Conductive film, method for manufacturing the same, and display device

Abstract

An electrically conductive film comprising a film-like base material and a resin layer and an electrically conductive part provided on a major surface of the base material is disclosed. The resin layer has a pattern including a linear trench. The electrically conductive part includes a portion provided within the linear trench. The resin layer includes a protruding portion formed on both sides of, and along, the linear trench, the protruding portion protruding in the thickness direction of the resin layer.

Description

Technical Field

[0001] The present disclosure relates to a conductive film, a method for manufacturing the same, and a display device.

Background Art

[0002] In a display device such as a liquid crystal display device, a conductive member having a conductor portion having a pattern including an opening formed by a metal fine wire may be used (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure relates to a novel conductive film that can be used in a display device or the like.

Means for Solving the Problems

[0005] The present disclosure includes at least the following aspects. [1] A film-shaped substrate, and a resin layer and a conductive portion provided on one or both main surface sides of the substrate, [[ID=四十五]] The resin layer has a pattern including linear trenches, The conductive portion has a portion provided in the linear trench, The resin layer has raised portions that bulge in the thickness direction of the resin layer and are formed along the trench on both sides of the linear trench. A conductive film. [2] The main surface of the resin layer on the side opposite to the substrate includes a plane parallel to the main surface of the substrate, The height of the raised portion with respect to the parallel plane is 0.17 μm or more. The conductive film according to [1]. [3] The conductive film according to [1] or [2], wherein the height of the conductive portion from the substrate is smaller than the height of the raised portion from the substrate. [4] The conductive film according to any one of [1] to [3], wherein the pattern includes a plurality of linear trenches that intersect each other. [5] The conductive film according to [4], wherein the pattern is a mesh pattern. [6] The conductive film according to [4] or [5], wherein the height of the raised portion from the substrate near the intersection where the two linear trenches intersect is greater than the height of the raised portion from the substrate at a position away from the intersection. [7] A display device comprising a conductive film as described in any one of items [1] to [6]. [8] A pattern including linear trenches is formed in the resin layer by pressing a mold having linear protrusions into a resin layer provided on one or both main surfaces of a film-like substrate, and then withdrawing the mold from the resin layer. To form a conductive portion including a portion provided within the linear trench, A method for producing a conductive film, including, A method in which the mold is pressed against the resin layer such that the resin layer forms raised portions along the trench on both sides of the linear trench, where the resin layer is raised in the thickness direction of the resin layer. [9] The main surface of the resin layer having the pattern on the side opposite to the substrate includes a parallel surface parallel to the main surface of the substrate, The method according to [8], wherein the height of the raised portion with respect to the parallel plane is 0.17 μm or more.

[10] The method according to [8] or [9], wherein the height of the conductive portion from the substrate is smaller than the height of the raised portion from the substrate.

[11] The method according to any one of [8] to

[10] , wherein the pattern includes a plurality of linear trenches intersecting each other.

[12] The method according to

[11] , wherein the pattern is a mesh pattern.

[13] The method according to

[11] or

[12] , wherein the height of the raised portion from the base material near the intersection where the two linear trenches intersect is greater than the height of the raised portion from the base material at a location away from the intersection.

[14] The resin layer before the mold is pressed contains a photocurable resin composition, The method according to any one of [8] to

[13] , wherein the resin layer is cured by irradiating the resin layer with ultraviolet light while the mold is pressed into the resin layer.

[15] The method according to any one of [8] to

[14] , wherein the conductive portion is formed by a plating method. A conductive film manufactured by the method described in any one of the items

[16] [8] to

[15] . [Effects of the Invention]

[0006] A conductive film relating to one aspect of this disclosure can constitute wiring with good conductivity. [Brief explanation of the drawing]

[0007] [Figure 1] This is a plan view showing an example of a conductive film. [Figure 2] This is a cross-sectional view along the line II-II in Figure 1. [Figure 3] This is an enlarged plan view showing an example of a trench intersection. [Figure 4] This is an enlarged cross-sectional view along the line IV-IV in Figure 3. [Figure 5] This is a cross-sectional view showing another example of a conductive film. [Figure 6] This is an enlarged cross-sectional view showing another example of a conductive film. [Figure 7] This is a cross-sectional view showing an example of a display device comprising a conductive film. [Modes for carrying out the invention]

[0008] The present invention is not limited to the following examples.

