Repeater, communication cable assembly, and method for manufacturing a repeater

JP7898642B1Active Publication Date: 2026-07-31HIRAKAWA HEWTECH
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
HIRAKAWA HEWTECH
Filing Date
2026-01-27
Publication Date
2026-07-31

AI Technical Summary

Benefits of technology

【0013】 本発明によれば、耐久性及びシールド性に優れた中継器及びそれを用いた通信ケーブルアッセンブリ、及び中継器の製造方法を提供することができる。

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Abstract

The present invention provides a repeater with excellent durability and shielding, a communication cable assembly using the same, and a method for manufacturing the repeater. [Solution] The repeater 1 is a repeater that electrically connects a first communication cable 10A and a second communication cable 10B without using a connector to relay signal transmission, and comprises a relay board 2 to which one end of each of the first communication cable 10A and the second communication cable 10B is connected, an inner resin molded body 3 which is resin-molded on the outside of the relay board 2 with the first communication cable 10A and the second communication cable 10B connected, a copper foil cover 5 which covers the outside of the inner resin molded body 3, and an outer molded body 6 which is resin-molded on the outside of the copper foil cover 5.
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Description

Technical Field

[0001] The present invention relates to a repeater, a communication cable assembly, and a method for manufacturing a repeater.

Background Art

[0002] In recent years, transmission cables that can reduce costs and improve transmission characteristics have been proposed (see, for example, Patent Document 1).

[0003] One of the interface standards, the USB (Universal Serial Bus) standard, has been formulated in various ways to date, and the maximum transfer speed has been improved. For example, in USB1.0 and USB1.1, it is 12 Mbps, in USB2.0 it is 480 Mbps, in USB3.0 it is 5 Gbps, in USB3.1 it is 10 Gbps, and in USB3.2 it is 20 Gbps. On the other hand, regarding connectors, Type-A and Type-B were defined, but since USB3.1, a reversible Type-C connector has been defined.

[0004] In addition, cables for USB have become capable of various communications with a single cable, and for this purpose, the configuration of the core wires has become complicated and the number of core wires has increased. For example, 4 cores are recommended for USB2.0, 8 cores for USB3.0, and 15 cores for USB Type-C.

[0005] The transmission cable described in Patent Document 1 is a transmission cable compliant with the USB Type-C standard, and is a 17-core cable including eight coaxial lines (for 10 Gbps transmission), four signal lines (first SBU line, second SBU line, CC line, and Vconn line), one power line, two ground lines, and a pair of twisted pair lines.

[0006] Transmission cables conforming to the conventional USB Type-C standard are dominant in many countries as charging cables for smartphones. Furthermore, there is a growing movement to adopt the USB Type-C standard as power and communication cables not only for smartphones, but also for PCs, other communication devices, and imaging devices. This is not to standardize cable characteristics, but rather to improve convenience by standardizing the connector plug (mating part) and the receptacle of the connected device. On the other hand, the USB Type-C standard defines specifications for both the cable and the connector. Due to the constraints on the circuit board size of the connector conforming to the USB Type-C standard, there are also constraints on the cable outer diameter (cable diameter). As a result, the conductor cross-sectional area of ​​each core wire cannot be increased, and there is a problem that communication quality deteriorates when the cable length is long.

[0007] Therefore, cables that amplify signals using repeaters placed in the middle of the cable (active repeater cables) have been put into practical use (see, for example, Non-Patent Document 1). This cable has a structure that allows a USB Type-C connector to be connected to the repeater, and the repeater amplifies both high-speed signals (5Gbps) and low-speed signals (480Mbps). [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2017-10747 [Non-patent literature]

[0009] [Non-Patent Document 1] https: / / www.sanwa.co.jp / product / syohin?code=KB-USB-R310 [Overview of the project] [Problems that the invention aims to solve]

[0010] However, conventional active repeater cables have a structure in which a pair of cables and the repeater are connected by a connector, resulting in signal attenuation at the contact points of the signal lines in the cables. Furthermore, durability due to repeated plugging and unplugging of the connectors is also a problem. In addition, for cables transmitting high-frequency signals, not only the cables but also the repeaters require high shielding capabilities.

