Sensing terminal and sensing method

Abstract

To provide a sensing terminal and a sensing method that can reduce power consumption.SOLUTION: A sensing terminal 500 includes a detection sensor 511, a control unit 520, a battery 550, and an acceleration sensor 512. The detection sensor 511 detects the environment inside a substrate processing device 100. The control unit 520 can transition between an active state of executing a predetermined operation on the basis of the detection result of the detection sensor 511, and a sleep state in which power consumption is lower than that in the active state. The battery 550 supplies power to the control unit 520. The acceleration sensor 512 detects acceleration. The control unit 520 transitions between the active state and the sleep state, on the basis of the detection result of the acceleration sensor 512.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a sensing terminal and a sensing method.

Background Art

[0002] Conventionally, semiconductor manufacturing apparatuses such as a substrate processing apparatus for processing a substrate are known. In a semiconductor manufacturing apparatus, in order to grasp the processing state in the processing step, it is required to measure the internal environment of the apparatus such as the surface temperature of the substrate being processed and the temperature of the processing liquid. Therefore, a sensing terminal for detecting the internal environment of a semiconductor manufacturing apparatus is known (see, for example, Patent Document 1). Patent Document 1 describes a process condition measurement device having a wafer shape (hereinafter referred to as a measurement device). The measurement device includes a substrate made of a silicon wafer or the like, a plurality of sensors arranged on the substrate, a microprocessor, a storage unit, a battery, and the like. The internal environment of the semiconductor manufacturing apparatus can be detected by the plurality of sensors. Further, the measurement device operates by the power stored in the battery.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in a sensing terminal that operates by power supply from a battery, it is required to suppress power consumption so that the detection operation can be executed for a long time. In the measurement device described in Patent Document 1, power consumption is reduced by increasing the setting interval during the data storage operation or compressing the data stored in the storage unit.

[0005] However, there are cases where environmental data is needed, for example, when a sensing terminal is in a predetermined location, or when semiconductor manufacturing equipment is performing a predetermined process. In this case, if the control unit acquires environmental data and performs a predetermined operation when the sensing terminal is not in the predetermined location, or when the semiconductor manufacturing equipment is not performing the predetermined process, there is a problem in that unnecessary power is consumed.

[0006] The present invention has been made in view of the above problems, and its purpose is to provide a sensing terminal and a sensing method that can reduce power consumption. [Means for solving the problem]

[0007] According to one aspect of the present invention, the sensing terminal comprises a detection sensor, a control unit, a battery, and an acceleration sensor. The detection sensor detects the environment inside the manufacturing equipment. The control unit is capable of transitioning between an active state in which it performs a predetermined operation based on the detection result of the detection sensor, and a sleep state in which it consumes less power than the active state. The battery supplies power to the control unit. The acceleration sensor detects acceleration. The control unit transitions between the active state and the sleep state based on the detection result of the acceleration sensor.

[0008] In one embodiment, the control unit may transition between the active state and the sleep state based on at least one of a pattern of time-series data generated based on the detection result of the acceleration sensor and a position calculated based on the detection result of the acceleration sensor.

[0009] In one embodiment, the control unit may determine whether the sensing terminal is positioned at a predetermined location based on at least one of the pattern and the position. If the control unit determines that the terminal is positioned at the predetermined location, it may transition from the sleep state to the active state.

[0010] In one embodiment, the control unit may determine, based on the detection result of the acceleration sensor, whether or not the sensing terminal has moved from the predetermined position. If the control unit determines that the terminal has moved from the predetermined position, it may transition from the active state to the sleep state.

[0011] In one embodiment, the control unit may compare the detection result of the acceleration sensor with a predetermined threshold. Based on the comparison result, the control unit may transition between the active state and the sleep state.

[0012] In one embodiment, the control unit may determine whether the detection result of the acceleration sensor is equal to or greater than a predetermined threshold. If the result is equal to or greater than the predetermined threshold, the control unit may transition from the sleep state to the active state.

[0013] In one embodiment, the manufacturing apparatus may be a semiconductor manufacturing apparatus for manufacturing semiconductor devices.

[0014] According to another aspect of the present invention, the sensing method is a sensing method using a sensing terminal comprising a detection sensor for detecting the environment inside a manufacturing apparatus, an acceleration sensor, a control unit, and a battery for supplying power to the control unit. The control unit is capable of transitioning between an active state in which it performs a predetermined operation based on the detection result of the detection sensor, and a sleep state in which it consumes less power than the active state. The sensing method includes the steps of the acceleration sensor detecting acceleration and the control unit transitioning between the active state and the sleep state based on the detection result of the acceleration sensor. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a sensing terminal and a sensing method that can reduce power consumption. [Brief explanation of the drawing]

[0016] [Figure 1] It is a schematic plan view of a substrate processing apparatus sensed by the sensing terminal of the first embodiment. [Figure 2] It is a schematic diagram of a substrate processing unit in a substrate processing apparatus. [Figure 3] It is a block diagram schematically showing the configuration of the sensing terminal. [Figure 4] It is a diagram showing an example of a pattern of time-series data regarding acceleration generated based on the detection result of an acceleration sensor. [Figure 5] It is a diagram showing an example of a pattern of time-series data regarding velocity generated based on the detection result of an acceleration sensor. [Figure 6] It is a flowchart showing an example of a substrate processing method by a substrate processing apparatus. [Figure 7] It is a flowchart showing an example of a sensing method by a sensing terminal. [Figure 8] It is a schematic diagram showing a state where the sensing terminal of the second embodiment is attached to a substrate holding part of a substrate processing apparatus. [Figure 9] It is a flowchart showing an example of a sensing method by the sensing terminal of the second embodiment.

