Light-emitting module

Abstract

To provide a light emitting module capable of securing an arrangement space of a power feeding part and a lead wire without making a substrate larger.SOLUTION: A light source part 20 (light emitting module) includes a substrate 22, a plurality of LED elements 23 (light emitting element) arranged on the substrate 22, and a power feeding part 24 for feeding power to the LED elements 23. The power feeding part 24 is arranged further on the edge part side of the substrate 22 than the LED elements 23. At least part of the plurality of LED elements 23 is constituted by: the LED elements 23 arranged side by side in the circumferential direction around an arrangement center A in a first arrangement position α positioned at a predetermined distance from the arrangement center A; and the LED elements 23 arranged in a second arrangement position β neighboring the LED elements 23 arranged in the first arrangement position α, the second arrangement position β being positioned at a shorter distance from the arrangement center A than the first arrangement position α. The second arrangement position β is arranged at the position adjacent to the power feeding part 24.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to the technology of light-emitting modules.

Background Art

[0002] Conventionally, technologies related to light-emitting modules including a substrate, a plurality of main light source LEDs arranged on the substrate, and a connector component for connecting to a power supply substrate at one of the four corners of the substrate are known (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the light-emitting module, since the main light source LEDs are arranged side by side in the circumferential direction around the center of the array on the substrate, and the connector component is arranged on the edge side of the substrate rather than the main light source LEDs, there is a risk that the substrate may be enlarged to secure the arrangement space for the connector component and the lead wires.

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a light-emitting module capable of securing the arrangement space for the power supply unit and the lead wires without enlarging the substrate.

Means for Solving the Problems

[0006] The problems to be solved by the present invention are as described above. Next, means for solving this problem will be described.

[0007] That is, the light-emitting module disclosed in the present application includes a substrate and on the substrate Arranged in the circumferential directionA light-emitting module comprising a plurality of light-emitting elements arranged and a power supply unit that supplies power to the light-emitting elements, wherein the power supply unit is positioned closer to the edge of the substrate than the light-emitting elements, and among the plurality of light-emitting elements It is located closest to the edge of the circuit board. The device consists of a first arrangement position located at a predetermined distance from the center of the array, where light-emitting elements are arranged in a circumferential direction with respect to the center of the array, and a second arrangement position located at a distance shorter than the distance from the center of the array to the first arrangement position, where light-emitting elements are arranged in connection with the light-emitting elements at the first arrangement position, with the second arrangement position being adjacent to the power supply unit.

[0008] The light-emitting module disclosed herein can take the following forms based on the above configuration. In the light-emitting module disclosed herein, it is preferable that the power supply unit be located in a portion of the substrate where the distance from the center of the arrangement to the edge of the substrate is relatively far.

[0009] In the light-emitting module disclosed herein, the substrate has portions at its edges that are configured in at least two intersecting linear directions. It is preferable that the power supply unit be positioned near the point where two linearly arranged portions on the edge of the substrate are closest to each other.

[0010] In the light-emitting module disclosed herein, it is preferable that the surface on the substrate on which the light-emitting element is arranged is substantially rectangular in shape, at least two corners of the rectangle on the substrate are formed as arcs with different radii of curvature, and the power supply unit is positioned near the corner with the relatively smaller radius of curvature among the corners formed as arcs with different radii of curvature on the substrate. [Effects of the Invention]

[0011] The present invention provides the following effects: In other words, according to the present invention, it is possible to secure space for the power supply unit and lead wires without increasing the size of the circuit board. [Brief explanation of the drawing]

[0012] [Figure 1] A perspective view showing a lighting fixture according to one embodiment of the present invention. [Figure 2] This is a side view showing the lighting fixture installed in the mounting hole. [Figure 3] Similarly, Figure 2 shows a cross-sectional view of the lighting fixture along line AA. [Figure 4] Similarly, this is a perspective view showing the disassembled state of the lighting fixture, including the heat dissipation section, light source section, first reflector section, panel, gasket, and second reflector section. [Figure 5] This is a bottom view showing the light source of the lighting fixture. [Figure 6] This is a bottom view showing the heat dissipation section, light source section, and first reflector section of the lighting fixture. [Modes for carrying out the invention]

