Apparatus for forming protective member, and method for calculating the supply amount of liquid resin.

Abstract

To provide a protective member forming apparatus for automatically calculating and adjusting a supply amount of a liquid resin according to a wafer having bumps, and a method for calculating the supply amount of the liquid resin.SOLUTION: A protective member forming apparatus for forming a protective member for protecting one surface of a wafer having bumps on the one surface includes a supply amount calculator for calculating volume of a protruding part of a resin on the basis of a width of the protruding part of the resin protruding outward from an outer periphery of the wafer and a distance between a sheet holding table and a wafer holding table according to a pickup image captured by a camera to calculate a supply amount of the liquid resin to be supplied to an upper surface of a first sheet from the next time.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a protective member forming apparatus and a method for calculating the supply amount of a liquid resin.

Background Art

[0002] When performing grinding of a wafer having bumps on one surface, a protective member is formed to protect the entire one surface of the wafer. As disclosed in Patent Document 1, the protective member forming apparatus adheres a sheet to one surface on which bumps are formed, supplies a liquid resin onto the sheet, and further presses the sheet held by a sheet holding table against the liquid resin to spread the liquid resin over the entire one surface of the wafer and cure it to form a protective member.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When forming a protective member on the surface of a wafer having bumps, if the liquid resin is spread and the amount of the liquid resin is large, the resin will overflow from the edge of the wafer. The amount of the overflowing resin varies depending on the number, height, and gap between the bumps. That is, it is necessary to adjust the supply amount of the liquid resin according to the type of the wafer having bumps. Therefore, it is desired that the protective member forming apparatus automatically calculates and adjusts the supply amount of the liquid resin according to the wafer having bumps.

[0005] The present invention has been made in view of this point, and an object thereof is to provide a protective member forming apparatus that automatically calculates and adjusts the supply amount of a liquid resin according to a wafer having bumps, and a method for calculating the supply amount of the liquid resin.

Means for Solving the Problems

[0006] The present invention is a protective member forming apparatus for forming a protective member that protects one side of a wafer having a bump on one side, Applicable wafer Applicable Cover one side Applicable A first sheet capable of forming an annular overhang outward from the outer edge of the wafer is adhered to the entire surface of one side and the outer surface. Applicable A wafer holding table that holds the other side of the wafer, and the wafer held by the wafer holding table Applicable A liquid resin supply unit that supplies liquid resin to the upper surface of the first sheet of the wafer, and above the wafer holding table Applicable wafer Applicable A sheet holding table holds a second sheet having an area capable of covering one side, and the sheet holding table and the wafer holding table are brought close together at a predetermined distance and supplied to the upper surface of the first sheet. Applicable The liquid resin is spread outwards beyond the outer edge of the wafer. Applicable An expansion means for causing the liquid resin to overflow, an ultraviolet irradiation unit positioned on the sheet holding table for irradiating the liquid resin with ultraviolet light from the second sheet side, and the liquid resin hardening Ta tree A camera receives the reflected light from the ultraviolet light reflected by the oil and images at least the excess resin. The camera calculates the volume of the excess resin from the width of the resin that has extended beyond the outer edge of the wafer and the distance between the sheet holding table and the wafer holding table, and then proceeds from there. Applicable To be supplied to the top surface of the first sheet Applicable It includes a liquid resin supply amount calculation unit that calculates the amount of liquid resin to be supplied.

[0007] In one aspect of the present invention, the supply amount calculation unit calculates the volume of the resin that has spilled out. of Shrinkage rate of the liquid resin in It was broken open, and the excess resin was formed. Applicable The amount of liquid resin is calculated, and the calculated amount of liquid resin is subtracted from the amount of liquid resin initially supplied to the first sheet, and then... Applicable To be supplied to the top surface of the first sheet ApplicableCalculate the supply amount of liquid resin.

[0008] The present invention relates to a method for calculating the supply amount of liquid resin, which involves supplying a predetermined amount of liquid resin to form a protective member by spreading and curing the liquid resin over the entire surface of one side of a wafer having bumps on one side. calculation It is a method, Applicable wafer Applicable Cover one side Applicable A first sheet capable of forming an annular overhang outward from the outer edge of the wafer is adhered to the entire surface of one side and the outer surface. Applicable A wafer holding process in which the other side of the wafer is held by a wafer holding table, and the wafer held by the wafer holding table Applicable On the upper surface of the first sheet of the wafer The liquid resin supply unit A liquid resin supply step involves supplying a liquid resin, a sheet holding step involves holding a second sheet on a sheet holding table, and bringing the sheet holding table and the wafer holding table closer together by a predetermined distance so that the liquid resin supplied to the upper surface of the first sheet is Applicable The process involves an expansion step of spreading the liquid resin so that it extends beyond the outer circumference of the wafer, a curing step of curing the liquid resin by irradiating it with ultraviolet light from the second sheet side, and a camera that shows when the liquid resin has cured. Ta tree The process involves an imaging step of receiving reflected light from the ultraviolet light reflected by the oil and imaging at least the excess resin; an overflow amount calculation step of calculating the volume of the overflowing resin from the width of the resin overflowing from the outer edge of the wafer and the distance between the sheet holding table and the wafer holding table, based on the image captured by the camera; and subtracting the amount of overflowing resin calculated in the overflow amount calculation step from the amount of liquid resin supplied in the liquid resin supply step, and then the liquid resin supply unit Applicable On the top surface of the first sheet Applicable The system includes a supply quantity calculation step for calculating the amount of liquid resin to be supplied.

