Imaging device

Abstract

To provide an imaging apparatus capable of properly controlling the removal of foreign matter from the surface of the imaging unit while easily switching between the using state and the out-of-using state of an optical filter.SOLUTION: An imaging apparatus (100) includes: an image sensor (121); an optical filter (160); an optical member (122) placed between the image sensor and the optical filter; a vibrating unit (124) for vibrating the optical member; and a control unit (130) that controls the vibrating unit. The optical filter is capable of moving between a first position where the same is inserted in the imaging range (190) and a second position where the same is retreated from the imaging range. The control unit changes the control between when the optical filter is in the first position and when the same is in the second position.SELECTED DRAWING: Figure 18

Description

Technical Field

[0001] The present invention relates to an imaging device.

Background Art

[0002] Conventionally, an imaging device that can perform imaging using an optical filter such as a dimming filter (ND filter) has been known. Patent Document 1 discloses an imaging device including a plurality of ND filters, in which the ND filters can move back and forth vertically. Patent Document 2 discloses a configuration including a through-hole for blowing gas for blowing off dust adhering to the ND filter.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the configuration disclosed in Patent Document 1, it is difficult to seal the ND filter and the imaging element respectively, so there is a possibility that dust or the like may enter the inside of the imaging device. In the configuration disclosed in Patent Document 2, dust or the like adhering to the ND filter can be removed, but since the removal function of dust or the like adhering to the surface of the imaging element unit cannot be properly controlled, there is a possibility that dust or the like may be reflected in the captured image.

[0005] Therefore, an object of the present invention is to provide an imaging device that can easily switch between the used state and the non-used state of an optical filter and can properly perform foreign matter removal control on the surface of an imaging unit.

Means for Solving the Problems

[0006] An imaging device as one aspect of the present invention comprises an image sensor, an optical filter, an optical member disposed between the image sensor and the optical filter, and a device that vibrates the optical member. , perform foreign object removal operation The system comprises an excitation unit and a control unit that controls the excitation unit, the optical filter being movable between a first position inserted into the imaging range and a second position retracted from the imaging range, and the control unit controls the optical filter The front If it is in the second position The foreign matter removal operation is made stronger than the foreign matter removal operation when the optical filter is in the first position. system To ru.

[0007] Other objects and features of the present invention are described in the following examples. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an imaging device that allows for easy switching between the use and non-use states of the optical filter, and that enables proper control of foreign matter removal from the surface of the imaging unit. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view of the imaging device in Example 1. [Figure 2] This is a block diagram of the imaging device in Example 1. [Figure 3] This is an exploded perspective view of the imaging device in Example 1. [Figure 4] This is an explanatory diagram of the operation of the optical filter in Example 1. [Figure 5] This is a cross-sectional view of the imaging device in Example 1. [Figure 6] This is a bottom perspective view of the imaging device in Example 1. [Figure 7] This is a perspective view of the imaging device in Example 2. [Figure 8] This is an exploded perspective view of the imaging device in Example 2. [Figure 9] This is an exploded perspective view of the optical filter unit in Example 2. [Figure 10]It is an explanatory diagram when driving the optical filter unit in Example 2. [Figure 11] It is a cross-sectional view of the imaging device in Example 2. [Figure 12] It is an exploded perspective view of the imaging unit in Examples 3 and 4. [Figure 13] It is an explanatory diagram of the piezoelectric element in Examples 3 and 4. [Figure 14] It is a side view showing the vibration shapes of the optical low-pass filter and the piezoelectric element in Examples 3 and 4. [Figure 15] It is a diagram showing the relationship between the vibration frequency and amplitude of the optical low-pass filter vibrated by the piezoelectric element and the foreign matter removal operation mode in Examples 3 and 4. [Figure 16] It is a cross-sectional view showing the states before and after the foreign matter removal operation of the optical low-pass filter in the inserted state of the optical filter in Examples 3 and 4. [Figure 17] It is a cross-sectional view showing the states before and after the foreign matter removal operation of the optical low-pass filter in the retracted state of the optical filter in Examples 3 and 4. [Figure 18] It is a flowchart showing the control of the foreign matter removal operation in Example 3. [Figure 19] It is a flowchart showing the control of the foreign matter removal operation in Example 4.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each embodiment, common elements are denoted by the same reference numerals. Also, each embodiment is an example for realizing the present invention, and should be appropriately modified or changed depending on the configuration of the device to which the present invention is applied and various conditions, and the present invention is not limited to the following embodiments. Also, a part of each of the embodiments described later may be appropriately combined and configured.

Examples

[0011] First, the imaging device in Embodiment 1 of the present invention will be described with reference to Figures 1(a) and (b). Figures 1(a) and (b) are external perspective views of the imaging device (camera body) 100 in this embodiment. Figure 1(a) is an external perspective view of the imaging device 100 as seen from the front, showing the state with the lens device (interchangeable lens) 104 (see Figure 2), which can be attached to the imaging device 100, removed. Figure 1(b) is an external perspective view of the imaging device 100 as seen from the rear. Although this embodiment describes an imaging system in which the lens device 104 can be attached to and detached from the imaging device (camera body) 100, it is not limited to this and can also be applied to imaging devices in which the camera body and lens device are integrally configured.

[0012] The imaging device 100 has a grip portion (gripping portion) 101 that the user can hold to stably hold the imaging device 100. A shutter button 102, which is a switch for starting imaging, is provided on the upper part of the grip portion 101. A mount portion (lens mount) 103 is provided on the front of the imaging device 100, and the lens device 104 is configured to be detachably attached to the imaging device 100 via the mount portion 103. An opening 190 (see Figures 4(a) to (c)) that defines the imaging range is provided inside the mount portion 103. The mount contact 105 electrically connects the imaging device 100 and the lens device 104, supplying power to the lens device 104 and communicating about lens control and lens data via electrical signals. When replacing the lens device 104, the lock can be released by pressing the lens lock release button 106, and the lens device 104 can be removed.

[0013] The power switch 107 is used to turn the power of the imaging device 100 ON or OFF. The main electronic dial 108 and sub electronic dial 119 are rotary operating members that can be rotated clockwise and counterclockwise, and by rotating them, various settings such as aperture and shutter speed can be changed. The mode switching dial 109 is an operating part for switching shooting modes and is used to switch to various modes such as shutter speed priority shooting mode, aperture value priority shooting mode, and video shooting mode. The SET button 110 is a push button and is mainly used to confirm selection items.

