Photosensitive resin composition, cured film, and touch panel

Abstract

To provide a photosensitive resin composition which enables formation of a cured film that has a high refractive index and high smoothness of a film surface, and can suppress increase in a resistance value of an ITO electrode formed on the cured film.SOLUTION: A photosensitive resin composition contains (A) an alkali-soluble resin (B) composite metal compound particles of at least one metallic compound particles selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles and aluminum compound particles, or at least one metallic compound selected from the group consisting of a titanium compound, a zirconium compound, a tin compound and an aluminum compound, and a silicon compound, (C) a photopolymerization initiator which contains a ketoxime ester group, and has an absorption peak at a wavelength of 325-340 nm, and (D) an ultraviolet absorber which has an absorption peak at a wavelength of 330-345 nm, and has a radical polymerizable group.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a photosensitive resin composition, a cured film, and a component for a touch panel. [Background technology]

[0002] Capacitive touch panels, liquid crystal displays, and organic EL devices generally use transparent conductive substrates on which transparent electrodes, such as tin-doped indium oxide (ITO), are formed. Transparent electrodes formed from ITO undergo a large change in refractive index depending on the film deposition substrate temperature, resulting in a large color difference between areas with and without ITO electrodes. This leads to the phenomenon of the ITO electrode pattern being visible (pattern visibility), which is a problem. Therefore, a technique has been developed to suppress pattern visibility by providing a thin film of Nb2O5 and SiO2 as an undercoat layer or topcoat layer (see, for example, Patent Documents 1 and 2).

[0003] In recent years, in order to further improve the visibility of displays, there has been a growing need for technologies that suppress the visibility of patterns not only in the ITO electrodes but also in the insulating film. Therefore, photosensitive materials with a high refractive index are required to suppress reflection at the interface between the ITO electrodes and the insulating film. Therefore, as a photosensitive material having a high refractive index and excellent chemical resistance and adhesion, resin compositions containing, for example, oxide fine particles, alkali-soluble resins, and specific fluorene skeleton compounds or thermosetting resins and polyfunctional monomers having four or more functional groups have been proposed (see, for example, Patent Document 3).

[0004] Furthermore, resin compositions have been proposed that contain an alkali-soluble resin having a specific structure, a photopolymerizable monomer having at least one ethylenically unsaturated bond, a photopolymerization initiator, metal oxide particles, a surfactant, and a silane compound as photosensitive materials having a high refractive index and excellent patternability and heat resistance (see, for example, Patent Document 4). [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2010-152809 [Patent Document 2] Japanese Patent Publication No. 2010-086684 [Patent Document 3] Japanese Patent Publication No. 2014-91790 [Patent Document 4] Japanese Patent Publication No. 2016-71359 [Overview of the project] [Problems that the invention aims to solve]

[0006] While the technologies described in Patent Documents 3 and 4 can produce cured films with excellent chemical resistance, heat resistance, and substrate adhesion, there was a problem in that the smoothness of the film surface was insufficient, causing the resistance value of the ITO electrodes on the cured film formed as an insulating film to increase. The present invention was devised in view of the problems of the prior art, and aims to provide a photosensitive resin composition that can form a cured film having a high refractive index and high surface smoothness, and that can suppress the increase in the resistance value of the ITO electrode formed on the cured film. [Means for solving the problem]

[0007] The object of the present invention is achieved by the following configuration: a photosensitive resin composition comprising (A) an alkali-soluble resin, (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or composite metal compound particles of at least one metal compound selected from the group consisting of titanium compounds, zirconium compounds, tin compounds, and aluminum compounds and a silicon compound, (C) a photopolymerization initiator containing a ketoxime ester group and having an absorption peak in the wavelength region of 325 to 340 nm, and (D) an ultraviolet absorber having an absorption peak in the wavelength region of 330 to 345 nm and having a radical polymerizable group. [Effects of the Invention]

[0008] According to the photosensitive resin composition of the present invention, it is possible to form a cured film that has a high refractive index and a smooth surface, and it is possible to suppress the increase in the resistance value of the ITO electrode formed on the cured film. [Modes for carrying out the invention]

[0009] The present invention will be described in more detail below. The photosensitive resin composition of the present invention is a photosensitive resin composition comprising the following (A) to (D). A photosensitive resin composition comprising (A) an alkali-soluble resin, (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or composite metal compound particles of at least one metal compound selected from the group consisting of titanium compounds, zirconium compounds, tin compounds, and aluminum compounds and a silicon compound, (C) a photopolymerization initiator containing a ketoxime ester group and having an absorption peak in the wavelength region of 325 to 340 nm, and (D) an ultraviolet absorber having an absorption peak in the wavelength region of 330 to 345 nm and having a radical polymerizable group.

[0010] In the present invention, a cured film having a high refractive index can be formed by including (A) an alkali-soluble resin, and (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or composite metal compound particles of at least one metal compound selected from the group consisting of titanium compounds, zirconium compounds, tin compounds, and aluminum compounds, and a silicon compound (hereinafter sometimes abbreviated as (B) metal compound particles or composite metal compound particles).

[0011] (C) By containing a photopolymerization initiator, the material exhibits negative-type photosensitivity, where un-irradiated areas are removed by the developer, enabling negative-type pattern processing. Furthermore, photopolymerization initiators containing ketoxime ester groups have high photoreactivity and are less susceptible to oxygen inhibition, resulting in excellent surface hardening and the formation of a highly smooth cured film. Moreover, photopolymerization initiators containing ketoxime ester groups and having an absorption peak in the 325-340 nm wavelength range have low absorbance in the 400 nm and higher wavelength range and high transparency, resulting in a highly transparent cured film.

[0012] (D) By including an ultraviolet absorber, curing of unexposed areas due to diffracted light can be suppressed, improving resolution. Furthermore, because it has radical polymerizable groups, it can crosslink with resins and monomers during exposure and firing, suppressing bleed-out and improving the transparency and surface smoothness of the cured film. In addition, by using an ultraviolet absorber that has an absorption peak in the wavelength range of 330-345 nm, it is possible to form a cured film with low absorbance in the range of 400 nm and above and high transparency.

[0013] To suppress the increase in resistance of ITO electrodes formed on an insulating film, it is necessary to increase the smoothness of the surface of the cured film formed as the insulating film. However, in photosensitive resin compositions containing metal compound particles, if photocuring during exposure is insufficient, the resin component that is highly soluble in alkaline developer is excessively washed away during the development process. As a result, the metal compound particles that are less soluble in alkaline developer remain excessively on the surface of the cured film, reducing the smoothness of the cured film surface. Therefore, it is necessary to increase the crosslinking density of the cured film surface by exposing it with short-wavelength light that is less susceptible to oxygen inhibition and has high surface curing properties. This suppresses the excessive washing away of resin components into the alkaline developer during the development process and increases the smoothness of the cured film surface. On the other hand, it has been difficult to utilize the short-wavelength region below 300 nm in photosensitive resin compositions containing metal compound particles due to light scattering by the metal compound particles. Therefore, we have found that the photosensitive resin composition of the present invention, by combining (C) a photopolymerization initiator having an absorption peak in the wavelength region of 325 to 340 nm and (D) an ultraviolet absorber having an absorption peak in the wavelength region of 330 to 345 nm, selectively utilizes light with a wavelength shorter than i-line (365 nm), specifically 310 nm to 350 nm, for radical reactions during exposure, thereby increasing the crosslinking density on the surface of the cured film. This suppresses the excessive flow of resin components into the alkaline developer during the development process and increases the smoothness of the surface of the cured film, thereby suppressing the increase in the resistance value of the ITO electrode formed on the cured film.

[0014] The photosensitive resin composition of the present invention contains (A) an alkali-soluble resin. (A) An alkali-soluble resin is a resin having one or more alkali-soluble groups. Examples of alkali-soluble groups include carboxyl groups, phenolic hydroxyl groups, sulfonic acid groups, and thiol groups. Among these, carboxyl groups are more preferred due to their high solubility in alkali. Examples of (A) alkali-soluble resins include siloxane resins, acrylic resins, vinyl ether resins, polyhydroxystyrene, novolac resins, polyimides, polyamides, and cardo resins. Two or more of these may be included. (A) It is preferable that the alkali-soluble resin has at least a portion of an ethylenically unsaturated double bond, which can improve the hardness of the cured film obtained from the photosensitive resin composition. (A) Among the polymers mentioned above, siloxane resins, acrylic resins, and cardo resins are more preferred as alkali-soluble resins due to the ease of introducing ethylenically unsaturated double bonds. Cardo resins are even more preferred, as they can improve the chemical resistance and refractive index of the cured film.