[0013] A lighting fixture 100, an example of a lighting fixture according to an embodiment of the present invention, will be described with reference to Figures 1 to 6. The lighting fixture 100 is a recessed lighting fixture that is installed by being embedded in, for example, a round mounting hole H formed in the ceiling C, which is the mounting surface, as shown in Figure 2. The lighting fixture according to the present invention is not limited to a recessed lighting fixture, but may also be a surface-mounted lighting fixture that is directly attached to the ceiling surface, or a suspended lighting fixture that is suspended from the ceiling surface. In the following description, the vertical direction of the lighting fixture 100 will be described as the vertical direction when the lighting fixture 100 is installed on the ceiling C. The direction perpendicular to the vertical direction will be described as the radial direction. In the description of this embodiment, the state in which the lighting fixture 100 is viewed from above will be described as a plan view. The state in which the lighting fixture 100 is viewed from a direction perpendicular to the vertical direction will be described as a side view. The state in which the cross-sectional shape of the lighting fixture 100 is viewed will be described as a cross-sectional view.

[0014] As shown in Figure 1 or Figure 2, the lighting fixture 100 mainly comprises a light fixture 10 and a power supply unit 50.

[0015] As shown in Figure 3, the light fixture 10 mainly comprises a light source unit 20, a panel 25, a heat dissipation unit 26, a first reflector unit 30, a second reflector unit 40, a pair of mounting springs 70, and a packing 80.

[0016] The light source unit 20 is the part that emits light toward the illumination surface side of the lighting fixture 100. As shown in Figure 3, the light source unit 20 is attached to the heat dissipation unit 26 and has a module substrate 21.

[0017] As shown in Figures 3 to 5, the module substrate 21 comprises a substrate 22, LED elements 23 as light-emitting elements, and a power supply unit 24 to which lead wires 27 for power supply are connected. The module substrate 21 is an LED light-emitting module in which a plurality of LED elements 23, which are point light sources, are arranged circumferentially on a substrate 22 that has been processed into a flat plate shape. The plurality of LED elements 23 and the power supply unit 24 are respectively located on the lower surface of the substrate 22. For example, sixteen LED elements 23 may be arranged roughly circumferentially on the outside (edge ​​side of the substrate 22), and eight LED elements 23 may be arranged roughly circumferentially inside them. The plurality of LED elements 23 are arranged on the lower surface of the substrate 22 so as to correspond to the opening 31 of the first reflecting part 30. Furthermore, the number or arrangement of the plurality of LED elements 23 is not limited to this configuration, and for example, a plurality of LED elements 23 may be arranged on the outside, inside, and inside respectively to form a triple annular row of LED elements 23. The circuit board 22 is configured as a roughly rectangular shape in plan view. The corners of the circuit board 22 (22a, 22b, 22c, and 22d in Figure 5) are each formed in an arc shape. Furthermore, the circuit board 22 is not limited to this shape, and may be configured as a polygon other than a rectangle in plan view, a roughly circular shape with connected rectangles, a sector shape, an ellipse, or an oblong shape, etc. The power supply unit 24 is configured as a connector with detachable connection terminals at the ends of the lead wires 27. Furthermore, the power supply unit 24 is not limited to this configuration, and may be configured such that the lead wires 27 are connected by solder, for example. By connecting the lead wires 27 to the power supply unit 24, the module circuit board 21 is electrically connected to the power supply unit 50. The power supply unit 24 is positioned near one of the corners of the circuit board 22 (corner 22a in this embodiment). In this way, by positioning the power supply unit 24 near one of the corners of the square of the substrate 22, it is possible to secure the area for arranging the LED elements 23 on the substrate 22 while suppressing an increase in the size of the substrate 22. Furthermore, the substrate 22 is manufactured by cutting it out from the substrate material (original substrate), and multiple substrates 22 can be manufactured from a single substrate material. By configuring the substrate 22 to be roughly square, multiple substrates 22 can be efficiently cut out from the substrate material.As a result, the amount of the substrate material to be discarded is small, and the manufacturing cost can be suppressed. The LED element 23 can be lit by supplying power from the power supply unit 50 through the lead wire 27. The LED element 23 generates heat when lit. The module substrate 21 is disposed so as to be sandwiched between the first reflection part 30 and the heat dissipation part 26, and the substrate 22 is disposed in contact with the heat dissipation part 26. Further, although an LED element (a surface mount type LED element) is used as the light source of the module substrate 21, the type of the light source is not limited to the LED element, and for example, a COB type light emitting module or an organic EL element (OLED) can also be realized. When the module substrate 21 is a COB type light emitting module, a plurality of light emitting diodes (for example, blue light emitting diodes) are formed on the substrate 21, and the whole of the plurality of light emitting diodes is coated with a phosphor (for example, a yellow phosphor). The positions of the plurality of light emitting diodes in this case are positions corresponding to the position of the LED element 23 shown in FIG. 5. Further, the module substrate 21 may be attached to the heat dissipation part 26 via a heat conductive sheet (not shown) or a heat dissipation grease, whereby higher heat dissipation performance can be obtained.