[0014] The LCD monitor 111 displays various settings screens for the imaging device 100, captured images, and live view images. The electronic viewfinder 112 is an eyepiece-compatible viewfinder that also displays various settings screens for the imaging device 100, captured images, and live view images. The multifunction button 113 is a push button that can be assigned by the user to switch various shooting settings. The display panel 114 displays the status of various settings for the imaging device 100, such as shooting mode and ISO sensitivity. The display panel 114 is also displayed when the power to the imaging device 100 is turned OFF.

[0015] The accessory shoe 115 has an accessory contact 116, allowing various accessories such as external strobes and microphones to be attached. The media slot cover 173 is openable and closable, and when open, an external recording medium (recording medium) 148 (see Figure 2), such as an SD card, can be inserted into or removed from the internal media slot (recording medium insertion section) 172 (see Figure 8).

[0016] Next, the electrical configuration and operation of the imaging device 100 will be described with reference to Figure 2. Figure 2 is a block diagram of the imaging device 100, showing the state with the lens device 104 attached. Parts common to Figure 1 are indicated by the same reference numerals.

[0017] The MPU130 is a compact central processing unit (control unit) built into the imaging device 100. The MPU130 is connected to a time measurement circuit 131, a shutter drive circuit 132, a switch sense circuit 133, a power supply circuit 134, a battery check circuit 135, a video signal processing circuit 136, an optical filter drive circuit 137, and a piezoelectric element drive circuit 145. The MPU130 is responsible for controlling the operation of the imaging device 100, processing input information and issuing instructions and controls to each element. The MPU130 has an EEPROM that can store time information from the time measurement circuit 131 and various setting information.

[0018] Furthermore, the MPU 130 communicates with the lens control circuit 138 built into the lens device 104 via the mount contact 105. This allows the MPU 130 to control the operation of the focus lens 141 and the electromagnetically driven diaphragm (aperture diaphragm) 142 via the AF drive circuit 139 or the diaphragm drive circuit 140. In Figure 2, only one focus lens 141 is schematically shown as the imaging optical system of the lens device 104, but in reality, the imaging optical system is composed of a large number of lens groups.

[0019] The AF drive circuit 139 is connected to, for example, a stepping motor (not shown) and drives the focus lens 141. The MPU 130 calculates the amount of focus lens drive according to the amount of defocus detected using the focus signal read from the image sensor 121 and transmits a focus command including the amount of focus lens drive to the lens control circuit 138. Upon receiving the focus command, the lens control circuit 138 controls the drive of the focus lens 141 through the AF drive circuit 139. This enables autofocus (AF).

[0020] The aperture drive circuit 140 is connected to an aperture actuator such as a stepping motor (not shown) and drives multiple aperture blades (not shown) that form the aperture opening in the electromagnetically driven aperture 142. By driving the multiple aperture blades, the size (diameter) of the aperture opening changes, and the amount of light is adjusted.

[0021] The MPU 130 calculates the aperture drive amount of the electromagnetically driven aperture 142 from the brightness signal read from the image sensor 121 and transmits an aperture command including the aperture drive amount to the lens control circuit 138. In other words, the MPU 130 communicates with the lens control circuit 138 to control the electromagnetically driven aperture 142. Upon receiving the aperture command, the lens control circuit 138 controls the drive of the electromagnetically driven aperture 142 through the aperture drive circuit 140. This automatically sets an appropriate aperture value (F number).

[0022] The mechanical focal-plane shutter 150 is driven by the shutter drive circuit 132. When taking an image, from the moment the user presses the shutter button 102, the front curtain shutter (not shown) is moved to open the shutter, and according to the desired exposure time, the rear curtain shutter (not shown) is moved to close the shutter, thereby controlling the exposure time to the image sensor 121.

[0023] The optical filter 160 is an optical element that gives a special effect to an image by diffusing incident light or attenuating a specific wavelength range. The optical filter 160 is not limited to, but includes ND filters that attenuate the amount of incident light at a constant rate, Polarized Light (PL) filters that suppress reflected light using a polarizing film, and soft filters that create a soft expression by diffusing light. The optical filter 160 is driven by the optical filter drive circuit 137, which allows the position of the optical filter 160 to be moved. The detailed configuration of the optical filter 160 will be described later.

[0024] The imaging unit 120 is mainly composed of an optical low-pass filter (optical element) 122, an optical low-pass filter holding member 123, a piezoelectric element (piezoelectric element, vibration part) 124, and an image sensor 121, all integrated into a single unit. The image sensor 121 converts the subject image (optical image) formed via the lens device 104 into photoelectric power. In this embodiment, the image sensor 121 is a Complementary Metal-Oxide-Semiconductor (CMOS) sensor, but is not limited to this. A Charge-Coupled Device (CCD) sensor or a Charge Injection Device (CID) sensor may also be used as the image sensor 121. The optical low-pass filter 122, positioned in front of the image sensor 121 (between the image sensor 121 and the optical filter 160), is a single birefringent plate made of quartz, and its shape is rectangular. The piezoelectric element 124 is a single-plate piezoelectric element (piezo element) that is excited by the piezoelectric element drive circuit 145, which receives instructions from the MPU 130, and is configured to transmit its vibrations to the optical low-pass filter 122. This vibration can shake off fine dust particles that have adhered to the optical low-pass filter 122.

[0025] The video signal processing circuit 136 is responsible for all aspects of image processing, including filtering and data compression, of the electrical signals obtained from the image sensor 121. Image data for monitor display from the video signal processing circuit 136 is displayed on the liquid crystal monitor 111 and the electronic viewfinder 112 via the liquid crystal drive circuit 144. The video signal processing circuit 136 can also save image data to the buffer memory 147 via the memory controller 146, according to instructions from the MPU 130. The video signal processing circuit 136 can also perform image data compression processing such as JPEG. When continuous shooting is performed, such as in burst shooting, the image data can be temporarily stored in the buffer memory 147, and the unprocessed image data can be sequentially read out via the memory controller 146. This allows the video signal processing circuit 136 to sequentially perform image processing and compression processing regardless of the speed of the incoming image data.

[0026] The memory controller 146 has the function of storing image data in an external recording medium 148 and the function of reading image data stored in the external recording medium 148. The external recording medium 148 is an SD card or CF card that can be attached to or removed from the imaging device 100, but is not limited to these.

[0027] The switch sense circuit 133 transmits input signals to the MPU 130 according to the operating state of each switch. Switch SW1 (102a) is turned ON by the first stroke (half-press) of the shutter button 102. Switch SW2 (102b) is turned ON by the second stroke (full-press) of the shutter button 102. When switch SW2 (102b) is turned ON, an instruction to start shooting is sent to the MPU 130. The switch sense circuit 133 is also connected to the main electronic dial 108, mode selection dial 109, power switch 107, SET button 110, and multifunction button 113, among others.

