Manufacturing method for conductive parts

Abstract

To provide an improved new method for producing a conductive component, and to obtain the conductive component.SOLUTION: A method for producing a conductive component comprises a first process where at least a part of a conductive component is subjected to lamination molding. The first process comprises: a step where metal powders are mutually coupled to form a conductor layer; and a step where metal powders are mutually coupled onto the conductor layer for plural times to laminate the conductive layers. The metal powder may be made of a copper-based metal or an aluminum-based metal. Further, at least a part of the conductive component may be subjected to lamination molding so that the surface of at least a part of the conductive component is provided with plural projecting parts with a height of 0.1 to 2 mm or plural recessed parts with a depth of 0.1 to 2 mm.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a conductive component and a conductive component.

Background Art

[0002] As a conventional conductive component, a bus bar made by press molding is known (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When manufacturing a conductive component by press molding, a mold is required. Since this mold is expensive, there were problems such that the price would not decrease unless the production quantity increased, or it was difficult to execute a shape change that required another mold from the perspective of cost reduction once the mold was manufactured, or the like. Also, in the case of a component with a complex shape, there were problems such that multiple press moldings were required, or it could not be made by press molding depending on the shape.

[0005] Therefore, one of the problems of the present invention is to obtain an improved and novel method for manufacturing a conductive component and the conductive component that can solve the above-described problems that occur when manufacturing a conductive component by press molding, for example.

Means for Solving the Problems

[0006] A method for manufacturing a conductive component of the present invention comprises, for example, a first step of additively manufacturing at least a part of the conductive component, the first step of bonding metal powders together to form a conductive layer, and a step of bonding metal powders together multiple times on the conductive layer to laminate the conductive layer.

[0007] In the method for manufacturing the conductive component, the metal powder may be made of a copper-based metal or an aluminum-based metal.

[0008] In the method for manufacturing the conductive component, in the first step, at least a portion of the conductive component may be additively fabricated such that the arithmetic mean roughness of at least a portion of the surface of the conductive component is 10 [μm] or more and 100 [μm] or less.

[0009] In the method for manufacturing the conductive component, in the first step, at least a portion of the conductive component may be additively fabricated such that the filling rate of at least a portion of the conductive component is 90% or more and 96% or less.

[0010] In the method for manufacturing the conductive component, in the first step, at least a portion of the conductive component may be additively fabricated such that a plurality of protrusions having a height of 0.1 mm or more and 2 mm or less, or a plurality of recesses having a depth of 0.1 mm or more and 2 mm or less, are provided on the surface of at least a portion of the conductive component.

[0011] In the method for manufacturing the conductive component, in the first step, at least a portion of the conductive component may be additively fabricated so that a cavity is provided inside the conductive component.

[0012] In the method for manufacturing the conductive component, in the first step, at least a portion of the conductive component may be additively fabricated such that its thickness varies depending on its location.

[0013] In the method for manufacturing the conductive component, in the first step, at least a portion of the conductive component may be additively fabricated such that the conductive component has a base and a plurality of branches connected to the base.

[0014] In the method for manufacturing the conductive component, in the first step, at least a portion of the conductive component may be additively fabricated such that the filling rate differs depending on the location of the conductive component.

[0015] In the method for manufacturing the conductive component, in the first step, at least a portion of the conductive component may be additively fabricated such that the arithmetic mean roughness of the surface differs depending on the location of the conductive component.

[0016] The method for manufacturing the conductive component may include a second step of joining a first conductor member made in the first step with a second conductor member different from the first conductor member.

[0017] In the method for manufacturing the conductive component, the first conductor member and the second conductor member may be welded together in the second step.

[0018] In the method for manufacturing the conductive component, the first conductor member and the second conductor member may be welded together in the second step.

[0019] In the method for manufacturing the conductive component, the first conductor member and the second conductor member may be welded together in the second step by irradiating them with laser light having a wavelength of 1200 nm or less.

[0020] In the method for manufacturing the conductive component, the wavelength of the laser light may be 400 nm or more and 500 nm or less.

[0021] The conductive component of the present invention has, for example, a layered fabrication portion having layer lines formed by additive manufacturing, and the layered fabrication portion has a surface with an arithmetic mean roughness of 10 [μm] or more and 100 [μm] or less.

[0022] Further, the conductive component of the present invention has, for example, a laminated molding part having a lamination mark by laminated molding, and the filling rate in the laminated molding part is 90% or more and 96% or less.

Advantages of the Invention

[0023] According to the present invention, for example, an improved and novel method for manufacturing a conductive component and the conductive component can be obtained.

