Imaging device

Abstract

To provide an imaging device that satisfies a heat radiation performance so as not to hinder a moving imaging element.SOLUTION: An imaging device comprises: an imaging element 115 that can move within a movable range in a direction different from an optical axis direction; a first circuit board 115a that mounts the imaging element; a second circuit board 107 opposed to the first circuit board; a first flexible substrate 112 that electrically connects the first and second circuit boards together; and a fan 130. The first flexible substrate is bent at a region superposed with the movable range of the imaging element in the optical axis direction. An air exhaustion port 131 of the fan 130 is arranged so as to face an inner surface of the closest bent part from the first circuit board of the first flexible substrate at a center position in the movable range of the imaging element when viewed from a direction orthogonal to an optical axis.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an imaging device having a heat dissipation structure for heat generated from a heat source.

Background Art

[0002] In recent years, with the demand for miniaturization of electronic devices, miniaturization and high density of mounted components inside the devices have become remarkable.

[0003] On the other hand, while the demand for higher functionality of imaging devices, particularly higher performance of video functions, is increasing, the amount of heat generated by the devices tends to increase.

[0004] During video shooting in a high-temperature environment, as the temperature inside the imaging device rises, there is a high possibility of malfunction or performance degradation of the mounted components, and ultimately, failure of the imaging device.

[0005] Therefore, when the amount of heat dissipation by natural heat dissipation is not sufficient for the amount of heat generated by the imaging device, a heat dissipation structure by forced air cooling using a fan or a heat conduction member is utilized.

[0006] In Patent Document 1, a device for cooling by connecting a movable image pickup element with a heat conduction member is disclosed.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] In recent years, an imaging device that moves an image pickup element in a direction orthogonal to the optical axis direction to perform shake correction in order to improve image quality has become widespread.

[0009] Even in imaging devices that perform image stabilization, sufficient heat dissipation is required because the heat generated in the image sensor during the operation of the image stabilization mechanism, continuous shooting, and video recording affects image quality.

[0010] However, the device disclosed in Patent Document 1 mentioned above has the problem that it is physically connected to the movable image sensor, which hinders the operation of the image sensor.

[0011] The present invention has been made in view of the above problems, and in the embodiments of the present invention, the objective is to provide an imaging device that satisfies heat dissipation performance without obstructing a movable image sensor. [Means for solving the problem]

[0012] The imaging apparatus of the present invention comprises an image sensor that can move within a movable range in a direction different from the optical axis direction, a first circuit board on which the image sensor is mounted, a second circuit board facing the first circuit board, a first flexible member that electrically connects the first circuit board and the second circuit board, and a fan, wherein the first flexible member is bent in a region that overlaps with the movable range of the image sensor in the optical axis direction, and the extension of the first flexible member in the direction of airflow from the exhaust port of the fan The aforementioned The present invention is characterized by having the inner surface of the bent portion closest to the first circuit board in the optical axis direction. [Effects of the Invention]

[0013] According to one embodiment of the present invention, it is possible to prevent the airflow generated by the airflow generating means from being obstructed by the flexible substrate, thereby preventing a reduction in the heat dissipation performance of the image sensor. [Brief explanation of the drawing]

[0014] [Figure 1] Digital camera 100 of the present invention [Figure 2] (a) Front exploded perspective view of the image sensor unit 106 of the present invention, (b) Rear exploded perspective view of the image sensor unit 106 of the present invention [Figure 3](a) Back view of the image sensor unit 106 and the cooling fan 130 of the present invention, (b) Schematic back view of the cooling fan 130 of the image sensor unit 106 of the present invention [Figure 4] Back perspective view of the image sensor unit 106 and the cooling fan 130 of the first embodiment of the present invention [Figure 5] (a) Cross-sectional view taken along the line A-A of the image sensor unit 106 and the cooling fan 130 of the first embodiment of the present invention, (b) Cross-sectional view taken along the line B-B of the image sensor unit 106 and the cooling fan 130 of the first embodiment of the present invention, (c) Back view of the image sensor unit 106 and the cooling fan 130 of the first embodiment of the present invention [Figure 6] (a) Development view of the imaging power flexible printed board 112 of the first embodiment of the present invention, (b) Development view of the imaging signal flexible printed board 111 of the first embodiment of the present invention [Figure 7] (a) Side view of the image sensor unit 106 of the first embodiment of the present invention, (b) Schematic view showing the path of the air flow generated by the cooling fan 130 of the first embodiment of the present invention [Figure 8] (a) Back perspective view of the image sensor unit 106 and the cooling fan 130 of the second embodiment of the present invention, (b) Back perspective view of the image sensor unit 106 and the cooling fan 130 of the second embodiment of the present invention [Figure 9] (a) Cross-sectional view taken along the line A-A of the image sensor unit 106 and the cooling fan 130 of the second embodiment of the present invention, (b) Cross-sectional view taken along the line B-B of the image sensor unit 106 and the cooling fan 130 of the second embodiment of the present invention, (c) Back view of the image sensor unit 106 and the cooling fan 130 of the second embodiment of the present invention [Figure 10] Block diagram of the present invention

Embodiments for Carrying Out the Invention

[0015] Hereinafter, exemplary embodiments of the technology of the present disclosure will be described in detail with reference to the drawings.

