Semiconductor device and method for manufacturing a semiconductor device

Abstract

To realize a highly reliable semiconductor device.SOLUTION: A semiconductor module 10 (semiconductor device) includes a case 11, a laminate 16, and a beam portion 17. The case 11 is frame-shaped and has a concave portion 11a on one side thereof. The laminate 16 has a structure in which a terminal 13, an insulating sheet 14, and a terminal 15 are laminated in order, and is arranged in a recess 11a of the case 11. The beam portion 17 is fixed to the recess 11a of the case 11 and fixes the laminate 16 arranged in the recess 11a. The case 11, the laminate 16, and the beam portion 17 are separately prepared and assembled. This prevents the insulating sheet 14 from coming into contact with a case resin material, which becomes relatively hot during molding, as in the case of insert-molding the laminate 16, thereby preventing the deterioration of the insulating sheet 14 and the deterioration of insulation failure between the terminals 13 and 15 to enhance the reliability of the semiconductor module 10.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a semiconductor device and a method for manufacturing a semiconductor device.

Background Art

[0002] Regarding a semiconductor device, there is a technique of storing a semiconductor unit including a ceramic circuit board and a semiconductor chip provided thereon in a case using a resin material such as polyphenylene sulfide (PPS) resin, and a technique of providing a terminal laminated portion in such a case in which a first power terminal, an insulating member, and a second power terminal are laminated in this order (Patent Document 1).

[0003] Also, there is a technique of providing a terminal block in which a plurality of main terminals and insulating paper inserted between the main terminals are fixed to a resin line inside the case of the semiconductor device, and regarding the formation of such a terminal block, holes are formed in the main terminals and the insulating paper, and at the time of molding the resin line using a mold, the main terminals and the insulating paper are fixed to the resin line by integrally molding together with the resin injected into the holes (Patent Document 2).

[0004] Also, there is known a semiconductor device having a terminal laminated portion in which a first power terminal, a first insulating sheet, and a second power terminal are overlapped in this order, the first power terminal having a first bonding region electrically connected to a first connection terminal of a capacitor, the second power terminal having a second bonding region electrically connected to a second connection terminal of the capacitor, and the first insulating sheet having a terrace portion extending in a direction from the second bonding region toward the first bonding region in a plan view (Patent Document 3).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

[0006] In semiconductor devices where a laminate consisting of a first terminal, an insulating sheet, and a second terminal is sequentially stacked and provided in a case, the laminate is insert-molded during the molding of the case resin material, for example. However, in this method, if the insulating sheet included in the laminate is made of an insulating material with a lower heat resistance temperature than the molding temperature of the case resin material, the insulating sheet may deteriorate due to contact with the relatively high temperature of the case resin material during molding. If the insulating sheet deteriorates, it becomes difficult to ensure the insulation between the first terminal and the second terminal provided through it, potentially leading to insulation failure. This could make it difficult to ensure the reliability of the semiconductor device in which this laminate of the first terminal, insulating sheet, and second terminal is provided in a case.

[0007] In one aspect, the present invention aims to realize a highly reliable semiconductor device. [Means for solving the problem]

[0008] In one embodiment, the present invention includes a frame-shaped case having a recess on one side of the frame, a laminate in which a first terminal, an insulating sheet, and a second terminal are sequentially laminated and placed in the recess, a beam fixed to the recess of the case and fixing the laminate placed in the recess, a first adhesive interposed between the recess of the case and the laminate, and a second adhesive interposed between the laminate and the beam. The first terminal is provided on the first surface side of the insulating sheet so as to face a part of the insulating sheet, the second terminal is provided on the second surface side of the insulating sheet opposite to the first surface side so as to face a part of the insulating sheet, the laminate is arranged such that the first terminal is located on the bottom side of the recess of the case and the second terminal is located on the beam side, the bottom of the recess of the case has a first recess on the side facing the laminate in which the first terminal is housed, the portion of the side facing the laminate that does not have the first recess faces the first surface of the insulating sheet, the beam has a second recess on the side facing the laminate in which the second terminal is housed, the portion of the side facing the laminate that does not have the second recess faces the second surface of the insulating sheet Semiconductor devices are provided.

[0009] In another embodiment, the process includes the steps of: preparing a frame-shaped case having a recess on one side of the frame; preparing a beam portion that can be placed in the recess of the case; preparing a laminate in which a first terminal, an insulating sheet, and a second terminal are sequentially laminated; placing the laminate in the recess of the case; fixing the laminate by fixing the beam portion to the recess of the case in which the laminate is placed; bonding the recess of the case and the laminate using a first adhesive; and bonding the laminate and the beam portion using a second adhesive. The first terminal is provided on the first surface side of the insulating sheet so as to face a part of the insulating sheet, and the second terminal is provided on the second surface side of the insulating sheet opposite to the first surface side so as to face a part of the insulating sheet, and the step of arranging the laminate includes the step of arranging the laminate such that the first terminal is housed in a first recess provided on the side of the bottom of the recess of the case that faces the laminate, and the portion of the side facing the laminate that is not the first recess faces the first surface of the insulating sheet, and the step of fixing the beam portion to the recess of the case includes the step of fixing the beam portion such that the second terminal of the laminate placed in the recess is housed in a second recess provided on the side of the beam portion that faces the laminate, and the portion of the side facing the laminate that is not the second recess faces the second surface of the insulating sheet. A method for manufacturing a semiconductor device is provided. [Effects of the Invention]

[0010] In one respect, it becomes possible to realize highly reliable semiconductor devices. [Brief explanation of the drawing]

[0011] [Figure 1] This figure illustrates an example of a semiconductor device according to the first embodiment. [Figure 2] This figure shows an example of a connection between a semiconductor module and a capacitor according to the first embodiment. [Figure 3] This figure illustrates an example of a semiconductor module according to the first embodiment. [Figure 4] This figure illustrates an example of a semiconductor joule case according to the first embodiment. [Figure 5] This figure illustrates an example of a semiconductor joule stack according to the first embodiment. [Figure 6] This figure illustrates an example of a beam portion of a semiconductor joule according to the first embodiment. [Figure 7] This figure illustrates an example of the preparation process for a laminate according to the first embodiment. [Figure 8] This is a diagram (part 1) illustrating an example of the assembly process for the laminate and beam section according to the first embodiment. [Figure 9]It is a diagram (part 2) for explaining an example of an assembling process of a case, a laminate, and a beam portion according to the first embodiment. [Figure 10] It is a diagram for explaining an example of a semiconductor module according to the second embodiment. [Figure 11] It is a diagram (part 1) for explaining an example of a semiconductor module according to the third embodiment. [Figure 12] It is a diagram (part 2) for explaining an example of a semiconductor module according to the third embodiment. [Figure 13] It is a diagram for explaining an example of a semiconductor module according to the fourth embodiment. [Figure 14] It is a diagram (part 1) for explaining a configuration example of a laminate of a semiconductor module according to the fifth embodiment. [Figure 15] It is a diagram (part 2) for explaining a configuration example of a laminate of a semiconductor module according to the fifth embodiment. [Figure 16] It is a diagram for explaining an example of a manufacturing method of a semiconductor module according to the sixth embodiment.

Embodiments for Carrying Out the Invention

[0012] [First Embodiment] FIG. 1 is a diagram for explaining an example of a semiconductor device according to the first embodiment. FIG. 1 schematically shows a perspective view of a main part of an example of a semiconductor device.

[0013] The semiconductor device 1 shown in FIG. 1 includes a semiconductor module (also referred to as a “semiconductor device”) 10, a capacitor 20, and a connection member 30 for connecting them.

[0014] The semiconductor module 10 includes a case 11. Inside the case 11 of the semiconductor module 10, an insulating substrate and semiconductor elements mounted on the insulating substrate are accommodated.