Brief Description of the Drawings

[0024] [Figure 1] FIG. 1 is an exemplary schematic configuration diagram of a laminated molding apparatus according to the first embodiment. [Figure 2] FIG. 2 is an explanatory diagram showing the operation of the laminated molding apparatus of FIG. 1 in the step of supplying metal powder as a raw material of a molded object to a molding stage. [Figure 3] FIG. 3 is an explanatory diagram showing the operation of the laminated molding apparatus of FIG. 1 in the step of molding one layer of a molded object. [Figure 4] FIG. 4 is an exemplary schematic configuration diagram of a laminated molding apparatus according to the second embodiment. [Figure 5] FIG. 5 is an exemplary schematic configuration diagram of a laminated molding apparatus according to the third embodiment. [Figure 6] FIG. 6 is an exemplary and schematic cross-sectional view of a part of a conductive component produced by the laminated molding method of the embodiment. [Figure 7] FIG. 7 is an exemplary and schematic perspective view of a conductive component according to the fourth embodiment. [Figure 8] FIG. 8 is an exemplary and schematic perspective view of a conductive component according to the fifth embodiment. [Figure 9] FIG. 9 is an exemplary and schematic perspective view of a conductive component according to the sixth embodiment. [Figure 10] FIG. 10 is an exemplary and schematic perspective view of a conductive component according to the seventh embodiment. [Figure 11] FIG. 11 is an exemplary and schematic cross-sectional view of a conductive component according to the eighth embodiment. [Figure 12]Figure 12 is an exemplary and schematic cross-sectional view of a conductive component according to the ninth embodiment. [Figure 13] Figure 13 is an exemplary and schematic perspective view of a conductive component according to the tenth embodiment. [Figure 14] Figure 14 is an exemplary and schematic cross-sectional view of a portion of the conductive component of the 11th embodiment. [Figure 15] Figure 15 is an exemplary and schematic cross-sectional view of a portion of the conductive component of the twelfth embodiment. [Figure 16] Figure 16 is an illustrative schematic diagram of an electrical device to which the conductive components of the 13th embodiment are applied. [Modes for carrying out the invention]

[0025] Illustrative embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, as well as the actions and results (effects) brought about by such configurations, are examples only. The present invention can also be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derived effects) that can be obtained by the configuration.

[0026] The multiple embodiments shown below have similar configurations. Therefore, the configuration of each embodiment yields similar functions and effects based on the same configuration. In addition, the same reference numerals are used for these similar configurations below, and redundant explanations may be omitted.

[0027] In each figure, the X direction is represented by the arrow X, the Y direction by the arrow Y, and the Z direction by the arrow Z. The X, Y, and Z directions intersect and are also orthogonal to each other. The Z direction can also be called the stacking direction. In Figures 1-5, the X and Y directions are horizontal, and the Z direction is vertically upward.

[0028] Furthermore, in this specification, ordinal numbers are assigned for convenience to distinguish processes, parts, components, etc., and do not indicate priority or order.

[0029] [First Embodiment] Figure 1 is a schematic diagram of the additive manufacturing apparatus 100A of the first embodiment. The additive manufacturing apparatus 100A creates a manufactured object (additive manufactured object) which is at least a part of a conductive component by additively manufacturing metal powder P using the laser melting method, which is one of the powder bed fusion methods.

[0030] Metal powder P is the raw material for molded objects. Metal powder P is made from conductive metal materials such as copper, copper alloys, and aluminum alloys. Metal powder P is an example of metal powder.

[0031] As shown in Figure 1, the additive manufacturing apparatus 100A comprises a material bucket 110, a manufacturing stage 120, a collection box 130, a coater 140, and a manufacturing mechanism 150A.

[0032] The material bucket 110 forms a containment chamber 111 for containing the metal powder P before processing. The material bucket 110 is equipped with an elevator 112 that can move in the Z direction and the opposite direction within the containment chamber 111. The elevator 112 can move the metal powder P upward.

[0033] The molding stage 120 forms a powder bed Pb on which metal powder P is laid and a storage chamber 121 for containing the molded object (not shown). At the upper end of the powder bed Pb, the metal powder P is selectively melted and hardened by irradiation with laser light La, and one layer of the molded object, i.e., a conductive layer, is formed.

[0034] The build stage 120 is equipped with an elevator 122 that can move in the Z direction and the opposite direction within the containment chamber 121. A support base 123 is placed on the elevator 122. The support base 123 supports the powder bed Pb and the build object. The top surface 123a of the support base 123 in the Z direction spreads out intersecting the Z direction. The elevator 122 can move the powder bed Pb and the build object in progress downward together with the support base 123. After the build object is completed, the elevator 122 can move the build object and the surrounding metal powder P upward together with the support base 123.

[0035] The collection box 130 forms a storage chamber 131 for collecting excess metal powder P from the material bucket 110 and the molding stage 120. The metal powder P collected in the storage chamber 131 may be returned to the storage chamber 111 of the material bucket 110 after undergoing sorting and purification processes as appropriate.

[0036] The coater 140 can transfer the metal powder P in the X direction by moving along the Z-direction end face, i.e., the upper end, of the material bucket 110 and the molding stage 120 in the X direction. The coater 140 is a so-called spatula, for example, having a lower edge extending in the Y direction. By moving in the X direction, the coater 140 can horizontally scrape the metal powder P on the containment chambers 111 and 121.

[0037] The molding mechanism 150A includes a light source 151 that emits laser light La as an energy line, and a galvanometer mirror 152. The galvanometer mirror 152 is an example of an optical system that guides the laser light La from the light source 151 onto the powder bed Pb in the molding stage 120. A control unit (not shown) changes the irradiation position of the laser light La on the powder bed Pb by changing the angle of the galvanometer mirror 152. Therefore, the galvanometer mirror 152 can also be called a scanning mechanism. Note that the scanning mechanism is not limited to the galvanometer mirror 152, and may be, for example, a mechanism that moves the light source 151 or the optical system that guides the laser light La from the light source 151 and the molding stage 120 in a direction intersecting the Z direction.