[0018] The heat dissipation part 26 is formed, for example, in a flat plate shape. The heat dissipation part 26 is formed of a metal material such as aluminum having a high thermal conductivity in order to improve the heat dissipation efficiency. The heat dissipation part 26 is disposed so as to contact the upper surface of the module substrate 21. The surface of the heat dissipation part 26 on which the module substrate 21 is disposed is formed to have a flat surface in order to increase the contact area with the module substrate 21 for transmitting the heat generated from the light source part 20. The heat dissipation part transmits the heat generated when the LED element 23 is lit and dissipates the heat. The heat dissipation part 26 has a pair of hole parts 26a·26a and a pair of attachment parts 26b in the vicinity of its edge part. The hole part 26a is a through hole through which the claw part 34 is inserted. The attachment part 26b is a through hole through which the screw 55 is inserted. Note that in the present embodiment, the heat dissipation part 26 is formed in a flat plate shape, but the present invention is not limited to this, and the shape can be appropriately changed as necessary, such as providing heat dissipation fins to enhance the heat dissipation performance.

[0019] As shown in FIGS. 3 to 9, the first reflection part 30 is a hat-shaped member that reflects light from a plurality of LED elements 23 while separating the panel 25 and the module substrate 21 at a predetermined interval. The first reflection part 30 corresponds to the reflection part of the present invention. The first reflection part 30 is formed of a resin material or the like. The first reflection part 30 has an opening 31, a peripheral wall part 32, a substrate guide part 33, and a claw part 34.

[0020] The opening 31 is an opening located at the center of the upper end of the first reflection part 30. The peripheral wall part 32 is a hat-shaped part whose diameter increases as it goes downward from the side of the opening 31, and is formed in an inclined shape. The inner peripheral surface of the peripheral wall part 32 serves as a reflection surface that reflects the light emitted from the LED element 23. Although the first reflection part 30 of the present embodiment has been described as being formed in an inclined shape that widens as the peripheral wall part 32 goes downward, it is not limited to this. For example, the shape of the first reflection part 30 may be formed in a parabolic shape that widens as the peripheral wall part 32 goes downward. The substrate guide part 33 surrounds at least a part of the outer shape of the substrate 22 along the outer peripheral edge of the substrate 22, and regulates the position of the module substrate 21 in the side surface direction. The substrate guide part 33 of the present embodiment is an annular shape that is substantially square in plan view and surrounds the periphery of the opening 31, and protrudes upward from the upper end of the peripheral wall part 32. The substrate guide part 33 is formed to generally match the shape of the outer peripheral edge of the substrate 22. The claw part 34 is composed of a pair and protrudes upward from the upper surface of the peripheral wall part 32. They are arranged so as to face each other with the opening 31 interposed therebetween. By inserting the claw part 34 into the hole part 26a of the heat dissipation part 26, the first reflection part 30 is positioned with respect to the heat dissipation part 26.

[0021] As shown in Figure 3, the panel 25 is a component that closes the lower end of the first reflecting part 30 and the opening 41 of the second reflecting part 40, transmitting and diffusing light from the LED element 23 to form an illumination surface. The panel 25 is made of a translucent resin material, glass material, etc. The panel 25 is made using acrylic resin. The panel 25 is formed in a circular, dome shape that protrudes downward in plan view. The panel 25 is positioned by having its peripheral edge sandwiched between the lower end of the first reflecting part 30 and the upper end (opening 41) of the second reflecting part 40, and is held in a position facing the LED element 23. Note that the shape of the panel 25 is not limited to a circular shape, but may also be a polygon such as a square. Also, it is not limited to a dome shape that protrudes downward, but may also be a shape that protrudes upward or a flat shape.

