Apparatus for forming sealing resin used in compression molding
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- YAMAHA ROBOTICS HLDG CO LTD
- Filing Date
- 2023-05-12
- Publication Date
- 2026-08-03
Smart Images
Figure 0007898735000001 
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Abstract
Description
Technical Field
[0001] The present invention relates to a forming apparatus for a sealing resin used in compression molding.
Background Art
[0002] As an example of a resin sealing apparatus and a resin sealing method for sealing a work in which an electronic component is mounted on a base material with a sealing resin and processing it into a molded product, a compression molding method is known.
[0003] The compression molding method is a technique for resin sealing by supplying a predetermined amount of sealing resin to a sealing region (cavity) provided in a sealing mold including an upper mold and a lower mold, disposing a work in the sealing region, and clamping with the upper mold and the lower mold. As an example, when using a sealing mold provided with a cavity in the upper mold, a technique of supplying and molding the sealing resin all at once at the center position on the work is known. On the other hand, when using a sealing mold provided with a cavity in the lower mold, a technique of supplying a release film (hereinafter sometimes simply referred to as "film") covering the mold surface including the cavity and a sealing resin and molding is known (see Patent Document 1: Japanese Unexamined Patent Application Publication No. 2019-145550).
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] For example, when resin encapsulating strip-type wire-connected electronic components (semiconductor chips) as a workpiece, a compression molding method in which a cavity is provided in the upper mold presents a problem: the wire portion of the workpiece held in the lower mold comes into contact with the encapsulating resin supplied to the cavity beforehand or to the workpiece, causing deformation and making resin encapsulation difficult. Therefore, a compression molding method has generally been adopted in which the workpiece is held in the upper mold, a cavity is provided in the lower mold, and the encapsulating resin (for example, granular resin) is supplied into the cavity.
[0006] However, in a configuration where the workpiece is held in the upper mold and a cavity is provided in the lower mold, there was a problem that when the workpiece was thin or large, it was difficult to hold it in the upper mold and it was prone to falling. Also, although the sealing resin is usually supplied into the cavity of the lower mold via a film, when trying to form a molded product that is thicker than about 1 mm (in this case, the thickness of the resin part after molding), the molding stroke becomes large, and there was a problem that molding defects such as the film getting caught in the molded product were likely to occur. Furthermore, when granular resin is used as the sealing resin, the bulk increases depending on the diameter of the granular resin, making the aforementioned film getting caught more likely to occur. In addition, there was a problem of dust generation during molding due to friction between the granular resins as they move, and handling was difficult. Moreover, it was difficult to supply (distribute) the sealing resin evenly to the entire area of the cavity provided in the lower mold. Sprinkling There was a problem with unevenness in the encapsulation process. Furthermore, during the application of the encapsulating resin, air trapped in the gaps between particles, and gaseous components resulting from degassing during melting, were not properly removed, leading to molding defects such as voids in the molded product. In particular, in workpieces with electronic components mounted via wire connections, there was a risk of wire flow (deformation or breakage of the wires) occurring due to resin flow within the cavity during resin encapsulation.
[0007] Furthermore, the sealing resin used in compression molding is naturally in a state before full curing, resulting in low rigidity (brittleness) and low strength. This presented a challenge in that cracking and breakage were likely to occur during the molding process. [Means for solving the problem]
[0008] The present invention has been made in view of the above circumstances, and provides a sealing resin that is easy to handle, and solves the problems of a configuration in which a cavity is provided in the upper mold and a configuration in which a cavity is provided in the lower mold, and the resin flow, Sprinkling The objective is to provide a compression molding apparatus and method for forming a sealing resin that enables the formation of large-thickness molded products while preventing molding defects caused by uneven molding, residual gas, and dust generation during molding. In addition, the objective is to prevent cracking of the sealing resin during the forming process. In particular, cracking is likely to occur when peeling off the release film attached to the sealing resin, so solving this problem is a challenge.
[0009] The present invention solves the above problem by a solution described below as one embodiment.
[0010] An apparatus for forming a sealing resin used in compression molding of a workpiece comprises a forming mold having a pair of lower and upper molds that open and close, a forming mold that contains and heats and pressurizes a base resin with a release film interposed therebetween to form the sealing resin of a predetermined shape, and a film peeling mechanism for peeling the release film from the formed sealing resin. The film peeling mechanism has a gripping portion that grips one end of the release film and moves toward the other end. This is a requirement.
[0011] For example, powder resin is used as the base resin, and the forming die is a tableting die for compressing the powder resin into tablets.
[0012] Furthermore, it is preferable that the forming mold be set to a heating temperature at which the base resin does not heat-cur, so that the formed sealing resin can be heat-cured when it is used for compression molding of the workpiece.
[0014] Furthermore, it is preferable that the film peeling mechanism includes a tension roller that moves linearly in the same direction as the gripping portion moves, while applying tension to the release film by causing it to roll or slide against a part of the circumferential surface as the gripping portion grips one end of the release film and moves toward the other end.
[0015] Furthermore, it is preferable that the film peeling mechanism rotatably supports the tension roller and has a tension section that provides resistance to restrict the linear movement of the tension roller.
[0016] Furthermore, it is preferable that the tensioning section has a linear motion mechanism using an air cylinder or an electric motor, and that the resistance is set or variably controlled by the linear motion mechanism.
[0017] Furthermore, it is preferable that the film peeling mechanism has an adsorption stage on either its upper or lower surface which is provided with an adsorption portion for adsorbing the sealing resin, and that the gripping portion and the tension roller are arranged on the same side as the surface on which the adsorption portion is provided with respect to the adsorption stage.
[0018] Furthermore, it is preferable to further provide an inversion mechanism that inverts the upper and lower surfaces of the sealing resin so that they are reversed. [Effects of the Invention]
[0019] The forming apparatus according to the present invention makes it possible to form a sealing resin that enables the realization of a compression molding apparatus and compression molding method that achieve the following effects. Specifically, in a compression molding apparatus and compression molding method, the problems of a configuration in which a cavity is provided in the upper mold and a configuration in which a cavity is provided in the lower mold can be solved. Furthermore, resin flow, Sprinkling This material prevents molding defects caused by unevenness, residual gas, and dust generation during molding. Furthermore, it can be used to form molded products with both small (thin) and large (thick) thicknesses. It also offers easier handling, particularly during supply and setup, compared to granular resins.
