Latent heat storage gypsum board, partition structure

Abstract

This latent heat storage gypsum board has: a gypsum board having a first main surface and a second main surface positioned on the opposite side to the first major surface; and a latent heat storage layer disposed on at least a portion of the first main surface of the gypsum board and containing a latent heat storage material and a binder, wherein the heat storage amount measured in a measurement temperature range of 15°C to 35°C according to the heat storage amount measurement specified in ASTM C 1784 is 260 kJ / m2 or more, and when heat generation is evaluated according to the heat generation test specified in JIS A 6901 (2014) by setting the surface on which the latent heat storage layer is disposed as the rear surface, the latent heat storage gypsum board is found to have first-class heat generation performance.

Description

[Technical Field]

[0001] This invention relates to a latent heat storage gypsum board and a partition structure. [Background technology]

[0002] Building materials have been considered for some time to suppress changes in indoor temperature by adding latent heat storage materials to building surface materials used indoors, such as gypsum board, to store thermal energy during the day in the latent heat storage material, and then releasing the stored thermal energy when the temperature drops, such as at night.

[0003] For example, Patent Document 1 discloses a gypsum board comprising two cover layers and a gypsum core, wherein the gypsum core contains predetermined microcapsules and a polymer. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japan Special Publication No. 2013-506774 [Overview of the project] [Problems that the invention aims to solve]

[0005] However, since paraffin and the like are used as latent heat storage materials, when a latent heat storage material is added to a gypsum board, as in the gypsum board disclosed in Patent Document 1, the amount of latent heat storage material that can be added is limited in order to maintain the non-combustibility of the gypsum board.

[0006] In view of the problems of the prior art described above, one aspect of the present invention aims to provide a latent heat storage gypsum board that is non-combustible and has excellent heat storage capacity. [Means for solving the problem]

[0007] To solve the above problems, according to one embodiment of the present invention, a gypsum board having a first main surface and a second main surface located on the opposite side of the first main surface, The gypsum board has a latent heat storage layer disposed on at least a portion of the first main surface, which contains a latent heat storage material and a binder. According to the heat storage measurement method specified in ASTM C 1784, the measured heat storage amount was 260 kJ / m³, with the measurement temperature range being 15°C to 35°C. 2 That's all. The present invention provides a latent heat storage gypsum board that exhibits Class 1 heat generation performance when evaluated using the heat generation test specified in JIS A 6901 (2014), with the side on which the latent heat storage layer is placed considered as the back surface. [Effects of the Invention]

[0008] According to one embodiment of the present invention, a latent heat storage gypsum board that is non-combustible and has excellent heat storage capacity can be provided. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a perspective view of a latent heat storage gypsum board according to an embodiment of the present invention. [Figure 2A] Figure 2A is an explanatory diagram of a partition structure according to an embodiment of the present invention. [Figure 2B] Figure 2B is an explanatory diagram of a partition structure according to an embodiment of the present invention. [Figure 2C] Figure 2C is an explanatory diagram of a partition structure according to an embodiment of the present invention. [Figure 3] Figure 3 is an explanatory diagram of the test method for the fluidity of a coating material containing latent heat storage material. [Figure 4] Figure 4 is an explanatory diagram of the test method for latent heat storage material leakage when fastened with screws. [Figure 5] Figure 5 is an explanatory diagram illustrating the relationship between the thickness X of the gypsum board, the specific gravity Y of the gypsum board, and the amount of heat stored Z in the latent heat storage gypsum board. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments for implementing the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications and substitutions can be made to the following embodiments without departing from the scope of the present invention. [Latent heat storage gypsum board] A specific configuration example of the latent heat storage gypsum board of the present embodiment will be specifically described while using the drawings.

[0011] As shown in FIG. 1, the latent heat storage gypsum board 10 of the present embodiment can have a gypsum board 11 and a latent heat storage layer 12.

[0012] The gypsum board 11 has a first main surface 11A and a second main surface 11B located on the opposite side of the first main surface 11A. Note that the gypsum board 11 can have a plate-like shape as shown in FIG. 1, for example. The first main surface 11A and the second main surface 11B are surfaces that intersect the thickness direction and are the surfaces with the largest area as shown in FIG. 1.

[0013] And the latent heat storage layer 12 can be disposed on at least a part of the first main surface 11A of the gypsum board 11. That is, the latent heat storage layer 12 can be disposed so as to cover at least a part of the first main surface 11A of the gypsum board 11. Note that it is preferable that the latent heat storage layer 12 is directly formed on the first main surface 11A of the gypsum board 11. That is, it is preferable not to dispose other members between the gypsum board 11 and the latent heat storage layer 12.

[0014] The latent heat storage gypsum board 10 of the present embodiment is provided with a latent heat storage layer 12 on the first main surface 11A of the gypsum board 11 separately from the gypsum board 11 as described above. Therefore, the second main surface 11B side of the gypsum board 11 can be configured not to be provided with the latent heat storage layer 12. As a result, when heated from the second main surface side 11B, the non-combustible effect of the gypsum board 11 can be exerted, and thus a latent heat storage gypsum board having non-combustibility can be easily obtained.

[0015] Furthermore, by providing the latent heat storage layer 12 on the first main surface 11A of the gypsum board 11, a latent heat storage gypsum board with excellent heat storage capacity can be made possible by the latent heat storage layer 12.

[0016] In particular, as mentioned above, the second main surface 11B side is the surface where the gypsum board 11 is exposed, making it easier to ensure non-combustibility. Therefore, compared to the case where latent heat storage material is added to the gypsum board 11, the constraints on the amount of latent heat storage material added to the latent heat storage layer 12, etc., for making the latent heat storage gypsum board non-combustible are relaxed. As a result, it is possible to make a latent heat storage gypsum board with particularly excellent heat storage capacity.

[0017] In other words, by using a latent heat storage gypsum board having the above configuration, it is possible to obtain a latent heat storage gypsum board that is non-combustible and has excellent heat storage capacity.

[0018] In the latent heat storage gypsum board 10 shown in Figure 1, an example is shown in which the latent heat storage layer 12 is formed over the entire first main surface 11A of the gypsum board 11, but the configuration is not limited to this. For example, the size and shape of the latent heat storage layer 12 can be selected according to the required amount of heat storage for the latent heat storage gypsum board 10. Therefore, the latent heat storage layer 12 may be placed over the entire first main surface 11A of the gypsum board 11, or it may be placed only over a part of the first main surface 11A.

