Cover tape and packaging for electronic components

Abstract

To provide a cover tape for packaging electronic components that has good antistatic properties while reducing the occurrence of blocking and powder shedding. [Solution] A cover tape for packaging electronic components, comprising a sealant layer, a base layer, and an antistatic layer in this order, wherein the antistatic layer side has an antistatic surface, the sealant layer side has a sealant surface, the arithmetic mean curvature Spc of the peak of the antistatic surface, measured in accordance with ISO 25178-2:2012, is 150 / mm or more, and the tack force of the sealant surface, measured by a predetermined method, is 60gf or less.

Description

[Technical Field]

[0001] This invention relates to cover tapes for packaging electronic components and electronic component packaging bodies. [Background technology]

[0002] Electronic components such as transistors, diodes, capacitors, piezoelectric elements, and resistors are sometimes transported in the form of "electronic component packages," which are created by housing the electronic components in recesses formed in a carrier tape to prevent damage, and then heat-sealing a cover tape to the carrier tape to seal the electronic components within the recesses. These electronic component packages are often exported and imported across national borders by air or sea freight. When using packaged electronic components, the cover tape on the electronic component packaging is peeled off and the component is removed from the recess.

[0003] Patent Document 1 discloses an electronic component packaging that can reliably house electronic components and allows for the proper peeling of a cover tape, comprising: a carrier tape 10 having a main surface 11 and a plurality of housing recesses 12; a plurality of electronic components 40 each housed in the plurality of housing recesses 12; and a cover tape 20 joined to the main surface 11 so as to cover the plurality of housing recesses 12, wherein the joint portion 30 between the carrier tape 10 and the cover tape 20 is composed of two linear portions 31 spaced apart in the width direction of the carrier tape 10 with the plurality of housing recesses 12 in between, each extending in the longitudinal direction, and a plurality of intermediate portions 32 each located between adjacent housing recesses 12, and the peel resistance ratio α between the maximum and minimum peel resistance values ​​when the cover tape 20 is continuously peeled from the carrier tape 10 along the longitudinal direction is 1.0 or more and 2.0 or less.

[0004] Patent Document 2 discloses a heat seal film for packaging electronic components, with the aim of developing a heat seal film that can be cut into cover tape, has stable peel strength, excellent antistatic performance, does not contaminate electronic components, and has a transparent appearance, comprising: a base layer; at least one intermediate layer provided on the base layer, the intermediate layer comprising a mixture of 5 to 70% by weight of vinyl acetate copolymer, where the total weight of the intermediate layer is 100% by weight, and the vinyl acetate copolymer is composed of a vinyl acetate copolymer in which units derived from vinyl acetate constitute more than 10 mol% of the copolymer, 20 to 90% by weight of styrene butadiene copolymer, and 0 to 40% by weight of a conductive polymer; and at least one heat seal layer provided on the surface of the intermediate layer opposite to the base layer.

[0005] Patent Document 3 discloses a cover tape for taping packaging of electronic components, characterized in that it has stable heat-sealability to a carrier tape, good zip-up properties, and satisfies all functions of conductivity and transparency, and has a base film layer, a flexible material layer and a heat-adhesive layer laminated sequentially, the flexible material layer is linear low-density polyethylene, the heat-adhesive layer contains a thermoplastic resin and conductive fine particles, the content of conductive fine particles in the heat-adhesive layer is 150 to 500 by mass relative to 100 of the thermoplastic resin in the heat-adhesive layer, the thickness of the flexible material layer is 10 to 50 μm, and the thickness of the heat-adhesive layer is 0.05 to 1.9 μm. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2017-171393 [Patent Document 2] International Publication No. 2012 / 079258 [Patent Document 3] Japanese Patent Publication No. 2003-246358 [Overview of the project] [Problems to be Solved by the Invention]

[0007] The present invention provides a cover tape for packaging electronic components that has good antistatic properties and can reduce the occurrence of blocking and powder dropping. [Means for Solving the Problems]

[0008] According to the present invention, there are provided a cover tape for packaging electronic components and an electronic component package as shown below.

[0009] [1] It includes a sealant layer, a base material layer, and an antistatic layer in this order. It has an antistatic surface on the antistatic layer side. It has a sealant surface on the sealant layer side. The arithmetic mean curvature Spc of the peak points of the antistatic surface measured in accordance with ISO 25178-2:2012 is 150 / mm or more. A cover tape for packaging electronic components, wherein the tack force of the sealant surface by the following (Method 1) is 60 gf or less. (Method 1) A SUS probe with a contact area of 5 mmφ is pressed against the sealant surface of the cover tape for packaging electronic components at a pressing speed of 0.5 mm / second, then held at a measurement temperature of 60°C and a pressing load of 2,000 gf for 20 seconds, and then the measured value of the load when pulled up vertically at a pulling speed of 10 mm / second is taken as the tack force (gf). [2] For the cover tape for packaging electronic components according to [1] above, the ratio (R1 / R0) of the surface resistance value R1 by the following (Method 3) to the surface resistance value R0 by the following (Method 2) is 10.0 or less. (Method 2) Measure the surface resistance value of the antistatic surface under the conditions of 25°C and 50% RH. (Method 3) The cover tape for packaging electronic components is treated under the conditions of 60°C, 90% RH, and 24 hours. Next, the surface resistance value of the antistatic surface is measured under conditions of 25°C and 50%RH. [3] The surface resistance value R0 obtained by the following method (Method 2) is 1.0 × 10 10 A cover tape for packaging electronic components as described in [1] or [2] above, wherein the impedance is Ω or less. (Method 2) The surface resistance of the antistatic surface is measured under conditions of 25°C and 50%RH. [4] The surface resistance value R1 obtained by the following method (Method 3) is 1.0 × 10 10 A cover tape for packaging electronic components as described in any of [1] to [3] above, wherein the impedance is Ω or less. (Method 3) The aforementioned cover tape for packaging electronic components is treated under the conditions of 60°C, 90% RH, and 24 hours. Next, the surface resistance value of the antistatic surface is measured under conditions of 25°C and 50%RH. [5] The cover tape for packaging electronic components according to any one of [1] to [4], wherein the antistatic layer contains a conductive polymer. [6] The cover tape for packaging electronic components according to any one of [1] to [5], wherein the antistatic layer contains a binder resin. [7] The cover tape for packaging electronic components according to any one of [1] to [6], wherein the antistatic layer comprises one or more selected from the group consisting of aziridine-based curing agents, carbodiimide-based curing agents, and oxazoline-based curing agents. [8] The cover tape for packaging electronic components according to any one of [1] to [7], wherein the antistatic layer comprises one or more selected from the group consisting of (meth)acrylic acid ester copolymer, polyester-(meth)acrylic acid ester copolymer, polyester-styrene copolymer, (meth)acrylic acid ester-styrene copolymer, and polyester-(meth)acrylic acid ester-styrene copolymer. [9] The cover tape for packaging electronic components according to any one of [1] to [8], wherein the antistatic layer contains a conductive additive.

[10] The cover tape for packaging electronic components according to any one of [1] to [9], wherein the sealant layer comprises one or more selected from the group consisting of ethylene-vinyl acetate copolymer, styrene resin, and (meth)acrylic resin.

[11] A cover tape for packaging electronic components according to any one of [1] to

[10] , wherein the base layer contains a polyester resin.

[12] A cover tape for packaging electronic components according to any one of [1] to

[11] , further comprising an intermediate layer between the base material layer and the sealant layer.

[13] The cover tape for packaging electronic components according to

[12] , wherein the intermediate layer comprises one or more selected from the group consisting of polyethylene resins and styrene resins.