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments of a sensing terminal and a sensing method according to the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and the description will not be repeated. In this specification, for the sake of easy understanding of the invention, the X-axis, Y-axis, and Z-axis orthogonal to each other may be described. In this embodiment, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0018] (First Embodiment) The sensing terminal 500 according to the first embodiment of the present invention is a device that senses the environment inside a manufacturing apparatus. The type of manufacturing apparatus that the sensing terminal 500 senses is not particularly limited, but in this embodiment, it is a semiconductor manufacturing apparatus. A semiconductor manufacturing apparatus is an apparatus for manufacturing semiconductor devices. Also, in this embodiment, the semiconductor manufacturing apparatus that the sensing terminal 500 senses is a substrate processing apparatus 100 that processes a substrate. That is, the sensing terminal 500 senses the environment inside the substrate processing apparatus 100. Note that the substrate processing apparatus 100 is an example of the "manufacturing apparatus" and the "semiconductor manufacturing apparatus" of the present invention. Further, the sensing terminal 500 may sense the environment inside, for example, a panel manufacturing apparatus that manufactures panels or a printing machine that manufactures printed matter by printing on a printing target, other than the semiconductor manufacturing apparatus.

[0019] To facilitate understanding, before describing the sensing terminal 500 of the first embodiment of the present invention, first, the substrate processing apparatus 100 will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic plan view of the substrate processing apparatus 100 sensed by the sensing terminal 500 of the first embodiment.

[0020] The substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W so as to perform at least one of etching, surface treatment, property imparting, processing film formation, removal of at least a part of the film, and cleaning on the substrate W.

[0021] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is substantially disc-shaped. Here, the substrate processing apparatus 100 processes the substrates W one by one. 4]

[0022] As shown in Figure 1, the substrate processing apparatus 100 comprises a plurality of substrate processing units 10, a processing liquid cabinet 110, a processing liquid box 120, a plurality of load ports 130, an indexer robot 140, a center robot 150, and a control device 101. The control device 101 controls the load ports 130, the indexer robot 140, and the center robot 150. The control device 101 includes a control unit 102 and a storage unit 104.

[0023] Each of the load ports 130 accommodates multiple substrates W stacked on top of each other. The indexer robot 140 transports the substrates W between the load ports 130 and the center robot 150. The center robot 150 transports the substrates W between the indexer robot 140 and the substrate processing unit 10. Each of the substrate processing units 10 processes the substrates W by discharging a processing liquid onto them. The processing liquid includes, for example, a chemical solution, a cleaning solution, a removal solution, and / or a water repellent. The processing liquid cabinet 110 contains the processing liquid. The processing liquid cabinet 110 may also contain gas.

[0024] Specifically, the multiple substrate processing units 10 form multiple towers 160 (four towers 160 in Figure 1) arranged to surround the central robot 150 in a plan view. Each tower 160 contains multiple substrate processing units 10 (three substrate processing units 10 in Figure 1) stacked vertically. Each processing liquid box 120 corresponds to one of the multiple towers 160. The liquid in the processing liquid cabinet 110 is supplied to all substrate processing units 10 included in the tower 160 corresponding to any of the processing liquid boxes 120. Similarly, the gas in the processing liquid cabinet 110 is supplied to all substrate processing units 10 included in the tower 160 corresponding to any of the processing liquid boxes 120.

[0025] In the substrate processing apparatus 100, a boundary wall 170 is placed between the area where the center robot 150 and the substrate processing unit 10 are installed and the area where the processing liquid cabinet 110 is installed. The processing liquid cabinet 110 partitions a portion of the space outside the boundary wall 170 within the substrate processing apparatus 100.

[0026] Typically, the processing liquid cabinet 110 has a preparation tank for preparing the processing liquid. The processing liquid cabinet 110 may have a preparation tank for one type of processing liquid, or it may have preparation tanks for multiple types of processing liquids. The processing liquid cabinet 110 also has a pump, nozzles, and / or filters for circulating the processing liquid.

[0027] In this configuration, the processing liquid cabinet 110 comprises a first processing liquid cabinet 1101 and a second processing liquid cabinet 1102. The first processing liquid cabinet 1101 and the second processing liquid cabinet 1102 are arranged facing each other.

[0028] The control device 101 controls various operations of the substrate processing device 100.

[0029] The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 may have, for example, a central processing unit (CPU). Alternatively, the control unit 102 may have a general-purpose computing unit.

[0030] The storage unit 104 stores data and computer programs. The data includes recipe data. The recipe data includes information indicating multiple recipes. Each of the multiple recipes specifies the processing content and processing procedure for the substrate W.

[0031] The storage unit 104 includes a main memory and an auxiliary storage device. The main memory is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include removable media. The control unit 102 executes the computer program stored in the storage unit 104 to perform board processing operations.

[0032] Next, the substrate processing unit 10 in the substrate processing apparatus 100 will be described with reference to Figure 2. Figure 2 is a schematic diagram of the substrate processing unit 10 in the substrate processing apparatus 100.

[0033] The substrate processing unit 10 comprises a chamber 11, a substrate holding section 20, and a processing liquid supply section 30.

[0034] Chamber 11 is a roughly box-shaped chamber with an internal space. Chamber 11 houses the substrate W. Here, the substrate processing apparatus 100 is a single-wafer type that processes substrates W one at a time, and each chamber 11 houses one substrate W. The substrate W is housed in and processed within the chamber 11. At least a portion of the substrate holding section 20 and the processing liquid supply section 30 are housed in the chamber 11.

[0035] The substrate holder 20 holds the substrate W. The substrate holder 20 holds the substrate W horizontally so that the upper surface (front surface) Wa of the substrate W faces upward and the back surface (bottom surface) Wb of the substrate W faces vertically downward. The substrate holder 20 also rotates the substrate W while holding it. For example, the upper surface Wa of the substrate W is provided with a laminated structure with recesses. The substrate holder 20 rotates the substrate W while holding it.

[0036] For example, the substrate holder 20 may be a clamping type that clamps the edges of the substrate W. Alternatively, the substrate holder 20 may have any mechanism for holding the substrate W from the back surface Wb. For example, the substrate holder 20 may be a vacuum type. In this case, the substrate holder 20 holds the substrate W horizontally by adhering the central part of the back surface Wb of the substrate W, which is the non-device forming surface, to its upper surface. Alternatively, the substrate holder 20 may combine a clamping type and a vacuum type, where a plurality of chuck pins contact the peripheral edge surface of the substrate W.

[0037] For example, the substrate holding section 20 includes a spin base 21, a chuck member 22, a shaft 23, an electric motor 24, and a housing 25. The chuck member 22 is provided on the spin base 21. The chuck member 22 chucks the substrate W. Typically, the spin base 21 is provided with multiple chuck members 22.