[0009] FIG. 1 is a plan view showing an example of a conductive film. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1. The conductive film 20 shown in FIGS. 1 and 2 is mainly composed of a film-like base material 1, a resin layer 3, and a conductive portion 5 provided on one main surface 1S side of the base material 1. The resin layer 3 has a pattern including a plurality of linear trenches 3a. The conductive portion 5 has a portion (linear portion) provided in the linear trench 3a. In the examples of FIGS. 1 and 2, a plurality of linear trenches 3a extending along two directions respectively intersect with each other, thereby forming a mesh-like pattern. The conductive portion 5 in the trench 3a also forms a mesh-like pattern. The conductive portion 5 having a mesh-like pattern can function well, for example, as a radiation element of an antenna. The trenches 3a and the conductive portion 5 are provided over a partial region of the main surface 1S of the base material 1. A resin layer and a conductive portion may be further provided on the main surface opposite to the main surface 1S of the base material 1.

[0010] FIG. 3 is an enlarged plan view of the vicinity of an intersection X where two linear trenches 3a and two linear portions 5A, 5B of the conductive portion 5 intersect with each other. FIG. 4 is an enlarged cross-sectional view taken along line IV-IV of FIG. 3. At the intersection X illustrated in FIGS. 3 and 4, the two linear trenches 3a intersect at right angles to each other. The angle between the two intersecting linear trenches 3a does not have to be 90 degrees, and can be, for example, in the range of 40 degrees or more and 140 degrees or less.

[0011] As shown in FIG. 4, the resin layer 3 has raised portions 30 that are formed on both sides of the linear trench 3a and bulge in the thickness direction of the resin layer 3. The raised portions 30 extend along the trench 3a. The main surface of the resin layer 3 on the side opposite to the base material 1 includes a parallel surface 3S that is parallel to the main surface 1S of the base material 1 inside (the side away from the trench 3a) the raised portions 30. The raised portions 30 include portions where the thickness of the resin layer 3 increases as it approaches the trench 3a. The apex of the raised portion 30, that is, the point where the height h of the raised portion with respect to the parallel surface 3S is maximum, is located near both sides of the trench 3a. When viewed from a direction perpendicular to the main surface 1S of the base material 1, the distance between the end face (the wall surface of the trench 3a) of the resin layer 3 at the position where the trench 3a shows the minimum width and the apex of the raised portion 30 may be 0.0 μm or more and 5.0 μm or less, or 0.0 μm or more and 4.0 μm or less. By having the raised portions 30 in the resin layer 3, the adhesiveness with other members provided on the resin layer 3 side of the conductive film can be improved. Also, it is easy to form a conductive portion 5 having stable and good conductivity.

[0012] When the height h of the raised portion with respect to the parallel surface 3S is 0.17 μm or more, good conductivity is particularly likely to be maintained even when the width of the conductive portion 5 is small. From the same viewpoint, the height h of the raised portion 30 with respect to the parallel surface 3S may be 0.18 μm or more. The height h of the raised portion may be 0.30 μm or less, or 0.25 μm or less.

[0013] The height h of the raised portion can be measured near any position of the trench 3a. For example, it can be a value obtained by continuously measuring the height of the resin layer 3 along a straight line that passes through the center C of the intersection X of the two linear trenches 3a and bisects the angle between the two linear trenches 3a. The center C of the intersection X is the intersection of the center lines that bisect each of the two linear trenches 3a. The height of the resin layer 3 is continuously measured, for example, by a scanning white light interference microscope. The height of the raised portion 30 with respect to the main surface 1S (or parallel surface 3S) of the base material 1 in the vicinity of the intersection X obtained by the above method may be larger than the height of the raised portion 30 with respect to the main surface 1S (or parallel surface 3S) of the base material 1 at a position away from the intersection X.

[0014] The depth d of the trench 3a relative to the parallel surface 3S may be 1.0 μm or more, 5.0 μm or less, 4.0 μm or less, or 3.0 μm or less. The minimum width w of the trench 3a may be 0.5 μm or more, 1.0 μm or more, 3.0 μm or less, 2.5 μm or less, or 2.0 μm or less. The depth d of the trench 3a usually coincides with the thickness of the resin layer 3 in the portion forming the parallel surface 3S. The height of the conductive portion 5 relative to the main surface 1S of the substrate 1 can be in the same range as the depth d of the trench 3a. The minimum width of the conductive portion 5 can be in the same range as the minimum width w of the trench 3a. In the conductive film according to this disclosure, even conductive portions having such fine sizes can have stable and good conductivity.