[0019] Furthermore, the shape of the latent heat storage layer does not need to be a continuous surface shape; the shape of the latent heat storage layer may be, for example, linear or dot-shaped. The latent heat storage gypsum board of this embodiment may also have multiple non-continuous latent heat storage layers.

[0020] It is preferable that the gypsum board 11 is exposed on the second main surface 11B of the gypsum board 11, without a latent heat storage layer 12. It is also preferable that the gypsum board 11 is exposed on the side surface 11C located between the first main surface 11A and the second main surface 11B of the gypsum board 11, without a latent heat storage layer 12. However, a latent heat storage layer can be provided on the second main surface 11B and the side surface 11C as long as it does not affect the non-combustibility of the latent heat storage gypsum board. Furthermore, it is not excluded that the second main surface 11B and the side surface 11C may have a latent heat storage layer formed due to the unintentional adhesion of the latent heat storage material coating during the manufacturing process. (1) Regarding the components of the latent heat storage gypsum board Each component of the latent heat storage gypsum board of this embodiment will be described below. (1-1) Gypsum board (Types of plasterboard) The gypsum board 11 is a plate-like body containing gypsum, and various types of gypsum boards can be used as the gypsum board 11. Examples of gypsum boards 11 include glass mat gypsum boards, glass fiber nonwoven fabric-containing gypsum boards, gypsum boards specified in JIS A 6901 (2014), gypsum boards that are lighter or heavier than the gypsum boards specified in JIS A 6901 (2014) (hereinafter, the gypsum boards specified in the above JIS, and gypsum boards that are lighter or heavier than the gypsum boards specified in JIS, will be collectively referred to as "gypsum boards"), gypsum boards, slag gypsum boards, etc.

[0021] The above-mentioned glass mat gypsum board is, for example, a gypsum board whose surface is covered with a glass mat.

[0022] A gypsum board containing glass fiber nonwoven fabric is, for example, a gypsum board in which glass fiber nonwoven fabric (glass tissue) is embedded on the surface side.

[0023] Furthermore, gypsum board can be, for example, a gypsum board whose surface is covered with a board base paper.

[0024] The gypsum boards listed as candidates for gypsum board 11 refer to gypsum boards that are not classified as glass mat gypsum boards, etc., and for example, gypsum boards that do not have a surface material.

[0025] Therefore, it is preferable that the gypsum board 11 is selected from, for example, glass mat gypsum board, glass fiber nonwoven fabric gypsum-containing board, gypsum board, gypsum board, or slag gypsum board.

[0026] Furthermore, it is preferable that the gypsum board 11 does not contain latent heat storage material. (Thickness of the plasterboard) The thickness X of the gypsum board 11 is not particularly limited, but from the viewpoint of improving the non-combustibility of the latent heat storage gypsum board 10, the thickness X of the gypsum board 11 is preferably 9.0 mm or more, and more preferably 9.5 mm or more.

[0027] While there are no particular limitations on the upper limit of the thickness X of the gypsum board 11, the latent heat-storing gypsum board of this embodiment can be used in partition structures such as walls, ceilings, and floors that demarcate indoor spaces. Therefore, from the viewpoint of preventing the indoor space from becoming narrower when applied to walls, ceilings, floors, etc., it is preferable that the thickness X of the gypsum board 11 is 15.0 mm or less. (Specific gravity of gypsum board) The specific gravity of the gypsum board 11 is not particularly limited, but in order to enhance the non-combustibility of the latent heat storage gypsum board 10, the specific gravity of the gypsum board 11 is preferably 0.35 or higher, and more preferably 0.65 or higher.

[0028] There are no particular upper limits on the specific gravity of the gypsum board 11, but it is preferable that it be 1.43 or less from the viewpoint of improving handling during construction. (1-2) Latent heat storage layer The latent heat storage layer can contain a latent heat storage material and a binder.

[0029] The latent heat storage layer can consist only of the latent heat storage material and a binder, but depending on the required properties and manufacturing process requirements, it may also contain any additional components besides the latent heat storage layer and binder. (Latent heat storage material) A latent heat storage material is a material in which at least a portion of the material can utilize the latent heat absorbed and released during phase changes for heat storage. For example, a material that can store thermal energy during the day and release thermal energy when the temperature drops, such as at night, is preferably used.

[0030] As latent heat storage materials, one or more selected from, for example, materials containing latent heat storage substances encapsulated in microcapsules, materials impregnated with latent heat storage substances in inorganic porous materials, molten mixtures of thermoplastic resins and latent heat storage substances, olefin polymers, crosslinked olefin polymers, etc., can be used.

[0031] Furthermore, in materials containing the above-mentioned latent heat storage material encapsulated in microcapsules, the latent heat storage material is a substance that can utilize the latent heat absorbed and released during phase changes for heat storage.

[0032] The latent heat storage material is not particularly limited, but for example, one or more selected from paraffin compounds, fatty acids, fatty acid esters, aliphatic ethers, aliphatic ketones, aliphatic alcohols, olefin polymers, inorganic hydrates, etc., can be used. The above materials may be used individually or in combination of two or more.

[0033] As previously mentioned, latent heat storage materials can also be used encapsulated in microcapsules. The material of the microcapsules is not particularly limited, but for example, one or more selected from ethylene-vinyl alcohol copolymer, styrene-butadiene copolymer, (meth)acrylonitrile-butadiene copolymer, hydrogenated conjugated diene (co)polymer, poly(meth)acrylate, polyolefin, polystyrene, poly(meth)acrylonitrile, polyamide, poly(meth)acrylamide, ethylcellulose, polyurethane, polyurea, polyurethane urea, melamine resin, gelatin, carboxymethylcellulose, gum arabic, etc. can be used.

[0034] Note that the notation (meth)acrylonitrile means either methacrylonitrile or acrylonitrile, or both. The notation (meth)acrylate means either methacrylate or acrylate, or both. The notation (meth)acrylamide means either methacrylamide or acrylamide, or both. In the case of a (co)polymer, it means either a copolymer or a single polymer, or both.

[0035] The content of the latent heat storage material in the latent heat storage layer is not particularly limited and can be arbitrarily selected according to the type of latent heat storage material used and the amount of heat storage required for the latent heat storage gypsum board. The latent heat storage layer 12 preferably contains the latent heat storage material in a proportion of 10 parts by mass or more and 69 parts by mass or less, more preferably 15 parts by mass or more and 69 parts by mass or less, and even more preferably 18 parts by mass or more and 69 parts by mass or less, when the total latent heat storage layer is 100 parts by mass.