[0020] Also, according to the above forming apparatus, when peeling the release film attached to the sealing resin in the forming process, it is possible to prevent the occurrence of chipping in the sealing resin.
Brief Description of the Drawings
[0021] [Figure 1] It is a plan view showing an example of a compression molding apparatus in which a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention is used. [Figure 2] It is an explanatory view for explaining an example of a compression molding method in which a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention is used. [Figure 3] FIG. 3A is an enlarged view of part III in FIG. 2. FIG. 3B is an explanatory view following FIG. 3A. [Figure 4] It is an explanatory view following FIG. 3B. [Figure 5] It is an explanatory view following FIG. 4. [Figure 6] It is an explanatory view for explaining another example of a compression molding method in which a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention is used. [Figure 7] It is an explanatory view following FIG. 6. [Figure 8] It is an explanatory view following FIG. 7. [Figure 9] It is a plan view showing an example of a forming apparatus for a sealing resin according to an embodiment of the present invention. [Figure 10] It is a front view showing an example of a press device of the forming apparatus shown in FIG. 9. [Figure 11] It is a front cross-sectional view showing an example of an ingot mold of the forming apparatus shown in FIG. 9. [Figure 12] It is a plan view showing an example of a resin guard of the forming apparatus shown in FIG. 9. [Figure 13] It is a front view showing an example of a film peeling mechanism of the forming apparatus shown in FIG. 9. [Figure 14] It is an explanatory view of a method for forming a sealing resin according to an embodiment of the present invention. [Figure 15]This is an explanatory diagram following Figure 14. [Figure 16] This is an explanatory diagram following Figure 15. [Figure 17] A perspective view showing an example of a sealing resin formed by the forming apparatus and forming method according to an embodiment of the present invention. [Figure 18] A perspective view showing another example of a encapsulating resin formed by the forming apparatus and forming method according to an embodiment of the present invention. [Figure 19] A perspective view showing another example of a encapsulating resin formed by the forming apparatus and forming method according to an embodiment of the present invention. [Figure 20] A perspective view showing another example of a encapsulating resin formed by the forming apparatus and forming method according to an embodiment of the present invention. [Figure 21] This is an explanatory diagram of a conventional compression molding method. [Figure 22] This is an explanatory diagram of a conventional compression molding method. [Modes for carrying out the invention]
[0022] (Compression molding apparatus and compression molding method) The sealing resin forming apparatus 100 and forming method according to an embodiment of the present invention are an apparatus and method for forming a sealing resin R used for compression molding of a workpiece W. First, an outline of the compression molding apparatus 1 and compression molding method that perform resin sealing (compression molding) of a workpiece W using the sealing resin R will be described. Here, Figure 1 is a plan view (schematic diagram) showing an example of the compression molding apparatus 1. For the sake of explanation, arrows in the figure may indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction). In addition, in all figures used to explain each embodiment, the same reference numerals are used for members having the same function, and repeated explanations may be omitted.
[0023] The workpiece W to be sealed has a configuration in which electronic components Wb are mounted on a substrate Wa. More specifically, examples of substrate Wa include plate-shaped members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. Examples of electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, and spacers. The shape of the substrate Wa can be rectangular (strip-shaped), square, circular, etc. The number of electronic components Wb mounted on a single substrate Wa can be one or multiple (for example, in a matrix).
[0024] Examples of methods for mounting electronic components Wb onto a substrate Wa include wire bonding and flip-chip mounting. Alternatively, in configurations where the substrate (glass or metal carrier plate) Wa is peeled off the molded product Wp after resin encapsulation, the electronic components Wb can be attached using heat-release adhesive tape or UV-curable resin that hardens upon UV irradiation.
[0025] Furthermore, suitable examples of film F include film materials with excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride. Film F is also used when forming the sealing resin R in the forming apparatus 100 described later.
[0026] As shown in Figure 1, the compression molding apparatus 1 mainly comprises a supply unit 10A for supplying workpieces W, a press unit 10B for processing workpieces W into molded products Wp by resin encapsulation, and a storage unit 10C for storing the molded products Wp. As an example, the supply unit 10A, press unit 10B, and storage unit 10C are arranged in that order along the X direction in Figure 1. However, the configuration is not limited to the above, and the equipment configuration within the units, the number of units (especially the number of press units), and the arrangement order of the units can be changed. It is also possible to have a configuration with units other than those shown above (none of which are shown).
[0027] Furthermore, the compression molding apparatus 1 has a guide rail 20 provided in a straight line spanning between each unit, and a transport device (first loader) 22 for transporting the workpiece W and the sealing resin R, and a transport device (second loader) 24 for transporting the molded product Wp (which may also be used for transporting the sealing resin R) are provided to move along the guide rail 20 between predetermined units. However, the configuration is not limited to the above, and a configuration with a common (single) transport device (loader) for transporting the workpiece W, the sealing resin R, and the molded product Wp is also possible (not shown). In addition, the transport device may be configured to include a robot hand or the like instead of a loader.
[0028] Furthermore, the compression molding apparatus 1 has a control unit 30 located in the supply unit 10A that controls the operation of each mechanism in each unit (it may also be configured to have the control unit 30 located in another unit).
[0029] The press unit 10B includes a pair of sealing dies that are opened and closed by the press device 250. The sealing dies may, for example, be configured such that a cavity is provided in the upper die (sealing die 202), or, as another example, a cavity may be provided in the lower die (sealing die 302).
[0030] As an example, the steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing die 202 will be described with reference to Figures 2 to 5. In this case, the press apparatus 250 is provided with a film supply unit 211 that supplies a film F to cover the mold surface 204a (a predetermined area) including the inner surface of the cavity 208 in the upper mold 204. For example, the film F is in the form of a roll, but it may also be in the form of strips.
[0031] First, a preparation process (sealing preparation process) is carried out. Specifically, the upper mold 204 and the lower mold 206 are heated to a predetermined temperature (for example, 100°C to 300°C). In addition, the film supply unit 211 is activated to supply a new film F, which is then adsorbed to cover a predetermined area of the mold surface 204a, including the inner surface of the cavity 208 in the upper mold 204.
[0032] After the preparation process, a workpiece holding process is performed in which the workpiece W is held in the workpiece holding section 205 of the lower mold 206. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and transported into the sealing mold 202, where it is held in the workpiece holding section 205 of the lower plate 242 (mold surface 206a).