[0015] The height (maximum height) of the conductive portion 5 relative to the main surface 1S of the base material 1 may be smaller than the height (d+h) of the raised portion 30 relative to the main surface 1S of the base material 1. This can suppress the diffusion of the conductive material constituting the conductive portion 5 into areas other than the trench 3a.

[0016] The ratio of the height of the raised portion 30 relative to the main surface 1S of the base material 1 (=h / (d+h)×100) may be 8.0% or more, 9.0% or more, or 20% or less, or 15% or less. In this case as well, good conductivity is particularly easy to maintain even when the width of the conductive portion 5 is small.

[0017] The substrate 1 may be a light-transmitting substrate. The light-transmitting substrate has, for example, the degree of light transmittance required when the conductive film 20 is incorporated into a display device. Specifically, the total light transmittance of the light-transmitting substrate may be 90 to 100%. The haze of the light-transmitting substrate may be 0 to 5%.

[0018] The light-transmitting substrate used as substrate 1 may be, for example, a transparent resin film, such as polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or polyimide (PI) films. Alternatively, the light-transmitting substrate may be a glass substrate.

[0019] Figure 5 is a cross-sectional view showing another example of a conductive film, and Figure 6 is an enlarged cross-sectional view of the conductive film of Figure 5. As in the examples of Figures 5 and 6, the substrate 1 may be a laminate having a support film 11 and an intermediate resin layer 12 and a base layer 13 provided sequentially on the support film 11. The support film 11 can be, for example, the light-transmitting substrate described above. The base layer 13 is a layer provided to form the conductive part 5 by electroless plating or the like. If the conductive part 5 is formed by other methods, the base layer 13 does not necessarily have to be provided. The intermediate resin layer 12 does not necessarily have to be provided between the support film 11 and the base layer 13.

[0020] The thickness of the base material 1 or the support film 11 constituting it may be 10 μm or more, 20 μm or more, or 35 μm or more, and may be 500 μm or less, 200 μm or less, or 100 μm or less.

[0021] The provision of the intermediate resin layer 12 can improve the adhesion between the support film 11 and the base layer 13. If the base layer 13 is not provided, the provision of the intermediate resin layer 12 between the support film 11 and the resin layer 3 can improve the adhesion between the support film 11 and the resin layer 3.

[0022] The intermediate resin layer 12 may be a layer containing resin and inorganic filler. An example of the resin constituting the intermediate resin layer 12 is acrylic resin. An example of the inorganic filler is silica.

[0023] The thickness of the intermediate resin layer 12 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, and may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0024] The base layer 13 may be a layer containing a catalyst and a resin. The resin may be a cured product of a curable resin composition. Examples of curable resins included in the curable resin composition include amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicon resins, diclopentadiene resins, benzocyclobutene resins, episulfide resins, ene-thiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and UV-curable resins. UV-curable resins contain functional groups that undergo polymerization reactions under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0025] The catalyst contained in the underlayer 13 may be an electroless plating catalyst. The electroless plating catalyst may be a metal selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, and may be Pd. The catalyst may be one type alone or a combination of two or more types. Typically, the catalyst is dispersed in the resin as catalyst particles.

[0026] The catalyst content in the base layer 13 may be 3% by mass or more, 4% by mass or more, or 5% by mass or more, based on the total amount of the base layer 13, or it may be 50% by mass or less, 40% by mass or less, or 25% by mass or less.

[0027] The thickness of the base layer 13 may be 10 nm or more, 20 nm or more, or 30 nm or more, and may be 500 nm or less, 300 nm or less, or 150 nm or less.

[0028] The substrate 1 may further have a protective layer provided on the main surface of the support film 11 opposite to the resin layer 3 and conductive portion 5. The provision of the protective layer suppresses damage to the support film 11. The protective layer can be the same layer as the intermediate resin layer 12. The thickness of the protective layer may be 5 nm or more, 50 nm or more, or 500 nm or more, and may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0029] The conductive part 5 may contain a metal as a conductive material. The conductive part 5 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, and may contain copper. The conductive part 5 may be a metal plating formed by a plating method. The conductive part 5 may further contain nonmetallic elements such as phosphorus, to the extent that appropriate conductivity is maintained.