[0022] The second reflective section 40 is a reflector with a bowl-shaped opening that faces downwards. The second reflective section 40 is positioned below the panel 25. The second reflective section 40 has an opening 41, a peripheral wall 42, and a screw mounting section 43.

[0023] The opening 41 is located in the center of the upper end of the second emitting section 40. The peripheral wall section 42 is formed in a parabolic shape that widens downward from the opening 41. The inner surface of the peripheral wall section 42 is a reflective surface that reflects the light emitted from the LED element 23 and passed through the panel 25. The second reflective section 40 is formed using a resin material, a metal material, or the like. The screw mounting section 43 is formed protruding upward from the peripheral wall section 42. A screw 55 is screwed into the screw mounting section 43. The upper end of the screw mounting section 43 is located above the opening 41. The screw mounting section 43 is located below the heat dissipation section 26 and is positioned in a location corresponding to the mounting section 26b of the heat dissipation section 26. Note that the plan view shape of the second reflective section 40 is not limited to a circular shape, but may also be a polygon such as a square, and may be a shape that can be attached to various mounting hole H opening shapes.

[0024] As shown in Figures 1 to 3, the mounting spring 70 is a fixing means for embedding and mounting the lighting fixture 100 in the mounting hole H of the ceiling C. The mounting spring 70 is configured to extend laterally from the second reflector 40. The mounting spring 70 is a leaf spring formed by bending and curving a plate-shaped metal member such as stainless steel at multiple points in the middle. When the lighting fixture 100 is installed in the mounting hole H of the ceiling C with the mounting spring 70 bent, the mounting spring 70 fixes the lighting fixture 100 to the ceiling C by pressing against the periphery of the mounting hole H with its expanding elastic force. Note that the shape, mounting position, and number of mounting springs 70 are not limited to those of this embodiment. The mounting spring 70 has a mounting portion 71 at its base. The mounting portion 71 is located above the heat dissipation portion 26. The mounting portion 71 is a through hole through which a screw 55 is inserted.

[0025] As shown in Figure 3 or Figure 4, the packing 80 is positioned between the second reflector 40 and the panel 25. The packing 80 is formed in an annular shape. As will be described in more detail later, the packing 80 enhances the airtightness between the panel 25 and the second reflector 40 when the heat dissipation section 26, the second reflector 40, and the mounting spring 70 are fixed using screws 55. This prevents foreign matter such as insects and dust from entering from the second reflector 40 side. Furthermore, the panel 25 is pressed upward by the elastic force of the packing 80. Consequently, the first reflective portion 30 and the module substrate 21 are pressed towards the heat dissipation portion 26, causing the first reflective portion 30 to contact the substrate 22 without any gaps. This further enhances the prevention of foreign matter from entering the internal space S, which is composed of the surface of the substrate 22 on which the LED elements 23 are arranged, the reflective surface of the peripheral wall portion 32, and the inner surface of the panel 24. In addition, since the substrate 22 is pressed against the heat dissipation portion 26, heat dissipation can be further enhanced.

[0026] As shown in Figure 3 or Figure 4, the module substrate 21 is placed inside the substrate guide portion 33 of the first reflector 30, and the claw portion 34 is inserted through the hole portion 26a of the heat dissipation portion 26, so that the module substrate 21 is sandwiched between the first reflector 30 (opening 31) and the lower surface of the heat dissipation portion 26. Then, the panel 25 is placed between the lower end of the first reflector 30 and the upper end (opening 41) of the second reflector 40. In this state, the mounting portion 26b of the heat dissipation portion 26, the screw mounting portion 43 of the second reflector 40, and the mounting portion 71 of the mounting spring 70 are aligned, and screws 55 are inserted through the mounting portion 26b and the mounting portion 71, and the screws 55 are screwed into the screw mounting portion 43, thereby assembling the light source portion 20, the first reflector 30, the panel 25, the heat dissipation portion 26, the second reflector 40, and the mounting spring 70, respectively, to form the luminaire 10.

