Suction head and conveying device

Abstract

A suction head (100) comprises: a body (10) having a suction hole (11) for suctioning a suction object 1; a piezoelectric pump (20) which is provided to the inside or the surface of the body (10) and by which a suction force is generated by energization; and a drive circuit (30) for driving the piezoelectric pump (20). A suction path (13) that connects the suction hole (11) and the piezoelectric pump (20) is provided inside the body (10).

Description

Technical Field

[0001] The present disclosure relates to an adsorption head that adsorbs an adsorption target by suction, and a transfer device including the adsorption head.

Background Art

[0002] An adsorption head that adsorbs an adsorption target by suction and transfers it to another position is known. Patent Document 1 discloses a work transfer device that sucks and transfers a processing target by an adsorption head including a vacuum pump. FIG. 9 is a perspective view of the adsorption head 300 disclosed in Patent Document 1 as viewed obliquely from above. As shown in FIG. 9, the adsorption head 300 includes a flat pad portion 310 provided with a plurality of adsorption holes, a vacuum pump 320, a support portion 330, and a transfer magnet 340. The support portion 330 extends in a predetermined direction (for example, the vertical direction), the pad portion 310 is fixed to one end, and the vacuum pump 320 is fixed to the other end. The adsorption holes are provided in the main surface 310b on the side opposite to the side where the support portion 330 is provided among the pair of opposing main surfaces 310a and 310b of the pad portion 310.

[0003] The vacuum pump 320 has a plurality of pump portions 321. Each pump portion 321 is connected to a plurality of adsorption holes provided in the pad portion 310 by a vacuum pipe 350. When each pump portion 321 operates, air is sucked from the adsorption holes and an adsorption force is generated.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the suction head 300 described in Patent Document 1, since each pump section 321 of the vacuum pump 320 is located away from the pad section 310, the length of the vacuum piping 350 connecting each pump section 321 to the suction hole needs to be increased. As a result, the responsiveness when adsorbing the object to be adsorbed decreases.

[0006] One aspect of this disclosure aims to solve the above problems and to provide an adsorption head that can improve the responsiveness when adsorbing an object to be adsorbed, and a conveying device equipped with such an adsorption head. [Means for solving the problem]

[0007] The suction head of this disclosure is A main body having suction holes for adsorbing objects to be adsorbed, A piezoelectric pump, provided inside or on the surface of the main body, generates suction force when an electric current is applied, The system includes a drive circuit for driving the piezoelectric pump, The main body is characterized by having a suction passage inside which the suction hole and the piezoelectric pump are connected.

[0008] The transport device of this disclosure is Multiple supply mechanisms capable of supplying the adsorbed object to each of the multiple supply positions, The aforementioned suction head, A moving mechanism comprising a stator of a linear motor having a predetermined travel trajectory, and a movable element of a linear motor that can move between a plurality of supply positions along the travel trajectory, The movable element is characterized by having the suction head. [Effects of the Invention]

[0009] The adsorption head of this disclosure improves the responsiveness when adsorbing an object. Specifically, when the piezoelectric pump is located away from the surface of the main body, the length of the piping connecting the piezoelectric pump and the suction port becomes long. However, by having the piezoelectric pump located inside or on the surface of the main body and connected to the suction port by a suction passage located inside the main body, the suction passage can be shortened, thereby improving responsiveness.

[0010] The transport device of this disclosure can improve the responsiveness when the suction head adsorbs an object to be adsorbed. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic plan view showing the second main surface side of the suction head in the first embodiment of the present disclosure. [Figure 2] This is a schematic plan view showing the first main surface side of the suction head in the first embodiment. [Figure 3] Figure 1 is a schematic cross-sectional view showing the structure of the suction head when it is cut along the line III-III. [Figure 4] This is a schematic cross-sectional view showing the structure of a piezoelectric pump. [Figure 5] This is a schematic plan view showing the second main surface of the suction head when the drive circuit is arranged on top of the piezoelectric pump. [Figure 6] This is a schematic cross-sectional view showing the configuration of the suction head in the second embodiment of the present disclosure. [Figure 7] This is a schematic plan view showing the configuration of a conveying device in one embodiment. [Figure 8] This diagram schematically shows the configuration of the movable element of the moving mechanism when viewed in the direction along the travel trajectory of the stator. [Figure 9] This is a perspective view of the suction head disclosed in Patent Document 1, viewed from diagonally above. [Figure 10] This is a schematic cross-sectional view showing the configuration of the suction head in the third embodiment of the present disclosure. [Figure 11] A cross-sectional view illustrating the state of the adsorption head in the third embodiment of the present disclosure when the piezoelectric pump is energized. [Figure 12] A cross-sectional view illustrating the state of the adsorption head in the third embodiment of the present disclosure when the piezoelectric pump is energized. [Figure 13] A cross-sectional view illustrating the state of the adsorption head in the third embodiment of the present disclosure when the piezoelectric pump is energized. [Figure 14] A cross-sectional view illustrating the state of the adsorption head in the third embodiment of the present disclosure when the piezoelectric pump is not energized. [Figure 15] A cross-sectional view illustrating the state of the adsorption head in the third embodiment of the present disclosure when the piezoelectric pump is not energized. [Figure 16] A cross-sectional view schematically showing the configuration of the adsorption head of the modified example.

Mode for Carrying Out the Invention

[0012] Embodiments of the present disclosure are shown below to specifically describe the features of the present disclosure. <First Embodiment> FIG. 1 is a plan view schematically showing the second main surface 10b side of the adsorption head 100 in the first embodiment of the present disclosure. FIG. 2 is a plan view schematically showing the first main surface 10a side of the adsorption head 100 in the first embodiment. FIG. 3 is a cross-sectional view schematically showing the structure when the adsorption head 100 shown in FIG. 1 is cut along line III-III.

[0013] The adsorption head 100 includes a main body portion 10, a piezoelectric pump 20, and a drive circuit 30. The adsorption head 100 may further include an adsorption confirmation sensor 40. The main body portion 10 has a suction hole 11 for sucking the adsorption object 1. The number of the suction holes 11 is arbitrary and may be one or more. In the present embodiment, a plurality of suction holes 11 are provided in the main body portion 10.

[0014] There are no particular restrictions on the type of object 1 that can be adsorbed by the adsorption head 100. The object 1 can, for example, have a sheet-like shape. In this embodiment, the main body 10 includes a flat plate portion having a first main surface 10a on which the suction holes 11 are provided, and a second main surface 10b opposite to the first main surface 10a. However, the main body 10 may include any other member besides the flat plate portion, or a part of the flat plate portion may have irregularities. In other words, the main body 10 does not have to be flat as a whole. The first main surface 10a on which the suction holes 11 are provided becomes the adsorption surface that adsorbs the object to be adsorbed 1.

[0015] The shape of the main body 10 is arbitrary. In the examples shown in Figures 1 and 2, the shape of the main body 10 when viewed in the direction perpendicular to the first main surface 10a and the second main surface 10b (hereinafter referred to as the thickness direction) is a rectangle with four inwardly recessed portions 10c. However, the shape of the main body 10 is not limited to the shapes shown in Figures 1 and 2.

[0016] The material of the main body 10 is arbitrary and can be, for example, resin or metal. The size of the main body 10 is also arbitrary. For example, if the shape of the main body 10 is considered to be rectangular when viewed in the thickness direction, the size is 120 mm x 120 mm, and the thickness of the main body 10, the thickness of the flat plate portion in this embodiment, is, for example, 5 mm. The thickness of the main body 10 is also arbitrary. However, from the viewpoint of shortening the distance from the suction hole 11 to the discharge port 14 described later, the thickness of the main body 10 is preferably 1 mm or more and 100 mm or less. If the thickness of the main body 10 is within this range, the distance from the suction hole 11 to the piezoelectric pump 20 connected to the discharge port 14 can be shortened, thereby improving the responsiveness when the suction head 100 adsorbs the object to be adsorbed 1. If the thickness of the main body 10 is not uniform, the average value of the maximum and minimum thickness of the main body 10 is taken as the thickness of the main body 10.

[0017] The shape of the suction hole 11 is arbitrary. In this embodiment, as shown in Figure 2, the shape of the suction hole 11 when viewed in the thickness direction is circular. Also in this embodiment, as shown in Figure 3, the suction hole 11 has a shape in which the diameter increases from the first main surface 10a toward the second main surface 10b. By having the suction hole 11 have a shape in which the diameter increases from the first main surface 10a toward the second main surface 10b, it becomes possible to adsorb the object to be adsorbed 1 with a greater suction force. For example, the diameter of the suction hole 11 on the first main surface 10a side is 1 mm, and the diameter on the second main surface 10b side is 3 mm. The distance between two adjacent suction holes 11 is, for example, 1 mm.

[0018] In this embodiment, four suction areas 12, each having multiple suction holes 11, are provided on the first main surface 10a of the main body 10. Specifically, as shown in Figure 2, suction areas 12 are provided at the four corners of the first main surface 10a of the main body 10. By providing suction areas 12 at the four corners of the main body 10, for example, a sheet-like object 1 can be adsorbed in a balanced manner. However, the number of suction areas 12 is not limited to four, nor are the positions of the suction areas 12 limited to those shown in Figure 2. The number of suction holes 11 included in one suction area 12 is arbitrary. At least one suction hole 11 is provided in each suction area 12. Furthermore, the suction holes 11 do not need to be clustered together in a single area like the suction areas 12, and can be provided at any position.