[0036] By setting the content of the latent heat storage material to 10 parts by mass or more, the heat storage capacity of the latent heat storage gypsum board can be sufficiently increased without excessively increasing the thickness of the latent heat storage layer. By setting the content of the latent heat storage material to 69 parts by mass or less, the latent heat storage layer can be made into a uniform film shape, and the adhesion to the gypsum board that serves as the base can be further improved.

[0037] In this embodiment, it is preferable that only the latent heat storage layer of the latent heat storage gypsum board contains the above-mentioned latent heat storage material. (binder) The binder is not particularly limited, but it can be one or more types selected from, for example, inorganic binders and organic binders.

[0038] Examples of organic binders include vinyl acetate binders and polyester binders. Examples of inorganic binders include alkali metal silicate binders, phosphate binders, and silica sol binders.

[0039] From the viewpoint of handling and other factors, it is preferable that the binder contains one or more types selected from alkali metal silicate binders and vinyl acetate binders. (Inorganic powder) As previously described, the latent heat storage layer may contain any components other than the latent heat storage material and binder mentioned above. The latent heat storage layer may also contain, for example, inorganic powder.

[0040] For example, talc can be used as the inorganic powder.

[0041] The inclusion of inorganic powder in the latent heat storage layer improves the dispersibility and stringability of the latent heat storage material and the latent heat storage material-containing coating material, including the binder, used in the manufacturing of the latent heat storage layer. Furthermore, the uniformity of the compounded materials within the latent heat storage layer formed by applying the latent heat storage material-containing coating material to a gypsum board can be improved. In addition, it prevents the latent heat storage material-containing coating material from sagging when forming the latent heat storage layer. (Plasticizer) The latent heat storage layer may also contain, for example, a plasticizer.

[0042] The plasticizer is not particularly limited, but dibutyl phthalate and the like can be suitably used.

[0043] Plasticizers have the effect of improving the surface properties of the latent heat storage layer, which can suppress the occurrence of cracks. (2) Characteristics of latent heat storage gypsum board (2-1) Amount of heat storage The latent heat storage gypsum board of this embodiment measured the amount of heat stored as defined in ASTM C 1784, with a measurement temperature range of 15°C to 35°C, and the measured amount of heat stored was 260 kJ / m³. 2 Preferably, it should be 290 kJ / m³ or more. 2 It is more preferable that the above conditions are met.

[0044] The above heat storage capacity is 260 kJ / m³. 2By doing so, when the latent heat-storing gypsum board is used as a partition structure that defines an indoor space such as a ceiling, wall, or floor, changes in indoor temperature can be particularly suppressed.

[0045] (2-2) Pyrolytic test In this embodiment, the latent heat storage gypsum board preferably has a heat generation performance of Class 1 when evaluated using the heat generation test specified in JIS A 6901 (2014), with the side on which the latent heat storage layer is placed considered as the back surface.

[0046] The above heat generation test is specified in Annex A of JIS A 6901 (2014), and a heat generation class of 1 means that the following criteria are met when the heating time is 20 minutes: The total heat generated up to the end of the heating time is 8 MJ / m³. 2 The following conditions must be met: There must be no cracks or holes penetrating to the back surface that would be harmful to fire safety during the heating time; and the maximum heat generation rate must remain at 200 kW / m² for at least 10 seconds during the heating time. 2 Do not exceed this limit.

[0047] In the heat generation test, evaluating the side with the latent heat storage layer as the back surface means evaluating the second main surface 11B, which is the side of the gypsum board 11 on which the latent heat storage layer 12 of the latent heat storage gypsum board 10 is provided, as the front surface. In other words, it means irradiating the second main surface 11B with radiant heat and conducting the heat generation test. (2-3) Correlation between gypsum board thickness, gypsum board specific gravity, and heat storage capacity The thickness X (mm) of the gypsum board, the specific gravity Y of the gypsum board, and the heat storage capacity Z (kJ / m³) 2 It is preferable that ) and satisfy the following relationship (1).

[0048] Z≦126.48X+928.61Y-1732.0 ···(1) The thickness and specific gravity of the gypsum board are parameters that affect the non-combustibility of the latent heat storage gypsum board. Therefore, as described above, if the thickness X of the gypsum board, the specific gravity Y, and the amount of heat stored Z have the relationship shown in equation (1), it is possible to produce a latent heat storage gypsum board that is particularly excellent in terms of non-combustibility and heat storage capacity.

[0049] Note that the thickness X of the gypsum board 11 corresponds to the thickness X in Figure 1. It is preferable to round the values ​​on the right and left sides of equation (1) above so that they have the same number of decimal places before comparison. It is preferable to round the values ​​on the right and left sides of equation (1) above to, for example, the second decimal place. That is, it is preferable to round the values ​​on the right and left sides of equation (1) above so that they have one decimal place before comparison. [Method for manufacturing latent heat storage gypsum boards] Next, an example of the configuration for the method of manufacturing the latent heat storage gypsum board of this embodiment will be described. The latent heat storage gypsum board described above can be manufactured using the method of manufacturing the latent heat storage gypsum board of this embodiment. For this reason, some of the matters already explained will be omitted.

[0050] The method for manufacturing a latent heat storage gypsum board according to this embodiment may include a step of forming a latent heat storage layer by coating a latent heat storage material-containing coating material, which contains a latent heat storage material and a binder, onto at least a portion of the first main surface of the gypsum board. The latent heat storage material-containing coating material may contain components that can suitably contain the latent heat storage layer, as described above. In addition, the latent heat storage material-containing coating material may further contain a solvent such as water as necessary to adjust and ensure fluidity during coating.

[0051] The raw materials used to form the latent heat storage layer in the latent heat storage layer formation process, their suitable addition amounts, and suitable gypsum boards, etc., have already been described, so we will omit further explanation.

[0052] In the latent heat storage layer formation process, the means and methods for applying the latent heat storage material-containing coating to at least a portion of the first main surface of the gypsum board are not particularly limited. However, it is preferable to apply the coating so that the thickness of the formed latent heat storage layer is uniform. For this reason, the coating method for applying the latent heat storage material-containing coating in the latent heat storage layer formation process is not particularly limited, and can be appropriately selected, for example, flow coating, roll coating, blade coating, etc., but flow coating is preferred because it is simple.

