Surface treatment apparatus and film protective member

Abstract

To provide a surface treatment apparatus and a membrane protection member capable of preventing breakage of an ion conductive membrane.SOLUTION: An apparatus of the invention includes: a housing which is arranged opposite to an object to be treated and can form a liquid chamber therein; an electrode arranged in the housing; an ion conducting membrane arranged between the liquid chamber and the object to be treated; a first membrane protection member arranged between the object to be treated and the ion conducting membrane; and a power supply unit which applies a voltage between the electrode and the object to be treated, wherein the first membrane protection member includes a first membrane support portion that supports the ion conducting membrane; and by applying a voltage between the electrode and the object to be treated, the surface of the object is treated by electrolysis through the ion conducting membrane and the first membrane support portion.SELECTED DRAWING: Figure 1A

Description

Technical Field

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[0003]

[0001] The present invention relates to a surface treatment apparatus, a film protection member, and a surface treatment method.

Background Art

[0002] Conventionally, there has been known a film forming apparatus including an anode, a cathode, a solid electrolyte membrane disposed between the anode and the cathode, and a power supply unit that applies a voltage between the anode and the cathode to deposit metal ions contained inside the solid electrolyte membrane on the cathode side, thereby forming a metal film on the surface of a substrate (for example, Patent Document 1).

[0003] This film forming apparatus includes a solution storage unit that stores a solution containing metal ions between the anode and the solid electrolyte membrane. An opening is formed at the bottom of the solution storage unit, and the solid electrolyte membrane is disposed so as to cover the opening. Further, a moving unit is connected to the lid of the solution storage unit. The moving unit pressurizes the solid electrolyte membrane against the film forming region of the substrate by moving the solid electrolyte membrane together with the solution storage unit toward the substrate. Furthermore, the moving unit has a function of relatively moving the solid electrolyte membrane and the substrate so as to increase the distance between the solid electrolyte membrane of the metal film and the substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in conventional film deposition apparatuses, when the solid electrolyte membrane is not in contact with the substrate, the weight of the solution contained in the solution container acts on the solid electrolyte membrane, causing it to deform and break. Therefore, it is necessary to supply the solution to the solution container while the solid electrolyte membrane is in contact with the substrate, and then separate the solid electrolyte membrane from the substrate after the solution is discharged. Furthermore, because the solid electrolyte membrane is in direct contact with the substrate, there is a problem that the solid electrolyte membrane is prone to tearing when it is separated from the substrate.

[0006] This invention has been made in view of these problems, and aims to provide a surface treatment apparatus, a film protective member, and a surface treatment method that can prevent damage to ion-conducting films. [Means for solving the problem]

[0007] The surface treatment apparatus according to the present invention comprises a housing positioned opposite a workpiece and capable of forming a liquid chamber inside; an electrode disposed within the housing; an ion-conducting membrane disposed between the liquid chamber and the workpiece; a first membrane protective member disposed between the workpiece and the ion-conducting membrane; and a power supply unit that applies a voltage between the electrode and the workpiece, wherein the first membrane protective member includes a first membrane support portion that supports the ion-conducting membrane, and the surface of the workpiece is treated by electrolysis via the ion-conducting membrane and the first membrane support portion by applying a voltage between the electrode and the workpiece.

[0008] In the surface treatment apparatus according to the present invention, the first film support portion may be a porous member.

[0009] In the surface treatment apparatus according to the present invention, the ion conductive film and the first film protective member may be attached to the housing.

[0010] In the surface treatment apparatus according to the present invention, the first film protective member may further include a covering portion for covering the untreated portion of the workpiece.

[0011] In the surface treatment apparatus according to the present invention, the first film protective member is further provided with an energizing portion on the side of the coating portion that is being treated, and the energizing portion may be arranged to be in contact with a part of the surface of the workpiece so as to provide electrical conductivity between the power supply portion and the surface of the workpiece.

[0012] In the surface treatment apparatus according to the present invention, the coated portion may have water-repellent properties.

[0013] In the surface treatment apparatus according to the present invention, the surface of the first film support portion may be insulated.

[0014] In the surface treatment apparatus according to the present invention, the first film support portion may be bonded to the surface of the ion-conducting film facing the workpiece.

[0015] The surface treatment apparatus according to the present invention further comprises a second film protective member disposed on the liquid chamber side of the ion conductive film, the second film protective member being provided opposite the ion conductive film and including a second film support portion that can pass through the solution in the liquid chamber, and the ion conductive film may be sandwiched between the first film support portion and the second film support portion.

[0016] In the surface treatment apparatus according to the present invention, the second film support portion may be adhered to the liquid chamber side surface of the ion conductive film.

[0017] The film protection member according to the present invention is a film protection member used in a surface treatment apparatus that processes the surface of a workpiece by electrolysis through the ion conduction membrane by applying a voltage between the electrode and the workpiece, comprising a housing positioned opposite the workpiece and capable of forming a liquid chamber inside, an electrode disposed within the housing, an ion conduction membrane disposed between the liquid chamber and the workpiece, and a power supply unit that applies a voltage between the electrode and the workpiece, wherein the film protection member comprises a film support portion that supports the ion conduction membrane and is configured to be positioned between the workpiece and the ion conduction membrane.

[0018] The film protection member according to the present invention may include a covering portion for covering the non-treated portion of the object to be treated.

[0019] The film protection member according to the present invention may further include an energization portion provided on the object to be treated side of the covering portion, and the energization portion may be configured to be able to contact a part of the surface of the object to be treated so as to conduct the power supply portion and the surface of the object to be treated.

