resin composition

Abstract

To provide a resin composition which can obtain a cured product excellent in adhesion between a conductor layer and the cured product even after HAST test; and a circuit board using the resin composition and a semiconductor chip package.SOLUTION: A resin composition contains (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, in which an amount of chloride ions contained in the resin composition measured according to sample combustion-ion chromatograph method (BS EN 14582 2007) is 50 ppm or less.SELECTED DRAWING: None

Description

[Technical Field]

[0001] This invention relates to a resin composition. Furthermore, this invention relates to a circuit board and a semiconductor chip package using a resin composition. [Background technology]

[0002] In recent years, the demand for small, high-performance electronic devices such as smartphones and tablet devices has increased, and consequently, there is a growing need for even higher performance insulating materials that can be used as sealing or insulating layers in these small electronic devices. Such insulating materials include, for example, those formed by curing resin compositions (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2013-237715 [Patent Document 2] Patent No. 6288344 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] The inventors of the present invention investigated resin compositions that can form sealing layers and insulating layers, and found that while the coefficient of thermal expansion (CTE) can be normally reduced by including inorganic fillers in the resin composition, environmental tests (HAST tests) conducted under high temperature and high humidity conditions reduce the adhesion between the insulating layer and the conductive layer such as copper foil.

[0005] The present invention was devised in view of the above-mentioned problems, and aims to provide a resin composition that can produce a cured product with excellent adhesion to the conductor layer even after HAST testing; a circuit board and a semiconductor chip package using the resin composition. [Means for solving the problem]

[0006] As a result of diligent research to solve the aforementioned problems, the inventors of the present invention have found that by keeping the amount of chloride ions contained in the resin composition below a certain value, it is possible to obtain a cured product with excellent adhesion to the conductive layer even after HAST testing, and have completed the present invention.

[0007] In other words, the present invention includes the following: [1] (A) epoxy resin, (B) Hardener, and (C) A resin composition containing an inorganic filler, A resin composition in which the amount of chloride ions contained in the resin composition is 50 ppm or less, as measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007). [2] The resin composition according to [1], wherein the content of component (C) is 80% by mass or more, when the nonvolatile components in the resin composition are taken as 100% by mass. [3] The coefficient of thermal expansion of the cured product obtained by heat-curing the resin composition at 180°C for 90 minutes is 15 ppm. / ℃ The resin composition described in [1] or [2] below. [4] A resin composition according to any one of [1] to [3], wherein component (B) is an acid anhydride-based curing agent. [5] The resin composition according to any one of [1] to [4], wherein the resin composition is liquid. [6] A resin composition for sealing or insulating layer, as described in any of [1] to [5]. [7] A circuit board comprising an insulating layer formed from a cured product of any of the resin compositions described in [1] to [6]. A semiconductor chip package comprising the circuit board described in [8] [7] and a semiconductor chip mounted on the circuit board. [9] A semiconductor chip package comprising a semiconductor chip and a cured product of any of the resin compositions described in [1] to [6] for sealing the semiconductor chip. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin composition capable of obtaining a cured product having excellent adhesion to a conductor layer even after a HAST test; a circuit board and a semiconductor chip package using the resin composition.

Embodiments for Carrying Out the Invention

[0009] Hereinafter, the present invention will be described in detail with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples given below, and can be arbitrarily modified and implemented without departing from the scope of the claims of the present invention and its equivalent scope. Also, "ppm" is based on mass unless otherwise specified.

[0010] [Resin Composition] The resin composition of the present invention is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, and the amount of chloride ions contained in the resin composition measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007) is 50 ppm or less. By setting the amount of chloride ions contained in the resin composition to 50 ppm or less, it becomes possible to obtain a cured product having excellent adhesion to a conductor layer such as a copper foil even after a HAST test.

[0011] As described above, by increasing the content of the inorganic filler in the resin composition, the coefficient of thermal expansion can be reduced, but the adhesion to the conductor layer after the HAST test decreases.

[0012] However, as a result of intensive studies by the present inventor, by setting the amount of chloride ions contained in the resin composition to 50 ppm or less, it becomes possible to improve the adhesion to the conductor layer after the HAST test.

[0013] The present inventor speculates as follows on the mechanism by which the excellent advantages described above can be obtained by setting the amount of chloride ions contained in the resin composition to 50 ppm or less. However, the technical scope of the present invention is not limited by the mechanism described below. (A) component may contain epichlorohydrin as an impurity. By removing this epichlorohydrin, corrosion of the conductor layer such as a copper foil by chloride ions of epichlorohydrin is suppressed. As a result, even after the HAST test, it is possible to obtain a cured product having excellent adhesion to the conductor layer. Therefore, the present invention is also excellent in that even if a large amount of an inorganic filler is contained in the resin composition, the coefficient of thermal expansion can be reduced, and it can be made compatible with improving the adhesion to the conductor layer after the HAST test.

[0014] Further, the resin composition may further contain an arbitrary component in combination with the (A) to (C) components. Examples of the arbitrary component include (D) a curing accelerator and (E) other additives. Hereinafter, each component contained in the resin composition of the present invention will be described in detail.

[0015] <(A) Epoxy resin> The resin composition contains (A) epoxy resin as the (A) component. Examples of the (A) epoxy resin include bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolak type epoxy resin, phenol novolak type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolak type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenyl ethane type epoxy resin, etc. The epoxy resin may be used alone or in combination of two or more.

[0016] The resin composition preferably contains an epoxy resin having two or more epoxy groups in one molecule as (A) epoxy resin. From the viewpoint of significantly obtaining the desired effects of the present invention, the ratio of the epoxy resin having two or more epoxy groups in one molecule to 100% by mass of the nonvolatile component of (A) epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0017] Epoxy resins include epoxy resins that are liquid at 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at 20°C (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition may use (A) liquid epoxy resin, solid epoxy resin, or a combination of liquid epoxy resin and solid epoxy resin. Among these, it is preferable to use liquid epoxy resin from the viewpoint of reducing the viscosity of the resin composition.

[0018] As the liquid epoxy resin, a liquid epoxy resin having two or more epoxy groups in one molecule is preferred.

[0019] Preferred liquid epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin; alicyclic epoxy resins such as glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolac type epoxy resin, and alicyclic epoxy resins having an ester skeleton; cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, glycidylamine type epoxy resin; and epoxy resins having a butadiene structure, with glycidylamine type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, and alicyclic epoxy resin being more preferred.

[0020] Specific examples of liquid epoxy resins include DIC's "HP4032," "HP4032D," and "HP4032SS" (naphthalene-type epoxy resin); Mitsubishi Chemical's "828US," "jER828EL," "825," and "Epicote 828EL" (bisphenol A-type epoxy resin); Mitsubishi Chemical's "jER807" and "1750" (bisphenol F-type epoxy resin); Mitsubishi Chemical's "jER152" (phenol novolac-type epoxy resin); Mitsubishi Chemical's "630" and "630LSD" (glycidylamine-type epoxy resin); and Nippon Steel & Sumitomo Metal Chemical's products. Examples include "ZX1059" (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); "EX-721" (glycidyl ester type epoxy resin) from Nagase ChemteX Corporation; "CEL-2021P" (alicyclic epoxy resin with an ester skeleton) from Daicel Corporation; "PB-3600" (epoxy resin with a butadiene structure) from Daicel Corporation; "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) from Nippon Steel & Sumitomo Metal Chemical Corporation; and "EP3950L" (glycidylamine type epoxy resin) from ADEKA Corporation. These may be used individually or in combination of two or more types.