[0028] The MPU 130 communicates information via the accessory contact 116 through the accessory communication control circuit 118 to utilize the functions of an accessory unit (not shown). The power supply circuit 134 distributes and supplies power from the battery 143 to each element of the imaging device 100. A battery check circuit 135 is also connected to the battery 143, which transmits information such as the remaining charge of the battery 143 to the MPU 130.

[0029] Next, the internal configuration of the imaging device 100 will be described with reference to Figure 3. Figure 3 is an exploded perspective view of the imaging device 100. The imaging device 100 has a structure mainly covered by an exterior consisting of a front cover 10, a top cover 11, and a rear cover 12, and operating members and display members are attached to each exterior. On the optical axis 1000 of the imaging optical system, in order from closest to the subject, a holding member 200, an imaging unit 120, and a main board (control board) 180 are arranged, and an optical filter 160 is mounted on the holding member 200. Any optical component such as an ND filter, a PL filter, or a soft filter (low-pass filter) may be used for the optical filter 160. Furthermore, the imaging device 100 can operate normally even when the optical filter 160 is not inserted.

[0030] Next, the configuration of the optical filter 160 and its operation during switching will be explained with reference to Figures 4(a) to 4(c). Figures 4(a) to 4(c) are explanatory diagrams of the operation of the optical filter 160, showing the components related to the optical filter 160 and the retaining member 200 as viewed from the rear side of the imaging device 100.

[0031] The optical filter 160 is inserted into and held by a retaining member 200. The retaining member 200 has a gear shape 200a and is mounted on the front cover 10 so as to be rotatable around the gear shape 200a. A motor (actuator, drive unit) 201 for driving the optical filter 160 is also mounted on the front cover 10, and a worm gear 201a is attached to the drive shaft of the motor 201. The worm gear 201a transmits rotational force to the gear shape 200a of the retaining member 200 via an intermediate gear 202, thereby allowing the retaining member 200 to rotate. A battery storage compartment 170 for housing a battery 143 is provided on the right side of the front cover 10.

[0032] In this embodiment, the multifunction button 113 is assigned the function of switching the insertion / retraction of the optical filter 160. Next, the operation when the optical filter 160 is driven by user operation will be described. Note that other buttons, dials, switches, setting screens, etc., may also be used for switching the optical filter 160.

[0033] Figure 4(a) shows the state in which the optical filter 160 is inserted into and superimposed on an opening 190 provided inside the mount portion 103 of the imaging device 100 (inserted state). The opening 190 defines the imaging range. As a result, light incident on the image sensor 121 passes through the optical filter 160, and various photographic expressions become possible due to the effect of the optical filter 160. For example, if an ND filter is inserted as the optical filter 160, the incident light is reduced, making it possible to take long-exposure photographs and suppress overexposure even in bright environments.

[0034] When the multifunction button 113 is pressed from the inserted state shown in Figure 4(a), the press is detected by the switch sense circuit 133. At this time, a drive command for the motor 201 is sent from the MPU 130, and the motor 201 starts rotating via the optical filter drive circuit 137. The rotation of the motor 201 is transmitted from the worm gear 201a to the gear shape 200a via the gear shape 200a, and the retaining member 200 equipped with the gear shape 200a starts to rotate. Figure 4(b) shows the state during rotation (intermediate state).

[0035] The holding member 200 moves to the retracted state shown in Figure 4(c) after passing through the intermediate state shown in Figure 4(b). The pivot axis of the gear shape 200a is located on the bottom side of the imaging device 100, relative to the optical axis 1000 and the aperture 190, and between the optical axis 1000 and the short side of the grip portion 101 of the aperture 190. This allows the holding member 200 to rotate without interfering with internal components such as the top cover 11, as shown in Figure 4(b). Similarly, by positioning the motor 201 on the bottom side of the optical axis 1000 and the aperture 190, the power transmission distance to the gear shape 200a is shortened, and the driving efficiency is improved.

[0036] When the holding member 200 moves to the retracted position (second position) shown in Figure 4(c), the optical filter drive circuit 137 stops the motor 201 in response to a detection signal from a position sensor (not shown). The position sensor refers to a position detection means such as a photoreflector, but the timing of stopping the drive can be determined by any means, such as detecting the rotation angle of the motor 201 or detection by a mechanical switch.

[0037] Figure 4(c) shows the state in which the retaining member 200 has rotated approximately 90 degrees on a plane parallel to the imaging unit 120 relative to the insertion state in Figure 4(a), and has been retracted from the opening 190 (retracted state). With the retaining member 200 retracted, the light focused by the lens device 104 enters the image sensor 121 without passing through the optical filter 160.

[0038] Figure 5 is a cross-sectional view of the imaging device 100, showing a cross-section along line AA in Figure 4(c). As shown in Figure 5, the holding member 200 retracts between the opening 190 and the battery storage section 170, that is, between the opening 190 and the grip section 101. By rotating the holding member 200 by approximately 90 degrees from its inserted state, the short side of the optical filter 160 becomes approximately parallel to the X direction (the lateral direction of the imaging device 100), allowing it to be accommodated between the opening 190 and the battery storage section 170.

[0039] If the user wishes to reinsert the optical filter 160 into the opening 190, pressing the multifunction button 113 in the retracted state shown in Figure 4(c) causes the motor 201 to rotate in the opposite direction to the operation described above. This moves the optical filter 160 through the intermediate state shown in Figure 4(b) to the inserted state shown in Figure 4(a). When the optical filter 160 moves to the inserted state position (first position) shown in Figure 4(a), the optical filter drive circuit 137 stops the motor 201 based on a detection signal from a position sensor (not shown), similar to the retracted state.

[0040] With the above configuration, the optical filter 160 can be inserted into and retracted relative to the optical axis 1000 without interfering with the internal components or units of the imaging device 100. Therefore, the optical filter 160 can be built into the imaging device 100 without increasing its size, and the inserted and retracted states of the optical filter 160 can be easily switched.

[0041] Next, with reference to Figures 6(a) to 6(c), the configuration of the bottom surface of the imaging device 100 and the operation when replacing the optical filter 160 will be explained. Figures 6(a) to 6(c) are perspective views of the imaging device 100 as seen from the bottom side when inserting or removing the optical filter 160.