[0016] However, the dimensions, materials, shapes, and relative arrangements of the components described below should be appropriately changed according to the configuration of the device to which the invention is applied and various conditions.

[0017] Therefore, it is not intended to limit the scope of the present invention to the following description.

[0018] For components and processes not particularly illustrated or described, well-known or publicly known techniques in the relevant technical field can be applied. Also, duplicate explanations may be omitted.

[0019] In the drawings, the same reference numerals are used between the drawings to indicate elements that are identical or functionally similar. In FIG. 5, the optical axis direction is the Z direction, the longitudinal direction is the X direction, and the short-side direction is the Y direction.

[0020] ​​​​​​​​​​​​​​​​​​​​​​​​​​​​ The main board 107 is equipped with a control IC 107a for controlling imaging signals, a recording medium connector 107b for housing an external recording medium, and an external communication terminal 107c for connecting cables to external devices.

[0027] The external communication terminal 107c is covered by the terminal cover 105a.

[0028] The image sensor unit 106 is a component that consumes a particularly large amount of power and generates a lot of heat, making it prone to rapid temperature increases, even within the digital camera 100.

[0029] The shooting time of the digital camera 100 is limited by the operating temperature of each component. In order to maintain the shooting time as long as possible, it becomes necessary to take measures to dissipate the heat from the image sensor 106, which is a heat source, and to prevent it from exceeding the operating temperature.

[0030] The image sensor unit 106 is fixed to the front base 102 with screws, and the heat from the image sensor unit is dissipated to the front base 102.

[0031] The cooling fan 130 is positioned around the image sensor 106 so that its airflow direction is perpendicular to the optical axis. By allowing air to pass over the back of the image sensor 106, which is a heat source, it prevents localized overheating. (Details will be described later.)

[0032] Furthermore, in this embodiment, the cooling fan 130 is a centrifugal fan as the air blowing means, but this is not limited to this, and other types such as axial fans are not limited as long as they can achieve the purpose.

[0033] In this embodiment, the airflow direction of the cooling fan 130 is positioned perpendicular to the optical axis. However, this is not the case if the airflow from the cooling fan 130 directly hits the image sensor 106, and the fan may be positioned so that the airflow direction is not perpendicular to the optical axis.

[0034] Furthermore, the main board 107 is also one of the heat sources, and by positioning the cooling fan 130 with the exhaust port 131 facing so that air is blown between the image sensor unit 106 and the main board 107, it is possible to provide a heat dissipation effect to multiple heat sources.

[0035] However, since the image sensor section 106, which has a movable part 114, has fewer heat dissipation paths, it is more advantageous for heat dissipation if the exhaust port 131 of the heat dissipation fan 130 is located closer to the image sensor section 106 than to the main board 107.

[0036] (Description of the image sensor unit 106) Figure 2 will be used to explain the details of the image sensor unit 106. Figure 2(a) is an exploded perspective view of the front of the image sensor unit 106, and Figure 2(b) is an exploded perspective view of the rear.

[0037] The movable part 114 has a coil section 116 on which coils and Hall elements are arranged for moving the image sensor 115, and is held by the sensor holder 117.

[0038] The drive mechanism 113 has three magnets 118 attached to it, and the movable part 114 is held in place by the magnets 118.

[0039] Between the movable part 114 and the drive mechanism 113, a ball (not shown) is placed in a ball holding part 117a provided on the sensor holder.

[0040] The movable part 114 can be moved by changing the amount of current supplied to the coil part 116. By moving the movable part 114 in a direction that cancels out the shaking of the digital camera body 100, image stabilization can be applied.

[0041] The image sensor 115 has a sensor chip (not shown) bonded to an imaging substrate 115a on which an imaging circuit is mounted, and is electrically connected to the imaging substrate 115a by wire bonding.

[0042] The image sensor 115 and the sensor holder 117 are bonded and fixed together with adhesive.

[0043] On the back surface of the sensor chip mounting surface on the imaging substrate 115a, components 115b such as capacitors, resistors, and regulators for the imaging circuit are mounted.

[0044] The electrical connection between the image sensor unit 106 and the main circuit board 107 is made using a flexible wiring board.

[0045] The imaging signal flexible board 111 is wired with imaging signals output from the image sensor 115 and control signals necessary for driving the image sensor 115, and these signals are sent to the control IC 107a on the main board 107.

[0046] The imaging power supply flexible board 112 is a flexible circuit that supplies power to drive the image sensor 115. Inter-board connectors are used to connect the imaging board 115a to each flexible circuit.

[0047] (A view of the cooling fan 130 and the image sensor unit 106 from the rear, and a schematic diagram thereof) Figures 3(a) and 3(b) show the heat dissipation fan 130 and the image sensor unit 106 as viewed from the rear, and a schematic diagram thereof.

[0048] Here, we will explain the relationship between the movement of the movable part 114 of the image sensor unit 106 and the position of the cooling fan 113.