[0021] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups per molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups per molecule is more preferred.

[0022] Preferred solid epoxy resins include bixylenol-type epoxy resin, naphthalene-type epoxy resin, naphthalene-type tetrafunctional epoxy resin, cresol novolac-type epoxy resin, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, naphthol-type epoxy resin, biphenyl-type epoxy resin, naphthylene ether-type epoxy resin, anthracene-type epoxy resin, bisphenol A-type epoxy resin, bisphenol AF-type epoxy resin, and tetraphenylethane-type epoxy resin, with bisphenol AF-type epoxy resin, biphenyl-type epoxy resin, and bixylenol-type epoxy resin being more preferred.

[0023] Specific examples of solid epoxy resins include DIC's "HP4032H" (naphthalene-type epoxy resin); DIC's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC's "N-690" (cresol novolac-type epoxy resin); DIC's "N-695" (cresol novolac-type epoxy resin); DIC's "HP-7200" (dicyclopentadiene-type epoxy resin); and DIC's "HP -7200HH", "HP-7200H", "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); Nippon Kayaku Co., Ltd.'s "EPPN-502H" (trisphenol type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC7000L" (naphthol novolac type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC3000H", "NC3000", "NC 3000L, NC3100 (biphenyl type epoxy resin); Nippon Steel & Sumitomo Metal Chemical's "ESN475V" (naphthol type epoxy resin); Nippon Steel & Sumitomo Metal Chemical's "ESN485" (naphthol novolac type epoxy resin); Mitsubishi Chemical's "YX4000H", "YX4000", "YL6121" (biphenyl type epoxy resin); Mitsubishi Chemical's "YX4000HK" (bixylenol type epoxy resin); Mitsubishi Chemical's "YX8 Examples include "800" (anthracene-type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemical Co., Ltd.; "YL7760" (bisphenol AF-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (solid bisphenol A-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "jER1031S" (tetraphenylethane-type epoxy resin) manufactured by Mitsubishi Chemical Corporation. These can be used individually or in combination of two or more types.

[0024] However, the commercially available epoxy resins mentioned above may contain epichlorohydrin. Therefore, commercially available epoxy resins are usually purified to remove epichlorohydrin before use. This reduces the amount of chloride ions in the resin composition. Examples of purification methods include distillation.

[0025] (A) When using a combination of liquid epoxy resin and solid epoxy resin as the epoxy resin, their mass ratio (liquid epoxy resin:solid epoxy resin) is preferably 1:1 to 1:20, more preferably 1:1.5 to 1:15, and particularly preferably 1:2 to 1:10. By having the mass ratio of liquid epoxy resin to solid epoxy resin within this range, the desired effects of the present invention can be remarkably obtained. Furthermore, when used in the form of a resin sheet, appropriate tackiness is provided. Also, when used in the form of a resin sheet, sufficient flexibility is obtained, improving handling. Furthermore, a cured product with sufficient breaking strength can usually be obtained.

[0026] (A) The epoxy equivalent of the epoxy resin is preferably 50 g / eq to 5000 g / eq, more preferably 50 g / eq to 3000 g / eq, even more preferably 80 g / eq to 2000 g / eq, and even more preferably 110 g / eq to 1000 g / eq. This range ensures sufficient crosslinking density in the cured resin composition layer, resulting in an insulating layer with low surface roughness. The epoxy equivalent is the mass of resin containing one equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0027] (A) The weight-average molecular weight (Mw) of the epoxy resin is preferably 100 to 5000, more preferably 250 to 3000, and even more preferably 400 to 1500, from the viewpoint of significantly obtaining the desired effects of the present invention. The weight-average molecular weight of a resin can be measured as a polystyrene equivalent using gel permeation chromatography (GPC).

[0028] (A) From the viewpoint of obtaining an insulating layer exhibiting good mechanical strength and insulation reliability, the epoxy resin content is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, when the non-volatile components in the resin composition are taken as 100% by mass. From the viewpoint of significantly obtaining the desired effects of the present invention, the upper limit of the epoxy resin content is preferably 20% by mass or less, more preferably 15% by mass or less, and particularly preferably 10% by mass or less. In the present invention, unless otherwise specified, the content of each component in the resin composition is the value when the non-volatile components in the resin composition are taken as 100% by mass.

[0029] From the viewpoint of keeping the chloride ion content in the resin composition below 50 ppm, it is generally preferable to distill the epoxy resin (A) before preparing the resin composition to remove epichlorohydrin, which is the main component of impurities in the epoxy resin (A). The distillation temperature of the epoxy resin (A), the pressure used during distillation, etc., can be appropriately changed depending on the type of epoxy resin (A).

[0030] <(B) Hardener> The resin composition contains a curing agent (B) as component (B). The curing agent (B) typically has the function of curing the resin composition by reacting with component (A). The curing agent (B) may be used alone or in combination of two or more types.

[0031] (B) Examples of curing agents include acid anhydride-based curing agents, active ester-based curing agents, phenol-based curing agents, naphthol-based curing agents, benzoxazine-based curing agents, cyanate ester-based curing agents, carbodiimide-based curing agents, and amine-based curing agents. Among these, it is preferable to include an acid anhydride-based curing agent from the viewpoint of obtaining the effects of the present invention in particular.

[0032] Examples of acid anhydride-based curing agents include curing agents having one or more acid anhydride groups in one molecule. Specific examples of acid anhydride-based curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexen-1,2-dicarboxylic acid anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenone tetracarboxylic acid di Examples include anhydrides, biphenyltetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, oxydiphthalic acid dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic acid dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymer-type acid anhydrides such as styrene-maleic acid resin obtained by copolymerizing styrene and maleic acid.

[0033] Examples of commercially available acid anhydride-based curing agents include "MH-700" manufactured by Shin Nippon Rika Co., Ltd.

[0034] As the active ester curing agent, compounds having one or more active ester groups in one molecule can be used. Among these, compounds having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are preferred as the active ester curing agent. The active ester curing agent is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferred.

[0035] Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0036] Examples of phenol compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolac. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by the condensation of two phenol molecules with one dicyclopentadiene molecule.

[0037] Preferred examples of active ester curing agents include active ester curing agents containing a dicyclopentadiene-type diphenol structure, active ester curing agents containing a naphthalene structure, active ester curing agents containing an acetylated phenol novolac, and active ester curing agents containing a benzoylated phenol novolac. Among these, active ester curing agents containing a naphthalene structure and active ester curing agents containing a dicyclopentadiene-type diphenol structure are more preferred. The term "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0038] Commercially available active ester curing agents include: "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T", "HPC-8000H-65TM", and "EXB-8000L-65TM" (manufactured by DIC Corporation) as active ester curing agents containing a dicyclopentadiene-type diphenol structure; "EXB9416-70BK" and "EXB-8150-65T" (manufactured by DIC Corporation) as active ester curing agents containing a naphthalene structure; and active ester curing agents containing acetylated phenol novolacs. Examples of curing agents include "DC808" (manufactured by Mitsubishi Chemical Corporation); "YLH1026" (manufactured by Mitsubishi Chemical Corporation) as an active ester curing agent containing a benzoylated phenol novolac; "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester curing agent that is an acetylated phenol novolac; and "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), and "YLH1048" (manufactured by Mitsubishi Chemical Corporation) as active ester curing agents that are benzoylated phenol novolacs.