[0020] The surface treatment method according to the present invention is a surface treatment method for treating the surface of an object to be treated by electrolyzing a solution in a liquid chamber through an ion conductive film by applying a voltage between an electrode and the object to be treated, and is characterized in that surface treatment is performed while supporting the facing surface of the ion conductive film with the object to be treated by a film protection member.

[0021] The surface treatment method according to the present invention may include accommodating the solution in the liquid chamber while supporting the facing surface of the ion conductive film with the object to be treated by the film protection member, and approaching and separating the ion conductive film from the object to be treated in a state where the solution is accommodated in the liquid chamber.

[0022] The surface treatment method according to the present invention may include a pressurization step of pressurizing the inside of the liquid chamber, and a voltage application step of applying a voltage between the electrode and the object to be treated after the pressurization step.

Effect of the Invention

[0023] According to the present invention, it is possible to provide a surface treatment apparatus, a film protection member, and a surface treatment method capable of preventing damage to an ion conductive film.

Brief Description of the Drawings

[0024] [Figure 1A] It is a schematic diagram showing an open state of a surface treatment apparatus according to the present embodiment of the present invention. [Figure 1B] It is a schematic diagram showing a closed state of a surface treatment apparatus according to the present embodiment. [Figure 1C]It is a schematic diagram showing the mold-closed state of the surface treatment apparatus according to this embodiment. [Figure 2] It is an exploded view showing the first film protection member according to this embodiment. [Figure 3] It is an assembled view showing the first film protection member according to this embodiment. [Figure 4] It is a cross-sectional view showing the first film protection member according to this embodiment. [Figure 5] It is a flowchart showing the surface treatment method according to this embodiment. [Figure 6] It is a schematic diagram showing an ion conductive film according to a modification of the present invention. [Figure 7] It is a schematic diagram showing the first film protection member and the second film protection member according to a modification of the present invention. [Figure 8] It is a cross-sectional view showing a modification of the first film protection member according to this embodiment. [Figure 9] It is a cross-sectional view showing a modification of the first film protection member according to this embodiment.

Mode for Carrying Out the Invention

[0025] Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the invention according to each claim, and not all combinations of the features described in the embodiments are essential for the solution means of the invention.

[0026] [Overall Configuration of the Surface Treatment Apparatus According to this Embodiment] First, referring to FIG. 1, the surface treatment apparatus 1 according to the present embodiment of the present invention will be outlined. As shown in FIGS. 1A to 1C, the surface treatment apparatus 1 according to the present embodiment can be used, for example, as a plating treatment apparatus that forms a film made of metal on the surface E of the workpiece C by reducing metal ions to deposit metal. However, the surface treatment apparatus 1 is not limited to this, and can be applied to various devices as long as it can process the surface E of the workpiece C.

[0027] In this embodiment, the workpiece C is described as a conductor such as a metal material, but it is not limited to this. For example, if the workpiece C is a material in which a conductor layer is formed on a resin substrate, glass substrate, silicon wafer, ceramic substrate, etc., the surface treatment apparatus 1 can also treat the surface of the conductor layer. Also, in this embodiment, the solution is described as an electrolyte, but it is not limited to this.

[0028] The surface treatment apparatus 1 comprises a housing 4 positioned opposite the workpiece C and capable of forming a liquid chamber (closed space, sealed space) 3 inside, an electrode 20 disposed within the housing 4, an ion-conducting membrane 6 disposed between the liquid chamber 3 and the workpiece C, a first membrane protective member 60 disposed between the workpiece C and the ion-conducting membrane 6, and a power supply unit 7 that applies a voltage between the electrode 20 and the workpiece C. The ion-conducting membrane 6 and the first membrane protective member 60 are attached to the housing 4.

[0029] The surface treatment apparatus 1 further includes a mounting base 2 on which a workpiece C can be placed, a moving mechanism 5 for moving at least one of the mounting base 2 and the housing 4 relative to the other, a solution supply unit (not shown) for supplying or discharging electrolyte into the liquid chamber 3, and a holding jig 35 for holding the ion conductive film 6. The holding jig 35 includes an inner frame film jig 36 and an outer frame film jig 37 that engages with the inner frame film jig 36.

[0030] In this embodiment, the electrolyte is a liquid containing, for example, the metal deposited on the surface E of the workpiece C in an ionic state. Examples of the metals included are copper, gold, silver, nickel, etc. The electrolyte is an ionized form of these metals, and various known electrolytes can be used. However, the electrolyte is not limited to those exemplified herein.

[0031] The mounting base 2 is positioned between the support base 8 and the housing 4, and is configured to allow the object to be processed C to be placed on its surface. In this embodiment, the surface processing apparatus 1 has a tray 9 into which the object to be processed C can be fitted, and the mounting base 2 has a recess into which the tray 9 can be fitted. However, the apparatus may also be configured such that the object to be processed C is fitted onto the mounting base 2 without using the tray 9, or the object to be processed C is simply placed on the mounting base 2.

[0032] The mounting base 2 and tray 9 have electrode portions (not shown) that connect to the workpiece C when the workpiece C is placed on them. The electrode portions of the mounting base 2 and tray 9, and consequently the workpiece C, are connected to the negative electrode (- electrode) of the power supply unit 7. As a result, the workpiece C constitutes the cathode in the surface treatment apparatus 1.

[0033] The housing 4 is positioned vertically above the mounting base 2 and is formed in a closed-bottom cylindrical shape (closed-bottom cylindrical, closed-bottom rectangular tubular, etc.) that constitutes a liquid chamber 3 having an internal upper surface and internal side surfaces. A rectangular ion-conducting membrane 6 and a first membrane protective member 60 are attached to the opening of the closed-bottom cylindrical shape. The housing 4 includes a discharge channel 31 formed through the wall surface of the housing 4 that can discharge gas from the liquid chamber 3, a supply channel 41 that can supply electrolyte to the liquid chamber 3, and a clamp portion 39 for fitting the housing 4 to the mounting base 2.