[0019] The main body 10 is provided with a suction passage 13 that connects the suction holes 11 to the piezoelectric pump 20. As shown in Figure 3, the multiple suction holes 11 provided in the main body 10 are in communication with the suction passage 13. The main body 10 also has multiple suction passages 13 that are in communication with the multiple suction holes 11. An outlet 14 is provided on the second main surface 10b of the main body 10 and is in communication with the suction passage 13. That is, the gas drawn in from the suction holes 11 of the main body 10 passes through the suction passage 13 and is blown out from the outlet 14.

[0020] The piezoelectric pump 20 is provided inside or on the surface of the main body 10, and generates suction force when energized. In this embodiment, the piezoelectric pump 20 is provided on the surface of the main body 10, more specifically on the second main surface 10b. When viewed in the thickness direction of the main body 10, the piezoelectric pump 20 is provided in a position where at least a portion of it overlaps with the suction area 12.

[0021] It is preferable that multiple piezoelectric pumps 20 are provided. By providing multiple piezoelectric pumps 20, the object to be adsorbed 1 can be adsorbed more reliably. For example, if the output of one piezoelectric pump 20 decreases, the other piezoelectric pumps 20 can maintain the adsorption force. Therefore, it is possible to suppress the object to be adsorbed 1 from suddenly detaching during adsorption. In the example shown in Figure 1, four piezoelectric pumps 20 are provided. The four piezoelectric pumps 20 are provided so that at least a portion of them overlaps with each of the four adsorption areas 12 when viewed in the thickness direction of the main body 10. However, the number of piezoelectric pumps 20 is not limited to four; it may be any number of three or fewer, or any number of five or more. At least one corresponding suction hole 11 is provided for each piezoelectric pump 20. As the piezoelectric pump 20, it is possible to use the piezoelectric pump disclosed in International Publication No. 2016 / 006677.

[0022] Furthermore, the suction passages 13 described above are not connected to the same outlet 14. In other words, each piezoelectric pump 20 is connected to a different suction passage 13. With this configuration, the object to be adsorbed 1 can be adsorbed at multiple locations. Therefore, the posture of the object to be adsorbed 1 is stable during adsorption.

[0023] Figure 4 is a schematic cross-sectional view showing the structure of the piezoelectric pump 20. The piezoelectric pump 20 comprises a piezoelectric element 21 and a structure 22. The structure 22 has a thin shape in the thickness direction. An outlet 23 is opened near the center of the top surface of the structure 22. An inlet 24 is opened near the edge of the bottom surface of the structure 22. The piezoelectric pump 20 is positioned such that the inlet 24 faces the second main surface 10b of the main body 10.

[0024] The structure 22 contains a flow path 25 and a pump chamber 26. The flow path 25 connects to the discharge port 23 at the top surface of the structure 22, extends from near the center outwards within the structure 22, and connects to the suction port 24 at the bottom surface of the structure 22. The pump chamber 26 is a space provided on the bottom side of the communication portion between the discharge port 23 and the flow path 25, and opens to the communication portion between the discharge port 23 and the flow path 25.

[0025] The inner bottom surface of the pump chamber 26 in the structure 22 is configured as a diaphragm (vibrating plate) 27 capable of bending vibration. The top surface of the diaphragm 27 faces the pump chamber 26, and a piezoelectric element 21 is attached to the bottom surface. The top surface of the diaphragm 27 faces the discharge port 23 with the pump chamber 26 in between. The piezoelectric element 21 is a thin disc in the thickness direction and has piezoelectric properties that cause it to expand and contract in the in-plane direction of its main surface when an AC voltage is applied.

[0026] As described in International Publication No. 2016 / 006677, the piezoelectric pump 20 functions as a pump when an electric current is applied, causing the piezoelectric element 21 to displace. Specifically, the displacement of the piezoelectric element 21 causes gas to be drawn in from the intake port 24, flow through the passage 25 into the pump chamber 26, and then discharged from the pump chamber 26 to the outside through the discharge port 23.

[0027] The piezoelectric pump 20 is bonded to the main body 10. The piezoelectric pump 20 and the main body 10 can be bonded by any method, for example, rubber double-sided tape can be used. By bonding the piezoelectric pump 20 and the main body 10 with rubber double-sided tape, it is possible to prevent gaps from forming between the piezoelectric pump 20 and the main body 10, thereby preventing gas drawn in from the suction port 11 from leaking out of the gap. However, it is preferable that the adhesive, such as double-sided tape, does not obstruct the flow of gas from the discharge port 14 to the intake port 24. Furthermore, it is preferable that the adhesive, such as double-sided tape, is installed in such a way that gas flowing from the discharge port 14 to the intake port 24 does not leak to the outside. Specifically, it is preferable that the adhesive, such as double-sided tape, is installed so as to surround the area where the discharge port 14 of the main body 10 and the intake port 24 of the piezoelectric pump 20 face each other. In this disclosure, the embodiment in which the piezoelectric pump 20 is provided on the surface of the main body 10 also includes a configuration in which the piezoelectric pump 20 is not in direct contact with the surface of the main body 10, but is provided on the surface of the main body 10 via double-sided tape or the like, as described above.

[0028] In this embodiment, the piezoelectric pump 20 has a flat plate shape, and its thickness direction is arranged parallel to the direction in which gas is drawn in from the suction holes 11 provided in the main body 10. The thickness direction of the flat plate piezoelectric pump 20 is the direction in which the pair of main surfaces constituting the plate face each other. More specifically, the piezoelectric pump 20 is bonded to the main body 10 such that the intake port 24 overlaps with the discharge port 14 provided on the second main surface 10b of the main body 10. Therefore, when the piezoelectric pump 20 is driven, gas is drawn in from the multiple suction holes 11 of the main body 10, passes through the discharge port 14 and the intake port 24 of the piezoelectric pump 20, and is discharged from the discharge port 23 to the outside of the suction head 100. Other components such as piping communicating with the discharge port 23 and a pressure reducing device communicating with the discharge port 23 may be attached to the piezoelectric pump 20. On the other hand, by not attaching other components to the discharge port 23, the overall weight of the suction head 100 can be reduced. In other words, according to the configuration of this embodiment, a lightweight and easy-to-handle suction head 100 can be made.

[0029] The drive circuit 30 is a circuit for driving the piezoelectric pump 20. In this embodiment, four drive circuits 30 are provided to drive four piezoelectric pumps 20, one of each. Two wires connect one drive circuit 30 to one piezoelectric pump 20. One of the two wires is the positive power line, and the other is the negative power line.

[0030] In the example shown in Figure 1, the drive circuit 30 is provided on the second main surface 10b of the main body 10. However, as shown in Figure 5, the drive circuit 30 may be placed on top of the piezoelectric pump 20, or it may be placed in another location.

[0031] The drive circuit 30 is connected to the power supply 50. In this embodiment, four power supplies 50 are provided corresponding to the four drive circuits 30. However, there may be only one power supply 50, and one power supply 50 may be connected to each of the four drive circuits 30. One power supply 50 and one drive circuit 30 are connected by two wires. One of the two wires is the positive power line, and the other is the negative power line.

[0032] The drive circuit 30 controls the operation of the piezoelectric pump 20 by controlling the supply of power to the piezoelectric pump 20. Specifically, the drive circuit 30 controls the operation of the piezoelectric pump 20 by adjusting the voltage applied to the piezoelectric element 21 of the piezoelectric pump 20.

[0033] Each of the multiple drive circuits 30 is configured to independently drive its corresponding piezoelectric pump 20. In other words, each of the multiple drive circuits 30 can drive its corresponding piezoelectric pump 20 at any desired timing.

[0034] For example, when multiple sheets of adsorbable object 1 are stacked, it is possible to detach and adsorb only one adsorbable object 1 from the stacked multiple objects by controlling the timing of driving multiple piezoelectric pumps 20. For instance, one of the four drive circuits 30 drives the corresponding piezoelectric pump 20 to start suction, which attracts the corners of the sheet-like adsorbable object 1, creating an opportunity to detach one of the adsorbable objects 1. Subsequently, the other three drive circuits 30 drive the corresponding piezoelectric pumps 20, making it possible to adsorb and detach one of the adsorbable objects 1.

[0035] The power supply 50 may be provided in the main body 10 or outside the main body 10. In this embodiment, as shown in Figure 1, the power supply 50 is provided on the second main surface 10b of the main body 10. If the power supply 50 is provided outside the main body 10, the wiring connecting the power supply 50 and the drive circuit 30 may become entangled when the suction head 100 is moved, but by providing the power supply 50 in the main body 10, it is possible to prevent the aforementioned wiring from becoming entangled.

[0036] The adsorption confirmation sensor 40 is a sensor for confirming whether or not the object to be adsorbed 1 is adsorbed, and in this embodiment, it is installed at the position where gas is discharged from the discharge port 23 of the piezoelectric pump 20. The adsorption confirmation sensor 40 can be any type that can confirm whether or not the object to be adsorbed 1 is adsorbed. For example, as the adsorption confirmation sensor 40, at least one of a pressure sensor that measures the pressure near the discharge port 23 and an airflow sensor that measures the airflow rate of the gas discharged from the discharge port 23 of the piezoelectric pump 20 can be used.