[0053] The above-mentioned roll coating method involves applying a coating material containing latent heat storage material to a rotating roller, thereby forming a latent heat storage layer on the surface of a gypsum board using the roller.

[0054] Flow coating is a method in which a latent heat storage material containing a coating agent is flowed in a thin film onto the first main surface of a gypsum board from above as it is being transported, thereby forming a latent heat storage layer on the first main surface of the gypsum board.

[0055] Blade coating is a method in which a latent heat storage material containing a coating material supplied to the first main surface of a gypsum board is scraped off with a blade and spread to the first main surface of the gypsum board to a desired thickness, thereby forming a latent heat storage layer.

[0056] Furthermore, the gypsum board supplied to the latent heat storage layer formation process can be masked in advance in areas where the latent heat storage layer will not be formed, thereby enabling the formation of a latent heat storage layer with a desired pattern.

[0057] The method for manufacturing latent heat storage gypsum board according to this embodiment may include any additional steps in addition to the latent heat storage layer formation step described above.

[0058] The method for manufacturing latent heat storage gypsum boards according to this embodiment may further include, if necessary, a drying step for drying the formed latent heat storage layer, a cutting step for cutting the latent heat storage gypsum board or the gypsum board used as raw material to any size, and so on.

[0059] The drying temperature in the drying process is not particularly limited, but it is preferably 100°C or lower, and more preferably 70°C or lower. This is because setting the drying temperature to 100°C or lower can suppress problems such as warping of the latent heat storage gypsum board or cracking of the latent heat storage layer.

[0060] While there is no particular lower limit to the drying temperature, from the viewpoint of productivity, it is preferable to set it at 20°C or higher, and more preferably at 30°C or higher. [Partition structure] Next, we will explain an example of a partition structure using the previously described latent heat storage gypsum board with the following diagrams: Figures 2A to 2C. Figures 2A to 2C are side views or top views of the partition structure.

[0061] The partition structure of this embodiment is a partition structure that demarcates an interior space.

[0062] The partition structure of this embodiment may include a latent heat storage gypsum board and a base material that supports the latent heat storage gypsum board.

[0063] The latent heat-storing gypsum board in the partition structure of this embodiment can be the latent heat-storing gypsum board described above. The second main surface of the gypsum board, that is, the surface opposite to the surface on which the latent heat-storing layer is provided, can be positioned towards the interior space.

[0064] Specifically, for example, as shown in Figure 2A, the partition structure 201 of this embodiment may include a latent heat storage gypsum board 10 and a base material 21 that supports the latent heat storage gypsum board 10. The latent heat storage gypsum board 10 may be fixed to the base material 21 with screws, nails, or the like.

[0065] The partition structure 201 shown in Figure 2A can be used, for example, as a wall, ceiling, or floor to separate an external space 201A from an internal space 201B. Note that the external space 201A refers to the space located outside the internal space 201B and is not limited to the outdoors.

[0066] In the partition structure 201, the second main surface 11B of the gypsum board 11 of the latent heat storage gypsum board 10, that is, the surface opposite to the first main surface 11A on which the latent heat storage layer 12 of the gypsum board 11 is provided, can be positioned on the side of the indoor space 201B.

[0067] Since fires and other fires typically originate from the interior space, by placing the second main surface 11B of the gypsum board 11, where the gypsum board 11 is exposed, on the interior space 201B side, a partition structure with excellent fire resistance can be created.

[0068] The partition structure 202 of this embodiment shown in Figure 2B may also have a latent heat storage gypsum board 10 and a base material 21 that supports the latent heat storage gypsum board 10. The latent heat storage gypsum board 10 may be fixed to the base material 21 with screws, nails, or the like.

[0069] The partition structure 202 shown in Figure 2B can be used, for example, as a wall separating two interior spaces 202A and interior space 202B.

[0070] In the partition structure 202, the second main surface 11B of the gypsum board 11 of the latent heat storage gypsum board 10 is positioned on the side of the interior space 202A and the interior space 202B, respectively. More specifically, the second main surface 11B of the gypsum board 11 of the latent heat storage gypsum board 10 that is in contact with each of the interior spaces 202A and 202B is positioned on the side of the interior space 202A and the 202B, respectively.

[0071] As explained in the partition structure 201, fires and the like usually originate from the interior space side. Therefore, by placing the second main surface 11B of the gypsum board 11, where the gypsum board 11 is exposed, on the interior space 202A and 202B side, a partition structure with excellent fire resistance can be created.

[0072] The partition structure 203 of this embodiment shown in Figure 2C may also have a latent heat storage gypsum board 10 and a base material 22 that supports the latent heat storage gypsum board 10. The latent heat storage gypsum board 10 may be supported only by the base material 22, or it may be fixed to the base material 22 with screws, nails, or the like.

[0073] The partition structure 203 shown in Figure 2C can be used, for example, as a ceiling to partition the external space 203A above the ceiling from the interior space 203B. Examples of partition structures having the configuration shown in Figure 2(C) include recessed ceilings.

[0074] In the partition structure 203, the second main surface 11B of the gypsum board 11 of the latent heat storage gypsum board 10 is positioned on the side facing the interior space 203B.

[0075] As explained in the partition structure 201, fires and the like usually originate from the interior space side. Therefore, by placing the second main surface 11B of the gypsum board 11, where the gypsum board 11 is exposed, on the interior space 203B side, a partition structure with excellent fire resistance can be created.

[0076] Figures 2A to 2C show an example in which the partition structure consists only of latent heat-storing gypsum boards. However, the partition structure may also consist of the aforementioned latent heat-storing gypsum boards and gypsum boards without a latent heat-storing layer.

[0077] Furthermore, the number of gypsum boards in the partition structure is not particularly limited, and any number of gypsum boards can be used depending on the location where the partition structure is placed.

[0078] The partition structure of this embodiment, as described above, has the latent heat-storing gypsum board described above, and therefore can be made into a partition structure that is non-combustible and has excellent heat storage properties. The partition structure of this embodiment can be used, for example, in walls, ceilings, floors, etc. [Examples]

[0079] The present invention will be described with specific examples below, but it is not limited to these examples. (1) Evaluation method Before describing the experimental examples, we will explain the evaluation method for latent heat storage gypsum boards obtained in the following experimental examples. (1-1) Fluidity of coating material containing latent heat storage material The fluidity of the latent heat storage material-containing coating, which includes a latent heat storage material and a binder, was evaluated as follows.