[0038] Figure 2 is an explanatory diagram showing the operation of the additive manufacturing apparatus 100A in the process of supplying metal powder P to the manufacturing stage 120. In the material supply process, first, the elevator 112 of the material bucket 110 rises. As the elevator 112 rises, the metal powder P piles up above the opening of the containment chamber 111. On the other hand, the elevator 122 of the manufacturing stage 120 descends. As the elevator 122 descends, a thin space (not shown) is formed at the upper end of the containment chamber 121, extending in a direction intersecting the Z direction.

[0039] In this state, the coater 140 moves in the X direction from position P0 shown in Figure 1, through positions P1 and P2 shown in Figure 2, to a position facing the containment chamber 131 (not shown). As a result, a portion of the metal powder P piled up on the containment chamber 111 of the material bucket 110 is contained within the thin space formed above the containment chamber 121 of the build stage 120. At the same time, the coater 140 scrapes off the upper end, forming a flat upper surface of the powder bed Pb. Furthermore, the coater 140 moves any remaining metal powder P scraped off on the build stage 120 into the containment chamber 131.

[0040] Figure 3 is an explanatory diagram showing the operation of the additive manufacturing apparatus 100A during the process of creating one layer of an object. As shown in Figure 3, laser light La from the light source 151 is irradiated onto the uppermost layer of the powder bed Pb via the galvanometer mirror 152. At the area I irradiated by the laser light La, the metal powder P is melted, the metal powder P particles bond together at that area I, and then harden to become part of the object (conductor layer). By changing the angle of the galvanometer mirror 152, the laser light La is scanned on the powder bed Pb, thereby obtaining one layer of the object, i.e., a conductor layer of a predetermined shape. The thickness t of one layer of the object is determined by the downward stroke of the elevator 122 in the material supply process. The thickness t is, for example, between 20 [μm] and 200 [μm].

[0041] The additive manufacturing apparatus 100A can create a molded object that constitutes at least a part of a conductive component, i.e., additive manufacturing, by repeating the material supply process shown in Figure 2 and the molding process shown in Figure 3. The repeated material supply process and molding process are an example of the first process. This first process includes a first sub-process in which metal powders P are bonded together on the molding stage 120 to form the first conductive layer, and a second sub-process in which metal powders P are bonded together multiple times on the first conductive layer formed in the first sub-process to laminate conductive layers and form the second and subsequent conductive layers. In the first sub-process, multiple metal powders P within the conductive layer being formed are bonded together. In the second sub-process, multiple metal powders P within the conductive layer being formed are bonded together, and metal powders P in the already formed (lower) conductive layer are bonded to the metal powders P in the conductive layer being formed.

[0042] [Second Embodiment] Figure 4 is a schematic diagram of the additive manufacturing apparatus 100B of the second embodiment. The additive manufacturing apparatus 100B creates a manufactured object, at least a part of a conductive component, by additively manufacturing metal powder P using the electron beam fusion method, which is one of the powder bed fusion methods. In other words, in this embodiment, the manufacturing mechanism 150B irradiates the powder bed Pb of the manufacturing stage 120 with an electron beam E as the energy line, rather than laser light La. The manufacturing mechanism 150B has a cathode, an anode, a focusing coil, multiple deflection coils, etc. (none of which are shown). The manufacturing mechanism 150B outputs the electron beam E using the cathode and anode, and the direction of emission of the electron beam E can be deflected by controlling the operation of the deflection coils, thereby allowing the electron beam E to be scanned on the powder bed Pb. The deflection coils may also be called a scanning mechanism. However, in this embodiment, the manufacturing stage 120 is provided in the processing chamber R of the chamber 101, which is reduced to a near-vacuum state. Furthermore, the inside of the molding mechanism 150B is also reduced to a near-vacuum state. Although not shown in Figure 4, the additive manufacturing apparatus 100B can also be equipped with a material bucket 110, a recovery box 130, a coater 140, etc., similar to those in the first embodiment described above.

[0043] The additive manufacturing apparatus 100B can also produce a fabricated object that constitutes at least a part of a conductive component by repeatedly performing a material supply process similar to that of the first embodiment and a fabrication process in which the portion of the powder bed Pb irradiated with an electron beam E is selectively melted and hardened. In this embodiment as well, the repeated material supply process and fabrication process are examples of the first process, and the fabricated object obtained by this process is an example of the first conductive member.

[0044] In the additive manufacturing apparatus 100A of the first embodiment using the laser melting method, and the additive manufacturing apparatus 100B of the second embodiment using the electron beam melting method, the specifications of the manufactured object, such as the elasticity (flexibility), infill rate, and surface roughness, can be appropriately set by, for example, the power of the energy line, scanning speed, scanning interval, thickness of each layer, particle size of the metal powder P, etc.

[0045] [Third Embodiment] Figure 5 is a schematic diagram of the additive manufacturing apparatus 100C of the third embodiment. The additive manufacturing apparatus 100C creates a molded object that is at least part of a conductive component by additively manufacturing metal powder P using a binder bonding method. That is, in this embodiment, the molding mechanism 150C sprays a binder B that binds the particles of metal powder P, rather than energy lines, onto the powder bed Pb of the molding stage 120. The binder B is, for example, a liquid photocurable resin. At the area I where the binder B is sprayed, the metal powder P solidifies and becomes part of the molded object (conductor layer). The molding mechanism 150C has a nozzle 153 for spraying the binder B. The nozzle 153 is, for example, an inkjet nozzle. By moving the nozzle 153 along the powder bed Pb in a direction intersecting the Z direction, the spraying position of the binder B on the powder bed Pb can be scanned. By scanning the spraying position, one layer of the molded object, i.e., a conductor layer of a predetermined shape, is obtained. Although not shown in Figure 5, the additive manufacturing apparatus 100C can also be equipped with a material bucket 110, a collection box 130, a coater 140, etc., similar to those in the first embodiment described above.