[0015] Here, for example, PPS resin is used for the case 11 of the semiconductor module 10. In addition, polybutylene terephthalate (PBT) resin, polybutylene succinate (PBS) resin, polyamide (PA) resin, acrylonitrile butadiene styrene (ABS) resin, etc., may be used for the case 11 of the semiconductor module 10. Using such resin material, the case 11 of the semiconductor module 10 is formed, for example, by injection molding.

[0016] The insulating substrate housed within the case 11 of the semiconductor module 10 may be, for example, a ceramic substrate with a predetermined pattern of conductive layers on both main surfaces. The ceramic substrate may be made of alumina, alumina-based composite ceramics, aluminum nitride, silicon nitride, or the like. The conductive layer may be made of metal such as copper or aluminum. The insulating substrate may also be a Direct Copper Bonding (DCB) substrate, an Active Metal Brazed (AMB) substrate, or the like.

[0017] The semiconductor elements mounted on the insulating substrate housed within the case 11 of the semiconductor module 10 include, for example, Insulated Gate Bipolar Transistors (IGBTs) and Metal Oxide Semiconductor Field Effect Transistors (MOSFETs). Other semiconductor elements may include diodes such as Free Wheeling Diodes (FWDs) and Schottky Barrier Diodes (SBDs), and such diodes may be integrated with IGBTs or MOSFETs. In addition, terminal components connected to the semiconductor elements may be mounted on the insulating substrate.

[0018] A terminal structure 12 is provided on one side of the case 11 of the semiconductor module 10, which houses such an insulating substrate and semiconductor elements mounted thereon, for connecting the semiconductor module 10 to an external capacitor 20, and for connecting the insulating substrate and semiconductor elements to the contained insulating substrate and semiconductor elements. A beam 17 is further provided on one side of the case 11. Here, as an example, a semiconductor module 10 is shown with three terminal structures 12 and a beam 17 provided on one side of the case 11. The terminal structures 12 and beam 17 of the semiconductor module 10 will be described later.

[0019] The capacitor 20 includes a case 21. The capacitor element is housed inside the case 21 of the capacitor 20. Here, for example, PPS resin is used for the case 21 of the capacitor 20. In addition, materials such as PBT resin, PBS resin, PA resin, and ABS resin may be used for the case 21 of the capacitor 20. Using such resin materials, the case 21 of the capacitor 20 is formed, for example, by injection molding.

[0020] A terminal structure 22 is provided on one side of the case 21 of the capacitor 20, which houses the capacitor element, for connecting the capacitor element to the external semiconductor module 10. Here, as an example, a capacitor 20 with three terminal structures 22 on one side of the case 21 is shown. The terminal structures 22 of the capacitor 20 will be described later.

[0021] The semiconductor module 10 and the capacitor 20 are arranged so that their terminal structures 12 and 22 face each other, and their terminal structures 12 and 22 are connected using a connecting member 30 such as a busbar. The semiconductor module 10 and the capacitor 20 are connected in this way, and the semiconductor device 1 is realized.

[0022] In the semiconductor device 1, an insulating substrate of the semiconductor module 10 and semiconductor elements mounted thereon, and capacitor elements of the capacitor 20 are used to form circuits having predetermined functions such as power conversion circuits and inverter circuits.

[0023] The connection between the semiconductor module 10 and the capacitor 20 of the semiconductor device 1 described above will now be explained. Figure 2 shows an example of a connection between a semiconductor module and a capacitor according to the first embodiment. Figure 2 schematically shows the II-II cross-sectional view in Figure 1.

[0024] The case 11 of the semiconductor module 10 is provided with a terminal structure 12 comprising a laminate 16 in which terminals 13, an insulating sheet 14, and terminals 15 are stacked in order, as shown in Figure 2. For example, terminal 13 is the negative (N) terminal of the semiconductor module 10, and terminal 15 is the positive (P) terminal of the semiconductor module 10. Terminals 13 and 15 are connected to the negative and positive terminals of an insulating substrate or semiconductor element or components connected to them, respectively, housed in the case 11. Terminals 13, 14, and 15 are stacked such that the insulating sheet 14 is interposed between terminals 13 and 15. Metals such as copper and aluminum are used for terminals 13 and 15. Insulating resin materials such as aramid resin, PA resin, fluororesin, and polyimide resin are used for the insulating sheet 14.

[0025] The terminals 13, insulating sheet 14, and terminals 15 of the laminate 16 are arranged in a stepped manner at the cross-sectional position shown in Figure 2. The laminate 16 having the laminated terminals 13, insulating sheet 14, and terminals 15 is fixed to the case 11 together with the beam portion 17 provided on top of it. The case 11 and the laminate 16 and beam portion 17 fixed to it will be described later.

[0026] The case 21 of the capacitor 20 connected to the semiconductor module 10 is provided with a terminal structure 22, which includes terminals 23, an insulating sheet 24, and terminals 25, as shown in Figure 2. For example, terminal 23 is the N terminal of the capacitor 20, and terminal 25 is the P terminal of the capacitor 20. Metals such as copper and aluminum are used for terminals 23 and 25. Insulating resin materials such as aramid resin, PA resin, fluororesin, and polyimide resin are used for the insulating sheet 24.

[0027] For example, as shown in Figure 2, terminal 23 has one end connected to case 21 and the other end bent outwards from case 21. Terminal 25 is located inward of terminal 23 on case 21, with one end connected to case 21 and the other end bent inwards from case 21. One end of the insulating sheet 24 is connected to case 21 between terminal 23 and terminal 25, and it has the flexibility to be bent towards terminal 23. The insulating sheet 24 is sized to cover terminal 23 when bent towards terminal 23.

[0028] The semiconductor module 10 and the capacitor 20 are arranged such that the terminal structures 12 of the case 11 and the terminal structures 22 of the case 21 face each other. A portion of the terminal 13 of the terminal structure 12 of the semiconductor module 10 that is exposed from the insulating sheet 14 (referred to as the "connection area") 13a is connected to the terminal 23 of the terminal structure 22 of the capacitor 20. For example, both the terminal 13 of the semiconductor module 10 and the terminal 23 of the capacitor 20 are N terminals.

[0029] The connection between the terminal 13 of the semiconductor module 10 and the terminal 23 of the capacitor 20 is performed, for example, by laser welding. Laser welding may be performed using a seam laser that continuously emits laser light, or using a spot laser that emits pulsed laser light. In addition, other methods such as soldering or ultrasonic bonding may be used to connect the terminal 13 of the semiconductor module 10 and the terminal 23 of the capacitor 20.

[0030] After connecting the terminal 13 of the semiconductor module 10 to the terminal 23 of the capacitor 20, the insulating sheet 24 of the capacitor 20 is bent towards the connection point between terminal 13 and terminal 23. By bending the insulating sheet 24 of the capacitor 20 in this way, the connection area 13a of terminal 23 and the terminal 13 connected to it, as well as the insulating sheet 14, are covered by the bent insulating sheet 24.

[0031] For convenience, Figure 2 shows a state in which the folded insulating sheet 24 does not come into contact with the terminals 23 of the capacitor 20 and the insulating sheet 14 of the semiconductor module 10. However, the folded insulating sheet 24 may come into contact with the terminals 23 of the capacitor 20 and the insulating sheet 14 of the semiconductor module 10.