[14] The package comprises a carrier tape having a recess, an electronic component housed in the recess, and an electronic component packaging cover tape as described in any of [1] to

[13] above. An electronic component package in which the sealant layer is adhered to the carrier tape to encapsulate the electronic component. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a cover tape for packaging electronic components that has good antistatic properties while reducing the occurrence of blocking and powder shedding. [Brief explanation of the drawing]

[0011] [Figure 1] This diagram schematically represents an example of the layer structure of cover tape. [Figure 2] This figure shows an example of the cover tape being adhered (heat-sealed) to the carrier tape. [Modes for carrying out the invention]

[0012] Embodiments of the present invention will be described below with reference to the drawings. In all drawings, similar components are denoted by the same reference numerals, and their descriptions are omitted where appropriate. Also, the drawings are schematic diagrams and do not correspond to the actual dimensional ratios. Furthermore, unless otherwise specified, the "~" indicating a numerical range represents "greater than or equal to" to "less than or equal to".

[0013] In this specification, the term "(meth)acrylic" refers to a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." In this specification, the surface of the cover tape on the sealant layer side may be referred to as the sealant surface. Similarly, the surface of the cover tape on the antistatic layer side may be referred to as the antistatic surface.

[0014] [Cover tape for electronic component packaging] The cover tape for packaging electronic components of this embodiment (hereinafter also referred to simply as "cover tape") comprises a sealant layer, a base layer, and an antistatic layer in this order. The cover tape for packaging electronic components of this embodiment has an antistatic surface on the antistatic layer side. The cover tape for packaging electronic components of this embodiment has a sealant surface on the sealant layer side. In the cover tape for packaging electronic components of this embodiment, the arithmetic mean curvature Spc of the peak of the antistatic surface, measured in accordance with ISO 25178-2:2012 (hereinafter also referred to simply as "Spc"), is 150 / mm or more. Furthermore, in the cover tape for packaging electronic components of this embodiment, the tack force (hereinafter also referred to simply as "tack force") of the sealant surface, measured by the following (Method 1), is 60gf or less. (Method 1) A SUS probe with a contact area of ​​5 mm in diameter is pressed against the sealant surface of a cover tape for electronic component packaging at a pressing speed of 0.5 mm / second. Then, it is held for 20 seconds at a measurement temperature of 60°C and a pressing load of 2,000 gf. Next, the measured load when the probe is lifted vertically at a lifting speed of 10 mm / second is defined as the tack force (gf). By having the above configuration, we can provide a cover tape for packaging electronic components that has good antistatic properties while reducing the occurrence of blocking and powder shedding. Furthermore, the cover tape for packaging electronic components according to this embodiment is less prone to a decrease in antistatic properties under high temperature and high humidity conditions, thereby improving the reliability of antistatic properties.

[0015] The reasons why the effects of this embodiment are obtained are not entirely clear, but the following reasons can be inferred. The cover tape of this embodiment is considered to have good antistatic properties because it has an antistatic layer. Furthermore, in this embodiment, the tack force of the sealant surface of the cover tape is 60 gf or less, thus suppressing the adhesiveness of the sealant surface, and the Spc of the antistatic surface is 150 / mm or more, so the irregularities of the antistatic surface are considered to be sharp. Therefore, when the antistatic surface and the sealant surface come into contact, the area in contact between the irregularities of the antistatic surface and the sealant surface can be reduced, and the adhesion of the contact area can be reduced. In other words, in this embodiment, the tack force of the sealant surface and the Spc of the antistatic surface are both within the above ranges, and it is considered that the synergistic effect of these factors can reduce the occurrence of blocking between the sealant surface and the antistatic surface, and the occurrence of powder shedding from the area in contact between the irregularities of the antistatic surface and the sealant surface. Furthermore, the cover tape of this embodiment has a tack force on the sealant surface and an Spc on the antistatic surface that are both within the above ranges. Due to the synergistic effect of these factors, it is believed that a decrease in antistatic properties under high temperature and high humidity conditions is less likely to occur, thereby improving the reliability of antistatic properties.

[0016] Next, the specific structure of the cover tape for packaging electronic components according to this embodiment will be described with reference to the diagrams. Figure 1 schematically shows an example of the layer structure of the cover tape (cover tape 10) for packaging electronic components according to this embodiment.

[0017] The cover tape 10 comprises a sealant layer 2, a base layer 1, and an antistatic layer 3 in this order. In other words, the cover tape 10 comprises a base layer 1, a sealant layer 2 on one side of the base layer 1, and an antistatic layer 3 on the side of the base layer 1 opposite to the one side.

[0018] The cover tape 10 has an antistatic surface S1 on the side facing the antistatic layer 3. In Figure 1, the antistatic surface S1 corresponds to the upper surface of the antistatic layer 3. In this embodiment, the antistatic surface S1 is the surface that is not heat-sealed to the surface of the carrier tape. Examples of the antistatic surface S1 include the surface of the antistatic layer 3, the surface of other layers laminated on the surface of the antistatic layer 3, and so on.

[0019] The cover tape 10 has a sealant surface S2 on the side facing the sealant layer 2. In Figure 1, the sealant surface S2 corresponds to the lower surface of the sealant layer 2. In this embodiment, the sealant surface S2 is the surface that is heat-sealed and faces the surface of the carrier tape. Examples of the sealant surface S2 include the surface of the sealant layer 2, the surface of another layer laminated on the surface of the sealant layer 2, and so on.

[0020] The overall thickness of the cover tape is preferably 1 μm to 100 μm, more preferably 10 μm to 90 μm, even more preferably 20 μm to 80 μm, even more preferably 30 μm to 70 μm, even more preferably 40 μm to 60 μm, and even more preferably 45 μm to 55 μm, from the viewpoint of improving the balance between strength and handling performance.

[0021] Next, specific examples of the components of the cover tape in this embodiment will be given.

[0022] <Base material layer> The material constituting the base layer is not particularly limited. Any film can be used as the base layer material, as long as it has sufficient mechanical strength to withstand the external forces applied to the cover tape and sufficient heat resistance to withstand the heat during heat sealing.

[0023] The base layer includes, for example, one or more materials selected from the group consisting of polyester resins, polyamide resins, polyolefin resins, (meth)acrylic resins, polyimide resins, polycarbonate resins, and ABS resins. From the viewpoint of improving the mechanical strength of the cover tape, the base layer preferably contains one or more selected from the group consisting of polyester resins and polyolefin resins, more preferably contains a polyester resin, and even more preferably contains polyethylene terephthalate (PET).

[0024] The film used to form the base layer is, for example, a stretched film. From the viewpoint of improving the mechanical strength of the cover tape, the film used to form the base layer preferably includes one or more selected from the group consisting of a film stretched uniaxially and a film stretched biaxially.

[0025] The base layer may be a single layer or a multi-layer layer.

[0026] The base layer preferably contains an antistatic agent, from the viewpoint of reducing the static charge generated when the carrier tape is peeled off. Furthermore, an antistatic layer may be provided on the antistatic surface of the cover tape as one of the base material layers.

[0027] The thickness of the base layer is preferably 100 μm or less, more preferably 75 μm or less, even more preferably 50 μm or less, even more preferably 45 μm or less, even more preferably 40 μm or less, even more preferably 35 μm or less, and even more preferably 30 μm or less, from the viewpoint of reducing the rigidity of the cover tape. If the rigidity of the cover tape is not too high, even if torsional stress is applied to the carrier tape after sealing, the cover tape can follow the deformation of the carrier tape, thus reducing the possibility of the cover tape peeling off. Furthermore, the thickness of the base layer is preferably 0.1 μm or more, more preferably 1 μm or more, even more preferably 3 μm or more, even more preferably 5 μm or more, even more preferably 8 μm or more, even more preferably 10 μm or more, and even more preferably 12 μm or more, from the viewpoint of improving the mechanical strength of the cover tape. If the mechanical strength of the cover tape is not too low, the possibility of the cover tape breaking can be reduced even if the cover tape is peeled off from the carrier tape at high speed. From the viewpoint of reducing the rigidity of the cover tape and improving the mechanical strength of the cover tape, the thickness of the base layer is preferably 0.1 μm to 100 μm, more preferably 1 μm to 75 μm, even more preferably 3 μm to 50 μm, even more preferably 5 μm to 45 μm, even more preferably 8 μm to 40 μm, even more preferably 10 μm to 35 μm, and even more preferably 12 μm to 30 μm.