[0011] The object of the present invention is to provide a repeater with excellent durability and shielding, a communication cable assembly using the same, and a method for manufacturing the repeater. [Means for solving the problem]

[0012] [1] A relay device that electrically connects a first communication cable and a second communication cable without using a connector to relay signal transmission, A circuit board to which one end of the first communication cable and the second communication cable are connected, An inner molded body formed by resin molding on the outside of the substrate with the first communication cable and the second communication cable connected, A shield member that covers the outside of the inner molded body, The shield member comprises an outer molded body formed from resin on the outside. 、 The substrate has a plurality of openings for positioning relative to the inner molded body, The inner molded body has a plurality of positioning holes that communicate with the plurality of openings and reach the outer surface of the inner molded body. Repeater. [2] The repeater according to [1], wherein the shielding member is formed from metal foil. [ 3 The opening is a notch formed on the side surface of the substrate, the [ 1 The repeater described in [ ]. [ 4 The first communication cable and the second communication cable, The first communication cable and the second communication cable are electrically connected without using connectors to relay signal transmission. [1] to [ 3 A communication cable assembly comprising a repeater as described in any one of the following: [ 5A method for manufacturing a repeater that electrically connects a first communication cable and a second communication cable without using a connector to relay signal transmission, a connecting step of connecting one end of each of the first communication cable and the second communication cable to a substrate; a first forming step of forming an inner molded body by resin molding on the outside of the substrate in a state where the first communication cable and the second communication cable are connected; , and position the substrate a second forming step of covering the outside of the inner molded body with a shield member; a third forming step of forming an outer molded body by resin molding on the outside of the shield member, and including fruit, The substrate has a plurality of notches formed on its side surface as positioning openings for the inner molded body. The first forming step is a step of forming the inner molded body by injecting molten resin into the cavity of the inner molded body mold while the substrate is positioned relative to the inner molded body mold using positioning pins, The positioning pin comprises a base portion that is inserted into a hole formed in the inner mold for the molded body, a tip portion that is inserted into the notch portion of the substrate, and a support portion that supports the main surface of the substrate. A method for manufacturing a repeater.

Effect of the Invention

[0013] According to the present invention, it is possible to provide a repeater excellent in durability and shielding properties, a communication cable assembly using the same, and a method for manufacturing a repeater.

Brief Description of the Drawings

[0014] <000009X> [Figure 1] FIG. 1 is a diagram showing an example of a communication cable assembly according to an embodiment of the present invention. [Figure 2] FIG. 2 shows an example of the external shape of a repeater according to an embodiment of the present invention, (a) is a plan view, and (b) is a front view. [Figure 3] FIG. 3 shows a cross-sectional view of FIG. 2, (a) is a cross-sectional view taken along line A-A of FIG. 2(a), (b) is a cross-sectional view taken along line B-B of FIG. 2(b), and (c) is a cross-sectional view taken along line C-C of FIG. 3(b). [Figure 4] FIG. 4 shows a schematic configuration example of a relay substrate, (a) is a plan view, (b) is an enlarged view of part D of (a), (c) is a front view, and (d) is a plan view showing a modified example. [Figure 5]Figure 5 shows an example of the external shape of the inner resin molded body, where (a) is a plan view and (b) is a front view. [Figure 6] Figure 6 shows an example of a copper foil cover that covers the outside of an inner resin molded body, where (a) is a top view, (b) is a front view, and (c) is a bottom view. [Figure 7] Figure 7(a) is a schematic cross-sectional view showing an example of a mold for an inner molded body, and Figure 7(b) is a perspective view of the main parts showing the intermediate substrate positioned with positioning pins. [Figure 8] Figure 8 is a schematic cross-sectional view corresponding to the EE line in Figure 6(c), showing an example of a mold for an outer molded body. [Modes for carrying out the invention]

[0015] Embodiments of the present invention will be described below with reference to the drawings. In each drawing, components having substantially the same function are denoted by the same reference numerals, and their redundant descriptions are omitted.