[0034] Furthermore, the housing 4 is provided with a pressurizing mechanism 30 that protrudes from the side surface of the housing 4 onto the outer wall surface of the discharge passage 31. In addition, the housing 4 is provided with a passage opening / closing valve 40 for opening and closing the supply passage 41. The passage opening / closing valve 40 has supply and discharge ports. The housing 4 is positioned opposite the mounting base 2 as described above, and is configured to form a liquid chamber 3, which becomes a closed space between the housing 4 and the mounting base 2, when it is moved toward the mounting base 2 side, for example by the moving mechanism 5.

[0035] In this embodiment, an upper heater 55 and insulating member 55a are provided on the entire upper surface of the housing 4, and a lower heater 56 is provided inside the mounting base 2. However, these may not be necessary depending on the type of surface treatment applied to the workpiece C.

[0036] The pressurizing mechanism 30 is connected to the discharge channel 31 and has an on-off valve for opening and closing the discharge channel 31. The pressurizing mechanism 30 is configured to open and close the discharge channel 31 and to pressurize the electrolyte supplied into the liquid chamber 3. The pressurizing mechanism 30 reduces the volume of the closed space of the liquid chamber 3 formed between the mounting base 2 and the housing 4 when the on-off valve is closed, thereby pressurizing the electrolyte within the closed space.

[0037] The clamp portion 39 is provided with an exhaust means for exhausting (preferably vacuuming) the air in the space below the mounting base 2 and the ion conductive membrane 6 when the clamp portion 39 and the mounting base 2 are fitted together. The exhaust means has an on / off valve 47 that is opened and closed to reduce the pressure in the space below. The on / off valve 47 is positioned outside a pressure-reducing passage 48 that opens into the space below and communicates with the area below the clamp portion 39. The clamp portion 39 is also configured to allow the attachment of the first membrane protective member 60.

[0038] The depressurized channel 48 is connected to the liquid chamber 3 (the space above the ion-conducting membrane 6) via a depressurized channel, a channel on / off valve, and a bypass channel (none of which are shown). The bypass channel is connected to a depressurized unit (not shown) that has a vacuum pump or the like for depressurizing. This depressurized system circuit is provided as a separate circuit from the solution supply system circuit, such as the pressurizing mechanism 30 and the channel on / off valve 40.

[0039] The electrode 20 is a metal plate and is made of any metal material (e.g., copper). The electrode 20 is suspended from the upper interior surface of the housing 4 and is positioned in the liquid chamber 3 such that the bottom 23 of the electrode 20 is directly above the ion-conducting membrane 6.

[0040] The electrode 20 is connected to the positive electrode (+ electrode) of the power supply unit 7 via the housing 4. With this configuration, the electrode 20 constitutes the anode in the surface treatment apparatus 1. The electrode 20 is not limited to a metal plate, but can be any configuration (for example, a cage-like member containing a metal of any shape) and arrangement as long as it can be positioned in a location immersed in the electrolyte in the liquid chamber 3.

[0041] The power supply unit 7 applies a voltage between the electrode 20, which becomes the anode, and the workpiece C, which becomes the cathode.

[0042] As shown in Figure 1C, the moving mechanism 5 moves at least one of the mounting base 2 and the housing 4 relative to the other in a direction that moves them closer or further apart. Specifically, the moving mechanism 5 has a linear rod 51, and is configured to move the housing 4 closer to or further away from the mounting base 2 by raising and lowering the housing 4 using the linear rod 51.

[0043] Furthermore, the moving mechanism 5 is configured to stop the housing 4 at at least three locations: the upper end position where the housing 4 is furthest away from the mounting base 2 (original position: see Figure 1A); a depressurization position where a liquid chamber 3 is formed between the housing 4 and the mounting base 2, and the space below is depressurized by the mounting base 2 and the clamp portion 39 fitting together below the liquid chamber 3 and the ion conductive film 6; and a processing position where the housing 4 is brought even closer to the mounting base 2 than the depressurization position to perform surface treatment (see Figure 1B).

[0044] In this embodiment, the moving mechanism 5 moves the housing 4 closer to or further away from the mounting base 2, but is not limited to this. Furthermore, the moving mechanism 5 is not limited to a configuration that includes the linear rod 51 described above, and any configuration that is capable of moving the housing 4 closer to or further away from the mounting base 2 can be adopted.

[0045] As shown in Figure 2, the first film protection member 60 includes a first film support portion 63 that supports the ion-conducting film 6 and a first frame portion 61 that supports the first film support portion 63. The first film protection member 60 further includes a covering portion 64 for covering the untreated portion of the workpiece C. As shown in Figure 1A, the first film protection member 60 is attached to the lower part (clamp portion 39) of the housing 4.

[0046] As shown in Figure 2, the first frame portion 61 is a rectangular flat plate with an opening 62 in the center that is larger than the surface E of the workpiece C. In this embodiment, the first frame portion 61 is made of stainless steel, but it is not limited to this, and various arbitrary configurations can be adopted as long as they are chemically resistant and not easily deformed.

[0047] The first membrane support portion 63 is a porous member, and metal ions that have passed through the ion-conducting membrane 6 can pass through its openings. Specifically, the first membrane support portion 63 is a rectangular, mesh-like material, and is formed to be the same shape and size as the first frame portion 61. The size of the opening of the first membrane support portion 63 is preferably such that the ion-conducting membrane 6 placed on the opening does not deform excessively due to the pressure of the electrolyte, but is not limited to this. For example, the first membrane support portion 63 can be made of a metal mesh such as stainless steel mesh or a synthetic fiber mesh such as polyester mesh.