[0037] When a pressure sensor is used as the adsorption confirmation sensor 40, for example, when the piezoelectric pump 20 is running, it can be determined that the object to be adsorbed 1 is adsorbed based on the pressure detected by the pressure sensor falling below a predetermined reference value.

[0038] Furthermore, when an airflow sensor is used as the adsorption confirmation sensor 40, for example, when the piezoelectric pump 20 is running, it can be determined that the object to be adsorbed 1 is adsorbed based on the airflow detected by the airflow sensor falling below a predetermined reference value. It is also possible to use both a pressure sensor and an airflow sensor as the adsorption confirmation sensor 40. For example, it can be determined that the object to be adsorbed 1 is adsorbed when the detected values ​​of both sensors fall below the reference value.

[0039] The adsorption confirmation sensor 40 can also be installed at a location other than the outlet 23 of the piezoelectric pump 20 where gas is discharged. However, for example, if the adsorption confirmation sensor 40 is installed on the suction side of the piezoelectric pump 20, the gas drawn in from the suction hole 11 may pass through the adsorption confirmation sensor 40, potentially reducing the responsiveness during suction. However, by installing the adsorption confirmation sensor 40 at the location where gas is discharged from the outlet 23 of the piezoelectric pump 20, the reduction in responsiveness during suction can be suppressed. Therefore, it is preferable that the adsorption confirmation sensor 40 be installed at the location where gas is discharged from the outlet 23 of the piezoelectric pump 20.

[0040] The suction head 100 in the first embodiment can improve the responsiveness when adsorbing the object to be adsorbed 1. Specifically, when the piezoelectric pump 20 is located away from the surface of the main body 10, the piping connecting the piezoelectric pump 20 and the suction port 11 becomes long. However, by providing the piezoelectric pump 20 inside or on the surface of the main body 10 and connecting it to the suction port 11 by a suction passage 13 provided inside the main body 10, the suction passage 13 can be shortened, thereby improving responsiveness.

[0041] Furthermore, since the suction head 100 in this embodiment is equipped with a piezoelectric pump 20, the mobility of the suction head 100 is improved compared to conventional suction heads equipped with a vacuum pump. In other words, because the piezoelectric pump 20 is lighter in weight than a vacuum pump, the mobility is improved compared to conventional suction heads, and rapid movement is possible. In addition, because the piezoelectric pump 20 produces less vibration and operating noise compared to a vacuum pump, for example, the positional accuracy when stopping the suction head 100 at a desired position and the positional accuracy when the suction head 100 picks up the object to be picked up 1 and places it in another position are improved.

[0042] In this embodiment of the suction head 100, the main body portion 10 includes a flat plate portion having a first main surface 10a on which the suction hole 11 is provided, and a second main surface 10b opposite to the first main surface 10a. Since the piezoelectric pump 20 is located on the second main surface 10b of the main body portion 10, the length of the suction passage 13 connecting the piezoelectric pump 20 and the suction hole 11 can be shortened, and the responsiveness during suction can be further improved.

[0043] Furthermore, as in the suction head 100 of this embodiment, the provision of multiple piezoelectric pumps 20 allows for more reliable and stable adsorption of the object to be adsorbed 1. <Second Embodiment> Figure 6 is a schematic cross-sectional view showing the configuration of the suction head 100A in the second embodiment. The suction head 100A in the second embodiment has a shape that tapers towards the tip. A suction hole 11 is provided at the tip of the suction head 100A. There may be one or more suction holes 11.

[0044] The piezoelectric pump 20 can be the same as the piezoelectric pump 20 in the first embodiment. In this embodiment, the piezoelectric pump 20 is provided inside the main body 10. More specifically, the piezoelectric pump 20 is provided inside the main body 10 in such a manner that at least a portion of it is exposed on the surface of the main body 10. The piezoelectric pump 20 has a flat plate shape and is positioned so that its thickness direction is perpendicular to the direction in which gas is drawn in from the suction hole 11. The thickness direction of the flat plate piezoelectric pump 20 is the direction in which the pair of main surfaces constituting the plate face each other. However, the position in which the piezoelectric pump 20 is provided is not limited to the position shown in Figure 6, and may be, for example, on the surface of the main body 10. Also, in the example shown in Figure 6, only one piezoelectric pump 20 is provided, but multiple piezoelectric pumps 20 may be provided.

[0045] As shown in Figure 6, the drive circuit 30 is provided inside the main body 10. However, the location where the drive circuit 30 is provided is not limited to inside the main body 10, and it may also be on the surface of the main body 10. Furthermore, if multiple piezoelectric pumps 20 are provided, multiple drive circuits 30 may be provided corresponding to the multiple piezoelectric pumps 20. In that case, each of the multiple drive circuits 30 can be configured to independently drive the corresponding piezoelectric pump 20. Note that in Figure 6, the power supply connected to the drive circuit 30 by wiring is omitted. Similar to the first embodiment, the power supply may be provided in the main body 10 or outside the main body 10.

[0046] Although not shown in Figure 6, the adsorption head 100A may further include an adsorption confirmation sensor 40 for confirming whether or not the object to be adsorbed 1 is being adsorbed. Similar to the adsorption head 100 in the first embodiment, the adsorption confirmation sensor 40 can be installed at a position where gas is discharged from the discharge port 23 of the piezoelectric pump 20.

[0047] The main body 10 is provided with a suction passage 13 connecting the suction hole 11 and the piezoelectric pump 20. When the piezoelectric pump 20 is energized, an attractive force is generated, allowing the object to be adsorbed 1 to be adsorbed through the suction hole 11. In this embodiment, the object to be adsorbed 1 is, for example, an electronic component such as a multilayer ceramic capacitor. The adsorption head 100A in this embodiment can, for example, adsorb an electronic component, which is the object to be adsorbed 1, and mount it onto a mounting substrate. Such an adsorption head 100A can be used, for example, mounted on a mounter that mounts electronic components and the like onto a substrate.

[0048] (Conveyor device) Next, the configuration of the transport device 200 equipped with the suction head 100 in the first embodiment described above will be explained.

[0049] Figure 7 is a schematic plan view showing the configuration of a transport device 200 in one embodiment. The transport device 200 comprises a suction head 100, a plurality of supply mechanisms 210, and a moving mechanism 220. Here, an example in which the object to be adsorbed 1 is a sheet-shaped battery material is described. However, the object to be adsorbed 1 is not limited to a sheet-shaped battery material. As will be described later, the transport device 200 in this embodiment also functions as a stacking device for stacking a plurality of objects to be adsorbed 1.

[0050] The multiple supply mechanisms 210 are capable of supplying the adsorbed object 1 to each of the multiple supply positions A1 to A4. One type of adsorbed object 1 is supplied to each of the multiple supply positions A1 to A4. In this embodiment, the multiple supply mechanisms 210 include four supply mechanisms: a first supply mechanism 210a, a second supply mechanism 210b, a third supply mechanism 210c, and a fourth supply mechanism 210d. However, the number of multiple supply mechanisms 210 is not limited to four.

[0051] The first supply mechanism 210a supplies the object to be adsorbed 1 to the first supply position A1. The object to be adsorbed 1 supplied by the first supply mechanism 210a is, for example, a resin film. The resin film is a sheet-like battery material that functions as a separator for a battery, and is made of, for example, polyethylene. In this embodiment, the first supply mechanism 210a is a belt conveyor, and it transports and supplies the object to be adsorbed 1 placed on the belt to the first supply position A1.

[0052] The second supply mechanism 210b supplies the object to be adsorbed 1 to the second supply position A2. The object to be adsorbed 1 supplied by the second supply mechanism 210b is, for example, the first metal foil. The first metal foil is a sheet-like battery material that functions as one of the electrodes, either the positive or negative electrode, of a battery, and is made of, for example, aluminum. In this embodiment, the second supply mechanism 210b is a belt conveyor that transports and supplies the object to be adsorbed 1 placed on the belt to the second supply position A2.

[0053] The third supply mechanism 210c supplies the object to be adsorbed 1 to the third supply position A3. The object to be adsorbed 1 supplied by the third supply mechanism 210c is, for example, a resin film. The resin film is a sheet-like battery material that functions as a separator for a battery, and is made of, for example, polyethylene. The resin film supplied by the third supply mechanism 210c can be the same as the resin film supplied by the first supply mechanism 210a. However, a different resin film may be used than the one supplied by the first supply mechanism 210a. In this embodiment, the third supply mechanism 210c is a belt conveyor, and it transports and supplies the object to be adsorbed 1 placed on the belt to the third supply position A3.

[0054] The fourth supply mechanism 210d supplies the object to be adsorbed 1 to the fourth supply position A4. The object to be adsorbed 1 supplied by the fourth supply mechanism 210d is, for example, a second metal foil. The second metal foil is a sheet-like battery material that functions as the other electrode of the positive and negative electrodes, and is made of, for example, aluminum. In this embodiment, the fourth supply mechanism 210d is a belt conveyor that transports and supplies the object to be adsorbed 1 placed on the belt to the fourth supply position A4.

[0055] Furthermore, the first supply mechanism 210a, the second supply mechanism 210b, the third supply mechanism 210c, and the fourth supply mechanism 210d are not limited to belt conveyors, but can be any structure capable of transporting and supplying the object to be adsorbed 1.

[0056] Alternatively, the supply mechanism 210 may be configured to transport a long, rectangular object 1 instead of transporting individual pieces of the object 1. In that case, the long object 1 can be cut at supply positions A1 to A4 to form individual pieces. In this embodiment, the shape of the object 1 is rectangular, but it may be a shape other than rectangular.