[0033] After the workpiece holding process, a resin placement process is performed in which the sealing resin R is placed on top of the workpiece W held in the workpiece holding section 205 (see Figure 2). Specifically, the sealing resin R formed in the sealing resin forming apparatus (sometimes simply referred to as the "forming apparatus") 100, which will be described later, is held by the first loader 22 (other conveying devices may also be used) and transported into the sealing mold 202, where it is placed on top of the workpiece W held in the workpiece holding section 205.
[0034] Alternatively, as another example of the resin placement process, it may be performed as a step in which the sealing resin R formed in the forming apparatus 100 is placed on the workpiece W before the workpiece holding process described above. In that case, the workpiece holding process becomes a process of holding the workpiece W with the sealing resin R placed on it in the workpiece holding section 205. That is, the first loader 22 holds the workpiece W with the sealing resin R placed on it and transports it into the sealing mold 202, where it is held in the workpiece holding section 205. This has the advantage of performing the process of placing the workpiece W and sealing resin R into the sealing mold 202 in one step, rather than separately.
[0035] Next, a resin sealing process is performed in which the workpiece W is sealed with sealing resin R to form a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is lowered relative to the cavity 208 surrounded by clamper 228, thereby performing a mold closing process in which the sealing resin R is heated and pressurized against the workpiece W. Note that Figure 3A is an enlarged view of part III in Figure 2, and during the mold closing process, the softening and melting of the sealing resin R progresses from the state in Figure 3A to the state in Figure 3B.
[0036] As a result, the sealing resin R heat-cures, completing the resin sealing (compression molding) process (see Figure 4).
[0037] The subsequent steps following the mold closing process described above are the same as those in conventional compression molding methods. In general, a mold opening process is performed in which the sealing mold 202 is opened to separate the molded product Wp from the used film F and allow the molded product Wp to be removed (see Figure 5). Next, a molded product removal process is performed in which the second loader 24 unloads the molded product Wp from inside the sealing mold 202 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. After the molded product removal process, or in parallel with it, a film supply unit 211 is activated to send the used film F out of the sealing mold 202 and feed a new film F into the sealing mold 202 and set it in place.
[0038] The above outlines the main steps of the compression molding method performed using the compression molding apparatus 1 equipped with a sealing mold 202. However, the above order of steps is merely an example, and the order can be changed or the steps performed in parallel as long as there are no obstacles.
[0039] As another example, the steps of a compression molding method performed using a compression molding apparatus 1 equipped with a sealing die 302 will be described with reference to Figures 6 to 8. In this case, the press apparatus 250 is provided with a film supply unit 311 that supplies a film F to cover the mold surface 306a (a predetermined area) including the inner surface of the cavity 308 in the lower mold 306. For example, the film F is in the form of a roll, but it may also be in the form of strips.
[0040] First, a preparation process (sealing preparation process) is carried out. Specifically, the upper mold 304 and the lower mold 306 are heated to a predetermined temperature (for example, 100°C to 300°C). In addition, the film supply unit 311 is activated to supply a new film F, which is then adsorbed to cover a predetermined area of the mold surface 306a, including the inner surface of the cavity 308 in the lower mold 306.
[0041] After the preparation process, a workpiece holding process is performed in which the workpiece W is held in the workpiece holding section 305 of the upper mold 304. Specifically, the workpiece W supplied from the supply magazine 12 is held by the first loader 22 and transported into the sealing mold 302, where it is held in the workpiece holding section 305 of the upper plate 342 (mold surface 304a).
[0042] The resin holding process is performed after the workpiece holding process (however, it may be performed before or in parallel with the workpiece holding process). The resin holding process has the following steps: The sealing resin R is held in the cavity 308 of the lower mold 306 (see Figure 6). Specifically, the sealing resin R formed in the forming apparatus 100 is held by the first loader 22 (other conveying devices may also be used) and transported into the sealing mold 302 and housed in the cavity 308 (specifically, it is placed on the upper surface of the cavity piece 326).
[0043] Next, a resin sealing process is carried out to seal the workpiece W with a sealing resin R to process it into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is raised relative to the workpiece W within the cavity 308 surrounded by the clamper 328, thereby performing a mold closing process in which the sealing resin R is heated and pressurized. As a result, the sealing resin R is heat-cured and the resin sealing (compression molding) is completed (see Figure 7).
[0044] The subsequent steps following the mold closing process described above are the same as those in conventional compression molding methods. In general, a mold opening process is performed in which the sealing mold 302 is opened to separate the molded product Wp from the used film F and allow the molded product Wp to be removed (see Figure 8). Next, a molded product removal process is performed in which the second loader 24 unloads the molded product Wp from inside the sealing mold 302 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 14. After the molded product removal process, or in parallel with it, a film supply unit 311 is activated to send the used film F out of the sealing mold 302 and feed a new film F into the sealing mold 302 and set it in place.
[0045] The above outlines the main steps of the compression molding method performed using the compression molding apparatus 1 equipped with a sealing die 302. However, the above order of steps is merely an example, and the order can be changed or the steps performed in parallel as long as there are no obstacles.
[0046] (Sealing resin forming apparatus) Next, the forming apparatus 100 for forming the sealing resin R used in the above-described compression molding apparatus 1 and compression molding method will be explained with reference to Figures 9 to 13. The forming apparatus 100 processes the base resin Rm to form the sealing resin R. Here, Figure 9 is a plan view (schematic diagram) showing an example of the forming apparatus 100. The forming apparatus 100 may be installed either inside or outside the compression molding apparatus 1.
[0047] In this embodiment, a thermosetting resin (for example, an epoxy resin containing a filler, but not limited to this) is used as the base resin Rm and the sealing resin R formed from the base resin Rm. The sealing resin R is formed as a solid or semi-solid resin having a predetermined shape (details described later) whose overall shape corresponds to the shape of the workpiece W. Normally, one piece constitutes the "whole" amount required for sealing (one batch per workpiece W), but it may also be configured so that several pieces (for example, two or three pieces) constitute the "whole" amount required for sealing. Furthermore, the above "semi-solid" refers not to a completely solid state but to a state that has melted to the so-called B stage. In addition, a powder resin (powdered resin form) which is a thermosetting resin (property) is preferably used as the base resin Rm. However, it is not limited to this, and a granular resin, crushed resin, solid resin, liquid resin, or a resin combining several of these may be used.
