Cooling systems, machine rooms, and methods for data centers

Abstract

The present disclosure provides a cooling system, a machine room, and a method for a data center. The system has a first channel and a second channel, and includes a stacked structure located between the first channel and the second channel. The stacked structure includes at least one stacked electronic device and at least one surface cooler. Each electronic device has a first air inlet and a first air outlet, and each surface cooler has a second air inlet and a second air outlet. The first air outlet and the second air inlet all face one side of the first channel, and the first air inlet and the second air outlet all face one side of the second channel. The cooling system of the data center of the present disclosure can simplify the cooling method of the data center and reduce the difficulty of operation and maintenance and the risk of liquid leakage.

Description

Technical Field

[0001] [Cross - reference to Related Applications] This disclosure claims the priority of Chinese Patent Application No. 202210884483.0 filed on July 25, 2022, and all the content disclosed in the above Chinese patent application is incorporated herein by reference in its entirety.

[0002] Embodiments of the present disclosure relate to a cooling system, a machine room, and a method for a data center.

Background Art

[0003] A data center is a specific network of devices that cooperate globally and is used to transmit, accelerate, display, calculate, and store data information on the network infrastructure of the Internet. It has a large energy consumption and high heat dissipation. Therefore, improving the energy utilization efficiency of the data center and controlling the Power Usage Effectiveness (abbreviated as PUE) has become an important issue.

[0004] Among many solutions for reducing the PUE usage efficiency of a data center, the full cold plate solution can dissipate heat from all heat - generating components in the server. However, the design of the cold plate in the full cold plate solution is complex, and the difficulty of component replacement and operation and maintenance is high, so it is not suitable for actual use. In addition, there are many pipe joints in the server, so the risk of liquid leakage is very high.

Summary of the Invention

[0005] The objective of the present disclosure is to provide a cooling system, a machine room, and a method for a data center so as to simplify the cooling method of the data center and reduce the difficulty of operation and maintenance and the risk of liquid leakage.

[0006] In a first aspect, the disclosure provides a cooling system for a data center, the cooling system for the data center having a first channel and a second channel, and the cooling system for the data center including a stacked structure located between the first channel and the second channel. The laminated structure includes at least one stacked electronic device and at least one surface cooler, each electronic device having a first intake port and a first outlet port, and each surface cooler having a second intake port and a second outlet port, the first outlet port and the second intake port both facing one side of the first channel, and the first intake port and the second outlet both facing one side of the second channel.

[0007] In the stacked structure of the cooling system for the data center described herein, the second air intake of each surface cooler and the first air outlet of each electronic device all face one side of the first channel, and the second air outlet of each surface cooler and the first air intake of each electronic device all face one side of the second channel. Based on this, the first air outlet of the electronic device can discharge hot air into the first channel, the second air intake of the surface cooler introduces the hot air from the first channel into the surface cooler, the surface cooler cools the hot air, and then the second air outlet of the surface cooler discharges cold air into the second channel. As a result, since the laminated structure is located between the adjacent first and second channels, the first and second channels can be separated by the laminated structure, reducing the probability of the airflows of the first and second channels coming into contact with each other. Therefore, the second outlet of the surface cooler does not come into contact with the hot air of the first channel after discharging cold air to the second channel, thus preventing the hot air of the first channel from affecting the cooling capacity of the cold air of the second channel. Consequently, the cold air from the first channel enters the interior of the electronic device through the first air intake of the electronic device, and the heat dissipated from the internal assembly of the electronic device is absorbed by the cold air.

[0008] As will be seen, the data center cooling system described herein can circulate cooling of the internal assemblies of electronic equipment using surface coolers, eliminating the need to lay separate cooling lines on the surface of the internal assemblies of electronic equipment. The surface coolers can be used as cooling devices for the internal assemblies of electronic equipment, and their cooling capacity is close to that of the associated air cooling system, thereby reducing the data center's PUE and operating costs. Furthermore, because at least one electronic device and at least one surface cooler are stacked together in the same stacked structure, operation and maintenance can be performed independently for the surface coolers or electronic equipment, requiring no special equipment or operations. This is far superior to immersion systems and full cold plate systems, effectively reducing the difficulty of operation and maintenance of the cooling devices for the internal assemblies of electronic equipment, reducing the number of internal pipe fittings in electronic equipment such as servers, and lowering the risk of liquid leakage during the cooling process of electronic equipment. Additionally, because at least one electronic device and at least one surface cooler are stacked together in the same stacked structure, the design difficulty of the data center cooling method is reduced. In actual production and installation, only the surface cooler and electronic equipment need to be stacked and installed, eliminating the need for special production conditions and installation / delivery processes, thus effectively simplifying data center cooling methods.

[0009] As can be seen from the above, the data center cooling system described in this disclosure can simplify the data center cooling method, reduce the difficulty of operation and maintenance and the risk of liquid leakage, and at the same time effectively reduce the data center cooling costs in three aspects: equipment investment, cooling capacity, and operation and maintenance.

[0010] In a second aspect, the disclosure further provides a data center machine room including a data center cooling system described in the technical solution of the disclosure.

[0011] The beneficial effects of the data center machine room relating to this disclosure are similar to the beneficial effects of the data center cooling system described in the technical solution of this disclosure, and will not be described in detail here.

[0012] This disclosure further provides a data center cooling method applicable to the data center cooling system described in the technical solution of this disclosure, wherein the data center cooling has a plurality of cooling cycles, each of which cooling cycles Each electronic device has a first outlet which discharges hot air to a first channel, The second air intake port of each surface cooler introduces the hot air from the first channel into the surface cooler, and the surface cooler cools the hot air. Each of the surface coolers has a second outlet which discharges cold air into the second channel, Each of the aforementioned electronic devices has a first air intake port which includes the steps of introducing the cold air in the second channel into the electronic device and absorbing the heat dissipated from the internal assembly of the electronic device by the cold air.

[0013] The beneficial effects of the data center cooling method relating to this disclosure are similar to the beneficial effects of the data center cooling system described in the technical solution of this disclosure, and will not be described in detail here.

[0014] The drawings described herein are used to provide a further understanding of the Disclosure and constitute part of the Disclosure, and the exemplary embodiments and descriptions thereof are used to interpret the Disclosure and are not intended to unduly limit the Disclosure. [Brief explanation of the drawing]

[0015] [Figure 1] Figure 1 shows a basic schematic plan view of a data center cooling system according to an exemplary embodiment of the present disclosure. [Figure 2] Figure 2 shows a basic structural schematic of a laminated structure of an exemplary embodiment of the present disclosure. [Figure 3] Figure 3 shows four schematic diagrams of the laminated structure of an exemplary embodiment of the present disclosure. [Figure 4] Figure 4 shows four schematic diagrams of the laminated structure of an exemplary embodiment of the present disclosure. [Figure 5]FIG. 5 shows four schematic structural views of the stacked structure of an exemplary embodiment of the present disclosure. [Figure 6] FIG. 6 shows four schematic structural views of the stacked structure of an exemplary embodiment of the present disclosure. [Figure 7] FIG. 7 shows three schematic plan views of the cooling system of a data center according to an exemplary embodiment of the present disclosure. [Figure 8] FIG. 8 shows three schematic plan views of the cooling system of a data center according to an exemplary embodiment of the present disclosure. [Figure 9] FIG. 9 shows three schematic plan views of the cooling system of a data center according to an exemplary embodiment of the present disclosure. [[ID=…]] [Figure 10A] FIG. 10A shows a schematic three-dimensional structure view of a cabinet at two angles of an exemplary embodiment of the present disclosure. [Figure 10B] FIG. 10B shows a schematic three-dimensional structure view of a cabinet at two angles of an exemplary embodiment of the present disclosure. [Figure 11A] FIG. 11A shows a schematic rear view of the cooling system of a data center of an exemplary embodiment of the present disclosure. [Figure 11B] FIG. 11B shows a schematic side view of the cooling system of a data center of an exemplary embodiment of the present disclosure. [Figure 11C] FIG. 11C shows a schematic front view of the cooling system of a data center of an exemplary embodiment of the present disclosure. [Figure 12] FIG. 12 shows another schematic side view of the cooling system of a data center of an exemplary embodiment of the present disclosure. [Figure 13A] FIG. 13A shows a schematic rear view of a surface cooler of an exemplary embodiment of the present disclosure. [Figure 13B] FIG. 13B shows a schematic side view of a surface cooler of an exemplary embodiment of the present disclosure. [Figure 13C] FIG. 13C shows a schematic front view of a surface cooler of an exemplary embodiment of the present disclosure. [Figure 14] FIG. 14 shows two electrical circuit diagrams of the automatic control of electronic equipment of an exemplary embodiment of the present disclosure. [Figure 15]Figure 15 shows two electrical circuit diagrams for automated electronic control in exemplary embodiments of the present disclosure. [Figure 16] Figure 16 shows a schematic flow diagram of each cooling cycle method in an exemplary embodiment of the present disclosure. [Figure 17] Figure 17 shows a schematic diagram of the interaction process between the first control module and the first sensing assembly in an exemplary embodiment of the present disclosure. [Figure 18] Figure 18 shows a schematic diagram of the interaction process between the second control module and the second sensing assembly in an exemplary embodiment of the present disclosure. [Modes for carrying out the invention]

[0016] To further clarify the technical problems, technical solutions, and beneficial effects that this disclosure aims to solve, the disclosure will be described in more detail below with reference to the drawings and examples. Please understand that the specific examples described here are for interpretation purposes only and do not limit the disclosure.

