Conveying device, lithography device, and method for manufacturing articles

Abstract

To provide a technique advantageous for appropriately controlling conveyance of an object.SOLUTION: A conveyance apparatus for conveying an object includes a measurement unit configured to measure a foreign substance on a surface of the object, a conveyance unit including a holding unit configured to hold the object by coming into contact with a part of the surface and configured to convey the object while holding the object by the holding unit, and a control unit configured to control conveyance of the object by the conveyance unit in accordance with the foreign substance in a contact region of the surface with which the holding unit comes into contact, the foreign substance being obtained from a measurement result by the measurement unit.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a transfer device, a lithography device, and an article manufacturing method.

Background Art

[0002] A lithography device for forming a pattern on a substrate is provided with a transfer device that transfers an object such as a reticle or a substrate while holding the object by vacuum suction or the like. In a lithography device, improvement in productivity (throughput) is required, and in the transfer device as well, it may be required to shorten the time required for transferring an object. Patent Document 1 describes detecting the strength of the adsorption force when an object is adsorbed and held by an adsorption holding means, and controlling the moving speed of the adsorption holding means based on the detected strength of the adsorption force.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] If an object is transferred at high speed according to the adsorption force as described in Patent Document 1, even if the adsorption force is sufficient, the object may not be transferred accurately. For example, if many foreign substances adhere to the region of the surface of the object to be transferred that is adsorbed and held, the frictional force between the adsorption holding means and the object may decrease even if the adsorption force is sufficient. When the object is transferred at high speed in this state, the object slips from the adsorption holding means, and the relative position between the adsorption holding means and the object is displaced. As a result, the object cannot be accurately transferred onto the stage that is the transfer destination of the object, and extra time may be required for positioning the object. In addition, distortion may occur in the object due to a foreign substance being sandwiched between the adsorption holding means and the object.

[0005] Therefore, the present invention aims to provide a technology that is advantageous for appropriately controlling the transport of objects. [Means for solving the problem]

[0006] To achieve the above objective, a transport device as one aspect of the present invention is a transport device for transporting an object, comprising: a measuring unit for measuring foreign matter on the surface of the object; a holding unit that contacts a part of the surface and holds the object, and transports the object while holding the object with the holding unit after the foreign matter has been measured by the measuring unit; and a control unit that controls the transport of the object by the transport unit according to the foreign matter in the contact area of ​​the surface that the holding unit contacts, as determined from the measurement results by the measuring unit.

[0007] Further objects or other aspects of the present invention will be revealed by preferred embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0008] According to the present invention, for example, it is possible to provide a technology that is advantageous for appropriately controlling the transport of objects. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic diagram showing an example configuration of the exposure apparatus of the first embodiment. [Figure 2] A schematic diagram showing an example of the surface configuration of the original plate. [Figure 3] Schematic diagram showing an example of the configuration of the hand of the second transport mechanism. [Figure 4] Schematic diagram showing an example configuration of a foreign object inspection device. [Figure 5A] A diagram showing an example of the distribution of foreign matter adhesion obtained by a foreign matter inspection device. [Figure 5B] A diagram showing an example of the distribution of foreign matter adhesion obtained by a foreign matter inspection device. [Figure 6] Flowchart showing the method for transporting the original plate in the first embodiment [Figure 7]Flowchart showing foreign object inspection in the second embodiment [Figure 8] In the third embodiment, a flowchart shows a method for predicting and notifying the time when the foreign matter adhesion status in the contact area no longer meets predetermined conditions. [Figure 9] A diagram showing an example of the relationship between the number of transports and the degree of foreign matter adhesion. [Figure 10] A flowchart illustrating a method for changing predetermined conditions according to the misalignment of the transport position of the master plate in the fourth embodiment. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] In this specification and the accompanying drawings, directions are typically indicated in an XYZ coordinate system, where the direction parallel to the horizontal plane is the XY plane. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are denoted as the X direction, Y direction, and Z direction, respectively, and the rotations around the X, Y, and Z axes are denoted as θX, θY, and θZ, respectively. Control and driving (movement) related to the X, Y, and Z axes means control or driving (movement) related to the direction parallel to the X, Y, and Z axes, respectively. Furthermore, control or driving related to the θX, θY, and θZ axes means control or driving related to rotation around the axis parallel to the X, Y, and Z axes, respectively.

[0012] In the following embodiments, an exposure apparatus that transfers the pattern of a master plate, such as a reticle or mask, onto a substrate by exposing the substrate is used as an example of a lithography apparatus for forming a pattern on a substrate, but the invention is not limited to this. For example, the present invention can also be applied to other lithography apparatuses, such as molding apparatuses (imprint apparatuses, planarization apparatuses) that form a composition on a substrate using a master plate such as a mold. Furthermore, in the following embodiments, a master plate is used as an example of an object to be transported by a transport apparatus, but the object to be transported may be a substrate.

[0013] <First Embodiment> A first embodiment of the exposure apparatus 100 according to the present invention will now be described. Figure 1 is a schematic diagram showing an example of the configuration of the exposure apparatus 100 of this embodiment, and shows the inside of the chamber that covers the entire exposure apparatus 100. The exposure apparatus 100 is a step-and-scan type exposure apparatus (so-called scanner) that transfers the pattern of the original plate R (reticle, mask) onto the substrate S (wafer) by performing an exposure process in which the substrate S is exposed while scanning the original plate R and the substrate S (wafer) relatively. Such an exposure process is performed for each of a plurality of shot regions on the substrate S. In this embodiment, a step-and-scan type exposure apparatus is used as an example for explanation, but the present invention can also be applied to a step-and-repeat type exposure apparatus (so-called stepper).

[0014] As shown in FIG. 1, the exposure apparatus 100 may include a forming apparatus 100a, a reticle transport apparatus 100b, a control unit CNT, and a user interface UI. The control unit CNT is composed of a computer (information processing apparatus) including a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and comprehensively controls the operation of the exposure apparatus 100. The control unit CNT can control the exposure process performed by the forming apparatus 100a and the reticle transport process performed by the reticle transport apparatus 100b. Further, the user interface UI may include an input unit that receives input from a user (operator) and a notification unit that notifies information to the user (operator). The notification unit may include, for example, a display for displaying information. In FIG. 1, illustration of a chamber that covers the entire exposure apparatus 100 and a substrate transport apparatus that transports the substrate S is omitted.