[0009] In one aspect of the present invention, the supply amount calculation step is: The volume of the resin that has spilled out The liquid resin of contraction rate in Break Applicable The resin that protruded from the wafer was formed. Applicable including a liquid resin amount calculation step for calculating the amount of the liquid resin, subtracting the amount of the liquid resin calculated in the liquid resin amount calculation step from the supply amount of the liquid resin supplied in the liquid resin supply step, and then the liquid resin supply unit Applicable on the upper surface of the first sheet Applicable calculates the supply amount for supplying the liquid resin.

Advantages of the Invention

[0010] According to the protection member forming apparatus and the method for calculating the supply amount of the liquid resin of the present invention, the supply amount of the liquid resin can be automatically calculated and adjusted according to the wafer provided with bumps.

Brief Description of the Drawings

[0011] [Figure 1] It is a perspective view showing the protection member forming apparatus of the present embodiment. [Figure 2] It is a cross-sectional view of a part of the protection member forming apparatus. [Figure 3] It is an explanatory view showing the liquid resin supply step in the protection member forming apparatus. [Figure 4] It is an explanatory view showing the spreading step (expansion step) and the imaging step in the protection member forming apparatus.

Embodiments for Carrying Out the Invention

[0012] Hereinafter, referring to the accompanying drawings, the protection member forming apparatus and the method for calculating the supply amount of the liquid resin according to the present embodiment will be described. FIGS. 1 and 2 show the whole and a part of the protection member forming apparatus according to the present embodiment. FIGS. 3 to 4 are views for explaining each step performed by the protection member forming apparatus.

[0013] The X, Y, and Z axes shown in each figure are perpendicular to each other. The X and Y axes are approximately horizontal, while the Z axis is vertical. In each figure, of the two arrows indicating the X axis, the side with the letter X is considered the left, and the side without the letter X is considered the right. Of the two arrows indicating the Y axis, the side with the letter Y is considered the front, and the side without the letter Y is considered the back. Of the two arrows indicating the Z axis, the side with the letter Z is considered the top, and the side without the letter Z is considered the bottom.

[0014] The protective member forming apparatus 1 shown in Figure 1 is an example of an apparatus that forms a protective member by curing a liquid resin, which has been spread over the entire surface of one side of a wafer 90, by applying an external stimulus. In Figure 1, the outer housing 10 of the protective member forming apparatus 1 is shown by a dashed line, and the internal components of the outer housing 10 are shown in a transparent view. Of the wafer 90, the side facing upwards during processing in the protective member forming apparatus 1 is designated as the upper surface 900, and the side facing downwards is designated as the lower surface 904.

[0015] As will be described in detail later, in the protective member forming apparatus 1, a wafer 90 is placed on the protective member forming stage 16, and liquid resin 31 (see Figures 3 and 4) is supplied onto the placed wafer 90. The sheet holding unit 20 then operates to press the second sheet 30, which it holds, against the liquid resin 31 from above the protective member forming stage 16. This operation causes the liquid resin 31 to spread between the wafer 90 and the second sheet 30, resulting in an expanded state on the wafer 90. In this state, an external stimulus is applied to the liquid resin 31 to cure it, and the protective member is formed by the cured resin and the second sheet 30.

[0016] This series of operations is performed under the control of a control unit 60 (Figure 1) that provides overall control of the protective member forming apparatus 1. Unless otherwise specified, the operation of each part described below is controlled by a control signal sent from the control unit 60.

[0017] Wafer 90 is, for example, a disc-shaped azu slice wafer cut from a cylindrical silicon ingot. Note that wafer 90 is not limited to an azu slice wafer before device formation; it may also be a device wafer after device formation.

[0018] On the upper surface 900 of the wafer 90, devices 902 such as ICs and LSIs are formed in multiple grid-like regions demarcated by multiple division lines 901. Multiple bumps (protruding electrodes) 903 are provided on the surface of each of these devices 902. The bumps 903, made of copper or the like, are set to have a height of, for example, several tens of micrometers.

[0019] The top surface 900 of the wafer 90 is covered by the first sheet 905. The first sheet 905 is attached to the entire surface of the top surface 900 of the wafer 90 in close contact. The first sheet 905 has an area that allows for the formation of an annular overhang 906 extending outward from the outer circumference of the wafer 90. Having the overhang 906 makes it possible to calculate the amount of excess resin 31 in the liquid resin calculation method described later.

[0020] Furthermore, the first sheet 905 may be attached in close contact with the entire upper surface 900 of the wafer 90, and also in close contact with the outer surface 907 of the wafer 90, forming an annular overhang 906 extending outward from the outer circumference of the wafer 90. This allows for a more accurate calculation of the amount of excess liquid resin 31 in the liquid resin calculation method described later.