[0032] After the insulating sheet 24 of the capacitor 20 is folded, the terminals 15 of the semiconductor module 10 and the terminals 25 of the capacitor 20 are connected using a connecting member 30. The connecting member 30 is made of a metal such as copper or aluminum. For example, a busbar is used for the connecting member 30. The connecting member 30 is positioned to straddle the connection between the terminal 13 of the semiconductor module 10 and the terminal 23 of the capacitor 20, and the insulating sheet 24 of the capacitor 20 which is provided to cover the insulating sheet 14 of the semiconductor module 10, and connects the terminal 15 of the semiconductor module 10 and the terminal 25 of the capacitor 20. For example, both the terminal 15 of the semiconductor module 10 and the terminal 25 of the capacitor 20 are P terminals, and the connecting member 30 is a P terminal connecting member that connects the P terminals of the semiconductor module 10 and the capacitor 20.

[0033] For convenience, Figure 2 shows the connecting member 30 not in contact with the folded insulating sheet 24, but the connecting member 30 may be in contact with the folded insulating sheet 24.

[0034] The connection between the terminals 15 of the semiconductor module 10 and the terminals 25 of the capacitor 20 and the connecting member 30 is performed, for example, by laser welding. Laser welding may be performed using a seam laser or a spot laser. In addition, other methods such as soldering or ultrasonic bonding may be used to connect the terminals 15 of the semiconductor module 10 and the terminals 25 of the capacitor 20 and the connecting member 30.

[0035] For example, the terminal structures 12 and 22 are connected to each other using the connecting member 30, thereby connecting the semiconductor module 10 and the capacitor 20. In this example, a capacitor 20 is used as an example of a connection partner for the semiconductor module 10, but the connection partners for the semiconductor module 10 are not limited to a capacitor 20. The semiconductor module 10 can be connected to various electronic components, such as modules or components, that have terminals that can be connected to its PN terminal.

[0036] Let's explain the semiconductor module 10 further. As described above, the semiconductor module 10 is provided with a laminate 16 in which terminals 13, an insulating sheet 14, and terminals 15 are stacked in order on its case 11.

[0037] Here, one method for providing the laminate 16 in the case 11 is to insert-molde the laminate 16 using the case resin material, such as PPS resin, when molding the case 11. However, in this insert-molding method for the laminate 16, the insulating sheet 14 of the laminate 16 comes into contact with the case resin material, such as PPS resin, which is relatively hot during molding. Therefore, if the insulating sheet 14 is made of an insulating material with a lower heat resistance temperature than the molding temperature of the case resin material (for example, up to about 330°C), the insulating sheet 14 may deteriorate due to contact with the relatively hot case resin material during molding. If the insulating sheet 14 deteriorates, it becomes difficult to ensure the insulation between the terminals 13 and 15 provided through it, which may lead to insulation failure. This could make it difficult to ensure the reliability of the semiconductor module 10 in which the laminate 16 of terminals 13, insulating sheet 14, and terminals 15 is provided in the case 11.

[0038] In view of these points, the semiconductor module 10 according to the first embodiment employs the above and the following configurations. Figure 3 illustrates an example of a semiconductor module according to the first embodiment. Figure 3 schematically shows a perspective view of the main parts of an example of a semiconductor module.

[0039] As shown in Figure 3 (and Figures 1 and 2 above), the semiconductor module 10 includes a case 11, a laminate 16, and a beam portion 17. Here, the case 11 is shown as a frame-shaped case or a frame-shaped portion of a case. The case 11 is frame-shaped and has a recess 11a on one side of its frame. As an example, Figure 3 shows a case 11 having three recesses 11a on one side of its frame. A laminate 16, that is, a laminate 16 in which terminals 13, insulating sheets 14, and terminals 15 are stacked in order, is placed in each recess 11a of such a case 11. Then, the beam portion 17 is placed and fixed in each recess 11a of the case 11 in which the laminate 16 is placed, and the laminate 16 is fixed in the recess 11a by the beam portion 17. The case 11, the laminate 16, and the beam section 17 of the semiconductor module 10 will be further explained with reference to Figures 4 to 6.

[0040] First, let's explain case 11 of the semiconductor module 10 with reference to Figure 4. Figure 4 illustrates an example of a semiconductor joule case according to the first embodiment. Figure 4(A) schematically shows a perspective view of the main part of an example semiconductor module case, Figure 4(B) schematically shows a plan view of the main part of an example semiconductor module case, and Figure 4(C) schematically shows a side view of the main part of an example semiconductor module case.

[0041] Figures 4(A) to 4(C) schematically show an example of the case 11 of the semiconductor module 10 in section P of Figure 3. A recess 11a is provided on one side of the frame-shaped case 11, as shown in Figures 4(A) to 4(C). The recess 11a is provided so as to penetrate the side of the case 11 in the inward and outward direction, that is, in a direction perpendicular to the extension direction of the side. The width of the recess 11a in the extension direction of the side of the case 11 is set to a width that can accommodate the laminate 16 and beam portion 17 which will be arranged in the recess 11a as described later.

[0042] The recess 11a of case 11 has a partially recessed recess 11b at its bottom, as shown in Figures 4(A) to 4(C). The recess 11b at the bottom of the recess 11a is set to a width and depth that can accommodate the terminals 13 of the laminate 16 which will be placed in the recess 11a as described later. That is, the terminals 13 of the laminate 16 are accommodated in the recess 11b provided at the bottom of the recess 11a. The portion of the bottom of the recess 11a that is not the recess 11b faces the insulating sheet 14 of the laminate 16.

[0043] Case 11 can be made of resin materials such as PPS resin, PBT resin, PBS resin, PA resin, or ABS resin. Using a predetermined resin material, for example, a case 11 having a recess 11a with the aforementioned depression 11b is formed by injection molding.

[0044] Next, the laminated structure 16 of the semiconductor module 10 will be described with reference to Figure 5. Figure 5 illustrates an example of a semiconductor joule stack according to the first embodiment. Figure 5(A) schematically shows a perspective view of the main part of an example of a semiconductor module stack, Figure 5(B) schematically shows a plan view of the main part of an example of a semiconductor module stack, and Figure 5(C) schematically shows a side view of the main part of an example of a semiconductor module stack.

[0045] Figures 5(A) to 5(C) schematically show an example of a laminate 16 of the semiconductor module 10 in section P of Figure 3. The laminate 16 has a configuration in which terminals 13, an insulating sheet 14, and terminals 15 are stacked in order. The terminals 13 and 15 facing each other via the insulating sheet 14 are, for example, the same or equivalent width in a plan view and a side view, as shown in Figures 5(B) and 5(C). The insulating sheet 14 sandwiched between terminals 13 and 15 is, for example, wider than terminals 13 and 15 in a plan view and a side view, as shown in Figures 5(B) and 5(C). The insulating sheet 14, which is wider than terminals 13 and 15, is set to a width that can be accommodated in a recess 11a of the case 11, that is, less than or equal to the width of the recess 11a in the extending direction of one side of the case 11 in which it is provided.

[0046] The insulating sheet 14 has a notch 14a on one edge (the tip that is on the outside of the case 11), as shown in Figures 5(A) to 5(C). The connection area 13a of the terminal 13 is exposed through the notch 14a of the insulating sheet 14. The terminal 13 is covered by the insulating sheet 14 with its connection area 13a located in the notch 14a of the insulating sheet 14. The terminal 13 is covered by the insulating sheet 14 except for the connection area 13a located in the notch 14a of the insulating sheet 14. The terminal 15 is provided on the insulating sheet 14, that is, on the side of the insulating sheet 14 opposite to the terminal 13. In a plan view, the terminal 15 is positioned opposite the terminal 13 via the insulating sheet 14 and does not overlap with its connection area 13a. The terminal 15, the insulating sheet 14, and the connection area 13a of the terminal 13 exposed from the notch 14a are stepped. As shown in Figure 5(C), the terminal 13 is bonded to the insulating sheet 14 using adhesive 18a, and as shown in Figure 5(C), the terminal 15 is bonded to the insulating sheet 14 using adhesive 18b.