[0057] The moving mechanism 220 comprises a stator 221 of a linear motor having a predetermined travel trajectory, and a movable element 222 of a linear motor that can move between a plurality of supply positions A1 to A4 along the travel trajectory. In this embodiment, the travel trajectory of the stator 221 has an elliptical annular shape in plan view, as shown in Figure 7. However, the shape of the travel trajectory in plan view is not limited to an elliptical annular shape.

[0058] In this embodiment, the movable element 222 includes a first movable element 222a, a second movable element 222b, a third movable element 222c, a fourth movable element 222d, a fifth movable element 222e, a sixth movable element 222f, a seventh movable element 222g, and an eighth movable element 222h. Each movable element 222a to 222h can move independently. By including multiple movable elements 222 in the moving mechanism 220, the transport and stacking of the objects to be adsorbed 1 can be performed efficiently in a short time.

[0059] Figure 8 schematically shows the configuration of the movable element 222 of the moving mechanism 220 when viewed in the direction along the travel trajectory of the stator 221. The movable element 222 comprises a suction head 100 and a stacking stage 240. In Figure 8, the X-axis direction is the direction in which the supply mechanism 210 transports the object to be suctioned 1, and the Y-axis direction is the direction in which the movable element 222 moves along the travel trajectory. The Z-axis direction is the vertical direction.

[0060] The suction head 100 picks up the object to be picked up 1 that is transported by the supply mechanism 210. The suction head 100 is movable in the Z-axis direction and approaches the object to be picked up 1 from above by descending.

[0061] The suction head 100, which has picked up the object to be picked up 1, releases its grip on the object to be picked up 1 while the movable element 222 is moving along the travel trajectory of the stator 221, and stacks the object to be picked up 1 on the stacking stage 240. Specifically, the suction head 100 descends to approach the stacking stage 240 and releases its grip, thereby stacking the object to be picked up 1 on the stacking stage 240. However, if the object to be picked up 1 is already stacked on the stacking stage 240, "stacking the object to be picked up 1 on the stacking stage 240" means stacking the object to be picked up 1 on top of the object to be picked up 1 that is already stacked on the stacking stage 240.

[0062] In this embodiment, as shown in Figure 8, the movable element 222 is attached to two guide rails 223 of the stator 221 that form the travel track, and moves along the guide rails 223. As shown in Figure 8, the guide rails 223 of the stator 221 are provided to the side of the movable element 222, rather than vertically below it. In a structure where the guide rails 223 are provided vertically below the movable element 222, control must be performed considering the difference in the inner wheel ratio of the two guide rails 223, but in a structure where they are provided to the side, it is not necessary to consider the difference in inner wheel ratio, making control simpler.

[0063] The transport device 200 in this embodiment further includes an imaging unit 230. As described above, in this embodiment, there are four supply positions A1 to A4 for supplying four types of objects to be adsorbed 1. The imaging unit 230 is provided in four locations corresponding to the four supply positions A1 to A4. Specifically, the first imaging unit 230a is provided corresponding to the first supply position A1, the second imaging unit 230b is provided corresponding to the second supply position A2, the third imaging unit 230c is provided corresponding to the third supply position A3, and the fourth imaging unit 230d is provided corresponding to the fourth supply position A4. Figure 7 shows an example in which one imaging unit 230 is provided corresponding to one supply position, but two or more imaging units 230 may be provided corresponding to one supply position.

[0064] The imaging unit 230 may be fixed in a position corresponding to the supply positions A1 to A4, or it may be included in the movable element 222 and configured to move together with the movement of the movable element 222.

[0065] The following describes a method for sequentially adsorbing and stacking four types of objects to be adsorbed 1 using a transport device 200 equipped with an adsorption head 100 in one embodiment. Here, the operation of the first movable element 222a among the eight movable elements 222 to adsorb and stack the objects to be adsorbed 1 is described, but the operation of the other movable elements 222b to 222h to stack the objects to be adsorbed 1 is similar. If T is the time it takes for the first movable element 222a to complete one revolution around the stator 221, then the eighth movable element 222h will operate with a timing delay of T / 8, the seventh movable element 222g with a timing delay of (2T) / 8, the sixth movable element 222f with a timing delay of (3T) / 8, the fifth movable element 222e with a timing delay of (4T) / 8, the fourth movable element 222d with a timing delay of (5T) / 8, the third movable element 222c with a timing delay of (6T) / 8, and the second movable element 222b with a timing delay of (7T) / 8, all operating in the same way as the first movable element 222a.

[0066] In this explanation, we will assume that the transport device 200 is equipped with a system control unit that controls the operation of multiple supply mechanisms 210 and multiple moving mechanisms 220. (S1) The system control unit controls the first supply mechanism 210a so that the resin film, which is the object to be adsorbed 1, is supplied to the first supply position A1, and stops the first movable element 222a at the first supply position A1. The suction head 100 descends and adsorbs the object to be adsorbed 1 at the first supply position A1. That is, the drive circuit 30 drives the piezoelectric pump 20 to start suction and adsorb the object to be adsorbed 1. The system control unit controls the first imaging unit 30a so that it images at least a portion of the object to be adsorbed 1 that has been adsorbed by the suction head 100.

[0067] When the first movable element 222a is stopped at the first supply position A1, the third movable element 222c is stopped at the second supply position A2, the fifth movable element 222e is stopped at the third supply position A3, and the seventh movable element 222g is stopped at the fourth supply position A4. As will be described later, the third movable element 222c, the fifth movable element 222e, and the seventh movable element 222g, like the first movable element 222a, pick up the objects to be adsorbed 1 supplied at each supply position A1 to A4 with the adsorption head 100 and stack them on the stacking stage 240 while moving to the next supply position A1 to A4 and stopping.

[0068] Furthermore, when the first movable element 222a is stopped at the first supply position A1, the second movable element 222b is located between the first supply position A1 and the second supply position A2, the fourth movable element 222d is located between the second supply position A2 and the third supply position A3, the sixth movable element 222f is located between the third supply position A3 and the fourth supply position A4, and the eighth movable element 222h is located between the fourth supply position A4 and the first supply position A1. The second movable element 222b, the fourth movable element 222d, the sixth movable element 222f, and the eighth movable element 222h each perform relative position correction of the object to be adsorbed 1 with respect to the stacking stage 240 while moving to the next supply positions A1 to A4 and stopping, as will be described later, to perform stacking.

[0069] (S2) Next, the system control unit moves the first movable element 222a along the travel track from the first supply position A1 to the second supply position A2. While the first movable element 222a moves from the first supply position A1 to the second supply position A2 and stops, the relative position of the object to be adsorbed 1, which is being adsorbed by the suction head 100, with respect to the stacking stage 240 is corrected. Specifically, based on the image of the object to be adsorbed 1 captured by the first imaging unit 230a, the relative position of the object to be adsorbed 1 with respect to the stacking stage 240 is corrected by moving at least one of the stacking stage 240 and the suction head 100 in at least one of the X-axis direction, Y-axis direction, and θ direction. The θ direction is the direction of rotation in the XY plane defined by the X-axis and Y-axis.

[0070] Subsequently, the suction head 100 descends toward the stacking stage 240, releasing the suction. As a result, the object to be suctioned 1 is stacked on the stacking stage 240. Furthermore, the system control unit not only moves the first movable element 222a from the first supply position A1 to the second supply position A2, but also moves the third movable element 222c from the second supply position A2 to the third supply position A3, moves the fifth movable element 222e from the third supply position A3 to the fourth supply position A4, and moves the seventh movable element 222g from the fourth supply position A4 to the first supply position A1, while also moving the second movable element 222b, the fourth movable element 222d, the sixth movable element 222f, and the eighth movable element 222h.

[0071] (S3) Next, the system control unit controls the second supply mechanism 210b so that the first metal foil, which is the object to be adsorbed 1, is supplied to the second supply position A2, and stops the first movable element 222a at the second supply position A2. The suction head 100 descends and adsorbs the object to be adsorbed 1 at the second supply position A2. That is, the drive circuit 30 drives the piezoelectric pump 20 to start suction and adsorbs the object to be adsorbed 1. The system control unit controls the second imaging unit 30b so that it images at least a portion of the object to be adsorbed 1 that has been adsorbed by the suction head 100.

[0072] Furthermore, when the first movable element 222a is stopped at the second supply position A2, the third movable element 222c is stopped at the third supply position A3, the fifth movable element 222e is stopped at the fourth supply position A4, and the seventh movable element 222g is stopped at the first supply position A1. In addition, the second movable element 222b is located between the second supply position A2 and the third supply position A3, the fourth movable element 222d is located between the third supply position A3 and the fourth supply position A4, the sixth movable element 222f is located between the fourth supply position A4 and the first supply position A1, and the eighth movable element 222h is located between the first supply position A1 and the second supply position A2.

[0073] (S4) Next, the system control unit moves the first movable element 222a along the travel track from the second supply position A2 to the third supply position A3. While the first movable element 222a is moving from the second supply position A2 to the third supply position A3 and stopping, the relative position of the object to be adsorbed 1, which is being adsorbed by the suction head 100, with respect to the stacking stage 240 is corrected. Specifically, based on the image of the object to be adsorbed 1 captured by the second imaging unit 230b, the relative position of the object to be adsorbed 1 with respect to the stacking stage 240 is corrected by moving at least one of the stacking stage 240 and the suction head 100 in at least one of the X-axis direction, Y-axis direction, and θ direction. After position correction, the operation of stacking the object to be adsorbed 1 on the stacking stage 240 is the same as the operation of stacking the object to be adsorbed 1 supplied to the first supply position A1.