[0015] (A) The solid content acid value of the alkali-soluble resin is preferably 30 KOH mg / g or more and 200 KOH mg / g or less. Having an acid value within this range makes it possible to form good patterns under various developing conditions.

[0016] As the siloxane resin, hydrolysis-condensation reaction products of trifunctional alkoxysilane compounds are preferred. Examples of trifunctional alkoxysilane compounds include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, hexyltrimethoxysilane, octadecyltrimethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, naphthyltrimethoxysilane, anthracenyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and 3-(N,N-diglycidyl)aminopropyl Dimethoxysilane, 3-glycidoxypropyltrimethoxysilane, glycidoxymethyltrimethoxysilane, glycidoxymethyltriethoxysilane, α-glycidoxyethyltrimethoxysilane, α-glycidoxyethyltriethoxysilane, β-glycidoxyethyltrimethoxysilane, β-glycidoxyethyltriethoxysilane, α-glycidoxypropyltrimethoxysilane, α-glycidoxypropyltriethoxysilane, β-glycidoxypropyltrimethoxysilane, β-glycidoxypropyltriethoxysilane Lan, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltripropoxysilane, γ-glycidoxypropyltriisopropoxysilane, γ-glycidoxypropyltributoxysilane, α-glycidoxybutyltrimethoxysilane, α-glycidoxybutyltriethoxysilane, β-glycidoxybutyltrimethoxysilane, β-glycidoxybutyltriethoxysilane, γ-glycidoxybutyltrimethoxysilane, γ-glycidoxybutyltriethoxysilane Toxysilane, δ-glycidoxybutyltrimethoxysilane, δ-glycidoxybutyltriethoxysilane, (3,4-epoxycyclohexyl)methyltrimethoxysilane, (3,4-epoxycyclohexyl)methyltriethoxysilane, (3,4-epoxycyclohexyl)methyltrimethoxysilane, (3,4-epoxycyclohexyl)methyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltripropoxysilane, 2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-Epoxycyclohexyl)ethyltriethoxysilane, 3-(3,4-Epoxycyclohexyl)propyltrimethoxysilane, 3-(3,4-Epoxycyclohexyl)propyltriethoxysilane, 4-(3,4-Epoxycyclohexyl)butyltrimethoxysilane, 4-(3,4-Epoxycyclohexyl)butyltriethoxysilane, trifluoromethyltrimethoxysilane, trifluoromethyltriethoxysilane, trifluoropropyltrimethoxysilane, trifluoropropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-isocyanatetopropyltriethoxysilane, p-surityltrimethoxysilane, 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl (Tert-Pentylcarbamoyl)-5-(trimethoxysilyl)pentanoic acid, 3-(isopropylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(isopropylamino)-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, 3-(isobutylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(isobutylamino)-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, 3-(tert-pentylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-pentylamino)-2-oxoethyl) Soethyl)-5-(trimethoxysilyl)pentanoic acid, 3-(tert-butylcarbamoyl)-6-(triethoxysilyl)hexanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl)-5-(triethoxysilyl)pentanoic acid, 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)pentanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl)-5-(trimethoxysilyl)butanoic acid, 2-(tert-butylcarbamoyl)-4-(2-(trimethoxysilyl)ethyl)cyclohexanecarboxylic acid, 2-(tert-butylcarbamoyl)-5-(2-(trimethoxysilyl)ethyl)cyclohexanecarboxylic acid, 3-trimethoxysilylpropyl succinic anhydride, 3-triethoxysilylpropyl succinic anhydride, 4-(2-trimethoxysilylethyl)cyclohexyl-1,2-dicarboxylic acid anhydride, 4-(2-triethoxysilylethyl)cyclohexyl-1,2-dicarboxylic acid anhydride, 3-(3-trimethoxysilylpropyl)cyclohexyl-1,2-dicarboxylic acid anhydride, 3-(3-triethoxysilylpropyl)cyclohexyl-1,Examples include 2-dicarboxylic acid anhydride, 4-(2-trimethoxysilylethyl)phthalic anhydride, 4-(2-triethoxysilylethyl)phthalic anhydride, 3-(3-trimethoxysilylpropyl)phthalic anhydride, and the like.,

[0017] As the acrylic resin, those having a carboxyl group are preferred, and copolymers of unsaturated carboxylic acids and ethylenically unsaturated compounds are more preferred. Examples of the unsaturated carboxylic acid include monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, vinylacetic acid; dicarboxylic acids such as itaconic acid, maleic acid, fumaric acid or their acid anhydrides; polyvalent carboxylic acid monoesters such as phthalic acid mono(2-(meth)acryloyloxyethyl), and the like.

[0018] Examples of the ethylenically unsaturated compound include unsaturated carboxylic acid alkyl esters such as methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, isopropyl acrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, n-pentyl acrylate, n-pentyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, benzyl acrylate, benzyl methacrylate, etc.; aromatic vinyl compounds such as styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene, α-methylstyrene, etc.; (crosslinked) cyclic hydrocarbon groups such as tricyclodecanyl (meth)acrylate, etc.; unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate, etc.; unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate, glycidyl methacrylate, etc.; vinyl carboxylates such as vinyl acetate, vinyl propionate, etc.; vinyl cyanide compounds such as acrylonitrile, methacrylonitrile, α-chloroacrylonitrile, etc.; aliphatic conjugated dienes such as 1,3-butadiene, isoprene, etc.; and polystyrene, polymethyl acrylate, polymethyl methacrylate, polybutyl acrylate, polybutyl methacrylate, etc. having an acryloyl group or methacryloyl group at the terminal.

[0019] The acrylic resin preferably has a structural unit derived from (meth)acrylic acid, and more preferably is obtained by reacting a compound having an ethylenically unsaturated group and an epoxy group with a carboxyl group, which can improve the sensitivity. The ethylenically unsaturated group is preferably an acrylic group or a methacrylic group. The cardo resin preferably contains two or more structures represented by the following formula (1-1) or (1-2) as repeating units and contains an ethylenically unsaturated group and a carboxyl group.

[0020] [Chemical formula]

[0021] In the above general formula (1-2), x is an integer between 1 and 2, and Y 1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an adjacent Y 1 Y is a group in which the ring formed by itself becomes an aromatic ring. 2 represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, or a hydrogen atom. q is an integer from 0 to 2. As a cardo-based resin having structure (1-2), structure (1-3) is preferred due to its ease of synthesis.

[0022] Examples of cardo-based resins include Ogzol CR-TR, Ogzol CR-TR2, Ogzol CR-TR3, Ogzol CR-TR4, Ogzol CR-TR5, and Ogzol CR-TR6 manufactured by Osaka Gas Chemical Co., Ltd., as well as V-259ME manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd. and WR-301 manufactured by ADEKA Corporation. The content of (A) alkali-soluble resin in the photosensitive resin composition of the present invention can be arbitrarily selected depending on the desired film thickness and application, and is preferably 10 to 70% by mass of 100% by mass of the solid content of the photosensitive resin composition.

[0023] The photosensitive resin composition of the present invention contains (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or at least one composite metal compound particle of a metal compound and a silicon compound selected from the group consisting of titanium compounds, zirconium compounds, tin compounds, and aluminum compounds.

[0024] Examples of composite metal compound particles of a metal compound and a silicon compound include silicon oxide-metal compound composite particles synthesized in the presence of a silicon oxide compound, and silane-coated metal compound particles obtained by reacting metal particles with a silane coupling agent. Among these, titanium compound particles, zirconium compound particles, or composite particles of a titanium compound or zirconium compound and a silicon compound are preferred. Two or more of these may also be included. By including such metal compound particles, a high refractive index can be brought to the cured product. If the cured product has a high refractive index, a high refractive index can be brought to the cured film using it.

[0025] (B) Examples of composite metal compound particles include, for example, "NanoYuse" (registered trademark) OT-RB300M7-20, a composite particle of tin oxide, titanium oxide, and silicon oxide; "NanoYuse" OT-RA-305M7-20, a composite particle of tin oxide, titanium oxide, zirconium oxide, and silicon oxide (both manufactured by Nissan Chemical Corporation); "Optlake" (registered trademark) TR-502 and "Optlake" TR-504, composite particles of tin oxide and titanium oxide; and "Optlake" TR-503 and "Optlake" TR-513, composite particles of titanium oxide and silicon oxide. Examples include "Optlake" TR-520, "Optlake" TR-527, "Optlake" TR-528, "Optlake" TR-529, "Optlake" TR-543, "Optlake" TR-544, "Optlake" TR-550, and titanium dioxide particles "Optlake" TR-505 (all manufactured by Catalytic Chemical Industries, Ltd.), and zirconium oxide particles such as "Nano-Use" OZ-S30M (manufactured by Nissan Chemical Corporation), DLZ-003W (manufactured by Daiken Chemical Industry Co., Ltd.), ZR-010 (manufactured by Solar Co., Ltd.), SZR-M (manufactured by Sakai Chemical Industry Co., Ltd.), etc. Two or more of these may be included.