[0047] In the laminate 16, for example, terminal 23 of the capacitor 20 described above is connected to the connection area 13a of terminal 13, and a connecting member 30 that can be connected to terminal 25 of the capacitor 20 described above is connected to terminal 15.

[0048] Next, the beam portion 17 of the semiconductor module 10 will be described with reference to Figure 6. Figure 6 illustrates an example of a beam section of a semiconductor joule according to the first embodiment. Figure 6(A) schematically shows a perspective view of the main part of an example of a beam section of a semiconductor module, Figure 6(B) schematically shows a plan view of the main part of an example of a beam section of a semiconductor module, and Figure 6(C) schematically shows a side view of the main part of an example of a beam section of a semiconductor module.

[0049] Figures 6(A) to 6(C) schematically show an example of the beam portion 17 of the semiconductor module 10 in section P of Figure 3. The beam portion 17 is provided between the opposing side walls of the recess 11a of the case 11. A clearance may be provided between the side wall of the recess 11a of the case 11 and the side surface of the beam portion 17 facing that side wall, allowing the adhesive 18d (or a portion thereof), described later, to enter. The beam portion 17 is a member placed in the recess 11a of the case 11, and is a member for sandwiching and fixing the laminate 16 placed in the recess 11a of the case 11 between itself and the bottom of the recess 11a.

[0050] The beam portion 17 has a partially recessed recess 17b on the side facing the laminated body 16 to be fixed, as shown in Figures 6(A) to 6(C). The recess 17b of the beam portion 17 is set to a width and depth that can accommodate the terminals 15 of the laminated body 16. That is, when the beam portion 17 is installed in the recess 11a of the case 11, the terminals 15 of the laminated body 16 are accommodated in the recess 17b of the beam portion 17. The portion of the beam portion 17 that does not have the recess 17b on the side facing the laminated body 16 faces the insulating sheet 14 of the laminated body 16.

[0051] Resin materials such as PPS resin, PBT resin, PBS resin, PA resin, and ABS resin are used for the beam portion 17. For example, the same type of resin material used for the case 11 is used for the beam portion 17. However, a different type of resin material may also be used for the beam portion 17 than the resin material used for the case 11. Using the predetermined resin material, the beam portion 17 having the above-described recess 17b is formed, for example, by injection molding.

[0052] Next, the assembly of the semiconductor module 10's case 11, laminate 16, and beam section 17 will be described. Prior to the assembly of case 11, laminate 16, and beam section 17, case 11 and beam section 17 are prepared, respectively. Specifically, case 11, which has a recess 11a with a depression 11b as shown in Figure 4, is formed and prepared by injection molding using a predetermined resin material such as PPS resin. Beam section 17, which has a depression 17b as shown in Figure 6, is formed and prepared by injection molding using a predetermined resin material such as PPS resin.

[0053] Furthermore, prior to the assembly of the case 11, the laminated body 16, and the beam section 17, the laminated body 16, in which terminals 13, insulating sheets 14, and terminals 15 are sequentially laminated, is prepared in addition to the case 11 and the beam section 17. Here, Figure 7 illustrates an example of the preparation process for a laminate according to the first embodiment. Figure 7(A) schematically shows a side view (exploded side view) of the main parts of an example of terminals, insulating sheets, and adhesive before lamination, and Figure 7(B) schematically shows a side view of the main parts of an example of the state after lamination of terminals, insulating sheets, and adhesive.

[0054] For example, as shown in Figure 7(A), terminals 13, insulating sheet 14, and terminal 15 are prepared in advance and formed to a predetermined size. Adhesives 18a and 18b are provided between terminal 13 and insulating sheet 14, and between insulating sheet 14 and terminal 15, respectively. Then, as shown in Figure 7(B), terminal 13 and insulating sheet 14 are bonded together using adhesive 18a, and insulating sheet 14 and terminal 15 are bonded together using adhesive 18b.

[0055] Adhesives 18a and 18b can be epoxy adhesives, silicone adhesives, ceramic adhesives, etc. Liquid adhesives can be used for adhesives 18a and 18b, or sheet adhesives can be used. The same type of adhesive may be used for adhesives 18a and 18b, or different types of adhesives may be used. In bonding terminal 13 and insulating sheet 14 using adhesive 18a, the terminal 13 with adhesive 18a pre-applied may be attached to the insulating sheet 14, or the terminal 13 may be attached to the insulating sheet 14 with adhesive 18a pre-applied. In bonding insulating sheet 14 and terminal 15 using adhesive 18b, the terminal 15 with adhesive 18b pre-applied may be attached to the insulating sheet 14, or the terminal 15 may be attached to the insulating sheet 14 with adhesive 18b pre-applied.

[0056] For example, the adhesive 18a interposed between the terminal 13 and the insulating sheet 14, and the adhesive 18b interposed between the insulating sheet 14 and the terminal 15, are cured using methods such as heating and light irradiation, depending on the materials used for adhesives 18a and 18b. In addition, adhesives 18a and 18b may be in an uncured or semi-cured state during the preparation stage of the laminate 16 (before placement in the recess 11a of the case 11).

[0057] For example, in this way, a laminate 16 is prepared as shown in Figure 7(B) and Figure 5 above, that is, a laminate 16 in which terminals 13, insulating sheets 14 and terminals 15 are stacked in order. The order in which the case 11, beam section 17, and laminated body 16 are prepared does not matter.

[0058] Figures 8 and 9 illustrate an example of the assembly process for the case, laminate, and beam according to the first embodiment. Figure 8 schematically shows a side view (exploded side view) of the main parts of an example of the case, laminate, beam, and adhesive before assembly. Figure 9(A) schematically shows a plan view of the main parts of an example of the case, laminate, beam, and adhesive after assembly, and Figure 9(B) schematically shows a side view of the main parts of an example of the case, laminate, beam, and adhesive after assembly.

[0059] For example, as shown in Figure 8, adhesive 18c and adhesive 18d are provided between the recess 11a (including the indentation 11b) of the pre-prepared case 11 and the laminate 16 (on the terminal 13 side), and between the laminate 16 (on the terminal 15 side) and the beam portion 17 (on the indentation 17b side), respectively. In addition to the space between the laminate 16 and the beam portion 17, adhesive 18d may also be provided between the side wall of the recess 11a of the case 11 and the side surface of the beam portion 17, if there is a clearance between them. Then, as shown in Figures 9(A) and 9(B), the laminate 16 is bonded to the recess 11a of the case 11 using adhesive 18c, and the beam portion 17 is bonded to the laminate 16 (or the laminate 16 and the side wall of the recess 11a of the case 11) using adhesive 18d.

[0060] Adhesives 18c and 18d can be epoxy adhesives, silicone adhesives, ceramic adhesives, etc. Liquid adhesives can be used for adhesives 18c and 18d, or sheet adhesives can be used. The same type of adhesive may be used for adhesives 18c and 18d, or different types of adhesives may be used. When bonding the laminate 16 to the recess 11a of the case 11 using adhesive 18c, the laminate 16 with adhesive 18c already applied may be attached to the case 11, or the laminate 16 may be attached to the case 11 with adhesive 18c already applied. In bonding the beam portion 17 to the laminate 16 (or the laminate 16 and the side wall of the recess 11a) using adhesive 18d, the beam portion 17, which has adhesive 18d pre-applied, may be attached to the laminate 16 (or the laminate 16 and the side wall of the recess 11a), or the beam portion 17 may be attached to the laminate 16 (or the laminate 16 and the side wall of the recess 11a) which has adhesive 18d pre-applied.

