Light source device, lithography device, and method for manufacturing articles
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- CANON KK
- Filing Date
- 2022-06-30
- Publication Date
- 2026-08-03
AI Technical Summary
【0009】 本発明によれば、光源の温度上昇を抑制する光源装置、リソグラフィ装置、及び物品の製造方法を提供することができる。
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Abstract
Description
Technical Field
[0001] The present invention relates to a light source device, a lithographic apparatus, and a method for manufacturing an article.
Background Art
[0002] In a lithography process for manufacturing a device such as a semiconductor device or a display device, an exposure apparatus is used. The exposure apparatus exposes a substrate with light from a light source device having a light source such as a lamp. Further, as the substrate size increases, etc., the light source device is required to have higher output, and suppressing the influence of radiant heat due to long-wavelength light contained in the light from the light source device has become an important issue.
[0003] Patent Document 1 discloses an invention related to an exposure mirror that reflects light emitted from a light source in order to expose a substrate. In the exposure mirror, a cooling member is attached to the base of the exposure mirror, a light absorption film is formed on the surface of the base of the exposure mirror, and a short-wavelength light reflection film that selectively reflects only predetermined short-wavelength light is formed on the upper layer thereof.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] In a light source device, the light source may be disposed inside a housing, and the light from the light source may be reflected by the housing, and the reflected light may irradiate the light source. When the reflected light reflected by the housing irradiates the light source, the temperature of the light source rises due to radiant heat.
[0006] Patent Document 1 describes cooling the housing with a cooling unit to dissipate heat and heated air that has reached the housing, but it does not describe suppressing the temperature rise of the light source caused by reflected light from the housing irradiating the light source.
[0007] Therefore, the present invention aims to provide a light source device, a lithography device, and a method for manufacturing articles that suppress the temperature rise of the light source. [Means for solving the problem]
[0008] A light source device, as one aspect of the present invention that solves the above problems, comprises a light source and a first housing that houses the light source, wherein a plurality of openings are formed in the plane of the first housing that lead to the outside of the first housing, and the first housing has a plurality of parts connected to the plane and having inclined surfaces tilted with respect to the plane, and at least one of the plurality of parts is from the light source Including infrared light The light is reflected and emitted out of one of the plurality of openings to the outside of the first housing. [Effects of the Invention]
[0009] According to the present invention, it is possible to provide a light source device, a lithography device, and a method for manufacturing articles that suppress the temperature rise of the light source. [Brief explanation of the drawing]
[0010] [Figure 1] This is a diagram showing the configuration of the exposure apparatus. [Figure 2] This is a diagram showing the configuration of the light source device according to the first embodiment. [Figure 3] This is a cross-sectional view of the light source device according to the first embodiment. [Figure 4] This is a perspective view of the first housing of the light source device according to the first embodiment. [Figure 5] This diagram illustrates the optical path of light emitted from a lamp. [Figure 6] This is a cross-sectional view of the light source device according to the second embodiment. [Figure 7]This is a side view of a part of the first housing of the light source device of the second embodiment. [Figure 8] This diagram shows the configuration of the light source device according to the third embodiment. [Figure 9] This is a perspective view of the first housing of the light source device according to the third embodiment. [Figure 10] This is a flowchart illustrating the manufacturing process of devices using an exposure system. [Figure 11] Figure 10 shows a detailed flowchart of the wafer process in step 4 of the flowchart. [Modes for carrying out the invention]
[0011] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.
[0012] <First Embodiment> First, the exposure apparatus 100 as a lithography apparatus will be described. Figure 1 is a diagram showing the configuration of the exposure apparatus 100. The exposure apparatus 100 may include, for example, a light source device 110, a shutter device 120, an illumination optical system 130, a master plate holder 140, a projection optical system 150, and a substrate holder 160. In this specification and the accompanying drawings, the direction along the optical axis of the mirror 50 configured in the light source device 110, which will be described later, is defined as the Z-axis direction, and the two mutually orthogonal directions along a plane perpendicular to the Z-axis direction are defined as the X-axis direction and the Y-axis direction.