[0074] Furthermore, the system control unit not only moves the first movable element 222a from the second supply position A2 to the third supply position A3, but also moves the third movable element 222c from the third supply position A3 to the fourth supply position A4, moves the fifth movable element 222e from the fourth supply position A4 to the first supply position A1, and moves the seventh movable element 222g from the first supply position A1 to the second supply position A2, while also moving the second movable element 222b, the fourth movable element 222d, the sixth movable element 222f, and the eighth movable element 222h.

[0075] (S5) Next, the system control unit controls the third supply mechanism 210c so that the resin film, which is the object to be adsorbed 1, is supplied to the third supply position A3, and stops the first movable element 222a at the third supply position A3. The adsorption head 100 descends and adsorbs the object to be adsorbed 1 at the third supply position A3. That is, the drive circuit 30 drives the piezoelectric pump 20 to start suction and adsorbs the object to be adsorbed 1. The system control unit controls the third imaging unit 30c so as to image at least a portion of the object to be adsorbed 1 that has been adsorbed by the adsorption head 100.

[0076] Furthermore, when the first movable element 222a is stopped at the third supply position A3, the third movable element 222c is stopped at the fourth supply position A4, the fifth movable element 222e is stopped at the first supply position A1, and the seventh movable element 222g is stopped at the second supply position A2. In addition, the second movable element 222b is located between the third supply position A3 and the fourth supply position A4, the fourth movable element 222d is located between the fourth supply position A4 and the first supply position A1, the sixth movable element 222f is located between the first supply position A1 and the second supply position A2, and the eighth movable element 222h is located between the second supply position A2 and the third supply position A3.

[0077] (S6) Next, the system control unit moves the first movable element 222a along the travel trajectory from the third supply position A3 to the fourth supply position A4. While the first movable element 222a is moving from the third supply position A3 to the fourth supply position A4 and stopping, the relative position of the object to be adsorbed 1, which is being adsorbed by the suction head 100, with respect to the stacking stage 240 is corrected. Specifically, based on the image of the object to be adsorbed 1 captured by the third imaging unit 230c, the relative position of the object to be adsorbed 1 with respect to the stacking stage 240 is corrected by moving at least one of the stacking stage 240 and the suction head 100 in at least one of the X-axis direction, Y-axis direction, and θ direction. After position correction, the operation of stacking the object to be adsorbed 1 on the stacking stage 240 is the same as the operation of stacking the object to be adsorbed 1 supplied to the first supply position A1.

[0078] Furthermore, the system control unit not only moves the first movable element 222a from the third supply position A3 to the fourth supply position A4, but also moves the third movable element 222c from the fourth supply position A4 to the first supply position A1, moves the fifth movable element 222e from the first supply position A1 to the second supply position A2, and moves the seventh movable element 222g from the second supply position A2 to the third supply position A3, while also moving the second movable element 222b, the fourth movable element 222d, the sixth movable element 222f, and the eighth movable element 222h.

[0079] (S7) Next, the system control unit controls the fourth supply mechanism 210d so that the second metal foil, which is the object to be adsorbed 1, is supplied to the fourth supply position A4, and stops the first movable element 222a at the fourth supply position A4. The suction head 100 descends and adsorbs the object to be adsorbed 1 at the fourth supply position A4. That is, the drive circuit 30 drives the piezoelectric pump 20 to start suction and adsorbs the object to be adsorbed 1. The system control unit controls the fourth imaging unit 30d so as to image at least a portion of the object to be adsorbed 1 that has been adsorbed by the suction head 100.

[0080] Furthermore, when the first movable element 222a is stopped at the fourth supply position A4, the third movable element 222c is stopped at the first supply position A1, the fifth movable element 222e is stopped at the second supply position A2, and the seventh movable element 222g is stopped at the third supply position A3. In addition, the second movable element 222b is located between the fourth supply position A4 and the first supply position A1, the fourth movable element 222d is located between the first supply position A1 and the second supply position A2, the sixth movable element 222f is located between the second supply position A2 and the third supply position A3, and the eighth movable element 222h is located between the third supply position A3 and the fourth supply position A4.

[0081] (S8) Next, the system control unit moves the first movable element 222a along the travel trajectory from the fourth supply position A4 to the first supply position A1. While the first movable element 222a moves from the fourth supply position A4 to the first supply position A1 and stops, the relative position of the object to be adsorbed 1 held by the suction head 100 with respect to the stacking stage 240 is corrected. Specifically, based on the image of the object to be adsorbed 1 captured by the fourth imaging unit 230d, the relative position of the object to be adsorbed 1 with respect to the stacking stage 240 is corrected by moving at least one of the stacking stage 240 and the suction head 100 in at least one of the X-axis direction, Y-axis direction, and θ direction. After position correction, the operation of stacking the object to be adsorbed 1 on the stacking stage 240 is the same as the operation of stacking the object to be adsorbed 1 supplied to the first supply position A1.

[0082] Furthermore, the system control unit not only moves the first movable element 222a from the fourth supply position A4 to the first supply position A1, but also moves the third movable element 222c from the first supply position A1 to the second supply position A2, moves the fifth movable element 222e from the second supply position A2 to the third supply position A3, and moves the seventh movable element 222g from the third supply position A3 to the fourth supply position A4, while also moving the second movable element 222b, the fourth movable element 222d, the sixth movable element 222f, and the eighth movable element 222h.

[0083] The processes (S1) to (S8) described above yield a set of semi-finished products in which four types of adsorbent materials 1—a resin film, a first metal foil, a resin film, and a second metal foil—are laminated in that order. Thereafter, by repeatedly performing the processes (S1) to (S8), a product with a predetermined number of laminated sets is obtained, that is, a laminate in which multiple positive and negative electrodes are alternately laminated with a resin film that functions as a separator. The laminate can be used, for example, as a component material for a battery pack.

[0084] According to the above embodiment, the suction head 100 has high responsiveness when adsorbing the object to be adsorbed 1. Therefore, the time required to sequentially adsorb the objects to be adsorbed 1 that are transported by multiple supply mechanisms 210 can be shortened.

[0085] Furthermore, the suction head 100 is lighter in weight compared to a suction head driven by a vacuum pump. Therefore, according to the configuration of the above embodiment, the mobility of the movable element 222 is improved when it moves sequentially from supply positions A1 to A4. In other words, rapid movement of the movable element 222 becomes possible.

[0086] Furthermore, if the power supply 50 is located in the main body 10, there is no need to route the wiring connecting the power supply 50 to the drive circuit 30 outside the movable element 222. Therefore, according to the configuration of the above embodiment, unnecessary wiring entanglement can be prevented.

[0087] Furthermore, in the above embodiment, no other components are attached to the discharge port 23. If a pressure reducing device were attached to the discharge port 23, it would be necessary to route the piping connected to the pressure reducing device outside the movable element 222. The configuration of the above embodiment makes it possible to suppress the routing of piping as described above, thereby suppressing interference between piping and other components.

[0088] <Third Embodiment> The third embodiment of the suction head will now be described. Note that the piezoelectric pump configuration in the third embodiment is the same as that in the first embodiment, and therefore will not be described further. The suction head in the third embodiment is applicable to the transport device 200 described above.

[0089] As shown in Figure 10, the suction head 100B comprises a main body 10, a piezoelectric pump 20, and a valve 60. The suction head 100B has four sets of piezoelectric pumps 20, valves 60, and related components. Since the configuration of each of these sets is the same, only one set will be described as representative below. Furthermore, Figures 10 to 15 schematically illustrate only the portion of the main body 10 corresponding to one set of piezoelectric pumps 20 and valves 60.

[0090] The main body 10 is provided with a plurality of suction holes 11 and an outlet 14 that opens at a different position from the suction holes 11. In other words, the main body 10 is equipped with a plurality of suction holes 11 and an outlet 14. Each suction hole 11 opens on the first main surface 10a of the main body 10. The outlet 14 opens on the second main surface 10b. Note that in Figure 10, only some of the suction holes 11 are labeled with reference numerals.

[0091] The main body 10 is provided with a suction passage 13 that connects the suction port 11 and the piezoelectric pump 20. In other words, the main body 10 is equipped with a suction passage 13. The suction passage 13 is partitioned by the inner wall of the main body 10, the outer wall of the piezoelectric pump 20, and the outer wall of the valve 60.

[0092] The piezoelectric pump 20 is located inside the main body 10. Specifically, the piezoelectric pump 20 is positioned at a distance from the suction port 11 of the main body 10. Therefore, the space between the piezoelectric pump 20 and the suction port 11 is part of the aforementioned suction passage 13.

[0093] The piezoelectric pump 20 is provided with a structure 22, a plurality of discharge ports 23, a plurality of suction ports 24, and a flow path 25. In other words, the piezoelectric pump 20 comprises a structure 22, discharge ports 23, suction ports 24, and a flow path 25. Note that Figure 10 shows a simplified internal structure of the piezoelectric pump 20 and therefore differs from the actual flow path configuration inside the piezoelectric pump 20.