[0026] (B) The composite metal compound particles are preferably surface-treated. Surface treatment refers to a process of bonding a compound that can react with hydroxyl groups present on the surface of the fine particles, such as a coupling agent. Examples of coupling agents include silane coupling agents and titanium coupling agents. Examples of silane coupling agents include (meth)acryloxysilanes such as 3-(meth)acryloxypropyltrimethoxysilane and 3-(meth)acryloxypropylmethyldimethoxysilane; epoxysilanes such as 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; vinyltrimethoxysilane, vinyltrithoxysilane, vinyltris(β-methoxyethoxy) Examples include vinylsilanes such as silane, dimethylvinylmethoxysilane, vinyltrichlorosilane, and dimethylvinylchlorosilane; aminosilanes such as N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, and N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane; quaternary ammonium salts such as hydrochloride of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; p-styryltrimethoxysilane; and phenyltrimethoxysilane. Examples of titanium coupling agents include titanates such as isopropyldimethacrylisostearoyltitanate and isopropyldiacrylisostearoyltitanate. Two or more of these may be used. Among these, (meth)acryloxysilanes are particularly preferred. Because it has radical polymerizable groups, it can be crosslinked with resins and monomers by exposure, suppressing phase separation between the composite metal compound particles and the resins and monomers, improving transparency, and further increasing the crosslinking density on the surface of the cured film, thereby improving the smoothness of the surface of the cured film.

[0027] (B) The D50 value in the particle size distribution of the composite metal compound particles is preferably 1 nm or greater from the viewpoint of improving dispersion stability. Furthermore, from the viewpoint of improving the smoothness of the film surface and suppressing light scattering in the cured film to improve transparency, it is preferably 70 nm or less, and more preferably 50 nm or less. Here, the D50 value in the particle size distribution of the composite metal compound particles can be measured by methods such as gas adsorption, dynamic light scattering, small-angle X-ray scattering, or by directly measuring the particle size using a transmission electron microscope or scanning electron microscope. In the present invention, it refers to the value measured by the dynamic light scattering method. The equipment used is not particularly limited, but examples include the dynamic light scattering altimeter DLS-8000 (manufactured by Otsuka Electronics Co., Ltd.).

[0028] In the photosensitive composition of the present invention, (B) composite metal compound particles are preferably 10 parts by mass or more, and more preferably 15 parts by mass or more, in the solid content from the viewpoint of the refractive index of the cured film. Furthermore, from the viewpoint of adhesion to the substrate, they are preferably 70 parts by mass or less, and more preferably 65 parts by mass or less, in the solid content.

[0029] The photosensitive resin composition of the present invention contains a photopolymerization initiator that contains a (C) ketoxime ester group and has an absorption peak in the wavelength region of 325 to 340 nm. In the present invention, a photopolymerization initiator refers to a substance that decomposes and / or reacts with light (including ultraviolet light and electron beams) to generate radicals. An example of a photopolymerization initiator that contains a (C) ketoxime ester group and has an absorption peak in the wavelength region of 325 to 340 nm is 1-[4-(phenylthio)phenyl]octane-1,2-dione 2-(O-benzoyloxime). Examples of commercially available radical initiators include "Irgacure" (registered trademark) OXE01; "Adeka Arcles" (registered trademark) NCI-930 (manufactured by ADEKA Corporation); TR-PBG-305, TR-PBG-3057 (both manufactured by Tronly); etc. Two or more of these may be included.

[0030] The absorption peak of a photoradical polymerization initiator can be determined by the following method. First, the photoradical polymerization initiator is diluted to a concentration of 0.001% by mass using propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA"). The absorbance of the resulting diluted solution is measured using a UV-2600 ultraviolet-visible spectrophotometer (manufactured by Shimadzu Corporation), and the absorption peak wavelength can be determined from the obtained absorbance spectrum.

[0031] In the photosensitive resin composition of the present invention, the content of (C) photoradical polymerization initiator is preferably 0.1% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass or more, from the viewpoint of sufficiently advancing radical curing, increasing the smoothness and pencil hardness of the cured film surface, and further suppressing the generation of outgassing during electrode and wiring processing. On the other hand, from the viewpoint of suppressing the residue of (C) photoradical polymerization initiator to further improve chemical resistance and suppressing excessive radical generation to further improve resolution, the content of (C) photoradical polymerization initiator is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 12% by mass or less, from the viewpoint of suppressing the residue of (C) photoradical polymerization initiator to further improve chemical resistance and suppressing excessive radical generation to further improve resolution.

[0032] The photosensitive resin composition of the present invention may further contain photoradical polymerization initiators other than (C) photoradical polymerization initiator, such as alkylphenone-based photoradical polymerization initiators, acylphosphine oxide-based photoradical polymerization initiators, oxime ester-based photoradical polymerization initiators, benzophenone-based photoradical polymerization initiators, oxantone-based photoradical polymerization initiators, imidazole-based photoradical polymerization initiators, benzothiazole-based photoradical polymerization initiators, benzoxazole-based photoradical polymerization initiators, carbazole-based photoradical polymerization initiators, triazine-based photoradical polymerization initiators, benzoic acid ester-based photoradical polymerization initiators, phosphorus-based photoradical polymerization initiators, and inorganic photoradical polymerization initiators such as titanates. Two or more of these may be contained.

[0033] The photosensitive resin composition of the present invention contains an ultraviolet absorber having an absorption peak in the wavelength region of 330 to 345 nm and a radical polymerizable group. Examples of ultraviolet absorbers having an absorption peak in the wavelength region of 335 to 345 nm and a radical polymerizable group include 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole. Examples of commercially available ultraviolet absorbers include RUVA-93 (Otsuka Chemical Co., Ltd.).

[0034] The absorption peak of an ultraviolet absorber can be determined by the following method. First, the ultraviolet absorber is diluted to a concentration of 0.001% by mass using PGMEA. The absorbance of the resulting diluted solution is measured using a UV-2600 ultraviolet-visible spectrophotometer (manufactured by Shimadzu Corporation), and the absorption peak wavelength can be determined from the resulting absorbance spectrum.

[0035] In the photosensitive resin composition of the present invention, the content of (D) ultraviolet absorber is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more, from the viewpoint of selectively utilizing light with wavelengths shorter than i-line (365nm), specifically wavelengths of 310nm to 350nm, to increase the smoothness of the cured film surface, and to improve the resolution of the photosensitive resin composition. On the other hand, from the viewpoint of suppressing the residue of (D) ultraviolet absorber to improve chemical resistance and to improve adhesion to substrates such as glass that serve as the base for the cured film, the content of (D) ultraviolet absorber is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 12% by mass or less, from the viewpoint of suppressing the residue of (D) ultraviolet absorber to improve chemical resistance and to improve adhesion to substrates such as glass that serve as the base for the cured film.

[0036] The photosensitive resin composition of the present invention may further contain ultraviolet absorbers other than (D) ultraviolet absorber. For example, examples of ultraviolet absorbers that are transparent and non-coloring include benzotriazole compounds, benzophenone compounds, triazine compounds, etc. Two or more of these may be included.

[0037] The photosensitive resin composition of the present invention preferably contains a monomer having a radical polymerizable group. A (meth)acryloyl group is more preferred as the radical polymerizable group. From the viewpoint of increasing the smoothness by increasing the crosslinking density of the cured film surface and suppressing the increase in the resistance value of the ITO electrode formed on the cured film, it is preferable that the monomer having a radical polymerizable group contains a polyfunctional monomer. Furthermore, from the viewpoint of improving chemical resistance by increasing the hydrophobicity of the cured film, it is preferable that the monomer having a radical polymerizable group contains a monomer having an aromatic ring and / or an alicyclic carbon ring.

[0038] A polyfunctional monomer is a compound having two or more radical polymerizable groups, and it is preferable that it has two or more (meth)acryloyl groups. Examples of compounds having two (meth)acryloyl groups include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, glycerin di(meth)acrylate, tripropylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and 1,10-decanediol di(meth)acrylate. Examples of compounds having three or more (meth)acryloyl groups include glycerin tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tripentaerythritol octa(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, pentapentaerythritol undeca(meth)acrylate, and pentapentaerythritol dodeca(meth)acrylate. Two or more of these may be included.

[0039] Examples of monomers having aromatic rings and / or alicyclic carbocyclic rings include acrylic acid esters such as 2,2-[9H-fluorene-9,9-diylbis(1,4-phenylene)bisoxy]diethanol di(meth)acrylate, dimethylol tricyclodecane di(meth)acrylate, and ethoxylated bisphenol A di(meth)acrylate. Two or more of these may be included.