[0042] Figure 6(a) shows the bottom surface of the imaging device 100 in its normal operating state. The bottom surface of the imaging device 100 is provided with a battery cover 171 for accessing the battery storage compartment 170 and inserting or removing the battery 143. Nearby, an optical filter cover 210 is provided for accessing the retaining member 200 and inserting or removing the optical filter 160.

[0043] Figure 6(b) shows the state in which the user has opened the optical filter cover 210 with the retaining member 200 shown in Figure 4(c) in the retracted position. A filter replacement opening 211 is provided on the inside of the optical filter cover 210, exposing the retracted retaining member 200 and the short side of the optical filter 160. A recess 10a is provided at the bottom of the imaging device 100, allowing the user to pick up and remove the optical filter 160. Note that the removal configuration for the optical filter 160 is not limited to this. For example, a removal configuration may be used in which the lock is released when the optical filter 160 is pushed in once, and it is pushed out by a biasing force such as a spring.

[0044] Figure 6(c) shows the optical filter 160 in the extended position. In this way, the user can insert and remove the optical filter 160, which is inserted into the retaining member 200, and replace it with various filters of their choice. In this embodiment, the battery cover 171 and the optical filter cover 210 are separate, but a common cover member may be used. With the above configuration, it is possible to replace the optical filter 160 from the bottom of the imaging device 100. [Examples]

[0045] Next, an imaging device in Embodiment 2 of the present invention will be described. Embodiment 1 described an example in which the invention was applied to a general imaging device 100 having one grip portion 101. On the other hand, this embodiment describes an imaging device 100a having two grip portions. In this embodiment, components and operations common to the imaging device 100 of Embodiment 1 will be described using the same reference numerals, and detailed explanations thereof will be omitted.

[0046] First, the differences between the imaging device 100a of this embodiment and the imaging device 100a of Embodiment 1 will be explained with reference to Figures 7(a) and 7(b). Figure 7 is a perspective view of the imaging device 100a in this embodiment. Figure 7(a) is an external perspective view of the imaging device 100a seen from the front, showing the state with the lens device 104 that can be attached to the imaging device 100a removed. Figure 7(b) is an external perspective view of the imaging device 100a seen from the rear. The imaging device 100a is equipped with a grip portion 101 for gripping when held in the upright position, and a grip portion 304 that can also be gripped when held in the vertical position. A detailed explanation of the gripping state in the upright and vertical positions will be omitted.

[0047] Next, the configuration of the imaging device 100a in this embodiment will be described with reference to Figure 8. Figure 8 is an exploded perspective view of the imaging device 100a. The exterior of the imaging device 100a is mainly composed of a front cover 10, a top cover 11, and a rear cover 12, similar to the imaging device 100 of Embodiment 1. The battery 143 is located at the bottom of the imaging device 100a and can be inserted and removed from the direction of arrow S51. The external recording medium 148 can be inserted into the media slot 172 provided on the side of the imaging device 100 from the direction of arrow S52. The media slot 172 has a push-type lever, and the external recording medium 148 can be attached and detached by pressing the lever. A mount section 103 and an imaging unit 120 are provided on the optical axis 1000, and the optical filter unit 320 in this embodiment is positioned in between them.

[0048] Referring to Figure 9, the configuration of the optical filter unit 320 in this embodiment will be described. Figure 9 is an exploded perspective view of the optical filter unit 320. The components constituting the optical filter unit 320 are attached to the base member 321. The optical filter 160 is held by the holding member 322. The holding member 322 has a rack gear shape 322a.

[0049] The retaining member 322 engages with the upper rail 323 and lower rail 324, which are guide members, and can drive the optical filter 160 in a specific direction. A motor (actuator, drive unit) 325 for driving the optical filter 160 is located at the bottom of the retaining member 322, and a pinion gear 325a is attached to the drive shaft. In addition, a first gear 326, a second gear 327, and a third gear 328 are rotatably mounted on a shaft provided on the base member 321.

[0050] Next, the state transitions of the optical filter unit 320 will be explained with reference to Figures 10(a) to (c). Figures 10(a) to (c) are explanatory diagrams of the optical filter unit 320 during operation. Figure 10(a) shows the inserted state in which the optical filter 160 is superimposed on the aperture 190. Figure 10(b) shows the intermediate state in which the optical filter 160 is moving from the inserted state to the retracted state. Figure 10(c) shows the retracted state in which the optical filter 160 has been retracted from the aperture 190.

[0051] In the inserted state shown in Figure 10(a), when the user presses the multifunction button 113, the optical filter unit 320 begins to move to the retracted state. The rotation of the motor 325 is transmitted to the rack gear shape 322a of the holding member 322 via the first gear 326, the second gear 327, and the third gear 328. Guided by the upper rail 323 and the lower rail 324, the optical filter 160 moves from the inserted state (Figure 10(a)) through an intermediate state (Figure 10(b)) to the retracted state (Figure 10(c)). Once the optical filter 160 reaches the retracted state, it receives a detection signal from a position sensor (not shown) and stops.

[0052] If the user wishes to reinsert the optical filter 160, pressing the multifunction button 113 in the retracted state shown in Figure 10(c) causes the motor 325 to rotate in the opposite direction to the above operation. As a result, the optical filter 160 moves through the intermediate state shown in Figure 10(b) to the inserted state shown in Figure 10(a). Once the optical filter 160 reaches the inserted state, it receives a detection signal from a position sensor (not shown) and stops, similar to the retracted state. With this configuration, the optical filter 160 can be built into the imaging device 100 without increasing its size, and it is possible to easily switch between the inserted state and the retracted state of the optical filter 160.

[0053] Next, with reference to Figures 11(a) to (c), the arrangement of the optical filter 160 and the retaining member 322 within the imaging device 100 during the transition from the inserted state to the retracted state will be described. Figures 11(a) to (c) are cross-sectional views of the imaging device 100a. Figure 11(a) is a view of the front cover 10, optical filter 160, retaining member 322, media slot 172, and main board (control board) 180 as seen from the rear side of the imaging device 100a. Figure 11(b) is a cross-sectional view along line BB in Figure 11(a) when the optical filter 160 is in the inserted state. Figure 11(c) is a cross-sectional view along line BB in Figure 11(a) when the optical filter 160 is in the retracted state.

[0054] As shown in Figure 11(c), in the retracted state, the optical filter 160 is retracted between the grip portion 101 and the media slot 172 or the main board 180. In this way, the optical filter 160 can be retracted to the retracted state without increasing the size of the imaging device 100a and without interfering with internal components such as the main board 180 or the media slot 172.