[0038] The shaft 23 is a hollow shaft. The shaft 23 extends vertically along the axis of rotation Ax. The spin base 21 is coupled to the upper end of the shaft 23. The substrate W is placed above the spin base 21.

[0039] The spin base 21 is disc-shaped and horizontally supports the substrate W. The shaft 23 extends downward from the center of the spin base 21. The electric motor 24 provides rotational force to the shaft 23. By rotating the shaft 23 in the rotational direction, the electric motor 24 rotates the substrate W and the spin base 21 around the rotation axis Ax. The housing 25 surrounds the shaft 23 and the electric motor 24.

[0040] The processing liquid supply unit 30 supplies processing liquid to the substrate W. Typically, the processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W. At least a portion of the processing liquid supply unit 30 is housed within the chamber 11.

[0041] The processing liquid supply unit 30 supplies processing liquid to the upper surface Wa of the substrate W. The processing liquid may contain a so-called chemical solution. The chemical solution may contain, for example, hydrofluoric acid. For example, hydrofluoric acid may be heated to 40°C to 70°C or 50°C to 60°C. However, hydrofluoric acid does not need to be heated. The chemical solution may also contain water or phosphoric acid.

[0042] Furthermore, the chemical solution may contain hydrogen peroxide. The chemical solution may also contain SC1 (ammonia-hydrogen peroxide mixture), SC2 (hydrochloric acid-hydrogen peroxide mixture), or aqua regia (a mixture of concentrated hydrochloric acid and concentrated nitric acid).

[0043] Alternatively, the treatment solution may include a so-called cleaning solution (rinsing solution). For example, the cleaning solution may include deionized water (DIW), carbonated water, electrolyzed ionized water, ozonated water, ammonia water, hydrochloric acid water at a diluted concentration (e.g., about 10 ppm to 100 ppm), or reduced water (hydrogen water).

[0044] The processing liquid supply unit 30 includes a pipe 32, a nozzle 34, and a valve 36. The nozzle 34 discharges the processing liquid onto the upper surface Wa of the substrate W. The nozzle 34 is connected to the pipe 32. The processing liquid is supplied to the pipe 32 from a supply source. The valve 36 opens and closes the flow path in the pipe 32. It is preferable that the nozzle 34 is configured to be movable relative to the substrate W.

[0045] Valve 36 opens and closes the flow path in the piping 32. Valve 36 adjusts the flow rate of the processing liquid supplied to the piping 32 by adjusting the degree of opening of the piping 32. Specifically, valve 36 includes a valve body (not shown) with a valve seat inside, a valve element that opens and closes the valve seat, and an actuator (not shown) that moves the valve element between an open position and a closed position.

[0046] The nozzle 34 may be movable. In this embodiment, the nozzle 34 is configured to be movable. Specifically, the processing liquid supply unit 30 further includes a moving mechanism 38. The moving mechanism 38 moves the nozzle 34. The nozzle 34 can move horizontally and / or vertically according to the moving mechanism 38 controlled by the control unit 102.

[0047] In detail, the moving mechanism 38 includes an arm 381, a rotating shaft 382, ​​and a drive mechanism 383. The arm 381 extends in a substantially horizontal direction. A nozzle 34 is fixed to one end of the arm 381. A rotating shaft 382 is fixed to the other end of the arm 381. The rotating shaft 382 extends in a substantially vertical direction. The drive mechanism 383 rotates the rotating shaft 382 around its central axis. As a result, the arm 381 and the nozzle 34 rotate around the rotating shaft 382. The drive mechanism 383 may also move the rotating shaft 382 in a substantially vertical direction. In this case, the arm 381 and the nozzle 34 move in a substantially vertical direction.

[0048] The substrate processing unit 10 further includes a cup 80. The cup 80 collects the processing liquid that has splashed from the substrate W. The cup 80 moves up and down. For example, the cup 80 rises vertically upward to the side of the substrate W during the period when the processing liquid supply unit 30 supplies processing liquid to the substrate W. In this case, the cup 80 collects the processing liquid that splashes from the substrate W due to the rotation of the substrate W. The cup 80 then descends vertically downward from the side of the substrate W when the period during which the processing liquid supply unit 30 supplies processing liquid to the substrate W ends.

[0049] As described above, the control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 controls the substrate holding unit 20, the processing liquid supply unit 30 and / or the cup 80. In one example, the control unit 102 controls the electric motor 24, the valve 36 and / or the cup 80.

[0050] The substrate processing apparatus 100 of this embodiment is suitably used for manufacturing semiconductor devices on which semiconductors are provided. Typically, in a semiconductor device, a conductive layer and an insulating layer are laminated on a substrate. The substrate processing apparatus 100 is suitably used for cleaning and / or processing (e.g., etching, property change, etc.) the conductive layer and / or insulating layer during the manufacturing of semiconductor devices.

[0051] In the substrate processing unit 10 shown in Figure 2, the processing liquid supply unit 30 can supply one type of processing liquid. However, this embodiment is not limited to this. The processing liquid supply unit 30 may supply multiple types of processing liquids. For example, the processing liquid supply unit 30 may sequentially supply multiple types of processing liquids with different applications to the substrate W. Alternatively, the processing liquid supply unit 30 may simultaneously supply multiple types of processing liquids with different applications to the substrate W.

[0052] Next, the sensing terminal 500 of this embodiment will be described with reference to Figure 3. Figure 3 is a block diagram schematically showing the configuration of the sensing terminal 500. As shown in Figure 3, the sensing terminal 500 comprises a sensor unit 510, a control unit 520, a storage unit 530, a communication unit 540, and a battery 550. Note that the control unit 520 is an example of the "control unit" of the present invention.

[0053] The sensor unit 510 includes a detection sensor 511 and an acceleration sensor 512. The detection sensor 511 detects the environment inside the manufacturing equipment. In this embodiment, the detection sensor 511 detects the environment inside the substrate processing apparatus 100.

