Chip mounting fixtures and chip mounting process
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- SHENZHEN GREPOW BATTERY CO LTD
- Filing Date
- 2023-01-17
- Publication Date
- 2026-07-31
AI Technical Summary
【0013】 従来技術に比べて、本発明の有益な効果は以下の通りである。治具本体のチップ溝の位置にワイヤ溝を設計することにより、チップの加工が完了した後に、外部物体の助けを借りて、ワイヤ溝の位置を介して、加工された後のチップをチップ溝の位置から取り出すことができ、取り出し操作が便利であるという利点を有する。
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Abstract
Description
Technical Field
[0006] , ,
[0005]
[0001] The present invention relates to the technical field of chip fixtures, and particularly to chip mounting fixtures.
Background Art
[0002] In the process of chip processing, usually, pins need to be attached to the chip. Therefore, it is necessary to design a fixture for attaching the chip and the pins. A normal fixture includes an upper cover plate and a lower cover plate. This fixture uses the upper cover plate and the lower cover plate to fix and process the chip. However, the above fixture has a technical problem that it is difficult to take out the processed chip, so it needs to be improved.
Summary of the Invention
Problems to be Solved by the Invention
[0003] The technical problem to be solved by the present invention is to provide a chip mounting fixture that solves the problems proposed in the above background art for the defects existing in the above prior art.
Means for Solving the Problems
[0004] In order to solve the above technical problems, the technical solutions adopted by the present invention are as follows.
[0005] A chip mounting fixture, which comprises a fixture body. The fixture body is provided with chip grooves that are uniformly distributed in an array for accommodating chips. At the position of the chip grooves, wire grooves that are recessed inward are provided. The wire grooves extend to the outside of the chip grooves. Furthermore, the wire grooves between the chip grooves on the same straight line are connected.
[0006] Furthermore, it comprises a stopper piece attached to the fixture body. One or more solder paste grooves that fit the chip grooves are provided on the stopper piece.
[0007] Furthermore, there are two solder paste grooves corresponding to the positions of the chip grooves, and the two solder paste grooves are provided with a staggered position, and the two solder paste grooves form a pressing belt that spans the chip groove. Furthermore, the stopper piece is magnetically attached to and fixed to the jig body by magnetic attraction.
[0008] Furthermore, the device is equipped with a stopper jig, the stopper jig having one or more needle grooves that fit into the tip groove and are used to position a straight needle or a square needle.
[0009] A chip mounting process comprising the steps of: positioning a chip in the chip groove of a jig body; attaching a magnetic member to a stopper piece, magnetically attaching the stopper piece to the jig body; applying solder paste to the pad surface of the chip through the solder paste groove of the stopper piece to form a solder paste belt, and pressing the chip with a pressure belt formed between the solder paste grooves; positioning a stopper jig on the stopper piece, positioning a straight needle / square needle in the needle groove to mount it with the solder paste belt; and removing the chip from the jig after the above operations have been completed.
[0010] Furthermore, the straight or square needle is attached to the solder paste belt of the chip using surface mount technology.
[0011] Furthermore, the step of positioning the straight / square needles in the needle grooves and mounting them to the solder paste belt includes the step of designing the structure to gradually open the openings of the needle grooves.
[0012] Furthermore, pins are provided at the four corners of the stopper jig, and pin holes corresponding to the four corners of the stopper piece are provided. Positioning columns are provided at the four corners of the jig body, and the pins of the stopper jig pass through the pin holes of the stopper piece and engage with the positioning columns of the jig body to fix them in place. One or more concave hand grooves are provided in the jig body. [Effects of the Invention]
[0013] Compared to conventional technology, the beneficial effects of the present invention are as follows: By designing a wire groove at the position of the chip groove on the jig body, after the chip machining is complete, the machined chip can be removed from the chip groove position via the wire groove with the help of an external object, which has the advantage of convenient removal operation. [Brief explanation of the drawing]
[0014] [Figure 1] Figure 1 is a schematic diagram of the structure of the chip mounting jig in the embodiment. [Figure 2] Figure 2 is a schematic diagram of the structure of the jig body in the embodiment. [Figure 3] Figure 3 is a schematic diagram of a partially enlarged structure of Figure 2. [Figure 4] Figure 4 is a schematic diagram of the structure of the stopper piece in the embodiment. [Figure 5] Figure 5 is a schematic diagram of a partially enlarged structure of Figure 4. [Figure 6] Figure 6 is a schematic diagram of the structure of the stopper jig in the embodiment. [Figure 7] Figure 7 is a schematic diagram of a partially enlarged structure of Figure 6. [Figure 8] Figure 8 is a schematic diagram of the exploded structure of the mounting jig in the embodiment. [Figure 9] Figure 9 is a schematic diagram of the chip product structure. [Modes for carrying out the invention]
[0015] The present invention will be described in more detail below with reference to the drawings.
