Capacitor components

Abstract

To provide a capacitor component capable of achieving an improvement in electric capacity.SOLUTION: A capacitor component includes: a body 110 having a plurality of through-holes H penetrating through in a first direction; a first electrode 111 covering an inner wall of each of the plurality of through-holes; a first common electrode layer 211 covering a first surface S1 among the first surface and a second surface S2 which face each other in the body and are perpendicular to the first direction, the first common electrode layer being connected to the first electrode; a dielectric 112 arranged in the through-hole so as to be surrounded by the first electrode; a second electrode 113 formed in the through-hole so as to be surrounded by the dielectric; a second common electrode layer 212 covering the second surface of the body and connected to the second electrode; a first external electrode 131 disposed on at least one of a plurality of side surfaces that connect the first surface and the second surface in the body and connected to a side surface of the first common electrode layer; and a second external electrode 132 disposed on at least one of the plurality of side surfaces that connect the first surface and the second surface in the body and connected to a side surface of the second common electrode layer.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to capacitor components.

Background Art

[0002] Capacitors are mounted on printed circuit boards of various electronic products such as liquid crystal display (LCD) devices and plasma display panel (PDP) devices, computers, smartphones, and mobile phones, and serve to charge or discharge electricity. Recently, there has been a trend towards thinner mobile IT products such as smartphones and wearable devices, which has increased the need for thinner passive components to reduce the overall package thickness.

[0003] Due to such a trend, the demand for thin film capacitors that can achieve an even thinner thickness has also increased. Thin film capacitors have the advantage of being able to realize thin capacitors using thin film technology. In addition, thin film capacitors have the advantage of having a low ESL, unlike conventional multilayer ceramic capacitors, and their application to decoupling capacitors for application processors (APs) has recently been under consideration. Thin film capacitors are manufactured in the form of land-side capacitors (LSCs) for use in such decoupling capacitors for APs.

[0004] On the other hand, trench-type capacitors have been developed to increase the capacitance in a limited space. This method involves forming a trench in a silicon substrate before forming the capacitor structure. While trench capacitors are suitable for increasing capacitance by increasing the surface area of ​​the electrodes, they require complex semiconductor process technology. Furthermore, considering the dielectric thickness required to meet the voltage withstand requirements, it is difficult to form a large number of dielectrics within the trench, making it challenging to achieve ultra-high capacitance. [Overview of the project] [Problems that the invention aims to solve]

[0005] One of the objectives of the present invention is to provide a capacitor component in which capacitance can be improved by having a large surface area in the capacitor region. [Means for solving the problem]

[0006] As a method for solving the above problems, the present invention proposes a novel structure for a capacitor component, specifically comprising: a body having a number of through-holes penetrating in a first direction; a first electrode covering the inner wall of the through-holes; a first common electrode layer covering the first of two faces perpendicular to the first direction, facing each other on the body, and connected to the first electrode; a dielectric disposed in the through-holes so as to be surrounded by the first electrode; a second electrode formed in the through-holes so as to be surrounded by the dielectric; a second common electrode layer covering the second face of the body and connected to the second electrode; a first external electrode disposed on at least one of a number of sides connecting the first and second faces on the body and connected to the side of the first common electrode layer; and a second external electrode disposed on at least one of a number of sides connecting the first and second faces on the body and connected to the side of the second common electrode layer.

[0007] In one embodiment, the first electrode and the first common electrode layer can be an integrated structure.

[0008] In one embodiment, the second electrode and the second common electrode layer can be an integrated structure.

[0009] In one embodiment, the dielectric material may be an extended form that covers the second surface of the main body.

[0010] In one embodiment, the region covering the second surface of the main body with the dielectric material can be arranged between the main body and the second common electrode layer.

[0011] In one embodiment, the region covering the second surface of the main body with the dielectric material can be in contact with the second surface of the main body.

[0012] In one embodiment, the numerous through-holes can be arranged regularly in a lattice structure.

[0013] In one embodiment, the system may further include an insulating layer positioned outside the first and second common electrode layers in the first direction and covering the first and second common electrode layers.

[0014] In one embodiment, the first common electrode layer may be connected to the first external electrode on the first surface side of the main body, but not connected to the second external electrode.

[0015] In one embodiment, the second common electrode layer may be connected to the second external electrode on the second surface side of the main body, but not connected to the first external electrode.

[0016] In one embodiment, the length of the second electrode can be made longer than the length of the through-hole, with respect to the length in the first direction.