[0054] The environment detected by the detection sensor 511 is not particularly limited, but examples include temperature, atmospheric pressure, liquid pressure, flow rate of a fluid such as gas or liquid, fluid composition, voltage value, current value, etching rate, and thickness of a film on the substrate W. The number of environments detected by the detection sensor 511 is not particularly limited, and the detection sensor 511 only needs to detect one or more environments. In this embodiment, the detection sensor 511 detects one environment. Also, the number of detection sensors 511 is not particularly limited, and one or more are sufficient. In this embodiment, the number of detection sensors 511 is one.

[0055] The detection sensor 511 is a sensor other than an acceleration sensor. In this embodiment, the detection sensor 511 is a temperature sensor that detects temperature. The type of detection sensor 511 is not particularly limited, but in this embodiment, the detection sensor 511 includes, for example, a thermocouple or a thermistor. The detection sensor 511 may be a contact type sensor or a non-contact type sensor.

[0056] The detection sensor 511 detects the internal environment of the substrate processing apparatus 100 at regular intervals. The detection sensor 511 transmits the detection result to the control unit 520. Specifically, the detection sensor 511 transmits a signal indicating the detection result to the control unit 520.

[0057] The acceleration sensor 512 detects acceleration. The type of acceleration sensor 512 is not particularly limited, but for example, a capacitive sensor or a piezoresistive sensor can be used.

[0058] The sensing terminal 500 is fixed to, for example, a movable component or device (hereinafter sometimes referred to as "component, etc.") inside the manufacturing equipment. The acceleration sensor 512 detects its own acceleration. In other words, the acceleration sensor 512 detects the acceleration of the detection sensor 511, the acceleration of the sensing terminal 500, and the acceleration of the component, etc. to which the sensing terminal 500 is fixed. The acceleration sensor 512 detects acceleration at regular intervals. The detection interval by the acceleration sensor 512 may be longer than the detection interval by the detection sensor 511. The acceleration sensor 512 transmits the detection result to the control unit 520. Specifically, the acceleration sensor 512 transmits a signal indicating the detection result to the control unit 520. As will be described later, the control unit 520 can calculate at least one of velocity, distance traveled, and position based on the acceleration detected by the acceleration sensor 512.

[0059] The control unit 520 includes, for example, a microcomputer (also called a microcontroller). The microcomputer has, for example, a microprocessor and memory. The control unit 520 performs various processes by executing a program stored in memory. The control unit 520 may be a processor such as a CPU (Central Processing Unit) or an MPU (Micro Processing Unit).

[0060] For example, the control unit 520 generates time-series data of detected values ​​based on the detection results of the detection sensor 511. Specifically, the control unit 520 converts the signal from the detection sensor 511 into detected values. The control unit 520 also generates time-series data of detected values ​​using the converted detected values. Furthermore, the control unit 520 compresses the generated time-series data and stores it in the storage unit 530.

[0061] The storage unit 530 stores data. For example, the storage unit 530 stores the detection results of the detection sensor 511. Specifically, for example, the storage unit 530 stores time-series data of the detection values ​​of the detection sensor 511. The storage unit 530 may also store the detection results of the acceleration sensor 512. In this case, the control unit 520 may convert the signal from the acceleration sensor 512 into a detection value to generate time-series data of the detection value, compress the generated time-series data, and store it in the storage unit 530. The storage unit 530 may also store various programs.

[0062] The storage unit 530 includes, for example, a main memory and an auxiliary storage device. The main memory is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may include removable media.

[0063] The communication unit 540 is a communication device. The communication unit 540 transmits data to devices other than the sensing terminal 500 by wire or wireless connection. The communication unit 540 includes, for example, an interface. The communication unit 540 may also include an antenna. Data stored in the storage unit 530 is transmitted via the communication unit 540 to devices other than the sensing terminal 500 (hereinafter sometimes referred to as receiving devices). Data stored in the storage unit 530 (for example, detection results from the detection sensor 511, or time-series data) is transmitted via the communication unit 540 to the receiving device when, for example, the sensing terminal 500 is not performing sensing.

[0064] The battery 550 supplies power to the control unit 520. The sensing terminal 500 performs sensing using the power stored in the battery 550. The battery 550 is not particularly limited, but for example, it is a lithium-ion battery. However, the battery 550 may be a battery other than a lithium-ion battery.

[0065] Furthermore, the battery 550 is charged by an external power source when the sensing terminal 500 is not performing sensing. For example, the battery 550 is charged by an external power source when the sensing terminal 500 is located in the retraction position described later. The battery 550 may also be charged by an external power source when it is detached from the sensing terminal 500.

[0066] Next, the control unit 520 will be described. The control unit 520 can transition between an active state and a sleep state. The active state is a state in which the control unit 520 performs a predetermined operation based on the detection result of the detection sensor 511. The predetermined operation includes, for example, converting the signal from the detection sensor 511 into a detected value. The predetermined operation also includes, for example, generating time-series data of the detected value based on the signal from the detection sensor 511. The predetermined operation also includes, for example, compressing the time-series data and storing it in the storage unit 530.

[0067] The sleep state is a state in which power consumption is lower compared to the active state. The sleep state includes, for example, a state in which the control unit 520 does not convert the signal from the detection sensor 511 into a detected value. The sleep state also includes, for example, a state in which the control unit 520 does not generate time-series data of the detected value. The sleep state also includes, for example, a state in which the control unit 520 does not compress the time-series data or store it in the storage unit 530. The sleep state may also include, for example, a state in which the control unit 520 does not supply power to the detection sensor 511 for detecting the environment.

[0068] The mounting position of the sensing terminal 500 is not particularly limited, but in this embodiment, as shown in Figure 2, the sensing terminal 500 is attached to the nozzle 34, for example. In this embodiment, the sensing terminal 500 detects the temperature of the processing liquid passing through the nozzle 34, or the temperature of the nozzle 34. The sensing terminal 500 detects the temperature of the processing liquid or the temperature of the nozzle 34 when the nozzle 34 is positioned in a predetermined location (for example, above the substrate W).