[0055] Although this embodiment does not describe the means for replacing the optical filter 160, a means for replacing the optical filter 160 may be provided, similar to Embodiment 1. Also, in Embodiment 1, the optical filter cover 210 for replacing the optical filter 160 is provided on the bottom surface of the imaging device 100, but in this embodiment, the imaging device 100, from which the retaining member 322 retracts, may be provided on the surface viewed from the direction of arrow S52. Furthermore, the optical filter cover 210 may be integrated with the media slot cover 173. [Examples]

[0056] Next, Embodiment 3 of the present invention will be described. In this embodiment, in the configuration described in Embodiments 1 and 2, the control of the foreign matter removal operation of the optical low-pass filter 122 according to the state of the optical filter 160 (inserted position (first position) or retracted position (second position)) will be described.

[0057] First, the configuration of the imaging unit 120 will be described with reference to Figure 12. Figure 12 is an exploded perspective view of the imaging unit 120. The piezoelectric element 124 has a single rectangular strip shape and is positioned and bonded to the periphery of the optical low-pass filter 122 such that the long side of the piezoelectric element 124 is substantially parallel to the short side (side) of the optical low-pass filter 122. A flexible printed circuit board 620 for piezoelectric elements is fixed to the piezoelectric element 124 by adhesive or the like. An elastic member 611 is arranged on the optical low-pass filter holding member 123, and the optical low-pass filter 122 is held by being sandwiched between the holding member 610. With this configuration, the piezoelectric element 124 can vibrate the optical low-pass filter 122 in order to remove foreign matter from the surface of the optical low-pass filter 122.

[0058] Next, the configuration of the piezoelectric element 124 will be described with reference to Figure 13. Figure 13 is an explanatory diagram of the piezoelectric element 124. The B-side of the piezoelectric element 124 is divided into a + phase and a G phase for exciting standing wave vibrations in the optical low-pass filter 122. The C-side of the piezoelectric element 124 is electrically connected by a conductive material (not shown) and maintained at the same potential as the G phase of the B-side. A flexible printed circuit board 620 for the piezoelectric element is fixed to the B-side by adhesive or the like, so that predetermined voltages can be independently applied to the + phase and the G phase. The C-side is fixed to the optical low-pass filter 122 by adhesive or the like, so that the piezoelectric element 124 and the optical low-pass filter 122 move as a single unit.

[0059] Next, with reference to Figure 14, the vibration behavior of the optical low-pass filter 122 as it removes foreign matter will be explained. Figure 14 is a side view of the optical low-pass filter 122 and the piezoelectric element 124 which is bonded to it and provided as an integral part. Figure 14 shows the state change (vibration shape) of the optical low-pass filter 122 and the piezoelectric element 124 when a driving voltage is applied to the piezoelectric element 124.

[0060] A positive voltage is applied to the + phase of the piezoelectric element 124 through the flexible printed circuit board 620 for the piezoelectric element (the G phase is ground). At this time, the piezoelectric element 124 stretches in the planar direction and contracts in the thickness direction. As a result, the optical low-pass filter 122, which is bonded to the piezoelectric element 124, experiences a force in the direction that expands the bonding surface. When subjected to such a force, when the optical low-pass filter 122 is viewed from the cross-sectional direction, the surface on the piezoelectric element 124 side deforms in the direction of stretching, and the opposite surface deforms in the direction of contraction, resulting in a convex shape with the piezoelectric element 124 on its apex. This deformation chains together, and when the optical low-pass filter 122 is viewed from the cross-sectional direction, a continuous bent deformation with a concave and convex shape occurs. That is, when a positive voltage is applied to the + phase, the optical low-pass filter 122 undergoes a bent deformation as shown by the solid line in Figure 14.

[0061] Similarly, when a negative voltage is applied to the + phase (G phase is ground), the piezoelectric element 124 shrinks in the planar direction and expands in the thickness direction. At this time, the optical low-pass filter 122, which is bonded to the piezoelectric element 124, is subjected to a force in the direction of contraction at the bonding surface. When subjected to such a force, when the optical low-pass filter 122 is viewed from the cross-sectional direction, the surface on the piezoelectric element 124 side deforms in the direction of contraction, and the opposite surface deforms in the direction of expansion, resulting in a concave shape that embraces the piezoelectric element 124 inward. In other words, a deformation occurs in the opposite direction to when a positive voltage is applied to the + phase, and the optical low-pass filter 122 undergoes a bending deformation as shown by the dashed line in Figure 14.

[0062] Therefore, by periodically switching between applying a positive voltage to the + phase and applying a negative voltage to the + phase while keeping the G phase connected to ground, standing wave oscillations are generated. That is, the piezoelectric element 124 causes periodic oscillations that alternately repeat the solid line state and the dashed line state in Figure 14. By setting the frequency of this periodic voltage near the resonant frequency of the optical low-pass filter 122's natural mode, a large amplitude can be obtained even with a small applied voltage, resulting in high efficiency. Furthermore, the optical low-pass filter 122 has multiple resonant frequencies, and applying a voltage at each resonant frequency allows it to oscillate in different order vibration modes. Figure 14 shows the 7th order vibration mode with 7 antinodes and the 8th order vibration mode with 8 antinodes. Increasing the applied drive voltage increases the amplitude of the oscillations generated in the optical low-pass filter 122, and therefore tends to improve the foreign matter removal performance.

[0063] As shown in Figure 14, in standing wave vibration, vibration nodes (f1, f2, ..., g1, g2, ...) and antinodes alternate. A vibration node is a position where the amplitude is nearly zero, and an antinode is a position where the amplitude is maximum between adjacent nodes. To shake off dust and other particles adhering to the surface of the optical low-pass filter 122, an acceleration must be generated such that a force greater than the adhesive force acts in the direction of peeling off the dust and other particles. The acceleration is determined by the frequency and amplitude of the vibration occurring in the optical low-pass filter 122. However, since the amplitude is nearly zero at the vibration nodes, the acceleration generated is also nearly zero, and it is not possible to shake off the dust and other particles against the adhesive force. Therefore, if the optical low-pass filter 122 is vibrated with only one vibration mode, dust and other particles will remain on the vibration nodes.

[0064] To improve this, the piezoelectric element 124 is controlled to vibrate the optical low-pass filter 122 in one vibration mode, and then vibrate it in another vibration mode. This allows dust and other particles remaining from the first vibration mode to be removed in the subsequent vibration mode. In this case, if the nodes of one vibration mode and the nodes of another vibration mode overlap, the dust and other particles at the overlapping nodes cannot be removed, so it is preferable to adjust the nodes so that they do not overlap. Therefore, it is desirable that the combination of vibration modes used be an even node (odd order) and an odd node (even order).