[0061] For example, first, the laminate 16 is placed in the recess 11a of the case 11 via adhesive 18c. The laminate 16 is placed between itself and the recess 11a via adhesive 18c so that its terminals 13 are accommodated in the recess 11b of the recess 11a of the case 11. Next, the beam portion 17 is placed in the recess 11a of the case 11 where the laminate 16 is placed via adhesive 18d. The beam portion 17 is placed between itself and the laminate 16 (or the side wall of the recess 11a) via adhesive 18d so that the terminals 15 of the laminate 16 are accommodated in its recess 17b. In this way, the state shown in Figures 9(A) and 9(B) is obtained.

[0062] Alternatively, first, the beam portion 17 is placed on the laminate 16 via adhesive 18d. The beam portion 17 is placed between the laminate 16 and the laminate 16 via adhesive 18d so that the terminal 15 of the laminate 16 is accommodated in its recess 17b. Next, the laminate 16 with the beam portion 17 placed via adhesive 18d is placed in the recess 11a of the case 11 via adhesive 18c. The laminate 16 is placed between the case 11 and the recess 11a via adhesive 18c so that its terminal 13 is accommodated in the recess 11b of the recess 11a of the case 11. Adhesive 18d may be provided between the beam portion 17 and the side wall of the recess 11a. In this way, the state shown in Figures 9(A) and 9(B) may be obtained.

[0063] After the conditions shown in Figures 9(A) and 9(B) are achieved, the adhesives 18c and 18d are cured using methods such as heating and light irradiation, depending on the materials used. Before or during the curing of adhesives 18c and 18d, a degassing process in a vacuum may be performed to suppress the generation of voids, etc. Furthermore, during the curing of adhesives 18c and 18d, a process may be performed to pressurize the beam portion 17 toward the bottom side of the recess 11a of the case 11 in order to suppress misalignment of the laminate 16 and the beam portion 17 and the generation of unfilled areas of adhesives 18c and 18d. As an example, adhesives 18c and 18d are cured by heating while being degassed in a vacuum and with the beam portion 17 pressed toward the bottom side of the recess 11a of the case 11.

[0064] Furthermore, in the preparation stage of the laminate 16 shown in Figure 7, if the adhesives 18a and 18b interposed between the insulating sheet 14 and the terminals 13 and 15 are in an uncured or semi-cured state, adhesives 18a and 18b may be cured simultaneously with adhesives 18c and 18d when adhesives 18c and 18d are cured.

[0065] As described above, the laminate 16 is placed in the recess 11a of the case 11 via adhesive 18c, and the laminate 16 is fixed using adhesive 18c. The beam portion 17 is placed in the recess 11a of the case 11 where the laminate 16 is placed via adhesive 18d, and the beam portion 17 is fixed using adhesive 18d. As a result, the laminate 16 placed in the recess 11a of the case 11 is fixed by the beam portion 17.

[0066] Thus, in the above method, a case 11 having a recess 11a is prepared, and separately from the case 11, a laminate 16 and a beam portion 17 are prepared. The laminate 16, prepared separately from the case 11, is placed in the recess 11a of the case 11, and the beam portion 17, also prepared separately from the case 11, is fixed to the recess 11a, thereby fixing the laminate 16 in the recess 11a. Therefore, it is avoided that the insulating sheet 14 comes into contact with the case resin material, which becomes relatively hot during molding, as would occur when insert molding the laminate 16 including the insulating sheet 14 with a case resin material that has a relatively high molding temperature, such as PPS resin used for the case 11 and beam portion 17. Because it is avoided that the insulating sheet 14 comes into contact with the case resin material, deterioration of the insulating sheet 14, which makes it difficult to ensure insulation between terminals 13 and 15 and causes insulation failure, and furthermore, it is difficult to ensure the reliability of the semiconductor module 10 including the laminate 16, are suppressed.

[0067] In insert molding, to suppress the deterioration of the insulating sheet 14, an insulating material having a certain heat resistance to the molding temperature of the case resin material that may come into contact with the insulating sheet 14 during insert molding (for example, around 330°C) is selected as the insulating material for the insulating sheet 14. In contrast, in the above method, in which the case 11, laminate 16, and beam section 17 are prepared separately and assembled, the insulating sheet 14 is not exposed to the case resin material at a relatively high temperature such as the molding temperature. Therefore, an insulating material with a lower heat resistance temperature than the molding temperature of the case resin material can be selected for the insulating sheet 14. For example, an insulating material with heat resistance to such temperatures can be selected based on the curing temperatures of adhesives 18a, 18b, 18c, and 18d, or the mounting temperature of components such as semiconductor elements mounted on the semiconductor module 10 (for example, around 220°C). Thus, it becomes possible to greatly expand the range of insulating materials that can be used for the insulating sheet 14.

[0068] Furthermore, in the above method, in which the case 11, laminate 16, and beam section 17 are prepared separately and assembled using adhesive 18c and adhesive 18d, adhesive 18c is filled between the case 11 and the laminate 16, and adhesive 18d is filled between the laminate 16 and the beam section 17. Therefore, the formation of gaps between the case 11 and the laminate 16, and between the laminate 16 and the beam section 17 is suppressed. The formation of such gaps is further suppressed by performing a degassing process in a vacuum during curing. By suppressing the formation of gaps, the risk of partial discharge is reduced. In order to effectively suppress partial discharge, it is preferable that there is no clearance between the side wall of the recess 11a of the case 11 and the side surface of the beam section 17 facing it, or that adhesive 18d is filled into the clearance between the side wall and the side surface.

[0069] Furthermore, the thickness of the adhesive 18c filled between the case 11 and the laminate 16, and the thickness of the adhesives 18a and 18b between the insulating sheet 14 of the laminate 16 and the terminals 13 and 15 can also be adjusted. By adjusting the thickness of the adhesives 18c, 18a, and 18b in this way, the height position of the terminals 13 and 15 relative to the bottom of the recess 11a of the case 11 can be adjusted. By adjusting the height position of the terminals 13 and 15, it is also possible to adjust the connection height between the insulating substrate or semiconductor element housed in the case 11, or the components connected to them.

[0070] [Second Embodiment] Figure 10 illustrates an example of a semiconductor module according to the second embodiment. Figure 10 schematically shows a side view of the main parts of an example of a semiconductor module.

[0071] The semiconductor module (also called a "semiconductor device") 10A shown in Figure 10 has a configuration in which a groove 11c is formed in a recess 11b provided in a recess 11a of the case 11, communicating with the recess 11b and extending in the direction of the depth of the paper, and a groove 17c is formed in a recess 17b provided in the beam portion 17, extending in the direction of the depth of the paper. The groove 11c in the recess 11a of the case 11 is formed to communicate with the recess 11b of the recess 11a, and the groove 17c in the beam portion 17 is formed to communicate with the recess 17b of the beam portion 17. The semiconductor module 10A differs from the semiconductor module 10 described in the first embodiment above in that it has such a configuration.

[0072] In the semiconductor module 10A, a groove 11c is formed in the recess 11b of the recess 11a of the case 11, allowing excess adhesive 18c used to fix the laminate 16 to the recess 11a to be stored in the groove 11c. Because excess adhesive 18c can be stored in the groove 11c, it is possible to prevent the height position of the terminals 13 and 15 of the laminate 16 relative to the bottom of the recess 11a of the case 11 from becoming higher than a predetermined position due to the thickness of the excess adhesive 18c. This makes it possible to suppress misalignment in the connection height between the terminals 13 and 15 of the laminate 16 and the insulating substrate or semiconductor element housed in the case 11 or components connected to them.

[0073] Furthermore, in the semiconductor module 10A, a groove 17c is formed in the recess 17b of the beam portion 17, allowing excess adhesive 18d used to fix the beam portion 17 to the laminate 16 (or the laminate 16 and the case 11) to be stored in the groove 17c. Because excess adhesive 18d can be stored in the groove 17c, it is possible to prevent the height position of the beam portion 17 relative to the case 11 from becoming higher than the predetermined position due to the thickness of the excess adhesive 18d. This makes it possible to prevent cosmetic defects caused by the beam portion 17 protruding from the case 11, and to prevent rattling of the lid if a lid is provided on the case 11.