[0039] From the viewpoint of heat resistance and water resistance, phenolic and naphthol-based curing agents are preferred if they have a novolac structure. Furthermore, from the viewpoint of adhesion to the conductive layer, nitrogen-containing phenolic curing agents are preferred, and triazine skeleton-containing phenolic curing agents are more preferred.

[0040] Specific examples of phenol-based and naphthol-based curing agents include, for example, "MEH-7700," "MEH-7810," and "MEH-7851" from Meiwa Chemical Co., Ltd.; "NHN," "CBN," and "GPH" from Nippon Kayaku Co., Ltd.; "SN170," "SN180," "SN190," "SN475," "SN485," "SN495," "SN-495V," and "SN375" from Nippon Steel & Sumitomo Metal Chemical Co., Ltd.; and "TD-2090," "LA-7052," "LA-7054," "LA-1356," "LA-3018-50P," and "EXB-9500" from DIC Corporation.

[0041] Specific examples of benzoxazine-based curing agents include "JBZ-OD100" (benzoxazine ring equivalent 218), "JBZ-OP100D" (benzoxazine ring equivalent 218), and "ODA-BOZ" (benzoxazine ring equivalent 218) manufactured by JFE Chemical Corporation; "Pd" (benzoxazine ring equivalent 217) and "Fa" (benzoxazine ring equivalent 217) manufactured by Shikoku Chemicals Co., Ltd.; and "HFB2006M" (benzoxazine ring equivalent 432) manufactured by Showa Polymer Co., Ltd.

[0042] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl) thioether, and bis(4-cyanatephenyl) ether; polyfunctional cyanate resins derived from phenol novolacs and cresol novolacs, etc.; and prepolymers in which these cyanate resins are partially triazined. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (phenol novolac type polyfunctional cyanate ester resin), "ULL-950S" (polyfunctional cyanate ester resin), "BA230", and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate is triazined and trimerized), all manufactured by Lonza Japan.

[0043] Specific examples of carbodiimide-based curing agents include Carbodilite® V-03 (carbodiimide group equivalent: 216), V-05 (carbodiimide group equivalent: 262), V-07 (carbodiimide group equivalent: 200); V-09 (carbodiimide group equivalent: 200) manufactured by Nisshinbo Chemical Co., Ltd., and Stavaxol® P (carbodiimide group equivalent: 302) manufactured by Rhein Chemie.

[0044] Examples of amine-based curing agents include curing agents having one or more amino groups in one molecule, such as aliphatic amines, polyetheramines, alicyclic amines, and aromatic amines. Among these, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. The amine-based curing agent is preferably a primary amine or a secondary amine, and more preferably a primary amine. Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxy Examples include bis(4-(4-aminophenoxy)phenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. Commercial amine-based curing agents may also be used, such as "KAYABOND C-200S", "KAYABOND C-100", "KAYAHARD AA", "KAYAHARD AB", and "KAYAHARD AS" from Nippon Kayaku Co., Ltd., and "Epicure W" from Mitsubishi Chemical Corporation.

[0045] The ratio of (A) epoxy resin to (B) curing agent is the ratio of [total number of epoxy groups in epoxy resin] to [total number of reactive groups in curing agent], preferably in the range of 1:0.01 to 1:10, more preferably 1:0.1 to 1:5, and even more preferably 1:1 to 1:3. Here, the reactive groups of the curing agent are activated hydroxyl groups, etc., and vary depending on the type of curing agent. The total number of epoxy groups in the epoxy resin is the sum of the values ​​obtained by dividing the solid content mass of each epoxy resin by the epoxy equivalent for all epoxy resins, and the total number of reactive groups in the curing agent is the sum of the values ​​obtained by dividing the solid content mass of each curing agent by the reactive group equivalent for all curing agents. By setting the ratio of epoxy resin to curing agent within this range, the heat resistance of the cured product of the resin composition is further improved.

[0046] (B) From the viewpoint of significantly obtaining the desired effects of the present invention, the content of the curing agent is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 3% by mass or more, preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 5% by mass or less, based on 100% by mass of the nonvolatile components in the resin composition.

[0047] <(C) Inorganic filler> The resin composition contains (C) an inorganic filler as component (C). By using (C) an inorganic filler, the coefficient of linear thermal expansion of the cured product of the resin composition can be reduced.

[0048] Inorganic compounds are used as materials for inorganic fillers. Examples of inorganic filler materials include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, calcium carbonate and silica are preferred, and silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Spherical silica is also preferred. (C) Inorganic fillers may be used individually or in combination of two or more types.

[0049] Examples of commercially available products containing component (C) include "ST7030-20" from Nippon Steel Chemical & Material Co., Ltd.; "MSS-6" and "AC-5V" from Ryusen Co., Ltd.; "SP60-05" and "SP507-05" from Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" from Admatex Co., Ltd.; "UFP-30", "SFP-130MC", "FB-7SDC", "FB-5SDC", and "FB-3SDC" from Denka Co., Ltd.; "Silfil NSS-3N", "Silfil NSS-4N", and "Silfil NSS-5N" from Tokuyama Corporation; and "SC2500SQ", "SO-C4", "SO-C2", "SO-C1", and "FE9" from Admatex Co., Ltd.

[0050] The specific surface area of ​​component (C) is preferably 1 m². 2 / g or more, more preferably 2m 2 / g or more, particularly preferably 3m 2 It must be 1 / g or more. There is no particular upper limit, but preferably 60m2 / g or less, 50m 2 / g or less or 40m 2 The value is less than or equal to / g. The specific surface area is obtained by adsorbing nitrogen gas onto the sample surface using a specific surface area measuring device (Macsorb HM-1210, manufactured by Mountec Co., Ltd.) according to the BET method, and then calculating the specific surface area using the BET multipoint method.

[0051] (C) The average particle size of component C is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, preferably 20 μm or less, more preferably 15 μm or less, and even more preferably 10 μm or less, from the viewpoint of significantly obtaining the desired effects of the present invention.

[0052] The average particle size of component (C) can be measured by a laser diffraction-scattering method based on Mie scattering theory. Specifically, a volume-based particle size distribution of the inorganic filler can be created using a laser diffraction-scattering particle size distribution analyzer, and the median diameter can be used as the average particle size. A sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing them using ultrasound for 10 minutes. The sample can be measured using a laser diffraction-type particle size distribution analyzer with blue and red light source wavelengths, and the volume-based particle size distribution of component (A) can be measured using a flow cell method. The average particle size can then be calculated as the median diameter from the obtained particle size distribution. An example of a laser diffraction-type particle size distribution analyzer is the "LA-960" manufactured by Horiba, Ltd.

[0053] (C) Component is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of surface treatment agents include vinylsilane coupling agents, (meth)acrylic coupling agents, fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, titanate coupling agents, etc. Among these, vinylsilane coupling agents, (meth)acrylic coupling agents, aminosilane coupling agents, epoxysilane coupling agents, and silane coupling agents are preferred from the viewpoint of significantly obtaining the effects of the present invention, and aminosilane coupling agents, epoxysilane coupling agents, and silane coupling agents are more preferred. Furthermore, the surface treatment agent may be used alone or two or more types may be used in any combination.

[0054] Examples of commercially available surface treatment agents include Shin-Etsu Chemical Co., Ltd.'s "KBM1003" (vinyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM503" (3-methacryloxypropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), and Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxy Examples include sisilane, Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane), etc.

[0055] The degree of surface treatment with the surface treatment agent preferably falls within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, it is preferable that 100 parts by mass of the inorganic filler is surface-treated with 0.2 to 5 parts by mass of the surface treatment agent, more preferably 0.2 to 3 parts by mass, and still more preferably 0.3 to 2 parts by mass.