[0049] The movable part 114 is movable perpendicular to the optical axis, and its range of movement is indicated by 114a. The range in which the movable part 114 is always present when it moves is indicated by 114b.

[0050] This range is the range in which the movable part 114 exists regardless of the position of the movable part 114 on 114a.

[0051] Next, the arrangement of the cooling fan 130 will be explained. As mentioned above, the cooling fan 130 blows air so that it passes over the back of the image sensor unit 106.

[0052] The exhaust port 131 of the cooling fan 130 is positioned so that air is blown into the area 114b where the movable part 114 is always located when the movable part 114 moves.

[0053] Here, the general direction of airflow is shown by 131a. As long as the airflow direction 131a is within the range of 114a, heat dissipation can be obtained regardless of the position of the movable part 114, which is the heat source of the image sensor unit 106.

[0054] Furthermore, since it is not physically connected to the movable part 114, it is possible to generate heat dissipation without hindering the image stabilization function caused by movement. The center position of the movable part 114 coincides with the optical axis.

[0055] Airflow is directed towards the shorter side of the image sensor 115 and exhausted from the exhaust port of the cooling fan 130.

[0056] (Positional relationship between the imaging signal flexible board 111, the imaging power supply flexible board 112, and the cooling fan 130) Furthermore, using Figures 4 and 5, the positional relationship between the imaging signal flexible substrate 111, the imaging power supply flexible substrate 112, and the heat dissipation fan 130 will be explained in detail.

[0057] Figure 4 shows the image sensor unit 106 and the heat dissipation fan 130 as viewed from the rear of the camera at an angle.

[0058] As shown in Figure 4, the image sensor unit 106 is equipped with an imaging power supply flexible board 112 and an imaging signal flexible board 111, which are fixed to the movable part 114 and the drive mechanism 113, respectively.

[0059] Figure 5(c) is a view of the image sensor unit 106 from the rear, and Figures 5(a) and 5(b) are cross-sectional views AA and BB of Figure 5(c), respectively.

[0060] As shown in Figure 5(a), the imaging power supply flexible substrate 112 is connected to a connector mounted on the side of the imaging substrate 115a on which the element 115b is mounted, and has a first end portion 112a that is positioned substantially parallel to the imaging substrate 115a.

[0061] Furthermore, it has a bent portion 112b that is bent 180° from the first end 112a with a predetermined bending diameter, and an excess portion 112c that forms from the bent portion 112b to a fixing portion 112d for fixing the imaging power supply flexible substrate 112 to the drive mechanism 113.

[0062] The second end portion 112e, extending from the fixing portion 112d, is connected to the main board 107.

[0063] In this way, the movable part 114 of the image sensor unit 106 is driven for image stabilization.

[0064] Even so, the deformation of the imaging power supply flexible substrate 112 is absorbed by the bent portion 112b and the excess portion 112c, reducing the effect of the tension of the imaging power supply flexible substrate 112 on the control of the movable portion 114.

[0065] Furthermore, the bent portion 112b of the imaging power supply flexible substrate 112 is formed in a direction extending from the first end 112a in the direction opposite to the heat dissipation fan 130.

[0066] Therefore, as shown in the AA cross-sectional view of Figure 5(a), a space is formed in the region of the imaging substrate 115a near the heat dissipation fan 130, sandwiched between the imaging substrate 115a and the excess portion 112c of the imaging power supply flexible substrate 112, extending to the bent portion 112b.

[0067] Furthermore, as shown in Figure 5(c), the imaging power supply flexible substrate 112 is positioned such that at least a portion of it is included within the area of ​​the airflow direction 131a of the heat dissipation fan 130, even when the movable part 114 moves.

[0068] With this configuration, even when the movable part 114 moves, a gap can be created between the imaging power supply flexible substrate 112 and the imaging substrate 115a in the area near the exhaust port 131 on the imaging substrate 115a, thereby reducing the airflow resistance of the cooling fan 130.

[0069] This prevents the airflow from being obstructed by the imaging power supply flexible substrate 112, which would make it difficult for air on the imaging substrate 115a to move.

[0070] Furthermore, as shown in Figure 5(c), the left-right direction is defined as the X direction and the up-down direction as the Y direction when viewed from the back of the camera.

[0071] In this process, the three magnets 118 provided in the drive mechanism 113 are divided into rectangular X-direction magnets 118a, rectangular Y-direction magnets 118b and 118c, respectively, in the direction in which they generate the driving force.

[0072] The Y-direction magnet 118b is positioned closer to the X-direction magnet 118a than the Y-direction magnet 118c.

[0073] Here, when the image sensor unit 106 is viewed from the back of the camera in the optical axis direction, we define the region 140 as the area sandwiched between the center 115c of the image sensor 115 and the X-direction magnet 118a, and also the area sandwiched between the center 115c of the image sensor 115 and the Y-direction magnet 118b.

[0074] The bent portion 112b of the imaging power supply flexible substrate 112 is formed to be positioned in region 140.

[0075] With this configuration, the inner surface of the bent portion 112b receives force from the airflow of the cooling fan 130 near the location where the magnetic force for driving the movable portion 114 is generated, thereby reducing the influence of disturbances on the movable portion 114 from the airflow.