[0028] <Middle class> The intermediate layer is provided to improve the cushioning properties of the cover tape. Improved cushioning allows the pressure from the sealing iron to be more easily transferred to the cover tape during heat sealing. This improves the adhesion between the cover tape and the carrier tape.

[0029] The cover tape of this embodiment may have an intermediate layer between the base layer and the sealant layer. Alternatively, the cover tape of this embodiment may have an intermediate layer between the base layer and the antistatic layer. Furthermore, the cover tape of this embodiment may have intermediate layers both between the base layer and the sealant layer, and between the base layer and the antistatic layer.

[0030] The material of the intermediate layer is not particularly limited. Any material that can provide cushioning to the cover tape can be used without any particular restrictions.

[0031] The intermediate layer includes, for example, one or more selected from the group consisting of polyethylene resins, ethylene-vinyl acetate copolymers, (meth)acrylic resins, polyvinyl acetate derivatives, styrene resins, polyolefin resins, and cyclic olefin resins. The intermediate layer preferably comprises one or more types selected from the group consisting of polyethylene resins and styrene resins, from the viewpoint of improving the cushioning properties of the cover tape, and more preferably low-density polyethylene (for example, density 880 kg / m³). 3 More than 930kg / m 3 It comprises one or more selected from the group consisting of polyethylene (with a density of less than 880 kg / m³) and styrene resins, and more preferably low-density polyethylene (for example, with a density of 880 kg / m³). 3 More than 930kg / m 3 Contains less than [amount] polyethylene.

[0032] The intermediate layer may be a single layer or a multi-layered layer.

[0033] From the viewpoint of improving the adhesion between the cover tape and the carrier tape during heat sealing, the thickness of the intermediate layer is preferably 1 μm to 200 μm, more preferably 2 μm to 100 μm, even more preferably 5 μm to 75 μm, even more preferably 10 μm to 50 μm, even more preferably 15 μm to 45 μm, and even more preferably 20 μm to 40 μm.

[0034] <Sealant layer> The sealant layer is provided on at least one side of the substrate layer. If an intermediate layer exists between the substrate layer and the sealant layer, the sealant layer is provided on the side of the intermediate layer opposite to the side in contact with the substrate layer. The sealant layer comes into contact with the carrier tape when the cover tape is heat-sealed to the carrier tape. Heating with a sealing iron softens or melts the sealant layer, causing it to adhere to the carrier tape.

[0035] The sealant layer includes, for example, a thermoplastic resin. The thermoplastic resin includes, for example, one or more selected from the group consisting of ethylene-vinyl acetate copolymer, styrene resin, (meth)acrylic resin, polyvinyl acetate derivative, olefin resin, urethane resin, and ester resin. The sealant layer preferably contains one or more selected from the group consisting of ethylene-vinyl acetate copolymer, styrene resin, and (meth)acrylic resin, and more preferably contains a (meth)acrylic resin, from the viewpoint of improving heat sealability with the carrier tape.

[0036] The sealant layer may be a single layer or multiple layers.

[0037] From the viewpoint of improving heat sealability, the thickness of the sealant layer is preferably 0.01 μm to 10 μm, more preferably 0.05 μm to 5 μm, and even more preferably 0.1 μm to 1 μm.

[0038] The sealant layer includes, for example, an antistatic agent. The antistatic agent includes, for example, one or more selected from the group consisting of metal oxides, conductive polymers, conductive carbons, and lithium salts.

[0039] The metal oxides include, for example, one or more selected from the group consisting of tin oxide, antimond-doped tin oxide (ATO), fluorine-doped tin oxide (FTO), phosphorus-doped tin oxide (PTO), aluminum-doped tin oxide, niobium-doped tin oxide, tantalum-doped tin oxide, tungsten-doped tin oxide, indium-doped tin oxide, tin-doped indium oxide (ITO), fluorine-doped indium oxide, cadmium-doped indium oxide, zinc oxide, indium-doped zinc oxide, fluorine-doped zinc oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, magnesium-doped zinc oxide, silicon-doped zinc oxide, tin-doped zinc oxide, boron-doped zinc oxide, zinc antimonate (AZO), and niobium-doped titanium oxide.

[0040] The conductive polymer includes, for example, one or more selected from the group consisting of polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylenevinylene, polyvinylcarbazole, polymers containing polyether structures, polymers containing carboxylic acid bases, and quaternary ammonium salt polymers. Polythiophenes include, for example, polyethylenedioxythiophene (PEDOT). Polyanilines include, for example, sulfonated polyanilines. Polymers containing polyether structures include, for example, one or more selected from the group consisting of polyamide copolymers such as polyether ester amides; block polymers consisting of polyolefins and polyethers; and polymers consisting of polyethylene ethers and glycols. Carboxylate base-containing polymers include, for example, potassium ionomers. Examples of lithium salts include lithium chloride, lithium fluoride, lithium bromide, lithium iodide, lithium perchlorate, lithium acetate, lithium fluorosulfonate, lithium methanesulfonate, lithium trifluoromethanesulfonate, and lithium pentafluoroethanesulfonate.

[0041] The antistatic agent contained in the sealant layer preferably contains a metal oxide, and more preferably contains antimond-doped tin oxide (ATO), from the viewpoint of improving the antistatic properties of the sealant layer.

[0042] The sealant layer includes, for example, a tackifier. The tackifier includes, for example, one or more selected from the group consisting of petroleum resins, rosin resins, terpene resins, styrene resins, and coumarone-indene resins.

[0043] The sealant layer may contain any additives such as antiblocking agents, slip agents, lubricants, plasticizers, antioxidants, UV absorbers, colorants, surfactants, and inorganic fillers, to the extent that they do not impair its properties. Furthermore, the surface of the sealant layer may be coated with these additives.

[0044] <Antistatic layer> The antistatic layer is provided on at least one side of the base layer. If an intermediate layer exists between the base layer and the antistatic layer, the antistatic layer is provided on the side of the intermediate layer opposite to the side in contact with the base layer.

[0045] The antistatic layer preferably comprises one or more components selected from the group consisting of conductive polymers, binder resins, curing agents, and conductive additives. The antistatic layer may also consist of one or more components selected from the group consisting of conductive polymers, binder resins, curing agents, and conductive additives, and may also contain other components.

[0046] The antistatic layer preferably contains a conductive polymer, more preferably one or more selected from the group consisting of polythiophene, polyacetylene, and polyaniline, even more preferably polythiophene, and even more preferably polyethylenedioxythiophene (PEDOT).

[0047] The conductive polymer may be a compound that exhibits conductivity itself, such as polythiophene. Alternatively, the conductive polymer may be a compound that imparts conductivity by reacting with water vapor in the air and forming a moisture film (conductive layer) on the surface of the antistatic layer, such as the cationic polymer surfactant described later.

[0048] Compounds in which the polymer itself exhibits conductivity include, for example, one or more selected from the group consisting of polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylenevinylene, and polyvinylcarbazole. Polythiophenes include, for example, polyethylenedioxythiophene (PEDOT). Polyanilines include, for example, sulfonated polyanilines.

[0049] Cationic polymer surfactants include, for example, quaternary ammonium salt polymers. Quaternary ammonium salt polymers are polymers having a quaternary ammonium base, and the type of the polymer's main chain, the type of anion, etc., are not particularly limited.

[0050] From the viewpoint of further improving antistatic properties, the content of conductive polymer in the antistatic layer is preferably 1% to 30% by mass, more preferably 3% to 20% by mass, even more preferably 4% to 10% by mass, and even more preferably 5% to 7% by mass, when the total amount of solids in the antistatic layer is taken as 100% by mass.

[0051] The antistatic layer preferably contains a binder resin, more preferably one or more selected from the group consisting of (meth)acrylic binder resins, epoxy binder resins, and polyester binder resins, and even more preferably contains a (meth)acrylic binder resin.