[0015] The forming apparatus 100a forms a pattern on the substrate S by performing an exposure process. The forming apparatus 100a of the present embodiment may include, for example, an illumination optical system 1 that illuminates the reticle R, a reticle stage 2 that holds and is movable with the reticle R, a projection optical system 3 that projects an image of the pattern of the reticle R onto the substrate S, and a substrate stage 4 that holds and is movable with the substrate S. The reticle R has a pattern (for example, a circuit pattern) to be transferred onto the substrate S, and is illuminated through the illumination optical system 1 by light generated from a light source (not shown) such as an excimer laser. The light that has passed through the reticle R is projected onto the substrate S at a predetermined magnification by the projection optical system 3 as an image of the pattern of the reticle R. In the forming apparatus 100a of the present embodiment, the reticle stage 2 and the substrate stage 4 relatively scan the reticle R and the substrate S in a predetermined scanning direction (for example, the Y direction) at a speed ratio corresponding to the projection magnification of the projection optical system 3 while synchronizing with each other. Thereby, the pattern of the reticle R can be transferred onto the substrate S.

[0016] The reticle transport apparatus 100b transports the reticle R so as to carry the reticle R into the forming apparatus 100a or carry the reticle R out from the forming apparatus 100a. The reticle transport apparatus 100b of the present embodiment may include, for example, a first transport mechanism 9, a second transport mechanism 14, and a foreign object inspection device 12.

[0017] The first transfer mechanism 9 is a mechanism that transfers the original plate R between the pod openers 7 and 8, the reticle stocker 11, the foreign object inspection device 12, and the alignment stage 13 while holding a part of the back surface (for example, the lower surface) of the original plate R. The second transfer mechanism 14 is a mechanism (transfer unit) that transfers the original plate R between the alignment stage 13 and the original plate stage 2 of the forming device 100a while holding a part of the front surface (for example, the upper surface) of the original plate R. The foreign object inspection device 12 is a device that inspects foreign objects adhering to the surface of the original plate R.

[0018] The original plate storage containers 5 and 6 are sealed containers that can store one or more original plates R and can be opened and closed, and are respectively placed on the pod openers 7 and 8. The original plate storage containers 5 and 6 are sometimes referred to as SMIF pods. The pod openers 7 and 8 are devices for opening and closing the original plate storage containers 5 and 6, and are provided with a lifting mechanism (not shown) for opening the original plate storage containers 5 and 6 and pulling out the original plate R from the original plate storage containers 5 and 6. The original plate R pulled out from the original plate storage containers 5 and 6 by the pod openers 7 and 8 is transferred by the first transfer mechanism 9.

[0019] The first transfer mechanism 9 can be configured as a transfer robot including, for example, a hand 9a that holds a part of the back surface of the original plate R and a drive mechanism 9b that drives the hand 9a for a plurality of axes (for example, six axes of X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). The original plate R is carried out from the pod openers 7 and 8 while being held by the hand 9a of the first transfer mechanism 9, the identification code of the original plate R is read by the code reader 10, and then it is transferred to the reticle stocker 11. The reticle stocker 11 is a storage unit (storage vault) that stores a plurality of original plates R, and has, for example, a shelf-like structure. The plurality of original plates R stored in the reticle stocker 11 can be managed by the control unit CNT based on the identification code read by the code reader 10. Among the plurality of original plates R stored in the reticle stocker 11, the original plate R to be used for the next exposure process is carried out from the reticle stocker 11 by the first transfer mechanism 9 and transferred to the foreign object inspection device 12.

[0020] The foreign matter inspection device 12 is a device that inspects the size, location, and amount of foreign matter adhering to the surface of the original plate R, and functions as a measuring unit that measures the foreign matter on the surface of the original plate R. In other words, the foreign matter inspection device 12 measures the distribution of foreign matter adhering to the surface of the original plate R. Here, if a pellicle is formed on the surface of the original plate R, the foreign matter inspection device 12 inspects the size, location, and amount of foreign matter adhering to the surface of the pellicle. The surface of the pellicle may be understood as part of the surface of the original plate R.

[0021] The original plate R, which has been inspected for foreign matter (measured for foreign matter) by the foreign matter inspection device 12, is transported to the alignment stage 13 by the first transport mechanism 9. The alignment stage 13 aligns the original plate R in the X, Y, and θZ directions, for example, so that the amount of deviation of the original plate R's position and orientation from the alignment reference falls within a specified range. The alignment reference may be understood as a reference value (target value) for the position and orientation of the original plate R.

[0022] The original plate R, which has been aligned by the alignment stage 13, is transported onto the original plate stage 2 of the forming apparatus 100a by the second transport mechanism 14. The second transport mechanism 14 includes a hand 14a that contacts a part of the surface of the original plate R to hold the original plate R, and a drive mechanism 14b that drives the hand 14a. In the second transport mechanism 14 of this embodiment, the hands 14a are provided at both ends of a beam-shaped support member 14c, and the drive mechanism 14b drives the hands 14a by rotating the support member 14c in the θZ direction or moving it up and down in the Z direction. As a result, the second transport mechanism 14 can transport the original plate R to the original plate stage 2 by holding the original plate R on the alignment stage 13 with the hand 14a and rotating the support member 14c in the θZ direction with the drive mechanism 14b.

[0023] When the exposure process is completed in the forming apparatus 100a, the second transport mechanism 14 holds the original plate R on the original plate stage 2 with the hand 14a and transports the original plate R onto the alignment stage 13 by rotating the support member 14c in the θZ direction with the drive mechanism 14b. The original plate R on the alignment stage 13 is transported to the reticle stocker 11 by the first transport mechanism 9 and temporarily stored. If the original plate R is not scheduled to be used for exposure processing again, it is transported by the first transport mechanism 9 to either the pod opener 7 or 8 and finally stored in either the original plate storage container 5 or 6.