[0076] In other words, the current flowing through the coil section 116 can be reduced in order to counteract the rotational moment on the movable section 114 caused by the force received by the flexible substrate 112 from the airflow.

[0077] Furthermore, it becomes possible to maintain the controllability of the movable part 114 compared to when the cooling fan 130 is not operating.

[0078] The imaging signal flexible substrate 111 and the imaging power supply flexible substrate 112 are arranged in the longitudinal direction of the image sensor.

[0079] Here, we will explain the features of the folded portion 112b using Figure 7. Figure 7(a) is a view of the image sensor portion 106 from the side of the camera.

[0080] Figure 7(b) is a cross-sectional view of CC in Figure 7(a). As shown in Figure 7(b).

[0081] The bent portion 112b is formed such that the line segment 141 connecting the center of the exhaust port 131 of the cooling fan 130 and the center of the bent portion 112b does not coincide with the normal 142 of the inner surface (inner circumferential surface) of the bent portion 112b.

[0082] Furthermore, at this time, the normal vector 142 of the inner surface (inner circumferential surface) of the bent portion 112b is tilted toward the center 115c of the image sensor 115 more than the line segment 141.

[0083] Specifically, the design guides the airflow from the heat dissipation fan 130 towards the center 115c of the image sensor 115, and prevents it from escaping in the direction of the X-direction magnet 118a.

[0084] If the airflow is allowed to escape in the direction of the X-direction magnet 118a, the airflow will not be able to reach a wider area on the imaging substrate 115a sufficiently, impairing the heat dissipation effect. This configuration prevents that from happening.

[0085] (Expanded view of the imaging power supply flexible circuit board 112) When the imaging power supply flexible substrate 112 is unfolded, it looks like Figure 6(a), and the first end portion 112a and the excess portion 112c are formed at a certain angle so as not to be in a straight line with respect to the bent portion 112b.

[0086] By configuring it in this way, when the bent portion 112b is formed so that the line segment 141 and the normal vector 142 do not coincide, the imaging power supply flexible substrate 112 can be housed in a small projection area when viewed from the camera optical axis direction, as shown in Figure 5(c), resulting in good space efficiency.

[0087] The imaging signal flexible substrate 111 has a similar folding configuration to the imaging power supply flexible substrate 112 so that its tension does not affect the control of the movable part 114 as much as possible.

[0088] However, as shown in Figure 4, it is positioned 180° opposite in direction to the imaging power supply flexible substrate 112.

[0089] Furthermore, the gap between the excess portion 111c of the imaging signal flexible substrate 111 and the imaging substrate 115a is set to be wider than the gap between the excess portion 112c of the imaging power supply flexible substrate 112 and the imaging substrate 115a, in order to reduce ventilation resistance.

[0090] Furthermore, the bent portion 111b of the imaging signal flexible substrate 111 is formed in a direction opposite to the bent portion 112b of the imaging power supply flexible substrate 112.

[0091] When the imaging signal flexible substrate 111 is unfolded, it looks like Figure 6(b), and the first end portion 111a and the excess portion 111c are formed at a certain angle, with the bent portion 111b in between.

[0092] (Airflow movement generated by cooling fan 130) Here, we will explain step by step the movement of the airflow generated by the cooling fan 130 using Figure 7.

[0093] As shown by the arrow in Figure 7(b), the airflow from the cooling fan 130 was discharged from the exhaust port 131.

[0094] After that, it passes through the space between the imaging substrate 115a and the excess portion 112c, and the space between the first end portion 112a and the excess portion 112c, and reaches the inner circumference side of the bent portion 112b.

[0095] At that time, the air on the imaging substrate 115a that has received heat from the imaging substrate 115a is moved along the arrow in Figure 7(b) by the airflow from the heat dissipation fan 130.

[0096] The airflow that reaches the bent portion 112b is bent so that its direction is toward the center 115c of the image sensor 115, and is guided into the space sandwiched between the excess portion 111c of the imaging signal flexible substrate 111 and the imaging substrate 115a.

[0097] A portion of the airflow reaches the bent portion 111b of the imaging signal flexible substrate 111, applying force and partially canceling out the rotational moment applied to the movable portion 114 by the airflow at the bent portion 112b.

[0098] The remaining air escapes in the lateral direction as shown in Figure 7(b) when viewed from the optical axis, moving the heated air on the imaging substrate 115a and diffusing into the camera.

[0099] In this way, the bent portion 112b of the imaging power supply flexible substrate 112 and the bent portion 111b of the imaging signal flexible substrate 111 are formed.

[0100] Therefore, the airflow from the heat dissipation fan 130 can be guided over a wide area on the imaging substrate 115a, effectively suppressing the temperature rise of the image sensor 115.

[0101] Furthermore, since the cooling fan 130 itself is not physically connected to the movable part 114, it is possible to generate heat dissipation without interfering with the image stabilization function caused by movement.

[0102] In Embodiment 1, for example, the cooling fan 130 is operating at an airflow rate of 4.5 L / min.