[0046] The additive manufacturing apparatus 100C can also produce a molded object that constitutes at least a part of a conductive component by repeating the same material supply process as in the first embodiment and the molding process in which the parts to which the binder B is sprayed onto the powder bed Pb are selectively bonded. However, in this embodiment, after the removal of unwanted metal powder P that was not bonded, the molded object is further subjected to a sintering process in which it is heated at a temperature lower than the melting point of the metal powder P (sintering process). In this sintering process, the binder B is removed from the molded object, and adjacent metal powders P within the molded object are bonded together. In this embodiment, the repeated material supply process, the molding process, and the sintering process are an example of the first process.

[0047] According to the additive manufacturing apparatuses 100A to 100C of the first to third embodiments described above, by setting the irradiation position of the laser beam La or electron beam E as energy lines in each layer, and the injection position of the binder B, it is possible to relatively easily manufacture objects with complex shapes or shapes that cannot be made or are difficult to make by press molding. Furthermore, since no molds are used, advantages such as reduced manufacturing costs for the manufactured object and conductive parts containing the manufactured object, and easy modification of the shape are obtained. In addition, since no scrap material is generated as with press molding, there is also the advantage of less waste of resources. Generally, the laser melting method as in the first embodiment enables more precise manufacturing, the electron beam melting method as in the second embodiment enables faster manufacturing, and the binder bonding method as in the third embodiment enables even faster manufacturing. Note that in additively manufactured objects, layer lines can be seen on the outer surface and cross-section.

[0048] Figure 6 is a cross-sectional view of a portion of the fabricated object 10 obtained by the additive manufacturing apparatus 100A to 100C. The fabricated object 10 is an example of an additively manufactured portion of a conductive component. Furthermore, if the conductive component is made solely from the fabricated object 10, the fabricated object 10 is an example of a conductive component.

[0049] In the fabricated object 10, the metal powder P is aggregated and bonded together. Therefore, the surface 10a of the fabricated object 10, which is made by additive manufacturing and has not undergone any other surface treatment, has minute irregularities based on the shape and arrangement of the metal powder P. Such a surface 10a with minute irregularities has the advantage of increased heat dissipation due to an increase in surface area. Furthermore, through diligent research by the inventors, it has been found that the absorption rate of laser light increases when laser welding is performed on the surface 10a with other components, resulting in a stronger weld with less energy. This increase in absorption rate is thought to occur because the laser light scattered by the minute irregularities on the surface 10a is re-irradiated onto other minute irregularities on the surface 10a. From this viewpoint, it is preferable that the arithmetic mean roughness (Ra) of the surface 10a is 10 [μm] or more and 100 [μm] or less, and more preferably 40 [μm] or more and 100 [μm] or less. Arithmetic mean roughness (Ra) is also called line roughness and can be measured in accordance with the JIS standard (JIS B 0601).

[0050] Furthermore, in the fabricated object 10, the metal powder P is aggregated and bonded together, so the interior of the fabricated object 10 contains minute voids 10b. In other words, the fabricated object 10 has a porous shape. The presence of voids 10b as gaps between the metal powder P within the component can be one piece of evidence that the component is a fabricated object 10 made by additive manufacturing. Such a fabricated object 10 will have lower elasticity (flexibility) than a solid material without voids 10b. For this reason, conductive components that include at least a portion of such fabricated objects 10 are suitable, for example, when applied in environments with relatively high vibrations or when attached to parts with relatively large dimensional tolerances due to manufacturing variations. On the other hand, if there are too many of these voids 10b, it will lead to a decrease in electrical conductivity and, consequently, an increase in the size of the fabricated object and conductive component. Through diligent research by the inventors, it has been determined that, from this perspective, the filling rate of the molded object is preferably 90% or more and 96% or less, and more preferably 90% or more and 94% or less. Here, the filling rate can be defined as the value obtained by dividing the apparent density by the true density. The apparent density is the density obtained by dividing the mass of the object by the base volume, which is the volume occupied by the object itself and the volume of internal voids, and voids exposed on the surface are not included in the base volume, while internal voids are included in the base volume. The apparent density can be measured by the liquid weighing method (balance method). On the other hand, the true density is the density obtained by dividing the mass of the object by the base volume, which is the volume occupied by the object itself, and voids exposed on the surface and internal voids are not included in the base volume. The true density can be measured by the Gay-Lussac specific gravity bottle method (pycnometer method). These densities can be measured in accordance with JIS standards (JIS K 0061, JIS Z 8807, etc.).

[0051] Regarding the infill rate of a fabricated object using energy beam irradiation, i.e., powder bed fusion bonding, the energy density of the energy beam further affects the infill rate. The energy density Ed can be expressed by the following equation (1). Ed = P / (v·s·t) ··· (1) Here, P is the energy line output [W], v is the scanning speed [mm / s], s is the scanning interval [μm], and t is the layer thickness [μm]. The scanning interval refers to the distance (spacing) between the centers of adjacent linear scanning paths in a direction perpendicular to the scanning direction. Therefore, for example, by making the energy line output smaller, or by making the scanning speed, scanning interval, or layer thickness larger, the energy density Ed can be made smaller, and consequently, the infill rate of the printed object can be made larger. On the other hand, for example, by making the energy line output larger, or by making the scanning speed, scanning interval, or layer thickness smaller, the energy density Ed can be made larger, and consequently, the infill rate of the printed object can be made larger.