[0056] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of the inorganic filler is preferably 0.02 mg / m 2 or more, more preferably 0.1 mg / m 2 or more, and still more preferably 0.2 mg / m 2 or more. On the other hand, from the viewpoint of suppressing an increase in the melt viscosity of the resin varnish and the melt viscosity in the sheet form, it is preferably 1 mg / m 2 or less, more preferably 0.8 mg / m 2 or less, and still more preferably 0.5 mg / m 2 or less.

[0057] The amount of carbon per unit surface area of the inorganic filler can be measured after washing the surface-treated inorganic filler with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with the surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by Horiba, Ltd. etc. can be used.

[0058] (C) The content (mass%) of component (C) is preferably 80% by mass or more, more preferably 83% by mass or more, even more preferably 85% by mass or more, preferably 95% by mass or less, more preferably 93% by mass or less, and even more preferably 90% by mass or less, when the non-volatile components in the resin composition are considered to be 100% by mass, from the viewpoint of effectively lowering the linear thermal expansion coefficient of the resin composition. In the present invention, even if the resin composition contains a large amount of inorganic filler, it is possible to maintain adhesion after the HAST test, thus making it possible to achieve both a reduction in the thermal expansion coefficient and an improvement in adhesion between the resin and the conductor layer after the HAST test.

[0059] <(D) Curing accelerator> The resin composition may contain (D) a curing accelerator as an optional component. Examples of curing accelerators include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, and metal-based curing accelerators, with amine-based and imidazole-based curing accelerators being preferred, and amine-based curing accelerators being more preferred. The curing accelerator may be used alone or in combination of two or more types.

[0060] Examples of phosphorus-based curing accelerators include triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate, with triphenylphosphine and tetrabutylphosphonium decanoate being preferred.

[0061] Examples of amine-based curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene, with 4-dimethylaminopyridine and 1,8-diazabicyclo(5,4,0)-undecene being preferred.

[0062] Examples of imidazole-based curing accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-Cyanoethyl-2-methylimidazole, 1-Cyanoethyl-2-undecylimidazole, 1-Cyanoethyl-2-ethyl-4-methylimidazole, 1-Cyanoethyl-2-phenylimidazole, 1-Cyanoethyl-2-undecylimidazolium trimellitate, 1-Cyanoethyl-2-phenylimidazolium trimellitate, 2,4-Diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2, 4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanurate adduct, 2-phenylimidazole isocyanurate adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-F Examples include imidazole compounds such as phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds with epoxy resins, with 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole being preferred.

[0063] Commercial imidazole-based curing accelerators may be used, such as "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0064] Examples of guanidine-based curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]deca-5-ene, and 7-methyl-1,5,7-triazabicyclo[4.4.0]deca-5-ene. Examples include ro[4.4.0]deca-5-ene, 1-methyl biguanide, 1-ethyl biguanide, 1-n-butyl biguanide, 1-n-octadecyl biguanide, 1,1-dimethyl biguanide, 1,1-diethyl biguanide, 1-cyclohexyl biguanide, 1-allyl biguanide, 1-phenyl biguanide, 1-(o-tolyl) biguanide, and the like, with dicyandiamide and 1,5,7-triazabicyclo[4.4.0]deca-5-ene being preferred.

[0065] Examples of metal-based hardening accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0066] (C) The content of the curing accelerator is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, particularly preferably 0.05% by mass or more, preferably 3% by mass or less, more preferably 1% by mass or less, and particularly preferably 0.5% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass.

[0067] <(E) Other additives> In addition to the components described above, the resin composition may also contain other additives as optional components. Examples of such additives include thermoplastic resins, flame retardants, organic fillers, organometallic compounds such as organic copper compounds, organic zinc compounds, and organic cobalt compounds, thickeners, defoamers, leveling agents, adhesion promoters, colorants, pigments, and other resin additives. These additives may be used individually or in combination of two or more types in any ratio.

[0068] Examples of colorants and pigments include fine particles such as melamine and organic bentonite; phthalocyanine blue; phthalocyanine green; iodine green; diazo yellow; crystal violet; titanium dioxide; carbon black such as "MA-600MJ-S" manufactured by Mitsubishi Chemical Corporation; and naphthalene black.

[0069] The content of colorants and pigments is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, particularly preferably 0.1% by mass or more, preferably 3% by mass or less, more preferably 1% by mass or less, and particularly preferably 0.5% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass.

[0070] The resin composition described above may contain a solvent as needed, but it is preferable that it be a solvent-free resin composition that is substantially free of solvents. Even without containing a solvent, the resin composition can be fluidized when molded using a compression molding method, and excellent compression moldability can be achieved. Therefore, this resin composition can be used as a solvent-free resin composition. "Substantially free of solvents" means, for example, that the solvent content is 1% by mass or less of the total solvent-free resin composition.

[0071] <Method for producing resin compositions> The resin composition of the present invention can be manufactured, for example, by stirring the compounding components using a stirring device such as a rotary mixer. As described above, it is preferable to remove epichlorohydrin, which is the main component of impurities in (A) epoxy resin, before manufacturing the resin composition. It is also preferable to remove impurities contained in components (B) to (E) as needed.

[0072] <Characteristics and physical properties of resin compositions> The resin composition of the present invention may be liquid or solid, but it is preferable that it be liquid during molding. For example, a resin composition that is liquid at room temperature (e.g., 20°C) may be molded by compression molding at room temperature without any special temperature adjustment, or it may be heated to an appropriate temperature and then molded by compression molding. Alternatively, a resin composition that is liquid at room temperature may be filled into a cartridge, the resin composition may be discharged from the cartridge, and then molded by compression molding. Furthermore, a resin composition that is solid at room temperature can usually become liquid by adjusting its temperature to a higher temperature (e.g., 130°C), so it can be molded by compression molding with appropriate temperature adjustment such as heating. The above-mentioned resin composition can usually become liquid at an appropriate temperature even without containing a solvent, and can be used, for example, as a liquid sealant.

[0073] Here, "liquid" refers to a resin composition whose minimum melt viscosity is 4000 poise or less. The details of the minimum melt viscosity of the resin composition are preferably 4000 Pa·s or less, more preferably 3000 poise or less, even more preferably 2000 poise or less, preferably 50 poise or more, more preferably 60 poise or more, and even more preferably 70 poise or more. Here, the term "minimum melt viscosity" refers to the minimum melt viscosity at 60°C to 200°C. The minimum melt viscosity can be measured using a dynamic viscoelasticity measuring device. The measurement of the minimum melt viscosity can be performed according to the method described in the examples below.

[0074] The cured product obtained by heat-curing the resin composition of the present invention at 180°C for 90 minutes typically exhibits a low coefficient of thermal expansion. Therefore, the cured product provides a sealing layer or insulating layer with a low coefficient of thermal expansion. The coefficient of thermal expansion is preferably 15 ppm. / ℃ The following is more optimal: 10 ppm / ℃ Further preferably 9 ppm / ℃ The following applies. On the other hand, the lower limit of the coefficient of thermal expansion is 1 ppm. / ℃ The above may be applicable. The coefficient of thermal expansion can be measured according to the method described in the examples below.