[0024] Figure 2 is a schematic diagram showing an example of the surface configuration of the master plate R, and is a view of the surface of the master plate R from above (+Z direction). As shown in Figure 2, the surface of the master plate R may include a pattern region R1 having a pattern to be transferred onto the substrate, and a surrounding region R2 surrounding the pattern region R1 in the X direction. Here, the pattern region R1 of the master plate R may be understood as the region illuminated by the illumination optical system 1 in the forming apparatus 100a (illumination region, exposure region). The surrounding region R2 of the master plate R may be understood as the region other than the pattern region R1.

[0025] Next, an example of the configuration of the hand 14a that holds the original plate R in the second transport mechanism 14 will be described with reference to Figure 3. Figure 3(a) is a schematic diagram showing an example of the configuration of the hand 14a of the second transport mechanism 14, and is a view of the hand 14a from below (-Z direction). The hand 14a of the second transport mechanism 14 has a plurality of suction pads 141 (holding parts) that contact a part of the original plate R and hold the original plate R by vacuum suction or the like. By aligning the original plate R in the alignment stage 13, the reference position Rr of the original plate R (e.g., the center of gravity position, see Figure 2) and the reference position 140 of the hand 14a (e.g., the center of gravity position) are brought into approximately coincidence. In this state of alignment, the plurality of suction pads 141 are arranged to contact and hold a part of the surrounding region R2 of the surface of the original plate R.

[0026] Figure 3(b) is an enlarged view of one suction pad 141. The suction pad 141 has an intake hole 142 for performing vacuum suction and an outer edge portion 143 that defines the space in which vacuum suction is performed through the intake hole 142. The outer edge portion 143 is the part that contacts the surface of the original plate R. Here, the contact area Rc on the surface of the original plate R that the suction pad 141 (outer edge portion 143) contacts is included in the surrounding area R2, as shown in Figure 2.

[0027] Next, an example of the configuration of the foreign object inspection device 12 will be described with reference to Figure 4. Figure 4 is a schematic diagram showing an example of the configuration of the foreign object inspection device 12. The foreign object inspection device 12 has a foreign object detection unit 120 composed of a laser light source 121 and a line sensor 122. The foreign object inspection device 12 also has a processing unit 123 that controls the foreign object detection unit 120 and processes the signals output from the foreign object detection unit 120 (line sensor 122).

[0028] Multiple foreign object detection units 120 may be provided within the foreign object inspection device 12 to inspect foreign objects on the front and back surfaces of the original plate R, for example. In Figure 4, only the foreign object detection unit 120 for inspecting foreign objects on the front surface of the original plate R is shown, and the foreign object detection unit 120 for inspecting foreign objects on the back surface of the original plate R is not shown. The line sensor 122 extends along the Y direction, and the length of the line sensor 122 in the Y direction may be greater than or equal to the length of the original plate R in the Y direction. The foreign object inspection device 12 also has a drive mechanism (not shown) that drives the original plate R and the foreign object detection unit 120 relative to each other in a direction perpendicular to the extension direction of the line sensor 122 (Y direction) (X direction). The relative drive range between the original plate R and the foreign object detection unit 120 by this drive mechanism may be greater than or equal to the length of the original plate R in the X direction.

[0029] In the foreign object inspection device 12, a laser light source 121 obliquely incidents laser light in a line on the surface of the original plate R, and the reflected light 124 from the surface of the original plate R is received by the line sensor 122. The line sensor 122 is constructed by arranging multiple sets of photoelectric conversion elements and optical systems (e.g., lenses) in a line in the Y direction. The foreign object inspection device 12 then drives the original plate R and the foreign object detection unit 120 relative to each other in a direction perpendicular to the line of laser light irradiated onto the surface of the original plate R (X direction), thereby enabling inspection of foreign objects across the entire surface of the original plate R.

[0030] Furthermore, the processing unit 123 sequentially receives signals output from the line sensor 122 and generates a foreign matter adhesion distribution on the surface of the original plate R based on these signals. As shown in Figure 4, when foreign matter 206 adheres to the surface of the original plate R, the laser light from the laser light source 121 is scattered by the foreign matter 206 and received by the line sensor 122 as scattered light. Therefore, from the output signal of the line sensor 122, the magnitude of the reflected light (scattered light), the relative position in the X direction between the original plate R and the foreign matter detection unit 120 when the scattered light is received by the line sensor 122, and the position in the Y direction of the sensor of the line sensor 122 that received the scattered light can be obtained. Based on this information, the processing unit 123 can calculate the size and position of the foreign matter on the surface of the original plate R and generate a foreign matter adhesion distribution represented as an XY plane map.

[0031] Figure 5A shows an example of a foreign matter adhesion distribution 200 acquired (measured) by the foreign matter inspection device 12. As mentioned above, the foreign matter adhesion distribution 200 is a map of the size and position of foreign matter adhering to the surface of the original plate R by receiving reflected light (scattered light) with the line sensor 122 while driving the original plate R and the foreign matter detection unit 120 relative to each other in the X direction. The coordinate "0" in the Y direction of the foreign matter adhesion distribution 200 indicates the reference position of the line sensor 122 (e.g., center position, centroid position), and the coordinate "0" in the X direction indicates the reference position of the drive stroke of the foreign matter detection unit 120 relative to the original plate R (e.g., center position, centroid position). That is, the coordinate (0,0) in the foreign matter adhesion distribution 200 indicates the position 210 corresponding to the reference position Rr of the original plate R.

[0032] In the foreign matter adhesion distribution 200, the size of the foreign matter adhering to the surface of the original plate R is classified into small particle size, medium particle size, and large particle size, according to the magnitude of the scattered light signal. The foreign matter adhesion distribution 200 shown in Figure 5A shows that small particle size foreign matter 201, medium particle size foreign matter 202, and large particle size foreign matter 203 are adhering to the original plate R.