[0016] The embodiments described with reference to the drawings are exemplary for interpreting the present application and should not be understood as limiting the present application. It can be understood that in the description of the present application, terms such as "center", "vertical direction", "horizontal direction", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the drawings, and are only for the convenience of the description of the present application and the simplification of the description, and do not indicate or imply that the shown devices or elements must have a specific orientation and be configured and operated in a specific orientation, so it cannot be understood as limiting the present application.
[0017] In addition, the terms "first" and "second" are for the purpose of explaining the object and should not be understood as indicating or suggesting relative importance or implicitly indicating the quantity of the indicated technical features. Therefore, the features limited as "first" and "second" may explicitly or implicitly include one or more of such features.
[0018] In the description of the present application, unless specifically and clearly limited, "several" and "plural" mean two or more. In the present application, unless otherwise clearly defined and limited, terms such as "attachment", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediate medium, or a communication inside two elements.
[0019] A person skilled in the art can understand the specific meaning of the above terms in the present application according to the specific situation.
[0020] In this application, unless otherwise clearly defined and limited, for the first feature to be "above" or "below" the second feature, the first feature and the second feature may be in direct contact, or the first feature and the second feature may not be in direct contact but may be in contact through other features therebetween.
[0021] Also, for the first feature to be "above", "upper", and "upper side" of the second feature, it includes that the first feature is directly above or obliquely above the second feature, or only represents that the horizontal height of the first feature is higher than that of the second feature. For the first feature to be "below", "lower", and "lower side" of the second feature, it includes that the first feature is directly below or obliquely below the second feature, or only represents that the horizontal height of the first feature is smaller than that of the second feature.
[0022] In view of the technical problems existing in the background art, as shown in FIGS. 1 to 3, a chip mounting jig is provided, which includes a jig body 1. The jig body 1 is provided with chip grooves 2 that are uniformly distributed in an array for accommodating chips. At the position of the chip grooves 2, wire grooves 3 that are recessed inward are provided, and the wire grooves 3 extend to the outside of the chip grooves 2.
[0023] In this embodiment, the chip grooves 2 are recessed at a certain depth along the end face of the jig body 1. The depth of this recess is based on the thickness of the chip. The chip grooves 2 are provided on the jig body 1 so as to be distributed in an array. At the same time, rounded corners are designed at the four corners of the chip grooves 2 to avoid damage to the four corners of the chip during processing.
[0024] In order to facilitate the removal of the processed chips, wire grooves 3 are designed at the positions of the chip grooves 2. Wire grooves 3 are designed for each chip groove 2, and the length of the wire grooves 3 extends to the outside of the chip grooves 2. Or, the wire grooves 3 between the chip grooves 2 on the same straight line can be connected.
[0025] As shown in Figures 4 and 5, the chip mounting jig includes a stopper piece 4 attached to the jig body 1, and the stopper piece 4 is provided with one or more solder paste grooves 5 that fit the chip groove 2. The stopper piece 4 is used to apply solder paste to a specific position on the chip to form a solder paste belt, and the stopper piece 4 is added to improve the accuracy and quality of solder paste application.
[0026] In the embodiment described below, there are two solder paste grooves 5 corresponding to the positions of the tip grooves 2, the two solder paste grooves 5 are provided adjacent to each other, and the two solder paste grooves 5 are provided offset from each other, that is, the solder paste grooves 5 are provided in a front-to-back direction, there is a certain distance between adjacent solder paste grooves 5, a pressure belt 6 is formed on the upper surface of the stopper piece 4, and during use, the pressure belt 6 is positioned across the tip grooves 2, thereby applying pressure to the tip on the tip grooves 2 and further fixing the tip in the tip grooves 2.
[0027] The stopper piece 4 is magnetically attached to and fixed to the jig body 1 by magnetic attraction. A magnetic attraction structure can be designed on the stopper piece 4 and the jig body 1, allowing the stopper piece 4 to be quickly attached to the jig body 1 by magnetic attraction, thereby improving work efficiency.
[0028] As shown in Figures 6 to 8, the chip mounting jig includes a stopper jig 7, and the stopper jig 7 is provided with one or more needle grooves 8 that fit into the chip groove 2 and for positioning a straight needle or a square needle.