[0013] The original plate holding unit 140 holds the original plate 142. The original plate holding unit 140 is positioned by an original plate positioning mechanism (not shown), whereby the original plate 142 can be positioned. The substrate holding unit 160 holds the substrate 162. The exposure apparatus 100 is supplied with the substrate 162 coated with resist (photosensitive material) by a resist coating apparatus. The substrate holding unit 160 is positioned by a substrate positioning mechanism (not shown), whereby the substrate 162 can be positioned.
[0014] The shutter device 120 is arranged so as to be able to block the light beam in the optical path between the light source device 110 and the original plate holding unit 140. The illumination optical system 130 illuminates the original plate 142 using the light from the light source device 110. The projection optical system 150 projects the pattern of the original plate 142 illuminated by the illumination optical system 130 onto the substrate 162, whereby the substrate 162 is exposed. Thereby, a latent image pattern is formed in the resist coated on the substrate 162. The latent image pattern is developed by a developing device (not shown), whereby a resist pattern is formed on the substrate 162.
[0015] Next, the light source device 110 will be described with reference to FIG. 2. FIG. 2 is a diagram showing the configuration of the light source device 110 according to the present embodiment. The light source device 110 may include a lamp 10 as a light source, a mirror 50 that condenses the light generated by the lamp 10, a first housing 111 that houses the lamp 10, and a second housing 112 that houses the first housing 111.
[0016] The lamp 10 may be a short arc type lamp such as a mercury lamp, a xenon lamp, or a metal halide lamp, for example. The mirror 50 may be an elliptical mirror having, for example, a first focal point FP1 and a second focal point FP2 located on the optical axis OAX of the mirror 50. Here, the optical axis OAX of the mirror 50 is the axis connecting the first focal point FP1 and the second focal point FP2.
[0017] The lamp 10 can be arranged on the optical axis OAX. The bright point AP of the lamp 10 is arranged at or near the first focal point FP1, and the mirror 50 can reflect the light emitted from the bright point AP and condense it at the second focal point FP2. The mirror 50 can be, for example, a cold mirror with an optical thin film that transmits long-wavelength light such as infrared light and reflects short-wavelength light such as visible light and ultraviolet light. The diameter of the opening of the mirror 50 can depend on the size of the lamp 10, but is, for example, 300 to 400 mm. Also, the mirror 50 may be a parabolic mirror that irradiates the reflected light in parallel.
[0018] Here, the light from the lamp 10 may be reflected on the plane of the first housing 111 facing the lamp 10 and irradiate the lamp 10. Since the light from the lamp 10 contains long-wavelength light such as infrared light, the lamp 10 may have its temperature increased by being irradiated with the reflected light. The temperature rise of the lamp 10 can contribute to shortening the life of the lamp 10, so it is important to suppress the temperature rise of the lamp 10.
[0019] Therefore, in the present embodiment, a plurality of portions that are connected to the plane of the first housing 111 facing the lamp 10 and have an inclined surface inclined with respect to the plane are arranged.
[0020] FIG. 3 is a cross-sectional view of the light source device 110 of the present embodiment. FIG. 3 is a view of the cross-section AA' in FIG. 2 seen from above. Also, FIG. 4 is a perspective view of the first housing of the light source device 110 according to the present embodiment. As shown in FIGS. 3(a) and FIG. 4, the first housing 111 has a plane 111a facing the lamp 10. The first housing 111 has a plurality of portions 111b (a collective body) that are connected to the plane 111a and have a surface (inclined surface) inclined with respect to the plane 111a. The plurality of portions 111b are arranged on the plane 111a side by side in the X-axis direction. Note that although the plurality of portions 111b shown in FIG. 4 are arranged side by side in the X-axis direction, the plurality of portions 111b on other surfaces may be arranged on the plane 111a side by side in the Y-axis direction.
[0021] Each of the multiple parts 111b is connected to the plane 111a and has an inclined surface tilted relative to the plane 111a, and is positioned so that the ramp 10 does not exist in the direction normal to the inclined surface. In other words, the inclined surface of each of the multiple parts 111b does not face the ramp 10. Furthermore, each of the multiple parts 111b in this embodiment has a plate-like shape.