[0033] Incidentally, if a lot of foreign matter adheres to the contact area Rc on the surface of the original plate R where the hand 14a (outer edge 143) of the second transport mechanism 14 makes contact, the frictional force between the hand 14a and the original plate R may decrease even if the suction force of the hand 14a is sufficient. In this state, if the hand 14a is driven at high speed, the original plate R may slip away from the hand 14a, and the relative positions of the hand 14a and the original plate R will shift. As a result, the original plate R cannot be transported accurately onto the original plate stage 2, and extra time may be required for positioning the original plate R in the forming apparatus 100a. In addition, distortion may occur in the original plate R if foreign matter gets caught between the hand 14a and the original plate R. Therefore, the original plate transport apparatus 100b of this embodiment controls the transport of the original plate R by the second transport mechanism 14 according to the amount of foreign matter on the contact area Rc on the surface of the original plate R where the hand 14a (outer edge 143) makes contact, as determined from the inspection results (measurement results) of the foreign matter inspection apparatus 12. Furthermore, the original plate transport device 100b of this embodiment controls the transport of the original plate R by the second transport mechanism 14 in response to foreign matter in the pattern region R1 on the surface of the original plate R that has a pattern to be transferred onto the substrate.

[0034] Figure 5B shows the foreign matter adhesion distribution 200 acquired by the foreign matter inspection device 12, with the region 221 corresponding to the contact region Rc of the original plate R (hereinafter sometimes referred to as the contact equivalent region 221) superimposed on it. Assuming that the reference position Rr of the original plate R coincides with the reference position 140 of the hand 14a of the second transport mechanism 14, the contact equivalent region 221 can be shown on the foreign matter adhesion distribution 200. The control unit CNT can determine the foreign matter adhesion status, which represents the size and position of foreign matter adhering to the contact region Rc on the surface of the original plate R, by comparing (matching) the foreign matter adhesion distribution 200 with the contact equivalent region 221. In Figure 5B, the region 220 corresponding to the pattern region R1 of the original plate R (hereinafter sometimes referred to as the pattern equivalent region 220) is also shown superimposed on the foreign matter adhesion distribution 200.

[0035] Next, the method for transporting the original plate R in the original plate transport device 100b of this embodiment will be described. Figure 6 is a flowchart showing the method for transporting the original plate R from the reticle stocker 11 to the original plate stage 2 of the forming apparatus 100a in the original plate transport device 100b of this embodiment. The flowchart in Figure 6 can be executed by the control unit CNT.

[0036] In step S101, the control unit CNT acquires identification information (ID) of the original plate R to be transported to the original plate stage 2 of the forming apparatus 100a. For example, the control unit CNT can acquire the identification information of the original plate R via the user interface UI. Next, in step S102, the control unit CNT controls the first transport mechanism 9 to unload the original plate R corresponding to the identification information acquired in step S101 from the reticle stocker 11 and transport the original plate R to the foreign object inspection apparatus 12.

[0037] In step S103, the control unit CNT causes the foreign matter inspection device 12 to perform a foreign matter inspection on the surface of the original plate R (i.e., measurement of the foreign matter adhesion distribution 200). The foreign matter inspection by the foreign matter inspection device 12 is as described above. As a result, the control unit CNT can obtain the foreign matter adhesion distribution 200 from the foreign matter inspection device 12. Once the foreign matter inspection by the foreign matter inspection device 12 is completed, the control unit CNT may transport the original plate R from the foreign matter inspection device 12 onto the alignment stage 13 using the first transport mechanism 9.

[0038] In step S104, the control unit CNT compares the foreign matter adhesion distribution 200 acquired in step S103 with the pattern-equivalent region 220. Then, in step S105, based on the comparison result in step S104, the control unit CNT determines the foreign matter adhesion status in the pattern region R1 of the original plate R and determines whether the foreign matter adhesion status in the pattern region R1 satisfies the specified conditions. These specified conditions are, for example, conditions that allow the foreign matter adhesion status in the pattern region R1 of the original plate R to satisfy the exposure processing specifications, and can be set in advance by experimentation, simulation, etc.

[0039] For example, the control unit CNT can determine the foreign matter adhesion status by calculating the area occupancy rate of foreign matter in the pattern region R1, and if this area occupancy rate is less than a specified value, it can determine that the foreign matter adhesion status of the pattern region R1 satisfies the specified conditions. The area occupancy rate of foreign matter in the pattern region R1 can be calculated based on the size and amount of foreign matter adhering to the pattern region R1. Alternatively, the control unit CNT can determine the amount of foreign matter in the pattern region R1 as the foreign matter adhesion status, and if this amount is less than a specified value, it can determine that the foreign matter adhesion status of the pattern region R1 satisfies the specified conditions. Furthermore, the control unit CNT may also determine the foreign matter adhesion status by calculating the size of the foreign matter in the pattern region R1. In this case, the control unit CNT can determine that the foreign matter adhesion status of the pattern region R1 satisfies the specified conditions if there is no foreign matter larger than the specified size (for example, medium-sized foreign matter 202 and large-sized foreign matter 203) in the pattern region R1.

[0040] If the foreign matter adhesion status in pattern region R1 meets the specified conditions, the process proceeds to step S106. On the other hand, if the foreign matter adhesion status in pattern region R1 does not meet the specified conditions, the process proceeds to step S111.

[0041] In step S106, the control unit CNT determines whether the number of times the original plate R has been transported by the second transport mechanism 14 is the first time or more than the specified number of times. If it is the first time the original plate R has been transported by the second transport mechanism 14, there is a possibility that a lot of foreign matter has already adhered to the surrounding area R2 (contact area Rc) on the surface of the original plate R when it is brought into the exposure apparatus 100. Also, if the number of times the original plate R has been transported by the second transport mechanism 14 is more than the specified number of times, there is a possibility that a lot of foreign matter has accumulated on the surrounding area R2 (contact area Rc) on the surface of the original plate R due to previous transports. The specified number of times is, for example, the upper limit of the number of times in which the relative positional deviation between the hand 14a and the original plate R that may occur during the transport of the original plate R by the second transport mechanism 14 can be kept within an acceptable range, and can be set in advance by experimentation or simulation. If the number of times the original plate R is transported by the second transport mechanism 14 is the first time or more than the specified number of times, the process proceeds to step S107. If the number of transports is less than the specified number of times (excluding the first time), the process proceeds to step S109.