[0052] (Meth)acrylic binder resins include, for example, (meth)acrylic resins obtained by polymerizing or copolymerizing one or more monomers selected from the group consisting of (meth)acrylate monomers containing hydroxyl groups, (meth)acrylate monomers containing amide groups, (meth)acrylate monomers containing carboxyl groups, and (meth)acrylate monomers containing hydrocarbon groups; and one or more resins obtained by crosslinking these (meth)acrylic resins with a crosslinking agent.

[0053] The (meth)acrylate monomers containing a hydroxyl group include, for example, one or more selected from the group consisting of 2-hydroxyethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, and hydroxybutyl (meth)acrylate. The (meth)acrylate monomers containing an amide group include, for example, one or more selected from the group consisting of (meth)acrylamide and N-methylol(meth)acrylamide. The (meth)acrylate monomers containing a carboxyl group include, for example, one or more selected from the group consisting of (meth)acrylic acid, itaconic acid, and maleic anhydride. The (meth)acrylate monomer containing a hydrocarbon group includes one or more selected from the group consisting of (meth)acrylate, ethyl (meth)acrylate, N-butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate.

[0054] The epoxy binder resin includes, for example, one or more selected from the group consisting of bixylenol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, naphthol novolac-type epoxy resin, phenol novolac-type epoxy resin, tert-butyl-catechol-type epoxy resin, naphthalene-type epoxy resin, naphthol-type epoxy resin, anthracene-type epoxy resin, glycidylamine-type epoxy resin, glycidyl ester-type epoxy resin, cresol novolac-type epoxy resin, biphenyl-type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiroring-containing epoxy resin, cyclohexanedimethanol-type epoxy resin, naphthylene ether-type epoxy resin, trimethylol-type epoxy resin, and tetraphenylethane-type epoxy resin.

[0055] The polyester binder resin has, for example, a portion derived from a polycarboxylic acid and a portion derived from a polyol. The polycarboxylic acid includes, for example, one or more selected from the group consisting of aromatic dicarboxylic acids and aliphatic dicarboxylic acids. Aromatic dicarboxylic acids include, for example, one or more selected from the group consisting of terephthalic acid, isophthalic acid, phthalic acid, diphenic acid, naphthalic acid, 1,2-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, and 2,6-naphthalenedicarboxylic acid. Aliphatic dicarboxylic acids include one or more selected from the group consisting of linear aliphatic dicarboxylic acids, branched aliphatic dicarboxylic acids, and alicyclic aliphatic dicarboxylic acids. Aliphatic dicarboxylic acids include, for example, one or more selected from the group consisting of oxalic acid, malonic acid, succinic acid, maleic acid, itaconic acid, glutaric acid, adipic acid, pimelic acid, 2,2-dimethylglutaric acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 1,3-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, diglycolic acid, and thiodipropionic acid. Polyols include, for example, ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 2,2-dimethyl-1,3-propanediol, 2-ethyl-2-butyl-1,3-propanediol, 2-ethyl-2-isobutyl-1,3-propanediol, 2,2,4-trimethyl-1,6-hexanediol, and 1,2-cyclohex It contains one or more substances selected from the group consisting of san-dimethanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, 4,4'-dihydroxybiphenol, 4,4'-methylenediphenol, 1,5-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), and 4,4'-sulfonyldiphenol (bisphenol S).

[0056] From the viewpoint of improving film-forming properties, the binder resin content in the antistatic layer is preferably 10% to 70% by mass, more preferably 20% to 60% by mass, even more preferably 30% to 50% by mass, and even more preferably 35% to 40% by mass, when the total amount of solids in the antistatic layer is taken as 100% by mass.

[0057] The antistatic layer preferably contains a curing agent, and more preferably contains one or more selected from the group consisting of aziridine-based curing agents, carbodiimide-based curing agents, oxazoline-based curing agents, melamine-based curing agents, urea-based curing agents, epoxy-based curing agents, isocyanate-based curing agents, ethyleneimine-based curing agents, and silane coupling agent compounds, and even more preferably contains one or more selected from the group consisting of aziridine-based curing agents, carbodiimide-based curing agents, and oxazoline-based curing agents, and even more preferably contains an aziridine-based curing agent.

[0058] From the viewpoint of further improving antistatic properties, the content of the hardening agent in the antistatic layer is preferably 1% to 50% by mass, more preferably 5% to 30% by mass, even more preferably 8% to 20% by mass, and even more preferably 10% to 15% by mass, when the total amount of solids in the antistatic layer is taken as 100% by mass.

[0059] The antistatic layer preferably contains one or more selected from the group consisting of (meth)acrylic acid copolymer, polyester-(meth)acrylic acid copolymer, polyester-styrene copolymer, (meth)acrylic acid copolymer, and polyester-(meth)acrylic acid copolymer, and more preferably contains one or more selected from the group consisting of (meth)acrylic acid copolymer, polyester-(meth)acrylic acid copolymer, polyester-styrene copolymer, (meth)acrylic acid copolymer, and polyester-(meth)acrylic acid copolymer (hereinafter also referred to as resin group 1), and even more preferably contains one or more selected from the group consisting of (meth)acrylic acid copolymer, polyester-(meth)acrylic acid copolymer, and polyester-(meth)acrylic acid copolymer.

[0060] From the viewpoint of improving slipperiness, the content of resin group 1 in the antistatic layer is preferably 5% to 70% by mass, more preferably 10% to 50% by mass, even more preferably 15% to 40% by mass, and even more preferably 20% to 30% by mass, when the total amount of solids in the antistatic layer is taken as 100% by mass.

[0061] The antistatic layer preferably contains a conductive additive, more preferably an organic compound having a polar group, and even more preferably ethylene glycol, from the viewpoint of improving conductivity. The polar group of an organic compound having a polar group includes, for example, one or more selected from the group consisting of an amide group, a hydroxyl group, and a sulfinyl group. Organic compounds having an amide group include, for example, one or more selected from the group consisting of N,N-dimethylacetamide, N-methylformamide, N,N-dimethylformamide, acetamide, N-ethylacetamide, N-phenyl-N-propylacetamide, benzamide, N-methylpyrrolidone, β-lactam, γ-lactam, δ-lactam, ε-caprolactam, and laurolactam. Organic compounds having a hydroxyl group include, for example, one or more selected from the group consisting of ethylene glycol, diethylene glycol, propylene glycol, trimethylene glycol, β-thiodiglycol, triethylene glycol, tripropylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,3-butanediol, 1,6-hexanediol, neopentyl glycol, catechol, cyclohexanediol, cyclohexanedimethanol, glycerin, erythritol, immitol, lactitol, maltitol, mannitol, sorbitol, xylitol, and sucrose. Organic compounds having a sulfinyl group include, for example, dimethyl sulfoxide.

[0062] The antistatic layer may contain any additives such as antiblocking agents, slip agents, lubricants, plasticizers, antioxidants, UV absorbers, colorants, surfactants, and inorganic fillers, to the extent that they do not impair its properties. Furthermore, the surface of the antistatic layer may be coated with these additives. Furthermore, the antistatic layer may contain a solvent. The solvent may include, for example, a polar solvent. The polar solvent may include, for example, water and one or more alcohols selected from the group consisting of methanol, ethanol, isopropanol, etc.

[0063] The antistatic layer may be a single layer or a multi-layer layer.

[0064] The thickness of the antistatic layer is preferably 0.001 μm to 1 μm, more preferably 0.01 μm to 0.5 μm, and even more preferably 0.05 μm to 0.3 μm, from the viewpoint of improving the balance between slipperiness and durability. Here, the thickness of the antistatic layer refers to the thickness after drying.

[0065] <Other layers> The cover tape may have additional layers in addition to the layers described above.