[0075] The cured product obtained by heat-curing the resin composition of the present invention at 180°C for 90 minutes exhibits high shear strength with copper after the HAST test, thus demonstrating excellent copper adhesion after the HAST test. Therefore, the cured product provides a sealing layer or insulating layer with excellent copper adhesion after the HAST test. The shear strength after the HAST test is preferably 0.5 kgf / mm². 2 More preferably 0.6 kgf / mm 2 More preferably 0.7 kgf / mm² 2 That concludes the explanation. On the other hand, the upper limit for shear strength is 10 kgf / mm². 2 The following are possible. The copper adhesion after the HAST test can be measured according to the method described in the examples below.

[0076] The chloride ion content of the resin composition of the present invention is 50 ppm or less, preferably 40 ppm or less, more preferably 30 ppm or less, and 25 ppm or less. By keeping the chloride ion content within this range, it is possible to obtain a cured product with excellent adhesion to the conductive layer even after HAST testing. The lower limit of the chloride ion content is not particularly limited, but it can be 0 ppm or more, 0.1 ppm or more, etc. The chloride ion content was measured in accordance with the sample combustion-ion chromatography method (BS EN 14582 2007).

[0077] Because the resin composition has the properties described above, it can be suitably used as a resin composition for encapsulating electronic devices such as organic EL devices and semiconductors (a resin composition for encapsulation), and in particular, it can be suitably used as a resin composition for encapsulating semiconductors (a resin composition for semiconductor encapsulation), and preferably as a resin composition for encapsulating semiconductor chips (a resin composition for semiconductor chip encapsulation). In addition, the resin composition can be used as a resin composition for insulating layers other than for encapsulation purposes. For example, the above-mentioned resin composition can be suitably used as a resin composition for forming an insulating layer of a semiconductor chip package (a resin composition for an insulating layer of a semiconductor chip package), and as a resin composition for forming an insulating layer of a circuit board (including a printed wiring board) (a resin composition for an insulating layer of a circuit board).

[0078] Examples of semiconductor chip packages include FC-CSP, MIS-BGA package, ETS-BGA package, fan-out type WLP (Wafer Level Package), fan-in type WLP, fan-out type PLP (Panel Level Package), and fan-in type PLP.

[0079] Furthermore, the aforementioned resin composition may also be used as an underfill material, for example, as a material for MUF (Molding Under Filling) used after connecting a semiconductor chip to a substrate.

[0080] Furthermore, the aforementioned resin composition can be used in a wide range of applications where resin compositions are used, such as sheet-like laminated materials like resin sheets and prepregs, solder resists, die bonding materials, hole-filling resins, and component-embedding resins.

[0081] [Resin sheet] The resin sheet of the present invention comprises a support and a resin composition layer provided on the support. The resin composition layer is a layer containing the resin composition of the present invention and is usually formed from the resin composition.

[0082] From the viewpoint of thinning, the thickness of the resin composition layer is preferably 600 μm or less, more preferably 550 μm or less, even more preferably 500 μm or less, 400 μm or less, 350 μm or less, 300 μm or less, or 200 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited and may be, for example, 1 μm or more, 5 μm or more, 10 μm or more, etc.

[0083] Examples of support materials include films made of plastic materials, metal foils, and release paper, with films made of plastic materials and metal foils being preferred.

[0084] When using a film made of plastic material as a support, examples of plastic materials include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"); polycarbonate (hereinafter sometimes abbreviated as "PC"); acrylic polymers such as polymethyl methacrylate (hereinafter sometimes abbreviated as "PMMA"); cyclic polyolefins; triacetylcellulose (hereinafter sometimes abbreviated as "TAC"); polyether sulfide (hereinafter sometimes abbreviated as "PES"); polyether ketones; polyimides; and others. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0085] When using metal foil as a support, examples of metal foil include copper foil and aluminum foil. Among these, copper foil is preferred. As for copper foil, foil made of single-metal copper may be used, or foil made of an alloy of copper with another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0086] The support may be subjected to treatments such as matte finish, corona treatment, or antistatic treatment on the surface that bonds with the resin composition layer.

[0087] Furthermore, as the support, a support with a release layer having a release layer on the surface that bonds with the resin composition layer may be used. Examples of release agents used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Examples of commercially available release agents include the alkyd resin-based release agents "SK-1", "AL-5", and "AL-7" manufactured by Lintec Corporation. Examples of supports with a release layer include "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Corporation, and "Unipeel" manufactured by Unitika Corporation.

[0088] The thickness of the support is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When using a support with a release layer, it is preferable that the overall thickness of the support with the release layer is within the above range.

[0089] Resin sheets can be manufactured, for example, by coating a resin composition onto a support using a coating device such as a die coater. Alternatively, if necessary, a resin varnish may be prepared by dissolving the resin composition in an organic solvent, and the resin sheet may be manufactured by coating it with this resin varnish. By using a solvent, the viscosity can be adjusted to improve the coatability. When using a resin varnish, the resin varnish is usually dried after coating to form a resin composition layer.

[0090] Examples of organic solvents include ketone solvents such as acetone, methyl ethyl ketone, and cyclohexanone; acetic acid ester solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitol solvents such as cellosolve and butyl carbitol; aromatic hydrocarbon solvents such as toluene and xylene; and amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. Organic solvents may be used individually or in combination of two or more in any ratio.

[0091] Drying may be carried out by known methods such as heating or blowing hot air. The drying conditions are such that the content of the organic solvent in the resin composition layer is usually 10% by mass or less, preferably 5% by mass or less. Although it varies depending on the boiling point of the organic solvent in the resin varnish, for example, when using a resin varnish containing 30% to 60% by mass of organic solvent, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0092] The resin sheet may include any layer other than the support and the resin composition layer, as needed. For example, in the resin sheet, a protective film similar to that of the support may be provided on the side of the resin composition layer that is not bonded to the support (i.e., the side opposite to the support). The thickness of the protective film is, for example, 1 μm to 40 μm. The protective film can prevent dirt and other debris from adhering to the surface of the resin composition layer and prevent scratches. If the resin sheet has a protective film, the resin sheet can be used by peeling off the protective film. The resin sheet can also be stored by rolling it up.

[0093] Resin sheets can be suitably used to form an insulating layer in the manufacturing of semiconductor chip packages (resin sheets for insulating semiconductor chip packages). For example, resin sheets can be used to form an insulating layer on a circuit board (resin sheets for insulating layers on circuit boards). Examples of packages using such boards include FC-CSP, MIS-BGA packages, and ETS-BGA packages.

[0094] Furthermore, the resin sheet can be suitably used to encapsulate semiconductor chips (resin sheet for semiconductor chip encapsulation). Applicable semiconductor chip packages include, for example, fan-out type WLP, fan-in type WLP, fan-out type PLP, and fan-in type PLP.

[0095] Furthermore, the resin sheet may be used as the material for the MUF (Microwave Interface) used after the semiconductor chip is connected to the substrate.

[0096] Furthermore, resin sheets can be used in a wide range of other applications where high insulation reliability is required. For example, resin sheets can be suitably used to form an insulating layer on circuit boards such as printed wiring boards.

[0097] [Circuit board] The circuit board of the present invention includes an insulating layer formed from a cured product of the resin composition of the present invention. This circuit board can be manufactured, for example, by a manufacturing method comprising the following steps (1) and (2). (1) A step of forming a resin composition layer on a substrate. (2) A step of forming an insulating layer by heat curing the resin composition layer.