[0042] In step S106 of this embodiment, the number of times the original plate R was transported by the second transport mechanism 14 was determined, but it is not limited to that. For example, the period during which the original plate R was stored in the reticle stocker 11 (storage unit) before the foreign matter inspection device 12 performed a foreign matter inspection (i.e., before the measurement of the foreign matter adhesion distribution) may be determined. The longer the storage period of the original plate R stored in the reticle stocker 11, the more foreign matter may have accumulated on the surface of the original plate R. In this case, in step S106, the control unit CNT determines whether the storage period of the original plate R in the reticle stocker 11 (storage unit) is equal to or greater than the specified period. If the storage period is equal to or greater than the specified period, the process proceeds to step S107; if the storage period is less than the specified period, the process proceeds to step S109.

[0043] In step S107, the control unit CNT compares the foreign matter adhesion distribution 200 acquired in step S103 with the contact area 221. Then, in step S108, based on the comparison result in step S107, the control unit CNT determines the foreign matter adhesion status in the contact area Rc of the original plate R and determines whether the foreign matter adhesion status in the contact area Rc satisfies the first or second specified condition. The first and second specified conditions are conditions concerning the foreign matter adhesion status in the contact area Rc and can be set in advance by experiments or simulations. The first specified condition is, for example, a condition in which the relative positional deviation between the hand 14a and the original plate R that may occur during transport can be kept within an acceptable range even when the original plate R is transported by the second transport mechanism 14 at a first transport speed (high speed). Furthermore, the second specified condition is that, for example, if the original plate R is transported by the second transport mechanism 14 at a second transport speed (low speed) slower than the first transport speed, the relative positional deviation between the hand 14a and the original plate R that may occur during transport can be kept within an acceptable range.

[0044] For example, the control unit CNT can determine the area occupancy rate of foreign matter in the contact area Rc as the foreign matter adhesion status, and determine whether the foreign matter adhesion status in the contact area Rc satisfies the first specified condition or the second specified condition, according to the said area occupancy rate. The area occupancy rate of foreign matter in the contact area Rc can be calculated based on the size and amount of foreign matter adhering to the contact area Rc. As an example, if the area occupancy rate of foreign matter in the contact area Rc is less than the first specified value (e.g., less than 3%), it is determined that the first specified condition is satisfied, and if the area occupancy rate is less than the second specified value (e.g., less than 10%), it is determined that the second specified condition is satisfied. If the area occupancy rate is equal to or greater than the second specified value (e.g., 10% or more), it is determined that neither the first nor the second specified condition is satisfied.

[0045] Alternatively, the control unit CNT can determine the amount of foreign matter in the contact area Rc as the foreign matter adhesion status, and determine whether the foreign matter adhesion status in the contact area Rc satisfies the first specified condition or the second specified condition, depending on the amount of foreign matter. Furthermore, the control unit CNT may also determine the size of the foreign matter in the contact area Rc as the foreign matter adhesion status, and determine whether the foreign matter adhesion status in the contact area Rc satisfies the first specified condition or the second specified condition, depending on the size of the foreign matter. For example, the control unit CNT may determine that the first specified condition is satisfied if there are neither medium-sized foreign matter 202 nor large-sized foreign matter 203 in the contact area Rc, and that the second specified condition is satisfied if there are medium-sized foreign matter 202 but no large-sized foreign matter 203 in the contact area Rc.

[0046] If the foreign matter adhesion status of the contact area Rc satisfies the first specified condition, the process proceeds to step S109. In step S109, the control unit CNT transports the original plate R onto the original plate stage 2 at the first transport speed (high speed) using the second transport mechanism 14. In this case, the forming apparatus 100a performs the exposure process using the original plate R as usual.

[0047] On the other hand, if the foreign matter adhesion status of the contact area Rc does not satisfy the first specified condition but satisfies the second specified condition, the process proceeds to step S110. In step S110, the control unit CNT transports the original plate R onto the original plate stage 2 at the second transport speed (low speed) using the second transport mechanism 14. In this case, the forming apparatus 100a performs the exposure process using the original plate R as usual. In addition, the control unit CNT notifies the user via the user interface UI that the amount of foreign matter adhering to the original plate R has increased. This notification may be given, for example, after the exposure process is completed.

[0048] If the foreign matter adhesion status of the contact area Rc does not satisfy either the first or second specified condition, the process proceeds to step S111. In step S111, the control unit CNT transports the original plate R to the pod openers 7 and 8 using the first transport mechanism 9, and removes the original plate R from the exposure apparatus 100. In this case, no exposure processing is performed using the original plate R. The control unit CNT then notifies the user via the user interface UI that the original plate R cannot be transported onto the original plate stage 2 by the second transport mechanism 14 due to the amount of foreign matter adhering to the original plate R (error notification). The control unit CNT may also provide a notification to prompt cleaning of the original plate R. Here, in step S111, the original plate R is transported to the pod openers 7 and 8, so the destination of the original plate R is different from that in steps S109 to S110, where it is transported to the original plate stage 2. That is, the destination of the original plate R is changed according to the foreign matter adhesion status of the contact area Rc.

[0049] As described above, the original plate transport device 100b of this embodiment determines the foreign matter adhesion status of the contact area Rc on the surface of the original plate R from the foreign matter adhesion distribution, and controls the transport of the original plate R by the second transport mechanism 14 according to the foreign matter adhesion status of the contact area Rc. This makes it possible to appropriately control the transport of the original plate R by the second transport mechanism 14. Here, in this embodiment, the upper surface of the original plate R is exemplified as the surface of the original plate R that the hand 14a of the second transport mechanism 14 contacts, but it may also be the lower surface of the original plate R. In this case, the transport of the original plate R by the second transport mechanism 14 can be controlled according to the foreign matter adhesion status obtained by the foreign matter inspection device 12 for the lower surface of the original plate R.