[0021] The first sheet 905 is made of a light-transmitting material. For example, a film made of polyethylene terephthalate can be used as the first sheet 905. Other materials may also be used.

[0022] The first sheet 905 may be brought into the protective member forming apparatus 1 already attached to the upper surface 900 of the wafer 90.

[0023] Furthermore, the protective member forming apparatus 1 may be provided with a mechanism for attaching the first sheet 905, or an apparatus for attaching the first sheet 905 may be provided outside the protective member forming apparatus 1. In this case, a wafer 90 without the first sheet 905 is brought into the mechanism or apparatus for attaching the first sheet 905 at any timing during the protective member forming process, and the first sheet 905 is attached to the wafer 90.

[0024] The protective member forming apparatus 1 has a cassette housing section 11 at one end (the left end) in the X-axis direction of the external housing 10. A housing space 112 is formed in the cassette housing section 11. Each cassette 106 contains multiple wafers 90 It can accommodate [this].

[0025] A temporary placement table 13 and a sheet cutting table 14 are provided on the right side of the cassette storage section 11 in the X-axis direction. The temporary placement table 13 is located above, and the sheet cutting table 14 is located below. The temporary placement table 13 is provided with a wafer detection unit 131 that detects the center position and orientation of the wafer 90 before the protective member is formed. The sheet cutting table 14 is provided with a sheet cutter that cuts the second sheet 30 attached to the wafer 90 along the outer shape of the wafer 90.

[0026] A first transport mechanism 12 for loading and unloading wafers 90 into and out of a cassette 106 is provided on the front side in the Y-axis direction relative to the temporary storage table 13 and the sheet cutting table 14. The first transport mechanism 12 includes a robot hand 122 supported on a base 121, and the base 121 is supported so as to be movable along a pair of guide rails 123 extending in the Y-axis direction. The base 121 has a threaded portion (not shown) that screws into a ball screw 124 extending in the Y-axis direction. When the ball screw 124 is rotated by the driving force of a motor, the base 121 moves in the Y-axis direction.

[0027] The first transport mechanism 12 transports wafers 90 between the cassette storage section 11, the temporary storage table 13, and the sheet cutting table 14 by moving the base 121 in the Y-axis direction and operating the robot hand 122. More specifically, the first transport mechanism 12 can remove wafers 90 before protective members are formed from the cassette 106 in the storage space 112 and place them on the temporary storage table 13. The first transport mechanism 12 can also remove wafers 90 after protective members have been formed from the sheet cutting table 14 and place them into the cassette 106 in the storage space 112.

[0028] The protective member forming apparatus 1 is equipped with a base 15 on the right side in the X-axis direction relative to the temporary placement table 13 and the sheet cutting table 14. A protective member forming stage 16 is provided on the base 15. The protective member forming stage 16 is formed in the shape of a disc. The upper surface of the protective member forming stage 16 is a wafer holding table 161.

[0029] The sheet holding unit 20 includes a sheet transport table 40 for transporting the second sheet 30 to the sheet holding table 201, and a horizontal movement mechanism 41 for moving it horizontally. The horizontal movement mechanism 41 includes an electric slider (not shown) disposed within the base 15.

[0030] A sheet placement mechanism 8 is provided on the base 402, which can pull out a strip-shaped second sheet 30, position it on the sheet transport table 40, and cut the second sheet 30 into a rectangle. The sheet placement mechanism 8 includes, for example, a sheet supply unit 80 consisting of a rotating shaft, a motor, and a plurality of rotating rollers, a sheet gripping unit 81 that grips the outer periphery (outer periphery in the X direction) of the strip-shaped second sheet 30 fed out from the sheet supply unit 80, a gripping unit moving unit 82 that moves the second sheet 30 gripped by the sheet gripping unit 81 to pull it out horizontally (in the X direction), and a sheet cutting unit 83 that cuts the rear end of the strip-shaped second sheet 30 fed out by the sheet supply unit 80 to make a rectangular second sheet 30.

[0031] seat The transport table 40 held second Sheet 30 (after being cut into a rectangle) second The sheet 30) is equipped with a dome-forming mechanism 42 that inflates the center upward. As shown in Figure 2, the dome-forming mechanism 42 is, for example, seat The transport table 40 includes a circular recess 432 formed in the center of the upper surface 431 of the transport frame 43, with a diameter smaller than that of the wafer 90, and in this embodiment, an elastic member 421 housed in the circular recess 432, with its upper portion protruding from the upper surface 431 of the transport frame 43.

[0032] The second sheet 30 is made of a light-transmitting material. For example, a film made of polyethylene terephthalate can be used as the second sheet 30. However, the second sheet 30 may also be made of a material other than this.

[0033] As shown in Figures 2 to 4, a disc-shaped porous member 162 is provided on the underside of the wafer holding table 161 of the protective member forming stage 16. The surface of the porous member 162 is the wafer holding surface 163. The porous member 162 is connected to a suction source 164. When the suction source 164 is operated, the wafer 90 placed on the wafer holding table 161 is held in place by suction to the wafer holding table 161.