[0017] Furthermore, when a particular element is described as being "fixed" or "installed" on another element, it may be directly present on or indirectly present on the other element. When a particular element is described as being "connected" to another element, it may be directly connected to or indirectly connected to the other element.

[0018] Furthermore, terms such as “first,” “second,” etc., are not intended to indicate or imply relative importance or implicitly indicate the number of technical features being described, but are merely descriptive. Thus, features limited by “first,” “second,” etc., may explicitly or implicitly include one or more such features. In this disclosure, unless otherwise specified, “multiple” means two or more. Unless otherwise specified, “several” means one or more.

[0019] As it is necessary to understand in the description of this disclosure, the directions or positional relationships indicated by terms such as “up,” “down,” “front,” “back,” “left,” and “right” are directions or positional relationships shown in the drawings and are merely for the purpose of facilitating and simplifying the description of this disclosure, and do not indicate or imply that the shown devices or elements necessarily have a specific direction or are constructed and operated in a specific direction, and should not be understood as limiting this disclosure.

[0020] In this disclosure, unless otherwise explicitly stated or limited, the terms “attachment,” “connection,” and “connection” should be understood broadly, for example, that connections may be fixed, detachably connected, or integrally connected; they may be mechanical or electrical connections; they may be direct connections or indirect connections via an intermediate medium; they may be internal communication between two elements or interaction relationships between two elements. Those skilled in the art will be able to understand the specific meaning of these terms in this disclosure depending on the specific circumstances.

[0021] Power Usage Effectiveness (PUE) is an indicator of a data center's energy efficiency. It is the ratio of all energy consumed by the data center to the energy used by the internet technology (IT) load, and is the inverse ratio of data center infrastructure efficiency (DCIE). The baseline PUE is 2, and the closer it is to 1, the higher the energy efficiency level of the data center.

[0022] In related technologies, data centers can be cooled using immersion liquid cooling solutions and full cold plate solutions. Immersion liquid cooling solutions are not widely used for cooling data centers, and while it allows network equipment in the data center to be immersed in coolant, the coolant is expensive, operation and maintenance are complex, and therefore the overall profitability of immersion liquid cooling solutions is not high. Cooling data centers with full cold plate solutions eliminates the need for cooling fans within network equipment, and all heat-generating components in the server are cooled by a cold plate structure. However, the biggest problem is that the cold plate structure is complex and very expensive. If individual components inside the network equipment need to be replaced, the cold plate structure must be removed from the network equipment, and then the internal components of the network equipment must be replaced, which complicates data center operation and maintenance. Furthermore, if all heat-generating components of the network equipment are cooled by a cold plate structure, the cold plate structure is not only complex but also has many joints, resulting in a high risk of potential liquid leakage.

[0023] To address the above issues, exemplary embodiments of this disclosure provide a data center cooling system and method. The data center cooling system of the exemplary embodiments of this disclosure applies surface cooling technology to data center cooling, using a surface cooler to cool the hot airflow discharged from electronic equipment, and then discharging the cool air to the side where the air intake of the electronic equipment is located. The cool air enters the electronic equipment through the air intake and absorbs the heat radiated from the internal components of the electronic equipment, thereby achieving the objective of cooling the electronic equipment. This effectively simplifies the data center cooling method and reduces the difficulty of operation and maintenance, as well as the risk of liquid leakage. The data center cooling system and method of exemplary embodiments of this disclosure will be described below with reference to the drawings.

[0024] Figure 1 shows a basic schematic plan view of a data center cooling system according to an exemplary embodiment of the present disclosure. As shown in Figure 1, the data center cooling system 100 of the exemplary embodiment of the present disclosure has a first channel 101 and a second channel 102. The data center cooling system 100 of the exemplary embodiment of the present disclosure may also include a stacked structure 103, which is located between the first channel 101 and the second channel 102, thereby separating the first channel 101 and the second channel 102.

[0025] Figure 2 shows a basic structural schematic of a laminated structure of an exemplary embodiment of the present disclosure. As shown in Figure 2, the laminated structure 103 of an exemplary embodiment of the present disclosure includes at least one stacked electronic device 1031 and at least one surface cooler 1032. In this embodiment, the assembly of the electronic device 1031 and the surface cooler 1032 is simple, requiring no special production, assembly conditions, and delivery processes, and effectively reducing the difficulty of assembling the laminated structure 103. It should be understood that the electronic device 1031 is not limited to various network devices such as switches, storage servers, computing servers, and graphics processing unit (GPU) servers.

[0026] As shown in Figure 2, in the same laminated structure 103 of the exemplary embodiment of the present disclosure, each electronic device 1031 has a first intake port and a first outlet port. External airflow can enter the electronic device 1031 through the first intake port and be discharged from the electronic device 1031 through the first outlet port. Each surface cooler 1032 has a second intake port and a second outlet port, and external airflow can enter the surface cooler 1032 through the second intake port and be discharged from the surface cooler 1032 through the second outlet port.

[0027] In actual application examples, as shown in Figures 1 and 2, the first air intake and first air outlet may be provided symmetrically on two end faces of the electronic device 1031 along a predetermined direction, and the second air intake and second air outlet may be provided symmetrically on two end faces of the surface cooler 1032 along a predetermined direction. Furthermore, the first air intake of each electronic device 1031 and the second air outlet of each surface cooler 1032 all face one side of the second channel 102, and the first air outlet of each electronic device 1031 and the second air intake of each surface cooler 1032 all face one side of the first channel 101.

[0028] In specific implementation, as shown in Figures 1 and 2, the first air outlets of each electronic device 1031 and the second air intakes of each surface cooler 1032 all face one side of the first channel 101, and the first air intakes of each electronic device 1031 and the second air outlets of each surface cooler 1032 all face one side of the second channel 102. Therefore, the heat radiated from the internal assembly of the electronic device 1031 can be discharged as hot air into the first channel 101 through the first air outlets. Subsequently, the second air intakes of the surface cooler 1032 introduce the hot air from the first channel 101 into the surface cooler 1032, where it is cooled by surface heat exchange. Then, the second air outlets of the surface cooler 1032 discharge cold air into the second channel 102. As a result, since the laminated structure 103 is located between the adjacent first channel 101 and second channel 102, the first channel 101 and the second channel 102 can be separated by the laminated structure 103, reducing the probability of the airflows of the first channel 101 and the second channel 102 coming into contact with each other. Therefore, the second outlet of the surface cooler 1032 does not come into contact with the hot air of the first channel 101 after discharging cold air to the second channel 102, thus preventing the hot air of the first channel 101 from affecting the cooling capacity of the cold air of the second channel 102. As a result, the cold air from the first channel enters the electronic device 1031 through the first air intake of the electronic device 1031, and the heat dissipated from the internal assembly of the electronic device 1031 is absorbed by the cold air.

[0029] As can be seen therefrom, as shown in Figures 1 and 2, the data center cooling system 100 according to an exemplary embodiment of the present disclosure can circulate and cool the internal assembly of the electronic equipment 1031 using a surface cooler 1032. Such a cooling method essentially cools the electronic equipment 1031 using ambient airflow, circulating cold and hot air internally by airflow. There is no need to lay cooling lines on the surface of the internal assembly of the electronic equipment 1031, and the surface cooler 1032 can be used as a cooling device for the internal assembly of the electronic equipment 1031, with a cooling capacity close to that of air-cooled systems of related technologies.