[0040] In the photosensitive resin composition of the present invention, the total content of monomers having radical polymerizable groups is preferably 5% by mass or more, and more preferably 10% by mass or more, of the solid content, from the viewpoint of increasing the smoothness of the cured film surface and suppressing the increase in the resistance value of the ITO electrode formed on the insulating film.

[0041] The photosensitive resin composition of the present invention may contain a crosslinking agent. This can promote or facilitate the crosslinking of the resin. Examples of crosslinking agents include nitrogen-containing organic substances, silicone resin curing agents, metal alkoxides, metal chelates, isocyanate compounds and their polymers, epoxy compounds and their polymers, methylolated melamine derivatives, and methylolated urea derivatives. Two or more of these may be included.

[0042] Among these, metal chelate compounds and epoxy compounds are preferred due to their reactivity as crosslinking agents and the chemical resistance of the resulting cured film. From the viewpoint of improving the chemical resistance of the cured film, the crosslinking agent content is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more, based on the solid content. On the other hand, from the viewpoint of improving the resolution of the photosensitive resin composition, the crosslinking agent content is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 6% by mass or less, based on the solid content.

[0043] The photosensitive resin composition of the present invention may contain an adhesion improver. By including an adhesion improver, adhesion to the substrate is improved, and a highly reliable cured film can be obtained. Examples of adhesion improvers include alicyclic epoxy compounds and silane coupling agents. Examples of alicyclic epoxy compounds include 3',4'-epoxycyclohexymethyl-3,4-epoxycyclohexanecarboxylate, 1,2-epoxy-4-(2-oxyranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic acid tetra(3,4-epoxycyclohexylmethyl)-modified ε-caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl ether, hydrogenated bisphenol A bis(propylene glycol glycidyl ether) ether, hydrogenated bisphenol A bis(ethylene glycol glycidyl ether) ether, 1,4-cyclohexanedicarboxylic acid diglycidyl, and 1,4-cyclohexanedimethanol diglycidyl ether. These may contain two or more types. Examples of silane coupling agents include (3,4-epoxycyclohexyl)methyltrimethoxysilane, (3,4-epoxycyclohexyl)methyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltripropoxysilane, 2-(3,4-epoxycyclohexyl)ethyltributoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltriphenoxysilane, 3-(3,4-epoxycyclohexyl)propyltrimethoxysilane, 3-(3,4-epoxycyclohexyl)propyltriethoxysilane, 4-(3,4-epoxycyclohexyl)butyltrimethoxysilane, 4-(3,4-epoxycyclohexyl)butyltriethoxysilane, and compounds represented by the following general formula (2).

[0044] [ka]

[0045] In the above general formula (2), each R 1 Each of the elements may be the same or different, and represents an alkyl group having 1 to 6 carbon atoms. The alkyl group may also have substituents. n represents 0 or 1. R 2 R represents a trivalent organic group with 3 to 30 carbon atoms. 3 Each of these may be the same or different, and represents an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a hydroxyl group, and a phenoxy group. Note that R 3Of these groups, all except the hydroxyl group may have further substituents. Examples of compounds represented by the above general formula (2) include 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, 3-(isopropylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(isopropylamino)-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, and 3-(isobutylcarbamoyl )-6-(trimethoxysilyl)hexanoic acid, 3-(tert-pentylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid, 2-(2-(tert-pentylamino)-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, 6-(dimethoxymethylsilyl)-3-(tert-butylcarbamoyl)hexanoic acid, 5-(dimethoxy(methyl)silyl-2-(2-(tert-butylamino)-2-oxoethyl)pentanoic acid, 3-(tert Examples include butylcarbamoyl)-6-(trimethoxysilyl)pentanoic acid, 2-(2-(tert-butylamino)-2-oxoethyl)-5-(trimethoxysilyl)butanoic acid, 2-(tert-butylcarbamoyl)-4-(2-(trimethoxysilyl)ethyl)cyclohexanecarboxylic acid, and 2-(tert-butylcarbamoyl)-5-(2-(trimethoxysilyl)ethyl)cyclohexanecarboxylic acid. Two or more of these may be included. Among these, the compound represented by the above general formula (2) is preferably used from the viewpoint of improving adhesion to the substrate. From the viewpoint of improving adhesion to the substrate, the content of the adhesion improver is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more in the solid content. On the other hand, from the viewpoint of suppressing color change due to heating, the content of the adhesion improver is preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 6% by mass or less in the solid content.

[0046] The photosensitive resin composition of the present invention may contain a solvent. The inclusion of a solvent allows for uniform dissolution of each component. Examples of solvents include aliphatic hydrocarbons, carboxylic acid esters, ketones, ethers, and alcohols. Two or more of these may be included. From the viewpoint of uniformly dissolving each component and improving the transparency of the resulting coating film, compounds having alcoholic hydroxyl groups and cyclic compounds having carbonyl groups are preferred.

[0047] Examples of compounds having an alcoholic hydroxyl group include acetol, 3-hydroxy-3-methyl-2-butanone, 4-hydroxy-3-methyl-2-butanone, 5-hydroxy-2-pentanone, 4-hydroxy-4-methyl-2-pentanone (diacetone alcohol), ethyl lactate, butyl lactate, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, propylene glycol mono-t-butyl ether, 3-methoxy-1-butanol, 3-methyl-3-methoxy-1-butanol, and tetrahydrofurfuryl alcohol.

[0048] Specific examples of cyclic compounds having a carbonyl group include γ-butyrolactone, γ-valerolactone, δ-valerolactone, propylene carbonate, N-methylpyrrolidone, cyclohexanone, and cycloheptanone. Among these, γ-butyrolactone is particularly preferred. Examples of aliphatic hydrocarbons include xylene, ethylbenzene, and solvent naphtha. Examples of carboxylic acid esters include benzyl acetate, ethyl benzoate, γ-butyrolactone, methyl benzoate, diethyl malonate, 2-ethylhexyl acetate, 2-butoxyethyl acetate, 3-methoxy-3-methyl-butyl acetate, diethyl oxalate, ethyl acetoacetate, cyclohexyl acetate, 3-methoxy-butyl acetate, methyl acetoacetate, ethyl-3-ethoxypropionate, 2-ethylbutyl acetate, isopentyl propionate, propylene glycol monomethyl ether propionate, propylene glycol monoethyl ether acetate, ethyl acetate, butyl acetate, isopentyl acetate, pentyl acetate, and propylene glycol monomethyl ether acetate.

[0049] Examples of ketones include cyclopentanone and cyclohexanone. Examples of ethers include aliphatic ethers such as propylene glycol derivatives like propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol tert-butyl ether, and dipropylene glycol monomethyl ether.

[0050] Among these, diacetone alcohol and tetrahydrofurfuryl alcohol are preferred from the viewpoint of storage stability, and propyl glycol monomethyl ether acetate is preferred from the viewpoint of step-coating properties.

[0051] The solvent content in the photosensitive resin composition of the present invention can be adjusted depending on the coating method. For example, when coated by spin coating, 50 to 95% by mass of the total photosensitive resin composition is common.

[0052] The photosensitive resin composition of the present invention may contain surfactants. The inclusion of surfactants can improve the flowability during application. Examples of surfactants include fluorine-based surfactants; silicone-based surfactants; fluorine-containing pyrolytic surfactants; polyether-modified siloxane-based surfactants; polyalkylene oxide-based surfactants; poly(meth)acrylate-based surfactants; anionic surfactants such as ammonium lauryl sulfate and polyoxyethylene alkyl ether sulfate triethanolamine; cationic surfactants such as stearylamine acetate and lauryltrimethylammonium chloride; amphoteric surfactants such as lauryldimethylamine oxide and laurylcarboxymethylhydroxyethylimidazolium betaine; and nonionic surfactants such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and sorbitan monostearate. Two or more of these may be included.

[0053] Examples of commercially available fluorine-based surfactants include "Megafac" (registered trademark) F142D, F172, F173, F183, F445, F470, F475, and F477 (all manufactured by DIC Corporation), NBX-15, and FTX-218 (manufactured by Neos Co., Ltd.). Examples of commercially available silicone-based surfactants include "BYK" (registered trademark) -333, BYK-301, BYK-331, BYK-345, and BYK-307 (manufactured by Big Chemie Japan Co., Ltd.). Examples of commercially available fluorine-containing pyrolytic surfactants include "Megafac" (registered trademark) DS-21 (manufactured by DIC Corporation). Examples of commercially available polyether-modified siloxane surfactants include "BYK" (registered trademark)-345, BYK-346, BYK-347, BYK-348, BYK-349 (all manufactured by Bic Chemie Japan Co., Ltd.), and "Sylface" (registered trademark) SAG002, SAG005, SAG0503A, SAG008 (all manufactured by Nisshin Chemical Industry Co., Ltd.).

