or pressure of the cooling gas at various locations in the lower heating module 300 via sensor 292. In some embodiments, the controller 440 may monitor the flow rate of the cooling gas via the current draw of the motor 468 of the fan 466. The controller 440 monitors the temperature and / or pressure and / or flow rate of the coolant via sensor 186. By monitoring the pressure and / or flow rate of the coolant, the controller 440 can determine whether a coolant leak is occurring within each heat exchange module 400.

[0071] The controller 440 is intended to include a central processing unit (CPU), memory containing instructions, and support circuitry for the CPU. The controller 440 is any form of general-purpose computer processor used in industrial settings for controlling various chambers and equipment and / or subprocessors on or within them. In some embodiments, one or more controllers 440 are used for a controller configuration of chamber 100.

[0072] Memory, or non-temporary computer-readable medium, is one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disks, hard disks, flash drives, or any other form of local or remote digital storage. Support circuitry is coupled to the CPU (processor) to support the CPU. Support circuitry includes caches, power supplies, clock circuits, input / output circuits, and subsystems. Operation and operating parameters are stored in memory as software routines that are executed or called to transform the controller 440 into a purpose-specific controller in order to control the operation of any of the individual heat exchange modules 400 in the upper heating module 200, the individual heat exchange modules 400 in the lower heating module 300, the individual valves 188 in the upper heating module 200, the individual valves 188 in the lower heating module 300, the individual fans 436 in the upper heating module 200, and / or the individual fans 466 in the lower heating module 300. The controller 440 is configured to perform any of the operations described herein. Instructions stored in memory, when executed, cause one or more of the operations described herein to occur.

[0073] In some embodiments, data from sensors 186, 292, and / or any other sensors associated with the processing chamber 100 may be used to provide feedback to the controller 440. In some embodiments, data of the current passing through fans 436, 466, heating lamps 222, 322, and / or any other electric components associated with the processing chamber 100 may be used to provide feedback to the controller 440. The controller 440 uses the data thus provided as input to process commands directed to fan 436, fan 466, and / or any valve 188.

[0074] Instructions in the memory of the controller 440 may include one or more machine learning / artificial intelligence algorithms that may be executed in addition to the operations described herein. For example, a machine learning / artificial intelligence algorithm executed by the controller 440 may tune and modify operating parameters based on received data. Operating parameters may include, for example, the pressure, temperature, and flow rate of the coolant and / or cooling gas. Operating parameters may include, for example, the status of each valve 188 to fully open and / or fully closed. Operating parameters may include, for example, the speed of each fan 436, 466. In some embodiments, one or more machine learning / artificial intelligence algorithms may prompt the controller 440 to initiate corrective actions to adjust any operating parameters.

[0075] Embodiments of the present disclosure provide a compact cooling system incorporated within a heating module. The cooling system does not rely on a cooling gas supplied through dedicated piping, which allows for a reduction in components (such as piping) associated with the processing chamber, thus saving space and improving access around the processing chamber.

[0076] It is intended that any element and feature of any one disclosed embodiment may be usefully incorporated into one or more other embodiments. While the foregoing applies to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from their basic scope, the scope of which is determined by the following claims.

Claims

1. A heating module for a process chamber suitable for use in semiconductor manufacturing, wherein the heating module is Outer housing and The lid on the outer housing, A reflector plate disposed within the outer housing, Multiple heating lamps associated with the reflector plate, A first heat exchange module disposed between the reflector plate and the lid, wherein the first heat exchange module includes a plurality of first heat exchange tubes disposed between a first inner shroud and a first outer shroud. A heating module equipped with the following features.

2. The heating module according to claim 1, wherein the first heat exchange module further comprises a plurality of plates coupled to each first heat exchange tube.

3. The heating module according to claim 1, wherein each first heat exchange tube is coupled to a coolant inlet and a coolant outlet.

4. The heating module according to claim 3, wherein each first heat exchange tube is arranged in a plurality of paths between the first inner shroud and the first outer shroud, and includes one or more U-shaped bends.

5. The heating module according to claim 1, wherein the first heat exchange module further comprises a first fan disposed between the reflector plate and the lid.