[0080] First, as schematically shown in Figure 3, 100 mL of latent heat storage material-containing coating 32 was poured onto the first main surface 31A of the acrylic plate 31. Then, after the latent heat storage material-containing coating 32 had dried, it was visually observed from the second main surface 31B side of the acrylic plate 31, following the arrow 33.

[0081] When there were no pinholes in the dried coating material containing the latent heat storage material 32, it was evaluated as ○, and when there were pinholes, it was evaluated as ×. Here, ○ means passing and × means failing.

[0082] This is because when the dried coating material containing the latent heat storage material has pinholes, the fluidity of the coating material containing the latent heat storage material is not sufficient, and it does not spread uniformly on the acrylic plate 31, resulting in the generation of pinholes. The evaluation results are shown in the column of "Fluidity of Coating Material" in the table. (1-2) Heat storage capacity Regarding the heat storage capacity of the obtained latent heat storage gypsum board, evaluation was carried out in accordance with ASTM C 1784 (step method). However, the measurement temperature range was set to 15°C or higher and 35°C or lower.

[0083] In the evaluation, a thermal conductivity measuring device (manufactured by Eihong Seiki Co., Ltd., model number: HC-074) was used. (1-3) Heat generation test The heat generation test of the obtained latent heat storage gypsum board was carried out in accordance with JIS A 6901 (2014). However, the evaluation was carried out with the latent heat storage layer side as the back surface.

[0084] As a result of the evaluation, when it was Class 1 for heat generation, it was evaluated as ○, and in other cases, it was evaluated as ×. Here, ○ means passing and × means failing. Also, the total heat generation amount during the heating time of 20 minutes is shown in the column of "Total heat generation amount 20 min value".

[0085] Note that Class 1 for heat generation means satisfying the following judgment criteria when the heating time is 20 minutes. The total heat generation amount until the end of the heating time is 8 MJ / m 2 Hereinafter, there are no cracks, holes, etc. penetrating to the back surface that are harmful in terms of fire prevention during the heating time, and the maximum heat generation rate does not exceed 200 kW / m continuously for 10 seconds or more during the heating time. 2 exceeding.

[0086] A cone calorimeter (manufactured by Toyo Seiki Seisakusho Co., Ltd., model number: C3) was used for the evaluation of the heat generation test. (1-4) Leakage of the latent heat storage material when screwing As shown in Figure 4, paraffin paper 41 was placed on the latent heat storage layer 12 of the obtained latent heat storage gypsum board 10, and the paraffin paper 41 was fastened with screws 42 at its center.

[0087] Next, the latent heat-storing gypsum board 10, to which the paraffin paper 41 was fixed, was heated sufficiently to a temperature above the melting point of the latent heat-storing material it contained. Specifically, it was kept in a 40°C drying oven until there was no further change in weight. Then, it was checked whether or not the latent heat-storing material had adhered to the paraffin paper 41.

[0088] If the latent heat storage material was found to be adhering to the paraffin paper 41, it was evaluated as ×; if the latent heat storage material was not found to be adhering, it was evaluated as ○. ○ means pass, and × means fail.

[0089] If no adhesion of the latent heat storage material is observed to the paraffin paper 41, it means that there is no leakage of the latent heat storage material and that the paper can be used repeatedly with virtually no change in the amount of heat stored. [Experimental Example 1] In Experimental Example 1, a latent heat storage gypsum board shown in Figure 1 was fabricated. In Experimental Example 1, the latent heat storage gypsum boards for Experimental Examples 1-1 to 1-6 shown in Table 1 were fabricated in the same manner, except that the composition of the latent heat storage layer was changed.

[0090] This document describes the manufacturing conditions for latent heat storage gypsum board.

[0091] A gypsum board measuring 12.5 mm in thickness, 300 mm in width, and 400 mm in length was prepared as the gypsum board 11, and a latent heat storage layer 12 was formed on the entire surface of the first main surface 11A to form the latent heat storage gypsum board 10.

[0092] The latent heat storage layer was formed by mixing a latent heat storage material with a binder to create a latent heat storage material-containing coating, applying it using a flow coat method, and then drying it.

[0093] As the latent heat storage material, we used a material in which fatty acid esters, which are latent heat storage substances, were encapsulated in microcapsules made of polyurethane.

[0094] As the binder, an aqueous solution of sodium alkali metal silicate and lithium silicate, i.e., an alkali metal silicate-based inorganic binder, was used.

[0095] As described above, a latent heat storage material-containing coating was prepared such that, when dried and formed into a latent heat storage layer, the mixing ratio of the latent heat storage material and the binder was as shown in Table 1. After drying, the coating containing the latent heat storage material was applied to a gypsum board as described above, and dried to produce a latent heat storage gypsum board with a latent heat storage layer thickness of 3 mm.

[0096] The obtained latent heat-storing gypsum boards were evaluated for their heat storage capacity, exothermic properties, coating fluidity, and leakage of the latent heat-storing material during screw fastening. The results are shown in Table 1.

[0097] Table 1 also shows the calculated amount of latent heat storage material, which is the mass of latent heat storage material contained per unit area of ​​the first main surface of the gypsum board 11 in the latent heat storage gypsum board 10 prepared in each experimental example.

[0098] Experimental Examples 1-2 to 1-5 are examples, while Experimental Examples 1-1 and 1-6 are comparative examples.

[0099] In the heat generation tests, it was confirmed that all of the latent heat storage gypsum boards in Experimental Examples 1-2 to 1-5 exhibited Class 1 heat generation performance. Furthermore, in these experimental examples, no cracks or holes penetrating to the back surface, which would be harmful from a fire prevention standpoint, occurred during the heating time, and the maximum heat generation rate remained at 200 kW / m² for more than 10 seconds during the heating time. 2 It never exceeded that.

[0100] [Table 1] According to the results shown in Table 1, in the examples, Experimental Examples 1-2 to 1-5, the exothermic properties were Class 1, and the heat storage capacity was 260 kJ / m³. 2 From the above, it was confirmed that a latent heat storage gypsum board with non-combustibility and excellent heat storage capacity was obtained.

[0101] Furthermore, in Experimental Examples 1-4 and 1-5, it was confirmed that despite an increase in the proportion of latent heat storage material in the target composition of the latent heat storage layer compared to Experimental Example 1-3, the amount of heat stored tended to decrease compared to Experimental Example 1-3. This is thought to be because, when forming the coating material containing latent heat storage material, the coating material thickens as the proportion of latent heat storage material increases, making it easier for air to be incorporated, and thus the actual content of latent heat storage material in the formed latent heat storage layer decreases compared to the target composition.