[0048] As shown in Figure 9, the forming apparatus 100 mainly comprises a supply unit 100A for supplying base resin Rm, a forming unit 100B for forming encapsulating resin R from base resin Rm, a storage unit 100C for peeling and storing the formed encapsulating resin R, a transport unit 100D for transporting base resin Rm and encapsulating resin R, and a control calculation unit 100E for controlling the operation of each mechanism.
[0049] First, the transport unit 100D includes, as an example, a guide rail 167 laid between the supply unit 100A and the storage unit 100C, a first transport device (loader) 168 that moves along the guide rail 167 to transport the base resin Rm, and a second transport device (loader) 169 that transports the sealing resin R. However, the configuration is not limited to the above, and a common (single) transport device (loader) for transporting the base resin Rm and the sealing resin R may also be provided. Furthermore, although the transport devices (loaders) 168 and 169 are configured to move in the X and Y directions, a configuration in which a transport device that moves in the X direction and a transport device that moves in the Y direction are provided separately may also be provided. In addition, the transport device may be configured to include a robot hand or the like instead of a loader (neither of which is shown).
[0050] Next, the forming section 100B includes, as an example, a forming die 102 having a pair of dies (for example, a set of multiple die blocks, die plates, die pillars, and other components made of alloy tool steel assembled together) that are opened and closed by a press device 150. A front view (schematic diagram) of the press device 150 is shown in Figure 10. A front cross-sectional view (schematic diagram) of the forming die 102 is shown in Figure 11.
[0051] As shown in Figure 10, the press device 150 is configured to include a pair of platens 154 and 156, a plurality of tie bars 152 on which the pair of platens 154 and 156 are mounted, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (however, it is not limited to this). In this embodiment, the upper platen 154 in the vertical direction is set as a fixed platen (a platen fixed to the tie bar 152), and the lower platen 156 is set as a movable platen (a platen that is slidably held by the tie bar 152 and moves up and down). However, it is not limited to this, and the top and bottom may be reversed, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper and lower sides may be set as movable platens (none of which are shown).
[0052] On the other hand, as shown in Figure 10, the forming die 102 is a pair of dies arranged between the pair of platens 154 and 156 in the press device 150, and comprises an upper die 104 on the upper side in the vertical direction and a lower die 106 on the lower side. The upper die 104 is assembled to the upper platen (fixed platen 154 in this embodiment), and the lower die 106 is assembled to the lower platen (movable platen 156 in this embodiment). The mold is closed and opened by the upper die 104 and the lower die 106 moving closer to and further apart from each other (the vertical direction (up and down direction) is the mold opening and closing direction). In this embodiment, powder resin is preferably used as the base resin Rm, and the forming die 102 is configured as a "tablet mold" that forms a sealing resin R by tableting the base resin Rm (powder resin) in the mold closing process. Specifically, the upper die 104 constitutes a so-called "punch mold," and the lower die 106 constitutes a so-called "die mold."
[0053] Next, the lower mold 106 of the forming mold 102 will be described in detail. As shown in Figure 11, the lower mold 106 comprises a lower mold chase 110 and a cavity piece 126, clamper 128, etc., held by it. The lower mold chase 110 is fixed to the upper surface of the support plate 114 via a support pillar 112. A cavity 108 is provided on the upper surface of the lower mold 106 (the surface on the upper mold 104 side). A predetermined amount of base resin Rm is contained within this cavity 108.
[0054] The clamper 128 is configured in an annular shape to surround the cavity die 126 and is assembled to move vertically while floating away from the upper surface of the support plate 114 via a push pin 122 and a clamper spring 124 (for example, a biasing member exemplified by a coil spring) (however, it is not limited to this assembly structure). The cavity die 126 constitutes the back (bottom) of the cavity 108, and the clamper 128 constitutes the side of the cavity 108. The shape and number of cavities 108 provided in one lower die 106 are set as appropriate (one or more).
[0055] Furthermore, the lower mold 106 is provided with suction passages (holes, grooves, etc.) that communicate with a suction device on the upper surface of the clamper 128 and at the boundary between the clamper 128 and the cavity piece 126 (not shown). This allows the film F (strip-shaped film), which is fed in with the base resin Rm placed on it by the resin guard 400 described later, to be adsorbed and held on the mold surface 106a, including the inner surface of the cavity 108.
[0056] Furthermore, in this embodiment, a lower mold heating mechanism (not shown) is provided to heat the lower mold 106 to a predetermined temperature. This lower mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control calculation unit 100E. As an example, the heater is built into the lower mold chase 110 and is configured to apply heat to the entire lower mold 106 and the base resin Rm contained in the cavity 108. At this time, the lower mold 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) such that the base resin Rm does not undergo thermal curing (full curing).
[0057] In addition, the lower mold 106 described above has a structure with a movable clamper (clamper 128) as an example, but it may also have a structure without a movable clamper as an example (not shown).
[0058] Next, the upper mold 104 of the forming die 102 will be described in detail. As shown in Figure 11, the upper mold 104 is equipped with a tableting plate 142 that presses a predetermined amount of base resin Rm contained in the cavity 108 of the lower mold 106 to form (tablet) a sealing resin R having a predetermined shape corresponding to the shape of the workpiece W (details of the forming method will be described later). The tableting plate 142 is held (fixed) in the upper mold chase 140. As an example, a leg-forming groove (including a recess) 143 for forming the leg portion Rb of the sealing resin R is provided on the lower surface (the surface on the lower mold 106 side) of the tableting plate 142. Although the leg-forming groove 143 is provided on the tableting plate 142, it may also be provided on the cavity die 126, or on both.
[0059] Here, the press device 150 is provided with an upper die film supply unit 113 that supplies a film F to cover the die surface 104a (a predetermined area) of the upper die 104. For example, the film F is in the form of a roll, but it may also be in the form of strips.
[0060] Furthermore, the upper mold 104 is provided with a suction passage (hole or groove, etc.) in the tablet pressing plate 142, etc., which communicates with a suction device (not shown). This allows the film F supplied from the upper mold film supply unit 113 to be adsorbed onto the mold surface 104a and held in place.
[0061] Furthermore, in this embodiment, an upper mold heating mechanism (not shown) is provided to heat the upper mold 104 to a predetermined temperature. This upper mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by the control calculation unit 100E. As an example, the heater is built into the upper mold chase 140 and is configured to apply heat to the entire upper mold 104. At this time, the upper mold 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) such that the base resin Rm held (housed) in the lower mold 106 does not undergo thermal curing (full curing).