[0030] The conductive portion 5 may be a laminate composed of multiple layers. For example, as illustrated in Figure 6, the conductive portion 5 may be composed of a first metal layer 51 and a second metal layer 52 formed sequentially from the main surface 1S side of the substrate 1. The first metal layer 51 may contain nickel. The second metal layer 52 may contain copper. The thickness of the first metal layer 51 may be, for example, 5 nm or more, 10 nm or more, or 50 nm or more, and may be 500 nm or less, 200 nm or less, or 100 nm or less. If the underlayer 13 is not provided, the first metal layer 51 (or conductive portion 5) may be formed on the intermediate resin layer 12. If the intermediate resin layer 12 and the underlayer 13 are not provided, the first metal layer 51 (or conductive portion 5) may be formed on the support film 11.

[0031] The conductive portion 5 may have a blackened layer as the surface layer opposite to the substrate 1. The blackened layer can contribute to improving the visibility of the display device incorporating the conductive film. The blackened layer may be a layer similar to the first metal layer 51, and may, for example, be a layer containing copper and nickel. In that case, the nickel content in the blackened layer may be 15% by mass or more and 60% by mass or less, based on the total amount of copper and nickel. The thickness of the blackened layer may be, for example, 300 nm or more and 400 nm or less. The blackened layer may be a layer formed by treating the conductive portion 5 with a treatment solution containing Pd.

[0032] The resin layer 3 may be a layer formed of a light-transmitting resin. The total light transmittance of the resin layer 3 may be 90-100%. The haze of the resin layer 3 may be 0-5%.

[0033] The resin forming the resin layer 3 may be a cured product of a curable resin composition (photocurable resin composition or thermosetting resin composition). The curable resin composition forming the resin layer 3 includes a curable resin. Examples of curable resins include acrylic resins, amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicon resins, dichloropentadiene resins, benzocyclobutene resins, episulfide resins, ene-thiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and UV-curable resins. UV-curable resins contain functional groups that undergo polymerization reactions under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0034] The conductive film 20 can be manufactured by a method including, for example, pattern formation by imprinting. An example of a method for manufacturing the conductive film 20 includes preparing a film-like substrate 1 having a support film and a catalyst-containing underlayer provided on one main surface of the support film; providing a resin layer 3 on the main surface 1S of the substrate 1; pressing a mold having linear protrusions into the resin layer 3, and then withdrawing the mold from the resin layer 3 to form a pattern including linear trenches 3a in the resin layer 3; and forming conductive parts 5 including linear parts provided in the linear trenches 3a by a plating method that includes growing metal plating from the underlayer exposed in the trenches 5a. If the resin layer 3 is a layer containing a curable resin composition, the resin layer 3 may be cured with the mold pressed into it. If the resin layer 3 contains a photocurable resin composition, the resin layer 3 may be cured by irradiating it with ultraviolet light with the mold pressed into it.

[0035] The mold used in the imprint method is pressed against the resin layer 3 so that the resin layer 3 forms a raised portion 30. For example, the raised portion 30 can be formed in the resin layer 3 by controlling the magnitude of the pressure applied to the resin layer 3 by the mold. When the pressure applied to the resin layer by the protrusions of the mold is large, the height h of the raised portion tends to be large. For example, by adjusting the pressure applied to the resin layer by the protrusions of the mold to a range of 0.20 MPa or more, or 0.25 MPa or more, a resin layer 3 having a raised portion 30 can be easily formed. The pressure applied to the resin layer by the protrusions of the mold may be 2.0 MPa or less, or 1.5 MPa or less.

[0036] If a portion of the resin layer remains at the bottom of the trench 3a after the formation of the trench 3a by the imprint method, it may be removed before the formation of the conductive portion 5. However, if the trench 3a is formed by the imprint method under conditions that allow sufficient formation of the raised portion 30, a conductive portion 5 with good conductivity can be efficiently formed by the plating method without the need to remove the remaining resin layer.

[0037] The formation of the conductive portion 5 by the plating method may include, for example, forming a seed layer on a substrate layer by electroless plating and forming Cu plating on the seed layer by electroless plating. In this case, the seed layer may be the first metal layer 51 and the Cu plating may be the second metal layer 52.