[0102] Furthermore, since no leakage of the latent heat storage material was observed even when the latent heat storage gypsum board was heated, it can be said that it exhibits a stable heat storage capacity even when used repeatedly.

[0103] In Experimental Example 1-1, the amount of heat stored was insufficient because no latent heat storage material was added to the latent heat storage layer. In Experimental Example 1-6, the fluidity of the coating material containing the latent heat storage material was insufficient, so the production of the latent heat storage gypsum board was discontinued, and the amount of heat stored was not evaluated. [Experimental Example 2] In Experimental Example 2, a latent heat storage gypsum board was fabricated as shown in Figure 1. In Experimental Example 2, the latent heat storage gypsum boards for Experimental Examples 2-1 to 2-6, shown in Table 2, were fabricated in the same manner, except that the composition of the latent heat storage layer was changed.

[0104] This document describes the manufacturing conditions for latent heat storage gypsum board.

[0105] A gypsum board measuring 12.5 mm in thickness, 300 mm in width, and 400 mm in length was prepared as the gypsum board 11, and a latent heat storage layer 12 was formed on the entire surface of the first main surface 11A to form the latent heat storage gypsum board 10.

[0106] The latent heat storage layer was formed by mixing a latent heat storage material with a binder to create a latent heat storage material-containing coating, applying it using a flow coat method, and then drying it.

[0107] As the latent heat storage material, we used a material in which fatty acid esters, which are latent heat storage substances, were encapsulated in microcapsules made of polyurethane.

[0108] As the binder, a vinyl acetate-based binder was used, containing water as the solvent, and containing 55.0% of the active ingredient of the binder by mass. In other words, an organic binder was used.

[0109] As described above, a latent heat storage material-containing coating was prepared such that, when dried and formed into a latent heat storage layer, the mixing ratio of the latent heat storage material and the binder was as shown in Table 2. After drying, the coating containing the latent heat storage material was applied to a gypsum board as described above, and dried to produce a latent heat storage gypsum board with a latent heat storage layer thickness of 3 mm.

[0110] The obtained latent heat-storing gypsum boards were evaluated for their heat storage capacity, exothermic properties, coating fluidity, and leakage of the latent heat-storing material during screw fastening. The results are shown in Table 2.

[0111] Table 2 also shows the calculated amount of latent heat storage material, which is the mass of latent heat storage material contained per unit area of ​​the first main surface of the gypsum board 11 in the latent heat storage gypsum board 10 prepared in each experimental example.

[0112] Experimental Examples 2-2 to 2-5 are examples, while Experimental Examples 2-1 and 2-6 are comparative examples.

[0113] In the heat generation tests, it was confirmed that all of the latent heat storage gypsum boards in Experimental Examples 2-2 to 2-5 exhibited Class 1 heat generation performance. Furthermore, in these experimental examples, no cracks or holes penetrating to the back surface, which would be harmful from a fire prevention standpoint, occurred during the heating time, and the maximum heat generation rate remained at 200 kW / m² for more than 10 seconds during the heating time. 2 It never exceeded that.

[0114] [Table 2] According to the results shown in Table 2, in the examples 2-2 to 2-5, the exothermic properties were Class 1, and the heat storage capacity was 260 kJ / m³. 2 From the above, it was confirmed that a latent heat storage gypsum board with non-combustibility and excellent heat storage capacity was obtained.

[0115] Furthermore, in Experimental Examples 2-4 and 2-5, it was confirmed that despite an increase in the proportion of latent heat storage material in the target composition of the latent heat storage layer compared to Experimental Example 2-3, the amount of heat stored tended to decrease compared to Experimental Example 2-3. This is thought to be because, when forming the coating material containing latent heat storage material, the coating material thickens as the proportion of latent heat storage material increases, making it easier for air to be incorporated, and thus the actual content of latent heat storage material in the formed latent heat storage layer decreases compared to the target composition.

[0116] Furthermore, since no leakage of the latent heat storage material was observed even when the latent heat storage gypsum board was heated, it can be said that it exhibits a stable heat storage capacity even when used repeatedly.

[0117] In Experimental Example 2-1, the amount of heat stored was insufficient because no latent heat storage material was added to the latent heat storage layer. In Experimental Example 2-6, the fluidity of the coating material containing the latent heat storage material was insufficient, so the production of the latent heat storage gypsum board was discontinued, and the amount of heat stored was not evaluated. [Experimental Example 3] (1) Experimental Example 3-1 In Experimental Example 3-1 (Examples 3-1-1 to 3-1-24, Comparative Example 3-1-1 to 3-1-27), latent heat storage gypsum boards were fabricated as shown in Figure 1.

[0118] In Experiment Example 3-1, the thickness X (mm) of the gypsum board 11, the specific gravity Y (-) of the gypsum board 11, and the heat storage capacity Z (kJ / m) were used. 2 To investigate the relationship with ), we fabricated latent heat-storing gypsum boards by varying the type of gypsum board and the amount of latent heat storage material, and then evaluated them.

[0119] The thickness X and specific gravity Y of the gypsum board 11 were measured in accordance with JIS A 6901 (2014).

[0120] This document describes the manufacturing conditions for latent heat storage gypsum board.

[0121] For each experimental example, gypsum boards with the thickness and specific gravity shown in Tables 3 to 6 were prepared as gypsum boards 11, and a latent heat storage layer 12 was formed on the entire surface of the first main surface 11A to form a latent heat storage gypsum board 10.

[0122] The latent heat storage layer was formed by applying a latent heat storage material-containing coating, which was created by kneading a latent heat storage material, a binder, and talc, using a flow coat method and then drying it.

[0123] As the latent heat storage material, we used a material in which fatty acid esters, which are latent heat storage substances, were encapsulated in microcapsules made of polyurethane.

[0124] As the binder, a vinyl acetate-based binder was used, containing water as the solvent, and containing 55.0% of the active ingredient of the binder by mass. In other words, an organic binder was used.

[0125] Furthermore, talc was added to the latent heat storage material-containing coating material in a proportion of 2.9 parts by mass when the latent heat storage layer is considered to be 100 parts by mass.

[0126] The latent heat storage material-containing coating used in Experimental Example 3-1 was kept at a constant concentration, and the thickness of the latent heat storage layer was adjusted so that the amount of latent heat storage material contained in the latent heat storage layer after coating was as shown in Tables 3 to 6 for each example and comparative example, and then applied to the gypsum board 11.