[0094] The structure 22 is flat. The thickness direction of the structure 22 is perpendicular to the first main surface 10a. Each suction port 24 is connected to the suction passage 13. Specifically, each suction port 24 is located in the structure 22 on the side facing the first main surface 10a of the main body 10. Each suction port 24 is connected to the portion of the suction passage 13 that extends along the first main surface 10a.

[0095] The discharge port 23 is located on the opposite side of the structure 22 from the intake port 24. Gas drawn in from the suction hole 11 is discharged from the discharge port 23. In this embodiment, the number of discharge ports 23 is the same as the number of intake ports 24, but the number of discharge ports 23 and the number of intake ports 24 may be different. Each flow path 25 is connected to the discharge port 23 at the top surface of the structure 22 and to the intake port 24 at the bottom surface of the structure 22.

[0096] The valve 60 includes a first housing 61, a second housing 62, and a sealing material 63. The first housing 61 is substantially flat. The thickness direction of the first housing 61 is perpendicular to the first main surface 10a.

[0097] The first housing 61 has a recess 610 and a projection 611. The recess 610 is recessed toward the bottom surface in the central part of the top surface of the first housing 61. The size of the recess 610 is determined so that it overlaps with all of the discharge ports 23 of the piezoelectric pump 20 when viewed from the thickness direction. In other words, the discharge ports 23 are located within the region where the recess 610 exists when viewed from the thickness direction. The projection 611 protrudes from the bottom surface of the recess 610 toward the top surface.

[0098] The first housing 61 has a plurality of first through holes 61A. The number of first through holes 61A corresponds to the number of discharge ports 23. Each first through hole 61A penetrates the first housing 61 in the thickness direction. Each first through hole 61A is connected to the corresponding discharge port 23.

[0099] The second housing 62 is substantially flat. The thickness direction of the second housing 62 coincides with the thickness direction of the first housing 61. The second housing 62 faces the first housing 61 on its top side. The top surface of the second housing 62 is fixed to the inner wall on the top side of the main body 10.

[0100] The second housing 62 has a second through-hole 62A. The second through-hole 62A penetrates the second housing 62 in the thickness direction. The second through-hole 62A is connected to the discharge port 14. Therefore, the valve 60 as a whole defines a first flow path 65 that connects the discharge port 23 of the piezoelectric pump 20 and the discharge port 14 of the main body 10. Specifically, the first flow path 65 is defined by the inner wall of the second through-hole 62A, the inner wall of the second housing 62, the inner wall of the recess 610 of the first housing 61, the outer wall of the projection 611 of the first housing 61, and the inner walls of each first through-hole 61A.

[0101] Furthermore, the second housing 62 has a second flow path 66 that connects the first flow path 65 and the suction path 13. Specifically, one end of the second flow path 66, the first opening 66A, is connected to the space in the first flow path 65 that is partitioned by the recess 610 of the first housing 61. The other end of the second flow path 66, the second opening 66B, is connected to the suction path 13 at an external surface of the second housing 62 that is not covered by the main body 10 and the first housing 61. In other words, the second flow path 66 connects the first flow path 65 and the suction path 13 without going through the discharge port 23.

[0102] The sealing material 63 is annular in shape. The sealing material 63 is located between the first housing 61 and the second housing 62. Specifically, the sealing material 63 is located on the outside of the recess 610 of the first housing 61. The sealing material 63 is made of synthetic rubber, adhesive, adhesive sheet, double-sided tape, etc. The sealing material 63 prevents gas from leaking between the first housing 61 and the second housing 62. In this embodiment, the sealing material 63 may be omitted, and the first housing 61 and the second housing 62 may be in a single integrated configuration. Also, the shapes of the first housing 61 and the second housing 62 are not limited to the examples described in this embodiment.

[0103] The valve 60 has a diaphragm 64. The diaphragm 64 is a flexible, membrane-like material. The diaphragm 64 is fixed to the second housing 62 via a sealing material 63. Together with the sealing material 63, the diaphragm 64 covers the recess 610 of the first housing 61 from the top side.

[0104] The diaphragm 64 has an air vent 640. The air vent 640 faces a projection 611 of the first housing 61. When the piezoelectric pump 20 is not energized, the diaphragm 64 is in contact with the projection 611. That is, in this state, the air vent 640 is blocked by the projection 611. Also, when the piezoelectric pump 20 is not energized, the area around the air vent 640 on the diaphragm 64 is pushed by the projection 611 and bent towards the top surface.

[0105] When the piezoelectric pump 20 is not energized, the pressure difference between the bottom surface of the diaphragm 64 and the top surface of the diaphragm 64 is approximately equal to atmospheric pressure, and therefore approximately zero. As a result, the diaphragm 64 is generally flat, as shown in Figure 10. In this state, as described above, the air holes 640 of the diaphragm 64 are blocked by the projections 611. That is, when the piezoelectric pump 20 is not energized, the first flow path 65 is divided by the diaphragm 64. Also, when the piezoelectric pump 20 is not energized, the diaphragm 64 is not in contact with the first opening 66A of the second flow path 66, and the second flow path 66 is open.

[0106] As shown in Figures 11 and 12, the diaphragm 64 opens and closes the flow path by bending in response to the pressure difference. As shown in Figure 11, when the piezoelectric pump 20 is energized, the piezoelectric pump 20 discharges gas from the discharge port 23, so the pressure on the bottom side of the diaphragm 64 is greater than the pressure on the top side of the diaphragm 64. As a result, a part of the diaphragm 64 bends towards the top side, closing the first opening 66A of the second flow path 66. In other words, the valve 60 closes the second flow path 66 when the piezoelectric pump 20 is energized and opens the second flow path 66 when the piezoelectric pump 20 is not energized. Note that "when the piezoelectric pump 20 is energized" does not mean a state in which the pressure in each flow path changes abruptly, such as immediately after energizing the piezoelectric pump 20, but rather a state in which sufficient time has elapsed after energizing the piezoelectric pump 20 and the pressure in each flow path has converged to a roughly constant pressure.

[0107] Furthermore, as shown in Figure 12, when the piezoelectric pump 20 is energized, the pressure on the bottom side of the diaphragm 64 is greater than the pressure on the top side of the diaphragm 64. Note that the pressure difference between the bottom and top sides of the diaphragm 64 is greater in the state shown in Figure 12 than in the state shown in Figure 11. As a result, the diaphragm 64 near the air hole 640 flexes, and the diaphragm 64 moves away from the projection 611. In other words, gas can flow through the entire first flow path 65 via the air hole 640. That is, the valve 60 opens the first flow path 65 when the piezoelectric pump 20 is energized and closes the first flow path 65 when the piezoelectric pump 20 is not energized.

[0108] As shown in Figure 10, the suction head 100B includes a tank 70 and a pressure sensor 80. The tank 70 partitions a space capable of storing gas. The tank 70 is connected to the main body 10. Specifically, the tank 70 is located on the second main surface 10b side of the main body 10. Also, a part of the inner wall of the tank 70 is common with the inner wall of the second main surface 10b. The tank 70 is connected to the outlet 14. That is, gas from the main body 10 can flow into the tank 70 through the outlet 14. The volume of the tank 70 is greater than or equal to the combined volume of the portion of the piezoelectric pump 20 through which gas can flow, the portion of the valve 60 through which gas can flow, and the first flow path 65. Note that the position of the tank 70 is not limited to the second main surface 10b side. The position of the tank 70 should be aligned with the position of the outlet 14. For example, if the discharge port 14 is located on a surface adjacent to the second main surface 10b of the main body 10, the tank 70 only needs to be located on the side of that surface adjacent to the second main surface 10b.

[0109] The material of tank 70 is rigid. Specifically, the material of tank 70 is rigid enough that its volume does not change when gas is supplied from the piezoelectric pump 20. Here, "no change in volume" means that the change in volume before and after gas is supplied from the piezoelectric pump 20 is 1% or less. In other words, the change in volume does not include minute volume changes or measurement errors.

[0110] The pressure sensor 80 is located inside the tank 70. The pressure sensor 80 measures the pressure inside the tank 70. The pressure sensor 80 is a sensor for confirming whether or not the object to be adsorbed 1 is adsorbed. The configuration of the pressure sensor 80 is the same as that of the adsorption confirmation sensor 40 described in the first embodiment.

[0111] Although not shown in the diagram, the suction head 100B includes a drive circuit 30 for driving the piezoelectric pump 20 and a power supply 50 connected to the drive circuit 30. The configuration of the drive circuit 30 and the power supply 50 is the same as in the first embodiment.

[0112] (Regarding the pressure inside the suction head) Next, the pressure inside the suction head 100B in the third embodiment described above will be explained.

[0113] As shown in Figure 11, the pressure near the suction hole 11 inside the main body 10, i.e., in the suction passage 13, is defined as the first pressure P1. The pressure near the first through-hole 61A inside the valve 60, i.e., near the discharge port 23 of the piezoelectric pump 20, is defined as the second pressure P2. The pressure near the outlet 14 of the main body 10 is defined as the third pressure P3.

[0114] When the piezoelectric pump 20 is energized, it draws in gas from the intake port 24 and discharges gas from the outlet port 23. As a result, the pressure on the bottom side of the diaphragm 64 becomes greater than the pressure on the top side of the diaphragm 64. Specifically, the second pressure P2 becomes higher than atmospheric pressure. Consequently, as described above, the second flow path 66 is blocked by the diaphragm 64. However, since the area near the air hole 640 in the diaphragm 64 is already bent towards the top side, at this stage the air hole 640 of the diaphragm 64 is blocked by the projection 611. Also, immediately after energizing the piezoelectric pump 20, the first pressure P1 and the third pressure P3 are approximately the same as atmospheric pressure (P2 > P1, P3 = atmospheric pressure).