[0054] The photosensitive resin composition of the present invention may contain a dispersant. Examples of dispersants include polyacrylic acid-based dispersants, polycarboxylic acid-based dispersants, phosphoric acid-based dispersants, and silicone-based dispersants.

[0055] A method for producing a cured film using the photosensitive resin composition of the present invention will be described with examples. The method for producing a cured film of the present invention preferably includes a step of curing with light and / or heat, without going through a step of removing all (A) alkali-soluble resin components by firing or stripping solution treatment. Specifically, a method of applying the photosensitive resin composition of the present invention, exposing and developing it, and heating it is preferred.

[0056] In the process of applying the photosensitive resin composition of the present invention, it is preferable to apply the photosensitive resin composition of the present invention onto a substrate and pre-bake it. Examples of application methods include microgravure coating, spin coating, dip coating, curtain flow coating, roll coating, spray coating, and slit coating. Examples of heating devices used for pre-baking include hot plates and ovens. The heating temperature for pre-baking is preferably 50 to 150°C, and the heating time is preferably 30 seconds to 30 minutes. The film thickness after pre-baking is preferably 0.03 to 15 μm.

[0057] After pre-baking, it is preferable to perform pattern processing by exposure and development. Examples of exposure equipment include mask aligners (LA) and mirror projection mask aligners (MPA). The exposure intensity is 10 to 4000 J / m². 2 A degree of exposure (calculated as exposure amount at a wavelength of 365 nm) is preferred. To form a pattern, exposure is preferably carried out through a desired mask, but if the entire surface is to be cured, exposure may be carried out without a mask. Generally, a high-pressure mercury lamp is used as the exposure light source, and its main wavelengths include 302 nm, 312 nm, 334 nm, 365 nm, and 405 nm.

[0058] Next, the unexposed areas are dissolved by development to obtain a negative-type pattern. Development methods include immersion in the developer solution by methods such as showering, dipping, and paddle. The development time is preferably 5 seconds to 10 minutes. As for the developer solution, known alkaline developers can be used, and specific examples include inorganic alkalis such as alkali metal hydroxides, carbonates, phosphates, silicates, and borates; amines such as 2-diethylaminoethanol, monoethanolamine, and diethanolamine; and aqueous solutions containing one or more quaternary ammonium salts such as tetramethylammonium hydroxide and choline. After development, it is preferable to rinse with water, and then drying bake can be performed in the range of 50 to 150°C.

[0059] It is preferable to heat the film after exposure and development using the aforementioned heating device. The heating temperature is preferably 150 to 450°C, and the heating time is preferably 20 minutes to 1 hour.

[0060] The cured film of the present invention can be used, for example, as various protective films such as protective films for touch panels and protective films for metal wiring, various insulating films such as insulating films for touch panels, insulating films for TFTs, and interlayer insulating films, various hard coat materials, planarization films for TFTs, overcoats for color filters, passivation films, anti-reflective films, optical filters, photospacers for color filters, and microlenses. Due to its negative photosensitivity, it is suitably used as a planarization film for TFTs in liquid crystal and organic EL displays, an insulating film, an anti-reflective film, an overcoat for color filters, and a column material. Among these, it is particularly suitable for use as an insulating film for touch panels and a protective film for metal wiring due to its high substrate adhesion. Examples of metal wiring include copper, silver, aluminum, chromium, molybdenum, titanium, ITO, IZO (indium zinc oxide), AZO (aluminum-added zinc oxide), and ZnO2. [Examples]

[0061] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples.

[0062] Furthermore, in the evaluation method, if the number of evaluations n is not specified, it is an evaluation of n=1, and if the temperature is not specified for each condition of evaluation and synthesis, it is performed at room temperature.

[0063] <Evaluation Method> "Particle size distribution D50 value" A dispersion of composite metal oxide nanoparticles was diluted 150-fold with methyl ethyl ketone (MEK), and the particle size distribution D50 value was measured by dynamic light scattering. Measuring instrument: Nikkiso Dynamic Light Scattering Particle Size Distribution Analyzer Analysis conditions: Particle size-based volume Refractive index of dispersed particles: Zirconium oxide: 2.17, Titanium oxide: 2.62 Solvent refractive index: Methyl ethyl ketone: 1.38.

[0064] "Absorption peak wavelength" The photopolymerization initiators and UV absorbers used in each example and comparative example were diluted to a concentration of 0.001% by mass using PGMEA. The absorbance of the resulting diluted solutions was measured at wavelengths of 300-400 nm using a UV-2600 UV-Vis spectrophotometer (manufactured by Shimadzu Corporation). The absorption peak wavelength was determined from the obtained absorbance spectra.

[0065] "Refractive index" On a silicon wafer substrate, the photosensitive resin compositions obtained in each example and comparative example were spin-coated using a spin coater (MS-A150 manufactured by Mikasa Co., Ltd.). The silicon wafer substrate coated with the photosensitive resin composition was prebaked at 100 °C for 2 minutes using a hot plate (HHP-230SQ manufactured by AS ONE Corporation) to produce a prebake film with a film thickness of 0.7 μm. After the obtained prebake film was exposed to the entire surface under the condition of an exposure amount of 200 mJ / cm2 with an ultra-high pressure mercury lamp, it was developed by shower development for 60 seconds using 2.38 mass% TMAH using an automatic developing apparatus (AD-1200 manufactured by Takizawa Sangyo Co., Ltd.), and then rinsed with water for 30 seconds. Finally, it was cured at 230 °C for 30 minutes in air using an oven (DHS-42 manufactured by ESPEC Corporation) to produce a cured film with a film thickness of 0.5 μm. For each cured film, the refractive index at 550 nm was measured using a spectroscopic ellipsometer FE5000 manufactured by Otsuka Electronics Co., Ltd.

[0066] "Transmittance" On a Tempax glass substrate (manufactured by AGC Techno Glass Co., Ltd.), the photosensitive resin compositions obtained in each example and comparative example were spin-coated using a spin coater (MS-A150 manufactured by Mikasa Co., Ltd.). The Tempax glass substrate coated with the photosensitive resin composition was prebaked at 100 °C for 2 minutes using a hot plate (HHP-230SQ manufactured by AS ONE Corporation) to produce a prebake film with a film thickness of 1.7 μm. After the obtained prebake film was exposed to the entire surface under the condition of an exposure amount of 200 mJ / cm 2 2, it was developed by shower development for 60 seconds using 2.38 mass% TMAH using an automatic developing apparatus (AD-1200 manufactured by Takizawa Sangyo Co., Ltd.), and then rinsed with water for 30 seconds. Finally, it was cured at 230 °C for 30 minutes in air using an oven (DHS-42 manufactured by ESPEC Corporation) to produce a cured film with a film thickness of 1.5 μm. Using a MultiSpec-1500 UV-Vis photodiode array spectrophotometer (manufactured by Shimadzu Corporation), the UV-Vis absorption spectrum of the Tempax glass substrate alone was measured and used as a reference. Next, the UV-Vis absorption spectrum of the resulting laminate of the cured film and Tempax glass was measured using a single beam, and the light transmittance at 400 nm was determined. The difference from the reference was defined as the transmittance of the cured film. From the perspective of industrial application, results A and B were deemed acceptable. A: Transmittance of 96% or more but less than 100% B: Transmittance of 93% or more but less than 96% C: Transmittance of 90% or more but less than 93% D: Transmittance less than 90%.

[0067] "resolution" A substrate (hereinafter referred to as the ITO substrate) was prepared by depositing an ITO film on an alkali-free glass substrate (glass thickness 0.7 mm) to a thickness of 20 nanometers and a resistance of 100 Ω / □. The photosensitive resin compositions obtained in each example and comparative example were spin-coated onto the ITO substrate using a spin coater (MS-A150, Mikasa Corporation). The alkali-free glass substrate coated with the photosensitive resin composition was pre-baked at 100°C for 2 minutes using a hot plate (HHP-230SQ, AS ONE Corporation) to produce a pre-baked film with a thickness of 1.7 μm. The obtained pre-baked film was exposed using a mask aligner (LA-610, Sanei Electric Works Co., Ltd.) with a high-pressure mercury lamp as the light source, using masks with 1:1 widths of 5, 10, 20, 30, 40, and 50 μm, and a mask gap of 200 μm. Subsequently, using an automatic developing device (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.), the samples were shower-developed for 60 seconds with a 2.38% by mass TMAH aqueous solution, followed by rinsing with water for 30 seconds. After exposure and development, the optimal exposure was determined to be the amount of exposure required to form a 50 μm line-and-space pattern with a 1:1 width. The exposure was measured using an i-line illuminometer. The minimum pattern size after development at the optimal exposure was measured and defined as the resolution. From the perspective of industrial use, A and B were considered acceptable. A: Resolution of 5μm or 10μm B: Resolution of 20 μm or 30 μm C: Resolution of 40 μm or more.