[0048] When a metal mesh is used, the mesh coarseness can be made finer than that of a synthetic fiber mesh, allowing for better dispersion of the force applied to the ion-conducting film 6, and also enabling finer patterning of the coating portion 64, which will be described later. Furthermore, because the metal mesh is more rigid than the synthetic fiber mesh, deformation under pressure is smaller, and the mesh portion not covered by the coating portion 64, which will be described later, is less likely to come into contact with the surface E of the workpiece C. When a metal mesh is used, it is preferable that the surface of the first film support portion 63 be insulated to prevent the surface from being plated.

[0049] On the other hand, when using synthetic fiber mesh, there is the advantage that the surface of the first film support portion 63 does not need to be plated because it is an insulator. Also, if the synthetic fiber has chemical resistance, it can be used even with electrolytes that would cause chemical reactions in metal mesh.

[0050] The first membrane support portion 63 is not limited to a mesh (network) shape, but may be other porous members. For example, the first membrane support portion 63 may be a member having a grid-like or dot-shaped opening, or it may be a porous film or porous plate with disordered pores.

[0051] As shown in Figure 4, the first film support portion 63 is attached to the upper surface (housing 4 side) of the first frame portion 61, and the portion of the first film support portion 63 that overlaps with the peripheral edge of the first frame portion 61 (the peripheral edge of the first film support portion 63) is bonded to the peripheral edge of the first frame portion 61. In addition, the surface of the first film support portion 63 is insulated by the covering portion 64.

[0052] Furthermore, the peripheral edges of the first film support portion 63 and the first frame portion 61 are insulated to prevent corrosion by the electrolyte in the liquid chamber 3 and to prevent current from flowing when voltage is applied. Specifically, as shown in Figures 3 and 4, the peripheral edges of the first film support portion 63 and the first frame portion 61 are covered with a protective film 66 that has chemical resistance and insulating properties.

[0053] As shown in Figure 4, the coating portion 64 is provided on the surface of the first film support portion 63 facing the workpiece C. Specifically, the coating portion 64 is a photosensitive resin material (emulsion) and is applied in a thin film to the surface of the first film support portion 63 facing the workpiece C. The coating portion 64 is also treated with a water-repellent coating, thereby providing water repellency. The thickness of the coating portion 64 is preferably such that the first film support portion 63 does not directly touch the surface E of the workpiece C. In this embodiment, the coating portion 64 is thicker than the metal film formed on the surface E of the workpiece C by the surface treatment, but is not limited to this. When the coating portion 64 is thicker than the metal film, the first film support portion 63 interferes with the formed metal film, preventing the formation of a mesh pattern of the first film support portion on the metal film.

[0054] Furthermore, as shown in Figure 2, the coating portion 64 has a pattern formed on it by exposure and development processing to selectively surface-treat the treated portion of the surface E of the workpiece C. Therefore, the portion of the first film support portion 63 that overlaps with the pattern of the coating portion 64 is not covered by the coating portion 64. With this configuration, the surface treatment apparatus 1 can selectively surface-treat only the treated portion of the surface E of the workpiece C that is not covered by the coating portion 64.

[0055] Furthermore, the first protective film member 60 may have an energizing portion 65 provided on the workpiece C side of the covering portion 64. The energizing portion 65 is made of a conductive metal material such as copper, gold, silver, stainless steel, or titanium, and is arranged to be in contact with a part of the surface E of the workpiece C so as to conduct electricity between the power supply unit 7 and the surface E of the workpiece C. In this embodiment, the energizing portion 65 is arranged to connect the electrode portions of the mounting base 2 and tray 9 to the unprocessed portion of the workpiece C.

[0056] The conductive portion 65 may be positioned on the surface of the coating portion 64 on the side facing the workpiece C, as shown in Figure 8, or it may be embedded in the surface of the coating portion 64 on the side facing the workpiece C, as shown in Figure 9. Furthermore, in this embodiment, the conductive portion 65 is a foil-like member and is attached to the coating portion 64 via an adhesive, but is not limited to this. For example, the conductive portion 65 may be formed by applying metal particles to the coating portion 64.

[0057] The ion-conducting membrane 6 is a single-sheet thin film member formed with a thickness of several μm to several hundred μm (for example, 5 to 450 μm). Examples of ion-conducting membranes 6 include porous membranes and solid electrolyte membranes, and resins such as polyethylene, polypropylene, hydrocarbon resins, and fluororesins can be used. However, the ion-conducting membrane 6 is not limited to these, as long as it can impregnate metal ions in the electrolyte supplied to the liquid chamber 3 by contact with the electrolyte, and deposit metal derived from the metal ions on the surface E of the workpiece C when a voltage is applied by the power supply unit 7.

[0058] The ion-conducting membrane 6 is held between the inner and outer membrane fixtures 36 and 37 of the holding fixture 35. The ion-conducting membrane 6 is held in a uniformly taut state by being held between the inner and outer membrane fixtures 36 and 37. The inner and outer membrane fixtures 36 and 37 are attached to the lower part of the housing 4, and the ion-conducting membrane 6 is positioned directly below the electrode 20 located in the liquid chamber 3.

[0059] The mounting of the ion-conducting film 6 is not limited to the above-described configuration, as long as the configuration allows the ion-conducting film 6 to be stretched without slack. For example, as shown in Figure 6, the first film support portion 63 of the first film protection member 60 is bonded to the surface of the ion-conducting film 6 facing the workpiece C. By having such a configuration, the ion-conducting film 6 can be held without using the holding jig 35, making it possible to miniaturize the device. In addition, it is possible to prevent the ion-conducting film 6 from sagging due to the weight of the electrolyte or swelling of the ion-conducting film 6.