[0034] Near the protective member forming stage 16, a liquid resin supply unit 18 is provided for supplying a predetermined amount of liquid resin 31 onto the first sheet 905 of the wafer 90 on the wafer holding table 161. The liquid resin supply unit 18 includes a dispenser 181 connected to a tank 184 provided in the base 15, and a resin supply nozzle 183 to which a connecting pipe 182 extending from the dispenser 181 connects. The resin supply nozzle 183 is rotatable about an axis oriented in the Z-axis direction, and can be positioned above the protective member forming stage 16 or retracted from above the protective member forming stage 16.

[0035] Liquid resin 31 stored in tank 184 is supplied by dispenser 181 via connecting pipe 182, and the liquid resin 31 is dripped downward from resin supply nozzle 183. The amount of liquid resin 31 supplied from resin supply nozzle 183 can be adjusted by dispenser 181.

[0036] The liquid resin 31 has the property of hardening in response to external stimuli. In this embodiment, an ultraviolet-curing resin that hardens upon irradiation with ultraviolet light is used.

[0037] A column 19 is provided on the left side of the protective member forming stage 16 in the X-axis direction, projecting upward from the base 15. The column 19 is provided with a lifting mechanism (extension means) 21 that moves the sheet holding part 20 in the Z-axis direction to move it closer to and further away from the protective member forming stage 16. The lifting mechanism (extension means) 21 includes a pair of guide rails 211 extending in the Z-axis direction, a lifting table 212 supported so as to be movable in the Z-axis direction relative to the pair of guide rails 211, and a ball screw 213 extending in the Z-axis direction and screwed into a threaded portion of the lifting table 212. When the ball screw 213 is rotated by the driving force of the motor 214, the lifting table 212 moves in the Z-axis direction along the pair of guide rails 211. When the ball screw 213 is rotated in the first direction, the lifting table 212 moves downward, and when the ball screw 213 is rotated in the second direction, the lifting table 212 moves upward.

[0038] The sheet holding section 20 is supported by a lifting table 212, and the sheet holding section 20 moves in the Z-axis direction in conjunction with the lifting table 212. The sheet holding section 20 includes a disc-shaped sheet holding table 201.

[0039] As shown in Figures 2 to 4, the sheet holding table 201 is provided with a disc-shaped glass plate 202. The surface of the glass plate 202 is the sheet holding surface 203. The sheet holding surface 203 has a plurality of suction holes (not shown) formed therein. The suction holes are connected to a suction source (not shown). By operating the suction source and applying suction force to the suction holes, the second sheet 30 is held in place by suction to the sheet holding surface 203.

[0040] With the second sheet 30 held by suction on the sheet holding surface 203 of the sheet holding section 20 (Figure 3), when the sheet holding section 20 holding the second sheet 30 is lowered by the lifting mechanism (expansion means) 21, the second sheet 30 comes into contact with the liquid resin 31 supplied onto the first sheet 905 of the wafer 90, and the liquid resin 31 is spread out by the force of lowering the second sheet 30.

[0041] The sheet holding unit 20 may include a load detection unit, although this is not shown in the figure. The output of the load detection unit may be used to determine the state of the liquid resin 31 spreading on the wafer 90.

[0042] Inside the sheet holding section 20, there is a curing mechanism 23 that applies external stimuli to the liquid resin 31 dropped onto the wafer 90 on the wafer holding table 161 to cure it. The curing mechanism 23 is equipped with a plurality of ultraviolet irradiation sections 231 capable of emitting ultraviolet UV (Figure 4), and cures the liquid resin 31 by irradiating it with ultraviolet UV through the light-transmitting first sheet 905 and second sheet 30. An LED may be used as the light source for the ultraviolet irradiation section 231.

[0043] Furthermore, a camera 24 is provided inside the sheet holding section 20 to image the direction of the wafer holding table 161. The camera 24 consists of a lens and an image sensor, and has an imaging range that allows imaging of the entire surface of the liquid resin 31 spread on the second sheet 30 on the wafer holding table 161, and the entire surface of the wafer 90 on which the liquid resin 31 has been spread, from above the sheet holding table 201. It is also preferable that the camera 24 receives reflected light (fluorescence) from ultraviolet light reflected by the cured liquid resin 31 and images at least the liquid resin 31 that has protruded from the outer edge of the wafer 90.

[0044] As shown in Figure 1, a second transport mechanism 25 is provided on the front side of the base 15 in the Y-axis direction. The second transport mechanism 25 includes a robot hand 252 supported on a base 251, and the base 251 is supported so as to be movable along a pair of guide rails 253 extending in the X-axis direction. The base 251 has a threaded portion (not shown) that screws onto a ball screw 254 extending in the X-axis direction. When the ball screw 254 is rotated by the driving force of the motor, the base 251 moves in the X-axis direction.

[0045] The second transport mechanism 25 transports wafers 90 between the temporary storage table 13 and the sheet cutting table 14 and the wafer holding table 161 by moving the base 251 in the X-axis direction and operating the robot hand 252. More specifically, the second transport mechanism 25 can receive and transport wafers 90 from the temporary storage table 13 before the protective member is formed and hand them over to the wafer holding table 161. The second transport mechanism 25 can also retrieve wafers 90 from the wafer holding table 161 after the protective member has been formed and transport them to the sheet cutting table 14.