[0098] In step (1), a substrate is prepared. Examples of substrates include glass epoxy substrates, metal substrates (such as stainless steel or cold-rolled steel sheet (SPCC)), polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may also have a metal layer, such as copper foil, on its surface as part of the substrate. For example, a substrate having a peelable first metal layer and a second metal layer on both surfaces may be used. When such a substrate is used, a conductor layer, which can function as a wiring layer for circuit wiring, is usually formed on the side of the second metal layer opposite to the first metal layer. Examples of materials for the metal layer include copper foil, copper foil with carriers, and the material for the conductor layer described later, with copper foil being preferred. Commercially available products can be used as substrates having such metal layers, for example, the ultra-thin copper foil with carrier copper foil "Micro Thin" manufactured by Mitsui Mining & Smelting Co., Ltd.

[0099] Furthermore, a conductive layer may be formed on one or both surfaces of the substrate. In the following description, a component including the substrate and the conductive layer formed on the surface of the substrate may be appropriately referred to as a "substrate with wiring layer". Examples of conductive materials included in the conductive layer include materials containing one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. As the conductive material, a single metal may be used, or an alloy may be used. Examples of alloys include alloys of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy). Among these, from the viewpoint of versatility in conductive layer formation, cost, and ease of patterning, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper as single metals; and nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy alloys as alloys; are preferred. Among these, single metals such as chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper; and nickel-chromium alloys are more preferred, with single metal copper being particularly preferred.

[0100] The conductor layer may be patterned, for example, to function as a wiring layer. In this case, the line (circuit width) / space (width between circuits) ratio of the conductor layer is not particularly limited, but is preferably 20 / 20 μm or less (i.e., pitch of 40 μm or less), more preferably 10 / 10 μm or less, even more preferably 5 / 5 μm or less, even more preferably 1 / 1 μm or less, and particularly preferably 0.5 / 0.5 μm or more. The pitch does not need to be the same throughout the entire conductor layer. The minimum pitch of the conductor layer may be, for example, 40 μm or less, 36 μm or less, or 30 μm or less.

[0101] The thickness of the conductor layer depends on the design of the circuit board, but is preferably 3 μm to 35 μm, more preferably 5 μm to 30 μm, even more preferably 10 μm to 20 μm, and particularly preferably 15 μm to 20 μm.

[0102] The conductive layer can be formed by a method that includes, for example, the steps of laminating a dry film (photosensitive resist film) onto a substrate, forming a pattern by exposing and developing the dry film under predetermined conditions using a photomask to form a pattern dry film, forming a conductive layer by a plating method such as electroplating using the developed pattern dry film as a plating mask, and peeling off the pattern dry film. As the dry film, a photosensitive dry film made of a photoresist composition can be used, for example, a dry film made of a resin such as novolac resin or acrylic resin can be used. The lamination conditions between the substrate and the dry film may be the same as the lamination conditions between the substrate and the resin sheet described later. The dry film can be peeled off by using an alkaline peeling solution such as a sodium hydroxide solution.

[0103] After preparing the substrate, a resin composition layer is formed on the substrate. If a conductive layer is formed on the surface of the substrate, it is preferable to form the resin composition layer in such a way that the conductive layer is embedded in the resin composition layer.

[0104] The resin composition layer is formed, for example, by laminating a resin sheet and a substrate. This lamination can be performed, for example, by heat-pressing the resin sheet onto the substrate from the support side, thereby bonding the resin composition layer to the substrate. Examples of the member used to heat-press the resin sheet onto the substrate (hereinafter sometimes referred to as the "heat-pressing member") include a heated metal plate (such as a SUS end plate) or a metal roll (such as a SUS roll). It is preferable to press the resin sheet with the heat-pressing member via an elastic material such as heat-resistant rubber, rather than pressing the resin sheet directly onto the substrate, so that the resin sheet can adequately follow the surface irregularities of the substrate.

[0105] Lamination of the substrate and the resin sheet may be carried out, for example, by a vacuum lamination method. In the vacuum lamination method, the heat-pressing temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C. The heat-pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably in the range of 0.29 MPa to 1.47 MPa. The heat-pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination is preferably carried out under reduced pressure conditions of 13 hPa or less.

[0106] After lamination, the laminated resin sheets may be smoothed by pressing a heat-sealing member from the support side under normal pressure (atmospheric pressure). The pressing conditions for the smoothing process can be the same as the heat-sealing conditions for lamination. Lamination and smoothing may be performed continuously using a vacuum laminator.

[0107] Furthermore, the resin composition layer can be formed, for example, by compression molding. The specific operation of compression molding involves, for example, preparing an upper mold and a lower mold. Applying the resin composition to the substrate. Attaching the substrate coated with the resin composition to the lower mold. Then, clamping the upper and lower molds together and applying heat and pressure to the resin composition to perform compression molding.

[0108] Furthermore, the specific operation of the compression molding method may be as follows, for example: An upper mold and a lower mold are prepared as molds for compression molding. The resin composition is placed on the lower mold. The base material is attached to the upper mold. Then, the upper and lower molds are clamped together so that the resin composition on the lower mold is in contact with the base material attached to the upper mold, and heat and pressure are applied to perform compression molding.

[0109] The molding conditions in the compression molding method vary depending on the composition of the resin composition. The mold temperature during molding is preferably a temperature at which the resin composition exhibits excellent compression moldability, for example, preferably 80°C or higher, more preferably 100°C or higher, even more preferably 120°C or higher, preferably 200°C or lower, more preferably 170°C or lower, and even more preferably 150°C or lower. The pressure applied during molding is preferably 1 MPa or higher, more preferably 3 MPa or higher, even more preferably 5 MPa or higher, preferably 50 MPa or lower, more preferably 30 MPa or lower, and even more preferably 20 MPa or lower. The curing time is preferably 1 minute or more, more preferably 2 minutes or more, particularly preferably 5 minutes or more, preferably 60 minutes or less, more preferably 30 minutes or less, and especially preferably 20 minutes or less. Typically, the mold is removed after the formation of the resin composition layer. The mold may be removed before or after the heat curing of the resin composition layer.

[0110] After forming a resin composition layer on a substrate, the resin composition layer is heat-cured to form an insulating layer. The heat-curing conditions for the resin composition layer vary depending on the type of resin composition, but the curing temperature is usually in the range of 120°C to 240°C (preferably in the range of 150°C to 220°C, more preferably in the range of 170°C to 200°C), and the curing time is in the range of 5 minutes to 120 minutes (preferably in the range of 10 minutes to 100 minutes, more preferably in the range of 15 minutes to 90 minutes).

[0111] Before thermal curing the resin composition layer, the resin composition layer may be subjected to a preheating treatment by heating it at a temperature lower than the curing temperature. For example, prior to thermal curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C or higher but less than 120°C (preferably 60°C or higher but 110°C or lower, more preferably 70°C or higher but 100°C or lower) for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes).

[0112] As described above, a circuit board having an insulating layer can be manufactured. Furthermore, the method for manufacturing the circuit board may include any additional steps. For example, when a circuit board is manufactured using a resin sheet, the method for manufacturing the circuit board may include a step of peeling off the support of the resin sheet. The support may be peeled off before the thermal curing of the resin composition layer, or after the thermal curing of the resin composition layer.

[0113] A method for manufacturing a circuit board may include, for example, a step of polishing the surface of an insulating layer after forming the insulating layer. The polishing method is not particularly limited. For example, the surface of the insulating layer can be polished using a surface grinding machine.

[0114] A method for manufacturing a circuit board may include, for example, a step (3) of interlayer bonding of conductor layers, and a step of drilling holes in the so-called insulating layer. This allows for the formation of holes such as via holes and through holes in the insulating layer. Examples of methods for forming via holes include laser irradiation, etching, and mechanical drilling. The dimensions and shape of the via holes may be determined as appropriate according to the design of the circuit board. Step (3) may also involve interlayer bonding by polishing or grinding the insulating layer.