[0060] Furthermore, as shown in Figure 7, the surface treatment apparatus 1 may further include a second film protection member 70 disposed on the liquid chamber 3 side of the ion-conducting film 6. Specifically, the second film protection member 70 includes a second film support portion 73 provided opposite the ion-conducting film 6 and capable of passing through the electrolyte in the liquid chamber 3, and a second frame portion 71 that supports the second film support portion 73. The second film protection member 70 is attached above the ion-conducting film 6 via an inner frame film jig 36 of the holding jig 35. In this case, the first film protection member 60 may be attached to the lower part of the housing 4 via an outer frame film jig 37 of the holding jig 35, or it may be attached to the clamp portion 39.

[0061] The second frame portion 71 has an opening similar to the first frame portion 61 of the first film protection member 60. The second film support portion 73 is a porous member similar to the first film support portion 63, but is not limited to this. Various arbitrary configurations can be adopted as long as the electrolyte can pass from the liquid chamber 3 side to the ion conductive film 6 side of the second film support portion 73.

[0062] If a second film protection member 70 is further provided, the ion-conducting film 6 is sandwiched between the first film support portion 63 of the first film protection member 60 and the second film support portion 73 of the second film protection member 70. With this configuration, the ion-conducting film 6 is supported from both sides, and damage to the ion-conducting film 6 can be further prevented. In addition, the second film support portion 73 may be bonded to the liquid chamber side surface of the ion-conducting film 6.

[0063] The surface treatment apparatus 1, having the above configuration, applies a voltage between the electrode 20 and the workpiece C, thereby treating the surface E of the workpiece C by electrolysis via the ion-conducting film 6 and the first film support portion 63.

[0064] [Explanation of surface treatment method] A surface treatment method using the surface treatment apparatus 1 according to this embodiment will be described with reference to Figure 5. Figure 5 is a flowchart showing an example of a surface treatment procedure using the surface treatment apparatus 1 according to this embodiment. The surface treatment method according to this embodiment is a surface treatment method in which an ion-conducting film 6 is placed between an electrode 20 and a workpiece C, and a voltage is applied between the electrode 20 and the workpiece C, thereby treating the surface E of the workpiece C by electrolysis of the electrolyte in the liquid chamber 3 via the ion-conducting film 6, wherein the surface treatment is performed with the surface of the ion-conducting film 6 facing the workpiece C supported by a film protection member.

[0065] Furthermore, in the surface treatment method according to this embodiment, the surface of the ion-conducting film 6 facing the workpiece C is supported by a film protective member, and the electrolyte is contained in the liquid chamber 3, while the ion-conducting film 6 is moved closer to and further away from the workpiece C while the electrolyte is contained in the liquid chamber 3.

[0066] The surface treatment method according to this embodiment comprises an approach step of bringing the housing 4 closer to the mounting base 2, a depressurization step of reducing the pressure in the space between the ion conductive film 6 and the workpiece C, a contact step of bringing the covering portion 64 of the first film protective member 60 into contact with the surface E of the workpiece C, a pressurization step of pressurizing the liquid chamber 3, a voltage application step of applying a voltage between the electrode 20 and the workpiece C after the pressurization step, and a separation step of moving the housing 4 away from the mounting base 2.

[0067] Furthermore, the surface treatment method further comprises a liquid supply step of injecting an electrolyte into the liquid chamber 3 and a liquid draining step of discharging the electrolyte from the liquid chamber 3. This method will be described in detail below.

[0068] First, as a preliminary step to surface treatment, with the housing 4 separated from the mounting base 2 (original position: see Figure 1A), the user sets the ion-conducting film 6 and the first film protective member 60, which has a covering portion 64 that matches the surface treatment pattern, onto the housing 4. Then, the moving mechanism 5 lowers the housing 4 and engages the clamp portion 39 of the housing 4 with the mounting base 2.

[0069] Next, with the ion-conducting membrane 6 supported by the first membrane support portion 63 of the first membrane protection member 60, the electrolyte is injected into the liquid chamber 3 from the external solution supply unit via the supply channel 41 (S1 in Figure 5: liquid supply process). As the liquid chamber 3 is filled with the electrolyte, any air remaining inside the liquid chamber 3 is exhausted to the solution supply unit through the discharge channel 31, which is the connection channel of the pressurizing mechanism 30. As the injection of the electrolyte continues, the liquid chamber 3 is completely filled with electrolyte at atmospheric pressure.

[0070] After the liquid chamber 3 is filled with electrolyte, the moving mechanism 5 raises the housing 4 back to its original position, separating it from the mounting base 2. After the housing 4 returns to its original position, a tray with the workpiece C placed on it is set on the mounting base 2. This completes the preparation for surface treatment.

[0071] After preparation is complete, the moving mechanism 5 lowers the housing 4 to the reduced pressure position described above, and the clamp portion 39 of the housing 4 is fitted with the mounting base 2 on which the workpiece C is placed (S2 in Figure 5: approach step). At this time, the fitting position of the clamp portion 39 and the mounting base 2 is set to a position in which the first film support portion 63 is as close as possible to the surface E of the workpiece C. The workpiece C is sealed in the lower space formed between the mounting base 2 and the ion conductive film 6, and is separated from the liquid chamber 3.

[0072] Next, with the clamp portion 39 of the housing 4 fitted together with the mounting base 2 on which the workpiece C is placed, the on-off valve 47 provided on the clamp portion 39 is opened, and the flow path on-off valve of the pressure reduction system described above is also opened, connecting the pressure reduction flow path 48 and a pressure reduction flow path (not shown) via a bypass flow path, thereby reducing the pressure in the space below (S3 in Figure 5: Pressure reduction process).