[0017] In one embodiment, the first and second external electrodes may be in a form that extends from the side surface of the main body to the first and second surfaces.

[0018] In one embodiment, a first connection layer can be further included, which is disposed between the first common electrode layer and the first external electrode on the first surface side of the main body and connects them. A second connection layer can also be further included, which is disposed between the second common electrode layer and the second external electrode on the second surface side of the main body and connects them.

[0019] In one embodiment, the first and second external electrodes can be disposed on the same side surface of the main body.

[0020] In one embodiment, the first external electrode extends to cover and connect with the first common electrode layer on the first surface side of the main body, and the second external electrode extends to cover and connect with the second common electrode layer on the second surface side of the main body.

[0021] In one embodiment, the dielectric can be in a form that extends and is disposed between the first common electrode layer and the second electrode.

Advantages of the Invention

[0022] In the case of the capacitor component according to an example of the present invention, the capacitance can be improved because the capacitor region has a large surface area.

Brief Description of the Drawings

[0023] [Figure 1] It is a perspective view schematically showing the appearance of a capacitor component according to an embodiment of the present invention. [Figure 2] It is a cross-sectional view of FIG. 1. [Figure 3] The drawing shows the main components of the capacitor component separated in the embodiment of FIG. 1. [Figure 4] [Figure 4] The drawing shows the main components of the capacitor component separated in the embodiment of FIG. 1. [Figure 5] The drawing shows the main components of the capacitor component separated in the embodiment of FIG. 1. [Figure 6]This is a drawing showing the main components of the capacitor component separated in the embodiment of FIG. 1. [Figure 7] This is a drawing showing a capacitor component according to a modified example. [Figure 8] This is a drawing showing a capacitor component according to a modified example. **Embodiments for Carrying Out the Invention**

[0024] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0025] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and in order to clearly represent a plurality of layers and regions, the thickness is enlarged and shown, and components having the same function within the scope of the same idea are described with the same reference numerals. Further, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless there is a particularly contrary description.

[0026] FIG. 1 is a perspective view schematically showing the appearance of a capacitor component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of FIG. 1, and FIGS. 3 to 6 are drawings showing the main components of the capacitor component separated in the embodiment of FIG. 1.

[0027] Referring to Figures 1 and 2, the capacitor component 100 according to one embodiment of the present invention includes a body 110 having a number of through-holes H, a first electrode 111, a first common electrode layer 211, a dielectric 112, a second electrode 113, a second common electrode layer 212, and external electrodes 131 and 132, wherein the first common electrode layer 211 is connected to the first external electrode 131 from the side, and the second common electrode layer 212 is connected to the second external electrode 132 from the side.

[0028] The main components of the capacitor component 100 will be described below with reference to Figures 3 to 6. In Figures 3 to 6, the internal shape of some of the numerous through-holes H is shown by dotted lines, and it goes without saying that other through-holes H that are not shown have the same shape. The main body 110 has a large surface area due to having numerous through-holes H that penetrate in the first direction (X direction). As shown in the illustrated configuration, the numerous through-holes H can completely penetrate the main body 110 in the first direction (X direction), thereby maximizing the surface area of ​​the capacitor region and effectively increasing the capacitance of the capacitor component 100. Here, the capacitor region corresponds to the region that functions as a capacitor, including the first electrode 111, the dielectric 112, and the second electrode 113. As an example, as shown in Figure 3, the through-holes H can be realized in a cylindrical shape. In addition, the numerous through-holes H can be regularly arranged in a lattice structure.

[0029] The main body 110 can be formed from an electrically insulating material, such as silicon or ceramic, and the through-hole H can be formed in the main body 110 by methods such as laser processing. In addition, the main body 110 can be an anodized material obtained by anodizing a metal; for example, the main body 110 can be formed by anodizing valve metals such as aluminum (Al), zirconium (Zr), titanium (Ti), or tungsten (W). The through-hole H can then be formed during the anodizing process of the main body 110.

[0030] The first electrode 111 covers the inner wall of the through-hole H in the main body 110 and constitutes part of the electrode portion of the capacitor. The first electrode 111 can be made of a metal with excellent electrical conductivity such as Ag, Cu, Pt, or Ni, and processes such as atomic layer deposition (ALD) can be used to effectively form it on the inner wall of the fine through-hole H. The first common electrode layer 212 covers the first surface S1 of the two surfaces S1 and S2 that face each other in the main body 110 and are perpendicular to the first direction (X direction), and is connected to the first electrode 111. The first common electrode layer 212 can be formed, for example, by applying a conductive paste containing metal. Furthermore, the first electrode 111 and the first common electrode layer 212 can be formed as an integrated structure, so that the first electrode 111 and the first common electrode layer 212 can be formed in the same process.