[0016] [Embodiment] Figure 1 shows an example of a communication cable assembly according to an embodiment of the present invention. This communication cable assembly 100 comprises a first communication cable 10A, a second communication cable 10B, a repeater 1 connecting the first communication cable 10A and the second communication cable 10B, a first connector 110A connected to one end of the first communication cable 10A, and a second connector 110B connected to one end of the second communication cable 10B. The other end of the first communication cable 10A is connected to one side of the repeater 1, and the other end of the second communication cable 10B is connected to the other side of the repeater 1. When referring to the first communication cable 10A and the second communication cable 10B collectively, they are hereinafter referred to as communication cable 10. The first connector 110A and the second connector 110B are also called the first plug connector and the second plug connector, respectively, and when referring to them collectively, they are hereinafter referred to as connector 110.

[0017] The communication cable 10 conforms to the USB Type-C standard. The communication cable 10 may have, for example, signal lines for transmitting high-speed differential signals (e.g., 5Gbps) and signal lines for transmitting low-speed differential signals (e.g., 480Mbps), but it does not necessarily have to conform to the USB Type-C standard. High-speed differential signals are an example of high-frequency signals.

[0018] The first connector 110A is connected to a receptacle provided on, for example, a computer (hereinafter referred to as the first device), and comprises a housing 111, a plug 112 provided so as to be exposed from the housing 111, and a connector board 200 disposed inside the housing 111. The connector board 200 of the first connector 110A electrically connects the plug 112 to one end of the first communication cable 10A. The plug 112 is an example of a mating portion.

[0019] The second connector 110B is connected to a receptacle provided on, for example, a peripheral device (hereinafter referred to as the second device), and uses the same connector as the first connector 110A. That is, the second connector 110B comprises a housing 111, a plug 112 provided so as to be exposed from the housing 111, and a connector board 200 disposed inside the housing 111. The connector board 200 of the second connector 110B electrically connects the plug 112 to one end of the second communication cable 10B.

[0020] The first and second devices connected to the first connector 110A or the second connector 110B include, for example, personal computers, tablet terminals, smartphones, digital cameras, printers, mice, earphones, USB memory devices, and chargers. The devices may also have charging capabilities. The first and second devices are, for example, compliant with the USB PD (Power Delivery) standard and have a PD control unit. The PD control unit performs PD communication compliant with the USB PD standard.

[0021] In this embodiment, as shown in Figure 1, the first connector 110A and the second connector 110B use the same connector, but different connectors may be used. For example, the first connector 110A or the second connector 110B may include a housing equipped with screws for preventing the connector from coming loose, a plug provided so as to be exposed from the housing, and a connector board 200 arranged inside the housing. Also, in this embodiment, the connector board 200 of the first connector 110A and the connector board 200 of the second connector 110B use the same board, but different boards may be used for each. Furthermore, a cable (USB Type-C legacy cable) may be used in which one of the first connector 110A and the second connector 110B conforms to the Type-C standard, and the other conforms to the Type-A standard, Type-B standard, or microType-B standard. Furthermore, if the communication cable 10 does not use CC wire, the first connector 110A and the second connector 110B may conform to the Type-A standard, Type-B standard, microType-A standard, or microType-B standard.

[0022] (Repeater configuration) Figure 2 shows an example of the external shape of a repeater according to an embodiment of the present invention, where (a) is a plan view and (b) is a front view. Figure 3 shows a cross-sectional view of Figure 2, where (a) is a cross-sectional view along line AA in Figure 2(a), (b) is a cross-sectional view along line BB in Figure 2(b), and (c) is a cross-sectional view along line CC in Figure 3(b). This repeater 1 relays signal transmission by electrically connecting the first communication cable 10A and the second communication cable 10B without using connectors. In other words, the repeater 1 electrically connects the first communication cable 10A and the second communication cable 10B via a connection structure other than a connector, that is, a structure that directly connects the conductive parts such as the conductors of the wires of the first communication cable 10A and the second communication cable 10B to the conductive parts such as the terminals of the repeater board 2 (for example, soldering). The repeater board 2 is also called an active board and is equipped with a chip that improves signal degradation. This chip will be described later.