[0046] The protective member forming apparatus 1 is centrally controlled by a control unit 60 (Figure 1). The control unit 60 consists of a processor that performs various processes and a memory that stores various parameters and programs. The memory of the control unit 60 stores the amount of liquid resin to be supplied. In addition, the memory of the control unit 60 stores a program that calculates the amount of liquid resin 31 to be supplied based on the image captured by the camera 24, which will be described later, as part of the control program for the protective member forming apparatus 1.

[0047] The control unit 60 includes a supply amount calculation unit 61 as one of its functional blocks. The supply amount calculation unit 61 calculates the supply amount of liquid resin 31 based on the image captured by the camera 24, which receives reflected light (fluorescence) from ultraviolet light irradiated by the ultraviolet irradiation unit 231 onto the cured liquid resin 31.

[0048] In the supply amount calculation unit 61, the volume of liquid resin 31 that has overflowed is calculated from the width of the liquid resin 31 that has overflowed from the outer circumference of the wafer 90 based on the image captured by the camera 24 and the distance between the sheet holding table 201 and the wafer holding table 161, and the amount of liquid resin to be supplied to the upper surface of the first sheet 905 is then calculated.

[0049] Furthermore, the supply amount calculation unit 61 calculates the volume of the liquid resin 31 that has spilled out. of Liquid resin 31 of contraction rate in The sheet is broken open, the amount of excess liquid resin 31 is calculated, and this calculated amount of liquid resin 31 is subtracted from the initial supply amount of liquid resin 31 to the first sheet 905 to calculate the amount of liquid resin to be supplied to the top surface of the first sheet 905 from now on.

[0050] It should be noted that the function of the supply amount calculation unit 61 is realized by the operation of the processor, memory, etc. that constitute the control unit 60, and this does not mean that the supply amount calculation unit 61 is composed of independent electronic components. Also, although Figures 2 to 4 schematically show only the connection relationship between the supply amount calculation unit 61 and the camera 24, the control unit 60 is also connected to each part of the protective member forming apparatus 1 other than the camera 24 so that signals can be sent and received.

[0051] The method for calculating and setting the supply amount of liquid resin 31 by the protective member forming apparatus 1 configured as described above will now be explained.

[0052] In this embodiment, the protective member forming device 1 automatically calculates the amount of liquid resin to be supplied when the number of bumps or the size of the bumps changes.

[0053] The wafer loading process will be explained using Figure 1. The first transport mechanism 12 takes one wafer 90 from the cassette 106 and transports it onto the temporary storage table 13. The wafer is detected on the temporary storage table 13, and the second transport mechanism 25 sucks and holds the wafer 90, then unloads the wafer 90 and places it on the wafer holding table 161. On the wafer holding table 161, the suction source 164 is operated to apply suction force to the porous member 162, and the lower surface 904 of the wafer 90 is sucked and held by the wafer holding surface 163.

[0054] As shown in Figure 2, the wafer 90 is placed on the wafer holding table 161. At this time, the protruding portion 906 of the first sheet 905 is on the wafer holding table 161 It is preferable to make it adhere closely to the upper surface. This makes it easier to calculate the liquid resin that will be overflowed in the liquid resin calculation method described later. liquid The amount of resin 31 can be calculated more accurately.

[0055] The sheet loading process will be explained using Figure 2. The sheet supply unit 80 is strip-shaped second The leading edge of the sheet 30 is fed horizontally in the X direction. The sheet gripping part 81 is moved by the gripping part moving part 82, and the sheet gripping part 81 is strip-shaped second Grasp the tip of sheet 30.

[0056] In parallel with the feeding of the second sheet 30 by the sheet supply unit 80, the horizontal movement mechanism 41 seat The transport table 40 is positioned to receive the second sheet 30. seat Above the upper surface 431 of the transport frame 43 of the transport table 40 and above the upper surface of the elastic member 421, the sheet gripping portion 81 is gripped. second Sheet 30 is now in the positioned position.

[0057] The strip-shaped second sheet 30, which has been pulled out to a predetermined length by the sheet gripping portion 81, is cut to a predetermined length at the sheet cutting portion 83 while completely covering the upper surface of the elastic member 421. As a result, the second sheet 30 is placed on the elastic member 421. Here, it is preferable that the predetermined length of the second sheet 30 ensures an area that can cover the upper surface 900 of the wafer 90.

[0058] Next, the sheet holding process will be explained. The second sheet 30 is placed seat The transport table 40 moves further in the X direction and is positioned directly below the sheet holding table 201. The sheet holding table 201 is lowered by the lifting mechanism (extension means) 21, and the sheet holding surface 203 of the glass plate 202 is on the elastic member 421. second It comes into contact with sheet 30. At this time, through a suction hole connected to a suction source (not shown), second Sheet 30 is held by suction on the sheet holding table 201. The second sheet 30 is then transferred to the sheet holding table 201. seat The transport table 40 detaches. As a result, the sheet holding table 201 holds the second sheet 30 above the wafer holding table 161, with an area sufficient to cover the top surface 900 of the wafer 90.