[0038] The conductive film described above can be incorporated into a display device, for example, as a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic EL display device. Figure 7 is a cross-sectional view showing an example of a display device incorporating a conductive film. The display device 100 shown in Figure 7 comprises an image display unit 10 having an image display area 10S, a conductive film 20, a polarizing plate 35, and a cover glass 40. The conductive film 20, the polarizing plate 35, and the cover glass 40 are laminated in this order from the image display unit 10 side on the image display area 10S side of the image display unit 10. The configuration of the display device is not limited to the form shown in Figure 7 and can be changed as needed. For example, the polarizing plate 35 may be provided between the image display unit 10 and the conductive film 20. The image display unit 10 may be, for example, a liquid crystal display unit. The polarizing plate 35 and the cover glass 40 can be those commonly used in display devices. The polarizing plate 35 and the cover glass 40 are not necessarily required. [Examples]

[0039] The present invention is not limited to the following embodiments.

[0040] 1. Mold A mold was prepared having multiple linear protrusions with a width L of 1 μm or 2 μm and arranged at intervals S of 100 μm or 200 μm. A mesh-like pattern was formed when the linear protrusions of the mold intersected each other at right angles.

[0041] 2. Imprint molding test A curable resin containing Pd particles for forming a base layer was prepared. This curable resin was applied to a transparent polyethylene terephthalate (PET) film (100 μm thick) using a bar coater. The coating was heated to 80°C and cured to form a base layer (100 nm thick). A photocurable resin composition containing an oligomer with an acrylic group was applied to the base layer to form a photocurable resin layer (2 μm thick).

[0042] The protrusions of the mold were pressed into the formed resin layer so that their tips reached the underlying layer, and the UV-curable resin layer was cured by UV irradiation in that state. By withdrawing the protrusions of the mold from the resin layer, a resin layer having a mesh-like pattern containing multiple intersecting linear trenches was formed. Imprint molding tests, as shown in Test Examples 1 to 6 in Table 1, were performed under several conditions with different pressures applied to the protrusions of the mold. The pressure on the protrusions of the mold was measured using pressure-sensitive paper.

[0043] 3. Observation of the trench shape The trench shape was observed using a scanning white-light interference microscope (VS1000, Hitachi, Ltd.). The change in the height of the resin layer forming the trench was measured by scanning the surface of the trench, where the shape of the intersection of linear protrusions (1 μm wide and spaced 100 μm apart) was transferred, along a 45-degree angle to the trench. A 20 μm or 30 μm range, including areas where the resin layer surface was horizontal, was scanned, centered on the trench intersection. Other measurement conditions were as follows. Camera: Sony XCL-C30 1 / 3" Camera speed: 1.0X Objective lens: 50XDI Telescope tube: 1.0X Zoom lens: 1.0X Light source: 530White Measurement device: Piezo Measurement mode: WaveT Scan speed: 4 μm / s Field of view size: 640 x 480 Effective pixels: 50 From the measurement results, the minimum trench width w, the trench depth d relative to the parallel plane parallel to the main surface of the resin layer substrate, and the height h of the raised portion relative to the parallel plane of the resin layer were determined. For Test Example 6, the shape of the trench near the intersection of a trench with a width L of 2 μm and a spacing S of 200 μm was also measured.

[0044] 4. Formation of conductive part A laminate consisting of a PET film, a base layer, and a resin layer was immersed in an alkaline degreasing solution containing a surfactant for 5 minutes. The laminate removed from the degreasing solution was washed with pure water. The washed laminate was immersed in an electroless plating solution containing nickel sulfate and sodium hypophosphite for 3 minutes to grow a metal plating as a seed layer (100 nm thick) composed of Ni and P from the base layer exposed on the bottom surface of the trench. The laminate removed from the electroless plating solution was washed with pure water. Subsequently, the laminate with the formed seed layer was immersed in an aqueous solution containing Pd for 5 minutes and then washed with pure water to adsorb Pd particles as a catalyst onto the seed layer. The laminate was then immersed in an electroless plating solution containing copper sulfate and formalin for 15 minutes to grow a Cu plating (upper metal plating layer) that fills the trench on the seed layer. The laminate removed from the electroless plating solution was washed with pure water and dried at 80°C for 3 minutes to obtain a conductive film having a mesh-like pattern and a conductive portion consisting of a seed layer and Cu plating.