[0065] The resonant frequency of the optical low-pass filter 122 varies depending on its shape, thickness, material, etc., but it is preferable to select a resonant frequency that falls outside the audible range in order to suppress the generation of unpleasant sounds. Figure 14 illustrates an example of generating vibrations in the 7th and 8th vibration modes, but it is not limited to this, and vibrations may be generated in vibration modes of other orders, or three or more vibration modes may be used. Generally, the more vibration modes there are, the better the foreign matter removal performance tends to be.

[0066] Next, referring to Figures 15(a) and (b), the relationship between the vibration frequency and amplitude of the optical filter 160, which is excited by the piezoelectric element 124, and the foreign matter removal operation mode will be explained. Figure 15(a) is a diagram showing the relationship between the vibration frequency and amplitude of the optical low-pass filter 122, which is excited by the piezoelectric element 124. In Figure 15(a), the X axis represents the vibration frequency and the Y axis represents the amplitude. As explained with reference to Figure 14, Figure 15(a) shows the 5th to 9th vibration modes, and a peak in amplitude occurs in each vibration mode. Although not shown, vibration modes also exist on the lower frequency side than the 5th order and on the higher frequency side than the 9th order.

[0067] Referring to FIG. 15(a), the normal mode of the foreign object removal operation will be described. The normal mode is indicated by the solid line in the graph. A driving voltage Vm is applied by the piezoelectric element driving circuit 145, and vibration is gradually changed from the high-frequency side to the low-frequency side in a frequency band R2 including the sixth, seventh, and eighth vibration modes for driving. Further, the driving in the frequency band R2 is repeatedly operated N times.

[0068] FIG. is a table regarding parameters for changing the strength of the operation mode of the foreign object removal operation. Parameters for determining the strength of the foreign object removal operation include the driving voltage, the frequency band, and the number of driving times. The driving voltage satisfies Vl < Vm < Vh. Regarding the influence of the driving voltage on the removal performance, the amplitudes of the eighth vibration mode when the driving voltage is applied at Vl, Vm, and Vh are A8l < A8m < A8h, respectively. As the voltage increases, the amplitude also increases, so there is a tendency to easily remove foreign objects. Therefore, regarding the removal performance, Vl is the weak mode, Vm is the normal mode, and Vh is the strong mode. Next, regarding the frequency band, it is R1 including the sixth and seventh vibration modes, R2 including the sixth, seventh, and eighth vibration modes, and R3 including the sixth, seventh, eighth, and ninth vibration modes. Regarding the frequency band, the more vibration modes are included, the more the abdomen by each of the aforementioned vibration modes increases, so the removal performance tends to be stronger. Therefore, R1 is the weak mode, R2 is the normal mode, and R3 is the strong mode. Regarding the number of driving times, the more times, the stronger the removal performance. Therefore, it is defined that N - a is the weak mode, N is the normal mode, and N + b is the strong mode.

[0069] The operation modes and parameters in the table shown in FIG. may be combined independently. For example, when only the driving voltage is changed, it becomes Vl, R2, N: weak mode, Vm, R2, N: normal mode, Vh, R2, N: strong mode. Also, when all parameters are changed, it becomes Vl, R1, N - a: weak mode, Vm, R2, N: normal mode, Vh, R3, N + b: strong mode. Thus, by varying the parameters of the driving voltage, the frequency band, and the number of driving times, it is possible to change the normal, strong, and weak modes of the removal performance.

[0070] Next, with reference to Figures 16(a), (b) and 17(a), (b), the state of the optical filter 160 before and after the foreign object removal operation in the inserted state (first position) and the retracted state (second position) will be described. Figures 16(a), (b) and 17(a), (b) are top cross-sectional views showing only the focal plane shutter 150, optical filter 160, and imaging unit 120 from the imaging device 100. As mentioned above, the focal plane shutter 150 is composed of a front curtain shutter and a rear curtain shutter and controls the exposure time to the image sensor 121. As shown in Figures 16(a), (b) and 17(a), (b), the focal plane shutter 150 is composed of multiple blade members, and the exposure to the image sensor 121 is controlled by the movement of the blade members.

[0071] Figures 16(a) and (b) show the case where the optical filter 160 is in the inserted position (first position), with Figure 16(a) showing the state before the foreign matter removal operation and Figure 16(b) showing the state after the foreign matter removal operation. When the optical filter 160 is in the inserted position, as shown in Figure 16(b), the foreign matter 630 removed from the optical low-pass filter 122 by the removal operation moves to an area around the imaging unit 120 that does not affect imaging, or adheres to the optical filter 160. As the imaging device 100 is made thinner, the distance between the optical filter 160 and the optical low-pass filter 122 becomes closer, and the amount of foreign matter adhering to the optical filter 160 tends to increase.

[0072] Figures 17(a) and (b) show the case where the optical filter 160 is in the retracted position (second position), with Figure 17(a) showing the state before the foreign matter removal operation and Figure 17(b) showing the state after the foreign matter removal operation. As shown in Figure 17(b), the foreign matter 630 removed from the optical low-pass filter 122 by the foreign matter removal operation moves to an area around the imaging unit 120 that does not affect shooting, or adheres to the front curtain shutter or rear curtain shutter of the focal plane shutter 150. The front curtain shutter and rear curtain shutter of the focal plane shutter 150 are farther away from the optical low-pass filter 122 than the optical filter 160, so foreign matter is less likely to adhere to them. Foreign matter attached to the focal plane shutter 150 is flicked off by running the front curtain shutter and rear curtain shutter, so it is possible to move the foreign matter to an area that does not affect shooting.

[0073] Next, with reference to Figure 18, the control of the foreign matter removal operation in the inserted and retracted states of the optical filter 160 will be described. If foreign matter is present in the optical components placed in the imaging light path, shadows of the foreign matter may appear in the captured image, so it is preferable to remove as much foreign matter as possible from the imaging light path. As shown in Figures 16(a), (b) and 17(a), (b), in order to prevent foreign matter removed from the optical low-pass filter 122 from adhering to the optical filter 160, it is preferable to weaken or disable the foreign matter removal operation when the optical filter 160 is inserted.