[0030] For example, in a data center, an air conditioner can be used to cool the data center based on a full cold plate solution, but the compressor inside the air conditioner requires an additional power supply, which increases the PUE of the data center. In the data center cooling system of the exemplary embodiment of the present disclosure, the method of cooling by circulating cold and hot air internally by airflow cools the electronic equipment 1031 by cooling the airflow using a surface cooler 1032, thereby reducing the PUE of the data center, the unit energy consumption, and the total cost of ownership (TCO).

[0031] In related technologies, when cooling electronic equipment using a complete liquid cooling system, liquid cooling piping is provided for all main heat-generating components of the electronic equipment, such as the central processor and image processor, or for secondary heat-generating components such as memory sticks. This results in complex internal liquid cooling piping and a risk of leakage. Consequently, the design of complete liquid cooling solutions is complex, and installation, operation, and maintenance costs are high. As shown in Figures 1 and 2, in the data center cooling system 100 of the exemplary embodiment of this disclosure, the liquid cooling piping for secondary heat-generating components within the electronic equipment 1031 is omitted, and the electronic equipment 10 3By cooling the airflow with the surface cooler 1032 stacked with 1, cool air is provided inside the electronic equipment, and the cool air absorbs the heat dissipated from the secondary heat-generating components. Based on this, the data center cooling system 100 of the exemplary embodiment of the present disclosure can reduce the number of pipe fittings inside electronic equipment such as servers and reduce the risk of liquid leakage during the cooling process of the electronic equipment. Furthermore, since at least one electronic equipment 1031 and at least one surface cooler 1032 are stacked integrally within the same stacked structure 103, there is no need to specifically design and arrange liquid cooling pipes for secondary heat-generating components, and thus the difficulty and complexity of designing the data center cooling system can be effectively simplified. Furthermore, since at least one electronic device 1031 and at least one surface cooler 1032 are stacked integrally, and the surface cooler 1032 and the electronic device 1031 are independent of each other, the operation and maintenance of the electronic device 1031 and the operation and maintenance of the surface cooler 1032 can be performed independently, without mutual interference, and without requiring special equipment or operations. This is far superior to immersion systems and full cold plate systems, and effectively reduces the difficulty of operation and maintenance of the cooling equipment for the internal assembly of the electronic device 1031.

[0032] Furthermore, in the data center cooling system of the exemplary embodiment of this disclosure, at least one electronic device 1031 and at least one surface cooler 1032 are integrally stacked within the same stacked structure 103. Therefore, in actual production, the electronic device 1031 and the surface cooler 1032 can be produced separately, and in assembly or delivery, only the surface cooler 1032 and the electronic device 1031 need to be stacked and installed. This eliminates the need for special production conditions and installation / delivery processes, thus effectively simplifying the data center cooling method.

[0033] As can be seen from the above, the data center cooling system described in this disclosure can simplify the data center cooling method, reduce the difficulty of operation and maintenance and the risk of liquid leakage, and at the same time effectively reduce the data center cooling costs in three aspects: equipment investment, operating costs and operation and maintenance costs.

[0034] In selectable configurations, as shown in Figure 2, the number of electronic devices 1031 and surface coolers 1032 in the exemplary embodiments of the present disclosure can be designed according to actual needs, and the number of electronic devices included in the laminated structure may be one or more. Similarly, the number of surface coolers may be one or more.

[0035] When the number of electronic devices included in the stacked structure is multiple, there may be one surface cooler or multiple surface coolers. When there are multiple surface coolers, the multiple surface coolers can be stacked together to form a surface cooling module, which can then be stacked with multiple electronic devices. Multiple surface coolers They may be provided at intervals in different parts of the laminated structure.

[0036] For example, when there is one surface cooler, or when there are multiple surface coolers, but they are stacked together with multiple electronic devices in the form of a surface cooling module, the surface cooler may be located in the center of the multiple electronic devices, at the bottom of the multiple electronic devices, or at the very top of the multiple electronic devices. When the surface cooler is located in the center of the stacked multiple electronic devices, that center is the center in a broad sense, but not in a narrow sense.

[0037] The following explanation will use the example of a single surface cooler located in the central part of multiple electronic devices. While the exemplary embodiments of this disclosure disclose an example where a single surface cooler is located in the central part of multiple electronic devices, it should be understood that this does not preclude implementation methods in which the single surface cooler is replaced by a surface cooling module to achieve the related functions.

[0038] Figure 3 shows a schematic diagram of the structure of a stacked structure of an exemplary embodiment of the present disclosure. As shown in Figure 3, the stacked structure 103 of the exemplary embodiment of the present disclosure includes six electronic devices 1031, and a surface cooler 1032 is provided between the third and fourth electronic devices along the direction indicated by the first arrow A. In this case, the surface cooler is located in the middle of the six stacked electronic devices. The surface cooler 1032 can symmetrically cool the three electronic devices 1031 below it and the three electronic devices 1031 above it, thereby ensuring a temperature balance of the electronic devices 1031 included in the entire stacked structure 103.

[0039] Figure 4 shows another schematic diagram of the laminated structure of an exemplary embodiment of the present disclosure. As shown in Figure 4, the laminated structure 103 of the exemplary embodiment of the present disclosure includes six electronic devices 1031, and a surface cooler 1032 is provided between the second and third electronic devices along the direction indicated by the second arrow B. In this case, the surface cooler 1032 is located at the bottom of the six laminated electronic devices 1031 and mainly cools the electronic devices 1031 located at the bottom of the laminated structure 103. Based on this, among the multiple electronic devices 1031 included in the laminated structure 103, the first to third electronic devices are more prone to generating heat or have lower heat dissipation capacity compared to the fourth to sixth electronic devices, and the surface cooler 1032 can be used to mainly cool the first to third electronic devices. The surface cooler 1032 can also cool the fourth to sixth electronic devices, but it should be understood that its cooling capacity for the fourth to sixth electronic devices is relatively lower compared to the first to third electronic devices.

[0040] Figure 5 shows yet another schematic diagram of the laminated structure of an exemplary embodiment of the present disclosure. As shown in Figure 5, the laminated structure 103 of the exemplary embodiment of the present disclosure includes six electronic devices 1031, and a surface cooler 1032 is provided between the fifth and sixth electronic devices along the direction indicated by the third arrow C. In this case, the surface cooler 1032 is located on top of the six laminated electronic devices and mainly cools the electronic devices 1031 located at the top of the laminated structure 103. Based on this, among the multiple electronic devices included in the laminated structure 103, the fourth to sixth electronic devices are more prone to generating heat or have lower heat dissipation capacity compared to the first to third electronic devices, and the surface cooler 1032 can be used to mainly cool the fourth to sixth electronic devices. It should be understood that the surface cooler 1032 can also cool the first to third electronic devices, but its ability to cool the first to third electronic devices is relatively lower compared to the fourth to sixth electronic devices.

[0041] When a stacked structure contains multiple electronic devices and surface coolers, the multiple surface coolers can be stacked integrally with multiple electronic devices at intervals. for example, Some of these are stacked and combined into a surface cooling module, while other surface coolers are stacked together with the surface cooling module in multiple stacked structures with spacing between them. There are .

[0042] Figure 6 shows yet another schematic diagram of a laminated structure of an exemplary embodiment of the present disclosure. As shown in Figure 6, the laminated structure 103 of an exemplary embodiment of the present disclosure includes four electronic devices 1031 and three surface coolers 1032, with the electronic devices 1031 and surface coolers 1032 alternately distributed along the direction indicated by the fourth arrow D. In this case, each surface cooler 1032 can be used to make the temperature distribution throughout the laminated structure uniform and avoid the problem of localized heat generation.

[0043] In selectable forms, the number of laminated structures in the exemplary embodiments of this disclosure may be one or more, and these laminated structures are divided into at least one group, with first and second channels alternately distributed along a first preset direction, and each group of laminated structures is located between adjacent first and second channels. The same group of laminated structures may contain at least one laminated structure. If the same group of laminated structures contains multiple laminated structures, the multiple laminated structures are alternately distributed along a second preset direction. It should be understood that the first and second preset directions here may be orthogonal to each other and may be set according to the actual situation. At the same time, the first preset direction may be the positive direction of the first preset direction or the negative direction of the first preset direction.