[0023] The repeater 1 comprises a repeater board 2 to which one end of each of the first communication cable 10A and the second communication cable 10B is connected, an inner resin molded body 3 molded in resin on the outside of the repeater board 2 with the first communication cable 10A and the second communication cable 10B connected, a copper tape 4 wrapped around predetermined positions on the first communication cable 10A and the second communication cable 10B, a copper foil cover 5 covering the outside of the inner resin molded body 3, and an outer resin molded body 6 molded in resin on the outside of the copper foil cover 5. The repeater board 2 is an example of a board. The inner resin molded body 3 is an example of an inner molded body. The copper tape 4 is an example of a metal tape. The copper foil cover 5 is an example of a shielding member or metal foil. The outer resin molded body 6 is an example of an outer molded body.

[0024] The inner resin molded body 3 may be formed, for example, from a flexible resin material (e.g., flexible polyvinyl chloride, thermoplastic polyurethane, polyethylene, polyimide, polyamide, nylon, etc., or thermoplastic elastomers thereof) by resin molding (e.g., injection molding, compression molding, extrusion molding, calendering, transfer molding, lamination molding, etc.).

[0025] The outer resin molded body 6 may be formed, for example, from a flexible resin material (e.g., flexible polyvinyl chloride, thermoplastic polyurethane, polyethylene, polyimide, polyamide, nylon, etc., or thermoplastic elastomers thereof) by resin molding (e.g., injection molding, compression molding, extrusion molding, calendering, transfer molding, lamination molding, etc.).

[0026] By forming the inner resin molded body 3 and the outer resin molded body 6 from a flexible resin material, the repeater 1 can be made flexible, thereby reducing the load on the first communication cable 10A and the second communication cable 10B when they are routed. Furthermore, by forming the inner resin molded body 3 and the outer resin molded body 6 by injection molding, it becomes possible to stably mass-produce products of the same quality.

[0027] The copper tape 4 is formed from copper foil, and its thickness is preferably 0.03 mm or more and 0.1 mm or less in order to provide shielding. The metal tape is not limited to copper tape; aluminum tape or the like may also be used. The copper tape 4 may be attached to the surface of the sheath of the communication cable 10 using an adhesive and wrapped around it.

[0028] The copper foil cover 5 is formed from copper foil, and its thickness is preferably 0.03 mm or more and 0.1 mm or less in order to provide shielding properties. By using copper foil as the material for the copper foil cover 5, it is easy to manufacture the copper foil cover 5 to match the individual surface shapes of the inner resin molded body 3. Note that the copper foil cover 5 is not limited to copper foil, but may be formed from metal foil such as aluminum foil. The copper foil cover 5 may be bonded to the surface of the inner resin molded body 3 with an adhesive, or an adhesive-backed copper foil tape may be attached to the surface of the inner resin molded body 3. Alternatively, the copper foil cover 5 may be joined to the copper tape 4 by soldering or conductive adhesive.

[0029] (Configuration of the relay board) Figure 4 shows a schematic example of the relay board configuration, where (a) is a plan view, (b) is an enlarged view of section D in (a), (c) is a front view, and (d) is a plan view showing a modified example. The relay board 2 is, for example, compliant with the USB Type-C standard, but may also be one that does not comply with the USB Type-C standard.

[0030] The relay board 2 has a rectangular shape, and multiple terminals (not shown) are formed on one longitudinal end of the front surface 2a and back surface 2b to which signal lines of the first communication cable 10A are connected, and multiple terminals (not shown) are formed on the other longitudinal end of the front surface 2a and back surface 2b to which signal lines of the second communication cable 10B are connected. The front surface 2a and back surface 2b are examples of main surfaces.