[0074] In this example, grooves 11c and 17c are formed in the recess 11a and beam portion 17 of case 11, respectively. Alternatively, groove 11c may be formed only in the recess 11a to accumulate excess adhesive 18c, or groove 17c may be formed only in the beam portion 17 to accumulate excess adhesive 18d.

[0075] The position, size, and number of grooves 11c formed in the recess 11a of case 11 are not limited to the above example, and grooves 11c can be formed in various positions, sizes, and numbers as long as they can hold excess adhesive 18c. Similarly, the position, size, and number of grooves 17c formed in beam portion 17 are not limited to the above example, and grooves 17c can be formed in various positions, sizes, and numbers as long as they can hold excess adhesive 18d.

[0076] The semiconductor module 10A, like the semiconductor module 10 described in the first embodiment above, can be connected to other electronic components such as a capacitor 20 using terminals 13 and 15 provided on the laminate 16 via an insulating sheet 14.

[0077] [Third Embodiment] Figures 11 and 12 illustrate an example of a semiconductor module according to a third embodiment. Figures 11(A) and 11(B), and Figure 12 respectively schematically show a plan view of the main parts of an example of a semiconductor module.

[0078] The semiconductor module (also called a "semiconductor device") 10B shown in Figure 11(A) has a configuration in which a locking portion 17d is provided on the beam portion 17 to lock onto the case 11, and a fitting portion 11d is provided on the case 11 to fit into the locking portion 17d of the beam portion 17. The semiconductor module 10B differs from the semiconductor module 10 described in the first embodiment in that it has this configuration. The insulating sheet 14, which is placed below the beam portion 17, may also have a locking portion corresponding to the fitting portion 11d. With such a configuration, the insulating sheet 14 can be easily aligned with the case 11.

[0079] The semiconductor module 10B is provided with a locking portion 17d for the beam portion 17, which protrudes from the side facing the side wall of the recess 11a of the case 11 in a plan view, and a fitting portion 11d for the case 11, which is recessed from the side wall of the recess 11a of the case 11 in a plan view. When attaching the beam portion 17 to the recess 11a of the case 11 in the semiconductor module 10B, the locking portion 17d of the beam portion 17 is inserted into and fitted into the fitting portion 11d of the case 11. As a result, the beam portion 17 is fixed to the case 11 in which the laminate 16 is placed in the recess 11a with positional displacement suppressed. Furthermore, the strength of the fixation of the beam portion 17 is increased by the fitting of its locking portion 17d into the fitting portion 11d of the case 11, and the detachment of the beam portion 17 due to external force is suppressed.

[0080] Furthermore, the semiconductor module (also called a "semiconductor device") 10C shown in Figure 11(B) has a configuration in which a locking portion 17d of the beam portion 17 is provided, which is recessed from the side surface facing the side wall of the recess 11a of the case 11 in a plan view, and a fitting portion 11d of the case 11 is provided, which is protruding from the side wall of the recess 11a of the case 11 in a plan view. The insulating sheet 14 placed below the beam portion 17 may also have recesses corresponding to the fitting portion 11d. With such a configuration, the insulating sheet 14 can be easily aligned with the case 11. The semiconductor module 10C differs from the semiconductor module 10 described in the first embodiment above in that it has such a configuration.

[0081] In the semiconductor module 10C, when attaching the beam portion 17 to the recess 11a of the case 11, the fitting portion 11d of the case 11 is inserted into the locking portion 17d of the beam portion 17 and fitted together. As a result, the beam portion 17 is fixed to the case 11 in which the laminate 16 is placed in the recess 11a, with positional displacement suppressed. Furthermore, the locking portion 17d of the beam portion 17 is fitted into the fitting portion 11d of the case 11, which increases the strength of the fixation and prevents the beam portion 17 from coming off due to external forces.

[0082] Furthermore, the semiconductor module (also called a "semiconductor device") 10D shown in Figure 12 has a beam portion 17 that is larger than the laminate 16 placed in the recess 11a of the case 11. In the semiconductor module 10D, a locking portion 17d is provided at the end of the beam portion 17, which protrudes inward into the frame of the case 11, and the case 11 is provided with a fitting portion 11d that is recessed inward into the frame and into which the locking portion 17d of the beam portion 17 fits. The semiconductor module 10D differs from the semiconductor module 10 described in the first embodiment in that it has this configuration.

[0083] Similarly, in the semiconductor module 10D, the locking portion 17d of the beam portion 17 is inserted into the fitting portion 11d of the case 11 and fitted together. As a result, the beam portion 17 is fixed to the case 11 with high strength while minimizing misalignment.

[0084] Furthermore, in semiconductor modules 10B, 10C, and 10D, a clearance may be provided between the locking portion 17d and the fitting portion 11d to allow the adhesive 18d to enter.

[0085] Furthermore, in semiconductor modules 10B, 10C, and 10D, grooves 11c for accumulating adhesive 18c and grooves 17c for accumulating adhesive 18d may be provided in the recess 11a and beam portion 17 of the case 11, in accordance with the example described in the second embodiment above.

[0086] The semiconductor modules 10B, 10C, and 10D can be connected to other electronic components such as capacitors 20 using terminals 13 and 15 provided on the laminate 16 via an insulating sheet 14, similar to the semiconductor module 10 described in the first embodiment above.

[0087] [Fourth Embodiment] Figure 13 illustrates an example of a semiconductor module according to the fourth embodiment. Figure 13(A) schematically shows a plan view of the main parts of an example of a semiconductor module, and Figure 13(B) schematically shows a plan view of the main parts of an example of a semiconductor module in which sealing resin is provided inside the case.

[0088] The semiconductor module (also called a "semiconductor device") 10E shown in Figure 13(A) has a configuration in which a roughened portion ("roughened portion") 17e is provided on the inner surface of the beam portion 17 that faces the case 11. The semiconductor module 10E differs from the semiconductor module 10 described in the first embodiment above in that it has this configuration.

[0089] The roughened portion 17e of the beam portion 17 can be formed, for example, by using a mold having a portion corresponding to the roughened portion 17e when forming the beam portion 17 by injection molding. Alternatively, the roughened portion 17e of the beam portion 17 can also be formed after the beam portion 17 is formed by injection molding by processing the inner surface of the case 11 using an appropriate processing method such as laser processing, sandblasting, or etching. The surface area of ​​the beam portion 17 is increased because the roughened portion 17e is provided on the inner surface of the case 11.

[0090] In the semiconductor module 10E, components such as an insulating substrate and semiconductor elements mounted thereon are housed inside the case 11. The insulating substrate and semiconductor elements housed inside the case 11 are sealed with a sealing resin 19, such as epoxy resin or silicone resin, as shown in Figure 13(B). When the inside of the case 11 is sealed with the sealing resin 19 in this way, the semiconductor module 10E has a roughened portion 17e on the surface of the beam portion 17 that faces the inside of the case 11, and the surface area of ​​this surface is increased, thereby improving the adhesion strength between the beam portion 17 and the sealing resin 19.

[0091] Furthermore, in the semiconductor module 10 described in the first embodiment, the semiconductor module 10A described in the second embodiment, and the semiconductor modules 10B, 10C, and 10D described in the third embodiment, the inside of the case 11 in which the insulating substrate, semiconductor elements, etc. are housed can be sealed with sealing resin 19, similar to the semiconductor module 10E described in this fourth embodiment.

[0092] Furthermore, in the semiconductor module 10E, grooves 11c for accumulating adhesive 18c and grooves 17c for accumulating adhesive 18d may be provided in the recess 11a and beam portion 17 of the case 11, according to the example described in the second embodiment above.