[0044] In actual application examples, as shown in Figure 1, the data center cooling system 100 of the exemplary embodiment of this disclosure may further include a sealed housing 104. At least one group stacked structure 103 may be located within the sealed housing 104. The first channel 101 and the second channel 102 are alternately distributed within the sealed housing 104 along a first predetermined direction. As shown in Figures 1 and 2, because the stacked structure 103 is located within the sealed housing 104, external heat can be prevented from entering the sealed housing 104 and affecting the cooling effect during the internal circulation of cold and hot air for cooling the electronic equipment 1031. This also reduces the leakage of cold air from inside the sealed housing 104 during the internal circulation of cold and hot air for cooling, thereby further reducing the PUE. At the same time, it is possible to reduce environmental noise, airflow, and electromagnetic radiation in the data center (Internet Data Center, abbreviated as IDC), and further improve the operational and maintenance environment. It should be understood that the number of first and second channels in the exemplary embodiment of this disclosure relates to the number of groups of stacked structures, which will be explained below with examples.

[0045] Figure 7 shows a schematic plan view of a data center cooling system according to an exemplary embodiment of the present disclosure. As shown in Figure 7, the data center cooling system 100 of the exemplary embodiment of the present disclosure has one first channel 101 and one second channel 102, and the first channel 101 and the second channel 102 are distributed along a first preset direction. The data center cooling system 100 includes one group of stacked structures, which are located between the first channel 101 and the second channel 102, and the group of stacked structures, the first channel 101 and the second channel 102 are all located within a sealed housing 104. In this case, regardless of whether the first channel 101 and the second channel 102 are distributed along the positive direction A of the first preset direction or along the negative direction B of the first preset direction, the number of both the first channel 101 and the second channel 102 is one. The stacked structure of the group includes five stacked structures 103, and the five stacked structures 103 are stacked and distributed along a second predetermined direction C. Figure 7 shows only the case where there are five stacked structures 103, but does not exclude cases where the number of stacked structures 103 is less than five, nor does it exclude cases where the number of stacked structures 103 is greater than five when there is one stacked structure 103. For these cases that are not excluded, refer to the relevant explanation in Figure 7.

[0046] When the number of groups in the layered structure is two or more, the number of first channels and the number of second channels are also related to the distribution method of the first and second channels in a first predetermined direction.

[0047] Assuming that the number of first channels is greater than the number of second channels, and that the number of first channels is N, when the first and second channels are distributed along the positive direction of the first preset direction, the number of second channels may be N-1, where N is an integer greater than or equal to 2. Figure 8 shows another schematic plan view of a data center cooling system according to an exemplary embodiment of the present disclosure. As shown in Figure 8, the data center cooling system 100 of the exemplary embodiment of the present disclosure has two first channels 101 and one second channel 102, and the first channels 101 and second channels 102 are alternately distributed along the positive direction A of the first preset direction. Within the sealed housing 104 are two groups of stacked structures 103 distributed along the first preset direction, and each group of stacked structures 103 includes five stacked structures 103 stacked along the second preset direction C, and the two groups of stacked structures 103 share one second channel 102.

[0048] When the first and second directions are distributed along the negative direction of a preset direction, the number of first channels is less than the number of second channels, and if the number of first channels is M, then the number of second channels may be M+1, where M is an integer greater than or equal to 1. Figure 9 shows yet another schematic distribution of a data center cooling system according to an exemplary embodiment of the present disclosure. As shown in Figure 9, the data center cooling system 100 of the exemplary embodiment of the present disclosure has one first channel 101 and two second channels 102, the first channel 101 and the second channel 102 are alternately distributed along the negative direction B of a first preset direction, and within the sealed housing 104 there are two groups of stacked structures distributed along the first preset direction, and each group of stacked structures 103 includes five stacked structures 103 stacked along the second preset direction C, and the two stacked structures 103 share one first channel 101.

[0049] Figures 8 and 9 show only the case where there are two groups of laminated structures and each group contains five laminated structures 103. However, the case where there are fewer than two groups of laminated structures 103 is not excluded, nor is the case where there are more than two groups of laminated structures and each group contains fewer than five laminated structures and one laminated structure 103 excluded, nor is the case where each group contains more than five laminated structures 103 excluded.

[0050] As shown in Figures 7 to 9, the sealed housing 104 in the exemplary embodiment of this disclosure may be a cabinet in the broad sense, as long as it is a container capable of housing the laminated structure 103. cabinet It can be called such a structure. For example, the sealed housing 104 may be a typical cabinet or machine room in a data center. If the sealed housing 104 is a cabinet, the stacked structure 103 in any one, more or all cabinets in the machine room of the data center can be configured as the structure of the data center cooling system in the exemplary embodiment of the disclosure. In addition, the sealed housing 104 in the exemplary embodiment of the disclosure needs to be provided with various threading holes, as well as through holes for passing pipelines for transporting cooling fluid.

[0051] Figures 10A and 10B show schematic diagrams of the three-dimensional structure of a sealed housing at two angles in an exemplary embodiment of the present disclosure. As shown in Figures 10A and 10B, the sealed housing 104 is a rectangular cabinet with an opening 1040 at its top, such as a thread hole and a through hole (in Figures 10A and 10B, the thread hole and the through hole are not distinguished and are both represented as opening 1040). To achieve sealing, the opening 1040 is sealed with a sealing structure, which may be a rubber seal, a sealing tape seal, etc., to ensure the overall airtightness of the cabinet and improve the cooling effect. At the same time, the rectangular cabinet has a sealed front door 1041 and a sealed rear door 1042, which can reduce ambient noise, airflow, and electromagnetic radiation in a data center (Internet Data Center, abbreviated as IDC), and further improve the operational and maintenance environment. When airtightness is not a consideration, the front and rear of the cabinet are designed with mesh doors or no doors at all. Furthermore, a power management unit may be provided inside the cabinet, located near the rear end of the first channel cabinet, and used to manage the power supply to the electronic equipment.

[0052] In selectable configurations, Figure 11A shows a schematic rear view of a data center cooling system in an exemplary embodiment of the present disclosure, Figure 11B shows a schematic side view of a data center cooling system in an exemplary embodiment of the present disclosure, and Figure 11C shows a schematic front view of a data center cooling system in an exemplary embodiment of the present disclosure. In the solutions shown in Figures 11A to 11C, the first air intake and the second air outlet are located on the same side, and the first air outlet and the second air intake are located on the same side. For example, as shown in Figures 11A and 11B, the first air outlet and the second air intake face the same first channel 101, and the first air intake and the second air outlet face the same second channel 102. The first air intake and the second air outlet are located at the front end of the electronic equipment 1031 or the front end of the surface cooler 1032, and the first air outlet and the second air intake are located at the rear end of the electronic equipment 1031 or the rear end of the surface cooler 1032.

[0053] As shown in Figures 10A, 11A-11C, the laminated structure 103 of an exemplary embodiment of the present disclosure is provided within a sealed housing 104, where the first channel 101 is located at the rear end of the electronics 1031 and surface cooler 1032 and close to a sealed rear door 1042, and as shown in Figures 10B, 11A-11C, the second channel 102 is located at the rear end of the electronics 1031 and surface cooler 1032 and close to a sealed front door 1041.

[0054] Lamination of exemplary embodiments of the present disclosure composition The electronic equipment inside can be cooled by a cooling fluid such as liquid cooling, air cooling, or a combination of both. Exemplary, different electronic equipment such as network equipment can be arranged in the stacked structure according to the actual needs. For example, standard air-cooled switches, computing air-cooled and / or cold plate servers, storage air-cooled and / or cold plate servers, and GPU air-cooled and / or cold plate servers. For example, in the solution shown in Figures 11A to 11C, the stacked structure 103 has, from bottom to top, two GPU air-cooled / cold plate servers 1031A, two storage air-cooled / cold plate servers 1031B, two computing air-cooled / cold plate servers 1031C, a surface cooler 1032, and one GPU-based The system includes an air-cooled / cold plate server 1031A, two storage-type air-cooled / cold plate servers 1031B, two computing-type air-cooled / cold plate servers 1031C, and two air-cooled switches 1031D. The air-cooled / cold plate may utilize a cooling method that combines both air and liquid cooling, but the use of a single air-cooled cooling method and a single liquid-cooled cooling method is not excluded.