[0103] Liters per minute (L / min) is a unit of volumetric flow rate. By incorporating a cooling fan 130, it is possible to reduce the maximum temperature reached by the image sensor 106 by 10°C.

[0104] This suppresses the temperature rise of the heat source, making it less likely for the digital camera 100 to reach the limit temperature at which it would shut down due to overheating.

[0105] The features of this embodiment are described below.

[0106] The imaging device includes an image sensor 115 that can move within a movable range in a direction different from the optical axis direction, a first circuit board 115a on which the image sensor is mounted, and a second circuit board 107 facing the first circuit board.

[0107] The device also includes a first flexible substrate 112 that electrically connects the first circuit board and the second circuit board, and a fan 130.

[0108] The first flexible substrate is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis.

[0109] Furthermore, when viewed from a direction perpendicular to the optical axis, at the center of the movable range of the image sensor, the exhaust port 131 of the fan 130 is positioned to face the inner surface of the bent portion closest to the first circuit board of the first flexible substrate.

[0110] The next characteristic is that there is always an airflow path even at the mechanical end.

[0111] When viewed from a direction perpendicular to the optical axis, as the image sensor moves within its movable range, the inner surface of the bent portion of the first flexible substrate closest to the first circuit board is always positioned in a region that extends in the direction of airflow 131a of the fan's exhaust port 131, at least a portion of which is in that direction.

[0112] The next characteristic is that the folded parts are not perpendicular to each other.

[0113] When viewed from the direction of the optical axis, if a line segment is defined connecting the center of the exhaust port to the center of the inner surface of the closest bent section, the line segment and the normal to the inner surface of the bent section do not coincide.

[0114] The next feature is that it does not spray onto magnets.

[0115] When viewed from the optical axis direction, the normal to the inner surface of the first flexible substrate closest to the first circuit board is inclined toward the center of the image sensor from the line segment.

[0116] The next characteristic is that when unfolded, the bending angles are not perpendicular.

[0117] When viewed from the optical axis direction, when the first flexible substrate is unfolded, the first flexible substrate is formed at an angle that is not a straight line at the bending portion closest to the first circuit board.

[0118] The next characteristic is that it is less affected by rotational moments (it is subjected to airflow in areas where rotational moments are kept small).

[0119] The imaging device includes a first magnet for driving the image sensor in a first direction different from the optical axis direction, and a second magnet for driving the image sensor in a second direction different from the first direction, which is different from the optical axis direction.

[0120] Furthermore, the bent portion of the first flexible substrate is positioned in the region sandwiched between the center of the image sensor and the first magnet, and also in the region sandwiched between the center of the image sensor and the second magnet, when viewed from the optical axis direction.

[0121] The next characteristic is that the effects of rotational moments cancel each other out, and the inner surfaces face each other.

[0122] The imaging device includes a second flexible substrate 111 that electrically connects the first circuit board and the second circuit board.

[0123] The second flexible substrate is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis.

[0124] Furthermore, the inner surface of the second flexible substrate 111 closest to the first circuit board is formed to face the inner surface of the first flexible substrate closest to the first circuit board.

[0125] The following features are that the airflow direction is along the longitudinal direction of the image sensor, and the bending direction is along the short direction of the image sensor.

[0126] The following characteristic is that the first flexible substrate is a flexible substrate or a graphite sheet.

[0127] [Second Embodiment] A second embodiment of the present invention will be described using Figures 8 and 9. For the sake of simplicity, the explanation will be omitted for parts that overlap with the first embodiment, and only the differences will be described.

[0128] Figure 8(a) shows the image sensor unit 106 and the heat dissipation fan 130 as viewed from the oblique rear of the camera. Figure 8(b) is a view of Figure 8(a) with the imaging signal flexible board 111 and the imaging power supply flexible board 112 hidden for easier viewing.

[0129] As shown in Figures 8(a) and 8(b), the image sensor unit 106 is provided with graphite sheets 121 and 122 that are fixed to the movable parts 1 and 14 and the drive mechanism 113, respectively, so as to overlap the imaging power supply flexible substrate 112 and the imaging signal flexible substrate 111.

[0130] The graphite sheets 121 and 122 function as heat dissipation members that have flexibility to transmit heat generated in the movable part 114 to the drive mechanism 113 while minimizing the impact on the controllability of the movable part 114.

[0131] Figure 9(c) is a view of the image sensor unit 106 from the rear, and Figures 9(a) and 9(b) are cross-sectional views AA and BB of Figure 9(c), respectively.

[0132] As shown in Figure 9(a), the graphite sheet 122 is attached so as to be in contact with the element 115b of the imaging substrate 115a and has a first end portion 122a that is positioned substantially parallel to the imaging substrate 115a.

[0133] Furthermore, it has a bent portion 122b that is bent 180° from the first end 122a with a predetermined bending diameter, and an excess portion 122c that forms from the bent portion 122b to a fixing portion 122d for fixing the graphite sheet 122 to the drive mechanism 113.

[0134] In this way, the movable part 114 of the image sensor unit 106 is driven for image stabilization.