[0050] <Second Embodiment> A second embodiment of the present invention will now be described. In the first embodiment described above, an example was given in which the foreign matter inspection device 12 performed a foreign matter inspection on the entire surface of the original plate R. In this embodiment, an example will be given in which a foreign matter inspection was performed on the surrounding area R2 of the surface of the original plate R without performing a foreign matter inspection on the pattern area R1. This embodiment basically follows the first embodiment, and can be followed in all respects except for the matters mentioned below.

[0051] Figure 7 is a flowchart of the foreign matter inspection (i.e., measurement of foreign matter adhesion distribution) performed in step S103 of Figure 6 in this embodiment. In this embodiment, the foreign matter inspection may be performed only on the peripheral region R2 of the surface of the original plate R. The foreign matter inspection of this embodiment will be described below according to the coordinate system shown in Figures 5A to 5B. Herein, in this embodiment, steps S104 to S105 may be omitted in the flowchart of Figure 6. Also, steps S102 to S103 may be performed between steps S106 and S107.

[0052] In step S201, the control unit CNT performs a foreign object inspection by driving the original plate R and the foreign object detection unit 120 relative to each other in the X direction at a first drive speed (low speed) in the range of coordinates -80 to -60 in the X direction. This allows the distribution of foreign object adhesion in the range of coordinates -80 to -60 in the X direction to be obtained. Here, the range of coordinates -80 to -60 in the X direction corresponds to the surrounding region R2 on the surface of the original plate R that includes the contact region Rc. The first drive speed can be set to the relative speed between the original plate R and the foreign object detection unit 120, which can perform the foreign object inspection by the foreign object detection unit 120.

[0053] In step S202, the control unit CNT drives the original plate R and the foreign object detection unit 120 relative to each other in the X direction at a second drive speed (high speed) that is faster than the first drive speed, within the range of X coordinates from -60 to +60. In step S202, no foreign object inspection is performed by the foreign object detection unit 120. Therefore, the relative drive speed between the original plate R and the foreign object detection unit 120 can be set to a second drive speed that is faster than the first drive speed, which can be advantageous in terms of throughput. Here, the range of X coordinates from -60 to +60 corresponds to the pattern area R1 on the surface of the original plate R. Furthermore, it is preferable that the second drive speed be set to a speed faster than the maximum relative speed between the original plate R and the foreign object detection unit 120 at which foreign object inspection can be performed by the foreign object detection unit 120.

[0054] In step S203, the control unit CNT performs a foreign object inspection by driving the original plate R and the foreign object detection unit 120 relative to each other in the X direction at a third drive speed (low speed) in the range of X coordinates +60 to +80. This allows the foreign object adhesion distribution in the range of X coordinates +60 to +80 to be obtained. Here, the range of X coordinates +60 to +80 corresponds to the surrounding region R2 on the surface of the original plate R that includes the contact region Rc. The third drive speed can be set to the relative speed between the original plate R and the foreign object detection unit 120, which can perform the foreign object inspection by the foreign object detection unit 120. The third drive speed is slower than the second drive speed and may be the same as the first drive speed.

[0055] As described above, in the second embodiment, for the range corresponding to the surrounding region R2 (coordinates in the X direction -80 to -60 and +60 to +80), foreign object inspection is performed while driving the original plate R and the foreign object detection unit 120 relative to each other in the X direction at the first drive speed or the third drive speed (low speed). On the other hand, for the range corresponding to the pattern region R1 (coordinates in the X direction -60 to +60), the original plate R and the foreign object detection unit 120 are driven relative to each other in the X direction at the second drive speed (high speed), but no foreign object inspection is performed. This allows for appropriate inspection of foreign objects in the surrounding region R2 on the surface of the original plate R, and may also be advantageous in terms of throughput.

[0056] <Third Embodiment> A third embodiment of the present invention will now be described. In this embodiment, an example will be described in which, based on the results of performing a foreign matter inspection (measurement of foreign matter adhesion distribution) on the original plate R multiple times using a foreign matter inspection device 12, the time when the foreign matter adhesion status of the contact area Rc will no longer meet predetermined conditions for transport by the second transport mechanism 14 will be predicted and notified. The predetermined conditions may include at least one of the first specified conditions and the second specified conditions. In the following, both the first specified conditions and the second specified conditions will be described as examples of predetermined conditions. Note that this embodiment basically follows the first embodiment, and matters other than those mentioned below may be followed in accordance with the first embodiment. Furthermore, the second embodiment may also be applied in this embodiment.

[0057] Figure 8 is a flowchart showing a method for predicting and notifying the time when the foreign matter adhesion status of the contact area Rc will no longer meet predetermined conditions (first specified condition, second specified condition). The flowchart in Figure 8 can be executed by the control unit CNT. Here, in step S108 of Figure 6, the control unit CNT stores the foreign matter adhesion status obtained for the contact area Rc of the original plate R in the storage unit in correspondence with the number of times the original plate R is transported by the second transport mechanism 14. The flowchart in Figure 8 can be executed, for example, each time the foreign matter adhesion status of the contact area Rc is determined in step S108.

[0058] In step S301, the control unit CNT obtains the relationship between the number of transports by the second transport mechanism 14 and the foreign matter adhesion status of the contact area Rc. As described above, the foreign matter adhesion status may be the area occupancy rate of the foreign matter in the contact area Rc, or the amount or size of the foreign matter in the contact area Rc may be used.

[0059] In step S302, the control unit CNT predicts the time (number of transports) when the foreign matter adhesion status of the contact area Rc will no longer satisfy a predetermined condition, based on the relationship between the number of transports and the foreign matter adhesion status obtained in step S301. Figure 9 shows an example of the relationship between the number of transports and the foreign matter adhesion status. For example, the control unit CNT obtains an approximation function 31 (e.g., an approximation line) for the relationship 30 between the number of transports and the foreign matter adhesion status obtained so far. Based on this approximation function 31, the control unit CNT can predict the time T1 (number of transports) when the first predetermined condition will be reached, and the time T2 (number of transports) when the second predetermined condition will be reached. Note that time T2 may be understood as the time when the original plate R should be cleaned.