[0115] As shown in Figure 12, when the piezoelectric pump 20 is continuously energized, it continues to draw in gas from the inlet 24 and discharge gas from the outlet 23. At this stage, the first flow path 65 is blocked by the diaphragm 64. Therefore, the second pressure P2 on the piezoelectric pump 20 side relative to the diaphragm 64 becomes greater than the third pressure P3. This pressure difference is greater than that of the piezoelectric pump 20 immediately after energization. Reflecting this pressure difference, as described above, the diaphragm 64 separates from the projection 611. That is, when the piezoelectric pump 20 is continuously energized, the first flow path 65 is opened. Then, gas from the piezoelectric pump 20 flows into the tank 70. That is, in this state, the second pressure P2 and the third pressure P3 become greater than or equal to the first pressure P1 (P2 > P3 ≥ P1). Also, in this state, air is drawn in from outside the main body 10 toward the suction hole 11, causing the object to be adsorbed 1 to be attracted toward the main body 10.

[0116] As shown in Figure 13, if the piezoelectric pump 20 is energized further, the object to be attracted 1 will come into contact with the first main surface 10a of the main body 10, blocking the suction hole 11. In this state, the first pressure P1 is less than atmospheric pressure. Also, the second pressure P2 and the third pressure P3 are greater than atmospheric pressure. In this state as well, the second pressure P2 remains greater than the third pressure P3 (P2 > P3 > atmospheric pressure > P1).

[0117] As shown in Figure 14, when the power supply to the piezoelectric pump 20 is stopped, the suction and discharge of gas by the piezoelectric pump 20 stops. Then, high-pressure gas flows from the tank 70 into the main body 10. As the pressure difference between the top and bottom sides of the diaphragm 64 decreases, the air holes 640 of the diaphragm 64 are closed by the projections 611. That is, the first flow path 65 is blocked. In this state, the third pressure P3 is greater than atmospheric pressure. On the other hand, immediately after the power supply to the piezoelectric pump 20 is stopped, the first pressure P1 is less than atmospheric pressure. Also, because the function of the piezoelectric pump 20 stops, the second pressure P2 gradually decreases to approximately the same pressure as the first pressure P1. That is, the second pressure P2 is also less than atmospheric pressure (P3 > atmospheric pressure ≥ P1, P2).

[0118] As shown in Figure 15, after a period of time has elapsed since the piezoelectric pump 20 was de-energized, a portion of the diaphragm 64 bends towards the bottom due to the pressure difference between the top and bottom sides of the diaphragm 64 (P3 > atmospheric pressure ≥ P1, P2). That is, the second flow path 66 is opened. The air in the tank 70 then passes through the second flow path 66 to the suction path 13. As described above, since the volume of the tank 70 is sufficiently large, the first pressure P1, the second pressure P2, and the third pressure P3 quickly become approximately the same. Also, as high-pressure gas from the third pressure P3 reaches the suction path 13, the first pressure P1 becomes greater than atmospheric pressure (P1, P2, P3 > atmospheric pressure). Therefore, because the pressure in the suction path 13 is greater than atmospheric pressure, the object to be adsorbed 1 quickly separates from the main body 10. Subsequently, as shown in Figure 10, the first pressure P1, the second pressure P2, and the third pressure P3 become atmospheric pressure. In other words, the deflection of the diaphragm 64 is also eliminated (P1, P2, P3 = atmospheric pressure).

[0119] In the third embodiment, the adsorption head 100B can ensure that positive-pressure gas is present in the tank 70 before the object to be adsorbed 1 is adsorbed onto the main body 10. When the pump stops, the gas in the tank 70 reaches the suction path 13 via the second flow path 66. In other words, gas at a pressure higher than atmospheric pressure is added to the object to be adsorbed 1 from inside the main body 10. This makes it possible to easily remove the object to be adsorbed 1 from the main body 10.

[0120] Furthermore, in the suction head 100B of the third embodiment, the valve 60 opens the first passage 65 when the piezoelectric pump 20 is energized, and closes the first passage 65 when the piezoelectric pump 20 is not energized. With this configuration, when the piezoelectric pump 20 is not energized, no gas flows through the first passage 65. If gas were to flow through the first passage 65 when the piezoelectric pump 20 is not energized, the gas would also flow into the bottom side of the diaphragm 64. In other words, high-pressure gas would flow into the bottom side of the diaphragm 64, making it difficult for the diaphragm 64 that closes the second passage 66 to return to its original shape. Therefore, with the above configuration, when the piezoelectric pump 20 is not energized, the lack of gas flowing through the first passage 65 can suppress the difficulty in the diaphragm 64 that closes the second passage 66 returning to its original shape.

[0121] Furthermore, in the third embodiment, the suction head 100B has a diaphragm 64 that opens and closes the flow path by bending in accordance with the pressure difference. Since the opening and closing of the first flow path 65 and the second flow path 66 can be achieved with a thin member such as the diaphragm 64, it is possible to suppress the increase in the outer diameter of the main body 10.

[0122] Furthermore, in the adsorption head 100B of the third embodiment, the material of the tank 70 is a rigid material whose volume does not change when gas is supplied from the piezoelectric pump 20. Because the volume of the tank 70 does not change even when gas flows in, the gas held in the tank 70 is more likely to be held at high pressure.

[0123] Furthermore, the suction head 100B in the third embodiment is further equipped with a pressure sensor 80 inside the tank 70 for measuring the pressure inside the tank 70. The pressure sensor 80 can detect whether or not the object to be adsorbed 1 has been adsorbed onto the main body 10. In addition, by installing the pressure sensor 80 inside the tank 70, the empty space inside the tank 70 can be effectively utilized, and the installation space inside the main body 10 can be eliminated.

[0124] This disclosure is not limited to the embodiments described above, and various applications and modifications are possible within the scope of this disclosure. For example, the adsorbent object 1 is not limited to the sheet-like battery material described above. For example, multiple types of adsorbent objects 1 can be sheet-like conductive layers and insulating layers, and a multilayer substrate can be fabricated by stacking multiple types of adsorbent objects 1. In that case, the conductive layer may consist of, for example, copper, silver, a copper-containing alloy, a silver-containing alloy, or Sn-Ag-based solder, and the insulating layer may consist of, for example, a thermoplastic resin such as liquid crystal polymer, polyetheretherketone, polyetherimide, or polyimide, or a thermosetting resin such as epoxy resin or unsaturated polyester.

[0125] In the transport device 200 in the embodiment described above, the suction head 100 is configured to approach the supply mechanism 210 by descending in order to adsorb the object to be adsorbed 1, but the supply mechanism 210 may also be configured to approach the suction head 100 by rising.

[0126] Although the transport device 200 in the above-described embodiment was explained as being equipped with the suction head 100 in the first embodiment, it may also be configured to be equipped with the suction head 100A in the second embodiment.

[0127] In the third embodiment described above, the valve 60 may have, instead of the diaphragm 64, a component capable of opening and closing the second flow path 66. Furthermore, the valve 60 only needs to be configured to close the second flow path 66 when the piezoelectric pump 20 is energized and to open the second flow path 66 when the piezoelectric pump 20 is not energized, and the first flow path 65 may always be in an open state.

[0128] In the third embodiment described above, the material of the tank 70 is not limited to being rigid enough that its volume does not change when gas is supplied from the piezoelectric pump 20. For example, the material of the tank 70 may be a material whose volume changes, as long as it can maintain a pressure of atmospheric pressure or higher inside the tank 70 when gas is supplied from the piezoelectric pump 20.

[0129] In the third embodiment described above, the tank 70 may be equipped with a constant pressure valve 90. As shown in the example in Figure 16, the tank 70 in the suction head 100B is equipped with a constant pressure valve 90. The constant pressure valve 90 switches between an open state and a closed state based on the pressure inside the tank 70. In the example shown in Figure 16, when the pressure inside the tank 70 is atmospheric pressure, the constant pressure valve 90 is in the closed state. Also, when the pressure inside the tank 70 becomes greater than the maximum pressure that the piezoelectric pump 20 can output, the constant pressure valve 90 becomes open. The constant pressure valve 90 may be a mechanical valve whose opening and closing are switched by a weight and spring, or it may be a solenoid valve, etc. With a configuration that includes a constant pressure valve 90, the pressure inside the tank 70 is more easily maintained below the maximum pressure of the piezoelectric pump 20. That is, according to the example shown in Figure 16, even when the piezoelectric pump 20 is operated continuously, the tank 70 can maintain a pressure that makes it easy to attach and detach the object to be adsorbed 1 from the suction head 100B.

[0130] In the third embodiment described above, the configuration of the pressure sensor 80 may differ from that of the adsorption confirmation sensor 40. Also, in the third embodiment, the pressure sensor 80 can be omitted from the adsorption head 100B. Furthermore, in the third embodiment, the adsorption head 100B may be equipped with an adsorption confirmation sensor 40 instead of the pressure sensor 80, which is located at the position where gas is discharged from the discharge port 23 of the piezoelectric pump 20.