[0073] Then, while maintaining the reduced pressure state, the housing 4 is lowered to the processing position described above by the moving mechanism 5 in order to fully fit the clamp portion 39 of the housing 4 onto the mounting base 2, and the covering portion 64 of the first film protective member 60 is brought into contact with the surface E of the workpiece C (S4 in Figure 5: contact process).

[0074] Next, the electrolyte in the liquid chamber 3 is pressurized by the pressurizing mechanism 30 provided on the outer side of the housing 4 (S5 in Figure 5: pressurizing step). This pressurizing step causes the coating portion 64 to adhere closely to the surface E of the workpiece C, and the coating portion 64 performs its coating function. Then, with the electrolyte in the liquid chamber 3 under pressurization, the power supply unit 7 applies a voltage between the electrode 20 and the workpiece C (S6 in Figure 5: voltage application step). This performs a surface treatment in which metal ions are deposited on the treated portion of the surface E of the workpiece C, forming a metal coating.

[0075] In this embodiment, the ion-conducting film 6 and the surface E of the workpiece C do not come into direct contact. However, due to the pressure difference between the space above and below the ion-conducting film 6, the electrolyte seeps out from the ion-conducting film 6 and fills the surface E of the workpiece C, and a metal coating is formed on the treated portion of the workpiece C.

[0076] Furthermore, by installing a pressure sensor in the housing 4 that can measure the pressure inside the liquid chamber 3, and controlling the operating air pressure of the pressurizing mechanism 30 based on this measurement, it is possible to pressurize the electrolyte to a desired pressure. If this state is maintained for a predetermined time and a predetermined voltage application time has elapsed, the surface treatment is completed.

[0077] After the surface treatment is complete, the housing 4 is raised back to its original position by the moving mechanism 5, thereby separating the housing 4 from the mounting base 2 (S7 in Figure 5: Separation process). After the housing 4 has moved back to its original position, the tray 9 on which the workpiece C is placed is removed from the mounting base 2.

[0078] When performing the same surface treatment pattern on multiple workpieces C consecutively (YES in S8 of Figure 5), a new workpiece C is set, and the process from approach to separation is repeated. If the surface treatment is repeated and it becomes necessary to replace the electrolyte, after the contact process (S4 in Figure 5), the electrolyte in the liquid chamber 3 is circulated with the clamp portion 39 of the housing 4 and the mounting base 2 fitted together.

[0079] If surface treatment is not performed continuously (NO in S8 of Figure 5), the surface treatment is terminated after a drainage process. Specifically, first, the housing 4 is lowered again by the moving mechanism 5, and the clamp portion 39 of the housing 4 is fitted with the mounting base 2. Then, the electrolyte in the liquid chamber 3 is discharged from the supply channel 41 which has an opening in the housing 4 (drainage process). In the drainage process, the channel opening valve 40 and the pressurizing mechanism 30 are opened, and low-pressure air is supplied from the pressurizing mechanism 30 to drain the electrolyte from the supply and discharge port of the channel opening valve 40. After the drainage is complete, the housing 4 is raised back to its original position by the moving mechanism 5, thereby separating the housing 4 from the mounting base 2.

[0080] Furthermore, when changing the surface treatment pattern, the first film protection member 60 attached to the housing 4 is removed after draining the liquid, and a new first film protection member 60 with a different surface treatment pattern is attached. Then, the electrolyte is injected into the liquid chamber 3, and the process from the approach step to the separation step is repeated again.

[0081] Through the above steps, a series of surface treatment methods using the surface treatment apparatus 1 according to this embodiment are performed.

[0082] [Advantages of the surface treatment apparatus, film protective member, and surface treatment method according to this embodiment] As described above, the surface treatment apparatus 1 according to this embodiment comprises a housing 4 positioned opposite the workpiece C and capable of forming a liquid chamber 3 inside, an electrode 20 disposed within the housing 4, an ion-conducting film 6 disposed between the liquid chamber 3 and the workpiece C, a first film protection member 60 disposed between the workpiece C and the ion-conducting film 6, and a power supply unit 7 that applies a voltage between the electrode 20 and the workpiece C. The first film protection member 60 includes a first film support portion 63 that supports the ion-conducting film 6, and by applying a voltage between the electrode 20 and the workpiece C, the surface E of the workpiece C is treated by electrolysis via the ion-conducting film 6 and the first film support portion 63.

[0083] Furthermore, the surface treatment apparatus 1 according to this embodiment has the advantage that, when the ion conductive film 6 is not in contact with the workpiece C, the ion conductive film 6 is supported by the first film support portion 63, so that the ion conductive film 6 is not deformed by the weight of the electrolyte in the liquid chamber 3 or by the pressure difference between the space above and below the ion conductive film 6 that occurs when the pressure is reduced, and also because the ion conductive film 6 does not come into direct contact with the workpiece C during surface treatment, thus preventing damage to the ion conductive film 6. In addition, because the first film support portion is positioned between the ion conductive film 6 and the workpiece C, residual bubbles that occur when the ion conductive film 6 comes into close contact with the surface E of the workpiece C during the depressurization process can be suppressed.

[0084] Furthermore, in the surface treatment apparatus 1 according to this embodiment, the first film support portion 63 is a porous member. This configuration has the advantage of evenly distributing the load on the ion-conducting film 6 due to the weight of the electrolyte while supporting the ion-conducting film 6. It also has the advantage of not hindering the seepage of the electrolyte because it has openings through which the electrolyte can pass.

[0085] Furthermore, in the surface treatment apparatus 1 according to this embodiment, the ion-conducting film 6 and the first film protective member 60 are attached to the housing 4. This configuration has the advantage that the first film protective member 60 does not need to be removed when repeatedly performing surface treatment on multiple workpieces C.