[0055] All surface coolers and electronic devices in the exemplary embodiments of this disclosure can be cooled with a cooling fluid. Based on this, as shown in Figure 11A, the cooling system of the data center in the exemplary embodiment of this disclosure further includes transport piping 105, which includes a first transport piping and a second transport piping (in Figures 11A and 11B, the first transport piping and the second transport piping are not distinguished and are both represented as transport piping 105). Each surface cooler 1032 has a cooler housing and cooling piping provided within the cooler housing, the cooling piping communicating with the first transport piping and the second transport piping, respectively, and a second intake port and a second outlet port are opened in the cooler housing.

[0056] In a specific implementation, as shown in Figures 11A and 11B, the first transport pipeline can introduce cooling fluid into the cooling fluid piping. The hot air from the first channel 101 can enter the cooler housing through the second intake port. At this time, the cooling fluid in the cooling piping can cool the hot air that has entered the cooler housing, and the temperature of the hot air gradually decreases, becoming cold air, and the second Exclusion The coolant is discharged from the air inlet into the second channel 102. Each of the exemplary embodiments of the present disclosure may be a liquid-cooled surface cooler, and the coolant transported by the first and second transport pipes may be water or other coolant capable of achieving cooling, and the present disclosure is not limited thereto.

[0057] Each of the exemplary embodiments of this disclosure may be a liquid-cooled electronic device. Accordingly, each electronic device may have a cooling structure, and the cooling structure may have a cooling chamber. The cooling chambers communicate with a first transport pipe and a second transport pipe, respectively. In this case, the cooling pipes of each surface cooler and the cooling chambers of the electronic devices all communicate with the first transport pipe and the second transport pipe. Accordingly, when the first transport pipe introduces cooling fluid into the cooling pipe of the surface cooler, it introduces cooling fluid into the cooling chamber of the electronic device and uses the cooling fluid to simultaneously absorb the heat dissipated from the main heat-generating component of the electronic device, and the second transport pipe communicates with the cooling pipe of the surface cooler. Cooling fluid insideBy deriving this, it is possible to simultaneously derive the cooling fluid in the cooling chamber of the electronic device.

[0058] Figure 12 shows another schematic side view of a data center cooling system in an exemplary embodiment of the present disclosure. The difference between the data center cooling system shown in Figure 12 and the data center cooling systems shown in Figures 11A to 11C is that the data center cooling system in Figure 12 has two stacked structures inside the cabinet, and a first channel 101 between the two stacked structures. A plan layout diagram of the data center cooling system shown in Figure 12 can be found in Figure 8.

[0059] In specific implementation, as shown in Figure 12, the two stacked structures are located within a sealed housing 104, and the heat inside the electronic equipment contained within the two stacked structures can be discharged in the form of hot air from a first outlet into a first channel 101 between the two stacked structures, and the two stacked structures can share one first channel 101. At the same time, the hot air from the electronic equipment contained within the two stacked structures interferes with each other within the first channel 101, increasing the probability that the hot air enters the surface cooler contained within the two stacked structures, thereby further improving the speed of internal circulation of cold and hot air and improving the cooling capacity of the surface cooler.

[0060] The cooling principle of a data center cooling system in an exemplary embodiment of this disclosure, where network equipment is considered electronic equipment and liquid-cooled surface coolers are considered surface coolers, will be explained below with reference to the schematic side view shown in Figure 11B. The cooling principle of the data center cooling system shown in Figure 12 can be found in Figure 11B and will not be explained in detail below.

[0061] In an exemplary embodiment of the present disclosure, a liquid-cooled surface cooler dissipates heat from the main heat-generating devices such as the CPU and GPU within the network equipment. Cool air is drawn into the second channel 102 through an intake port at the front end of the network equipment, i.e., the front end of the system, to cool and dissipate heat from other heat-generating components (located inside the network equipment). The hot air is then discharged to the first channel 101 through an exhaust port at the rear end of the network equipment. The hot air enters the surface cooler 1032 through an intake port at the rear end of the surface cooler 1032, where it is cooled by liquid cooling. The cooled air is then discharged to the second channel 102 from the front end of the surface cooler 1032, i.e., the front end of the system, thereby forming a circulation system of cool and hot air within the sealed system, which dissipates heat from the network equipment within the sealed system. Based on this, in the data center cooling system of the exemplary embodiment of the present disclosure, only the provision of a cooling water system by the machine room is required, and no additional cooling system is needed, reducing PUE and machine room construction costs.

[0062] Exemplary, as shown in Figure 11B, the cooling system of a data center in an exemplary embodiment of the present disclosure may include at least one exhaust device 106, each exhaust device 106 located at a second outlet of a corresponding surface cooler 1032, thereby utilizing the exhaust device 106 to accelerate the rate at which the corresponding surface cooler 1032 discharges cold air, increasing the airflow velocity inside the electronic equipment 1031 and achieving the objective of rapid cooling. The exhaust device 106 may include one or more exhaust fans or other devices capable of providing exhaust. The arrangement of the exhaust fans or devices can be set according to the actual needs.

[0063] Exemplary, at least one electronic device of an exemplary embodiment of the present disclosure has an air suction device inside, which is an air suction fan or the like that can draw a second channel of cool air into the electronic device. Including the components This is also good. If there is an air intake device inside the electronic device, the cool air in the second channel can enter the inside of the electronic device more quickly, and the heat-generating components inside the electronic device can be cooled down.

[0064] Exemplary, a data center cooling system in an exemplary embodiment of the present disclosure may include at least one exhaust device and an air intake device inside the electronic equipment, the air intake device and exhaust device may be configured as an engine for driving the circulation of cold and hot air within a sealed system, ensuring that the pressure difference between the first and second channels is close to provide stable cooling for the electronic equipment.

[0065] In actual application examples, the cooling structure of the exemplary embodiment of this disclosure is each The cooler housing has a first fluid inlet and a first fluid outlet that communicate with the cooling chamber, and the first fluid inlet and first fluid outlet can be designed according to the actual situation. The cooler housing also has a second fluid inlet and a second fluid outlet that communicate with the cooling piping, and the second fluid inlet and second fluid outlet can be designed according to the actual situation.

[0066] The electronic devices of the exemplary embodiments of the present disclosure may, exemplary, have one first fluid inlet and one first fluid outlet, and the surface cooler may have a pair of second fluid inlets and a pair of second fluid outlets, although the number may be designed in other possible realizations. As is evident from Figures 11A and 11B, the electronic device 1031 of the exemplary embodiments of the present disclosure may, exemplary, have one first fluid inlet and one first fluid outlet, and the surface cooler 1032 may have a pair of second fluid inlets and a pair of second fluid outlets.

[0067] In the exemplary embodiments of this disclosure, both the first fluid inlet and the second fluid inlet communicate with a first transport pipe, thereby ensuring that cooling fluid can be simultaneously introduced into the cooling piping of the cooling chamber and surface cooler within the electronic device using the first transport pipe. Both the first fluid outlet and the second fluid outlet communicate with a second transport pipe, thereby ensuring that the cooling fluid from the cooling piping of the cooling chamber and surface cooler within the electronic device can be simultaneously discharged using the second transport pipe.

[0068] Figure 13A shows a schematic rear view of a surface cooler of an exemplary embodiment of the present disclosure, Figure 13B shows a schematic side view of the surface cooler 1032 of an exemplary embodiment of the present disclosure, and Figure 13C shows a schematic front view of the surface cooler 1032 of an exemplary embodiment of the present disclosure. As shown in Figures 13A to 13C, the second intake port of the surface cooler 1032 of the exemplary embodiment of the present disclosure is opened at the rear end of the surface cooler 1032, and the rear end of the surface cooler 1032 has a fluid supply port 1302a and a fluid return port 1302b, with the fluid supply port 1302a being used as a second fluid inlet and the fluid return port 1302b being used as a second fluid outlet. As shown in Figure 13C, the second outlet of the surface cooler 1032 of the exemplary embodiment of the present disclosure is opened at the front end of the surface cooler 1032, and two rows of exhaust fans are fixed to the front end of the surface cooler 1032, with four exhaust fans in each row, and are used as an exhaust device 106.