[0115] After the via holes are formed, it is preferable to perform a step to remove the smear inside the via holes. This step is sometimes called a desmear step. For example, when the conductive layer on the insulating layer is formed by a plating step, a wet desmear treatment may be performed on the via holes. Also, when the conductive layer on the insulating layer is formed by a sputtering step, a dry desmear step such as a plasma treatment step may be performed. Furthermore, the insulating layer may be roughened by the desmear step.

[0116] Furthermore, the insulating layer may be roughened before forming the conductive layer on the insulating layer. This roughening treatment typically roughens the surface of the insulating layer, including the areas within via holes. The roughening treatment may be either dry or wet. An example of a dry roughening treatment is plasma treatment. An example of a wet roughening treatment is a method in which swelling treatment with a swelling solution, roughening treatment with an oxidizing agent, and neutralization treatment with a neutralizing solution are performed in that order.

[0117] After forming via holes, a conductor layer is formed on the insulating layer. By forming the conductor layer at the location where the via holes were formed, the newly formed conductor layer and the conductor layer on the substrate surface become electrically connected, and interlayer connection is established. Examples of methods for forming the conductor layer include plating, sputtering, and vapor deposition, with plating being preferred. In a preferred embodiment, a conductor layer having a desired wiring pattern is formed by plating the surface of the insulating layer using an appropriate method such as a semi-additive method or a fully additive method. Furthermore, if the support in the resin sheet is a metal foil, a conductor layer having a desired wiring pattern can be formed by a subtractive method. The material of the formed conductor layer may be a single metal or an alloy. In addition, this conductor layer may have a single-layer structure or a multi-layer structure including two or more layers of different types of materials.

[0118] Here, an example of an embodiment for forming a conductor layer on an insulating layer will be described in detail. A plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer in accordance with the desired wiring pattern. After forming an electroplated layer on the exposed plating seed layer by electroplating, the mask pattern is removed. Subsequently, the unnecessary plating seed layer can be removed by etching or other processes to form a conductor layer having the desired wiring pattern. The dry film used to form the mask pattern when forming the conductor layer is the same as the dry film described above.

[0119] The method for manufacturing a circuit board may include a step (4) of removing the substrate. By removing the substrate, a circuit board having an insulating layer and a conductive layer embedded in the insulating layer is obtained. This step (4) can be performed, for example, when a substrate having a peelable metal layer is used.

[0120] [Semiconductor chip package] A semiconductor chip package according to the first embodiment of the present invention includes the circuit board described above and a semiconductor chip mounted on the circuit board. This semiconductor chip package can be manufactured by bonding a semiconductor chip to a circuit board.

[0121] The bonding conditions between the circuit board and the semiconductor chip can be any conditions that allow for conductive connection between the terminal electrodes of the semiconductor chip and the circuit wiring of the circuit board. For example, conditions used in flip-chip mounting of semiconductor chips can be adopted. Alternatively, for example, the semiconductor chip and the circuit board may be bonded via an insulating adhesive.

[0122] An example of a bonding method is a method of crimping a semiconductor chip onto a circuit board. The crimping conditions are typically a crimping temperature in the range of 120°C to 240°C (preferably in the range of 130°C to 200°C, more preferably in the range of 140°C to 180°C), and a crimping time in the range of 1 second to 60 seconds (preferably in the range of 5 seconds to 30 seconds).

[0123] Another example of a bonding method is to bond semiconductor chips to a circuit board by reflow soldering. The reflow conditions may be in the range of 120°C to 300°C.

[0124] After bonding the semiconductor chip to the circuit board, the semiconductor chip may be filled with mold underfill material. As this mold underfill material, the resin composition described above may be used, or the resin sheet described above may be used.

[0125] A semiconductor chip package according to a second embodiment of the present invention includes a semiconductor chip and a cured product of the resin composition that encapsulates the semiconductor chip. In such a semiconductor chip package, the cured product of the resin composition typically functions as a encapsulation layer. An example of a semiconductor chip package according to the second embodiment is a fan-out type WLP.

[0126] Manufacturing methods for semiconductor chip packages such as Fan-out type WLP are (A) A step of laminating a temporary fixing film onto the substrate, (B) A step of temporarily fixing the semiconductor chip onto a temporary fixing film, (C) A step of laminating a resin composition layer of the resin sheet of the present invention onto a semiconductor chip, or applying the resin composition of the present invention onto a semiconductor chip and heat-curing it to form a sealing layer. (D) Steps to peel off the substrate and temporary fixing film from the semiconductor chip, (E) A step of forming a redistribution layer (insulating layer) on the surface from which the substrate and temporary fixing film of the semiconductor chip have been peeled off. (F) A step of forming a conductor layer (rewiring layer) on a rewiring layer (insulating layer), and (G) The step of forming a solder resist layer on a conductor layer. The method for manufacturing a semiconductor chip package may also include (H) the step of dicing a plurality of semiconductor chip packages into individual semiconductor chip packages to form individual pieces.

[0127] Details of the manufacturing method for such semiconductor chip packages can be found in paragraphs 0066-0081 of International Publication No. 2016 / 035577, which are incorporated herein by reference.

[0128] A semiconductor chip package according to a third embodiment of the present invention is, for example, a semiconductor chip package in which a redistribution layer or solder resist layer is formed from a cured product of the resin composition of the present invention, as in the semiconductor chip package of the second embodiment.

[0129] [Semiconductor device] Examples of semiconductor devices on which the aforementioned semiconductor chip packages are mounted include various types of semiconductor devices used in electrical products (e.g., computers, mobile phones, smartphones, tablet devices, wearable devices, digital cameras, medical equipment, and televisions, etc.) and vehicles (e.g., motorcycles, automobiles, trains, ships, and aircraft, etc.). [Examples]

[0130] The present invention will be described in detail below with reference to examples. However, the present invention is not limited to the following examples. In the following description, "ppm", "parts", and "%" used to express quantities are based on mass unless otherwise specified. Furthermore, the operations described below were performed in an environment of normal temperature and pressure unless otherwise specified.

[0131] The epoxy resin used in the examples was a commercially available product that had been distilled and purified. Furthermore, the silica A, silica B, and silica C used in the examples and comparative examples are as follows. Silica A: Average particle size 9.2 μm, specific surface area 3.3 m² 2 / g, silica surface-treated with KBM573 (manufactured by Shin-Etsu Chemical Co., Ltd., N-phenyl-3-aminopropyltrimethoxysilane). Silica B: average particle size 8.5μm, specific surface area 3.2m 2 / g, silica surface-treated with KBM403 (manufactured by Shin-Etsu Chemical Co., Ltd., 3-glycidoxypropyltrimethoxysilane). Silica C: average particle size 9.6μm, specific surface area 2.9m 2 / g, silica surface-treated with KBM4803 (Shin-Etsu Chemical Co., Ltd., long-chain epoxy-type silane coupling agent).

[0132] <Example 1> Five parts of glycidylamine-type epoxy resin (epoxy equivalent 95 g / eq.), five parts of bisphenol-type epoxy resin (a 1:1 mixture of bisphenol A and bisphenol F, epoxy equivalent 169 g / eq.), seven parts of acid anhydride curing agent (Shin Nippon Rika Co., Ltd., "MH-700", acid anhydride equivalent 164 g / eq.), 140 parts of silica A, 0.1 parts of curing accelerator (Shikoku Kasei Kogyo Co., Ltd., "1B2PZ", 1-benzyl-2-phenylimidazole), and 0.6 parts of carbon black (Mitsubishi Chemical Corporation, "MA-600MJ-S") were mixed and uniformly dispersed in a mixer to prepare resin composition 1.