[0031] The dielectric 112 is positioned within the through-hole H, surrounded by the first electrode 111. The dielectric layer 112 can be formed from a dielectric material, such as alumina (Al2O3), SiO2, Sn3N4, ZrO2, CaTiO3, SrTiO3, (Ba,Sr)TiO3, or BaTiO3. In this case, the insulating properties can be improved by forming the dielectric 112 from multiple materials. As shown in the illustrated configuration, the dielectric 112 can be extended to cover the second surface S2 of the main body 110. The region of the dielectric 112 that covers the second surface S2 of the main body 110 can be positioned between the main body 110 and the second common electrode layer 212. Furthermore, the region of the dielectric 112 that covers the second surface S2 of the main body 110 can be in contact with the second surface S2 of the main body 110.

[0032] The second electrode 113 is formed so as to be surrounded by the dielectric 112 within the through-hole H. The second common electrode layer 212 covers the second surface S2 of the main body 110 and is connected to the second electrode 113. The second electrode 113 constitutes the electrode portion of the capacitor section and, by filling the through-hole H, can have a large surface area, thereby increasing the capacitance of the capacitor component 100. The second electrode 113 can be formed by filling the through-hole H with conductive paste or by a plating process. Alternatively, the second electrode 113 can be formed using a conductive polymer. The second common electrode layer 213 can be formed, for example, by applying a conductive paste containing metal. Furthermore, the second electrode 113 and the second common electrode layer 213 can be formed as an integrated structure, allowing the second electrode 113 and the second common electrode layer 212 to be formed in the same process.

[0033] In the configuration described above, the second electrode 113 can be formed to be even longer than the through-hole H. That is, as shown in Figure 2, the length L2 of the second electrode 113, which is positioned on the innermost side of the through-hole H, can be even longer than the length L1 of the through-hole H, based on the length in the first direction (X direction).

[0034] The first external electrode 131 is positioned on at least one of a number of sides of the main body 110 that connect the first surface S1 and the second surface S2, and in this embodiment, an example is shown where it covers three sides. The first external electrode 131 can also have a form that extends from the side of the main body 110 to the first surface S1 and the second surface S2. The first external electrode 131 is connected to the side of the first common electrode layer 211, and in Figure 2, the contact area between the first external electrode 131 and the first common electrode layer 211 is indicated by C1. As a specific example, the first common electrode layer 211 may be connected to the first external electrode 131 on the first surface S1 side of the main body 110, but not connected to the second external electrode 132.

[0035] Similarly, the second external electrode 132 is positioned on at least one of a number of sides of the main body 110 that connect the first surface S1 and the second surface S2, and in this embodiment, an example is shown where it covers three sides. The second external electrode 132 can also have a form that extends from the side of the main body 110 to the first surface S1 and the second surface S2. The second external electrode 132 is connected to the side of the second common electrode layer 212, and in Figure 2, the contact area between the second external electrode 132 and the second common electrode layer 212 is indicated by C2. As a specific example, the second common electrode layer 212 may be connected to the second external electrode 132 on the second surface S2 side of the main body 110, but not connected to the first external electrode 132.

[0036] On the other hand, the first and second external electrodes 131 and 132 can be formed by methods such as manufacturing a paste containing a conductive metal and then applying it to the main body 110. Examples of conductive metals include nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or alloys thereof. Here, the first and second external electrodes 131 and 132 may further include a plating layer containing Ni, Sn, etc.

[0037] The insulating layer 121 is positioned outside the first and second common electrode layers 211 and 212 in the first direction (X direction), covering the first and second common electrode layers 211 and 212, and can function to protect the above-mentioned components as a whole. For this purpose, as shown in the configuration in Figure 1, the insulating layer 121 can also cover the sides of the main body. As described above, the first common electrode layer 211 does not need to be connected to the second external electrode 132 on the first surface S1 side of the main body 110, and for this reason, the insulating layer 121 can be positioned between the first common electrode layer 211 and the second external electrode 132 as shown in the diagram. Also, the second common electrode layer 212 does not need to be connected to the first external electrode 131 on the second surface S2 side of the main body 110, and for this reason, the insulating layer 121 can be positioned between the second common electrode layer 212 and the first external electrode 131. The insulating layer 121 can be formed from metal oxides such as SiO2, TiO2, and Al2O3, or from ceramics, and can also be formed from polymers.