[0135] Nevertheless, the deformation of the graphite sheet 122 is absorbed by the folded portion 122b and the excess portion 122c, reducing the influence of the tension of the graphite sheet 122 on the control of the movable portion 114.

[0136] Furthermore, the bent portion 122b of the graphite sheet 122 is formed in a direction extending from the first end 122a in the direction opposite to the cooling fan 130.

[0137] Therefore, as shown in the AA cross-sectional view of Figure 9(a), a space is formed in the region of the imaging substrate 115a near the heat dissipation fan 130, sandwiched between the imaging substrate 115a and the excess portion 122c of the graphite sheet 122, extending to the bent portion 122b.

[0138] As shown in Figure 9(a), the imaging power supply flexible substrate 112 is positioned so that the inner surface of the folded portion 112b of the imaging power supply flexible substrate 112 faces the outer surface of the folded portion 122b of the graphite sheet 122.

[0139] The graphite sheet 121 has a folding configuration similar to that of the graphite sheet 122, so as to minimize the effect of its tension on the control of the movable part 114.

[0140] However, as shown in Figure 8(b), it is positioned 180° opposite in direction to the graphite sheet 122.

[0141] As shown in Figure 9(b), the imaging signal flexible substrate 111 is positioned so that the inner surface of the folded portion 111b of the imaging signal flexible substrate 111 faces the outer surface of the folded portion 121b of the graphite sheet 121.

[0142] By arranging them in this way, the fixing portions 121d and 122d of the graphite sheets 121 and 122 do not sandwich the imaging signal flexible substrate 111 or the imaging power supply flexible substrate 112.

[0143] Since it can be directly contacted and fixed to the drive mechanism 113, it is suitable for heat dissipation from the movable part 114 to the drive mechanism 113.

[0144] In addition, the configuration of the bent portions 121b and 122b of the graphite sheets 121 and 122 can be replaced with the bent portions 111b and 112b of the imaging signal flexible substrate 111 and the imaging power supply flexible substrate 112 in the first embodiment.

[0145] It is clear that this will yield the same effects as the first embodiment.

[0146] (Block diagram showing an example configuration of the digital camera 400) Figure 10 is a block diagram showing an example configuration of the digital camera 400 according to the present invention.

[0147] The shutter 410 is a focal-plane shutter that allows for free control of the exposure time of the imaging unit 411, which will be described later.

[0148] This control is performed by the system control unit 420, which will be described later.

[0149] The imaging unit 411 has an imaging surface on which the subject image (optical image) that has passed through the lens 501 is formed, and is an imaging device that outputs an electrical signal (analog signal) corresponding to the optical image on the imaging surface by photoelectric conversion.

[0150] The imaging unit 411 can be a CCD (Charge Couple Device) or a CMOS (Complementary MOS) sensor.

[0151] The A / D converter 412 is a signal conversion means used to convert the analog signal output from the imaging unit 411 into a digital signal.

[0152] The image processing unit 413 is an image processing means that generates image data by performing resizing processing such as pixel interpolation and reduction, and color conversion processing on the digital signal from the A / D converter 412 or the digital signal from the memory control unit 422, which will be described later.

[0153] Based on the calculation results obtained by the image processing unit 413, the system control unit 420 controls the aperture position and lens position.

[0154] The image processing unit 413 further performs calculations using the image data and performs TTL-type AWB (auto white balance) processing based on the obtained calculation results.

[0155] The system control unit 420 is a control unit consisting of at least one processor or circuit, and controls the entire digital camera 400.

[0156] Each process of the present invention is realized by executing the program recorded in the non-volatile memory 423 described later.

[0157] The memory 421 is a storage means for temporarily recording digital signals obtained by the imaging unit 411 and converted by the A / D converter 412, as well as image data generated by the image processing unit 413.

[0158] The memory 421 has sufficient storage capacity to store a predetermined number of still images, a predetermined amount of video footage, and audio.

[0159] The memory control unit 422 is a memory control means that controls the transmission and reception of data controlled by the system control unit 420 to and from the A / D converter 412, the image processing unit 413, and the memory 421.

[0160] The digital signal output from the A / D converter 412 is written directly to the memory 421 via the image processing unit 413 and the memory control unit 422, or via the memory control unit 422 alone.

[0161] The non-volatile memory 423 is an electrically erasable and recordable read-only storage means, and stores constants, programs, and the like for the operation of the system control unit 420.

[0162] The system memory 424 is a read-and-write storage means that stores constants, variables, and programs read from the non-volatile memory 423 for the operation of the system control unit 420.

[0163] The system timer 425 is a timing unit that measures the time until the auto power-off operation, which turns off the various display components described later, is performed, as well as the exposure time.

[0164] The auto power-off function has the ability to turn off various indicator lights (described later) to prevent battery drain when it determines that the photographer is not operating the digital camera 400.

[0165] The power supply unit 430 consists of primary batteries such as alkaline batteries and lithium batteries, secondary batteries such as NiCd batteries, NiMH batteries and Li batteries, and an AC adapter.

[0166] The power control unit 431 consists of a circuit for detecting the power supply unit 430, which is the power source for driving the digital camera 400, a DC-DC converter, a switch circuit for switching the power supply destination, and the like.