[0086] Furthermore, in the surface treatment apparatus 1 according to this embodiment, the first film protective member 60 further includes a covering portion 64 for covering the untreated portion of the workpiece C. With this configuration, the spread of the electrolyte seeping from the ion conductive film 6 on the workpiece is suppressed by the thickness of the covering portion 64, thus having the advantage of selectively surface-treating only the treated portion of the workpiece C. In addition, since the covering portion 64 is provided on the first film protective member 60, a more flexible covering pattern can be realized compared to the case where the covering portion is provided separately from the first film protective member 60.

[0087] Furthermore, in the surface treatment apparatus 1 according to this embodiment, the first film protective member 60 is further provided with an energizing portion 65 on the workpiece C side of the covering portion 64, and the energizing portion 65 is arranged to be in contact with a part of the surface E of the workpiece C so as to provide electrical conductivity between the power supply unit 7 and the surface E of the workpiece C. With this configuration, even if the workpiece C is a material on which a conductive layer is formed, such as a resin substrate, glass substrate, silicon wafer, or ceramic substrate, the power supply unit 7 and the conductive layer can be electrically connected and the surface treatment can be performed. In addition, the workpiece C can be easily connected to the electrode portions of the mounting base 2 and tray 9, and consequently to the negative electrode of the power supply unit 7. Furthermore, since electrical conductivity is provided between the power supply unit 7 and the surface E of the workpiece C near the processing portion of the workpiece C, the accuracy of the surface treatment can be further improved.

[0088] Furthermore, in the surface treatment apparatus 1 according to this embodiment, the coating portion 64 is water-repellent. This configuration has the advantage of preventing electrolyte seeping from the ion-conducting film 6 from penetrating into the coating portion 64 and entering the untreated portion of the workpiece C.

[0089] Furthermore, in the surface treatment apparatus 1 according to this embodiment, the surface of the first film support portion 63 is insulated. This configuration has the advantage that when voltage is applied, current is supplied to the first film support portion 63, preventing the surface of the first film support portion 63 from being plated.

[0090] Furthermore, in the surface treatment method according to this embodiment, a solution (electrolyte) is contained in the liquid chamber 3 while the surface of the ion-conducting film 6 facing the workpiece C is supported by a film protective member, and the ion-conducting film 6 is moved closer to and further away from the workpiece C while the solution (electrolyte) is contained in the liquid chamber 3. By having such a configuration, it is not necessary to inject and discharge the electrolyte after each cycle, which has the advantage of shortening the time required for one cycle of surface treatment.

[0091] Furthermore, the surface treatment method according to this embodiment includes a pressurization step of pressurizing the liquid chamber 3, and a voltage application step of applying a voltage between the electrode 20 and the workpiece C after the pressurization step. This configuration has the advantage of improving the adhesion between the coating portion 64 and the surface E of the workpiece C, allowing for more effective coating.

[0092] [Differentiation] Although preferred embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the embodiments described above. Various modifications or improvements can be made to the embodiments described above.

[0093] For example, in this embodiment, the first film support portion 63 has been described as a porous member, but it is not limited to this. Any configuration can be adopted for the first film support portion 63, as long as it is capable of allowing ions that have passed through the ion-conducting film 6 to pass through and can support the ion-conducting film 6.

[0094] In this embodiment, the ion-conducting membrane 6 and the first membrane protective member 60 have been described as being attached to the housing 4, but the invention is not limited to this. The first membrane protective member 60 may be attached, for example, to cover the workpiece C on the mounting base 2 or tray 9 when the workpiece C is placed on the mounting base 2 or tray 9.

[0095] In this embodiment, the first protective film member 60 has been described as further including a covering portion 64 for covering the untreated portion of the workpiece C, but it is not limited to this, and the first protective film member 60 does not have to include the covering portion 64.

[0096] In this embodiment, the first film protective member 60 is described as having an energizing portion 65 further provided on the workpiece C side of the covering portion 64, and the energizing portion 65 is arranged to be in contact with a part of the surface E of the workpiece C so as to conduct electricity between the power supply portion 7 and the surface E of the workpiece C. However, the embodiment is not limited to this, and the first film protective member 60 does not necessarily have an energizing portion 65 further provided on the workpiece C side of the covering portion 64.

[0097] In this embodiment, the coating portion 64 has been described as having water-repellent properties, but it is not limited to this, and the coating portion 64 may not have water-repellent properties.

[0098] In this embodiment, the first film support portion 63 has been described as having an insulating surface, but it is not limited to this, and the first film support portion 63 does not have to have an insulating surface.

[0099] The surface treatment method according to this embodiment has been described as involving supporting the surface of the ion-conducting film 6 facing the workpiece C with a film protective member, containing a solution (electrolyte) in the liquid chamber 3, and moving the ion-conducting film 6 closer to and further away from the workpiece C while the solution (electrolyte) is contained in the liquid chamber 3, but is not limited to this. In the surface treatment method according to this embodiment, the ion-conducting film 6 may be moved closer to and further away from the workpiece C without containing a solution (electrolyte) in the liquid chamber 3.

[0100] The surface treatment method according to this embodiment has been described as comprising a pressurization step of pressurizing the liquid chamber 3 and a voltage application step of applying a voltage between the electrode 20 and the workpiece C after the pressurization step, but is not limited thereto. The surface treatment method according to this embodiment does not necessarily have to include a pressurization step and a voltage application step.

[0101] In this embodiment, the coating portion 64 has been described as an emulsion, but it is not limited to this. For example, the coating portion 64 may be a resin film, a photosensitive resin (such as a dry film), an insulated metal material (such as a metal mask), etc.

[0102] In this embodiment, the ion-conducting film 6 has been described as being rectangular in shape, but it is not limited to this, and various arbitrary configurations can be adopted as long as they cover the opening of the housing 4. For example, it may be circular in shape, etc. Also, the openings of the first frame portion 61 and the second frame portion 71 may be of a shape other than rectangular, in accordance with the shape of the ion-conducting film 6.