[0060] In step S303, the control unit CNT notifies the user interface UI of the predicted times T1 and T2 in step S302. For example, the control unit CNT may notify by displaying the times T1 and T2 on the user interface UI display. In this embodiment, an example has been described in which both the time T1 when the first defined condition is reached and the time T2 when the second defined condition is reached are notified, but the system is not limited to this, and only time T2 may be notified. Alternatively, only time T1 may be notified.

[0061] As described above, in this embodiment, based on the relationship between the number of transports and the foreign matter adhesion status obtained so far, the time when the foreign matter adhesion status in the contact area Rc of the original plate R will no longer meet predetermined conditions is predicted and notified. This allows the user (operator) to take appropriate measures, such as cleaning the original plate R, before the foreign matter adhesion status in the contact area Rc no longer meets predetermined conditions.

[0062] <Fourth Embodiment> A fourth embodiment of the present invention will be described. In this embodiment, an example will be described in which predetermined conditions for determining whether or not to transport the original plate R by the second transport mechanism 14 in accordance with the displacement of the original plate R transported on the original plate stage 2 (on the member) by the second transport mechanism 14 are changed. The predetermined conditions may include at least one of the first predetermined condition and the second predetermined condition. In the following, both the first predetermined condition and the second predetermined condition will be described as examples. Note that this embodiment basically follows the first embodiment, and may follow the first embodiment except for matters mentioned below. In addition, the second embodiment or the third embodiment may be applied in this embodiment.

[0063] Figure 10 is a flowchart showing a method for changing predetermined conditions according to the misalignment of the master plate R transported onto the master plate stage 2 by the second transport mechanism 14. The flowchart in Figure 10 may be executed by the control unit CNT after the master plate R has been transported onto the master plate stage 2 via step S109 or step S110 in the flowchart of Figure 6. Here, the exposure apparatus 100 (forming apparatus 100a) of this embodiment may be provided with a detection unit 15 for detecting the position of the master plate R on the master plate stage 2, as shown in Figure 1. The detection unit 15 may be understood as detecting the misalignment (hereinafter sometimes referred to as transport position misalignment) between the target position on the master plate stage 2 where the master plate R should be transported (placed) and the position where the master plate R is actually transported by the second transport mechanism 14. For example, the detection unit 15 may be configured to detect the transport position misalignment by detecting alignment marks provided on the master plate R.

[0064] If a misalignment occurs in the transport position of the original plate R transported onto the original plate stage 2 by the second transport mechanism 14, it is possible that the original plate R slipped from the hand 14a while being transported by the second transport mechanism 14, causing a shift in the relative position between the hand 14a and the original plate R. In this case, the predetermined conditions (first specified condition, second specified condition) for determining whether or not to transport the original plate R by the second transport mechanism 14 may not be appropriate. Therefore, in this embodiment, the misalignment of the transport position of the original plate R on the original plate stage 2 is detected, and the predetermined conditions are changed based on that misalignment.

[0065] In step S401, the control unit CNT detects the misalignment of the transport position of the master plate R using the detection unit 15. In step S402, the control unit CNT corrects the misalignment of the transport position of the master plate R. Next, in step S403, the control unit CNT performs the exposure process.

[0066] In step S404, the control unit CNT determines whether the misalignment of the transport position of the original plate R detected in step S401 is within the acceptable range. If the misalignment of the transport position of the original plate R is within the acceptable range, the process ends; if the misalignment of the transport position of the original plate R is outside the acceptable range, the process proceeds to step S405. In step S405, the control unit CNT changes the predetermined conditions (first specified condition, second specified condition) for determining whether or not to transport the original plate R by the second transport mechanism 14. For example, if the misalignment of the transport position of the original plate R is outside the acceptable range, the control unit CNT determines that the relative position between the hand 14a and the original plate R has shifted during transport of the original plate R by the second transport mechanism 14, and changes the predetermined conditions to be stricter. As an example, if the area occupancy rate of foreign matter in the contact area Rc is used as the foreign matter adhesion status, the control unit CNT may change the first specified value regarding the area occupancy rate of foreign matter in the contact area Rc from less than 3% to less than 2% as the first specified condition. Furthermore, the control unit CNT changes the second specified value for the area occupancy rate of foreign matter in the contact area Rc from less than 10% to less than 8% as a second specified condition.

[0067] As described above, in this embodiment, predetermined conditions (first defined condition, second defined condition) for determining whether or not to transport the original plate R by the second transport mechanism 14 are changed according to the displacement of the transport position of the original plate R transported onto the original plate stage 2 by the second transport mechanism 14. This makes it possible to appropriately control the transport of the original plate R by the second transport mechanism 14. Here, in this embodiment, steps S404 to S405 were performed after steps S402 to S403, but are not limited to this, and may be performed before steps S402 to S403, or in parallel with steps S402 to S403.