[0167] The power supply unit 430 then detects whether a battery is installed, the type of battery, and the remaining battery level.

[0168] Furthermore, the power control unit 431 controls the DC-DC converter based on the detection results and instructions from the system control unit 420, and supplies the necessary voltage to the recipient at the necessary timing.

[0169] The communication terminal 440 is provided on the digital camera 400 and is electrically connected to the lens communication terminal 506, which will be described later.

[0170] When the communication terminal 440 is electrically connected, the system control unit 420, which controls the entire digital camera 400, becomes able to communicate with the lens 500, which will be described later.

[0171] The recording medium I / F441 is an interface with the recording medium 600, which will be described later.

[0172] The attitude detection unit 442 detects the attitude of the digital camera 400 relative to the direction of gravity.

[0173] Based on the posture detected by the posture detection unit 442, the imaging unit 411 can output orientation information indicating whether the image was taken with the digital camera held horizontally or vertically.

[0174] The system control unit 420 can add orientation information output by the attitude detection unit 442 to the image data.

[0175] The attitude detection unit 442 can use an acceleration sensor, a gyroscope, or the like.

[0176] By using an acceleration sensor and a gyro sensor as the attitude detection unit 442, it is also possible to detect the movement of the digital camera 400 (pan, tilt, lift, whether it is stationary or not, etc.).

[0177] The eyepiece section 443 is the point where the photographer's eye (object) 700 approaches (eyepieces) the digital camera 400.

[0178] The eyepiece detection unit 444 is an approach or eyepiece detection sensor that detects when the eye 700 approaches (approaches) and moves away from (separates) the eyepiece unit 443.

[0179] The eyepiece detection unit 444 detects the presence of an eye 700 in the eyepiece unit 443 based on whether or not light is received by the light-receiving unit (not shown) of the infrared proximity sensor.

[0180] After detecting eye placement, the system control unit 420 determines that the eye placement state is maintained until eye separation is detected.

[0181] After detecting eye separation, the system control unit 420 remains in a non-eyepiece state until eyepiece detection is detected.

[0182] Note that the infrared proximity sensor is just one example; the eyepiece detection unit 444 may use any other sensor that can detect the approach of an eye or object that can be considered an eyepiece.

[0183] The aforementioned memory 421 also serves as memory for displaying images (video memory).

[0184] Digital signals and image data written to memory 421 are displayed via memory control unit 422 by rear display unit 450 and EVF 451.

[0185] The rear display unit 450 displays information according to the signal from the memory control unit 422.

[0186] The EVF451 displays information according to the signal from the memory control unit 422 when the eyepiece detection unit 444 detects that an eyepiece has been used.

[0187] The analog signal generated by the imaging unit 411 is converted by the A / D converter 412 and recorded as a digital signal in the memory 421. This digital signal is then sequentially transferred to the rear display unit 450 or the EVF 451 for display.

[0188] This enables real-time display, known as live view shooting display.

[0189] The system control unit 420 switches the display (display state) / hidden (hidden state) of the rear display unit 450 and the EVF 451 according to the state detected by the eyepiece detection unit 444.

[0190] When not using an eyepiece, the display is shown on the rear display unit 450, and the EVF 451 is turned off.

[0191] Additionally, the EVF451 displays the image while the eyepiece is engaged, and the rear display unit 450 is turned off.

[0192] The operation unit 460 consists of various operating components that act as input units for receiving operations from the user.

[0193] The control unit 460 includes various control elements described later (mode switching switch 461, shutter button 462, first shutter switch 463, second shutter switch 464, touch panel 465, power switch 466).

[0194] Furthermore, the operation unit 460 is an operating means for inputting various operation instructions to the system control unit 420.

[0195] The mode switching switch 461 switches the operating mode of the system control unit 420 to one of the following: still image shooting mode, video shooting mode, etc.

[0196] The shooting modes included in still image shooting mode are Auto Shooting Mode, Auto Scene Recognition Mode, and Manual Shooting Mode.

[0197] In addition, the still image shooting modes include aperture priority mode (Av mode), shutter speed priority mode (Tv mode), and program AE mode (P mode).

[0198] Similarly, video recording modes may also include multiple shooting modes.

[0199] The shutter button 462 is a button used by the photographer to give instructions for preparing to take a picture and to take the picture.

[0200] The first shutter switch 463 turns ON during the operation of the shutter button 462 on the digital camera 400, specifically when it is half-pressed (indicating preparation for shooting), and generates the first shutter switch signal SW1.

[0201] The first shutter switch signal SW1 initiates shooting preparation operations such as AF (autofocus), AE (automatic exposure), and AWB (automatic white balance).

[0202] The second shutter switch 464 turns ON when the shutter button 462 is fully pressed (instructing the camera to take a picture), generating the second shutter switch signal SW2.

[0203] The system control unit 420 receives the second shutter switch signal SW2, which reads out the analog signal from the imaging unit 411 and performs signal conversion processing in the A / D converter 412 and the image processing unit 413.

[0204] Furthermore, the system control unit 420 starts the shooting process operation until the image data temporarily recorded in the memory 421 is written to the recording medium 600, which will be described later.