[0027] As shown in Figures 1 to 3, the power supply unit 50 is a power supply device that supplies power to the LED elements 23 of the light source unit 20 to light up the LED elements 23. The power supply unit 50 is attached to the upper surface of the heat dissipation unit 26 by fasteners such as screws. The power supply unit 50 houses a power supply circuit in a box-shaped power supply case 52, on which multiple electronic components are mounted on a rectangular printed circuit board. The multiple electronic components include components that generate heat during operation. The heat generated from the electronic components is transferred to the power supply case 52. The power supply unit 50 converts the alternating current supplied from an external commercial power supply into a predetermined direct current and supplies the converted current to the multiple LED elements 23 on the module board 21. The power supply unit 50 is electrically connected to a terminal block 53 via wiring (not shown). The terminal block 53 is located on one side of the power supply unit 50 (power supply case 52). When installing the lighting fixture 100 to the ceiling C, the power supply unit 50 is electrically connected to the external commercial power supply (not shown) on the other side of the ceiling by connecting the terminal block 53 with wiring (not shown). The power supply unit 50 and the module board 21 are electrically connected by lead wires 27. Note that the power supply unit 50 does not necessarily have to be mounted on the upper surface of the heat dissipation unit 26. For example, it may be configured to be separate from the heat dissipation unit 26 without being mounted on it.

[0028] The light source unit 20 will be described in more detail with reference to Figure 5. Hereinafter, the four corners of the substrate 22 will be referred to as the first corner 22a, the second corner 22b, the third corner 22c, and the fourth corner 22d, respectively (see Figure 5). As shown in Figure 5, the first corner 22a, the second corner 22b, the third corner 22c, and the fourth corner 22d are arranged in a clockwise order when viewed from below. Also below, the four sides that make up the substrate 22 will be referred to as the first side 22e, the second side 22f, the third side 22g, and the fourth side 22h, respectively (see Figure 5). The first corner 22a is composed of the first side 22e and the fourth side 22h, the second corner 22b is composed of the first side 22e and the second side 22f, the third corner 22c is composed of the second side 22f and the third side 22g, and the fourth corner 22d is composed of the third side 22g and the fourth side 22h.

[0029] Of the multiple LED elements 23, those positioned on the outer side (the edge side of the substrate 22) are arranged side by side at a first placement position α and a second placement position β. The first placement position α and the second placement position β are not actual locations on the substrate 22, but rather virtual positions used to specify the location of the LED elements 23. The first placement position α is located at a predetermined distance from the array center A. In this embodiment, the first placement position α is a circle centered on the array center A. The array center A is located approximately in the center of the surface on the substrate 22 where the LED elements 23 are arranged. At the first placement position α, the multiple LED elements 23 are arranged circumferentially around the array center A. No LED elements 23 are placed at the first corner 22a side of the first placement position α. ​​The second placement position β is located at a distance shorter than the distance from the array center A to the first placement position α. ​​The second placement position β is located between the array center A and the first corner 22a. The second placement position β is configured in a straight line. The second placement position β is configured in a straight line that intersects with the first placement position α. That is, at the second placement position β, multiple LED elements 23 are arranged in a manner that connects with the multiple LED elements 23 arranged at the first placement position α. ​​The power supply unit 24 is positioned closer to the edge of the substrate 22 than the LED elements 23 arranged on the substrate 22, and near the first corner 22a. The second placement position β is positioned adjacent to the power supply unit 24.

[0030] Thus, the outermost LED elements 23 (at least some of the LED elements 23) consist of LED elements 23 arranged circumferentially around the center A at the first placement position α, and LED elements 23 arranged in a manner connected to the LED elements 23 at the first placement position α at a second placement position β, which is located at a distance shorter than the distance from the center A to the first placement position α. ​​The second placement position β is located adjacent to the power supply unit 24. Therefore, compared to a configuration where all the outermost LED elements 23 are placed at the first placement position α and the LED elements 23 are arranged in a ring shape, the space between the second placement position β and the first corner 22a can be increased, and space for the power supply unit 24 and lead wires 27 can be secured without increasing the size of the substrate 22. Furthermore, by making the wiring area of ​​the lead wire 27 relatively large, when the lead wire 27 is bent and wired from the mounting surface to the back side of the substrate 21 near the first corner 22a, the force that causes the lead wire 27 to move away from the mounting surface of the substrate 21 in a direction approximately perpendicular to it due to the tension acting on the lead wire 27 can be suppressed. This makes it possible to suppress connection failures between the power supply unit 24 and the lead wire 27. The "wiring area" refers to the area where the lead wire 27 can be placed, and in the configuration shown in Figure 5, it is the area between the power supply unit 24 and the first corner 22a.

