Manufacturing method for leadless semiconductor package components

Abstract

To provide a manufacturing method for a leadless semiconductor package component which improves bond strength of lead and a plastic molding material, improves airtightness of the package component, and improves stability and quality of a package unit.SOLUTION: In a manufacturing method for a leadless semiconductor package component, a chip is mounted on a metal frame, and the metal frame includes two short metal connection bars; an upper metal contact point and a lower metal contact point are electrically connected to respective two X direction connection metal bars, bonding or soldering is performed; plastic package molding is performed; a Y direction connection bar is cut by a first cutter so as to expose whole side surfaces of a plurality of metal contact points; solderable metal layers are applied to all the plurality of metal contact points that are exposed in an electric plating step; a plastic molding material is cut with a second cutter having a diameter smaller than a diameter of the first cutter; and one semiconductor package component is obtained.SELECTED DRAWING: Figure 4

Claims

1. A chip is mounted on a metal frame, the metal frame includes two Y-direction connecting bars and two X-direction connecting bars connected to each other, each of the two Y-direction connecting bars is connected to a plurality of metal contacts, the plurality of metal contacts include at least an upper metal contact and a lower metal contact along the Y direction, the upper metal contact and the lower metal contact are electrically connected to the two X-direction connecting bars by being connected to two short metal connecting bars, respectively. Using a plastic molding material, a plastic package is formed on the metal frame on which the chip is mounted. The Y-direction connecting bar is cut by the first cutter without cutting the plastic molding material, until a portion of the plastic molding material is cut, so that the entire side surface of the Y-direction connecting bar is exposed to the plurality of metal contacts. A solderable metal layer is applied to all of the plurality of metal contacts exposed by the electroplating process, the plurality of metal contacts further include four right-side metal contacts, the upper metal contacts include three upper-left metal contacts, the lower metal contacts include a lower-left metal contact, the two X-direction connecting bars include an upper X-direction connecting bar and a lower X-direction connecting bar, the three upper-left metal contacts spaced apart during the electroplating process are electrically connected to one of the two short metal connecting bars, the current flowing from the upper X-direction connecting bar forms a series circuit, the current flowing from the lower X-direction connecting bar flows to the lower-left metal contact via the other of the two short metal connecting bars, the four right-side metal contacts located on the side of the chip soldering area receive the current flowing from the two X-direction connecting bars, To obtain one semiconductor package component, the plastic molding material is completely cut along the Y direction by a second cutter, and further, the plastic molding material and the two X-direction connecting bars are completely cut along the X direction, the width of the blade of the second cutter is smaller than the width of the blade of the first cutter. The three upper left metal contacts are spaced apart from the lower left metal contact, and the three upper left metal contacts and the lower left metal contact are not connected to the chip soldering area. In the step of forming the plastic package, a plurality of package units electrically connected to the Y-direction connecting bar and the X-direction connecting bar are further arranged on the metal frame, a chip soldering area is provided on each of the plurality of package units, and the three upper left metal contacts, the lower left metal contacts, and the four right metal contacts are provided on the left and right sides of the chip soldering area, respectively. The three upper left metal contacts and the lower left metal contact are positioned between the two short metal connecting bars. A method for manufacturing leadless semiconductor package components.

2. In the step of mounting the chip on the metal frame, the rear surface of the chip is further joined or soldered to the chip soldering area of ​​the metal frame. A method for manufacturing a leadless semiconductor package component according to claim 1.

3. In the step of mounting the chip onto the metal frame, the front surface of the chip is further joined to the upper metal contact by a clip. A method for manufacturing a leadless semiconductor package component according to claim 1.

4. In the step of mounting the chip onto the metal frame, the front surface of the chip is further connected to the lower metal contact by bonding or soldering with a ribbon. A method for manufacturing a leadless semiconductor package component according to claim 1.

5. In the step of cutting the Y-direction connecting bar with the first cutter, the cutting depth is equal to 1 / 3 of the thickness of the semiconductor package component. A method for manufacturing a leadless semiconductor package component according to claim 1.

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