[0068] "Quantitative value Ra for film surface roughness" The photosensitive resin compositions obtained in each example and comparative example were spin-coated onto alkali-free glass substrates (glass thickness 0.7 mm) using a spin coater (MS-A150, Mikasa Corporation). The alkali-free glass substrates coated with the photosensitive resin compositions were pre-baked at 100°C for 2 minutes using a hot plate (HHP-230SQ, AS ONE Corporation) to produce a pre-baked film with a thickness of 1.7 μm. The obtained pre-baked film was fully exposed using an ultra-high pressure mercury lamp at the optimal exposure level (exposure level that forms a 50 μm line and space pattern with a 1:1 width), and then shower-developed for 60 seconds with 2.38 mass% TMAH using an automatic developing device (AD-1200, Takizawa Sangyo Co., Ltd.), followed by rinsing with water for 30 seconds. Finally, the film was cured in air at 230°C for 30 minutes using an oven (DHS-42, manufactured by ESPEC Corporation) to produce a cured film with a thickness of 1.5 μm.

[0069] The arithmetic mean roughness (Ra) of the hardened film surface was measured using a scanning probe microscope, NanoScope V Dimension Icon (manufactured by BrukerAXS). [Measurement conditions] Probe (Tip): Silicone cantilever Scanning mode: Tapping mode Scanning range: 3 μm square Scanning speed: 0.3Hz Measurement environment: Room temperature, in ambient air From the perspective of industrial use, A and B were deemed acceptable. A: Ra 0.1nm or more and less than 3nm B:Ra 3nm or more and less than 5nm C:Ra 5nm to less than 10nm D: Ra10nm or more.

[0070] "ITO resistance increase rate" The photosensitive resin compositions obtained in each example and comparative example were spin-coated onto alkali-free glass substrates (glass thickness 0.7 mm) using a spin coater (MS-A150, Mikasa Corporation). The alkali-free glass substrates coated with the photosensitive resin compositions were pre-baked at 100°C for 2 minutes using a hot plate (HHP-230SQ, AS ONE Corporation) to produce a pre-baked film with a thickness of 1.7 μm. The obtained pre-baked film was fully exposed using an ultra-high pressure mercury lamp at the optimal exposure level (exposure level that forms a 50 μm line and space pattern with a 1:1 width), and then shower-developed for 60 seconds with 2.38 mass% TMAH using an automatic developing device (AD-1200, Takizawa Sangyo Co., Ltd.), followed by rinsing with water for 30 seconds. Finally, the film was cured in air at 230°C for 30 minutes using an oven (DHS-42, manufactured by ESPEC Corporation) to produce a cured film with a thickness of 1.5 μm. On the resulting cured film, ITO was deposited to a thickness of 20 nanometers, and the ITO resistance was measured. The resistance value of 100 Ω / □ when ITO was deposited to a thickness of 20 nanometers on an alkali-free glass substrate was used as a reference, and the rate of increase in ITO resistance relative to the reference was calculated. From the perspective of industrial application, results A and B were considered acceptable. A: ITO resistance increase rate of 0.1% or more and less than 5% B: ITO resistance increase rate of 5% or more but less than 10% C: ITO resistance increase rate 10% or more but less than 15% D: ITO resistance increase rate of 15% or more.

[0071] [Synthesis Example 1] A PGMEA solution of cardo resin containing ethylenically unsaturated groups and carboxyl groups, "WR-301 (trade name)" (manufactured by ADEKA Corporation), was prepared. The solid content concentration of "WR-301" was 45% by mass, the solid content acid value was 100 KOH mg / g, and the mass-average molecular weight (Mw) in polystyrene terms, measured by the GPC method, was 5500. 100 g of "WR-301" was weighed, 12.5 g of PGMEA was added and stirred to obtain a cardo resin solution (P-1) with a solid content concentration of 40% by mass.

[0072] [Synthesis Example 2] 1.0 g of 2,2'-azobis(isobutyronitrile) and 100 g of PGMEA were placed in a 500 ml flask. After purging the flask with nitrogen, it was heated to 120°C, and a mixture of 5.2 g of styrene, 35.5 g of glycidyl methacrylate, and 41.0 g of dicyclopentanyl methacrylate was added dropwise over 2.5 hours using a dropping tube. Next, the flask was purged with air, and 17.0 g of acrylic acid was added, along with 0.3 g of trisdimethylaminomethylphenol and 0.3 g of hydroquinone, and the mixture was heated and stirred at 120°C for 5 hours. Furthermore, 30.4 g of tetrahydrophthalic anhydride and 0.5 g of triethylamine were added, and the mixture was heated and stirred at 120°C for 4 hours. Finally, PGMEA was added to obtain an acrylic resin solution (PA-1) with a solid content of 40% by mass. The Mw of the acrylic resin was 14000, and the acid value was 140 mg KOH / g.

[0073] [Synthesis Example 3] 1.1 g of 2,2'-azobis(isobutyronitrile) and 100 g of cyclohexanone were placed in a 500 ml flask. After purging the flask with nitrogen, it was heated to 80°C, and a mixture of 37.2 g of n-butyl methacrylate, 12.9 g of 2-hydroxyethyl methacrylate, 12.0 g of methacrylic acid, and 20.7 g of paracumylphenol ethylene oxide-modified acrylate ("Aronics" (registered trademark) M-110, manufactured by Toagosei Co., Ltd.) was added dropwise over 2 hours using a dropping tube. After the addition was complete, the mixture was heated and stirred for a further 3 hours, and then PGMEA was added to obtain an acrylic resin solution (PA-2) with a solid content of 40% by mass. The Mw of the acrylic resin was 25000, and the acid value was 90 mgKOH / g. [Synthesis Example 4] 200 g of PGMEA was mixed with 41.97 g (0.16 mol) of 3-trimethoxysilylpropyl succinic anhydride and 11.70 g (0.16 mol) of t-butylamine, and the mixture was stirred at room temperature for a while, then stirred at 40°C for 2 hours. The temperature was then raised to 80°C and heated and stirred for 6 hours. PGMEA was added to the resulting solution to bring the solid content concentration to 20% by mass, and a silane coupling agent (G-1) solution, which is a mixed solution of 3-(tert-butylcarbamoyl)-6-(trimethoxysilyl)hexanoic acid and 2-(2-(tert-butylamino)-2-oxoethyl)-5-(trimethoxysilyl)pentanoic acid, was obtained.

[0074] [Example 1] Under yellow light, 25.04 g of a 30% by mass dispersion of zirconia nanoparticles in MEK (ZR-010, manufactured by Solar Co., Ltd., hereinafter referred to as ZR-010) was dissolved in 42.50 g of diacetone alcohol (hereinafter referred to as DAA) and 18.13 g of PGMEA. Then, 0.67 g of 1,2-octanedione,1-[4-(phenylthio)-2-(O-benzoyloxime)] (BASF's "Irgacure" (registered trademark) OXE01 (hereinafter referred to as OXE-01)), 0.54 g of 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole (Otsuka Chemical Co., Ltd.'s "RUVA-93 (hereinafter referred to as RUVA-93)), 4.65 g of the cardo resin solution (P-1) obtained by Synthesis Example 1, and dipentaerythritol hexaacrylate ("Kayarad" 1.42 g of (registered trademark) DPHA (product name) (manufactured by Nippon Kayaku Co., Ltd.), 5.39 g of a 50% by mass solution of 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene PGMEA (manufactured by Osaka Gas Chemical Co., Ltd., "Ogusol" (registered trademark) EA-0250P (hereinafter referred to as EA-0250P)), 1.35 g of a silane coupling agent (G-1) solution obtained by Synthesis Example 4, and 0.30 g of a 10% by mass solution of the silicone surfactant "BYK" (registered trademark)-333 (manufactured by BY Chemie Japan Co., Ltd.) PGMEA were added and stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-1). A cured film was prepared from the obtained photosensitive resin composition (A-1) using the method described above and evaluated using the method described above.

[0075] [Example 2] Under a yellow light, 30.07 g of ZR-010 was dissolved in 42.50 g of DAA and 15.73 g of PGMEA. Then, 0.74 g of OXE-01, 0.60 g of RUVA-93, 3.84 g of (P-1), 0.74 g of DPHA, 4.14 g of EA-0250P, 1.34 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-2). A cured film was prepared from the obtained photosensitive resin composition (A-2) using the method described above and evaluated using the method described above.