[0074] Figure 18 is a flowchart showing the control of the foreign object removal operation in this embodiment, illustrating a control method that weakens or eliminates the foreign object removal operation when the optical filter 160 is retracted. First, in step S601, the MPU 130 determines whether or not the foreign object removal operation has been started. The foreign object removal operation is started when an operating member such as the SET button 110 is pressed from the menu screen of the imaging device 100, and the switch sense circuit 133 transmits the input signal of the press to the MPU 130. Alternatively, the operation may be initiated using cursor keys or instruction buttons from a menu displayed on the liquid crystal monitor 111 or the electronic viewfinder 112.

[0075] If the foreign object removal operation is started, the process proceeds to step S602. In step S602, the MPU 130 determines whether the optical filter 160 is in the retracted position (second position). As described above, the state of the optical filter 160 can be determined by the transmission of signals from position detection sensors or other devices placed on the movement trajectory of the optical filter 160 or the holding member 200 to the MPU 130. If the optical filter 160 is in the retracted position, the process proceeds to step S603. On the other hand, if the optical filter 160 is in the inserted position, the process proceeds to step S610.

[0076] In step S603, the MPU 130 transmits a drive command to the piezoelectric element drive circuit 145 to perform the foreign object removal operation in normal mode. Upon receiving the drive command from the MPU 130, the piezoelectric element drive circuit 145 generates a periodic voltage that excites standing wave vibrations in the optical low-pass filter 122 and applies it to the piezoelectric element 124. The piezoelectric element 124 expands and contracts in response to the applied voltage, generating standing wave vibrations in the optical low-pass filter 122. Here, the foreign object removal operation is performed in the normal mode as described with reference to Figures 15(a) and (b).

[0077] In step S610, the MPU 130 determines whether the user has given an instruction (move instruction) to move the optical filter 160 to the retracted position. The move instruction is detected by the switch sense circuit 133 when an operating component such as the multifunction button 113 or the SET button 110 is pressed. If a move instruction is given, the process proceeds to step S611. On the other hand, if there is no move instruction, the process proceeds to step S620. There may also be a mode in which no instruction is given to the user by not setting step S610. In this case, if the optical filter 160 is not in the retracted position in step S602, the process proceeds directly to step S620.

[0078] In step S611, the MPU 130 sends a drive command to the optical filter drive circuit 137. This drive command moves the optical filter 160 to the retracted position. The detailed structure and state transitions are as described above. Next, in step S612, the MPU 130 performs a foreign object removal operation in normal mode. This operation is the same as in step S603, so the explanation is omitted. Next, in step S613, the MPU 130 sends a drive command to the optical filter drive circuit 137. This drive command moves the optical filter 160 to the insertion position. Step S613 is the process of returning the optical filter 160 to the insertion position it was in before moving to the retracted position in step S611 after the foreign object removal operation is completed.

[0079] In step S620, the MPU 130 sends a drive command to the piezoelectric element drive circuit 145 to perform a foreign matter removal operation in weak mode. Upon receiving the drive command from the MPU 130, the piezoelectric element drive circuit 145 generates a periodic voltage that excites standing wave vibrations in the optical low-pass filter 122 and applies it to the piezoelectric element 124. The piezoelectric element 124 expands and contracts in response to the applied voltage, generating standing wave vibrations in the optical low-pass filter 122. Here, the foreign matter removal operation is the setting of parameters to operate in weak mode, as explained with reference to Figures 15(a) and (b). Also in step S620, if it is not desired that foreign matter adhere to the optical filter 160, the MPU 130 may be controlled not to perform the foreign matter removal operation. In configurations where the optical filter 160 cannot be removed, some users may want to avoid foreign matter adhering to the optical filter 160. [Examples]

[0080] Next, Embodiment 4 of the present invention will be described. In this embodiment, the state of the insertion position or retracted position of the optical filter 160 in the configuration in which the optical filter 160 can be replaced in the retracted state described in Embodiment 1, and the control of the foreign matter removal operation of the optical low-pass filter 122 will be described.

[0081] Referring to Figure 19, a cleaning mode will be described in which foreign matter inside the imaging device 100 is actively attached to the optical filter 160, and the optical filter 160 is removed and cleaned to remove the foreign matter inside the imaging device 100. Figure 19 is a flowchart showing the control of the foreign matter removal operation in this embodiment.

[0082] First, in step S630, the MPU 130 determines whether or not the cleaning mode has been started. The cleaning mode is started when an operating element such as the SET button 110 is pressed from the menu screen of the imaging device 100, and the switch sense circuit 133 sends an input signal to the MPU 130 indicating that the button has been pressed. Alternatively, the mode may be initiated using cursor keys or instruction buttons from the menu displayed on the LCD monitor 111 or the electronic viewfinder 112.

[0083] Next, in step S631, the MPU 130 receives a command to start cleaning mode and switches the imaging device 100 to the cleaning mode state. Next, in step S632, the MPU 130 determines whether the optical filter 160 is in the insertion position or not. The state of the optical filter 160 can be determined by the transmission of signals from position detection sensors or other devices placed on the movement trajectory of the optical filter 160 or the holding member 200 to the MPU 130, as described above. If the optical filter 160 is in the insertion position, the process proceeds to step S633. On the other hand, if the optical filter 160 is in the retracted position, the process proceeds to step S640.

[0084] In step S640, the MPU 130 determines whether the cleaning mode should be continued. The cleaning mode is continued when an operating element such as the SET button 110 is pressed from the menu screen of the imaging device 100, and the switch sense circuit 133 sends an input signal to the MPU 130. Alternatively, the user may be instructed to continue the cleaning mode using cursor keys or instruction buttons from the menu displayed on the LCD monitor 111 or the electronic viewfinder 112. If the cleaning mode is to be continued, the process proceeds to step S641. On the other hand, if the cleaning mode is not to be continued, the process proceeds to step S650.

[0085] In step S641, the MPU 130 sends a drive command to the optical filter drive circuit 137, and the optical filter 160 moves to the insertion position. The detailed structure and state transitions are as described above.

[0086] In step S633, the MPU 130 sends a drive command to the piezoelectric element drive circuit 145 to perform a foreign matter removal operation in strong mode. Upon receiving the drive command from the MPU 130, the piezoelectric element drive circuit 145 generates a periodic voltage that excites standing wave vibrations in the optical low-pass filter 122 and applies it to the piezoelectric element 124. The piezoelectric element 124 expands and contracts in response to the applied voltage, generating standing wave vibrations in the optical low-pass filter 122. Here, the foreign matter removal operation is the setting of parameters to operate the strong mode, as explained with reference to Figures 15(a) and (b). As explained with reference to Figure 16(b), when the foreign matter removal operation is performed in strong mode with the optical filter 160 in the insertion position, foreign matter from the optical low-pass filter 122 can be actively attached to the optical filter 160.