[0052] When the packing density is high and adjacent metal powders P are in close contact, the depth of the recess between adjacent metal powders P is, for example, about half the particle size of the metal powders P. In contrast, when the packing density is low and adjacent metal powders P are spaced apart, the depth of the recess between adjacent metal powders P is, for example, about the same as the particle size. In other words, when the packing density is low, the surface roughness (arithmetic mean roughness) of the surface 10a can be made higher than when the packing density is high. Furthermore, by using metal powders P with larger particle sizes, the surface roughness of the surface 10a can be made even higher.

[0053] In additive manufacturing of the object 10, the values ​​of the energy density parameters (P, v, s, t) may be changed for each layer being manufactured, or for each location within each layer. This makes it possible to change the infill density for each location within the object 10, or to change the surface roughness (arithmetic mean roughness) for each location on the surface 10a.

[0054] It should be noted that the additive manufacturing apparatuses 100A to 100C described above are merely examples, and the molded object 10 produced by additive manufacturing of metal powder P having the structural characteristics described above, and the conductive component containing at least a part of the molded object 10, may be manufactured using an additive manufacturing apparatus different from those used in the additive manufacturing apparatuses 100A to 100C.

[0055] [Fourth Embodiment] Figure 7 is a perspective view showing a conductive component 10A of the fourth embodiment manufactured by additive manufacturing. The conductive component 10A is made solely from the material manufactured by additive manufacturing. The layering direction in the additive manufacturing of the conductive component 10A is not limited to the Z direction, but may also be the X direction or the Y direction. The conductive component 10A is, for example, a busbar.

[0056] As shown in Figure 7, the conductive component 10A has two relatively thick plate-shaped parts 10c and four relatively thin plate-shaped parts 10d. The two parts 10c extend in the Z direction and the opposite direction of the Z direction, respectively, and the four parts 10d extend in the X direction, the opposite direction of the X direction, the Y direction, and the opposite direction of the Y direction, respectively. Parts 10c and 10d can also be called extensions. Manufacturing a conductive component 10A of this shape by press molding becomes more difficult as the length and width of each part 10c and 10d increase. Also, manufacturing a conductive component 10A of this shape by joining each part 10c and 10d becomes more time-consuming and laborious as the number of parts 10c and 10d increases. In this respect, additive manufacturing offers advantages such as being able to more easily manufacture conductive components with shapes that cannot be made or are difficult to make by press molding, as in this embodiment, and being able to manufacture conductive components more easily or more quickly compared to joining multiple members.

[0057] Furthermore, the conductive component 10A has two parts 10c and 10d with different thicknesses. Additive manufacturing makes it easier to produce conductive components with multiple parts of different thicknesses.

[0058] [Fifth Embodiment] Figure 8 is a perspective view showing the conductive component 10B of the fifth embodiment, which is manufactured by additive manufacturing. The conductive component 10B is made solely from the objects manufactured by additive manufacturing. The layering direction in the additive manufacturing of the conductive component 10B is not limited to the Z direction, but may also be the X direction or the Y direction.

[0059] As shown in Figure 8, the conductive component 10B has two plate-like portions 10c and 10d. As is clear from Figure 8, the two portions 10c and 10d are arranged in a twisted position relative to each other. Portions 10c and 10d may also be called extensions. The conductive component 10B also has a portion 10e between the two portions 10c and 10d that smoothly connects the two portions 10c and 10d. Portion 10e may also be called an intervening portion, connecting portion, or twisted portion. Portion 10e suppresses the abrupt change in cross-sectional area as it moves toward the Z direction at the boundary between portions 10c and 10d. Manufacturing a conductive component 10B of this shape by press molding becomes more difficult as the length and width of each portion 10c and 10d increase. In this respect, additive manufacturing makes it easier to manufacture conductive components with shapes that cannot be made or are difficult to make by press molding, such as in this embodiment.

[0060] [Sixth Embodiment] Figure 9 is a perspective view showing the conductive component 10C of the sixth embodiment, manufactured by additive manufacturing. The conductive component 10C is made solely from the material created by additive manufacturing. The layering direction in the additive manufacturing of the conductive component 10C is not limited to the Z direction, but may also be the X direction or the Y direction.

[0061] As shown in Figure 9, the conductive component 10C has one plate-shaped portion 10f and multiple plate-shaped portions 10g connected in parallel to the portion 10f, in other words, separated from the portion 10f. The portions 10f and 10g can also be called extensions. Furthermore, portion 10f is an example of a base, and portion 10g is an example of a branch. Manufacturing a conductive component 10C of this shape by press molding becomes more difficult as the width and length of each portion 10f and 10g increase. Also, manufacturing a conductive component 10C of this shape by joining each portion 10f and 10g becomes more time-consuming and laborious as the number of portions 10g increases. In this respect, additive manufacturing offers advantages such as being able to more easily manufacture conductive components with shapes that cannot be made or are difficult to make by press molding, as in this embodiment, and being able to manufacture conductive components more easily or more quickly compared to joining multiple members.