[0076] [Example 3] Under a yellow light, 9.80 g of ZR-010 was dissolved in 42.50 g of DAA and 27.24 g of PGMEA. Then, 0.80 g of OXE-01, 0.53 g of RUVA-93, 6.68 g of (P-1), 4.70 g of DPHA, 6.09 g of EA-0250P, 1.34 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-3). A cured film was prepared from the obtained photosensitive resin composition (A-3) using the method described above and evaluated using the method described above.

[0077] [Example 4] A photosensitive resin composition (A-4) was prepared in the same manner as in Example 1, except that "ADEKA Cruise" (registered trademark) NCI-930 (manufactured by ADEKA Corporation) was used instead of OXE-01. The obtained photosensitive resin composition (A-4) was evaluated in the same manner as in Example 1.

[0078] [Example 5] A photosensitive resin composition (A-5) was prepared in the same manner as in Example 1, except that TR-PBG-305 (manufactured by TRONLY) was used instead of OXE-01. The obtained photosensitive resin composition (A-5) was evaluated in the same manner as in Example 1.

[0079] [Example 6] A photosensitive resin composition (A-6) was prepared in the same manner as in Example 1, except that TR-PBG-3057 (manufactured by TRONLY) was used instead of OXE-01. The obtained photosensitive resin composition (A-6) was evaluated in the same manner as in Example 1.

[0080] [Example 7] A photosensitive resin composition (A-7) was prepared in the same manner as in Example 1, except that SPI-03 (manufactured by Samyang) was used instead of OXE-01. The obtained photosensitive resin composition (A-7) was evaluated in the same manner as in Example 1.

[0081] [Example 8] A photosensitive resin composition (A-8) was prepared in the same manner as in Example 1, except that TPM-DT7 (manufactured by TAKOMA) was used instead of OXE-01. The obtained photosensitive resin composition (A-8) was evaluated in the same manner as in Example 1.

[0082] [Example 9] Under a yellow light, 24.53 g of ZR-010 was dissolved in 42.50 g of DAA and 19.19 g of PGMEA. Then, 1.14 g of OXE-01, 0.89 g of RUVA-93, 3.81 g of Cardo-based resin solution (P-1), 1.23 g of DPHA, 5.15 g of EA-0250P, 1.27 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and the mixture was stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-9). A cured film was prepared from the obtained photosensitive resin composition (A-9) using the method described above and evaluated using the method described above.

[0083] [Example 10] Under a yellow light, 10.03 g of ZR-010 was dissolved in 42.50 g of DAA and 26.43 g of PGMEA. Then, 0.42 g of OXE-01, 0.28 g of RUVA-93, 7.52 g of Cardo-based resin solution (P-1), 4.83 g of DPHA, 6.30 g of EA-0250P, 1.40 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-10). A cured film was prepared from the obtained photosensitive resin composition (A-10) using the method described above and evaluated using the method described above.

[0084] [Example 11] Under a yellow light, 24.52 g of ZR-010 was dissolved in 42.50 g of DAA and 18.94 g of PGMEA. Then, 0.77 g of OXE-01, 1.03 g of RUVA-93, 4.19 g of Cardo-based resin solution (P-1), 1.29 g of DPHA, 5.16 g of EA-0250P, 1.29 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-11). A cured film was prepared from the obtained photosensitive resin composition (A-11) using the method described above and evaluated using the method described above.

[0085] [Example 12] Under a yellow light, 25.64 g of ZR-010 was dissolved in 42.50 g of DAA and 17.56 g of PGMEA. Then, 0.69 g of OXE-01, 0.27 g of RUVA-93, 4.64 g of Cardo-based resin solution (P-1), 1.44 g of DPHA, 5.49 g of EA-0250P, 1.37 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and the mixture was stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-12). A cured film was prepared from the obtained photosensitive resin composition (A-12) using the method described above and evaluated using the method described above.

[0086] [Example 13] Under a yellow light, 24.33 g of ZR-010 was dissolved in 42.50 g of DAA and 19.49 g of PGMEA. Then, 1.36 g of OXE-01, 0.99 g of RUVA-93, 3.77 g of Cardo-based resin solution (P-1), 1.11 g of DPHA, 4.90 g of EA-0250P, 1.24 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and the mixture was stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-13). A cured film was prepared from the obtained photosensitive resin composition (A-13) using the method described above and evaluated using the method described above.

[0087] [Example 14] Under a yellow light, 10.22 g of ZR-010 was dissolved in 42.50 g of DAA and 26.10 g of PGMEA. Then, 0.29 g of OXE-01, 0.14 g of RUVA-93, 7.66 g of Cardo-based resin solution (P-1), 4.89 g of DPHA, 6.47 g of EA-0250P, 1.43 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, the mixture was filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-14). A cured film was prepared from the obtained photosensitive resin composition (A-14) using the method described above and evaluated using the method described above.

[0088] [Example 15] Under a yellow light, 24.32 g of ZR-010 was dissolved in 42.50 g of DAA and 19.28 g of PGMEA. Then, 0.76 g of OXE-01, 1.27 g of RUVA-93, 3.96 g of Cardo-based resin solution (P-1), 1.27 g of DPHA, 5.07 g of EA-0250P, 1.27 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and stirred. Next, the mixture was filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-15). A cured film was prepared from the obtained photosensitive resin composition (A-15) using the method described above and evaluated using the method described above.

[0089] [Example 16] Under a yellow light, 25.64 g of ZR-010 was dissolved in 42.50 g of DAA and 17.52 g of PGMEA. Then, 0.69 g of OXE-01, 0.14 g of RUVA-93, 4.68 g of Cardo-based resin solution (P-1), 1.46 g of DPHA, 5.68 g of EA-0250P, 1.39 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and the mixture was stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-16). A cured film was prepared from the obtained photosensitive resin composition (A-16) using the method described above and evaluated using the method described above.

[0090] [Example 17] A photosensitive resin composition (A-17) was prepared in the same manner as in Example 1, except that a 30% by mass dispersion of titania nanoparticles ("OT-RA305K7-AC" manufactured by Nissan Chemical Corporation) was used instead of ZR-010. The obtained photosensitive resin composition (A-17) was evaluated in the same manner as in Example 1.

[0091] [Example 18] A photosensitive resin composition (A-18) was prepared in the same manner as in Example 1, except that a 30% by mass methanol dispersion of zirconia nanoparticles (SZR-M, manufactured by Sakai Chemical Industry Co., Ltd.) was used instead of ZR-010. The obtained photosensitive resin composition (A-18) was evaluated in the same manner as in Example 1.

[0092] [Example 19] A photosensitive resin composition (A-19) was prepared in the same manner as in Example 1, except that a 30% by mass methanol dispersion of titania nanoparticles ("OT-RA305M7-20" manufactured by Nissan Chemical Corporation) was used instead of ZR-010. The obtained photosensitive resin composition (A-19) was evaluated in the same manner as in Example 1.

[0093] [Example 20] A photosensitive resin composition (A-20) was prepared in the same manner as in Example 1, except that a 30% by mass methanol dispersion of zirconia nanoparticles (OZ-S30M, manufactured by Nissan Chemical Corporation) was used instead of ZR-010. The obtained photosensitive resin composition (A-20) was evaluated in the same manner as in Example 1.

[0094] [Comparative Example 1] A photosensitive resin composition (A-21) was prepared in the same manner as in Example 1, except that "Irgacure" (registered trademark) OXE02 (manufactured by BASF) was used instead of OXE-01. The obtained photosensitive resin composition (A-21) was evaluated in the same manner as in Example 1.

[0095] [Comparative Example 2] A photosensitive resin composition (A-22) was prepared in the same manner as in Example 1, except that "ADEKA Cruise" (registered trademark) N-1919 (manufactured by ADEKA Corporation) was used instead of OXE-01. The obtained photosensitive resin composition (A-22) was evaluated in the same manner as in Example 1.

[0096] [Comparative Example 3] A photosensitive resin composition (A-23) was prepared in the same manner as in Example 1, except that "Irgacure" (registered trademark) 819 (manufactured by BASF) was used instead of OXE-01. The obtained photosensitive resin composition (A-23) was evaluated in the same manner as in Example 1.

[0097] [Comparative Example 4] A photosensitive resin composition (A-24) was prepared in the same manner as in Example 1, except that TR-PBG-304 (manufactured by TRONLY) was used instead of OXE-01. The obtained photosensitive resin composition (A-24) was evaluated in the same manner as in Example 1.