[0059] The liquid resin supply process will be explained using Figure 4. The resin supply nozzle 183 of the liquid resin supply unit 18 is positioned above the wafer 90 that has been placed on the wafer holding table 161 by the sheet loading process described above. Then, the dispenser 181 is controlled to send liquid resin 31 to the resin supply nozzle 183, and the liquid resin 31 is dripped from the resin supply nozzle 183 onto the first sheet 905 of the wafer 90. The resin supply nozzle 183 is positioned above the center of the protective member forming stage 16, and the liquid resin 31 dripped from the resin supply nozzle 183 accumulates near the center of the upper surface of the first sheet 905 of the wafer 90 in an area smaller than the area of ​​the wafer 90.

[0060] The control unit 60 causes the liquid resin supply unit 18 to supply a predetermined amount of liquid resin 31 to the wafer 90. Once the supply of the predetermined amount of liquid resin 31 is complete, the resin supply nozzle 183 is rotated to detach it from above the protective member forming stage 16, completing the liquid resin supply process. When calculating the amount of liquid resin 31 to be supplied, it is preferable to supply a slightly larger amount of liquid resin so that it overflows from the wafer 90.

[0061] Furthermore, at least a portion of the wafer holding process may be performed in parallel with (simultaneously with) the sheet loading process and the liquid resin supply process.

[0062] When the second sheet 30, held by the sheet holding section 20, is positioned opposite the liquid resin 31 on the wafer 90 (Figure 3), the process proceeds to the spreading process (expansion process) shown in Figure 4. In the spreading process (expansion process), the motor 214 is operated by the lifting mechanism (expansion means) 21 to lower the lifting table 212 and the sheet holding section 20 at a predetermined feed speed.

[0063] As shown in Figure 4, as the sheet holding portion 20 descends, the second sheet 30 approaches the protective member forming stage 16 and comes into contact with the liquid resin 31. The liquid resin 31 is then pressed by the second sheet 30, causing it to spread radially across the wafer 90. Before contacting the second sheet 30, the liquid resin 31 is concentrated near the center of the second sheet 30, and as it is pressed by the second sheet 30, the liquid resin 31 spreads outwards toward the outer edge of the wafer 90.

[0064] In this embodiment, as shown in Figure 4, if the liquid resin 31 spills out beyond the outer circumference of the wafer 90, the amount of liquid resin 31 to be supplied, as described later, is calculated. In the spreading process (expansion process), the lifting mechanism (expansion means) 21 brings the sheet holding table 201 and the wafer holding table 161 closer together to a predetermined distance, spreading the liquid resin 31 supplied to the upper surface of the first sheet 905, causing the liquid resin 31 to spill out beyond the outer circumference of the wafer 90.

[0065] When determining the state of the liquid resin 31's spread, it may be detected by a load detection unit (not shown), or by referring to an image captured by the camera 24.

[0066] Once the spreading process (expansion process) is complete and the liquid resin 31 completely covers the first sheet 905 of the wafer 90, the process proceeds to the curing process shown in Figure 4. In the curing process, ultraviolet UV light of sufficient intensity to cure the liquid resin 31 is irradiated from the ultraviolet irradiation unit 231 of the curing mechanism 23 toward the wafer holding table 161. The ultraviolet UV light emitted from the ultraviolet irradiation unit 231 passes through the translucent glass plate 202 and the second sheet 30 to reach the liquid resin 31, curing the liquid resin 31, which is an ultraviolet curing resin. When the liquid resin 31 is judged to be sufficiently cured, the irradiation of ultraviolet UV light from the curing mechanism 23 is terminated.

[0067] In the subsequent imaging process, reflected light (fluorescence) from ultraviolet light reflected by the cured liquid resin 31 is received, and the liquid resin 31 that has protruded beyond the outer edge of the wafer 90 is imaged.

[0068] Based on the image captured in the imaging process, the supply amount calculation unit 61 calculates the supply amount of liquid resin 31. The process for calculating the supply amount will now be explained.

[0069] In this embodiment, the height of the liquid resin 31 when expanded can be determined from the encoder values ​​of the motor 214 of the lifting mechanism (expansion means) 21. In the imaging process, the width of the liquid resin 31 that has spilled out from the outer circumference of the wafer 90 can be determined from the captured image. Based on this information, the amount of liquid resin 31 that has spilled out from the outer circumference of the wafer 90 is calculated. Based on the calculated amount of spilled liquid resin 31, an accurate amount of liquid resin to supply that prevents the liquid resin 31 from spilling out from the edge of the wafer 90 can be calculated from the initially set amount of liquid resin to supply.

[0070] The initial supply amount V1 of liquid resin 31 supplied to the first sheet 905 is denoted as V1. Furthermore, the supply amount V1 is the initially set supply amount of liquid resin 31, and the supply amount V1 is in volume.

[0071] The process for calculating the amount of overflow will now be explained. In the overflow calculation process, the volume of the liquid resin 31 that has overflowed is calculated from the width of the liquid resin 31 that has overflowed from the outer edge of the wafer 90, based on the image captured by the camera 24, and the distance between the sheet holding table 201 and the wafer holding table 161.