[0066] For example, if the cover tape does not have an intermediate layer between the base layer and the sealant layer, the cover tape may have an adhesive layer between the base layer and the sealant layer. Also, if the cover tape has an intermediate layer between the base layer and the sealant layer, the cover tape may have an adhesive layer between the base layer and the intermediate layer or between the intermediate layer and the sealant layer. Furthermore, if the cover tape has an intermediate layer between the base layer and the sealant layer, the cover tape may have adhesive layers both between the base layer and the intermediate layer and between the intermediate layer and the sealant layer.

[0067] For example, if the cover tape does not have an intermediate layer between the base layer and the antistatic layer, the cover tape may have an adhesive layer between the base layer and the antistatic layer. Also, if the cover tape has an intermediate layer between the base layer and the antistatic layer, the cover tape may have an adhesive layer between the base layer and the intermediate layer or between the intermediate layer and the antistatic layer. Furthermore, if the cover tape has an intermediate layer between the base layer and the antistatic layer, the cover tape may have adhesive layers both between the base layer and the intermediate layer and between the intermediate layer and the antistatic layer.

[0068] As the material for forming the adhesive layer, for example, known solvent-based or water-based dry laminating agents or anchor coating agents can be used. The dry laminating agent includes, for example, one or more dry laminating agents selected from the group consisting of isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based agents. The anchor coating agent also includes, for example, one or more anchor coating agents selected from the group consisting of isocyanate-based, polyurethane-based, polyester-based, polyethyleneimine-based, polybutadiene-based, polyolefin-based, and alkyl titanate-based agents.

[0069] Furthermore, by performing corona treatment on any layer of the cover tape, the adhesion between the corona-treated layer and the other layers can be improved. This corona treatment can be carried out by appropriately selecting known conditions. For example, the corona treatment may be performed on the substrate layer or on the intermediate layer.

[0070] <Shape of cover tape> The width and length of the cover tape can be set as appropriate, primarily according to the width and length of the carrier tape. The width of the cover tape is, for example, between 1 mm and 100 mm. The length of the cover tape is, for example, between 100 m and 30,000 m.

[0071] <Physical properties of cover tape> Next, we will explain the physical properties of the cover tape.

[0072] Regarding the cover tape of this embodiment, the arithmetic mean curvature Spc of the peak of the antistatic surface, measured in accordance with ISO 25178-2:2012, will be described.

[0073] The Spc of the antistatic surface in this embodiment is 150 / mm or more, preferably 170 / mm or more, more preferably 190 / mm or more, even more preferably 210 / mm or more, even more preferably 230 / mm or more, even more preferably 250 / mm or more, and even more preferably 270 / mm or more, from the viewpoint of having good antistatic properties while reducing the occurrence of blocking and powder shedding. There are no particular restrictions on the upper limit of Spc on the antistatic surface, but it may be, for example, 1000 / mm or less, 800 / mm or less, 600 / mm or less, 500 / mm or less, 400 / mm or less, 350 / mm or less, or 300 / mm or less. The antistatic surface Spc of this embodiment is preferably 150 / mm to 1000 / mm, more preferably 170 / mm to 800 / mm, even more preferably 190 / mm to 600 / mm, even more preferably 210 / mm to 500 / mm, even more preferably 230 / mm to 400 / mm, even more preferably 250 / mm to 350 / mm, and even more preferably 270 / mm to 300 / mm, from the viewpoint of having good antistatic properties while reducing the occurrence of blocking and powder shedding.

[0074] The antistatic surface Spc can be adjusted, for example, by adjusting the type of substrate layer, the method of forming the antistatic layer, the conditions for forming the antistatic layer, the composition of the antistatic layer, etc. Furthermore, the method for measuring Spc on the antistatic surface can be, for example, the method described in the examples.

[0075] The tack force of the sealant surface of the cover tape of this embodiment, as determined by Method 1 above, will be explained.

[0076] The tack force of the sealant surface in this embodiment is 60 gf or less, preferably 50 gf or less, more preferably 40 gf or less, still more preferably 30 gf or less, and even more preferably 25 gf or less, from the viewpoint of reducing blocking and powdering while having good antistatic properties. The lower limit of the tack force of the sealant surface is not particularly limited. For example, it may be 0 gf or more, 0.1 gf or more, 0.5 gf or more, 1 gf or more, 5 gf or more, or 10 gf or more. The tack force of the sealant surface is preferably 0 gf or more and 60 gf or less, may be 0.1 gf or more and 50 gf or less, may be 0.5 gf or more and 40 gf or less, may be 1 gf or more and 30 gf or less, may be 5 gf or more and 30 gf or less, or may be 10 gf or more and 25 gf or less, from the viewpoint of reducing blocking and powdering while having good antistatic properties.

[0077] The tack force of the sealant surface can be adjusted by adjusting, for example, the type of the base material layer, the type of the intermediate layer, the thickness of the intermediate layer, the formation method of the sealant layer, the formation conditions of the sealant layer, the composition of the sealant layer, the thickness of the sealant layer, the surface roughness of the sealant surface, etc. The measurement method of the tack force of the sealant surface can adopt, for example, the method described in the examples.

[0078] The surface resistance value R0 of the cover tape in this embodiment will be described by the following (Method 2). (Method 2) Measure the surface resistance value of the antistatic surface under the conditions of 25°C and 50% RH.

[0079] The surface resistance value R0 of the antistatic surface in this embodiment is preferably 1.0×10 10 Ω or less, more preferably 1.0×10 9 [[ID=ID=26]]Ω or less, still more preferably 5.0×10 8 Ω or less, and even more preferably 2.0×10 8It is less than or equal to Ω, and more preferably 1.0 × 10⁻⁶. 8 It is less than or equal to Ω, and more preferably 5.0 × 10⁻⁶. 7 It is less than or equal to Ω, and more preferably 2.0 × 10⁻⁶. 7 It is less than or equal to Ω, and more preferably 1.0 × 10⁻⁶. 7 It is less than or equal to Ω, and more preferably 5.0 × 10⁻⁶. 6 It is less than or equal to Ω, and more preferably 2.0 × 10⁻⁶. 6 It is less than or equal to Ω. There is no particular limit to the lower limit of the surface resistance value R0 of the antistatic surface, but for example, 1.0 × 10 0 It may be greater than or equal to Ω, and 1.0 × 10 1 It may be greater than or equal to Ω, and 1.0 × 10 3 It may be greater than or equal to Ω, and 1.0 × 10 4 It may be greater than or equal to Ω, and 1.0 × 10 5 It may be Ω or higher.

[0080] The surface resistance R0 of the antistatic surface can be adjusted, for example, by adjusting the type of base layer, the method of forming the antistatic layer, the conditions for forming the antistatic layer, the composition of the antistatic layer, etc. Furthermore, the method for measuring the surface resistance R0 of the antistatic surface can be, for example, the method described in the examples.

[0081] The surface resistance value R1 of the cover tape of this embodiment will be explained below (Method 3). (Method 3) The cover tape was treated at 60°C, 90% RH, for 24 hours. Next, the surface resistance of the antistatic surface is measured under conditions of 25°C and 50%RH.

[0082] From the viewpoint of improving antistatic properties, the surface resistance value R1 of the antistatic surface in this embodiment is preferably 1.0 × 10⁻⁶. 10 It is less than or equal to Ω, and more preferably 1.0 × 10⁻⁶. 9 It is less than or equal to Ω, and more preferably 5.0 × 10⁻⁶. 8 It is less than or equal to Ω, and more preferably 2.0 × 10⁻⁶. 8 It is less than or equal to Ω, and more preferably 1.0 × 10⁻⁶. 8It is less than or equal to Ω, and more preferably 5.0 × 10⁻⁶. 7 It is less than or equal to Ω, and more preferably 2.0 × 10⁻⁶. 7 It is less than or equal to Ω, and more preferably 1.0 × 10⁻⁶. 7 It is less than or equal to Ω, and more preferably 5.0 × 10⁻⁶. 6 It is less than or equal to Ω. There is no particular limit to the lower limit of the surface resistance value R1 of the antistatic surface, but for example, 1.0 × 10 0 It may be greater than or equal to Ω, and 1.0 × 10 1 It may be greater than or equal to Ω, and 1.0 × 10 3 It may be greater than or equal to Ω, and 1.0 × 10 4 It may be Ω or higher.