[0069] The control unit 520 transitions between an active state and a sleep state based on the detection result of the acceleration sensor 512. Therefore, for example, the control unit 520 can perform a predetermined operation only when the sensing terminal 500 is in a predetermined position, or when the substrate processing device 100 is performing a predetermined process. Thus, the control unit 520 can be prevented from performing a predetermined operation when the sensing terminal 500 is not in a predetermined position, or when the substrate processing device 100 is not performing a predetermined process. As a result, the power consumption of the sensing terminal 500 can be reduced. In this embodiment, for example, the power consumption of the sensing terminal 500 can be reduced when the nozzle 34 is not in a predetermined position above the substrate W.

[0070] In this embodiment, the control unit 520 transitions between an active state and a sleep state based on at least one of the time-series data pattern generated based on the detection results of the acceleration sensor 512 and the position calculated based on the detection results of the acceleration sensor 512. Therefore, for example, the control unit 520 can easily transition between an active state and a sleep state based on whether the sensing terminal 500 is in a predetermined position or whether the substrate processing device 100 is performing a predetermined process. Thus, when the sensing terminal 500 is not in a predetermined position or when the substrate processing device 100 is not performing a predetermined process, the control unit 520 can be easily prevented from performing a predetermined operation. Furthermore, since the execution of a predetermined operation by the control unit 520 can be prevented, the amount of data stored in the storage unit 530 can be reduced. Therefore, it is also possible to miniaturize the storage unit 530.

[0071] Specifically, the control unit 520 generates time-series data based on, for example, the detection results of the acceleration sensor 512. The control unit 520 also generates a pattern of time-series data based on, for example, the detection results of the acceleration sensor 512. Figure 4 shows an example of a time-series data pattern related to acceleration generated based on the detection results of the acceleration sensor 512. Figure 5 shows an example of a time-series data pattern related to velocity generated based on the detection results of the acceleration sensor 512. The time-series data pattern may be a time-series data pattern related to acceleration (see Figure 4). The time-series data pattern may also be a time-series data pattern related to velocity (see Figure 5). The time-series data pattern may also be a time-series data pattern related to position (not shown). Thus, the time-series data pattern is, for example, a pattern with acceleration, velocity, or position on the vertical axis and time on the horizontal axis. When the substrate processing apparatus 100 performs the same processing, for example, the time-series data pattern of the member to which the acceleration sensor 512 is attached (in this case, the nozzle 34) will be substantially the same.

[0072] Specifically, the control unit 520 calculates the position of the sensing terminal 500 based on the detection result of the acceleration sensor 512, for example. In other words, the control unit 520 calculates the position of the acceleration sensor 512, the position of the detection sensor 511, or the position of the member to which the sensing terminal 500 is fixed, based on the detection result of the acceleration sensor 512. For example, the position of the sensing terminal 500 is calculated by integrating the direction of movement and the distance traveled of the sensing terminal 500 with respect to the position of the sensing terminal 500 in the retracted position (e.g., the home position). The direction of movement and the distance traveled of the sensing terminal 500 can be calculated, for example, by integrating the detected value of the acceleration sensor 512 twice.

[0073] Furthermore, in this embodiment, the control unit 520 determines whether the detection sensor 511 is positioned at a predetermined location based on at least one of the time-series data pattern (see Figures 4 and 5) and the calculated position of the sensing terminal 500. Therefore, it is easy to determine whether the sensing terminal 500 is in a predetermined location or whether the substrate processing device 100 is performing a predetermined process, based on at least one of the time-series data pattern and the calculated position. When the control unit 520 determines that the sensing terminal is in a predetermined location, it transitions from a sleep state to an active state. Therefore, it is easy to prevent the control unit 520 from performing a predetermined operation when the sensing terminal 500 is not in a predetermined location or when the substrate processing device 100 is not performing a predetermined process.

[0074] Furthermore, in this embodiment, the control unit 520 determines whether the sensing terminal 500 has moved from a predetermined position based on the detection result of the acceleration sensor 512, and if it determines that it has moved from the predetermined position, it transitions from the active state to the sleep state.Therefore, it is possible to easily determine whether the sensing terminal 500 is in a predetermined position or whether the substrate processing device 100 is performing a predetermined process, based on at least one of the time-series data pattern and the calculated position.As a result, it is possible to easily suppress the control unit 520 from performing a predetermined operation when the sensing terminal 500 is not in a predetermined position or when the substrate processing device 100 is not performing a predetermined process.

[0075] Next, to facilitate understanding, before describing the sensing method by the sensing terminal 500, we will refer to Figure 6 to explain an example of a substrate processing method by the substrate processing apparatus 100. Figure 6 is a flowchart showing an example of a substrate processing method by the substrate processing apparatus 100.

[0076] An example of a substrate processing method using the substrate processing apparatus 100 of this embodiment includes steps S1 to S6. Steps S1 to S6 are performed by the control unit 102.

[0077] As shown in Figure 6, in step S1, the control unit 520 moves the nozzle 34 to the discharge position. Specifically, the control unit 520 moves the nozzle 34 from the retracted position to the discharge position using the drive mechanism 383. For example, the retracted position is a position moved horizontally from above the substrate W. In other words, the retracted position is a position other than above the substrate W. The discharge position is a position above the substrate W. The discharge position is the position where the nozzle 34 is positioned when the processing liquid is discharged from the nozzle 34.

[0078] Next, in step S2, the control unit 520 rotates the substrate W using the substrate holding unit 20. Specifically, the control unit 520 rotates the substrate W by rotating the spin base 21 with the electric motor 24. In this embodiment, the rotation of the substrate W is started after the nozzle 34 is moved to the discharge position, but the nozzle 34 may be moved to the discharge position after the rotation of the substrate W has started, or the movement of the nozzle 34 to the discharge position and the start of the rotation of the substrate W may be performed in parallel.

[0079] Next, in step S3, the control unit 520 discharges the processing liquid from the nozzle 34. The processing liquid is heated to a predetermined temperature by a heater (not shown) and then discharged from the nozzle 34 onto the substrate W. This applies a predetermined treatment (such as etching) to the substrate W.

[0080] Next, in step S4, the control unit 520 stops the discharge of the processing liquid from the nozzle 34. Specifically, after a predetermined time has elapsed since the start of the discharge of the processing liquid in step S3, the control unit 520 stops the discharge of the processing liquid.