[0131] In the third embodiment described above, the entire valve 60 can be omitted. In that case, the discharge port 23 of the piezoelectric pump 20 only needs to be connected to the outlet port 14 of the main body 10. Also, similar to the third embodiment, the suction port 24 of the piezoelectric pump 20 only needs to be connected to the suction passage 13.

[0132] In this example, when the piezoelectric pump 20 is energized, high-pressure gas flows directly into the tank 70. When the piezoelectric pump 20 is not energized, the high-pressure gas stored in the tank 70 passes through the piezoelectric pump 20 and reaches the suction path 13. In other words, when the object to be adsorbed 1 is adsorbed onto the main body 10, gas at a pressure higher than atmospheric pressure is added to the object to be adsorbed 1. This makes it possible to easily remove the object to be adsorbed 1 from the main body 10.

[0133] The suction head and transport device in this application are as follows: <1> A main body having suction holes for adsorbing objects to be adsorbed, A piezoelectric pump, provided inside or on the surface of the main body, generates suction force when an electric current is applied, The system includes a drive circuit for driving the piezoelectric pump, The suction head is characterized in that a suction passage connecting the suction hole and the piezoelectric pump is provided inside the main body.

[0134] <2> The main body portion includes a flat plate portion having a first main surface on which the suction hole is provided and a second main surface opposite to the first main surface. The piezoelectric pump is characterized by being arranged on the second main surface. <1> The suction head described above.

[0135] <3> The piezoelectric pump is provided with a discharge port from which the gas drawn in through the suction hole is discharged. The piezoelectric pump is further equipped with an adsorption confirmation sensor located at the position from which gas is discharged from the discharge port, for confirming whether or not the object to be adsorbed is adsorbed. <1> or <2> The suction head described above.

[0136] <4> The adsorption confirmation sensor is characterized by being at least one of a pressure sensor for measuring pressure and an airflow sensor for measuring airflow. <3> The suction head described above. <5> The piezoelectric pump is characterized by being provided in multiple quantities. <1> ~ <4> A suction head as described in one of the following descriptions.

[0137] <6> The main body has a plurality of suction passages, Each of the piezoelectric pumps is characterized by being connected to a different suction path. <5> The suction head described above.

[0138] <7> The drive circuit is provided in multiple units corresponding to the multiple piezoelectric pumps, Each of the multiple drive circuits is configured to independently drive the corresponding piezoelectric pump. <5> or <6> The suction head described above.

[0139] <8> The piezoelectric pump is characterized by having a flat plate shape and having its thickness direction oriented perpendicular to the direction in which gas is drawn in from the suction hole. <1> The suction head described above.

[0140] <9> A power supply connected to the drive circuit by wiring is provided in the main body. <1> ~ <8> A suction head as described in one of the following descriptions. <10> The main body is provided with an outlet that opens at a different location from the suction hole. The piezoelectric pump is provided with an inlet connected to the suction passage and an outlet from which the gas drawn in from the suction hole is discharged. A valve that divides a first flow path connecting the discharge port and the outlet port, and a second flow path connecting the first flow path and the suction path without passing through the discharge port, The system further comprises a tank connected to the aforementioned outlet and partitioning a space capable of storing gas, The valve closes the second passage when the piezoelectric pump is energized, and opens the second passage when the piezoelectric pump is not energized. <1> ~ <9> A suction head as described in one of the following descriptions.

[0141] <11> The valve opens the first passage when the piezoelectric pump is energized, and closes the first passage when the piezoelectric pump is not energized. <10> The suction head described above.

[0142] <12> The valve has a diaphragm that opens and closes the flow path by bending in response to the pressure difference. <10> or <11> The suction head described above. <13> The main body is provided with an outlet that opens at a different position from the suction hole. The piezoelectric pump is provided with an inlet connected to the suction passage and an outlet from which the gas drawn in from the suction hole is discharged. The suction port is connected to the suction path, and the discharge port is connected to the outlet. The system further comprises a tank connected to the aforementioned outlet, which partitions a space capable of storing gas. <1> ~ <9> A suction head as described in one of the following descriptions.

[0143] <14> The material of the tank is a rigid material whose volume does not change when gas is supplied from the piezoelectric pump. <10> ~ <13> A suction head as described in one of the following descriptions. <15> The tank is further equipped with a pressure sensor for measuring the pressure inside the tank. <10> ~ <14> A suction head as described in one of the following descriptions.

[0144] <16> The tank is equipped with a constant pressure valve that switches between an open state and a closed state based on the pressure inside the tank. <10> ~ <15> A suction head as described in one of the following descriptions. <17> Multiple supply mechanisms capable of supplying the adsorbed material to each of the multiple supply positions, <1> ~ <16> The suction head described in any one of the following, A moving mechanism comprising a stator of a linear motor having a predetermined travel trajectory, and a movable element of a linear motor that can move between a plurality of supply positions along the travel trajectory, The conveying device is characterized in that the movable element has the suction head. [Explanation of symbols]

[0145] 10 Main body 10a First main surface 10b Second main surface 11 Suction hole 12 Adsorption Area 13 Suction path 14 Outlet 20 Piezoelectric pumps 21 Piezoelectric element 22 Structure 23 Discharge port 24 Inlet 25 channels 26 Pump Room 27 Diaphragm 30 Drive Circuit 40 Adsorption Confirmation Sensor 50 power supply 100, 100A, 100B Suction Head 200 Conveyor System 210 Supply mechanism 220 Moving mechanism 221 Stator 222 Mover 230 Imaging Unit 240 stacking stage

Claims

1. A main body having suction holes for adsorbing objects to be adsorbed, A piezoelectric pump, provided inside or on the surface of the main body, generates suction force when an electric current is applied, A drive circuit for driving the piezoelectric pump, Equipped with, The main body is provided with a suction passage connecting the suction hole and the piezoelectric pump. The main body portion includes a flat plate portion having a first main surface on which the suction hole is provided and a second main surface opposite to the first main surface. The piezoelectric pump is characterized by being positioned on the second main surface of the suction head.

2. The piezoelectric pump is provided with a discharge port from which the gas drawn in through the suction hole is discharged. The adsorption head according to claim 1, further comprising an adsorption confirmation sensor provided at a position from which gas is discharged from the discharge port of the piezoelectric pump, for confirming whether or not the object to be adsorbed is adsorbed.

3. The suction head according to claim 2, characterized in that the suction confirmation sensor is at least one of a pressure sensor for measuring pressure and an airflow sensor for measuring airflow.

4. The suction head according to claim 1, characterized in that a plurality of piezoelectric pumps are provided.

5. The main body has a plurality of suction passages, The suction head according to claim 4, characterized in that each piezoelectric pump is connected to a different suction path.

6. The aforementioned drive circuits are provided in multiple units corresponding to the multiple piezoelectric pumps, The suction head according to claim 4, characterized in that each of the multiple drive circuits is configured to independently drive the corresponding piezoelectric pump.

7. The suction head according to claim 1, characterized in that a power supply connected to the drive circuit by wiring is provided in the main body.

8. A main body having suction holes for adsorbing objects to be adsorbed, A piezoelectric pump, provided inside or on the surface of the main body, generates suction force when an electric current is applied, A drive circuit for driving the piezoelectric pump, Equipped with, The main body is provided with a suction passage connecting the suction hole and the piezoelectric pump. The main body is provided with an outlet that opens at a different position from the suction hole. The piezoelectric pump is provided with an inlet connected to the suction passage and an outlet from which the gas drawn in from the suction hole is discharged. A valve that divides a first flow path connecting the discharge port and the outlet port, and a second flow path connecting the first flow path and the suction path without passing through the discharge port, The system further comprises a tank connected to the aforementioned outlet and partitioning a space capable of storing gas, The valve is characterized in that it closes the second flow path when the piezoelectric pump is energized and opens the second flow path when the piezoelectric pump is not energized.

9. The valve opens the first passage when the piezoelectric pump is energized and closes the first passage when the piezoelectric pump is not energized. The suction head according to claim 8.

10. The valve has a diaphragm that opens and closes the flow path by bending in response to the pressure difference. The suction head according to claim 8.

11. A main body having suction holes for adsorbing objects to be adsorbed, A piezoelectric pump, provided inside or on the surface of the main body, generates suction force when an electric current is applied, A drive circuit for driving the piezoelectric pump, Equipped with, The main body is provided with a suction passage connecting the suction hole and the piezoelectric pump. The main body is provided with an outlet that opens at a different position from the suction hole. The piezoelectric pump is provided with an inlet connected to the suction passage and an outlet from which the gas drawn in from the suction hole is discharged. The suction port is connected to the suction path, and the discharge port is connected to the outlet. The adsorption head is further characterized by comprising a tank connected to the aforementioned discharge port, which partitions a space capable of storing gas.

12. The material of the tank is a rigid material whose volume does not change when gas is supplied from the piezoelectric pump. The suction head according to claim 8 or 11.

13. The tank is further equipped with a pressure sensor for measuring the pressure inside the tank. The suction head according to claim 8 or 11.

14. The tank is equipped with a constant pressure valve that switches between an open state and a closed state based on the pressure inside the tank. The suction head according to claim 8 or 11.

15. Multiple supply mechanisms capable of supplying the adsorbed object to each of the multiple supply positions, The suction head according to claim 1, 8, or 11, A moving mechanism comprising a stator of a linear motor having a predetermined travel trajectory, and a movable element of a linear motor that can move between a plurality of supply positions along the travel trajectory, The conveying device is characterized in that the movable element has the suction head.

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