[0031] Furthermore, a first chip 21 for improving signal degradation of the high-speed differential signal of the first communication cable 10A and a second chip 22 for improving signal degradation of the low-speed differential signal are mounted on the front surface 2a of the relay board 2. Note that either or both of the first chip 21 and the second chip 22 may be mounted on the back surface 2b of the relay board 2. For example, the first chip 21 may be mounted on one of the front surface 2a and the back surface 2b of the relay board 2, and the second chip 22 on the other.

[0032] As shown in Figures 3(a) and 3(b), multiple semicircular notches 2c (for example, with a radius of about 0.7 mm) are formed on the side surface of the relay substrate 2 for positioning the relay substrate 2 relative to the inner resin molded body 3. The shape of the notches 2c is not limited to semicircular shapes, but may also be rectangular, triangular, or other shapes. In addition, the notches 2c for positioning may also be multiple through holes 2d that penetrate the front surface 2a and back surface 2b of the relay substrate 2, as shown in Figure 4(d). The shape of the through holes 2d is not limited to circular shapes, but may also be rectangular, triangular, or other shapes. The notches 2c and through holes 2d are examples of openings for positioning. Compared to through holes 2d, the notches 2c are less likely to interfere with the wiring pattern of the relay substrate 2, and openings for positioning can be easily provided.

[0033] The first chip 21 improves degradation due to attenuation of high-speed differential signals (e.g., 5 Gbps) when transmitting high-speed differential signals (e.g., 5 Gbps) through the communication cable 10. The second chip 22 improves degradation due to attenuation of low-speed differential signals (e.g., 480 Mbps) when transmitting low-speed differential signals (e.g., 480 Mbps) through the communication cable 10.

[0034] (Manufacturing method for communication cable assemblies and repeaters) Next, an example of a method for manufacturing the communication cable assembly 100 and the repeater 1 will be described with reference to Figures 5 to 8. Figure 5 shows an example of the external shape of the inner resin molded body, where (a) is a plan view and (b) is a front view. Figure 6 shows an example of a copper foil cover that covers the outside of the inner resin molded body, where (a) is a plan view, (b) is a front view and (c) is a bottom view. Figure 7(a) is a schematic cross-sectional view showing an example of a mold for the inner molded body, and Figure 7(b) is a perspective view of the main part showing the repeater substrate positioned with positioning pins. Figure 8 is a schematic cross-sectional view corresponding to the EE line in Figure 6(c) showing an example of a mold for the outer molded body.

[0035] (1) Connection of the first and second communication cables to the relay board The conductors at one end of each of the first communication cable 10A and the second communication cable 10B are exposed and soldered to terminals (not shown) on the relay board 2 to connect them. Next, a copper tape 4 of a predetermined thickness (for example, 0.07 mm) is attached to predetermined positions (see Figures 3, 5, and 6) of the first communication cable 10A and the second communication cable 10B using adhesive and wrapped around them. The predetermined positions of the copper tape 4 are, for example, positions where the copper foil cover 5 can come into contact with the copper tape 4.

[0036] (2) Positioning of the relay board With the first communication cable 10A and the second communication cable 10B connected, the relay board 2 is placed on the lower mold 7A of the inner molded body mold, as shown in Figure 7(a). At this time, positioning pins 73 are inserted into the four holes 71a formed in the lower mold 7A of the inner molded body mold, corresponding to the positioning holes 31 shown in Figure 3(c). Also, positioning hole forming pins 74 are inserted into the two holes 71b formed in the center of the lower mold 7A of the inner molded body mold. Note that the number of holes 71b and positioning hole forming pins 74 is not limited to two, but may be three or more. By using three or more, the inner resin molded body 3 can be stably positioned relative to the outer molded body mold 8 (see Figure 8).