[0081] Next, in step S5, the control unit 520 stops the rotation of the substrate W. Specifically, the control unit 520 stops the rotation of the substrate W by stopping the rotation of the spin base 21 by the electric motor 24.

[0082] Next, in step S6, the control unit 520 moves the nozzle 34 to the retracted position. Specifically, the control unit 520 moves the nozzle 34 from the discharge position to the retracted position using the drive mechanism 383. In this embodiment, the nozzle 34 is moved to the retracted position after the rotation of the substrate W is stopped, but the rotation of the substrate W may be stopped after the nozzle 34 is moved to the retracted position, or the stopping of the rotation of the substrate W and the movement of the nozzle 34 to the retracted position may be performed in parallel.

[0083] The processing of substrate W is now complete.

[0084] Next, the sensing method using the sensing terminal 500 of this embodiment will be described. Figure 7 is a flowchart showing an example of the sensing method using the sensing terminal 500.

[0085] The sensing method by the sensing terminal 500 in this embodiment includes steps S101 to S105. Steps S101 to S105 are executed by the control unit 520. Steps S101 and S104 are examples of the "step in which the acceleration sensor detects acceleration" in the present invention. Steps S102 and S105 are examples of the "step in which the system transitions between an active state and a sleep state" in the present invention.

[0086] As shown in Figure 7, in step S101, the control unit 520 determines whether or not the sensing terminal 500 is positioned in a predetermined location. Note that in step S101, the control unit 520 is in sleep mode.

[0087] Specifically, in step S1 above, when the nozzle 34 moves from the retracted position to the discharge position, the acceleration sensor 512 detects a change in acceleration. More specifically, the acceleration sensor 512 detects that the horizontal acceleration is increasing. The control unit 520 generates a time-series data pattern (see Figures 4 and 5) based on the detection result of the acceleration sensor 512, and determines whether the sensing terminal 500 is positioned at a predetermined location based on the time-series data pattern. Alternatively, the control unit 520 calculates the position of the sensing terminal 500 based on the detection result of the acceleration sensor 512, and determines whether the sensing terminal 500 is positioned at a predetermined location based on the calculated position. The control unit 520 may also determine whether the sensing terminal 500 is positioned at a predetermined location based on both the time-series data pattern and the calculated position.

[0088] For example, the control unit 520 compares the pattern of the generated time-series data with a reference pattern previously stored in the storage unit 530. For example, the control unit 520 determines whether the sensing terminal 500 is positioned at a predetermined location based on whether the degree of agreement between the pattern of the generated time-series data and the reference pattern previously stored in the storage unit 530 is above a threshold.

[0089] Alternatively, for example, the control unit 520 compares the calculated position with a target position previously stored in the storage unit 530. For example, the control unit 520 determines whether the sensing terminal 500 is positioned at a predetermined location based on whether the degree of agreement between the calculated position and the target position previously stored in the storage unit 530 is above a threshold.

[0090] If the control unit 520 determines in step S101 that the sensing terminal 500 is not positioned in the predetermined location, the process repeats step S101. Specifically, the process repeats step S101 until the nozzle 34 is positioned in the discharge location in step S1.

[0091] On the other hand, if the control unit 520 determines in step S101 that the sensing terminal 500 has been positioned in a predetermined location, the process proceeds to step S102. Specifically, if the nozzle 34 is positioned in the discharge position in step S1, the process proceeds to step S102.

[0092] Next, in step S102, the control unit 520 transitions from sleep state to active state.

[0093] Next, in step S103, the control unit 520 performs sensing. That is, sensing is performed by the sensing terminal 500. Specifically, the control unit 520 converts the signal from the detection sensor 511 into a detection value. The control unit 520 also generates time-series data of the detection value using the converted detection value. The control unit 520 also compresses the generated time-series data and stores it in the storage unit 530.

[0094] Next, in step S104, the control unit 520 determines whether the sensing terminal 500 has moved from its predetermined position. Specifically, when the nozzle 34 moves from the discharge position to the retracted position in step S6, the acceleration sensor 512 detects a change in acceleration.

[0095] For example, the control unit 520 determines whether the sensing terminal 500 has moved from its predetermined position based on whether the degree of agreement between the generated time-series data pattern and a reference pattern previously stored in the storage unit 530 is above a threshold, in the same manner as in step S101.

[0096] Alternatively, for example, the control unit 520 may determine whether the sensing terminal 500 has moved from its predetermined position by checking whether the degree of agreement between the calculated position and the retracted position previously stored in the storage unit 530 is greater than or equal to a threshold, in the same manner as in step S101.

[0097] If the control unit 520 determines in step S104 that the sensing terminal 500 has not moved from its predetermined position, the process returns to step S103. Specifically, the process repeats steps S103 and S104 until the nozzle 34 starts moving from the discharge position towards the retracted position in step S6. Alternatively, the process may repeat steps S103 and S104 until the nozzle 34 reaches the retracted position in step S6.

[0098] On the other hand, if the control unit 520 determines in step S104 that the sensing terminal 500 has moved from its predetermined position, the process proceeds to step S105. Specifically, if the nozzle 34 starts moving from the discharge position toward the retracted position in step S6, the process proceeds to step S105. Alternatively, if the nozzle 34 reaches the retracted position in step S6, the process may proceed to step S105.

[0099] Next, in step S105, the control unit 520 transitions from an active state to a sleep state. As a result, the control unit 520 stops sensing. In other words, sensing by the sensing terminal 500 stops. Specifically, the control unit 520 does not convert the signal from the detection sensor 511 into a detected value. Alternatively, the control unit 520 does not have to generate time-series data using the converted detected value. Alternatively, the control unit 520 does not have to compress the time-series data or store it in the storage unit 530. Alternatively, by transitioning to a sleep state, the control unit 520 does not have to receive the detection result from the detection sensor 511, nor does it have to supply a voltage to the detection sensor 511 for detecting the environment.

[0100] With the above steps completed, the sensing by the sensing terminal 500 is finished.