[0069] To reduce the complexity of pipe laying, as shown in Figure 11B, the first fluid inlet, second fluid inlet, first fluid outlet, and second fluid outlet all face the same first channel 101. In this case, for the same stacked structure, the first transport pipe and the second transport pipe can be laid on the same side of the stacked structure. If there are multiple stacked structures, one group of transport pipes, including the first transport pipe and the second transport pipe, can be arranged in each stacked structure.

[0070] In actual application examples, the first and second transport pipelines of the exemplary embodiments of this disclosure can be implemented in the form of a liquid separation and collection device, which can be connected to a cooling water system in a machine room. The first transport pipeline corresponds to the main pipeline for liquid separation in the liquid separation and collection device, and the second transport pipeline corresponds to the main pipeline for liquid return in the liquid separation and collection device. As shown in Figures 11A and 11B, the first transport pipeline has a plurality of first branch ports 1051 which can be connected to the first fluid inlet of each electronic device and the second fluid inlet of the surface cooler, and the second transport pipeline has a plurality of second branch ports 1052 which can be connected to the first fluid outlet of each electronic device and the second fluid outlet of the surface cooler. Furthermore, controllable valves such as electromagnetic valves can be installed at each first branch port 1051 and / or second branch port 1052 to adjust the inflow and outflow rates of the cooling fluid, and to indirectly adjust the cooling structure of the electronic device and the cooling capacity of the surface cooler.

[0071] The cooling piping in the exemplary embodiment of this disclosure includes a plurality of main pipes and at least one connecting pipe, each connecting pipe connecting two adjacent main pipes. One of the plurality of main pipes connects to the first transport pipe as an inlet pipe, and another main pipe connects to the second transport pipe as an outlet pipe. The direction of extension of the main pipes in the exemplary embodiment of this disclosure can be set according to the actual situation. It should be understood that each main pipe extends along the distribution direction of the second intake and second outlet or along the height direction of the stacked structure. Here, for example, Each main pipe extends along the height direction of the stacked structure.

[0072] When the distribution direction of the second intake port and the second outlet port is the positive direction of the first preset direction, each main pipe in the transport piping is distributed along the positive direction of the first preset direction. In this case, along the height direction of the stacked structure, the cooling fluid in each main pipe can uniformly cool the hot air that has entered the cooler housing, and the cooling capacity of the cooling fluid in each main pipe decreases along the positive direction of the first preset direction. Because the second intake port and the second outlet port are distributed along the positive direction of the first preset direction, along the positive direction of the first preset direction, the hot air that has entered the cooler housing becomes colder and turns into cold air, and therefore, even if the cooling capacity of the cooling fluid in each main pipe decreases along the positive direction of the first preset direction, the supply of cold energy to cool the hot air can be ensured.

[0073] To accelerate the cooling rate of the hot air by the cooling fluid, each surface cooler further comprises a heat dissipation fin module provided within the cooler housing, the heat dissipation fin module being provided on the cooling pipe. The cooling fluid in the cooling pipe can transfer its cold energy to the heat dissipation fin module via the cooling pipe, and because the heat dissipation fin module has a large heat dissipation area, it provides a large surface contact area with the hot air, further improving the cooling efficiency of the surface cooler. For example, the heat dissipation fin module in the exemplary embodiment of this disclosure may be a fin-shaped heat dissipation module, or it may include a plurality of heat dissipation fins provided on the cooling pipe.

[0074] Figure 14 shows an electrical circuit diagram of an automated control system in an exemplary embodiment of the present disclosure. As shown in Figure 14, the data center cooling system in the exemplary embodiment of the present disclosure may further include a first sensing assembly 107 and a first control module 108 that communicates with the first sensing assembly. The first control module 108 further communicates with an exhaust system 106 and a surface cooler 1032, respectively. The communication method may be a conventional wired communication method or a wireless communication method.

[0075] Exemplary, the first sensing assembly is used to collect the temperature of at least one of the first intake port, the second intake port, the first outlet port, and the second outlet port. The first control module is used to acquire at least one temperature and, if it determines that at least one temperature matches a preset cooling condition, to increase the exhaust capacity of the exhaust system and / or the cooling capacity of the surface cooler. It should be understood that a temperature sensor or a humidity sensor can be installed at at least one of the first intake port, the second intake port, the first outlet port, and the second outlet port.

[0076] In one example, if at least one temperature includes the temperature of the first air intake, the temperature of the second air intake, the temperature of the first outlet, or the temperature of the second outlet, the preset cooling condition may be that at least one temperature is less than or equal to a preset temperature. The preset temperature may be a single fixed value or a range value.

[0077] If at least one temperature includes the temperature of the first air intake or the temperature of the second outlet, the temperature of the cold air entering the electronic device or the temperature of the cold air introduced into the second channel from the surface cooler is detected. In this case, the preset temperature may be 45°C. If at least one temperature includes the temperature of the second air intake or the temperature of the first outlet, the temperature of the hot air introduced into the first channel from the electronic device or the temperature of the hot air entering the surface cooler is detected. In this case, the preset temperature may be 65°C.

[0078] In another example, when at least one temperature includes the temperature of the first air intake and the temperature of the first outlet, the preset cooling condition is that the temperature difference between the first air intake and the first outlet is less than or equal to a preset temperature difference threshold. In other words, when the temperature difference between the first air intake and the first outlet is less than or equal to a preset temperature difference threshold, it means that the cool air provided by the surface cooler is not effectively cooling the heat-generating components inside the electronic equipment, and therefore it is necessary to increase the exhaust capacity of the exhaust system or increase the cooling capacity of the surface cooler, and further Sucking Air device Sucking Ki-power PowerIt can be increased simultaneously.

[0079] When at least one temperature includes the temperature of the second intake port and the temperature of the second outlet port, the preset cooling condition is that the temperature difference between the second intake port and the second outlet port is less than or equal to a preset temperature difference (e.g., 5°C). In other words, if the temperature difference between the second intake port and the second outlet port is less than the preset temperature difference, it means that the cooling capacity of the surface cooler is insufficient, and the exhaust capacity of the exhaust device can be increased, or the cooling capacity of the surface cooler can be increased, and further Sucking Air device Sucking Ki-power Power It can be increased simultaneously.

[0080] For example, when increasing the exhaust capacity of an exhaust system and / or the cooling capacity of a surface cooler, regardless of the pre-set cooling conditions used, the influence of ambient temperature can be considered. For instance, if the ambient temperature is high in summer, the cool air may rapidly heat up after being cooled by the surface cooler; therefore, the ambient temperature factor can be introduced into the adjustment of exhaust capacity and / or cooling capacity. For example, for the same temperature or temperature difference, the exhaust capacity of the exhaust system and / or the cooling capacity of the surface cooler may need to be appropriately increased in summer compared to winter to balance the influence of ambient temperature.

[0081] In practical applications, theoretical tuning parameters can be determined based on at least one temperature, and these theoretical tuning parameters can be corrected using correction parameters.

[0082] If the theoretical adjustment parameters include the theoretical adjustment parameters for the exhaust system, the correction parameters include ambient temperature correction parameters for the exhaust system; and if the theoretical adjustment parameters include the theoretical adjustment parameters for the surface cooler, the correction parameters include ambient temperature correction parameters for the surface cooler.

[0083] Here, when increasing the exhaust capacity of an exhaust device, taking an exhaust fan as an example, the exhaust capacity of the exhaust fan can be improved by increasing the rotational speed of the exhaust fan's drive motor. When increasing the cooling capacity of a surface cooler, the flow velocity of the cooling fluid at the second fluid inlet and second fluid outlet of the surface cooler can be accelerated. For example, the cooling capacity of the surface cooler can be improved by increasing the flow rate of the cooling fluid at the second fluid inlet and second fluid outlet by controlling the controllable valve at the first branch port connected to the second fluid inlet and / or the controllable valve at the second branch port connected to the second fluid outlet.

[0084] 2nd speech bubble Taking the temperature of the mouth as an example, the second speech bubble If the temperature of the opening is higher than the preset temperature, based on the relationship between the temperature and the flow rate control parameter of the cooling fluid, the second speech bubble It can be set up so that the flow velocity control parameters of the cooling fluid corresponding to the temperature of the inlet can be determined. Similarly, the temperature of the second intake port and the second speech bubble Taking the temperature of the mouth as an example, the second air intake and the second speech bubble When the temperature difference at the opening is higher than a preset temperature, the cooling fluid flow velocity control parameter can be determined based on the relationship between the temperature difference and the cooling fluid flow velocity control parameter.