[0037] As shown in Figure 7(b), the positioning pin 73 is formed by tapering the tip of a cylindrical body portion 73a with a diameter of approximately 2 mm to a diameter of approximately 1.4 mm, creating a machined portion 73b and a shoulder portion 73c (also called a stepped pin). By inserting the machined portion 73b into a notch portion 2c with a radius of approximately 0.7 mm in the intermediate substrate 2, the shoulder portion 73c can support the back surface 2b of the intermediate substrate 2. Even when a flat structure is adopted for the intermediate substrate 2, without concave or convex surfaces on the front surface 2a and back surface 2b, as in this embodiment, the intermediate substrate 2 can be supported by devising the pin shape. The portion of the positioning pin 73 that is inserted into the hole 71a in the body portion 73a is an example of the base end. The machined portion 73b is an example of the tip. The shoulder portion 73c is an example of the support portion.

[0038] Furthermore, a hole for inserting a positioning pin may be formed in the upper mold 7B, and the positioning pin may be made to have a length from the hole 71a of the lower mold 7A to the hole of the upper mold 7B, with the intermediate portion processed to a smaller diameter, and the intermediate portion may be inserted into the notch 2c of the intermediate substrate 2. This ensures that the intermediate substrate 2 is positioned correctly in the vertical direction. Alternatively, a structure may be used in which multiple protrusions and recesses are added to the intermediate substrate 2 to hold it in place.

[0039] (3) Formation of the inner resin molded body With the first communication cable 10A and the second communication cable 10B connected, an inner resin molded body 3 is formed on the outside of the relay board 2, for example, by injection molding. This process is also called the first forming process. Specifically, the lower mold 7A and upper mold 7B of the inner molded body mold are joined together, molten first resin is injected into the cavity (first space) 72 between the lower mold 7A and upper mold 7B of the inner molded body mold, and after the first resin cools and solidifies, the solidified molded product is released from the inner molded body mold 7. As a result, the inner resin molded body 3 is formed with the first communication cable 10A and the second communication cable 10B connected to the terminals of the relay board 2. In addition, a positioning hole 31 is formed corresponding to the positioning pin 73, communicating with the notch 2c of the relay board 2 and reaching the outer surface of the inner resin molded body 3. Also, a positioning hole 32 is formed corresponding to the positioning hole forming pin 74 and reaching the outer surface of the inner resin molded body 3. Furthermore, it is preferable to mold the inner resin molded body 3 at low pressure (for example, by injection molding) so as not to damage the first chip 21 and the second chip 22 mounted on the relay substrate 2.

[0040] (4) Formation of copper foil cover Next, as shown in Figure 6, the outside of the inner resin molded body 3 is covered with a copper foil cover 5 of a predetermined thickness (for example, 0.07 mm), and the copper foil cover 5 is soldered to the copper tape 4. This step is also called the second forming step.

[0041] (5) Formation of the outer resin molded body Next, an outer resin molded body 6 is formed on the outside of the copper foil cover 5, for example, by injection molding. This step is also called the third forming step. Specifically, as shown in Figure 8, with the first communication cable 10A and the second communication cable 10B connected, the inner resin molded body 3 covered with the copper foil cover 5 is placed on the lower mold 8A of the outer molded body mold, and the upper mold 8B of the outer molded body mold is brought into place. At this time, positioning pins 83 are inserted into the two holes 81a formed in the center of the lower mold 8A of the outer molded body mold and into the holes 32 of the inner resin molded body 3, respectively, to position the inner resin molded body 3 relative to the outer molded body mold 8. For example, a straight pin with the same outer diameter along its entire length is used as the positioning pin 83. The positioning pin 83 may be tapered, with its outer diameter becoming smaller towards the relay substrate 2, to facilitate demolding.

[0042] Next, molten second resin is injected into the cavity (second space) 82 between the lower mold 8A and the upper mold 8B of the outer molded body mold. After the second resin cools and solidifies, it is released from the solidified outer molded body mold. This forms the outer resin molded body 6 with the first communication cable 10A and the second communication cable 10B connected.

[0043] Next, the communication cable assembly 100 is completed by connecting the connectors 110 to the ends of the first communication cable 10A and the second communication cable 10B that are opposite to the repeater 1.