[0101] A first embodiment of the present invention has been described above with reference to Figures 1 to 7. In this embodiment, as described above, the control unit 520 can perform a predetermined operation only when the sensing terminal 500 is in a predetermined position, or when the substrate processing device 100 is performing a predetermined process. Therefore, the control unit 520 can be prevented from performing a predetermined operation when the sensing terminal 500 is not in a predetermined position, or when the substrate processing device 100 is not performing a predetermined process. As a result, the power consumption of the sensing terminal 500 can be reduced. In this embodiment, for example, the power consumption of the sensing terminal 500 can be reduced when the nozzle 34 is not in the discharge position above the substrate W.

[0102] Furthermore, as described above, in step S104, the nozzle 34 begins to move from the discharge position towards the retracted position, and the process proceeds to step S105. Therefore, the transition from the active state to the sleep state occurs earlier compared to the case where the process proceeds to step S105 after the nozzle 34 has reached the retracted position. Thus, the power consumption of the sensing terminal 500 can be reduced further.

[0103] (Second Embodiment) Next, with reference to Figure 8, a sensing terminal 500 according to a second embodiment of the present invention will be described. In the second embodiment, unlike the first embodiment, an example will be described in which the sensing terminal 500 is attached to the substrate holding portion 20. Figure 8 is a schematic diagram showing the sensing terminal 500 of this embodiment attached to the substrate holding portion 20 of the substrate processing apparatus 100.

[0104] As shown in Figure 8, the sensing terminal 500 is attached to the substrate holder 20. In this embodiment, the sensing terminal 500 is attached to the spin base 21 of the substrate holder 20. The sensing terminal 500 detects, for example, the temperature of the spin base 21 or the temperature of the substrate W placed on the spin base 21. In this embodiment, the sensing terminal 500 detects the temperature of the spin base 21 or the temperature of the substrate W while the spin base 21 is rotating.

[0105] In this embodiment, the control unit 520 compares the detection result of the acceleration sensor 512 with a predetermined threshold and transitions between an active state and a sleep state based on the comparison result. Therefore, for example, it is not necessary to generate a time-series data pattern of the detection value of the acceleration sensor 512 or to calculate the position of the sensing terminal 500. Thus, the control unit 520 can easily transition between an active state and a sleep state. In this embodiment, for example, the power consumption of the sensing terminal 500 can be reduced when the substrate W is not rotating.

[0106] Specifically, the control unit 520 determines whether the detection result of the acceleration sensor 512 has exceeded a predetermined threshold (hereinafter sometimes referred to as the first threshold). The predetermined threshold is a value determined in advance and is stored, for example, in the storage unit 530. The predetermined threshold is, for example, a value greater than zero and less than the acceleration when processing the substrate W. When the detection result of the acceleration sensor 512 exceeds the predetermined threshold, the control unit 520 transitions from sleep state to active state. Therefore, for example, the control unit 520 can easily perform a predetermined operation only when the substrate processing device 100 is performing a predetermined process. Thus, it is easy to suppress the control unit 520 from performing a predetermined operation when the substrate processing device 100 is not performing a predetermined process.

[0107] Furthermore, the control unit 520 determines whether the detection result of the acceleration sensor 512 falls below a predetermined threshold (hereinafter sometimes referred to as the second threshold). If the detection result of the acceleration sensor 512 falls below the predetermined threshold, the control unit 520 transitions from the active state to the sleep state. The second threshold may be the same as the first threshold, or it may be different from the first threshold.

[0108] Next, the sensing method using the sensing terminal 500 of this embodiment will be described. Figure 9 is a flowchart showing an example of the sensing method using the sensing terminal 500.

[0109] The sensing method by the sensing terminal 500 in this embodiment includes steps S201 to S205. Steps S201 to S205 are executed by the control unit 520. Steps S201 and S204 are examples of the "step in which the acceleration sensor detects acceleration" according to the present invention. Steps S202 and S205 are examples of the "step in which the system transitions between an active state and a sleep state" according to the present invention.

[0110] As shown in Figure 9, in step S201, the control unit 520 determines whether the detection result of the acceleration sensor 512 has exceeded a predetermined threshold (first threshold). Note that in step S201, the control unit 520 is in a sleep state.

[0111] Specifically, when the spin base 21 of the substrate holding unit 20 starts rotating in step S2 above, the acceleration sensor 512 detects a change in acceleration. More specifically, the acceleration sensor 512 detects that the radial acceleration around the rotation axis Ax has increased. The control unit 520 determines whether the detection result of the acceleration sensor 512 has exceeded a predetermined threshold. Note that when the spin base 21 is not rotating, the detection result of the acceleration sensor 512 is, for example, zero. Also, as the rotation speed of the spin base 21 increases, the detection result of the acceleration sensor 512 also increases.

[0112] If the control unit 520 determines in step S201 that the detection result of the acceleration sensor 512 is not above a predetermined threshold, the process repeats step S201. Specifically, the process repeats step S201 until the rotation speed of the spin base 21 exceeds a predetermined value in step S2.

[0113] On the other hand, if the control unit 520 determines in step S201 that the detection result of the acceleration sensor 512 has exceeded a predetermined threshold, the process proceeds to step S202. Specifically, if the rotation speed of the spin base 21 exceeds a predetermined value in step S2, the process proceeds to step S202.

[0114] Next, in step S202, the control unit 520 transitions from sleep state to active state.

[0115] Next, in step S203, the control unit 520 performs sensing. That is, sensing is performed by the sensing terminal 500. Specifically, the control unit 520 converts the signal from the detection sensor 511 into a detection value. The control unit 520 also generates time-series data of the detection value using the converted detection value. The control unit 520 also compresses the generated time-series data and stores it in the storage unit 530.

[0116] Next, in step S204, the control unit 520 determines whether the detection result of the acceleration sensor 512 has fallen below a predetermined threshold (second threshold). Specifically, when the rotation of the spin base 21 is stopped in step S5, the rotation speed of the spin base 21 becomes zero after falling below a predetermined value.

[0117] If the control unit 520 determines in step S204 that the detection result of the acceleration sensor 512 is not below a predetermined threshold, the process returns to step S203. Specifically, the process repeats steps S203 and S204 until the rotation speed of the spin base 21 falls below a predetermined value in step S5.