[0093] Furthermore, in the semiconductor module 10E, the case 11 and the beam portion 17 may be provided with a fitting portion 11d and a locking portion 17d, in accordance with the example described in the third embodiment above.

[0094] The semiconductor module 10E, like the semiconductor module 10 described in the first embodiment above, can be connected to other electronic components such as a capacitor 20 using terminals 13 and 15 provided on the laminate 16 via an insulating sheet 14.

[0095] [Fifth Embodiment] The configuration of the laminate 16, in which terminals 13, insulating sheet 14, and terminals 15 are stacked in order, is not limited to those described in the first to fourth embodiments above. Here, another example of the configuration of the laminate 16 will be described as the fifth embodiment.

[0096] Figures 14 and 15 illustrate an example of the configuration of a semiconductor module stack according to the fifth embodiment. Figures 14(A) and 14(B), and Figures 15(A) and 15(B) schematically show a plan view of the main parts of an example of a semiconductor module.

[0097] For example, as shown in Figure 14(A), the laminate 16 does not necessarily require that the insulating sheet 14 have a notch 14a. The insulating sheet 14 does not need to have a notch 14a as long as the terminals 13 and 15 are provided via the insulating sheet 14, the tip of the terminal 13 which is on the outside of the case 11 is exposed from the insulating sheet 14, and the terminals 13, insulating sheet 14, and terminal 15 are laminated in a stepped manner at a cross-sectional position passing through the tip of the terminal 13, the insulating sheet 14, and the terminal 15. The insulating sheet 14 does not need to have a notch 14a. The tip of the terminal 13 exposed from the insulating sheet 14 functions as a connection area 13a that connects to the terminals of electronic components such as the capacitor 20.

[0098] In the laminate 16 shown in Figure 14(A), since the insulating sheet 14 does not have a notch 14a, the preparation and placement of the insulating sheet 14 are simplified. As the laminate 16, one like the one shown in Figure 14(A) can also be used.

[0099] Furthermore, as shown in Figure 14(B), for example, the terminals 13 of the laminate 16 may be provided such that their tips extend from the outer edge of the recess 11a of the case 11. The insulating sheet 14 is provided in the recess 11a of the case 11 such that the tips of the terminals 13 extending from the outer edge of the recess 11a of the case 11 are exposed. The tips of the terminals 13 extending from the outer edge of the recess 11a of the case 11 and exposed from the insulating sheet 14 function as a connection area 13a that connects to the terminals of electronic components such as a capacitor 20.

[0100] In the laminate 16 shown in Figure 14(B), the connection area 13a of the terminal 13 extends outside the recess 11a of the case 11. Therefore, when the terminals of electronic components such as capacitors 20 are connected to the connection area 13a by laser welding or the like, damage to the recess 11a of the case 11 below the terminal 13 is suppressed. As the laminate 16, one such structure as shown in Figure 14(B) can also be used.

[0101] Furthermore, as shown in Figure 15(A), the laminate 16 may be configured such that the tip of the terminal 13 extending from the outer edge of the recess 11a of the case 11 is covered with an insulating sheet 14 having a notch 14a. A portion of the terminal 13 extending from the outer edge of the recess 11a of the case 11 and exposed through the notch 14a of the insulating sheet 14 functions as a connection region 13a that connects to the terminals of electronic components such as a capacitor 20.

[0102] In the laminate 16 shown in Figure 15(A), the connection area 13a of the terminal 13 extends outside the recess 11a of the case 11. Therefore, when the terminals of electronic components such as capacitors 20 are connected to the connection area 13a by laser welding or the like, damage to the recess 11a of the case 11 below the terminal 13 is suppressed.

[0103] Furthermore, in the laminate 16 shown in Figure 15(A), the tip of the terminal 13 extending from the outer edge of the recess 11a of the case 11 is covered with an insulating sheet 14 that is wider than the terminal 13 in a plan view, except for the connection area 13a. This ensures that a sufficient insulation distance (creepage distance) along the insulating sheet 14 is secured between the connecting member 30 (P terminal connecting member, shown as a thin solid line in Figure 15(A) for convenience) and the terminal 13, which is located above the terminal 13 (N terminal) when connected to an electronic component such as a capacitor 20, as described above. As the laminate 16, one like the one shown in Figure 15(A) can also be used.

[0104] Furthermore, as shown in Figure 15(B), the laminate 16 is configured such that the tip of the terminal 13 extending from the outer edge of the recess 11a of the case 11 is covered with an insulating sheet 14 having a notch 14a, and the terminal 13 may be wider in plan view than in the case of Figure 15(A). The insulating sheet 14 is shaped to be even wider in plan view than the wider terminal 13 in the region extending from the outer edge of the recess 11a of the case 11.

[0105] As shown in Figure 15(B), the laminate 16 also helps to prevent damage to the recess 11a of the case 11 below the terminal 13 when the terminals of electronic components such as the capacitor 20 are connected to the connection region 13a extending outside the recess 11a of the case 11 by laser welding or the like.

[0106] Furthermore, the laminated structure 16 shown in Figure 15(B) also allows for the connection of a connecting member 30 (P terminal connecting member, for convenience shown in Figure 15(B)) to be located above the terminal 13 (N terminal) when connecting to an electronic component such as a capacitor 20, for example, as described above. B As shown by the thin solid line in Figure 15(B), a sufficient insulation distance (creepage distance) along the insulating sheet 14 between the terminal 13 and the laminate 16 is ensured. Furthermore, with the laminate 16 shown in Figure 15(B), the terminal 13 (N terminal) is wider than the connecting member 30 (P terminal connecting member) connected to the terminal 15 (P terminal), and the cross-sectional area of ​​the terminal 13 is increased compared to the case in Figure 15(A), so the inductance at the connection part with electronic components such as the capacitor 20 is reduced. With the laminate 16 shown in Figure 15(B), it is possible to reduce inductance while ensuring the insulation distance. As the laminate 16, one like the one shown in Figure 15(B) can also be used.

[0107] In the semiconductor module 10 described in the first embodiment, the semiconductor module 10A described in the second embodiment, the semiconductor module 10B, semiconductor module 10C, and semiconductor module 10D described in the third embodiment, and the semiconductor module 10E described in the fourth embodiment, a laminate 16 as shown in Figures 14(A) and 14(B) and Figures 15(A) and 15(B) may be used.

[0108] [Sixth Embodiment] Here, an example of a manufacturing method (assembly method) for the semiconductor module 10, etc., as described above, will be explained as a sixth embodiment.

[0109] Figure 16 illustrates an example of a semiconductor module manufacturing method according to the sixth embodiment.

[0110] First, a case 11 having a recess 11a with a depression 11b is prepared (step S1). For example, a predetermined resin material such as PPS resin is used, and a case 11 as shown in Figure 4 is formed by injection molding. Alternatively, a case 11 is formed in which a groove 11c is provided in the depression 11b of the recess 11a, as shown in Figure 10. Alternatively, a case 11 is formed in which a fitting portion 11d is provided, as shown in Figures 11 and 12.

[0111] In addition, separate from case 11, a beam portion 17 having a recess 17b is prepared to be placed in the recess 11a of case 11 (step S2). For example, a predetermined resin material such as PPS resin, for example the same type of resin material used for case 11, is used, and the beam portion 17 as shown in Figure 6 is formed by injection molding. Alternatively, a beam portion 17 with a groove 17c in the recess 17b is formed as shown in Figure 10. Alternatively, a beam portion 17 with a locking portion 17d is formed as shown in Figures 11 and 12. Alternatively, a beam portion 17 with a roughened portion 17e is formed as shown in Figure 13.