[0083] The surface resistance R1 of the antistatic surface can be adjusted, for example, by adjusting the type of base layer, the method of forming the antistatic layer, the conditions for forming the antistatic layer, the composition of the antistatic layer, etc. Furthermore, the method for measuring the surface resistance R1 of the antistatic surface can be, for example, the method described in the examples.

[0084] Regarding the cover tape of this embodiment, the ratio (R1 / R0) of the surface resistance value R1 obtained by (Method 3) to the surface resistance value R0 obtained by (Method 2) will be explained.

[0085] In this embodiment, the ratio of antistatic surfaces (R1 / R0) is preferably 10.0 or less, more preferably 8.0 or less, even more preferably 6.0 or less, even more preferably 4.0 or less, even more preferably 2.0 or less, and even more preferably 1.0 or less, from the viewpoint of improving antistatic properties. There is no particular lower limit to the ratio of antistatic surfaces (R1 / R0), but it may be, for example, 0.01 or higher, 0.1 or higher, or 0.2 or higher.

[0086] The ratio of the antistatic surface (R1 / R0) can be adjusted, for example, by adjusting the type of substrate layer, the method of forming the antistatic layer, the conditions for forming the antistatic layer, the composition of the antistatic layer, etc.

[0087] <Uses of cover tape> Next, I will explain the uses of cover tape. The cover tape of this embodiment has good antistatic properties while reducing blocking and powder shedding, making it suitable for use with various carrier tapes.

[0088] <How to manufacture cover tape> As mentioned above, the cover tape 10 can be manufactured using appropriate materials and following an appropriate manufacturing process. Below, we will describe in more detail the preferred manufacturing method and the materials used in that manufacturing method.

[0089] First, prepare the base layer 1. The base layer 1 is a film formed from, for example, a polyester resin, a polyamide resin, a polyolefin resin, etc. The base layer 1 may include an adhesive layer containing a dry laminating agent or an anchor coating agent, from the viewpoint of reducing peeling from other layers.

[0090] Next, a sealant layer 2 is formed on one side of the substrate layer. The sealant layer 2 can be formed, for example, by applying a sealant layer forming coating liquid (hereinafter also referred to as "coating liquid 1" as appropriate) to the substrate layer 1 and drying it. As for the coating method, for example, a gravure coating method can be used.

[0091] Coating solution 1 can be prepared, for example, by mixing a thermoplastic resin, a solvent, and other additives as needed. The viscosity of coating solution 1 at 28°C is, for example, 0.1 to 10 mPa·s when measured using a vibrating viscometer in accordance with JIS Z 8803. The viscosity of coating solution 1 at 28°C can be adjusted, for example, by adjusting the amount of solvent, the type of solvent, etc.

[0092] The solvent used in coating solution 1 is not particularly limited, but may be one or more selected from the group consisting of, for example, esters such as ethyl acetate and butyl acetate; ketones such as methyl ethyl ketone, acetone, cyclohexanone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene and xylene; aliphatic alcohols such as methanol, ethanol, n-propanol, and isopropanol; alicyclic alcohols such as cyclohexanol; and water.

[0093] In the cover tape of this embodiment, for example, by using a coating liquid 1 prepared to the viscosity described above, and by controlling the drying conditions of the coating liquid 1, a cover tape 10 in which the tack force of the sealant surface S2 is within a predetermined numerical range can be manufactured. Specifically, after applying the coating liquid 1 prepared to the viscosity described above, the coating liquid 1 is dried in a drying oven with a length of 5 to 15 m, under conditions of an oven temperature of 40 to 120°C and a transport speed of 50 to 300 m / min.

[0094] Although the details are unclear, it is presumed that because the drying of coating liquid 1 is uneven and volatile, controlling the drying conditions such as the drying speed of coating liquid 1 in addition to the viscosity of coating liquid 1 (which is particularly related to its spreadability) will create irregularities on the sealant surface S2, resulting in a surface texture that is good for reducing blocking and powder shedding after drying. Furthermore, if the coating liquid 1 contains particles (for example, particles containing metal elements), it is presumed that the tack force of the sealant surface S2 can be controlled not only by controlling the viscosity of the coating liquid 1, which is closely related to the ease with which the particles settle, but also by controlling the drying rate of the coating liquid 1. This allows the particles to be fixed in a state where they are appropriately settled (or floating) in the dried sealant layer 2.

[0095] Next, an antistatic layer 3 can be formed by applying an antistatic layer-forming coating liquid (hereinafter also referred to as "coating liquid 2" as appropriate) to the surface of the substrate layer 1 opposite to the sealant layer 2 and drying it. For example, a gravure coating method can be used as the coating method.

[0096] The coating solution 2 can be prepared, for example, by mixing a conductive polymer, a binder resin, a solvent, and other additives as needed. The viscosity of the coating solution 2 at 28°C is, for example, 0.1 to 10 mPa·s when measured using a vibrating viscometer in accordance with JIS Z 8803. The viscosity of the coating solution 2 at 28°C can be adjusted, for example, by adjusting the amount of solvent, the type of solvent, etc.

[0097] The solvent used in coating solution 2 is not particularly limited, but may be one or more selected from the group consisting of, for example, esters such as ethyl acetate and butyl acetate; ketones such as methyl ethyl ketone, acetone, cyclohexanone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene and xylene; aliphatic alcohols such as methanol, ethanol, n-propanol, and isopropanol; alicyclic alcohols such as cyclohexanol; and water.

[0098] In the cover tape of this embodiment, for example, by using a coating liquid 2 prepared to the viscosity described above, and by controlling the drying conditions of the coating liquid 2, a cover tape 10 in which the Spc of the antistatic surface S1 is within a predetermined numerical range can be manufactured. Specifically, after applying the coating liquid 2 prepared to the viscosity described above, the coating liquid 2 is dried using a drying oven with a length of 5 to 15 m, under conditions of an oven temperature of 40 to 120°C and a transport speed of 50 to 300 / min.

[0099] Although the details are unclear, it is presumed that because the drying of coating liquid 2 is uneven and volatile, controlling the drying conditions such as the drying speed of coating liquid 2 in addition to the viscosity of coating liquid 2 (which is particularly related to its spreadability) will create irregularities on the antistatic surface S1, resulting in a surface texture that is good for reducing blocking and powder shedding after drying. Furthermore, if the coating solution 2 contains particles (for example, particles containing metal elements), it is presumed that the Spc of the antistatic surface S1 can also be controlled by controlling the drying rate of the coating solution 2, in addition to the viscosity of the coating solution 2, which is closely related to how easily the particles settle. This allows the particles to be fixed in a state where they are appropriately settled (or floating) in the final antistatic layer 3.

[0100] The cover tape 10 may also have an intermediate layer between the base layer 1 and the sealant layer 2. If the cover tape 10 has an intermediate layer between the base layer 1 and the sealant layer 2, the cover tape 10 can be formed, for example, by the following method.

[0101] First, an intermediate layer is formed on at least one side of the base layer 1. The intermediate layer can be formed by, for example, an extrusion lamination method or a dry lamination method. Next, a sealant layer 2 can be formed by applying coating liquid 1 to the side of the intermediate layer opposite to the base layer 1 and drying it. Next, an antistatic layer 3 can be formed by applying coating liquid 2 to the side of the base layer 1 opposite to the sealant layer 2 and drying it.

[0102] [Electronic component packaging] The electronic component packaging of this embodiment comprises a carrier tape having a recess, an electronic component housed in the recess, and a cover tape of this embodiment. In other words, the electronic component packaging of this embodiment comprises a carrier tape in which the electronic component is housed in the recess, and a cover tape of this embodiment. In the electronic component packaging of this embodiment, a sealant layer is adhered to the carrier tape so as to encapsulate the electronic component.