[0062] Next, the supply unit 100A includes, for example, a film supply unit 165 for supplying film F (strip-shaped film). It also includes a dispenser 166 for supplying (discharging) base resin Rm. In this embodiment, a resin guard (conveyor) 400 is used to hold the film F (strip-shaped film) and the base resin Rm, and they are conveyed by a loader 168. Multiple resin guards 400 are provided as needed and are configured to be used in a circulating manner.
[0063] As shown in Figure 12, the resin guard 400 has a housing section 402 for housing the base resin Rm. A through hole 404 is formed in the housing section 402, penetrating in the vertical direction, and an adsorption hole 408 for adsorbing the film F is drilled in the peripheral edge 406 of the through hole 404. With this configuration, the base resin Rm can be placed on and held on the film F inside the through hole 404 while the strip-shaped film F is adsorbed so as to block the through hole 404 from the bottom side. The size of the through hole 404 is slightly smaller than the cavity 108 of the molding die 102. The thickness of the resin guard 400 is the thickness required to transport the base resin Rm (powder resin) into the cavity 108 of the molding die 102 for formation.
[0064] Next, the storage section 100C includes, for example, a film peeling mechanism 170 for peeling the film F from the sealing resin R formed by tableting the base resin Rm (powder resin). It also includes a storage magazine 192 for storing the sealing resin R after the film F has been peeled off. A known stack magazine or the like can be used for the storage magazine 192. It also includes an inversion mechanism 194 for inverting the sealing resin R so that its upper and lower surfaces are reversed. Depending on the configuration of the forming mold 102 and the configuration of the sealing resin R to be formed, the inversion mechanism 194 may be omitted if inversion is not necessary (not shown).
[0065] As shown in Figure 13, the film peeling mechanism 170 includes an adsorption stage 172 on either its upper or lower surface, which has an adsorption section 174 for adsorbing the surface of the sealing resin R to be adsorbed (the surface not covered by the strip-shaped film F) (for the sake of simplicity in the figure, the sealing resin R is shown as a roughly plate-shaped object). With this configuration, the sealing resin R can be held on the adsorption stage 172 without clamping, thus preventing cracking of the sealing resin R caused by clamping.
[0066] Furthermore, the film peeling mechanism 170 includes a gripping portion 176 that grips one end of the film F and moves toward the other end. With this configuration, the film F can be peeled from the sealing resin R while it is held in place by adsorption on the adsorption stage 172. As an example, the mechanism for gripping the film F uses gripping claws, but it is not limited to this, and a configuration using an adsorption pad or the like may also be used (not shown).
[0067] Furthermore, the film peeling mechanism 170 includes a tension roller 178 that moves linearly in the same direction as the gripping part 176 moves, applying tension to the film F by causing it to roll (or slide) against a part of the circumferential surface as the gripping part 176 grips one end of the film F and moves toward the other end. The gripping part 176 grips the end of the film, and then the gripping part 176 moves diagonally upward in the peeling direction. do This allows it to be wrapped around the tension roller 178.
[0068] As an example, the gripping portion 176 and the tension roller 178 are positioned on the same side of the suction stage 172 as the surface on which the suction force from the suction portion 174 is generated. Furthermore, the central axis of the tension roller 178 is positioned perpendicular to the linear movement direction.
[0069] Furthermore, the film peeling mechanism 170 has a support portion 182 that rotatably supports the tension roller 178, and a tension portion 180 that provides resistance to restrict the linear movement of the tension roller 178.
[0070] The tension section 180 is configured, for example, to include a linear motion mechanism 184 using an air cylinder (a mechanism that linearly moves the support section 182 in the same direction as the gripping section 176), and the above-mentioned "resistance" is set by the linear motion mechanism 184 (for example, by sliding resistance or operating force). Note that the sliding resistance of air exhaust vented to the atmosphere may be used alone, or the exhaust pressure may be controlled. Alternatively, as another example, a linear motion mechanism using an electric motor and a ball screw may be included (not shown). In any of the above examples, instead of a configuration in which the "resistance" is set to a constant value, it may be configured to be variably controlled by the control calculation unit 100E.
[0071] With this configuration, when peeling the film F from the sealing resin R, an appropriate tension that is not too strong can be applied to the film F, thereby preventing cracking of the sealing resin R caused by excessive tension.
[0072] (Method for forming encapsulating resin) Next, the steps of the method for forming the sealing resin according to this embodiment, which is carried out using the forming apparatus 100 described above, will be explained. Here, Figures 14 to 16 are explanatory diagrams of each step, and are shown as front cross-sectional views in the same direction as Figure 11.
[0073] First, a preparation process (tablet preparation process) is carried out. The preparation process consists of the following steps: A lower mold heating process is carried out in which the lower mold 106 is heated to a predetermined temperature (a temperature at which the base resin Rm and sealing resin R do not fully harden, for example, 50°C to 80°C) using a lower mold heating mechanism. An upper mold heating process is carried out in which the upper mold 104 is heated to a predetermined temperature (a temperature at which the base resin Rm and sealing resin R do not fully harden, for example, 50°C to 80°C) using an upper mold heating mechanism. An upper mold film supply process is carried out in which a new film F is supplied by operating the upper mold film supply unit 113 and adsorbed to cover a predetermined area of the mold surface 104a of the upper mold 104.
[0074] After the preparation step, the film F is adsorbed and held in place so as to block the through-hole 404 of the resin guard 400. In this state, the base resin Rm is supplied (discharged) onto the film F from the dispenser 166. Next, the film F and base resin Rm held in place by the resin guard 400 are transported by the loader 168, and a setting step is performed in which the film F and base resin Rm are set in a predetermined position in the molding mold 102 (in this case, so as to be housed in the cavity 108 of the lower mold 106) (see Figure 14). The resin guard 400 after the film F and base resin Rm have been set is returned to the supply unit 100A by the loader 168.
[0075] After the setting process, a forming process is carried out in the forming die 102, where the base resin Rm is heated and pressurized with the film F interposed between them to form a sealing resin R of a predetermined shape. The forming process according to this embodiment includes a tableting process in which the base resin Rm is tableted to form a solid or semi-solid resin as the sealing resin R, having a "predetermined shape" (details described later) whose overall shape corresponds to the shape of the workpiece W. Specifically, the press device 150 is operated to perform a process (mold closing process) in which the forming die 102, which has been heated to the predetermined temperature, is closed (see Figure 15). At this time, the cavity piece 126 rises relatively within the cavity 108, and the base resin Rm is tableted (pressurized by being sandwiched) between the cavity piece 126 and the tableting plate 142. As a result, a solid or semi-solid sealing resin R having a predetermined shape and in a state that has not yet undergone heat curing (full curing) is formed. At this time, the base resin Rm that enters the leg-forming groove 143 of the tablet plate 142 via the film F becomes the leg Rb of the sealing resin R, and the remaining base resin Rm becomes the main body Ra of the sealing resin R (the detailed configuration of the sealing resin R will be described later). As a variation of the tableting process, a part of the base resin Rm may be held (welded, gripped, etc.) by the upper die 104 (not shown).