[0087] Next, in step S634, the MPU 130 displays a message on the liquid crystal monitor 111 or electronic viewfinder 112 instructing the user to remove the optical filter 160. Following this instruction, the user removes the optical filter 160, cleans its surface, and reinserts it into the imaging device 100. By cleaning the surface of the optical filter 160, which has foreign matter attached to it from inside the imaging device 100, it is possible to remove the foreign matter that was present inside the imaging device 100 via the optical filter 160.

[0088] In step S650, the MPU 130 transmits a drive command to the piezoelectric element drive circuit 145 to perform the foreign matter removal operation in normal mode. Upon receiving the drive command from the MPU 130, the piezoelectric element drive circuit 145 generates a periodic voltage that excites standing wave vibrations in the optical low-pass filter 122 and applies it to the piezoelectric element 124. The piezoelectric element 124 expands and contracts in response to the applied voltage, generating standing wave vibrations in the optical low-pass filter 122. Here, the foreign matter removal operation is the setting of parameters to operate in normal mode, as explained with reference to Figures 15(a) and (b). At this time, the optical filter 160 is in a retracted state, and there is no concern about foreign matter adhering to the optical filter 160 during the foreign matter removal operation, but it is driven in normal mode rather than strong mode for power saving. The drive voltage, frequency bandwidth, and number of drives, which are related to foreign matter removal performance, consume more power when set to enhance foreign matter removal performance. Therefore, it is effective to drive with an appropriate foreign matter removal operation according to the position state of the optical filter 160.

[0089] As described above, the imaging device 100 (100a) includes an image sensor 121, an optical filter 160, an optical element (optical low-pass filter 122), an excitation unit (piezoelectric element 124) that vibrates the optical element, and a control unit (MPU 130) that controls the excitation unit. The optical filter is movable between a first position (inserted position) inserted into the imaging range (aperture 190) and a second position (retracted position) retracted from the imaging range. The control unit changes its control depending on whether the optical filter is in the first position or the second position.

[0090] Preferably, the optical filter is movable between a first position and a second position according to user instructions. Also preferably, the control unit changes at least one of the amplitude, frequency band, or number of vibrations of the optical member depending on whether the optical filter is in the first position or the second position. More preferably, the control unit sets the amplitude to a first amplitude when the optical filter is in the first position, and sets the amplitude to a second amplitude which is larger than the first amplitude when the optical filter is in the second position. Also preferably, the control unit sets the frequency band to a first frequency band when the optical filter is in the first position, and sets the frequency band to a second frequency band which is wider than the first frequency band when the optical filter is in the second position. Also preferably, the control unit sets the number of drives to a first drive count when the optical filter is in the first position, and sets the number of drives to a second drive count which is greater than the first drive count when the optical filter is in the second position. Also preferably, the control unit does not vibrate the optical member when the optical filter is in the first position. Note that the optical member is not limited to an optical low-pass filter 122, but may be other optical members.

[0091] According to each embodiment, it is possible to provide an imaging device that allows for easy switching between the use and non-use states of the optical filter, and that enables proper control of foreign matter removal from the surface of the imaging unit.

[0092] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its essence.

[0093] For example, in Embodiments 3 and 4, if the optical low-pass filter 122 is instructed to remove foreign matter while the optical filter 160 is positioned between the first and second positions, the optical filter 160 can be moved to the second position before the optical low-pass filter 122 is vibrated. Also, for example, in each embodiment, a configuration was described in which the insertion and removal of the optical filter 160 is controlled in response to the user pressing the multifunction button 113, but the invention is not limited to this. For example, if the presence or absence of insertion and removal of the optical filter 160 can be adjusted as one of the parameters for exposure control, the imaging device 100 may be configured to automatically insert and remove the optical filter 160 according to the brightness of the subject. [Explanation of symbols]

[0094] 100 Imaging device 121 Image sensor 122 Optical low-pass filter (optical component) 124 Piezoelectric element (vibration part) 130 MPU (Control Unit) 160 Optical Filters

Claims

1. Image sensor and Optical filters and An optical element disposed between the imaging sensor and the optical filter, The vibration unit vibrates the optical element to perform a foreign object removal operation, It includes a control unit that controls the vibration unit, The optical filter is movable between a first position inserted into the imaging range and a second position retracted from the imaging range. The imaging apparatus is characterized in that the control unit controls the foreign matter removal operation when the optical filter is in the second position to be stronger than the foreign matter removal operation when the optical filter is in the first position.

2. The imaging apparatus according to claim 1, characterized in that the optical filter is movable between the first position and the second position according to the user's instructions.

3. The imaging apparatus according to claim 1 or 2, characterized in that the control unit changes the amplitude of vibration of the optical member depending on whether the optical filter is in the first position or the second position.

4. The control unit, When the optical filter is in the first position, the amplitude is set to the first amplitude. The imaging apparatus according to claim 3, characterized in that when the optical filter is in the second position, the amplitude is set to a second amplitude which is larger than the first amplitude.

5. The imaging apparatus according to any one of claims 1 to 3, characterized in that the control unit changes the frequency band for vibrating the optical member depending on whether the optical filter is in a first position or a second position.

6. The control unit, When the optical filter is in the first position, the frequency band is set to the first frequency band. The imaging apparatus according to claim 5, characterized in that when the optical filter is in the second position, the frequency band is set to a second frequency band that is wider than the first frequency band.

7. The imaging apparatus according to any one of claims 1 to 6, characterized in that the control unit changes the number of times the optical member is vibrated when the optical filter is in the first position and when it is in the second position.

8. The control unit, When the optical filter is in the first position, the number of drives is set to the first number of drives. The imaging apparatus according to claim 7, characterized in that when the optical filter is in the second position, the number of drives is set to a second number of drives which is greater than the first number of drives.

9. The imaging apparatus according to any one of claims 1 to 8, characterized in that the control unit does not vibrate the optical member when the optical filter is in the first position.

10. The imaging apparatus according to any one of claims 1 to 9, characterized in that the optical element is an optical low-pass filter.

11. It further has a mount section from which the lens device can be attached and detached, The imaging apparatus according to any one of claims 1 to 10, characterized in that the optical filter is disposed between the image sensor and the mounting portion.

12. The imaging device according to claim 11, characterized in that the imaging range is defined by an opening provided inside the mounting portion.

13. The imaging apparatus according to any one of claims 1 to 12, characterized in that the optical filter is an ND filter, a PL filter, or a soft filter.

Images