[0022] The first housing 111 has multiple parts 111b, which suppresses the reflection of light emitted from the lamp 10 by the first housing 111 and illuminating the lamp 10. Figure 5 is a diagram illustrating the optical path of light emitted from the lamp 10. Note that in Figure 5, some reference numerals such as plane 111a are omitted as it is the same as in Figure 3(a). In Figure 5, the light F1 emitted from the lamp 10 passes through the mirror 50 or over the mirror 50 and reaches the first housing 111. The light F1 is then reflected by one of the inclined surfaces of the multiple parts 111b, so it is not reflected in the direction toward the lamp 10 and does not illuminate the lamp 10. Furthermore, the reflected light is attenuated by diffuse reflection. The reflected light is also attenuated by repeated reflections inside the first housing 111. Therefore, the amount of light emitted from the lamp 10 that returns to the lamp 10 and illuminates the lamp 10 is reduced. In other words, the multiple parts 111b reduce the amount of light emitted from the lamp 10 that returns to the lamp 10 and illuminates the lamp 10. Therefore, by having multiple parts 111b in the first housing 111, it is possible to suppress the temperature rise of the lamp 10.
[0023] Furthermore, it is preferable that the multiple parts 111b are arranged such that the inclined surfaces are at an angle of 10° to 80° with respect to the plane 111a in order to reduce the amount of light reflected from the inclined surfaces that illuminates the lamp 10. It is even more preferable that the multiple parts 111b are arranged such that the inclined surfaces are at an angle of 30° to 60° with respect to the plane 111a.
[0024] Furthermore, it is preferable that some of the multiple parts 111b are arranged at a different angle from the other multiple parts 111b. As shown in Figure 3(b), it is preferable that the multiple parts 111b are arranged such that their inclined surfaces are different with respect to the plane 111a, as in the multiple parts 111b1 and multiple parts 111b2. By arranging them in this way, it is possible to avoid the inclined surfaces of some of the multiple parts 111b being positioned to face the lamp 10. Also, it is preferable that the boundary between the multiple parts 111b1 and the multiple parts 111b2 is offset from a position on a straight line P1 that is perpendicular to a plane parallel to the plane 111a and passes through the center of the lamp 10. This is to suppress the reflection of light emitted from the opening 111c located at the boundary between the multiple parts 111b1 and the multiple parts 111b2 by the second housing 112 and the illumination of the lamp 10.
[0025] Furthermore, multiple openings 111c are formed in the plane 111a of the first housing 111. These multiple openings 111c connect the internal space of the first housing 111 (first space) with the space outside the first housing 111 and inside the second housing 112 (second space). Here, the second space can be the space between the first housing and the second housing. For example, light F2 emitted from the lamp 10 passes through the mirror 50 or over the mirror 50 and reaches the first housing 111. When the angle of incidence of light F2 with respect to the plane 111a is greater than 0, the light F2 is attenuated by being reflected between the first housing 111 and the second housing 112. As a result, the amount of light emitted from the lamp 10 that returns to the lamp 10 and illuminates the lamp 10 is reduced. Thus, by having multiple openings 111c in the first housing 111, it is possible to suppress the temperature rise of the lamp 10.
[0026] Furthermore, it is preferable that each of the multiple openings 111c is positioned between the multiple sections 111b. As shown in Figure 5, for example, light F3 reflected from one of the inclined surfaces of the multiple sections 111b is emitted to the outside of the first housing 111 through the opening 111c positioned between the multiple sections 111b, and therefore does not illuminate the lamp 10. Thus, by positioning each of the multiple openings 111c between the multiple sections 111b, it is possible to suppress the temperature rise of the lamp 10.
[0027] Here, in the first housing 111 illustrated in Figure 3, etc., multiple portions 111b and multiple openings 111c are arranged on the four sides facing the lamp 10, but the invention is not limited to this configuration. It is sufficient that multiple portions 111b and multiple openings 111c are arranged on at least one of the multiple sides facing the lamp 10. Furthermore, in the first housing 111 illustrated in Figure 3, etc., multiple portions 111b and multiple openings 111c are arranged on the sides facing the lamp 10, but the invention is not limited to this configuration. Multiple portions 111b and multiple openings 111c may be arranged on the upper surface facing the lamp 10, the lower surface facing the lamp 10, or on both the upper and lower surfaces.