[0031] The distance from the center of the array A to the first corner 22a is greater than the distance from the center of the array A to the middle of the first side 22e, the middle of the second side 22f, the middle of the third side 22g, or the middle of the fourth side 22h. In other words, the power supply unit 24 is located at the first corner 22a, in a part of the substrate 22 where the distance from the center of the array A to the edge of the substrate 22 is relatively far. In this way, since the power supply unit 24 is located in a part of the substrate 22 where the distance from the center of the array A to the edge of the substrate 22 is relatively far, space for the power supply unit 24 and lead wires 27 can be secured without increasing the size of the substrate 22.

[0032] Furthermore, since the substrate 22 has at least two linearly aligned portions (first side 22e and second side 22f) at its edge, and the power supply unit 24 is positioned near the point (first corner 22a) where the two linearly aligned portions (first side 22e and second side 22f) at the edge of the substrate 22 are closest to each other, space for the power supply unit 24 and lead wires 27 can be secured without increasing the size of the substrate 22.

[0033] The first corner 22a, second corner 22b, third corner 22c, and square corner 22d are formed in an arc shape. The radius of curvature of the first corner 22a is different from the radii of curvature of the second corner 22b, third corner 22c, and square corner 22d, and is smaller than the radius of curvature of the second corner 22b, etc. In this way, the power supply unit 24 is positioned near the corner with the relatively smaller radius of curvature (first corner 22a) among the arc-shaped corners with different radii of curvature formed on the substrate 22, so that space for the power supply unit 24 and lead wires 27 can be secured without increasing the size of the substrate 22. [Explanation of symbols]

[0034] 10 Lights 20 Light source section 21 Module board 22 circuit boards 23 LED element (light-emitting element) 24 Power supply section 25 panels 26 Heat radiation part 30 First reflection part (reflection part) 31 Opening 32 Peripheral wall part 33. Circuit board guide section 34 Claw part 40 Second reflection section 41 Opening 42 Peripheral wall part 43 Mounting part 50 Power supply section 80 Packing 100 lighting fixtures A center α First placement position β Second Configuration Position

Claims

1. circuit board and A plurality of light-emitting elements are arranged on the substrate so as to be aligned in the circumferential direction, A light-emitting module comprising a power supply unit that supplies power to the light-emitting element, The power supply unit is positioned closer to the edge of the substrate than the light-emitting element. Of the plurality of light-emitting elements, the one positioned closest to the edge of the substrate is: A light-emitting element is arranged in a circumferential direction with respect to the center of the array at a first arrangement position located at a predetermined distance from the center of the array, It consists of a light-emitting element positioned at a second position, which is located at a distance shorter than the distance from the center of the array to the first position, and which is positioned so as to be connected to the light-emitting element positioned at the first position, The second placement position is a light-emitting module located adjacent to the power supply unit.

2. The light-emitting module according to claim 1, wherein the power supply unit is located in a portion of the substrate where the distance from the center of the arrangement to the edge of the substrate is relatively far.

3. The substrate has portions at its edges that are formed in at least two intersecting linear directions, The light-emitting module according to claim 2, wherein the power supply unit is positioned near the point where two linearly arranged portions on the edge of the substrate are closest to each other.

4. The surface on the substrate where the light-emitting element is arranged is configured to be substantially rectangular in shape. At least two of the four corners of the substrate are formed in the shape of arcs with different radii of curvature, The light-emitting module according to any one of claims 1 to 3, wherein the power supply unit is arranged near the corner with the relatively smaller radius of curvature among the corners formed in the substrate in an arc shape with different radii of curvature.

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