6. The annular heat shield extends from the reflector plate, The space within the heating module is The first region between the first fan and the lid, The second region between the first fan and the reflector plate, The third region between the annular heat shield and the outer housing It was divided into, The aforementioned first fan, Drawing cooling gas from the first region to the second region, The cooling gas is supplied from the second region through the plurality of openings in the reflector plate and through the annular heat shield, Transporting the cooling gas from the annular heat shield to the third region, The cooling gas is transported from the third region to the first inner shroud and the first outer shroud, around the first heat exchange tube, and to the first region. In a circuit including the heating module, the cooling gas is supplied within the heating module, The heating module according to claim 5.

7. The heating module according to claim 1, wherein the first heat exchange module further comprises a baffle extending from the outer shroud to the lid.

8. The heating module according to claim 1, wherein the first heat exchange module further comprises a skirt extending from the inner shroud to a reflector mounting ring coupled to the reflector plate.

9. The heating module according to claim 1, further comprising a second heat exchange module disposed between the reflector plate and the lid, the second heat exchange module including a plurality of second heat exchange tubes disposed between a second inner shroud and a second outer shroud.

10. The heating module according to claim 9, further comprising a second fan disposed between the reflector plate and the lid.

11. The heating module according to claim 1, further comprising a cooling tube coupled to the reflector plate.

12. The heating module according to claim 11, wherein the first heat exchange tube is configured to transport a first coolant, and the cooling tube is configured to transport a second coolant different from the first coolant.

13. A heating module for a process chamber suitable for use in semiconductor manufacturing, wherein the heating module comprises: Outer housing and The lid on the outer housing, A reflector plate disposed within the outer housing, Multiple heating lamps associated with the reflector plate, A heat exchange module disposed between the reflector plate and the lid, It is an enclosure, An inner shroud extending between the first end plate and the second end plate, An enclosure including an outer shroud extending between the first end plate and the second end plate, Multiple heat exchange tubes are arranged within the enclosure, A plurality of inner plates are arranged within the enclosure and coupled to each heat exchange tube. Equipped with, A heat exchange module in which the inner shroud, the outer shroud, and each heat exchange tube are curved in the horizontal plane, A heating module equipped with the following features.

14. The heating module according to claim 13, wherein the inner plate is coupled to at least one of the inner shroud or the outer shroud.

15. The heating module according to claim 13, wherein each heat exchange tube is connected in parallel to the coolant inlet and connected in parallel to the coolant outlet.

16. The heating module according to claim 13, wherein each heat exchange tube is arranged in a plurality of paths between the inner shroud and the outer shroud, and includes one or more U-shaped bends.

17. The heating module according to claim 16, wherein each heat exchange tube penetrates the first end plate and the second end plate, and at least a portion of each U-shaped bend is outside the enclosure.

18. A processing chamber suitable for use in semiconductor manufacturing, A chamber body including an upper window disposed above a lower window, wherein the upper window and the lower window form the boundary of the processing volume, An upper heating module coupled to the chamber body above the upper window, wherein the upper heating module is The first outer housing and The first lid on the first outer housing, A first reflector plate disposed within the first outer housing, A plurality of first heating lamps associated with the first reflector plate, A first heat exchange module disposed between the first reflector plate and the first lid, wherein the first heat exchange module includes a plurality of first heat exchange tubes disposed between the first inner shroud and the first outer shroud. Includes an upper heating module and A processing chamber equipped with the following:

19. A lower heating module coupled to the chamber body below the lower window, wherein the lower heating module is The second outer housing and The second lid on the second outer housing, A second reflector plate disposed within the second outer housing, A plurality of second heating lamps associated with the second reflector plate, A second heat exchange module disposed between the second reflector plate and the second lid, wherein the second heat exchange module includes a plurality of second heat exchange tubes disposed between the second inner shroud and the second outer shroud. Includes lower heating module The processing chamber according to claim 18, further comprising:

20. The processing chamber according to claim 19, further comprising a controller configured to control the operation of the first fan of the first heat exchange module and the second fan of the second heat exchange module.

21. The processing chamber according to claim 18, wherein the first heat exchange module further comprises a baffle extending from the first outer shroud to the first lid.

22. The heating module according to claim 18, wherein the first heat exchange module further comprises a skirt extending from the first inner shroud to a reflector mounting ring coupled to the first reflector plate.

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