[0028] Furthermore, although the multiple parts 111b are arranged such that their inclined surfaces are tilted inward from the first housing 111, the multiple parts 111b may also be arranged such that their inclined surfaces are tilted outward from the first housing 111.
[0029] Furthermore, it is preferable that the flat surface 111a of the first housing 111, the surface including the inclined surfaces of the multiple parts 111b, and the inner surface of the second housing 112 be black in order to absorb the light emitted from the lamp 10. Also, it is preferable that the flat surface 111a of the first housing 111, the surface including the inclined surfaces of the multiple parts 111b, and the inner surface of the second housing 112 be rough surfaces with irregularities and low flatness in order to diffusely reflect the light emitted from the lamp 10.
[0030] Furthermore, the exposure apparatus 100 may have a supply device (not shown) connected to the light source device 110 via piping to supply gas at a temperature lower than the internal temperature of the light source device 110. The exposure apparatus 100 may also have an exhaust device (not shown) connected to the light source device 110 via piping to exhaust gas heated by the light emitted from the lamp 10 from inside the light source device 110. These configurations further suppress the temperature rise of the lamp 10.
[0031] As described above, according to the light source device of this embodiment, the housing has multiple parts having a plate shape with a surface inclined with respect to the surface facing the light source, which reduces the amount of light from the light source that is reflected by the housing and irradiates the light source, thereby suppressing the temperature rise of the light source.
[0032] <Second Embodiment> Next, a light source device 110 according to the second embodiment will be described. Matters not mentioned as part of the second embodiment may follow those of the first embodiment. In the light source device according to the second embodiment, each of the plurality of parts 111b (or a collection thereof) having an inclined surface tilted with respect to the plane facing the lamp 10 has a convex shape toward the lamp 10 side (a convex shape protruding inward from the first housing 111). Figure 6 is a cross-sectional view of the light source device 110 of this embodiment. In Figure 6(a), each of the plurality of parts 111b has a convex shape with a triangular cross-section. That is, each of the plurality of parts 111b has a conical shape such as a cone, triangular pyramid, or square pyramid. Also, in Figure 6(b), each of the plurality of parts 111b has a convex shape with a circular or elliptical cross-section. That is, each of the plurality of parts 111b has a partial shape such as a sphere or ellipsoid. Also, each of the plurality of parts 111b has a shape such as a hemisphere or semiellipsoid. Figure 6(b) shows an example where the cross-sectional shape of the multiple parts 111b is a convex shape that is part of a circle or an ellipse, but the cross-sectional shape of the multiple parts 111b may also be a convex shape consisting of a curve. In other words, the multiple parts 111b may have a convex shape consisting of a curved surface.
[0033] Furthermore, each of the multiple parts 111b may be arranged so that multiple parts 111b are aligned not only in the X-axis direction or the Y-axis direction but also in the Z-axis direction. Figure 7 is a side view of a part of the first housing 111 of the light source device 110 of this embodiment. Multiple parts 111b, each having a convex shape, are arranged in the X-axis direction and the Y-axis direction.
[0034] Here, an example has been described in which the multiple parts 111b have a convex shape that protrudes inward from the first housing 111. However, the multiple parts 111b may also have a concave shape toward the lamp 10 side (a concave shape that is recessed toward the outside of the first housing 111).
[0035] Furthermore, multiple openings 111c are formed in the plane 111a of the first housing 111. The multiple openings 111c connect the internal space of the first housing 111 with the space outside the first housing 111, which is the interior of the second housing 112. Each of the multiple openings 111c is located between multiple sections 111b, but in the example of Figure 7, one opening 111c is located between four sections 111b, although one opening 111c may be located between two sections 111b in the X and Z axis directions.
[0036] Furthermore, the light emitted from the lamp 10 is reflected by the inclined surfaces of each of the multiple parts 111b, so it is not reflected back towards the lamp 10 and does not illuminate the lamp 10. In addition, the reflected light is attenuated by diffuse reflection. The reflected light is also attenuated by repeated reflections inside the first housing 111. In addition, some of the light reflected by the multiple parts 111b is emitted to the outside of the first housing 111 from the multiple openings 111c. If the angle of incidence of the emitted light with respect to the plane 111a is greater than 0, the emitted light is attenuated by reflecting between the first housing 111 and the second housing 112. Therefore, the amount of light emitted from the lamp 10 that returns to the lamp 10 and illuminates the lamp 10 is reduced.