[0045] 5. Rating In test examples 1-3, plating did not precipitate from the underlayer, and no conductive material was formed. This is thought to be because a resin layer remained at the bottom of the trench. For test examples 4-6 in which conductive parts were formed, the number of areas with defects such as defects in the conductive parts was confirmed by microscopic observation. As the conductive parts to be observed, in areas where the trench spacing S was 100 μm and the trench width L was 1 μm or 2 μm, six conductive parts with a length of 200 μm that constituted a square shape containing four meshes were selected. In areas where the trench spacing S was 200 μm and the trench width L was 1 μm or 2 μm, four conductive parts with a length of 200 μm that surrounded one mesh were selected. Of the 60 conductive parts comprising a total of 40 locations, 10 locations each from the areas with a trench spacing S of 100 μm and a trench width L of 1 μm or 2 μm, and 10 locations each from the areas with a trench spacing S of 200 μm and a trench width L of 1 μm or 2 μm, the number of conductive parts with defects was recorded. The conformity rate was calculated by determining the percentage of conductive parts that were free of defects out of 60 conductive parts. For test examples 4-6, the surface resistance of the formed conductive parts was measured.

[0046] [Table 1]

[0047] Table 1 shows the evaluation results. When the trench width L was 2 μm and the trench spacing was 200 μm, after imprint molding under conditions that formed raised portions as in Test Examples 4-6, a conductive portion with good conductivity was stably formed without the need to remove the remaining resin layer. When forming even finer conductive portions, after imprint molding under the conditions of Test Examples 5 and 6, a conductive portion with good conductivity was stably formed without removing the remaining resin layer. [Explanation of Symbols]

[0048] 1...Substrate, 1S...Main surface, 3...Resin layer, 5...Conductive part, 51...First metal layer, 52...Second metal layer, 3a...Trench, 3S...Parallel surface, 5A, 5B...Linear part, 11...Support film, 12...Intermediate resin layer, 13...Underlayment layer, 20...Conductive film, 30...Raised part, 100...Display device, X...Intersection, C...Center of the intersection.

Claims

1. The device comprises a film-like substrate, and a resin layer and a conductive portion provided on one or both main surfaces of the substrate. The resin layer has a pattern including linear trenches, The conductive portion has a portion provided within the linear trench, The resin layer has raised portions that are formed along the trench on both sides of the linear trench and are raised in the thickness direction of the resin layer. Conductive film.

2. The main surface of the resin layer opposite to the substrate includes a parallel surface parallel to the main surface of the substrate. The conductive film according to claim 1, wherein the height of the raised portion with respect to the parallel surface is 0.17 μm or more.

3. The conductive film according to claim 1, wherein the height of the conductive portion from the substrate is smaller than the height of the raised portion from the substrate.

4. The conductive film according to claim 1, wherein the pattern includes a plurality of linear trenches that intersect each other.

5. The conductive film according to claim 4, wherein the pattern is a mesh-like pattern.

6. The conductive film according to claim 4, wherein the height of the raised portion from the substrate near the intersection where the two linear trenches intersect is greater than the height of the raised portion from the substrate at a position away from the intersection.

7. A display device comprising a conductive film according to any one of claims 1 to 6.

8. A mold having linear protrusions is pressed into a resin layer provided on one or both main surfaces of a film-like substrate, and then the mold is withdrawn from the resin layer to form a pattern including linear trenches in the resin layer. To form a conductive portion including a portion provided within the linear trench, A method for producing a conductive film, including, A method in which the mold is pressed against the resin layer such that the resin layer forms raised portions along the trench on both sides of the linear trench, where the resin layer is raised in the thickness direction of the resin layer.

9. The main surface of the resin layer having the pattern, on the side opposite to the substrate, includes a parallel surface parallel to the main surface of the substrate. The method according to claim 8, wherein the height of the raised portion with respect to the parallel surface is 0.17 μm or more.

10. The method according to claim 8, wherein the height of the conductive portion from the substrate is smaller than the height of the raised portion from the substrate.

11. The method according to claim 8, wherein the pattern includes a plurality of linear trenches that intersect each other.

12. The method according to claim 11, wherein the pattern is a mesh-like pattern.

13. The method according to claim 11, wherein the height of the raised portion from the base material near the intersection where the two linear trenches intersect is greater than the height of the raised portion from the base material at a position away from the intersection.

14. The resin layer before the mold is pressed contains a photocurable resin composition. The method according to claim 8, wherein the resin layer is cured by irradiating the resin layer with ultraviolet light while the mold is pressed into the resin layer.

15. The method according to claim 8, wherein the conductive portion is formed by a plating method.

16. A conductive film manufactured by the method described in any one of claims 8 to 15.

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