[0103] In this embodiment, the shape and material of the carrier tape in the electronic component packaging are not particularly limited.

[0104] For example, an electronic component package can be obtained from the cover tape of this embodiment and a carrier tape in which the electronic component is housed in a recess. This will be explained with reference to Figure 2.

[0105] In Figure 2, the cover tape 10 is used as a lid material for a strip-shaped carrier tape 20, which has a series of concave pockets 21 arranged to match the shape of electronic components (not shown). Specifically, the cover tape 10 is adhered (usually heat-sealed) to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. Hereafter, the structure obtained by adhering the cover tape 10 and the carrier tape 20 will be referred to as the electronic component packaging 100.

[0106] The electronic component packaging 100 can be manufactured, for example, by following the procedure below. First, the electronic components are placed inside the pockets 21 of the carrier tape 20. Next, the cover tape 10 is heat-sealed to the surface of the carrier tape 20 so as to cover the entire opening of the pocket 21 of the carrier tape 20. At this time, the sealant layer 2 of the cover tape 10 is made to be in contact with the carrier tape 20 (that is, the heat sealing is performed so that the "back surface" of the cover tape 10 in Figure 2 becomes the sealant layer 2). The specific method or conditions for heat sealing are not particularly limited, as long as the cover tape 10 is sufficiently strongly adhered to the carrier tape 20. Heat sealing can be performed, for example, using a known heat sealing machine, within the range of a temperature of 100°C to 240°C, a load of 0.1 kgf to 10 kgf, and a time of 0.0001 seconds to 1 second.

[0107] As a result, a structure (electronic component packaging 100) in which electronic components are sealed and housed is obtained. This structure (electronic component packaging 100) can store electronic components, for example, while they are wound around a core, until the time of use. Furthermore, the electronic component packaging 100, while wound around a core, can be used to transport electronic components to remote locations by sea or air freight. The core includes, for example, a metal core, a paper core, a resin core, and the like.

[0108] When using electronic components, the cover tape 10 is peeled off from the carrier tape 20, and the electronic components that were housed in it are removed. The electronic components housed within the electronic component packaging 100 are not particularly limited, but include, for example, semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related components, connectors, electrodes, and all other components used in the manufacture of electrical and electronic equipment.

[0109] The embodiments of the present invention have been described above, but these are merely examples, and various other configurations can also be adopted. Furthermore, the present invention is not limited to the embodiments described above, and any modifications, improvements, etc., that do not impair the effects of the present invention are included in the present invention. [Examples]

[0110] This embodiment will be described in detail below with reference to examples and other relevant information. However, this embodiment is not limited in any way to the descriptions of these examples.

[0111] The cover tape for each example was prepared using the following method.

[0112] <Example 1> A PET film (manufactured by Toyobo Industries Ltd., E5102, 25 μm thick) (hereinafter also referred to as PET film 1) was prepared as the base layer. An intermediate layer was formed on PET film 1 by extrusion lamination using low-density polyethylene (manufactured by Sumitomo Chemical Co., Ltd., Sumikasen L705) (hereinafter also referred to as LDPE 1) to a thickness of 25 μm at an extrusion temperature of 300°C. Next, coating solution 1 was prepared by uniformly dispersing or dissolving 60 parts by mass of antimond-doped tin oxide (manufactured by Mitsubishi Materials Corporation, T-1) and 40 parts by mass of (meth)acrylic resin (manufactured by Kusumoto Chemicals Co., Ltd., NeoCryl B-810) using toluene. Then, coating solution 1 was applied to the surface of the intermediate layer opposite to the substrate layer by gravure coating, and a sealant layer with a thickness of 0.5 μm was formed by drying in a 10 m long drying oven under conditions of oven temperature of 60°C and transport speed of 120 m / min. Next, coating solution 2 was prepared by mixing 10 parts by mass of PEDOT-containing (meth)acrylic resin (Arakawa Chemical Industries, Ltd., Aracoat AS601D, solids content 5.0% by mass), 0.5 parts by mass of (meth)acrylic resin emulsion (Toagosei Co., Ltd., Aron NS-1200(1), solids content 40% by mass), 1.0 part by mass of aziridine-based curing agent (Arakawa Chemical Industries, Ltd., Aracoat CL-910, solids content 10% by mass), 1.0 part by mass of ethylene glycol (Fujifilm Wako Pure Chemical Industries, Ltd.), and 87.5 parts by mass of a 70% by mass aqueous solution of isopropanol. Then, coating solution 2 was applied to the surface of the substrate layer opposite to the intermediate layer by gravure coating, and then dried in a 10 m long drying oven at a furnace temperature of 100 °C and a transport speed of 120 m / min to form an antistatic layer with a thickness of 0.1 μm. Based on the above, the cover tape of Example 1 was manufactured.

[0113] <Example 2> The cover tape of Example 2 was prepared under the same conditions as in Example 1, except that the antistatic layer was 0.2 μm thick.

[0114] <Comparative Example 1> A cover tape for Comparative Example 1 was prepared under the same conditions as in Example 1, except that the thickness of the intermediate layer was changed to 20 μm and the method of forming the sealant layer was changed as follows. First, 15 parts by mass of styrene-(meth)methyl copolymer (manufactured by Nippon Steel Chemical & Material Co., Ltd., Estyrene MS-600) (also called St-MMA), 65 parts by mass of ethylene-(meth)methyl copolymer (manufactured by Mitsui Dow Polychemical Co., Ltd., Elbaroy AC 1820) (hereinafter also called EMA), and 20 parts by mass of polyether / polyolefin copolymer (manufactured by Sanyo Chemical Industries, Ltd., Perestat 212) (hereinafter also called PEG-PP) were prepared. Next, these were melt-mixed to obtain molten mixture 1. Next, a sealant layer was formed on the surface of the intermediate layer opposite the base layer by extrusion lamination at an extrusion temperature of 200°C to a thickness of 5 μm using the molten mixture 1. During this film formation, the sealant layer was pressed against a cooling roll equipped with protrusions with a maximum height Rz of 2.5 μm, and the surface roughness of the sealant layer was adjusted by pressing a silicone rubber touch roll from the base layer side at a pressure of 0.2 MPa. The temperature of the cooling roll was set to 20°C.

[0115] <Comparative Example 2> The cover tape of Comparative Example 2 was prepared under the same conditions as in Comparative Example 1, except that the method for forming the sealant layer was changed as follows. A sealant layer was formed on the surface of the intermediate layer opposite the base layer by extrusion lamination at an extrusion temperature of 200°C to a thickness of 5 μm using the molten mixture 1. During this film formation, the sealant layer was pressed against a cooling roll equipped with protrusions with a maximum height Rz of 5.5 μm, and the surface roughness of the sealant layer was adjusted by pressing a silicone rubber touch roll from the base layer side at a pressure of 0.2 MPa. The temperature of the cooling roll was set to 20°C.

[0116] <Comparative Example 3> As a base layer, a PET film (manufactured by Toyobo Industries Ltd., E7415, 25 μm thick) having an antistatic layer (hereinafter also referred to as PET film 2) was prepared. An intermediate layer was formed on the side of PET film 2 where the antistatic layer was not formed by extrusion lamination, by depositing LDPE 1 to a thickness of 25 μm at an extrusion temperature of 300°C. Next, a sealant layer with a thickness of 0.5 μm was formed under the same conditions as in Example 1. Based on the above, the cover tape for Comparative Example 3 was prepared.

[0117] <Comparative Example 4> The cover tape of Comparative Example 4 was prepared under the same conditions as Comparative Example 3, except that the base layer was changed to a PET film with an antistatic layer (Futamura Chemical Co., Ltd., FE2021, 25 μm thick).

[0118] The physical properties of the cover tapes in each example were measured or evaluated using the following method. The results are shown in Table 1.