[0112] In addition, separate from the case 11 and the beam portion 17, a laminate 16 is prepared to be placed in the recess 11a of the case 11, i.e., a laminate 16 in which terminals 13, insulating sheet 14 and terminals 15 are stacked in order (step S3). For example, as shown in Figures 5 and 7 above, terminals 13 are provided on one side of the insulating sheet 14 via adhesive 18a, and terminals 15 are provided on the other side of the insulating sheet 14 via adhesive 18b. Alternatively, a laminate 16 as shown in Figures 14 and 15 above is prepared.

[0113] The order in which the preparation of case 11 (step S1), beam section 17 (step S2), and laminated body 16 (step S3) are carried out does not matter.

[0114] After preparing case 11, beam section 17, and laminate 16, the laminate 16 is placed in the recess 11a of case 11 via adhesive 18c, according to the example in Figures 8 and 9 (step S4).

[0115] Furthermore, as shown in the examples in Figures 8 and 9 above, the beam portion 17 is placed in the recess 11a of the case 11 where the laminate 16 is placed, via adhesive 18d, and the beam portion 17 is fixed to the recess 11a (step S5). This fixes the laminate 16 to the recess 11a of the case 11.

[0116] When the beam portion 17 is placed in the recess 11a of case 11, if the case 11 is provided with a fitting portion 11d and the beam portion 17 is provided with a locking portion 17d, the locking portion 17d is fitted into the fitting portion 11d and locked in place. Furthermore, when the beam portion 17 is fixed to the recess 11a of case 11 in which the laminate 16 is placed, the beam portion 17 is fixed by, for example, heating while degassing in a vacuum.

[0117] Furthermore, the arrangement of the laminated body 16 (step S4) and the arrangement of the beam portion 17 (step S5) may be carried out by attaching the beam portion 17 to the laminated body 16 via adhesive 18d, and then attaching the laminated body 16 with the beam portion 17 attached in this manner to the recess 11a of the case 11 via adhesive 18c.

[0118] For example, a method like the one described in steps S1 to S5 is used to manufacture the semiconductor module 10 described above. The manufactured semiconductor module 10, etc., is connected to the capacitor 20 using terminals 13 and 15 provided on the laminate 16 via an insulating sheet 14, for example, according to the example shown in Figures 1 and 2 above. This results in a semiconductor device 1 as shown in Figures 1 and 2 above. Note that the semiconductor module 10, etc., can be connected to other electronic components besides the capacitor 20, as long as they are connected using terminals 13 and 15 of the laminate 16.

[0119] In the above description, an example was shown in which the laminate 16 is fixed to the recess 11a of the case 11 using adhesive 18c, and the beam portion 17 is fixed to the recess 11a of the case 11 using adhesive 18d. In addition, it is also possible to provide a non-adhesive or adhesive sealing material between the laminate 16 and the recess 11a and beam portion 17 of the case 11, which can fill the gap between them, and to fit and fix the beam portion 17 to the case 11 or to fix it with screws. [Explanation of symbols]

[0120] 1 Semiconductor device 10, 10A, 10B, 10C, 10D, 10E semiconductor modules 11,21 cases 11a Recess 11 b indentation (First depression) 17b Depression (Second Depression) 11 c groove (1st groove) 17c groove (2nd groove) 11d Mating part 12,22 Terminal structure 1 3 terminals (1st terminal) 15 Terminal (2nd terminal) Terminals 23, 25 13a Connection area 14,24 Insulating sheet 14a Notch 16 Laminate 17 Beam section 17d Locking part 17e Roughening section 18 a glue (Third adhesive) 18b Adhesive (Adhesive No. 4) 18c Adhesive (First Adhesive) 18d Adhesive (Second Adhesive) 19 Sealing resin 20 Capacitors 30 Connecting Members

Claims

1. A case that is frame-shaped and has a recess on one side of the frame shape, A laminate is formed in which a first terminal, an insulating sheet, and a second terminal are stacked in order and placed in the recess, A beam portion fixed to the recess of the case and fixing the laminated body placed in the recess, A first adhesive interposed between the recess of the case and the laminate, A second adhesive interposed between the laminate and the beam portion, Includes, The first terminal is provided on the first surface side of the insulating sheet so as to face a part of the insulating sheet. The second terminal is provided on the second surface side of the insulating sheet, opposite to the first surface side, so as to face a part of the insulating sheet. The laminate is arranged such that the first terminal is located on the bottom side of the recess of the case and the second terminal is located on the beam side. The bottom of the recess of the case has a first recess on the side facing the laminate in which the first terminal is housed, and the portion of the side facing the laminate that does not have the first recess faces the first surface of the insulating sheet. The beam portion has a second recess on the side facing the laminate in which the second terminal is housed, and the portion of the beam portion on the side facing the laminate that does not have the second recess faces the second surface of the insulating sheet, wherein the semiconductor device.

2. The semiconductor device according to claim 1, wherein the laminate includes a third adhesive interposed between the first terminal and the insulating sheet, and a fourth adhesive interposed between the insulating sheet and the second terminal.

3. The first adhesive adheres the case and the insulating sheet together. The semiconductor device according to claim 1 or 2, wherein the second adhesive bonded the beam portion and the insulating sheet.

4. The case has a first groove that communicates with the first recess, The semiconductor device according to any one of claims 1 to 3, wherein the beam portion has a second groove that communicates with the second recess.

5. The beam portion has a locking portion that engages with the case, The semiconductor device according to any one of claims 1 to 4, wherein the case has a fitting portion into which the locking portion of the beam portion fits.

6. The semiconductor device according to any one of claims 1 to 5, wherein the material of the beam portion is the same type of material as the material of the case.

7. The semiconductor device according to any one of claims 1 to 6, wherein the beam portion is fixed to the recess of the case and has a roughened portion on the inner surface of one side of the frame shape.

8. A step of preparing a case that is frame-shaped and has a recess on one side of the frame shape, A step of preparing a beam portion that can be placed in the recess of the case, A step of preparing a laminate in which a first terminal, an insulating sheet, and a second terminal are stacked in order, A step of placing the laminate in the recess of the case, A step of fixing the laminate by fixing the beam portion to the recess of the case in which the laminate is arranged, The process involves bonding the recess of the case and the laminate using a first adhesive, The process involves bonding the laminate and the beam portion using a second adhesive, Includes, The first terminal is provided on the first surface side of the insulating sheet so as to face a part of the insulating sheet. The second terminal is provided on the second surface side of the insulating sheet, opposite to the first surface side, so as to face a part of the insulating sheet. The step of arranging the laminate includes the step of arranging the laminate such that the first terminal is housed in a first recess provided on the side of the bottom of the recess of the case that faces the laminate, and the portion of the laminate that does not have the first recess faces the first surface of the insulating sheet. A method for manufacturing a semiconductor device, comprising the step of fixing the beam portion to the recess of the case, wherein the second terminal of the laminate, which is arranged in the recess, is housed in a second recess provided on the side of the beam portion facing the laminate, and the portion of the beam portion that does not have the second recess, which faces the laminate, faces the second surface of the insulating sheet.

9. The step of preparing the laminate is: The first terminal and the insulating sheet are bonded together using a third adhesive, A step of bonding the insulating sheet and the second terminal using a fourth adhesive, A method for manufacturing a semiconductor device according to claim 8, including the method described in claim 8.

10. The first adhesive adheres the case and the insulating sheet together. The method for manufacturing a semiconductor device according to claim 8 or 9, wherein the second adhesive bondes the beam portion and the insulating sheet.

11. The beam portion has a locking portion that engages with the case, The case has a fitting portion into which the locking portion of the beam portion fits, The method for manufacturing a semiconductor device according to any one of claims 8 to 10, wherein the step of fixing the beam portion to the recess of the case includes the step of fitting the locking portion of the beam portion to the fitting portion of the case.

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