[0038] Hereinafter, modified examples of the present invention will be described with reference to Figures 7 and 8. First, in the embodiment shown in Figure 7, the only difference from the previous embodiment is the connection area between the common electrode layers 211, 212 and the external electrodes 131, 132. Specifically, a first connection layer 311 is provided on the first surface S1 side of the main body 110, and the first connection layer 311 is positioned between the first common electrode layer 211 and the first external electrode 131, allowing them to be connected. In this case, the first connection layer 311 can be positioned at the same level as the insulating layer 121 with respect to the first surface S1 of the main body 110. Then, a second connection layer 312 is provided on the second surface S2 side of the main body 110, and the second connection layer 312 is positioned between the second common electrode layer 212 and the second external electrode 132, allowing them to be connected. In this case, the second connection layer 312 can be positioned at the same level as the insulating layer 121 with respect to the second surface S2 of the main body 110.

[0039] Next, in the embodiment shown in Figure 8, there are differences in the specific shapes of the external electrodes 231 and 232. As shown in the illustrated form, the first and second external electrodes 231 and 232 can be arranged on the same side surface of the main body 110. In this case, the first external electrode 231 includes the side cover region 233 of the main body 110, thereby covering the first common electrode layer 211 on the first surface S1 side of the main body 110 and including an extended region 234 that connects to it. The second external electrode 232 also includes the side cover region 235 of the main body 110, thereby covering the second common electrode layer 212 on the second surface S2 side of the main body 110 and including an extended region 236 that connects to it. As the shapes of the first and second external electrodes 231 and 232 are modified, the shape of the dielectric 112 can also change. Specifically, the dielectric 112 can be in a form that extends to be arranged between the first common electrode layer 211 and the second electrode 113, and one region corresponding to this is represented by A. As in this embodiment, by deforming the external electrodes 231 and 232, the capacitor component can be used as a bottom electrode structure, and this corresponds to a configuration in which the capacitor component is mounted using the side forming regions 233 and 235 of the main body 110, among the first and second external electrodes 231 and 232.

[0040] The present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, it is obvious to those with ordinary skill in the art that various forms of substitution, modification, and alteration are possible without departing from the technical idea of ​​the present invention as described in the claims, and this also falls under the technical idea described in the claims. [Other adjacent items] [Item 1] A body having numerous through-holes penetrating in a first direction, A first electrode covering the inner wall of the through-hole, In the main body, a first common electrode layer is provided, which covers the first of the two surfaces perpendicular to the first direction, and is connected to the first electrode, while facing each other. A dielectric is placed in the through-hole so as to be surrounded by the first electrode, A second electrode is formed in the through-hole so as to be surrounded by the dielectric, A second common electrode layer covers the second surface of the main body and is connected to the second electrode, The main body includes a first external electrode, which is positioned on at least one of the numerous sides connecting the first and second surfaces and connected to the side of the first common electrode layer, A capacitor component comprising: a second external electrode disposed on at least one of a number of sides connecting the first and second surfaces of the main body and connected to the side of the second common electrode layer. [Item 2] The capacitor component described in item 1, wherein the first electrode and the first common electrode layer are integrally structured. [Item 3] The capacitor component described in item 1, wherein the second electrode and the second common electrode layer are integrally structured. [Item 4] The capacitor component described in item 1, wherein the dielectric material is an extension that covers the second surface of the main body. [Item 5] The region covering the second surface of the main body in the dielectric is the capacitor component described in item 4, disposed between the main body and the second common electrode layer. [Item 6] The region covering the second surface of the main body in the dielectric is a capacitor component as described in item 4, in contact with the second surface of the main body. [Item 7] The aforementioned numerous through-holes are arranged regularly in a grid structure, as described in item 1, for the capacitor component. [Item 8] The capacitor component according to item 1, further comprising an insulating layer disposed outside the first common electrode layer and the second common electrode layer in the first direction and covering the first common electrode layer and the second common electrode layer. [Item 9] The capacitor component described in item 1, wherein the first common electrode layer is connected to the first external electrode on the first surface side of the main body, but is not connected to the second external electrode. [Item 10] The capacitor component described in item 1, wherein the second common electrode layer is connected to the second external electrode on the second surface side of the main body and not connected to the first external electrode. [Item 11] A capacitor component as described in item 1, wherein the length of the second electrode is longer than the length of the through-hole, with respect to the length in the first direction. [Item 12] The capacitor component according to item 1, wherein the first external electrode and the second external electrode are in a form that extends from the side surface to the first and second surfaces of the main body. [Item 13] A first connecting layer is provided on the first surface side of the main body, positioned between the first common electrode layer and the first external electrode, and connecting them. The capacitor component according to item 12, further comprising a second connecting layer disposed between the second common electrode layer and the second external electrode on the second surface side of the main body, and connecting them. [Item 14] The first external electrode and the second external electrode are capacitor components according to any one of items 1 to 13, arranged on the same side surface of the main body. [Item 15] The first external electrode extends to connect with the first common electrode layer on the first surface side of the main body, covering it as it is located. The capacitor component described in item 14, wherein the second external electrode is extended to connect with the second common electrode layer on the second surface side of the main body while covering it. [Item 16] The capacitor component according to item 15, wherein the dielectric is in an extended form so as to be positioned between the first common electrode layer and the second electrode. [Explanation of symbols]