[0076] Furthermore, it is important that the above tablet compression process is carried out at a temperature at which the base resin Rm does not heat-cur (mainly harden) so that the formed encapsulating resin R can be heat-cured (mainly hardened) in the resin encapsulation process (one step of the compression molding method) later carried out in the compression molding apparatus 1 (by heating the lower mold 106 and upper mold 104 to a temperature at which heat-curing (mainly hardening) does not occur). As mentioned above, the "temperature at which heat-curing does not occur" depends on the material of the base resin Rm, but as a specific example, it is about 50°C to 80°C (in this embodiment, it is about 70°C).
[0077] Here, the "predetermined shape" of the sealing resin R will be explained. As an example, in the case of a sealing resin R used in a compression molding apparatus 1 equipped with a sealing mold 202, the "predetermined shape" is a shape that does not come into contact with the electronic component Wb (including the wire if the electronic component Wb has a wire) when placed on the base material Wa of the workpiece W. As an example, as shown in Figure 2, a sealing resin R with a plate-shaped or block-shaped main body Ra and legs Rb intermittently (or continuously) erected on one surface of the main body Ra (the surface of the workpiece W facing the electronic component Wb) is preferred (however, it is not limited to this shape). The main body Ra is sized to fit inside the cavity 208 in a plan view, and considering resin flow, it is preferable that it be slightly smaller than the shape of the cavity 208 (especially the cavity block 226). In addition, the legs Rb need to have a height H (see Figure 3A) that does not come into contact with the electronic component Wb, but this does not exclude contact to the extent that the wire does not undergo plastic deformation. Furthermore, the legs Rb are positioned so as not to contact the electronic components Wb in a plan view of the main body Ra, and so as not to tilt the main body Ra when placed on the base material Wa of the workpiece W. In addition, it is preferable that the legs Rb be positioned between or around the electronic components Wb to minimize damage to the wiring (especially wires) of the workpiece W during molding. The total amount of resin for the plate-shaped or block-shaped main body Ra and the legs Rb may be an amount that is neither too much nor too little, or a large amount of resin, so as not to be insufficient for a single compression molding. Specific examples of the configuration of the sealing resin R (Figures 17 to 20) will be described later.
[0078] As another example, in the case of a sealing resin R used in a compression molding apparatus 1 equipped with a sealing mold 302, the "predetermined shape" is such that, when closing the sealing mold 302, the upper mold 304 is gradually brought closer to the lower mold 306, and the tip (upper end) of the leg portion Rb of the sealing resin R housed in the cavity 308 comes into contact with the base material Wa of the workpiece W held by the workpiece holding portion 305, the main body portion Ra of the sealing resin R does not come into contact with the electronic component Wb of the workpiece W (including the wire if the electronic component Wb has a wire). The specific shape of the sealing resin R is the same as in the case of a sealing resin R used in a compression molding apparatus 1 equipped with a sealing mold 202 (see Figures 17 to 20), so repeated explanations are omitted. However, the sealing resin R is not limited to the configuration shown in Figures 17 to 20, and may have a configuration in which the upper surface is formed in a flat shape without providing the leg portion Rb on the upper surface (not shown).
[0079] Next, the resin quantity setting process for setting the "determined amount" of the base resin Rm will be explained. As an example of the resin quantity setting process, for each workpiece W to be sealed, the control calculation unit 100E acquires data obtained by measuring the number of electronic components Wb mounted on a single base material Wa (this can be the number mounted or the number missing, and may also include measuring the height of each electronic component Wb, and measuring the thickness of the base material Wa and the weight of the workpiece W) using a measuring mechanism (not shown). Then, based on the measurement data, the control calculation unit 100E calculates the amount of resin (in grams) required for resin sealing (compression molding) for each workpiece W. Alternatively, as another example of the resin quantity setting process, multiple standard quantities corresponding to the type of workpiece W to be sealed are prepared, and the control calculation unit 100E or the operator selects the optimal one from among these standard quantities according to the type of workpiece W to set the "determined amount". In the case of standard quantities, it is important that there is no shortage of resin during resin sealing (compression molding). In either setting, an appropriate amount of base resin Rm can be supplied to the workpiece W. Therefore, it is possible to prevent molding defects caused by insufficient resin during resin encapsulation. Furthermore, it is possible to prevent waste caused by supplying more resin than necessary.
[0080] Furthermore, it is preferable to use powdered resin as the base resin Rm. This allows for extremely precise adjustment and supply of the resin in the specified amount compared to cases where granular resin or crushed resin is used. However, it is not limited to powdered resin.
[0081] After the tableting process, the mold 102 is opened to separate the sealing resin R from the used film F (the roll-shaped film F attached to the first surface of the sealing resin R) and to allow the sealing resin R to be removed (see Figure 16). For the sake of explanation, the surface of the sealing resin R that is pressurized and formed by the upper mold 104 is referred to as the "first surface," and the surface that is pressurized and formed by the lower mold 106 is referred to as the "second surface."
[0082] After the mold opening process, or concurrently thereafter, the upper mold film supply unit 113 is activated to feed out the used film F (roll-shaped film) for the upper mold 104 from inside the forming mold 102, and a new film F is fed into the forming mold 102 and set on the upper mold 104 (mold surface 104a) in an upper mold film supply process.
[0083] Furthermore, after the mold opening process, a loading process is performed in which the sealing resin R is unloaded from the forming mold 102 by the loader 169 and transported to the storage section 100C. In this embodiment, the used film F (strip-shaped film) for the lower mold 106 is attached to the second surface of the sealing resin R when it is transported to the storage section 100C.
[0084] After the unloading process, a peeling process is performed to peel the film F (the strip-shaped film F attached to the second surface of the sealing resin R) from the sealing resin R. In this embodiment, first, an inversion process is performed in which the sealing resin R is inverted vertically using the inversion mechanism 194. This makes it possible to have the second surface of the sealing resin R to which the strip-shaped film F is attached facing upwards, and the first surface to which the strip-shaped film F is not attached facing downwards. If inversion is not necessary, the above inversion process can be omitted.