[0085] Therefore, by selectively considering the effect of ambient temperature on the cooling fluid control parameters, it is possible to correct the cooling fluid control parameters using correction parameters related to ambient temperature to offset errors due to ambient temperature, or to directly use the cooling fluid control parameters to adjust the flow velocity of the surface cooler.

[0086] Considering that the ambient temperature is high in summer and surface coolers have difficulty cooling hot air, the cooling capacity of the surface cooler can be further increased. For example, when the ambient temperature is 30°C to 35°C, the first correction parameter of the cooling fluid adjustment parameter exists accordingly, and when the ambient temperature is higher than 35°C, the second correction parameter of the cooling fluid adjustment parameter exists accordingly, and the ability of the second correction parameter to correct the cooling fluid adjustment parameter is greater than the ability of the first correction parameter to correct the cooling fluid adjustment parameter. Assuming the ambient temperature is 38°C, after determining the cooling fluid velocity adjustment parameter, the second ambient temperature influence parameter is added to the cooling fluid velocity adjustment parameter to obtain the corrected cooling fluid velocity adjustment parameter.

[0087] The ambient temperature in winter low Considering this, a surface cooler can easily cool down hot air. but, The cooling capacity of the surface cooler moreover This can be reduced. For example, when the ambient temperature is between -15°C and -5°C, a corresponding third correction parameter exists for the cooling fluid's adjustment parameters, and when the ambient temperature is higher than -5°C and 5°C or lower, a corresponding fourth correction parameter exists for the cooling fluid's adjustment parameters, and the ability of the third correction parameter to correct the cooling fluid's adjustment parameters is greater than the ability of the fourth correction parameter to correct the cooling fluid's adjustment parameters. Assuming the ambient temperature is -8°C, after determining the cooling fluid's velocity adjustment parameters, the fourth ambient temperature influence parameter is subtracted from the cooling fluid's velocity adjustment parameters to obtain the corrected cooling fluid's velocity adjustment parameters.

[0088] Furthermore, the first control module of the exemplary embodiment of this disclosure can monitor the temperature of major heat-generating components of an electronic device such as a CPU or GPU. If the temperature of any one major heat-generating component in a particular electronic device exceeds a temperature limit (e.g., 80°C or above), the control module can rapidly cool the electronic device by increasing the opening of controllable valves at a first branch port connected to a first fluid inlet and a second branch port connected to a first fluid outlet of the electronic device. The method of cooling and the selection of the openings are described in detail here and can be found in related technologies.

[0089] Figure 15 shows an electrical circuit diagram of another automated control in an exemplary embodiment of the present disclosure. As shown in Figure 15, the data center cooling system in the exemplary embodiment of the present disclosure further includes a second sensing assembly 109 and a second control module 110 that communicates with the second sensing assembly 109, the second control module 110 further communicating with an exhaust device 106 and an air intake device 111, respectively, the communication method of which can be wired or wireless and can be selected according to the actual situation. The functions of the first and second control modules can be integrated and used as a control platform for the data center cooling system to optimize the performance of the data center cooling system.

[0090] A second sensing assembly in an exemplary embodiment of the present disclosure is used to collect pressure values ​​from a first channel and a second channel. A second control module is used to obtain the pressure values ​​from the first channel and the second channel and, if it determines that the pressure difference between the first channel and the second channel is greater than or equal to a preset pressure difference, to reduce the exhaust capacity of the exhaust device and / or the air intake capacity of the air intake device. The preset pressure difference may be 10% of standard atmospheric pressure, or less than 10% of standard atmospheric pressure, so that the pressure difference between the first channel and the second channel is as close as possible to 1 atmosphere. When the laminated structure is located within a sealed housing and the pressure difference is controlled within this range, the inside of the sealed housing does not easily leak, thereby reducing the possibility of heat exchange with the external environment.

[0091] In actual applications, the second sensing assembly may include multiple pressure sensors, divided into two groups, located in the first channel and the second channel, respectively. The pressure values ​​collected by each pressure sensor located in the first channel are the pressure values ​​of the first channel, and the pressure values ​​collected by each pressure sensor located in the second channel are the pressure values ​​of the second channel.

[0092] exhaust Device exhaust fan Includes , air suction device air suction fan including In some cases, the pressure difference between the first channel and the second channel can be controlled by adjusting the motor speed of the exhaust fan and / or air intake fan. For example, a correspondence between the pressure difference and the motor speed of the exhaust fan and / or air intake fan can be created. When the pressure difference between the first channel and the second channel is greater than or equal to a preset pressure difference, the target motor speed of the exhaust fan and / or air intake fan can be determined from the correspondence based on the pressure difference, and then the pressure difference between the first channel and the second channel can be controlled by controlling the motor speed of the exhaust fan and / or air intake fan based on the target motor speed.

[0093] The exemplary embodiments of this disclosure further provide a data center machine room which may include a data center cooling system for the exemplary embodiments of this disclosure, the beneficial effects of which can be found in the above description and will not be described in detail here.

[0094] In selectable configurations, the data center machine room in the exemplary embodiment of this disclosure includes a plurality of cabinets, which can be arranged according to actual needs. One or more of the cabinets may be one of the various cabinets described above. Any one of the examples It could also be used in a data center cooling system.

[0095] In an optional embodiment, the data center machine room of the exemplary embodiment of the present disclosure includes a plurality of stacked structures, the data center machine room is enclosed, and the plurality of stacked structures may be distributed in the manner shown in Figure 12, or in a manner similar to the principle shown in Figure 12.

[0096] In selectable forms, the data center machine room in the exemplary embodiment of the present disclosure may include one or more cabinets and one or more stacked structures, the cabinet structures may be conventional structures or various possible data center cooling systems as described above. The stacked structures may be various possible stacked structures as described above, and the cooling principles for the included electronic equipment can likewise refer to the relevant descriptions above.

[0097] Exemplary embodiments of this disclosure further disclose a data center cooling method applied to a data center cooling system of the exemplary embodiments of this disclosure. The data center cooling has a plurality of cooling cycles. Figure 16 shows a schematic flow diagram of each cooling cycle method of the exemplary embodiments of this disclosure. As shown in Figure 16, each cooling cycle is Each electronic device has a first outlet which discharges hot air to a first channel in step 201, Step 202 involves introducing hot air from the first channel into the surface cooler via a second air intake port in each surface cooler, and then cooling the hot air with the surface cooler. The second outlet of each surface cooler discharges cold air to the second channel in step 203, The first air intake of each electronic device includes step 204, which introduces cool air from a second channel into the electronic device and absorbs the heat dissipated from the internal assembly of the electronic device by the cool air.

[0098] In a selectable configuration, if the data center cooling system to which the data center cooling method of the exemplary embodiment of this disclosure is applied includes a first control module and a first sensing assembly, Figure 17 shows a schematic diagram of the interaction process between the first control module and the first sensing assembly of the exemplary embodiment of this disclosure. As shown in Figure 17, each cooling cycle is: The first sensing assembly collects the temperature of at least one of the first intake port, the second intake port, the first outlet port, and the second outlet port in step 301. The first control module further includes step 302 of acquiring at least one temperature and, if it determines that at least one temperature matches a preset cooling condition, increasing the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler.

[0099] For example, if at least one temperature includes the temperature of the first air intake, the temperature of the second air intake, the temperature of the first outlet, or the temperature of the second outlet, the preset cooling condition is that at least one temperature is less than or equal to a preset temperature.

[0100] When at least one temperature includes the temperature of the first air intake and the temperature of the first air outlet, the preset cooling condition is that the temperature difference between the first air intake and the first air outlet is less than or equal to a preset temperature difference.

[0101] If at least one temperature includes the temperature of the second air intake and the temperature of the second air outlet, the preset cooling condition is that the temperature difference between the second air intake and the second air outlet is less than or equal to a preset temperature difference.

[0102] Exemplary, the step of increasing the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler includes determining a theoretical adjustment parameter based on at least one temperature and correcting the theoretical adjustment parameter using a correction parameter.