[0062] [Seventh Embodiment] Figure 10 is a perspective view showing the conductive component 10D of the seventh embodiment, which is manufactured by additive manufacturing. The conductive component 10D is made solely from the material created by additive manufacturing. The layering direction in the additive manufacturing of the conductive component 10D is not limited to the Z direction, but may also be the X direction or the Y direction.

[0063] As shown in Figure 10, the conductive component 10D has a rectangular parallelepiped, relatively thick plate-like, or rectangular bar-like shape that is elongated in one direction (the X direction). The conductive component 10D also has two parts 10f located at both ends in the X direction, and multiple plate-like parts 10g spanning between the two parts 10f. Parts 10f may also be called ends, and parts 10g may also be called intermediate parts or bridge parts. The multiple parts 10g are connected in parallel to each of the two parts 10f. In other words, each of the multiple parts 10g is separated from each of the two parts 10f. A slit-like cavity 10h is provided between two adjacent parts 10g. In the intermediate part in the X direction, each of the multiple parts 10g is thin in the Z direction and extends in the X direction with a substantially constant width in the Y direction. The multiple parts 10g overlap with a gap in the Z direction. Furthermore, each of the multiple cavities 10h extends in the X and Y directions with a substantially constant height in the Z direction, and penetrates the conductive component 10D in the Y direction. .Each part 10f is provided with a through hole 10i extending in the Z direction, for example, for bolt fixing, but this through hole 10i is optional. Press forming a conductive part 10D of this shape becomes more difficult as the width and length of each part 10f, 10g and cavity 10h increase. Also, forming a conductive part 10D of this shape by joining each part 10f, 10g becomes more time-consuming and laborious as the number of parts 10g increases. Furthermore, forming cavities 10h by cutting or etching becomes more difficult, laborious and time-consuming as the width and length of cavities 10h increase, or as the number of cavities 10h increases. In this respect, additive manufacturing offers advantages such as being able to more easily produce conductive parts with shapes that cannot be made or are difficult to make by press forming or post-processing of cavities 10h, as in this embodiment, and being able to produce conductive parts more easily or more quickly compared to joining multiple members or post-processing of cavities 10h. Furthermore, according to this embodiment, the provision of the cavity 10h reduces the overall elasticity of the conductive component 10D, which has the advantage of allowing for a more flexible configuration. In addition, the provision of the cavity 10h increases the surface area, which has the advantage of improving heat dissipation. Moreover, by flowing a gas such as air or a liquid such as water, i.e., a coolant, into the cavity 10h, heat dissipation can be further improved through heat exchange with the coolant. Note that the cavity does not need to penetrate the conductive component (formed object), and may be a closed cavity inside.

[0064] [Eighth Embodiment] Figure 11 is a cross-sectional view showing a conductive component 10E of the eighth embodiment, manufactured by additive manufacturing. The conductive component 10E is made solely from the additively manufactured parts. The layering direction in the additive manufacturing of the conductive component 10E is preferably the Z direction, but it may also be the X direction or the Y direction.

[0065] As shown in Figure 11, the surface 10a of the conductive component 10E is provided with a plurality of recesses 10j with a depth D. In other words, the surface 10a1 has a plurality of protrusions 10k with a height H. The protrusions 10k have shapes such as rectangular prisms, triangular prisms, cylindrical shapes, or plate shapes. The recesses 10j and protrusions 10k are distributed on the surface 10a (10a1) in the X and Y directions with a predetermined spatial period, for example, a constant spatial period. With this configuration, the surface area of ​​the conductive component 10E is increased, which has the advantage of improving heat dissipation. The depth D (height H) is preferably 0.1 [mm] or more and 2 [mm] or less. Note that the shape of the protrusions 10k or recesses 10j may differ depending on the location on the conductive component 10E. The protrusions 10k are an example of a convex portion.

[0066] [Ninth Embodiment] Figure 12 is a cross-sectional view showing a conductive component 10F of the ninth embodiment manufactured by additive manufacturing. The conductive component 10F is made solely from the material manufactured by additive manufacturing. The layering direction in the additive manufacturing of the conductive component 10F is preferably the Z direction, but it may also be the X direction or the Y direction.

[0067] As shown in Figure 12, the surface 10a of the conductive component 10F is provided with a plurality of recesses 10j with a depth D. In other words, the surface 10a1 has a plurality of protrusions 10k with a height H. The protrusions 10k have shapes such as a square pyramidal shape, a triangular pyramidal shape, a conical shape, or a rib shape. The recesses 10j and protrusions 10k are distributed on the surface 10a (10a1) in the X and Y directions with a predetermined spatial period, for example, a constant spatial period. With this configuration, the surface area of ​​the conductive component 10F is increased, which has the advantage of improving heat dissipation. From this viewpoint, the depth D (height H) is preferably 0.1 [mm] or more and 2 [mm] or less. Note that the shape of the protrusions 10k or recesses 10j may differ depending on the location on the conductive component 10F.

[0068] [Tenth Embodiment] Figure 13 is a perspective view showing a conductive component 10G of the tenth embodiment, manufactured by additive manufacturing and laser welding. The conductive component 10G is manufactured by welding a manufactured object 11(10) produced by additive manufacturing and a plurality of flat plate-shaped members 12 that are not manufactured by additive manufacturing in a welding area Wa. The layering direction in the additive manufacturing of the manufactured object 11 is preferably the Z direction, but it may also be the X direction or the Y direction.