[0103] In this embodiment, the peripheral edges of the first film support portion 63 and the first frame portion 61 of the first film protective member 60 are described as being covered with a protective film 66 having chemical resistance and insulating properties. However, the embodiment is not limited to this, and the peripheral edges of the first film support portion 63 and the first frame portion 61 do not need to be covered with the protective film 66. Various arbitrary configurations can be adopted as long as the first frame portion 61 is not electrically short-circuited.

[0104] In this embodiment, the first film support portion 63 has been described as being the same shape and size as the first frame portion 61, but it is not limited to this, and the first film support portion 63 does not have to be the same shape and size as the first frame portion 61.

[0105] In this embodiment, the second film protective member 70 has been described as being attached to the inner frame film jig 36 of the holding jig 35, but it is not limited to this, and various arbitrary configurations can be adopted for the second film protective member 70 as long as it is positioned above the ion conductive film 6.

[0106] In this embodiment, the process described as lowering the housing 4 and fitting the clamp portion 39 of the housing 4 with the mounting base 2, and then injecting the electrolyte into the liquid chamber 3 (liquid supply step), is described as a preliminary step to the surface treatment. However, the embodiment is not limited to this. For example, in the first surface treatment, the electrolyte may be injected into the liquid chamber 3 after the contact step.

[0107] Although the surface treatment method according to this embodiment has been described as including a reduced pressure step, it is not limited thereto, and the surface treatment method according to this embodiment may not include a reduced pressure step. [Explanation of symbols]

[0108] 1 Surface treatment apparatus 2. Mounting base 3 Liquid chamber 4 Housing 5 Moving mechanism 6. Ion-conducting membrane 7 Power supply section 8 Support base 9 trays 20 electrodes 23 Bottom 30 Pressurization mechanism 31 Discharge channel 35 Holding fixture 36 Inner frame membrane jig 37 Outer frame membrane jig 39 Clamp section 40 Flow control valve 41 Supply channel 47. Shut-off valve 48. Depressurization channel 51 Linear rod 55 Top heater 55a Insulating material 56. Lower heater 60 First protective film member 61. Section 1 62 Aperture 63 1st membrane support part 64 Covering part 65 Power supply section 66 Protective Films 70 Second protective film member 71 Second Slot 73 Second membrane support part C. Items to be processed E surface

Claims

1. A housing positioned opposite the object to be processed and capable of forming a liquid chamber inside, The electrode arranged within the housing, An ion-conducting membrane is disposed between the liquid chamber and the object to be treated. A first film protective member is disposed between the object to be treated and the ion conductive film, A power supply unit that applies voltage between the electrode and the workpiece to be processed. Equipped with, The first film protective member includes a first film support portion that supports the ion conductive film, and is configured to suppress deformation of the ion conductive film. The first film support portion is a porous member and extends over the entire region of the ion-conducting film facing the workpiece. By applying a voltage between the electrode and the object to be treated, the surface of the object to be treated is treated by electrolysis via the ion-conducting film and the first film support. A surface treatment apparatus characterized by the following:

2. The ion-conducting film and the first film protective member are attached to the housing. The surface treatment apparatus according to claim 1.

3. The first protective film member further includes a covering portion for covering the untreated portion of the workpiece. The surface treatment apparatus according to claim 1 or 2.

4. The first protective film member is further provided with an energizing portion on the side of the coating portion that is being treated, The energizing unit is positioned so as to be in contact with a portion of the surface of the workpiece to be processed, so as to provide electrical conductivity between the power supply unit and the surface of the workpiece to be processed. The surface treatment apparatus according to claim 3.

5. The coating portion has water-repellent properties. The surface treatment apparatus according to claim 3.

6. The surface of the first film support portion is insulated. The surface treatment apparatus according to claim 1 or 2.

7. The first film support portion is bonded to the surface of the ion-conducting film facing the workpiece. The surface treatment apparatus according to claim 1 or 2.

8. The ion-conducting membrane further comprises a second membrane protective member disposed on the liquid chamber side, The second membrane protective member is provided opposite the ion-conducting membrane and includes a second membrane support portion that can pass through the solution in the liquid chamber, and is configured to suppress deformation of the ion-conducting membrane. The ion-conducting film is sandwiched between the first film support portion and the second film support portion. The surface treatment apparatus according to claim 1 or 2.

9. The second membrane support portion is bonded to the liquid chamber side surface of the ion-conducting membrane. The surface treatment apparatus according to claim 8.

10. A film protective member used in a surface treatment apparatus that processes the surface of a workpiece by electrolysis via the ion conductive membrane, wherein the surface of the workpiece is processed by applying a voltage between the electrode and the workpiece, the protective member comprising: a housing positioned opposite the workpiece and capable of forming a liquid chamber inside; an electrode disposed within the housing; an ion conductive membrane positioned between the liquid chamber and the workpiece; and a power supply unit that applies a voltage between the electrode and the workpiece. It comprises a membrane support portion that supports the ion-conducting membrane, is configured to be positioned between the workpiece and the ion-conducting membrane, and is configured to suppress deformation of the ion-conducting membrane. The first film support portion is a porous member and extends over the entire region of the ion-conducting film facing the workpiece. A film protective member characterized by the following features.

11. The material includes a covering portion for covering the untreated portion of the object to be treated. The film protective member according to feature 10.

12. The coating portion is further provided on the side of the object to be processed, The energizing portion is configured to be able to contact a part of the surface of the workpiece so as to establish electrical conductivity between the power supply portion and the surface of the workpiece. The film protective member according to feature 11.

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