[0085] After the inversion process, the sealing resin R (with the first surface facing downwards) is placed on the suction stage 172. Next, the suction unit 174 is activated to generate suction force, and the sealing resin R is adsorbed and held on the suction stage 172 (the first surface becomes the surface to be adsorbed). Then, the gripping unit 176 grips (clamps) one end of the film F and moves toward the other end. More specifically, the gripping unit 176, which is gripping one end of the film F, first moves diagonally upward (in the direction of arrow A), and then moves horizontally (in the direction of arrow B) (see Figure 13). Through these movements, the film F (strip-shaped film) can be peeled off from the sealing resin R (second surface).
[0086] Here, as the gripping portion 176 moves, the tension roller 178 moves linearly in the same direction as the gripping portion 176, while the film F is brought into rolling (or sliding) contact with a part of the circumferential surface of the tension roller 178 (note that the distance traveled by the gripping portion 176 is longer than that of the tension roller 178). At this time, the tension portion 180 applies resistance to the movement of the tension roller 178 (resistance that acts to suppress linear movement, i.e., a force acting in the opposite direction to the direction of movement). As described above, this resistance is set to a constant value by the sliding resistance and operating force of the linear motion mechanism 184, but as a modified example, it may be configured to be variably controlled by the control calculation unit 100E, that is, a configuration in which the resistance can be changed as appropriate according to the material of the sealing resin R and the film F.
[0087] As mentioned above, the sealing resin R before full curing has low rigidity (brittleness) and low strength, making it prone to cracking. With the above configuration, the sealing resin R can be held on the adsorption stage 172 without clamping, thus preventing cracking of the sealing resin R. Furthermore, when peeling the film F, an appropriate tension that is not too strong can be applied to the film F, thus preventing cracking of the sealing resin R.
[0088] After the peeling process, the peeled film F (strip-shaped film) is disposed of in a disposer (not shown). The sealing resin R is then stored in the storage magazine 192.
[0089] The above outlines the main steps of the method for forming the sealing resin R using the forming apparatus 100. However, the above order of steps is just one example, and the order can be changed or the steps performed in parallel as long as there are no obstacles.
[0090] (Sealing resin) Next, Figures 17 to 20 show specific examples of the configuration of the sealing resin R formed by the above-described forming apparatus 100 and forming method, and their respective characteristics will be explained.
[0091] First, as a configuration common to each example shown in Figures 17 to 20, the main body Ra is formed in a plate shape (however, other shapes such as a block shape with recesses or protrusions may also be used). The legs Rb are erected on the main body Ra so as not to come into contact with the electronic components Wb of the workpiece W when the sealing resin R is placed on the base material Wa of the workpiece W, and are formed to a height H (see Figure 3A, etc.) that ensures a distance that prevents the main body Ra from coming into contact with the electronic components Wb. As described above, in the tableting process, the base resin Rm that enters the leg-forming groove 143 of the tableting plate 142 via the film F becomes the legs Rb of the sealing resin R, and the remaining base resin Rm becomes the main body Ra of the sealing resin R.
[0092] In the example of the sealing resin R shown in Figure 17, the legs Rb are formed as convex bodies Rb1, which are arranged in a point-like manner (either entirely or partially). As an example of the convex bodies Rb1, they are arranged at multiple positions and are formed in a shape such that the ratio t of length L1 to width W1 in a plan view is 0.5 ≤ t ≤ 2. With this configuration, the columnar shape in which the legs Rb are arranged in a point-like manner can suppress the flow of the sealing resin R placed on the workpiece W during compression molding. Therefore, wire flow and other issues can be prevented, and molding quality can be improved.
[0093] In the example of the encapsulation resin R shown in FIG. 18, the leg portion Rb is formed as a convex body Rb2, a part of which (or all of it may also be) is arranged linearly. As an example of the convex body Rb2, it is arranged at one position (or may be at a plurality of positions), and in a plan view, the ratio t of the length L2 to the width W2 is formed in a shape where, as an example, t < 0.5 or 2 < t. According to this, resin flow is intentionally generated from the leg portion Rb (in this case, the convex body Rb2) having a dike-like configuration of a predetermined length, and filling of the encapsulation resin R into a narrow portion in the workpiece W (for example, between the substrate Wa connected by flip chip and the electronic component Wb, etc.) can be promoted. Therefore, it is possible to prevent gas from remaining in the molded product Wp and improve the molding quality.
[0094] In the example of the encapsulation resin R shown in FIG. 19, the leg portion Rb is formed as a convex body Rb3 that is arranged to intermittently (or may be continuously) surround the entire outer periphery (referring to the outer edge region) of the main body portion Ra. As an example of the convex body Rb3, a convex body having the same configuration as the above Rb2 is formed continuously in a circumferential shape while providing a gap L3 at a predetermined interval. Generally, the outer peripheral position of the encapsulation resin R in the molded product Wp is the position where it is cut by a dicing machine or the like when being separated into individual pieces, and since there is no electronic component Wb, a larger amount of resin for encapsulation is required compared to the central position. Therefore, by providing a leg portion Rb (in this case, the convex body Rb3) arranged to surround the entire outer periphery as in this configuration, it is possible to supply a large amount of resin to the outer peripheral position while suppressing resin flow during compression molding. Furthermore, by providing the gap L3, the discharge of gas components such as air from the inside (central part) to the outside is promoted.
[0095] On the other hand, the example of the sealing resin R shown in Figure 20 is a configuration example relating to the other surface of the main body Ra (the surface on which the leg portion Rb is not provided, i.e., the surface on which the workpiece W does not face the electronic component Wb). Specifically, on the other surface of the main body Ra, linear groove portions Rg are formed at the positions where dicing for individual piece formation is performed. This reduces wear on the dicing blade and reduces dust generated during dicing. As an example, the groove portions Rg are provided in a grid pattern that coincides with the dicing positions, but this is not the only option. In order to form the groove portions Rg, the tableting process can be carried out using a cavity die 126 on which a correspondingly shaped projection (not shown) is provided on the upper surface.
[0096] As described above, the forming apparatus 100 according to the present invention allows the sealing resin R to be held without clamping when peeling off the film F that has adhered to the sealing resin R during the forming process. Furthermore, the peeling operation of the film F can be performed while applying an appropriate tension that is not too strong to the film F. Therefore, it is possible to prevent cracking or breakage from occurring in the sealing resin R before it has fully cured.