[0069] As shown in Figure 13, the fabricated object 11 has a base part 10f and multiple branch parts 10g. The multiple parts 10g are connected in parallel to part 10f. The multiple parts 10g extend from part 10f in a direction intersecting the Z direction, in other words, along a virtual plane (XY plane) intersecting the Z direction. Furthermore, each of the multiple parts 10g has a different shape; for example, the degree of curvature and length differ for each part 10g. The tip of each part 10g and the member 12 are joined by laser welding. In this case, laser welding is performed by irradiation with laser light with a wavelength of 1200 [nm] or less. Furthermore, through diligent research by the inventors, it was found that when the wavelength of the laser light is between 400 [nm] and 500 [nm], the absorption rate by the metallic material is higher compared to other wavelength bands, resulting in a better joining state and enabling more energy-efficient laser welding.

[0070] Creating an object 11 of this shape by press molding becomes more difficult as the width and length of each part 10f, 10g increase. Furthermore, creating an object 11 of this shape by joining parts 10f, 10g becomes more time-consuming and laborious as the number of parts 10g increases. In this respect, additive manufacturing offers advantages such as the ability to more easily create objects with shapes that are difficult or impossible to create by press molding, as in this embodiment, and the ability to produce conductive parts more easily or quickly compared to joining multiple components.

[0071] Furthermore, as in this embodiment, when the conductive component 10G has multiple parts (parts 10f, 10g, and member 12) extending in various directions, manufacturing the entire conductive component 10G by additive manufacturing may actually take more time. Here, the flat member 12 can be obtained more easily or quickly by cutting it from a flat material, and laser welding can also be performed more easily or quickly. Therefore, as in this embodiment, manufacturing the conductive component 10G by laser welding the additively manufactured object 11 and multiple flat member 12 may be advantageous from the viewpoint of manufacturing cost and manufacturing time. Member 12 is an example of a second conductive member, and the laser welding process is an example of a second process.

[0072] It should be noted that such conductive components are not limited to this embodiment, and may, for example, be assemblies in which multiple molded objects 11 and one or more flat plate-shaped members 12 are joined by laser welding. Furthermore, the conductive component may include multiple molded objects 11 that are directly or indirectly integrated via the members 12. Also, instead of laser welding, the conductive component may be made by joining the molded objects and the flat plate-shaped members using other welding methods, such as brazing or soldering. Moreover, the members joined to the molded objects are not limited to flat plate-shaped members, but may be other members, such as rod-shaped members, that can be obtained through relatively simple processes such as cutting.

[0073] [Embodiment No. 11] Figure 14 is a cross-sectional view of a part of the conductive component 10H of the 11th embodiment. The conductive component 10H is made by welding a product 11 made by additive manufacturing and a flat plate-shaped member 12 that is not made by additive manufacturing, by irradiation with laser light Lb.

[0074] As shown in Figure 14, the fabricated object 11 and the member 12 are fitted together at the point where they are laser-welded. In this example, a portion of the member 12 is inserted into a recess 11a provided in the fabricated object 11 and fitted together. With this configuration, relative positional misalignment between the fabricated object 11 and the member 12 can be suppressed, making laser welding by irradiation with laser light Lb easier, faster, and more reliable. Furthermore, the fitting also has the advantage of increasing the joint strength between the fabricated object 11 and the member 12. Note that the fitting structure is not limited to this, and a portion of the fabricated object 11 may be inserted into a recess provided in the member 12 and fitted together. Also, the irradiation position of the laser light Lb is not limited to that shown in Figure 14.

[0075] [Twelfth Embodiment] Figure 15 is a cross-sectional view of a part of the conductive component 10I of the twelfth embodiment. The conductive component 10I is made by welding a product 11 made by additive manufacturing and a flat plate-shaped member 12 that is not made by additive manufacturing, by irradiation with laser light Lb.

[0076] As shown in Figure 15, the fabricated object 11 and the member 12 are fitted together at the point where they are laser-welded. In this example, a projection 11b on the fabricated object 11 is inserted into a through-hole 12a on the member 12, thereby fitting them together. This configuration suppresses relative misalignment between the fabricated object 11 and the member 12, allowing laser welding by irradiation with laser light Lb to be performed more easily, quickly, and reliably. Furthermore, the fitting provides the advantage of increasing the joint strength between the fabricated object 11 and the member 12. Note that the fitting structure is not limited to this; a projection on the member 12 may be inserted into a through-hole on the fabricated object 11, thereby fitting them together. Also, the irradiation position of the laser light Lb is not limited to that shown in Figure 15.

[0077] [13th Embodiment] Figure 16 is a schematic diagram showing the general configuration of the power distribution device 21 as an electrical device equipped with conductive components according to this embodiment, and the electrical components surrounding it.

[0078] The power distribution device 21 is an example of an electrical device mounted on an electric vehicle. It is electrically connectable to an external power source 22 and is also electrically connected to an inverter 23, a high-voltage battery 24, and a low-voltage battery 25 mounted on the electric vehicle. Electrical devices mounted on such vehicles have a high demand for miniaturization, requiring complex conductive paths, and for reducing the impact of heat and vibration generated in the electric vehicle and the conductive paths on electrical connections.

[0079] The power distribution device 21 includes a junction box 21a, a charger 21b, and a DC / DC converter 21c as multiple electrical components housed within a housing 21e. The housing 21e is also referred to as a case and includes, for example, a body, base, cover, lid, bracket, etc.