[0119] <Surface roughness of the antistatic surface> For each example of cover tape, the surface roughness of the antistatic surface was measured using a laser microscope (VK-X3000, manufactured by Keyence Corporation). The analysis software included with the laser microscope was used. Specifically, the following indicators were measured to assess surface roughness. • Arithmetic mean curvature of the mountain peak measured in accordance with ISO 25178-2:2012 (Spc)

[0120] <Tackiness of the sealant surface> A 5mmφ stainless steel probe was pressed against the sealant surface of the cover tape in each example at a pressing speed of 0.5mm / second. The stainless steel probe was then held at a measurement temperature of 60°C, with a pressing load of 2,000gf, for 20 seconds. The stainless steel probe was then lifted vertically at a lifting speed of 10mm / second. The peak value of the load on the stainless steel probe was measured during this process. This measurement was performed with a sample size of n=5. The average value of each sample was defined as the tuck force (gf).

[0121] <Evaluation of powder fallout> Each example of cover tape was cut to a width of 5.4 mm and heat-sealed onto the surface of a polystyrene carrier tape (CEL-E980A, manufactured by Sumitomo Bakelite Co., Ltd.) using a taping machine (TWA-6621, manufactured by Tokyo Wells Co., Ltd.) with a double-bladed iron with one blade measuring 0.4 mm in width and 28 mm in length, under the following conditions: sealing temperature 180°C, load 5 kgf, sealing time 60 milliseconds, and carrier tape feed pitch 4 mm. Next, the tape guide part of the taping machine that rubbed against the antistatic layer side of the cover tape was observed. The powder fallout of the cover tape was evaluated according to the following (evaluation criteria for powder fallout).

[0122] (Evaluation criteria for powder fallout) A: No powder has fallen off the tape guide section after 1,000m of heat sealing. B: Powder falloff occurred in the tape guide area after 1,000m of heat sealing. C: Powder fallout occurred in the tape guide area after heat sealing of 100m.

[0123] <Blocking Evaluation> Each example of cover tape was cut to a width of 5.4 mm and a length of 500 m. Next, structure 1 was fabricated by winding the cut cover tape tightly around an ABS resin core (width 5.4 mm, diameter 3 inches). Next, structure 1 was left to stand at 60°C for 24 hours. After standing, structure 1 was positioned vertically and slowly rotated in the opposite direction to the direction in which the cover tape was wrapped. At this time, the strength of adhesion between the front and back of the cover tape (degree of blocking) was evaluated according to the following (blocking evaluation criteria).

[0124] (Blocking evaluation criteria) A: The cover tape can be unwound by its own weight. B: The cover tape cannot be unwound by its own weight, but it can be unwound by gently shaking it with your hand, which will release the adhesive. C: The cover tape cannot be unwound by its own weight, and even lightly shaking the cover tape by hand does not release the adhesive, making it impossible to unwind.

[0125] <Measurement of surface resistance R0 of an antistatic surface> For each example, the antistatic surface of the cover tape was measured using a surface resistance meter (SIMCO ST-3) under conditions of 25°C and 50%RH, and the surface resistance value R0 was defined as the surface resistance value R0. Note that, for example, "1.2E+8" in Example 1 listed in Table 1 is equivalent to "1.2 × 10 8 This represents "1.7E+11" in Comparative Example 4, and "1.7×10 11 This represents "[...]". The same applies to the surface resistance value R1 and the ratio (R1 / R0).

[0126] <Measurement of surface resistance R1 of the antistatic surface> The cover tapes for each example were left standing under conditions of 60°C, 90% RH, and 24 hours. The antistatic surface of the cover tape after standing was measured using a surface resistance meter (SIMCO ST-3) under conditions of 25°C and 50%RH, and the surface resistance value R1 was defined as the surface resistance value R1.

[0127] <Calculation of the ratio (R1 / R0)> For each example of cover tape, the ratio (R1 / R0) was calculated by dividing the surface resistance value R1 by the surface resistance value R0.

[0128] [Table 1] [Explanation of Symbols]

[0129] 1 Base material layer S1 Antistatic surface S2 sealant surface 2. Sealant layer 3. Antistatic layer 10. Cover tape for electronic component packaging (cover tape) 20 Carrier Tapes 21 pockets 100 Electronic component packaging

Claims

1. The structure comprises a sealant layer, a substrate layer, and an antistatic layer in this order. The antistatic layer side has an antistatic surface, The sealant layer side has a sealant surface, The arithmetic mean curvature Spc of the peak of the aforementioned antistatic surface, measured in accordance with ISO 25178-2:2012, is 150 / mm or more. A cover tape for packaging electronic components, wherein the tack force of the sealant surface, as determined by the following method (Method 1), is 60 gf or less. (Method 1) A SUS probe with a contact area of ​​5 mmφ is pressed against the sealant surface of the electronic component packaging cover tape at a pressing speed of 0.5 mm / second. Then, it is held for 20 seconds at a measurement temperature of 60°C and a pressing load of 2,000 gf. The measured load when the probe is then pulled up vertically at a pulling speed of 10 mm / second is defined as the tack force (gf).

2. Surface resistance value R according to the following (Method 2) ０ The surface resistance value R for the following (Method 3) １ Ratio (R １ / R ０ The cover tape for packaging electronic components according to claim 1, wherein the coefficient of (Method 2) The surface resistance of the antistatic surface is measured under conditions of 25°C and 50% RH. (Method 3) The aforementioned cover tape for packaging electronic components is treated under the conditions of 60°C, 90% RH, and 24 hours. Next, the surface resistance value of the antistatic surface is measured under conditions of 25°C and 50% RH.

3. Surface resistance value R according to the following (Method 2) ０ 1.0 × 10 １０ A cover tape for packaging electronic components according to claim 1 or 2, wherein the impedance is Ω or less. (Method 2) The surface resistance of the antistatic surface is measured under conditions of 25°C and 50% RH.

4. Surface resistance value R according to the following (Method 3) １ 1.0 × 10 １０ A cover tape for packaging electronic components according to claim 1 or 2, wherein the impedance is Ω or less. (Method 3) The aforementioned cover tape for packaging electronic components is treated under the conditions of 60°C, 90% RH, and 24 hours. Next, the surface resistance value of the antistatic surface is measured under conditions of 25°C and 50% RH.

5. The cover tape for packaging electronic components according to claim 1 or 2, wherein the antistatic layer contains a conductive polymer.

6. The cover tape for packaging electronic components according to claim 1 or 2, wherein the antistatic layer includes a binder resin.

7. The cover tape for packaging electronic components according to claim 1 or 2, wherein the antistatic layer comprises one or more selected from the group consisting of aziridine-based curing agents, carbodiimide-based curing agents, and oxazoline-based curing agents.

8. The cover tape for packaging electronic components according to claim 1 or 2, wherein the antistatic layer comprises one or more selected from the group consisting of (meth)acrylic acid ester copolymer, polyester-(meth)acrylic acid ester copolymer, polyester-styrene copolymer, (meth)acrylic acid ester-styrene copolymer, and polyester-(meth)acrylic acid ester-styrene copolymer.

9. The cover tape for packaging electronic components according to claim 1 or 2, wherein the antistatic layer contains a conductive additive.

10. The cover tape for packaging electronic components according to claim 1 or 2, wherein the sealant layer comprises one or more selected from the group consisting of ethylene-vinyl acetate copolymer, styrene resin, and (meth)acrylic resin.

11. The cover tape for packaging electronic components according to claim 1 or 2, wherein the base layer contains a polyester resin.

12. The cover tape for packaging electronic components according to claim 1 or 2, further comprising an intermediate layer between the base material layer and the sealant layer.

13. The cover tape for packaging electronic components according to claim 12, wherein the intermediate layer comprises one or more selected from the group consisting of polyethylene resins and styrene resins.

14. The package comprises a carrier tape having a recess, an electronic component housed in the recess, and the cover tape for packaging electronic components according to claim 1 or 2. An electronic component package in which the sealant layer is adhered to the carrier tape to encapsulate the electronic component.

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