[0041] 100 Capacitor Components 110 Main Unit 111 1st electrode 112 Dielectrics 113 2nd electrode 121 Insulating layer 211 1st common electrode layer 212 Second common electrode layer 131 1st external electrode 132 2nd external electrode 311 First Connectivity Layer 312 Second Connection Layer

Claims

1. A body having numerous through-holes penetrating in a first direction, A first electrode covering the inner wall of the through-hole, In the main body, a first common electrode layer covers the first of the two surfaces perpendicular to the first direction, while facing each other, and is connected to the first electrode. A dielectric material is placed in the through-hole so as to be surrounded by the first electrode, A second electrode is formed in the through-hole so as to be surrounded by the dielectric, A second common electrode layer covers the second surface of the main body and is connected to the second electrode, The main body includes a first external electrode, which is positioned on at least one of the numerous side surfaces connecting the first and second surfaces and connected to the side surface of the first common electrode layer, The main body includes a second external electrode, which is positioned on at least one of the numerous side surfaces connecting the first and second surfaces and connected to the side surface of the second common electrode layer, The first external electrode is connected to the first common electrode layer at at least one of the plurality of sides on which the first external electrode is arranged. The second external electrode is connected to the second common electrode layer at at least one of the numerous sides on which the second external electrode is located. A capacitor component in which at least one of the first external electrode and the second external electrode is in contact with the dielectric.

2. The capacitor component according to claim 1, wherein the first electrode and the first common electrode layer are integrally structured.

3. The capacitor component according to claim 1, wherein the second electrode and the second common electrode layer are integrally structured.

4. The capacitor component according to claim 1, wherein the dielectric material is extended to cover the second surface of the main body.

5. The capacitor component according to claim 4, wherein the region covering the second surface of the main body in the dielectric is disposed between the main body and the second common electrode layer.

6. The capacitor component according to claim 4, wherein the region covering the second surface of the main body in the dielectric is in contact with the second surface of the main body.

7. The capacitor component according to claim 1, wherein the numerous through-holes are regularly arranged in a grid structure.

8. The capacitor component according to claim 1, further comprising an insulating layer disposed outside the first common electrode layer and the second common electrode layer in the first direction and covering the first common electrode layer and the second common electrode layer.

9. The capacitor component according to claim 1, wherein the first common electrode layer is connected to the first external electrode on the first surface side of the main body, but is not connected to the second external electrode.

10. The capacitor component according to claim 1, wherein the second common electrode layer is connected to the second external electrode on the second surface side of the main body and is not connected to the first external electrode.

11. The capacitor component according to claim 1, wherein the length of the second electrode is further longer than the length of the through-hole with respect to the length in the first direction.

12. The capacitor component according to claim 1, wherein the first external electrode and the second external electrode are in a form that extends from the side surface to the first surface and the second surface of the main body.

13. A first connecting layer is disposed between the first common electrode layer and the first external electrode on the first surface side of the main body, connecting them together. The capacitor component according to claim 12, further comprising a second connecting layer disposed between the second common electrode layer and the second external electrode on the second surface side of the main body, and connecting them.

14. The capacitor component according to any one of claims 1 to 13, wherein the first external electrode and the second external electrode are arranged on the same side surface of the main body.

15. The first external electrode extends on the first surface side of the main body so as to cover and connect with the first common electrode layer, The capacitor component according to claim 14, wherein the second external electrode is extended to connect with the second common electrode layer while covering it on the second surface side of the main body.

16. The capacitor component according to claim 15, wherein the dielectric is in an extended form so as to be disposed between the first common electrode layer and the second electrode.

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