[0103] If the theoretical adjustment parameters include theoretical adjustment parameters for the exhaust system, the correction parameters include ambient temperature correction parameters for correcting the exhaust system, and / or, if the theoretical adjustment parameters include theoretical adjustment parameters for the surface cooler, the correction parameters include ambient temperature correction parameters for the surface cooler.

[0104] In an optional embodiment, the data center cooling method of the exemplary embodiment of this disclosure is applied to a data center cooling system. The data center cooling system includes a second sensing module and a second control module. Figure 18 shows a schematic diagram of the interaction process between the second control module and the second sensing assembly of the exemplary embodiment of this disclosure. As shown in Figure 18, each of the cooling cycles is: The second sensing assembly collects the pressure difference between the first channel and the second channel in step 401, The second control module further includes step 402, which involves acquiring the pressure difference between the first channel and the second channel, and if it determines that the pressure difference is greater than or equal to a preset pressure difference, reducing the exhaust capacity of the exhaust device and / or the air intake capacity of the air intake device.

[0105] The data center cooling method in the exemplary embodiment of this disclosure can be referenced to the beneficial effects of the data center cooling system in the exemplary embodiment of this disclosure, and will not be described in detail here.

[0106] In the above description of embodiments, specific features, structures, materials, or characteristics can be combined in an appropriate manner in any one or more embodiments or examples.

[0107] The above is merely a specific embodiment of the present disclosure, and the scope of protection of the present disclosure is not limited thereto. All modifications and substitutions that are readily conceivable to a person skilled in the art within the technical scope disclosed herein should also fall within the scope of protection of the present disclosure. Accordingly, the scope of protection of the present disclosure should be subject to the scope of protection of the claims.

Claims

1. A cooling system for a data center, comprising a first channel and a second channel, wherein the cooling system for the data center includes a stacked structure located between the first channel and the second channel. The laminated structure includes at least one stacked electronic device and at least one surface cooler, each electronic device having a first intake port and a first outlet port, each surface cooler having a second intake port and a second outlet port, the first outlet port and the second intake port all facing one side of the first channel, and the first intake port and the second outlet port all facing one side of the second channel. The at least one electronic device includes a plurality of electronic devices, the at least one surface cooler includes a plurality of surface coolers, and the plurality of electronic devices and the plurality of surface coolers are distributed alternately. The data center cooling system further includes a plurality of exhaust devices and a plurality of air intake devices, one of the exhaust devices is installed at the first outlet of each surface cooler, and the air intake devices are located inside each electronic device, and the air intake devices and the exhaust devices are configured as engines for driving the circulation of cold air and hot air.

2. A cooling system for a data center according to claim 1, further comprising a first transport pipe and a second transport pipe, wherein each surface cooler has a cooler housing and cooling pipes provided within the cooler housing, a second intake port and a second outlet port are opened in the cooler housing, and the cooling pipes communicate with the first transport pipe and the second transport pipe, respectively.

3. The cooling system for a data center according to claim 2, wherein the cooling piping includes a plurality of main pipes and at least one connecting pipe, each of which the connecting pipe connects two adjacent main pipes, one of which main pipes connects to the first transport pipe, and the other main pipe connects to the second transport pipe.

4. Each of the surface coolers further comprises a heat dissipation fin module provided within the cooler housing, the heat dissipation fin module being provided on the cooling piping, the data center cooling system according to claim 2.

5. The data center cooling system according to claim 2, wherein each of the electronic devices has a cooling structure, the cooling structure has a cooling chamber, and the cooling chambers communicate with the first transport pipe and the second transport pipe, respectively.

6. The cooling structure has a first fluid inlet and a first fluid outlet communicating with the cooling chamber, and the cooler housing each has a second fluid inlet and a second fluid outlet communicating with the cooling piping. The cooling system for a data center according to claim 5, wherein both the first fluid inlet and the second fluid inlet communicate with the first transport piping, both the first fluid outlet and the second fluid outlet communicate with the second transport piping, and the first fluid inlet, the second fluid inlet, the first fluid outlet and the second fluid outlet all face the same first channel.

7. A cooling system for a data center according to claim 1, further comprising a sealed housing, wherein at least one group of the stacked structures is located within the sealed housing, the first channel and the second channel are alternately distributed within the sealed housing along a first predetermined direction, each group of the stacked structures is located between adjacent first and second channels, and the same group of the stacked structures comprises at least one stacked structure.

8. The data center cooling system according to claim 1, wherein each of the aforementioned electronic devices is a liquid-cooled electronic device, and each of the aforementioned surface coolers is a liquid-cooled surface cooler.

9. The system further includes a first sensing assembly and a first control module that communicates with the first sensing assembly, the first control module further communicates with the exhaust device and the surface cooler, respectively. The data center cooling system according to claim 8, wherein the first sensing assembly is used to collect the temperature of at least one of the first intake port, the second intake port, the first outlet port, and the second outlet port, and the first control module is used to acquire the at least one temperature and, if it determines that the at least one temperature matches a preset cooling condition, to increase the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler.

10. The system further includes a second sensing assembly and a second control module that communicates with the second sensing assembly, the second control module further communicating with the exhaust device and the air intake device, respectively. The data center cooling system according to claim 9, wherein the second sensing assembly is used to collect pressure values ​​of the first channel and the second channel, and the second control module is used to obtain the pressure values ​​of the first channel and the second channel and, if it determines that the pressure difference between the first channel and the second channel is greater than or equal to a preset pressure difference, to reduce the exhaust capacity of the exhaust device and / or the air intake capacity of the air intake device.

11. A data center machine room including the data center cooling system according to claim 1.

12. A method for cooling a data center, applicable to the data center cooling system described in claim 1, wherein the data center cooling method has a plurality of cooling cycles, and each of the cooling cycles is Each electronic device has a first outlet which discharges hot air to a first channel, The second air intake port of each surface cooler introduces the hot air from the first channel into the surface cooler, and the surface cooler cools the hot air. Each of the surface coolers has a second outlet which discharges cold air into the second channel, A method for cooling a data center, comprising the steps of: each of the electronic devices having a first air intake port introducing the cold air in the second channel into the electronic device and absorbing the heat dissipated from the internal assembly of the electronic device by the cold air.

13. The cooling method for the data center is applied to the data center cooling system described in claim 9, and each of the cooling cycles is The first sensing assembly includes the steps of collecting the temperature of at least one of the first air intake, the second air intake, the first outlet, and the second outlet, A method for cooling a data center according to claim 12, further comprising the steps of: first control module acquiring the at least one temperature and, if it determines that the at least one temperature matches a preset cooling condition, increasing the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler.

14. The at least one temperature includes the temperature of the first air intake, the temperature of the second air intake, the temperature of the first outlet, or the temperature of the second outlet, and the preset cooling condition is that the at least one temperature is less than or equal to the preset temperature, or The at least one temperature includes the temperature of the first air intake and the temperature of the first air outlet, and the preset cooling condition is that the temperature difference between the first air intake and the first air outlet is less than or equal to a preset temperature difference, or The method for cooling a data center according to claim 13, wherein the at least one temperature includes the temperature of the second air intake and the temperature of the second air outlet, and the preset cooling condition is that the temperature difference between the second air intake and the second air outlet is less than or equal to a preset temperature difference.

15. The step of increasing the exhaust capacity of the exhaust device and / or the cooling capacity of the surface cooler is, The steps include determining a theoretical adjustment parameter based on the at least one temperature and correcting the theoretical adjustment parameter using a correction parameter, The theoretical adjustment parameter includes the theoretical adjustment parameter of the exhaust system, and the correction parameter includes an ambient temperature correction parameter for correcting the exhaust system, and / or The method for cooling a data center according to claim 13, wherein the theoretical adjustment parameter includes the theoretical adjustment parameter of the surface cooler, and the correction parameter includes the ambient temperature correction parameter of the surface cooler.

16. The cooling method for the data center is applied to the data center cooling system described in claim 10, and each of the cooling cycles is The second sensing assembly includes the step of collecting pressure values ​​from the first channel and the second channel, A method for cooling a data center according to claim 12, further comprising the step of a second control module acquiring pressure values ​​of the first channel and the second channel, and if it determines that the pressure difference between the first channel and the second channel is greater than or equal to a preset pressure difference, reducing the exhaust capacity of the exhaust device and / or the air intake capacity of the air intake device.

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