[0072] The volume of the liquid resin 31 that has overflowed from the wafer 90 is calculated. As shown in Figure 4, the radius of the wafer 90 is r, the width R of the liquid resin 31 that has overflowed from the outer circumference of the wafer 90 is defined as H, the distance H between the sheet holding surface 203 of the sheet holding table 201 and the wafer holding surface 163 of the wafer holding table 161 is defined as Va, and the volume Va of the liquid resin 31 that has overflowed from the outer circumference of the wafer 90 is defined as H. The width R is the radius from the center of the wafer 90 to the outer circumference of the overflowing liquid resin 31. The distance H may also be the distance between the pressing surface 311 of the second sheet 30 and the wafer holding surface 163 of the wafer holding table 161, taking into account the thickness of the second sheet 30.

[0073] In the overflow calculation process, for example, the volume Va of the liquid resin 31 that has overflowed onto the outer circumference of the wafer 90 is calculated according to Equation 1. The value of pi is assumed to be π. (R 2 ×H × π) - (r 2 (×H×π)=Va···(Equation 1)

[0074] The supply amount calculation process will now be explained. The supply amount calculation process subtracts the amount of liquid resin 31 that was overflowed in the overflow amount calculation process from the amount of liquid resin 31 supplied in the liquid resin supply process, and then proceeds to the liquid resin supply section. 18 The liquid resin is applied to the upper surface of the first sheet 905. 31 Calculate the amount to be supplied.

[0075] In the supply amount calculation process, the liquid resin amount calculation process is performed first. The liquid resin amount calculation process calculates the volume Va of the liquid resin 31 that has overflowed, which was calculated in the overflow amount calculation process. of Shrinkage rate of liquid resin 31: X% in Break 、 The amount VA of liquid resin that formed the excess liquid resin 31 is calculated. Note that the amount VA of liquid resin is in volume.

[0076] Furthermore, the shrinkage rate X is a characteristic of the liquid resin 31 and may be set by referring to known literature, or the operator of the protective member forming apparatus 1 may set an arbitrary value.

[0077] The liquid resin quantity calculation step involves, for example, calculating the amount VA of liquid resin that formed the excess liquid resin 31 according to Equation 2. Va / (X / 100) = VA ... (Equation 2)

[0078] After the liquid resin quantity calculation step, the calculated amount VA of liquid resin 31 is subtracted from the initial supply amount V1 of liquid resin 31 supplied to the first sheet 905 to calculate the supply amount V2 of liquid resin to be supplied to the upper surface of the first sheet 905 for the next protective member formation.

[0079] For example, according to Equation 3, the amount of liquid resin V2 supplied to the upper surface of the first sheet 905 from the formation of the next protective member is calculated. V1 - VA = V2 ... (Equation 3)

[0080] The calculated supply amount V2 information is transmitted to the control unit 60 and set as the precise supply amount of liquid resin 31 so that the liquid resin 31 does not overflow from the edge of the wafer 90.

[0081] By calculating the supply amount V2, it is possible to calculate the precise amount of liquid resin to supply so that the liquid resin 31 does not overflow from the edge of the wafer 90. This allows the supply amount of liquid resin to be automatically calculated and adjusted according to the wafer equipped with bumps, when the number and size of bumps 903 on the wafer 90 change.

[0082] The process of calculating the supply amount of liquid resin 31 is completed, and the suction holding of the wafer 90 to the wafer holding table 161 of the protective member forming stage 16 is released.

[0083] The wafer used to calculate the amount of liquid resin is transferred from the wafer holding table 161 to the second transport mechanism 25.

[0084] The protective member may then be transported to an apparatus or mechanism for peeling it off, where it may be removed and then subjected to the protective member formation process again.

[0085] Alternatively, instead of transporting the wafer to an apparatus or mechanism for peeling off the protective member, it may be transported to a sheet cutting table 14, and the outer periphery of the cured resin may be cut when calculating the amount of liquid resin to obtain a wafer 90 with the desired protective member formed on it.

[0086] As described above, the protective member forming apparatus in this embodiment can automatically calculate and adjust the amount of liquid resin supplied according to the wafer equipped with bumps.

[0087] Furthermore, the embodiments of the present invention are not limited to the embodiments and modifications described above, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Moreover, if the technical idea of ​​the present invention can be realized in a different way by advances in the art or by other derived arts, it may be implemented by that method. Accordingly, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial applicability]

[0088] As described above, the protective member forming apparatus of the present invention can automatically calculate and adjust the supply amount of liquid resin according to a wafer equipped with bumps. Therefore, it is possible to form wafers on which the desired protective member is formed, and this apparatus is particularly useful in the manufacturing field of semiconductors and the like, which includes a process of forming a protective member on one side of a wafer. [Explanation of symbols]