[0044] (Effects of the embodiment) This embodiment provides the following effects. (a) Since the structure connects the first communication cable 10A and the second communication cable 10B to the repeater 1 directly without using connectors, the two cable plugs on both sides of the repeater board 2 and their molding process are unnecessary, and the two receptacles for mounting the repeater board are unnecessary, thus reducing costs. (b) Since the structure connects the first communication cable 10A and the second communication cable 10B to the repeater 1 directly without using connectors, there is no contact resistance in connector coupling and no deterioration in connector insertion and removal. In terms of electrical characteristics, it is superior in terms of attenuation characteristics (insertion loss), impedance fluctuations, and reflection characteristics (return loss). In other words, there is no signal attenuation at the contact points of the signal lines of the cables, and a repeater 1 with excellent electrical characteristics and durability can be provided. (c) Since a copper foil cover 5 is provided between the inner resin molded body 3 and the outer resin molded body 6, the shielding performance of the repeater 1 can be stably achieved. (d) Since multiple notches 2c formed on the side surface are used as positioning openings for the relay board 2, it is easy to form positioning openings without interfering with the wiring pattern of the relay board 2.

[0045] Although embodiments of the present invention have been described above, the embodiments of the present invention are not limited to those described above, and various modifications and implementations are possible. [Explanation of symbols]

[0046] 1…Repeater, 2…Repeater board, 2a…Front surface, 2b…Back surface, 2c…Notch, 2d…Through hole, 3…Inner resin molded body, 4…Copper tape, 5…Copper foil cover, 6…Outer resin molded body, 7…Mold for inner molded body, 7A…Lower mold for inner molded body, 7B…Upper mold for inner molded body, 8…Mold for outer molded body, 8A…Lower mold for outer molded body, 8B…Upper mold for outer molded body, 10…Communication cable, 10A…First communication cable, 10B…Second communication cable, 21…First 1 chip, 22...2nd chip, 31, 32...positioning holes, 71a, 71b...holes, 72...cavity, 73...positioning pin, 73a...main body, 73b...machined part, 73c...shoulder part, 74...positioning hole forming pin, 81a...hole, 82...cavity, 83...positioning pin, 100...communication cable assembly, 110...connector, 110A...first connector, 110B...second connector, 111...housing, 112...plug, 200...connector board

Claims

1. A relay device that electrically connects a first communication cable and a second communication cable without using connectors to relay signal transmission, A circuit board to which one end of the first communication cable and the second communication cable are connected, An inner molded body formed by resin molding on the outside of the substrate with the first communication cable and the second communication cable connected, A shield member that covers the outside of the inner molded body, The shield member comprises an outer molded body formed from resin on the outside, The substrate has a plurality of openings for positioning relative to the inner molded body, The inner molded body has a plurality of positioning holes that communicate with the plurality of openings and reach the outer surface of the inner molded body. Repeater.

2. The shield member is formed from metal foil. The repeater according to claim 1.

3. The opening is a notch formed on the side surface of the substrate. The repeater according to claim 1.

4. The first communication cable and the second communication cable, A relay device according to any one of claims 1 to 3, which electrically connects the first communication cable and the second communication cable without using a connector to relay signal transmission, A communication cable assembly equipped with [a specific feature / feature].

5. A method for manufacturing a relay device that relays signal transmission by electrically connecting a first communication cable and a second communication cable without using a connector, A connection step of connecting one end of the first communication cable and the second communication cable to the circuit board, A first forming step involves forming an inner molded body on the outside of the substrate by resin molding while the first communication cable and the second communication cable are connected and the substrate is positioned, A second forming step involves covering the outside of the inner molded body with a shielding member, The process includes a third forming step of forming an outer molded body on the outside of the shield member by resin molding, The substrate has a plurality of notches formed on its side surface as openings for positioning relative to the inner molded body. The first forming step is a step of forming the inner molded body by injecting molten resin into the cavity of the inner molded body mold while the substrate is positioned relative to the inner molded body mold using positioning pins, The positioning pin comprises a base portion that is inserted into a hole formed in the inner mold for the molded body, a tip portion that is inserted into the notch portion of the substrate, and a support portion that supports the main surface of the substrate. A method for manufacturing a repeater.