[0205] The touch panel 465 is a device that detects touch or drag operations by the photographer.

[0206] Here, it is integrated with the rear display unit 450, and can be operated by touching the display area of ​​the rear display unit 450 with your finger.

[0207] The power switch 466 is a switch that turns the power ON / OFF. The power control unit 431 controls the power supply from the power supply unit 430 based on the switching operation of the power switch 466.

[0208] The cooling fan 470 is controlled by the system control unit 420 to cool the heat source inside the digital camera 400.

[0209] The lens unit 500 is an interchangeable lens that can be attached to and detached from the digital camera 400.

[0210] Lens 501 is a group of lenses that generate an optical image (subject image) from the subject light reflected by the subject, and is composed of multiple lenses, but in this diagram, for simplicity, only one lens is shown.

[0211] The lens communication terminal 506 is a communication terminal for the lens unit 500 to communicate with the digital camera 400.

[0212] As described above, the lens unit 500 can communicate with the system control unit 420, which controls the entire digital camera 400, by electrically connecting the lens communication terminal 506 and the communication terminal 440.

[0213] This enables the system control unit 420 to communicate with the lens system control circuit 505 and the aperture drive circuit 504 to control the position of the aperture 503 and the focus state of the real image by displacing the lens 501.

[0214] The recording medium 600 is a recording medium such as a memory card that is detachable from the digital camera 400 and is used to record captured images.

[0215] Examples include SD cards, FLASH® memory, and hard drives. [Industrial applicability]

[0216] The technology disclosed herein is used in electronic devices and imaging systems. [Explanation of symbols]

[0217] 100, 400 digital cameras 102 Front Base 102a Mounting section 106 Image sensor section 107 Main board 111 Flexible substrate for imaging signals 111a First end 111b Folded section 111c surplus portion 111d Fixed part 111e Second end 112 IMAGING Power Supply Flexible Board 112a First end 112b Folded section 112c surplus portion 112d Fixed part 112e Second end 113 Drive mechanism 114 Moving parts 114a Movement range 114b The range in which a movable part exists at any movement position. 115 Image sensor 115a Imaging substrate 115b element 115c center 116 Coil section 118 Magnets 118a X direction magnet 118b Y-direction magnet 118c Y direction magnet 121 Graphite Sheet 121a First end 121b Folded section 121c surplus portion 121d Fixed part 122 Graphite Sheets 122a First end 122b Folded section 122c surplus portion 122d Fixed part 130, 470 cooling fan 131 Exhaust vent 131a Air blow direction

Claims

1. An image sensor that can move within a movable range in a direction different from the optical axis, A first circuit board on which the aforementioned image sensor is mounted, A second circuit board facing the first circuit board, A first flexible member that electrically connects the first circuit board and the second circuit board, With fans, The first flexible member is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis, An imaging apparatus characterized in that the inner surface of the bent portion of the first flexible member that is closest to the first circuit board in the optical axis direction is provided on the extension of the exhaust port of the fan in the direction of airflow.

2. The imaging apparatus according to claim 1, characterized in that even when the image sensor moves within the movable range, at least a portion of the inner surface of the bent portion of the first flexible member closest to the first circuit board in the optical axis direction is always positioned on the extension in the airflow direction of the exhaust port of the fan.

3. The imaging apparatus according to claim 1 or 2, characterized in that, when viewed from the optical axis direction, a line segment is defined connecting the center of the exhaust port and the center of the inner surface of the nearest bent portion, and the line segment does not coincide with the normal to the inner surface of the bent portion.

4. The imaging apparatus according to claim 3, characterized in that, when viewed from the optical axis direction, the normal to the inner surface of the bent portion of the first flexible member closest to the first circuit board is inclined toward the center of the image sensor from the line segment.

5. The imaging apparatus according to claim 3 or 4, characterized in that, when viewed from the optical axis direction, when the first flexible member is unfolded, the first flexible member is formed at an angle that is not in a straight line at the bending portion closest to the first circuit board.

6. The system comprises a first magnet for driving the image sensor in a first direction different from the optical axis direction, and a second magnet for driving the image sensor in a second direction different from the first direction different from the optical axis direction. The imaging apparatus according to any one of claims 1 to 5, characterized in that the bent portion of the first flexible member is located in a region sandwiched between the center of the image sensor and the first magnet, and in a region sandwiched between the center of the image sensor and the second magnet, when viewed from the optical axis direction.

7. The first circuit board and the second circuit board are electrically connected by a second flexible substrate, The second flexible substrate is bent in a region that overlaps with the movable range of the image sensor in the direction of the optical axis. The imaging apparatus according to any one of claims 1 to 6, characterized in that the direction in which the inner surface of the second flexible substrate closest to the first circuit board faces is opposite to the direction in which the inner surface of the first flexible member closest to the first circuit board faces.

8. The imaging apparatus according to claim 2, characterized in that the direction of the airflow is the longitudinal direction of the image sensor.

9. The imaging apparatus according to any one of claims 1 to 8, wherein the first flexible member is a flexible substrate.

Images