[0089] 1: Protective member forming apparatus 8: Seat placement mechanism 10: External enclosure 11: Cassette storage compartment 12: First conveying mechanism 13: Temporary Table 14: Sheet cutting table 15: Base 16: Protective member forming stage 18: Liquid resin supply unit 19: Column 20: Sheet holding section 23:Curing mechanism 24: Camera 25: Second conveying mechanism 30: Second seat 31: Liquid resin 40: Sheet transport table 41: Horizontal movement mechanism 42: Dome formation mechanism 43: Transport frame 60: Control Unit 61:Supply amount calculation section 80: Sheet supply unit 81: Sheet gripping section 82: Grip moving part 83: Sheet cutting section 90: Wafer 103: Support base 106: Cassette 112: Storage space 121: Pedestal 122: Robot Hand 123: Guide rail 124: Ball screw 131: Wafer detection unit 141: Sheet cutter 161: Wafer holding table 162: Porous material 163: Wafer holding surface 164 :Suction source 181: Dispenser 182: Connecting pipe 183: Resin supply nozzle 184: Tank 201: Sheet holding table 202: Glass plate 203: Sheet holding surface 211: Guide rail 212: Height-adjustable table 213: Ball screw 214: Motor 231: UV irradiation area 251: Pedestal 252: Robot Hand 253: Guide rail 254: Ball screw 402: Base 421: Elastic member 431:Top surface 432: Circular recess 900:Top surface 901: Planned split line 902: Device 903: Bump 904: Bottom surface 905: First sheet 906: Overhang 907 :Outer surface

Claims

1. A protective member forming apparatus for forming a protective member that protects one side of a wafer having a bump on one side, A wafer holding table that holds the other side of the wafer, wherein a first sheet, which covers one side of the wafer and is capable of forming an annular overhang outward from the outer circumference of the wafer, is in close contact with the entire surface of the one side and the outer surface of the wafer, A liquid resin supply unit that supplies liquid resin to the upper surface of the first sheet of the wafer held by the wafer holding table, A sheet holding table that holds a second sheet having an area capable of covering one side of the wafer, above the wafer holding table, An expansion means that brings the sheet holding table and the wafer holding table closer together by a predetermined distance, spreading the liquid resin supplied to the upper surface of the first sheet so that the liquid resin extends beyond the outer circumference of the wafer, An ultraviolet irradiation unit is arranged on the sheet holding table and irradiates the liquid resin with ultraviolet light from the second sheet side, A camera that receives reflected light from the resin after the liquid resin has hardened and captures images of at least the excess resin, A protective member forming apparatus comprising: a liquid resin supply amount calculation unit that calculates the volume of the resin that has overflowed from the outer edge of the wafer based on the width of the resin that has overflowed from the outer edge of the wafer based on the image captured by the camera and the distance between the sheet holding table and the wafer holding table, and then calculates the amount of liquid resin to be supplied to the upper surface of the first sheet thereafter.

2. The protective member forming apparatus according to claim 1, wherein the supply amount calculation unit divides the volume of the resin that has overflowed by the shrinkage rate of the liquid resin to calculate the amount of liquid resin that formed the overflowed resin, subtracts the calculated amount of liquid resin from the amount of liquid resin initially supplied to the first sheet, and then calculates the amount of liquid resin to be supplied to the upper surface of the first sheet from then on.

3. A method for calculating the amount of liquid resin to be supplied in order to supply a predetermined amount of liquid resin to form a protective member by spreading and curing the liquid resin over the entire surface of one of the surfaces of a wafer having bumps on one surface, A wafer holding step in which a wafer holding table holds the other side of the wafer, with a first sheet that covers one side of the wafer and is capable of forming an annular overhang outward from the outer circumference of the wafer, in close contact with the entire surface of the one side and the outer surface of the wafer, A liquid resin supply step in which a liquid resin supply unit supplies the liquid resin to the upper surface of the first sheet of the wafer held by the wafer holding table, A sheet holding process in which a second sheet is held on a sheet holding table, An expansion step is to bring the sheet holding table and the wafer holding table closer together by a predetermined distance, thereby spreading the liquid resin supplied to the upper surface of the first sheet and causing the liquid resin to extend beyond the outer circumference of the wafer. A curing step in which ultraviolet light is irradiated onto the liquid resin from the second sheet side to cure it, The imaging step involves using a camera to receive reflected light from the hardened resin of the liquid resin, which has been exposed to ultraviolet light, and to image at least the excess resin. A process for calculating the amount of excess resin, which involves calculating the volume of the excess resin from the width of the resin that has protruded from the outer edge of the wafer based on the image captured by the camera and the distance between the sheet holding table and the wafer holding table. A method for calculating the amount of liquid resin to be supplied, comprising: a supply amount calculation step, which subtracts the amount of excess resin calculated in the excess amount calculation step from the amount of liquid resin supplied in the liquid resin supply step, and calculates the amount of liquid resin that the liquid resin supply unit will supply to the upper surface of the first sheet from thereafter.

4. The method for calculating the supply amount of liquid resin according to claim 3, wherein the supply amount calculation step includes a liquid resin amount calculation step which calculates the amount of liquid resin that formed the resin that protruded from the wafer by dividing the volume of the resin that protruded by the shrinkage rate of the liquid resin, and the supply amount that the liquid resin supply unit will supply to the upper surface of the first sheet from the supply amount of liquid resin supplied in the liquid resin supply step.

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