[0068] <Embodiment of Article Manufacturing Method> The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices, semiconductor devices, and elements having a microstructure. The article manufacturing method of this embodiment includes a formation step of forming a pattern on a substrate using the above-described lithography apparatus (exposure apparatus), a processing step of processing the substrate on which the pattern was formed in the formation step, and a manufacturing step of manufacturing an article from the substrate processed in the processing step. Furthermore, such an article manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0069] <Summary of Embodiments> The disclosures herein include at least the following conveying devices, lithography devices, and methods for manufacturing articles. (Item 1) A conveying device for transporting objects, A measuring unit for measuring foreign matter on the surface of the object, A conveying unit having a holding portion that contacts a part of the surface and holds the object, and conveying the object, which has been measured by the measuring unit as a foreign substance, while holding it with the holding portion, A control unit controls the transport of the object by the transport unit according to the foreign matter in the contact area of ​​the surface that the holding unit contacts, as determined from the measurement results by the measurement unit, A conveying device characterized by being equipped with the following features. (Item 2) The surface of the object includes a pattern region having a pattern to be transferred onto the substrate, and a peripheral region surrounding the pattern region and having the contact region. The transport device according to item 1, characterized in that the control unit further controls the transport of the object by the transport unit in accordance with the foreign matter in the pattern area determined from the measurement results by the measurement unit. (Item 3) The transport device according to item 1 or 2, characterized in that the control unit further controls the transport of the object by the transport unit based on the number of times the transport unit has transported the object. (Item 4) The system further includes a storage unit where the object is stored before measurement by the measuring unit, The transport device according to any one of items 1 to 3, characterized in that the control unit controls the transport of the object by the transport unit based on the period of time the object was stored in the storage unit. (Item 5) The conveying device according to any one of items 1 to 4, characterized in that the control unit changes the conveying speed of the object by the conveying unit according to the foreign matter in the contact area. (Item 6) The conveying device according to any one of items 1 to 5, characterized in that the control unit changes the destination of the object according to the foreign matter in the contact area. (Item 7) The conveying device according to any one of items 1 to 6, characterized in that the control unit determines the area occupancy rate of foreign matter in the contact area as the foreign matter adhesion status in the contact area from the measurement results. (Item 8) The conveying device according to any one of items 1 to 6, characterized in that the control unit determines at least one of the amount and size of foreign matter in the contact area as the foreign matter adhesion status in the contact area from the measurement results. (Item 9) The surface of the object includes a pattern region having a pattern to be transferred onto the substrate, and a peripheral region surrounding the pattern region and having the contact region. The conveying device according to any one of items 1 to 8, characterized in that the measuring unit measures the foreign matter over a range including the pattern area and the surrounding area. (Item 10) The surface of the object includes a pattern region having a pattern to be transferred onto the substrate, and a peripheral region surrounding the pattern region and having the contact region. The conveying device according to any one of items 1 to 8, characterized in that the measuring unit measures the foreign matter only in the surrounding area. (Item 11) The conveying device according to any one of items 1 to 10, characterized in that the control unit predicts and notifies the time when the foreign matter in the contact area will no longer meet the predetermined conditions for being conveyed by the conveying unit, based on the results of measurements taken multiple times on the object by the measuring unit. (Item 12) The conveying device according to any one of items 1 to 11, characterized in that the control unit conveys the object onto the member by the conveying unit when the foreign matter in the contact area determined from the measurement results satisfies predetermined conditions, and changes the predetermined conditions according to the displacement of the object conveyed onto the member by the conveying unit. (Item 13) A lithography apparatus for forming patterns on a substrate, The transport device is provided as described in any one of items 1 to 12. The lithography apparatus is characterized in that the transport device transports the substrate or a master plate having a pattern to be transferred to the substrate. (Item 14) A forming step of forming a pattern on a substrate using the lithography apparatus described in item 13, A processing step for processing the substrate on which the pattern has been formed in the forming step, A manufacturing process for producing an article from the substrate processed in the above-mentioned processing step, A method for manufacturing articles, characterized by including the following:

[0070] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0071] 100: Exposure device, 100a: Forming device, 100b: Conveying device, 9: First conveying mechanism, 12: Foreign object inspection device (measurement unit), 14: Second conveying device, CNT: Control unit, R: Master plate

Claims

1. A conveying device for transporting objects, A measuring unit for measuring foreign matter on the surface of the object, A conveying unit having a holding portion that contacts a part of the surface and holds the object, and conveying the object, which has been measured by the measuring unit as a foreign substance, while holding it with the holding portion, A control unit controls the transport of the object by the transport unit according to the foreign matter in the contact area of ​​the surface that the holding unit contacts, as determined from the measurement results by the measurement unit, A conveying device characterized by being equipped with the following features.

2. The surface of the object includes a pattern region having a pattern to be transferred onto the substrate, and a peripheral region surrounding the pattern region and having the contact region. The conveying device according to claim 1, characterized in that the control unit further controls the conveying of the object by the conveying unit in accordance with the foreign matter in the pattern area determined from the measurement results by the measurement unit.

3. The transport device according to claim 1, characterized in that the control unit further controls the transport of the object by the transport unit based on the number of times the transport unit has transported the object.

4. The system further includes a storage unit where the object is stored before measurement by the measuring unit, The transport device according to claim 1, characterized in that the control unit controls the transport of the object by the transport unit based on the period of time the object was stored in the storage unit.

5. The conveying device according to claim 1, characterized in that the control unit changes the conveying speed of the object by the conveying unit according to the foreign matter in the contact area.

6. The conveying device according to claim 1, characterized in that the control unit changes the destination of the object according to the foreign matter in the contact area.

7. The conveying device according to claim 1, characterized in that the control unit determines the area occupancy rate of foreign matter in the contact area as the foreign matter adhesion status in the contact area from the measurement results.

8. The conveying device according to claim 1, characterized in that the control unit determines at least one of the amount and size of foreign matter in the contact area as the foreign matter adhesion status in the contact area from the measurement results.

9. The surface of the object includes a pattern region having a pattern to be transferred onto the substrate, and a peripheral region surrounding the pattern region and having the contact region. The conveying device according to claim 1, characterized in that the measurement unit measures the foreign matter over a range including the pattern region and the surrounding region.

10. The surface of the object includes a pattern region having a pattern to be transferred onto the substrate, and a peripheral region surrounding the pattern region and having the contact region. The conveying device according to claim 1, characterized in that the measurement unit measures the foreign matter only in the surrounding area.

11. The conveying device according to claim 1, characterized in that the control unit predicts and notifies the time when the foreign matter in the contact area will no longer meet the predetermined conditions for being conveyed by the conveying unit, based on the results of measurements taken multiple times on the object by the measuring unit.

12. The conveying device according to claim 1, characterized in that the control unit conveys the object onto the member by the conveying unit when the foreign matter in the contact area determined from the measurement results satisfies predetermined conditions, and changes the predetermined conditions according to the displacement of the object conveyed onto the member by the conveying unit.

13. A lithography apparatus for forming patterns on a substrate, A conveying device according to any one of claims 1 to 12, The lithography apparatus is characterized in that the transport device transports the substrate or a master plate having a pattern to be transferred to the substrate.

14. A forming step of forming a pattern on a substrate using the lithography apparatus described in claim 13, A processing step for processing the substrate on which the pattern has been formed in the forming step, A manufacturing process for producing an article from the substrate processed in the above-mentioned processing step, A method for manufacturing articles, characterized by including the following:

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