[0127] Furthermore, the latent heat storage material-containing coating was prepared such that the latent heat storage layer contained 64.8% by mass of latent heat storage material, 32.3% by mass of binder, and 2.9% by mass of talc. The amount of latent heat storage material is the mass of latent heat storage material contained per unit area of ​​the first main surface 11A of the gypsum board 11.

[0128] The obtained latent heat storage gypsum boards were evaluated for the heat storage capacity and heat generation capacity as described above. The results are shown in Tables 3 to 6. In Examples 3-1-1 to 3-1-24, no cracks or holes penetrating to the back surface, which would be harmful from a fire prevention standpoint, occurred during the heat generation test, and the maximum heat generation rate remained at 200 kW / m² for 10 seconds or more during the heating time. 2 It never exceeded that.

[0129] [Table 3]

[0130] [Table 4]

[0131] [Table 5]

[0132] [Table 6] (2) Experimental Example 3-2 In Experimental Example 3-2 (Examples 3-2-1 to 3-2-24, Comparative Examples 3-2-1 to 3-2-27), latent heat storage gypsum boards were fabricated as shown in Figure 1.

[0133] In Experiment Example 3-2, the thickness X (mm) of the gypsum board 11, the specific gravity Y (-) of the gypsum board 11, and the heat storage capacity Z (kJ / m) were used. 2 To investigate the relationship with ), we fabricated latent heat-storing gypsum boards by varying the type of gypsum board and the amount of latent heat storage material, and then evaluated them.

[0134] The thickness X and specific gravity Y of the gypsum board 11 were measured in accordance with JIS A 6901 (2014).

[0135] This document describes the manufacturing conditions for latent heat storage gypsum board.

[0136] For each experimental example, gypsum boards with the thickness and specific gravity shown in Tables 7 to 10 were prepared as gypsum boards 11, and a latent heat storage layer 12 was formed on the entire surface of the first main surface 11A to form a latent heat storage gypsum board 10.

[0137] The latent heat storage layer was formed by mixing a latent heat storage material with a binder to create a latent heat storage material-containing coating, applying it using a flow coat method, and then drying it.

[0138] As the latent heat storage material, we used a material in which fatty acid esters, which are latent heat storage substances, were encapsulated in microcapsules made of polyurethane.

[0139] As the binder, a vinyl acetate-based binder was used, containing water as the solvent, and containing 55.0% of the active ingredient of the binder by mass. In other words, an organic binder was used.

[0140] The latent heat storage material-containing coating used in Experimental Example 3-2 was kept at a constant concentration, and the thickness of the latent heat storage layer was adjusted so that the amount of latent heat storage material contained in the latent heat storage layer after coating was as shown in Tables 7 to 10 for each example and comparative example, and then applied to the gypsum board 11.

[0141] Furthermore, the latent heat storage material-containing coating was prepared such that the latent heat storage layer contained 64.8% by mass of latent heat storage material and 35.2% by mass of binder. The amount of latent heat storage material is the mass of latent heat storage material contained per unit area of ​​the first main surface 11A of the gypsum board 11.

[0142] The obtained latent heat storage gypsum boards were evaluated for the heat storage capacity and heat generation capacity as described above. The results are shown in Tables 7 to 10. In Examples 3-2-1 to 3-2-24, no cracks or holes penetrating to the back surface, which would be harmful from a fire prevention standpoint, occurred during the heat generation test, and the maximum heat generation rate remained at 200 kW / m² for 10 seconds or more during the heating time. 2 It never exceeded that.

[0143] [Table 7]

[0144] [Table 8]

[0145] [Table 9]

[0146] [Table 10] (3) Experimental Example 3-3 In Experimental Example 3-3 (Examples 3-3-1 to 3-3-24, Comparative Examples 3-3-1 to 3-3-27), latent heat storage gypsum boards were fabricated as shown in Figure 1.

[0147] In Experiment Example 3-3, the thickness X (mm) of the gypsum board 11, the specific gravity Y (-) of the gypsum board 11, and the heat storage capacity Z (kJ / m) were used. 2 To investigate the relationship with ), we fabricated latent heat-storing gypsum boards by varying the type of gypsum board and the amount of latent heat storage material, and then evaluated them.

[0148] The thickness X and specific gravity Y of the gypsum board 11 were measured in accordance with JIS A 6901 (2014).

[0149] This document describes the manufacturing conditions for latent heat storage gypsum board.

[0150] For each experimental example, gypsum boards with the thickness and specific gravity shown in Tables 11 to 14 were prepared as gypsum boards 11, and a latent heat storage layer 12 was formed on the entire surface of the first main surface 11A to form a latent heat storage gypsum board 10.

[0151] The latent heat storage layer was formed by mixing a latent heat storage material with a binder to create a latent heat storage material-containing coating, which was then applied using a flow coater and dried.

[0152] As the latent heat storage material, we used a material in which paraffin, a latent heat storage substance, was encapsulated in microcapsules made of melamine resin.

[0153] As the binder, a vinyl acetate-based binder was used, containing water as the solvent, and containing 55.0% of the active ingredient of the binder by mass. In other words, an organic binder was used.

[0154] The latent heat storage material-containing coating used in Experimental Example 3-3 was kept at a constant concentration, and the thickness of the latent heat storage layer was adjusted so that the amount of latent heat storage material contained in the latent heat storage layer after coating was as shown in Tables 11 to 14 for each example and comparative example, and then applied to the gypsum board 11.

[0155] Furthermore, the latent heat storage material-containing coating was prepared such that the latent heat storage layer contained 64.8% by mass of latent heat storage material and 35.2% by mass of binder. The amount of latent heat storage material is the mass of latent heat storage material contained per unit area of ​​the first main surface 11A of the gypsum board 11.

[0156] The obtained latent heat storage gypsum boards were evaluated for the heat storage capacity and heat generation capacity as described above. The results are shown in Tables 11 to 14. In Examples 3-3-1 to 3-3-24, no cracks or holes penetrating to the back surface, which would be harmful from a fire prevention standpoint, occurred during the heat generation test, and the maximum heat generation rate remained at 200 kW / m² for 10 seconds or more during the heating time. 2 It never exceeded that.