[0097] Furthermore, by using the sealing resin R formed by the forming apparatus 100 and forming method, a compression molding apparatus 1 and compression molding method can be realized that provide the following effects. Specifically, the compression molding apparatus 1 and compression molding method enable resin flow, Sprinkling This system prevents molding defects caused by uneven molding, residual gas, and dust generation during molding. Furthermore, it can form not only thin molded products (Wp) with a thickness of less than 1 mm, but also thick molded products (Wp) with a thickness of 1 mm or more. While the upper limit of the thickness depends on various setting conditions, it is considered possible to form products up to approximately 10 mm thick. Additionally, handling during supply and setup is facilitated.
[0098] Furthermore, the compression molding apparatus 1 and compression molding method can solve the problems that arise when a cavity is provided in the upper mold. Specifically, in conventional compression molding apparatuses where a cavity is provided in the upper mold, for example, when performing a mold closing process on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, the wire portion of the workpiece held in the lower mold comes into contact with the sealing resin supplied to the cavity beforehand or the sealing resin supplied onto the workpiece, causing deformation and cutting, which makes resin sealing difficult. This problem can be solved by adopting a configuration in which the sealing resin R formed by the apparatus and method according to this embodiment is a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.
[0099] Specifically, during the mold closing process, the sealing resin R softens and melts due to heating, as shown in Figure 3A to Figure 3B. At this time, the resin (specifically, the main body Ra) comes into uniform contact with all the wires (see Figure 3B). Therefore, deformation and breakage of the wires can be prevented.
[0100] Furthermore, when experiments were actually conducted using the above-described compression molding apparatus 1 with the sealing resin R formed by the apparatus and method according to this embodiment, it was confirmed that, compared to a conventional compression molding apparatus having a configuration in which the workpiece W is held in the upper mold, a cavity is provided in the lower mold, and sealing resin (specifically, granular resin) is supplied to the cavity, wire deformation and breakage were prevented and molding quality was improved.
[0101] On the other hand, the compression molding apparatus 1 and compression molding method can also solve the problems that arise when a cavity is provided in the lower mold. In other words, in conventional compression molding apparatuses where a cavity is provided in the lower mold, especially when granular resin is used as the sealing resin, the particle size and height (layer thickness) of the sealing resin (granular resin) contained in the cavity are not uniform. For example, depending on the type and melting state of the granular resin, it may not be completely liquid (low viscosity), and when performing the mold closing process on a workpiece W on which a strip-type wire-connected electronic component (semiconductor chip) Wb is mounted, as shown in Figure 21, depending on the position, the wire portion of the workpiece held in the upper mold may come into strong (large) contact with the sealing resin (granular resin), causing deformation and cutting. Furthermore, as shown in Figure 22, there was a problem that a large amount of resin flow occurred in the cavity, causing deformation and cutting of the wire portion. This problem can be solved by adopting a configuration that uses a sealing resin R formed by the apparatus and method according to this embodiment, that is, a solid or semi-solid resin formed into a predetermined shape corresponding to the shape of the workpiece W.
[0102] Specifically, the reason is the same as explained in Figures 3A and 3B above: during the mold closing process, the sealing resin R softens and melts due to heating, resulting in a state where the resin (specifically, the main body Ra) comes into uniform contact with all the wires. From this perspective, the sealing resin R is not limited to the configurations shown in Figures 17 to 20, and may also be configured (not shown) with a flat top surface without the legs Rb on the top surface. Even with this configuration, it is possible to solve the problems caused by the non-uniformity of particle size and height (layer thickness) compared to conventional technology using granular resin.
[0103] Furthermore, by making the forming device 100 a separate device from the compression molding device 1, the compression molding device 1 can be made unaffected by dust generated when the powder resin inside the forming device 100 is compressed into tablets, and the compression molding device 1 can be easily placed inside a clean room. However, the configuration is not limited to this, and the forming device 100 may also be installed integrally within the compression molding device 1.
[0104] Furthermore, the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the scope of the invention. [Explanation of Symbols]
[0105] 1. Compression molding apparatus 100 Apparatus for forming encapsulating resin 102 Forming mold 170 Film peeling mechanism 202, 302 Sealing mold F Release Film Rm base resin R Sealing resin Double job
Claims
1. A forming apparatus for forming a sealing resin used in the compression molding of a workpiece, A forming mold having a pair of lower and upper molds that open and close, which contains and heats and pressurizes a base resin with a release film interposed therein to form the sealing resin of a predetermined shape, The system includes a film peeling mechanism for peeling the release film from the sealing resin that is formed, The film peeling mechanism has a gripping portion that grips one end of the release film and moves toward the other end. A sealing resin forming apparatus characterized by the following.
2. Powder resin is used as the base resin. The forming die is a tableting die for compressing the powder resin into tablets. The apparatus for forming a sealing resin according to claim 1, characterized by the above.
3. The forming mold is set to a heating temperature at which the base resin does not heat-cur, so that the formed sealing resin can be heat-cured when it is used for compression molding of the workpiece. An apparatus for forming a sealing resin according to claim 1 or claim 2, characterized by the above.
4. The film release mechanism includes a tension roller that moves linearly in the same direction as the gripping portion moves, while applying tension to the release film by causing it to roll or slide against a part of its circumferential surface as the gripping portion grips one end of the release film and moves toward the other end. The apparatus for forming a sealing resin according to claim 1, characterized by the above.
5. The film peeling mechanism has a tension section that rotatably supports the tension roller and applies resistance to restrict the linear movement of the tension roller. The apparatus for forming a sealing resin according to claim 4, characterized by the above.
6. The tensioning section has a linear motion mechanism using an air cylinder or an electric motor, and the resistance is set or variably controlled by the linear motion mechanism. The apparatus for forming a sealing resin according to claim 5, characterized by the above.
7. The film peeling mechanism has an adsorption stage on which an adsorption portion for adsorbing the sealing resin is provided on either the upper or lower surface, The gripping portion and the tension roller are positioned on the same side as the surface on which the suction portion is provided relative to the suction stage. The apparatus for forming a sealing resin according to claim 4, characterized by the above.
8. The sealing resin is further provided with an inversion mechanism that inverts the upper and lower surfaces so that they are reversed. An apparatus for forming a sealing resin according to claim 1 or claim 2, characterized by the above.