[0133] <Example 2> In Example 1, silica A was replaced with silica B. Resin composition 2 was prepared in the same manner as in Example 1, except for the above.

[0134] <Example 3> In Example 1, silica A was replaced with silica C. Resin composition 3 was prepared in the same manner as in Example 1, except for the above.

[0135] <Example 4> In Example 1, an additional 3 parts of alicyclic epoxy resin (epoxy equivalent 136 g / eq.) were used. Resin composition 4 was prepared in the same manner as in Example 1, except for the above.

[0136] <Comparative Example 1> In Example 1, Replace 5 parts of glycidylamine type epoxy resin (epoxy equivalent 95g / eq.) with 5 parts of glycidylamine type epoxy resin (Mitsubishi Chemical Corporation "630", epoxy equivalent 95g / eq.), Five parts of bisphenol-type epoxy resin (a 1:1 mixture of bisphenol A and bisphenol F, epoxy equivalent 169 g / eq.) were replaced with five parts of bisphenol F-type epoxy (Nagase ChemteX, "EX-211", epoxy equivalent: 138 g / eq.). Resin composition 5 was prepared in the same manner as in Example 1, except for the matters described above. In Comparative Example 1, "630" and "EX-211" were not distilled, and commercially available products were used as is.

[0137] <Measurement of chloride ion content> The chloride ion content of resin compositions 1 to 5 prepared in the examples and comparative examples was measured using combustion-ion chromatography (in accordance with BS EN 14582 2007).

[0138] <Measurement of the coefficient of thermal expansion (CTE)> On the release-treated 12-inch silicon wafer, Resin Compositions 1 to 5 prepared in the examples and comparative examples were compression-molded using a compression molding apparatus (mold temperature: 130 °C, pressure: 6 MPa, cure time: 10 minutes) to form a resin composition layer with a thickness of 300 μm. Then, the resin composition layer was peeled off from the release-treated silicon wafer and heated at 180 °C for 90 minutes to thermally cure the resin composition layer to prepare a cured sample. The cured sample was cut into a width of 5 mm and a length of 15 mm to obtain test pieces. For these test pieces, thermomechanical analysis was performed by the tensile loading method using a thermomechanical analyzer (ThermoPlus TMA8310 manufactured by Rigaku Corporation). Specifically, after mounting the test piece on the thermomechanical analyzer, two consecutive measurements were performed under the measurement conditions of a load of 1 g and a heating rate of 5 °C / min. Then, in the second measurement, the coefficient of thermal expansion (ppm / °C) in the planar direction in the range from 25 °C to 150 °C was calculated.

[0139] <Measurement of Minimum Melt Viscosity> The minimum melt viscosities of Resin Compositions 1 to 5 prepared in the examples and comparative examples were measured using a dynamic viscoelasticity measuring apparatus (Rheosol-G3000 manufactured by UBM Co., Ltd.). For 1 g of the sample resin composition, using a parallel plate with a diameter of 18 mm, the temperature was raised from an initial temperature of 60 °C to 200 °C at a heating rate of 5 °C / min, and the dynamic viscoelastic modulus was measured under the measurement conditions of a measurement temperature interval of 2.5 °C, a vibration of 1 Hz, and a strain of 1 deg to obtain the numerical value of the minimum melt viscosity.

[0140] <Evaluation of Copper Adhesion after HAST Test> Test specimens were formed on the copper surface of a glass cloth substrate epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") using the resin compositions prepared in the examples and comparative examples, with a diameter of 4 mm and a height of 5 mm. Specifically, a silicone rubber frame with a diameter of 4 mm was used to fill the resin composition into a cylindrical shape with a height of 5 mm, and after heating at 180°C for 90 minutes, the silicone rubber frame was removed to prepare the test specimen. After conducting a high-temperature, high-humidity environment test (HAST) on the test specimens at 130°C, 85% RH for 96 hours, the shear strength at the interface between the copper and the test specimen was measured using a bond tester (Dage Series 4000) with the head position 1 mm from the substrate and a head speed of 700 μm / s. The test was performed 5 times, and the average value was used. The shear strength was 0.5 kgf / mm². 2 Items that meet the above criteria are marked with "〇", 0.5 kgf / mm 2 Values ​​less than a certain value are marked with "×".

[0141] [Table 1]

[0142] In Examples 1 to 4, it was confirmed that even when components (D) to (E) were not included, the results were similar to those of the above examples, albeit to varying degrees.

Claims

1. (A) Epoxy resin, (B) Hardening agent, and (C) Contains inorganic fillers, A resin composition that is substantially free of solvents, The resin composition is a resin composition for an insulating layer that adheres to copper. (A) Component contains distilled epoxy resin, A resin composition in which the amount of chloride ions contained in the resin composition is 50 ppm or less, as measured by sample combustion-ion chromatography (BS EN 14582 2007).

2. (A) Epoxy resin, (B) Hardening agent, and (C) A resin composition containing an inorganic filler, The resin composition is a resin composition for an insulating layer that adheres to copper. (A) Component contains distilled epoxy resin, A resin composition in which the amount of chloride ions contained in the resin composition is 50 ppm or less, as measured by sample combustion-ion chromatography (BS EN 14582 2007).

3. The resin composition according to claim 1 or 2, wherein component (A) consists of only one selected from the group consisting of bixylenol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, trisphenol-type epoxy resin, naphthol novolac-type epoxy resin, phenol novolac-type epoxy resin, tert-butyl-catechol-type epoxy resin, naphthalene-type epoxy resin, naphthol-type epoxy resin, anthracene-type epoxy resin, glycidylamine-type epoxy resin, glycidyl ester-type epoxy resin, cresol novolac-type epoxy resin, biphenyl-type epoxy resin, alicyclic epoxy resin, naphthylene ether-type epoxy resin, and tetraphenylethane-type epoxy resin.

4. (A) Epoxy resin, (B) Hardening agent, and (C) A resin composition containing an inorganic filler, The resin composition is a resin composition for an insulating layer that adheres to copper. (A) Component contains a glycidylamine type epoxy resin, (A) Component contains distilled epoxy resin, A resin composition in which the amount of chloride ions contained in the resin composition is 50 ppm or less, as measured by sample combustion-ion chromatography (BS EN 14582 2007).

5. The resin composition according to any one of claims 1 to 4, wherein the content of component (C) is 80% by mass or more when the nonvolatile components in the resin composition are taken as 100% by mass.

6. The resin composition according to any one of claims 1 to 5, wherein the coefficient of thermal expansion of the cured product obtained by heat-curing the resin composition at 180°C for 90 minutes is 15 ppm / °C or less.

7. (B) The resin composition according to any one of claims 1 to 6, wherein component (B) contains an acid anhydride-based curing agent.

8. The resin composition according to any one of claims 1 to 7, wherein the resin composition is in liquid form.

9. A circuit board comprising an insulating layer formed from a cured product of the resin composition according to any one of claims 1 to 8.

10. A semiconductor chip package comprising a circuit board according to claim 9 and a semiconductor chip mounted on the circuit board.

11. A semiconductor chip package comprising a semiconductor chip and a cured product of a resin composition according to any one of claims 1 to 8 for sealing the semiconductor chip.

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