[0118] On the other hand, if the control unit 520 determines in step S204 that the detection result of the acceleration sensor 512 has fallen below a predetermined threshold, the process proceeds to step S205. Specifically, if the rotation speed of the spin base 21 falls below a predetermined value in step S5, the process proceeds to step S205.

[0119] Next, in step S205, the control unit 520 transitions from the active state to the sleep state. As a result, the control unit 520 stops sensing. In other words, sensing by the sensing terminal 500 stops.

[0120] With the above steps completed, the sensing by the sensing terminal 500 is finished.

[0121] Other configurations and sensing methods of the second embodiment are the same as those of the first embodiment described above.

[0122] A second embodiment of the present invention has been described above with reference to Figures 8 and 9. In this embodiment, as described above, the control unit 520 compares the detection result of the acceleration sensor 512 with a predetermined threshold and transitions between an active state and a sleep state based on the result of the comparison. Therefore, the control unit 520 does not need to, for example, generate a time-series data pattern of the detection value of the acceleration sensor 512 or calculate the position of the sensing terminal 500. Thus, the control unit 520 can easily transition between an active state and a sleep state. In this embodiment, for example, the power consumption of the sensing terminal 500 when the substrate W is not rotating can be easily suppressed.

[0123] Other effects of the second embodiment are the same as those of the first embodiment described above.

[0124] Embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from the spirit of the invention. Furthermore, various inventions can be formed by appropriately combining the multiple components disclosed in the above embodiments. For example, some components may be deleted from all the components shown in the embodiments. Furthermore, components from different embodiments may be appropriately combined. The drawings schematically show each component in order to make them easy to understand, and the thickness, length, number, spacing, etc. of each component shown may differ from the actual dimensions due to the convenience of drawing creation. Also, the material, shape, dimensions, etc. of each component shown in the above embodiments are examples and are not particularly limited, and various modifications are possible without substantially departing from the effects of the present invention.

[0125] For example, in the above embodiment, an example was described in which data stored in the storage unit 530 is transmitted to the receiving device when the sensing terminal 500 is not performing sensing, but the present invention is not limited to this. The data stored in the storage unit 530 may also be transmitted to the receiving device when the sensing terminal 500 is performing sensing. With this configuration, the amount of data stored in the storage unit 530 can be reduced, and thus the storage unit 530 can be made smaller.

[0126] Furthermore, although the above embodiment describes an example in which the sensing terminal 500 is attached to the nozzle 34 or the spin base 21, the present invention is not limited thereto. For example, the sensing terminal 500 may be a terminal having a wafer shape. With this configuration, for example, the temperature of the substrate W during processing, or the temperature of the chemical solution discharged onto the substrate W during processing, can be easily detected.

[0127] Furthermore, although the above embodiment describes an example of detecting the environment during processing of the substrate W, the present invention is not limited thereto. For example, the environment during transport of the substrate W by an indexer robot 140 or a center robot 150 may be detected.

[0128] Furthermore, while the first embodiment described an example in which the control unit 520 transitions from a sleep state to an active state when the sensing terminal 500 is placed in a predetermined position, the present invention is not limited to this. For example, when the sensing terminal 500 is placed in a predetermined position, the control unit 520 may transition from an active state to a sleep state.

[0129] Furthermore, while the first embodiment described an example in which the control unit 520 transitions from an active state to a sleep state when the detection sensor 511 is moved from a predetermined position, the present invention is not limited to this. For example, the control unit 520 may transition from a sleep state to an active state when the detection sensor 511 is moved from a predetermined position.

[0130] Furthermore, while the second embodiment describes an example where the system transitions from a sleep state to an active state when the detection result of the acceleration sensor 512 exceeds a predetermined threshold, the present invention is not limited to this. For example, the system may transition from an active state to a sleep state when the detection result of the acceleration sensor 512 exceeds a predetermined threshold.

[0131] Furthermore, while the second embodiment describes an example where the system transitions from an active state to a sleep state when the detection result of the acceleration sensor 512 falls below a predetermined threshold, the present invention is not limited to this. For example, the system may transition from a sleep state to an active state when the detection result of the acceleration sensor 512 falls below a predetermined threshold. [Industrial applicability]

[0132] The present invention is preferably used in sensing terminals and sensing methods. [Explanation of Symbols]

[0133] 100: Substrate processing equipment (manufacturing equipment, semiconductor manufacturing equipment) 500: Sensing terminal 511: Detection Sensor 512: Accelerometer 520: Control Unit 550: Battery

Claims

1. A detection sensor that detects the environment inside the manufacturing equipment, A control unit that can transition between an active state in which a predetermined operation is performed based on the detection result of the detection sensor and a sleep state in which power consumption is lower than that of the active state, A battery that supplies power to the control unit, Accelerometer that detects acceleration and Equipped with, The control unit is a sensing terminal that transitions between the active state and the sleep state based on at least one of a pattern of time-series data generated based on the detection results of the acceleration sensor and a position calculated based on the detection results of the acceleration sensor.

2. The control unit, Based on at least one of the pattern and the position, it is determined whether the sensing terminal is positioned at a predetermined location. The sensing terminal according to claim 1, which transitions from the sleep state to the active state when it is determined that it has been placed in the predetermined position.

3. The control unit, Based on the detection result of the acceleration sensor, it is determined whether or not the sensing terminal has moved from the predetermined position. The sensing terminal according to claim 2, which transitions from the active state to the sleep state when it is determined that it has moved from the predetermined position.

4. The sensing terminal according to any one of claims 1 to 3, wherein the manufacturing apparatus is a semiconductor manufacturing apparatus for manufacturing semiconductor devices.

5. A sensing method using a sensing terminal comprising a detection sensor for detecting the environment inside a manufacturing apparatus, an acceleration sensor, a control unit, and a battery for supplying power to the control unit, The control unit is capable of transitioning between an active state in which it performs a predetermined operation based on the detection result of the detection sensor, and a sleep state in which it consumes less power than the active state. The aforementioned sensing method is The steps include: detecting acceleration with the acceleration sensor, The control unit performs a step of transitioning between the active state and the sleep state based on at least one of a pattern of time-series data generated based on the detection result of the acceleration sensor and a position calculated based on the detection result of the acceleration sensor. A sensing method, including

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