[0157] [Table 11]

[0158] [Table 12]

[0159] [Table 13]

[0160] [Table 14] (4) Experimental Example 3-4 In Experimental Example 3-4 (Examples 3-4-1 to 3-4-23, Comparative Examples 3-4-1 to 3-4-23), latent heat storage gypsum boards were fabricated as shown in Figure 1.

[0161] In Experimental Example 3-4, the thickness X (mm) of the gypsum board 11, the specific gravity Y (-) of the gypsum board 11, and the heat storage capacity Z (kJ / m³) were used. 2 To investigate the relationship with ), we fabricated latent heat-storing gypsum boards by varying the type of gypsum board and the amount of latent heat storage material, and then evaluated them.

[0162] The thickness X and specific gravity Y of the gypsum board 11 were measured in accordance with JIS A 6901 (2014).

[0163] This document describes the manufacturing conditions for latent heat storage gypsum board.

[0164] For each experimental example, gypsum boards with the thickness and specific gravity shown in Tables 15 to 18 were prepared as gypsum boards 11, and a latent heat storage layer 12 was formed on the entire surface of the first main surface 11A to form a latent heat storage gypsum board 10.

[0165] The latent heat storage layer was formed by mixing a latent heat storage material with a binder to create a latent heat storage material-containing coating, applying it using a flow coat method, and then drying it.

[0166] As the latent heat storage material, we used a material in which fatty acid esters, which are latent heat storage substances, were encapsulated in microcapsules made of polyurethane.

[0167] As the binder, an aqueous solution of sodium alkali metal silicate and lithium silicate, i.e., an alkali metal silicate-based inorganic binder, was used.

[0168] The latent heat storage material-containing coating used in Experimental Examples 3-4 was kept at a constant concentration, and the thickness of the latent heat storage layer was adjusted so that the amount of latent heat storage material contained in the latent heat storage layer after coating was as shown in Tables 15 to 18 for each example and comparative example, and then applied to the gypsum board 11.

[0169] Furthermore, the latent heat storage material-containing coating was prepared such that the latent heat storage layer contained 54.9% by mass of latent heat storage material and 45.1% by mass of binder. The amount of latent heat storage material is the mass of latent heat storage material contained per unit area of ​​the first main surface 11A of the gypsum board 11.

[0170] The obtained latent heat storage gypsum boards were evaluated for the heat storage capacity and heat generation capacity as described above. The results are shown in Tables 15 to 18. In Examples 3-4-1 to 3-4-23, no cracks or holes penetrating to the back surface, which would be harmful from a fire prevention standpoint, occurred during the heat generation capacity test, and the maximum heat generation rate remained at 200 kW / m² for 10 seconds or more during the heating time. 2 It never exceeded that.

[0171] [Table 15]

[0172] [Table 16]

[0173] [Table 17]

[0174] [Table 18] (5) Summary Based on the results of Experiment Example 3 described above, the relationship between the thickness X of the gypsum board, the specific gravity Y of the gypsum board, and the heat storage amount Z in the example that satisfies the requirement of Class 1 heat generation was determined using the least squares method with Solver, an optimization analysis tool in Microsoft Excel spreadsheet software.

[0175] As a result, it was confirmed that the gypsum board satisfies the following equation when its thickness X, specific gravity Y, and heat storage capacity Z satisfy the same condition as the gypsum board. In contrast, it was confirmed that none of the comparative examples in Experimental Example 3, which did not satisfy the same condition as the gypsum board, satisfied the following equation.

[0176] Z ≤ 126.48X + 928.61Y - 1732.0 Figure 5 shows the results of Experimental Example 3-2 and the plane 40 obtained by the above formula.

[0177] In Figure 5, Examples 3-2-1 to 3-2-24 are located below plane 40 and are therefore omitted from the description. As shown in Figure 5, Examples 3-2-1 to 3-2-24 and Comparative Examples 3-2-1 to 3-2-27 are separated by plane 40, and it was confirmed that satisfying the above formula satisfies the requirement of Class 1 exothermic performance.

[0178] Although latent heat storage gypsum boards and partition structures have been described above in the embodiments, the present invention is not limited to the above embodiments. Various modifications and changes are possible within the scope of the gist of the present invention as described in the claims.

[0179] This application claims priority based on Japanese Patent Application No. 2021-095442, filed with the Japan Patent Office on June 7, 2021, and the entire contents of Japanese Patent Application No. 2021-095442 are incorporated herein by reference. [Explanation of Symbols]

[0180] 10 Latent heat storage gypsum board 11 Gypsum board 11A 1st main surface 11B 2nd main surface X Thickness 12 Latent heat storage layer Partition structures 201, 202, 203 21, 22 Underlayment Y specific gravity Z heat storage amount

Claims

1. A gypsum board having a first main surface and a second main surface located on the opposite side of the first main surface, The gypsum board has a latent heat storage layer disposed over the entire first main surface, which contains a latent heat storage material and a binder. The aforementioned latent heat storage material is a material in which fatty acid esters are encapsulated in microcapsules. The binder is an alkali metal silicate-based binder or a vinyl acetate-based binder. According to the heat storage capacity measurement method specified in ASTM C 1784, the measured heat storage capacity was 260 kJ / m³, with the measurement temperature range being 15°C to 35°C. ２ That's all. According to the heat generation test specified in JIS A 6901 (2014), when the side on which the latent heat storage layer is placed is evaluated as the back surface, it exhibits a heat generation performance of Class 1. A latent heat storage gypsum board in which the thickness X (mm) of the gypsum board, the specific gravity Y of the gypsum board, and the heat storage amount Z (kJ / m²) satisfy the following relationship (1). Z≦126.48X+928.61Y-1732.0...(1)

2. The latent heat storage gypsum board according to claim 1, wherein the gypsum board has a thickness of 9.0 mm or more and a specific gravity of 0.35 or more.

3. The latent heat storage gypsum board according to claim 1 or claim 2, wherein the latent heat storage layer contains the latent heat storage material in a proportion of 10 parts by mass or more and 69 parts by mass or less when the latent heat storage layer is 100 parts by mass.

4. The latent heat storage gypsum board according to claim 1 or claim 2, wherein the latent heat storage layer comprises inorganic powder.

5. A partition structure that demarcates an interior space, The partition structure comprises a latent heat storage gypsum board and a base material that supports the latent heat storage gypsum board. The latent heat storage gypsum board is the latent heat storage gypsum board according to claim 1 or claim 2, A partition structure in which the second main surface of the latent heat storage gypsum board is located on the side facing the indoor space.

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