[0037] As described above, in the light source device according to this embodiment, each of the multiple parts 111b has an inclined surface that is tilted with respect to a plane, and each of the inclined surfaces of the multiple parts 111b does not face the lamp 10. Therefore, the amount of light emitted from the lamp 10 that returns to the lamp 10 and illuminates the lamp 10 is reduced. In other words, the multiple parts 111b reduce the amount of light emitted from the lamp 10 that returns to the lamp 10 and illuminates the lamp 10. By having multiple parts 111b in the first housing 111, it is possible to suppress the reflection of light emitted from the lamp 10 by the first housing 111 and the illumination of the lamp 10.
[0038] As described above, according to the light source device of this embodiment, the housing has multiple parts having a convex shape with a surface inclined with respect to the surface facing the light source, which reduces the amount of light from the light source that is reflected by the housing and irradiates the light source, thereby suppressing the temperature rise of the light source.
[0039] <Third Embodiment> Next, a light source device 110 according to the third embodiment will be described. Matters not mentioned as part of the second embodiment may follow those of the first embodiment. In the light source device according to the third embodiment, a plurality of parts 111b are arranged in line in the Z-axis direction.
[0040] Figure 8 shows the configuration of the light source device 110 according to this embodiment. Figure 9 is a perspective view of the first housing of the light source device 110 according to this embodiment. In the light source device 110 according to the first embodiment, the multiple parts 111b are arranged in the X-axis direction or the Y-axis direction, as shown in Figure 3, etc., but in the light source device 110 according to this embodiment, the multiple parts 111b are arranged in the Z-axis direction.
[0041] Each of the multiple parts 111b has an inclined surface, and is positioned so that the ramp 10 does not exist in the direction normal to the inclined surface. In other words, the inclined surface of each of the multiple parts 111b does not face the ramp 10. Furthermore, each of the multiple parts 111b in this embodiment has a plate-like shape.
[0042] Furthermore, the first housing 111 may have a plurality of openings 111c. In the light source device 110 according to the first embodiment, the plurality of openings 111c are arranged in the X-axis direction or the Y-axis direction, as shown in Figure 3, etc., but in the light source device 110 according to this embodiment, the plurality of openings 111c are arranged in the Z-axis direction.
[0043] As described above, according to the light source device of this embodiment, the housing has multiple parts having a plate shape with a surface inclined with respect to the surface facing the light source, which reduces the amount of light from the light source that is reflected by the housing and irradiates the light source, thereby suppressing the temperature rise of the light source.
[0044] <Method of manufacturing articles> As examples of articles, we will describe a method for manufacturing devices (semiconductor devices, magnetic storage media, liquid crystal display elements, etc.), color filters, or hard disks. Such a manufacturing method includes a step of forming a pattern on a substrate (wafer, glass plate, film substrate, etc.) by irradiating it with light from a lithography apparatus (e.g., exposure apparatus, imprint apparatus, drawing apparatus, etc.) having a light source. Such a manufacturing method further includes a step of processing the substrate on which the pattern has been formed (processing step). This processing step may include a step of removing the residual film of the pattern. This processing step may also include a step of etching the substrate using the pattern as a mask. This processing step may also include other well-known steps such as dicing, bonding, and packaging. The method for manufacturing articles in this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the articles.
[0045] Next, as an example of an article manufacturing method, an embodiment of a device manufacturing method using the exposure apparatus described above will be explained with reference to Figures 10 and 11. Figure 10 is a flowchart for explaining the manufacturing of devices (semiconductor chips such as ICs and LSIs, LCDs, CCDs, etc.). Here, the manufacturing method of a semiconductor chip will be explained as an example.