[0029] During implementation, the stopper jig 7 restricts the straight or square needle, and the needle groove 8 has a through structure. During use, due to the action of surface mount technology (SMT), the square or straight needle moves to the designated needle groove 8, passes through the needle groove 8, and engages with the solder paste-coated tip below. As shown in Figure 9, the chip product is produced using the above-described jig.
[0030] The following describes the actual operation process using the above-described chip mounting jig, which comprises a jig body 1, a stopper piece 4, and a stopper jig 7. The jig body 1, the stopper piece 4, and the stopper jig 7 have positioning holes at their four corners, pins are provided at the four corners of the stopper jig 7, pin holes corresponding to the four corners of the stopper piece 4 are provided, positioning columns are provided at the four corners of the jig body 1, and the pins of the stopper jig 7 pass through the pin holes of the stopper piece 4 and engage with the positioning columns of the jig body 1 to fix them in place.
[0031] A magnetic member having magnetic properties is attached to the jig body 1, and the stopper piece 4 can engage with the jig body 1 by magnetic attachment. The jig body has four recessed hand grooves to facilitate movement.
[0032] During use, the chip is placed in the chip groove 2 of the jig body 1, the stopper piece 4 is magnetically attached to the jig body 1, solder paste is applied to the pad surface of the chip through the solder paste groove 5 of the stopper piece 4 to form a solder paste belt, the pressing belt 6 formed between the solder paste grooves 5 presses the chip (since the solder paste belt of the chip includes two solder paste belts, two solder paste grooves 5 are required), the stopper jig 7 is placed on the stopper piece 4, and the straight needle / square needle is placed in the needle groove 8 using surface mount technology (SMT) and attached to the solder paste belt to complete the mounting, and the chip after the above operation is removed from the jig. The opening of the needle groove 8 is designed to open gradually, making it easy to attach the straight needle / square needle.
[0033] Unlike conventional mounting processes, the above operating process allows for more precise application of solder paste, resulting in more accurate mounting positions and improved overall quality of the processed chip.
[0034] The above does not limit the technical scope of the present invention, and any modifications, equivalent substitutions, and alterations made to the above embodiments based on the technical essence of the present invention fall within the scope of the technical solutions of the present invention. [Explanation of Symbols]
[0035] 1. Jig body, 2. Chip groove, 3. Wire groove, 4. Stopper piece, 5. Solder paste groove, 6. Pressure belt, 7. Stopper jig, 8. Needle groove, 9. Tips, 10. Square needle, 11. Straight needle.
Claims
1. A chip mounting jig comprising a jig body, the jig body provided with uniformly distributed chip grooves for accommodating chips, wire grooves recessed inward at the positions of the chip grooves, and the wire grooves extending to the outside of the chip grooves, The jig body is further equipped with a stopper piece, the stopper piece is provided with one or more solder paste grooves that fit the tip groove, there are two solder paste grooves corresponding to the positions of the tip grooves, the two solder paste grooves are offset from each other, and a pressing belt is formed between the two solder paste grooves, spanning the tip groove. A chip mounting jig characterized by comprising a stopper jig, wherein the stopper jig is provided with one or more needle grooves that fit the chip groove and are for arranging a straight needle or a square needle.
2. The chip mounting jig according to claim 1, characterized in that the wire grooves between the chip grooves that are on the same straight line are in communication with each other.
3. The chip mounting jig according to claim 1, characterized in that the stopper piece is magnetically attached to and fixed to the jig body by magnetic attraction.
4. Chip mounting process, A chip mounting process characterized by including the steps of: positioning the chip in the chip groove of the jig body; providing a magnetic member on a stopper piece, magnetically attaching the stopper piece to the jig body; applying solder paste to the pad surface of the chip through the solder paste groove of the stopper piece to form a solder paste belt; pressing the chip with a pressure belt formed between the solder paste grooves; positioning a stopper jig on the stopper piece; positioning a straight needle / square needle in the needle groove and mounting it with the solder paste belt; and removing the chip from the jig after all the above steps have been completed.
5. The chip mounting process according to claim 4, characterized in that a straight needle or a square needle is attached to the position of the solder paste belt on the chip by surface mounting technology.
6. The chip mounting process according to claim 4, characterized in that the straight needle / square needle is positioned at the needle groove and attached to the solder paste belt to complete the mounting, and the structure is designed to gradually open the opening of the needle groove.
7. The chip mounting process according to claim 4, characterized in that pins are provided at the four corners of the stopper jig, pin holes corresponding to the four corners of the stopper piece are provided, positioning columns are provided at the four corners of the jig body, the pins of the stopper jig pass through the pin holes of the stopper piece and engage with the positioning columns of the jig body to fix them in place, and one or more concave hand grooves are provided in the jig body.