[0098] [Comparative Example 5] A photosensitive resin composition (A-25) was prepared in the same manner as in Example 1, except that TR-PBG-345 (manufactured by TRONLY) was used instead of OXE-01. The obtained photosensitive resin composition (A-25) was evaluated in the same manner as in Example 1.

[0099] [Comparative Example 6] A photosensitive resin composition (A-26) was prepared in the same manner as in Example 1, except that "Irgacure" (registered trademark) 379 (manufactured by Ciba Specialty Chemicals Co., Ltd.) was used instead of OXE-01. The obtained photosensitive resin composition (A-26) was evaluated in the same manner as in Example 1.

[0100] [Comparative Example 7] A photosensitive resin composition (A-27) was prepared in the same manner as in Example 1, except that "Tinuvin" (registered trademark) PS (manufactured by BASF) was used instead of RUVA-93. The obtained photosensitive resin composition (A-27) was evaluated in the same manner as in Example 1.

[0101] [Comparative Example 8] A photosensitive resin composition (A-28) was prepared in the same manner as in Example 1, except that "Tinuvin" (registered trademark) 384-2 (manufactured by BASF) was used instead of RUVA-93. The obtained photosensitive resin composition (A-28) was evaluated in the same manner as in Example 1.

[0102] [Comparative Example 9] A photosensitive resin composition (A-29) was prepared in the same manner as in Example 1, except that "Tinuvin" (registered trademark) 405 (manufactured by BASF) was used instead of RUVA-93. The obtained photosensitive resin composition (A-29) was evaluated in the same manner as in Example 1.

[0103] [Comparative Example 10] Under a yellow light, 25.98 g of ZR-010 was dissolved in 42.50 g of DAA and 17.27 g of PGMEA. Then, 0.70 g of OXE-01, 4.65 g of Cardo-type resin solution (P-1), 1.47 g of DPHA, 5.74 g of EA-0250P, 1.40 g of (G-1) solution, and 0.30 g of a 10% by mass PGMEA solution of "BYK" (registered trademark)-333 were added and the mixture was stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-30). A cured film was prepared from the obtained photosensitive resin composition (A-30) using the method described above and evaluated using the method described above.

[0104] [Comparative Example 11] A photosensitive resin composition (A-31) was prepared in the same manner as in Comparative Example 10, except that the acrylic resin solution (PA-1) obtained in Synthesis Example 2 was used instead of the cardo-based resin solution (P-1). The obtained photosensitive resin composition (A-31) was evaluated in the same manner as in Example 1.

[0105] [Comparative Example 12] Under a yellow light, 41.27 g of a 20% by mass dispersion of zirconia nanoparticles in water (Nissan Chemical Corporation, "ZR-20AS") was dissolved in 42.50 g of DAA and 3.13 g of PGMEA. Then, 0.28 g of OXE-01, 10.14 g of acrylic resin solution (PA-1), 1.68 g of decafunctional urethane acrylate (KSM Corporation, "KUA-10H"), 0.70 g of silane coupling agent "KBM-403" (trade name) (Shin-Etsu Chemical Co., Ltd.), and 0.30 g of a 10% by mass solution of "BYK" (registered trademark)-333 PGMEA were added and the mixture was stirred. The mixture was then filtered through a 0.2 μm filter to obtain photosensitive resin composition (A-32). A cured film was prepared from the obtained photosensitive resin composition (A-32) using the method described above and evaluated using the method described above.

[0106] [Comparative Example 13] A photosensitive resin composition (A-33) was prepared in the same manner as in Comparative Example 12, except that the acrylic resin solution (PA-2) obtained in Synthesis Example 3 was used instead of the acrylic resin solution (PA-1). The obtained photosensitive resin composition (A-33) was evaluated in the same manner as in Example 1.

[0107] The composition of the resin compositions in each example and comparative example is shown in Tables 1 and 2, and the evaluation results are shown in Table 3. The photosensitive resin composition prepared in the examples has a high refractive index and can form a cured film with a smooth surface, and can suppress the increase in the resistance value of the ITO electrode formed on the cured film.

[0108] [Table 1]

[0109] [Table 2]

[0110] [Table 3] [Industrial applicability]

[0111] According to the photosensitive resin composition of the present invention, a cured film having a high refractive index and a smooth surface can be formed, and the increase in the resistance value of the ITO electrode formed on the cured film can be suppressed. Therefore, it can be suitably used as various protective films such as protective films for touch panels and protective films for metal wiring, as well as various insulating films such as insulating films for touch panels, insulating films for TFTs, and interlayer insulating films.

Claims

1. A photosensitive resin composition comprising (A) an alkali-soluble resin, (B) at least one metal compound particle selected from the group consisting of titanium compound particles, zirconium compound particles, tin compound particles, and aluminum compound particles, or composite metal compound particles of at least one metal compound selected from the group consisting of titanium compounds, zirconium compounds, tin compounds, and aluminum compounds and a silicon compound, (C) a photopolymerization initiator containing a ketoxime ester group and having an absorption peak in the wavelength region of 325 to 340 nm, and (D) an ultraviolet absorber having an absorption peak in the wavelength region of 330 to 345 nm and having a radical polymerizable group. The photopolymerization initiator containing the (C) ketoxime ester group and having an absorption peak in the wavelength region of 325 to 340 nm is a compound represented by 1,2-octanedione, 1-[4-(phenylthio)-2-(O-benzoyloxime)], the following formula (3-1), or the following formula (3-2). 【Chemistry 1】 【Chemistry 2】 The ultraviolet absorber having an absorption peak in the wavelength region of 330 to 345 nm and having a radical polymerizable group is 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole, A photosensitive resin composition in which, when the surface roughness Ra is determined by the following method, Ra is 0.1 nm or more and less than 5 nm. <Method for measuring the quantitative value Ra of film surface roughness> A photosensitive resin composition is spin-coated onto an alkali-free glass substrate (glass thickness 0.7 mm) using a spin coater (MS-A150, manufactured by Mikasa Corporation). The alkali-free glass substrate coated with the photosensitive resin composition is pre-baked at 100°C for 2 minutes using a hot plate (HHP-230SQ, manufactured by AS ONE Corporation) to produce a pre-baked film with a thickness of 1.7 μm. The obtained pre-baked film is fully exposed to an ultra-high pressure mercury lamp at the optimal exposure level (exposure level that forms a 50 μm line and space pattern with a 1:1 width), and then shower-developed for 60 seconds with 2.38 mass% TMAH using an automatic developing device (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.), followed by rinsing with water for 30 seconds. Finally, the film is cured in an oven (DHS-42, manufactured by ESPEC Corporation) at 230°C in air for 30 minutes to produce a cured film with a thickness of 1.5 μm. The arithmetic mean roughness (Ra) of the hardened film surface is measured using a scanning probe microscope, NanoScope V Dimension Icon (manufactured by Bruker AXS). [Measurement conditions] Tip: Silicone cantilever Scanning mode: Tapping mode Scanning range: 3 μm square Scanning speed: 0.3 Hz Measurement environment: Room temperature, in ambient air

2. The photosensitive resin composition according to claim 1, wherein, when the content of (A) alkali-soluble resin is a mass%, the content of (C) photopolymerization initiator is c mass%, and the content of (D) ultraviolet absorber is d mass%, c / a is 0.10 to 0.80 and d / c is 0.3 to 1.

5.

3. The photosensitive resin composition according to claim 1 or 2, wherein the D50 value in the particle size distribution of the composite metal compound particles (B) measured by dynamic light scattering is 1 nm or more and 40 nm or less.

4. The photosensitive resin composition according to any one of claims 1 to 3, wherein the (B) metal compound particles are surface-treated with (meth)acrylsilane.

5. A photosensitive resin composition according to any one of claims 1 to 4, comprising at least a compound represented by general formula (2) as an adhesion improving agent. 【Transformation 3】 (Each R １ Each of the elements may be the same or different, and represents an alkyl group having 1 to 6 carbon atoms. The alkyl group may also have substituents. n represents 0 or 1. R ２ R represents a trivalent organic group with 3 to 30 carbon atoms. ３ Each of these may be the same or different, and represents an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group, a hydroxyl group, and a phenoxy group. Note that R ３ Of these groups, all except the hydroxyl group may have further substituents.

6. A cured film obtained by curing the photosensitive resin composition according to any one of claims 1 to 5.

7. A touch panel having a cured film obtained by curing the photosensitive resin composition according to claim 6.

8. The touch panel according to claim 7, having a cured film having a refractive index of 1.60 or more and 1.75 or less at a wavelength of 550 nm, a transmittance of 90% or more at a wavelength of 400 nm, a transmittance of 40% or less at a wavelength of 330 nm, and a cured film having a cured film surface roughness quantitative value Ra of 0.1 nm or more and 5.0 nm or less.

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