[0046] Step S1 (Circuit Design) involves designing the circuit for a semiconductor device. Step S2 (Mask Fabrication) involves fabricating a mask (master plate) based on the designed circuit pattern. Step S3 (Wafer Manufacturing) involves manufacturing a wafer (substrate) using materials such as silicon. Step S4 (Wafer Processing) is called the front-end process, where the mask and wafer are used to form the actual circuit on the wafer using lithography technology with the exposure equipment mentioned above. Step S5 (Assembly) is called the back-end process, where the wafer fabricated in Step S4 is used to create a semiconductor chip, and includes assembly processes such as assembly (dicing, bonding) and packaging (chip encapsulation). Step S6 (Inspection) involves performing inspections such as operational verification tests and durability tests on the semiconductor device fabricated in Step S5. After these processes, the semiconductor device is completed and shipped (Step S7).
[0047] Figure 11 is a detailed flowchart of the wafer process in step 4. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the surface of the wafer. In step S13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step S14 (ion implantation), ions are implanted into the wafer. In step S15 (resist treatment), a photosensitive material is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is exposed onto the wafer using an exposure device. In step S17 (development), the exposed wafer is developed. In step S18 (etching), the parts other than the developed resist image are removed. In step S19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.
[0048] Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its essence.
[0049] Furthermore, while an exposure apparatus has been described as an example of a lithography apparatus, it is not limited to these. An example of a lithography apparatus may be an imprint apparatus that forms a pattern of imprint material on a substrate using a mold (template) having a raised and recessed pattern. Another example of a lithography apparatus may be a planarization apparatus that shapes a composition on a substrate to flatten it using a mold (planar template) having a flat surface without a raised and recessed pattern. Yet another example of a lithography apparatus may be a drawing apparatus that forms a pattern on a substrate by drawing on it with a charged particle beam (such as an electron beam or ion beam) via a charged particle optical system.
[0050] Furthermore, each of the first to third embodiments can be implemented independently, or any combination of the first to third embodiments can be used.
Claims
1. Light source and It comprises a first housing that houses the light source, Multiple openings are formed on the plane of the first housing that lead to the outside of the first housing. The first housing has a plurality of parts connected to the plane and having inclined surfaces that are tilted relative to the plane, A light source device characterized in that at least one of the plurality of parts reflects light including infrared light from the light source and emits it out of one of the plurality of apertures to the outside of the first housing.
2. The light source device according to claim 1, characterized in that each of the aforementioned plurality of parts has a plate-like shape.
3. The light source device according to claim 2, characterized in that at least two of the plurality of parts are arranged on the plane such that the inclined surfaces are parallel to each other.
4. A light source, It comprises a first housing that houses the light source, Multiple openings are formed on the plane of the first housing that lead to the outside of the first housing. The first housing has a plurality of parts connected to the plane and having inclined surfaces that are tilted relative to the plane, At least one of the plurality of parts reflects light, including infrared light, from the light source and emits it out of one of the plurality of apertures to the outside of the first housing. A light source device characterized in that each of the aforementioned plurality of parts has a convex or concave shape toward the light source side.
5. The light source device according to claim 4, characterized in that each of the aforementioned plurality of parts has a convex or concave shape of a cone.
6. The light source device according to claim 4, characterized in that each of the plurality of parts has a convex or concave shape consisting of a curved surface.
7. The light source device according to any one of claims 1 to 6, characterized in that the plane of the first housing and the surface including the inclined surfaces of the plurality of parts are rough surfaces.
8. The light source device according to any one of claims 1 to 6, characterized in that the plane of the first housing and the surface including the inclined surfaces of the plurality of parts are black.
9. The light source device according to claim 1, characterized in that each of the plurality of openings is positioned between at least two of the plurality of parts.
10. The first housing has a second housing on the outside, The light source device according to claim 1, characterized in that the plurality of openings lead from a first space inside the first housing to a second space between the first housing and the second housing.
11. The light source device according to claim 10, characterized in that the inner surface of the second housing is a rough surface.
12. The light source device according to claim 10, characterized in that the inner surface of the second housing is black.
13. The light source device according to claim 1, characterized by having a mirror for concentrating light from the light source.
14. The light source device according to claim 13, characterized in that the mirror is a cold mirror.
15. A lithography apparatus for forming patterns on a substrate, A lithography apparatus characterized by having the light source device described in claim 1.
16. A step of forming a pattern on a substrate using a light source device of a lithography apparatus according to claim 15, A method for manufacturing an article, comprising the step of manufacturing an article from the substrate on which the pattern is formed.