[0080] Within the power distribution device 21, each electrical component is electrically connected via a conductive path 21d. The conductive path 21d may partially include conductive components such as the conductive components 10A to 10I of the above embodiment. Similarly, the electrical wiring within the junction box 21a may also include conductive components such as 10A to 10I. Therefore, the electrical device of this embodiment provides the effects obtained by the conductive components 10A to 10I of the above embodiment, enabling the easy implementation of complex conductive paths in an electrical device mounted on an electric vehicle, while reducing the impact of heat and vibration generated in the electric vehicle and the conductive path on the electrical connections.

[0081] Although embodiments of the present invention have been illustrated above, these embodiments are merely examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. Furthermore, each configuration, shape, and other specifications (structure, type, orientation, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be modified as appropriate. [Explanation of symbols]

[0082] 10, 11… Manufactured object (at least a part of the conductive component, additive manufacturing area) 10A~10I...conductive components 10a,10a1…Surface 10b…Vacancy 10c~10g…Part 10h…Cavity 10i...Through hole 10j…recess 10k... protrusion (convex part) 11a…recess 11b...Protrusion 12... Components 12a... Through hole 21…Power distribution device (electrical equipment) 21a... Junction Box 21b…Charger 21c…DC / DC converter 21d... Conductive path 21e… Housing 22…External power supply 23…Inverter 24… High-voltage battery 25... Low-voltage battery 100A~100C...Additive manufacturing equipment 101... Chamber 110...Material bucket 111... Confinement Chamber 112... Elevator 120... Sculpting Stage 121... Confinement Chamber 122... Elevator 123...Support Base 123a…Top surface 130... Collection box 131... Confinement Chamber 140... Kota 150A~150C…Forming mechanism 151...Light source 152... Galvano Mirror 153…Nozzle B…Binding material D... depth E... Electron beam Ed...Energy Genre H...height I...part La, Lb… Laser light P...Metal powder (powder) Pb... Powder bed P0,P1,P2…Position R... Processing room t...thickness Wa... Welding area X…direction Y... Direction Z... direction (stack direction, first direction)

Claims

1. A first step involves additively fabricating at least a portion of the first conductor member in a first direction, A second step is to join the first conductor member produced in the first step with a second conductor member different from the first conductor member, separately from the first step. Equipped with, The first step is, A process of bonding metal powders together to form a conductive layer, A step of laminating a conductive layer by bonding metal powders together multiple times on the conductive layer, Includes, The first conductor member has a base and a plurality of branches branched from the base, A method for manufacturing a conductive component, comprising the second step of joining each of the branches to the second conductor member to produce a single conductive component made solely of conductive metal.

2. In the first step, the first conductor member is laminated such that each of the branches extends in a direction intersecting the first direction, and the parts of the plurality of branches that are away from the base move away from each other in a direction intersecting the first direction. The method for manufacturing a conductive component according to claim 1, wherein in the second step, the second conductor member extending in the second direction and the branches of the first conductor member, each of which extends in a direction intersecting the second direction and the portions of the plurality of branches that are away from the base are separated from each other in a direction intersecting the second direction, are joined together.

3. In the second step, the first conductor member and the second conductor member are laser-welded together. A method for manufacturing a conductive component according to claim 1 or 2, wherein in the first step, the portion of the first conductive member that is irradiated with laser light in the second step is additively fabricated such that the arithmetic mean surface roughness of the portion of the first conductive member is 10 [μm] or more and 100 [μm] or less.

4. The method for manufacturing a conductive component according to any one of claims 1 to 3, wherein the metal powder is made of a copper-based metal or an aluminum-based metal.

5. A method for manufacturing a conductive component according to any one of claims 1 to 4, wherein in the first step, at least a portion of the conductive component is additively fabricated such that the filling rate of at least a portion of the conductive component is 90% or more and 96% or less.

6. A method for manufacturing a conductive component according to any one of claims 1 to 5, wherein in the first step, at least a portion of the conductive component is additively fabricated such that a plurality of protrusions having a height of 0.1 mm or more and 2 mm or less, or a plurality of recesses having a depth of 0.1 mm or more and 2 mm or less, are provided on the surface of at least a portion of the conductive component.

7. A method for manufacturing a conductive component according to any one of claims 1 to 6, wherein in the first step, at least a portion of the conductive component is additively fabricated such that a cavity is provided inside the conductive component.

8. A method for manufacturing a conductive component according to any one of claims 1 to 7, wherein in the first step, at least a portion of the conductive component is additively fabricated such that its thickness varies depending on its location.

9. A method for manufacturing a conductive component according to any one of claims 1 to 8, wherein in the first step, at least a portion of the conductive component is additively fabricated such that the filling rate differs depending on the location of the conductive component.

10. A method for manufacturing a conductive component according to any one of claims 1 to 9, wherein in the first step, at least a portion of the conductive component is additively fabricated such that the arithmetic mean roughness of the surface differs depending on the location of the conductive component.

11. The method for manufacturing a conductive component according to any one of claims 1 to 10, wherein in the second step, the first conductive member and the second conductive member are welded together in a fitted state.

12. The method for manufacturing a conductive component according to claim 3, wherein in the second step, the first conductive member and the second conductive member are welded by irradiating them with laser light having a wavelength of 1200 nm or less.

13. The method for manufacturing a conductive component according to claim 12, wherein the wavelength of the laser light is 400 nm or more and 500 nm or less.

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